TW201926764A - 用以於一真空腔室中成像之設備、用於一基板之真空處理的系統、及用以在一真空腔室中使至少一物體成像之方法 - Google Patents
用以於一真空腔室中成像之設備、用於一基板之真空處理的系統、及用以在一真空腔室中使至少一物體成像之方法 Download PDFInfo
- Publication number
- TW201926764A TW201926764A TW107133121A TW107133121A TW201926764A TW 201926764 A TW201926764 A TW 201926764A TW 107133121 A TW107133121 A TW 107133121A TW 107133121 A TW107133121 A TW 107133121A TW 201926764 A TW201926764 A TW 201926764A
- Authority
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- Taiwan
- Prior art keywords
- vacuum chamber
- substrate
- imaging
- light
- mask
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 79
- 239000000758 substrate Substances 0.000 title claims description 143
- 238000000034 method Methods 0.000 title claims description 30
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 230000000873 masking effect Effects 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 22
- 230000008021 deposition Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 8
- 238000001704 evaporation Methods 0.000 description 8
- 239000011368 organic material Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 210000001255 hallux Anatomy 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 210000000453 second toe Anatomy 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 3
- 230000007717 exclusion Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052722 tritium Inorganic materials 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- -1 and the like) Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Studio Devices (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/US2017/052645 | 2017-09-21 | ||
| PCT/US2017/052645 WO2019059909A1 (en) | 2017-09-21 | 2017-09-21 | VACUUM CHAMBER IMAGING APPARATUS, SUBSTRATE VACUUM PROCESSING SYSTEM, AND IMAGING METHOD OF AT LEAST ONE OBJECT IN VACUUM CHAMBER |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201926764A true TW201926764A (zh) | 2019-07-01 |
Family
ID=65810562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107133121A TW201926764A (zh) | 2017-09-21 | 2018-09-20 | 用以於一真空腔室中成像之設備、用於一基板之真空處理的系統、及用以在一真空腔室中使至少一物體成像之方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2020505794A (ja) |
| KR (1) | KR102140688B1 (ja) |
| CN (1) | CN109891618B (ja) |
| TW (1) | TW201926764A (ja) |
| WO (1) | WO2019059909A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110093584B (zh) * | 2019-06-06 | 2021-03-02 | 京东方科技集团股份有限公司 | 一种掩膜版、掩膜系统及蒸镀掩膜方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5298939A (en) * | 1991-11-04 | 1994-03-29 | Swanson Paul A | Method and apparatus for transfer of a reticle pattern onto a substrate by scanning |
| JP4510609B2 (ja) * | 2004-12-21 | 2010-07-28 | 株式会社アルバック | 基板とマスクのアライメント方法および有機薄膜蒸着方法ならびにアライメント装置 |
| JP2008293798A (ja) * | 2007-05-24 | 2008-12-04 | Toyota Industries Corp | 有機ｅｌ素子の製造方法 |
| NL2004365A (en) * | 2009-04-10 | 2010-10-12 | Asml Holding Nv | Method and system for increasing alignment target contrast. |
| JP6053110B2 (ja) * | 2011-07-07 | 2016-12-27 | 株式会社アルバック | 真空蒸着装置 |
| KR101851384B1 (ko) * | 2011-07-18 | 2018-04-24 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 패널용 제조 장치와, 이를 이용한 유기 발광 디스플레이 패널의 제조 방법 |
| US10679883B2 (en) * | 2012-04-19 | 2020-06-09 | Intevac, Inc. | Wafer plate and mask arrangement for substrate fabrication |
| KR102206593B1 (ko) * | 2013-12-02 | 2021-02-02 | 주식회사 선익시스템 | 기판의 얼라인 장치 및 방법 |
| JP6093091B2 (ja) * | 2014-09-26 | 2017-03-08 | 株式会社アルバック | Ｘｙステージ、アライメント装置、蒸着装置 |
-
2017
- 2017-09-21 JP JP2018553093A patent/JP2020505794A/ja active Pending
- 2017-09-21 KR KR1020187030158A patent/KR102140688B1/ko active IP Right Grant
- 2017-09-21 WO PCT/US2017/052645 patent/WO2019059909A1/en active Application Filing
- 2017-09-21 CN CN201780038510.XA patent/CN109891618B/zh active Active
-
2018
- 2018-09-20 TW TW107133121A patent/TW201926764A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190034493A (ko) | 2019-04-02 |
| CN109891618A (zh) | 2019-06-14 |
| CN109891618B (zh) | 2021-02-26 |
| WO2019059909A1 (en) | 2019-03-28 |
| KR102140688B1 (ko) | 2020-08-03 |
| JP2020505794A (ja) | 2020-02-20 |
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