JP2014089199A - Radioactive ray detection sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radioactive ray detection sensor having a radioactive ray detection pattern and performing a part of signal processing.SOLUTION: The radioactive ray detection sensor comprises: a first wiring layer including grid-like anode electrode patterns, and cathode electrode patterns each surrounding each anode electrode pattern and patterned so as to be the same node in a row direction; a first vertical conductive path group in contact with the anode electrode pattern and penetrating through a first insulator layer; a second wiring layer causing the anode electrode pattern to be the same node in a column direction below the first insulator layer; a first flexible circuit board providing electrical conduction for each row of the cathode electrode patterns; a second vertical conductive path group in contact with each of independent patterns of the second wiring layer and penetrating through the first insulator layer; a relay wiring group each relay wiring of which is in contact with each conductive path of the second vertical conductive path group and which is provided on the first insulator layer; a second flexible circuit board providing electrical conduction with each relay wiring of the relay wiring group; a third wiring layer connected to the other side of the first flexible circuit board and to the other side of the second flexible circuit board, and including a component mounting land; and a signal processing IC mounted on the component mounting land.

Description

  The present invention relates to a radiation detection sensor having a plurality of cells of an anode electrode and a cathode electrode in a two-dimensional arrangement on a substrate (insulating layer), and more particularly to a radiation detection sensor including a signal processing circuit.

  In order to detect the incident position of radiation, there is a radiation detection device of a type that detects a leakage current generated by exciting gas particles by incident radiation. In such a radiation detection apparatus, a radiation detection panel having a plurality of cells of an anode electrode and a cathode electrode in a two-dimensional arrangement on a substrate is used as a device body for radiation detection.

  The anode electrode is a pattern in which fine circular patterns are arranged in a grid, and a plurality of anode electrode wirings for electrical conduction are arranged for each row (each column). The cathode electrode is a conductor pattern that surrounds each anode electrode at an approximately equal distance from each other, and is a pattern that is electrically connected to each column (row). Due to such vertical and horizontal electrical arrangement of the anode electrode and the cathode electrode, when a current flows between the anode electrode and the cathode electrode of any cell, this can be detected and the radiation incident position can be specified.

  The electrical signal from the substrate constituting the radiation detection panel is then subjected to signal processing. Physically, the number of wirings from the board increases as many as the number of cells, and a dedicated area that is not narrow is required on the board to secure an area for providing connectors to be sent to the signal processing unit. Become. This dedicated area naturally becomes an area where radiation cannot be detected, which hinders the compactness of the detection panel.

  One example of the radiation detector and its signal processing is disclosed in Patent Document 1 below. In this disclosure, a path of an output signal from a sensor unit (radiation detection device body) is provided so as to be drawn out from the sensor unit. Therefore, it is considered that a dedicated area with a certain area is required on the substrate in order to secure an area for providing a connector to be sent to the signal processing section in the sensor section.

JP 2002-62360 A (FIG. 1)

  The present invention has been made in consideration of the above-described circumstances. In a radiation detection sensor having a plurality of cells of an anode electrode and a cathode electrode in a two-dimensional arrangement on a substrate (insulating layer), the radiation detection sensor has a compact configuration and can detect radiation. An object of the present invention is to provide a radiation detection sensor capable of performing a process from the presence of a conductor pattern to a part of signal processing.

  In order to solve the above-described problems, a radiation detection sensor according to one embodiment of the present invention includes an anode electrode pattern that is substantially circular and arranged in a grid; and is spaced apart from each of the anode electrode patterns at an approximately equal distance. A cathode electrode pattern that surrounds the anode electrode pattern and is patterned so as to be the same electrical node in the row direction; and under the first wiring layer A first insulating layer positioned on the side, a first vertical conductive path group provided in contact with each of the anode electrode patterns and penetrating the first insulating layer, and a first insulating layer The first pattern is arranged so as to be located on the lower side, in contact with each of the first vertical conductive path groups, and in the column direction of the anode electrode pattern to be the same electrical node. A wiring layer; a second insulating layer located below the second wiring layer; and a solder connection so as to establish electrical continuity with each row of the cathode electrode pattern. A first flexible circuit board having a conductive pattern that is electrically conductive to each of the first flexible circuit board and an electrically independent pattern of the second wiring layer are provided to penetrate through the first insulating layer. Two vertical conductive path groups, and a relay wiring group provided in parallel with the first wiring layer on the first insulating layer in contact with each of the second vertical conductive path groups, A second flexible circuit board having a conductive pattern electrically connected to each of the relay wiring groups, which is solder-connected to each of the relay wiring groups, and under the second insulating layer; Located in the first frame A kibble circuit board is soldered to provide electrical continuity to each of the conductive patterns of the first flexible circuit board, and the second flexible circuit board is soldered to the second flexible circuit board. Each of the conductive patterns includes a third wiring layer that is electrically conductive and includes a component mounting land, and a signal processing IC mounted on the component mounting land of the third wiring layer. It is characterized by.

  That is, this radiation detection sensor is characterized in that the anode electrode pattern and the cathode electrode pattern are provided by the first wiring layer provided on the first insulating layer. Have. The cathode electrode pattern can be electrically connected to the third wiring layer through the first flexible circuit board. On the other hand, from the anode electrode pattern, the first vertical conductive path group penetrating the first insulating layer, the second wiring layer, the second vertical conductive path group penetrating the first insulating layer, the first Electrical connection can be made to the third wiring layer through the relay wiring on the insulating layer and the second flexible circuit board. A component mounting land is provided on the third wiring layer, and a signal processing IC is mounted on the mounting land.

  Therefore, in the first wiring layer, although the relay wiring is provided, it is only necessary to prepare an area to which the first and second flexible circuit boards are connected, and other configurations (for example, bonding wires and wirings therefrom) And a connector, and further, a configuration for performing a relay function for connection to a processing circuit). The area where the flexible circuit board is connected may be small, and since it is highly flexible, the minimum required area in space is sufficient. Further, since the third wiring layer is a wiring layer different from the first wiring layer, the third wiring layer can be positioned so as to overlap with the first wiring layer, and the radiation from the first wiring layer is detected. Does not affect area allocation. Therefore, as a radiation detection sensor, it is possible to handle from the provision of conductor patterns such as an anode electrode pattern and a cathode electrode pattern, which detect radiation, to a part of signal processing with a compact configuration.

  According to the present invention, in a radiation detection sensor having a plurality of cells of an anode electrode and a cathode electrode in a two-dimensional arrangement on a substrate (insulating layer), an anode electrode pattern, a cathode electrode pattern, etc. that detect radiation with a compact configuration From the presence of the conductor pattern to a part of the signal processing.

Regardless of the description below, the embodiment described with reference to FIGS. 1 to 4 is a reference embodiment. However, it includes matters to be referred to as embodiments of the invention.
The top view and sectional view which show typically the composition of the radiation detection sensor concerning one embodiment of the present invention. Process drawing which shows the manufacturing process of the radiation detection sensor shown in FIG. Sectional drawing which shows typically the structure of the radiation detection sensor which concerns on another embodiment of this invention. FIG. 4 is a process diagram schematically showing a part of a manufacturing process of the radiation detection sensor shown in FIG. The top view and sectional drawing which show typically the structure of the radiation detection sensor which concerns on another embodiment of this invention.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view and a cross-sectional view schematically showing a configuration of a radiation detection sensor according to one embodiment of the present invention. A cross section in the direction of the arrow at the position A-Aa shown in FIG. 1A corresponds to FIG. In FIG. 1A, for the sake of simplification of display, the configuration far from the top surface is omitted as appropriate.

  As shown in FIG. 1, the radiation detection sensor includes an insulating layer (first insulating layer) 10, an insulating layer 50, an insulating layer 60 (insulating layers 50 and 60 being a second insulating layer), a cathode electrode pattern 11, Anode electrode pattern 12 (cathode electrode pattern 11, first wiring layer with anode electrode pattern 12), vertical conductive path (plating via; first vertical conductive path) 12a, wiring layer (second wiring layer; anode) (Wiring pattern) 13, plating via 21, relay wiring 31, relay wiring 61, interlayer connection body 41, plating via 62 (plating via 21, relay wiring 31, relay wiring 61, interlayer connection body 41, plating via 62, the second A vertical conductive path), a wiring layer 63 (third wiring layer), a signal processing IC 71, a gold bump 72, an underfill resin 73, and an interlayer connector 42 (a part of the third vertical conductive path).

  Similar to the interlayer connector 41, the interlayer connector 42 is provided so as to penetrate the insulating layer 50. Each of the interlayer connectors 42 is connected to each of the anode wiring patterns 13, and is further connected to the relay wiring 61 in the same layer as the relay wiring 61. As in the case of the plating via 62, the wiring layer 63 is electrically connected through a plating via (not shown) provided through the insulating layer 60. The interlayer connector 42, the relay wiring (not shown), and the plating via (not shown) constitute a third vertical conductive path.

  Each of the anode electrode patterns 12 is a substantially circular metal pattern that is exposed on one surface of the insulating layer 10 and arranged in a grid. The diameter of each is 50 micrometers-80 micrometers, for example, and is arrange | positioned by the pitch of 400 micrometers each vertically and horizontally. There are, for example, a little less than about 600,000 (for example, 768 vertical x 768 horizontal) in an area of 30 cm × 30 cm as a whole.

  The cathode electrode pattern 11 is a layer that is formed in a pattern that is exposed on one side of the insulating layer 10 and that surrounds each anode electrode pattern 12 while being spaced apart from each anode electrode pattern 12 at substantially equal intervals. The surrounding diameter is, for example, 250 μm, and is a continuous pattern in the horizontal direction of each row in the illustration of FIG. The cathode electrode pattern 11 in each row is electrically connected to the wiring layer 63 through the plating via 21, the relay wiring 31, the interlayer connection body 41, the relay wiring 61, and the plating via 62. Corresponding to each anode electrode pattern 12, it and the cathode electrode pattern 11 constitute a detection cell.

  The insulating layer 10 has a cathode electrode pattern 11 on its surface and an anode electrode pattern 12 exposed, and has a layer having an anode wiring pattern 13 and a relay wiring 31 on its back surface. 60 μm. A plating via 21 and a plating via 12a are provided in the penetration direction of the insulating layer 10. The plating vias 21 are formed in one row in the vertical direction of FIG. 1A so as to be connected corresponding to each of the cathode electrode patterns 11. The material of the insulating layer 10 is, for example, polyimide.

  The insulating layer 60 has a wiring layer 63 on its front surface, and has a relay wiring (not shown) for the relay wiring 61 and the anode wiring pattern 13 (= for each interlayer connector 42) on its back surface. The thickness is, for example, 60 μm. In the penetration direction of the insulating layer 60, there are a plating via 62 and a plating via (not shown) for each anode wiring pattern 13 (= for each interlayer connector 42). The material of the insulating layer 60 is, for example, polyimide.

  The insulating layer 50 is an insulating layer provided between the insulating layer 10 and the insulating layer 60 having the above-described configuration, and the patterns on the back side of the insulating layers 10 and 60 are vertically connected by the interlayer connectors 41 and 42. It has a spacing function necessary for electrical connection in the direction. The thickness of the insulating layer 50 is, for example, 10 μm to 50 μm, and the material thereof is, for example, polyimide. Each of the interlayer connectors 41 and 42 is derived from a conductive bump formed by screen printing of a conductive paste. Depending on the manufacturing process, the interlayer connectors 41 and 42 are vertically (in the illustration of FIG. 1B, up and down). The diameter changes in the direction of stacking. The diameter is, for example, 50 μm on the thick side.

  The anode electrode pattern 12 is electrically connected to a vertical conductive path 12 a that is a plating via formed through the insulating layer 10. The vertical conductive path 12 a is an anode wiring pattern on the back side of the insulating layer 10. 13 is electrically connected. With the anode wiring pattern 13, the vertical conductive paths 12 a are electrically connected so that the vertical direction (each column) in FIG. 1A is the same electrical node. The width of the anode wiring pattern 13 is, for example, 300 μm.

  The anode wiring pattern 13 in each column is connected to a wiring layer via an interlayer connector 42, a relay wiring (not shown) (the same layer as the relay wiring 61), and a plating via (not shown) penetrating the insulating layer 60 as with the plating via 62). 63 is electrically connected. The interlayer connector 42, the relay wiring (not shown), and the plating via (not shown) are each formed in one row in the horizontal direction of FIG.

  The wiring layer 63 is a wiring layer provided on the main surface of the insulating layer 60 on the side opposite to the insulating layer 50 side, and as described above, the cathode of each row via the second vertical conductive path. Electrical connection from the electrode pattern 11 and electrical connection from the anode wiring pattern 13 in each column via the third vertical conductive path are provided. The wiring layer 63 further includes a component mounting land for mounting the signal processing IC 71 as shown in the figure, and the IC 71 thereby electrically connects the cathode electrode pattern 11 in each row and the anode wiring pattern 13 in each column. Connection is made.

  As shown, the IC 71 is electrically flip-connected on the wiring layer 63 via the gold bump 72 (and mechanically on the insulating layer 60 via the underfill resin 73). However, the present invention is not limited to this, and other general mounting methods may be used. For example, a surface mount type package product (BGA or LGA) may be used.

  The IC 71 has a function of detecting a leakage current between the anode and the cathode while removing noise, amplifying a signal obtained by the detection, and generating a position detection signal in which the leakage current is generated based on the result. Finally, an output signal that is a digital signal is generated. The input side of the IC 71 is, for example, 768 × 2 analog signals, but the output side is, for example, 33 digital signals. Of course, the IC 71 may be a combination of a plurality of ICs by function. Even in that case, they can be provided side by side on the wiring layer 63.

  As described above, this radiation detection sensor is characterized in that the anode electrode pattern 12 and the cathode electrode pattern 11 are provided by the wiring layer provided on the insulating layer 10. have. From the anode electrode pattern 12, a longitudinal conductive path 12 a that penetrates the insulating layer 10, a wiring layer 13, an interlayer connector 42 that penetrates the insulating layer 50, a relay wiring (not shown), and a plating (not shown) that penetrates the insulating layer 60. Electrical conduction can be made to the wiring layer 63 via the via.

  On the other hand, from the cathode electrode pattern 11, the plating via 21, the relay wiring 31, the interlayer connection body 41, the relay wiring 61, and the plating via 62, which are longitudinal conductive paths penetrating the insulating layers 10, 50, 60, are provided. Thus, electrical conduction can be made to the wiring layer 63. The wiring layer 63 is provided with a component mounting land, and a signal processing IC 71 is mounted on the mounting land.

  An area provided with a vertical conductive path for the cathode electrode pattern 11 and a vertical conductive path for the anode wiring pattern 13 is required in the outer area of the pattern for detecting radiation, but the required area is a very small area. Just do it. Even if the area occupied by the insulating layer 10 is largely estimated, a width area of about 2 mm to 3 mm, for example, may be secured at the edge. For example, this is a great difference compared to a case where a bonding wire, a wiring and connector from the bonding wire, a configuration for performing a relay function for connection to a processing circuit, and the like are provided.

  Further, since the wiring layer 63 on the back surface is a wiring layer different from the wiring layer on the front surface, it can be positioned so as to overlap with the wiring layer on the front surface, and a region for detecting radiation by the wiring layer on the front surface can be secured. Has no effect. Therefore, as a radiation detection sensor, it is possible to handle from the presence of a conductor pattern for detecting radiation to a part of signal processing with a compact configuration. Furthermore, if the radiation detection sensor shown in FIG. 1 is used, a plurality of radiation detection sensors are arranged so as to be spread vertically and horizontally, so that radiation detection of a large area with a very small undetectable region becomes possible. In addition, since part of the signal processing is close to the radiation detection region, the influence of noise is small and high-quality processing is possible, and high-speed processing and cost reduction can be expected as a whole.

  The operation as a radiation detection sensor will be briefly described below. A voltage is applied between the anode electrode pattern 12 and the cathode electrode pattern 11, and in this state, radiation is incident on the atmosphere. Thus, when gas particle excitation occurs, a leakage current flows between the nearby anode electrode pattern 12 and the cathode electrode pattern 11. The radiation incident position is detected based on the horizontal position of the anode electrode pattern 12 and the vertical position of the cathode electrode pattern 11 where the leakage current is generated.

  Next, a method for manufacturing the radiation detection sensor shown in FIG. 1 will be described with reference to FIG. FIG. 2 is a process diagram schematically showing a cross section of the manufacturing process of the radiation detection sensor shown in FIG. 1, and is a diagram corresponding to FIG. 1 (b). In FIG. 2, the same or equivalent parts as those shown in FIG.

  First, as shown in FIG. 2A, an insulating layer 10 (made of polyimide) having a thickness of, for example, 60 μm, in which copper foils 11A and 13A (both of which are, for example, 18 μm) are laminated on both main surfaces, is prepared. Through this, a laser processed hole 12h (diameter, for example, 50 μm to 80 μm) is formed. The laser processed hole 12h includes a through hole for vertical conductive path of the anode electrode pattern 12 (vertical and horizontal arrangement) and a through hole for vertical conductive path of the cathode electrode pattern 11 (one line arrangement).

  The thickness of the insulating layer 60 has a problem with the noise level generated by coupling (interference) between the cathode electrode pattern 11 processed and formed from the copper foil 11A and the anode wiring pattern 13 processed and formed from the copper foil 13A. It is set to a certain thickness as a thickness that does not occur. If a laser is used for processing the hole 12h, the position and processing accuracy can be improved. On the other hand, since the laser processing is performed so that the diameter gradually decreases in the depth direction, the thickness of the insulating layer 60 is made too thick as a hole for forming the plated vias 12a and 21 having good shapes. That is not preferable. Here, the thickness of the insulating layer 60 is set to 60 μm, and both reduction in noise level and formation of the plated vias 12a and 21 having good shapes are achieved.

  Next, as shown in FIG. 2B, a copper plating process is performed so as to fill the inside of the laser processed hole 12h, thereby forming plating vias 21 and 12a. This copper plating can be efficiently formed by first forming a seed layer on the inner wall surface of the laser processed hole 12h by electroless plating and then growing the plating layer on the seed layer by electrolytic plating. it can.

  Next, as shown in FIG. 2C, the copper foils 11A and 13A on both main surfaces are patterned by, for example, a well-known photolithography process, and the copper foil 11A is formed into a cathode electrode pattern 11 and an anode electrode pattern 12. The copper foil 13A is processed into the anode wiring pattern 13 and the relay wiring 31, respectively. The member shown in FIG. 2C obtained as a result is one laminated member used in the following lamination process in FIG.

  Next, three laminated members are laminated and integrated in an arrangement as shown in FIG. The member arranged at the top is the member shown in FIG. The lowermost member is formed by a process similar to the process described in FIGS. 2A to 2C except for the conductive bump 41A. More specifically, a relay wiring 61 and a relay wiring (not shown) are formed in place of the cathode electrode pattern 11 and the anode electrode pattern 12, and a plating via 62 and a not shown are replaced in place of the plating vias 21 and 12a. Are formed, and the wiring layer 63 is formed in place of the anode wiring pattern 13 and the relay wiring 31.

  The conductive bump 41A formed on the relay wiring 61 is formed in a substantially conical shape by using a paste-like conductive composition, for example, by screen printing, and has a bottom surface diameter of, for example, 50 μm and a height of insulation. The thickness is, for example, about 15 μm to 75 μm depending on the thickness of the layer 50A. This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin. After the conductive bump 41A is printed, it is dried and cured. Such conductive bumps can be provided at a high density in a small region, and can cope with a reduction in area of each cell of the radiation detection sensor in order to increase detection resolution.

  Although not shown, when screen printing is performed to form the conductive bumps 41A on the relay wiring 61, the conductive bumps to be used as the interlayer connectors 42 for electrical connection with each cathode wiring pattern 13 are not used. It can be simultaneously formed on the illustrated relay wiring (explained).

  The insulating layer 50A illustrated as an intermediate layer in FIG. 2D is an insulating layer that penetrates the conductive bump 41A and the conductive bump to be the interlayer connector 42. The thickness is, for example, 10 μm to 50 μm, and the material is, for example, polyimide.

  Each laminated member is pressurized and heated with a press in an arrangement as shown in FIG. Thereby, the insulating layer 50A becomes an adhesive layer, and the whole is laminated and integrated. At this time, the conductive bump 41A and a conductive bump (not shown) penetrate the insulating layer 50A, the relay wiring 31 is derived from the conductive bump 41A, and the anode wiring pattern 13 is coupled to the interlayer connection 42. And are electrically connected to each other.

  After that, although not shown, a radiation detection sensor as shown in FIG. 1 can be obtained by mounting a predetermined signal processing IC 71 on the wiring layer 63 by a predetermined mounting method. In this embodiment, the plating vias (not shown) penetrating the plating vias 21 and 62 and the insulating layer 60 can be formed as a part of each of the longitudinal conductive paths reaching the wiring layer 63 in a good shape. This is because the plating vias (not shown) penetrating the plating vias 21 and 62 and the insulating layer 60 are formed to penetrate the insulating layer 10 or 60 having a limited thickness. And in order to electrically connect the plating via 21 and 62, the interlayer connection body 41 derived from the conductive bump obtained by screen printing of the conductive paste is used as an auxiliary.

  Next, a radiation detection sensor according to another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing a configuration of a radiation detection sensor according to another embodiment. In FIG. 3, the same reference numerals are given to the same or equivalent components as those appearing in the already described drawings. The explanation of the portion is omitted unless there is a matter to be added. Since the plan view corresponding to FIG. 1A is the same, the illustration is omitted.

  In this embodiment, an anisotropic conductive film 80 is used in place of the intermediate insulating layer 50. By using the anisotropic conductive film 80, electrical connection is established between the relay wiring 31 and 61, and between the anode wiring pattern 13 and the relay wiring (not shown) on the insulating layer 60. Has been. An anisotropic conductive film has a structure in which conductive particles 81 are dispersed in a resin film. When sandwiched between convex conductors such as the relay wiring 31 and 61, the conductive film 81 The conductive particles 81 come into contact with the conductor, and the state is fixed by hardening of the resin to form an electrically conductive state.

  FIG. 4 is a process diagram schematically showing in cross section a part of the manufacturing process of the radiation detection sensor shown in FIG. 3, and shows the stage (stacking process) shown in FIG. In FIG. 4, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings.

  As shown in FIG. 4, it is not necessary to form bumps such as the conductive bumps 41A on the lower laminated member in the figure at this lamination stage. For example, instead of the polyimide insulating layer 50A, an anisotropic conductive film 80A is used as a laminated intermediate layer. Each laminated member is pressurized and heated with a press in an arrangement as shown in FIG. Thereby, the anisotropic conductive film 80A becomes an adhesive layer, and the whole is laminated and integrated. At this time, the relay wiring 31 is electrically connected to the relay wiring 61 and the anode wiring pattern 13 is electrically connected to the relay wiring (not shown) on the insulating layer 60 by the conductive particles contained in the anisotropic conductive film 80A. .

  Thereafter, although not shown, a radiation detection sensor as shown in FIG. 3 can be obtained by mounting a predetermined signal processing IC 71 on the wiring layer 63 by a predetermined mounting method. Also in this embodiment, the plating vias (not shown) penetrating the plating vias 21 and 62 and the insulating layer 60 can be formed as a part of each of the longitudinal conductive paths reaching the wiring layer 63. This is because the plating vias (not shown) penetrating the plating vias 21 and 62 and the insulating layer 60 are formed to penetrate the insulating layer 10 or 60 having a limited thickness. Then, in order to electrically connect the plating vias 21 and 62, an anisotropic conductive film 80 is used as an auxiliary.

  Next, a radiation detection sensor according to still another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a plan view and a cross-sectional view schematically showing a configuration of a radiation detection sensor according to still another embodiment. The cross section in the arrow direction at the position B-Ba shown in FIG. 5A corresponds to FIG. In FIG. 5A, for the sake of simplification of display, the configuration far from the top surface is omitted as appropriate.

  In this embodiment, a flexible circuit board 91 is used for electrical connection from the cathode electrode pattern 11 to the wiring layer 63 on the back surface, and an insulating layer is used for electrical connection from the anode wiring pattern 13 to the wiring layer 63. A flexible circuit board 92 is further used through a plated via 12b penetrating through 10 and a relay wiring 13b formed on the insulating layer. Other points are the same as those of the embodiment shown in FIG.

  That is, the insulating layer 10 has a cathode electrode pattern 11 and a relay wiring 13b on its surface, an anode electrode pattern 12 exposed, and a layer having the anode wiring pattern 13 on its back surface. Is, for example, 60 μm. In the penetration direction of the insulating layer 10, there are a plating via 12a and a plating via 12b. The plating vias 12b are vias arranged in one row so as to be connected to the anode electrode patterns 13 corresponding to the anode electrode patterns 13. The plating vias 12b are each connected to the relay wiring 13b.

  The flexible circuit board 91 is solder-connected to each of the cathode electrode patterns 11 (for each row) so as to be electrically connected (solder is not shown), and has a conductive pattern for electrically connecting each of the rows. Yes. The wiring layer 63 is electrically connected to each of the conductive patterns of the flexible circuit board 91 by connecting the flexible circuit board 91 with solder (solder is not shown). The flexible circuit board 91 is provided so as to cover and cover the edge of one side of the insulating layers 10, 50 and 60.

  The flexible circuit board 92 is solder-connected so as to be electrically connected to each of the relay wirings 13b (solder is not shown), and has a conductive pattern that electrically connects each of the relay wirings 13b. The wiring layer 63 is electrically connected to each conductive pattern of the flexible circuit board 92 by soldering the flexible circuit board 91 (solder is not shown). The flexible circuit board 92 is provided so as to surround and cover the edge of another side of the insulating layers 10, 50, 60 so as to be orthogonal to the flexible circuit board 91.

  This radiation detection sensor is characterized in that the anode electrode pattern 12 and the cathode electrode pattern 11 are provided by the wiring layer provided on the insulating layer 10, and first, the configuration of the conductive path therefrom. Electrical conduction can be achieved from the cathode electrode pattern 11 to the wiring layer 63 on the back surface through the flexible circuit board 91. On the other hand, from the anode electrode pattern 12, a vertical conductive path 12a that penetrates the insulating layer 10, an anode wiring pattern 13, a vertical conductive path 12b that penetrates the insulating layer 10, a relay wiring 13b on the insulating layer 10, a flexible circuit board Through 92, electrical conduction can be made to the wiring layer 63 on the back surface. The wiring layer 63 is provided with a component mounting land, and a signal processing IC 71 is mounted on the mounting land.

  An area outside the pattern for detecting radiation requires an area where the relay wiring 13b is provided and an area where the flexible circuit boards 91 and 92 are connected. However, the necessary area may be very small. Even if the area occupied by the insulating layer 10 is largely estimated, a width area of about 2 mm to 3 mm, for example, may be secured at the edge. For example, this is a great difference compared to a case where a bonding wire, a wiring and connector from the bonding wire, a configuration for performing a relay function for connection to a processing circuit, and the like are provided.

  To manufacture the radiation detection sensor shown in FIG. 5, three members, a laminated member centering on the insulating layer 10, an insulating layer 50 </ b> A (see FIG. 2D), and a laminated member centering on the insulating layer 60 are used. After lamination and integration, flexible circuit boards 91 and 92 are attached to the laminate with solder. Thereafter, a predetermined signal processing IC 71 may be mounted on the wiring layer 63 by a predetermined mounting method. The mounting of the signal processing IC and the mounting of the flexible circuit boards 91 and 92 can be reversed.

  DESCRIPTION OF SYMBOLS 10 ... Insulating layer (1st insulating layer), 11 ... Cathode electrode pattern, 11A ... Copper foil, 12 ... Anode electrode pattern, 12a ... Longitudinal direction conductive path (1st vertical direction conductive path; Plating via), 12b ... Vertical direction conductive path (plating via), 12h... Laser processing hole, 13... Wiring layer (second wiring layer; anode wiring pattern), 13A... Copper foil, 13b. 41 ... interlayer connection (derived from conductive bump obtained by screen printing of conductive paste), 41A ... conductive bump, 42 ... interlayer connection (conductivity obtained by screen printing of conductive paste) 50 ... Insulating layer (part of the second insulating layer), 50A ... Insulating layer before lamination, 60 ... Insulating layer (part of the second insulating layer), 61 ... Relay wiring, 62 ... Plating via, 63 ... Wiring (Third wiring layer), 71 ... signal processing IC, 72 ... gold bump, 73 ... underfill resin, 80 ... anisotropic conductive film (after curing), 80A ... anisotropic conductive film (before curing) 81 ... conductive particles, 91 ... flexible circuit board, 92 ... flexible circuit board.

Claims (1)

An anode electrode pattern, each of which is substantially circular and arranged in a grid; and surrounds the anode electrode pattern at an approximately equal distance from each of the anode electrode patterns, and the same electrical node in the row direction A first wiring layer having a cathode electrode pattern patterned to be
A first insulating layer located below the first wiring layer;
A first vertical conductive path group provided in contact with each of the anode electrode patterns and penetrating the first insulating layer;
Patterns are located below the first insulating layer, in contact with each of the first longitudinal conductive path groups, and in the column direction of the anode electrode pattern to be the same electrical node A second wiring layer,
A second insulating layer located below the second wiring layer;
A first flexible circuit board having a conductive pattern electrically connected to each row, wherein the first flexible circuit board is solder-connected to each row of the cathode electrode pattern;
A second vertical conductive path group provided in contact with each of the electrically independent patterns of the second wiring layer and penetrating the first insulating layer;
A relay wiring group provided in parallel with the first wiring layer on the first insulating layer in contact with each of the second vertical conductive path groups;
A second flexible circuit board having a conductive pattern electrically connected to each of the relay wiring groups, solder-connected to each of the relay wiring groups,
Located below the second insulating layer, the first flexible circuit board is solder-connected to electrically connect each of the conductive patterns of the first flexible circuit board, and the second A third wiring layer including a component mounting land, wherein the flexible circuit board is electrically connected to each of the conductive patterns of the second flexible circuit board by soldering,
And a signal processing IC mounted on the component mounting land of the third wiring layer.

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