TW201736116A - Metal clad laminate and manufacturing method thereof - Google Patents

Abstract

A metal clad laminate including a first single-sided board and a second single-sided board is provided. The first single-sided board includes a first insulating substrate and a first metal layer disposed in stack arrangement. The second single-sided board includes a second insulating substrate and a second metal layer disposed in stack arrangement. The second insulating substrate is directly attached onto the first insulating substrate. A peel strength between the first insulating substrate and second the insulating substrate is in a range from 0.001 kgf/cm to 0.5 kgf/cm.

Description

Metal laminated board and manufacturing method thereof

The present invention relates to a metal laminate and a method of manufacturing the same, and more particularly to a metal laminate for use in fabricating a flexible printed circuit board and a method of fabricating the same.

The flexible printed circuit board factory has a process device capable of performing a flexible printed circuit (FPC) process on both sides of a metal laminated board such as a flexible copper clad laminate (FCCL) (hereinafter, referred to as a double panel). Process equipment). Common materials for making single-sided flexible printed circuit boards are single-panel and double-panel, wherein the single-sided panel has a metal layer on one side of the substrate, and the double-sided panel has a metal layer on both sides of the substrate.

When using a single-panel process equipment and using a single panel to make a single-sided flexible printed circuit board, since only a flexible printed circuit process is performed on one side of the single-panel, the production capacity is only half that of the double-panel.

Therefore, a process for fabricating two single-sided flexible printed circuit boards using a double panel has been developed. In detail, two single panels were attached to both sides of a polyethylene terephthalate carrier (PET carrier) by a glue layer to form a double panel. Next, a flexible printed circuit process is performed on both sides of the dual panel using a dual-panel processing device. Then, after all the flexible printed circuit processes are completed, the PET carrier is peeled off to form two single-sided flexible printed circuit boards.

However, the PET carrier board not only needs good adhesion, but after peeling off the PET carrier board, the glue must not remain on the flexible printed circuit board, but also has the effect of being able to withstand all processes and heat. In addition, the use of PET carrier plates, in addition to increasing costs, generates a large amount of waste, which causes environmental problems.

The present invention provides a metal laminate and a method of manufacturing the same, which can effectively increase the productivity of a flexible printed circuit board.

The invention provides a metal laminate board comprising a first single panel and a second single panel. The first single panel includes a first insulating substrate and a first metal layer stacked in a stack. The second single panel includes a second insulating substrate and a second metal layer stacked in a stack. The second insulating substrate is directly bonded to the first insulating substrate. The peel strength between the first insulating substrate and the second insulating substrate ranges from 0.001 kgf/cm to 0.5 kgf/cm.

According to an embodiment of the present invention, in the above metal laminated board, the peel strength between the first insulating substrate and the second insulating substrate may range from 0.002 kgf/cm to 0.2 kgf/cm.

According to an embodiment of the present invention, in the above metal laminated board, the materials of the first insulating substrate and the second insulating substrate are, for example, polyimine (PI), polyethylene (PE), and Teflon. (Teflon).

According to an embodiment of the present invention, in the above metal laminated board, the first insulating substrate and the second insulating substrate may have a single layer structure or a multilayer structure.

According to an embodiment of the present invention, in the above metal laminated board, the glass transition temperature (Tg) of the first insulating substrate and the second insulating substrate may range from 150 ° C to 400 ° C.

According to an embodiment of the present invention, in the above metal laminated board, the thickness of the first insulating substrate and the second insulating substrate may range from 5 micrometers to 200 micrometers.

According to an embodiment of the present invention, in the above metal laminated board, the material of the first metal layer and the second metal layer is, for example, copper, aluminum, silver or an alloy thereof.

The present invention provides a method of manufacturing a metal laminate comprising the following steps. A first single panel is provided, wherein the first single panel includes a first insulating substrate and a first metal layer stacked in a stack. A second single panel is provided, wherein the second single panel comprises a second insulating substrate and a second metal layer disposed in a stack. Combining the first single panel and the second single panel to form a metal laminate, wherein the second insulating substrate is directly bonded to the first insulating substrate, and between the first insulating substrate and the second insulating substrate The peel strength ranges from 0.001 kgf/cm to 0.5 kgf/cm.

According to an embodiment of the present invention, in the method for manufacturing a metal laminate, the peel strength between the first insulating substrate and the second insulating substrate may range from 0.002 kgf/cm to 0.2 kgf/cm. .

According to an embodiment of the present invention, in the method of manufacturing a metal laminate, the bonding process is, for example, a thermal compression bonding process.

According to an embodiment of the present invention, in the method of manufacturing a metal laminate, the temperature of the thermocompression bonding process is, for example, higher than a glass transition temperature of the first insulating substrate and the second insulating substrate.

According to an embodiment of the present invention, in the above method for manufacturing a metal laminate, the temperature of the thermocompression bonding process may range from 150 ° C to 400 ° C.

According to an embodiment of the present invention, in the method for manufacturing a metal laminate, the temperature of the thermocompression bonding process may range from 300 ° C to 380 ° C.

According to an embodiment of the present invention, in the above method for manufacturing a metal laminate, the machine speed of the thermocompression bonding process may range from 1 m/min to 10 m/min.

According to an embodiment of the present invention, in the above method for manufacturing a metal laminate, the machine speed of the thermocompression bonding process may range from 1 m/min to 5 m/min.

According to an embodiment of the present invention, in the method for manufacturing a metal laminate, the metal laminate is further subjected to a stripping process to be reduced to the first single panel and the second single panel.

According to an embodiment of the present invention, in the method for manufacturing a metal laminate, the peeling process can be peeled off or peeled off by hand using a peeling machine.

According to an embodiment of the present invention, in the above method of manufacturing a metal laminate, the stripping process can be performed at room temperature.

According to an embodiment of the present invention, in the method for manufacturing a metal laminate, the method further includes performing a flexible printed circuit process on the metal laminate before performing the stripping process.

According to an embodiment of the present invention, in the method for manufacturing a metal laminate, the glass transition temperature of the first insulating substrate and the second insulating substrate may range from 150 ° C to 400 ° C.

Based on the above, in the metal laminated board and the manufacturing method thereof according to the present invention, since the second insulating substrate is directly bonded to the first insulating substrate, the first single panel and the second single panel can be combined. A metal laminate is formed. Since the metal laminate is a double panel, when a flexible printed circuit board is fabricated using the double-layer process equipment and the metal laminate, the two single-sided flexible printed circuit boards can be fabricated by using a double panel, thereby effectively Increase the productivity of flexible printed circuit boards. In addition, since the metal laminate does not have a PET carrier, the cost can be reduced without environmental problems.

On the other hand, since the peel strength between the first insulating substrate and the second insulating substrate ranges from 0.001 kgf/cm to 0.5 kgf/cm, the metal laminate is not in the subsequent various flexible printed circuit processes. Will be separated. In addition, the first single panel and the second single panel can be easily peeled off during the finished product stage without causing damage to the finished product.

The above described features and advantages of the invention will be apparent from the following description.

1A and 1B are cross-sectional views showing a manufacturing process of a metal laminate according to an embodiment of the present invention. 2 is a flow chart showing the manufacturing process of a metal laminate according to an embodiment of the present invention.

Referring to FIG. 1A and FIG. 1B, step S100 is performed to provide a single panel 100, wherein the single panel 100 includes a stacked insulating substrate 102 and a metal layer 104. In another embodiment, the single panel 100 further includes a glue layer (not shown) disposed between the insulating substrate 102 and the metal layer 104.

The material of the insulating substrate 102 is, for example, polyimide, polyethylene or Teflon. In an embodiment, the material of the insulating substrate 102 may be polyimide. The glass transition temperature of the insulating substrate 102 may range from 150 ° C to 400 ° C, and more preferably from 300 ° C to 380 ° C. The insulating substrate 102 may be a single layer structure or a multilayer structure. In this embodiment, the material of the insulating substrate 102 is described by taking a single layer structure as an example, but the invention is not limited thereto. The thickness of the insulating substrate 102 can range from 5 microns to 200 microns. The material of the metal layer 104 is, for example, copper, aluminum, silver or an alloy thereof.

Step S102 is performed to provide a single panel 200, wherein the single panel 200 includes a stacked insulating substrate 202 and a metal layer 204. In another embodiment, the single panel 200 further includes a glue layer (not shown) disposed between the insulating substrate 202 and the metal layer 204.

The material of the insulating substrate 202 is, for example, polyimide, polyethylene or Teflon. In an embodiment, the material of the insulating substrate 202 may be polyimide. The glass transition temperature of the insulating substrate 202 may range from 150 ° C to 400 ° C, and more preferably from 300 ° C to 380 ° C. The insulating substrate 202 may be a single layer structure or a multilayer structure. In this embodiment, the material of the insulating substrate 202 is described by taking a single layer structure as an example, but the invention is not limited thereto. The thickness of the insulating substrate 202 can range from 5 microns to 200 microns. The material of the metal layer 204 is, for example, copper, aluminum, silver or an alloy thereof.

In step S104, the single-panel 100 and the single-panel 200 are combined to form a metal laminate 300, wherein the insulating substrate 202 is directly bonded to the insulating substrate 102, and between the insulating substrate 102 and the insulating substrate 202. The peel strength ranges from 0.001 kgf/cm to 0.5 kgf/cm. In an embodiment, the peel strength between the insulating substrate 102 and the insulating substrate 202 may range from 0.002 kgf/cm to 0.2 kgf/cm.

The bonding process performed on the single panel 100 and the single panel 200 is, for example, a thermal compression bonding process. The temperature of the thermocompression bonding process is, for example, higher than the glass transition temperature of the insulating substrate 102 and the insulating substrate 202, whereby the insulating substrate 102 and the insulating substrate 202 can be softened to facilitate press-fitting. The thermocompression bonding process can range from 150 ° C to 400 ° C, and more preferably from 300 ° C to 380 ° C. In one embodiment, the temperature of the thermocompression bonding process can be 360 °C. The speed of the thermocompression bonding process can range from 1 m/min to 10 m/min, and can range from 1 m/min to 5 m/min. The peel strength between the insulating substrate 102 and the insulating substrate 202 can be adjusted by the temperature and machine speed of the thermocompression bonding process. The thermocompression bonding process can be carried out by a multi-axis press machine (e.g., a biaxial press machine). In addition, the thermocompression bonding process can be a roll-to-roll process.

Since the metal laminate 300 is a double panel, when a flexible printed circuit board is fabricated using the double-layer process equipment and the metal laminate 300 is used, two single-sided flexible printed circuit boards can be fabricated by a double-sided process. In turn, the productivity of the flexible printed circuit board can be effectively increased. In addition, since the metal laminate 300 does not have a PET carrier, the cost can be reduced without causing environmental problems.

On the other hand, since the peeling strength between the insulating base material 102 and the insulating base material 202 ranges from 0.001 kgf/cm to 0.5 kgf/cm, the metal laminated plate 300 can be formed into a false double panel. Thereby, the metal laminated board 300 does not separate in various subsequent flexible printed circuit processes. In addition, the single panel 100 can be easily peeled off from the single panel 200 in the finished product stage without causing damage to the finished product.

Step S106 can be selectively performed to perform a flexible printed circuit process on the metal laminate board 300. The single-panel 100 and the single-panel 200 can be separately fabricated into a flexible printed circuit board by a flexible printed circuit process.

Referring to FIG. 1B and FIG. 2, step S108 may be selectively performed to perform a stripping process on the metal laminate 300 to be reduced to the single panel 100 and the single panel 200. If the step S106 has been performed, the single panel 100 and the single panel 200 may be flexible printed circuit boards. The stripping process can be stripped or peeled off by hand using a stripper. In addition, the stripping process can be carried out at room temperature.

Hereinafter, the metal laminated plate 300 of the present embodiment will be described with reference to Fig. 1A. Further, although the manufacturing method of the metal laminated board 300 of the present embodiment is described as an example of the above manufacturing method, the method of manufacturing the metal laminated board 300 of the present invention is not limited thereto.

Referring to FIG. 1A, the metal laminate 300 includes a single panel 100 and a single panel 200. The single panel 100 includes an insulating substrate 102 and a metal layer 104 that are stacked. The single panel 200 includes an insulating substrate 202 and a metal layer 204 that are stacked. The insulating substrate 202 is directly bonded to the insulating substrate 102. The peel strength between the insulating substrate 102 and the insulating substrate 202 ranges from 0.001 kgf/cm to 0.5 kgf/cm. In addition, the materials, installation methods, parameter conditions, forming methods, and effects of the respective members in the metal laminated plate 300 have been described in detail in the above-described manufacturing methods of FIGS. 1A and 2, and thus will not be described herein.

Based on the above embodiment, since the insulating substrate 202 is directly bonded to the insulating substrate 102, the single-panel 100 and the single-panel 200 can be combined to form the metal laminated board 300. Since the metal laminate 300 is a double-panel, when a flexible printed circuit board is fabricated using the double-layer process equipment and the metal laminate 300, two single-sided flexible printed circuit boards can be fabricated by a double-sided process. Can effectively increase the productivity of flexible printed circuit boards. In addition, since the metal laminate 300 does not have a PET carrier, the cost can be reduced without causing environmental problems.

On the other hand, since the peeling strength between the insulating base material 102 and the insulating base material 202 ranges from 0.001 kgf/cm to 0.5 kgf/cm, the metal laminated board 300 does not undergo subsequent flexible printed circuit processes. separate. In addition, the single panel 102 can be easily peeled off from the single panel 202 during the finished product stage without damaging the finished product.

Experimental example

<Relationship between temperature and peel strength of the thermocompression bonding process>

First, two single panels are provided, each of which is a stacked structure of a copper metal layer and a polyimide substrate, wherein the thickness of the copper metal layer is 11.4 micrometers, and the thickness of the polyimide substrate is 25 micrometers. The glass transition temperature is from 300 ° C to 340 ° C. Then, the two double panels are subjected to a thermocompression bonding process by a press machine. Wherein, the temperature of the thermocompression bonding process is set to be higher than the glass transition temperature of the polyimide. In Experimental Examples 1 and 2, the temperatures of the thermocompression bonding process were 360 ° C and 300 ° C, respectively, and the machine speed of the thermocompression bonding process was 2 m/min, respectively. Then, a peel test was performed on the two single panels using a peeling machine in a peel test method of TM-650 No. 2.4.9.

After the peeling test, the relationship between the temperature of the thermocompression bonding process of Experimental Examples 1 and 2 and the peeling strength is shown in Table 1 below.

Table 1

As can be seen from Table 1, at the temperature of the thermocompression bonding process of Experimental Examples 1 and 2, it is possible to have a suitable peeling strength between the two single panels to form a double-panel with a false stick.

As described above, the metal laminated board of the above embodiment and the method of manufacturing the same can effectively increase the productivity of the flexible printed circuit board, reduce the cost, and cause environmental problems. On the other hand, the metal laminate is not separated in the various flexible printed circuit processes that are subsequently performed, and can be easily peeled off at the finished stage.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100, 200‧‧‧ single panel
102, 202‧‧‧Insulation substrate
104, 204‧‧‧ metal layer
300‧‧‧Metal laminate
S100, S102, S104, S106, S108‧‧‧ steps

1A and 1B are cross-sectional views showing a manufacturing process of a metal laminate according to an embodiment of the present invention. 2 is a flow chart showing the manufacturing process of a metal laminate according to an embodiment of the present invention.

100, 200‧‧‧ single panel

102, 202‧‧‧Insulation substrate

104, 204‧‧‧ metal layer

300‧‧‧Metal laminate

Claims (20)

A metal laminate board comprising: a first single panel comprising a first insulating substrate and a first metal layer stacked in a stack; and a second single panel comprising a second insulating substrate and a second metal layer disposed in a stack, Wherein the second insulating substrate is directly bonded to the first insulating substrate, and the peel strength between the first insulating substrate and the second insulating substrate ranges from 0.001 kgf/cm to 0.5 Kgf/cm. The metal laminate according to claim 1, wherein the peel strength between the first insulating substrate and the second insulating substrate ranges from 0.002 kgf/cm to 0.2 kgf/cm. The metal laminate according to claim 1, wherein the material of the first insulating substrate and the second insulating substrate comprises polyimide, polyethylene or Teflon. The metal laminate according to claim 1, wherein the first insulating substrate and the second insulating substrate have a single layer structure or a multilayer structure. The metal laminate according to claim 1, wherein the glass transition temperature of the first insulating substrate and the second insulating substrate ranges from 150 ° C to 400 ° C. The metal laminate according to claim 1, wherein the first insulating substrate and the second insulating substrate have a thickness ranging from 5 micrometers to 200 micrometers. The metal laminate according to claim 1, wherein the material of the first metal layer and the second metal layer comprises copper, aluminum, silver or an alloy thereof. A method for manufacturing a metal laminate, comprising: providing a first single panel, wherein the first single panel comprises a first insulating substrate and a first metal layer stacked in a stack; and a second single panel is provided, wherein the second single The panel includes a second insulating substrate and a second metal layer disposed in a stack; and a bonding process of the first single panel and the second single panel to form a metal laminated board, wherein the second insulating substrate is directly Bonded to the first insulating substrate, and the peel strength between the first insulating substrate and the second insulating substrate ranges from 0.001 kgf/cm to 0.5 kgf/cm. The method for producing a metal laminate according to claim 8, wherein the peel strength between the first insulating substrate and the second insulating substrate ranges from 0.002 kgf/cm to 0.2 kgf/cm. . The method of manufacturing a metal laminate according to claim 8, wherein the bonding process comprises a thermocompression bonding process. The method for producing a metal laminate according to claim 10, wherein a temperature of the thermocompression bonding process is higher than a glass transition temperature of the first insulating substrate and the second insulating substrate. The method for producing a metal laminated board according to claim 10, wherein the temperature of the thermocompression bonding process ranges from 150 ° C to 400 ° C. The method for producing a metal laminate according to claim 12, wherein the temperature of the thermocompression process ranges from 300 ° C to 380 ° C. The method for producing a metal laminate according to claim 10, wherein the machine speed of the thermocompression process ranges from 1 m/min to 10 m/min. The method for producing a metal laminate according to claim 14, wherein the machine speed of the thermocompression process ranges from 1 m/min to 5 m/min. The method for manufacturing a metal laminated board according to claim 8, further comprising performing a stripping process on the metal laminated board to reduce the first single panel and the second single panel. The method for producing a metal laminate according to claim 16, wherein the peeling process is peeled off or peeled off by hand using a peeling machine. The method for producing a metal laminate according to claim 16, wherein the stripping process is performed at room temperature. The method for manufacturing a metal laminate according to claim 16, further comprising performing a flexible printed circuit process on the metal laminate before performing the stripping process. The method for producing a metal laminate according to claim 8, wherein the glass transition temperature of the first insulating substrate and the second insulating substrate ranges from 150 ° C to 400 ° C.