TWI793040B - Detachable testing device and holder thereof - Google Patents

Detachable testing device and holder thereof Download PDF

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TWI793040B
TWI793040B TW111125041A TW111125041A TWI793040B TW I793040 B TWI793040 B TW I793040B TW 111125041 A TW111125041 A TW 111125041A TW 111125041 A TW111125041 A TW 111125041A TW I793040 B TWI793040 B TW I793040B
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circuit board
fan
distance
wide
connection surface
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TW111125041A
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Chinese (zh)
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TW202403310A (en
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蕭博剛
鄭孟杰
刁盈銘
蘇偉誌
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中華精測科技股份有限公司
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Abstract

The present invention provides a detachable testing device and a holder thereof. The holder includes a circuit board, an outer frame, a connection layer, and a space transformer module. The outer frame is assembled to the circuit board so as to jointly form an accommodating space. The connection layer is disposed on the circuit board and includes a plurality of conductive pillars spaced apart from each other, and one end portion of each of the conductive pillars is abutted against and electrically coupled to the circuit board. The space transformer module is arranged in the accommodating space and includes a fan-out structure and a housing that is assembled to the circuit board and that presses against the fan-out structure. Another end portion of each of the conductive pillars is abutted against and electrically coupled to a wide pitch connection surface of the fan-out structure, and a narrow pitch connection surface of the fan-out structure is exposed from the housing.

Description

可拆式測試裝置及其固持座Detachable test device and its holder

本發明涉及一種測試裝置,尤其涉及一種可拆式測試裝置及其固持座。The invention relates to a test device, in particular to a detachable test device and its holding seat.

現有的探針卡測試裝置所包含的多個導電探針是連接於一轉接板,而後再通過所述轉接板焊接於一電路板,進而使多個所述導電探針能夠電性耦接於所述電路板。然而,所述轉接板與所述電路板的製造成本高昂,所以現有探針卡測試裝置所採用的焊接方式並不利於所述轉接板與所述電路板的後續使用(如:維修替換)。The plurality of conductive probes included in the existing probe card testing device is connected to an adapter board, and then welded to a circuit board through the adapter board, so that the plurality of conductive probes can be electrically coupled connected to the circuit board. However, the manufacturing cost of the adapter board and the circuit board is high, so the welding method adopted by the existing probe card testing device is not conducive to the subsequent use of the adapter board and the circuit board (such as: maintenance and replacement) ).

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.

本發明實施例在於提供一種可拆式測試裝置及其固持座,能有效地改善現有探針卡測試裝置所可能產生的缺陷。The embodiment of the present invention provides a detachable testing device and its holding base, which can effectively improve the possible defects of the existing probe card testing device.

本發明實施例公開一種可拆式測試裝置,其包括:一固持座,包含有:一電路板;一外框架,安裝於所述電路板並共同包圍形成有一容置空間;一連接層,包含有彼此間隔設置的多個導電膠柱,並且每個所述導電膠柱具有位於相反側的一第一端部與一第二端部;其中,所述連接層設置於所述電路板上且位於所述容置空間內,多個所述導電膠柱的所述第一端部抵頂且電性耦接於所述電路板;及 一轉板模組,位於所述容置空間內且包含有:一線路扇出結構,具有位於相反側的一寬距連接面及電性耦接於所述寬距連接面的一窄距連接面;其中,多個所述導電膠柱的所述第二端部抵頂且電性耦接於所述寬距連接面;及一殼體,安裝於所述電路板並壓迫於所述線路扇出結構,並且所述窄距連接面裸露於所述殼體之外;以及一探針頭,包含有一定位板組及安裝於所述定位板組的多個導電探針;其中,所述探針頭的所述定位板組安裝於所述外框架,並且多個所述導電探針抵頂且電性耦接於所述窄距連接面、進而通過所述線路扇出結構與多個所述導電膠柱而電性耦接於所述電路板。The embodiment of the present invention discloses a detachable test device, which includes: a holding seat, including: a circuit board; an outer frame, installed on the circuit board and surrounding together to form an accommodating space; a connecting layer, including There are a plurality of conductive adhesive posts spaced apart from each other, and each of the conductive adhesive posts has a first end and a second end on opposite sides; wherein, the connecting layer is arranged on the circuit board and Located in the accommodating space, the first ends of the plurality of conductive adhesive columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodating space and It includes: a line fan-out structure, which has a wide-distance connection surface on the opposite side and a narrow-distance connection surface electrically coupled to the wide-distance connection surface; wherein, the plurality of conductive adhesive columns The second end abuts against and is electrically coupled to the wide-distance connecting surface; and a housing, installed on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance connecting surface is exposed on the said wide-distance connecting surface. Outside the housing; and a probe head, including a positioning plate set and a plurality of conductive probes installed on the positioning plate set; wherein, the positioning plate set of the probe head is installed on the outer frame, and a plurality of the conductive probes are abutted against and electrically coupled to the narrow-pitch connection surface, and then electrically coupled to the circuit through the circuit fan-out structure and the plurality of conductive adhesive posts plate.

本發明實施例也公開一種可拆式測試裝置的固持座,其包括:一電路板;一外框架,安裝於所述電路板並共同包圍形成有一容置空間;一連接層,包含有彼此間隔設置的多個導電膠柱,並且每個所述導電膠柱具有位於相反側的一第一端部與一第二端部;其中,所述連接層設置於所述電路板上且位於所述容置空間內,多個所述導電膠柱的所述第一端部抵頂且電性耦接於所述電路板;以及一轉板模組,位於所述容置空間內且包含有:一線路扇出結構,具有位於相反側的一寬距連接面及電性耦接於所述寬距連接面的一窄距連接面;其中,多個所述導電膠柱的所述第二端部抵頂且電性耦接於所述寬距連接面;及一殼體,安裝於所述電路板並壓迫於所述線路扇出結構,並且所述窄距連接面裸露於所述殼體之外。The embodiment of the present invention also discloses a holding seat for a detachable test device, which includes: a circuit board; an outer frame, which is installed on the circuit board and surrounds together to form an accommodating space; a connecting layer, including A plurality of conductive adhesive columns are provided, and each of the conductive adhesive columns has a first end and a second end on opposite sides; wherein, the connection layer is arranged on the circuit board and is located on the In the accommodating space, the first ends of the plurality of conductive glue columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodating space and includes: A line fan-out structure has a wide-distance connection surface on the opposite side and a narrow-distance connection surface electrically coupled to the wide-distance connection surface; wherein, the second ends of the plurality of conductive adhesive columns part abutting against and electrically coupled to the wide-distance connection surface; and a housing, mounted on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance connection surface is exposed to the housing outside.

綜上所述,本發明實施例所公開的可拆式測試裝置及其固持座,通過所述連接層的多個所述導電膠柱來電性耦接所述轉板模組與所述電路板,據以使所述轉板模組與所述電路板之間通過可被拆卸的所述連接層來取代既有的焊接方式,進而實現彼此可拆卸、以利於後續使用(如:維修替換或轉用至其他構件)。To sum up, the detachable test device and its holding seat disclosed in the embodiments of the present invention electrically couple the rotating board module and the circuit board through the plurality of conductive adhesive columns on the connecting layer. , so that the existing welding method is replaced by the detachable connecting layer between the transfer plate module and the circuit board, so as to realize detachability for subsequent use (such as: maintenance and replacement or transferred to other components).

為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.

以下是通過特定的具體實施例來說明本發明所公開有關“可拆式測試裝置及其固持座”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a description of the implementation of the "detachable test device and its holder" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[實施例一][Example 1]

請參閱圖1至圖6所示,其為本發明的實施例一。如圖1至圖3所示,本實施例公開一種可拆式測試裝置,其包含有一固持座100及安裝於所述固持座100的一探針頭200。需先說明的是,所述固持座100於本實施例中雖是以搭配於所述探針頭200來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述固持座100可以依據設計需求而被單獨地應用(如:販賣)或是搭配其他構件使用。以下將先介紹所述固持座100和所述探針頭200的構造,而後再適時說明其彼此的連接關係。Please refer to FIG. 1 to FIG. 6 , which are the first embodiment of the present invention. As shown in FIGS. 1 to 3 , the present embodiment discloses a detachable testing device, which includes a holding base 100 and a probe head 200 installed on the holding base 100 . It should be noted that although the holding base 100 is described as collaborating with the probe head 200 in this embodiment, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the holding seat 100 can be used alone (for example: sold) or used in conjunction with other components according to design requirements. The structure of the holding base 100 and the probe head 200 will be introduced first, and then the connection relationship between them will be described in due course.

如圖2至圖5所示,所述固持座100包含有一電路板1、安裝於所述電路板1的一外框架2、設置於所述電路板1上的一連接層3、及設置於所述連接層3且位於所述外框架2之內的一轉板模組4。其中,所述電路板1電性耦接於一測試儀器(圖未示),並且所述電路板1與所述外框架2共同包圍形成有一容置空間S,其連通於所述外框架2的一框口21。As shown in Figures 2 to 5, the holding base 100 includes a circuit board 1, an outer frame 2 mounted on the circuit board 1, a connection layer 3 arranged on the circuit board 1, and a The connecting layer 3 is a turntable module 4 located inside the outer frame 2 . Wherein, the circuit board 1 is electrically coupled to a test instrument (not shown in the figure), and the circuit board 1 and the outer frame 2 jointly surround and form an accommodating space S, which communicates with the outer frame 2 A box mouth 21 .

所述連接層3位於所述容置空間S內,並且所述連接層3於本實施例中包含有設置於所述電路板1上的一底墊圈31、設置於所述底墊圈31上的一承載片32、設置於所述承載片32內的多個導電膠柱33、及位於所述承載片32上的一填充體34,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述底墊圈31、所述承載片32、及所述填充體34的至少其中之一可以依據設計需求而被省略或是以其他構件取代。The connection layer 3 is located in the accommodating space S, and the connection layer 3 includes a bottom gasket 31 arranged on the circuit board 1 in this embodiment, a bottom gasket 31 arranged on the bottom gasket 31 A carrier sheet 32 , a plurality of conductive glue columns 33 disposed in the carrier sheet 32 , and a filling body 34 on the carrier sheet 32 , but the present invention is not limited thereto. For example, in other unillustrated embodiments of the present invention, at least one of the bottom gasket 31, the bearing sheet 32, and the filling body 34 can be omitted according to design requirements or be replaced by other methods. Component Replacement.

更詳細地說,所述底墊圈31呈環形且具有彈性,而所述承載片32的外側部位設置於所述底墊圈31上;也就是說,所述底墊圈31夾持於所述承載片32與所述電路板1之間,以使所述承載片32、所述電路板1、及所述底墊圈31共同包圍有一密封空間。In more detail, the bottom gasket 31 is annular and has elasticity, and the outer part of the bearing piece 32 is disposed on the bottom gasket 31; that is, the bottom gasket 31 is clamped on the bearing piece 32 and the circuit board 1 , so that the carrier 32 , the circuit board 1 , and the bottom gasket 31 together enclose a sealed space.

再者,多個所述導電膠柱33具有彈性且彼此間隔地設置,並且每個所述導電膠柱33具有位於相反側的一第一端部331與一第二端部332。其中,每個所述導電膠柱33的所述第一端部331與所述第二端部332分別突伸出所述承載片32的相反兩側(如:圖2中的所述承載片32底側與頂側);也就是說,位於每個所述導電膠柱33的所述第一端部331與所述第二端部332之間的中央部位是被埋置於所述承載片32內。Furthermore, a plurality of the conductive glue pillars 33 are elastic and arranged at intervals from each other, and each of the conductive glue pillars 33 has a first end portion 331 and a second end portion 332 on opposite sides. Wherein, the first end portion 331 and the second end portion 332 of each conductive glue column 33 respectively protrude from opposite sides of the carrier sheet 32 (such as: the carrier sheet in FIG. 2 32 bottom side and top side); that is to say, the central part between the first end 331 and the second end 332 of each conductive glue column 33 is embedded in the bearing Sheet 32 inside.

進一步地說,多個所述導電膠柱33的所述第一端部331是位於所述密封空間內(也就是,所述底墊圈31圍繞在多個所述導電膠柱33的所述第一端部331的外側),並且多個所述導電膠柱33的所述第一端部331抵頂且電性耦接於所述電路板1。再者,所述填充體34具有彈性且位於所述承載片32的所述頂側並圍繞於多個所述第二端部332之中的至少部分,所述填充體34的高度較佳是不大於其所圍繞的任一個所述第二端部332的高度。Further, the first ends 331 of the plurality of conductive glue columns 33 are located in the sealed space (that is, the bottom gasket 31 surrounds the first ends 331 of the plurality of conductive glue columns 33 ). one end 331 ), and the first ends 331 of the plurality of conductive glue pillars 33 abut and are electrically coupled to the circuit board 1 . Furthermore, the filling body 34 has elasticity and is located on the top side of the carrier sheet 32 and surrounds at least part of the plurality of second end portions 332. The height of the filling body 34 is preferably not greater than the height of any one of the second end portions 332 surrounded by it.

所述轉板模組4位於所述容置空間S內、且包含有一殼體41及位於所述殼體41內的一線路扇出結構42。其中,所述殼體41安裝於所述電路板1並壓迫於所述線路扇出結構42,並且所述殼體41於本實施例中是通過螺鎖方式安裝於所述電路板1,以使所述承載片32(與所述底墊圈31)夾持在所述殼體41與所述電路板1之間,但本發明不以此為限。The turntable module 4 is located in the accommodating space S, and includes a housing 41 and a circuit fan-out structure 42 located in the housing 41 . Wherein, the housing 41 is installed on the circuit board 1 and pressed against the circuit fan-out structure 42, and in this embodiment, the housing 41 is installed on the circuit board 1 by screw locking, so as to The carrying sheet 32 (and the bottom gasket 31 ) is clamped between the housing 41 and the circuit board 1 , but the present invention is not limited thereto.

所述線路扇出結構42於本實施例中具有一中介板421、設置於所述中介板421上的一扇出轉接板422、及設置於所述扇出轉接板422上的一頂墊圈423,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述中介板421與所述頂墊圈423的至少其中之一可以依據設計需求而被省略或是以其他構件取代。In this embodiment, the line fan-out structure 42 has an intermediary board 421, a fan-out adapter board 422 arranged on the intermediary board 421, and a top board arranged on the fan-out adapter board 422. Gasket 423, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, at least one of the intermediate plate 421 and the top gasket 423 can be omitted or replaced by other components according to design requirements.

所述中介板421具有位於相反側(如:圖2中的所述中介板421底側與頂側)且彼此電性耦接的一寬距連接面4211與一寬距內接面4212;其中,所述寬距內接面4212的多個第一內接點4213之間的間隔與排佈大致等同於所述寬距連接面4211的多個接點(未標示)之間的間隔與排佈。再者,多個所述導電膠柱33的所述第二端部332抵頂且電性耦接於所述寬距連接面4211,並且所述填充體34位於所述承載片32與所述寬距連接面4211之間。The intermediary board 421 has a wide-distance connection surface 4211 and a wide-distance inner connection surface 4212 located on opposite sides (such as: the bottom side and the top side of the intermediary board 421 in FIG. 2 ) and electrically coupled to each other; wherein , the spacing and arrangement between the plurality of first internal contact points 4213 of the wide-distance internal connection surface 4212 are approximately equal to the spacing and arrangement between the multiple contact points (not marked) of the wide-distance connecting surface 4211 cloth. Furthermore, the second end portions 332 of the plurality of conductive adhesive posts 33 are abutted against and electrically coupled to the wide-distance connection surface 4211, and the filling body 34 is located between the carrier sheet 32 and the Wide distance between the connecting surfaces 4211.

所述扇出轉接板422具有位於相反側(如:圖2中的所述扇出轉接板422頂側與底側)且彼此電性耦接的一窄距連接面4221與一扇出內接面4222;其中,所述扇出內接面4222的多個第二內接點4223之間的間隔與排佈相較於所述窄距連接面4221的多個接點(未標示)更為寬廣且分散、且其大致等同於所述寬距內接面4212的多個所述第一內接點4213之間的間隔與排佈。The fan-out adapter plate 422 has a narrow-distance connection surface 4221 and a fan-out adapter plate 4221 located on opposite sides (such as: the top side and the bottom side of the fan-out adapter plate 422 in FIG. 2 ) and electrically coupled to each other. Inner connection surface 4222; wherein, the spacing and arrangement between the plurality of second inner contact points 4223 of the fan-out inner connection surface 4222 are compared with the multiple contacts (not marked) of the narrow-pitch connection surface 4221 It is wider and dispersed, and it is roughly equal to the spacing and arrangement of the plurality of first internal contact points 4213 of the wide-distance internal contact surface 4212 .

進一步地說,所述中介板421與所述扇出轉接板422於本實施例中通過所述寬距內接面4212的多個所述第一內接點4213分別連接(如:焊接)於所述扇出內接面4222的多個第二內接點4223,以使所述寬距連接面4211與所述窄距連接面4221彼此電性耦接。Furthermore, in this embodiment, the intermediary board 421 and the fan-out adapter board 422 are respectively connected (for example: welded) through a plurality of the first internal contact points 4213 of the wide-distance internal contact surface 4212 A plurality of second internal contact points 4223 on the fan-out internal connection surface 4222 are used to electrically couple the wide-pitch connection surface 4211 and the narrow-pitch connection surface 4221 to each other.

再者,所述寬距連接面4211與所述窄距連接面4221分別位於所述線路扇出結構42的相反兩側(如:圖2中的所述線路扇出結構42底側與頂側),並且所述窄距連接面4221裸露於所述殼體41之外。其中,所述頂墊圈423呈環形且具有彈性、並設置於所述窄距連接面4221的外側部位(如:所述窄距連接面4221的多個所述接點被所述頂墊圈423所圍繞且裸露於所述殼體41之外);也就是說,所述頂墊圈423夾持於所述殼體41與所述扇出轉接板422(如:所述窄距連接面4221)之間。Furthermore, the wide-distance connection surface 4211 and the narrow-distance connection surface 4221 are respectively located on opposite sides of the circuit fan-out structure 42 (such as: the bottom side and the top side of the circuit fan-out structure 42 in FIG. 2 ), and the narrow-distance connection surface 4221 is exposed outside the housing 41 . Wherein, the top washer 423 is ring-shaped and has elasticity, and is arranged on the outer part of the narrow-distance connection surface 4221 (such as: a plurality of the contacts of the narrow-distance connection surface 4221 are held by the top washer 423 surrounding and exposed outside the housing 41); that is to say, the top gasket 423 is clamped between the housing 41 and the fan-out adapter plate 422 (for example: the narrow-distance connecting surface 4221) between.

據此,所述固持座100於本實施例中是通過所述連接層3的多個所述導電膠柱33來電性耦接所述轉板模組4與所述電路板1,據以使所述轉板模組4與所述電路板1之間通過可被拆卸的所述連接層3來取代既有的焊接方式,進而實現彼此可拆卸、以利於後續使用(如:維修替換或轉用至其他構件)。Accordingly, in this embodiment, the holding base 100 electrically couples the transfer board module 4 and the circuit board 1 through the plurality of conductive adhesive columns 33 of the connecting layer 3, so that The detachable connecting layer 3 is used to replace the existing welding method between the transfer plate module 4 and the circuit board 1, so as to realize mutual detachment for subsequent use (such as maintenance, replacement or transfer). to other components).

進一步地說,所述轉板模組4於本實施例中通過採用所述中介板421與所述殼體41來夾持所述扇出轉接板422,以使所述可拆式測試裝置在組裝完成後,所述扇出轉接板422能夠降低其水平變形程度(也就是,維持有較佳的水平度)。Furthermore, in this embodiment, the turntable module 4 clamps the fan-out adapter plate 422 by using the intermediate plate 421 and the housing 41, so that the detachable test device After the assembly is completed, the fan-out adapter plate 422 can reduce its horizontal deformation (that is, maintain a better levelness).

再者,所述固持座100於本實施例中還可以通過在多個構件之間的適當位置處設置有彈性構件(如:所述底墊圈31、所述填充體34、所述頂墊圈423),以使相對應構件能夠因為力平衡而產生預期形變,進而令所述可拆式測試裝置在組裝完成後,所述扇出轉接板422的水平變形程度可以有效地降低(也就是,維持有較佳的水平度)、並使所述連接層3的多個所述導電膠柱33能夠穩定地連接於所述轉板模組4。Furthermore, in this embodiment, the holding seat 100 can also be provided with elastic members (such as: the bottom washer 31, the filling body 34, the top washer 423, etc.) ), so that the corresponding components can produce expected deformation due to force balance, so that after the assembly of the detachable test device is completed, the horizontal deformation of the fan-out adapter plate 422 can be effectively reduced (that is, maintain a better level), and enable the multiple conductive adhesive columns 33 of the connection layer 3 to be stably connected to the turntable module 4 .

需額外說明的是,每個所述導電膠柱33於本實施例中可以進一步限定為一異方性導電膠柱,其能通過所述線路扇出結構42而間接地被所述殼體41所壓迫,進而於所述電路板1與所述寬距連接面4211之間形成一信號傳輸路徑,但本發明不受限於此。It should be noted that each of the conductive adhesive columns 33 in this embodiment can be further defined as an anisotropic conductive adhesive column, which can be indirectly controlled by the housing 41 through the circuit fan-out structure 42 A signal transmission path is formed between the circuit board 1 and the wide-distance connecting surface 4211, but the present invention is not limited thereto.

所述探針頭200包含有一定位板組201及安裝於所述定位板組201的多個導電探針202,並且多個所述導電探針202於本實施例中是採用垂直式探針(vertical probe),但不以此為限。其中,所述探針頭200的所述定位板組201安裝於所述外框架2(如:所述定位板組201安裝於所述外框架2的所述框口21,進而大致封閉所述容置空間S),多個所述導電探針202抵頂且電性耦接於所述轉板模組4的所述窄距連接面4221(的多個所述接點)、進而通過所述線路扇出結構42與多個所述導電膠柱33而電性耦接於所述電路板1。需說明的是,所述扇出轉接板422的任兩個所述第二內接點4223之間的一距離大於其(通過所述窄距連接面4221)所電性耦接的兩個所述導電探針202之間的距離。The probe head 200 includes a positioning plate set 201 and a plurality of conductive probes 202 installed on the positioning plate set 201, and a plurality of the conductive probes 202 are vertical probes ( vertical probe), but not limited to this. Wherein, the positioning plate group 201 of the probe head 200 is installed on the outer frame 2 (such as: the positioning plate group 201 is installed on the frame opening 21 of the outer frame 2, thereby approximately closing the accommodating space S), a plurality of conductive probes 202 abut and electrically coupled to the narrow-distance connecting surface 4221 of the turntable module 4 (a plurality of the contacts), and then pass through the The circuit fan-out structure 42 and the plurality of conductive adhesive posts 33 are electrically coupled to the circuit board 1 . It should be noted that the distance between any two of the second internal contacts 4223 of the fan-out adapter plate 422 is greater than the two electrically coupled points (through the narrow-distance connection surface 4221 ). The distance between the conductive probes 202 .

更詳細地說,所述定位板組201包含有安裝於所述外框架2的一間隔板2011、設置於所述間隔板2011外側的一上導板2012、及設置於所述間隔板2011內側的一下導板2013。其中,所述下導板2013搭配於所述上導板2012、且其位置分別對應於所述轉板模組4。More specifically, the positioning plate group 201 includes a partition plate 2011 mounted on the outer frame 2, an upper guide plate 2012 disposed outside the partition plate 2011, and an upper guide plate 2012 disposed inside the partition plate 2011. The click guide 2013. Wherein, the lower guide plate 2013 is matched with the upper guide plate 2012 and its positions correspond to the rotating plate modules 4 respectively.

再者,相互搭配的所述上導板2012與所述下導板2013,其固定有多個所述導電探針202,用以抵頂且電性耦接於所述轉板模組4的所述窄距連接面4221,但本發明不以此為限。舉例來說,如圖6所示,所述轉板模組4可以擴增為多個,並且多個所述轉板模組4同樣設置於所述電路板1與所述外框架2所共同包圍的所述容置空間S內,而所述探針頭200與所述連接層3則為相對應的調整。Furthermore, the upper guide plate 2012 and the lower guide plate 2013 that match each other are fixed with a plurality of the conductive probes 202 for abutting against and electrically coupled to the transfer plate module 4 . The narrow-distance connection surface 4221, but the present invention is not limited thereto. For example, as shown in FIG. 6 , the transfer board module 4 can be multiplied into multiples, and a plurality of the transfer board modules 4 are also arranged on the joint between the circuit board 1 and the outer frame 2 In the surrounding accommodating space S, the probe head 200 and the connection layer 3 are correspondingly adjusted.

[實施例二][Example 2]

請參閱圖7所示,其為本發明的實施例二。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 7 , which is the second embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:

於本實施例中,所述殼體41的內緣具有一第一環形階面411及位於所述第一環形階面411內側的一第二環形階面412,並且所述第一環形階面411壓迫於所述中介板421的所述寬距內接面4212(的外側部位),而所述第二環形階面412則是壓迫於所述頂墊圈423。此外,在本發明未繪示的其他實施例中,如所述線路扇出結構42未採用所述頂墊圈423時,則所述殼體41的所述第二環形階面412壓迫於所述扇出轉接板422(的外側部位)。In this embodiment, the inner edge of the housing 41 has a first annular step surface 411 and a second annular step surface 412 located inside the first annular step surface 411, and the first ring The shaped stepped surface 411 presses against (the outer part of) the wide-distance inscribed surface 4212 of the intermediate plate 421 , and the second annular stepped surface 412 presses against the top gasket 423 . In addition, in other embodiments not shown in the present invention, if the top gasket 423 is not used in the line fan-out structure 42, the second annular stepped surface 412 of the housing 41 is pressed against the The fan-out adapter plate 422 (the outer part).

據此,所述轉板模組4於本實施例中可以通過所述殼體41所形成的所述第一環形階面411與所述第二環形階面412,以使所述線路扇出結構42內的構件(如:所述中介板421、所述扇出轉接板422、及所述頂墊圈423)能夠被精準地定位於所述連接層3,進而確保彼此的電性連接。Accordingly, in this embodiment, the turntable module 4 can pass through the first annular step surface 411 and the second annular step surface 412 formed by the casing 41, so that the circuit fan The components in the output structure 42 (such as: the intermediate board 421, the fan-out adapter plate 422, and the top gasket 423) can be precisely positioned on the connection layer 3, thereby ensuring electrical connection with each other .

[實施例三][Embodiment three]

請參閱圖8所示,其為本發明的實施例三。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 8 , which is the third embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:

於本實施例中,所述線路扇出結構42未包含有實施例一所載的所述中介板421;也就是說,所述線路扇出結構42可以是僅為單個板體(如:所述扇出轉接板422)或者是僅包含有所述扇出轉接板422與所述頂墊圈423,但不以此為限。In this embodiment, the circuit fan-out structure 42 does not include the intermediary board 421 described in Embodiment 1; that is to say, the circuit fan-out structure 42 may be only a single board (such as: The fan-out adapter plate 422) or only includes the fan-out adapter plate 422 and the top gasket 423, but not limited thereto.

具體來說,所述線路扇出結構42具有位於相反側的所述寬距連接面4211及電性耦接於所述寬距連接面4211的所述窄距連接面4221。也就是說,實施例一所載的所述扇出轉接板422的所述扇出內接面4222在此被作為所述線路扇出結構42的所述寬距連接面4211使用。其中,多個所述導電膠柱33的所述第二端部332抵頂且電性耦接於所述寬距連接面4211,多個所述導電探針202抵頂且電性耦接於所述窄距連接面4221、進而通過所述線路扇出結構42與多個所述導電膠柱33而電性耦接於所述電路板1。Specifically, the circuit fan-out structure 42 has the wide-distance connection surface 4211 on the opposite side and the narrow-distance connection surface 4221 electrically coupled to the wide-distance connection surface 4211 . That is to say, the fan-out internal connection surface 4222 of the fan-out adapter board 422 in the first embodiment is used as the wide-distance connection surface 4211 of the circuit fan-out structure 42 here. Wherein, the second ends 332 of the plurality of conductive adhesive posts 33 are abutted against and electrically coupled to the wide-distance connecting surface 4211, and the plurality of conductive probes 202 are abutted against and electrically coupled to The narrow-pitch connecting surface 4221 is further electrically coupled to the circuit board 1 through the circuit fan-out structure 42 and the plurality of conductive glue posts 33 .

此外,所述殼體41於本實施例中形成有穿設於所述連接層3與所述電路板1的多個第一定位柱413、及穿設於所述轉板模組4的多個第二定位柱414,據以使所述連接層3與所述轉板模組4能通過所述殼體41而準確地設置在所述電路板1上。In addition, in this embodiment, the housing 41 is formed with a plurality of first positioning columns 413 penetrating the connection layer 3 and the circuit board 1 , and a plurality of positioning columns 413 penetrating the rotating plate module 4 . A second positioning post 414 is provided so that the connection layer 3 and the turntable module 4 can be accurately arranged on the circuit board 1 through the housing 41 .

[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]

綜上所述,本發明實施例所公開的可拆式測試裝置及其固持座,通過所述連接層的多個所述導電膠柱來電性耦接所述轉板模組與所述電路板,據以使所述轉板模組與所述電路板之間通過可被拆卸的所述連接層來取代既有的焊接方式,進而實現彼此可拆卸、以利於後續使用(如:維修替換或轉用至其他構件)。To sum up, the detachable test device and its holding seat disclosed in the embodiments of the present invention electrically couple the rotating board module and the circuit board through the plurality of conductive adhesive columns on the connecting layer. , so that the existing welding method is replaced by the detachable connecting layer between the transfer plate module and the circuit board, so as to realize detachability for subsequent use (such as: maintenance and replacement or transferred to other components).

進一步地說,所述轉板模組通過採用所述中介板與所述殼體來夾持所述扇出轉接板,以使所述可拆式測試裝置在組裝完成後,所述扇出轉接板能夠降低其水平變形程度(也就是,維持有較佳的水平度)。Furthermore, the turntable module clamps the fan-out adapter board by using the intermediate board and the housing, so that after the assembly of the detachable test device is completed, the fan-out The adapter plate can reduce its horizontal deformation (that is, maintain a better levelness).

再者,所述固持座還可以通過在多個構件之間的適當位置處設置有彈性構件(如:所述底墊圈、所述填充體、所述頂墊圈),以使相對應構件能夠因為力平衡而產生預期形變,進而令所述可拆式測試裝置在組裝完成後,所述扇出轉接板的水平變形程度可以有效地降低(也就是,維持有較佳的水平度)、並使所述連接層的多個所述導電膠柱能夠穩定地連接於所述轉板模組。Furthermore, the holding seat can also be provided with elastic members (such as: the bottom washer, the filling body, the top washer) at appropriate positions between multiple members, so that the corresponding members can be force balance to produce expected deformation, so that after the assembly of the detachable test device is completed, the horizontal deformation of the fan-out adapter plate can be effectively reduced (that is, to maintain a better levelness), and The plurality of conductive glue columns of the connection layer can be stably connected to the transfer plate module.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.

100:固持座 1:電路板 2:外框架 21:框口 3:連接層 31:底墊圈 32:承載片 33:導電膠柱 331:第一端部 332:第二端部 34:填充體 4:轉板模組 41:殼體 411:第一環形階面 412:第二環形階面 413:第一定位柱 414:第二定位柱 42:線路扇出結構 421:中介板 4211:寬距連接面 4212:寬距內接面 4213:第一內接點 422:扇出轉接板 4221:窄距連接面 4222:扇出內接面 4223:第二內接點 423:頂墊圈 S:容置空間 200:探針頭 201:定位板組 2011:間隔板 2012:上導板 2013:下導板 202:導電探針 100: holding seat 1: circuit board 2: Outer frame 21: frame mouth 3: Connection layer 31: Bottom washer 32: Carrier sheet 33: Conductive adhesive column 331: first end 332: second end 34: filling body 4: Transfer board module 41: shell 411: The first annular step surface 412: Second annular step surface 413: The first positioning column 414: The second positioning column 42: Line fan-out structure 421:Intermediate board 4211: wide distance connecting surface 4212: Wide distance inner joint surface 4213: The first inner contact point 422: Fan-out adapter board 4221: narrow distance connection surface 4222: Fan-out internal interface 4223: The second inner contact point 423: top washer S: storage space 200: probe head 201: Positioning plate group 2011: Partition board 2012: Upper guide 2013: Bottom guide 202: Conductive probe

圖1為本發明實施例一的可拆式測試裝置的立體示意圖。FIG. 1 is a three-dimensional schematic diagram of a detachable testing device according to Embodiment 1 of the present invention.

圖2為圖1沿剖線II-II的剖視示意圖。FIG. 2 is a schematic cross-sectional view of FIG. 1 along the section line II-II.

圖3為圖1的分解示意圖。FIG. 3 is an exploded schematic view of FIG. 1 .

圖4為圖3的連接層與轉板模組的分解示意圖。FIG. 4 is an exploded schematic diagram of the connection layer and the transfer plate module in FIG. 3 .

圖5為圖3的連接層與轉板模組的另一視角分解示意圖。FIG. 5 is an exploded view from another perspective of the connection layer and the transfer plate module in FIG. 3 .

圖6為本發明實施例一的可拆式測試裝置另一態樣的剖視示意圖。FIG. 6 is a schematic cross-sectional view of another form of the detachable testing device according to Embodiment 1 of the present invention.

圖7為本發明實施例二的可拆式測試裝置的剖視示意圖。FIG. 7 is a schematic cross-sectional view of a detachable testing device according to Embodiment 2 of the present invention.

圖8為本發明實施例三的可拆式測試裝置的剖視示意圖。FIG. 8 is a schematic cross-sectional view of a detachable testing device according to Embodiment 3 of the present invention.

100:固持座 100: holding seat

1:電路板 1: circuit board

2:外框架 2: Outer frame

21:框口 21: frame mouth

3:連接層 3: Connection layer

31:底墊圈 31: Bottom washer

32:承載片 32: Carrier sheet

33:導電膠柱 33: Conductive adhesive column

331:第一端部 331: first end

332:第二端部 332: second end

34:填充體 34: filling body

4:轉板模組 4: Transfer board module

41:殼體 41: Shell

42:線路扇出結構 42: Line fan-out structure

421:中介板 421:Intermediate board

4211:寬距連接面 4211: wide distance connecting surface

4212:寬距內接面 4212: Wide distance inner joint surface

4213:第一內接點 4213: The first inner contact point

422:扇出轉接板 422: Fan-out adapter board

4221:窄距連接面 4221: narrow distance connection surface

4222:扇出內接面 4222: Fan-out internal interface

4223:第二內接點 4223: The second internal contact point

423:頂墊圈 423: top washer

S:容置空間 S: storage space

200:探針頭 200: probe head

201:定位板組 201: Positioning plate group

2011:間隔板 2011: Partition board

2012:上導板 2012: Upper guide

2013:下導板 2013: Bottom guide

202:導電探針 202: Conductive probe

Claims (10)

一種可拆式測試裝置,其包括:一固持座,包含有:一電路板;一外框架,安裝於所述電路板並共同包圍形成有一容置空間;一連接層,包含有:多個導電膠柱,彼此間隔設置,並且每個所述導電膠柱具有位於相反側的一第一端部與一第二端部;及一承載片,設置有多個所述導電膠柱於其中,並且每個所述導電膠柱的所述第一端部與所述第二端部分別突伸出所述承載片的相反兩側;其中,所述連接層設置於所述電路板上且位於所述容置空間內,多個所述導電膠柱的所述第一端部抵頂且電性耦接於所述電路板;及一轉板模組,位於所述容置空間內且包含有:一線路扇出結構,具有位於相反側的一寬距連接面及一窄距連接面,並且所述窄距連接面電性耦接於所述寬距連接面;其中,多個所述導電膠柱的所述第二端部抵頂且電性耦接於所述寬距連接面;及一殼體,安裝於所述電路板並壓迫於所述線路扇出結構,並且所述窄距連接面裸露於所述殼體之外;以及一探針頭,包含有一定位板組及安裝於所述定位板組的多個導電探針;其中,所述探針頭的所述定位板組安裝於所述外框架,並且多個所述導電探針抵頂且電性耦接於所述窄距連接面、進而通過所述線路扇出結構與多個所述導電膠柱而電性耦接 於所述電路板。 A detachable test device, which includes: a holding seat, including: a circuit board; an outer frame, installed on the circuit board and together to form an accommodating space; a connecting layer, including: a plurality of conductive Adhesive pillars are spaced apart from each other, and each of the conductive adhesive pillars has a first end and a second end on opposite sides; and a carrier sheet, in which a plurality of the conductive adhesive pillars are arranged, and The first end and the second end of each of the conductive adhesive posts respectively protrude from opposite sides of the carrier sheet; wherein, the connecting layer is arranged on the circuit board and located on the In the accommodating space, the first ends of the plurality of conductive glue columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodating space and includes : A line fan-out structure, having a wide-distance connection surface and a narrow-distance connection surface on opposite sides, and the narrow-distance connection surface is electrically coupled to the wide-distance connection surface; wherein, a plurality of the conductive The second end of the glue column abuts against and is electrically coupled to the wide-distance connecting surface; and a housing is installed on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance The connection surface is exposed outside the housing; and a probe head includes a positioning plate set and a plurality of conductive probes installed on the positioning plate set; wherein, the positioning plate set of the probe head Installed on the outer frame, and a plurality of the conductive probes are abutted against and electrically coupled to the narrow-distance connecting surface, and then electrically coupled with the plurality of conductive adhesive posts through the circuit fan-out structure catch on the circuit board. 如請求項1所述的可拆式測試裝置,其中,所述連接層包含有:一底墊圈,夾持於所述承載片與所述電路板之間,並且所述底墊圈圍繞在多個所述導電膠柱的所述第一端部的外側;其中,所述承載片與所述底墊圈夾持在所述殼體與所述電路板之間。 The detachable test device according to claim 1, wherein the connecting layer includes: a bottom gasket clamped between the carrier sheet and the circuit board, and the bottom gasket is surrounded by a plurality of The outer side of the first end of the conductive glue column; wherein, the bearing sheet and the bottom gasket are clamped between the housing and the circuit board. 如請求項1所述的可拆式測試裝置,其中,所述承載片夾持在所述殼體與所述電路板之間,所述連接層包含有:一填充體,位於所述承載片與所述寬距連接面之間;其中,所述填充體圍繞於多個所述第二端部之中的至少部分。 The detachable test device according to claim 1, wherein the carrier sheet is clamped between the housing and the circuit board, and the connection layer includes: a filling body located on the carrier sheet Between the wide-distance connection surface; wherein, the filling body surrounds at least part of the plurality of second end portions. 如請求項3所述的可拆式測試裝置,其中,所述填充體的高度不大於其所圍繞的任一個所述第二端部的高度。 The detachable testing device according to claim 3, wherein the height of the filling body is not greater than the height of any one of the second ends it surrounds. 如請求項1所述的可拆式測試裝置,其中,所述線路扇出結構包含有:一中介板,具有位於相反側且彼此電性耦接的所述寬距連接面與一寬距內接面;及一扇出轉接板,具有位於相反側且彼此電性耦接的所述窄距連接面與一扇出內接面,並且所述寬距內接面的多個第一內接點分別連接於所述扇出內接面的多個第二內接點。 The detachable test device according to claim 1, wherein the circuit fan-out structure includes: an interposer having the wide-distance connection surfaces and a wide-distance inner plane located on opposite sides and electrically coupled to each other and a fan-out adapter plate, which has the narrow-pitch connection surface and a fan-out internal connection surface located on opposite sides and electrically coupled to each other, and a plurality of first internal connection surfaces of the wide-distance internal connection surface The contacts are respectively connected to a plurality of second internal contacts on the fan-out internal contact surface. 如請求項5所述的可拆式測試裝置,其中,所述線路扇出結構包含有夾持於所述殼體與所述扇出轉接板之間的一頂墊 圈。 The detachable test device according to claim 5, wherein the circuit fan-out structure includes a top pad clamped between the housing and the fan-out adapter plate lock up. 如請求項6所述的可拆式測試裝置,其中,所述殼體的內緣具有一第一環形階面及一第二環形階面,並且所述第一環形階面壓迫於所述中介板的所述寬距內接面,而所述第二環形階面則是壓迫於所述頂墊圈。 The detachable test device according to claim 6, wherein the inner edge of the housing has a first annular step surface and a second annular step surface, and the first annular step surface is pressed against the The wide-distance internal contact surface of the intermediate plate, and the second annular step surface is pressed against the top gasket. 如請求項1所述的可拆式測試裝置,其中,每個所述導電膠柱進一步限定為一異方性導電膠柱,其通過所述線路扇出結構被所述殼體壓迫而於所述電路板與所述寬距連接面之間形成一信號傳輸路徑。 The detachable test device according to claim 1, wherein each of the conductive adhesive columns is further defined as an anisotropic conductive adhesive column, which is pressed by the housing through the fan-out structure of the line to the A signal transmission path is formed between the circuit board and the wide-distance connecting surface. 一種可拆式測試裝置的固持座,其包括:一電路板;一外框架,安裝於所述電路板並共同包圍形成有一容置空間;一連接層,包含有:多個導電膠柱,彼此間隔設置,並且每個所述導電膠柱具有位於相反側的一第一端部與一第二端部;及一承載片,設置有多個所述導電膠柱於其中,並且每個所述導電膠柱的所述第一端部與所述第二端部分別突伸出所述承載片的相反兩側;其中,所述連接層設置於所述電路板上且位於所述容置空間內,多個所述導電膠柱的所述第一端部抵頂且電性耦接於所述電路板;以及一轉板模組,位於所述容置空間內且包含有:一線路扇出結構,具有位於相反側的一寬距連接面及一窄 距連接面,並且所述窄距連接面電性耦接於所述寬距連接面;其中,多個所述導電膠柱的所述第二端部抵頂且電性耦接於所述寬距連接面;及一殼體,安裝於所述電路板並壓迫於所述線路扇出結構,並且所述窄距連接面裸露於所述殼體之外。 A holding seat for a detachable test device, which includes: a circuit board; an outer frame, which is installed on the circuit board and surrounds together to form an accommodating space; a connecting layer, including: a plurality of conductive glue columns, connected to each other arranged at intervals, and each of the conductive glue columns has a first end and a second end on opposite sides; and a carrier sheet, in which a plurality of the conductive glue columns are arranged, and each of the The first end and the second end of the conductive adhesive column respectively protrude from opposite sides of the carrier sheet; wherein, the connection layer is arranged on the circuit board and located in the accommodating space Inside, the first ends of the plurality of conductive glue columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodation space and includes: a circuit fan Out structure, with a wide connection surface on the opposite side and a narrow and the narrow-pitch connection surface is electrically coupled to the wide-pitch connection surface; wherein, the second ends of the plurality of conductive adhesive posts abut against and are electrically coupled to the wide-pitch connection surface. a connection surface; and a housing, installed on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance connection surface is exposed outside the housing. 如請求項9所述的可拆式測試裝置的固持座,其中,所述連接層包含有:一底墊圈,夾持於所述承載片與所述電路板之間,並且所述底墊圈圍繞在多個所述導電膠柱的所述第一端部的外側;其中,所述承載片與所述底墊圈夾持在所述殼體與所述電路板之間;以及一填充體,位於所述承載片與所述寬距連接面之間;其中,所述填充體圍繞於多個所述第二端部中的至少部分,並且所述填充體的高度不大於其所圍繞的任一個所述第二端部的高度。 The holding seat of the detachable test device according to claim 9, wherein the connection layer includes: a bottom gasket, clamped between the carrier sheet and the circuit board, and the bottom gasket surrounds On the outside of the first ends of the plurality of conductive glue posts; wherein, the bearing sheet and the bottom gasket are clamped between the housing and the circuit board; and a filling body is located Between the carrying sheet and the wide-distance connection surface; wherein, the filling body surrounds at least part of the plurality of second end portions, and the height of the filling body is not greater than any one of the surrounding parts the height of the second end.
TW111125041A 2022-07-05 2022-07-05 Detachable testing device and holder thereof TWI793040B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060006890A1 (en) * 2003-03-12 2006-01-12 Karavakis Konstantine N Interconnect structure that controls spacing between a probe card and a contact substrate
US20070176302A1 (en) * 2006-02-01 2007-08-02 Samsung Electro-Mechanics Co., Ltd. Low temperature co-fired ceramic module and method of manufacturing the same
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TWI641839B (en) * 2017-08-18 2018-11-21 中華精測科技股份有限公司 Detection device
CN110268274A (en) * 2017-02-07 2019-09-20 日本麦可罗尼克斯股份有限公司 Jig
TWI689731B (en) * 2019-03-18 2020-04-01 中華精測科技股份有限公司 Probe card testing device and signal switching module thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060006890A1 (en) * 2003-03-12 2006-01-12 Karavakis Konstantine N Interconnect structure that controls spacing between a probe card and a contact substrate
US20070176302A1 (en) * 2006-02-01 2007-08-02 Samsung Electro-Mechanics Co., Ltd. Low temperature co-fired ceramic module and method of manufacturing the same
US20140306729A1 (en) * 2013-04-16 2014-10-16 Mpi Corporation Position adjustable probing device and probe card assembly using the same
CN110268274A (en) * 2017-02-07 2019-09-20 日本麦可罗尼克斯股份有限公司 Jig
TWI641839B (en) * 2017-08-18 2018-11-21 中華精測科技股份有限公司 Detection device
TWI689731B (en) * 2019-03-18 2020-04-01 中華精測科技股份有限公司 Probe card testing device and signal switching module thereof

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