CN112684224A - Method and system for efficiently preventing chip welding spot needle insertion deviation - Google Patents
Method and system for efficiently preventing chip welding spot needle insertion deviation Download PDFInfo
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- CN112684224A CN112684224A CN202011587754.3A CN202011587754A CN112684224A CN 112684224 A CN112684224 A CN 112684224A CN 202011587754 A CN202011587754 A CN 202011587754A CN 112684224 A CN112684224 A CN 112684224A
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- 238000003466 welding Methods 0.000 title claims abstract description 11
- 238000003780 insertion Methods 0.000 title description 7
- 230000037431 insertion Effects 0.000 title description 7
- 239000000523 sample Substances 0.000 claims abstract description 65
- 238000003860 storage Methods 0.000 claims abstract description 19
- 238000001467 acupuncture Methods 0.000 claims abstract description 12
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 238000005070 sampling Methods 0.000 claims abstract description 4
- 238000004364 calculation method Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
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- 208000012266 Needlestick injury Diseases 0.000 description 1
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- 238000004590 computer program Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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Abstract
The invention discloses a method and a system for efficiently preventing chip welding spot needle displacement, which comprises the following steps: setting the puncture standard of the probe: determining the position of a probe needle and an allowable interval according to the size of each PAD on the chip; sampling the PAD pricking standard graph corresponding to each PAD size through a camera device, and storing the PAD pricking standard graph into a storage device; automatically calibrating the PAD acupuncture position: before testing, a PAD pricking graph is captured through a camera device arranged above the wafer; and calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking standard graph with the PAD pricking standard graph, scanning the current probe tip, calculating the position offset of the probe tip through the calculating unit, and adjusting the position of the probe tip through the probe adjusting device according to the offset. The invention can automatically identify and search the PAD pin position deviation for PAD of each size on the chip and adjust the pin position to the middle of the PAD, thereby improving the adjustment efficiency and the adjustment precision and being suitable for popularization and application.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a method and a system for efficiently preventing chip welding point pricking pin deviation.
Background
The semiconductor industry in China starts late but develops rapidly, and keeps higher acceleration continuously for years. The three major industries of integrated circuits have been steadily growing. The appearance and development of integrated circuit chips provide a source for human beings to enter an information era. In the information age, integrated circuit chips are being widely used in work, life, and production. Along with the mass production of integrated chips, the chip is especially important in the control of each link yield, promotes the chip quality, reduce cost, and as the first process that the chip came out, wafer test process is vital. When the wafer is processed in a flow studio, the chips are 6-inch, 8-inch or 12-inch circles formed by splicing thousands of chips, which are called wafers. In the process of testing a wafer on a probe station, as shown in fig. 1A and 1B, in the drawings, 101 is a probe tip mark, 102 is a chip PAD, 103 is a protection area, and a probe needs to be in a central area of a PAD area when a probe is inserted into a chip PAD (hereinafter, referred to as PAD), however, as the probe tip passes a large current for a long time, the probe is gradually worn and then the probe is cleaned, the probe tip is worn to different degrees, as shown in fig. 1C, at this time, the probe tip will shift in different directions, if the probe is pulled out of the PAD guard ring, the circuit of the chip will be damaged, and a large-area chip will be damaged, if the probe is pulled out of the PAD guard ring, which results in a bad chip, and for the above-mentioned problem, the conventional method is to manually take out the probe card and manually adjust the probe card when the probe shifts, the method has low efficiency and poor adjustment precision, and other normal needle positions are easy to touch during adjustment. The above problems are urgently needed to be solved.
Disclosure of Invention
The present invention is directed to solving the problems set forth above in the background section by a method and system for efficiently preventing pin-punch deviation in a die pad.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for efficiently preventing chip welding point needle shift comprises the following steps:
setting the puncture standard of the probe: determining the position of a probe needle and an allowable interval according to the size of each PAD on the chip; sampling the PAD pricking standard graph corresponding to each PAD size through a camera device, and storing the PAD pricking standard graph into a storage device;
automatically calibrating the PAD acupuncture position: before testing, a PAD pricking graph is captured through a camera device arranged above the wafer; and calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking standard graph with the PAD pricking standard graph, scanning the current probe point, calculating the position offset of the probe point through a calculation unit, and adjusting the position of the probe point through a probe adjusting device according to the offset.
In particular, the PAD sizes include, but are not limited to, 80um x 80um and 60um x 60um, with 80um x 80um sizes corresponding to needle locations of 25um x 25um, and 60um x 60um corresponding to needle locations of 15um x 15 um.
In particular, PAD pricking position detection is performed every other number of chips according to the degree of probe damage in automatically calibrating PAD pricking positions.
The invention also discloses a system for efficiently preventing the displacement of the chip welding spot pricking pin by adopting the method for efficiently preventing the displacement of the chip welding spot pricking pin, which comprises the following steps: the device comprises an image pickup device, a storage device, a calculation unit and a probe adjusting device; the image pickup apparatus is configured to: when the needle inserting standard of the probe is set, the PAD needle inserting standard graph corresponding to each PAD size is sampled and stored in the storage device; when the PAD acupuncture position is automatically calibrated, a PAD acupuncture graph is captured; the calculation unit is used for calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking standard graph with the PAD pricking standard graph, and calculating the probe tip position offset according to the scanned current probe tip position; the probe adjusting device is used for adjusting the position of the probe tip according to the offset of the position of the probe tip calculated by the calculating unit.
In particular, the PAD sizes include, but are not limited to, 80um x 80um and 60um x 60um, with 80um x 80um sizes corresponding to needle locations of 25um x 25um, and 60um x 60um corresponding to needle locations of 15um x 15 um.
Particularly, the system for efficiently preventing the displacement of the chip welding point pricking sets the PAD pricking position detection of every other chips according to the damage degree of the probe.
The method and the system for efficiently preventing the pin insertion offset of the welding point of the chip can automatically identify and search the pin position offset of the PAD for each size of PAD on the chip, and adjust the pin position to the middle of the PAD, thereby improving the adjustment efficiency and the adjustment precision and being suitable for popularization and application.
Drawings
FIG. 1A is a schematic view of a normal needle insertion;
FIG. 1B is an enlarged view of a normal insertion diagram of the PAD;
FIG. 1C is a schematic diagram of PAD needle displacement;
fig. 2 is a schematic diagram of the position of an 80um x 80um size PAD needle according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a 60um by 60um PAD puncture needle position provided by an embodiment of the present invention;
FIG. 4 is a schematic flow chart of a method for efficiently preventing a chip solder joint from needle stick shifting according to an embodiment of the present invention;
fig. 5 is a schematic application diagram of a system for efficiently preventing a die pad pin from shifting according to an embodiment of the present invention.
Detailed Description
The invention is further illustrated by the following figures and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It is also to be noted that, for the convenience of description, only a part of the contents, not all of the contents, which are related to the present invention, are shown in the drawings, and unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example one
The method for effectively preventing the displacement of the chip welding spot pricking pin in the embodiment comprises the following steps:
setting the puncture standard of the probe: determining the position of a probe needle and an allowable interval according to the size of each PAD on the chip; sampling the PAD pricking standard graph corresponding to each PAD size through a camera device, and storing the PAD pricking standard graph into a storage device; reading relevant parameters and characteristics including chip size and pattern judgment standard.
Automatically calibrating the PAD acupuncture position: before testing, a PAD pricking graph is captured through a camera device arranged above the wafer; calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking graph with the PAD pricking standard graph, scanning the current probe point, calculating the offset of the probe point position through a calculation unit, and adjusting the probe point position through a probe adjusting device according to the offset, wherein the precision can reach plus or minus 2um in the embodiment.
Specifically, in the present embodiment, the PAD sizes include, but are not limited to, 80um x 80um and 60um x 60um, as shown in fig. 2 and 3, the acupuncture position corresponding to 80um x 80um size is 25um x 25um, and the acupuncture position corresponding to 60um x 60um is 15um x 15 um.
Specifically, in the embodiment, the system for efficiently preventing the displacement of the PAD pricking pins of the chips may set how many chips are arranged according to the damage degree of the probes to perform PAD pricking position detection, but is not limited to this, and all chips may also be detected simultaneously. In operation, as shown in fig. 4, fig. 4 is a schematic flow chart of a method for efficiently preventing a chip solder joint from being shifted in a needle inserting manner according to an embodiment of the present invention.
Example two
Fig. 5 is a schematic diagram of an application of the system for efficiently preventing the displacement of the pad pin according to the embodiment of the present invention, as shown in fig. 5. The embodiment discloses a system for efficiently preventing chip solder joint pricking deviation, which adopts the method for efficiently preventing chip solder joint pricking deviation according to the first embodiment, and the system comprises: the device comprises an image pickup device, a storage device, a calculation unit and a probe adjusting device; the image pickup apparatus is configured to: when the needle inserting standard of the probe is set, the PAD needle inserting standard graph corresponding to each PAD size is sampled and stored in the storage device; the system reads relevant parameters and characteristics, including chip size and graph judgment standard; when the PAD acupuncture position is automatically calibrated, a PAD acupuncture graph is captured; the calculation unit is used for calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking standard graph with the PAD pricking standard graph, and calculating the probe tip position offset according to the scanned current probe tip position; the probe adjusting device is used for adjusting the position of the probe tip according to the position offset of the probe tip calculated by the calculating unit, wherein the precision can reach plus or minus 2um in the embodiment.
Specifically, in this embodiment, the PAD sizes include, but are not limited to, 80um x 80um and 60um x 60um, where the needle insertion positions corresponding to 80um x 80um sizes are 25um x 25um, and the needle insertion positions corresponding to 60um x 60um are 15um x 15 um. Specifically, in this embodiment, the system for efficiently preventing displacement of the PAD pricking pins of the chip sets the PAD pricking positions of every other chip according to the damage degree of the probe.
According to the technical scheme provided by the invention, the pin position deviation of the PAD can be automatically identified and searched for the PAD with each size on the chip, and the pin position is adjusted to the middle of the PAD, so that the adjustment efficiency and the adjustment precision are improved, and the method is suitable for popularization and application.
It will be understood by those skilled in the art that all or part of the above embodiments may be implemented by the computer program to instruct the relevant hardware, and the program may be stored in a computer readable storage medium, and when executed, may include the procedures of the embodiments of the methods as described above. The storage medium may be a magnetic disk, an optical disk, a read-only memory or a random access memory.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (6)
1. A method for efficiently preventing chip welding point needle shift is characterized by comprising the following steps:
setting the puncture standard of the probe: determining the position of a probe needle and an allowable interval according to the size of each PAD on the chip; sampling the PAD pricking standard graph corresponding to each PAD size through a camera device, and storing the PAD pricking standard graph into a storage device;
automatically calibrating the PAD acupuncture position: before testing, a PAD pricking graph is captured through a camera device arranged above the wafer; and calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking standard graph with the PAD pricking standard graph, scanning the current probe point, calculating the position offset of the probe point through a calculation unit, and adjusting the position of the probe point through a probe adjusting device according to the offset.
2. The method of claim 1, wherein PAD sizes include but are not limited to 80um x 80um and 60um x 60um, 80um x 80um sizes corresponding to needle locations of 25um x 25um, and 60um x 60um sizes corresponding to needle locations of 15um x 15 um.
3. The method for preventing PAD pricking deviation of chips according to any of claims 1 or 2, wherein PAD pricking position detection is performed every other chip according to the probe damage degree in automatic calibration of PAD pricking position.
4. A system for efficiently preventing chip solder joint needle shift is characterized by comprising: the device comprises an image pickup device, a storage device, a calculation unit and a probe adjusting device; the image pickup apparatus is configured to: when the needle inserting standard of the probe is set, the PAD needle inserting standard graph corresponding to each PAD size is sampled and stored in the storage device; when the PAD acupuncture position is automatically calibrated, a PAD acupuncture graph is captured; the calculation unit is used for calling the PAD pricking standard graph stored in the storage device, comparing the PAD pricking standard graph with the PAD pricking standard graph, and calculating the probe tip position offset according to the scanned current probe tip position; the probe adjusting device is used for adjusting the position of the probe tip according to the offset of the position of the probe tip calculated by the calculating unit.
5. The system of claim 4, wherein the PAD sizes include but are not limited to 80um x 80um and 60um x 60um, the 80um x 80um size corresponds to a needle location of 25um x 25um, and the 60um x 60um size corresponds to a needle location of 15um x 15 um.
6. The system for preventing PAD pricking deviation of chips according to any of claims 4 or 5, wherein the system is configured to detect PAD pricking positions of every other chip according to the damage degree of the probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011587754.3A CN112684224A (en) | 2020-12-29 | 2020-12-29 | Method and system for efficiently preventing chip welding spot needle insertion deviation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011587754.3A CN112684224A (en) | 2020-12-29 | 2020-12-29 | Method and system for efficiently preventing chip welding spot needle insertion deviation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113968A (en) * | 2022-01-26 | 2022-03-01 | 广州粤芯半导体技术有限公司 | Adjusting method of wafer testing device |
| CN115055958A (en) * | 2022-08-19 | 2022-09-16 | 上海泽丰半导体科技有限公司 | Automatic deviation rectifying system for needle implantation |
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| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
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2020
- 2020-12-29 CN CN202011587754.3A patent/CN112684224A/en active Pending
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| JPS63136542A (en) * | 1986-11-27 | 1988-06-08 | Tokyo Electron Ltd | Positioning method for semiconductor wafer chip |
| US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114113968A (en) * | 2022-01-26 | 2022-03-01 | 广州粤芯半导体技术有限公司 | Adjusting method of wafer testing device |
| CN115055958A (en) * | 2022-08-19 | 2022-09-16 | 上海泽丰半导体科技有限公司 | Automatic deviation rectifying system for needle implantation |
| CN115055958B (en) * | 2022-08-19 | 2022-12-02 | 上海泽丰半导体科技有限公司 | Automatic deviation rectifying system for needle implantation |
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