TW201919873A - 樹脂薄片、半導體裝置及樹脂薄片的使用方法 - Google Patents

樹脂薄片、半導體裝置及樹脂薄片的使用方法 Download PDF

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Publication number
TW201919873A
TW201919873A TW107128548A TW107128548A TW201919873A TW 201919873 A TW201919873 A TW 201919873A TW 107128548 A TW107128548 A TW 107128548A TW 107128548 A TW107128548 A TW 107128548A TW 201919873 A TW201919873 A TW 201919873A
Authority
TW
Taiwan
Prior art keywords
resin
layer
resin composition
sheet
adhesive
Prior art date
Application number
TW107128548A
Other languages
English (en)
Chinese (zh)
Inventor
根津裕介
渡邉康貴
杉野貴志
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201919873A publication Critical patent/TW201919873A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW107128548A 2017-08-31 2018-08-16 樹脂薄片、半導體裝置及樹脂薄片的使用方法 TW201919873A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017166583 2017-08-31
JP2017-166583 2017-08-31
JP2017232800 2017-12-04
JP2017-232800 2017-12-04

Publications (1)

Publication Number Publication Date
TW201919873A true TW201919873A (zh) 2019-06-01

Family

ID=65526326

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107128548A TW201919873A (zh) 2017-08-31 2018-08-16 樹脂薄片、半導體裝置及樹脂薄片的使用方法

Country Status (5)

Country Link
JP (1) JPWO2019044398A1 (ko)
KR (1) KR20200047447A (ko)
CN (1) CN110536796A (ko)
TW (1) TW201919873A (ko)
WO (1) WO2019044398A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021014102A (ja) * 2019-07-16 2021-02-12 パナソニックＩｐマネジメント株式会社 積層部材の製造方法
KR102516292B1 (ko) * 2020-06-30 2023-03-31 (주)이녹스첨단소재 전자장치 제조용 절연필름

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006281488A (ja) * 2005-03-31 2006-10-19 Lintec Corp 積層回路基板製造用工程フィルム
JP4668001B2 (ja) * 2005-08-18 2011-04-13 リンテック株式会社 ダイシング・ダイボンド兼用シートおよびこれを用いた半導体装置の製造方法
TW200846802A (en) * 2007-03-27 2008-12-01 Lintec Corp Resin sheet for circuit substrate, sheet for circuit substrate and circuit substrate for display
US20140079913A1 (en) * 2011-03-28 2014-03-20 Tomoo Nishiyama Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor device
TWI657730B (zh) 2012-05-31 2019-04-21 日商味之素股份有限公司 多層印刷配線板之製造方法
JP6171604B2 (ja) 2013-06-17 2017-08-02 味の素株式会社 部品内蔵回路板の製造方法、および半導体装置
KR102367513B1 (ko) * 2015-05-29 2022-02-24 린텍 가부시키가이샤 점착 시트
JP2017088758A (ja) * 2015-11-11 2017-05-25 リンテック株式会社 接着シート
JP2017088759A (ja) * 2015-11-11 2017-05-25 リンテック株式会社 接着シート

Also Published As

Publication number Publication date
WO2019044398A1 (ja) 2019-03-07
KR20200047447A (ko) 2020-05-07
JPWO2019044398A1 (ja) 2020-08-13
CN110536796A (zh) 2019-12-03

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