TW201934620A - 伸縮性膜及其形成方法 - Google Patents

伸縮性膜及其形成方法 Download PDF

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TW201934620A
TW201934620A TW108103666A TW108103666A TW201934620A TW 201934620 A TW201934620 A TW 201934620A TW 108103666 A TW108103666 A TW 108103666A TW 108103666 A TW108103666 A TW 108103666A TW 201934620 A TW201934620 A TW 201934620A
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Taiwan
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stretchable film
film
group
linear
polysiloxane
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TW108103666A
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TWI706973B (zh
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畠山潤
岩淵元亮
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日商信越化學工業股份有限公司
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    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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Abstract

本發明提供有優良的伸縮性及強度且膜表面之撥水性亦優良的伸縮性膜及其形成方法。一種伸縮性膜,其特徵為:具有下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯層形成在具有下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯層之表面。
[化1]

Description

伸縮性膜及其形成方法
本發明係關於兼具伸縮性、強度、及撥水性之伸縮性膜及其形成方法。
近年來隨著物聯網(IoT,Internet of Things)之普及,穿戴式器件之開發進展。能夠連接於網路的鐘錶、眼鏡為其代表例。又,在醫療領域、運動領域,也需要能夠隨時監測身體狀態的穿戴式器件,為今後成長的領域。
就穿戴式器件而言,可揭示貼附在身體而隨時監控身體狀態之形態。如此的穿戴式器件,通常係由用以檢測來自身體的電訊號之生物體電極、用以將電訊號傳給感測器之配線、成為感測器之半導體晶片、及電池構成。又,通常,也需要用以黏接在皮膚的之黏接墊。針對生物體電極及周邊的配線、黏接墊之結構,詳載於專利文獻1。專利文獻1記載之穿戴式器件中,在生物體電極之周邊配置有聚矽氧系黏接膜,在生物體電極與感測器器件之間以被覆著伸縮性胺甲酸酯膜之蛇腹形狀之可伸縮之銀配線連接。
胺甲酸酯膜的伸縮性及強度高,具有作為伸縮配線之被覆膜的優良機械特性。但是胺甲酸酯膜有水解性,所以會有由於水解導致伸縮性及強度下降的缺點。另一方面,聚矽氧膜無水解性但有強度低的缺點。
有人探討在聚合物主鏈具有胺甲酸酯鍵與矽氧烷鍵兩者之聚矽氧胺甲酸酯聚合物。此聚合物之硬化物,比起聚矽氧單獨時有較高強度,比起聚胺甲酸酯單獨時有較低水解性。但是此聚合物之硬化物,其比起聚胺甲酸酯單獨時之強度低、聚矽氧單獨時之撥水性低,僅能獲得聚矽氧與聚胺甲酸酯中間的強度及撥水性。
高伸縮性的胺甲酸酯膜,會有觸摸時表面發黏的特性。表面若發黏則膜彼此黏連時不會分開,且此膜上實施網版印刷時版與膜會黏在一起而造成印刷不良。另一方面,聚矽氧膜的剝離性高,所以膜彼此不會黏連。惟聚矽氧的強度低,所以薄膜的聚矽氧膜一拉伸便會很容易地碎裂。若在聚矽氧膜上實施網版印刷,不會因為和版黏連而導致印刷不良,但是因為和印墨間的黏著性低,所以硬化後之印墨會剝落。原因是聚矽氧之表面的剝離性高的關係。另一方面,胺甲酸酯膜與印墨間的黏接力高,硬化後之印墨不會剝落。
又,使用了懸吊了聚矽氧之聚胺甲酸酯的膜,伸縮性、強度、撥水性的均衡性優異,但因為膜表面發黏所以會有膜彼此黏連、或網版印刷時膜和版黏連的缺點。以聚矽氧嵌段共聚合於主鏈的聚胺甲酸酯作為基礎的膜,膜表面無發黏感但強度弱。
希望可以開發出高伸縮、高強度、且表面不發黏而能實施網版印刷等印刷,而且印刷後之印墨不剝落的伸縮性膜。
有人提案一種自行車片用皮材,其表面以聚矽氧胺甲酸酯膜覆蓋,內部為胺甲酸酯膜,又更內部為聚烯烴系彈性體(專利文獻2)。藉由最表面為聚矽氧胺甲酸酯膜,耐摩耗性較好。聚矽氧因為表面能量低,不會發黏,藉此,耐摩耗性提高。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2004-033468號公報
[專利文獻2]日本特開2001-018329號公報
[發明欲解決之課題]
基於如此的背景,希望開發出具有和聚胺甲酸酯同程度之優良伸縮性及強度且有和聚矽氧同程度之優良撥水性,且膜彼此不會黏連的自立性之伸縮性膜及其形成方法。
本發明係為了解決上述問題,目的在於提供有優良的伸縮性及強度,且膜表面之撥水性也優良的伸縮性膜及其形成方法。
[解決課題之方式]
為了解決上述課題,本發明提供一種伸縮性膜,其中,具有下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯層,形成在具有下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯層之表面。
【化1】
式中,R1 、R4 為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6 、R11 、R12 、R13 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2 R3 )s -OSiR2 R3 R5 基。R7 、R9 為單鍵、亞甲基、或伸乙基,R7 及R9 之碳數之合計為1或2。R8 為氫原子或碳數1~4之直鏈狀之烷基,R10 為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可含有醚基。m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
若為如本發明之伸縮性膜,會成為有優良的伸縮性及強度且膜表面之撥水性優良的伸縮性膜。
又,前述聚矽氧主鏈型胺甲酸酯層宜具有下列通式(3)-1及/或(3)-2表示之在末端具有(甲基)丙烯酸酯基之結構較佳。
【化2】
式中,R1 ~R5 、m、n、p同前所述,R14 為氫原子、甲基。t、u為1分子中之單元數,為1≦t≦100、1≦u≦3之範圍之整數。
又,前述聚矽氧懸吊型胺甲酸酯層宜具有下列通式(4)-1及/或(4)-2表示之在末端具(甲基)丙烯酸酯基之結構較佳。
【化3】
式中,R2 、R3 、R5 ~R13 、q、r同前所述。R14 為氫原子、甲基。t、u為1分子中之單元數,且為1≦t≦100、1≦u≦3之範圍之整數。
若使用如此的在末端具有(甲基)丙烯酸酯基之結構者,則會成為有更優良的伸縮性及強度,且膜表面的撥水性也更優良的伸縮性膜。
又,前述伸縮性膜宜為在JIS K 6251規定之拉伸試驗之伸縮率為20~800%之範圍者較佳。
若為如此的伸縮率的伸縮性膜,特別適合作為伸縮配線之被覆膜使用。
又,前述伸縮性膜宜為可作為接觸有伸縮性之導電性配線之膜使用者較佳。
本發明之伸縮性膜特別適合使用在如此的用途。
又,本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,藉由利用加熱及/或照光而硬化以形成具下列通式(2)-1及/或(2)-2所示之結構之聚矽氧懸吊型胺甲酸酯層,並在前述聚矽氧懸吊型胺甲酸酯層之表面上,藉由利用加熱及/或照光而硬化以形成有下列通式(1)-1及/或(1)-2所示之結構之聚矽氧主鏈型胺甲酸酯層。
【化4】
式中,R1 、R4 為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6 、R11 、R12 、R13 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2 R3 )s -OSiR2 R3 R5 基。R7 、R9 為單鍵、亞甲基、或伸乙基,R7 及R9 之碳數之合計為1或2。R8 為氫原子或碳數1~4之直鏈狀之烷基,R10 為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可含有醚基。m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
若為如本發明之伸縮性膜之形成方法,可輕易地形成有優良的伸縮性及強度且膜表面之撥水性也優良的伸縮性膜。
[發明之效果]
如上,若為本發明之伸縮性膜,可成為具有和聚胺甲酸酯為同程度之優良的伸縮性及強度,且膜表面具有和主鏈為矽氧烷鍵之聚矽氧乃同程度或更好之優良的撥水性、表面沒有發黏感的伸縮性膜。如本發明,於以懸吊了聚矽氧之聚胺甲酸酯為基礎之層之表面形成了以聚矽氧嵌段共聚合於主鏈之聚胺甲酸酯為基礎的層而得的複合伸縮性膜,能形成高強度且表面無發黏感的膜。若是使如此的本發明之伸縮性膜接觸導電性配線、或被覆了導電性配線之單側或兩面而獲得之複合伸縮性配線膜,則不僅伸縮性及強度優異,表面無發黏感,皮膚觸感良好,撥水性也優良。因此若為本發明之伸縮性膜,不僅適合使用在穿戴式器件中連接生物體電極與感測器之配線部,也特別適合於作為能夠承載生物體電極、感測器全部的伸縮性膜。又,若為本發明之伸縮性膜之形成方法,能輕易地形成如上述伸縮性膜。
聚胺甲酸酯有充分的伸縮性及強度,但是有撥水性低,會因水解造成強度與伸縮性降低的缺點,聚矽氧的撥水性高但有強度低的缺點。又,主鏈上有胺甲酸酯鍵與矽氧烷鍵兩者的聚矽氧胺甲酸酯聚合物的硬化物,膜表面的發黏感小,撥水性優異,但有強度低的缺點,以在側鏈懸吊了聚矽氧之胺甲酸酯為基礎的膜,高強度、高伸縮、高撥水,但有表面發黏的缺點。基於如此的背景,希望開發出和聚胺甲酸酯有同程度之優良的伸縮性及強度且膜表面之強度也充分高,且有和聚矽氧為同程度或更好之優良的撥水性及表面硬度的伸縮性膜及其形成方法。
本案發明人等針對上述課題努力研究,結果發現:藉由在以高伸縮、高強度、高撥水性但表面發黏的側鏈聚矽氧型胺甲酸酯為基礎的層之表面上形成以主鏈具聚矽氧與胺甲酸酯兩者之聚矽氧胺甲酸酯為基礎的層且製成複合膜,則會成為高伸縮、高強度、高撥水性、表面無發黏感,膜彼此不會黏連的優良的伸縮性膜,特別適合作為用以形成穿戴式器件中的伸縮配線之伸縮性基板膜,乃完成本發明。
亦即,本發明係一種伸縮性膜,其中,具有下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯層形成在具有下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯層之表面。
【化5】
式中,R1 、R4 為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6 、R11 、R12 、R13 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2 R3 )s -OSiR2 R3 R5 基。R7 、R9 為單鍵、亞甲基、或伸乙基,R7 及R9 之碳數之合計為1或2。R8 為氫原子或碳數1~4之直鏈狀之烷基,R10 為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可含有醚基。m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
以下針對本發明詳細說明,但本發明不限定於此等。
<伸縮性膜>
[聚矽氧主鏈型胺甲酸酯層]
本發明之伸縮性膜之表面上形成之聚矽氧主鏈型胺甲酸酯層,具有通式(1)-1及/或(1)-2表示之結構。
【化6】
式中,R1 、R4 為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基。R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。m、n為1~100之範圍之整數,p為2~10之範圍之整數。
R1 、R4 之具體例可列舉亞甲基、伸乙基、伸丙基、伸丁基等。又,R2 、R3 、R5 之具體例可列舉甲基、乙基、異丙基、3,3,3-三氟丙基、苯基等。
又,具通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯層,宜具有通式(3)-1及/或(3)-2表示之末端有(甲基)丙烯酸酯基之結構較佳。
【化7】
式中,R1 ~R5 、m、n、p同前所述、R14 為氫原子、甲基。t、u為1分子中之單元數,且為1≦t≦100、1≦u≦3之範圍之整數。
就用以形成具有通式(1)-1及/或(1)-2之結構之聚矽氧主鏈型胺甲酸酯層的聚矽氧化合物而言,可列舉下列通式(1)-1’、(1)-2’表示之化合物。
【化8】
式中,R1 ~R5 、m、n、p同前所述。
[聚矽氧懸吊型胺甲酸酯層]
本發明之伸縮性膜中含有的聚矽氧懸吊型胺甲酸酯層具有通式(2)-1及/或(2)-2表示之結構。
【化9】
式中,R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基。R6 、R11 、R12 、R13 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2 R3 )s -OSiR2 R3 R5 基。R7 、R9 為單鍵、亞甲基、或伸乙基,R7 及R9 之碳數之合計為1或2。R8 為氫原子或碳數1~4之直鏈狀之烷基,R10 為氫原子或甲基。A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可含有醚基。q、r、s為0~20之範圍之整數。
又,具通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯層,宜具有通式(4)-1及/或(4)-2表示之末端具有(甲基)丙烯酸酯基之結構較佳。
【化10】
式中,R2 、R3 、R5 ~R14 、A、X、q、r、t、u同前所述。
作為用以形成聚矽氧懸吊型胺甲酸酯層之通式(2)-1表示之結構之二醇化合物,可列舉下列通式(2)-1’表示之化合物。
【化11】
式中,R2 、R3 、R5 ~R10 、A、q、r同前所述。
通式(2)-1’表示之懸吊了短鏈聚矽氧之二醇化合物,例如可藉由使甘油單烯丙醚與具有SiH基之短鏈矽氧烷化合物於鉑觸媒中反應而獲得。具體而言可例示如下。
【化12】
【化13】
作為用以形成聚矽氧懸吊型胺甲酸酯層之通式(2)-2表示之結構之二醇化合物,可列舉下列通式(2)-2’表示之化合物。
【化14】
式中,R11 ~R13 、X同前所述。
通式(2)-2’表示之懸吊了短鏈聚矽氧之二醇化合物,例如可藉由使二羥基二烯基化合物與具有SiH基之短鏈矽氧烷化合物於鉑觸媒中反應而獲得。具體而言可例示如下。
【化15】
【化16】
【化17】
【化18】
【化19】
【化20】
【化21】
式中之重複數代表平均値。
本發明之伸縮性膜中含有的具通式(1)-1、(1)-2、(2)-1、(2)-2所示之結構之樹脂,可藉由以通式(1)-1’、(1)-2’、(2)-1’、(2)-2’所示之具含矽基之化合物作為原料,使它們與異氰酸酯化合物反應以形成。
作為和上述通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物反應之異氰酸酯化合物,具體而言可例示如下。
【化22】
【化23】
式中,l為1以上之整數。
上述異氰酸酯化合物之中,尤其藉由使具有(甲基)丙烯酸酯基之異氰酸酯化合物與通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物反應,可獲得通式(3)-1、(3)-2、(4)-1、(4)-2表示之在末端具有(甲基)丙烯酸酯基之化合物。藉由使具有羥基之具(甲基)丙烯酸酯基之化合物與異氰酸酯化合物反應,也可獲得通式(3)-1、(3)-2、(4)-1、(4)-2表示之在末端具(甲基)丙烯酸酯基之化合物。
上述異氰酸酯化合物和通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物的反應性高,所以有時難以控制。又,異氰酸酯化合物有時保存中會和大氣中之水分反應而導致異氰酸酯基失活,所以保存時需要十分小心充分防止濕度等。為了防止該等情事,有時會使用異氰酸酯基用取代基予以保護的具封端異氰酸酯基之化合物。
封端異氰酸酯基,係因加熱而封端基脫保護,成為異氰酸酯基者,具體而言可列舉經醇、苯酚、硫醇、亞胺、酮亞胺(ketimine)、胺、內醯胺、吡唑、肟、β-二酮等取代之異氰酸酯基。
為了使封端異氰酸酯基之脫保護溫度低溫化,也可添加觸媒。此觸媒已知有二月桂酸二丁基錫等有機錫、鉍鹽、2-乙基己酸鋅、乙酸鋅等羧酸鋅。
尤其日本特開2012-152725號公報揭示:藉由就羧酸而言含有α,β-不飽和羧酸鋅作為封端異氰酸酯解離觸媒,能夠使脫保護反應低溫化。
又,除了上述通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之化合物、異氰酸酯化合物,也可加入有多數羥基之化合物。藉由添加如此的有多數羥基之化合物,可進行鏈長延長、分子間交聯。
藉由進行鏈長延長,能夠使伸縮性、強度更好。例如藉由導入兩末端為羥基的聚醚系之鏈長延長劑,伸縮性會提高。兩末端為羥基之聚酯系之鏈長延長劑會使伸縮性及強度皆更好,若導入聚碳酸酯系鏈長延長劑,則強度會顯著提高。
作為有多數羥基之化合物具體而言可列舉如下。
【化24】
【化25】
【化26】
式中,附有括弧之重複單元的重複數為任意數。
又,也可添加有胺基的化合物。異氰酸酯基若與胺基反應,會形成脲鍵。胺甲酸酯鍵與脲鍵的部分稱為硬鏈段,藉由該等的氫鍵,強度提高。因此,不僅是胺甲酸酯鍵,又增加脲鍵,能夠使強度提高。
由含有鏈長延長之聚醚、聚酯、聚碳酸酯之二醇化合物形成的部分稱為軟鏈段。該等中伸縮性最高的是聚醚,其次伸縮性按順序由高而低是聚酯、聚碳酸酯。按拉伸強度的順序則是和伸縮性的順序顛倒。藉由軟鏈段之種類、重複單元的選擇,能夠調整強度及伸縮性。
本發明之伸縮性膜形成中使用的聚矽氧胺甲酸酯樹脂宜為重量平均分子量為500以上者較佳。若為如此者,適合用在本發明之伸縮性膜。又,樹脂之重量平均分子量之上限値宜為500,000以下較佳。
又,本發明之伸縮性膜,按JIS K 6251規定之拉伸試驗測得的伸縮率宜為20~800%較佳。若為如此的伸縮率,特別適合作為伸縮配線之被覆膜使用。
又,本發明之伸縮性膜宜作為接觸有伸縮性之導電性配線之膜較佳。本發明之伸縮性膜特別適合於如此的用途。
若為如以上說明之本發明之伸縮性膜,會成為和聚胺甲酸酯有同程度的優良的伸縮性及強度,且膜表面有和聚矽氧同程度之優良的撥水性及無發黏感之表面的伸縮性膜。
<伸縮性膜之形成方法>
又,本發明提供一種伸縮性膜之形成方法,係形成上述伸縮性膜之方法,藉由加熱及/或照光而硬化來形成有通式(2)-1及/或(2)-2所示之結構之聚矽氧懸吊型胺甲酸酯層,並在前述聚矽氧懸吊型胺甲酸酯層之表面上,藉由加熱及/或照光而硬化來形成有通式(1)-1及/或(1)-2所示之結構之聚矽氧主鏈型胺甲酸酯層。
此時,宜將通式(2)-1’及或(2)-2’表示之二醇化合物、有異氰酸酯基之化合物、視情形用以將鏈長延長之二醇化合物、胺化合物、觸媒予以混合,將該混合物製膜,並利用加熱或照光使其硬化,形成成為基礎的第1層之伸縮性膜,於其上將上述通式(1)-1’及/或(1)-2’表示之化合物、具有異氰酸酯基之化合物、視情形之用以將鏈長延長之二醇化合物、胺化合物、觸媒予以混合,將該混合物製膜,並利用加熱或照光使其硬化,在成為基礎之第1層之伸縮性膜之上形成第2層之膜較佳。
作為如此的伸縮性膜之形成方法之一例,可列舉第1層、第2層皆將例如通式(2)-1’、(2)-2’、(1)-1’、(1)-2’表示之化合物、和保護或未保護之異氰酸酯化合物、用以將鏈長延長、交聯之有多數羥基之化合物、及視情形的有胺基之化合物予以混合,將此混合物就第1層塗佈並使其加熱硬化而形成在基板上,就第2層塗佈並使其加熱硬化而形成第1層之上之方法。
此方法中,藉由異氰酸酯基與羥基之反應,邊形成胺甲酸酯鍵且同時高分子量化,藉此形成聚合物網絡。若有羥基、異氰酸酯基為3個以上之化合物則交聯反應會進行,故伸縮性下降,但膜強度提高。因此藉由調整羥基、異氰酸酯基為2個或3個之化合物的添加量,能夠調整硬度、伸縮性、強度。又,硬化後將膜從基板剝下,藉此可獲得獨立的伸縮性膜。
混合物中之羥基與異氰酸酯基之莫耳數之比例宜為羥基與異氰酸酯基係同莫耳數或羥基較多,亦即羥基之莫耳數除以異氰酸酯基之莫耳數而得的數値為1以上較佳。異氰酸酯基若較少,則不會有過剩的異氰酸酯基和水反應而產生二氧化碳氣體的情形,故膜內無因發泡導致出現孔洞之虞。製作發泡胺甲酸酯時係使異氰酸酯基過量,但本發明之伸縮性膜,需要高強度的特性,所以膜內宜不存在因發泡產生的孔洞較佳。
本發明之伸縮性膜中,樹脂若如以上述羥基之莫耳數多於異氰酸酯基的狀態形成,則在聚合物末端有時會僅於通式(2’)-1、(2’)-2表示之二醇化合物之單側形成胺甲酸酯鍵。
【化27】
式中,R2 、R3 、R5 ~R13 、A、X、q、r如上所述。
將含有羥基之化合物與異氰酸酯化合物混合,形成高分子體(預聚物),之後將含有羥基之化合物或含有異氰酸酯基之化合物進行追加混合而加熱硬化,利用預聚物法,也可形成膜。形成預聚物時,使含羥基之化合物或異氰酸酯化合物中任一者過量而提高分子量。相較於將含羥基之化合物或異氰酸酯化合物混合而一次形成膜之單擊法(one shot method),未反應之殘留異氰酸酯量可較少,可減少未交聯部分而形成高強度的膜。
硬化時之加熱溫度宜為室溫至200℃之範圍較理想。更佳為40~160℃之範圍,時間為5秒至60分鐘之範圍。加熱硬化時,有以剝離膜來覆蓋膜之單側的情形及來覆蓋膜兩側的情形,邊以輥捲繞邊硬化時宜為單側,以單片硬化時宜為兩側,但不限定。
又,也可藉由異氰酸酯基與羥基之反應來合成胺甲酸酯聚合物,並在通式(3)-1、(3)-2、(4)-1、(4)-2表示之末端形成(甲基)丙烯酸酯基,將此聚合物製膜並加熱及/或照光使其硬化,也可形成伸縮性膜。具體而言,將上述通式(1)-1’、(1)-2’、(2)-1’、(2)-2’表示之二醇化合物,與保護或未保護之異氰酸酯化合物、為了將鏈長延長、交聯之有多數羥基之化合物混合並聚合,合成聚合物末端為(甲基)丙烯酸酯之胺甲酸酯(甲基)丙烯酸酯聚合物。將胺甲酸酯(甲基)丙烯酸酯聚合物製膜,利用熱或照光將其硬化而形成伸縮性膜之方法。於此情形,係將(甲基)丙烯酸酯以自由基反應而交聯。自由基交聯之方法宜係添加自由基發生劑。自由基發生劑有因熱分解而產生自由基之熱自由基發生劑、因照光而產生自由基之光自由基發生劑。
熱自由基發生劑可列舉偶氮系自由基發生劑、過氧化物系自由基發生劑,偶氮系自由基發生劑可列舉2,2’-偶氮雙異丁腈(AIBN)、2,2’-偶氮雙(2,4-二甲基戊腈)、2,2’-偶氮雙(2-甲基丙酸)二甲酯、2,2’-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2’-偶氮雙(環己烷-1-甲腈)、4,4’-偶氮雙(4-氰基戊酸)等。過氧化物系自由基發生劑可列舉過氧化苯甲醯、過氧化癸醯、過氧化月桂醯、過氧化琥珀酸、過氧化-2-乙基己酸第三丁酯、過氧化三甲基乙酸第三丁酯、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯等。
光自由基發生劑可列舉苯乙酮、4,4’-二甲氧基二苯乙二酮、二苯乙二酮、苯偶因、二苯基酮、2-苯甲醯基苯甲酸、4,4’-雙(二甲胺基)二苯基酮、4,4’-雙(二乙胺基)二苯基酮、苯偶因甲醚、苯偶因乙醚、苯偶因異丙醚、苯偶因丁醚、苯偶因異丁醚、4-苯甲醯基苯甲酸、2,2’-雙(2-氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2-苯甲醯基苯甲酸甲基、2-(1,3-苯并間二氧雜環戊烯-5-基)-4,6-雙(三氯甲基)-1,3,5-三、2-苄基-2-(二甲胺基)-4’-啉代苯丁酮、4,4’-二氯二苯基酮、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,4-二乙基硫 -9-酮、二苯基(2,4,6-三甲基苯甲醯基)氧化膦、1,4-二苯甲醯基苯、2-乙基蒽醌、1-羥基環己基苯基酮、2-羥基-2-甲基苯丙酮、2-羥基-4’-(2-羥基乙氧基)-2-甲基苯丙酮、2-異亞硝基苯丙酮、2-苯基-2-(對甲苯磺醯氧基)苯乙酮(BAPO)、樟腦醌。
又,熱或光自由基發生劑之添加量宜相對於樹脂100質量份為0.1~50質量份之範圍較理想。
又,也可以添加有多數的(甲基)丙烯酸酯、硫醇的交聯劑。藉此,能夠使自由基交聯的效率更好。
也可以添加有烷基、芳基之單體、有含矽基、經氟取代之烷基、芳基之單體。藉此,能夠使溶液之黏度下降,形成更薄膜之伸縮性膜。該等單體若有聚合性雙鍵,則膜硬化時會在膜中固定化。
有烷基、芳基之單體,可列舉丙烯酸異莰酯、丙烯酸月桂酯、丙烯酸十四酯、硬脂基丙烯酸酯、丙烯酸異硬脂酯、丙烯酸二十二酯、丙烯酸金剛烷酯、苯氧基乙二醇丙烯酸酯、苯氧基二乙二醇丙烯酸酯、2~6官能之丙烯酸酯。2官能之丙烯酸酯可列舉1,6-己烷二醇二丙烯酸酯、1,9-壬烷二醇二丙烯酸酯、異壬烷二醇二丙烯酸酯、1,10-癸烷二醇二丙烯酸酯、新戊二醇二丙烯酸酯、2-羥基-3-甲基丙烯酸基丙基丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、二丙二醇二丙烯酸酯、三丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、聚四亞甲基二醇二丙烯酸酯、聚乙烯聚丙二醇二丙烯酸酯、二㗁烷二醇二丙烯酸酯、三環癸烷二甲醇二丙烯酸酯、9,9-雙[4-(2-羥基乙氧基)苯基]茀丙烯酸酯、乙氧基化雙酚A二丙烯酸酯、丙氧基化雙酚A二丙烯酸酯、乙氧基化丙氧基化雙酚A二丙烯酸酯,3官能之丙烯酸酯可列舉三羥甲基丙烷三丙烯酸酯、乙氧基化三羥甲基丙烷三丙烯酸酯、丙氧基化三羥甲基丙烷三丙烯酸酯、甘油三丙烯酸酯、乙氧基化甘油三丙烯酸酯、丙氧基化甘油三丙烯酸酯、參(2-丙烯醯氧基乙基)異氰尿酸酯、己內酯改性參(2-丙烯醯氧基乙基)異氰尿酸酯、新戊四醇三丙烯酸酯,4官能之丙烯酸酯可列舉新戊四醇四丙烯酸酯、乙氧基化新戊四醇四丙烯酸酯、丙氧基化新戊四醇四丙烯酸酯、二(三羥甲基)丙烷四丙烯酸酯、乙氧基化二(三羥甲基)丙烷四丙烯酸酯、丙氧基化二(三羥甲基)丙烷四丙烯酸酯,5-6官能之丙烯酸酯可列舉二新戊四醇聚丙烯酸酯、乙氧基化二新戊四醇聚丙烯酸酯、丙氧基化二新戊四醇聚丙烯酸酯。也可使用前述丙烯酸酯變更為甲基丙烯酸酯而得的單體。
當使用末端具有(甲基)丙烯酸酯基之化合物形成伸縮性膜時,也可將熱硬化與光硬化組合而使其硬化。例如:以熱硬化形成成為基礎之伸縮性膜時,其上之伸縮性膜可以利用光硬化形成。光硬化的好處是不一定需要加熱及可於短時間硬化。缺點是光照不到的部分無法硬化。藉由將熱硬化與光硬化組合,可選擇發揮各別的長處的硬化方法。
例如:將混合了通式(4)-1、(4)-2表示之基礎聚合物及自由基發生劑的溶液塗佈在基板上,利用熱或照光使其硬化,形成第1層,於其上塗佈混合了(3)-1、(3)-2表示之基礎聚合物及自由基發生劑的溶液,並塗佈第2層,以熱或照光使其硬化,可形成伸縮性膜。
亦可第1層係使通式(2)-1’、(2)-2’表示之二醇化合物、與保護或未保護之異氰酸酯化合物、用以將鏈長延長、交聯之有多數羥基之化合物、及視情形之有胺基之化合物混合並使其硬化而形成,第2層係塗佈混合了通式(3)-1、(3)-2表示之基礎聚合物及自由基發生劑之溶液並以熱或光使其硬化而形成。又,亦可第1層係塗佈混合了通式(4)-1、(4)-2表示之基礎聚合物及自由基發生劑之溶液並以熱或光使其硬化而形成,第2層係混合通式(1)-1’、(1)-2’表示之化合物、與保護或未保護之異氰酸酯化合物、及用以將鏈長延長、交聯之有多數羥基之化合物、及視情形之有胺基之化合物並使其硬化而形成。
作為形成本發明之伸縮性膜之第1層之方法可列舉將上述組成物塗佈在平板基板上、輥上的方法。塗佈組成物之方法,例如:旋塗、桿塗、輥塗、流塗、浸塗、噴塗、刮刀塗佈等。又,宜進行塗佈使塗佈膜厚成為1μm~2mm較佳。
針對有凹凸之零件之密封,宜為輥塗、噴塗等方法、利用網版印刷等僅塗佈在必要部分之方法較佳。又,為了實施各種的塗佈、印刷,需調整混合溶液之黏度。欲為低黏度時則混合有機溶劑,欲為高黏度時則混合二氧化矽等填充劑。
有機溶劑宜為在大氣壓之沸點為115~200℃之範圍的有機溶劑較佳。具體而言,宜選用2-辛酮、2-壬酮、2-庚酮、3-庚酮、4-庚酮、2-己酮、3-己酮、二異丁基酮、甲基環己酮、苯乙酮、甲基苯乙酮、乙酸丙酯、乙酸丁酯、乙酸異丁酯、乙酸戊酯、乙酸丁烯酯、乙酸異戊酯、乙酸苯酯、甲酸丙酯、甲酸丁酯、甲酸異丁酯、甲酸戊酯、甲酸異戊酯、戊酸甲酯、戊烯酸甲酯、巴豆酸甲酯、巴豆酸乙酯、丙二醇單甲醚、乙二醇單甲醚、丙二醇單乙醚、乙二醇單乙醚、丙二醇二甲醚、二乙二醇二甲醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯中之1種以上較佳。
利用加熱使末端具有(甲基)丙烯酸酯基之化合物硬化時,加熱硬化例如可藉由熱板、烘箱中或遠紅外線之照射來實施。加熱條件宜為30~150℃、10秒~60分鐘較理想,50~120℃、30秒~20分鐘更理想。烘烤環境為大氣中、鈍性氣體中、真空中皆無妨。
利用照光使末端具有(甲基)丙烯酸酯基之化合物硬化時,照光所為之硬化宜利用波長200~500nm之光進行較佳。光源,例如可使用鹵素燈、氙燈、準分子雷射、金屬鹵化物燈、LED等。又,也可為電子束之照射。照射量設為1mJ/cm2 ~100J/cm2 之範圍較佳。
本發明之伸縮性膜,係在具通式(2)-1及/或(2)-2所示之結構之聚矽氧懸吊型胺甲酸酯層之表面形成具通式(1)-1及/或(1)-2所示之結構之聚矽氧主鏈型胺甲酸酯層的複合伸縮性膜,但聚矽氧主鏈型胺甲酸酯層可以覆蓋聚矽氧懸吊型胺甲酸酯層之兩面、或任一單面。聚矽氧主鏈型胺甲酸酯層之膜厚無特殊限定,比起聚矽氧懸吊型胺甲酸酯膜較薄時,於高強度的觀點較理想。
為了形成薄膜的聚矽氧主鏈型胺甲酸酯層,宜混合前述有機溶劑較佳。聚矽氧懸吊型胺甲酸酯層之溶液則可含或不含有機溶劑皆無妨。
本發明之伸縮性膜不僅可作為單獨的自立膜使用,也可形成在纖維上、膜上。
在此,圖1~7顯示本發明之伸縮性膜之使用例。圖1係從生物體電極側觀看本發明之伸縮性膜6上所形成之心電計1的概略圖。又,圖2係顯示本發明之伸縮性膜6形成在基板7上之狀態之剖面圖,圖3係顯示在伸縮性膜6上形成了心電計1之狀態之剖面圖,圖4係圖3之心電計1之伸縮之配線3與中心器件4以伸縮性膜6覆蓋之狀態之剖面圖,圖1之心電計1係專利文獻1記載者。如圖1,心電計1係3個生物體電極2以通電電訊號之配線3連接,並且連到中心器件4。
配線3的材料一般而言使用金、銀、鉑、鈦、不銹鋼等金屬、碳等導電性材料。又,為了展現伸縮性,可如專利文獻1記載製成蛇腹形狀之配線,也可在伸縮性薄膜上貼附前述導電性材料的粉末、線化的導電性材料、或印刷含有前述導電性材料的導電印墨、或使用導電性材料與纖維複合成的導電性布來形成配線3。
心電計1需貼附在皮膚,故圖3、4中,為了不使生物體電極2脫離皮膚,在生物體電極2的周邊配置有黏接部5。又,生物體電極2有黏接性時,不一定需要有周邊之黏接部5。
如圖1,在係本發明之伸縮性膜的伸縮性膜6上製作此心電計1。伸縮性膜6表面的發黏少,故在其上利用網版印刷等進行印刷時,脫版性良好。脫版性不良時,脫版時會造成印墨剝離,有時印墨不轉印在伸縮膜上,不理想。
也可進一步將伸縮的配線3以伸縮性膜6來覆蓋。此時之伸縮性膜6不需為複合型,為僅伸縮性膜第1層6-1、伸縮性膜第2層6-2中任一層的膜亦無妨。又,圖4中,伸縮之配線3係以伸縮性膜第2層6-2覆蓋。
再者,也可如圖5所示,使圖2形成的伸縮性膜翻轉,製成在伸縮性膜第1層6-1之未形成伸縮性膜第2層6-2的面也形成伸縮性膜第2層6-2的伸縮性膜。使用了此時之伸縮性膜的心電計的剖面圖示於圖6或圖7。
若為如以上說明之本發明之伸縮性膜之形成方法,則可輕易地形成和聚胺甲酸酯有同程度或更好之優良的伸縮性及強度且膜表面有高撥水性之伸縮性膜。
[實施例]
以下使用實施例及比較例對於本發明具體說明,但本發明不限於此等。又,重量平均分子量(Mw)代表利用GPC測得之聚苯乙烯換算之重量平均分子量。
伸縮性膜形成用組成物中摻合的懸吊了聚矽氧之二醇化合物1~5、聚矽氧二醇化合物1、聚矽氧化合物1、異氰酸酯化合物1~5、羥基化合物1~5如下所示。
【化28】
式中之重複數代表平均値。
【化29】
伸縮性膜形成用組成物中摻合之作為於末端具有(甲基)丙烯酸酯基之化合物的懸吊了聚矽氧之胺甲酸酯(甲基)丙烯酸酯1~8、聚矽氧胺甲酸酯(甲基)丙烯酸酯1~3如下所示。
【化30】
【化31】
【化32】
【化33】
式中之重複數代表平均値。
伸縮性膜形成用組成物中摻合之作為添加劑之光自由基發生劑1~3如下所示。
光自由基發生劑1:二苯基(2,4,6-三甲基苯甲醯基)氧化膦
光自由基發生劑2:2,2-二甲氧基-2-苯基苯乙酮
光自由基發生劑3:(±)-樟腦醌
伸縮性膜形成用組成物中摻合之有機溶劑如下所示。
有機溶劑:丙二醇單甲醚乙酸酯(PGMEA)
伸縮性膜形成用組成物中摻合之具有烷基、芳基之單體如下所示。
具有烷基、芳基之單體:丙烯酸異莰酯、三羥甲基丙烷三丙烯酸酯、三環癸烷二甲醇二丙烯酸酯
[實施例、比較例]
按照表1記載之組成將懸吊了聚矽氧之二醇化合物、聚矽氧二醇化合物、聚矽氧化合物、異氰酸酯化合物、羥基化合物、有機溶劑進行混合、脫泡,製備成伸縮性膜形成用組成物(伸縮性膜材料1-1~1-9)。伸縮性膜形成用組成物中之羥基與異氰酸酯基之莫耳數之比,一併示於表1。
【表1】
按照表2記載之組成將末端具(甲基)丙烯酸酯基之聚矽氧胺甲酸酯化合物、具有烷基、芳基之單體、光自由基發生劑1~3、有機溶劑進行混合,製備成伸縮性膜形成用組成物(伸縮性膜材料2-1~2-14)。
【表2】
(伸縮性膜之製作)
在聚乙烯基板上以塗佈棒塗佈第1層伸縮性材料1-1~1-5,於氮氣環境下於130℃烘烤20分鐘,於基板上製作伸縮性膜之第1層。在聚乙烯基板上以塗佈棒塗佈第1層伸縮性材料2-1~2-8,於氮氣環境下以1,000W的氙燈照射500mJ/cm2 之光,使伸縮性膜的第1層硬化。
在第1層上將第2層伸縮性材料以比起第1層更為薄膜塗佈用之塗佈棒進行塗佈,第2層伸縮性膜材料1-6、1-7於氮氣環境下於130℃烘烤20分鐘使其硬化,2-9~2-11則是於塗佈後於110℃烘烤10分鐘後,於氮氣環境下以1,000W的氙燈照射500mJ/cm2 之光,使伸縮性膜之第2層硬化,2-12~2-14則是於氮氣環境下以1,000W的氙燈照射500mJ/cm2 之光,使伸縮性膜之第2層硬化,形成伸縮性膜。
為了作為比較例,將第1層伸縮性材料與第2層伸縮性材料分別單獨塗佈,並使其硬化。伸縮性膜材料1-8、1-9、2-12~2-14,分別係1-6、1-7、2-9~2-11之未經溶劑稀釋之組成物,使用在測定單獨膜之伸縮性、強度。塗佈後,使伸縮性膜材料1-8、1-9以和1-6、1-7同樣的條件,2-12~2-14以和2-9~2-11同樣的條件進行硬化。
(膜厚、接觸角、伸縮率、強度之測定)
測定硬化後之伸縮性膜(實施例1~20)、比較例之第1層伸縮性膜(比較例11~14)、第2層伸縮性膜(比較例1~10)之膜厚、及表面之水之接觸角,並求以手指觸摸時的黏感。又,測定伸縮性膜表面之水之接觸角後,從基板將伸縮性膜剝離,依據JIS K 6251之方法測定伸縮率及強度。結果示於表3、4。
【表3】
【表4】
如表3、4,本發明之伸縮性膜,撥水性、強度、伸縮性高,且表面之黏性低。
另一方面,如比較例1~14之僅有1層的膜,第1層伸縮性膜單獨(比較例11~14)時,撥水性、強度、伸縮性高但是表面有黏性,膜彼此黏連,第2層伸縮性膜單獨(比較例1~10)時,表面沒有黏性但是強度差。
由以上可知若為本發明之伸縮性膜,因為有優良的伸縮性及強度且膜表面之撥水性及低黏性優異,所以具有穿戴式器件等中使用的伸縮性的配線作為可印刷之膜的優良的特性。
又,本發明不限於上述實施形態。上述實施形態係例示,凡和本發明之申請專利範圍記載之技術思想有實質上相同構成且發揮同樣作用效果者皆包括在本發明之技術範圍內。
1‧‧‧心電計
2‧‧‧生物體電極
3‧‧‧配線
4‧‧‧中心器件
5‧‧‧黏接部
6‧‧‧伸縮性膜
6-1‧‧‧伸縮性膜第1層
6-2‧‧‧伸縮性膜第2層
7‧‧‧基板
[圖1]顯示從生物體電極側觀察形成在本發明之伸縮性膜上之心電計的概略圖。
[圖2]顯示本發明之伸縮性膜形成在基板上之狀態之剖面圖。
[圖3]顯示在本發明之伸縮性膜上形成心電計之狀態之剖面圖。
[圖4]顯示以伸縮性膜之第2層覆蓋圖3之配線與中心器件之狀態之剖面圖。
[圖5]顯示以伸縮性膜的第2層覆蓋伸縮性膜之第1層之兩面之狀態之剖面圖。
[圖6]顯示在圖5之伸縮性膜上形成心電計之狀態之剖面圖。
[圖7]顯示以伸縮性膜之第2層覆蓋圖6之配線與中心器件之狀態之剖面圖。

Claims (6)

  1. 一種伸縮性膜,其特徵為: 具有下列通式(1)-1及/或(1)-2表示之結構之聚矽氧主鏈型胺甲酸酯層形成在具有下列通式(2)-1及/或(2)-2表示之結構之聚矽氧懸吊型胺甲酸酯層之表面; 式中,R1 、R4 為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基;R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基;R6 、R11 、R12 、R13 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2 R3 )s -OSiR2 R3 R5 基;R7 、R9 為單鍵、亞甲基、或伸乙基,R7 及R9 之碳數之合計為1或2;R8 為氫原子或碳數1~4之直鏈狀之烷基,R10 為氫原子或甲基;A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可含有醚基;m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
  2. 如申請專利範圍第1項之伸縮性膜,其中,該聚矽氧主鏈型胺甲酸酯層具有下列通式(3)-1及/或(3)-2表示之末端具(甲基)丙烯酸酯基之結構; 式中,R1 ~R5 、m、n、p同前所述,R14 為氫原子、甲基;t、u為1分子中之單元數,且為1≦t≦100、1≦u≦3之範圍之整數。
  3. 如申請專利範圍第1或2項之伸縮性膜,其中,該聚矽氧懸吊型胺甲酸酯層具有下列通式(4)-1及/或(4)-2表示之末端具(甲基)丙烯酸酯基之結構; 式中,R2 、R3 、R5 ~R13 、q、r同前所述;R14 為氫原子、甲基;t、u為1分子中之單元數,且為1≦t≦100、1≦u≦3之範圍之整數。
  4. 如申請專利範圍第1或2項之伸縮性膜,其中,該伸縮性膜在JIS K 6251規定之拉伸試驗的伸縮率為20~800%之範圍。
  5. 如申請專利範圍第1或2項之伸縮性膜,其中,該伸縮性膜係作為接觸有伸縮性之導電性配線之膜使用。
  6. 一種伸縮性膜之形成方法,係形成伸縮性膜之方法,其特徵為: 利用加熱及/或照光而硬化以形成具下列通式(2)-1及/或(2)-2所示之結構之聚矽氧懸吊型胺甲酸酯層,並在該聚矽氧懸吊型胺甲酸酯層之表面上,利用加熱及/或照光而硬化以形成具下列通式(1)-1及/或(1)-2所示之結構之聚矽氧主鏈型胺甲酸酯層; 式中,R1 、R4 為碳數1~40之直鏈狀、分支狀之伸烷基,也可以有醚基、硫醇基;R2 、R3 、R5 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基;R6 、R11 、R12 、R13 為相同、不同之碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、或3,3,3-三氟丙基、-(OSiR2 R3 )s -OSiR2 R3 R5 基;R7 、R9 為單鍵、亞甲基、或伸乙基,R7 及R9 之碳數之合計為1或2;R8 為氫原子或碳數1~4之直鏈狀之烷基,R10 為氫原子或甲基;A為碳數3~7之直鏈狀、分支狀之伸烷基,X為碳數3~7之直鏈狀、分支狀之伸烷基,也可含有醚基;m、n為1~100之範圍之整數,p為2~10之範圍之整數,q、r、s為0~20之範圍之整數。
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