TWI793040B - Detachable testing device and holder thereof - Google Patents
Detachable testing device and holder thereof Download PDFInfo
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本發明涉及一種測試裝置,尤其涉及一種可拆式測試裝置及其固持座。The invention relates to a test device, in particular to a detachable test device and its holding seat.
現有的探針卡測試裝置所包含的多個導電探針是連接於一轉接板,而後再通過所述轉接板焊接於一電路板,進而使多個所述導電探針能夠電性耦接於所述電路板。然而,所述轉接板與所述電路板的製造成本高昂,所以現有探針卡測試裝置所採用的焊接方式並不利於所述轉接板與所述電路板的後續使用(如:維修替換)。The plurality of conductive probes included in the existing probe card testing device is connected to an adapter board, and then welded to a circuit board through the adapter board, so that the plurality of conductive probes can be electrically coupled connected to the circuit board. However, the manufacturing cost of the adapter board and the circuit board is high, so the welding method adopted by the existing probe card testing device is not conducive to the subsequent use of the adapter board and the circuit board (such as: maintenance and replacement) ).
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.
本發明實施例在於提供一種可拆式測試裝置及其固持座,能有效地改善現有探針卡測試裝置所可能產生的缺陷。The embodiment of the present invention provides a detachable testing device and its holding base, which can effectively improve the possible defects of the existing probe card testing device.
本發明實施例公開一種可拆式測試裝置,其包括:一固持座,包含有:一電路板;一外框架,安裝於所述電路板並共同包圍形成有一容置空間;一連接層,包含有彼此間隔設置的多個導電膠柱,並且每個所述導電膠柱具有位於相反側的一第一端部與一第二端部;其中,所述連接層設置於所述電路板上且位於所述容置空間內,多個所述導電膠柱的所述第一端部抵頂且電性耦接於所述電路板;及 一轉板模組,位於所述容置空間內且包含有:一線路扇出結構,具有位於相反側的一寬距連接面及電性耦接於所述寬距連接面的一窄距連接面;其中,多個所述導電膠柱的所述第二端部抵頂且電性耦接於所述寬距連接面;及一殼體,安裝於所述電路板並壓迫於所述線路扇出結構,並且所述窄距連接面裸露於所述殼體之外;以及一探針頭,包含有一定位板組及安裝於所述定位板組的多個導電探針;其中,所述探針頭的所述定位板組安裝於所述外框架,並且多個所述導電探針抵頂且電性耦接於所述窄距連接面、進而通過所述線路扇出結構與多個所述導電膠柱而電性耦接於所述電路板。The embodiment of the present invention discloses a detachable test device, which includes: a holding seat, including: a circuit board; an outer frame, installed on the circuit board and surrounding together to form an accommodating space; a connecting layer, including There are a plurality of conductive adhesive posts spaced apart from each other, and each of the conductive adhesive posts has a first end and a second end on opposite sides; wherein, the connecting layer is arranged on the circuit board and Located in the accommodating space, the first ends of the plurality of conductive adhesive columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodating space and It includes: a line fan-out structure, which has a wide-distance connection surface on the opposite side and a narrow-distance connection surface electrically coupled to the wide-distance connection surface; wherein, the plurality of conductive adhesive columns The second end abuts against and is electrically coupled to the wide-distance connecting surface; and a housing, installed on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance connecting surface is exposed on the said wide-distance connecting surface. Outside the housing; and a probe head, including a positioning plate set and a plurality of conductive probes installed on the positioning plate set; wherein, the positioning plate set of the probe head is installed on the outer frame, and a plurality of the conductive probes are abutted against and electrically coupled to the narrow-pitch connection surface, and then electrically coupled to the circuit through the circuit fan-out structure and the plurality of conductive adhesive posts plate.
本發明實施例也公開一種可拆式測試裝置的固持座,其包括:一電路板;一外框架,安裝於所述電路板並共同包圍形成有一容置空間;一連接層,包含有彼此間隔設置的多個導電膠柱,並且每個所述導電膠柱具有位於相反側的一第一端部與一第二端部;其中,所述連接層設置於所述電路板上且位於所述容置空間內,多個所述導電膠柱的所述第一端部抵頂且電性耦接於所述電路板;以及一轉板模組,位於所述容置空間內且包含有:一線路扇出結構,具有位於相反側的一寬距連接面及電性耦接於所述寬距連接面的一窄距連接面;其中,多個所述導電膠柱的所述第二端部抵頂且電性耦接於所述寬距連接面;及一殼體,安裝於所述電路板並壓迫於所述線路扇出結構,並且所述窄距連接面裸露於所述殼體之外。The embodiment of the present invention also discloses a holding seat for a detachable test device, which includes: a circuit board; an outer frame, which is installed on the circuit board and surrounds together to form an accommodating space; a connecting layer, including A plurality of conductive adhesive columns are provided, and each of the conductive adhesive columns has a first end and a second end on opposite sides; wherein, the connection layer is arranged on the circuit board and is located on the In the accommodating space, the first ends of the plurality of conductive glue columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodating space and includes: A line fan-out structure has a wide-distance connection surface on the opposite side and a narrow-distance connection surface electrically coupled to the wide-distance connection surface; wherein, the second ends of the plurality of conductive adhesive columns part abutting against and electrically coupled to the wide-distance connection surface; and a housing, mounted on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance connection surface is exposed to the housing outside.
綜上所述,本發明實施例所公開的可拆式測試裝置及其固持座,通過所述連接層的多個所述導電膠柱來電性耦接所述轉板模組與所述電路板,據以使所述轉板模組與所述電路板之間通過可被拆卸的所述連接層來取代既有的焊接方式,進而實現彼此可拆卸、以利於後續使用(如:維修替換或轉用至其他構件)。To sum up, the detachable test device and its holding seat disclosed in the embodiments of the present invention electrically couple the rotating board module and the circuit board through the plurality of conductive adhesive columns on the connecting layer. , so that the existing welding method is replaced by the detachable connecting layer between the transfer plate module and the circuit board, so as to realize detachability for subsequent use (such as: maintenance and replacement or transferred to other components).
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.
以下是通過特定的具體實施例來說明本發明所公開有關“可拆式測試裝置及其固持座”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a description of the implementation of the "detachable test device and its holder" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.
[實施例一][Example 1]
請參閱圖1至圖6所示,其為本發明的實施例一。如圖1至圖3所示,本實施例公開一種可拆式測試裝置,其包含有一固持座100及安裝於所述固持座100的一探針頭200。需先說明的是,所述固持座100於本實施例中雖是以搭配於所述探針頭200來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述固持座100可以依據設計需求而被單獨地應用(如:販賣)或是搭配其他構件使用。以下將先介紹所述固持座100和所述探針頭200的構造,而後再適時說明其彼此的連接關係。Please refer to FIG. 1 to FIG. 6 , which are the first embodiment of the present invention. As shown in FIGS. 1 to 3 , the present embodiment discloses a detachable testing device, which includes a
如圖2至圖5所示,所述固持座100包含有一電路板1、安裝於所述電路板1的一外框架2、設置於所述電路板1上的一連接層3、及設置於所述連接層3且位於所述外框架2之內的一轉板模組4。其中,所述電路板1電性耦接於一測試儀器(圖未示),並且所述電路板1與所述外框架2共同包圍形成有一容置空間S,其連通於所述外框架2的一框口21。As shown in Figures 2 to 5, the
所述連接層3位於所述容置空間S內,並且所述連接層3於本實施例中包含有設置於所述電路板1上的一底墊圈31、設置於所述底墊圈31上的一承載片32、設置於所述承載片32內的多個導電膠柱33、及位於所述承載片32上的一填充體34,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述底墊圈31、所述承載片32、及所述填充體34的至少其中之一可以依據設計需求而被省略或是以其他構件取代。The
更詳細地說,所述底墊圈31呈環形且具有彈性,而所述承載片32的外側部位設置於所述底墊圈31上;也就是說,所述底墊圈31夾持於所述承載片32與所述電路板1之間,以使所述承載片32、所述電路板1、及所述底墊圈31共同包圍有一密封空間。In more detail, the
再者,多個所述導電膠柱33具有彈性且彼此間隔地設置,並且每個所述導電膠柱33具有位於相反側的一第一端部331與一第二端部332。其中,每個所述導電膠柱33的所述第一端部331與所述第二端部332分別突伸出所述承載片32的相反兩側(如:圖2中的所述承載片32底側與頂側);也就是說,位於每個所述導電膠柱33的所述第一端部331與所述第二端部332之間的中央部位是被埋置於所述承載片32內。Furthermore, a plurality of the
進一步地說,多個所述導電膠柱33的所述第一端部331是位於所述密封空間內(也就是,所述底墊圈31圍繞在多個所述導電膠柱33的所述第一端部331的外側),並且多個所述導電膠柱33的所述第一端部331抵頂且電性耦接於所述電路板1。再者,所述填充體34具有彈性且位於所述承載片32的所述頂側並圍繞於多個所述第二端部332之中的至少部分,所述填充體34的高度較佳是不大於其所圍繞的任一個所述第二端部332的高度。Further, the
所述轉板模組4位於所述容置空間S內、且包含有一殼體41及位於所述殼體41內的一線路扇出結構42。其中,所述殼體41安裝於所述電路板1並壓迫於所述線路扇出結構42,並且所述殼體41於本實施例中是通過螺鎖方式安裝於所述電路板1,以使所述承載片32(與所述底墊圈31)夾持在所述殼體41與所述電路板1之間,但本發明不以此為限。The
所述線路扇出結構42於本實施例中具有一中介板421、設置於所述中介板421上的一扇出轉接板422、及設置於所述扇出轉接板422上的一頂墊圈423,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述中介板421與所述頂墊圈423的至少其中之一可以依據設計需求而被省略或是以其他構件取代。In this embodiment, the line fan-
所述中介板421具有位於相反側(如:圖2中的所述中介板421底側與頂側)且彼此電性耦接的一寬距連接面4211與一寬距內接面4212;其中,所述寬距內接面4212的多個第一內接點4213之間的間隔與排佈大致等同於所述寬距連接面4211的多個接點(未標示)之間的間隔與排佈。再者,多個所述導電膠柱33的所述第二端部332抵頂且電性耦接於所述寬距連接面4211,並且所述填充體34位於所述承載片32與所述寬距連接面4211之間。The
所述扇出轉接板422具有位於相反側(如:圖2中的所述扇出轉接板422頂側與底側)且彼此電性耦接的一窄距連接面4221與一扇出內接面4222;其中,所述扇出內接面4222的多個第二內接點4223之間的間隔與排佈相較於所述窄距連接面4221的多個接點(未標示)更為寬廣且分散、且其大致等同於所述寬距內接面4212的多個所述第一內接點4213之間的間隔與排佈。The fan-out
進一步地說,所述中介板421與所述扇出轉接板422於本實施例中通過所述寬距內接面4212的多個所述第一內接點4213分別連接(如:焊接)於所述扇出內接面4222的多個第二內接點4223,以使所述寬距連接面4211與所述窄距連接面4221彼此電性耦接。Furthermore, in this embodiment, the
再者,所述寬距連接面4211與所述窄距連接面4221分別位於所述線路扇出結構42的相反兩側(如:圖2中的所述線路扇出結構42底側與頂側),並且所述窄距連接面4221裸露於所述殼體41之外。其中,所述頂墊圈423呈環形且具有彈性、並設置於所述窄距連接面4221的外側部位(如:所述窄距連接面4221的多個所述接點被所述頂墊圈423所圍繞且裸露於所述殼體41之外);也就是說,所述頂墊圈423夾持於所述殼體41與所述扇出轉接板422(如:所述窄距連接面4221)之間。Furthermore, the wide-
據此,所述固持座100於本實施例中是通過所述連接層3的多個所述導電膠柱33來電性耦接所述轉板模組4與所述電路板1,據以使所述轉板模組4與所述電路板1之間通過可被拆卸的所述連接層3來取代既有的焊接方式,進而實現彼此可拆卸、以利於後續使用(如:維修替換或轉用至其他構件)。Accordingly, in this embodiment, the
進一步地說,所述轉板模組4於本實施例中通過採用所述中介板421與所述殼體41來夾持所述扇出轉接板422,以使所述可拆式測試裝置在組裝完成後,所述扇出轉接板422能夠降低其水平變形程度(也就是,維持有較佳的水平度)。Furthermore, in this embodiment, the
再者,所述固持座100於本實施例中還可以通過在多個構件之間的適當位置處設置有彈性構件(如:所述底墊圈31、所述填充體34、所述頂墊圈423),以使相對應構件能夠因為力平衡而產生預期形變,進而令所述可拆式測試裝置在組裝完成後,所述扇出轉接板422的水平變形程度可以有效地降低(也就是,維持有較佳的水平度)、並使所述連接層3的多個所述導電膠柱33能夠穩定地連接於所述轉板模組4。Furthermore, in this embodiment, the
需額外說明的是,每個所述導電膠柱33於本實施例中可以進一步限定為一異方性導電膠柱,其能通過所述線路扇出結構42而間接地被所述殼體41所壓迫,進而於所述電路板1與所述寬距連接面4211之間形成一信號傳輸路徑,但本發明不受限於此。It should be noted that each of the conductive
所述探針頭200包含有一定位板組201及安裝於所述定位板組201的多個導電探針202,並且多個所述導電探針202於本實施例中是採用垂直式探針(vertical probe),但不以此為限。其中,所述探針頭200的所述定位板組201安裝於所述外框架2(如:所述定位板組201安裝於所述外框架2的所述框口21,進而大致封閉所述容置空間S),多個所述導電探針202抵頂且電性耦接於所述轉板模組4的所述窄距連接面4221(的多個所述接點)、進而通過所述線路扇出結構42與多個所述導電膠柱33而電性耦接於所述電路板1。需說明的是,所述扇出轉接板422的任兩個所述第二內接點4223之間的一距離大於其(通過所述窄距連接面4221)所電性耦接的兩個所述導電探針202之間的距離。The
更詳細地說,所述定位板組201包含有安裝於所述外框架2的一間隔板2011、設置於所述間隔板2011外側的一上導板2012、及設置於所述間隔板2011內側的一下導板2013。其中,所述下導板2013搭配於所述上導板2012、且其位置分別對應於所述轉板模組4。More specifically, the
再者,相互搭配的所述上導板2012與所述下導板2013,其固定有多個所述導電探針202,用以抵頂且電性耦接於所述轉板模組4的所述窄距連接面4221,但本發明不以此為限。舉例來說,如圖6所示,所述轉板模組4可以擴增為多個,並且多個所述轉板模組4同樣設置於所述電路板1與所述外框架2所共同包圍的所述容置空間S內,而所述探針頭200與所述連接層3則為相對應的調整。Furthermore, the
[實施例二][Example 2]
請參閱圖7所示,其為本發明的實施例二。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 7 , which is the second embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:
於本實施例中,所述殼體41的內緣具有一第一環形階面411及位於所述第一環形階面411內側的一第二環形階面412,並且所述第一環形階面411壓迫於所述中介板421的所述寬距內接面4212(的外側部位),而所述第二環形階面412則是壓迫於所述頂墊圈423。此外,在本發明未繪示的其他實施例中,如所述線路扇出結構42未採用所述頂墊圈423時,則所述殼體41的所述第二環形階面412壓迫於所述扇出轉接板422(的外側部位)。In this embodiment, the inner edge of the
據此,所述轉板模組4於本實施例中可以通過所述殼體41所形成的所述第一環形階面411與所述第二環形階面412,以使所述線路扇出結構42內的構件(如:所述中介板421、所述扇出轉接板422、及所述頂墊圈423)能夠被精準地定位於所述連接層3,進而確保彼此的電性連接。Accordingly, in this embodiment, the
[實施例三][Embodiment three]
請參閱圖8所示,其為本發明的實施例三。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 8 , which is the third embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:
於本實施例中,所述線路扇出結構42未包含有實施例一所載的所述中介板421;也就是說,所述線路扇出結構42可以是僅為單個板體(如:所述扇出轉接板422)或者是僅包含有所述扇出轉接板422與所述頂墊圈423,但不以此為限。In this embodiment, the circuit fan-out
具體來說,所述線路扇出結構42具有位於相反側的所述寬距連接面4211及電性耦接於所述寬距連接面4211的所述窄距連接面4221。也就是說,實施例一所載的所述扇出轉接板422的所述扇出內接面4222在此被作為所述線路扇出結構42的所述寬距連接面4211使用。其中,多個所述導電膠柱33的所述第二端部332抵頂且電性耦接於所述寬距連接面4211,多個所述導電探針202抵頂且電性耦接於所述窄距連接面4221、進而通過所述線路扇出結構42與多個所述導電膠柱33而電性耦接於所述電路板1。Specifically, the circuit fan-out
此外,所述殼體41於本實施例中形成有穿設於所述連接層3與所述電路板1的多個第一定位柱413、及穿設於所述轉板模組4的多個第二定位柱414,據以使所述連接層3與所述轉板模組4能通過所述殼體41而準確地設置在所述電路板1上。In addition, in this embodiment, the
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述,本發明實施例所公開的可拆式測試裝置及其固持座,通過所述連接層的多個所述導電膠柱來電性耦接所述轉板模組與所述電路板,據以使所述轉板模組與所述電路板之間通過可被拆卸的所述連接層來取代既有的焊接方式,進而實現彼此可拆卸、以利於後續使用(如:維修替換或轉用至其他構件)。To sum up, the detachable test device and its holding seat disclosed in the embodiments of the present invention electrically couple the rotating board module and the circuit board through the plurality of conductive adhesive columns on the connecting layer. , so that the existing welding method is replaced by the detachable connecting layer between the transfer plate module and the circuit board, so as to realize detachability for subsequent use (such as: maintenance and replacement or transferred to other components).
進一步地說,所述轉板模組通過採用所述中介板與所述殼體來夾持所述扇出轉接板,以使所述可拆式測試裝置在組裝完成後,所述扇出轉接板能夠降低其水平變形程度(也就是,維持有較佳的水平度)。Furthermore, the turntable module clamps the fan-out adapter board by using the intermediate board and the housing, so that after the assembly of the detachable test device is completed, the fan-out The adapter plate can reduce its horizontal deformation (that is, maintain a better levelness).
再者,所述固持座還可以通過在多個構件之間的適當位置處設置有彈性構件(如:所述底墊圈、所述填充體、所述頂墊圈),以使相對應構件能夠因為力平衡而產生預期形變,進而令所述可拆式測試裝置在組裝完成後,所述扇出轉接板的水平變形程度可以有效地降低(也就是,維持有較佳的水平度)、並使所述連接層的多個所述導電膠柱能夠穩定地連接於所述轉板模組。Furthermore, the holding seat can also be provided with elastic members (such as: the bottom washer, the filling body, the top washer) at appropriate positions between multiple members, so that the corresponding members can be force balance to produce expected deformation, so that after the assembly of the detachable test device is completed, the horizontal deformation of the fan-out adapter plate can be effectively reduced (that is, to maintain a better levelness), and The plurality of conductive glue columns of the connection layer can be stably connected to the transfer plate module.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.
100:固持座 1:電路板 2:外框架 21:框口 3:連接層 31:底墊圈 32:承載片 33:導電膠柱 331:第一端部 332:第二端部 34:填充體 4:轉板模組 41:殼體 411:第一環形階面 412:第二環形階面 413:第一定位柱 414:第二定位柱 42:線路扇出結構 421:中介板 4211:寬距連接面 4212:寬距內接面 4213:第一內接點 422:扇出轉接板 4221:窄距連接面 4222:扇出內接面 4223:第二內接點 423:頂墊圈 S:容置空間 200:探針頭 201:定位板組 2011:間隔板 2012:上導板 2013:下導板 202:導電探針 100: holding seat 1: circuit board 2: Outer frame 21: frame mouth 3: Connection layer 31: Bottom washer 32: Carrier sheet 33: Conductive adhesive column 331: first end 332: second end 34: filling body 4: Transfer board module 41: shell 411: The first annular step surface 412: Second annular step surface 413: The first positioning column 414: The second positioning column 42: Line fan-out structure 421:Intermediate board 4211: wide distance connecting surface 4212: Wide distance inner joint surface 4213: The first inner contact point 422: Fan-out adapter board 4221: narrow distance connection surface 4222: Fan-out internal interface 4223: The second inner contact point 423: top washer S: storage space 200: probe head 201: Positioning plate group 2011: Partition board 2012: Upper guide 2013: Bottom guide 202: Conductive probe
圖1為本發明實施例一的可拆式測試裝置的立體示意圖。FIG. 1 is a three-dimensional schematic diagram of a detachable testing device according to Embodiment 1 of the present invention.
圖2為圖1沿剖線II-II的剖視示意圖。FIG. 2 is a schematic cross-sectional view of FIG. 1 along the section line II-II.
圖3為圖1的分解示意圖。FIG. 3 is an exploded schematic view of FIG. 1 .
圖4為圖3的連接層與轉板模組的分解示意圖。FIG. 4 is an exploded schematic diagram of the connection layer and the transfer plate module in FIG. 3 .
圖5為圖3的連接層與轉板模組的另一視角分解示意圖。FIG. 5 is an exploded view from another perspective of the connection layer and the transfer plate module in FIG. 3 .
圖6為本發明實施例一的可拆式測試裝置另一態樣的剖視示意圖。FIG. 6 is a schematic cross-sectional view of another form of the detachable testing device according to Embodiment 1 of the present invention.
圖7為本發明實施例二的可拆式測試裝置的剖視示意圖。FIG. 7 is a schematic cross-sectional view of a detachable testing device according to
圖8為本發明實施例三的可拆式測試裝置的剖視示意圖。FIG. 8 is a schematic cross-sectional view of a detachable testing device according to
100:固持座 100: holding seat
1:電路板 1: circuit board
2:外框架 2: Outer frame
21:框口 21: frame mouth
3:連接層 3: Connection layer
31:底墊圈 31: Bottom washer
32:承載片 32: Carrier sheet
33:導電膠柱 33: Conductive adhesive column
331:第一端部 331: first end
332:第二端部 332: second end
34:填充體 34: filling body
4:轉板模組 4: Transfer board module
41:殼體 41: Shell
42:線路扇出結構 42: Line fan-out structure
421:中介板 421:Intermediate board
4211:寬距連接面 4211: wide distance connecting surface
4212:寬距內接面 4212: Wide distance inner joint surface
4213:第一內接點 4213: The first inner contact point
422:扇出轉接板 422: Fan-out adapter board
4221:窄距連接面 4221: narrow distance connection surface
4222:扇出內接面 4222: Fan-out internal interface
4223:第二內接點 4223: The second internal contact point
423:頂墊圈 423: top washer
S:容置空間 S: storage space
200:探針頭 200: probe head
201:定位板組 201: Positioning plate group
2011:間隔板 2011: Partition board
2012:上導板 2012: Upper guide
2013:下導板 2013: Bottom guide
202:導電探針 202: Conductive probe
Claims (10)
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US20060006890A1 (en) * | 2003-03-12 | 2006-01-12 | Karavakis Konstantine N | Interconnect structure that controls spacing between a probe card and a contact substrate |
US20070176302A1 (en) * | 2006-02-01 | 2007-08-02 | Samsung Electro-Mechanics Co., Ltd. | Low temperature co-fired ceramic module and method of manufacturing the same |
US20140306729A1 (en) * | 2013-04-16 | 2014-10-16 | Mpi Corporation | Position adjustable probing device and probe card assembly using the same |
TWI641839B (en) * | 2017-08-18 | 2018-11-21 | 中華精測科技股份有限公司 | Detection device |
CN110268274A (en) * | 2017-02-07 | 2019-09-20 | 日本麦可罗尼克斯股份有限公司 | Jig |
TWI689731B (en) * | 2019-03-18 | 2020-04-01 | 中華精測科技股份有限公司 | Probe card testing device and signal switching module thereof |
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US20060006890A1 (en) * | 2003-03-12 | 2006-01-12 | Karavakis Konstantine N | Interconnect structure that controls spacing between a probe card and a contact substrate |
US20070176302A1 (en) * | 2006-02-01 | 2007-08-02 | Samsung Electro-Mechanics Co., Ltd. | Low temperature co-fired ceramic module and method of manufacturing the same |
US20140306729A1 (en) * | 2013-04-16 | 2014-10-16 | Mpi Corporation | Position adjustable probing device and probe card assembly using the same |
CN110268274A (en) * | 2017-02-07 | 2019-09-20 | 日本麦可罗尼克斯股份有限公司 | Jig |
TWI641839B (en) * | 2017-08-18 | 2018-11-21 | 中華精測科技股份有限公司 | Detection device |
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