TWI811005B - Detachable testing device - Google Patents

Abstract

The present invention provides a detachable testing device and a circuit fan-out structure thereof. The circuit fan-out structure includes an intermediary board, a supporting layer, a fan-out board, and a plurality of solders. The supporting layer is sandwiched between a wide-interval connection surface of the intermediary board and a fan-out connection surface of the fan-out board. The supporting layer has a plurality of thru-holes, a plurality of first internal contacts of the wide-interval connection surface are respectively arranged in one side of the thru-holes, and a plurality of second internal contacts of the fan-out connection surface are respectively arranged in another one side of the thru-holes. The solders are respectively filled in the thru-holes, so that the solder in any one of the thru-holes covers and electrically connects the corresponding first internal contact and the corresponding second internal contact.

Description

Detachable test device

The invention relates to a test device, in particular to a detachable test device and its circuit fan-out structure.

The plurality of conductive probes included in the existing probe card testing device is connected to an adapter board, and then welded to a circuit board through the adapter board, so that the plurality of conductive probes can be electrically coupled connected to the circuit board. However, the manufacturing cost of the adapter board and the circuit board is high, so the soldering method adopted by the existing probe card testing device is not conducive to the subsequent use of the adapter board and the circuit board (such as maintenance and replacement) ).

Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.

Embodiments of the present invention provide a detachable testing device and its circuit fan-out structure, which can effectively improve possible defects of existing probe card testing devices.

The embodiment of the present invention discloses a detachable test device, which includes: a holding seat, including: a circuit board; an outer frame, installed on the circuit board and surrounding together to form an accommodating space; a connecting layer, including There are a plurality of conductive adhesive posts spaced apart from each other, and each of the conductive adhesive posts has a first end and a second end on opposite sides; wherein, the connecting layer is disposed on The circuit board is located in the accommodating space, the first ends of the plurality of conductive glue columns are abutted against and electrically coupled to the circuit board; and a turntable module is located in the accommodating space. The accommodating space includes: a line fan-out structure, including: an interposer, having a wide-distance connection surface and a wide-distance inner junction surface located on opposite sides and electrically coupled to each other; wherein, a plurality of The second end of the conductive glue column abuts against and is electrically coupled to the wide-distance connection surface; a support layer is arranged on the wide-distance inner connection surface, and the support layer is formed with a plurality of Perforation; wherein, the plurality of first internal contact points of the wide-distance internal connection surface are respectively located on one side of the plurality of perforations; a fan-out adapter plate is arranged on the support layer, and the fan-out The adapter board has a narrow-distance connection surface and a fan-out internal connection surface located on opposite sides and electrically coupled to each other; wherein, the plurality of second internal contact points of the fan-out internal connection surface are respectively located on the plurality of said the other side of the perforation; and a plurality of soldering bodies, which are respectively filled in the multiple perforation holes, so that the soldering body in any one of the perforation holes is covered and electrically connected to correspond to the first internal contact Corresponding to the second internal contact; and a housing, installed on the circuit board and pressed against the circuit fan-out structure, and the narrow-distance connection surface is exposed outside the housing; and a The probe head includes a positioning plate set and a plurality of conductive probes installed on the positioning plate set; wherein, the positioning plate set of the probe head is installed on the outer frame, and a plurality of the conductive probes The probes abut against and are electrically coupled to the narrow-distance connecting surface, and then electrically coupled to the circuit board through the circuit fan-out structure and the plurality of conductive glue posts.

The embodiment of the present invention also discloses a circuit fan-out structure of a detachable test device, which includes: an intermediary board with a wide-distance connection surface and a wide-distance inner connection surface on opposite sides; a support layer arranged on the On the wide-distance inner connection surface, and the support layer is formed with a plurality of perforations; wherein, the plurality of first inner connection points of the wide-distance inner connection surface are respectively located on one side of the plurality of through holes; a fan-out The adapter plate is arranged on the support layer, and the fan-out adapter plate has a narrow-distance connection surface and a fan-out inner connection surface on opposite sides; wherein, a plurality of fan-out inner connection surfaces The second internal contact points are respectively located on the other side of the plurality of through holes; and a plurality of welding bodies are respectively filled in the plurality of through holes, so that the welding body in any one of the through holes is covered and electrically connected. conduction corresponding to the first internal contact with the phase Corresponding to the second inner contact point.

To sum up, the detachable test device disclosed in the embodiment of the present invention electrically couples the transfer board module and the circuit board through a plurality of the conductive glue pillars on the connection layer. The detachable connecting layer is used to replace the existing welding method between the transfer board module and the circuit board, so as to realize mutual detachment for subsequent use (such as: maintenance and replacement or transfer to other components).

Furthermore, the circuit fan-out structure disclosed in the embodiment of the present invention uses the intermediary board to cooperate with the support layer and a plurality of soldering bodies to fix on the fan-out adapter board, so as to effectively Structurally supporting the fan-out adapter board, thereby reducing the influence of ambient temperature on the fan-out adapter board, and effectively reducing the horizontal deformation of the fan-out adapter board (that is, the fan-out adapter board The adapter plate can maintain better levelness).

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.

100: holding seat

1: circuit board

2: Outer frame

21: frame mouth

3: Connection layer

31: Bottom washer

32: Carrier sheet

33: Conductive adhesive column

331: first end

332: second end

34: filling body

4: Transfer board module

41: shell

411: The first annular step surface

412: Second annular step surface

42: Line fan-out structure

421:Intermediate board

4211: wide distance connecting surface

4212: Wide distance inner joint surface

4213: The first inner contact point

422: Fan-out adapter board

4221: narrow distance connection surface

4222: Fan-out internal interface

4223: The second internal contact point

423: top washer

424: support layer

4241: ceramic plate

4242: film

4243: perforation

425: welded body

S: storage space

200: probe head

201: Positioning plate group

2011: Partition board

2012: Upper guide

2013: Bottom guide

202: Conductive probe

FIG. 1 is a three-dimensional schematic diagram of a detachable testing device according to Embodiment 1 of the present invention.

FIG. 2 is a schematic cross-sectional view of FIG. 1 along the section line II-II.

FIG. 3 is an exploded schematic view of FIG. 1 .

FIG. 4 is an exploded schematic diagram of the connection layer and the transfer plate module in FIG. 3 .

FIG. 5 is an exploded view from another perspective of the connection layer and the transfer plate module in FIG. 3 .

FIG. 6 is a schematic cross-sectional view of another form of the detachable testing device according to Embodiment 1 of the present invention.

FIG. 7 is a schematic cross-sectional view of a detachable testing device according to Embodiment 2 of the present invention.

The following is a description of the implementation of the "detachable test device and its circuit fan-out structure" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification . The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to FIG. 1 to FIG. 6 , which are the first embodiment of the present invention. As shown in FIGS. 1 to 3 , the present embodiment discloses a detachable testing device, which includes a holding base 100 and a probe head 200 installed on the holding base 100 . It should be noted that although the holding base 100 is described as collaborating with the probe head 200 in this embodiment, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the holding seat 100 can be used alone (for example: sold) or used in conjunction with other components according to design requirements. The structure of the holding base 100 and the probe head 200 will be introduced first, and then the connection relationship between them will be described in due course.

As shown in Figures 2 to 5, the holding base 100 includes a circuit board 1 installed on the An outer frame 2 of the circuit board 1 , a connecting layer 3 arranged on the circuit board 1 , and a turntable module 4 arranged on the connecting layer 3 and inside the outer frame 2 . Wherein, the circuit board 1 is electrically coupled to a test instrument (not shown in the figure), and the circuit board 1 and the outer frame 2 jointly surround and form an accommodating space S, which communicates with the outer frame 2 A box mouth 21 .

The connection layer 3 is located in the accommodating space S, and the connection layer 3 includes a bottom gasket 31 arranged on the circuit board 1 in this embodiment, a bottom gasket 31 arranged on the bottom gasket 31 A carrier sheet 32 , a plurality of conductive glue columns 33 disposed in the carrier sheet 32 , and a filling body 34 on the carrier sheet 32 , but the present invention is not limited thereto. For example, in other unillustrated embodiments of the present invention, at least one of the bottom gasket 31, the bearing sheet 32, and the filling body 34 can be omitted according to design requirements or be replaced by other methods. Component Replacement.

In more detail, the bottom gasket 31 is annular and elastic, and the outer part of the bearing piece 32 is disposed on the bottom gasket 31; that is, the bottom gasket 31 is clamped on the bearing piece 32 and the circuit board 1 , so that the carrier 32 , the circuit board 1 , and the bottom gasket 31 together enclose a sealed space.

Furthermore, a plurality of the conductive glue pillars 33 are elastic and arranged at intervals from each other, and each of the conductive glue pillars 33 has a first end portion 331 and a second end portion 332 on opposite sides. Wherein, the first end portion 331 and the second end portion 332 of each conductive glue column 33 respectively protrude from opposite sides of the carrier sheet 32 (such as: the carrier sheet in FIG. 2 32 bottom side and top side); That is to say, the central part between the first end 331 and the second end 332 of each conductive glue column 33 is embedded in the carrier Sheet 32 inside.

Further, the first ends 331 of the plurality of conductive glue columns 33 are located in the sealed space (that is, the bottom gasket 31 surrounds the first ends 331 of the plurality of conductive glue columns 33 ). one end 331 ), and the first ends 331 of the plurality of conductive adhesive posts 33 abut and are electrically coupled to the circuit board 1 . Furthermore, the filling body 34 has elasticity and is located on the side of the carrying sheet 32 The top side surrounds at least part of the plurality of second end portions 332 , and the height of the filling body 34 is preferably not greater than the height of any one of the second end portions 332 it surrounds.

The turntable module 4 is located in the accommodating space S, and includes a housing 41 and a circuit fan-out structure 42 located in the housing 41 . Wherein, the housing 41 is installed on the circuit board 1 and pressed against the circuit fan-out structure 42, and in this embodiment, the housing 41 is installed on the circuit board 1 by screw locking, so as to The supporting sheet 32 (and the bottom gasket 31 ) are clamped between the housing 41 and the circuit board 1 , but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the line fan-out structure 42 can also be applied (for example: sold) alone or used in combination with other components.

In this embodiment, the line fan-out structure 42 has an intermediary board 421, a support layer 424 disposed on the intermediary board 421, a fan-out adapter board 422 disposed on the support layer 424, connecting all The intermediary board 421 and the plurality of welding bodies 425 of the fan-out adapter plate 422 , and a top gasket 423 disposed on the fan-out adapter plate 422 , but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the top washer 423 can be omitted or replaced by other components according to design requirements.

The interposer 421 has a wide-distance connecting surface 4211 and a wide-distance inner connection surface 4212 located on opposite sides (such as: the bottom side and the top side of the intermediary board 421 in FIG. 2 ) and electrically coupled to each other; wherein , the spacing and arrangement between the plurality of first internal contact points 4213 of the wide-distance internal connection surface 4212 are approximately the same as the spacing and arrangement between the multiple contact points (not marked) of the wide-distance connecting surface 4211 cloth. Furthermore, the second end portions 332 of the plurality of conductive glue posts 33 are abutted against and electrically coupled to the wide-distance connection surface 4211, and the filling body 34 is located (or clamped) on the between the carrier sheet 32 and the wide-distance connection surface 4211 .

The fan-out adapter plate 422 has a narrow-distance connecting surface 4221 and a fan-out adapter plate 4221 located on opposite sides (such as: the top side and the bottom side of the fan-out adapter plate 422 in FIG. 2 ) and electrically coupled to each other. Inner surface 4222; Wherein, the spacing and arrangement between the multiple second internal contacts 4223 of the fan-out internal connection surface 4222 are wider than the multiple contacts (not marked) of the narrow-pitch connection surface 4221 and scattered, and it is roughly equal to the spacing and arrangement of the plurality of first internal contact points 4213 of the wide-distance internal contact surface 4212 .

The supporting layer 424 has a thickness between 300 micrometers (μm) and 650 micrometers in this embodiment, and the supporting layer 424 is disposed on the wide-distance internal contact surface 4212 of the intermediary board 421 , and the The fan-out adapter plate 422 is disposed on the support layer 424 with its fan-out inner connection surface 4222 , and the periphery of the fan-out adapter plate 422 is preferably aligned with the periphery of the support layer 424 That is to say, the supporting layer 424 is sandwiched between the wide-distance internal connection surface 4212 and the fan-out internal connection surface 4222 .

In more detail, the supporting layer 424 in this embodiment includes a ceramic plate 4241 and a film 4242 sandwiched between the ceramic plate 4241 and the wide-distance internal contact surface 4212, and the ceramic The board 4241 is glued and fixed to the wide-distance inner surface 4212 of the intermediate board 421 through the adhesive film 4242 , but the invention is not limited thereto. Furthermore, the support layer 424 is formed with a plurality of perforations 4243 (for example: any one of the perforations 4243 penetrates the ceramic plate 4241 and the film 4242 ), and the plurality of the wide-distance internal contact surface 4212 The first internal contact points 4213 are respectively located on one side of the multiple through holes 4243 , and the multiple second internal contact points 4223 of the fan-out internal contact surface 4222 are respectively located on the other side of the multiple through holes 4243 .

Further, a plurality of said welding bodies 425 are respectively filled in a plurality of said through holes 4243 (such as: any one of said welding bodies 425 fills up one of said through holes 4243), so that any one of said through holes 4243 The welding body 425 covers and is electrically connected to the corresponding first internal contact 4213 and corresponding to the second internal contact 4223 . In this embodiment, the intermediary board 421 and the fan-out adapter board 422 are respectively welded by a plurality of the first inner contact points 4213 of the wide-distance inner contact surface 4212 with a plurality of welding bodies 425 A plurality of second internal contact points 4223 on the fan-out internal contact surface 4222, so that the wide pitch The connection surface 4211 and the narrow-distance connection surface 4221 are electrically coupled to each other.

Furthermore, the wide-distance connection surface 4211 and the narrow-distance connection surface 4221 are respectively located on opposite sides of the circuit fan-out structure 42 (such as: the bottom side and the top side of the circuit fan-out structure 42 in FIG. 2 ), and the narrow-distance connection surface 4221 is exposed outside the housing 41 . Wherein, the top washer 423 is ring-shaped and has elasticity, and is arranged on the outer part of the narrow-distance connection surface 4221 (such as: a plurality of the contacts of the narrow-distance connection surface 4221 are held by the top washer 423 surrounding and exposed outside the housing 41); that is to say, the top gasket 423 is clamped between the housing 41 and the fan-out adapter plate 422 (such as: the narrow-distance connecting surface 4221) between.

Accordingly, in this embodiment, the holding base 100 electrically couples the turntable module 4 and the circuit board 1 through the plurality of conductive adhesive posts 33 of the connecting layer 3, so that The detachable connecting layer 3 is used to replace the existing welding method between the transfer plate module 4 and the circuit board 1, so as to realize mutual detachment for subsequent use (such as maintenance, replacement or transfer). to other components).

Furthermore, in this embodiment, the transfer plate module 4 is fixed on the fan-out adapter plate 422 by using the intermediary plate 421 together with the support layer 424 and a plurality of the welding bodies 425. To effectively support the fan-out adapter plate 422 structurally, thereby reducing the influence of ambient temperature on the fan-out adapter plate 422, and effectively reducing the horizontal deformation of the fan-out adapter plate 422 (also That is, the fan-out adapter plate 422 can maintain a better level).

Furthermore, in this embodiment, the holding seat 100 can also be provided with elastic members (such as: the bottom washer 31, the filling body 34, the top washer 423, etc.) ), so that the corresponding components can produce expected deformation due to force balance, and then after the assembly of the detachable test device is completed, the horizontal deformation of the fan-out adapter plate 422 can be effectively reduced (that is, maintain a better level), and enable the plurality of conductive adhesive columns 33 of the connection layer 3 to be stably connected to the turntable module 4 .

It should be noted that each of the conductive adhesive columns 33 in this embodiment can be further defined as an anisotropic conductive adhesive column, which can be indirectly controlled by the housing 41 through the circuit fan-out structure 42 A signal transmission path is formed between the circuit board 1 and the wide-distance connecting surface 4211, but the present invention is not limited thereto.

The probe head 200 includes a positioning plate set 201 and a plurality of conductive probes 202 installed on the positioning plate set 201, and the multiple conductive probes 202 in this embodiment are vertical probes ( vertical probe), but not limited to this. Wherein, the positioning plate group 201 of the probe head 200 is installed on the outer frame 2 (such as: the positioning plate group 201 is installed on the frame opening 21 of the outer frame 2, and then roughly closes the accommodating space S), a plurality of the conductive probes 202 are abutted and electrically coupled to the narrow-distance connection surface 4221 (the plurality of contacts) of the turntable module 4, and then pass through the The circuit fan-out structure 42 and the plurality of conductive adhesive posts 33 are electrically coupled to the circuit board 1 . It should be noted that the distance between any two of the second inner contacts 4223 of the fan-out adapter plate 422 is greater than the two electrically coupled points (through the narrow-distance connection surface 4221 ). The distance between the conductive probes 202 .

More specifically, the positioning plate group 201 includes a partition plate 2011 mounted on the outer frame 2, an upper guide plate 2012 disposed outside the partition plate 2011, and an upper guide plate 2012 disposed inside the partition plate 2011. The click guide 2013. Wherein, the lower guide plate 2013 is matched with the upper guide plate 2012 and its positions correspond to the rotating plate modules 4 respectively.

Furthermore, the upper guide plate 2012 and the lower guide plate 2013 that match each other are fixed with a plurality of the conductive probes 202 for abutting against and electrically coupled to the transfer plate module 4 . The narrow-distance connection surface 4221, but the present invention is not limited thereto. For example, as shown in FIG. 6 , the transfer board module 4 can be multiplied into multiples, and a plurality of the transfer board modules 4 are also arranged on the joint between the circuit board 1 and the outer frame 2 In the surrounding accommodating space S, the probe head 200 and the connection layer 3 are correspondingly adjusted.

[Example 2]

Please refer to FIG. 7 , which is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows: In this embodiment, the shell The inner edge of the body 41 has a first annular step surface 411 and a second annular step surface 412 located inside the first annular step surface 411, and the first annular step surface 411 is pressed against the intermediate The wide-distance internal contact surface 4212 of the plate 421 is (the outer portion of) the second annular step surface 412 is pressed against the top gasket 423 . In addition, in other embodiments not shown in the present invention, if the top gasket 423 is not used in the line fan-out structure 42, the second annular stepped surface 412 of the housing 41 is pressed against the The fan-out adapter plate 422 (the outer part).

Accordingly, in this embodiment, the turntable module 4 can pass through the first annular step surface 411 and the second annular step surface 412 formed by the casing 41, so that the circuit fan The output structure 42 can be precisely positioned on the connection layer 3 to ensure electrical connection with each other.

[Technical effects of the embodiments of the present invention]

To sum up, the detachable test device disclosed in the embodiment of the present invention electrically couples the transfer board module and the circuit board through a plurality of the conductive glue pillars on the connection layer. The detachable connecting layer is used to replace the existing welding method between the transfer board module and the circuit board, so as to realize mutual detachment for subsequent use (such as: maintenance and replacement or transfer to other components).

Furthermore, the circuit fan-out structure disclosed in the embodiment of the present invention uses the intermediary board to cooperate with the support layer and a plurality of soldering bodies to fix on the fan-out adapter board, so as to effectively Structurally supporting the fan-out adapter board, thereby reducing the influence of ambient temperature on the fan-out adapter board, and effectively reducing the horizontal deformation of the fan-out adapter board (that is, the fan-out adapter board The adapter plate can maintain better levelness).

Furthermore, the holding seat can also be provided with elastic members (such as: the bottom washer, the filling body, the top washer) at appropriate positions between a plurality of members, so that the corresponding members can be Force balance produces expected deformation, so that after the assembly of the detachable test device is completed, the horizontal deformation of the fan-out adapter plate can be effectively reduced (that is, to maintain a better levelness), and The plurality of conductive glue columns of the connection layer can be stably connected to the transfer plate module.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.

100: holding seat

1: circuit board

2: Outer frame

21: frame mouth

3: Connection layer

31: Bottom washer

32: Carrier sheet

33: Conductive adhesive column

331: first end

332: second end

34: filling body

4: Transfer board module

41: shell

42: Line fan-out structure

421:Intermediate board

4211: wide distance connecting surface

4212: Wide distance inner joint surface

4213: The first inner contact point

422: Fan-out adapter board

4221: narrow distance connection surface

4222: Fan-out internal interface

4223: The second internal contact point

423: top washer

424: support layer

4241: ceramic plate

4242: film

4243: perforation

425: welded body

S: storage space

200: probe head

201: Positioning plate group

2011: Partition board

2012: Upper guide

2013: Bottom guide

202: Conductive probe

Claims (6)

A detachable test device, which includes: a holding seat, including: a circuit board; an outer frame, installed on the circuit board and together to form an accommodating space; a connecting layer, including: a plurality of conductive Adhesive pillars are spaced apart from each other, and each of the conductive adhesive pillars has a first end and a second end on opposite sides; wherein, the connecting layer is arranged on the circuit board and is located in the container placed in the space, the first ends of the plurality of conductive adhesive columns are abutted against and electrically coupled to the circuit board; a carrier sheet is clamped between the housing and the circuit board, The carrying sheet is provided with a plurality of the conductive adhesive posts therein, and the first end and the second end of each conductive adhesive post respectively protrude from opposite sides of the carrying sheet a bottom gasket, clamped between the carrier sheet and the circuit board, and the bottom gasket surrounds the outer sides of the first ends of the plurality of conductive adhesive posts; wherein, the carrier sheet clamped between the housing and the circuit board with the bottom gasket; and a filling body, located between the carrier sheet and the wide-distance connecting surface; wherein, the filling body surrounds a plurality of At least part of the second end, and the height of the filling body is not greater than the height of any one of the second ends it surrounds; and a rotating plate module, located in the accommodating space and Contains: a line fan-out structure, including: an interposer with a wide distance on opposite sides and electrically coupled to each other The connection surface and a wide-distance internal connection surface; wherein, the second ends of the plurality of conductive adhesive columns are abutted against and electrically coupled to the wide-distance connection surface; a supporting layer is arranged on the wide-distance connection surface. On the distance inner connection surface, and the support layer is formed with a plurality of through holes; wherein, the plurality of first inner connection points of the wide distance inner connection surface are respectively located on one side of the plurality of through holes; a fan-out transition The board is arranged on the support layer, and the fan-out adapter board has a narrow-distance connection surface and a fan-out internal connection surface located on opposite sides and electrically coupled to each other; wherein, the fan-out internal connection A plurality of second internal contacts on the surface are respectively located on the other side of the plurality of through holes; Covering and electrically conducting corresponding to the first internal contact and corresponding to the second internal contact; and a housing, installed on the circuit board and pressed against the circuit fan-out structure, and the The narrow-distance connection surface is exposed outside the housing; and a probe head includes a positioning plate set and a plurality of conductive probes installed on the positioning plate set; wherein, the positioning of the probe head The board group is installed on the outer frame, and a plurality of the conductive probes are abutted against and electrically coupled to the narrow-pitch connection surface, and then electrically connected through the circuit fan-out structure and the plurality of conductive glue columns. sexually coupled to the circuit board. The detachable test device according to claim 1, wherein the thickness of the support layer is between 300 microns (μm) and 650 microns, and the periphery of the support layer is aligned with that of the fan-out adapter plate perimeter. The detachable testing device as claimed in claim 1, wherein the support layer includes a ceramic plate, and clamped between the ceramic plate and the wide-distance internal contact surface A film, and the ceramic plate is bonded and fixed on the wide-distance internal contact surface through the film. The detachable testing device as claimed in claim 1, wherein a distance between any two of the second internal contacts is greater than a distance between the two conductive probes electrically coupled thereto. The detachable testing device according to claim 1, wherein the circuit fan-out structure includes a top gasket clamped between the housing and the fan-out adapter plate. The detachable test device according to claim 1, wherein each of the conductive adhesive columns is further defined as an anisotropic conductive adhesive column, which is indirectly contained by the housing through the circuit fan-out structure compressing, thereby forming a signal transmission path between the circuit board and the wide-distance connecting surface.