TW201928364A - Method for adjusting needle tip position of probe needle, and inspection device - Google Patents
Method for adjusting needle tip position of probe needle, and inspection device Download PDFInfo
- Publication number
- TW201928364A TW201928364A TW107142659A TW107142659A TW201928364A TW 201928364 A TW201928364 A TW 201928364A TW 107142659 A TW107142659 A TW 107142659A TW 107142659 A TW107142659 A TW 107142659A TW 201928364 A TW201928364 A TW 201928364A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- tip
- image
- probes
- needle tip
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
本發明之各種面向及實施型態係關於一種探針之針尖位置調整方法及檢查裝置。Various aspects and implementation modes of the present invention relate to a method and an inspection device for adjusting a needle tip position of a probe.
在半導體製造過程中，會於半導體晶圓上形成具有特定電路圖案的複數半導體元件。針對所形成之半導體元件進行電性特性等檢查，來區分為良品與不良品。半導體元件的電性特性檢查係在各半導體元件被分割前之半導體晶圓的狀態下，使用檢查裝置來進行。檢查裝置係具有設置有複數探針之探針卡。檢查裝置會使探針卡與半導體元件接近，來使探針卡所設置的各探針接觸於半導體元件上所設置的測試墊。然後，檢查裝置係在探針接觸於各測試墊之狀態下，透過各探針來將電氣訊號供應至半導體元件，並依據透過各探針而從半導體元件輸出的電氣訊號，來區分該半導體元件是否為不良品。
又，已知有一種使用照相機來進行半導體元件上所形成之焊線的形狀檢查之技術。上述般之技術中，係對半導體元件上的焊線進行落射照明，並以複數個不同高度方向的位置會成為焦點面之方式來拍攝被照明的焊線，且取得焊線之各焦點面中輝點影像的影像資訊。然後，依據所取得之各焦點面中輝點影像的影像資訊當中，存在於特定位置處者的輝度與各焦點面的高度方向位置來特定出焊線的高度。
[先前技術文獻]
[專利文獻]
專利文獻1：日本特開平10-247669號公報
然而，隨著近年來半導體元件的高集積化，使得半導體元件所設置之測試墊變小，且測試墊間的間隔亦變窄。又，隨著近年來半導體元件的高機能化，使得半導體元件所設置之測試墊的數量變多。於是，探針卡便會以狹窄的間距配置有複數探針。
為了使上述般之複數探針確實地接觸於分別對應的測試墊，則探針的針尖與測試墊的對位便非常重要。為了判定探針的針尖位置是否已被配置於期望位置，便必須正確地特定出探針的針尖位置。特定出探針的針尖位置之方法有一種藉由照相機來拍攝探針的針尖，並依據所拍攝之照相機的位置與影像內之探針的針尖位置，來特定出探針的針尖位置之方法。
但隨著近年來半導體元件的高集積化，探針卡係設置有極多數量的探針。因此，若以照相機來個別地一個個拍攝探針的針尖，則特定出探針的針尖位置之處理便會耗費很多時間。於是，半導體元件的檢查便會耗費很多時間。During the semiconductor manufacturing process, a plurality of semiconductor elements having a specific circuit pattern are formed on a semiconductor wafer. Inspection of the electrical characteristics of the formed semiconductor device is performed to distinguish between good and defective products. The inspection of the electrical characteristics of the semiconductor element is performed using an inspection device in a state of a semiconductor wafer before each semiconductor element is divided. The inspection device has a probe card provided with a plurality of probes. The inspection device brings the probe card close to the semiconductor element, so that each probe provided on the probe card contacts the test pad provided on the semiconductor element. Then, the inspection device supplies electrical signals to the semiconductor elements through the probes while the probes are in contact with the test pads, and distinguishes the semiconductor elements based on the electrical signals output from the semiconductor elements through the probes. Whether it is defective.
Further, a technique is known in which the shape inspection of a bonding wire formed on a semiconductor element is performed using a camera. In the above-mentioned technique, epitaxial illumination is performed on the bonding wires on the semiconductor element, and the illuminated bonding wires are photographed in such a manner that a plurality of positions in different height directions will become focal surfaces, and the focal surfaces of the bonding wires are obtained Image information of the highlight image. Then, the height of the bonding wire is specified based on the obtained image information of the bright spot images in each focal plane, the luminance of the person at a specific position, and the height direction position of each focal plane.
[Prior technical literature]
[Patent Literature]
Patent Document 1: Japanese Patent Application Laid-Open No. 10-247669 However, with the increase in the concentration of semiconductor devices in recent years, the test pads provided for semiconductor devices have become smaller, and the interval between test pads has also become narrower. In addition, in recent years, with the increasing performance of semiconductor devices, the number of test pads provided on semiconductor devices has increased. As a result, the probe card is provided with a plurality of probes at a narrow pitch.
In order for the above-mentioned plural probes to reliably contact the corresponding test pads, the alignment of the probe tips and the test pads is very important. In order to determine whether the position of the tip of the probe has been placed at a desired position, the position of the tip of the probe must be accurately specified. There is a method for specifying the position of the probe tip by a camera, and a method of specifying the position of the probe tip according to the position of the camera and the position of the probe tip in the image.
However, with the recent increase in the accumulation of semiconductor elements, probe cards have been provided with an extremely large number of probes. Therefore, if a camera is used to individually capture the tip of the probe, the process of specifying the position of the tip of the probe will take a lot of time. As a result, the inspection of the semiconductor device takes much time.
本發明之一面向為一種探針之針尖位置調整方法，係檢查裝置中之探針的針尖位置調整方法，該檢查裝置會使探針的針尖接觸於被檢查體所設置之各複數襯墊，而透過複數探針的針尖來將電氣訊號供應至被檢查體以檢查被檢查體；該方法會使該檢查裝置實施攝影工序、記憶工序、檢測工序、特定工序及調整工序。攝影工序中，檢查裝置會使照相機沿各探針的高度方向移動，並在移動後之照相機的各位置處，讓照相機以複數探針的針尖會投射在1個影像內之方式來拍攝複數探針的針尖。記憶工序中，檢查裝置會使藉由照相機所拍攝之影像對應於顯示照相機之對焦面的位置之位置資訊而記憶在記憶部。檢測工序中，檢查裝置會針對每個探針，依據記憶部所記憶之各影像來檢測出對焦於探針的針尖之影像。特定工序中，檢查裝置會針對每個探針，依據檢測工序中所檢測出之影像內有對焦之探針的針尖位置，來特定出複數探針的配列方向中之探針的針尖位置。調整工序中，檢查裝置會依據特定工序中所特定出之各探針的針尖位置，來調整各探針的針尖位置。
依據本發明之各種面向及實施型態，便可縮短被檢查體的檢查所需時間。One aspect of the present invention is a method for adjusting the position of a needle tip of a probe, which is a method for adjusting the position of a needle tip of a probe in an inspection device. The electrical signal is supplied to the object to be inspected through the needle tip of a plurality of probes; this method causes the inspection device to perform a photographing process, a memory process, a detection process, a specific process, and an adjustment process. In the photographing process, the inspection device moves the camera in the height direction of each probe, and at each position of the camera after the movement, allows the camera to shoot the plurality of probes such that the tip of the plurality of probes is projected into one image. Needle tip of the needle. In the memorizing step, the inspection device memorizes the position information of the image captured by the camera corresponding to the position at which the focusing surface of the camera is displayed in the memory. In the detection process, the inspection device detects, for each probe, an image focused on the tip of the probe based on each image stored in the memory section. In a specific process, the inspection device specifies, for each probe, the position of the probe tip in the alignment direction of the plurality of probes according to the position of the probe tip in focus in the image detected in the detection process. In the adjustment process, the inspection device adjusts the position of the needle tip of each probe according to the position of the needle tip of each probe specified in the specific process.
According to various aspects and implementation modes of the present invention, the time required for the inspection of the subject can be shortened.
所揭示的探針之針尖位置調整方法在一實施型態中，為一種探針之針尖位置調整方法，係檢查裝置中之探針的針尖位置調整方法，該檢查裝置會使探針的針尖接觸於被檢查體所設置之各複數襯墊，而透過複數探針的針尖來將電氣訊號供應至被檢查體以檢查被檢查體；該方法係使該檢查裝置實施攝影工序、記憶工序、檢測工序、特定工序及調整工序。攝影工序中，檢查裝置會使照相機沿各探針的高度方向移動，並在移動後之照相機的各位置處，讓照相機以複數探針的針尖會投射在1個影像內之方式來拍攝複數探針的針尖。記憶工序中，檢查裝置會使藉由照相機所拍攝之影像對應於顯示照相機之對焦面的位置之位置資訊而記憶在記憶部。檢測工序中，檢查裝置會針對每個探針，依據記憶部所記憶之各影像來檢測出對焦於探針的針尖之影像。特定工序中，檢查裝置會針對每個探針，依據檢測工序中所檢測出之影像內有對焦之探針的針尖位置，來特定出複數探針的配列方向中之探針的針尖位置。調整工序中，檢查裝置會依據特定工序中所特定出之各探針的針尖位置，來調整各探針的針尖位置。
又，所揭示的探針之針尖位置調整方法在一實施型態中，檢查裝置亦可在特定工序中，會特定出以對應於檢測工序檢測出之影像的位置資訊所顯示的位置，來作為探針之針尖的高度方向上位置。
又，所揭示的探針之針尖位置調整方法在一實施型態中，檢查裝置亦可在檢測工序中，當針對每個探針，檢測出複數個對焦影像的情況，會檢測出在所檢測之複數影像當中，探針的高度方向上，從最遠離探針的針尖之位置所拍攝之影像，來作為對焦於探針的針尖之影像。
又，所揭示的探針之針尖位置調整方法在一實施型態中，檢查裝置亦可在檢測工序中，會針對每個探針，就記憶部所記憶之各影像，來特定出對焦區域的大小，並檢測出複數影像間，對應於各探針的針尖之區域的大小會成為最小之影像，來作為對焦於探針的針尖之影像。
又，所揭示的探針之針尖位置調整方法在一實施型態中，檢查裝置亦可在檢測工序中，針對每個探針，就記憶部所記憶之影像當中較記憶部所記憶之影像的數量要少數量之各複數影像，會計算出用以評估探針的針尖所投射之區域中的焦點之指標值，來推定所計算出之指標值的變化傾向，並推定所推定之傾向中指標值會成為最大之情況下，探針的高度方向中之對焦面的位置，而檢測出顯示最接近於推定位置的位置之位置資訊所對應之影像，來作為對焦於探針的針尖之影像。
又，所揭示的探針之針尖位置調整方法在一實施型態中，為一種探針之針尖位置調整方法，係檢查裝置中之探針的針尖位置調整方法，該檢查裝置會使探針的針尖接觸於被檢查體所設置之各複數襯墊，而透過複數探針的針尖來將電氣訊號供應至被檢查體以檢查被檢查體；該方法係使該檢查裝置實施第1攝影工序、記憶工序、檢測工序、第1特定工序、移動工序、第2攝影工序、第2特定工序及調整工序。第1攝影工序中，檢查裝置會使照相機沿各探針的高度方向移動，並在移動後之照相機的各位置處，使照相機以第1範圍內之複數探針的針尖會投射在1個影像內之方式來拍攝複數探針的針尖。記憶工序中，檢查裝置會使藉由照相機所拍攝之影像對應於照相機之對焦面的位置資訊來記憶在記憶部。檢測工序中，檢查裝置會針對每個探針，依據記憶部所記憶之各影像來檢測出對焦於探針的針尖之影像。第1特定工序中，檢查裝置會針對每個探針，依據檢測工序中所檢測出之影像中有對焦之探針的針尖位置，來特定出複數探針的配列方向中之探針的針尖位置。移動工序中，檢查裝置會針對每個探針，使照相機移動至可拍攝第1特定工序中所特定出之探針的針尖位置之位置，且為檢測工序中，被檢測為有對焦之探針的針尖影像相對應之位置資訊所顯示探針之高度方向上的位置。第2攝影工序中，檢查裝置會針對每個探針，在藉由移動工序而被移動後之位置處，使照相機拍攝較第1範圍要狹窄的第2範圍。第2特定工序中，檢查裝置會針對每個探針，依據第2攝影工序中所拍攝之影像中之探針的針尖位置，來進一步特定出複數探針的配列方向中之探針的針尖位置。調整工序中，檢查裝置會依據第2特定工序中所特定出之各探針的針尖位置，來調整各探針的針尖位置。
又，所揭示的檢查裝置在一實施型態中，為一種檢查裝置，係使探針的針尖接觸於被檢查體所設置之各複數襯墊，而透過複數探針的針尖來將電氣訊號供應至被檢查體以檢查被檢查體，具有照相機、移動部、攝影控制部、記憶部、檢測部、特定部及調整部。移動部係使照相機沿各探針的高度方向移動。攝影控制部係在藉由移動部而移動後之照相機的各位置處，讓照相機以複數探針的針尖會投射在1個影像內之方式來拍攝複數探針的針尖。記憶部係使藉由照相機所拍攝之影像對應於照相機之對焦面的位置資訊來加以記憶。檢測部係針對每個探針，依據記憶部所記憶之各影像，來檢測出對焦於針尖之影像。特定部係針對每個探針，依據藉由檢測部所檢測之影像內有對焦之探針的針尖位置，來特定出複數探針的配列方向中之各探針的針尖位置。調整部係依據藉由特定部所特定出之各探針的針尖位置，來調整各探針的針尖位置。
以下，便依據圖式來針對所揭示的探針之針尖位置調整方法及檢查裝置的實施型態詳細地說明。此外，所揭示的探針之針尖位置調整方法及檢查裝置並不因本實施型態而受到限制。
[實施例1]
[檢查裝置10的構成]
圖1係顯示檢查裝置10的一例之主要部分剖面圖。本實施例中的檢查裝置10係具有檢查裝置本體20及控制裝置50。檢查裝置本體20係具有中空的框體21，框體21內的略中央係設置有會使載置台25移動於上下方向(圖1所示之z軸方向)及橫向(與圖1所示的x軸及y軸呈平行之xy平面內的方向)之移動機構23。載置台25的上面係載置有為被檢查體一例之半導體晶圓W，載置台25係藉由真空夾具等來將被載置於上面之半導體晶圓W吸附保持在載置台25的上面。載置台25的側面係安裝有照相機27。照相機27係以拍攝方向朝向上方之型態被安裝在載置台25的側面。
藉由移動機構23來使載置台25移動，則載置台25的側面所安裝之照相機27便亦會移動。移動機構23係藉由控制裝置50而受到控制，移動機構23的移動量係藉由控制裝置50而受到管理。於是，載置台25及照相機27在框體21內之位置的x座標、y座標及z座標便會藉由控制裝置50而受到管理。
框體21係於上部具有略圓形狀的開口部，該開口部係設置有測試頭30。測試頭30係被固定在沿開口部的周緣所設置之框架22。在測試頭30內，框架22的位置處係設置有複數傾斜調整部32。各傾斜調整部32係沿著框架22而以特定間隔配置在開口部的周邊。本實施例中，例如3個傾斜調整部32係沿著框架22而以特定間隔設置在開口部的周邊。又，各傾斜調整部32係在框架22的下方處，透過軸件33而由上方來保持略圓筒狀的保持具34。
保持具34係於其下部處，可裝卸地保持著設置有複數探針38之探針卡36。探針卡36所設置之各探針38係以針尖朝向下方之方式被設置於探針卡36。圖1所例示之探針卡36雖係圖示單臂式探針38，但探針卡36亦可設置有垂直針型態的探針38，或是亦可設置有單臂式探針38與垂直針型態的探針38兩者。
又，各探針38係以當載置台25所載置之半導體晶圓W移動至檢查時的位置時，會成為使得探針38的針尖接觸於半導體晶圓W所設置的測試墊之位置之方式來被配置在探針卡36。各探針38係連接於探針卡36所設置之配線，探針卡36所設置之各配線係透過保持具34所設置之配線而被連接於測試頭30。測試頭30係連接有外部測試器31。
此處，探針卡36會因被組裝於保持具34時的組裝誤差等，而有使得各探針38的針尖位置成為整體地自半導體晶圓W所設置之測試墊相對應的位置偏移之位置的情況。例如，若探針卡36橫向地偏移而被加以組裝之情況，則所有探針38的針尖位置便會在橫向上偏移固定量。又，若探針卡36相對於z軸而斜傾地被加以組裝之情況，則探針38在z軸方向上的針尖位置差異便會變大。
若探針38的針尖位置橫向地大幅偏移，則各探針38的針尖便會變得無法接觸於相對應的測試墊。又，若探針38在z軸方向上的針尖位置差異過大，當所有探針38的針尖接觸於測試墊時，便會使針尖位在最下方之探針38的彈性變形變大而有折斷或變形的情況。因此，本實施例中，係在檢查開始前，先使用照相機27來檢測出各探針38的位置，並針對每個探針38來計算出探針38的針尖位置與測試墊的位置之誤差，再依據所計算出之誤差來調整探針38的位置及半導體晶圓W的位置。
各傾斜調整部32係以框架22的下面與保持具34的上面之間會相隔特定間隙之方式來保持保持具34。然後，各傾斜調整部32會對應於來自控制裝置50的指示來使軸件33個別地上下移動，以控制框架22的下面與保持具34的上面之間的間隔。藉此，則保持具34相對於xy平面的傾斜便會受到控制，且藉由保持具34而被保持之探針卡36的面相對於xy平面的傾斜便會受到控制。藉由探針卡36的傾斜會受到控制，便可調整探針卡36所設置之複數探針38的針尖在上下方向，即探針38之z軸方向上的針尖位置。
依上述方式構成的檢查裝置本體20中，當進行載置台25上所載置之半導體晶圓W的檢查時，首先，控制裝置50會控制移動機構23來使照相機27位在探針38的下方。然後，控制裝置50會一邊控制移動機構23來使照相機27接近探針38，一邊使照相機27拍攝探針38。然後，控制裝置50會依據照相機27所拍攝之影像，來測量各探針38之針尖在橫向及上下方向上的位置。
然後，控制裝置50會控制各傾斜調整部32以補正各探針38之針尖的上下方向位置偏移。又，關於各探針38之針尖的橫向位置偏移，控制裝置50係藉由控制移動機構23來微調載置台25的橫向位置。
然後，控制裝置50係藉由控制移動機構23，來使載置有半導體晶圓W之載置台25上升，以使半導體晶圓W上的各測試墊與探針38以特定的過驅動量來相接觸。過驅動量係指使載置有半導體晶圓W之載置台25上升，來使半導體晶圓W上的測試墊與各探針38的針尖相接觸後，進一步地再使載置台25上升時的上升量。然後，控制裝置50會控制外部測試器31來使其朝測試頭30輸出特定的電氣訊號。測試頭30會將從外部測試器31所輸出的電氣訊號透過保持具34內的各配線來朝探針卡36輸出。朝探針卡36所輸出之電氣訊號會透過探針卡36內的配線而被供應至各探針38，再透過探針38來朝半導體晶圓W的測試墊被輸出。
又，從半導體晶圓W上的測試墊所輸出之電氣訊號會朝探針38被輸出。朝探針38被輸出的電氣訊號會透過探針卡36內的配線及保持具34內的配線來朝測試頭30被輸出。朝測試頭30被輸出的電氣訊號會朝外部測試器31被輸出。外部測試器31會依據朝測試頭30所輸出的電氣訊號與從測試頭30所輸出的電氣訊號，來評估半導體晶圓W的電氣特性，並將評估結果朝控制裝置50輸出。
此外，當探針38發生破損或變形等不良的情況，即便藉由各傾斜調整部32來進行傾斜調整，或是藉由移動機構23來進行橫向上的位置微調，仍會難以正確地進行檢查。因此，當依據照相機27所拍攝的影像而檢測出各探針38的針尖發生破損或變形等時，控制裝置50便會透過顯示器等來對作業員通知警訊，以促進探針卡36的維修保養或更換。
[控制裝置50]
圖2係顯示控制裝置50的一例之方塊圖。控制裝置50例如圖2所示，係具備有攝影控制部51、記憶部52、檢測部53、特定部54、調整部55及檢查實行部56。
攝影控制部51會控制移動機構23來讓載置台25移動，以使照相機27位在探針38的下方。然後，攝影控制部51會控制移動機構23來讓載置台25上升。藉此，照相機27便會和載置台25一起上升，且沿各探針38的高度方向(即圖1的z軸方向)移動。然後，攝影控制部51會在移動後之照相機27的各位置處，以複數探針38的針尖會投射在1個影像內之方式來使照相機27拍攝複數探針38的針尖。
然後，攝影控制部51會使照相機27所拍攝之影像對應於對焦面的z座標並記憶在記憶部52。本實施例中，攝影控制部51係預先設定有從照相機27的透鏡至對焦面之被攝體距離，攝影控制部51會依據各影像中，被攝體距離與該影像被拍攝時照相機27之透鏡位置的座標來特定出對焦面的z座標。
圖3係用以說明照相機27的移動方向與對焦面的位置之一關係例之圖式。攝影控制部51藉由控制移動機構23來如圖3之箭頭所示般地使照相機27從探針38的下方上升般地移動。然後，攝影控制部51會在移動後之照相機27的各位置處，以複數探針38的針尖會投射在1個影像內之方式來使照相機27拍攝複數探針38的針尖。圖3之範例中，照相機27所拍攝之1個影像內係投射有3個探針38-1~38-3的針尖。藉由照相機27的上升，則照相機27之對焦面的z座標便會例如圖3所示般地由Z1變化為Z11。
此外，以下將照相機27之對焦面的z座標(即Zn，n為1~11的整數)相對應的影像記載為影像Zn。圖3之範例中，影像Z4中，係對焦於探針38-1的針尖，影像Z6中，係對焦於探針38-2的針尖，影像Z8中，係對焦於探針38-3的針尖。此外，照相機27較佳為景深較短(淺)的照相機。藉此，在拍攝方向上，對焦距離的範圍會變得更狹窄，可精確度佳地檢測各探針38之針尖在z軸方向上的位置差異。
記憶部52會使照相機27所拍攝的各影像對應於照相機27之對焦面的位置資訊來加以記憶。位置資訊例如為照相機27之對焦面的z座標。
檢測部53會參照記憶部52，而在照相機27的各位置處，依據照相機27所拍攝之影像來檢測出對焦於探針38的針尖之影像。具體來說，檢測部53係針對每個影像，來將投射在影像內之畫素群組化。z座標為相鄰接之影像間，有特定比率以上的區域相重疊之群組會被判定為相同的群組。然後，檢測部53會針對每個群組來計算出顯示對焦程度的指標值。然後，檢測部53會依據針對每個群組所計算出之指標值，來檢測出對焦於探針38的針尖之影像。
此處，再次參閱圖3。由於照相機27會一邊由探針38的下方上升一邊拍攝複數探針38，首先，便會從影像Z1來依序拍攝。影像Z3係成為例如圖4所示般。圖4~圖7係顯示照相機27所拍攝的一影像例之圖式。檢測部53會依據照相機27所拍攝之影像內各畫素的輝度等畫素值，來將該影像內的畫素加以群組化。圖4之範例中，探針38-1的針尖相對應之畫素係被群組化為群組41-1，探針38-2的針尖相對應之畫素係被群組化為群組41-2，探針38-3的針尖相對應之畫素係被群組化為群組41-3。此外，以下並未將各探針38-1~38-3加以區別而是總稱的情況，則僅記載為探針38，並未將各群組41-1~41-3加以區別而是總稱的情況，則僅記載為群組41。
圖4所例示之影像Z3中，由於未對焦於任何探針38的針尖，故所有的群組41幾乎都很模糊，所有群組41的大小皆是大於對焦於探針38的針尖情況下之群組41的大小。
又，將影像Z4加以圖示，係成為例如圖5所示般。圖5所例示之影像Z4內係包含有探針38-1的針尖相對應之群組41-1、探針38-2的針尖相對應之群組41-2、以及探針38-3的針尖相對應之群組41-3。影像Z4中，由於有對焦於探針38-1的針尖，故探針38-1相對應之群組41-1的大小便會小於未對焦情況下之群組41-1的大小。複數影像間，若著眼於相同的群組41之情況，則對焦於探針38-1的針尖之影像中，群組41的大小會成為最小。
又，將影像Z5加以圖示，係成為例如圖6所示般。圖6所例示之影像Z5中，由於未對焦於任何探針38，故所有的群組41幾乎都很模糊。又，將影像Z6加以圖示，係成為例如圖7所示般。圖7所例示之影像Z6中，由於有對焦於探針38-2的針尖，故探針38-2相對應之群組41-2的大小會成為最小。但其他的探針38相對應之群組41則會大於當對焦於針尖情況下之探針38相對應之群組41的大小。
回到圖2來繼續說明。特定部54會針對每個群組，依據檢測部53所檢測之影像，來特定出該群組相對應之探針38的針尖位置。具體來說，特定部54係依據檢測部53所檢測之影像內有對焦之群組的位置，來特定出xy平面內該群組相對應之探針38的針尖位置。又，特定部54會針對每個群組來特定出檢測部53所檢測之影像相對應的z座標，而作為該群組相對應之探針38之針尖的z座標。藉此，特定部54便可針對影像內所投射之探針38的每個針尖，來特定出該針尖之3維空間內位置的x座標、y座標及z座標。然後，特定部54會將針對每個群組所特定出之探針38的針尖位置資訊朝調整部55輸出。
調整部55會依據從特定部54所輸出之探針38的針尖位置資訊，來調整各探針38的針尖位置。具體來說，調整部55會依據從特定部54所輸出之探針38之每個針尖的位置資訊，來針對每個傾斜調整部32計算出用以縮小各針尖的z座標差異之調整量。然後，調整部55會依據針對每個傾斜調整部32所計算出之調整量，來控制各傾斜調整部32。藉此，便可縮小各探針38之針尖之在z方向上的位置差異。又，由於亦可辨識各探針38之針尖的z座標偏差，故縱使不調整探針卡36的傾斜，仍可計算出所需的過驅動量，從而便可以適當的壓力來使各探針38的針尖與半導體晶圓W上的測試墊相接觸。
又，調整部55會依據從特定部54所輸出之每個群組的位置資訊，來計算出各群組相對應之探針38的針尖與接觸於各探針38的針尖之半導體晶圓W上的測試墊在xy平面內的位置誤差。然後，調整部55會將所計算出之xy平面內的位置誤差朝檢查實行部56輸出。
檢查實行部56係藉由控制移動機構23，來使載置有半導體晶圓W之載置台25移動至探針38的下方，並使載置台25上升，以使半導體晶圓W上的測試墊與探針38的針尖相接觸。然後，會對外部測試器31指示檢查開始，來開始半導體晶圓W的檢查。此外，檢查實行部56係依據從調整部55所輸出之xy平面內的位置誤差，來使半導體晶圓W檢查時之xy平面內的半導體晶圓W位置會偏移。藉此，便可使各探針38的針尖確實地接觸於相對應之測試墊。
此外，探針38中，不僅垂直針型態，而亦存在有單臂式探針。圖8係用以說明單臂式探針38-4被拍攝時，照相機27的移動方向與對焦面的位置之一關係例之圖式。圖8之範例中，影像Z3中，雖有對焦於探針38-4的針尖，但影像Z8~Z11中，亦有對焦於探針38-4的臂部。
又，將影像Z3加以圖示，係成為例如圖9所示般。圖9~圖11係顯示照相機27所拍攝的一影像例之圖式。圖9所例示之影像Z3中，係特定出探針38-4的針尖及臂部相對應之畫素的群組41-4。然後，群組41-4內，針尖相對應之區域42中有對焦。
另一方面，將影像Z8加以圖示，係成為例如圖10所示般。圖10所例示之影像Z8中，係對焦於探針38-4的針尖及臂部相對應之畫素的群組41-4當中，臂部的一部分相對應之區域42。
又，將影像Z9加以圖示，係成為例如圖11所示般。圖11所例示之影像Z9中，亦係對焦於探針38-4的針尖及臂部相對應之群組41-4當中，臂部的一部分相對應之區域42。此處，單臂式探針38-4中，雖有對焦於臂部的情況，但若改變照相機27在z軸方向上的位置，例如圖10及圖11所示般地，則對焦之區域42便會在影像內移動。另一方面，當對焦於探針38的針尖部分之情況，則對焦區域便不會在影像間移動，或是即使移動，其移動量仍非常地少。
如圖9至圖11所示般，單臂式探針38-4中，除了針尖以外，亦有對焦於臂部的情況，而有臂部被誤辨識為針尖的情況。為了避免上述情況，本實施例之檢測部53係比較所連續拍攝的影像，當對焦區域在影像間移動的情況，若判定為對焦於針尖以外的物體，則會自成為針尖有對焦的候補之影像來加以除外。藉此，檢測部53即便是單臂式探針38-4，仍可精確度佳地檢測對焦於針尖之影像。
又，即便是單臂式探針38-4，針尖係位在z軸方向上較臂部要下方。因此，當檢測部53針對每個探針38而檢測出複數個有對焦於探針38的針尖之影像的情況，則亦可將該複數影像當中，自最遠離探針38的針尖之位置所拍攝之影像，作為有對焦於探針38的針尖之影像來加以檢測。藉此，則檢測部53縱使是單臂式探針38-4，仍可精確度佳地檢測對焦於針尖之影像。
此處，係針對依據一個個地拍攝探針38之影像來測量探針38的位置之比較例加以說明。比較例中，係針對每個探針38，在z軸方向上一邊改變照相機27的位置一邊拍攝探針38的針尖，來特定出對焦影像。然後，照相機27會以被拍攝之特定影像的z軸方向位置作為最佳對焦位置來移動至最佳對焦位置。然後，在最佳對焦位置處再次拍攝探針38，並依據所拍攝之影像內的針尖位置來特定出探針38的針尖位置。
如此般地，比較例中，由於係針對每個探針來辨識出探針的針尖位置，若以每一根的辨識時間為T秒，則n根探針的針尖位置辨識時間便會總共費時nT秒。相對於此，本實施例中，由於可一次同時進行n根探針的針尖位置辨識，故能以大約T秒來辨識出探針的針尖位置。從而，本實施例中，便可使針尖位置的辨識時間縮短為比較例的大約1/n。
[實施例2]
實施例1中係一邊改變z軸方向上照相機27的位置，一邊比較所拍攝之各複數影像，而使用有對焦之影像來特定出探針38的針尖位置。相對於此，本實施例中，則是一邊改變z軸方向上照相機27的位置，一邊針對所拍攝之複數影像當中，較該複數影像要少數量的影像來進行比較，而由影像的位移傾向來推定出z座標。然後，使用最接近於所推定的z座標之座標相對應的影像，來特定出探針38的針尖位置。藉此，則相較於針對照相機27所拍攝的全部影像來進行比較之情況，便可減少演算量，從而可更迅速地特定出各探針38的針尖位置。
接著，針對本實施例中z位置的一具體推定方法例來加以說明。首先，檢測部53會選擇照相機27所拍攝之Zmax
個影像當中的一部分影像(例如第奇數個影像)，並將所選擇之各影像內的畫素加以群組化。此外，檢測部53若是使用較Zmax
個影像要少數量的影像來將各影像內的畫素加以群組化，則亦可使用例如第偶數個影像或每隔k(k為2以上的整數)之不同編號的影像來將各影像內的畫素加以群組化。
接著，檢測部53會參照探針的針尖被拍攝之影像內所投射之針尖的區域，來選擇針尖的區域最小之影像(影像編號：In
)以及針尖的區域次小之影像(影像編號：In+1
)。然後，檢測部53會分別計算出各影像中所投射之針尖區域的大小(例如區域的直徑：φn
及φn+1
)。有對焦之z位置被認為是介於影像編號In
相對應的z座標與影像編號In+1
相對應的z座標之間。因此，檢測部53便會依據區域的位移傾向，而將影像編號In
相對應的z座標與影像編號In+1
相對應的z座標之間的座標，推定為有對焦之z座標。具體來說，檢測部53係由影像編號In
相對應的z座標，而將z軸方向上遠離φn
/(φn
+φn+1
)之座標推定為有對焦之z座標。
[實施例3]
實施例1中，係使用以複數探針38的針尖會投射在1張影像之方式所拍攝的複數影像，來特定出各探針38的針尖位置。相對於此，本實施例3中，則係使用以第1範圍內之複數探針38的針尖會投射在1張影像之方式所拍攝的影像，來特定出各探針38的針尖位置。然後，針對各探針38的針尖，使照相機27移動至可拍攝針尖之位置，並使照相機27以較第1範圍要狹窄之第2範圍來進一步地拍攝探針38的針尖，而依據所拍攝之影像，來更詳細地特定出探針38的針尖位置。藉此，便可更佳精確度地特定出各探針38的針尖位置。
具體來說，攝影控制部51係以第1範圍內之複數探針38的針尖會投射在1個影像內之方式來使照相機27拍攝複數探針38的針尖。檢測部53會檢測出各影像內，所特定出之每個群組中有對焦的影像。然後，特定部54會針對每個群組，依據檢測部53所檢測之影像，來將群組位置的x座標、y座標及z座標，分別特定為群組相對應之探針38之針尖位置的x座標、y座標及z座標。特定部54會針對每個群組，將檢測部53所檢測之影像中群組的區域(例如中心位置的x座標、y座標及z座標)，分別特定為群組相對應之探針38之針尖位置的x座標、y座標及z座標。
特定部54係藉由控制移動機構23來使照相機27朝可拍攝被特定出的位置之位置移動。此時，特定部54會使照相機27移動至檢測部53拍攝出所檢測之影像時之z軸方向上的照相機27位置，且為可拍攝包含有被特定出的位置之範圍的位置。
然後，特定部54會在已完成移動之照相機27的位置處，使照相機27拍攝探針38的針尖。此時，特定部54會使照相機27拍攝較第1範圍要狹窄之第2範圍。亦即，特定部54會使照相機27放大較第1範圍要狹窄之第2範圍來進行拍攝。
然後，特定部54會依據照相機27所拍攝之影像來進一步特定出影像內所投射之群組相對應之探針38的針尖位置的x座標及y座標。
如以上的說明，本實施例中，係使用以第1範圍內之複數探針38的針尖會投射在1張影像之方式所拍攝的影像，來特定出各探針38的針尖位置。然後，針對各探針38的針尖，使照相機27進一步地移動至可拍攝針尖之位置，而以較第1範圍要狹窄之第2範圍來拍攝探針38的針尖，並依據所拍攝之影像來更詳細地特定出探針38的針尖位置。
[硬體]
此外，上述實施例1~3所示之控制裝置50係藉由例如圖12所示般的硬體來加以實現。圖12係顯示控制裝置50的一硬體例之圖式。控制裝置50係具備有CPU(Central Processing Unit)500、RAM(Random Access Memory)501、ROM(Read Only Memory)502、輔助記憶裝置503、通訊介面(I/F)504、輸出入介面(I/F)505、及媒體介面(I/F)506。
CPU500會依據儲存在ROM502或輔助記憶裝置503之程式而動作，來進行各部的控制。ROM502會儲存當控制裝置50起動時，CPU500所執行的啟動程式，或依附於控制裝置50的硬體之程式等。
輔助記憶裝置503為例如HDD(Hard Disk Drive)或SSD(Solid State Drive)等，會儲存CPU500所執行之程式及該程式所使用之資料等。CPU500會從輔助記憶裝置503來讀取該程式並下載在RAM501上，且執行所下載的程式。
通訊I/F504會透過LAN(Local Area Network)等通訊線路來與檢查裝置本體20之間進行通訊。通訊I/F504會透過通訊線路來從檢查裝置本體20接收資料並朝CPU500傳送，且將CPU500所生成的資料透過通訊線路來朝檢查裝置本體20傳送。
CPU500會透過輸出入I/F505來控制鍵盤等輸入裝置及顯示器等輸出裝置。CPU500會透過輸出入I/F505來取得從輸入裝置所輸入之訊號並朝CPU500傳送。又，CPU500會透過輸出入I/F505來將所生成之資料朝輸出裝置輸出。
媒體I/F506會讀取儲存在記錄媒體507的程式或資料，並儲存在輔助記憶裝置503。記錄媒體507為例如DVD(Digital Versatile Disc)、PD(Phase change rewritable Disk)等光學記錄媒體、MO(Magneto-Optical disk)等光磁性記錄媒體、帶式媒體、磁性記錄媒體或半導體記憶體等。
控制裝置50的CPU500係藉由執行被下載在RAM501上的程式，來實現攝影控制部51、檢測部53、特定部54、調整部55及檢查實行部56的各功能。又，RAM501或輔助記憶裝置503係儲存有記憶部52內的資料。
控制裝置50的CPU500雖會從記錄媒體507來讀取被下載在RAM501上的程式並儲存在輔助記憶裝置503，但作為其他例，亦可從其他裝置而透過通訊線路來取得程式並儲存在輔助記憶裝置503。
此外，本發明並未限定於上述各實施例，可在其要旨之範圍內做各種變形。
例如，作為第一變形例，控制裝置50亦可具有輸出部，該輸出部會朝記憶部52或控制裝置50的外部所設置之外部記憶媒體，來輸出以特定部54被加以特定再朝調整部55被輸出之針尖位置資訊。從輸出部所輸出之針尖位置資訊會被利用來作為例如用以檢測針尖位置的依時變化之日誌檔(log file)。由於本發明中可大幅地縮短探針尖檢測的檢測所需時間，故能較以往要更早實施朝日誌檔的保存。藉由確認所保存的日誌檔，便可客觀地獲得因使用而造成探針尖位置的依時變化或複數探針卡的機差。然後，藉由追蹤探針尖位置的變化量，便可得知探針卡的組裝不良或及早發現探針卡本身的不良，或是得知探針本身的消耗程度或及早判斷使用壽命。
又，上述各實施例中，係依據照相機27所拍攝之複數影像，來分別特定出各探針38之針尖位置的x座標、y座標及z座標。但所揭示之技術不限於此。例如，作為第二變形例，檢查裝置10亦可依據照相機27所拍攝之複數影像，來分別特定出各探針38之針尖在複數探針38之配列方向上的位置，即x座標及y座標。亦即，檢查裝置10亦可不針對各探針38之針尖的z座標來加以特定。
又，上述各實施例中，雖係使照相機27從遠離探針38的針尖之位置朝向接近探針38的針尖之位置移動，並在移動後之照相機27的各位置處拍攝複數探針38的針尖，但所揭示之技術不限於此。例如，亦可使照相機27從接近探針38的針尖之位置朝向遠離探針38的針尖之位置移動，並在移動後之照相機27的各位置處拍攝複數探針38的針尖。The disclosed method for adjusting the position of a needle tip of a probe is, in one embodiment, a method for adjusting the position of a needle tip of a probe, which is a method of adjusting the position of a needle of a probe in an inspection device. Each of the plurality of pads provided on the object to be inspected is supplied with electrical signals through the needle tips of the plurality of probes to inspect the object; the method is to make the inspection device implement a photographing process, a memory process, and a detection process. Specific procedures and adjustment procedures. In the photographing process, the inspection device moves the camera in the height direction of each probe, and at each position of the camera after the movement, allows the camera to shoot the plurality of probes such that the tip of the plurality of probes is projected into one image. Needle tip of the needle. In the memorizing step, the inspection device memorizes the position information of the image captured by the camera corresponding to the position at which the focusing surface of the camera is displayed in the memory. In the detection process, the inspection device detects, for each probe, an image focused on the tip of the probe based on each image stored in the memory section. In a specific process, the inspection device specifies, for each probe, the position of the probe tip in the alignment direction of the plurality of probes according to the position of the probe tip in focus in the image detected in the detection process. In the adjustment process, the inspection device adjusts the position of the needle tip of each probe according to the position of the needle tip of each probe specified in the specific process.
In addition, in the embodiment of the disclosed method for adjusting the tip position of the probe, the inspection device may also specify the position displayed by the position information corresponding to the image detected by the detection process in a specific process as Position of the tip of the probe in the height direction.
In addition, in an embodiment of the disclosed method for adjusting the tip position of the probe, the inspection device may also detect a plurality of in-focus images for each probe during the detection process. Among the plurality of images, the image taken from the position of the needle tip furthest from the probe in the height direction of the probe is used as the image focused on the needle tip of the probe.
In addition, in an embodiment of the disclosed method for adjusting the position of the tip of the probe, the inspection device may also specify the focus area for each probe in the detection process based on the images stored in the memory unit. Size, and among the plural images detected, the size of the area corresponding to the tip of each probe becomes the smallest image, which is used as the image focused on the tip of the probe.
In addition, in the embodiment of the disclosed method for adjusting the tip position of the probe, the inspection device may also perform, in the detection process, for each probe, the image stored in the memory section compared with the image stored in the memory section. The number of each plural image should be small, and the index value of the focus in the area projected by the needle tip of the probe is calculated to estimate the change tendency of the calculated index value and the estimated index value of the estimated tendency. When it becomes the maximum, the position corresponding to the position of the focusing surface in the height direction of the probe is detected, and the image corresponding to the position information showing the position closest to the estimated position is detected as the image focused on the tip of the probe.
In addition, the disclosed method for adjusting the tip position of a probe is, in one embodiment, a method for adjusting the tip position of a probe, which is a method for adjusting the tip position of a probe in an inspection device. The needle tip is in contact with each of the plurality of pads provided on the subject, and the electrical signal is supplied to the subject through the tip of the plurality of probes to inspect the subject; this method is to make the inspection device perform the first photographing process and memory Process, detection process, first specific process, moving process, second imaging process, second specific process, and adjustment process. In the first photographing step, the inspection device moves the camera in the height direction of each probe, and at each position of the moved camera, the camera projects a single image with the tip of the plurality of probes in the first range. Inside the way to shoot the tip of multiple probes. In the memorizing process, the inspection device memorizes the position information of the image captured by the camera corresponding to the focusing surface of the camera in the memory section. In the detection process, the inspection device detects, for each probe, an image focused on the tip of the probe based on each image stored in the memory section. In the first specific step, the inspection device specifies, for each probe, the position of the probe tip in the alignment direction of the plurality of probes based on the position of the probe tip in focus in the image detected in the detection process. . During the moving process, the inspection device moves the camera to each of the probes to a position where the needle tip position of the probe specified in the first specific process can be captured, and it is detected as a focused probe during the detection process. The position of the probe in the height direction shown by the position information corresponding to the needle tip image of. In the second imaging step, the inspection device makes the camera image the second range narrower than the first range for each probe at the position after being moved by the moving step. In the second specific step, the inspection device further specifies the position of the probe tip in the alignment direction of the plurality of probes for each probe according to the position of the probe tip in the image captured in the second photographing step. . In the adjustment process, the inspection device adjusts the position of the needle tip of each probe according to the position of the needle tip of each probe specified in the second specific step.
In addition, in one embodiment, the disclosed inspection device is an inspection device in which the needle tip of a probe is in contact with each of a plurality of pads provided on an object to be inspected, and electrical signals are supplied through the needle tips of the multiple probes The device includes a camera, a moving unit, a photographing control unit, a memory unit, a detection unit, a specific unit, and an adjustment unit. The moving unit moves the camera in the height direction of each probe. The shooting control section is to shoot the needle tip of the plural probes so that the needle tip of the plural probes will be projected into one image at each position of the camera moved by the moving section. The memory unit memorizes the position information of the image captured by the camera corresponding to the focusing surface of the camera. The detection unit detects, for each probe, an image focused on the needle tip based on each image stored in the memory unit. The specific part specifies, for each probe, the position of the tip of each probe in the alignment direction of the plurality of probes based on the position of the tip of the focused probe in the image detected by the detection unit. The adjusting unit adjusts the position of the needle tip of each probe according to the position of the needle tip of each probe specified by the specific unit.
In the following, the method for adjusting the tip position of the probe and the implementation form of the inspection device will be described in detail based on the drawings. In addition, the disclosed method for adjusting the tip position of the probe and the inspection device are not limited by this embodiment.
[Example 1]
[Configuration of Inspection Device 10]
FIG. 1 is a sectional view of a main part showing an example of the inspection device 10. The inspection device 10 in this embodiment includes an inspection device body 20 and a control device 50. The inspection device main body 20 has a hollow frame body 21, and the center of the frame body 21 is provided to move the mounting table 25 in the up-down direction (z-axis direction shown in FIG. 1) and horizontally (as shown in FIG. 1). The x-axis and the y-axis are in a direction parallel to the xy plane). The semiconductor wafer W, which is an example of an object, is mounted on the mounting table 25, and the semiconductor wafer W mounted on the mounting table 25 is sucked and held on the mounting table 25 by a vacuum jig or the like. A camera 27 is attached to the side of the mounting table 25. The camera 27 is attached to the side surface of the mounting base 25 so that the imaging direction faces upward.
When the mounting table 25 is moved by the moving mechanism 23, the camera 27 mounted on the side of the mounting table 25 also moves. The moving mechanism 23 is controlled by the control device 50, and the movement amount of the moving mechanism 23 is controlled by the control device 50. Then, the x-coordinate, y-coordinate, and z-coordinate of the positions of the mounting table 25 and the camera 27 in the housing 21 are managed by the control device 50.
The frame body 21 has an opening portion having a substantially circular shape in the upper portion, and the opening portion is provided with the test head 30. The test head 30 is fixed to a frame 22 provided along the periphery of the opening. In the test head 30, a plurality of tilt adjustment sections 32 are provided at the positions of the frame 22. Each of the tilt adjustment portions 32 is arranged along the frame 22 at a specific interval around the opening portion. In this embodiment, for example, the three tilt adjustment sections 32 are provided around the opening 22 along the frame 22 at specific intervals. Each of the tilt adjustment portions 32 is located below the frame 22 and holds the slightly cylindrical holder 34 from above through the shaft member 33.
The holder 34 is attached to a lower portion thereof, and detachably holds a probe card 36 provided with a plurality of probes 38. Each of the probes 38 provided on the probe card 36 is provided on the probe card 36 with the needle tip facing downward. Although the probe card 36 illustrated in FIG. 1 is a single-arm probe 38 as shown in the figure, the probe card 36 may also be provided with a probe of the vertical pin type 38 or may be provided with a single-arm probe 38 Both with the vertical pin type probe 38.
In addition, each of the probes 38 is a position where the tip of the probe 38 is brought into contact with the test pad provided on the semiconductor wafer W when the semiconductor wafer W placed on the mounting table 25 is moved to a position during inspection. The way comes to be arranged on the probe card 36. Each probe 38 is connected to the wiring provided in the probe card 36, and each wiring provided in the probe card 36 is connected to the test head 30 through the wiring provided in the holder 34. The test head 30 is connected to an external tester 31.
Here, the probe card 36 may be misaligned from the position corresponding to the test pad provided on the semiconductor wafer W due to an assembly error or the like when the probe card 36 is assembled in the holder 34. Position. For example, if the probe cards 36 are assembled laterally offset, the positions of the needle tips of all the probes 38 may be offset laterally by a fixed amount. When the probe card 36 is assembled obliquely with respect to the z-axis, the difference in the position of the needle tip of the probe 38 in the z-axis direction becomes larger.
If the position of the needle tip of the probe 38 is largely shifted laterally, the needle tip of each probe 38 will become inaccessible to the corresponding test pad. In addition, if the position of the tip of the probe 38 in the z-axis direction is too large, when the tips of all the probes 38 contact the test pad, the elastic deformation of the probe 38 with the tip positioned at the bottom will become large and broken. Or deformation. Therefore, in this embodiment, before the inspection starts, the position of each probe 38 is detected using the camera 27, and the error between the position of the tip of the probe 38 and the position of the test pad is calculated for each probe 38. Then, the position of the probe 38 and the position of the semiconductor wafer W are adjusted according to the calculated error.
Each tilt adjustment portion 32 holds the holder 34 such that a specific gap is provided between the lower surface of the frame 22 and the upper surface of the holder 34. Then, each of the tilt adjustment units 32 moves the shaft member 33 up and down individually in response to an instruction from the control device 50 to control the interval between the lower surface of the frame 22 and the upper surface of the holder 34. Thereby, the inclination of the holder 34 with respect to the xy plane is controlled, and the inclination of the surface of the probe card 36 held by the holder 34 with respect to the xy plane is controlled. Since the inclination of the probe card 36 is controlled, the needle points of the plurality of probes 38 provided in the probe card 36 can be adjusted in the up-down direction, that is, the position of the needle tips in the z-axis direction of the probe 38.
In the inspection device body 20 configured as described above, when the semiconductor wafer W mounted on the mounting table 25 is inspected, first, the control device 50 controls the moving mechanism 23 so that the camera 27 is positioned below the probe 38. . Then, the control device 50 controls the moving mechanism 23 to bring the camera 27 close to the probe 38 and causes the camera 27 to capture the probe 38. Then, the control device 50 measures the position of the needle tip of each probe 38 in the lateral and vertical directions according to the image captured by the camera 27.
Then, the control device 50 controls each of the tilt adjustment sections 32 to correct the positional deviation of the needle tip of each probe 38 in the vertical direction. Regarding the lateral position shift of the needle tip of each probe 38, the control device 50 finely adjusts the lateral position of the mounting table 25 by controlling the moving mechanism 23.
Then, the control device 50 controls the moving mechanism 23 to raise the mounting table 25 on which the semiconductor wafer W is mounted, so that each of the test pads and the probes 38 on the semiconductor wafer W are driven by a specific overdrive amount. Phase contact. The overdriving amount refers to a rise when the mounting table 25 on which the semiconductor wafer W is placed is brought up to bring the test pad on the semiconductor wafer W into contact with the tip of each probe 38 and then the mounting table 25 is further raised. the amount. Then, the control device 50 controls the external tester 31 to output a specific electrical signal to the test head 30. The test head 30 outputs electrical signals output from the external tester 31 to the probe card 36 through each wiring in the holder 34. The electrical signal output to the probe card 36 is supplied to each probe 38 through the wiring in the probe card 36, and is then output to the test pad of the semiconductor wafer W through the probe 38.
In addition, the electrical signal output from the test pad on the semiconductor wafer W is output toward the probe 38. The electrical signal output to the probe 38 is output to the test head 30 through the wiring in the probe card 36 and the wiring in the holder 34. The electrical signal output to the test head 30 is output to the external tester 31. The external tester 31 evaluates the electrical characteristics of the semiconductor wafer W based on the electrical signals output to the test head 30 and the electrical signals output from the test head 30, and outputs the evaluation results to the control device 50.
In addition, when the probe 38 is damaged or deformed, even if the tilt adjustment is performed by each of the tilt adjustment units 32 or the lateral position is finely adjusted by the moving mechanism 23, it is still difficult to accurately inspect . Therefore, when the tip of each probe 38 is damaged or deformed based on the image captured by the camera 27, the control device 50 notifies the operator of a warning message through a display or the like to facilitate maintenance of the probe card 36 Maintenance or replacement.
[Control device 50]
FIG. 2 is a block diagram showing an example of the control device 50. The control device 50 includes, for example, as shown in FIG. 2, a photographing control unit 51, a memory unit 52, a detection unit 53, a specific unit 54, an adjustment unit 55, and an inspection execution unit 56.
The photography control unit 51 controls the moving mechanism 23 to move the mounting table 25 so that the camera 27 is positioned below the probe 38. Then, the imaging control unit 51 controls the moving mechanism 23 to raise the mounting table 25. As a result, the camera 27 rises together with the mounting table 25 and moves in the height direction of each probe 38 (that is, the z-axis direction in FIG. 1). Then, the imaging control unit 51 causes the camera 27 to capture the needle tip of the plurality of probes 38 at each position of the camera 27 after the movement so that the needle tip of the plurality of probes 38 is projected into one image.
Then, the photography control unit 51 causes the image captured by the camera 27 to correspond to the z-coordinate of the focus plane and stores the image in the storage unit 52. In this embodiment, the photographing control unit 51 sets the subject distance from the lens of the camera 27 to the focusing surface in advance. The photographing control unit 51 determines the distance between the subject and the camera 27 when the image is taken in each image. The coordinates of the lens position specify the z-coordinate of the focal plane.
FIG. 3 is a diagram for explaining an example of the relationship between the moving direction of the camera 27 and the position of the focusing surface. The imaging control unit 51 controls the moving mechanism 23 to move the camera 27 upward from below the probe 38 as shown by the arrow in FIG. 3. Then, the imaging control unit 51 causes the camera 27 to capture the needle tip of the plurality of probes 38 at each position of the camera 27 after the movement so that the needle tip of the plurality of probes 38 is projected into one image. In the example shown in FIG. 3, the three needles 38-1 to 38-3 are projected in an image captured by the camera 27. As the camera 27 rises, the z-coordinate of the focal plane of the camera 27 changes from Z1 to Z11 as shown in FIG. 3.
In addition, an image corresponding to the z coordinate (that is, Zn, n is an integer of 1 to 11) of the focal plane of the camera 27 is described below as an image Zn. In the example in Figure 3, the image Z4 is focused on the tip of the probe 38-1, the image Z6 is focused on the tip of the probe 38-2, and the image Z8 is focused on the tip of the probe 38-3 . The camera 27 is preferably a camera having a shorter (shallow) depth of field. Thereby, in the shooting direction, the range of the focusing distance becomes narrower, and the position difference of the tip of each probe 38 in the z-axis direction can be detected with good accuracy.
The storage unit 52 causes each image captured by the camera 27 to store positional information corresponding to the focal plane of the camera 27. The position information is, for example, the z coordinate of the focal plane of the camera 27.
The detection unit 53 refers to the memory unit 52 and detects an image focused on the tip of the probe 38 based on the image captured by the camera 27 at each position of the camera 27. Specifically, the detection unit 53 groups pixels projected into the image for each image. The z-coordinate is the same group if the areas with overlapping areas above a certain ratio are adjacent to each other. Then, the detection unit 53 calculates an index value indicating the degree of focus for each group. Then, the detection unit 53 detects an image of the needle tip focused on the probe 38 according to the index value calculated for each group.
Here, refer to FIG. 3 again. Since the camera 27 shoots the plurality of probes 38 while rising from below the probes 38, first, it sequentially shoots from the image Z1. The video Z3 is, for example, as shown in FIG. 4. 4 to 7 are diagrams showing an example of an image captured by the camera 27. The detection unit 53 groups pixels in the image based on pixel values such as the luminance of each pixel in the image captured by the camera 27. In the example in FIG. 4, the pixel systems corresponding to the tip of the probe 38-1 are grouped into a group 41-1, and the pixel systems corresponding to the tip of the probe 38-2 are grouped into a group. 41-2, the pixels corresponding to the tip of probe 38-3 are grouped into group 41-3. In addition, in the following, when the probes 38-1 to 38-3 are not distinguished but collectively, only the probe 38 is described, and the groups 41-1 to 41-3 are not distinguished but collectively. In this case, only group 41 is described.
In the image Z3 illustrated in FIG. 4, all the groups 41 are almost blurred because the needle tip of any of the probes 38 is not focused. The size of group 41.
The image Z4 is shown in FIG. 5 for example. The image Z4 illustrated in FIG. 5 includes the group 41-1 corresponding to the tip of the probe 38-1, the group 41-2 corresponding to the tip of the probe 38-2, and the probe 38-3. The needle tip corresponds to group 41-3. In the image Z4, because there is a needle tip focused on the probe 38-1, the size of the group 41-1 corresponding to the probe 38-1 will be smaller than the size of the group 41-1 in the case of no focus. When focusing on the same group 41 among the plurality of images, the group 41 will have the smallest size among the images focused on the tip of the probe 38-1.
The image Z5 is shown in FIG. 6 for example. In the image Z5 illustrated in FIG. 6, since no probe 38 is focused, all the groups 41 are almost blurred. The image Z6 is shown in FIG. 7 for example. In the image Z6 illustrated in FIG. 7, since there is a needle tip focused on the probe 38-2, the size of the group 41-2 corresponding to the probe 38-2 will be the smallest. However, the group 41 corresponding to the other probes 38 is larger than the size of the group 41 corresponding to the probes 38 when the needle tip is focused.
Back to FIG. 2 to continue the description. For each group, the specific section 54 specifies the position of the needle tip of the probe 38 corresponding to the group based on the image detected by the detection section 53. Specifically, the specific unit 54 specifies the position of the needle tip of the probe 38 corresponding to the group in the xy plane according to the position of the group in focus in the image detected by the detection unit 53. In addition, the specific unit 54 specifies the z-coordinate corresponding to the image detected by the detection unit 53 for each group, and serves as the z-coordinate of the needle tip of the probe 38 corresponding to the group. With this, the specific part 54 can specify the x-coordinate, y-coordinate, and z-coordinate of the position of the needle tip in the three-dimensional space for each needle tip of the probe 38 projected in the image. Then, the specifying unit 54 outputs the tip position information of the probe 38 specified for each group to the adjusting unit 55.
The adjusting unit 55 adjusts the needle tip position of each probe 38 based on the needle tip position information of the probe 38 output from the specific unit 54. Specifically, the adjustment unit 55 calculates an adjustment amount for reducing the z-coordinate difference of each needle tip for each tilt adjustment unit 32 based on the position information of each needle tip of the probe 38 output from the specific unit 54. Then, the adjustment section 55 controls each of the tilt adjustment sections 32 according to the adjustment amount calculated for each of the tilt adjustment sections 32. Thereby, the difference in position of the tip of each probe 38 in the z direction can be reduced. In addition, since the z-coordinate deviation of the tip of each probe 38 can also be identified, even if the tilt of the probe card 36 is not adjusted, the required overdrive amount can be calculated, so that the appropriate pressure can be used to make each probe The needle tip of 38 is in contact with the test pad on the semiconductor wafer W.
In addition, the adjustment section 55 calculates the tip of the probe 38 corresponding to each group and the semiconductor wafer W in contact with the tip of each probe 38 based on the position information of each group output from the specific section 54. The position error of the upper test pad in the xy plane. Then, the adjustment unit 55 outputs the calculated position error in the xy plane to the inspection execution unit 56.
The inspection execution unit 56 controls the moving mechanism 23 to move the mounting table 25 on which the semiconductor wafer W is placed below the probe 38 and raise the mounting table 25 to make the test pad on the semiconductor wafer W It is in contact with the tip of the probe 38. Then, the start of the inspection is instructed to the external tester 31 to start the inspection of the semiconductor wafer W. The inspection execution unit 56 shifts the position of the semiconductor wafer W in the xy plane during the inspection of the semiconductor wafer W based on a position error in the xy plane output from the adjustment unit 55. Thereby, the tip of each probe 38 can be reliably brought into contact with the corresponding test pad.
In addition, the probe 38 includes not only the vertical needle type but also a single-arm type probe. FIG. 8 is a diagram for explaining an example of the relationship between the moving direction of the camera 27 and the position of the focusing surface when the single-arm probe 38-4 is photographed. In the example of FIG. 8, although the tip of the probe 38-4 is focused in the image Z3, the arms of the probe 38-4 are also focused in the images Z8 to Z11.
The video Z3 is shown in FIG. 9 for example. 9 to 11 are diagrams showing an example of an image captured by the camera 27. In the image Z3 illustrated in FIG. 9, the pixel group 41-4 corresponding to the tip and arm of the probe 38-4 is specified. Then, in the group 41-4, the area corresponding to the tip of the needle 42 has focus.
On the other hand, the image Z8 is shown in FIG. 10, for example. In the image Z8 illustrated in FIG. 10, the region 42 corresponding to a part of the arm in the group 41-4 of the pixel corresponding to the tip of the probe 38-4 and the pixel corresponding to the arm is focused.
The image Z9 is shown in FIG. 11 for example. In the image Z9 illustrated in FIG. 11, the area 42 corresponding to a part of the arm in the group 41-4 corresponding to the tip of the probe 38-4 and the arm is also focused. Here, although the single-arm probe 38-4 may focus on the arm portion, if the position of the camera 27 in the z-axis direction is changed, for example, as shown in FIG. 10 and FIG. 11, the focus area is 42 will move within the image. On the other hand, when focusing on the tip portion of the probe 38, the focus area does not move between images, or even if it moves, the amount of movement is still very small.
As shown in FIG. 9 to FIG. 11, in the single-arm probe 38-4, in addition to the needle tip, the arm may be focused on the arm, and the arm may be misidentified as the needle tip. In order to avoid the above situation, the detection unit 53 of this embodiment compares continuously captured images. When the focus area moves between the images, if it is determined to focus on an object other than the needle tip, it will become a candidate for the needle tip to have focus. Image to exclude. Accordingly, even if the detection unit 53 is a single-arm probe 38-4, it is possible to detect the image focused on the needle tip with high accuracy.
In addition, even with the single-arm probe 38-4, the needle tip is positioned lower than the arm in the z-axis direction. Therefore, when the detection unit 53 detects a plurality of images with the needle tip focused on the probe 38 for each probe 38, the plurality of images may be located from the position of the needle tip farthest from the probe 38. The captured image is detected as an image having a needle tip focused on the probe 38. With this, even if the detection unit 53 is a single-arm probe 38-4, the image focused on the needle tip can be detected with high accuracy.
Here, a comparative example in which the position of the probe 38 is measured based on the images of the probe 38 taken one by one will be described. In the comparative example, for each of the probes 38, the tip of the probe 38 is captured while changing the position of the camera 27 in the z-axis direction to specify a focused image. Then, the camera 27 uses the z-axis direction position of the specific image to be captured as the optimal focus position to move to the optimal focus position. Then, the probe 38 is photographed again at the optimal focus position, and the needle tip position of the probe 38 is specified according to the needle tip position in the captured image.
In this way, in the comparative example, since the position of the tip of the probe is identified for each probe, if the identification time of each probe is T seconds, the identification time of the position of the n probes will take time. nT seconds. In contrast, in this embodiment, since the needle tip positions of the n probes can be identified at the same time, the needle tip positions of the probes can be identified in about T seconds. Therefore, in this embodiment, the identification time of the needle tip position can be shortened to about 1 / n of the comparative example.
[Example 2]
In the first embodiment, the positions of the camera 27 in the z-axis direction are changed, and the plurality of captured images are compared, and the focused image is used to specify the position of the needle tip of the probe 38. In contrast, in this embodiment, while changing the position of the camera 27 in the z-axis direction, a comparison is made between a smaller number of images among the plurality of captured images than the plurality of images, and the displacement tendency of the images is compared. To estimate the z-coordinate. Then, the image corresponding to the coordinate closest to the estimated z-coordinate is used to specify the needle tip position of the probe 38. As a result, the amount of calculation can be reduced compared to a case where all images captured by the camera 27 are compared, and the needle tip position of each probe 38 can be specified more quickly.
Next, an example of a specific method for estimating the z position in this embodiment will be described. First, the detection section 53 selects Z taken by the camera 27 max Part of the images (such as an odd number of images), and grouping pixels in each selected image. In addition, if the detection unit 53 max A small number of images are used to group pixels in each image. For example, an even number of images or images with different numbers every k (k is an integer of 2 or more) can be used to group each image. The pixels inside are grouped.
Next, the detection unit 53 refers to the area of the needle tip projected in the image captured by the needle tip of the probe to select the image with the smallest area of the needle tip (image number: I n ) And the next smallest image of the needle tip area (image number: I n + 1 ). Then, the detection unit 53 separately calculates the size of the area of the needle tip projected in each image (for example, the diameter of the area: φ n And φ n + 1 ). The in-focus z position is considered to be between image number I n Corresponding z coordinate and image number I n + 1 The corresponding z-coordinates. Therefore, the detection unit 53 assigns the image number I according to the displacement tendency of the area. n Corresponding z coordinate and image number I n + 1 The coordinates between the corresponding z-coordinates are presumed to be in-focus z-coordinates. Specifically, the detection unit 53 is identified by the image number I n The corresponding z-coordinate and move the z-axis away from φ n / (φ n + φ n + 1 ) Is estimated to be the z coordinate with focus.
[Example 3]
In the first embodiment, the position of the needle tip of each probe 38 is specified by using a plurality of images taken in such a manner that the needle tips of the plurality of probes 38 are projected on one image. On the other hand, in the third embodiment, the position of the tip of each probe 38 is specified by using an image captured in such a manner that the tip of the plurality of probes 38 in the first range is projected on one image. Then, for the needle tip of each probe 38, the camera 27 is moved to a position where the needle tip can be captured, and the camera 27 is further used to capture the needle tip of the probe 38 in a second range narrower than the first range. Image to specify the needle tip position of the probe 38 in more detail. Thereby, the position of the needle tip of each probe 38 can be specified more accurately.
Specifically, the imaging control unit 51 causes the camera 27 to capture the needle tip of the plurality of probes 38 so that the needle tips of the plurality of probes 38 within the first range are projected into one image. The detection unit 53 detects an in-focus image in each of the groups specified in the images. Then, the specific section 54 specifies, for each group, the x-, y-, and z-coordinates of the group position according to the images detected by the detection section 53 as the needle tip positions of the probe 38 corresponding to the group X-, y-, and z-coordinates. For each group, the specific section 54 specifies the area of the group (for example, the x coordinate, the y coordinate, and the z coordinate in the center position) in the image detected by the detection section 53 as the corresponding group of the probe 38. X-, y-, and z-coordinates of the needle position.
The specifying unit 54 controls the moving mechanism 23 to move the camera 27 to a position where the specified position can be captured. At this time, the specifying unit 54 moves the camera 27 to the position of the camera 27 in the z-axis direction when the detection unit 53 captures the detected image, and is a position that can capture a range including the specified position.
Then, the specific portion 54 causes the camera 27 to capture the needle tip of the probe 38 at the position of the camera 27 that has completed the movement. At this time, the specific portion 54 causes the camera 27 to capture a second range that is narrower than the first range. That is, the specific portion 54 causes the camera 27 to zoom in on a second range that is narrower than the first range to perform imaging.
Then, the specifying unit 54 further specifies the x-coordinates and y-coordinates of the tip positions of the probes 38 corresponding to the group projected in the image according to the image captured by the camera 27.
As described above, in this embodiment, an image captured in such a manner that the tip of the plurality of probes 38 in the first range is projected on one image is used to specify the position of the tip of each probe 38. Then, for the needle tip of each probe 38, the camera 27 is further moved to a position where the needle tip can be captured, and the needle tip of the probe 38 is captured in a second range narrower than the first range, and based on the captured image, The needle tip position of the probe 38 is specified in more detail.
[Hardware]
The control device 50 shown in the first to third embodiments is implemented by hardware such as that shown in FIG. 12. FIG. 12 is a diagram showing an example of the hardware of the control device 50. The control device 50 is provided with a CPU (Central Processing Unit) 500, a RAM (Random Access Memory) 501, a ROM (Read Only Memory) 502, an auxiliary memory device 503, a communication interface (I / F) 504, and an input / output interface (I / F) 505, and media interface (I / F) 506.
The CPU 500 operates according to a program stored in the ROM 502 or the auxiliary memory device 503 to control each unit. The ROM 502 stores a startup program executed by the CPU 500 when the control device 50 is started, or a program attached to the hardware of the control device 50.
The auxiliary memory device 503 is, for example, an HDD (Hard Disk Drive) or an SSD (Solid State Drive), and stores programs executed by the CPU 500 and data used by the programs. The CPU 500 reads the program from the auxiliary memory device 503 and downloads the program on the RAM 501, and executes the downloaded program.
The communication I / F 504 communicates with the inspection device main body 20 through a communication line such as a LAN (Local Area Network). The communication I / F 504 receives data from the inspection device body 20 and transmits it to the CPU 500 through a communication line, and transmits the data generated by the CPU 500 to the inspection device body 20 through the communication line.
The CPU500 controls input devices such as a keyboard and output devices such as a display through the input / output I / F505. The CPU500 obtains the signal input from the input device through the input / output I / F505 and transmits it to the CPU500. In addition, the CPU 500 outputs the generated data to the output device through the input / output I / F 505.
The media I / F 506 reads programs or data stored in the recording medium 507 and stores it in the auxiliary memory device 503. The recording medium 507 is, for example, an optical recording medium such as a DVD (Digital Versatile Disc) or a PD (Phase Change rewritable Disk), a magneto-optical recording medium such as a MO (Magneto-Optical disk), a tape medium, a magnetic recording medium, or a semiconductor memory.
The CPU 500 of the control device 50 implements the functions of the imaging control unit 51, the detection unit 53, the specific unit 54, the adjustment unit 55, and the inspection execution unit 56 by executing programs downloaded to the RAM 501. The RAM 501 or the auxiliary storage device 503 stores data in the storage unit 52.
Although the CPU 500 of the control device 50 reads the program downloaded on the RAM 501 from the recording medium 507 and stores it in the auxiliary memory device 503, as another example, the program may be obtained from another device through a communication line and stored in the auxiliary Memory device 503.
In addition, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the gist thereof.
For example, as a first modification, the control device 50 may have an output unit that outputs the specified portion 54 to the external storage medium provided in the memory portion 52 or the control device 50 and then adjusts the direction. The tip position information is output from the unit 55. The tip position information output from the output section is used as, for example, a log file for detecting a temporal change in the position of the tip. Since the time required for the detection of the probe tip detection can be greatly shortened in the present invention, the log file can be saved earlier than before. By confirming the saved log file, you can objectively obtain the time-dependent change in the position of the probe tip or the difference in the number of probe cards due to use. Then, by tracking the amount of change in the position of the probe tip, one can know that the probe card is poorly assembled or the probe card itself is found early, or that the probe itself is consumed or the service life is judged early.
In each of the above embodiments, the x-coordinate, y-coordinate, and z-coordinate of the needle tip position of each probe 38 are specified based on the plurality of images captured by the camera 27. But the disclosed technology is not limited to this. For example, as a second modification, the inspection device 10 may also specify the positions of the tip of each probe 38 in the arrangement direction of the plurality of probes 38, that is, the x-coordinate and the y-coordinate, based on the plurality of images captured by the camera 27. . That is, the inspection device 10 may not specify the z-coordinate of the needle tip of each probe 38.
In each of the above embodiments, the camera 27 is moved from a position away from the needle tip of the probe 38 toward a position close to the needle tip of the probe 38, and the plurality of probes 38 are photographed at each position of the camera 27 after the movement. Needle tip, but the technology disclosed is not limited to this. For example, the camera 27 may be moved from a position near the needle tip of the probe 38 toward a position remote from the needle tip of the probe 38, and the needle tips of the plurality of probes 38 may be captured at each position of the camera 27 after the movement.
W‧‧‧半導體晶圓W‧‧‧Semiconductor wafer
Z‧‧‧影像 Z‧‧‧Image
10‧‧‧檢查裝置 10‧‧‧ Inspection device
20‧‧‧檢查裝置本體 20‧‧‧Inspection device body
21‧‧‧框體 21‧‧‧Frame
22‧‧‧框架 22‧‧‧Frame
23‧‧‧移動機構 23‧‧‧ mobile agency
25‧‧‧載置台 25‧‧‧mounting table
27‧‧‧照相機 27‧‧‧ Camera
30‧‧‧測試頭 30‧‧‧test head
31‧‧‧外部測試器 31‧‧‧External Tester
32‧‧‧傾斜調整部 32‧‧‧Tilt adjustment section
33‧‧‧軸件 33‧‧‧Shaft
34‧‧‧保持具 34‧‧‧ holder
36‧‧‧探針卡 36‧‧‧ Probe Card
38‧‧‧探針 38‧‧‧ Probe
41‧‧‧群組 41‧‧‧group
42‧‧‧區域 42‧‧‧area
50‧‧‧控制裝置 50‧‧‧control device
51‧‧‧攝影控制部 51‧‧‧Photographic Control Department
52‧‧‧記憶部 52‧‧‧Memory Department
53‧‧‧檢測部 53‧‧‧Testing Department
54‧‧‧特定部 54‧‧‧ Specific Department
55‧‧‧調整部 55‧‧‧ Adjustment Department
56‧‧‧檢查實行部 56‧‧‧ Inspection Implementation Department
500‧‧‧CPU 500‧‧‧CPU
501‧‧‧RAM 501‧‧‧RAM
502‧‧‧ROM 502‧‧‧ROM
503‧‧‧輔助記憶裝置 503‧‧‧ auxiliary memory device
504‧‧‧通訊I/F 504‧‧‧Communication I / F
505‧‧‧輸出入I/F 505‧‧‧I / F
506‧‧‧媒體I/F 506‧‧‧Media I / F
507‧‧‧記錄媒體 507‧‧‧Recording media
圖1係顯示一檢查裝置例之主要部分剖面圖。Fig. 1 is a sectional view of a main part showing an example of an inspection device.
圖2係顯示一控制裝置例之方塊圖。 Fig. 2 is a block diagram showing an example of a control device.
圖3係說明照相機的移動方向與對焦面的位置之一關係例之圖式。 FIG. 3 is a diagram illustrating an example of the relationship between the moving direction of the camera and the position of the focusing surface.
圖4係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 4 is a diagram showing an example of an image captured by a camera.
圖5係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 5 is a diagram showing an example of an image captured by a camera.
圖6係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 6 is a diagram showing an example of an image captured by a camera.
圖7係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 7 is a diagram showing an example of an image captured by a camera.
圖8係用以說明單臂式探針被拍攝時，照相機的移動方向與對焦面的位置之一關係例之圖式。 FIG. 8 is a diagram for explaining an example of the relationship between the camera's moving direction and the position of the focal plane when the single-arm probe is photographed.
圖9係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 9 is a diagram showing an example of an image captured by a camera.
圖10係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 10 is a diagram showing an example of an image captured by a camera.
圖11係顯示藉由照相機所拍攝的一影像例之圖式。 FIG. 11 is a diagram showing an example of an image captured by a camera.
圖12係顯示控制裝置的一硬體例之圖式。 FIG. 12 is a diagram showing a hardware example of the control device.
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-231874 | 2017-12-01 | ||
| JP2017231874A JP2019102640A (en) | 2017-12-01 | 2017-12-01 | Needle tip position adjustment method of probe needle and inspection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201928364A true TW201928364A (en) | 2019-07-16 |
Family
ID=66663948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107142659A TW201928364A (en) | 2017-12-01 | 2018-11-29 | Method for adjusting needle tip position of probe needle, and inspection device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2019102640A (en) |
| KR (1) | KR102362929B1 (en) |
| CN (1) | CN111386595A (en) |
| TW (1) | TW201928364A (en) |
| WO (1) | WO2019107173A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112020004743T5 (en) * | 2019-10-31 | 2022-08-04 | Baker Hughes Oilfield Operations Llc | TESTS AND INSPECTION PROCEDURES AND SYSTEM |
| CN112684224A (en) * | 2020-12-29 | 2021-04-20 | 无锡圆方半导体测试有限公司 | Method and system for efficiently preventing chip welding spot needle insertion deviation |
| TWI769698B (en) * | 2021-02-08 | 2022-07-01 | 鴻勁精密股份有限公司 | Image taking apparatus and handler using the same |
| CN113687215B (en) * | 2021-08-04 | 2024-03-19 | 深圳市森美协尔科技有限公司 | Method and equipment for improving contact precision of probe and wafer test point |
| CN114088979A (en) * | 2021-12-20 | 2022-02-25 | 百及纳米科技(上海)有限公司 | Probe calibration method, surface measurement method, and probe control apparatus |
| JP2024010713A (en) | 2022-07-13 | 2024-01-25 | 東京エレクトロン株式会社 | Inspection device, inspection method, and program |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119036A (en) * | 1987-10-31 | 1989-05-11 | Canon Inc | Wafer prober |
| JPH0536767A (en) * | 1991-08-01 | 1993-02-12 | Tokyo Electron Yamanashi Kk | Probe apparatus |
| JP3163221B2 (en) * | 1993-08-25 | 2001-05-08 | 東京エレクトロン株式会社 | Probe device |
| JP2661872B2 (en) * | 1994-03-28 | 1997-10-08 | 東京エレクトロン株式会社 | Probe apparatus and probing method |
| JP2737744B2 (en) * | 1995-04-26 | 1998-04-08 | 日本電気株式会社 | Wafer probing equipment |
| JPH10247669A (en) | 1997-03-04 | 1998-09-14 | Canon Inc | Device and method for inspecting bonding wire |
| JP2000077502A (en) * | 1998-08-27 | 2000-03-14 | Ando Electric Co Ltd | Device and method for inspecting electronic components |
| JP2001144197A (en) * | 1999-11-11 | 2001-05-25 | Fujitsu Ltd | Semiconductor device, manufacturing method therefor, and testing method |
| JP4071461B2 (en) * | 2001-07-05 | 2008-04-02 | 大日本スクリーン製造株式会社 | Substrate processing system, substrate processing apparatus, program, and recording medium |
| JP2005351807A (en) * | 2004-06-11 | 2005-12-22 | Kawasaki Microelectronics Kk | Probe card, and control method for probe card |
| JP2006177787A (en) * | 2004-12-22 | 2006-07-06 | Matsushita Electric Ind Co Ltd | Stylus pressure adjustment probe card, stylus pressure adjustment method for probe stylus, and characteristics inspection method for semiconductor device |
| EP1739440A3 (en) * | 2005-06-30 | 2009-05-13 | Feinmetall GmbH | Electrical testmethod and -device and manufacturing method for a contacting device |
| JP2007071765A (en) * | 2005-09-08 | 2007-03-22 | Tokyo Seimitsu Co Ltd | Probe control apparatus and probe control method for measuring probe position |
| US7538564B2 (en) * | 2005-10-18 | 2009-05-26 | Gsi Group Corporation | Methods and apparatus for utilizing an optical reference |
| JP2007183193A (en) * | 2006-01-10 | 2007-07-19 | Micronics Japan Co Ltd | Probing apparatus |
| JP5374651B2 (en) * | 2010-03-12 | 2013-12-25 | カスケード マイクロテック インコーポレイテッド | Semiconductor test system |
| CA2826372C (en) * | 2011-02-01 | 2020-03-31 | Constitution Medical, Inc. | Fast auto-focus in microscopic imaging |
| JP2013003108A (en) * | 2011-06-21 | 2013-01-07 | Panasonic Corp | Semiconductor inspection apparatus |
| JP2013137224A (en) * | 2011-12-28 | 2013-07-11 | Sharp Corp | Multichip prober, method for correcting contact position thereof, control program, and readable recording medium |
| JP6445887B2 (en) * | 2015-02-09 | 2018-12-26 | キヤノン株式会社 | Focus adjustment apparatus, imaging apparatus, control method therefor, and program |
| JP6164548B1 (en) * | 2016-03-28 | 2017-07-19 | 株式会社東京精密 | Probe card tilt detection method and prober |
-
2017
- 2017-12-01 JP JP2017231874A patent/JP2019102640A/en active Pending
-
2018
- 2018-11-16 CN CN201880075721.5A patent/CN111386595A/en active Pending
- 2018-11-16 WO PCT/JP2018/042384 patent/WO2019107173A1/en active Application Filing
- 2018-11-16 KR KR1020207017822A patent/KR102362929B1/en active IP Right Grant
- 2018-11-29 TW TW107142659A patent/TW201928364A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN111386595A (en) | 2020-07-07 |
| JP2019102640A (en) | 2019-06-24 |
| WO2019107173A1 (en) | 2019-06-06 |
| KR20200090211A (en) | 2020-07-28 |
| KR102362929B1 (en) | 2022-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201928364A (en) | Method for adjusting needle tip position of probe needle, and inspection device | |
| JP4245166B2 (en) | Apparatus and method for testing circuit boards and test probe for the apparatus and method | |
| KR100945328B1 (en) | Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus | |
| JP5295588B2 (en) | Probe card tilt adjustment method, probe card tilt detection method, and program recording medium recording probe card tilt detection method | |
| KR101877432B1 (en) | Method of auto focusing and auto cleaning Needles of a Probe Card | |
| WO2017170393A1 (en) | Prober and prober operation method | |
| JP6149338B1 (en) | Prober and prober operation method | |
| TW202036744A (en) | Probe card management system and probe card management method | |
| KR20120052087A (en) | Method of inspecting board | |
| JP6164548B1 (en) | Probe card tilt detection method and prober | |
| TWI589897B (en) | Alignment support device for probe device and alignment support method | |
| JP2010219110A (en) | Probe method and probe device | |
| JP2019219357A (en) | Imaging apparatus, imaging method, and imaging program | |
| JP2012042407A (en) | Semiconductor integrated circuit inspection apparatus, inspection method of semiconductor integrated circuit, and control program for inspection apparatus for semiconductor integrated circuit | |
| KR20220044741A (en) | Wafer appearance inspection apparatus and method | |
| TWI623761B (en) | Chip probing apparatus and chip probing method | |
| JP3828532B2 (en) | Inspection apparatus and inspection method | |
| JP2013011569A (en) | Displacement amount identification device, displacement amount identification method, and displacement amount identification program | |
| JP2001349929A (en) | Method and device for detecting tip position of probe needle | |
| TWI845721B (en) | Wafer appearance inspection device and method | |
| JP2006023229A (en) | Probe card quality evaluation method, its apparatus, and probe inspection method | |
| US20150138541A1 (en) | Objective lens switching mechanism and inspection apparatus | |
| JP2009231765A (en) | Probe device, probe method, and program recording medium with the probe method stored | |
| JP2024071205A (en) | Inspection device and method for identifying needle tip position | |
| JP2008177231A (en) | Method and apparatus for automatic probe inspection |