CN109425813A - Detection device - Google Patents
Detection device Download PDFInfo
- Publication number
- CN109425813A CN109425813A CN201710750275.0A CN201710750275A CN109425813A CN 109425813 A CN109425813 A CN 109425813A CN 201710750275 A CN201710750275 A CN 201710750275A CN 109425813 A CN109425813 A CN 109425813A
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- Prior art keywords
- circuit board
- probe
- pressure
- detection device
- frame
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- 238000001514 detection method Methods 0.000 title claims abstract description 52
- 239000000523 sample Substances 0.000 claims abstract description 130
- 238000007689 inspection Methods 0.000 claims description 32
- 238000010276 construction Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a detection device which comprises a probe card and a press touch switch arranged on the probe card. The probe card comprises a circuit board, a frame arranged on the circuit board and a probe head arranged on the frame. The probe head comprises a plate-shaped unit and a plurality of probes. Each probe is electrically connected with the circuit board. The ends of the plurality of probes away from the circuit board are formed with a plurality of heights corresponding to the circuit board, respectively. The press-touch switch comprises a press-touch probe electrically connected with the circuit board. The press-contact probe has a distal end that is remote from the circuit board, and a maximum distance between the distal end of the press-contact probe and the circuit board is not greater than a minimum height of the plurality of heights. When the external component is pressed and touched on the tail ends of the probes and the tail ends of the probes, the pressure touch switch can trigger an alarm signal to stop the relative movement of the probe card and the external component, so that the risk of overpressure of the probe head is effectively reduced.
Description
Technical field
The present invention relates to a kind of detection device more particularly to a kind of detection devices with collision prevention function.
Background technique
Currently, in semiconductor processing, wafer process complete and before not yet carrying out cutting encapsulation, it is good in order to ensure wafer
Rate and the waste for avoiding structure from filling, it is necessary to the electrical testing for first carrying out wafer stage, by the probe in probe card directly and on wafer
Weld pad or convex block directly contact, draw wafer signal, then cooperate peripheral test instrument and software control reaches automatic measurement
Purpose.
The probe of existing probe card need to rely on the alignment that wafer probing machine (Prober) does needle position and height.It is operating
When, after needle pressure need to being set via operator, carry wafer carrying platform (Chuck) can and probe do precisely and critically
Contact.Since the stroke of probe and wafer contacts is very short (may there was only 30~80 μm), when wafer bestows the pressure of probe
Power has been more than the needle pressure limit (assuming that about 120 μm), will promote probe due to over-voltage by the risk of compression failure.Current wafer probing
Although machine has the function of setting the needle pressure limit, to prevent probe over-voltage, however only pass through the internal control of wafer probing machine
Mechanism, probe still suffer from easy over-voltage and the risk damaged.
It then, is the special utilization for concentrating on studies and cooperating the principles of science, finally inventors believe that drawbacks described above can improve
It is proposed that a kind of design is reasonable and is effectively improved the present invention of drawbacks described above.
Summary of the invention
The embodiment of the present invention is to provide a kind of detection device, can effectively improve existing probe card and carry out wafer probing
When institute issuable defect.
The embodiment of the present invention discloses a kind of detection device, including a probe card and a pressure touching switch, the probe card packet
It is set on the circuit board containing a circuit board, a frame (Jig) and a probe, the frame；The probe installation
In the frame, and the probe includes a plate-shaped unit and the multiple probes for being arranged in the plate-shaped unit；Wherein, often
A probe is electrically connected at the circuit board, and the end of multiple probes far from the circuit board corresponds respectively to
The circuit board is formed with multiple height, and the end of multiple probes is used to press touching in an external module；It is described
Pressure touching switch is removably installed in the probe card, and the pressure touching switch includes the pressure for being electrically connected at the circuit board
Feeler inspection needle, the pressure feeler inspection needle set have the end far from the circuit board, and one between the end and the circuit board
Maximum distance is no more than the minimum constructive height in multiple height, and a difference of the maximum distance and the minimum constructive height
Between 40 microns to 90 microns；Wherein, when the touching of external module pressure in the end of multiple probes and touches
When the end of the pressure feeler inspection needle, the pressure touching switch can trigger a restricted speed signal by the circuit board, to stop
State the relative movement of probe card Yu the external module.
Preferably, the frame is formed with an accommodating space, and the accommodating space is from far from the circuit board
The recessed formation of the frame surface institute, and pressure touching switch is set in the accommodating space of the frame.
Preferably, the frame is formed with multiple perforation, and each perforation is passed through with for a screw, the appearance
One of them described perforation of multiple perforation is connected between emptying, and pressure touching switch is formed with a matching hole, and
And the position of the matching hole corresponds to the perforation for being connected to the accommodating space.
Preferably, the pressure touching switch further includes a supporter, one first locating plate and one second locating plate, institute
It states the first locating plate and second locating plate is set to the supporter at each interval, the pressure feeler inspection needle, which is worn, to be positioned at
First locating plate and second locating plate.
Preferably, the pressure feeler inspection needle set has an interlude, a detection section and a linkage section, the interlude to be located at described
Between first locating plate and second locating plate；The detection section is piercing in first locating plate, and the detection section
Free end is defined as the end；The linkage section is piercing in second locating plate, and the linkage section be connected to it is described
Circuit board.
Preferably, in the pressure feeler inspection needle, the interlude is in bending, and the detection section and the linkage section
In the setting that misses one another.
Preferably, the pressure touching switch is installed on the outside on the circuit board and being located at the frame.
Preferably, the material of the pressure feeler inspection needle and construction are identical to the material and construction of any one probe.
Preferably, the detection device further comprises having a fixed bracket, and the probe card is installed on the fixed branch
On frame, and the circuit board is clamped and fastened between the frame and the fixed bracket.
Preferably, the probe card includes a pinboard, and the pinboard is set on the circuit board and position
In the inside of the frame；Wherein, the opposite end position of each probe is pierced by the plate-shaped unit respectively and determines respectively
Justice is a linkage section and a detection section, and the linkage section of multiple probes is connected to the pinboard, to be turned by described
Fishplate bar and be electrically connected at the circuit board.
In conclusion detection device disclosed in the embodiment of the present invention, can touch by pressure is separately equipped on the probe card
Switch, and designed by pressure touching switch and the connection structure of probe card to each other, pressure touching switch can be used to monitor probe card
With at a distance from external module whether too close to, and when the distance too close to when, pressure touching switch can issue guard against believe
Number, to stop the relative movement of probe card and external module, to be effectively reduced the risk of probe over-voltage.
For that can be further understood that feature and technology contents of the invention, please refer to the following detailed descriptions related to the present invention
With attached drawing, but these explanations are only used to illustrate the present invention with attached drawing, rather than make any limitation to protection scope of the present invention.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of detection device of the present invention.
Fig. 2 is the decomposition diagram of Fig. 1.
Fig. 3 is schematic cross-sectional view of the Fig. 1 along III-III hatching line.
Fig. 4 is schematic cross-sectional view of the Fig. 1 along IV-IV hatching line.
Fig. 5 is that external module pressure is touched in the schematic diagram of multiple probe in detecting sections in the embodiment of the present invention.
Fig. 6 is that pressure touching switch is set to schematic diagram of on the circuit board and position on the outside of frame in the embodiment of the present invention.
Fig. 7 is the schematic diagram that detection device of the invention is applied to wafer probing board.
Specific embodiment
Fig. 1 to Fig. 7 is please referred to, is the embodiment of the present invention, need to first illustrate, various embodiments of the present invention respective figure institute
The correlated measure and external form referred to is only used to specifically describe embodiments of the present invention, in order to understand the contents of the present invention,
Rather than it is used to limit to protection scope of the present invention.
Such as Fig. 1 and Fig. 2, the embodiment of the present invention discloses a kind of detection device 100, including a probe card 1, a detector 2
And a fixed bracket 3, wherein the detector 2 is installed in probe card 1, probe card 1 is installed on fixed bracket 3.Below will
The various components specific configuration for illustrating the present embodiment detection device 100 respectively, then illustrates each of detection device 100 in due course again
The connection relationship of inter-module.
Need to first it illustrate, in order to facilitate understanding the present embodiment, so the local structure of detection device 100 is only presented in attached drawing
It makes, in order to which the various components construction and connection relationship of detection device 100 is clearly presented.
As shown in Figure 1 to Figure 4, the probe card 1 includes a circuit board 11, a frame 12 (Jig), a probe 13 and one turn
Fishplate bar 14.Wherein, the frame 12 is set on circuit board 11, and probe 13 is installed on frame 12, and pinboard 14 is set to
On circuit board 11, and it is located at the inside of frame 12.
More specifically, the frame 12 (such as Fig. 2) annular in shape and its upper inside edges be formed with it is stair-stepping one installation
Portion 121, and the shape of above-mentioned mounting portion 121 corresponds to the outer rim of the probe 13, so that probe 13 can be installed
In on mounting portion 121, and enable probe 13 and circuit board 11 in being positioned apart from.The frame 12 is in above-mentioned mounting portion
121 outside is formed with an accommodating space 122 and multiple perforation 123, and the accommodating space 122 can be to accommodate the detection
Device 2.Multiple 123 preferably compartment of terrain of the perforation are distributed on frame 12, and each perforation 123 can be with for a spiral shell
Silk 124 passes through (such as Fig. 3).Whereby, be formed with it is multiple perforation 123 frame 12 can pass through multiple corresponding screws 124 by its
It is locked on circuit board 11.If multiple screws 124 can penetrate the circuit in addition, needing the integral strength of reinforcement circuit board 11
Plate 11, and it is further locked in the fixed bracket 3, so as to making circuit board 11 be clamped and fastened on frame 12 and fixed bracket 3
Between.
Such as Fig. 4, the probe 13 includes a plate-shaped unit 131 and the multiple probes 132 for being arranged in plate-shaped unit 131.
Preferably, the plate-shaped unit 131 can further include one first guide plate 1311, one second guide plate 1312 and be set to
A spacing board 1313 between first guide plate 1311 and the second guide plate 1312.The spacing board 1313 corresponds to probe 132
Part typically exhibits hollow state, therefore probe 132 will not touch spacing board 1313.
Furthermore each probe 132 is electrically coupled to circuit board 11, and multiple probes far from the circuit board 11
132 end (end of the detection section 1322 of such as following probes 132) corresponds respectively to circuit board 11 and is formed with multiple height.More
Specifically, in the present embodiment, the opposite end position of each probe 132 is pierced by the first of the plate-shaped unit 131 respectively
Guide plate 1311 and the second guide plate 1312, and a linkage section 1321 and a detection section 1322 can be respectively defined as.Multiple institutes
The linkage section 1321 for stating probe 132 is electrically coupled to the circuit board 11.The detection section 1322 of multiple probes 132 can be used to press
It touches in an external module O.In addition, it is multiple it is described detection sections 1322 ends correspond respectively to circuit board 11 be formed with it is multiple high
Degree, that is to say, that multiple height are defined by end to the distance between circuit board 11 of multiple detection sections 1322.It is necessary
Illustrate, the probe 13 of the present embodiment is to be pierced by the plate-shaped unit respectively with the opposite end position of each probe 132
131 the first guide plate 1311 and the second guide plate 1312, and it is respectively defined as a linkage section 1321 and a detection section 1322
For, but in practical application, connection relationship of the probe 132 of probe 13 with the structure of plate-shaped unit 131 and to each other
There are a variety of different versions, therefore the present invention is not only restricted to this.
The pinboard 14 is a Signals Transfer Board 14 (Signal Transfer Board, STB) in the present embodiment.
The pinboard 14 can be used to pair that be arbitrarily enlarged or reducing electrical contact between circuit board 11 and multiple probes 132 (figure is unlabeled)
Answer ratio or distribution, that is to say, that the distribution of multiple electrical contacts of circuit board 11 and pinboard 14 can be greater than or
Less than the distribution of multiple probes 132 and the electrical contact of pinboard 14.
It further says, the pinboard 14 is to be set between circuit board 11 and probe 13, and be located at the frame
12 inside.The linkage section 1321 of multiple probes 132 is connected to pinboard 14, to be electrically connected at by pinboard 14
Circuit board 11, but the present invention is not only restricted to this.For example, can also not have between the circuit board 11 and the probe card 1
Pinboard 14 (figure is not painted), as long as the circuit board 11 and the probe card 1 can be electrically connected.
Such as Fig. 3 to Fig. 6, the detector 2 can be used to monitor the probe 13 at a distance from the external module O whether
Too close to being generated because of over-voltage by the risk of compression failure (hitting card) to avoid probe 13.In the present embodiment, the detector
2 be to touch switch 2 (such as Fig. 3) using a pressure.The pressure touching switch 2 includes a load-bearing part 21 and the pressure for being set to load-bearing part 21
Feeler inspection needle 22.The load-bearing part 21 can further include a supporter 211, one first locating plate 212 and one second locating plate
213。
First locating plate 212 and the second locating plate 213 are set to supporter 211 at each interval, press feeler inspection needle 22
It wears and is positioned at the first locating plate 212 and the second locating plate 213.There is the pressure feeler inspection needle 22 interlude 221, one to detect section
222 and a linkage section 223, wherein the interlude 221 is between the first locating plate 212 and the second locating plate 213.The inspection
It surveys section 222 and is piercing in the first locating plate 212, and the free end for detecting section 222 is defined as an end.The linkage section 223 is worn
For the second locating plate 213, and linkage section 223 passes through said frame 12 and is electrically connected at circuit board 11.It is worth mentioning
It is that the interlude 221 of the pressure feeler inspection needle 22 is to be in by the positioning of above-mentioned first locating plate 212 and the second locating plate 213
Existing bending, so that detection section 222 and linkage section 223, in the setting that misses one another, whereby, pressure feeler inspection needle 22 can be stably fixed
In on load-bearing part 21, so as to avoid the risk of landing.
Used material is polyester film in this present embodiment for first locating plate 212 and the second locating plate 213
(Mylar), but the present invention is not only restricted to this.For example, in the embodiment that the present invention is not painted, first locating plate
212 and second locating plate 213 use material be also possible to sheet rubber or silica gel piece.
Used material and construction can be identical to any one described probe to the pressure feeler inspection needle 22 in this present embodiment
132 material and construction, but the present invention is not only restricted to this.That is, not needing spy when making the pressure touching switch 2
The probe 132 of other types is not looked for, it is only necessary to use type identical with the probe 132 of probe 13.Whereby, may be used
It saves the cost of manufacture of pressure touching switch 2 and reduces the difficulty of production.
Further to say, pressure touching switch 2 is in the accommodating space 122 for be set to the frame 12 (such as Fig. 3), but
Invention is not only restricted to this.It is described pressure touching switch 2 setting position can according to designer demand and adjusted, such as: press
Touching switch 2 can also be installed on circuit board 11 and position in the outside (such as Fig. 6) of frame 12.
Such as Fig. 3, the accommodating space 122 of the frame 12 is connected to one of perforation 123 of multiple perforation 123.Pressure touching
The load-bearing part 21 of switch 2 is formed with a matching hole 214, and the position of matching hole 214 corresponds to wearing for connection accommodating space 122
Hole 123.Whereby, the screw 124 can be fed through above-mentioned corresponding matching hole 214 and perforation 123 in order, and lock
In the circuit board 11 (and fixed bracket 3), to pressure touching switch 2 is removably installed in the probe card 1, and electricity
Property is connected to the circuit board 11.Furthermore by the fixation of screw 124, pressure touching switch 2 can be stably fixed in probe card
On 1, because of external force collision or it will not pull and fall easily, cause the damage of probe card 1.
As Fig. 4 to Fig. 5, the distance D that the end of the detection section 222 of the pressure feeler inspection needle 22 corresponds to circuit board 11 can be less than
The end of the detection section 1322 of multiple probes 132 corresponds to circuit board 11 and is formed by the minimum constructive height in multiple height
HL (fixed value).Briefly, the maximum distance D between the end and circuit board 11 of the detection section 222 of the pressure feeler inspection needle 22
No more than the minimum constructive height HL in multiple height.
Such as Fig. 5, when external module O pressure touching is when the detection section 1322 of multiple probes 132, external module O with
There is an alterable distance DV between circuit board 11, and press touching switch 2 that can be used to monitor alterable distance DV and minimum constructive height HL
Between a difference to be monitored.When the difference to be monitored that pressure touching switch 2 is monitored is greater than a critical value, pressure touching switch 2 can pass through
Circuit board 11 triggers a restricted speed signal S (such as Fig. 7), to stop the relative movement of probe card 1 Yu external module O.Wherein, described to face
Dividing value is between 40 microns to 90 microns, and a difference of the maximum distance D and minimum constructive height HL are also between 40 microns
To 90 microns.
It changes an angle to say, when the external module O just touches the probe in multiple probes 132 with minimum constructive height HL
When 132 end, the difference to be monitored that the pressure touching switch 2 is monitored is essentially a zero, and all probes 132 of probe 13 are all opened
Begin to generate needle pressure, but needle pressure is still in sustainable range.At this point, external module O has touched owning in probe 13
Probe 132.Then, when the external module O continue towards circuit board 11 direction pressure feeler inspection syringe needle 13 probe 132, it is described to
Monitoring difference can continue to be promoted, and the needle pressure of probe 132 also and then can be promoted persistently, but needle pressure is still in sustainable range.
Finally, the difference to be monitored can be greater than when the external module O touches the end of the pressure feeler inspection needle 22 of pressure touching switch 2
Critical value (value between 40 microns to 90 microns), the needle pressure of probe 132 soon exceeds endurable range at this time, if
The probe 132 of feeler inspection syringe needle 13 is constantly pressed, probe 13 might have by the risk of compression failure.In order to solve the problems, such as this one, this
The pressure touching switch 2 of embodiment further can trigger a restricted speed signal S by circuit board 11, to stop probe card 1 and external module O
Relative movement.
Whereby, the detector 2 of the present embodiment can produce the pressure touching switch using load-bearing part 21 and pressure feeler inspection needle 22
2, there are the beneficial effects such as cost of manufacture is cheap, production method is simple and production quality is stablized.Furthermore the present embodiment is by by institute
It states pressure touching switch 2 and is set in probe card 1 (external anticollision mechanism), be not only effectively reduced probe 13 due to over-voltage by compression failure
Risk, and significantly improve the use reliability of probe card 1.In addition, since pressure touching switch 2 is by pressing feeler inspection needle 22
It is electrically connected (internal cabling) with circuit board 11, therefore avoids and uses external route, so that reducing pressure touching switch 2 can
Can because external force collision or pull and the risk that falls.
It should be noted that the pressure touching switch 2 of the present embodiment be press feeler inspection needle 22 to be described with the positioning of load-bearing part 21, but
The present invention is not only restricted to this.That is, when probe card 1 is formed with the construction that can position above-mentioned pressure feeler inspection needle 22, it is described
Load-bearing part 21 can also be omitted.
Referring to Fig. 7, being applied to the schematic diagram of a wafer probing board 200 for the detection device 100 of the present embodiment.It is described
Wafer probing board 200 includes a carrier module 201 (being equivalent to external module O), the driving mould of the detection device 100, one
Block 202 and a processing module 203.Wherein, the carrier module 201 (chuck) is to carry a wafer C on one side.It is described
Detection device 100 is located at the top of carrier module 201.The drive module 202 is connected to 201 another side of carrier module.It is described
Processing module 203 is electrically connected at the circuit board 11 and drive module 202 of probe card 1.When operator is executing probe 13
Needle position and height alignment when, the carrier module 201 (including wafer C) can be done with probe 13 critically to be contacted, and
Multiple probes 132 of probe 13 can start to generate needle pressure.When the carrier module 201 touches the pressure feeler inspection of pressure touching switch 2
When the end of needle 22, the needle pressure of the probe 132 of the probe 13 soon exceeds endurable range.At this point, the pressure touching
Switch 2 can be triggered a restricted speed signal S by circuit board 11 and be transferred to processing module 203.The processing module 203 can basis
Restricted speed signal S stops the relative movement of probe card 1 and carrier module 201, so that probe 13 be avoided to be occurred by the case where compression failure.
The foregoing is merely preferred possible embodiments of the invention, are not used to limit to protection scope of the present invention, it is all according to
The equivalent changes and modifications that claims of the present invention is done should all belong to the protection scope of claims of the present invention.
Claims (10)
1. a kind of detection device, which is characterized in that the detection device includes:
One probe card includes:
One circuit board；
One frame is set on the circuit board；And
One probe is installed on the frame, and the probe comprising a plate-shaped unit and is arranged in the plate-shaped unit
Multiple probes；
Wherein, each probe is electrically connected at the circuit board, and the end of multiple probes far from the circuit board
End corresponds respectively to the circuit board and is formed with multiple height, and the end of multiple probes is used to press touching outside one
Parts；And
One pressure touching switch is removably installed in the probe card, and the pressure touching switch includes to be electrically connected at the circuit
One pressure feeler inspection needle of plate, the pressure feeler inspection needle set has the end far from the circuit board, and the pressure feeler inspection needle is described
A maximum distance between end and the circuit board is no more than the minimum constructive height in multiple height, and the maximum distance
A difference with the minimum constructive height is between 40 microns to 90 microns；
Wherein, when the touching of external module pressure in the end of multiple probes and touches the institute for pressing feeler inspection needle
When stating end, pressure touching switch can trigger a restricted speed signal by the circuit board, with stop the probe card with it is described outside
The relative movement of parts.
2. detection device according to claim 1, which is characterized in that the frame is formed with an accommodating space, and institute
Stating accommodating space is from the recessed formation of frame surface institute far from the circuit board, and described in pressure touching switch is set to
In the accommodating space of frame.
3. detection device according to claim 2, which is characterized in that the frame is formed with multiple perforation, and each
The perforation is passed through with for a screw, and the accommodating space is connected to one of them described perforation of multiple perforation, and
And the pressure touching switch is formed with a matching hole, and the position of the matching hole corresponds to the described of the connection accommodating space
Perforation.
4. detection device according to claim 1, which is characterized in that the pressure touching switch further includes a support
Body, one first locating plate and one second locating plate, first locating plate are set at each interval with second locating plate
The supporter, the pressure feeler inspection needle, which is worn, is positioned at first locating plate and second locating plate.
5. detection device according to claim 4, which is characterized in that the pressure feeler inspection needle includes
One interlude, between first locating plate and second locating plate；
One detection section is piercing in first locating plate, and the free end of the detection section is defined as the end；And
One linkage section is piercing in second locating plate, and the linkage section is connected to the circuit board.
6. detection device according to claim 5, which is characterized in that in the pressure feeler inspection needle, the interlude is in curved
It is curved, and the detection section and the linkage section are in the setting that misses one another.
7. detection device according to claim 1, which is characterized in that the pressure touching switch is installed on the circuit board simultaneously
And position is in the outside of the frame.
8. according to detection device described in any one of claims 1 to 7, which is characterized in that the material of the pressure feeler inspection needle with
Construction is identical to the material and construction of any one probe.
9. according to detection device described in any one of claims 1 to 7, which is characterized in that the detection device is further wrapped
A fixed bracket is included, the probe card is installed on the fixed bracket, and the circuit board is clamped and fastened on the frame
Between frame and the fixed bracket.
10. according to detection device described in any one of claims 1 to 7, which is characterized in that the probe card includes one turn
Fishplate bar, and the pinboard is set to the inside on the circuit board and being located at the frame；Wherein, each probe
Opposite end position is pierced by the plate-shaped unit respectively and is respectively defined as a linkage section and a detection section, multiple probes
The linkage section is connected to the pinboard, to be electrically connected at the circuit board by the pinboard.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106128107 | 2017-08-18 | ||
| TW106128107A TWI641839B (en) | 2017-08-18 | 2017-08-18 | Detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109425813A true CN109425813A (en) | 2019-03-05 |
Family
ID=65034371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710750275.0A Pending CN109425813A (en) | 2017-08-18 | 2017-08-28 | Detection device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109425813A (en) |
| TW (1) | TWI641839B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111736061A (en) * | 2020-07-23 | 2020-10-02 | 深圳市微特自动化设备有限公司 | Pneumatic two-stage type detection equipment for high-precision circuit board |
| CN111766416A (en) * | 2020-08-14 | 2020-10-13 | 强一半导体（苏州）有限公司 | Docking method of guide plate MEMS (micro-electromechanical systems) probe structure and switching layer |
Families Citing this family (2)
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| TWI793040B (en) * | 2022-07-05 | 2023-02-11 | 中華精測科技股份有限公司 | Detachable testing device and holder thereof |
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| TW201913102A (en) | 2019-04-01 |
| TWI641839B (en) | 2018-11-21 |
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