CN107877716A - Diamond cutter and its scribble method - Google Patents
Diamond cutter and its scribble method Download PDFInfo
- Publication number
- CN107877716A CN107877716A CN201710839501.2A CN201710839501A CN107877716A CN 107877716 A CN107877716 A CN 107877716A CN 201710839501 A CN201710839501 A CN 201710839501A CN 107877716 A CN107877716 A CN 107877716A
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- China
- Prior art keywords
- substrate
- line
- diamond cutter
- blade
- top surface
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The present invention relates to diamond cutter and its scribble method, when being rule its can on the outside of the substrate line and line can be terminated with circumscribed.For the angle of the prismatic pedestal (11) of diamond cutter (10), formed from the inclined top surface in upper surface and from the inclined inclined plane in side, and using as the crest line of the intersecting lens of inclined plane and the intersection point of top surface as blade.Using upper surface as guide surface, and contacted with guide surface with base ends, after preset distance is slided, the mode that top surface contacts with base ends starts to rule.Because guide surface has predetermined length, so being damaged without having to worry about other blades, line of beginning can be cut in addition.Also, there is no other blades at the rear in line direction, so as to can prevent blade to be damaged when terminating and ruling yet.
Description
Technical field
The present invention relates to for being rule to brittle substrates such as glass substrate, silicon wafers by diamond icking tool
Diamond cutter and its scribble method.
Background technology
At present, in order to be rule to glass substrate, silicon wafer, employ one kind and use stitch marker, based single crystal Buddha's warrior attendant
The cutter of the diamond icking tool of stone.For glass substrate, the stitch marker rolled relative to substrate is mainly employed, but draw from improving
The advantages that substrate strength after line, sets out, and is also studying the use of the diamond icking tool as fixing cutter.In patent document 1,2
It is proposed the multi-point cutter for being rule to the substrate of the high rigidity such as sapphire wafer, aluminum oxide wafer.These are special
Employ cutter cutting edge being arranged on the crest line of pyramid in sharp document, the cutter that front end is circular cone.Moreover, patent document
It is proposed in 3 and a kind of employs the chalker of the Glass scriber with cone-shaped nose to be rule to glass plate.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2003-183040 publications
Patent document 2：Japanese Unexamined Patent Publication 2005-079529 publications
Patent document 3：Japanese Unexamined Patent Publication 2013-043787 publications
The content of the invention
Invention technical problems to be solved
When being rule by the existing cutter for being used as fixing cutter, blade can be worn, so needing to change blade.
Also, when being rule with cutter, blade needs to contact with substrate at a proper angle.But according to existing cutter,
Cutter need to be made to rotate vertically when changing blade, it is difficult to accurately adjust the contact angle.
Therefore, as shown in Figure 1, it is contemplated that by each summit of gusset shape cutter be ground into two sides it is overlapping and formed tilt
Face, the line cutter 100 using the intersecting lens both sides of inclined plane as blade P1, P2 ....When cutter of being rule as utilization, and
When the crest line preceding is arrived to blade P1 on substrate 101 to be rule as shown in Fig. 1 (a), even with line
During by line of the so-called circumscribed end of the end of substrate to substrate 101, adjacent another blade P2 bands will not be also given
To damage.On the other hand, cut beyond be intended to when beginning line, preceding blade P2 be possible to collide with the end of substrate 101 and
It is impaired.
In contrast, as shown in Fig. 1 (b), obliquely enter forwards in a manner of crest line is at rear when using blade P2
During row line, even cut line of beginning in addition also will not bring damage to another blade P1.But exist circumscribed when terminating
When the blade P1 that does not use be also possible to contact with the face of substrate 101 and it is impaired the problem of.
Therefore, but can not be with the case where cutting line of having begun in addition when being rule with such line cutter
Circumscribed end, cut and begin within being needed in the case of being rule with circumscribed end.Therefore, in the one end meeting of the substrates such as glass plate
The remaining part not being scribed.So, when disconnecting the substrate rule through inscribe along line, the edge of substrate for not forming line be present
The problem of disconnection deterioration in accuracy at portion.
The present invention be in view of it is such existing the problem of and make, its object is to, there is provided one kind can beyond cut
Begin and terminate the diamond cutter and its scribble method of line.
For solving the scheme of technical problem
In order to solve the above-mentioned technical problem, diamond cutter of the invention has：Prismatic pedestal, the pedestal include
Upper surface and multiple outer peripheral faces perpendicular to the upper surface；Top surface, at least two in the upper surface of the prismatic pedestal
At individual angle, tilted and formed from the upper surface in a manner of the line vertical with bisector is turned into section, the bisector includes
The angle of the upper surface is interiorly by the upper surface decile；And a pair of angled face, from two abutted with the top surface
The individual outer peripheral face is formed towards the corresponding overturning angle, and the diamond cutter is incited somebody to action using the upper surface as guide surface
The intersection point of the pair of inclined plane and the top surface is as blade.
Wherein, the length of the guide surface can also be more than 0.8mm.
Wherein or, the prismatic pedestal is quadrangular, and the upper surface is square, the upper surface
One side length in more than 0.7mm.
In order to solve the above-mentioned technical problem, the scribble method for employing diamond cutter of the invention includes：With the gold
The diamond cutter is held in scribe head by the mode under one blade of diamond cutter is located at most；The scribe head is pushed,
So that in the outside of substrate, position of the blade positioned at the upper surface than the substrate more on the lower；It is and described by making
The upper surface of scribe head and the substrate is moved parallel to, so that the ends contact of the guide surface and the substrate, described
After guide surface slides preset distance in the end of the substrate, the ends contact of the top surface and the substrate and start circumscribed
Line.
Wherein, can also rule to the end of the substrate, the local edge of the crest line presses the end of the substrate, side
Separated with the end of the substrate, so as to terminate to rule.
Invention effect
, can be since the end face of brittle substrate, i.e. by drawing circumscribed according to the present invention with such feature
Line.Therefore, it can obtain when disconnecting substrate along line after terminating to rule, good section can be also obtained in the end of substrate
Effect.
Brief description of the drawings
Fig. 1 (a) and (b) is to show to be drawn using the diamond cutter for having two blades at an angle of gusset shape
The side view of line.
Fig. 2 (a) and (b) be the manufacturing process for showing the diamond cutter according to embodiment of the present invention plan with
And front view.
Fig. 3 (a) and (b) is the plan and front view of the diamond cutter according to embodiment.
Fig. 4 is the partial enlarged drawing for the knife edge part for showing the diamond cutter according to embodiment of the present invention.
Fig. 5 (a) and (b) is the main view for showing to be provided with the scribe head of the diamond cutter according to embodiment of the present invention
Figure and side view.
Fig. 6 be show to employ the line of the diamond cutter according to embodiment of the present invention front view (one of).
Fig. 7 is the front view (two) for showing to employ the line of the diamond cutter according to embodiment of the present invention.
Fig. 8 is the front view (three) for showing to employ the line of the diamond cutter according to embodiment of the present invention.
Fig. 9 is the front view (four) for showing to employ the line of the diamond cutter according to embodiment of the present invention.
Figure 10 is the enlarged drawing of the blade P before the line of present embodiment starts.
Figure 11 is blade P when starting to rule of present embodiment periphery enlarged drawing.
Embodiment
Then, embodiments of the present invention are illustrated.Fig. 2 is the system for showing the diamond cutter according to embodiment of the present invention
Make the plan and front view of process.The diamond cutter is using the single-crystal diamond of the quadrangular of certain altitude as pedestal
11.The pedestal 11 has outer peripheral face 13a~13d of upper surface 12 and surrounding.Upper surface 12 is square, by the four of upper surface 12
The summit in week is set to 12a~12d.For the pedestal 11, blade (knife is generated in each summit 12a~12d parts of upper surface 12
Point；ポイント).
Then, the processing for being formed at the blade on the summit of the surrounding of upper surface 12 is illustrated.For a top of upper surface 12
Point 12a, as shown in Fig. 3 (a) and Fig. 4 so that with comprising summit 12a interiorly by the bisector 15 of the decile of upper surface 12
((a) of reference picture 2) vertical line turns into section (the Japanese statement of upper surface 12：Section) 14a mode, from the court of upper surface 12
The ground of outer peripheral face 13a, 13b tilt angle theta 1 forms top surface 16a.
For the summit 12b of upper surface 12, as shown in Fig. 3 (a) so that with comprising summit 12b interiorly by upper table
The vertical line of the bisector 14 of the decile of face 12 turns into the section 15a of upper surface 12 mode, from upper surface 12 towards outer peripheral face 13b,
The ground of 13c tilt angle thetas 1 forms top surface 16b.
For the summit 12c of upper surface 12, as shown in Fig. 3 (a), so that the line vertical with bisector 15 turns into upper surface
12 section 14b mode, top surface 16c is formed from upper surface 12 towards the ground of outer peripheral face 13c, 13d tilt angle theta 1.
For the summit 12d of upper surface 12, as shown in Fig. 3 (a), so that the line vertical with bisector 14 turns into upper surface
12 section 15b mode, top surface 16d is formed from upper surface 12 towards the ground of outer peripheral face 13d, 13a tilt angle theta 1.Wherein, angle, θ
1 is set to more than 0 ° and below 15 °, preferably at 1 °~10 °.During close to 0 °, working (finishing) area increase, process time is spent, and
It is possible to bring influence to other top surfaces when processing top surface.When more than 15 °, the processing of inclined plane described later becomes difficult.
Then, for summit 12a, shown in (a), Fig. 4 such as Fig. 3, the grinding outer peripheral face 13a portion to connect with top surface 16a
Point, inclined plane 17a is formed, also, the outer peripheral face 13b part to connect with top surface 16a is ground, form inclined plane 17b.At this moment,
When line formed by two inclined planes 17a, 17b is set into crest line 18a, in the plan of Fig. 3 (a), with inclined plane 17a, 17b
Symmetrically, and crest line 18a forms inclined plane 17a, 17b parallel to the mode of bisector 15.The top surface 16a and rib that will be consequently formed
Line 18a intersection point is as blade (point of a knife；ポイント)P1.
Then, for summit 12b, as shown in Fig. 3 (a), the outer peripheral face 13b part to connect with top surface 16b, shape are ground
Into inclined plane 17c, also, the outer peripheral face 13c part to connect with top surface 16b is ground, form inclined plane 17d.At this moment, by two
It is symmetrical with inclined plane 17c, 17d in the plan of Fig. 3 (a) when line formed by inclined plane 17c, 17d is set to crest line 18b,
And crest line 18b forms inclined plane 17c, 17d parallel to the mode of bisector 14.By the top surface 16b being consequently formed and crest line 18b
Intersection point as blade P2.It should be noted that although blade P1 inclined plane 17b and blade P2 inclined plane 17c grindings are certainly
Same outer peripheral face 13c, but respectively independent face.I.e., on inclined plane, corresponding each blade is formed and different faces, so
The grinding of each inclined plane will not give the inclined plane of other blades to bring influence.
Then, for summit 12c, as shown in Fig. 3 (a), the outer peripheral face 13c part to connect with top surface 16c, shape are ground
Into inclined plane 17e, also, the outer peripheral face 13d part to connect with top surface 16c is ground, form inclined plane 17f.At this moment, by two
It is symmetrical with inclined plane 17e, 17f in the plan of Fig. 2 (a) when line formed by inclined plane 17e, 17f is set to crest line 18c,
And crest line 18c forms inclined plane 17e, 17f parallel to the mode of bisector 15.By the top surface 16c being consequently formed and crest line 18c
Intersection point as blade P3.
Then, for summit 12d, as shown in Fig. 3 (a), the outer peripheral face 13d part to connect with top surface 16d, shape are ground
Into inclined plane 17g, also, the outer peripheral face 13a part to connect with top surface 16d is ground, form inclined plane 17h.At this moment, by two
It is symmetrical with inclined plane 17g, 17h in the plan of Fig. 3 (a) when line formed by inclined plane 17g, 17h is set to crest line 18d,
And crest line 18d forms inclined plane 17g, 17h parallel to the mode of bisector 14.By the top surface 16d being consequently formed and crest line 18d
Intersection point as blade P4.
Wherein, as shown in figure 4, top surface 16a and crest line 18a angulations θ 2 is less than 160 ° preferably more than 130 °.For
Angle, θ 2 is set to be formed as such value, it is preferable that upper surface 12 and top surface 16d angle, θ 1 is below 15 °.For other tops
Point is also same.Thus, it is possible to be formed as that there is blade P1~P4 near each summit 12a~12d of the pedestal 12 of quadrangular
Diamond cutter 10.In addition, paying け by soldering (ロ ー) etc., easily and stably the lower section of the pedestal 11 can be installed
In knives rack.At this moment, the outer peripheral face of predetermined length is left in the lower section of pedestal 11, the face is contacted with knives rack, so as to
Diamond cutter 10 can be reliably positioned at knives rack.
It should be noted that in this embodiment, summit 12a~12d of the upper surface of the first pedestal 11 in quadrangular
Top surface 16a~16d is formed, is subsequently formed inclined plane 17a~17h, but each inclined plane 17a~17h can also be initially formed, afterwards
Re-form top surface 16a~16d.Either any situation, when processing crest line processing top surface and forming inclined plane, even if
As long as also only processing the top surface again when gap occurs in top surface side, the top surface of other blades will not be given to bring influence.
Also, it is also that similarly, when the crest line for carrying out a blade is processed, the inclined plane of adjacent blade will not be given on inclined plane
And top surface brings influence.
In above-mentioned each embodiment, knife is provided with everywhere near each summit of the upper surface of quadrangular pedestal
Sword, but have to blade be all not necessarily set everywhere, as long as being set at least two.Also, in this embodiment,
The pedestal of quadrangular is employed, but is not limited to quadrangular, blade is formed on the summit of the upper surface of polygon prism.
Fig. 5 is the front view and side view for showing diamond cutter 10 being installed on the state of line head unit 30.
As shown in figure 5, diamond cutter 10 is maintained on knives rack 20.Knives rack 20 is the part of rectangular-shape, diamond tool
Tool 10 is tiltedly maintained at the lower end of knives rack 20 in a manner of blade P1 is in lower end.Screw at two is provided with knives rack 20
Hole, thus, it is fixed in line head unit 30.
Line head unit 30 is configured to, and the head plate 31 of tabular itself is moved down on the whole by sliding equipment (not shown)
It is dynamic.In addition, the cylinder 32 of line load is fixed with the head plate 31.The lower end of cylinder 32 is protruded in a manner of freely stretching
There is bar 32a.As shown in Fig. 5 (b), guiding mechanism 33 and sliding part 34 are provided with the bar 32a of head plate 31 lower section, with predetermined
Load presses downwards sliding part 34.Sliding part 34 is remained and moved up and down freely by guiding mechanism 33.Set on sliding part 34
There is the plate 35 of L-shaped.Plate 35 is moved up and down together with sliding part 34, and its lower limit is limited by limiter 36.In addition, knives rack
20 are being fixed on the plate 35 obliquely by set screw.In addition, by making line head unit 30 be moved along arrow A directions, from
And it can be rule.
The situation for illustrating to be rule using the diamond cutter 10 of present embodiment using Fig. 6~Fig. 9.Start to rule
When, first, as shown in fig. 6, making the blade P1 of diamond cutter 10 decline line head unit 30 close to substrate 40.At this moment, such as
Shown in the enlarged drawing of P1 weeks side of blade in Figure 10, preferably 15 ° of upper surface 12 and brittle substrate angulation θ 3~
20 °, push line head unit 30 so that the blade P of diamond cutter 10 is lower than the upper surface of substrate 40, difference in height D according to
The thickness of substrate 40 is in 0.05mm~0.2mm or so.Afterwards, move right line head unit 30 from the left surface of substrate 40.
So, as shown in fig. 7, the upper surface 12 of diamond cutter 10 and the upper left ends contact of substrate 40.I.e., upper surface 12
At least a portion or the guide surface for all playing a part of blade P1 being directed to substrate 40.At this moment, as in Figure 11 enlarged drawing
It is shown, blade P1 and substrate 40 interval F are determined according to angle, θ 3 and difference in height D, such as when θ 3=15 °, D=0.2mm, F is about
For 0.78mm.Therefore, the length with more than 0.8mm, preferably more than 1.0mm on crest line 18a extended line of guide surface 12 is
Can.Also, when upper surface 12 is square, it is preferable that the length on one side of upper surface 12 is in more than 0.7mm.Thus, even if
Cut in addition when beginning line, the blade different with the blade for line will not contact with substrate, can prevent to blade and
Base ends bring accidental injury.
Then, when moving diamond cutter along arrow A directions, as shown in figure 8, substrate 40 resists the pressure of cylinder 32
Power, sliding part 34 is pushed up, plate 35 itself rises.When further moving line head unit 30 to the right, guiding
While the side of face 12 is slided relative to substrate 40, the peripheral part of the blade P1 comprising top surface 16a enters substrate 40, can start
Line, i.e. circumscribed line from the end of substrate 40, line is initially formed from the end of substrate 40.When further along arrow A
Direction movement line head unit 30 is when being rule, can be with the top surface 16a of diamond cutter 10 preceding and crest line 18a is located at
The mode at rear is rule.As described above, when starting circumscribed line, first, the upper surface (guiding of diamond cutter 10
Face) 12 with the upper left ends contact of substrate 40, the blade afterwards comprising top surface 16a is directed face and is directed to substrate 40 and contacts,
Even if it can also prevent the damage of other blades so as to cut line of beginning in addition.And then by the top surface of wider width preceding, and
Crest line then contacts with substrate, so as to which stress is not concentrated in the end of substrate 40, can also suppress to start edge of substrate during line
Portion is damaged.
Moreover, as shown in figure 9, untill line (circumscribed line) proceeds to the end for departing from substrate 40.At this moment, diamond tool
The crest line 18a of tool 10 local edge somewhat presses the end of substrate, and side separates with substrate.When terminating line, similarly in Buddha's warrior attendant
The blade P of stone cutter 10 nearby, i.e. the side opposite with top surface of crest line there is no other blades yet, so without having to worry about to other
The damage of blade, it can terminate to rule with circumscribed.And then substrate is pressed in line end, local by crest line 18a, so as to
It is enough that vertical crack is reliably formed below line.
Also, in the respective embodiments described above, whole pedestal is formed by single-crystal diamond, but as long as with fragile material base
Just it is enough for diamond for the surface portion of plate contact, so can also be in the pedestal formed using hard alloy, sintered diamond
Outer peripheral face and crest line surface formed polycrystalline diamond layer, precise finiss further is carried out to it and forms blade.Also,
The impurity such as doping boron can also be used and make it have the monocrystalline or polycrystalline diamond of electric conductivity.By using conductive
Diamond, inclined plane can be readily formed by electro-discharge machining.
Industrial applicibility
The diamond cutter of the present invention can be suitably applied to be begun to rule and with circumscribed knot to cutting beyond brittle substrate
The chalker of beam line.
Description of reference numerals
10：Diamond cutter
11：Pedestal
12：Upper surface (guide surface)
12a~12d：Summit
13a~13d：Outer peripheral face
14、15：Bisector
14a、14b、15a、15b：Section
16a~16d：Top surface
17a~17h：Inclined plane
18a~18d：Crest line
P1~P4：Blade
Claims (5)
1. a kind of diamond cutter, has：
Prismatic pedestal, the pedestal include upper surface and multiple outer peripheral faces perpendicular to the upper surface；
Top surface, at least two jiaos of the upper surface of the prismatic pedestal, cut so that the line vertical with bisector turns into
The mode of piece is tilted from the upper surface and formed, and the bisector includes the angle of the upper surface interiorly by the upper table
Face decile；And
A pair of angled face, formed from two outer peripheral faces that the top surface abuts towards the corresponding overturning angle,
The diamond cutter makees the intersection point of the pair of inclined plane and the top surface using the upper surface as guide surface
For blade.
2. diamond cutter according to claim 1, wherein,
The length of the guide surface is in more than 0.8mm.
3. diamond cutter according to claim 1, wherein,
The prismatic pedestal is quadrangular, and the upper surface is square, and the length on one side of the upper surface is in 0.7mm
More than.
4. a kind of scribble method, employs the diamond cutter described in claim 1, the scribble method includes：
The diamond cutter is held in a manner of most lower by scribe head by the blade of the diamond cutter；
Push the scribe head so that in the outside of substrate, the blade be located at than the substrate upper surface more on the lower
Position；And
By being moved parallel to the upper surface of the scribe head and the substrate, so that the guide surface and the substrate
Ends contact, after the guide surface slides preset distance in the end of the substrate, the end of the top surface and the substrate
Contact and start circumscribed line.
5. scribble method according to claim 4, in addition to：
To the end of the substrate, the local edge of crest line presses the end of the substrate, side and the end part of the substrate for line
From so as to terminate to rule.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016191079A JP2018051945A (en) | 2016-09-29 | 2016-09-29 | Diamond tool and its scribing method |
| JP2016-191079 | 2016-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107877716A true CN107877716A (en) | 2018-04-06 |
Family
ID=61780689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710839501.2A Withdrawn CN107877716A (en) | 2016-09-29 | 2017-09-15 | Diamond cutter and its scribble method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018051945A (en) |
| KR (1) | KR20180035668A (en) |
| CN (1) | CN107877716A (en) |
| TW (1) | TW201815540A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018131179A1 (en) * | 2018-12-06 | 2020-06-10 | Schott Ag | Glass element with cut edge and process for its production |
| JP7396376B2 (en) * | 2019-06-28 | 2023-12-12 | 日本電気株式会社 | Impersonation detection device, impersonation detection method, and program |
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| JP2015063020A (en) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | Scribe head, scribe device and scribe method |
-
2016
- 2016-09-29 JP JP2016191079A patent/JP2018051945A/en not_active Ceased
-
2017
- 2017-08-11 TW TW106127235A patent/TW201815540A/en unknown
- 2017-09-11 KR KR1020170116148A patent/KR20180035668A/en not_active Application Discontinuation
- 2017-09-15 CN CN201710839501.2A patent/CN107877716A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1692083A (en) * | 2001-11-08 | 2005-11-02 | 夏普株式会社 | Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device |
| CN1668431A (en) * | 2002-07-18 | 2005-09-14 | 三星钻石工业股份有限公司 | Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head |
| CN1958488A (en) * | 2006-04-18 | 2007-05-09 | 塔工程有限公司 | Apparatus for substrate marking |
| CN102040330A (en) * | 2009-10-23 | 2011-05-04 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method |
| CN102142485A (en) * | 2010-01-27 | 2011-08-03 | 三星钻石工业股份有限公司 | Scribing apparatus for thin film solar cells |
| CN102807316A (en) * | 2011-05-31 | 2012-12-05 | 三星钻石工业股份有限公司 | Marking method, diamond point, and marking device |
| CN203487032U (en) * | 2013-09-18 | 2014-03-19 | 永润应用材料股份有限公司 | Cutting equipment for optical glass and diamond cutter of cutting equipment |
| CN203639329U (en) * | 2013-11-08 | 2014-06-11 | 蚌埠朝阳玻璃机械有限公司 | Cutter box of glass cutting machine |
| CN105799074A (en) * | 2015-01-20 | 2016-07-27 | 三星钻石工业股份有限公司 | Multi-edge diamond cutter |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201815540A (en) | 2018-05-01 |
| KR20180035668A (en) | 2018-04-06 |
| JP2018051945A (en) | 2018-04-05 |
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Application publication date: 20180406 |