TW201826464A - Thermal module - Google Patents

Abstract

A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.

Description

Cooling module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module capable of improving the problem that solder paste is easily scraped when a conventional heat dissipation fin structure is combined with a heat dissipation unit.

According to the progress of semiconductor technology, the volume of integrated circuits has gradually decreased. In order to enable integrated circuits to process more data, integrated circuits under the same volume can already accommodate several times more than before. Computing elements. When the number of computing elements in the integrated circuit is increasing, the execution efficiency is getting higher and higher, so the thermal energy generated by the computing elements is also getting larger and larger. Taking a common CPU as an example, When the workload is fully loaded, the heat emitted by the central processing unit is sufficient to completely burn the central processing unit. Therefore, the heat dissipation device of the integrated circuit becomes an important issue. The central processing unit and the chip or other electronic components in the electronic equipment are all heat sources in the electronic equipment. When the electronic equipment is operating, the heat source will generate heat. Therefore, currently, heat conducting components such as heat pipes, temperature equalizing plates, Flat-type heat pipes have good heat dissipation and thermal conductivity for heat conduction or temperature equalization. Among them, heat pipes are mainly used for remote heat conduction; it absorbs heat at one end to convert the internal working fluid from liquid to vapor and transfer heat to the heat pipe. At the other end, the purpose of heat conduction is achieved, and for parts with a large heat transfer area, a temperature equalizing plate is selected as a heat dissipation component. The temperature equalizing plate mainly absorbs heat from one side of the surface in contact with the heat source, and then conducts heat to the other Cooling and condensation on one side. At present, there is a heat dissipation element 1 on the market. As shown in FIGS. 1A and 1B, the two temperature equalizing plates 11 are covered by a cylinder (covered by the heat dissipation fin group 12 as shown) between the two temperature equalizing plates 11. 11 are connected to form the heat dissipating element 1, and a heat dissipating fin group 12 is built in the heat dissipating element 1. When using, the conventional heat dissipating fin group 12 is directly placed between the two temperature equalizing plates 11 for combination. Because the upper and lower sides of the heat dissipation fin group 12 need to be coated with solder paste (or the solder paste can also be optionally coated on the temperature equalizing plate 11), the heat dissipation fin group 12 coated with the solder paste is placed in Between the two temperature equalizing plates 11, during the installation process, since the height (distance) H ₁ between the two temperature equalizing plates 11 is equal to the height H _{2 of the} heat radiation fin group 12, and the heat radiation fin group must be made 12 is firmly combined with the two temperature equalizing plates 11, so when the heat dissipation fin group 12 is placed, it will contact at least one side of the two temperature equalizing plates 12 and slide in after being attached, so that during the assembly process A part of the solder paste coated with the heat dissipation fin group 12 on the solder paste side will be scratched and damaged by the temperature equalizing plate, resulting in the loss of the heat dissipation fin group 12 due to the solder paste during soldering. However, it is impossible to truly comprehensively weld, thereby reducing its stability and generating thermal resistance.

Therefore, in order to effectively solve the above-mentioned problems, the main object of the present invention is to provide a heat-dissipating mold set which can greatly improve the problem that the solder paste is easily scraped when the conventional heat-dissipating fin structure is combined with the heat-dissipating unit. A secondary object of the present invention is to provide a more solid heat dissipation module. To achieve the above object, the present invention provides a heat dissipation module including a heat dissipation unit, a first heat dissipation fin group and a second heat dissipation fin group. The heat dissipation unit has a first body and a second body. The first body has a first surface and a second surface, the second body has a third surface and a fourth surface, and two ends of a pipe body are connected to the first and third surfaces, respectively. The first and second bodies and the tube body jointly define an accommodation space, and the first and second heat dissipation fin groups are disposed in the accommodation space, and the first heat dissipation fin group has a first side and a second Side, the second side is convexly provided with at least a first convex portion, a top end of the first convex portion forms a first vertex, and a first inclined surface and a second inclined surface are formed on both sides of the first vertex, and the second heat dissipation The fin group has a third side and a fourth side, and the third side is corresponding to the second side, and the third side is provided with at least one second convex portion corresponding to the first convex portion. A second vertex is formed at the top of the second convex portion, and a third bevel is formed on both sides of the second vertex. And a fourth bevel. According to the design of the structure of the present invention, the first heat dissipation fin group further has a first end and a second end, and the second heat dissipation fin group further has a third end and a fourth end. During implementation, firstly, the first and four sides are coated with solder paste, and then the first and second heat dissipation fin groups are superimposed and placed together in the accommodation space of the heat dissipation unit. The first and second protrusions are misaligned, so that the first and third ends are not flush, the second and fourth ends are not flush, and then the first heat sink fin The first end of the group slides in the direction of the second end, and contacts the third inclined surface through the second inclined surface and slides upward, so that the second vertex corresponds to the first inclined surface. At this point, an open space is formed between the first and second heat dissipation fin groups, so that the first and fourth sides of the first and second heat dissipation fin groups are closely adhered to the first and third heat dissipation units, respectively. On the surface, the first and second heat dissipation fin groups can be combined with the heat dissipation unit more stably, and Know well the problem of solder paste being easily scraped when the heat sink fin structure is combined with the heat sink unit.

The above object of the present invention, and its structural and functional characteristics will be described based on the preferred embodiments of the drawings. Please refer to Figs. 2, 3 and 4, which are a perspective view, an assembled perspective view and an enlarged view of the first embodiment of the heat sink module of the present invention. As shown, the heat sink module includes a heat sink unit 3 and a first A heat dissipation fin group 21 and a second heat dissipation fin group 22. The first heat dissipation fin group 21 is composed of a plurality of first heat dissipation fins 211, and has a first side 212 and a second side 213. The first heat dissipation fin 211 further has a first plane 211c, and two sides of the first plane 211c are bent to form a first bent surface 211d and a second bent surface 211e. At least one first convex portion 214 is protruded on 211e. A top end of the first convex portion 214 forms a first vertex 215, and a first inclined surface 215a and a second inclined surface 215b are formed on both sides of the first vertex 215. The second heat radiation fin group 22 is composed of a plurality of second heat radiation fins 221, and has a third side 222 and a fourth side 223. The third side 222 is corresponding to the second side 213, The second heat dissipation fin 221 further has a second plane 221c, and two sides of the second plane 221c are bent to form a third bent surface 221d and a fourth A folded surface 221e, and at least one second convex portion 224 is provided on the third bent surface 221d corresponding to the first convex portion 214, and a top point of the second convex portion 224 forms a second vertex 225, and the second vertex 225 A third inclined surface 225a and a fourth inclined surface 225b are formed on both sides. The lengths of the first and second inclined surfaces 215a and 215b are equal to each other. The third and fourth inclined surfaces 225a and 225b are equal to each other. Without limitation, in actual implementation, the length of the first inclined surface 215a may be greater than the length of the second inclined surface 215b, and the length of the third inclined surface 225a may be shorter than the length of the fourth inclined surface 215b, so that the second inclined surface The slopes of the three slopes 215b and 225a are greater than the slopes of the first and fourth slopes 215a and 215b. Wherein, the first and second convex portions 214 and 224 are respectively arranged on the second and third sides 213 and 222 at equal intervals in this embodiment, but they are not limited thereto, and the actual implementation is not limited thereto. In accordance with the needs of the user, the first and second convex portions 214 and 224 may be arranged on the second and third sides 213 and 222 at irregular intervals, respectively. In addition, the first and second convex portions 214 and 224 The forming method is a stamping method, which can be punched (as shown in Figure 4) or punched (as shown in Figure 5). Continue to refer to Figures 6, 7, and 8 together, which are schematic side-view illustrations of the first embodiment of the heat sink module of the present invention. The first heat sink fin group 21 further has a first end 211a and a first end. Two ends 211b, the second heat dissipation fin group 22 further has a third end 221a and a fourth end 221b; in the drawing of this embodiment, two sets of first and second heat dissipation fin groups 21, 22, and the two sets of first and second heat dissipation fin groups 21 and 22 are actually operated and assembled in the same way. The present invention is described with one of the first and second heat dissipation fin groups 21 and 22 as a representative. In actual implementation, it is necessary to match the aforementioned heat dissipation unit 3, which has a first body 31 and a second body 32, the first body 31 has a first surface 311 and a second surface 312, and the second body 32 It has a third surface 321 and a fourth surface 322, and two ends of a pipe body 33 are respectively connected to the first and third surfaces 311 and 321, and the first and second bodies 31 and 32 and the pipe body 33 are in common. A receiving space 34 is defined. First, the first side 212 and the first side 212 of the first heat dissipation fin group 21 are first The fourth side 223 of the two heat dissipation fin groups 22 is coated with solder paste, and then the first and second heat dissipation fin groups 21 and 22 are superimposed and placed together in the accommodation space 34 of the heat dissipation unit 3, so that The first and second convex portions 214 and 224 are in a misaligned state on the second and third sides 213 and 222. Because the first and second convex portions 214 and 224 are misaligned, the first heat dissipation is The first end 211a of the fin group 21 is not flush with the third end 221a of the second heat radiation fin group 22, and the second end 211b of the first heat radiation fin group 21 and the second heat radiation fin The fourth end 221b of the group 22 is also not flush. Then, the first end 211a of the first fin group 21 is slid toward the second end 211b, and is moved to the first and third ends 211a. And 221a are flush with each other, and the second and fourth ends 211b and 221b are flush with each other, and contact the third slanted surface 225a through the second slanted surface 215b and perform an upward sliding motion. The vertex 225 is abutted against the first vertex 215, and an open space 227 is formed between the first and second heat dissipation fin groups 21 and 22, so that the The first and fourth sides 212 and 223 of the first and second heat dissipation fin groups 21 and 22 are respectively closely adhered to the first and third surfaces 311 and 321 of the heat dissipation unit 3 to reach the first and second heat dissipation fins. The groups 21 and 22 can be more firmly combined with the heat dissipation unit 3, and the problem that the solder paste is easily scraped off when the conventional heat dissipation fin structure is combined with the heat dissipation unit 3 is improved. Please refer to Figs. 9, 10, 11, and 12 and Figs. 3 and 4 together, which are a perspective view and an enlarged view of the second embodiment of the heat dissipation module of the present invention. Some components of the heat dissipation module and The corresponding relationship between the components is the same as the aforementioned heat dissipation module, so it will not be repeated here, but the main difference between this heat dissipation module and the foregoing is that a groove 226 is formed on the second vertex 225, so The first vertex 215 is abutted against the groove 226. Since the structure of the groove 226 can make the first vertex 215 have a relatively large area contact, in addition to achieving the same effect as described above, The first heat-dissipating fin group 21 can also be more firmly combined with the second heat-dissipating fin group 22 correspondingly. Finally, please refer to Figs. 13, 14, and 15, which are a perspective view and a side view implementation diagram of the third embodiment of the heat dissipation module of the present invention. The components of the heat dissipation module and the corresponding relationships between the components are as described above. The structure of the heat dissipation module is the same, so it is not repeated here, but the main difference between this heat dissipation module and the foregoing is that the first convex portion 214 is convexly disposed on the first plane 211c of the first heat dissipation fin 211. In the above, the second convex portion 224 is convexly provided on the second plane 221c of the second heat dissipation fin 221, and the first and second convex portions 214 and 224 are disposed in a corresponding misalignment manner, and the The first and second convex portions 214 and 224 may be longitudinally or laterally convex on the first and second planes 211c and 221c. When in use, the first heat dissipation fin group 21 is slid and moved to make the first The convex portion 214 abuts against the second convex portion 224 and can also achieve the aforementioned effect. As described above, the present invention has the following advantages over the conventional one: 1. Improves the problem that the conventional solder paste is easily scraped off; 2. It is more firm. The present invention has been described in detail above, but the above is only one preferred embodiment of the present invention, and the scope of implementation of the present invention cannot be limited. That is, all equivalent changes and modifications made in accordance with the scope of the application of the present invention shall still fall within the scope of patent of the present invention.

21‧‧‧The first cooling fin group

211‧‧‧The first heat dissipation fin

211a‧‧‧ first end

211b‧‧‧Second End

211c‧‧‧First plane

211d‧‧‧First curved surface

211e‧‧‧Second Bend

212‧‧‧first side

213‧‧‧second side

214‧‧‧The first convex part

215‧‧‧First Vertex

215a‧‧‧First slope

215b‧‧‧Second bevel

22‧‧‧Second heat dissipation fin group

221‧‧‧Second cooling fin

221a‧‧‧ third end

221b‧‧‧ fourth end

221c‧‧‧Second Plane

221d‧‧‧The third curved surface

221e‧‧‧Fourth Bend

222‧‧‧third side

223‧‧‧Fourth side

224‧‧‧ second convex

225‧‧‧Second Vertex

225a‧‧‧ Third bevel

225b‧‧‧ fourth slope

226‧‧‧Groove

227‧‧‧ open space

3‧‧‧Cooling Unit

31‧‧‧First Body

311‧‧‧first surface

312‧‧‧Second Surface

32‧‧‧Second Ontology

321‧‧‧ Third Surface

322‧‧‧ fourth surface

33‧‧‧ tube body

34‧‧‧accommodation space

Fig. 1A is an exploded perspective view of a conventional heat sink module; Fig. 1B is an assembled perspective view of a conventional heat sink module; Fig. 2 is a perspective view of a first embodiment of the heat sink module of the present invention; The figure is a three-dimensional combined view of the first embodiment of the heat sink module of the present invention; the fourth figure is an enlarged view of the first embodiment of the heat sink module of the present invention; the fifth figure is the first embodiment of the heat sink module of the present invention An enlarged view of the embodiment; FIG. 6 is a side view implementation schematic diagram of the first embodiment of the heat sink module of the present invention; FIG. 7 is a side view implementation schematic diagram of the first embodiment of the heat sink module of the present invention; The figure is a side view implementation schematic diagram of the first embodiment of the heat sink module of the present invention; FIG. 9 is a side view of the second embodiment of the heat sink module of the present invention; FIG. 10 is the first embodiment of the heat sink module of the present invention An enlarged view of the second embodiment; FIG. 11 is a side view of the second embodiment of the heat sink module of the present invention; FIG. 12 is an enlarged view of the second embodiment of the heat sink module of the present invention; A perspective view of a third embodiment of the heat dissipation module of the present invention; FIG. 14 is a view of heat dissipation of the present invention The third set of embodiments a schematic side view of the embodiment; FIG. 15, a third embodiment of the line side of the heat dissipation module of the present invention. FIG.

Claims (11)

A heat dissipation module includes: a heat dissipation unit having a first body and a second body, the first body having a first surface and a second surface, the second body having a third surface and a first surface; Four surfaces, two ends of a tube body are respectively connected to the first and third surfaces, and the first and second surfaces and the tube body jointly define an accommodation space; a first heat dissipation fin group is disposed on the surface In the accommodating space, at least one first convex portion is protruded on one side of the first heat dissipation fin group, a top of the first convex portion forms a first vertex, and two sides of the first vertex form a first inclined surface and a A second inclined surface; and a second heat dissipation fin group, which is disposed in the accommodation space and is relatively arranged on one side of the first heat dissipation fin group, and one side of the second heat dissipation fin group corresponds to the first The convex portion is provided with at least a second convex portion, a top end of the second convex portion forms a second vertex, and a third inclined surface and a fourth inclined surface are formed on both sides of the second vertex, and the second vertex is relatively against the first inclined surface. An apex forms an open space between the first and second heat dissipation fin groups. The heat dissipation module according to claim 1, wherein the first and second convex portions are arranged at equal intervals on one side of the first and second heat dissipation fin groups, respectively. The heat dissipation module according to claim 1, wherein the first and second convex portions are arranged at different intervals on one side of the first and second heat dissipation fin groups, respectively. The heat dissipation module according to claim 1, wherein the first heat dissipation fin group has a first side and a second side, and the second heat dissipation fin group has a third side and a fourth side, The second side is convexly provided with the first convex portion, and the third side is provided with the second convex portion corresponding to the first convex portion. The heat dissipation module according to claim 1, wherein the first heat dissipation fin group is composed of a plurality of first heat dissipation fins, and the second heat dissipation fin group is composed of a plurality of second heat dissipation fins. The heat dissipation module according to claim 1, wherein the second vertex further forms a groove, and the first vertex corresponds to the groove. The heat dissipation module according to claim 1, wherein the first heat dissipation fin group further has a first end and a second end, and the second heat dissipation fin group further has a third end and a fourth end The first and third ends should be flush, and the second and fourth ends should be flush. The heat dissipation module according to claim 1, wherein the lengths of the first and second slopes are equal or unequal, and the lengths of the third and fourth slopes are equal or unequal. The heat dissipation module according to claim 5, wherein the first heat dissipation fin further has a first plane, and both sides of the first plane are bent to form a first bent surface and a second bent surface, The second heat dissipation fin further has a second plane, and two sides of the second plane are bent to form a third bent surface and a fourth bent surface. The heat dissipation module according to claim 9, wherein the first convex portion is convexly disposed on the second curved surface, and the second convex portion is convexly disposed on the third curved surface. The heat dissipation module according to claim 9, wherein the first convex portion is convexly provided on the first plane, and the second convex portion is convexly provided on the second plane.