KR102399836B1 - Die bonding apparatus and manufacturing method of semiconductor device - Google Patents

Abstract

A die bonding apparatus that further improves positioning accuracy is provided.
A die bonding apparatus includes a bonding head that mounts a picked-up die on a substrate, a target marker emitting light formed on the bonding head, and an imaging device that images a position recognition mark of the substrate and the target marker . The said imaging device images the said target marker in the state out of focus.

Description

DIE BONDING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder having a camera for recognizing a substrate.

A part of the manufacturing process of a semiconductor device includes a process of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a die) on a wiring board, a lead frame, or the like (hereinafter simply referred to as a substrate). Some include a step of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) (a dicing step), and a die bonding step of mounting the divided die on a substrate. A semiconductor manufacturing apparatus used in a die bonding process is a die bonding apparatus, such as a die bonder.

A die bonder is a device for bonding (mounting and bonding) a die to a substrate or an already bonded die using solder, gold plating, or resin as a bonding material. In a die bonder that bonds a die to the surface of a substrate, for example, a suction nozzle called a collet is used to suck and pick up the die from the wafer (pickup process), transfer it onto the substrate, and apply a pressing force while , the operation (operation) of performing bonding by heating the bonding material (bonding step) is repeatedly performed.

At the time of the pickup process and bonding process mentioned above, according to each process, a dyna and a board|substrate are imaged with an imaging device, and positioning and inspection are performed by image processing based on the imaged image.

Japanese Patent Laid-Open No. 2016-171107 Japanese Patent Laid-Open No. 2016-197629 Japanese Patent Laid-Open No. 2016-197630

However, due to the recent development of chip-on-chip stacking technology due to the miniaturization and thinning of the package and the thinning of the die, the bonding of the die requires more strict single-digit order micrometer positioning. In order to increase the positioning accuracy, it is important to accurately grasp the position and the posture defined by the rotation angle of the mounting units such as the bonding head and the imaging system involved in the bonding process.

An object of the present disclosure is to provide a die bonding apparatus that further improves positioning accuracy.

Other problems and novel features will become apparent from the description of the present specification and the accompanying drawings.

A brief outline of representative ones of the present disclosure is as follows.

That is, the die bonding apparatus includes a bonding head that mounts a picked-up die on a substrate, a target marker that emits light installed on the bonding head, and an imaging device that images a position recognition mark of the substrate and the target marker. be prepared The said imaging device images the said target marker in the state out of focus.

According to the said die-bonding apparatus, positioning accuracy can be improved more.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining the coordinate system of a bonding head and a camera.
2 is a view for explaining a method of matching the coordinate system of the bonding head and the camera.
3 is a view for explaining the effect of pitching generated by the operation of the X-axis or Y-axis of the bonding head on the Z-axis.
4 is a view for explaining the displacement of the bonding head.
It is a figure which shows the relationship between the camera of embodiment, a bonding head, and a board|substrate.
It is a figure explaining the relationship between a light emitting target marker and a position alignment mark.
Fig. 7 is a diagram showing a captured image of the light emitting target marker of Fig. 6;
Fig. 8 is a diagram showing a configuration example of a light emitting target marker;
It is a figure explaining the comparison of the light emitting target marker of embodiment and another target marker.
It is a figure explaining the position shift of a bonding head.
It is a figure explaining the light emitting target marker of a 1st modified example.
It is a figure explaining the light emitting target marker of a 2nd modified example.
It is a figure explaining the measurement of the inclination of a bonding head.
It is a figure explaining the measurement of the inclination of a bonding head.
It is a figure explaining the light emitting target marker of 3rd modified example.
Fig. 16 is a diagram showing a configuration example of a light emitting target marker according to a fourth modification;
Fig. 17 is a diagram for explaining the overlap of adjacent circular shapes;
Fig. 18 is a schematic top view showing a configuration example of the die bonder of the embodiment;
Fig. 19 is a view for explaining a schematic configuration when viewed from the direction of arrow A in Fig. 18;
Fig. 20 is an external perspective view showing the configuration of the die supply section of Fig. 18;
Fig. 21 is a schematic cross-sectional view showing a main part of the die supply section of Fig. 18;
Fig. 22 is a block diagram showing a schematic configuration of a control system of the die bonder of Fig. 18;
Fig. 23 is a flowchart for explaining a die bonding process in the die bonder of Fig. 18;

EMBODIMENT OF THE INVENTION Hereinafter, embodiment, a modification, and an Example are demonstrated using drawings. However, in the following description, the same code|symbol is attached|subjected to the same component, and repeated description may be abbreviate|omitted. In addition, in order to make the description clearer, the drawings may be schematically expressed about the width, thickness, shape, etc. of each part compared to the actual aspect, but this is only an example and does not limit the interpretation of the present invention .

First, the subject of positioning is demonstrated using FIGS. 1 is a view for explaining a coordinate system of a bonding head and a camera. 2 is a view for explaining a method of matching the coordinate systems of the bonding head and the camera. 3 is a view for explaining the effect of pitching generated by the operation of the X-axis or Y-axis of the bonding head on the Z-axis. 4 is a view for explaining the displacement of the bonding head.

As shown in FIG. 1, camera CA which images workpieces, such as a board|substrate, is mounted on XY table DU1, and bonding head HD is mounted on another XY table DU2. It is intended to stabilize the bonding precision by accurately grasping the position of the bonding head in the bonding apparatus. However, it is difficult to mechanically completely match the coordinate systems of the bonding head HD mounted on different XY tables and the camera CA (optical system).

In order to accurately grasp the position of the bonding head HD, there is a method of forming a plurality of dents on the pressure-sensitive paper PSP with the bonding head HD, and creating a transformation matrix of two planar coordinate systems of the bonding head and the optical system. In this method, unless a considerable number of dents are formed, the influence of pitching and yaw of the XY table DU2 of the bonding head HD cannot be eliminated. Therefore, practically, correction of pitching and yaw by this method is impossible. Moreover, when a mount etc. are thermally deformed and the positional relationship of XY table DU2 of bonding head HD, and XY table DU1 of camera CA fluctuates, the influence cannot be eliminated. Also, it is not possible to monitor the position of the bonding head HD in real time.

As shown in Fig. 3, pitching generated by the operation of the X-axis or Y-axis of the bonding head HD affects the Z-axis. That is, from pitching, yaw, etc. occurring in the XY table DU2 on which the bonding head HD is mounted, displacement in elevation angle, displacement in elevation direction, and displacement in the θ direction of the bonding head HD also occur. By changing the elevation angle, the landing position of the bonding head HD is affected (the landing position is changed). Therefore, in order to realize accurate bonding, it is necessary to also grasp the inclination (elevation angle) of the Z-axis of the bonding head HD mounted on the XY table. As shown in Fig. 4, the XY displacement of the bonding head HD (XY offset coordinates) and also the displacement (head height), elevation angle (head elevation angle (α)) and elevation angle direction (head elevation angle direction (β)), displacement in the direction of the head itself (head rotation (θ)) need to detect

<Embodiment>

Next, embodiment which is an example which solves the above-mentioned subject is demonstrated using FIGS. 5-8. It is a figure which shows the relationship between the camera of embodiment, a bonding head, and a board|substrate. It is a figure explaining the relationship between a light emitting target marker and a position alignment mark. FIG. 7 is a diagram showing a captured image of the light emitting target marker of FIG. 6 . Fig. 8 is a diagram showing a configuration example of a light emitting target marker.

As shown in FIG. 5, the coordinates of the target position (position recognition mark) TP and bonding head on the board|substrate S are collectively monitored by camera CA which is an imaging device. Thereby, the coordinate system in the image of camera CA can manage integrally, and an accurate offset amount can be computed. In addition, since the position of the bonding head HD can be monitored in real time, it is possible to cope with thermal deformation and the like.

In order to monitor the coordinates of the bonding head HD, as shown in Fig. 6, a light emitting target marker LTM including an LED light source is installed in the bonding head HD, and the position is detected by the camera CA. At this time, since the target on the substrate S is in focus, the light emitting target marker LTM is located at a distance Lh shorter than the focal length Lf of the camera CA, and the captured image is out of focus, as shown in Fig. 7 . A light source (light emitting target marker LTM) is rounded off to form a circular shape CI. The circular CI linearly follows the movement of the bonding head HD. Therefore, even if it is circular shape CI of this defocus, the relative position of camera CA and bonding head HD can be calculated|required. In addition, circular image CI is taken larger than the light source image at the time of focusing. The positioning accuracy in a circle that is large is better than a circle that is small in image calculation. In general, in the case of a circle, the longer the circumferential length, which is the image boundary, the better the positioning accuracy.

In addition, when the LED is mounted directly on the bonding head HD, the position of the light emission target marker LTM is moved due to the effect of self-heating during light emission of the LED. It is preferable to separate from the HD and guide the light to the position of the luminescent target marker LTM on the top of the bonding head HD by the optical fiber OF. The position of the luminescent target marker LTM can be stabilized by using an optical fiber to separate the target marker portion and the heat source of the luminescent light source.

Here, it is compared with other examples. Fig. 9 is a view for explaining a comparison between the light emitting target marker of the embodiment and another target marker, and Fig. 9 (A) is a view showing a case where the camera is focused on a target on the substrate, and Fig. 9 ( B) is a diagram showing a case where the target marker of Comparative Example 1 is mounted on the bonding head, FIG. 9(C) is a diagram showing a case where the target marker of Comparative Example 2 is mounted on the bonding head, and FIG. 9 (D) is a diagram showing a case where the bonding head of FIG. 9(C) is inclined, and FIG. 9(E) is a diagram showing a case where the light emitting target marker of the embodiment is mounted on the bonding head.

From the following reasons, it can be said that the method of the embodiment using a luminescent light source as a target marker mounted on the bonding head HD is excellent.

The target on the board|substrate S is focused at the position of camera CA shown in FIG.9(A).

As shown in Fig. 9B, when a normal target marker TM that does not emit light in a glass deposition type is mounted on the bonding head HD, the target marker TM is out of focus and the image is captured out of focus, The image overlaps with the surroundings, making it difficult to identify the target marker TM. Moreover, it is necessary to install a lighting separately, and the surroundings will also illuminate. Therefore, a peripheral design is required for the target marker TM to float. As shown in Fig. 9E, in the embodiment in which an LED having a small light spot is mounted and recognized (a light emitting target marker LTM is used), the contrast difference with the surroundings can be increased.

As shown in Fig. 9(C), it is considered that a mirror MR or a prism is installed, and the target mark TM is mounted on the side of the bonding head HD to achieve focus, but if a mirror MR or a prism is used, As shown in FIG.9(D), when the elevation angle of bonding head HD changes, it becomes difficult to grasp|ascertain a position.

Next, correction|amendment of the position shift of a bonding head is demonstrated using FIG. 10 is a view for explaining the position shift of the bonding head, FIGS. 10 (A) and (D) are views showing the case where the position does not shift, and FIG. 10 (B) is the bonding head in the positive Y-axis direction. It is a figure which shows the case where there is a position shift, and FIG. 10(C) is a figure which shows the case where the bonding head is position shifted in the negative Y-axis direction.

As shown in Fig. 10 (B) and (C), when there is an increase or decrease in the movement amount of the bonding head HD, the movement amount is increased or decreased ( position deviation) can be detected. By correcting that amount, the bonding position can be precisely controlled.

According to embodiment, one or more effects shown below are acquired.

(1) By measuring the positions of the work-in substrate and the bonding head with one camera, relative position detection becomes possible in the coordinate system of one camera image. It is not necessary to perform unnecessary correction processing due to coordinate alignment between cameras or units.

(2) It becomes possible to measure the coordinates of the bonding head each time. Accordingly, it becomes possible to reduce the dependence on the correction data generated before the start of construction.

(3) By using the luminescence target marker, it becomes possible to stably obtain a captured image in an out-of-focus state.

(4) Accurately grasping the spatial position of the bonding head makes it possible to improve bonding precision.

<Modified example>

Hereinafter, some representative modifications of the embodiment will be exemplified. In the following description of the modified example, it is assumed that the same reference numerals as in the above-described embodiment can be used for parts having the same configuration and functions as those described in the above-described embodiment. In addition, about the description of such a part, it shall be assumed that the description in the above-mentioned embodiment can be used suitably within the range which does not contradict technically. In addition, all or a part of a part of embodiment mentioned above and a plurality of modified examples can be suitably and complexly applied within the range which does not contradict technically.

In the embodiment, there is only one light emitting target mark mounted on the bonding head, but by mounting a plurality of light emission target marks, the rotation of the bonding head, the height, and the measurement related to the elevation angle become possible.

(1st modification)

The first modified example is an example of measuring the rotation and height of the bonding head, and will be described with reference to FIG. 11 .

Fig. 11 is a view for explaining the light emitting target marker of the first modification, Fig. 11 (A) is a front view of the light emitting target marker of the embodiment, and Fig. 11 (B) is a front view of the light emitting target marker of the first modification. , Fig. 11 (C) is a front view of the luminescent target marker when the bonding head is rotating, Fig. 11 (D) is a front view of the luminescent target mark when the bonding head is raised, and Fig. 11 (E) ) is a side view of the light emitting target marker of the first modification, FIG. 11(F) is the captured image of FIG. 11(A), FIG. 11(G) is the captured image of FIG. 11(B), and FIG. 11(H) is the captured image of FIG. 11(C) , and FIG. 11(I) is the captured image of FIG. 11(D).

11(A) and 11(B), in the first modification, five light-emitting target markers smaller than the light-emitting target marker LTM of the embodiment are mounted on the bonding heads HD. One light emitting target marker LTM1 is arranged in the center, and four light emitting target markers LTM2, LTM3, LTM4 and LTM5 are arranged equidistantly in all directions around it, and three light emission target markers LTM1, LTM2, LTM3 are arranged in the first direction. Place them in a straight line. The three light emitting target markers LTM1, LTM4, and LTM5 are arranged in a straight line in the second direction. The first direction is a direction orthogonal to the second direction. As shown in (A) (B) of Fig. 11, the bonding head HD has the same height, and as shown in (E) (F) of Fig. 11, the light emitting target marker has a circular shape, The circular shape of the light emitting target markers LTM1 to LTM5 of the modified example is smaller than the circular shape of the light emitting target marker LTM of the embodiment.

When the bonding head HD is rotated, as shown in FIG. 11(H) , since the positions of the plurality of light emitting target markers positioned on a straight line are also rotated, θ can be measured. In addition, when the height of the bonding head HD is changed, as shown in Fig. 11(I) , the size of the image of the light emitting target marker and the distance between the images of the light emitting target marker also change. By measuring the change in the distance between the phases of the light emitting target marker, the displacement of Z (height) of the bonding head HD can be measured.

In addition, the displacement of Z (height) of the bonding head HD can be measured also by measuring the size of the image of the light emitting target marker.

By pluralizing the light emitting target markers, the height of the bonding head and the displacement of the θ rotation can be detected.

(Second Modification)

The second modification is an example of detecting the inclination component of the bonding head, and will be described with reference to FIGS. 12 to 14 .

It is a figure explaining the light emitting target marker of a 2nd modified example. 13 is a view for explaining the measurement of the inclination of the bonding head, FIG. 13 (A) is an image of the luminescent target marker when the bonding head has no inclination, and FIG. 13 (B) is the bonding head, although there is no inclination. It is an image of the light emitting target marker when it is displaced in the XY direction, and FIG. 13(C) is an image of the light emitting target marker when the bonding head has an inclination. 14 is a view for explaining the measurement of the inclination of the bonding head, FIGS. 14 (A) and (D) are views showing a state in which there is no inclination in the bonding head, and (B) (C) of FIG. 14 are bonding It is a figure which shows the state with an inclination in a head.

As shown in FIG. 12 , the plurality of light emitting target markers LTMs have different installation heights (ΔH > 0). In other words, the light emitting target marker LTM is mounted at positions with different heights of the upper part of the bonding head HD. At this time, even if the size of the light emitting target marker LTM is the same, since the focal lengths are different, as shown in FIG. 13A , the circular images of the defocus are different in size. By measuring the distance between the centers of the circular shape, it is possible to distinguish whether the bonding head HD is inclined or whether the movement distance of the bonding head HD is different. As shown in Fig. 13 (B), when two light emitting target markers LTM having different distances between subjects move at an equidistant distance (Lb = La), the bonding head HD moves in the XY direction, and in Fig. 13 (C) As shown, when the distance between the images of the two light emitting target markers LTM is changed (Lc≠La), it can be determined that the bonding head HD is inclined.

Therefore, as shown in (B) (C) of Fig. 14, when the bonding head HD is inclined, the elevation displacement and elevation direction of the bonding head can be detected by changing the installation height of the plurality of light emitting target markers. there is.

(3rd modification)

The third modified example is an example of measuring the rotation, height, and inclination of the bonding head, and will be described with reference to FIG. 15 . It is a figure explaining the light emitting target marker of a 3rd modified example.

As shown in Fig. 15 , the third modification is an example in which the first modification and the second modification are combined, and in the third modification, five light emitting target markers are bonded in the same arrangement as in the first modification. It is mounted on the top of the head HD. One light emitting target marker LTM1 is arranged in the center, and four light emitting target markers LTM2, LTM3, LTM4 and LTM5 are arranged equidistantly in all directions around it, and three light emission target markers LTM1, LTM2, LTM3 are arranged in the first direction. Place them in a straight line. The three light emitting target markers LTM1, LTM4, and LTM5 are arranged in a straight line in the second direction. The first direction is a direction orthogonal to the second direction. Further, the heights of the three light emitting target marks arranged in a straight line in the first direction are changed, and the heights of the three light emitting target marks arranged in a straight line in the second direction are changed. Thereby, rotation, height, and inclination of the bonding head can be measured.

By increasing the number of luminescent target markers and the types of distances, and using statistical calculation processing, more accurate measurement becomes possible.

(4th modification)

Fig. 16 is a diagram showing a configuration example of a light emitting target marker according to a fourth modification. It is a figure explaining the overlap of adjacent circular shapes.

The light emitting target markers LTM1 to LTM5 of the third modification are manufactured as an integral piece of quartz glass QG having different thickness depending on the location, for example, holes (optical conduction paths) OC1, OC2, OC3 is formed, and light is guided from the light sources LS1, LS2, LS3 to the holes OC1, OC2, OC3 through optical fibers OF1, OF2, OF3. Thereby, the relative position can be stabilized. In addition, by separately controlling the light emission of each of the light sources LS1, LS2, and LS3 by the power supply/control units PC1, PC2, and PC3, one of them is lit one by one, and the influence of the overlap of adjacent circular shapes as shown in Fig. 17 can be prevented. The light emitting target markers LTM4 and LTM5 are similarly configured.

An example in which the above-described embodiment is applied to a die bonder will be described below.

[Example]

It is a top view which shows the outline of the die bonder which concerns on an Example. It is a figure explaining the operation|movement of a pickup head and a bonding head, when it sees from the arrow A direction in FIG.

The die bonder 10 is broadly divided, and a supply unit 1 for supplying a die D mounted on a substrate S on which a product area (hereinafter, referred to as package area P) that becomes one or a plurality of final packages is printed, and pick-up The unit 2 , the intermediate stage unit 3 , the bonding unit 4 , the transfer unit 5 , the substrate supply unit 6 , the substrate discharging unit 7 , and a control unit for monitoring and controlling the operation of each unit has (8). The Y-axis direction is the front-back direction of the die bonder 10, and the X-axis direction is the left-right direction. The die feed portion 1 is disposed on the front side of the die bonder 10 , and the bonding portion 4 is disposed on the rear side.

First, the die supply unit 1 supplies the die D to be mounted in the package area P of the substrate S. The die supply unit 1 includes a wafer holder 12 for holding the wafer 11 , and a pushing-up unit 13 indicated by a dotted line for pushing up the die D from the wafer 11 . The die supply unit 1 moves in the XY direction by a driving means (not shown) to move the pick-up die D to the position of the push-up unit 13 .

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and lifts, rotates, and X the collet 22. It has each drive part (not shown) which moves in a direction. The pickup head 21 has a collet 22 (see also FIG. 19 ) for adsorbing and holding the pushed up die D at its tip, and picks up the die D from the die supply unit 1 , and is placed on the intermediate stage 31 . load up The pickup head 21 has respective driving units not shown for lifting, rotating, and moving the collet 22 in the X direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily mounted, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31 .

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it on the package area P of the substrate S being conveyed, or laminates it on the die already bonded on the package area P of the substrate S. bonding in the form The bonding part 4 is a bonding head 41 provided with the collet 42 (refer FIG. 19 also) which adsorb|sucks and holds the die D at the front-end|tip similarly to the pickup head 21, and the bonding head 41 Y It has the Y drive part 43 which moves in the direction, and the board|substrate recognition camera 44 which imaged the position recognition mark (not shown) of the package area P of the board|substrate S, and recognized a bonding position. Here, the bonding head 41 respond|corresponds to the bonding head HD of embodiment, and is equipped with the light emitting target marker LTM in any one of embodiment and 1st modification - 3rd modification at the upper part.

With such a configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32 , picks up the die D from the intermediate stage 31 , and the substrate recognition camera 44 . Bond the die D to the substrate based on the imaging data of

The conveyance part 5 has the board|substrate conveyance claw 51 which grips|grips and conveys the board|substrate S, and the conveyance lane 52 through which the board|substrate S moves. The board|substrate S moves by driving the nut (not shown) of the board|substrate conveyance claw 51 provided in the conveyance lane 52 with the ball screw (not shown) provided along the conveyance lane 52. As shown in FIG.

By such a structure, the board|substrate S moves from the board|substrate supply part 6 along the conveyance lane 52 to a bonding position, and after bonding, it moves to the board|substrate carrying-out part 7, and the board|substrate S is carried out to the board|substrate carrying-out part 7. hand over S.

The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each unit of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

Next, the structure of the die supply part 1 is demonstrated using FIG. 20 and FIG. 20 is a diagram showing an external perspective view of a die supply unit. Fig. 21 is a schematic cross-sectional view showing a main part of a die supply section.

The die supply unit 1 includes a wafer holder 12 that moves in the horizontal direction (XY direction), and a push-up unit 13 that moves in the vertical direction. The wafer holder 12 horizontally holds the expand ring 15 holding the wafer ring 14 and the dicing tape 16 held by the wafer ring 14 and to which a plurality of dies D are adhered. It has a support ring 17 for positioning. The push-up unit 13 is disposed on the inside of the support ring 17 .

The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 is stretched and the distance between the die D is enlarged, and the die D is pushed up from below the die D by the push-up unit 13, The pickup performance of D is improved. In addition, with the reduction in thickness, the adhesive for bonding the die to the substrate becomes a film form from a liquid, and a film-form adhesive material called a die attach film (DAF) 18 between the wafer 11 and the dicing tape 16 . is bonding In the wafer 11 having the die attach film 18 , dicing is performed on the wafer 11 and the die attach film 18 . Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16 .

The die bonder 10 includes a wafer recognition camera 24 for recognizing the posture of the die D on the wafer 11 , a stage recognition camera 32 for recognizing the posture of the die D mounted on the intermediate stage 31 ; It has a board|substrate recognition camera 44 which recognizes the mounting position on the bonding stage BS. What must be corrected for the positional shift between the recognition cameras is the stage recognition camera 32 involved in pickup by the bonding head 41, and the board recognition camera 44 involved in bonding to the mounting position by the bonding head 41. am.

The control part 8 is demonstrated using FIG. 22 is a block diagram showing a schematic configuration of a control system. The control system 80 includes a control unit 8 , a driving unit 86 , a signal unit 87 , and an optical system 88 . The control unit 8 is largely divided into a control/arithmetic unit 81 mainly including a CPU (Central Processor Unit), a storage unit 82, an input/output unit 83, a bus line 84, and a power supply unit ( 85). The storage device 82 includes a main storage device 82a including a RAM for storing a processing program and the like, and an auxiliary storage device including an HDD or SSD for storing control data, image data, etc. necessary for control. (82b). The input/output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting instructions from an operator, a mouse 83c for operating the monitor, and an optical system 88 . It has an image introduction device 83d for introducing image data. In addition, the input/output device 83 includes a motor control device 83e that controls a driving unit 86 such as an XY table (not shown) of the die supply unit 1 or a ZY drive shaft of the bonding head table, and various sensor signals or An I/O signal control device 83f for introducing or controlling a signal from a signal unit 87 such as a switch such as a lighting device is provided. The optical system 88 includes a wafer recognition camera 24 , a stage recognition camera 32 , and a substrate recognition camera 44 . The control/arithmetic unit 81 introduces necessary data through the bus line 84, performs calculation, and transmits information to the control of the pickup head 21 or the like, the monitor 83a, or the like.

The control unit 8 stores image data captured by the wafer recognition camera 24 , the stage recognition camera 32 , and the substrate recognition camera 44 through the image introduction device 83d in the storage device 82 . The positioning of the package area P of the die D and the substrate S and the surface inspection of the die D and the substrate S are performed using the control/arithmetic device 81 by software programmed based on the saved image data. Based on the positions of the package area P of the die D and the substrate S calculated by the control/arithmetic unit 81, the driving unit 86 is moved via the motor control unit 83e by software. By this process, the positioning of the die on the wafer is performed, and the drive unit of the pickup unit 2 and the bonding unit 4 is operated to bond the die D on the package area P of the substrate S. The wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 used are gray scale, color, etc., and digitize the light intensity.

Fig. 23 is a flowchart for explaining a die bonding process in the die bonder of Fig. 18;

In the die bonding process of the embodiment, first, the control unit 8 takes out the wafer ring 14 holding the wafer 11 from the wafer cassette and places it on the wafer holder 12 , and the wafer holder 12 . ) to the reference position where the pickup of the die D is performed (wafer loading (process P1)). Then, from the image acquired by the wafer recognition camera 24, the control part 8 makes fine adjustment so that the arrangement position of the wafer 11 may correspond exactly with the reference position.

Next, the control unit 8 arranges the first pick-up die D at the pick-up position by pitching the wafer holding table 12 on which the wafer 11 is mounted at a predetermined pitch and holding it horizontally (die conveyance). (Process P2)). The wafer 11 is inspected for each die in advance by an inspection device such as a prober, and map data indicating good or bad for each die is generated and stored in the storage device 82 of the control unit 8 . Determination of whether the die D to be picked up is a good product or a defective product is made based on the map data. When the die D is a defective product, the control unit 8 pitches the wafer holder 12 on which the wafer 11 is mounted at a predetermined pitch, and arranges the next picked up die D at the pickup position, Skip die D.

The control unit 8 images the main surface (upper surface) of the die D as the pickup target by the wafer recognition camera 24 , and calculates the amount of position shift from the pickup position of the die D as the pickup target from the acquired image. The control unit 8 moves the wafer holder 12 on which the wafer 11 is mounted based on this positional shift amount, and precisely places the die D as the pick-up target at the pick-up position (die positioning (step P3)) .

Next, the control unit 8 performs a surface inspection of the die D from the image acquired by the wafer recognition camera 24 (step P4). Here, the control unit 8 determines whether there is a problem in the surface inspection, and when it is determined that there is no problem with the surface of the die D, it proceeds to the next step (step P9 to be described later), but when it is determined that there is a problem, A surface image is visually confirmed, or a more sensitive inspection or inspection with changing lighting conditions, etc. is performed. If there is a problem, a skip process is performed, and if there is no problem, the next step is processed. The skip process skips the steps P9 and later of the die D, the wafer holding holders 12 on which the wafers 11 are mounted are pitch-shifted at a predetermined pitch, and the die D picked up next is placed at the pickup position.

The control part 8 loads the board|substrate S on the conveyance lane 52 from the board|substrate supply part 6 (substrate loading (process P5)). The control part 8 moves the board|substrate conveyance claw 51 which grips and conveys the board|substrate S to a bonding position (substrate conveyance (process P6)).

The position recognition mark (not shown) of the package area P of the board|substrate S is imaged with the board|substrate recognition camera 44, a bonding position is recognized, and a positioning is performed (substrate positioning (process P7)).

Next, the control part 8 performs a surface inspection of the package area P of the board|substrate S from the image acquired with the board|substrate recognition camera 44 (process P8). Here, the control unit 8 determines whether there is a problem in the surface inspection, and when it is determined that there is no problem in the surface of the package area P of the substrate S, it proceeds to the next step (step P9 to be described later), but if there is a problem When it is determined, the surface image is visually confirmed, or a more sensitive inspection or inspection with changing lighting conditions is performed. If there is a problem, a skip process is performed, and if there is no problem, the next step is processed. The skip process skips the process P10 and later to the corresponding tab of the package area P of the board|substrate S, and performs defect registration in board|substrate start-up information.

The control unit 8 accurately places the die D, which is to be picked up by the die supply unit 1 , at the pickup position, and then removes the die D from the dicing tape 16 by the pickup head 21 including the collet 22 . It is picked up (die handling (process P9)) and mounted on the intermediate stage 31 ((process P10). The control unit 8 detects a posture shift (rotational shift) of the die mounted on the intermediate stage 31 . The die D is imaged by the stage recognition camera 32 (step P11), and when there is a posture shift, the control unit 8 is mounted at a mounting position by a swing drive device (not shown) provided on the intermediate stage 31 . The positional shift is corrected by turning the stage 31 on a plane parallel to the mounting surface having .

The control unit 8 performs a surface inspection of the die D from the image acquired by the stage recognition camera 32 (step P12). Here, the control unit 8 determines whether or not there is a problem in the surface inspection, and when it is determined that there is no problem in the surface of the die D, it proceeds to the next step (step P13 to be described later), but when it is determined that there is a problem , the surface image is visually confirmed, or a more sensitive inspection or inspection with changing lighting conditions is performed. is subjected to the following steps. The skip processing skips the steps P13 and later of the die D, the wafer holding holders 12 on which the wafers 11 are mounted are pitch-shifted at a predetermined pitch, and the die D picked up next is placed at the pickup position.

The control unit 8 picks up the die D from the intermediate stage 31 by the bonding head 41 including the collet 42, and is bonded to the package area P of the substrate S or the package area P of the substrate S already. Die bonding to the die (die attach (step P13)). The control unit 8 captures the light emitting target marker mounted on the upper portion of the bonding head 41 with the substrate recognition camera 44, recognizes the position and posture of the bonding head 41, and there is a deviation in the position or posture. In this case, correction is made.

After bonding the die D, the control unit 8 inspects whether the bonding position is correctly made by imaging the die D and the substrate S with the substrate recognition camera 44 (inspection of the relative position of the die and the substrate (step P14)) . At this time, similarly to the alignment of the die, the center of the die and the center of the tab are obtained, and whether the relative positions are correct is checked.

Next, the control part 8 performs surface inspection of the die D and the board|substrate S from the image acquired with the board|substrate recognition camera 44 (process P15). Here, the control unit 8 determines whether there is a problem in the surface inspection, and when it is determined that there is no problem in the surface of the bonded die D, it proceeds to the next step (step P9 to be described later), but it is determined that there is a problem In this case, the surface image is visually confirmed, or a more sensitive inspection or inspection with changing lighting conditions, etc. is performed. If there is a problem, a skip process is performed, and if there is no problem, the next step is processed. In the skip process, defect registration is performed in the board|substrate construction start information.

Thereafter, the dies D are bonded to the package area P of the substrate S one by one according to the same procedure. When bonding of one substrate is completed, the substrate S is moved to the substrate carrying-out unit 7 with the substrate transfer claw 51 (substrate transfer (step P16)), and the substrate S is passed to the substrate carrying-out unit 7 ( Substrate unloading (process P17)).

Thereafter, the die D is peeled off from the dicing tape 16 one by one according to the same procedure (step P9). When the pickup of all dies D except for defective products is completed, the dicing tape 16, wafer ring 14, etc. holding the dies D in the shape of the wafer 11 are unloaded into the wafer cassette (step P18). ).

As mentioned above, although the invention made|formed by this inventor was specifically demonstrated based on embodiment, a modification, and an Example, this invention is not limited to the said embodiment, a modification, and an Example, It goes without saying that various changes are possible. .

For example, although die appearance inspection recognition is performed after die position recognition in the embodiment, die position recognition may be performed after die appearance inspection recognition.

In addition, although the DAF is adhere|attached to the back surface of a wafer in an Example, the DAF may not be needed.

In addition, although each of a pick-up head and a bonding head is provided in an Example, two or more may be sufficient respectively. In addition, although the intermediate stage is provided in the embodiment, the intermediate stage is not required. In this case, the pickup head and the bonding head may be used concurrently.

In addition, although bonding is carried out with the surface of the die facing up in the embodiment, after the die is picked up, the front and back of the die are inverted to bond with the back side of the die facing up. In this case, it is not necessary to provide an intermediate stage. This device is called a flip chip bonder.

10 : Die Bonder
1: die supply
13: push-up unit
2: pickup unit
24: wafer recognition camera
3: middle stage part
31: middle stage
32: stage recognition camera
4: bonding part
41: bonding head
42 : collet
44: board recognition camera
5: transfer unit
51: substrate transfer hook
8: control unit
S: substrate
BS: bonding stage
D: die
P: package area
CA: camera
HD: bonding head
LTM: Luminescent Target Marker

Claims (15)

a bonding head formed above the substrate and loading the picked-up die on the substrate;
a target marker emitting light formed on the bonding head;
an imaging device formed above the bonding head and configured to image a position recognition mark and the target marker formed on the substrate;
A control device for controlling the bonding head and the imaging device
to provide
The control device has a larger image than a light source image when the target marker is in focus while the imaging device focuses on the position recognition mark and is out of focus at a position shorter than the focal position of the imaging device A die bonding apparatus configured to detect a state of the bonding head based on an image obtained by imaging a circular image to be taken. According to claim 1,
The target marker is an LED having a small light spot. According to claim 1,
The control device is a die bonding device that measures the position of the bonding head based on the circular shape of the target marker. According to claim 1,
The bonding head is provided with a plurality of the target markers on a straight line,
The control device is a die bonding device that measures the rotation or height of the bonding head based on the circular shape of the target marker. 4. The method of claim 3,
The bonding head is provided with a plurality of the target markers on a straight line,
The control device is a die bonding device that measures the rotation or height of the bonding head based on the circular shape of the target marker. According to claim 1,
A plurality of the target markers have different heights,
The control device is a die bonding device that measures the inclination or the direction of the inclination of the bonding head based on the circular shape of the target marker. 4. The method of claim 3,
A plurality of the target markers have different heights,
The control device is a die bonding device that measures the inclination or the direction of the inclination of the bonding head based on the circular shape of the target marker. 5. The method of claim 4,
A plurality of the target markers have different heights,
The control device is a die bonding device that measures the inclination or the direction of the inclination of the bonding head based on the circular shape of the target marker. 9. The method according to any one of claims 1 to 8,
The light source of the target marker is spaced apart from the bonding head, and the target marker and the light source are connected by an optical fiber. 9. The method according to any one of claims 1 to 8,
a pickup head for picking up the die;
Further comprising an intermediate stage on which the picked-up die is loaded,
The bonding head is a die bonding apparatus for picking up the die mounted on the intermediate stage. (a) A bonding head formed above a substrate while mounting a target marker emitting light thereon, and a position recognition mark formed above the bonding head and formed on the substrate A process of preparing a die bonding apparatus including the apparatus;
(b) a step of carrying in a wafer ring holder holding the dicing tape to which the die is attached;
(c) loading the substrate;
(d) picking up the die;
(e) bonding the picked-up die onto the substrate or a die already bonded to the substrate
to provide
In the step (e), the imaging device acquires a circular image that is larger than the light source image when the target marker is in focus while the imaging device is out of focus at a position shorter than the focal position of the imaging device. A method of manufacturing a semiconductor device for detecting a state of the bonding head based on an image. 12. The method of claim 11,
The method of manufacturing a semiconductor device, wherein the target marker is an LED having a small light spot. 12. The method of claim 11,
In the step (e), the position of the bonding head is measured based on the circular shape of the target marker. 14. The method of claim 13,
The bonding head is provided with a plurality of the target markers on a straight line,
In the step (e), the rotation or height of the bonding head is measured based on the circular shape of the target marker. 15. The method of claim 14,
A plurality of the target markers have different heights,
In the step (e), the inclination of the bonding head is measured based on the circular shape of the target marker.

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