TW201742164A - 指紋感測晶片封裝方法及利用該方法製成之指紋感測模組 - Google Patents

指紋感測晶片封裝方法及利用該方法製成之指紋感測模組 Download PDF

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TW201742164A
TW201742164A TW105116374A TW105116374A TW201742164A TW 201742164 A TW201742164 A TW 201742164A TW 105116374 A TW105116374 A TW 105116374A TW 105116374 A TW105116374 A TW 105116374A TW 201742164 A TW201742164 A TW 201742164A
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printed circuit
fingerprint sensing
circuit board
packaging
sensing module
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TW105116374A
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TWI578414B (zh
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謝忠澔
和正平
林繼周
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旭景科技股份有限公司
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Priority to TW105116374A priority Critical patent/TWI578414B/zh
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Publication of TWI578414B publication Critical patent/TWI578414B/zh
Priority to US15/599,498 priority patent/US20170344797A1/en
Publication of TW201742164A publication Critical patent/TW201742164A/zh

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    • G—PHYSICS
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    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • G—PHYSICS
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    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
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Abstract

本發明提出一種指紋感測晶片封裝方法及利用該方法製成之指紋感測模組，該方法包含步驟：A.提供數個用於封裝指紋感測晶片的印刷電路板，該些印刷電路板以連板形式相接；B.於每一印刷電路板上安裝指紋感測晶片與其它所有電子元件，以形成數個印刷電路板總成；C.固定該些印刷電路板總成，使該些指紋感測晶片的表面實質位於一平面；D.滴灌一液狀的封裝材料至一圍堰體內，包覆該些安裝指紋感測晶片與其它所有電子元件；E.固化該液狀的封裝材料；及F.分割該些相接的印刷電路板總成並切除突起結構，以形成各自獨立的印刷電路板總成。

Description

指紋感測晶片封裝方法及利用該方法製成之指紋 感測模組
本發明關於一種指紋感測晶片封裝方法及一種利用該方法製成之指紋感測模組，特別是一種使用可澆注固化封裝材料的指紋感測晶片封裝方法及一種利用該方法製成之指紋感測模組。
指紋感測晶片是各種利用指紋來進行安全維護以及身份辨識設備的基礎元件。隨著行動支付服務在智慧型手機上的廣泛應用，指紋感測晶片漸漸成為智慧型手機的必備元件。然而，為了滿足智慧型手機的薄型化設計，指紋感測晶片除了本身厚度不宜過大，相應的封裝方法更重要：因為它決定最終產品外觀與性能的重要因素。
請見第1圖，該圖繪示一個利用傳統封裝方法所製成的指紋感測模組1。指紋感測模組1的封裝方法如下：首先將必要的被動元件5焊接到一印刷電路板2設計的位置上；再將一指紋感測晶片4以銀膠3固定於印刷電路板2上；接者以打線 方式，利用結合線7連接指紋感測晶片4上接合墊6與印刷電路板1上的對應電路接點；最後，一層封裝材料8(通常是環氧樹脂模製化合物)以注模方式覆蓋在上述元件上方，形成保護層。必要時，封裝材料8的厚度可以藉由研磨變薄，直到滿足設計厚度。
以上的習知技術有以下的缺點。首先，由於每一個指紋感測模組1的封裝材料8都需要研磨製程，這會造成額外的成本浪費。第二，研磨的精準度受到印刷電路板2厚度公差、平整度公差、固定模具公差以及研磨設備運作時的公差影響；最終研磨後的指紋感測模組1上表面，可能與指紋感測晶片4上表面有較大的偏差角度，進而影響指紋感測模組1的性能。或者，研磨之後各個指紋感測模組1之間的厚度也會有差異。第三，適用於注模工法的封裝材料8通常不具透明特性，要客製化不同的封裝後外觀顏色，成本也高。最後，一般指紋感測模組的表面通常都會塗覆一層氟化物，以避免手指殘餘物汙染指紋感測模組，造成後續使用上的失誤，或殘留的指紋造成安全上的問題。該氟化物的形成是一道特製工續，無法藉與封裝材料8混合，利用密度差而形成，這使得指紋感測模組1的成本還是無法進一步減省。
是故，新式的指紋感測晶片封裝方法，可以用來解決以上各種問題，極為業界所需。
本段文字提取和編譯本發明的某些特點。其它特點將被揭露於後續段落中。其目的在涵蓋附加的申請專利範圍之精神和範圍中，各式的修改和類似的排列。
為了解決上述的問題，本發明提出一種指紋感測晶片封裝方法，該方法包含步驟：A.提供數個用於封裝指紋感測晶片的印刷電路板，該些印刷電路板以連板形式相接，其中在最外圍之印刷電路板的上表面各具有一突起結構，每一突起結構與鄰近突起結構相連，形成一圍堰體；B.於每一印刷電路板上安裝指紋感測晶片與其它所有電子元件，以形成數個印刷電路板總成；C.固定該些印刷電路板總成，使該些指紋感測晶片的表面實質位於一平面；D.滴灌一液狀的封裝材料至該圍堰體內，包覆該些安裝指紋感測晶片與其它所有電子元件；E.固化該液狀的封裝材料；及F.分割該些相接的印刷電路板總成並切除該些突起結構，以形成各自獨立的印刷電路板總成。
最好，進一步包含一步驟E1於步驟E之後：E1.形成一疏油疏水氟化物層於該固化之封裝材料上方。而步驟C包含以下子步驟：C1.將該些連板相接的印刷電路板總成置於一模具內，使該些連板相接的印刷電路板總成的下表面與模具的一部份形成一空間；及C2.對該空間施加一小於該些連板相接的印刷電路板總成上表面所接受壓力之氣壓。
依照本發明，步驟E之固化可光固化、熱固化或靜置長時間自然固化。該液狀的封裝材料在進行滴灌前，可進一步與一疏油疏水氟化物混合，以便於滴灌後固化前，該疏油疏水氟化物可藉由密度差而上浮至該液狀封裝材料之表面。該疏油疏水氟化物可為全氟烷基甲基丙烯酸共聚物或氟化二氧化矽奈米顆粒。該封裝材料的成分可包含環氧樹脂(epoxy)、矽氧樹脂(silicone)、壓克力樹脂(Acrylic)或前述物質之延伸物，或包含可對其它成分進行硬化的硬化劑，或包含染色劑。而具有突起結構的印刷電路板之至少一邊長度長於未具有突起結構的印刷電路板之對應邊長度，每一具有突起結構的印刷電路板在裁除該突起結構後，其外觀形狀與未具有突起結構的印刷電路板相同。
本發明的另一種態樣是一種指紋感測模組，該指紋感測模組包含：一印刷電路總成；一指紋感測晶片，該指紋感測晶片安裝於該印刷電路總成上；及一封裝層，該封裝層包覆該指紋感測晶片的上表面及該印刷電路總成的部分上表面，其中該印刷電路總成用以運作該指紋感測晶片；該封裝層之上表面無研磨痕跡。
依照本發明，該指紋感測模組可進一步包含一疏油疏水氟化物層於該封裝層上方。該封裝層的材料成分可包含環氧樹脂、矽氧樹脂、壓克力樹脂或前述物質之延伸物，或包含可對其它成分進行固化的固化劑，或包含染色劑。
本發明提出的指紋感測晶片封裝方法無須進行研磨製程，較習知技術省去不少成本。製成之指紋感測模組各部件因為經過固定步驟，相對公差變小，各切割成型之指紋感測模組電器性能相近。此外，利用本發明，封裝後的指紋感測模組可以藉染色劑，呈現不同顏色的外觀，氟化物層形成的方式也多元。
1‧‧‧指紋感測模組
2‧‧‧銀膠
3‧‧‧印刷電路板
4‧‧‧指紋感測晶片
5‧‧‧被動元件
6‧‧‧接合墊
7‧‧‧結合線
8‧‧‧封裝材料
10‧‧‧連板
20‧‧‧指紋感測模組
100‧‧‧印刷電路板
100a‧‧‧第一印刷電路板
100b‧‧‧第二印刷電路板
100c‧‧‧第三印刷電路板
100d‧‧‧第四印刷電路板
102‧‧‧印刷電路板總成
102c‧‧‧第三印刷電路板總成
110‧‧‧圍堰體
110a‧‧‧第一突起結構
110b‧‧‧第二突起結構
110c‧‧‧第三突起結構
120‧‧‧電子元件
130‧‧‧指紋感測晶片
140‧‧‧封裝材料
141‧‧‧封裝層
150‧‧‧氟化物層
200‧‧‧模具
D‧‧‧保護厚度
S‧‧‧空間
第1圖繪示一個利用傳統封裝方法所製成的指紋感測模組。
第2圖為本發明揭露的一種指紋感測晶片封裝方法步驟之流程圖。
第3圖為16個形成一連板的印刷電路板之上視圖。
第4圖為每一印刷電路板安裝好一指紋感測晶片與其它所有電子元件的上視圖。
第5圖為第4圖中沿AA’線垂直圖面之剖面圖。
第6圖繪示連板相接的印刷電路板總成102置入一模具內並施加壓力差。
第7圖繪示連板相接的印刷電路板總成102置於一模具內並施加壓力差，以確保該印刷電路板總成102之平坦度。
第8圖繪示形成一氟化物層。
第9圖為依照前述方法製作的一指紋感測模組的剖面圖。
第10圖繪示封裝材料成形的一種態樣。
第11圖繪示封裝材料成形的另一種態樣。
本發明將藉由參照下列的實施方式而更具體地描述。
請參閱第2圖，該圖為本發明揭露的一種指紋感測晶片封裝方法之流程圖。該方法包含數個步驟，為求完整理解本發明之精神，請同步參閱第3圖到第9圖相關之圖式。
本方法第一個步驟是提供數個用於封裝指紋感測晶片130的印刷電路板100，該些印刷電路板100以連板形式相接，其中在最外圍之印刷電路板100的上表面各具有一突起結構，每一突起結構與鄰近突起結構相連，形成一圍堰體110(S01)。請見第3圖，該圖為16個形成一連板10的印刷電路板100之上視圖。就印刷電路板的工藝而言，一般小型的印刷電路板基於製作成本考量，會將數個印刷電路板製作於一個具有基本運作面積的母版上，形成一個連板(為了便於說明，以下提到所有印刷電路板100未分割前的連接狀態，皆以連板10代之)。各印刷電路板間以溝槽(V-shaped grooves)為界，該些溝槽在印刷電路板完成電子元件之安裝與封裝後，可沿之折斷或切割板與板間的連接，以形成獨立的印刷電路板總成 (PCBA)。在本實施例中，連板10包含了16個印刷電路板100。依照本發明的精神，印刷電路板100的數量不限定於16個，任何數量都可以。為了進行更進一步的說明，特別標定了數個不同特徵的印刷電路板100而給予另外的特定名稱，如第一印刷電路板100a、第二印刷電路板100b、第三印刷電路板100c及第四印刷電路板100d。
在第3圖中，印刷電路板間的溝槽以較細直線繪示(相對於連板10的邊界)。然而，為了怕圍堰體110因溝槽的存在而有破口，溝槽在圍堰體110之下最好不要形成。當然，如果考慮連板10以機器精密切割，溝槽也可以不用形成。最外圍之印刷電路板100為圍堰體110橫跨的12個印刷電路板100(包含第一印刷電路板100a、第二印刷電路板100b與第三印刷電路板100c)，該些印刷電路板100都具有組成圍堰體110的突起結構，只是該些突起結構外觀不盡相同。舉例來說，第一印刷電路板100a具有一第一突起結構110a，該第一突起結構110a由一L形框所標示，上視外型為L形；第二印刷電路板100b具有一第二突起結構110b，該第二突起結構110b由一橢圓形框所標示，上視外型為橫向長棒形；第三印刷電路板100c具有一第三突起結構110c，該第三突起結構110c由一橢圓形框所標示，上視外型為橫縱向長棒形。其它最外圍印刷電路板100上的突起結構，也是具有以上三種上視外型之一。然而，突起結構的上視外型並不局限於第3圖所繪式的三種，只 要是所有突起結構都能圍結成一個密閉的圍堰體110(圍堰體110的功用及進一步設置條件將與之後說明)，任何形狀的上視外型都可以，比如圓弧形、曲線形、折線形，甚至是任意的線形。
要注意的是，具有突起結構的印刷電路板100之至少一邊長度長於未具有突起結構的印刷電路板之對應邊長度。如第二印刷電路板100b的長度較第四印刷電路板100d長度來的長，第三印刷電路板100c的寬度較第四印刷電路板100d寬度來的長，第一印刷電路板100a的長度與寬度都較第四印刷電路板100d的長度與寬度來的長。圍堰體110本身是由連板10製作過程中的一些後續工序所形成。
由於考慮到最終指紋感測模組量產時的一致性，印刷電路板100最終的尺寸應如非最外圍印刷電路板100(在本實施例中，為中央的4個印刷電路板100，包含第四印刷電路板100d)一般，故最外圍印刷電路板100的實際尺寸在封裝主體作業完成後，要進一步進行裁切。這裁切的線路為第3圖中的虛線框所示。如果僅以該虛線框範圍內來看，每個印刷電路板100的尺寸都一樣。要注意的是，第3圖是為了說明而繪示，其長寬比例較實作上來的或大或小，並不以之限制本發明之應用。
本發明所揭露之方法的第二個步驟是於每一印刷電路板100上安裝一指紋感測晶片130與其它所有電子元件120， 以形成數個印刷電路板總成102(S02)。請見第4圖，該圖為每一印刷電路板100安裝好指紋感測晶片130與其它所有電子元件120的上視圖。此處所謂的其它所有電子元件120，包含了需要正常運作指紋感測晶片130的主被動元件，是指紋感測模組製作領域中具有通常知識的人所理解與熟知的，本發明不對其細節部分進行闡述。然而，所有電子元件120和指紋感測晶片130一樣，安裝的方式和本身I/O設計息息相關，可以是以銀膠黏結再進行打線，或是直接進行焊接結合，依照指紋感測模組的設計，可以有不同的工序。在完成步驟S02後，每一印刷電路板100上就形成了一個印刷電路板總成102。舉例而言，第三印刷電路板100就形成了一第三印刷電路板總成102c。
接著，固定該些印刷電路板總成102，使該些指紋感測晶片130的表面實質位於一平面(S03)。為了進一步說明此點，茲取沿著第4圖的AA’線的一垂直於第4圖平面的剖面圖做說明，請見第5圖。此處要先說明，在剖面圖中可以看出圍堰體110(或每一突起結構)是突出於印刷電路板100的上表面而形成。圍堰體110的頂端高度，要高於前述指紋感測晶片130、其它所有電子元件120或其連結打線的最高部位之高度。指紋感測晶片130的表面實質位於一平面上可以確保封裝後的每一指紋感測模組的電氣特性近似。然而，因為連板10的製作與指紋感測晶片130及其它所有電子元件120的結合都會有些 微公差，而其中最大的公差來源是連板10可能會彎曲。因此，若將印刷電路板總成102底部(也就是印刷電路板100底部，就本發明而言，最好所有電子元件都安裝於印刷電路板100的一側)固定於一平面上，前述的公差可以減少到最小，指紋感測晶片130的表面也能實質位於一平面上。
請見第6圖，依照本發明，前述的固定方式可以是將該些連板相接的印刷電路板總成102置於一模具200內，使該些連板相接的印刷電路板總成102的下表面與模具200的一部份形成一空間S，並對該空間S施加一小於該些連板相接的印刷電路板102總成102上表面所接受壓力之氣壓。因為存在壓力差，印刷電路板總成102底部能與模具200底面盡可能平貼(請見第7圖)，只要保持模具200底面於水平狀態，指紋感測晶片130表面所在的平面也能約在水平狀態，有助於後續步驟之施作。要注意的是，在本實施例中的模具200雖繪示為開放狀態，即連板相接的印刷電路板102總成102上表面接觸到的是大氣壓力，但實作上，模具200也可以是一套具有密閉空間的模具。此時，前述的大氣壓力就可以改成任何的氣體壓力，以控制印刷電路板總成102底部的貼平作業。
接著，滴灌一液狀的封裝材料140至該圍堰體110內，包覆該些安裝指紋感測晶片130與其它所有電子元件120(S04)。此處所指的液狀的封裝材料140的成分可包含環氧樹脂(epoxy)、矽氧樹脂(silicone)、壓克力樹脂(Acrylic)或 前述物質之延伸物，比如聚氨酯型環氧樹脂。型態上，不同於傳統指紋感測晶片封裝使用的成型複合物(Molding Compound)，其用途為熱熔注模，本發明使用的封裝材料140必須在封裝階段為液體狀，可流動。也就是說，本發明的封裝材料140在步驟S04進行滴灌時，無須對其施加額外壓力。藉由封裝材料140的流動性，連板10上方所有元件都能被包覆。此外，靠地心引力的作用，封裝材料140停止流動時，其表面為一水平面，進而實質平行於各指紋感測晶片130的上表面，達成每一封裝完成之指紋感測模組可具有一致電器特性的目的。封裝材料140在滴灌後，最好其表面比下方元件的最高處，還要高一個保護厚度D，以提供下方電子元件120與指紋感測晶片130保護作用。保護厚度D至少要大於25μm，最好在25μm到75μm之間。現今科技的發展，精密定量滴灌可以控制灌入每批產品圍堰體110內之封裝材料140總量(體積)，幾近相等。雖然每批大貨生產的連板10與其印刷電路板總成或有公差存在，因為該些公差造成的總體積變動量相對於圍堰體110上方水平面下的內部體積很小，使用精密定量滴灌，可確保每批每個印刷電路板總成上方的保護厚度D接近相同。進而，每一封裝完成之指紋感測模組可具有一致電器特性。
另一個和習知指紋感測晶片封裝材料不同之處，本發明的封裝材料140的外觀不一定是不透明的，也可以是透明或半透明狀，藉以透視下方元件外觀，形成一種特別的視覺 效果。此外，如果需要，封裝材料140的成分可包含染色劑，藉以改變封裝後指紋感測模組的外觀顏色。由於是以透明材料藉滴灌方式加工，染色劑的量可以視需要而添加。反觀傳統上如果封裝材料要使用非常規色(黑色)，染色劑混合的量要很大，調出的顏色也有限(通常偏暗)，成本不經濟效果也差。
本方法的下一步驟是固化該液狀封裝材料140(S05)。固化方法依不同的材質，可以是光固化，如施加紫外線，或熱固化。然而，因為本發明使用的封裝材料140是可以進行滴灌作業，是故，在封裝材料140的成分中加入可對其它成分進行硬化的硬化劑，就如同AB膠的結合(例如使用丙烯酸改性環氧樹脂時，硬化劑可為改性胺)。此時，固化方法就為靜置長時間自然固化。
在本實施例中，本發明所提出的方法之最後一個步驟是，分割該些相接的印刷電路板總成102，並切除該些突起結構，以形成各自獨立的印刷電路板總成102(S06)。分割的方法可以是機器裁切或人工直接沿溝槽折斷。至此，分割後的印刷電路板總成102可具有一致的功能性與接近的電器特性，並具有一致的外觀尺寸。換句話說，也就是每一具有突起結構的印刷電路板100在裁除該突起結構後，其外觀形狀與未具有突起結構的印刷電路板100相同。
要注意的是，依照本發明的精神，封裝後形成的指紋感測模組可以包含一層疏油疏水氟化物層，以避免手指上的油垢水漬黏附於指紋感測模組上。該疏油疏水氟化物可以是全氟烷基甲基丙烯酸共聚物，或者是氟化二氧化矽奈米顆粒。是故，在另一實施例中，於步驟S05之後，步驟S06之前加一步驟S05’：S05’形成一疏油疏水氟化物層150於該固化之封裝材料140上方。形成氟化物層150後的剖面圖如第8圖所示。以上所述的步驟S05’屬於特定的加工步驟，用來形成氟化物層150。然而，氟化物層150也可以內發性地形成。比如，該液狀的封裝材料140在進行滴灌前，進一步與另一種疏油疏水氟化物混合，以便於滴灌後固化前，前述的疏油疏水氟化物可藉由密度差而上浮至該液狀封裝材料之表面。待靜置一段時間後，氟化物層150自然形成。
一種依照前述方法製作的指紋感測模組20如第9圖所示。該指紋感測模組20主要包含：一印刷電路總成102、一指紋感測晶片130、一封裝層141及一疏油疏水氟化物層150。其中該指紋感測晶片130安裝於印刷電路總成102上，封裝層141包覆該指紋感測晶片130的上表面及該印刷電路總成102的部分上表面，印刷電路總成102用以運作指紋感測晶片130。由於少了研磨封裝層141以獲得想要的封裝層141厚度，故和一般封裝後的指紋感測模組不同之處在於該封裝層141之上表面無研磨痕跡，亦無習知技術研磨造成的問題。
最後，本發明使用的封裝材料140在液狀時，會因其表面張力不同，與圍堰體110間形成的介面會不同。如第10圖所示，封裝材料140的表面張力較小，介面會是一個向下凹的曲面；而如第11圖所示，封裝材料140的表面張力較大，介面會是一個向上凸的曲面。是故在選擇封裝材料140時，需考慮前述曲面形成的範圍，要在第3圖的虛線框之外。這樣一來，最終切割完成的指紋感測模組20，其上表面是平整的。
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。

Claims (16)

  1. 一種指紋感測晶片封裝方法，包含步驟：A.提供複數個用於封裝指紋感測晶片的印刷電路板，該些印刷電路板以連板形式相接，其中在最外圍之印刷電路板的上表面各具有一突起結構，每一突起結構與鄰近突起結構相連，形成一圍堰體；B.於每一印刷電路板上安裝指紋感測晶片與其它所有電子元件，以形成複數個印刷電路板總成；C.固定該些印刷電路板總成，使該些指紋感測晶片的表面實質位於一平面；D.滴灌一液狀的封裝材料至該圍堰體內，包覆該些安裝指紋感測晶片與其它所有電子元件；E.固化該液狀的封裝材料；及F.分割該些相接的印刷電路板總成並切除該些突起結構，以形成各自獨立的印刷電路板總成。
  2. 如申請專利範圍第1項所述之封裝方法，進一步包含一步驟E1於步驟E之後：E1.形成一疏油疏水氟化物層於該固化之封裝材料上方。
  3. 如申請專利範圍第2項所述之封裝方法，其中該疏油疏水氟化物為全氟烷基甲基丙烯酸共聚物或氟化二氧化矽奈米顆粒。
  4. 如申請專利範圍第1項所述之封裝方法，其中步驟C包含以 下子步驟：C1.將該些連板相接的印刷電路板總成置於一模具內，使該些連板相接的印刷電路板總成的下表面與模具的一部份形成一空間；及C2.對該空間施加一小於該些連板相接的印刷電路板總成上表面所接受壓力之氣壓。
  5. 如申請專利範圍第1項所述之封裝方法，其中步驟E之固化為光固化、熱固化或靜置長時間自然固化。
  6. 如申請專利範圍第1項所述之封裝方法，其中該液狀的封裝材料在進行滴灌前，進一步與一疏油疏水氟化物混合，以便於滴灌後固化前，該疏油疏水氟化物可藉由密度差而上浮至該液狀封裝材料之表面。
  7. 如申請專利範圍第1項所述之封裝方法，其中該封裝材料的成分包含環氧樹脂(epoxy)、矽氧樹脂(silicone)、壓克力樹脂(Acrylic)或前述物質之延伸物。
  8. 如申請專利範圍第7項所述之封裝方法，其中該封裝材料的成分包含可對其它成分進行硬化的硬化劑。
  9. 如申請專利範圍第7項所述之封裝方法，其中該封裝材料的成分包含染色劑。
  10. 如申請專利範圍第1項所述之封裝方法，其中具有突起結構的印刷電路板之至少一邊長度長於未具有突起結構的印刷電路板之對應邊長度。
  11. 如申請專利範圍第10項所述之封裝方法，其中每一具有突起結構的印刷電路板在裁除該突起結構後，其外觀形狀與未具有突起結構的印刷電路板相同。
  12. 一種指紋感測模組，包含：一印刷電路總成；一指紋感測晶片，該指紋感測晶片安裝於該印刷電路總成上；及一封裝層，該封裝層包覆該指紋感測晶片的上表面及該印刷電路總成的部分上表面，其中該印刷電路總成用以運作該指紋感測晶片；該封裝層之上表面無研磨痕跡。
  13. 如申請專利範圍第12項所述之指紋感測模組，進一步包含一疏油疏水氟化物層於該封裝層上方。
  14. 如申請專利範圍第12項所述之指紋感測模組，其中該封裝層的材料成分包含環氧樹脂、矽氧樹脂或前述物質之延伸物。
  15. 如申請專利範圍第14項所述之指紋感測模組，其中該封裝層的材料成分包含可對其它成分進行固化的固化劑。
  16. 如申請專利範圍第14項所述之指紋感測模組，其中該封裝層的材料成分包含染色劑。
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