TW201918713A - Probe card being used for transmitting a signal from a detection machine to an electronic object to be detected - Google Patents

Abstract

The probe card is used for transmitting a signal from a detection machine to an electronic object to be detected. The probe card comprises a modular circuit board containing a first substrate that is configured to have first conductive wires electrically connected to each other and a plurality of first conductive pads, wherein one end of first conductive wire is electrically connected to the detection machine, and a second substrate, where a gap is provided between the first and the second substrates, that is configured to have second conductive wires electrically connected to each other and a plurality of second conductive pads; an interpose layer that is disposed between the first substrate and the second substrate, the interpose layer includes a plurality of electrical conductors, and the electrical conductors are electrically connected to the first conductive pads and the second conductive pads; and a plurality of probes, wherein one end of the probe is electrically connected to the second conductive wire, and the other end is in contact with the electronic object to be detected.

Description

Probe card

The invention relates to a probe card; in particular, a probe card structure in which a circuit board structure of a probe card can perform high-level number stacking, and has a high aspect ratio, a short hole of a signal path, and the like.

Referring to FIG. 1 , the structure of a general probe test system generally includes a detector 1, a circuit board 2, a carrier 3, a header 4, and a plurality of probes 5 for transmitting the circuit board. (such as PCB) 2, carrier 3 (such as MLO, MLC) and the probe card structure such as the probe 5 for signal detection and electrical analysis of an electronic object to be tested 6, wherein the carrier 3 is mainly used to The circuitry of board 2 is spatially converted to match the probes with smaller spacing. Among them, the conventional circuit board 2 structure mostly presses a plurality of substrates (such as fiberglass boards) into a single body through a pressing process, and no space is left between the substrates, otherwise the gaps will easily accumulate moisture and air residues. It is easy to produce a Popcorn Effect when used and there is a risk of bursting.

In addition, the conventional circuit board 2 manufactured by the press-bonding process has an increase in the tolerance of the overlapping alignment as the number of stacked layers of the substrate increases. In addition, mechanical drilling (such as re-drilling) is required after the pressing. When it is too high, the number of stacked layers is too high, and the total thickness is increased, resulting in excessive friction, which causes the drill bit to be easily broken. Therefore, the depth ratio of the circuit board of the conventional conventional pressing process ( The plate thickness/drill hole diameter is mostly limited and cannot be further improved. Furthermore, the circuit board after the re-drilling process will have a plurality of Via Stubs, which will easily generate a Via Stub Effect and easily cause an increase in the amount of reflection during signal transmission. .

In view of the above, an object of the present invention is to provide a probe card whose circuit board can be stacked on a high-rise number and has a high aspect ratio, and the through-hole of the signal path is short-circuited, eliminating the need for expensive and high-risk re-drilling. Process.

In order to achieve the above object, the present invention provides a probe card for transmitting a signal of a detecting machine to an electronic object to be tested, which comprises: a modular circuit board comprising: a first substrate; Having a first surface, a plurality of first conductive pads are disposed on the first surface, and the first substrate has a plurality of first conductive lines, one end of which is electrically connected to the detecting, and the other end is respectively associated with the first conductive pads The first conductive pad is electrically connected; a second substrate has a second surface, the second surface faces the first surface, and has a gap between the first surface and the second surface a plurality of second conductive pads are disposed, and the second substrate has a plurality of second conductive lines, one end of which is electrically connected to the second conductive pads respectively; and an interposer disposed on the first substrate and the The interposer includes a plurality of electrical conductors, the electrical conductors electrically connecting the first conductive pads and the second conductive pads respectively; the plurality of probes, the plurality of probes One end of the probe and the second one The other end of the electrical line is electrically connected to the other end for the object in contact with the DUT.

Wherein, the vertical height of the void is greater than or equal to 10 μm.

The interposer includes an insulating support layer that respectively abuts the first surface of the first substrate and the second surface of the second substrate, and the insulating support layer has a plurality of perforations. The through holes respectively accommodate the electrical conductors.

The interposer includes a conductive layer having a third surface opposite to the fourth surface, the third surface facing the first substrate, the fourth surface facing the second substrate, The conductive layer has a plurality of conductive paths; a portion of the conductive bodies are located between the first substrate and the conductive layer, and are electrically connected to the first conductive pads and the conductive paths respectively; and the conductive portions of the other portion The body is located between the second substrate and the conductive layer, and electrically connected to the second conductive pads and the conductive paths.

The interposer includes a first insulating support layer and a second insulating support layer. The first insulating support layer is located between the first substrate and the conductive layer, and respectively abuts the first of the first substrate. a surface and the third surface of the conductive layer, and the first insulating support layer has a plurality of through holes for accommodating the plurality of electrical conductors; the second insulating support layer is located between the second substrate and the conductive layer And respectively abutting the second surface of the second substrate and the fourth surface of the conductive layer, and the second insulating support layer has a plurality of through holes for accommodating the other portions of the electrical conductors.

The at least one electronic component is disposed at least one of the third surface and the fourth surface of the conductive layer, and the at least one electronic component is electrically connected to the conductive paths of the conductive layer.

Wherein at least one of the third surface and the fourth surface is recessed to form a recess, and the at least one electronic component is disposed in the recess.

Wherein, the area of the first surface is X, and the area of the second surface is Y, which satisfies the following condition: 0.7≦ ≦1.0; or 0.7≦ ≦ 1.0.

Wherein the interposer has at least one hollowed out area, the area of the first surface corresponding to at least one hollowed out area occupies more than 10% of the area of the first surface; the area of the second surface corresponding to at least one hollowed out area occupies the first More than 10% of the area of the two surfaces.

The area of the first surface of the first substrate and the area of the second surface of the second substrate are both greater than or equal to 900 square centimeters.

The device includes a plurality of signal conductors for electrically connecting to the second conductive lines and the probes.

The invention skips the frame of the conventional circuit board to be pressed into the process, and the effect is that a gap is left between the first substrate and the second substrate to help remove moisture and heat dissipation; in addition, the designed gap can provide more A large amount of available space allows the user to flexibly place more electronic components; in addition, the substrates are electrically connected by the electrical conductors of the interposer, so that a plurality of layers of the substrate can be arbitrarily stacked, and It is not limited by the general drilling depth ratio; in addition, the individual substrates can be manufactured by different board manufacturers, circuit layout, and finally the substrates are combined into a modular substrate, which can spread the production risk and facilitate modularization. In large-scale manufacturing; in addition, when there are some substrates with defects, it is only necessary to replace the defective substrate, and it is not necessary to scrap the whole batch, thereby effectively reducing the production cost.

In order to explain the present invention more clearly, the embodiments are described in detail with reference to the drawings. As shown in FIG. 2 , the probe card 7 of the first embodiment of the present invention transmits a signal of a detecting machine 1 to an electronic object to be tested 6 , which includes a modular circuit board 100 and a plurality of Root probe 5. The modular circuit board 100 includes a first substrate 10, a second substrate 20, and an interposer 30.

The first substrate 10 has a first surface 12 on which a plurality of first conductive pads 14 are disposed. In addition, a plurality of first conductive lines 16 are disposed in the first substrate 10 (FIG. Only a part of the first conductive line 16 is connected to a transmission interface (not shown) of the upper surface (the surface opposite to the first surface 12), and the transmission interface may be, but not limited to, A Ball Grid Array (BGA), a Pogo Pin, or the like is provided for electrically connecting to the detector 1 and the other end is electrically connected to the first conductive pads 14 respectively. In this embodiment, the first substrate 10 can be, but not limited to, a fiberglass board.

The second substrate 20 has a second surface 22 facing the first surface 12 , and the second surface 22 is provided with a plurality of second conductive pads 24 . In addition, a plurality of second conductive lines 26 are disposed in the second substrate 20 (only some of the lines are shown in the figure), and one ends of the second conductive lines 26 are electrically connected to the second conductive pads 24, respectively. . The second substrate 20 is spaced apart from the first substrate 10 by a predetermined distance such that a gap 40 is maintained between the second surface 22 and the first surface 12. Preferably, the gap 40 has a vertical height of at least 10 μm, wherein the vertical height of the gap 40 corresponds to the first surface 12 of the first substrate 10 and the second surface 22 of the second substrate 20. The vertical distance between. In this embodiment, the second substrate 20 can be, but not limited to, a fiberglass board.

The interposer 30 is disposed in the gap 40 between the first substrate 10 and the second substrate 20. In this embodiment, the interposer 30 includes a plurality of electrical conductors 32, and the electrical conductors 32 are respectively electrically Connecting the first conductive pads 14 and the second conductive pads 24 to make the first conductive lines 16 of the first substrate 10 and the second conductive lines 26 of the second substrate 20 respectively Sexual connection. The conductive body 32 may be a solder ball, a conductive adhesive, a metal terminal or the like, or other conductive functional component. The conductive filler used in the conductive adhesive may be gold, silver, copper, aluminum or zinc. , iron, nickel, etc. powder, graphite or other conductive compounds, but not limited to this.

The probes 5 are disposed on the hub 4, and one end of the probes 5 is electrically connected to the second conductive lines 26, and the other end is in contact with the mat object 6 to be electrically connected. And electrical detection.

In addition, in one embodiment, on one side of the modular circuit board 10, between the second substrate 20 and the probe 5, a carrier 3, the carrier 3 and the second substrate may be disposed as needed. 20 is connected, and the carrier 3 is provided with a plurality of signal conductors 3a electrically connected to the second conductive lines 26 of the second substrate 20 and the probes 5, respectively. The carrier 3 may be a multi-layer organic (MLO) or a multi-layer ceramic (MLC), and the like, and the first substrate 10 or the second substrate 20 The area of the surface is substantially smaller than the area of the first surface 12 of the first substrate 10 and smaller than the area of the second surface 22 of the second substrate 20. The role of the carrier 3 is to convert the pitch of the two adjacent second conductive lines 26 of the second substrate 20 into a matching distance with the probe 5.

In addition, in an embodiment, the area of the first surface 12 of the first substrate 10 is X, and the area of the second surface 22 of the second substrate 20 is Y, which satisfies the following condition: 0.7≦ ≦1.0; or 0.7≦ ≦ 1.0. Preferably, the following conditions are met: 0.9≦ ≦1.0; or 0.9≦ ≦ 1.0. In this embodiment, the area of the first surface 12 of the first substrate 10 is approximately equal to the area of the second surface 22 of the second substrate 20. Through the above design, the difference in the area of the surface facing the first substrate 10 and the second substrate 20 is not excessively different, so that the first surface 12 and the second surface 22 can be fully utilized for the circuit layout.

In addition, in an embodiment, the first surface 12 of the first substrate 10 has an area greater than or equal to 900 square centimeters, and the second surface 22 of the second substrate 20 has an area greater than or equal to 900 square centimeters. The area of the first substrate 10 and the second substrate 20 may be composed of any combination of aspect ratios, for example, a length of 30 cm ́30 cm, or 20 cm ́45 cm, or It is a combination of 35 cm ́35 cm, but not limited to this. Among them, the advantages of the above design include: suitable for use in high-end detectors, and can meet the requirements of high test channel (Test Channels).

In addition, in an embodiment, a reinforcing ring 8 can be added on the other side of the modular circuit board 10. For example, the reinforcing ring 8 is disposed on the upper surface of the first substrate 10, and the reinforcing ring 8 can be modularized. The circuit board 10 is subjected to external force tolerance to prevent it from being deformed by an external force.

Therefore, the modular circuit board 100 of the present invention has a gap 40 between the first substrate 10 and the second substrate 20, which can facilitate the removal of moisture and heat dissipation. Further, the gap 40 is also available. An electronic component such as an inductive component or a capacitive component is disposed to increase an available area of the circuit board. Further, since the line between the first substrate 10 and the second substrate 20 is electrically connected through the conductor 32 of the interposer 30 Therefore, in practice, according to the stacking manner of the first substrate 10 and the second substrate 20, please be provided with a conductive pad on the surface facing the two adjacent substrates 110 as shown in FIG. The chip 120 is provided with an interposer between the two adjacent substrates, and the electrical connection between the adjacent substrates is realized by the electrical conductors 130 of the interposer, thereby stacking the plurality of modular circuit boards 100'. The circuit board of the probe card of the present invention does not need to be pressed and then subjected to a re-drilling process, thereby realizing high-level substrate stacking and high. The advantage of depth ratio.

Referring to FIG. 4, a modular circuit board 200 according to a second embodiment of the present invention is substantially the same as the modular circuit board 100 of the first embodiment, and is equally applicable to the probe card 7. In particular, the interposer 30 of the modular circuit board 200 of the second embodiment further includes an insulating support layer 34, which is made of an insulating material, for example, the insulating support layer 34 can be It is made of, but not limited to, an insulating sheet, an insulating rubber, an insulating resin, or a polymer such as polyimide (PI), polyethylene, or polyester. The upper and lower sides of the insulating support layer 34 are respectively Abutting on the first surface 12 of the first substrate 10 and the second surface 22 of the second substrate 20, the effect of supporting between the first substrate 10 and the second substrate 20 can be achieved. In addition, the insulating support layer 34 has a plurality of through holes 34a for receiving the electrical conductors 32, respectively. In addition, the insulating support layer 34 may also be provided with at least one hollowed out area 34b. For example, in the embodiment, a plurality of hollowed out areas 34b are provided, wherein the hollowed out area 34b is provided for the circulation of air to help heat escape and water. Exclusion of gas. Wherein, regarding the relationship between the cross-sectional area of the hollow region 34b and the area of the first surface 12 of the first substrate 10 and the area of the second surface 22 of the second substrate 20, preferably, a combination of the following relationship may be adopted, the first The surface 12 corresponds to at least one hollow area 34b occupying more than 10% of the area of the first surface 12; the second surface 22 corresponds to at least one hollow area 34b occupying more than 10% of the area of the second surface 22. Therefore, in addition to facilitating water vapor discharge and heat dissipation, the first surface 12 and the second surface 22 corresponding to the hollow portion 34b can also provide space for other electronic components to be provided to enhance the space of the modular circuit board. use. In addition, in an embodiment, the hollowed out area may also be formed by a plurality of hollowed out portions, and is not limited to the above description.

Referring to FIG. 5, a modular circuit board 300 according to a third embodiment of the present invention is substantially the same as the modular circuit board of the foregoing embodiment, and in particular, the interposer 30 includes a conductive layer 36. The conductive layer 36 has a third surface 36a facing the first substrate 10 opposite to the first surface 10, and the fourth surface 36b faces the second substrate 20, the conductive layer 36 has a plurality of conduction paths 36c. A portion of the electrical conductors 32 are disposed between the first substrate 10 and the conductive layer 36, and are electrically connected to the first conductive pads 14 and the conductive paths 36c, respectively. The other portion of the electrical conductors 32 are disposed on the second substrate 20 The second conductive pads 24 and the conductive paths 36c are electrically connected to the conductive layer 36. In one embodiment, the conductive layer 36 may be, but not limited to, a carrier (such as MLO, MLC, etc.) or an anisotropic conductive paste or the like, and the conductive paths 36c are disposed in a vertical direction. In the embodiment, the conductive layer 36 is exemplified by a carrier plate, and the conductive vias penetrating the third surface 36a and the fourth surface 36b of the carrier plate constitute the conduction path 36c, and are in the conductive via hole. The two ends are respectively provided with conductive pads for electrically connecting with the electrical conductors 32.

In addition, in this embodiment, an insulating support layer may be disposed between the substrate and the conductive layer. For example, the interposer 30 further includes a first insulating support layer 38 and a second insulating support layer 39. The first insulating support layer 38 is disposed on the first substrate 10 conductive layer 36 and respectively abuts the first surface 12 of the first substrate 10 and the third surface 36a of the conductive layer 36, and the first insulation The support layer 38 has a plurality of through holes 38a for accommodating the electrical conductors 32. The second insulating support layer 39 is located between the second substrate 20 and the conductive layer 36, and respectively abuts the second substrate 20. The second surface 22 and the fourth surface 36b of the conductive layer 36, and the second insulating support layer 39 has a plurality of through holes 39a for accommodating the other portions of the electrical conductors 32. In addition, similar to the foregoing embodiment, the first insulating support layer 38 may further be provided with at least one hollow portion 38b, and the second insulating support layer 39 may be provided with at least one hollow portion 39b for water vapor discharge and heat dissipation. In addition, the conductive layer 36 may be provided with at least one hollow portion 36d corresponding to the hollow portions 38b and 39b to form an exhaust and a heat dissipation channel. In addition, in an embodiment, the conductive layer 36 is not limited to a whole carrier or an anisotropic conductive adhesive. In practice, the carrier layer and/or the anisotropic conductive adhesive may be used together. The conductive layer 36 is formed.

Referring to FIG. 6 to FIG. 8 , a modular circuit board 400 according to a fourth embodiment of the present invention is substantially the same as the modular circuit board 300 of the third embodiment, and particularly includes at least An electronic component 50 is disposed between the first substrate 10 and the conductive layer 36 and electrically connected to the conduction path of the first conductive line or the conductive layer of the first substrate 10 or the second substrate 20 and the conductive layer 36. And electrically connected to the conductive path of the second conductive line or the conductive layer 36 of the second substrate 20; for example, it may be disposed on a surface of the first substrate 10 and the conductive layer 36 facing each other, or may be disposed On the surface of the second substrate 20 and the conductive layer 36 facing each other; in addition, the electronic component 50 may be disposed on at least one of the third surface 36a and the fourth surface 36b of the conductive layer 36, and the conductive layer The conductive paths 36c of the 36 are electrically connected. Preferably, the recess 36e is recessed on the third surface 36a or the fourth surface 36b, and the electronic component 50 is disposed in the recess 36e. For example, in the embodiment, the electronic component 50 is disposed in the recess 36e on the third surface 36a of the conductive layer 36, and is electrically connected to the conductive path 36c of the conductive layer 36. The electronic component 50 can be an inductive component or a capacitive component, but it is not limited thereto. In practice, it can be used in combination with other types of electronic components according to application requirements.

Therefore, through the above design, more available space can be provided between the first substrate 10 and the conduction layer 36 and between the second substrate 20 and the conduction layer 36, so that the user can expand and set more electronic components. It can improve board space utilization and high electronic component density configuration. In addition, the gap between the first substrate 10 and the second substrate 20 is also effective for dissipating heat and discharging moisture.

The modular circuit boards provided by the present invention can be stacked on each other. For example, as shown in FIG. 9, the modular circuit board 100 of the first embodiment and the modular circuit of the second embodiment are shown. The circuit board of the board 200 and the modular circuit board 400 of the fourth embodiment are stacked, and the substrates of the adjacent circuit boards are electrically connected through the interposer, and by the logic of the stack, the user can Test requirements, electrical considerations, etc., freely choose the required number of stacked layers and circuit layout.

In addition, as shown in FIG. 10 , a schematic diagram of a modular circuit board 500 according to an embodiment of the present invention is formed by stacking a plurality of substrates including two first substrates 510 and two second substrates 520 . A gap is left between the adjacent first substrate 510 and the second substrate 520, and an interposer 530 is disposed in each of the gaps for electrically connecting the adjacent first substrate 510 and the second substrate 520. Conductive line. The architectures of the first substrate 510, the second substrate 520, and the interposer 530 are as described in the foregoing embodiments, and are not described herein again. In particular, in the embodiment, the first substrate 510 and the second substrate 520 are processed by a plurality of layers of sheet materials, and the wires of the first substrate 510 and the second substrate 520 are interposed. After the connection of the layer 530, a plurality of signal paths P1 to P4 can be formed. The signal paths P1 to P4 can be designed according to requirements, but are not limited to a test signal transmission path or a power signal transmission path. In addition, with the above design, the composition of each signal path P1~P4 can be pre-split in each substrate, which can help to form a shunt architecture for the test signal path and the power signal path, for example, the signal path P1, P2 is used as The power signal path is used, and the signal paths P3 and P4 are used as test signal paths.

It is to be noted that, since the substrates are electrically connected through the interposer 530, it is not necessary to perform re-drilling after the substrates are pressed together as in the prior art. Electrically connected, therefore, the modular circuit board 500 of the present embodiment does not have excess via stubs VS1~6 (as indicated by the dotted line) in each signal path P1~P4, so it can be helpful. The reduction in the effect of the stub hole.

In addition, by the above modular design, each substrate in the present invention can also be separately manufactured by different board manufacturers, and finally assembled into a modular circuit board through the interposer, thereby dispersing the production risk of the substrate. And it is advantageous for modular mass production; for example, the circuit board made by re-drilling after stacking the substrate is used. If the re-drilling fails, the entire set of circuit boards needs to be scrapped, and the invention is processed on the process. First, the quality control of each substrate can be performed first, and the defective substrate is replaced in advance, and then the substrates are stacked by using the interposer, thereby reducing the occurrence of batch scraping of the circuit board and helping to reduce production. cost.

In addition, the modular circuit board of the present invention can perform substrate stacking of any number of layers, and is not limited by the general drilling depth ratio. For example, if the first substrate 510 and the second substrate 520 are both layers 30 layers After the substrate board 500 is stacked by the two first substrate 510 and the second substrate 520, the circuit board structure with a high equivalent aspect ratio of up to 120 layers can be easily realized.

The above is only a preferred embodiment of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

1‧‧‧Detector

2‧‧‧ boards

3‧‧‧ Carrier Board

3a‧‧‧Signal conductor

4‧‧‧ needle seat

5‧‧‧ probe

6‧‧‧Electronic objects to be tested

[this invention]

8‧‧‧ reinforcing circle

100‧‧‧Modified circuit board

10‧‧‧First substrate

12‧‧‧ first surface

14‧‧‧First conductive gasket

16‧‧‧First conductive line

20‧‧‧second substrate

22‧‧‧ second surface

24‧‧‧Second conductive gasket

26‧‧‧Second conductive line

30‧‧‧Intermediary

32‧‧‧Electrical conductor

34‧‧‧Insulating support layer

34a‧‧‧Perforation

34b‧‧‧Breakspace

36‧‧‧ conduction layer

36a‧‧‧ third surface

36b‧‧‧Fourth surface

36c‧‧‧ conduction path

36d‧‧‧镂空部

36e‧‧‧ Groove

38‧‧‧First insulating support layer

38a‧‧‧Perforation

38b‧‧‧Focus Department

39‧‧‧Second insulating support layer

39a‧‧‧Perforation

39b‧‧‧Focus Department

40‧‧‧ gap

50‧‧‧Electronic components

100'‧‧‧Modular Board

110‧‧‧Substrate

120‧‧‧conductive gasket

130‧‧‧Electrical conductor

500‧‧‧Modular board

510‧‧‧First substrate

520‧‧‧second substrate

530‧‧‧Intermediary

P1, P3, P3, P4‧‧‧ signal path

VS1, VS2, VS3, VS4, VS5, VS6‧‧‧through hole stub

Figure 1 is a schematic illustration of a conventional probe testing system. 2 is a schematic view of a probe card according to a first embodiment of the present invention. FIG. 3 is a schematic diagram of a multi-layer stacking of a modular circuit board according to an embodiment of the invention. 4 is a schematic diagram of a modular circuit board according to a second embodiment of the present invention. FIG. 5 is a schematic diagram of a modular circuit board according to a third embodiment of the present invention. FIG. 6 is a schematic diagram of a modular circuit board according to a fourth embodiment of the present invention. Fig. 7 is a perspective view showing the application of the modular circuit board of the fourth embodiment. Figure 8 is a cross-sectional exploded view of a modular circuit board to which the fourth embodiment is applied. FIG. 9 is a schematic diagram of high-level number stacking by using the modular circuit board of the present invention. FIG. 10 is a schematic diagram of a modular circuit board according to an embodiment of the invention.

Claims (11)

A probe card for transmitting a signal of a detecting machine to an electronic object to be tested, comprising: a modular circuit board, comprising: a first substrate having a first surface, the first a plurality of first conductive pads are disposed on the surface, and the first substrate has a plurality of first conductive lines, one end of which is electrically connected to the detecting, and the other end is electrically connected to the first conductive pads respectively; The second substrate has a second surface facing the first surface and having a gap with the first surface, and the second surface is provided with a plurality of second conductive pads. The second substrate has a plurality of second conductive lines, one end of which is electrically connected to the second conductive pads, and an interposer disposed between the first substrate and the second substrate. The interposer includes a plurality of electrical conductors electrically connected to the first conductive pads and the second conductive pads respectively; a plurality of probes, one end of the probes and the second The other end of the conductive line is electrically connected, Each end for contact with the DUT object. The probe card of claim 1, wherein the gap has a vertical height of 10 μm or more. The probe card of claim 1, wherein the interposer includes an insulating support layer that abuts the first surface of the first substrate and the second surface of the second substrate, respectively, and The insulating support layer has a plurality of through holes, and the through holes respectively accommodate the electrical conductors. The probe card of claim 1, wherein the interposer comprises a conductive layer, the conductive layer has a third surface opposite to the fourth surface, the third surface facing the first substrate, the third surface The fourth surface faces the second substrate, the conductive layer has a plurality of conductive paths; a part of the electrical conductors are located between the first substrate and the conductive layer, and electrically connected to the first conductive pads and the The conductive paths are located between the second substrate and the conductive layer, and are electrically connected to the second conductive pads and the conductive paths. The probe card of claim 4, wherein the interposer comprises a first insulating support layer and a second insulating support layer, the first insulating support layer being located between the first substrate and the conductive layer, and respectively Abutting the first surface of the first substrate and the third surface of the conductive layer, and the first insulating support layer has a plurality of through holes for accommodating the electrical conductors; the second insulating support layer is located at the third surface Between the second substrate and the conductive layer, and respectively abut the second surface of the second substrate and the fourth surface of the conductive layer, and the second insulating support layer has a plurality of perforations for accommodating another portion The electrical conductors. The probe card of claim 4, comprising at least one electronic component disposed on at least one of the third surface and the fourth surface of the conductive layer, and the at least one electronic component and the conductive layer The conduction paths are electrically connected. The probe card of claim 6, wherein at least one of the third surface and the fourth surface is recessed to form a recess, and the at least one electronic component is disposed in the recess. The probe card of claim 1, wherein the first surface has an area of X and the second surface has an area Y, which satisfies the following condition: 0.7≦ ≦1.0; or 0.7≦ ≦ 1.0. The probe card of claim 3, wherein the insulating support layer has at least one hollowed out region, the first surface corresponding to at least one hollowed out area occupying more than 10% of an area of the first surface; the second surface The area corresponding to at least one hollow area accounts for more than 10% of the area of the second surface. The probe card of claim 1, wherein an area of the first surface of the first substrate and an area of the second surface of the second substrate are both greater than or equal to 900 square centimeters. The probe card of claim 1 includes a carrier board having a plurality of signal conductors for electrically connecting to the second conductive lines and the probes, respectively.