TWM484283U - Flexible board structure with intermediate support structure - Google Patents

Description

Flexible plate structure with intermediate support structure

The present invention relates to a substrate structure, and in particular to a flexible board structure having an intermediate support structure that combines high structural strength and dimensional stability and contributes to increasing productivity potential.

According to the flexible composite board, it has the advantages of light weight, thin thickness, high wiring density, less wiring space limitation, and high wiring flexibility. Therefore, it is widely used in computers and its peripherals, communication, display, consumer and other electronic products. For example, if the flexible composite board is applied to the design of the liquid crystal screen, the side width of the liquid crystal screen can be reduced to reduce the proportion of the invisible area of the edge of the screen; or, the flexible composite board can be applied to the design of the mobile phone. Make the phone compact and foldable.

In recent years, the demand for flexible composite panels has increased rapidly with the miniaturization of various electronic products. It is worth noting that the substrate of the flexible composite board has insufficient structural strength and flexibility, so it needs to be combined with the hard carrier to increase the process yield when performing various processing processes, that is, the flexible composite board. The substrate is fixed to a rigid carrier during the manufacturing process for a series of processing processes.

However, the substrate of the flexible composite board is generally fixed to the rigid carrier by adhesive bonding, usually in the case where the adhesive is too strong, the substrate itself is formed in the process of being removed from the rigid carrier. The components thereon may be damaged; on the other hand, in the case of insufficient adhesion of the adhesive, displacement may occur between the substrate and the hard carrier during the process, thereby causing process failure; Flexible complex Due to its structural design and physical properties, the substrate of the plywood can only be processed in a single-sided process, which limits the improvement of productivity.

The creator of the present invention has the necessity of improving the structural design of the substrate of the flexible composite board, and has actively studied how to effectively improve the performance and efficiency of the process, with various years of experience in design and manufacturing in related fields. Under the careful consideration, this work was finally developed.

In order to lack the substrate and processing technology of the conventional flexible composite board, this paper proposes a flexible board structure with intermediate structure and high structural strength, high dimensional stability and good processability, which is applied to various types of flexibility. The double-sided processing of the composite panel can increase productivity by at least twice.

In order to achieve the above objects and effects, the present invention adopts the following technical solution: a flexible board structure with an intermediate support structure, which is suitable for a double-sided processing process of a flexible composite board, the flexible board structure with an intermediate support structure including a base layer, a first substrate structure and a second substrate structure, wherein the base layer has a first bonding surface and a second bonding surface with respect to the first bonding surface, and the first substrate structure is detachably laminated on the substrate In the first bonding surface, the second substrate structure is detachably laminated on the second bonding surface.

The present invention has at least the following beneficial effects: In summary, the flexible plate structure with the intermediate support structure of the present invention is applied to the processing process of various flexible composite plates, and the two substrate structures can be processed at the same time, thereby improving at least two Double the production capacity, or at a fixed production rate, can reduce at least half of the process time.

Furthermore, the two substrate structures after processing can be easily separated from the substrate under certain conditions, so the present invention can overcome the technical limitations of the processing process of the conventional flexible composite board, such as manufacturing cost (including manpower, equipment and raw materials costs). ) is very expensive, and the resulting circuit board products have good structural, dimensional stability and electrical characteristics.

Other objects and advantages of the present work can be further understood from the technical features disclosed in the present work. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims

1, 1a, 1b, 1c‧‧‧ flexible plate structure with intermediate support structure

10‧‧‧ grassroots

11‧‧‧First joint

12‧‧‧Second joint

20‧‧‧First substrate structure

21‧‧‧Substrate

22‧‧‧metal layer

221‧‧‧First metal layer

222‧‧‧Second metal layer

22’‧‧‧metal circuit layer

221’‧‧‧First metal circuit layer

222’‧‧‧Second metal circuit layer

23‧‧‧ glue layer

30‧‧‧Second substrate structure

31‧‧‧Substrate

32‧‧‧metal layer

321‧‧‧First metal layer

322‧‧‧Second metal layer

32’‧‧‧metal circuit layer

321’‧‧‧First metal circuit layer

322’‧‧‧Second metal circuit layer

33‧‧‧ glue layer

1 is a cross-sectional view showing a flexible plate structure having an intermediate support structure according to a first embodiment of the present invention.

2 is a schematic view showing the state of use of the flexible board structure with the intermediate support structure according to the first embodiment of the present invention.

Figure 3 is a cross-sectional view showing the structure of a flexible board having an intermediate support structure according to a second embodiment of the present invention.

Figure 4 is a cross-sectional view showing the structure of a flexible board having an intermediate support structure according to a third embodiment of the present invention.

Fig. 5 is a schematic view showing the use state of the flexible board structure with the intermediate support structure according to the third embodiment of the present invention.

Fig. 6 is a schematic view showing the use state of the flexible board structure with the intermediate support structure according to the third embodiment of the present invention (2).

Figure 7 is a cross-sectional view showing the structure of a flexible board having an intermediate support structure according to a fourth embodiment of the present invention.

The disclosure of the present invention relates to a flexible board structure with an intermediate support structure suitable for performing a double-sided processing process of a flexible composite board. The present invention is characterized in that two substrates to be processed are disposed on one of the base layers. On the opposite surface, the two substrate structures can be processed simultaneously in the process, and the two substrate structures can be easily separated from the substrate after processing, that is, two circuit board products can be obtained through a single process.

The following description will be made through specific embodiments and with reference to the drawings The structural features and the way of use, so that those skilled in the art can easily understand the characteristics and functions of the creation through the disclosure of this creation, and carry out various modifications and changes without departing from the spirit of the creation, based on different viewpoints. Or apply this creation.

[First Embodiment]

Referring to FIG. 1, a cross-sectional view of a flexible board structure having an intermediate support structure according to a first embodiment of the present invention is shown. As shown, the flexible board structure 1 having an intermediate support structure includes a base layer 10, a first substrate structure 20, and a second substrate structure 30.

In general, the base layer 10 has a first bonding surface 11 and a second bonding surface 12 with respect to the first bonding surface 11. The first substrate structure 20 is in contact with the first bonding surface 11 and the second substrate structure 30 is In connection with the second bonding surface 12, those skilled in the art can determine the thicknesses to be used for the first and second substrate structures 20, 30 and the substrate 10 according to the state of the prior art, which is not limited in this creation.

In this embodiment, the base layer 10 can be a double-sided adhesive film layer having a suitable thickness and a degree of flexibility, and wherein the first and second bonding faces 11, 12 have appropriate adhesive forces, thereby The first and second substrate structures 20, 30 are adhesively fixed to the base layer 10 for performing a double-sided processing process of various flexible composite boards such as etching, bonding, hot pressing, electroless plating, punching, and the like.

It is worth mentioning that the first substrate structure 20 can provide a sufficient positive support force for the second substrate structure 30 together with the base layer 10 during the process. Similarly, the second substrate structure 30 can also be connected to the base layer 10 during the process. A sufficient back support force is provided for the first substrate structure 20. In this way, the flexible board structure 1 with the intermediate support structure can ensure that the structural strength of the structure is maintained in the process to maintain a certain strength, so as to avoid problems in the circuit board product caused by abnormal process.

It is also worth mentioning that, since the base layer 10 also has a good release effect, the first substrate structure 20 and the second substrate structure 30 of the flexible board structure 1 having the intermediate support structure can be easily and the base layer 10 after the processing. Separation. Further, the first and second substrate structures 20, 30 and the base layer 10 can be separated under specific conditions, for example, a temperature condition between 150 and 200 degrees Celsius or The specific organic solvent, but the present invention is not limited thereto, and specific conditions in which the first and second bonding faces 11, 12 of the base layer 10 are reduced (or temporarily lowered) can be used in the present embodiment.

In the case of the base layer 10, according to a variant embodiment, it may also be an insulating base layer of a polymer material, such as but not limited to a PET film layer, and for the above purpose, the base layer 10 (polymer insulating film layer) The first and second bonding surfaces 11 and 12 are evenly coated with a thermosetting strippable adhesive; in practical applications, the first and second substrate structures 20 and 30 are adhered to the first through the thermosetting strippable adhesive. And the second joint faces 11, 12, and the heat-set peelable rubber is hardened by an oven or a UV lamp. Accordingly, the first substrate structure 20 in the flexible board structure 1 having the intermediate support structure is releasably laminated on the first joint surface 11, and the second substrate structure 30 is releasably laminated on the second joint surface 12.

Referring to FIG. 1 , the first substrate structure 20 includes a substrate 21 and a metal layer 22 directly formed on the substrate 21 . The second substrate structure 30 also includes a substrate 31 and a direct molding on the substrate 31 . The metal layer 32, in other words, both the first and second substrate structures 20, 30 are glueless single panel structures.

Further, the substrate 21, 31 may be a PET film (Polyethylene Terephtalate) or a PI film (Polyimide), and the metal layers 22, 32 may be a flexible and preferably rolled metal layer (Rolled Annealed Copper, RA), but This creation is not limited to this. The soft substrates 21, 31 may also be other suitable polymer materials such as polyethylene terephtalate, Teflon, polyamide, polymethyl, based on practical application requirements. A film made of polymethylmethacrylate, Polycarbonate or Polyamide Polyethylene-Terephthalate copolymer.

Referring to FIG. 2, the structural features of the flexible board structure 1 with the intermediate support structure of the present embodiment have been described in detail above. Next, the manner of using the flexible board structure 1 with the intermediate support structure will be described by taking a metal circuit as an example. Specifically, the flexible board structure 1 with the intermediate support structure can be used for the etching process for fabricating the metal lines. The first and second bonding surfaces 11 and 12 disposed on the base layer 10 through the first and second substrate structures 20 and 30 are designed such that the metal layer 22 on the first substrate structure 20 and the metal layer 32 on the second substrate structure 30 At the same time, the wiring pattern is formed by etching; that is, the metal wiring layers 22', 32' can be simultaneously formed on the first and second substrate structures 20, 30 via a single etching process. Furthermore, after the fabrication of the metal wiring layers 22', 32' is completed, the first and second substrate structures 20, 30 can be easily separated from the substrate 10 under certain conditions (such as high temperature conditions), thereby improving at least Double the production capacity, or at a fixed production rate, can reduce at least half of the process time.

[Second embodiment]

Please refer to FIG. 3, which is a cross-sectional view showing the structure of a flexible board having an intermediate support structure according to a second embodiment of the present invention. The flexible board structure 1a having the intermediate support structure of the present embodiment is different from the previous embodiment in that the first substrate structure 20 and the second substrate structure 30 are both a single-sided substrate structure (the first embodiment) A substrate structure and a second substrate structure are both a glueless single-sided substrate structure).

In this embodiment, the first substrate structure 20 includes a substrate 21, a metal layer 22, and a bonding layer 23, wherein the substrate 21 has opposite first and second surfaces (not labeled), and the substrate The first surface of the 21 is in contact with the first bonding surface 11 of the base layer 10. The bonding layer 23 is formed on the second surface of the substrate 21. The metal layer 22 is adhered to the bonding layer 23 and passes through the bonding layer 23 and the substrate. 21 for combination. The second substrate structure 30 also includes a substrate 31, a metal layer 32 and a bonding layer 33. The substrate 31 has opposite first and second surfaces (not labeled), and the first surface of the substrate 31 is The second bonding surface 12 of the base layer 10 is joined, and the bonding layer 33 is formed on the second surface of the substrate 31. The metal layer 32 is adhered to the bonding layer 33 and bonded to the substrate 31 through the bonding layer 33.

In more detail, the material of the glue layers 23 and 33 may be an epoxy resin adhesive, an acrylic adhesive, a polyamidene adhesive, and may be formed on the substrates 21 and 31 by coating. The second surface; the metal layers 22, 32 can be closely connected to the glue layers 23, 33 by pressing, and can be stabilized through the glue layers 23, 33 and the substrates 21, 31, respectively. Solid joints together. Since the material selection of the substrates 21, 31 and the metal layers 22, 32 has been described in detail in the first embodiment, it will not be further described herein.

[Third embodiment]

Referring to FIG. 4, a cross-sectional view of a flexible board structure having an intermediate support structure according to a third embodiment of the present invention is shown. The flexible board structure 1b of the present embodiment having the intermediate support structure is different from the foregoing embodiment in that the first substrate structure 20 and the second substrate structure 30 are both a glueless double-sided substrate structure.

In this embodiment, the first substrate structure 20 includes a substrate 21, a first metal layer 221, and a second metal layer 222, wherein the substrate 21 has opposite first and second surfaces (not labeled) The first metal layer 221 and the second metal layer 222 are respectively formed on the first surface and the second surface, and one of the first and second metal layers 221, 222 may further be combined with the base layer according to process requirements. The first joint faces 11 of 10 are in contact.

The second substrate structure 30 also includes a substrate 31, a first metal layer 321 and a second metal layer 322, wherein the substrate 31 has opposite first and second surfaces (not labeled), the first metal layer 321 and a second metal layer 322 are respectively formed on the first surface and the second surface, and one of the first and second metal layers 321 and 322 may further be connected to the second bonding surface of the base layer 10 according to process requirements. 12 connected. Since the material selection of the first metal layers 221, 321 , the second metal layers 222, 322 and the substrates 21, 31 of the present embodiment may be the same as the foregoing embodiment, it will not be further described herein.

Referring to FIGS. 5 and 6, the following uses the metal circuit as an example to illustrate the use of the flexible board structure 1b having the intermediate support structure. First of all, it must be mentioned that the flexible board structure 1b with the intermediate support structure, during the etching process for fabricating the metal lines, the first metal layers 221, 321 and the second of the first and second substrate structures 20, 30 Both metal layers 222, 322 need to be etched to form a line pattern (as shown in Figure 6). To achieve the above objective, the flexible board structure 1b having the intermediate support structure may be first subjected to an etching process for fabricating a metal line for the first time, wherein the second metal layers 222, 322 and the first and second bonding surfaces of the base layer 10, respectively. 11, 12 connected (Figure not In other words, the first metal layers 221 and 321 are exposed to be etched to form the first metal wiring layers 221' and 321'.

After the fabrication of the first metal wiring layers 221', 321' is completed, the processed first and second substrate structures 20, 30 and the substrate 10 can be separated under specific conditions, and the first and second bonding of the substrate 10 are completed. After the adhesion of the faces 11, 12 is restored, the bonding is repeated, and the first metal circuit layers 221', 321' are respectively connected to the first and second bonding faces 11, 12 of the base layer 10 (as shown in FIG. 5). .

Thereafter, the flexible board structure 1b with the intermediate support structure is followed by a second etching process for fabricating the metal lines, further exposing the exposed second metal layers 222, 322 to form the second metal circuit layers 222', 322' When the fabrication of the second metal wiring layers 222', 322' is completed, the first and second substrate structures 20, 30 can be easily separated from the substrate 10 under specific conditions such as high temperature conditions. In summary, although the flexible board structure 1b having the intermediate support structure needs to be etched twice to form a line pattern on both sides of the first and second substrate structures 20, 30, it is compatible with the processing technology of the conventional flexible composite board. Compared, it can still achieve the effect of increasing production and reducing process time.

[Fourth embodiment]

Referring to FIG. 5, a cross-sectional view of a flexible board structure having an intermediate support structure according to a fourth embodiment of the present invention is shown. The difference between the present embodiment and the previous embodiment is that both the first substrate structure 20 and the second substrate structure 30 have a glue-based double-sided substrate structure.

In this embodiment, the first substrate structure 20 includes a substrate 21, a first metal layer 221, a second metal layer 222, and two bonding layers 23, wherein the substrate 21 has a first surface disposed opposite to each other. a second surface (not shown), the two bonding layers 23 are respectively formed on the first surface and the second surface, and the first metal layer 221 is in contact with one of the two bonding layers 23, and the second metal The layer 222 is connected to the other of the two bonding layers 23, and one of the first and second metal layers 221, 222 may further be connected to the first bonding surface 11 of the base layer 10, depending on process requirements. .

The second substrate structure 30 includes a substrate 31, a first metal layer 321, and a second a metal layer 322 and two bonding layers 33, wherein the substrate 31 has opposite first and second surfaces (not labeled), and the two bonding layers 33 are respectively formed on the first surface and the second surface, A metal layer 321 is in contact with one of the two bonding layers 33, and a second metal layer 322 is connected to the other of the two bonding layers 33, and the first and second are required according to process requirements. One of the metal layers 321, 322 may further interface with the second joint surface 12 of the base layer 10. Since the material selection of the substrate 21, 31, the first metal layer 221, 321 , the second metal layer 222, 322, and the bonding layers 23, 33 of the present embodiment may be the same as the foregoing embodiment, it will not be further described herein.

In summary, compared with the conventional soft board, the flexible board structure with the intermediate support structure is applied to the processing of various flexible composite boards, and the two substrate structures (the first and second substrate structures) can be simultaneously applied. Processing can increase production capacity by at least twice, or at least half of the process time with a fixed production volume.

Secondly, since the first substrate structure in the process can provide a sufficient positive support force for the second substrate structure together with the base layer and vice versa, the flexible plate structure with the intermediate support structure can ensure the structural strength of the structure in the process. Maintain a certain strength to avoid problems with the board product caused by abnormal process.

Furthermore, the two substrate structures after processing can be easily separated from the substrate under certain conditions, so the present invention can overcome the technical limitations of the processing process of the conventional flexible composite board, such as manufacturing cost (including manpower, equipment and raw materials costs). ) is very expensive, and the resulting circuit board products have good structural, dimensional stability and electrical characteristics.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent protection of the present invention. Therefore, the equivalent changes of the present specification and the contents of the drawings are all included in the right of the creation. Within the scope of protection, it is given to Chen Ming.

1‧‧‧Flexible plate structure with intermediate support structure

10‧‧‧ grassroots

11‧‧‧First joint

12‧‧‧Second joint

20‧‧‧First substrate structure

21‧‧‧Substrate

22‧‧‧metal layer

30‧‧‧Second substrate structure

31‧‧‧Substrate

32‧‧‧metal layer

Claims (11)

A flexible board structure with an intermediate support structure suitable for performing a double-sided processing process of a flexible composite board, the flexible board structure having an intermediate support structure comprising: a base layer having a first joint surface and a relative joint surface a second bonding surface of the first bonding surface; a first substrate structure, the first substrate structure is releasably laminated on the first bonding surface; and a second substrate structure, the second substrate structure Releasably laminated on the second joint surface. The flexible board structure with an intermediate support structure according to claim 1, wherein the first substrate structure comprises a substrate and a metal layer, and the substrate of the first substrate structure is connected to the first joint surface The metal layer of the first substrate structure is formed on the substrate of the first substrate structure. The flexible board structure with an intermediate support structure according to claim 2, wherein the second substrate structure comprises a substrate and a metal layer, and the substrate of the second substrate structure is connected to the second joint surface The metal layer of the second substrate structure is formed on the substrate of the second substrate structure. The flexible board structure with an intermediate support structure according to claim 1, wherein the first substrate structure comprises a substrate, a glue layer and a metal layer, and the substrate of the first substrate structure and the first The bonding surface is in contact with the bonding layer of the first substrate structure formed on the substrate of the first substrate structure, and the metal layer of the first substrate structure is adhered to the bonding layer of the first substrate structure. The flexible board structure with an intermediate support structure according to claim 4, wherein the second substrate structure comprises a substrate, a glue layer and a metal layer, and the substrate of the second substrate structure and the second The bonding surface is in contact with the bonding layer of the second substrate structure formed on the substrate of the second substrate structure, and the metal layer of the second substrate structure is adhered to the bonding layer of the second substrate structure. A flexible board structure having an intermediate support structure according to claim 1, wherein said a substrate structure includes a first metal layer, a substrate, and a second metal layer, wherein the first metal layer and the second metal layer of the first substrate structure are respectively formed on a substrate of the first substrate structure And a first metal layer of the first substrate structure further contacts the first bonding surface. The flexible board structure with an intermediate support structure according to claim 6, wherein the second substrate structure comprises a first metal layer, a substrate and a second metal layer, and the first metal of the second substrate structure The layer and the second metal layer are respectively formed on opposite surfaces of the substrate of the second substrate structure, and the first metal layer of the second substrate structure further contacts the second bonding surface. The flexible board structure with an intermediate support structure according to claim 1, wherein the first substrate structure comprises a substrate, two bonding layers, a first metal layer and a second metal layer, the first substrate Two bonding layers of the structure are respectively formed on opposite surfaces of the substrate of the first substrate structure, and the first metal layer of the first substrate structure simultaneously forms the first bonding surface and the first substrate structure One of the two bonding layers is in contact with each other, and the second metal layer of the first substrate structure is in contact with the other of the two bonding layers of the first substrate structure. The flexible board structure with an intermediate support structure according to claim 8, wherein the second substrate structure comprises a substrate, two bonding layers, a first metal layer and a second metal layer, and the second substrate Two bonding layers of the structure are respectively formed on opposite surfaces of the substrate of the second substrate structure, and the first metal layer of the second substrate structure simultaneously forms the second bonding surface and the second substrate structure One of the two bonding layers is in contact with each other, and the second metal layer of the second substrate structure is in contact with the other of the two bonding layers of the second substrate structure. The flexible board structure with an intermediate support structure according to any one of claims 2 to 5, wherein the substrate of the first substrate structure is a PET film or a PI film, and the metal layer of the first substrate structure The substrate of the second substrate structure is a PET film or a PI film, and the metal layer of the second substrate structure is a rolled metal layer. The flexible board structure with an intermediate support structure according to any one of claims 6 to 9, wherein the substrate of the first substrate structure is a PET film or a PI film, and the first substrate structure is first. The metal layer is a rolled metal layer, the second metal layer of the first substrate structure is a rolled metal layer, and the substrate of the second substrate structure is a PET film or a PI film, and the second substrate structure is The first metal layer is a rolled metal layer, and the second metal layer of the second substrate structure is a rolled metal layer.