TW201921708A - 光半導體模組 - Google Patents

光半導體模組

Info

Publication number
TW201921708A
TW201921708A TW107127464A TW107127464A TW201921708A TW 201921708 A TW201921708 A TW 201921708A TW 107127464 A TW107127464 A TW 107127464A TW 107127464 A TW107127464 A TW 107127464A TW 201921708 A TW201921708 A TW 201921708A
Authority
TW
Taiwan
Prior art keywords
optical semiconductor
substrate
semiconductor module
thickness
thermoelectric conversion
Prior art date
Application number
TW107127464A
Other languages
English (en)
Chinese (zh)
Inventor
齋藤唯
前嶋聰
池內宏樹
田中真木子
Original Assignee
日商松下知識產權經營股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW201921708A publication Critical patent/TW201921708A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
TW107127464A 2017-08-25 2018-08-07 光半導體模組 TW201921708A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762550170P 2017-08-25 2017-08-25
US62/550,170 2017-08-25

Publications (1)

Publication Number Publication Date
TW201921708A true TW201921708A (zh) 2019-06-01

Family

ID=65438646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127464A TW201921708A (zh) 2017-08-25 2018-08-07 光半導體模組

Country Status (2)

Country Link
TW (1) TW201921708A (ja)
WO (1) WO2019039221A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230180611A1 (en) * 2020-05-01 2023-06-08 E-ThermoGentek Co., Ltd. Thermoelectric power-generation module, wearable biological-body-sensing device, biological-body location detection system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414180A (en) * 1977-07-05 1979-02-02 Canon Inc Semiconductor laser unit
JPH0325988A (ja) * 1989-06-23 1991-02-04 Nec Corp 半導体レーザチップキャリアの構造
US20020121094A1 (en) * 2001-03-02 2002-09-05 Vanhoudt Paulus Joseph Switch-mode bi-directional thermoelectric control of laser diode temperature
JP4325246B2 (ja) * 2003-03-28 2009-09-02 ヤマハ株式会社 熱電装置用パッケージおよびその製造方法
JP2005086094A (ja) * 2003-09-10 2005-03-31 Okano Electric Wire Co Ltd レーザダイオードモジュール
JP2009164498A (ja) * 2008-01-10 2009-07-23 Yamaha Corp 熱電モジュール
CN103140949B (zh) * 2010-11-18 2016-05-11 松下知识产权经营株式会社 热电转换元件模块
JP6384220B2 (ja) * 2014-09-12 2018-09-05 株式会社デンソー レーザユニット

Also Published As

Publication number Publication date
WO2019039221A1 (ja) 2019-02-28

Similar Documents

Publication Publication Date Title
CN109148670B (zh) Led倒装芯片封装基板和led封装结构
JP6294417B2 (ja) 光半導体装置および光半導体装置の製造方法
JP6668022B2 (ja) 発光モジュールおよび発光モジュールの製造方法
JP6037293B2 (ja) 窒化物半導体発光装置
WO2018043096A1 (ja) 光半導体装置および光半導体装置の製造方法
US20090294789A1 (en) Light emitting device and method of manufacturing light emitting device
US20070205419A1 (en) Semiconductor device and its manufacturing method
WO2021052514A1 (zh) 激光器
US20220329039A1 (en) Micromechanical optical component and manufacturing method
KR20020040540A (ko) 광 반도체 기밀 밀봉 패키지, 광 반도체 모듈 및 광파이버 증폭기
JP2019079847A (ja) 発光装置及びそれに用いる蓋体
JP2014082348A (ja) 光学素子収納用パッケージ、光学フィルターデバイス、光学モジュール、および電子機器
TW201921708A (zh) 光半導體模組
JP2021090078A (ja) 光半導体素子収納用パッケージおよび光半導体装置
JP7306831B2 (ja) 半導体パッケージ用ステム、半導体パッケージ
JPH1062659A (ja) 光素子モジュール
JP3670527B2 (ja) 光半導体素子収納用パッケージ
JP6332347B2 (ja) 光モジュール
US11239222B2 (en) Cooled optical transmission module device and method of manufacturing the same
JP2008277055A (ja) 光源装置
CN113764973A (zh) 激光器及其制备方法
JP4728625B2 (ja) 光半導体装置およびそれを用いた光モジュール
JP4429115B2 (ja) 蓋体およびこれを用いた光素子収納用パッケージ
JP2016004989A (ja) 光通信用パッケージ及び光モジュール
JP4009110B2 (ja) 光半導体素子収納用パッケージおよび光半導体装置