TWI668495B - Heat dissipating structure, electronic device and display device using same - Google Patents

Heat dissipating structure, electronic device and display device using same

Info

Publication number
TWI668495B
TWI668495B TW107113407A TW107113407A TWI668495B TW I668495 B TWI668495 B TW I668495B TW 107113407 A TW107113407 A TW 107113407A TW 107113407 A TW107113407 A TW 107113407A TW I668495 B TWI668495 B TW I668495B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
layer
buffer layer
dissipation structure
electronic device
Prior art date
Application number
TW107113407A
Other languages
Chinese (zh)
Inventor
馬禎妘
蔡正豐
張正芳
Original Assignee
大陸商業成科技〈成都〉有限公司
大陸商業成光電(深圳)有限公司
英特盛科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201810331839.1A priority Critical patent/CN108389885A/en
Priority to ??201810331839.1 priority
Application filed by 大陸商業成科技〈成都〉有限公司, 大陸商業成光電(深圳)有限公司, 英特盛科技股份有限公司 filed Critical 大陸商業成科技〈成都〉有限公司
Application granted granted Critical
Publication of TWI668495B publication Critical patent/TWI668495B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3223Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED] combined with dummy elements, i.e. non-functional features
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays

Abstract

A heat dissipation structure includes a buffer layer and a heat dissipation layer, the heat dissipation layer including a body portion laminated on one side of the buffer layer and at least one extension portion extending from the body portion, each extension portion extending through the buffer layer. The present invention also provides an electronic device and a display device to which the above heat dissipation structure is applied. The present invention enables the heat dissipation layer to extend into the through hole by providing a through hole on the buffer layer, thereby enabling the heat dissipation layer to directly contact the heat generating electronic device, thereby facilitating heat conduction and emission.

Description

Heat dissipation structure and electronic device and display device using same

The present invention relates to a heat dissipation structure and an electronic device and display device using the same.

Light-Emitting Diode (LED) and Organic Electroluminesence Display (OELD) are two commonly used light-emitting devices. The light-emitting diode generates injected minority carriers (electrons or holes) by using a semiconductor P-N junction structure, and recombines minority carriers to emit light. The organic light-emitting diodes emit light by applying a very thin coating of an organic material on the glass substrate when a current is passed therethrough. Conventional white LEDs mainly use blue wafers and encapsulated yellow phosphor powder to mix white light to produce white light. However, the LED base layer generally uses a sapphire substrate because of its low thermal conductivity, which makes the LED heat dissipation poor, thereby affecting LED illumination. Efficiency and longevity. Similarly, the OLED glass substrate does not have a high thermal conductivity, and there is also a heat dissipation problem.

In view of this, it is necessary to provide a heat dissipation structure which has a good heat dissipation effect. A heat dissipation structure includes a buffer layer and a heat dissipation layer, the heat dissipation layer including a body portion laminated on one side of the buffer layer and at least one extension portion extending from the body portion, each extension portion extending through the buffer layer.

Further, the buffer layer is correspondingly provided with at least one through hole penetrating the buffer layer, and each of the extending portions is embedded in a corresponding one of the through holes.

Further, an adhesive layer is disposed between the main body portion and the buffer layer to bond the buffer layer and the heat dissipation layer, and the extension portion penetrates the adhesive layer.

Further, each of the extensions is attached/contacted to the wall of the hole corresponding to the through hole.

Further, an adhesive layer is disposed on the wall of each of the through holes to bond the extension and the buffer layer.

Further, the at least one through hole includes a plurality of through holes, and the plurality of through holes are arranged in a space.

Further, an end surface of the extending portion away from the main body portion is flush with a surface of the buffer layer.

It is also necessary to provide an electronic device to which the heat dissipation structure is applied.

An electronic device includes a heat-generating electronic device and a heat dissipation structure laminated on a side of the heat-generating electronic device, wherein the heat dissipation structure is the heat dissipation structure described above.

Further, the buffer layer and the extension of the heat dissipation structure are directly attached to the heat-generating electronic device.

Further, the heat-generating electronic device is an active matrix organic light-emitting diode device.

The present invention enables the heat dissipation layer to extend into the through hole by providing a through hole on the buffer layer, thereby enabling the heat dissipation layer to directly contact the heat generating electronic device, thereby facilitating heat conduction and emission.

100, 200‧‧‧ electronic devices

20‧‧‧Active Matrix Organic Light Emitting Diode Device

10‧‧‧heating structure

11‧‧‧buffer layer

13‧‧‧heat layer

15‧‧‧Adhesive layer

131‧‧‧ Main body

133‧‧‧Extension

111‧‧‧through hole

17‧‧‧Electromagnetic mask layer

1 is a schematic cross-sectional view showing an electronic device according to a first embodiment of the present invention.

2 is a schematic plan view of a heat dissipation structure according to a first embodiment of the present invention.

3 is a schematic plan view of a heat dissipation structure according to a second embodiment of the present invention.

4 is a schematic plan view of a heat dissipation structure according to a third embodiment of the present invention.

Figure 5 is a cross-sectional view showing an electronic device according to a second embodiment of the present invention.

The embodiments of the present invention are shown in the drawings, and the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more complete and complete disclosure of the invention and the scope of the invention. For clarity, the dimensions of the layers and regions are enlarged in the figures. It will be understood that, although the terms of the first, second, etc. may be used herein to describe various elements, elements, regions, layers and/or parts, these elements, elements, regions, layers and/or parts are not limited to these terms. . These terms are only used to distinguish between elements, elements, regions, layers and/or parts and other elements, elements, regions, layers and/or parts. Thus, a first element, component, region, layer and/or portion discussed herein may be referred to as a second element, element, region, layer and/or portion, without departing from the teachings of the invention.

The proper terminology used herein is for the purpose of describing the particular embodiments and The singular forms "a", "an" and "the" It is also to be understood that the terms "comprising", "comprising", "the" The existence of steps, operations, components and/or components.

Embodiments of the invention are described herein with reference to cross-section illustrations, which are schematic representations of an idealized embodiment (and intermediate construction) of the invention. Thus, due to manufacturing processes and/or tolerances The different shapes of the illustrations are foreseeable. Thus, embodiments of the invention should not be construed as limited to the particular shapes of the embodiments illustrated herein. The regions shown in the figures are merely schematic, and their shapes are not intended to illustrate the actual shape of the device and are not intended to limit the scope of the invention.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art of the invention, unless otherwise defined. It should also be understood that terms such as those defined in the general dictionary should be interpreted as having meanings consistent with their meaning in the context of the relevant field and should not be interpreted in terms of overly idealized or overly formal meaning. Unless explicitly defined in this document.

Referring to FIG. 1 , an electronic device 100 according to a first embodiment of the present invention is an OLED display device including a heat dissipation structure 10 and an active matrix organic light emitting diode device 20 disposed on the heat dissipation structure 10 . The heat dissipation structure 10 serves as a support substrate for the active matrix organic light emitting diode device 20.

It is to be understood that the active matrix organic light emitting diode device 20 includes a thin film transistor (TFT) layer and a light emitting diode layer laminated on the TFT layer. Preferably, the active matrix organic light emitting diode device 20 can be flexible, that is, the OLED display device is a flexible OLED display device.

It can be understood that the active matrix organic light emitting diode device 20 of the electronic device 100 can also be replaced with other electronic devices capable of generating thermal energy.

The heat dissipation structure 10 can not only support the active matrix organic light emitting diode device 20 but also conduct heat from the active matrix organic light emitting diode device 20. The heat dissipation structure 10 includes a buffer layer 11 , a heat dissipation layer 13 , and an adhesive layer 15 disposed between the buffer layer 11 and the heat dissipation layer 13 . The adhesive layer 15 is formed on the surface of the buffer layer 11 away from the active matrix organic light emitting diode device 20 for integrating the buffer layer 11 and the heat dissipation layer 13 into one body.

The buffer layer 11 may be selected from materials having a force buffering function conventionally used in the art, such as foam, silicone, and the like. The heat dissipation layer 13 may be made of a material having good thermal conductivity, such as graphene, which is conventionally used in the art.

The buffer layer 11 of the heat dissipation structure 10 is directly attached to the active matrix organic light emitting diode device 20. Since the heat conduction function of the buffer layer 11 is weak, in order to improve the heat dissipation function of the heat dissipation structure 10, At least one through hole 111 penetrating through the buffer layer 11 and the adhesive layer 15 is formed in the buffer layer 11 and the adhesive layer 15 , and the heat dissipation layer 13 extends into the at least one through hole 111 . And the buffer layer 11 is exposed and directly contacts the active matrix organic light emitting diode device 20 to better conduct heat dissipation. That is, the heat dissipation layer 13 extends through the buffer layer 11 and the adhesive layer 15.

The heat dissipation layer 13 includes a body portion 131 and at least one extension portion 133 extending from the body portion 131. In this embodiment, the main body portion 131 is a layered layer stacked on a side of the buffer layer 11 away from the active matrix organic light emitting diode device 20. The number of the extending portions 133 is the same as the number of the through holes 111, and each of the through holes 111 is provided with an extending portion 133. In this embodiment, the at least one through hole 111 is a plurality of through holes 111, and the plurality of through holes 111 are spaced apart from each other; the at least one extending portion 133 is a plurality of extending portions 133, and the plurality of extending portions 133 are Set apart from each other.

In this embodiment, the end surface of the extending portion 133 away from the main body portion 131 is flush with the surface of the buffer layer 11 adjacent to the active matrix organic light emitting diode device 20, as shown in FIG. Referring to FIG. 2 to FIG. 4, the cross-sectional shape (top view shape) of the plurality of through holes 111 may be a circle, a rectangle, or the like, but is not limited to the rectangle shown in FIG. 2 and the rectangle shown in FIG. Other arbitrary rules or irregular shapes, such as triangles, ellipses, etc., may also be used. The plurality of through holes 111 may be arranged in a matrix as shown in FIG. 2-3, or may be arranged in multiple rows/multiple columns as shown in FIG. 4. It can be understood that the arrangement of the plurality of through holes 111 is not limited to that shown in FIGS. 2-4, and may be other arbitrary arrangements.

In this embodiment, each of the extending portions 133 of the heat dissipation layer 13 is tightly embedded in its corresponding through hole 111 (the extension portion 133 is attached/contacted to the hole wall of the through hole 111), and thus the extension The shape of the portion 133 matches the shape of the through hole 111. For example, when the cross section of the through hole 111 is circular, the shape of the extending portion 133 is cylindrical; when the cross section of the through hole 111 is rectangular, the shape of the extending portion 133 is a rectangular column shape. It can be understood that the extending portion 133 can also be disposed in the corresponding through hole 111, but not in the hole wall of the through hole 111 (ie, not tightly embedded).

As shown in FIG. 1, the heat dissipation structure 10 further includes an electromagnetic mask layer 17. The electromagnetic shielding layer 17 is disposed on a side of the heat dissipation layer 13 away from the buffer layer 11 .

The electromagnetic mask layer 17 may be made of a material having an electromagnetic mask function, such as metallic copper, which is conventionally used in the art.

It can be understood that an additional adhesive layer 15 may be disposed between the electromagnetic shielding layer 17 and the heat dissipation layer 13 to integrate the electromagnetic shielding layer 17 and the heat dissipation layer 13 into one body.

The active matrix organic light emitting diode device 20 includes an electron transport layer (not shown) formed on the heat dissipation layer 13 , a light emitting layer (not shown) formed on the electron transport layer, and formed in the A hole transport layer (not shown) on the light-emitting layer, and a hole injection layer (not shown) formed on the hole transport layer.

Referring to FIG. 5 , an electronic device 200 according to a second embodiment of the present invention is an OLED display device including a heat dissipation structure 10 and an active matrix organic light emitting diode device 20 disposed on the heat dissipation structure 10 . The heat dissipation structure 10 serves as a support substrate for the active matrix organic light emitting diode device 20.

It is to be understood that the active matrix organic light emitting diode device 20 includes a thin film transistor (TFT) layer and a light emitting diode layer laminated on the TFT layer. Preferably, the active matrix organic light emitting diode device 20 can be flexible, that is, the OLED display device is a flexible OLED display device.

It can be understood that the active matrix organic light emitting diode device 20 of the electronic device 100 can also be replaced with other electronic devices capable of generating thermal energy.

The heat dissipation structure 10 can not only support the active matrix organic light emitting diode device 20 but also conduct heat from the active matrix organic light emitting diode device 20. The heat dissipation structure 10 of the present embodiment also includes a buffer layer 11, a heat dissipation layer 13 and an adhesive layer 15; unlike the heat dissipation structure 10 shown in FIG. 1, the adhesive layer 15 of the present embodiment is disposed at a different position.

At least one through hole 111 penetrating the buffer layer 11 is correspondingly opened in the buffer layer 11 . An adhesive layer 15 is disposed on the wall of each of the through holes 111. The heat dissipation layer 13 extends into the at least one through hole 111 to expose the heat dissipation layer 13 to the buffer layer 11 , and the heat dissipation layer 13 can directly contact the active matrix organic light emitting diode device. 20 for better conduction heat dissipation. That is, the heat dissipation layer 13 extends through the buffer layer 11.

The heat dissipation layer 13 includes a body portion 131 and at least one extension portion 133 extending from the body portion 131. The main body portion 131 is a layered layer stacked on a side of the buffer layer 11 away from the active matrix organic light emitting diode device 20. The number of the extending portions 133 is the same as the number of the through holes 111, and one extending portion 133 is embedded in each of the through holes 111. An adhesive layer 15 is not disposed between the main body portion 131 and the buffer layer 11, and the adhesive layer 15 is disposed on the hole wall of the through hole 111 between the buffer layer 11 and the extending portion 133 to The buffer layer 11 and the heat dissipation layer 13 are integrated into one body. In this embodiment, the at least one through hole 111 is a plurality of through holes 111, and the plurality of through holes 111 are spaced apart from each other. The adhesive layer 15 is formed on the hole wall of each of the through holes 111 for integrating the buffer layer 11 and the heat dissipation layer 13 into one body.

In this embodiment, the end surface of the extending portion 133 away from the main body portion 131 is flush with the surface of the buffer layer 11 adjacent to the active matrix organic light emitting diode device 20, as shown in FIG. As shown in FIG. 5, the heat dissipation structure 10 further includes an electromagnetic mask layer 17. The electromagnetic shielding layer 17 is disposed on a side of the heat dissipation layer 13 away from the buffer layer 11 . The electromagnetic shielding layer 17 can be selected from the field A material commonly used for electromagnetic shielding, such as metallic copper. It can be understood that an additional adhesive layer 15 may be disposed between the electromagnetic shielding layer 17 and the heat dissipation layer 13 to integrate the electromagnetic shielding layer 17 and the heat dissipation layer 13 into one body.

The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to be limiting, and the above, the left, the right and the right directions appearing in the drawings are only for convenience of understanding, although the present invention is described in detail with reference to the preferred embodiments, A person skilled in the art should understand that the technical solutions of the present invention may be modified or equivalently substituted without departing from the spirit and scope of the technical solutions of the present invention.

Claims (10)

  1. A heat dissipation structure comprising a buffer layer and a heat dissipation layer, wherein the heat dissipation layer comprises a body portion laminated on one side of the buffer layer and at least one extension portion extending from the body portion, each extension portion extending through the body The buffer layer has a force buffering function and is made of foam or silicone.
  2. The heat dissipation structure of claim 1, wherein the buffer layer is correspondingly provided with at least one through hole penetrating the buffer layer, and each of the extension portions is embedded in a corresponding one of the through holes.
  3. The heat dissipation structure of claim 2, wherein: an adhesive layer is disposed between the main body portion and the buffer layer to bond the buffer layer and the heat dissipation layer, and the extension portion penetrates the adhesive layer Floor.
  4. The heat dissipation structure of claim 2, wherein: each of the extensions is attached/contacted to a wall of the hole corresponding to the through hole.
  5. The heat dissipation structure according to claim 2, wherein an adhesive layer is disposed on a wall of each of the through holes to bond the extension portion and the buffer layer.
  6. The heat dissipation structure of claim 2, wherein the at least one through hole is a plurality of through holes, and the plurality of through holes are spaced apart from each other.
  7. The heat dissipation structure according to claim 1, wherein the end surface of the extending portion away from the main body portion is flush with a surface of the buffer layer.
  8. An electronic device comprising a heat-generating electronic device and a heat dissipation structure laminated on a side of the heat-generating electronic device, the heat dissipation structure being the heat dissipation structure according to any one of claims 1-7.
  9. The electronic device of claim 8, wherein: the buffer layer and the extension of the heat dissipation structure are directly attached to the heat-generating electronic device.
  10. A display device comprising a substrate and an active matrix organic light emitting diode device formed on the substrate, the substrate being the heat dissipation structure according to any one of claims 1-7.
TW107113407A 2018-04-13 2018-04-19 Heat dissipating structure, electronic device and display device using same TWI668495B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201810331839.1A CN108389885A (en) 2018-04-13 2018-04-13 Radiator structure and apply its electronic device and display device
??201810331839.1 2018-04-13

Publications (1)

Publication Number Publication Date
TWI668495B true TWI668495B (en) 2019-08-11

Family

ID=63074006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107113407A TWI668495B (en) 2018-04-13 2018-04-19 Heat dissipating structure, electronic device and display device using same

Country Status (2)

Country Link
CN (1) CN108389885A (en)
TW (1) TWI668495B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102403419A (en) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 Manufacturing technology of high-power LED radiating structure
TW201218467A (en) * 2010-10-29 2012-05-01 Foxsemicon Integrated Tech Inc Light emitting element
US20120161190A1 (en) * 2010-12-22 2012-06-28 Zhimin Jamie Yao Electronic device submounts including substrates with thermally conductive vias
TW201424063A (en) * 2012-12-13 2014-06-16 Hon Hai Prec Ind Co Ltd Light-emitting diode module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201218467A (en) * 2010-10-29 2012-05-01 Foxsemicon Integrated Tech Inc Light emitting element
US20120161190A1 (en) * 2010-12-22 2012-06-28 Zhimin Jamie Yao Electronic device submounts including substrates with thermally conductive vias
CN102403419A (en) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 Manufacturing technology of high-power LED radiating structure
TW201424063A (en) * 2012-12-13 2014-06-16 Hon Hai Prec Ind Co Ltd Light-emitting diode module

Also Published As

Publication number Publication date
CN108389885A (en) 2018-08-10

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