TW201913102A - Detection device - Google Patents

Abstract

A detection device includes a probe card and a contact switch mounted on the probe card. The probe card includes a circuit board, a frame provided on the circuit board, and a probe head mounted on the frame. The probe head includes a plate unit and a plurality of probes. Each probe is electrically connected to the circuit board. The ends of the probes arranged distant from the circuit board are formed with a plurality of heights corresponding to the circuit board. The contact switch includes a contact probe electrically connected to the circuit board. The contact probe has a distal end away from the circuit board and the maximum distance between the distal end and the circuit board is not larger than the minimum height among the plurality of heights. When an external unit contacts the ends of the probes and the distal end of the contact probe, the contact switch triggers a warning signal to stop the relative movement of the probe card with the external unit.

Description

   Detection device   

The invention relates to a probe card, in particular to a detection device with an anti-collision function.

At present, in the semiconductor process, before the wafer process is completed without cutting and packaging, in order to ensure the yield of the wafer and avoid the waste of the structure, the electrical test at the wafer stage must be performed first. The pins are directly in contact with the solder pads or bumps on the wafer, which leads to the wafer signal, and then cooperates with peripheral testing equipment and software control to achieve the purpose of automated measurement.

The probe head of the existing probe card needs to rely on a wafer prober (Prober) to align the needle position and height. During operation, after the needle pressure is set by the operator, the carrier platform (Chuck) carrying the wafer will make precise and precise contact with the probe head. Since the stroke between the probe head and the wafer is very short (may be only 30 ~ 80μm), when the pressure applied by the wafer to the probe exceeds the needle pressure limit (assuming about 120μm), the probe head will be lifted due to overpressure Risk of being crushed. Although the current wafer probers have the function of setting the needle pressure limit to prevent the probe head from overpressure, only through the internal monitoring mechanism of the wafer probers, the probe head still has the risk of being easily overpressured and damaged. .

Therefore, the present inventor believes that the above-mentioned defects can be improved, and with special research and cooperation with the application of scientific principles, he finally proposes an invention with a reasonable design and effective improvement of the above-mentioned defects.

An embodiment of the present invention is to provide a detection device, which can effectively improve the defects that may occur when the existing probe card performs wafer pin testing.

An embodiment of the present invention discloses a detection device, including: a probe card including: a circuit board; a frame (Jig) provided on the circuit board; and a probe head installed on the frame, In addition, the probe head includes a plate-shaped unit and a plurality of probes penetrating the plate-shaped unit; wherein each of the probes is electrically connected to the circuit board, and is far from the circuit board. The ends of the plurality of probes correspond to a plurality of heights formed on the circuit board, respectively, and the ends of the plurality of probes are used to press against an external component; and a pressure switch is detachably Mounted on the probe card, the pressure contact switch includes a pressure contact probe electrically connected to the circuit board, the pressure contact probe has an end far from the circuit board, and the end A maximum distance from the circuit board is not greater than a minimum height among the plurality of heights, and a difference between the maximum distance and the minimum height is between 40 micrometers and 90 micrometers; The external element is pressed against the ends of a plurality of the probes and contacts all of the probes. When the probe tip contact pressure, the pressure contact of the switching circuit board can trigger a warning signal, to stop the movement of the probe card relative to said outer member.

To sum up, the detection device disclosed in the embodiment of the present invention can be provided with a pressure contact switch separately installed on the probe card, and through the design of the connection structure between the pressure contact switch and the probe card, The touch switch can be used to monitor whether the distance between the probe card and the external component is too close, and when the distance is too close, the pressure touch switch can send a warning signal to stop the relative movement of the probe card and the external component, thereby being effective This reduces the risk of overpressure on the probe head.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and not to make any limitation to the protection scope of the present invention. limit.

100‧‧‧detection device

1‧‧‧ Probe Card

11‧‧‧Circuit Board

12‧‧‧Frame

121‧‧‧Mounting Department

122‧‧‧accommodation space

123‧‧‧perforation

124‧‧‧Screw

13‧‧‧ Probe head

131‧‧‧ plate unit

1311‧‧‧The first guide plate

1312‧‧‧Second Guide Plate

1313‧‧‧ spacer

132‧‧‧ Probe

1321‧‧‧connection section

1322‧‧‧ Detection section

14‧‧‧ adapter board

2‧‧‧Pressure switch (detector)

21‧‧‧carriage

211‧‧‧ support

212‧‧‧The first positioning film

213‧‧‧Second positioning film

214‧‧‧Matching hole

22‧‧‧Pressure Probe

221‧‧‧ middle section

222‧‧‧ Detection section

223‧‧‧ connecting section

3‧‧‧ fixed bracket

200‧‧‧wafer pin tester

201‧‧‧bearing module

202‧‧‧Driver Module

203‧‧‧Processing Module

O‧‧‧External components

C‧‧‧ Wafer

D‧‧‧distance

DV‧‧‧Variable distance

HL‧‧‧Minimal Height

S‧‧‧Warning signal

FIG. 1 is a schematic perspective view of a detection device of the present invention.

FIG. 2 is an exploded view of FIG. 1.

FIG. 3 is a schematic cross-sectional view taken along the line III-III of FIG. 1.

FIG. 4 is a schematic cross-sectional view taken along the line IV-IV in FIG. 1.

FIG. 5 is a schematic diagram of external components pressing against a plurality of probe detection sections according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of a pressure contact switch provided on a circuit board and positioned outside a frame in an embodiment of the present invention.

FIG. 7 is a schematic diagram of a detection device of the present invention applied to a wafer prober.

Please refer to FIGS. 1 to 7, which are embodiments of the present invention. It should be noted that the embodiments of the present invention correspond to the related quantities and appearances mentioned in the drawings, and are only used to specifically describe the embodiments of the present invention. In order to understand the content of the present invention, it is not intended to limit the protection scope of the present invention.

As shown in FIG. 1 and FIG. 2, an embodiment of the present invention discloses a detection device 100 including a probe card 1, a detector 2, and a fixed bracket 3, wherein the detector 2 is installed on the probe card. 1, the probe card 1 is installed on the fixed bracket 3. The specific structure of each component of the detection device 100 in this embodiment will be described below, and then the connection relationship between the various components of the detection device 100 will be described in due course.

It should be noted that, in order to facilitate understanding of this embodiment, the drawings only show a partial structure of the detection device 100, so as to clearly show the structure and connection relationship of each element of the detection device 100.

As shown in FIG. 1 to FIG. 4, the probe card 1 includes a circuit board 11, a frame 12 (Jig), a probe head 13, and an adapter board 14. Wherein, the frame 12 is disposed on the circuit board 11, the probe head 13 is installed on the frame 12, the adapter board 14 is disposed on the circuit board 11, and is located inside the frame 12.

More specifically, the frame 12 is ring-shaped (as shown in FIG. 2) and a stepped mounting portion 121 is formed on the upper inner edge thereof, and the shape of the mounting portion 121 corresponds to that of the probe head 13. The outer edge is such that the probe head 13 can be mounted on the mounting portion 121 and the probe head 13 can be disposed at a distance from the circuit board 11. The frame 12 has an accommodating space 122 and a plurality of perforations 123 formed outside the mounting portion 121. The accommodating space 122 can be used for accommodating the detector 2. A plurality of the through holes 123 are preferably distributed on the frame 12 at intervals, and each of the through holes 123 can be used for a screw 124 to pass through (see FIG. 3). Thereby, the frame 12 formed with a plurality of through holes 123 can be fixed on the circuit board 11 through a plurality of corresponding screws 124. In addition, if the overall strength of the circuit board 11 needs to be reinforced, a plurality of screws 124 can penetrate the circuit board 11 and be further locked to the fixing bracket 3, so that the circuit board 11 is clamped and fixed to the frame 12 and the fixing bracket. Between 3.

As shown in FIG. 4, the probe head 13 includes a plate-shaped unit 131 and a plurality of probes 132 passing through the plate-shaped unit 131. Preferably, the plate-shaped unit 131 may further include a first guide plate 1311, a second guide plate 1312, and a space provided between the first guide plate 1311 and the second guide plate 1312. Plate 1313. The portion of the spacer plate 1313 corresponding to the probe 132 is generally hollow, so the probe 132 does not touch the spacer plate 1313.

In addition, each of the probes 132 is electrically connected to the circuit board 11, and the ends of the plurality of probes 132 (such as the ends of the detection section 1322 of the probe 132 below) far from the circuit board 11 correspond respectively. A plurality of heights are formed on the circuit board 11. More specifically, in this embodiment, the opposite ends of each probe 132 pass through the first guide plate 1311 and the second guide plate 1312 of the plate-shaped unit 131 respectively, and can be defined as A connection section 1321 and a detection section 1322. A plurality of connection sections 1321 of the probes 132 are electrically connected to the circuit board 11. The detection sections 1322 of the plurality of probes 132 can be used to press against an external component O. In addition, the ends of the plurality of detection sections 1322 respectively correspond to a plurality of heights formed on the circuit board 11, that is, the plurality of heights are distances from the ends of the plurality of detection sections 1322 to the circuit board 11. As defined. It must be noted that the probe head 13 of this embodiment penetrates the first guide plate 1311 and the second guide plate 1312 of the plate-shaped unit 131 through the opposite ends of each probe 132, and Defined as a connection section 1321 and a detection section 1322 as examples, but in practical applications, there are many different variations in the structure of the probe 132 of the probe head 13 and the plate-shaped unit 131 and the connection relationship between them. Therefore, the present invention is not limited to this.

The transfer board 14 is a signal transfer board (STB) in this embodiment. The adapter board 14 can be used to arbitrarily enlarge or reduce the corresponding proportion or distribution range of the electrical contacts (not shown in the figure) between the circuit board 11 and the plurality of probes 132, that is, the circuit board 11 and the adapter board The distribution range of the plurality of electrical contacts of 14 may be larger or smaller than the distribution range of the plurality of electrical contacts of the probes 132 and the adapter plate 14.

Further, the adapter board 14 is disposed between the circuit board 11 and the probe head 13 and is located inside the frame 12. The connecting sections 1321 of the plurality of probes 132 abut against the adapter board 14 to be electrically connected to the circuit board 11 through the adapter board 14, but the present invention is not limited thereto. For example, the circuit board 11 and the probe card 1 may not have an adapter board 14 (not shown), as long as the circuit board 11 and the probe card 1 can be electrically connected. Just fine.

As shown in FIG. 3 to FIG. 6, the detector 2 can be used to monitor whether the distance between the probe head 13 and the external component O is too close to prevent the probe head 13 from being crushed (impacted) due to overpressure. Card). In this embodiment, the detector 2 is a pressure-contact switch 2 (see FIG. 3). The pressure switch 2 includes a support member 21 and a pressure contact probe 22 disposed on the support member 21. The carrier 21 may further include a support body 211, a first positioning piece 212, and a second positioning piece 213.

The first positioning piece 212 and the second positioning piece 213 are disposed on the supporting body 211 at a distance from each other, and the pressure contact probe 22 is penetrated and set between the first positioning piece 212 and the second positioning piece 213. The pressure contact probe 22 has an intermediate section 221, a detection section 222, and a connecting section 223, wherein the intermediate section 221 is located between the first positioning piece 212 and the second positioning piece 213. The detection section 222 is inserted through the first positioning piece 212, and a free end of the detection section 222 is defined as an end. The connecting section 223 passes through the second positioning piece 213, and the connecting section 223 passes through the frame 12 and is electrically connected to the circuit board 11. It is worth mentioning that the middle section 221 of the pressure contact probe 22 is curved by the positioning of the first positioning sheet 212 and the second positioning sheet 213, so that the detection section 222 and the connection section 223 are mutually The staggered arrangement allows the pressure contact probe 22 to be stably fixed to the carrier 21, thereby avoiding the risk of slipping.

The material used for the first positioning sheet 212 and the second positioning sheet 213 in this embodiment is Mylar, but the present invention is not limited thereto. For example, in an embodiment not shown in the present invention, a material used for the first positioning sheet 212 and the second positioning sheet 213 may be a rubber sheet or a silicon sheet.

The material and structure of the pressure-contact probe 22 in this embodiment may be the same as the material and structure of any one of the probes 132, but the present invention is not limited thereto. That is to say, when manufacturing the pressure switch 2, it is not necessary to specifically look for other types of probes 132, but only the same types as the probes 132 of the probe head 13 may be used. Thereby, the manufacturing cost of the pressure contact switch 2 can be saved, and the ease of manufacturing can be reduced.

Further, the pressure switch 2 is disposed in the accommodating space 122 of the frame 12 (see FIG. 3), but the present invention is not limited thereto. The setting position of the pressure contact switch 2 can be adjusted according to the needs of the designer. For example, the pressure contact switch 2 can also be installed on the circuit board 11 and positioned outside the frame 12 (see FIG. 6).

As shown in FIG. 3, the accommodating space 122 of the frame 12 communicates with one of the plurality of perforations 123. The supporting member 21 of the pressure switch 2 is formed with a fitting hole 214, and the position of the fitting hole 214 corresponds to the through hole 123 communicating with the accommodation space 122. Thereby, the screws 124 can be sequentially passed through the corresponding matching holes 214 and the through holes 123, and locked to the circuit board 11 (and the fixing bracket 3), so that the pressure contact switch 2 can be detachably Mounted on the probe card 1 and electrically connected to the circuit board 11. In addition, by fixing the screws 124, the pressure switch 2 can be stably fixed on the probe card 1 and will not be easily dropped due to impact or pulling by the external force, resulting in damage to the probe card 1.

As shown in FIGS. 4 to 5, the distance D of the end of the detection section 222 of the pressure-contact probe 22 corresponding to the circuit board 11 is smaller than the end of the detection section 1322 of the plurality of probes 132 corresponding to the circuit board 11. A minimum height HL (fixed value) of the plurality of heights formed. In brief, a maximum distance D between the end of the detection section 222 of the pressure-contact probe 22 and the circuit board 11 is not greater than a minimum height HL of the plurality of heights.

As shown in FIG. 5, when the external component O presses the detection sections 1322 of the plurality of probes 132, there is a variable distance DV between the external component O and the circuit board 11, and the pressure switch 2 can be used. To monitor a difference to be monitored between the variable distance DV and the minimum height HL. When the difference to be monitored monitored by the pressure switch 2 is greater than a critical value, the pressure switch 2 can trigger a warning signal S (as shown in FIG. 7) through the circuit board 11 to stop the probe card 1 from facing the external component O. mobile. Wherein, the critical value is between 40 micrometers and 90 micrometers, and a difference between the maximum distance D and the minimum height HL is also between 40 micrometers and 90 micrometers.

To put it another way, when the external component O just touches the end of the probe 132 having the minimum height HL among the plurality of probes 132, the difference to be monitored monitored by the pressure switch 2 is approximately zero, and the probe All the probes 132 of the head 13 started to produce needle pressure, but the needle pressure was still tolerable. At this time, the external element O has touched all the probes 132 in the probe head 13. Next, when the external component O continues to press the probe 132 of the probe head 13 in the direction of the circuit board 11, the difference to be monitored will continue to increase, and the needle pressure of the probe 132 will continue to increase, but the needle The pressure is still tolerable. Finally, when the external element O contacts the end of the pressure contact probe 22 of the pressure switch 2, the difference to be monitored will be greater than a critical value (a value between 40 microns and 90 microns). The pressure of the needle 132 is almost beyond the tolerable range. If the probe 132 of the probe head 13 is continuously pressed, the probe head 13 may be crushed. In order to solve this problem, the pressure switch 2 in this embodiment can further trigger a warning signal S through the circuit board 11 to stop the relative movement of the probe card 1 and the external component O.

Therefore, the detector 2 of this embodiment can be manufactured by using the carrier 21 and the pressure-contact probe 22, and has the beneficial effects of low production cost, simple production method, and stable production quality. Furthermore, in this embodiment, the pressure contact switch 2 is provided on the probe card 1 (external collision avoidance mechanism), which not only effectively reduces the risk of the probe head 13 being crushed due to overpressure, but also greatly improves The use reliability of the probe card 1 is improved. In addition, since the pressure switch 2 is electrically connected to the circuit board 11 through the pressure probe 22 (internal wiring), the use of external lines is avoided, thereby reducing the possibility that the pressure switch 2 may be impacted or pulled by external forces. Risk of falling.

It should be noted that the pressure contact switch 2 in this embodiment is described by using the support member 21 to locate the pressure contact probe 22, but the present invention is not limited thereto. That is, when the probe card 1 is formed with a structure capable of positioning the above-mentioned pressure contact probe 22, the carrier 21 may be omitted.

Please refer to FIG. 7, which is a schematic diagram of the detection device 100 applied to a wafer prober 200 in this embodiment. The wafer prober 200 includes a carrier module 201 (equivalent to an external component O), the detection device 100, a drive module 202, and a processing module 203. One side of the carrier module 201 (chuck) is used to carry a wafer C. The detection device 100 is located above the carrier module 201. The driving module 202 is connected to the other side of the carrying module 201. The processing module 203 is electrically connected to the circuit board 11 and the driving module 202 of the probe card 1. When the operator performs the alignment of the needle position and height of the probe head 13, the carrier module 201 (including wafer C) makes precise contact with the probe head 13, and multiple detections of the probe head 13 are performed. The needle 132 will begin to produce needle pressure. When the load-bearing module 201 contacts the end of the pressure-contact probe 22 of the pressure-contact switch 2, the needle pressure of the probe 132 of the probe head 13 is almost beyond the tolerable range. At this time, the pressure contact switch 2 can trigger a warning signal S through the circuit board 11 and transmit it to the processing module 203. The processing module 203 can stop the relative movement of the probe card 1 and the bearing module 201 according to the warning signal S, thereby avoiding the situation where the probe head 13 is crushed.

The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any equal changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the protection scope of the claims of the present invention .

Claims (10)

    A detection device includes: a probe card including: a circuit board; a frame (Jig) provided on the circuit board; and a probe head mounted on the frame and the probe The head includes a plate-shaped unit and a plurality of probes penetrating through the plate-shaped unit; wherein each of the probes is electrically connected to the circuit board, and a plurality of the probes far from the circuit board. The ends of the pins correspond to a plurality of heights formed on the circuit board, and the ends of the plurality of probes are used to press against an external component; and a pressure switch is detachably mounted on the probe. A pin card, the pressure contact switch includes a pressure contact probe electrically connected to the circuit board, the pressure contact probe has an end far from the circuit board, and A maximum distance between the end and the circuit board is not greater than a minimum height among the plurality of heights, and a difference between the maximum distance and the minimum height is between 40 microns and 90 microns; wherein, When the external element is pressed against the ends of the plurality of probes and contacts the probe When the tip of the contact probe, the pressure contact of the switching circuit board can trigger a warning signal, to stop the movement of the probe card relative to said outer member.         The detecting device according to claim 1, wherein the frame is formed with an accommodating space, and the accommodating space is recessed from the surface of the frame far from the circuit board, and the contact pressure A switch is disposed in the accommodating space of the frame.         The detection device according to claim 2, wherein the frame is formed with a plurality of perforations, and each of the perforations is used for a screw to pass through, and the accommodation space is communicated with one of the plurality of perforations. One of the perforations, and the pressure contact switch is formed with a fitting hole, and a position of the fitting hole corresponds to the through hole communicating with the accommodation space.         The detection device according to claim 1, wherein the pressure switch further includes a support, a first positioning piece, and a second positioning piece, the first positioning piece and the second positioning piece The pressure-probing probes are disposed on the support body at a distance from each other, and are located on the first positioning piece and the second positioning piece.         The detection device according to claim 4, wherein the pressure-contact probe has: an intermediate section between the first positioning sheet and the second positioning sheet; a detection section, penetrating out The first positioning piece, and the free end of the detection section is defined as the end; and a connecting section passes through the second positioning piece, and the connecting section is connected to the circuit board.         The detection device according to claim 5, wherein in the pressure-contact probe, the middle section is curved, and the detection section and the connection section are disposed offset from each other.         The detection device according to claim 1, wherein the touch switch is mounted on the circuit board and located outside the frame.         The detection device according to any one of claims 1 to 7, wherein a material and a structure of the pressure-contact probe are the same as a material and a structure of any of the probes.         The detection device according to any one of claims 1 to 7, further comprising a fixing bracket, the probe card is mounted on the fixing bracket, and the circuit board is clamped and fixed to the frame and Between the fixed brackets.         The detection device according to any one of claims 1 to 7, wherein the probe card includes an adapter board, and the adapter board is disposed on the circuit board and located inside the frame ; Wherein the opposite ends of each of the probes respectively penetrate the plate-shaped unit and are respectively defined as a connecting section and a detecting section, and the connecting sections of a plurality of the probes abut on all The adapter board is electrically connected to the circuit board through the adapter board.