TW201800535A - 黏著劑組成物以及黏著片及其製造方法 - Google Patents
黏著劑組成物以及黏著片及其製造方法 Download PDFInfo
- Publication number
- TW201800535A TW201800535A TW106104418A TW106104418A TW201800535A TW 201800535 A TW201800535 A TW 201800535A TW 106104418 A TW106104418 A TW 106104418A TW 106104418 A TW106104418 A TW 106104418A TW 201800535 A TW201800535 A TW 201800535A
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- polymer
- adhesive
- group
- adhesive composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016038371 | 2016-02-29 | ||
JP2016-038371 | 2016-02-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201800535A true TW201800535A (zh) | 2018-01-01 |
Family
ID=59743757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106104418A TW201800535A (zh) | 2016-02-29 | 2017-02-10 | 黏著劑組成物以及黏著片及其製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2017149982A1 (ko) |
KR (1) | KR20180113199A (ko) |
CN (1) | CN108633285A (ko) |
TW (1) | TW201800535A (ko) |
WO (1) | WO2017149982A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111742027B (zh) * | 2018-03-26 | 2022-04-15 | 琳得科株式会社 | 粘着剂组合物、粘着片及加工物的制造方法 |
TW202041558A (zh) * | 2019-03-28 | 2020-11-16 | 日商三井化學股份有限公司 | 防護膜 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000328023A (ja) * | 1999-05-21 | 2000-11-28 | Lintec Corp | 粘着シート |
JP2003113355A (ja) * | 2001-10-03 | 2003-04-18 | Bridgestone Corp | 光硬化型仮固定用シート |
JP2004225022A (ja) * | 2002-11-29 | 2004-08-12 | Sekisui Chem Co Ltd | 接着樹脂シート |
JP5781302B2 (ja) * | 2010-12-28 | 2015-09-16 | 日東電工株式会社 | 放射線硬化型粘着剤組成物及び粘着シート |
JP5687897B2 (ja) * | 2010-12-28 | 2015-03-25 | 日東電工株式会社 | 放射線硬化型粘着剤組成物及び粘着シート |
CN104541360B (zh) * | 2012-08-23 | 2019-10-01 | 琳得科株式会社 | 带保护膜形成层的切割片和芯片的制造方法 |
JP6210827B2 (ja) * | 2013-10-04 | 2017-10-11 | リンテック株式会社 | 半導体加工用シート |
-
2017
- 2017-01-19 WO PCT/JP2017/001819 patent/WO2017149982A1/ja active Application Filing
- 2017-01-19 KR KR1020187024841A patent/KR20180113199A/ko unknown
- 2017-01-19 JP JP2018502573A patent/JPWO2017149982A1/ja active Pending
- 2017-01-19 CN CN201780010072.6A patent/CN108633285A/zh active Pending
- 2017-02-10 TW TW106104418A patent/TW201800535A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN108633285A (zh) | 2018-10-09 |
KR20180113199A (ko) | 2018-10-15 |
JPWO2017149982A1 (ja) | 2018-12-20 |
WO2017149982A1 (ja) | 2017-09-08 |
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