TW201829125A - 具有一致的墊表面微紋理的化學機械拋光墊 - Google Patents

具有一致的墊表面微紋理的化學機械拋光墊 Download PDF

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Publication number
TW201829125A
TW201829125A TW106132147A TW106132147A TW201829125A TW 201829125 A TW201829125 A TW 201829125A TW 106132147 A TW106132147 A TW 106132147A TW 106132147 A TW106132147 A TW 106132147A TW 201829125 A TW201829125 A TW 201829125A
Authority
TW
Taiwan
Prior art keywords
cmp
pad
polishing layer
polishing
cmp polishing
Prior art date
Application number
TW106132147A
Other languages
English (en)
Chinese (zh)
Inventor
傑弗瑞 詹姆士 漢卓恩
傑弗瑞 羅伯特 史塔克
Original Assignee
美商羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 美商羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201829125A publication Critical patent/TW201829125A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW106132147A 2016-09-29 2017-09-19 具有一致的墊表面微紋理的化學機械拋光墊 TW201829125A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/279,689 US20180085888A1 (en) 2016-09-29 2016-09-29 Chemical mechanical polishing pads having a consistent pad surface microtexture
US15/279,689 2016-09-29

Publications (1)

Publication Number Publication Date
TW201829125A true TW201829125A (zh) 2018-08-16

Family

ID=61563983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106132147A TW201829125A (zh) 2016-09-29 2017-09-19 具有一致的墊表面微紋理的化學機械拋光墊

Country Status (7)

Country Link
US (1) US20180085888A1 (ko)
JP (1) JP2018051759A (ko)
KR (1) KR20180035698A (ko)
CN (1) CN107877360A (ko)
DE (1) DE102017008998A1 (ko)
FR (1) FR3056430A1 (ko)
TW (1) TW201829125A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11078380B2 (en) 2017-07-10 2021-08-03 Entegris, Inc. Hard abrasive particle-free polishing of hard materials
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
CN108994723A (zh) * 2018-08-03 2018-12-14 成都时代立夫科技有限公司 一种cmp复合沟槽抛光垫
JP7306234B2 (ja) * 2019-11-19 2023-07-11 株式会社Sumco ウェーハの研磨方法及びシリコンウェーハ
CN114762955A (zh) * 2022-03-14 2022-07-19 宁波赢伟泰科新材料有限公司 一种间断性圆弧沟槽抛光垫

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
TW200305482A (en) 2002-03-25 2003-11-01 Thomas West Inc Smooth pads for CMP and polishing substrates
US7985122B2 (en) * 2006-06-13 2011-07-26 Freescale Semiconductor, Inc Method of polishing a layer using a polishing pad
US9415479B2 (en) * 2013-02-08 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Conductive chemical mechanical planarization polishing pad
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
CN104149023A (zh) * 2014-07-17 2014-11-19 湖北鼎龙化学股份有限公司 化学机械抛光垫

Also Published As

Publication number Publication date
FR3056430A1 (fr) 2018-03-30
CN107877360A (zh) 2018-04-06
DE102017008998A1 (de) 2018-03-29
US20180085888A1 (en) 2018-03-29
KR20180035698A (ko) 2018-04-06
JP2018051759A (ja) 2018-04-05

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