TW201941315A - Die mounting device and manufacturing method of semiconductor device for enhancing positioning precision - Google Patents

Abstract

The subject of the present invention is to provide a die mounting device for enhancing positioning precision. The solution of the present invention is to provide a die mounting device comprising: a bonding head for carrying the picked die on a substrate; a target indicator which is mounted on the upper portion of the bonding head for emitting light; and a camera device for photographing the position identification label of the substrate and the target indicator; wherein, the camera device photographs the target indicator while the focal point is deviated.

Description

Sticky crystal device and manufacturing method of semiconductor device

This case relates to a die attach device, for example, a die attach device that can be applied to a camera having an identification substrate.

A part of the manufacturing process of a semiconductor device includes a process in which a semiconductor wafer (hereinafter referred to as a die) is mounted on a wiring board or a lead frame (hereinafter referred to as a substrate) in a combined package, and a part of the combined packaging process includes a semiconductor crystal A process (cutting process) of dividing a die by a circle (hereinafter referred to as a wafer) and a die bonding process of mounting the divided die on a substrate. A semiconductor manufacturing apparatus used in a die bonding process is a die bonding apparatus such as a die bonding machine.

The die bonder is a device that uses solder, gold plating, and resin as bonding materials to bond (mount and adhere) the crystal grains to the substrate or the bonded crystal grains. In a die-bonding machine for bonding crystal grains to the surface of a substrate, for example, a suction nozzle called a chuck is used to pick up the crystal grains from the wafer and pick them up (pick-up process), transfer them to the substrate, apply a pressing force, and borrow The operation (work) of joining (joining process) by heating the joining material is repeated.

At the time of the picking process and the joining process described above, in cooperation with each process, a crystal device or a substrate is captured by an imaging device, and positioning and inspection are performed by image processing based on the captured image.

[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-171107
[Patent Document 2] Japanese Patent Laid-Open No. 2016-197629
[Patent Document 3] Japanese Patent Application Publication No. 2016-197630

(Problems to be solved by the invention)

However, with the recent development of chip-on-chip lamination technology for package miniaturization, thinning of chips, and thinning of crystal grains, the bonding of the crystal grains must be more strictly positioned at a single-digit μm. In order to improve the positioning accuracy, it is important to accurately grasp the positions of the mounting units such as the bonding head, the camera system, and the like involved in the bonding process, and the posture specified by the rotation angle.
The object of the present case is to provide a die-bonding device that improves positioning accuracy.
Other problems and novel features can be clearly understood from the description of this specification and the drawings.

(Means for solving problems)

A brief summary of the representative in this case is as follows.
That is, the sticky crystal device has:
A bonding head, which is configured to load the picked die on a substrate;
A target marker that emits light on the upper part of the bonding head; and an imaging device that picks up the position identification mark of the substrate and the target marker,
The imaging device is in a state where the focus is deviated and captures the target indicator.

[Effect of the invention]

According to the above-mentioned sticking crystal device, the positioning accuracy can be further improved.

Hereinafter, the embodiments, modifications, and examples will be described using drawings. However, in the following description, the same components are denoted by the same reference numerals, and redundant descriptions may be omitted. In addition, in order to make the description clearer, the width, thickness, and shape of each part may be schematically shown in comparison with the actual form. However, this is an example and does not limit the interpreter of the present invention.

First, the problems related to positioning will be described using FIGS. 1 to 4. FIG. 1 is a diagram illustrating the coordinate system of a joint head and a camera. FIG. 2 is a diagram illustrating a method of coupling a coordinate system of a joint head and a camera. FIG. 3 is a diagram illustrating the effect of pitching on the X-axis or Y-axis of the bonding head to the Z-axis. FIG. 4 is a diagram illustrating displacement of the bonding head.

As shown in FIG. 1, the camera CA that picks up a workpiece such as a substrate is mounted on the XY stage DU1, and the bonding head HD is mounted on another XY stage DU2. It is desirable to stabilize the joining accuracy by accurately grasping the position of the joining head of the joining device. However, it is difficult to mechanically make the joint heads HD mounted on different XY stages completely coincide with the coordinate system of the camera CA (optical system).

In order to accurately grasp the position of the bonding head HD, there is a method of setting a plurality of marks on the pressure-sensitive paper PSP with the bonding head HD, and forming a conversion matrix of the two plane coordinate systems of the bonding head and the optical system. In this method, if there are not a considerable number of marks, the effects of pitching and yawing of the XY stage DU2 of the bonding head HD cannot be removed. Therefore, in this method, the correction of swing and roll is impossible. In addition, when the positional relationship between the XY stage DU2 of the joint head HD and the XY stage DU1 of the camera CA changes due to thermal deformation of the gantry or the like, the influence cannot be removed. Moreover, the position of the bonding head HD cannot be monitored in real time.

As shown in FIG. 3, the swing caused by the X-axis or Y-axis movement of the bonding head HD affects the Z-axis. That is, the swing of the XY stage DU2 equipped with the joint head HD, the roll, and the like also cause a displacement in the elevation angle of the joint head HD, a displacement in the elevation direction, and a displacement in the θ direction. The change in elevation angle affects the landing position (landing position variation) of the joint head HD. Therefore, in order to achieve accurate joining, the inclination (elevation angle) of the Z axis of the joining head HD mounted on the XY stage must also be grasped. As shown in FIG. 4, it is necessary to detect the XY displacement (XY displacement) of the joining head HD Coordinates) and further Z displacement (head height), elevation angle (head elevation angle (α)) and elevation direction (head elevation angle direction (β)), head displacement (head rotation (θ )).

<Embodiment>
Next, an embodiment related to an example of solving the above problems will be described with reference to FIGS. 5 to 8. FIG. 5 is a diagram showing a relationship between a camera, a bonding head, and a substrate according to the embodiment. FIG. 6 is a diagram illustrating a relationship between a light emitting target indicator and an alignment mark. FIG. 7 is a diagram showing a photographed image of the light-emitting target marker of FIG. 6. FIG. 8 is a diagram showing a configuration example of a light emitting target indicator.

As shown in FIG. 5, the camera CA of the imaging device monitors the coordinates of the target position (position identification mark) TP on the substrate S and the joint head together. Thereby, the coordinate system in the image of the camera CA can be centrally managed, and an accurate displacement amount can be calculated. In addition, the position of the bonding head HD can be monitored in real time, and thermal deformation and the like can be handled.

In order to monitor the coordinates of the bonding head HD, as shown in FIG. 6, a light emitting target indicator LTM constituted by an LED light source is mounted on the bonding head HD, and its position is detected by the camera CA. At this time, because the target on the substrate S is focused, the light-emitting target indicator LTM is located at a distance (Lh) shorter than the focal distance (Lf) of the camera CA, and the photographed image is defocused, as shown in FIG. 7 Generally, the light source (light emitting target indicator LTM) will appear round to form a circular image CI. The circular image CI follows the movement of the bonding head HD linearly. Therefore, even for this defocused circular image CI, the relative position of the camera CA and the joint head HD can be obtained. In addition, the circular image CI is larger than the light source image at the time of focusing. The positioning accuracy of a large circle is better than that of a small circle. Generally, in the case of a circle, the circumferential length of the image interface is long, and the positioning accuracy is better.

In addition, if the LED is directly mounted on the bonding head HD, the position of the light emitting target indicator LTM will be moved due to the effect of self-heating during the light emission of the LED, so as shown in FIG. 8, the light source LS, which is also a heat source, will be separated. The bonding head HD preferably guides light to the position of the light emitting target indicator LTM on the upper portion of the bonding head HD through the optical fiber OF. By using an optical fiber to separate the target indicator portion of the light emitting light source from the heat source, the position of the light emitting target indicator LTM can be stabilized.

Here, compare with other examples. FIG. 9 is a diagram illustrating a comparison between a light-emitting target marker and other target markers according to the embodiment. FIG. 9 (A) is a view showing a state where a camera focuses on a target on a substrate, and FIG. 9 (B) is a view showing a state where FIG. 9 (C) is a view showing a case where the target marker of the first comparative example is mounted on the head, and FIG. 9 (D) is a view showing FIG. 9 (C) FIG. 9 (E) is a view showing a case where the bonding head is tilted, and FIG. 9 (E) is a view showing a case where the light emitting target indicator of the embodiment is mounted on the bonding head.

For the following reasons, the method of using the light emitting light source as the target indicator mounted on the bonding head HD is superior.

At the position of the camera CA shown in FIG. 9 (A), the target on the substrate S is focused.

As shown in FIG. 9 (B), if a normal target marker TM that does not emit light with a glass evaporation type is mounted on the upper part of the bonding head HD, the target marker TM is out of focus and the image is defocused. Overlapping makes it difficult to identify the target marker TM. In addition, it is necessary to provide additional lighting, so that the surrounding area is also illuminated. Therefore, the peripheral design must be designed in such a way that the target marker TM can be exposed. As shown in FIG. 9 (E), an embodiment in which an LED with a small light spot is mounted for identification (using a light emitting target indicator LTM) can improve the contrast with the surroundings.

As shown in FIG. 9 (C), it is possible to think of mounting a mirror MR or 稜鏡, etc., and to mount the target mark TM on the side of the joint head HD, and focus, but if using a mirror MR or 稜鏡, etc., as shown in FIG. As shown in 9 (D), it is difficult to grasp the position when the elevation angle of the joint head HD changes.

Next, the correction of the positional deviation of the bonding head will be described using FIG. 10. Fig. 10 is a diagram illustrating the positional deviation of the joint head. Figs. 10 (A) and 10 (D) are diagrams showing a state where the positional deviation is not caused. FIG. 10 (C) is a diagram showing a state where the position of the bonding head is shifted in the negative direction of the Y axis.

As shown in FIGS. 10 (B) and (C), when the amount of movement of the bonding head HD increases or decreases, the camera CA can be used to identify the light-emitting target indicator LTM provided on the top of the bonding head HD, and it can be detected. Increase or decrease in movement amount (position deviation amount). By correcting this part, the joining position can be accurately controlled.

According to the embodiment, one or a plurality of effects shown below can be obtained.
(1) By measuring the positions of the substrate and the bonding head of the workpiece with one camera, the relative position can be detected in the coordinate system of the image of one camera. Unnecessary correction processing for coordinate alignment between cameras or units can be omitted.
(2) The coordinates of the joint head can be measured each time. Therefore, reliance on correction data generated before construction can be reduced.
(3) By using a light-emitting target marker, it is possible to stably acquire a captured image in an unfocused state.
(4) The accuracy of the joining can be improved by accurately grasping the position of the space of the joining head.

＜ Modifications ＞
In the following, some representative modifications of the embodiments are given. In the following description of the modification example, the same reference numerals as those of the above-mentioned embodiment may be used for portions having the same configuration and function as those described in the above-mentioned embodiment. In addition, the description about such a part is a description which can appropriately refer to the said embodiment within the range which is not technically contradictory. In addition, a part of the above-described embodiment and all or a part of the plural modifications can be appropriately combined in a technically non-contradictory range.

In the embodiment, there is one light emitting target mark mounted on the bonding head. However, by mounting a plurality of light emitting target marks, it is possible to measure the rotation, height, and elevation angle of the bonding head.

(First Modification)
The first modification is an example of measuring the rotation and height of the bonding head, and it will be described using FIG. 11.

FIG. 11 is a diagram illustrating a light-emitting target marker according to a first modification. FIG. 11 (A) is a front view of the light-emitting target marker according to the embodiment, and FIG. 11 (B) is a front view of the light-emitting target marker according to the first modification. FIG. 11 (C) is a front view of the light emitting target indicator when the bonding head is rotated, FIG. 11 (D) is a front view of the light emitting target mark when the bonding head is raised, and FIG. 11 (E) is a first modification FIG. 11 (F) is a photographed image of FIG. 11 (A), FIG. 11 (G) is a photographed image of FIG. 11 (B), and FIG. 11 (H) is FIG. 11 (C) Fig. 11 (I) is a photographic portrait of Fig. 11 (D).

As shown in FIG. 11 (A) and FIG. 11 (B), a first modification example is to mount a light emitting target marker smaller than the light emitting target marker LTM of the embodiment on five joint heads HD. One light-emitting target indicator LTM1 is arranged at the center, four light-emitting target indicators LTM2, LTM3, LTM4, and LTM5 are equidistantly arranged on the perimeter, and three light-emitting target indicators LTM1, LTM2, and LTM3 are arranged at the same distance. It is arranged in a straight line in the first direction. The three light-emitting target markers LTM1, LTM4, and LTM5 are arranged in a straight line in the second direction. The first direction is a direction orthogonal to the second direction. As shown in FIG. 11 (A) (B), the height of the bonding head HD is the same. As shown in FIG. 11 (E) (F), the light emitting target indicator is a circular image. The circular images of the light-emitting target markers LTM1 to LTM5 are smaller than the circular images of the light-emitting target marker LTM of the embodiment.

When the bonding head HD is rotated, as shown in FIG. 11 (H), the positions of the images of the plurality of light-emitting target markers located on a line are also rotated, so that θ can be measured. When the height of the bonding head HD is changed, as shown in FIG. 11 (I), the size of the image of the light emitting target indicator and the distance between the images of the light emitting target indicator also change. By measuring the change in the distance between the images of the luminous target indicator, the Z (height) displacement of the bonding head HD can be measured.

In addition, by measuring the size of the image of the light emitting target indicator, the Z (height) displacement of the bonding head HD can also be measured.

By multiplexing the light emitting target indicator, it is possible to detect the displacement of the height of the joint head and theta rotation.

(Second Modification)
The second modification is an example in which the inclination component of the bonding head is detected, and is described with reference to FIGS. 12 to 14.

FIG. 12 is a diagram illustrating a light emitting target indicator according to a second modification. FIG. 13 is a diagram illustrating the measurement of the inclination of the bonding head. FIG. 13 (A) is an image of the light emitting target indicator when the bonding head is not inclined. FIG. FIG. 13 (C) is a portrait of the light-emitting target indicator when the joint is tilted, and FIG. 13 (C) is a portrait of the light-emitting target indicator when the bonding head is inclined. FIG. 14 is a diagram illustrating the measurement of the inclination of the bonding head. FIGS. 14 (A) and (D) are diagrams showing a state where the bonding head is not inclined, and FIG. 14 (B) (C) is a diagram showing the inclination of the bonding head. State diagram.

As shown in FIG. 12, the plurality of light emitting target indicators LTM are set at different heights (ΔH> 0). In other words, the light emitting target indicator LTM is mounted at a position where the height of the upper part of the bonding head HD is different. At this time, even if the size of the light emitting target indicator LTM is the same, the focal distance will be different. As shown in FIG. 13 (A), the defocused circular images have different sizes. By measuring the distance between the centers of the circular images, it can be distinguished whether the bonding head HD is inclined or the moving distance of the bonding head HD is different. As shown in FIG. 13 (B), if the images of two light-emitting target markers LTM with different distances between the subjects move at equal distances (Lb = La), the bonding head HD moves in the XY direction, as shown in FIG. 13 ( C) As shown in the figure, if the distance between the images of the two light-emitting target markers LTM is changed (Lc ≠ La), it can be determined that the bonding head HD is inclined.

Therefore, as shown in FIGS. 14 (B) and (C), when the bonding head HD is tilted, by changing the setting height of the plural luminous target indicator, it is possible to detect the elevation angle displacement and the elevation direction of the bonding head.

(Third Modification)
The third modification is an example of measuring the rotation, height, and inclination of the bonding head, and is described with reference to FIG. 15. FIG. 15 is a diagram illustrating a light emitting target indicator according to a third modification.

As shown in FIG. 15, the third modification is an example in which the first modification and the second modification are combined. In the third modification, five light-emitting target markers are mounted in the same configuration as the first modification. On the upper part of the joint head HD. One light-emitting target indicator LTM1 is arranged at the center, four light-emitting target indicators LTM2, LTM3, LTM4, and LTM5 are equidistantly arranged on the perimeter, and three light-emitting target indicators LTM1, LTM2, and LTM3 are arranged at the same distance. It is arranged in a straight line in the first direction. The three light-emitting target markers LTM1, LTM4, and LTM5 are arranged in a straight line in the second direction. The first direction is a direction orthogonal to the second direction. Then, the heights of the three light-emitting target marks arranged in a line in the first direction are changed, and the heights of the three light-emitting target marks arranged in a line in the second direction are changed. Thereby, the rotation, height, and inclination of the bonding head can be measured.

If the number of light emitting target markers or the type of the distance are increased to use statistical calculation processing, more accurate measurement can be performed.

(Fourth Modification)
FIG. 16 is a diagram showing a configuration example of a light emitting target indicator according to a fourth modification. FIG. 17 is a diagram explaining the superimposition of a close circular image.

The light-emitting target markers LTM1 to LTM5 of the third modification are made of an integrated type of quartz glass QG with different thickness depending on the location. For example, holes (light guide paths) OC1 are formed at the positions of the light-emitting target markers LTM1, LTM2, and LTM3. OC2, OC3, from the light sources LS1, LS2, LS3 through the optical fibers OF1, OF2, OF3 to guide light to the holes OC1, OC2, OC3. Thereby, the relative position can be stabilized. In addition, by controlling the light emission of each of the light sources LS1, LS2, and LS3 by the power source control units PC1, PC2, and PC3, each of them can be turned on to prevent the influence of the superimposed circular image as shown in FIG. 17. The light emitting target indicators LTM4 and LTM5 are also configured in the same manner.

An example in which the above-described embodiment is applied to a die attach machine will be described below.

[Example]

FIG. 18 is a schematic plan view showing a die bonder according to the embodiment. FIG. 19 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 18.

The die attacher 10 is roughly divided into a supply unit 1, a pick-up unit 2, an intermediate stage unit 3, a joint unit 4, a transport unit 5, a substrate supply unit 6, a substrate carry-out unit 7, and a control unit 8 that monitors and controls the operation of each unit. The supply unit 1 is a die D for supplying a substrate S mounted on a product area (hereinafter referred to as a package area P) printed with one or a plurality of final 1 packages printed. The Y-axis direction is the front-back direction of the die attach machine 10, and the X-axis direction is the left-right direction. The die supply section 1 is arranged on the front side of the die attacher 10, and the bonding section 4 is arranged on the inner side.

First, the die supply unit 1 is a die D that supplies a package region P mounted on a substrate S. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11, and a jacking unit 13 indicated by a dotted line that lifts the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means (not shown), and the picked-up die D is moved to the position of the jack unit 13.

The pick-up section 2 includes a pick-up head 21 that picks up the die D, a Y-driving section 23 that picks up the pick-up head 21 in the Y direction, and a not-shown diagram that moves the chuck 22 up, down, and moves the X-direction. Each driving section. The pick-up head 21 is a chuck 22 (see also FIG. 19) that sucks and holds the jacked-up crystal grains D at the front end, picks up the crystal grains D from the crystal grain supply unit 1, and places them on the intermediate stage 31. The pick-up head 21 includes drive units (not shown) for raising, lowering, rotating, and moving the chuck 22 in the X direction.

The intermediate stage unit 3 includes an intermediate stage 31 on which the die D is temporarily placed, and a stage identification camera 32 for identifying the die D on the intermediate stage 31.

The bonding portion 4 picks up the die D from the intermediate stage 31 and is bonded to the package area P of the substrate S that has been transported, or is bonded in a form of being stacked on the die that has been bonded to the package area P of the substrate S. . The bonding section 4 includes a bonding head 41 including a chuck 42 (also referred to in FIG. 19) for holding and holding the crystal grain D on the tip end in the same manner as the pickup head 21, and a Y driving section 43 for moving the bonding head 41 in the Y direction. And a substrate identification camera 44 that picks up a position identification mark (not shown) of the package area P of the substrate S, and identifies the bonding position. Here, the bonding head 41 corresponds to the bonding head HD of the embodiment, and includes a light-emitting target indicator LTM of the embodiment and any one of the first modification to the third modification in the upper portion thereof.
With this configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the platform recognition camera 32, picks up the die D from the intermediate platform 31, and bonds the die D to the substrate based on the imaging data of the substrate recognition camera 44. .

The transfer unit 5 includes a substrate transfer claw 51 that grips and transfers the substrate S, and a transfer rail 52 that moves the substrate S. The substrate S is moved by driving a nut (not shown) of the substrate transfer claw 51 provided on the transfer rail 52 with a ball screw (not shown) provided along the transfer rail 52.
With such a configuration, the substrate S is moved from the substrate supply section 6 to the bonding position along the transfer rail 52, and after the bonding, the substrate S is moved to the substrate carrying-out section 7 and the substrate S is delivered to the substrate carrying-out section 7.

The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each unit of the die attacher 10, and a central processing unit (CPU) that executes the program stored in the memory.

Next, the structure of the crystal grain supply part 1 is demonstrated using FIG. 20 and FIG. 21. FIG. FIG. 20 is a diagram showing an external perspective view of a die supply unit. FIG. 21 is a schematic cross-sectional view showing a main part of a crystal grain supply unit.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction), and a jacking unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expansion ring 15 that holds the wafer ring 14, and a horizontal support ring 17 that positions the dicing tape 16 that is held on the wafer ring 14 and has a plurality of dies D adhered thereto. The jacking unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expansion ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 will be pulled up, and the interval between the crystal grains D will be increased. Picking up. In addition, as the thickness is reduced, the adhesive that adheres the crystal grains to the substrate changes from a liquid state to a thin film state. A film called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. Like adhesive material. For the wafer 11 having the die-attached film 18, the dicing is performed on the wafer 11 and the die-attached film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

The die attacher 10 includes a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a platform recognition camera 32 that recognizes the posture of the die D placed on the intermediate platform 31, and a bonding platform. The substrate identification camera 44 at the mounting position on the BS. It is necessary to correct the posture deviation between the recognition cameras. The platform recognition camera 32 participating in the pickup of the bonding head 41 and the substrate recognition camera 44 participating in the bonding of the bonding head 41 to the mounting position.

The control unit 8 will be described using FIG. 22. 22 is a block diagram showing a schematic configuration of a control system. The control system 80 includes a control unit 8, a driving unit 86, a signal unit 87, and an optical system 88. The control unit 8 is roughly divided into a control / computing device 81 mainly composed of a CPU (Central Processor Unit), a memory device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The memory device 82 includes a main memory device 82a constituted by a RAM such as a memory processing program, and an auxiliary memory device 82b constituted by HDD, SSD, or the like, such as control data or image data necessary for memory control. The input / output device 83 is a monitor 83a for displaying device status or information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor, and an image for acquiring image data from the optical system 88. Take-in device 83d.
The input / output device 83 includes:
A motor control device 83e, which is a drive unit 86 that controls an XY stage (not shown) of the die supply unit 1 or a ZY drive shaft of the joint head stage; and
The I / O signal control device 83f takes in or controls signals from a signal unit 87, such as various sensor signals or switches such as lighting devices.
The optical system 88 includes a wafer identification camera 24, a platform identification camera 32, and a substrate identification camera 44. The control / calculation device 81 fetches necessary data via the bus line 84, performs calculations, and transmits the information to the control of the pickup head 21 or the like or the monitor 83a or the like.

The control unit 8 stores the image data captured by the wafer identification camera 24, the platform identification camera 32, and the substrate identification camera 44 in the memory device 82 via the image taking device 83d. By using software programmed based on the stored image data, the control unit 81 is used to perform positioning of the die D and the package region P of the substrate S, and surface inspection of the die D and the substrate S. Based on the positions of the die D and the package area P of the substrate S calculated by the control unit 81, the drive unit 86 is actuated by the software via the motor control device 83e. According to this process, the die is positioned on the wafer, and the driving sections of the pickup section 2 and the bonding section 4 are operated to bond the die D to the package region P of the substrate S. The wafer identification camera 24, the platform identification camera 32, and the substrate identification camera 44 to be used are gray scale, color, and the like, and the light intensity is quantified.

FIG. 23 is a flowchart illustrating a die bonding process of the die bonder of FIG. 18.
In the die bonding process of the embodiment, first, the control unit 8 removes the wafer ring 14 holding the wafer 11 from the wafer cassette, places the wafer ring 14 on the wafer holding table 12, and transfers the wafer holding table 12 to the process. A reference position for picking up the die D (wafer loading (process P1)). Next, the control unit 8 performs fine adjustment from the image acquired by the wafer recognition camera 24 so that the arrangement position of the wafer 11 exactly matches the reference position thereof.

Next, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch and maintains it horizontally, thereby arranging the first picked-up die D at the pick-up position (die transfer (process P2) )). The wafer 11 is inspected for each die by an inspection device such as a probe in advance, and map data indicating good or bad is generated for each die, and is stored in the memory device 82 of the control unit 8. The determination of whether the crystal grain D to be picked is a good product or a defective product is performed based on the map data. When the die D is defective, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is mounted at a predetermined pitch, arranges the next picked die D at the pickup position, and skips the defective die. Grain D.

The control unit 8 picks up the principal surface (upper surface) of the pick-up die D by the wafer recognition camera 24, and calculates the position deviation amount of the pick-up die D from the pick-up position from the acquired image. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed in accordance with the position deviation amount, and correctly arranges the pick-up die D at the pick-up position (die positioning (process P3)).

Next, the control unit 8 performs a surface inspection of the die D from the image acquired by the wafer recognition camera 24 (process P4). Here, the control unit 8 determines whether there is a problem by surface inspection, and determines that there is no problem with the surface of the crystal grain D, and proceeds to the next process (process P9 described later). Or carry out further high-sensitivity inspections or inspections where lighting conditions are changed. If there is a problem, skip the process. If there is no problem, perform a sub-process. The skip process is performed after the process P9 of skipping the die D, and the wafer holding table 12 on which the wafer 11 is placed is moved at a predetermined pitch, and the next picked-up die D is arranged at the picking position.

The control unit 8 uses the substrate supply unit 6 to place the substrate S on the transfer rail 52 (substrate loading (process P5)). The control unit 8 moves the substrate transfer claw 51 that grips the substrate S to the bonding position (substrate transfer (process P6)).

The substrate identification camera 44 captures a position identification mark (not shown) of the package area P of the substrate S, and recognizes the bonding position for positioning (substrate positioning (process P7)).

Next, the control unit 8 performs a surface inspection of the package region P of the substrate S from the image acquired by the substrate recognition camera 44 (process P8). Here, the control unit 8 determines whether there is a problem by surface inspection. When it is determined that there is no problem on the surface of the package area P of the substrate S, the process proceeds to the next process (process P9 described later). However, when it is determined that there is a problem, it is confirmed visually. For surface portraits, or further high-sensitivity inspections or inspections where lighting conditions have been changed, skip processing if there is a problem, or sub-process processing if there is no problem. The skip processing is to skip the process of the tape-and-reel automatic joining process P10 of the package area P of the substrate S, and then perform defective registration of the substrate operation information.

The control unit 8 picks up the die D to be picked up at the picking position by the die supply unit 1 and picks up the die D from the dicing tape 16 by the picker 21 including the chuck 22 (die) Manipulate (process P9)) and place it on the intermediate platform 31 ((process P10). The control unit 8 picks up the die D with the platform recognition camera 32 and deviates the orientation (rotational deviation) of the die placed on the intermediate platform 31. ) Detection (process P11). When there is a posture deviation, the control unit 8 rotates the intermediate platform 31 on a plane parallel to a mounting surface having a mounting position by a swivel driving device (not shown) provided on the intermediate platform 31. Correct posture deviation.

The control unit 8 performs a surface inspection of the crystal grain D from the image acquired by the platform recognition camera 32 (process P12). Here, the control unit 8 determines whether there is a problem by surface inspection, and determines that the process proceeds to the next process (the process P13 described later) when there is no problem on the surface of the crystal grain D. However, when it is determined that there is a problem, the surface image is visually confirmed. Further, a high-sensitivity inspection or an inspection with changed lighting conditions may be performed. If there is a problem, the die is placed on a defective tray (not shown) and the processing is skipped. If there is no problem, a secondary process is performed. The skip process is performed after the process P13 of skipping the die D, and the wafer holding table 12 on which the wafer 11 is placed is moved at a predetermined pitch, and the next picked-up die D is arranged at the pickup position.

The control unit 8 picks up the die D from the intermediate stage 31 by the bonding head 41 including the chuck 42 and bonds the die to the package area P of the substrate S or the die (the package area P that has been bonded to the substrate S) ( Die attach (Project P13)). The control unit 8 uses the substrate recognition camera 44 to pick up the light emitting target indicator mounted on the upper part of the bonding head 41, recognizes the position and posture of the bonding head 41, and corrects when the position or posture deviates.

After joining the die D, the control unit 8 picks up the die D and the substrate S with the substrate recognition camera 44 and checks whether the joining position is correct (the relative position of the die and the substrate is checked (process P14)). At this time, the center of the crystal grains and the center of the tape-and-roll automatic joining are obtained in the same manner as the alignment of the crystal grains, and it is checked whether the relative position is correct.

Next, the control unit 8 performs surface inspection of the crystal grain D and the substrate S from the image acquired by the substrate recognition camera 44 (process P15). Here, the control unit 8 determines whether there is a problem by surface inspection. When it is determined that there is no problem on the surface of the bonded crystal grains D, it proceeds to the next process (process P9 described later). Check the surface image, or perform a high-sensitivity inspection or inspection to change the lighting conditions. If there is a problem, skip the process. If there is no problem, perform a sub-process. Skip processing is a bad registration of substrate start information.

Thereafter, in accordance with the same procedure, each of the die D is bonded to the package region P of the substrate S. Once the joining of one substrate is completed, the substrate S is moved to the substrate carrying-out portion 7 by the substrate carrying claw 51 (substrate carrying (process P16)), and the substrate S is delivered to the substrate carrying-out portion 7 (substrate unloading (process P17)) ).

Thereafter, in accordance with the same procedure, each of the crystal grains D is peeled from the dicing tape 16 (process P9). Once all the dies D except for defective products have been picked up, the dicing tape 16 and the wafer ring 14 holding the dies D in the shape of the wafer 11 are unloaded to the wafer cassette (process P18).

The inventions developed by the present inventors have been specifically described based on the embodiments, modifications, and examples, but the present invention is not limited to the above-mentioned embodiments, modifications, and examples, and various modifications can be implemented.

For example, in the embodiment, the grain appearance inspection and recognition are performed after the grain position recognition, but the grain location recognition may be performed after the grain appearance inspection and recognition.
In the embodiment, the DAF is attached to the back of the wafer, but the DAF may be omitted.
In the embodiment, one pickup head and one bonding head are provided, but two or more of them may be provided. In the embodiment, the intermediate platform is provided, but the intermediate platform may not be provided. In this case, the pickup head and the bonding head may be used in combination.
In the embodiment, the surfaces of the crystal grains are bonded upward, but the surface of the crystal grains may be reversed after picking up the crystal grains, and the back surface of the crystal grains may be bonded upward. In this case, the intermediate platform is optional. This device is called a flip chip adhesive.

10‧‧‧ Sticky Crystal Machine

1‧‧‧Crystal Supply Department

13‧‧‧ jacking unit

2‧‧‧Pick up department

24‧‧‧ Wafer Identification Camera

3‧‧‧Middle Platform Department

31‧‧‧ intermediate platform

32‧‧‧Platform identification camera

4‧‧‧ Junction

41‧‧‧Joint head

42‧‧‧Chuck

44‧‧‧ substrate identification camera

5‧‧‧Transportation Department

51‧‧‧ substrate transfer claw

8‧‧‧Control Department

S‧‧‧ substrate

BS‧‧‧Joint Platform

D‧‧‧ Grain

P‧‧‧Packing area

CA‧‧‧Camera

HD‧‧‧ Joint Head

LTM‧‧‧ Illuminated Target Marker

FIG. 1 is a diagram illustrating the coordinate system of a joint head and a camera.

FIG. 2 is a diagram illustrating a method of coupling a coordinate system of a joint head and a camera.

FIG. 3 is a diagram illustrating the influence of the swing on the X-axis or Y-axis of the bonding head to the Z-axis.

FIG. 4 is a diagram illustrating displacement of the bonding head.

FIG. 5 is a diagram showing a relationship between a camera, a bonding head, and a substrate according to the embodiment.

FIG. 6 is a diagram illustrating a relationship between a light emitting target indicator and an alignment mark.

FIG. 7 is a diagram showing a photographed image of the light-emitting target marker of FIG. 6.

FIG. 8 is a diagram showing a configuration example of a light emitting target indicator.

FIG. 9 is a diagram explaining a comparison between a light-emitting target marker according to the embodiment and another target marker.

FIG. 10 is a diagram illustrating a positional deviation of the bonding head.

FIG. 11 is a diagram illustrating a light emitting target indicator according to a first modification.

FIG. 12 is a diagram illustrating a light emitting target indicator according to a second modification.

FIG. 13 is a diagram illustrating the measurement of the inclination of the bonding head.

FIG. 14 is a diagram illustrating the measurement of the inclination of the bonding head.

FIG. 15 is a diagram illustrating a light emitting target indicator according to a third modification.

FIG. 16 is a diagram showing a configuration example of a light emitting target indicator according to a fourth modification.

FIG. 17 is a diagram explaining the superimposition of a close circular image.

FIG. 18 is a schematic plan view showing a configuration example of a die bonder of the embodiment.

FIG. 19 is a diagram illustrating a schematic configuration when viewed from an arrow A direction in FIG. 18.

FIG. 20 is an external perspective view showing a configuration of a crystal grain supply unit in FIG. 18.

FIG. 21 is a schematic cross-sectional view showing a main part of the crystal grain supply unit of FIG. 18.

22 is a block diagram showing a schematic configuration of a control system of the die bonder of FIG. 18.

FIG. 23 is a flowchart illustrating a die bonding process of the die bonder of FIG. 18.

Claims (15)

A crystal sticking device is characterized by: A bonding head, which is configured to load the picked die on a substrate; A target indicator, which is provided on the upper part of the joint head to emit light; and An imaging device that picks up the position identification mark of the substrate and the target indicator, The imaging device is in a state where the focus is deviated and captures the target indicator. For example, the sticky crystal device of the first patent application scope further includes a control device for controlling the joint head and the camera device, The imaging device is in a state of focusing on the position identification mark, and captures the target marker. For example, the sticky crystal device according to item 2 of the patent application range, wherein the control device measures the position of the bonding head based on a circular image of the target indicator. For example, the crystal sticking device according to item 2 of the patent application, wherein the aforementioned bonding head is provided with a plurality of the aforementioned target markers on a straight line, The control device measures the rotation or height of the bonding head based on a circular image of the target indicator. For example, the crystal sticking device of the third scope of the patent application, wherein the aforementioned bonding head is provided with a plurality of the aforementioned target markers on a straight line, The control device measures the rotation or height of the bonding head based on a circular image of the target indicator. For example, the device for sticking a crystal of item 2 of the patent scope, wherein the heights of the plurality of the aforementioned target markers are different, The control device measures a tilt or a tilt direction of the bonding head based on a circular image of the target indicator. For example, for the sticky crystal device of the third scope of the application for patent, wherein the heights of the plurality of the aforementioned target indicators are different, The control device measures a tilt or a tilt direction of the bonding head based on a circular image of the target indicator. For example, the device for sticking a crystal of item 4 of the patent application, wherein the heights of the plurality of the aforementioned target markers are different, The control device measures a tilt or a tilt direction of the bonding head based on a circular image of the target indicator. According to the crystal sticking device described in any one of claims 1 to 8, the light source of the target marker is located away from the bonding head, and the target marker and the light source are connected by optical fibers. As described in any one of claims 1 to 8 of the scope of patent application, the crystal sticking device further includes: A pick-up head for picking up the aforementioned die; and An intermediate stage on which the aforementioned die is placed, The bonding head picks up the crystal grains placed on the intermediate platform. A method for manufacturing a semiconductor device, comprising: (a) The project of preparing a sticky crystal device with a bonding head and an imaging device equipped with a light-emitting target marker on the upper part thereof, and the camera device taking the position identification mark of the substrate and the aforementioned target marker; (b) the process of moving the wafer ring fixture holding the dicing tape with the die attached; (c) the project of moving into the substrate; (d) the work of picking up the aforementioned grains; and (e) a process of bonding the picked up crystal grains to the substrate or crystal grains that have been bonded to the substrate, In the step (e), the imaging device is in a state where the focus is out of focus and captures the target indicator. For example, in the method for manufacturing a semiconductor device according to item 11 of the scope of patent application, in the step (e), the imaging device is in a state of focusing on the position identification mark, and captures the target marker. For example, in the method for manufacturing a semiconductor device according to claim 12, wherein the (e) process is to measure the position of the bonding head based on a circular image of the target indicator. For example, the method for manufacturing a semiconductor device according to item 13 of the application, wherein the bonding head is provided with a plurality of the foregoing target markers on a straight line, In the step (e), the rotation or height of the joint head is measured based on a circular image of the target indicator. For example, in the method for manufacturing a semiconductor device according to item 14 of the application, wherein the heights of the plurality of target indicators are different, In the step (e), the inclination of the bonding head is measured based on a circular image of the target indicator.