TW201815540A - Diamond tool and scribing method thereof enabling scribing to be started from the outside of the substrate and ended with external cutting and capable of preventing damages to the scribing ends even at the end of scribing - Google Patents
Diamond tool and scribing method thereof enabling scribing to be started from the outside of the substrate and ended with external cutting and capable of preventing damages to the scribing ends even at the end of scribing Download PDFInfo
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- TW201815540A TW201815540A TW106127235A TW106127235A TW201815540A TW 201815540 A TW201815540 A TW 201815540A TW 106127235 A TW106127235 A TW 106127235A TW 106127235 A TW106127235 A TW 106127235A TW 201815540 A TW201815540 A TW 201815540A
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- scribing
- substrate
- diamond tool
- top surface
- scribe
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
Description
本發明係關於一種鑽石工具及其劃線方法，其用於利用鑽石筆對玻璃基板或矽晶圓等脆性材料基板劃線。The invention relates to a diamond tool and a scribing method thereof, which are used for scribing a brittle material substrate such as a glass substrate or a silicon wafer using a diamond pen.
先前，為了對玻璃基板或矽晶圓劃線，使用一種使用由劃線輪或利用單結晶鑽石形成之鑽石筆之工具。對於玻璃基板，主要使用相對於基板轉動之劃線輪，但從提高劃線後之基板之強度等優點考慮，亦正研究固定刀刃即鑽石筆之使用。於專利文獻1、2中，提案一種用於對藍寶石晶圓或氧化鋁晶圓等之硬度較高之基板劃線之點切割器。於該等專利文獻中，使用於角椎之稜線上設置切割點之工具，或前端成為圓錐之工具。又，於專利文獻3中，為了對玻璃板劃線而提案一種使用具有圓錐形之前端之玻璃劃線器之劃線裝置。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2003-183040號公報 [專利文獻2]日本專利特開2005-079529號公報 [專利文獻3]日本專利特開2013-043787號公報Previously, in order to scribe a glass substrate or a silicon wafer, a tool using a diamond pen formed by a scribing wheel or using a single crystal diamond was used. For glass substrates, a scribing wheel that rotates relative to the substrate is mainly used, but considering the advantages of improving the strength of the substrate after scribing, the use of a fixed blade, that is, a diamond pen is also being studied. In Patent Documents 1 and 2, a point cutter for scoring a substrate with high hardness such as a sapphire wafer or an alumina wafer is proposed. In these patent documents, a tool for setting a cutting point on a ridge line of a corner vertebra, or a tool whose front end becomes a cone. Further, in Patent Document 3, in order to scribe a glass plate, a scribe device using a glass scriber having a conical front end is proposed. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2003-183040 [Patent Literature 2] Japanese Patent Laid-Open No. 2005-079529 [Patent Literature 3] Japanese Patent Laid-Open No. 2013-043787 Bulletin
[發明所欲解決之問題] 若使用先前之固定刀刃的工具進行劃線，則劃線端會磨損，因此必須變更劃線端。又，於利用工具進行之劃線中，劃線端必須以適當之角度接觸基板。然而，於先前之工具中，於變更劃線端之情形，必須使工具沿軸方向旋轉，想要精度良好地調整該接觸角度並不容易。 因此，考慮一種如圖1所示之將角板狀之工具之各頂點以自兩側面相互重疊之方式研磨而形成傾斜面，將傾斜面之交線之兩側設為劃線端P1、P2等之劃線工具100。使用此種劃線工具，於如圖1(a)所示，使稜線先行之劃線端P1抵壓於基板101而劃線之情形時，即使以通過基板之端部之方式劃線之所謂外切而於基板101上結束劃線之情形，亦不會對鄰接之其他劃線端P2造成損傷。另一方面，於欲以外切開始劃線之情形時，有先行之劃線端P2會碰撞基板101之端部而受損傷之可能性。 相對於此，如圖1(b)所示，於使用劃線端P2以稜線為後方之方式向前方傾斜進行劃線之情形時，即使以外切開始劃線亦不會對另一劃線端P1造成損傷。但，於結束外切時，亦有未使用之劃線端P1接觸基板101之面而受損之的問題。 因此，於使用此種劃線工具劃線之情形，於以外切開始劃線之情形時，必須不以外切結束；以外切結束劃線之情形時，必須以內切開始。因此，會於玻璃板等之基板之一端部留有未劃線之部分。如此，若將內切劃線後之基板沿劃線進行裂片，則有於未形成劃線之基板端部之分斷精度惡化之問題。 本發明係鑒於此種先前之問題點而完成者，其目的在於提供一種可以外切開始劃線並結束之鑽石工具及其劃線方法。 [解決問題之技術手段] 為了解決該課題，本發明之鑽石工具具備：角柱形之基底，其包含上表面與垂直於其之複數個外周面；頂面，其於上述角柱之上表面之各角，以與將包含上表面之該角之上表面等分之等分線垂直之線成為切片之方式自上表面傾斜；一對傾斜面，其等自包含該角之鄰接之2個外周面朝向該頂點傾斜；且將上述上表面作為引導面，上述一對傾斜面與上述頂面之交點作為劃線端。 此處，上述引導面之長度可設為0.8 mm以上。 此處，上述角柱形之基底為四角柱，上述上表面為正方形，上述上表面之一邊之長度可設為0.7 mm以上。 為了解決該課題，使用本發明之鑽石工具之劃線方法係以上述鑽石工具之1個劃線端為最下位之方式保持於劃線頭，藉由於基板之外側以使上述劃線端成為較上述基板之上表面更下方之方式押下劃線頭，使上述劃線頭於基板之面平行移動，使上述引導面接觸於基板之端部，於上述基板端部使上述引導面滑動特定距離後，使上述頂面接觸於上述基板端部並開始外切劃線。 此處，亦可劃線至基板之端部，藉由使上述稜線之一部分一邊按壓基板端部一邊離開而結束劃線。 [發明之效果] 根據具有此種特徵之本發明，可自脆性材料基板之一端面，亦即藉由外切而開始劃線。因此，於結束劃線後，沿著劃線分斷基板時，可獲得於基板之端部亦得到良好剖面之效果。[Problems to be Solved by the Invention] If a scribe is performed using a tool with a fixed blade, the scribe end will be worn, so the scribe end must be changed. In addition, in the scribing using a tool, the scribing end must contact the substrate at an appropriate angle. However, in the previous tool, when changing the scribe end, the tool must be rotated in the axial direction, and it is not easy to adjust the contact angle with good accuracy. Therefore, consider a method in which the vertices of a corner plate-shaped tool are ground so that they overlap each other from both sides to form an inclined surface as shown in FIG. Etching line tool 100. When using such a scribing tool, as shown in FIG. 1 (a), when the scribe line leading edge P1 leading to the ridge line is pressed against the substrate 101 and scribed, the so-called scribe line is passed through the end of the substrate. In the case where the scribe is ended by cutting out on the substrate 101, the other scribe ends P2 adjacent to it will not be damaged. On the other hand, when it is intended to start scribing with an incision, the leading scribing end P2 may collide with the end of the substrate 101 and be damaged. On the other hand, as shown in FIG. 1 (b), when the scribe line P2 is slanted forward with the ridge line as the rear, the scribe line will not be applied to the other scribe line even if the scribe line is started. P1 causes damage. However, there is also a problem that the unused scribe end P1 contacts the surface of the substrate 101 and is damaged when the circumcision is finished. Therefore, in the case of using such a scribing tool to draw a line, in the case of starting a line with an incision, it must not end with an incision; in the case of ending a line with an incision, it must start with an incision. Therefore, an unscribed portion is left at one end of a substrate such as a glass plate. In this way, if the substrate after the inscribed scribe is split along the scribe, there is a problem that the cutting accuracy at the end portion of the substrate where the scribe is not formed deteriorates. The present invention has been made in view of such a previous problem, and an object thereof is to provide a diamond tool which can be circumscribed to start and end scribe and a scribe method thereof. [Technical means to solve the problem] In order to solve the problem, the diamond tool of the present invention includes a corner pillar-shaped base including an upper surface and a plurality of outer peripheral surfaces perpendicular thereto, and a top surface on each of the upper surfaces of the corner pillars. The angle is inclined from the upper surface in such a way that a line perpendicular to the bisector of the upper surface of the corner including the upper surface is sliced; a pair of inclined surfaces is equal to two adjacent peripheral surfaces including the angle Incline toward the vertex; and use the upper surface as a guide surface, and the intersection of the pair of inclined surfaces and the top surface as a scribe end. Here, the length of the guide surface can be set to 0.8 mm or more. Here, the base of the corner pillar is a quadrangular pillar, the upper surface is square, and the length of one side of the upper surface can be set to 0.7 mm or more. In order to solve this problem, the scribing method using the diamond tool of the present invention is to keep the scribing head with one scribing end of the above-mentioned diamond tool as the lowest position. After the scribing head is pushed downward on the upper surface of the substrate, the scribing head is moved in parallel on the surface of the substrate, the guide surface contacts the end of the substrate, and the guide surface slides a certain distance at the end of the substrate. The top surface is brought into contact with the end of the substrate, and an undercut is started. Here, it is also possible to scribe to the end portion of the substrate, and to end the scribe by leaving a part of the ridgeline while pressing the end portion of the substrate. [Effects of the Invention] According to the present invention having such a feature, it is possible to start scribing from one end surface of a brittle material substrate, that is, by cutting out. Therefore, after the scribing is completed, when the substrate is divided along the scribing, the effect of obtaining a good cross section at the end portion of the substrate can also be obtained.
其次，對本發明之實施形態進行說明。圖2係顯示本發明之實施形態之鑽石工具之製造過程之俯視圖及前視圖。此鑽石工具係將一定高度之四角柱之單結晶鑽石設為基底11。該基底11具有上表面12及方形之外周面13a～13d。上表面12為正方形，將上表面12之四角之頂點設為12a～12d。對於該基底11於上表面12之各頂點12a～12d部分生成劃線端。 其次，針對形成於上表面12之四角頂點之劃線端之加工進行說明。關於上表面12之1個頂點12a，如圖3(a)及圖4所示，以與將包含該頂點12a之上表面12等分之等分線15(參照圖2(a))垂直之線成為上表面12之切片14a，及自上表面12向外周面13a、13b傾斜角度θ1之方式形成頂面16a。 關於上表面12之頂點12b，如圖3(a)所示，以與將包含該頂點12b之上表面12等分之等分線14垂直之線成為上表面12之切片15a，及自上表面12向外周面13b、13c傾斜角度θ1之方式形成頂面16b。 關於上表面12之頂點12c，如圖3(a)所示，以與等分線15垂直之線成為上表面12之切片14b，及自上表面12向外周面13c、13d傾斜角度θ1之方式形成頂面16c。 關於上表面12之頂點12d，如圖3(a)所示，以與等分線14垂直之線成為上表面12之切片15b，及自上表面12向外周面13d、13a傾斜角度θ1之方式形成頂面16d。此處，角度θ1設為超過0°且15°以下，較佳為1°～10°。若接近於0°則加工面積變大，耗費加工時間之同時，有於頂面加工時對其他頂面造成影響之可能性。若超過15°則後述之傾斜面之加工變難。 其次，關於頂點12a，如圖3(a)、圖4所示，研磨與外周面13a之頂面16a相接之部分形成傾斜面17a，又，研磨與外周面13b之頂面16a相接之部分形成傾斜面17b。此時，若將2個傾斜面17a、17b所成之線設為稜線18a，則於圖3(a)之俯視圖中，以傾斜面17a、17b成對稱，且稜線18a成為平行於等分線15之方式形成傾斜面17a、17b。且將如此形成之頂面16a與稜線18a之交點設為尖頭P1。 其次，關於頂點12b，如圖3(a)所示，研磨與外周面13b之頂面16b相接之部分形成傾斜面17c，又，研磨與外周面13c之頂面16b相接之部分形成傾斜面17d。此時，若將2個傾斜面17c、17d所成之線設為稜線18b，則於圖3(a)之俯視圖中，以傾斜面17c、17d成對稱，且稜線18b成為平行於等分線14之方式形成傾斜面17c、17d。將如此形成之頂面16b與稜線18b之交點設為尖頭P2。另，尖頭P1之傾斜面17b，與尖頭P2之傾斜面17c雖均為自相同外周面13c研磨，但為各自獨立之面。即，關於傾斜面，亦因於每個尖頭形成不同面，故各傾斜面之研磨不會對其他尖頭之傾斜面造成影響。 其次，關於頂點12c，如圖3(a)所示，研磨與外周面13c之頂面16c相接之部分形成傾斜面17e，又，研磨與外周面13d之頂面16c相接之部分形成傾斜面17f。此時，若將2個傾斜面17e、17f所成之線設為稜線18c，則於圖2(a)之俯視圖中，以傾斜面17e、17f成對稱，稜線18c成為平行於等分線15之方式形成傾斜面17e、17f。且將如此形成之頂面16c與稜線18c之交點設為尖頭P3。 其次，關於頂點12d，如圖3(a)所示，研磨與外周面13d之頂面16d相接之部分形成傾斜面17g，又，研磨與外周面13a之頂面16d相接之部分形成傾斜面17h。此時，若將2個傾斜面17g、17h所成之線設為稜線18d，則於圖3(a)之俯視圖中，以傾斜面17g、17h成對稱，稜線18d成為平行於等分線14之方式形成傾斜面17g、17h。且將如此形成之頂面16d與稜線18d之交點設為尖頭P4。 此處，如圖4所示，頂面16a與稜線18a所成之角度θ2較佳為130°以上160°以下。為了使角度θ2成為此值，上表面12與頂面16d之角度θ1較佳為15°以下。對於其他頂點亦相同。藉此可設為於四角柱之基底12之各頂點12a～12d之附近具有尖頭P1～P4之鑽石工具10。且該基底11之下方藉由硬焊等可容易而穩定地安裝於工具托架。此時，於基底11之下方，外周面留有特定長度，藉由使該面接觸於工具托架可相對於工具托架確實地定位鑽石工具10。 另，於該實施形態中，雖於四角柱之基底11之上表面之頂點12a～12a先形成頂面16a～16d，其次形成傾斜面17a～17h，但亦可先形成各傾斜面17a～17h，其後形成頂面16a～16d。無論哪種情形，於加工頂面、形成傾斜面、加工稜線時，即使於頂面側產生缺口之情形，只要再次僅加工該頂面，便不會對其他尖頭之頂面造成影響。又，關於傾斜面亦同樣，於1個尖頭之稜線加工時，不會對鄰接之尖頭之傾斜面及頂面造成影響。 於上述之各實施形態中，雖於四角柱之基底之上表面之各頂點附近之4個部位設置尖頭，但尖頭並無必要4個部位全部設置，至少2個部位即可。又，於該實施形態中使用四角柱之基底，但並未限定於四角柱，只要於多角柱之上表面之頂點形成尖頭即可。 圖5係顯示將鑽石工具10安裝於劃線頭單元30之狀態之前視圖及側視圖。鑽石工具10係如圖5所示般保持於工具托架20。工具托架20為長方體狀之構件，並於其下端以鑽石工具10之尖頭P1成為下端之方式傾斜保持鑽石工具10。於工具托架20設置有2個螺絲孔，藉此固定於劃線頭單元30。 劃線頭單元30構成為藉由未圖示之滑動機構，使板狀之頭板31本身全體上下移動。且，於該頭板31固定有劃線荷重用之氣缸32。於氣缸32之下端伸縮自在地突出桿32a。另，如圖5(b)所示，於頭板31之桿32a之下方，設置有引導機構33與滑動部34，以特定荷重將滑動部34向下方按壓。引導機構33係以上下移動自如地保持滑動部34者。於滑動部34設置有L字形之薄板35。薄板35與滑動部34一起上下移動，但因止動部36而限制下限。且，於該薄板35藉由螺栓斜向固定有工具托架20。且，藉由使劃線頭單元30向箭頭A方向移動而可進行劃線。 針對使用該實施形態之鑽石工具10劃線之情形，使用圖6至圖9進行說明。於開始劃線時，首先如圖6所示使鑽石工具10之尖頭P1接近基板40，並使劃線頭單元30下降。此時，如圖10之尖頭P1周邊之放大圖所示，上表面12與脆性材料基板所成之角度θ3較佳設為15°～20°；以使鑽石工具10之尖頭P較基板40之上表面低，且使高度差D對應於基板40之厚度而設為0.05～0.2 mm左右之方式，押下劃線頭單元30。接著使劃線頭單元30自基板40之左側面向右移動。如此，如圖7所示，鑽石工具10之上表面12與基板40之左上端部接觸。即，上表面12之至少一部分或全部，作為將尖頭P1引導至基板40之引導面而發揮作用。此時，如圖11之放大圖所示，尖頭P1與基板40之間隔F由角度θ3與高度差D決定，例如θ3=15°、D=0.2 mm，則F大約為0.78 mm。因此，引導面12於稜線18a之延長線上具有0.8 mm以上，較佳為具有1.0 mm以上之長度即可。又，上表面12為正方形時，上表面12之一邊之長度較佳為0.7 mm以上。藉此，即使於以外切開始劃線之情形，與用於劃線之劃線端不同之劃線端亦不會接觸基板，可防止劃線端及基板端部之意外損傷。 其次，若使鑽石工具朝箭頭A方向移動，則如圖8所示，基板40抵抗氣缸32之壓力僅將滑動部34上推，薄板35本身上升。再者，若使劃線頭單元30向右側移動，則引導面12相對於基板40滑動且包含頂面16a之劃線端P1之周邊部分進入基板40，可開始自基板40之端部之劃線，即開始外切劃線，並自基板40之端部形成劃線。再者，若使劃線頭單元30向箭頭A方向移動，則可以鑽石工具10之頂面16a先行，稜線18a成為後方之方式，進行劃線。如上述，於外切劃線開始時，首先鑽石工具10之上表面(引導面)12與基板40之左上端部接觸，其後藉由包含頂面16a之劃線端藉由引導面引導並接觸於基板40，因而即使藉由外切開始劃線，亦可防止其他劃線端之損傷。進而，藉由寬度較廣之頂面先行，稜線自後方接觸基板，則應力亦不會集中於基板40之端部，而可抑制劃線開始時之基板端部之損傷。 再者，如圖9所示之劃線直至偏離基板40之端部(外切劃線)。此時，鑽石工具10係一邊使稜線18a之一部分僅按壓基板之端部，一邊自基板離開。結束劃線之情形亦因於鑽石工具10之劃線端P之附近，即於與稜線之頂面相反側無其他劃線端，故可不必考慮其他劃線端之損傷，而以外切結束劃線。進而又於劃線終端，藉由稜線18a之一部分按壓基板，可於劃線下方確實地形成垂直裂縫。 又於上述之各實施形態中，以單晶體鑽石構成基底全體，但由於與脆性材料基板接觸之表面部分只要為鑽石即足夠，故亦可於使用超硬合金或燒結鑽石製形成之基底之外周面及稜線之表面形成多結晶鑽石層，進而精密地研磨該鑽石層形成劃線端。又，亦可使用摻雜硼等不純物而帶有導電性之單結晶或多結晶鑽石。藉由使用具有導電性之鑽石，可藉由放電加工容易地形成傾斜面。 [產業上之可利用性] 本發明之鑽石工具可較好地使用於以外切脆性材料基板而開始劃線，且以外切結束劃線之劃線裝置。Next, an embodiment of the present invention will be described. 2 is a plan view and a front view showing a manufacturing process of a diamond tool according to an embodiment of the present invention. This diamond tool is a single crystal diamond with a square prism of a certain height as the base 11. The base 11 has an upper surface 12 and a rectangular outer peripheral surface 13a to 13d. The upper surface 12 is a square, and the vertices of the four corners of the upper surface 12 are set to 12a to 12d. A scribed end is formed on each of the vertexes 12 a to 12 d of the upper surface 12 of the base 11. Next, the processing of the scribe ends of the four corner vertices formed on the upper surface 12 will be described. As shown in FIG. 3 (a) and FIG. 4, one vertex 12a of the upper surface 12 is perpendicular to the bisector 15 (refer to FIG. 2 (a)) which divides the upper surface 12 containing the vertex 12a in equal intervals. The line becomes a slice 14a of the upper surface 12 and forms a top surface 16a in such a manner that it is inclined at an angle θ1 from the upper surface 12 to the outer peripheral surfaces 13a and 13b. As shown in FIG. 3 (a), the vertex 12b of the upper surface 12 is a slice 15a of the upper surface 12 by a line perpendicular to the bisector 14 containing the upper surface 12 of the vertex 12b. The top surface 16b is formed so that the outer peripheral surfaces 13b and 13c are inclined at an angle θ1. As shown in FIG. 3 (a), the vertex 12c of the upper surface 12 becomes a slice 14b of the upper surface 12 by a line perpendicular to the bisector 15 and is inclined by an angle θ1 from the upper surface 12 to the outer peripheral surfaces 13c and 13d. The top surface 16c is formed. As for the vertex 12d of the upper surface 12, as shown in FIG. 3 (a), a line 15 perpendicular to the bisector 14 becomes a slice 15b of the upper surface 12, and an angle θ1 is inclined from the upper surface 12 to the outer peripheral surfaces 13d and 13a. The top surface 16d is formed. Here, the angle θ1 is set to more than 0 ° and 15 ° or less, and preferably 1 ° to 10 °. If it is close to 0 °, the processing area becomes large, and it takes time to process. At the same time, it may affect other top surfaces when processing the top surface. If it exceeds 15 °, processing of the inclined surface described later becomes difficult. Next, as shown in FIG. 3 (a) and FIG. 4, as for the vertex 12a, the portion contacting the top surface 16a of the outer peripheral surface 13a is formed to form an inclined surface 17a, and the top surface 16a of the outer peripheral surface 13b is contacted by polishing The inclined surface 17b is partially formed. At this time, if the line formed by the two inclined surfaces 17a and 17b is the ridgeline 18a, then in the plan view of FIG. 3 (a), the inclined surfaces 17a and 17b are symmetrical, and the ridgeline 18a becomes parallel to the bisector. The method of 15 forms inclined surfaces 17a and 17b. And the intersection of the top surface 16a and the ridgeline 18a formed in this way is set as the pointed point P1. Next, as for the vertex 12b, as shown in FIG. 3 (a), the part contacting the top surface 16b of the outer peripheral surface 13b forms an inclined surface 17c, and the part contacting the top surface 16b of the outer peripheral surface 13c forms an inclined surface. Face 17d. At this time, if the line formed by the two inclined surfaces 17c and 17d is set as the ridgeline 18b, then in the plan view of FIG. 3 (a), the inclined surfaces 17c and 17d are symmetrical and the ridgeline 18b becomes parallel to the bisector The method of 14 forms inclined surfaces 17c and 17d. The intersection of the top surface 16b and the ridgeline 18b formed in this manner is referred to as a pointed point P2. In addition, although the inclined surface 17b of the pointed P1 and the inclined surface 17c of the pointed P2 are ground from the same outer peripheral surface 13c, they are independent surfaces. That is, as for the inclined surface, since each of the pointed surfaces forms a different surface, the polishing of each inclined surface does not affect the inclined surfaces of the other pointed surfaces. Next, regarding the vertex 12c, as shown in FIG. 3 (a), the portion contacting the top surface 16c of the outer peripheral surface 13c forms an inclined surface 17e, and the portion contacting the top surface 16c of the outer peripheral surface 13d is formed to be inclined. Face 17f. At this time, if the line formed by the two inclined surfaces 17e and 17f is the ridgeline 18c, then in the plan view of FIG. 2 (a), the inclined surfaces 17e and 17f are symmetrical, and the ridgeline 18c becomes parallel to the bisector 15 In this way, the inclined surfaces 17e and 17f are formed. And the intersection point of the top surface 16c and the ridgeline 18c formed in this way is set as the pointed point P3. Next, regarding the vertex 12d, as shown in FIG. 3 (a), the part contacting the top surface 16d of the outer peripheral surface 13d is ground to form an inclined surface 17g, and the part contacting the top surface 16d of the outer peripheral surface 13a is ground to form an inclined surface. 17h. At this time, if the line formed by the two inclined surfaces 17g and 17h is set as the ridgeline 18d, then in the plan view of FIG. 3 (a), the inclined surfaces 17g and 17h are symmetrical and the ridgeline 18d becomes parallel to the bisector 14 In this way, inclined surfaces 17g and 17h are formed. And the intersection of the top surface 16d and the ridgeline 18d formed in this way is set as the pointed point P4. Here, as shown in FIG. 4, the angle θ2 formed by the top surface 16 a and the ridge line 18 a is preferably 130 ° or more and 160 ° or less. In order for the angle θ2 to have this value, the angle θ1 between the upper surface 12 and the top surface 16d is preferably 15 ° or less. The same is true for other vertices. This can be set as a diamond tool 10 having pointed points P1 to P4 near the vertices 12a to 12d of the base 12 of the quadrangular prism. The lower part of the base 11 can be easily and stably mounted on the tool holder by brazing or the like. At this time, a certain length is left on the outer peripheral surface below the base 11, and the diamond tool 10 can be reliably positioned relative to the tool holder by bringing the surface into contact with the tool holder. Moreover, in this embodiment, although the top surfaces 16a-16d are formed first on the vertices 12a-12a of the upper surface of the base 11 of the quadrangular pillar, and the inclined surfaces 17a-17h are formed next, each of the inclined surfaces 17a-17h may be formed first. Then, the top surfaces 16a-16d are formed. In any case, when machining the top surface, forming the inclined surface, and processing the ridge line, even if there is a notch on the side of the top surface, as long as only the top surface is processed again, it will not affect the top surfaces of other sharp points. The same applies to the inclined surface, and it does not affect the inclined surface and the top surface of the adjacent sharp edge during the ridge processing of one sharp edge. In each of the above-mentioned embodiments, although there are four points near the apexes on the upper surface of the base of the quadrangular pillar, it is not necessary to set all four points, at least two points. In this embodiment, the base of the quadrangular pillar is used, but it is not limited to the quadrangular pillar, as long as a point is formed at the vertex of the upper surface of the polygonal pillar. FIG. 5 is a front view and a side view showing a state where the diamond tool 10 is mounted on the scribe head unit 30. The diamond tool 10 is held on a tool holder 20 as shown in FIG. 5. The tool holder 20 is a rectangular parallelepiped member, and the diamond tool 10 is held at its lower end so that the tip P1 of the diamond tool 10 becomes the lower end. The tool holder 20 is provided with two screw holes for fixing to the scribing head unit 30. The scribing head unit 30 is configured to move the entire plate-shaped head plate 31 itself up and down by a sliding mechanism (not shown). In addition, an air cylinder 32 for scribe load is fixed to the head plate 31. A rod 32a is telescopically projected from the lower end of the cylinder 32. Further, as shown in FIG. 5 (b), a guide mechanism 33 and a sliding portion 34 are provided below the lever 32a of the head plate 31, and the sliding portion 34 is pressed downward with a specific load. The guide mechanism 33 is a person who holds the sliding portion 34 in a freely movable manner. An L-shaped thin plate 35 is provided on the sliding portion 34. The thin plate 35 moves up and down together with the slide portion 34, but the lower limit is restricted by the stopper portion 36. A tool bracket 20 is fixed to the thin plate 35 obliquely by bolts. Then, the scribing head unit 30 can be moved by moving the scribing head unit 30 in the direction of the arrow A. A case where the diamond tool 10 according to this embodiment is used for scribing will be described with reference to FIGS. 6 to 9. When the scribing is started, first, as shown in FIG. 6, the tip P1 of the diamond tool 10 is brought close to the substrate 40, and the scribing head unit 30 is lowered. At this time, as shown in the enlarged view around the tip P1 of FIG. 10, the angle θ3 between the upper surface 12 and the brittle material substrate is preferably set to 15 ° -20 °; so that the tip P of the diamond tool 10 is more than the substrate The upper surface of 40 is low, and the height difference D is set to about 0.05 to 0.2 mm according to the thickness of the substrate 40, and the scribe head unit 30 is pushed down. Next, the scribing head unit 30 is moved to the right from the left side of the substrate 40. In this way, as shown in FIG. 7, the upper surface 12 of the diamond tool 10 is in contact with the upper left end of the substrate 40. That is, at least a part or all of the upper surface 12 functions as a guide surface that guides the tip P1 to the substrate 40. At this time, as shown in the enlarged view of FIG. 11, the interval F between the tip P1 and the substrate 40 is determined by the angle θ3 and the height difference D. For example, if θ3 = 15 ° and D = 0.2 mm, F is about 0.78 mm. Therefore, the guide surface 12 may have a length of 0.8 mm or more on the extension line of the ridgeline 18a, and preferably a length of 1.0 mm or more. When the upper surface 12 is a square, the length of one side of the upper surface 12 is preferably 0.7 mm or more. Thereby, even if the scribing is started at the circumcision, the scribing end different from the scribing end used for scribing will not contact the substrate, and accidental damage to the scribing end and the end of the substrate can be prevented. Next, if the diamond tool is moved in the direction of arrow A, as shown in FIG. 8, the substrate 40 pushes the sliding portion 34 only against the pressure of the air cylinder 32, and the thin plate 35 itself rises. Furthermore, if the scribing head unit 30 is moved to the right, the guide surface 12 slides relative to the substrate 40 and the peripheral portion including the scribing end P1 of the top surface 16a enters the substrate 40, and the drawing from the end of the substrate 40 can be started Line, that is, a circumscribed line is started, and a scribed line is formed from an end of the substrate 40. Furthermore, if the scribing head unit 30 is moved in the direction of the arrow A, the top surface 16a of the diamond tool 10 can be advanced, and the ridgeline 18a can be drawn backward. As described above, at the beginning of the circumscribed scribe, first the upper surface (guide surface) 12 of the diamond tool 10 is in contact with the upper left end of the substrate 40, and then guided by the guide surface through the scribe end including the top surface 16a and Since it is in contact with the substrate 40, even if scribing is started by cutting out, damage to other scribing ends can be prevented. Furthermore, by having the wide top surface in advance and the ridgeline contacting the substrate from behind, the stress will not be concentrated on the end portion of the substrate 40, and damage to the end portion of the substrate at the beginning of scribing can be suppressed. Further, the scribe line shown in FIG. 9 is offset from the end portion (outline scribe line) of the substrate 40. At this time, the diamond tool 10 is separated from the substrate while pressing a part of the ridge 18a only on the end of the substrate. The end of the scribe is also near the scribe end P of the diamond tool 10, that is, there is no other scribe end on the side opposite to the top surface of the ridge line. Therefore, it is unnecessary to consider the damage of the other scribe end, and the end cut is finished line. Furthermore, at the end of the scribe line, a part of the ridge line 18a presses the substrate, and a vertical crack can be surely formed under the scribe line. In each of the above-mentioned embodiments, the entire substrate is made of single crystal diamond. However, since the surface portion in contact with the brittle material substrate is sufficient as the diamond, it can also be used on the outer peripheral surface of the substrate formed of cemented carbide or sintered diamond. A polycrystalline diamond layer is formed on the surface of the ridge line, and the diamond layer is precisely ground to form a scribe end. Alternatively, a single crystal or polycrystalline diamond doped with impurities such as boron and having conductivity may be used. By using a diamond having conductivity, an inclined surface can be easily formed by electric discharge machining. [Industrial Applicability] The diamond tool of the present invention can be suitably used as a scribing device for starting a scribing of a substrate made of a brittle material outside, and ending the scribing after cutting.
10‧‧‧鑽石工具10‧‧‧ Diamond Tools
11‧‧‧基底11‧‧‧ substrate
12‧‧‧上表面(引導面)12‧‧‧upper surface (guide surface)
12a～12d‧‧‧頂點12a ～ 12d‧‧‧Vertex
13a～13d‧‧‧外周面13a ～ 13d‧‧‧outer surface
14‧‧‧等分線14‧‧‧ bisector
14a～14b‧‧‧切片14a ～ 14b‧‧‧‧Slice
15‧‧‧等分線15‧‧‧ bisector
15a～15b‧‧‧切片15a ～ 15b‧‧‧‧Slice
16a～16d‧‧‧頂面16a ～ 16d‧‧‧Top surface
17a～17h‧‧‧傾斜面17a ～ 17h‧‧‧inclined surface
18a～18d‧‧‧稜線18a ～ 18d‧‧‧Edge
20‧‧‧工具托架20‧‧‧tool holder
30‧‧‧劃線頭單元30‧‧‧ scribing head unit
31‧‧‧頂板31‧‧‧Top plate
32‧‧‧氣缸32‧‧‧ cylinder
32a‧‧‧桿32a‧‧‧
33‧‧‧引導機構33‧‧‧Guiding agency
34‧‧‧滑動部34‧‧‧ sliding section
35‧‧‧薄板35‧‧‧ Sheet
36‧‧‧止動部36‧‧‧ Stop
40‧‧‧基板40‧‧‧ substrate
100‧‧‧劃線工具100‧‧‧ Crossing tool
101‧‧‧基板101‧‧‧ substrate
A‧‧‧方向A‧‧‧ direction
D‧‧‧高度差D‧‧‧ height difference
F‧‧‧間隔F‧‧‧ interval
P1～P4‧‧‧劃線端P1 ～ P4‧‧‧scribe end
θ1～θ3‧‧‧角度θ1 ～ θ3‧‧‧‧ angle
圖1(a)、(b)係顯示使用為角板狀且於1個角具有2個劃線端之鑽石工具之劃線之側視圖。 圖2(a)、(b)係顯示本發明之實施形態之鑽石工具之製造過程之俯視圖及前視圖。 圖3(a)、(b)係實施形態之鑽石工具之俯視圖及前視圖。 圖4係顯示本發明之實施形態之鑽石工具之劃線端部分之部分放大圖。 圖5(a)、(b)係顯示安裝有本發明之實施形態之鑽石工具之劃線頭之前視圖及側視圖。 圖6係顯示使用本發明之實施形態之鑽石工具劃線之前視圖(其1)。 圖7係顯示使用本發明之實施形態之鑽石工具劃線之前視圖(其2)。 圖8係顯示使用本發明之實施形態之鑽石工具劃線之前視圖(其3)。 圖9係顯示使用本發明之實施形態之鑽石工具劃線之前視圖(其4)。 圖10係本實施形態之劃線開始前之劃線端P之放大圖。 圖11係本實施形態之劃線開始時之劃線端P之周邊之放大圖。Figures 1 (a) and (b) are side views showing the scribe lines of a diamond tool having a corner plate shape and two scribe ends at one corner. 2 (a) and (b) are a plan view and a front view showing a manufacturing process of a diamond tool according to an embodiment of the present invention. 3 (a) and 3 (b) are a plan view and a front view of a diamond tool according to an embodiment. FIG. 4 is an enlarged view of a part of a scribe end of a diamond tool according to an embodiment of the present invention. 5 (a) and 5 (b) are a front view and a side view showing a scribing head on which a diamond tool according to an embodiment of the present invention is installed. FIG. 6 is a front view (part 1) showing the use of a diamond tool according to an embodiment of the present invention. FIG. 7 is a front view (part 2) showing the use of a diamond tool according to an embodiment of the present invention. FIG. 8 is a front view (part 3) showing the use of a diamond tool according to an embodiment of the present invention. Fig. 9 is a front view of a diamond tool using a diamond tool according to an embodiment of the present invention (part 4). FIG. 10 is an enlarged view of the scribe end P before the scribe is started in this embodiment. FIG. 11 is an enlarged view of the periphery of the scribing end P at the beginning of scribing in this embodiment.
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016191079A JP2018051945A (en) | 2016-09-29 | 2016-09-29 | Diamond tool and its scribing method |
| JP??2016-191079 | 2016-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201815540A true TW201815540A (en) | 2018-05-01 |
Family
ID=61780689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106127235A TW201815540A (en) | 2016-09-29 | 2017-08-11 | Diamond tool and scribing method thereof enabling scribing to be started from the outside of the substrate and ended with external cutting and capable of preventing damages to the scribing ends even at the end of scribing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018051945A (en) |
| KR (1) | KR20180035668A (en) |
| CN (1) | CN107877716A (en) |
| TW (1) | TW201815540A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018131179A1 (en) * | 2018-12-06 | 2020-06-10 | Schott Ag | Glass element with cut edge and process for its production |
| US11798564B2 (en) * | 2019-06-28 | 2023-10-24 | Nec Corporation | Spoofing detection apparatus, spoofing detection method, and computer-readable storage medium |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5718647U (en) * | 1980-07-04 | 1982-01-30 | ||
| JPH11314928A (en) * | 1997-09-25 | 1999-11-16 | Beldex:Kk | Scribing device and its method |
| JP4472112B2 (en) * | 2000-05-10 | 2010-06-02 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus based thereon |
| CN101042487A (en) * | 2001-11-08 | 2007-09-26 | 夏普株式会社 | Liquid crystal panel |
| TW200403192A (en) * | 2002-07-18 | 2004-03-01 | Mitsuboshi Diamond Ind Co Ltd | Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head |
| US7302761B2 (en) * | 2005-10-05 | 2007-12-04 | Loomis Industries, Inc. | Automatic tool tilting apparatus for a scribe tool |
| KR20070103188A (en) * | 2006-04-18 | 2007-10-23 | 주식회사 탑 엔지니어링 | Apparatus for scribing substrate |
| JP2011088382A (en) * | 2009-10-23 | 2011-05-06 | Mitsuboshi Diamond Industrial Co Ltd | Breaking device and breaking method |
| JP2011155151A (en) * | 2010-01-27 | 2011-08-11 | Mitsuboshi Diamond Industrial Co Ltd | Scribing apparatus for thin-film solar cell |
| TWI498293B (en) * | 2011-05-31 | 2015-09-01 | Mitsuboshi Diamond Ind Co Ltd | Scribe method, diamond point and scribe apparatus |
| CN203487032U (en) * | 2013-09-18 | 2014-03-19 | 永润应用材料股份有限公司 | Cutting equipment for optical glass and diamond cutter of cutting equipment |
| JP2015063020A (en) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | Scribe head, scribe device and scribe method |
| CN203639329U (en) * | 2013-11-08 | 2014-06-11 | 蚌埠朝阳玻璃机械有限公司 | Cutter box of glass cutting machine |
| JP6476892B2 (en) * | 2015-01-20 | 2019-03-06 | 三星ダイヤモンド工業株式会社 | Multipoint diamond tools |
-
2016
- 2016-09-29 JP JP2016191079A patent/JP2018051945A/en not_active Ceased
-
2017
- 2017-08-11 TW TW106127235A patent/TW201815540A/en unknown
- 2017-09-11 KR KR1020170116148A patent/KR20180035668A/en not_active Application Discontinuation
- 2017-09-15 CN CN201710839501.2A patent/CN107877716A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN107877716A (en) | 2018-04-06 |
| JP2018051945A (en) | 2018-04-05 |
| KR20180035668A (en) | 2018-04-06 |
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