TW201730273A - 三維直通矽穿孔(tsv)封裝用底部填充膜之樹脂組合物及供其裝備之組合物 - Google Patents
三維直通矽穿孔(tsv)封裝用底部填充膜之樹脂組合物及供其裝備之組合物 Download PDFInfo
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- TW201730273A TW201730273A TW105137361A TW105137361A TW201730273A TW 201730273 A TW201730273 A TW 201730273A TW 105137361 A TW105137361 A TW 105137361A TW 105137361 A TW105137361 A TW 105137361A TW 201730273 A TW201730273 A TW 201730273A
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- Prior art keywords
- composition
- group
- epoxy resin
- aryl
- alkynyl
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 104
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title 2
- 239000011342 resin composition Substances 0.000 title 1
- 239000000377 silicon dioxide Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 66
- 239000003822 epoxy resin Substances 0.000 claims abstract description 65
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000012745 toughening agent Substances 0.000 claims abstract description 17
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 10
- -1 arylalkylene Chemical group 0.000 claims description 37
- 239000004593 Epoxy Substances 0.000 claims description 24
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 23
- 125000003118 aryl group Chemical group 0.000 claims description 21
- 239000003085 diluting agent Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 230000004907 flux Effects 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 239000000178 monomer Substances 0.000 claims description 13
- 229920005862 polyol Polymers 0.000 claims description 11
- 125000000304 alkynyl group Chemical group 0.000 claims description 10
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 150000003077 polyols Chemical class 0.000 claims description 10
- 150000003254 radicals Chemical class 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 229910003849 O-Si Inorganic materials 0.000 claims description 8
- 229910003872 O—Si Inorganic materials 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 8
- 239000002318 adhesion promoter Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 125000001072 heteroaryl group Chemical group 0.000 claims description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 125000005000 thioaryl group Chemical group 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 5
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 5
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical group C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 claims description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- 125000005024 alkenyl aryl group Chemical group 0.000 claims description 4
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000005019 carboxyalkenyl group Chemical group 0.000 claims description 4
- 125000004181 carboxyalkyl group Chemical group 0.000 claims description 4
- 150000001735 carboxylic acids Chemical group 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 4
- 239000002529 flux (metallurgy) Substances 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 150000002466 imines Chemical class 0.000 claims description 4
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- 125000005025 alkynylaryl group Chemical group 0.000 claims description 3
- 125000006294 amino alkylene group Chemical group 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 3
- 238000001879 gelation Methods 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims description 3
- 150000001261 hydroxy acids Chemical class 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 239000006254 rheological additive Substances 0.000 claims description 3
- 125000004001 thioalkyl group Chemical group 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229920002732 Polyanhydride Polymers 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920002675 Polyoxyl Polymers 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- 125000005021 aminoalkenyl group Chemical group 0.000 claims description 2
- 125000004103 aminoalkyl group Chemical group 0.000 claims description 2
- 125000005124 aminocycloalkyl group Chemical group 0.000 claims description 2
- 125000005214 aminoheteroaryl group Chemical group 0.000 claims description 2
- 238000004458 analytical method Methods 0.000 claims description 2
- 125000005018 aryl alkenyl group Chemical group 0.000 claims description 2
- 125000005015 aryl alkynyl group Chemical group 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims description 2
- 229920001400 block copolymer Polymers 0.000 claims description 2
- 125000005026 carboxyaryl group Chemical group 0.000 claims description 2
- 125000005352 carboxycycloalkyl group Chemical group 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 150000002431 hydrogen Chemical group 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims description 2
- 238000006384 oligomerization reaction Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 125000000466 oxiranyl group Chemical group 0.000 claims description 2
- 125000005429 oxyalkyl group Chemical group 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
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- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
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- 150000004322 quinolinols Chemical class 0.000 claims description 2
- 238000010526 radical polymerization reaction Methods 0.000 claims description 2
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- 230000000930 thermomechanical effect Effects 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- LTSWUFKUZPPYEG-UHFFFAOYSA-N 1-decoxydecane Chemical compound CCCCCCCCCCOCCCCCCCCCC LTSWUFKUZPPYEG-UHFFFAOYSA-N 0.000 claims 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 claims 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 150000001345 alkine derivatives Chemical class 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000005001 aminoaryl group Chemical group 0.000 claims 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims 1
- 125000001033 ether group Chemical group 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 150000002924 oxiranes Chemical group 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- JGBOVFKUKBGAJQ-UHFFFAOYSA-N 2-methylidenebutanediamide Chemical compound NC(=O)CC(=C)C(N)=O JGBOVFKUKBGAJQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000009472 formulation Methods 0.000 description 20
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
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- 229930185605 Bisphenol Natural products 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
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- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 5
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- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- AAMHBRRZYSORSH-UHFFFAOYSA-N 2-octyloxirane Chemical compound CCCCCCCCC1CO1 AAMHBRRZYSORSH-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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Classifications
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Abstract
本文提供混合樹脂系統及其用於三維TSV封裝用晶圓級底部填充(WAUF)之用途。在一態樣中,提供包括(1)環氧樹脂、(2)馬來醯亞胺、納地醯亞胺或衣康醯亞胺、(3)韌化劑及(4)填充劑之組合物。在某些態樣中,本發明係關於自本發明組合物製得之底部填充膜。在某些態樣中,本發明係關於包括本文所闡述之該等底部填充膜之物件。
Description
本發明係關於混合樹脂系統及使用其製備三維直通矽穿孔(TSV)封裝用晶圓級底部填充物(WAUF)之方法。在一態樣中,本發明係關於包括至少(1)環氧樹脂、(2)馬來醯亞胺、納地醯亞胺或衣康醯亞胺、(3)韌化劑及(4)填充劑之組合之組合物。在某些態樣中,本發明係關於自本發明組合物製得之底部填充膜。在某些態樣中,本發明係關於包括本文所闡述之該等底部填充膜之物件。在某些實施例中,本發明係關於總成,其包括藉由如本文所闡述調配物之固化等分試樣永久性黏著至第二物件之第一物件。
根據本發明,提供混合樹脂系統及使用其製備三維直通矽穿孔(TSV)封裝用晶圓級底部填充物(WAUF)之方法。 在一態樣中,提供包括至少(1)環氧樹脂、(2)馬來醯亞胺、納地醯亞胺或衣康醯亞胺、(3)韌化劑及(4)填充劑之組合之組合物。值得注意地,本發明組合物實質上不含丙烯酸酯樹脂。 在某些態樣中,提供自本發明組合物製得之底部填充膜。 在某些態樣中,提供包括本文所闡述之底部填充膜之物件。 在某些態樣中,提供總成,其包括藉由如本文所闡述調配物之固化等分試樣永久性黏著至第二物件之第一物件。
根據本發明,提供包括以下之組合物: (i)馬來醯亞胺、納地醯亞胺或衣康醯亞胺, (ii)環氧樹脂, (iii)韌化劑,及 (iv)填充劑, 然而,條件係該組合物實質上不含丙烯酸酯樹脂; 其中: 該馬來醯亞胺、納地醯亞胺或衣康醯亞胺係單體或寡聚且可發生自由基固化以形成聚合網絡; 該環氧樹脂係可固化成三維聚合物網絡之熱固性樹脂; 該韌化劑減小該組合物之材料脆性且增加其抗衝擊性,且 該填充劑調節所得組合物之熱膨脹係數(CTE);且 其中該組合物在固化時具有: 100℃ – 205℃之差示掃描量熱(DSC)起始溫度; 在200泊 - 40,000泊範圍內之熔體黏度,及 130℃ – 180℃之膠凝溫度,如藉由Ares流變儀在10 Rad頻率下以10℃/min斜升速率使用1英吋直徑及1 mm厚試樣所量測。 涵蓋用於本文中之馬來醯亞胺、納地醯亞胺或衣康醯亞胺係分別具有以下結構之化合物:其中: m為1至15, p為0至15, 每一R2
獨立地選自氫或低碳烷基(例如C1-5
),且 J係包括有機或有機矽氧烷基團之單價或多價基團,及 其兩者或更多者之組合。 在本發明之一些實施例中,J係選自以下之單價或多價基團: - 通常具有在約6個至最多約500個範圍內之碳原子之烴基或經取代烴基物質,其中該等烴基物質係選自烷基、烯基、炔基、環烷基、環烯基、芳基、烷基芳基、芳基烷基、芳基烯基、烯基芳基、芳基炔基或炔基芳基,然而,條件係僅在J包括兩種或更多種不同物質之組合時J方可為芳基; - 通常具有在約6個至最多約500個範圍內之碳原子之伸烴基或經取代伸烴基物質,其中該等伸烴基物質係選自伸烷基、伸烯基、伸炔基、伸環烷基、伸環烯基、伸芳基、烷基伸芳基、芳基伸烷基、芳基伸烯基、烯基伸芳基、芳基伸炔基或炔基伸芳基, - 通常具有在約6個至最多約500個範圍內之碳原子之雜環或經取代雜環物質, - 聚矽氧烷,或 - 聚矽氧烷-聚胺基甲酸酯嵌段共聚物,以及 上述基團中之一或多者與選自以下之連接體之組合:共價鍵、-O-、-S-、-NR-、-NR-C(O)-、-NR-C(O)-O-、-NR-C(O)-NR-、-S-C(O)-、-S-C(O)-O-、-S-C(O)-NR-、-O-S(O)2
-、-O-S(O)2
-O-、-O-S(O)2
-NR-、-O-S(O)-、-O-S(O)-O-、-O-S(O)-NR-、-O-NR-C(O)-、-O-NR-C(O)-O-、-O-NR-C(O)-NR-、-NR-O-C(O)-、-NR-O-C(O)-O-、-NR-O-C(O)-NR-、-O-NR-C(S)-、-O-NR-C(S)-O-、-O-NR-C(S)-NR-、-NR-O-C(S)-、-NR-O-C(S)-O-、-NR-O-C(S)-NR-、-O-C(S)-、-O-C(S)-O-、-O-C(S)-NR-、-NR-C(S)-、-NR-C(S)-O-、-NR-C(S)-NR-、-S-S(O)2
-、-S-S(O)2-
O-、-S-S(O)2
-NR-、-NR-O-S(O)-、-NR-O-S(O)-O-、-NR-O-S(O)-NR-、-NR-O-S(O)2
-、-NR-O-S(O)2
-O-、-NR-O-S(O)2
-NR-、-O-NR-S(O)-、-O-NR-S(O)-O-、-O-NR-S(O)-NR-、-O-NR-S(O)2
-O-、-O-NR-S(O)2
-NR-、-O-NR-S(O)2
-、-O-P(O)R2
-、-S-P(O)R2
-或-NR-P(O)R2
-;其中每一R獨立地係氫、烷基或經取代烷基。 實例性組合物包含J係以下基團者:氧基烷基、硫代烷基、胺基烷基、羧基烷基、氧基烯基、硫代烯基、胺基烯基、羧基烯基、氧基炔基、硫代炔基、胺基炔基、羧基炔基、氧基環烷基、硫代環烷基、胺基環烷基、羧基環烷基、氧基環烯基、硫代環烯基、胺基環烯基、羧基環烯基、雜環、氧基雜環、硫代雜環、胺基雜環、羧基雜環、氧基芳基、硫代芳基、胺基芳基、羧基芳基、雜芳基、氧基雜芳基、硫代雜芳基、胺基雜芳基、羧基雜芳基、氧基烷基芳基、硫代烷基芳基、胺基烷基芳基、羧基烷基芳基、氧基芳基烷基、硫代芳基烷基、胺基芳基烷基、羧基芳基烷基、氧基芳基烯基、硫代芳基烯基、胺基芳基烯基、羧基芳基烯基、氧基烯基芳基、硫代烯基芳基、胺基烯基芳基、羧基烯基芳基、氧基芳基炔基、硫代芳基炔基、胺基芳基炔基、羧基芳基炔基、氧基炔基芳基、硫代炔基芳基、胺基炔基芳基或羧基炔基芳基、氧基伸烷基、硫代伸烷基、胺基伸烷基、羧基伸烷基、氧基伸烯基、硫代伸烯基、胺基伸烯基、羧基伸烯基、氧基伸炔基、硫代伸炔基、胺基伸炔基、羧基伸炔基、氧基伸環烷基、硫代伸環烷基、胺基伸環烷基、羧基伸環烷基、氧基伸環烯基、硫代伸環烯基、胺基伸環烯基、羧基伸環烯基、氧基伸芳基、硫代伸芳基、胺基伸芳基、羧基伸芳基、氧基烷基伸芳基、硫代烷基伸芳基、胺基烷基伸芳基、羧基烷基伸芳基、氧基芳基伸烷基、硫代芳基伸烷基、胺基芳基伸烷基、羧基芳基伸烷基、氧基芳基伸烯基、硫代芳基伸烯基、胺基芳基伸烯基、羧基芳基伸烯基、氧基烯基伸芳基、硫代烯基伸芳基、胺基烯基伸芳基、羧基烯基伸芳基、氧基芳基伸炔基、硫代芳基伸炔基、胺基芳基伸炔基、羧基 芳基伸炔基、氧基炔基伸芳基、硫代炔基伸芳基、胺基炔基伸芳基、羧基炔基伸芳基、雜伸芳基、氧基雜伸芳基、硫代雜伸芳基、胺基雜伸芳基、羧基雜伸芳基、含雜原子二價或多價環狀部分、含氧基雜原子二價或多價環狀部分、含硫代雜原子二價或多價環狀部分、含胺基雜原子二價或多價環狀部分或含羧基雜原子二價或多價環狀部分。 涵蓋用於本文中之環氧樹脂包含上面具有一或多個環氧化物基團之聚合主鏈。本文涵蓋使用眾多種環氧官能化樹脂,例如基於雙酚A之液體型環氧樹脂、基於雙酚A之固體型環氧樹脂、基於雙酚F之液體型環氧樹脂(例如Epiclon EXA-835LV)、酚醛清漆環氧樹脂、基於酚-酚醛清漆樹脂多官能環氧樹脂、二環戊二烯型環氧樹脂(例如Epiclon HP-7200L)、萘型環氧樹脂、矽氧烷改質環氧樹脂、環脂族環氧樹脂、聯苯環氧樹脂、改質環氧樹脂及諸如此類以及其任兩者或更多者之組合。 涵蓋用於本文中之實例性環氧官能化樹脂包含環脂族醇之二環氧化物、氫化雙酚A (可以Epalloy 5000形式購得)、六氫鄰苯二甲酸酐之二官能環脂族縮水甘油基酯(可以Epalloy 5200形式購得)、Epiclon EXA-835LV、Epiclon HP-7200L及諸如此類以及其任兩者或更多者之混合物。 在某些實施例中,環氧組份可包含兩種或更多種不同基於雙酚之環氧樹脂之組合。該等基於雙酚之環氧樹脂可選自雙酚A、雙酚F或雙酚S環氧樹脂或其組合。另外,可使用兩種或更多種屬相同樹脂類型內之不同雙酚環氧樹脂(例如A、F或S)。 涵蓋用於本文中之雙酚環氧樹脂之市售實例包含雙酚-F型環氧樹脂(例如來自Nippon Kayaku, Japan之RE-404-S及來自Dai Nippon Ink & Chemicals, Inc.之EPICLON 830 (RE1801)、830S (RE1815)、830A (RE1826)及830W以及來自Resolution之RSL 1738及YL-983U)及雙酚A型環氧樹脂(例如來自Resolution之YL-979及980)。 購自Dai Nippon之上述雙酚環氧樹脂係以黏度遠低於基於雙酚A環氧樹脂之習用環氧樹脂之液體未稀釋表氯醇-雙酚F環氧樹脂形式促銷且具有類似於液體雙酚A環氧樹脂之物理性質。雙酚F環氧具有低於雙酚A環氧樹脂之黏度,所有其他方面在兩類環氧樹脂之間皆相同,此提高較低黏度及由此快速流動之底部填充密封劑材料。該4種雙酚F環氧樹脂之EEW介於165與180之間。25℃下之黏度介於3,000 cp與4,500 cp之間(RE1801除外,其黏度上限為4,000 cp)。可水解氯化物含量據報告為200 ppm (對於RE1815及830W)及100 ppm (對於RE1826)。 購自Resolution之上述雙酚環氧樹脂係以含有低氯化物之液體環氧樹脂促銷。雙酚A環氧樹脂具有介於180與195之間之EEW (g/eq)及介於100 cp與250 cp之間之25℃下黏度。YL-979之總氯化物含量據報告為介於500 ppm與700 ppm之間且YL-980據報告為介於100 ppm與300 ppm之間。雙酚F環氧樹脂具有介於165與180之間之EEW (g/eq)及介於30與60之間之25℃下黏度。RSL-1738之總氯化物含量據報告為介於500與700 ppm之間且YL-983U據報告為介於150 ppm與350 ppm之間。 除雙酚環氧樹脂外,涵蓋其他環氧化合物以用作本發明調配物之環氧組份。舉例而言,可使用環脂族環氧樹脂,例如3,4-環氧環己基甲基-3,4-環氧環己基碳酸酯。亦可使用單官能、二官能或多官能反應性稀釋劑來調節黏度及/或降低所得樹脂材料之Tg。實例性反應性稀釋劑包含丁基縮水甘油基醚、甲苯酚基縮水甘油基醚、聚乙二醇縮水甘油基醚、聚丙二醇縮水甘油基醚及諸如此類。 適用於本文中之環氧樹脂包含酚類化合物之聚縮水甘油基衍生物,例如可以商品名EPON購得者(例如來自Resolution之EPON 828、EPON 1001、EPON 1009及EPON 1031);來自Dow Chemical Co.之DER 331、DER 332、DER 334及DER 542;及來自Nippon Kayaku之BREN-S。其他適宜環氧樹脂包含自多元醇及諸如此類製得之聚環氧化物及酚-甲醛酚醛清漆之聚縮水甘油基衍生物,後者係(例如)來自Dow Chemical之DEN 431、DEN 438及DEN 439。甲酚類似物亦可以商品名ARALDITE購得,例如來自Ciba Specialty Chemicals Corporation之ARALDITE ECN 1235、ARALDITE ECN 1273及ARALDITE ECN 1299。SU-8係可自Resolution購得之雙酚A型環氧酚醛清漆。胺、胺基醇及多羧酸之聚縮水甘油基加合物亦可用於本發明中,其市售樹脂包含來自F.I.C. Corporation之GLYAMINE 135、GLYAMINE 125及GLYAMINE 115、來自Ciba Specialty Chemicals之ARALDITE MY-720、ARALDITE 0500及ARALDITE 0510及來自Sherwin-Williams Co之PGA-X及PGA-C。 可選擇用於本文中之適當單官能環氧共反應劑稀釋劑包含黏度低於環氧組份(通常小於約250 cp)者。 單官能環氧共反應劑稀釋劑應具有含有約6至約28個碳原子之烷基之環氧基,其實例包含C6-28
烷基縮水甘油基醚、C6-28
脂肪酸縮水甘油基酯、C6-28
烷基苯酚縮水甘油基醚及諸如此類。 在包含此一單官能環氧共反應劑稀釋劑之情形下,基於組合物之總重量,該共反應劑稀釋劑應以約0.5重量%至約10重量%之量採用;在一些實施例中,基於組合物之總重量,該共反應劑稀釋劑應以約0.25重量%至約5重量%之量採用。 環氧組份應以在約1重量%至約20重量%範圍內之量存在於組合物中;在一些實施例中,本發明調配物包括約2重量%至約18重量%之環氧樹脂;在一些實施例中,本發明調配物包括約5重量%至約15重量%之環氧樹脂。 在一些實施例中,本文所用之環氧組份係矽烷改質環氧樹脂,例如包含以下之物質組合物: (A)由下列結構涵蓋之環氧組份:其中: Y可或可不存在且在Y存在時係直接鍵、CH2
、CH(CH3
)2
、C=O或S, 此處之R1
係烷基、烯基、羥基羧基及鹵素,且 此處之x為1-4; (B)由下列結構涵蓋之環氧官能化烷氧基矽烷:其中 R1
係含有環氧乙烷之部分且 R2
係具有一至十個碳原子之經烷基或烷氧基取代之烷基、芳基或芳烷基;及 (C)組份(A)及(B)之反應產物。 一種該矽烷改質環氧樹脂之一實例係形成為芳香族環氧樹脂(例如雙酚A、E、F或S環氧樹脂或聯苯環氧樹脂)及環氧矽烷之反應產物,其中環氧矽烷係由下列結構涵蓋:其中 R1
係含有環氧乙烷之部分,其實例包含2-(乙氧基甲基)環氧乙烷、2-(丙氧基甲基)環氧乙烷、2-(甲氧基甲基)環氧乙烷及2-(3-甲氧基丙基)環氧乙烷且 R2
係具有一至十個碳原子之經烷基或烷氧基取代之烷基、芳基或芳烷基。 在一實施例中,R1
係2-(乙氧基甲基)環氧乙烷且R2
係甲基。 用於製備矽烷改質環氧樹脂之芳香族環氧樹脂之理想化結構包含其中 Y可或可不存在,且在Y存在時係直接鍵、CH2
、CH(CH3
)2
、C=O或S, R1
係烷基、烯基、羥基、羧基或鹵素,且 x為1-4。 當然,在x為2-4時,芳香族環氧樹脂之鏈延伸形式亦預計由此結構涵蓋。 舉例而言,芳香族環氧樹脂之鏈延伸形式可由下述結構涵蓋:在一些實施例中,矽氧烷改質環氧樹脂具有以下結構:
-(O-Si(Me)2
-O-Si(Me)(Z)-O-Si(Me)2
-O-Si(Me)2
)n
- 其中: Z係-O-(CH2
)3
-O-Ph-CH2
-Ph-O-(CH2
-CH(OH)-CH2
-O-Ph-CH2
-Ph-O-)n
-CH2
-環氧乙烷,且 n在約1-4範圍內。 在一些實施例中,藉由使下列組份之組合在適於促進其反應之條件下進行接觸來產生矽氧烷改質環氧樹脂:其中「n」在約1-4範圍內。 矽烷改質環氧樹脂亦可為芳香族環氧樹脂、環氧矽烷及芳香族環氧樹脂與環氧矽烷之反應產物之組合。可自芳香族環氧樹脂及環氧矽烷以1:100至100:1 (例如1:10至10:1之重量比率)之重量比率來製備反應產物。 涵蓋用於本發明組合物中之環氧單體之量應足夠,從而所得調配物包括在約1 - 40 wt %範圍內之環氧樹脂。在某些實施例中,所得調配物包含在約2-30 wt %範圍內之該環氧樹脂。在某些實施例中,所得調配物包含在約5-20 wt %範圍內之該環氧樹脂。 環氧固化劑視情況與環氧單體組合採用。實例性環氧固化劑包含脲、脂肪族及芳香族胺、胺硬化劑、聚醯胺、咪唑、雙氰胺、醯肼、脲-胺混合固化系統、自由基起始劑(例如過氧基酯、過氧基碳酸酯、氫過氧化物、烷基過氧化物、芳基過氧化物、偶氮化合物及諸如此類)、有機鹼、過渡金屬觸媒、酚、酸酐、路易斯(Lewis)酸及路易斯鹼。 在存在環氧固化劑時,本發明組合物包括在約0.1 - 2 wt %範圍內之環氧固化劑。在某些實施例中,本發明組合物包含在約0.5 - 5 wt %範圍內之環氧固化劑。 視情況,一或多種其他單體或自其衍生之樹脂可存在於本發明調配物在,例如氰酸酯、聚矽氧、氧雜環丁烷、聚酯、聚胺基甲酸酯、聚醯亞胺、三聚氰胺、脲-甲醛、酚-甲醛及諸如此類。在存在時,基於最終調配物之總重量,該等材料可以約0.1至最高約60 wt %之範圍存在。 在存在時,涵蓋用於實踐本發明之氰酸酯單體含有兩個或更多個成環氰酸酯(-O-C≡N)基團,該等基團在加熱時發生環三聚合以形成經取代三嗪環。因在固化氰酸酯單體期間不形成離去基團或揮發性副產物,故固化反應稱為加成聚合。可用於實踐本發明之適宜聚氰酸酯單體包含(例如) 1,1-雙4-氰氧基苯基)甲烷、1,1-雙4-氰氧基苯基)乙烷、2,2-雙4-氰氧基苯基)丙烷、雙4-氰氧基苯基)-2,2-丁烷、1,3-雙[2-(4-氰氧基苯基)丙基]苯、雙4-氰氧基苯基)醚、4,4'-二氰氧基二苯基、雙4-氰氧基-3,5-二甲基苯基)甲烷、參(4-氰氧基苯基)乙烷、氰化酚醛清漆、1,3-雙[4-氰氧基苯基-1-(1-甲基亞乙基)]苯、氰化酚二環戊二烯加合物及諸如此類。本發明所用之聚氰酸酯酯單體可易於藉由使適當二元或多元酚與鹵化氰在酸受體存在下進行反應來製備。 根據本發明可視情況與聚氰酸酯單體組合之單體係選自彼等發生加成聚合之單體。該等單體包含乙烯基醚、二乙烯基醚、二烯丙基醚、二甲基丙烯酸酯、二炔丙基醚、混合炔丙基烯丙基醚、單馬來醯亞胺、雙馬來醯亞胺及諸如此類。該等單體之實例包含環己烷二甲醇單乙烯基醚、氰尿酸參烯丙基酯、1,1-雙4-烯丙基氧基苯基)乙烷、1,1-雙4-炔丙基氧基苯基)乙烷、1,1-雙4-烯丙基氧基苯基-4'-炔丙基氧基苯基)乙烷、3-(2,2-二甲基三亞甲基縮醛)-1-馬來醯亞胺基苯、2,2,4-三甲基六亞甲基-1,6-雙馬來醯亞胺、2,2-雙[4-(4-馬來醯亞胺基苯氧基)苯基]丙烷及諸如此類。 涵蓋用於實踐本發明之其他氰酸酯在業內已眾所周知。例如參見美國專利第5,718,941號,其全部內容以引用方式併入本文中。 在存在時,涵蓋用於實踐本發明之聚矽氧在業內已眾所周知。例如參見美國專利第5,717,034號,其全部內容以引用方式併入本文中。 在存在時,氧雜環丁烷(亦即1,3-環氧丙烷)係具有分子式C3
H6
O之雜環有機物化合物,其具有含有三個碳原子及一個氧原子之4員環。術語氧雜環丁烷通常亦係指含有氧雜環丁烷環之任一有機化合物。例如參見Burkhard等人,Angew. Chem. Int. Ed. 2010, 49, 9052 – 9067,其全部內容以引用方式併入本文中。 在存在時,涵蓋用於實踐本發明之聚酯係指藉由多元醇(polyol) (亦稱為多元醇(polyhydric alcohol))與飽和或不飽和二元酸之反應形成之縮合聚合物。所用典型多元醇係二醇,例如乙二醇;通常使用之酸係鄰苯二甲酸及馬來酸。連續去除水(酯化反應之副產物),從而驅使反應完成。不飽和聚酯及添加劑(例如苯乙烯)之使用會降低樹脂之黏度。初始液體樹脂藉由交聯鏈轉化成固體。此係藉由在不飽和鍵處產生自由基來進行,該等自由基在鏈反應中擴散至毗鄰分子中之其他不飽和鍵處,從而連接製程中之毗鄰鏈。 在存在時,涵蓋用於實踐本發明之聚胺基甲酸酯係指由藉由胺基甲酸酯(carbamate、urethane)連接接合之有機單元鏈構成之聚合物。聚胺基甲酸酯聚合物係藉由使異氰酸酯與多元醇進行反應而形成。用於製備聚胺基甲酸酯之異氰酸酯及多元醇平均每分子含有兩個或更多個官能基。 在存在時,涵蓋用於實踐本發明之聚醯亞胺係指由藉由醯亞胺鏈接(亦即-C(O)-N(R)-C(O)-)接合之有機單元鏈構成之聚合物。聚醯亞胺聚合物可藉由各種反應形成,亦即,藉由使二酐及二胺進行反應、藉由二酐與二異氰酸酯之間之反應及諸如此類。 在存在時,涵蓋用於實踐本發明之三聚氰胺係指藉由聚合自三聚氰胺(亦即1,3,5-三嗪-2,4,6-三胺)及甲醛製得之硬熱固性塑膠材料。其丁基化形式可溶於正丁醇及/或二甲苯中。其可用於與其他樹脂(例如醇酸樹脂、環氧樹脂、丙烯酸樹脂及聚酯樹脂)進行交聯。 在存在時,涵蓋用於實踐本發明之脲-甲醛係自在弱鹼(例如氨或吡啶)存在下加熱之脲及甲醛製得之非透明熱固性樹脂或塑膠。 在存在時,涵蓋用於實踐本發明之酚-甲醛係指藉由酚或經取代酚與甲醛之反應獲得之合成聚合物。 涵蓋用於本文中之韌化劑係增強引入其之調配物之抗衝擊性之添加劑。實例性韌化劑包含表氯醇及雙酚A之中等分子量至高分子量熱塑性聚合物,例如具有聚羥基醚結構且具有末端羥基以及沿其主鏈之重複羥基之苯氧基樹脂。一種該韌化劑係具有以下結構之苯氧基樹脂:其中n在約50至最高約150範圍內。 涵蓋用於實踐本發明之微粒填充劑包含二氧化矽、矽酸鈣、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氧化鋁(Al2
O3
)、氧化鋅(ZnO)、氧化鎂(MgO)、氮化鋁(AIN)、氮化硼(BN)、碳奈米管、金剛石、黏土、鋁矽酸鹽及諸如此類以及其任兩者或更多者之混合物。在一些實施例中,微粒填充劑係二氧化矽。 通常,本發明調配物中所採用之填充劑具有在約0.005 µm (亦即5 nm)至最高約20 µm範圍內之粒徑。在某些實施例中,本文所用之填充劑具有在約0.1 µm至最高約5 µm範圍內之粒徑。 本發明組合物包括在約30-75 wt %範圍內之該微粒填充劑。在一些實施例中,本發明組合物包括在約40-60 wt %範圍內之該微粒填充劑。 本發明組合物可視情況進一步包括在約0.2 - 2 wt %範圍內之自由基聚合起始劑。在某些實施例中,本發明組合物可進一步包括在約0.2-1 wt %範圍內之自由基聚合起始劑。 實例性自由基起始劑包含過氧酯、過氧碳酸酯、氫過氧化物、烷基過氧化物、芳基過氧化物、偶氮化合物及諸如此類。 本發明組合物視情況進一步包括一或多種流動添加劑、黏著促進劑、流變改質劑、熔劑、膜增韌劑、環氧樹脂固化觸媒(例如咪唑)、固化劑(例如自由基起始劑,例如過氧化二異丙苯)、自由基聚合調控劑(例如8-羥基喹啉)及/或基團穩定劑以及其任兩者或更多者之混合物。 如本文中所使用,術語「流動添加劑」係指改變引入其之調配物之黏度之化合物。賦予該等性質之實例性化合物包含矽聚合物、丙烯酸乙酯/丙烯酸2-乙基己基酯共聚物、酮肟磷酸酯之烷醇銨鹽及諸如此類以及其任兩者或更多者之組合。 如本文中所使用,術語「黏著促進劑」係指增強引入其之調配物之黏著性質之化合物。 如本文中所使用,術語「流變改質劑」係指改變引入其之調配物之一或多種物理性質之添加劑。 如本文中所使用,術語「熔劑」係指防止在熔融金屬表面上形成氧化物之還原劑。通常,熔劑: -與金屬表面上之氧化物發生反應,從而促進熔融金屬之潤濕,且 -藉由塗覆熱表面而用作氧障壁,從而預防其氧化。 實例性熔劑包含羧酸、醇、多元醇、羥基酸、羥基鹼及諸如此類。 實例性羧酸包含松香膠、十二烷二酸(可以Corfree M2購自Aldrich)、己二酸、癸二酸、聚癸二酸聚酐、馬來酸、酒石酸、檸檬酸及諸如此類。熔劑亦可包含醇、羥基酸及羥基鹼。實例性熔料包含多元醇(例如乙二醇、甘油、3-[雙縮水甘油基氧基甲基)甲氧基]-1,2-丙二醇、D-核糖、D-纖維二糖、纖維素、3-環己烯-1,1-二甲醇及諸如此類。 在一些實施例中,涵蓋用於本文中之熔劑係多元醇。 在一些實施例中,涵蓋用於本文中之熔劑係羥基喹啉或羥基喹啉衍生物。通常,本發明調配物具有足夠酸性以充分實施為熔劑,但酸性不足以引起過早膠凝或腐蝕。組合物亦顯示高於不含羥基喹啉或羥基喹啉衍生物之類似組合物之Tg值。 如本文中所使用,術語「自由基穩定劑」係指諸如以下等化合物:氫醌、苯醌、受阻酚、受阻胺(例如基於硫代羰基硫之化合物)、
基於苯并三唑之紫外吸收劑、基於三嗪之紫外吸收劑、基於二苯基酮之紫外吸收劑、基於苯甲酸酯之紫外吸收劑、基於受阻胺之紫外吸收劑、基於硝氧化基團之化合物及諸如此類以及其任兩者或更多者之組合。 在自由基穩定劑存在時,本發明組合物包括在約0.1 - 1 wt %範圍內之該自由基穩定劑。在一些實施例中,本發明組合物包括在約0.1-0.6 wt %範圍內之該自由基穩定劑。 本發明組合物亦可視情況含有一或多種稀釋劑。在稀釋劑存在時,本發明組合物包括相對於總組合物在約10 - 50 wt %範圍內之稀釋劑。在某些實施例中,本發明組合物包括在約20-40 wt %範圍內之稀釋劑。 在稀釋劑存在時,涵蓋用於本文中之實例性稀釋劑包含芳香族烴(例如苯、甲苯、二甲苯及諸如此類)、飽和烴(例如己烷、環己烷、庚烷、十四烷)、氯化烴(例如二氯甲烷、氯仿、四氯化碳、二氯乙烷、三氯乙烯及諸如此類)、醚(例如二乙醚、四氫呋喃、二噁烷、二醇醚、乙二醇之單烷基醚或二烷基醚及諸如此類)、多元醇(例如聚乙二醇、丙二醇、聚丙二醇及諸如此類)、酯(例如乙酸乙酯、乙酸丁酯、乙酸甲氧基丙基酯及諸如此類);二元酯、α-萜品醇、β-萜品醇、煤油、鄰苯二甲酸二丁酯、丁基卡必醇、丁基卡必醇乙酸酯、卡必醇乙酸酯、乙基卡必醇乙酸酯、己二醇、高沸點醇及其酯、二醇醚、酮(例如丙酮、甲基乙基酮及諸如此類)、醯胺(例如二甲基甲醯胺、二甲基乙醯胺及諸如此類)、雜芳香族化合物(例如N-甲基吡咯啶酮及諸如此類)及諸如此類以及其任兩者或更多者之混合物。 涵蓋用於本文中之含羥基稀釋劑包含水及具有C1
至最高約C10
主鏈之含羥基化合物。實例性含羥基稀釋劑包含水、甲醇、乙醇、丙醇、乙二醇、丙二醇、甘油、萜品醇及諸如此類以及其任兩者或更多者之混合物。 涵蓋用於本發明中之含羥基稀釋劑之量可廣泛變化且通常在組合物之約5重量%至多約80重量%範圍內。在某些實施例中,含羥基稀釋劑之量在總組合物之約10重量%至最高60重量%範圍內。在一些實施例中,含羥基稀釋劑之量在總組合物之約20重量%至最高約50重量%範圍內。 視情況,本文所闡述之組合物可包含流動添加劑及諸如此類。所涵蓋視情況用於本文中之流動添加劑包含矽聚合物、丙烯酸乙酯/丙烯酸2-乙基己基酯共聚物、酮肟磷酸酯之烷醇銨鹽及諸如此類以及其任兩者或更多者之組合。 本發明組合物通常包括: 至少15 wt %之該環氧樹脂, 至少1 wt %之該馬來醯亞胺、納地醯亞胺或衣康醯亞胺, 至少5 wt %之該韌化劑,及 至少40 wt %之該填充劑。 在一些實施例中,本發明組合物可進一步包括: 至少1 wt %之熔劑,及/或 至少0.2 wt %之黏著促進劑。 在一些實施例中,本發明組合物包括: 在約5 wt %至最高40 wt %範圍內之該環氧樹脂, 在約1 wt %至最高25 wt %範圍內之該馬來醯亞胺、納地醯亞胺或衣康醯亞胺, 在約5 wt %至最高25 wt %範圍內之該韌化劑,及 在約10 wt %至最高80 wt %範圍內之該填充劑。 該等組合物可進一步包括: 至少1 wt %至最高約10 wt %之熔劑,及/或 至少0.1 wt %至最高約2 wt %之黏著促進劑。 根據本發明之另一實施例,提供包括本發明之固化組合物之反應產物之底部填充膜。 本發明之底部填充膜在85%相對濕度下暴露於85℃下約2天時通常吸收小於2重量%之水分;在一些實施例中,本發明之底部填充膜在85%相對濕度下暴露於85℃下約2天時通常吸收小於1.5重量%之水分;在一些實施例中,本發明之底部填充膜在85%相對濕度下暴露於85℃下約2天時通常吸收小於1.2重量%之水分;在一些實施例中,本發明之底部填充膜在85%相對濕度下暴露於85℃下約2天時通常吸收小於1.0重量%之水分。 本發明之底部填充膜在為B階時在固化之後具有大於約80℃之Tg,如藉由熱機械分析(TMA)所測定。 本發明之底部填充膜可另外表徵為在260℃下具有至少5 kg/cm2
之晶粒剪切力,如使用SiN晶粒/PI晶粒/SiO2
(大小:3.81 × 3.81 × 700 mm3
)所測試,其中將晶粒以120℃/1kg力/5秒附接於BT基板上,然後藉由使溫度經30分鐘自室溫斜升至175℃,然後在175℃下保持5hr來進行固化。 根據本發明之另一實施例,提供製備底部填充膜之方法,該等方法包括在將如本文所闡述之組合物施加至適宜基板之後將其固化。 根據本發明之又一實施例,提供包括如本文所闡述底部填充膜之物件,該底部填充膜黏著至其適宜基板。 涵蓋用於本文中之適宜基板包含聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚乙烯、聚丙烯、聚碳酸酯、環氧樹脂、聚醯亞胺、聚醯胺、聚酯、玻璃、具有氮化矽鈍化之Si晶粒、具有聚醯亞胺鈍化之Si晶粒、BT基板、裸Si、SR4基板、SR5基板及諸如此類。 該底部填充膜至本發明物件中之該基板之黏著力通常為至少5 kg/cm2
,如使用SiN晶粒/PI晶粒/SiO2
(大小:3.81 × 3.81 × 700 mm3
)所測試,其中將晶粒以120℃/1kg力/5秒附接於BT基板上,然後藉由使溫度經30分鐘自室溫斜升至175℃,然後在175℃下保持5hr來進行固化。 可採用本發明材料製備各種物件,包含(例如)倒裝晶片封裝、堆疊晶粒、混合記憶體立方體、TSV裝置及諸如此類。 藉由下列非限制性實例闡釋本發明之各個態樣。該等實例係用於闡釋性目的且不限制本發明之任一實踐。應理解,可作出各種變化及修改,此並不背離本發明之精神及範圍。熟習此項技術者易於知曉如何合成或以商業方式獲得本文所闡述之試劑及組份。 實例 製備如表1中所匯總之本發明之若干調配物。 表1
對上述調配物中之每一者實施性能測試,其結果陳述於表2中。 表2
表2中之差示掃描量熱法(DCS)數據展示,所有調配物皆具有快速固化性質,其中「DSC起始溫度」與「DSC峰溫」之間之ΔT小於20℃;在一些實施例中,ΔT小於15℃;且在一些實施例中,ΔT小於10℃。 上述結果顯示,使用獨特混合樹脂系統(例如本文所闡述之樹脂系統),可達成快速固化型底部填充膜材料。 除本文中展示且闡述之修改外,熟習此項技術者根據上述闡述可瞭解本發明之各種修改。該等修改亦意欲屬隨附申請專利範圍之範圍內。 說明書中提及之專利及公開案指示熟習本發明所屬領域技術者之水平。該等專利及公開案係以引用方式併入本文中,其併入程度如同將每一個別申請案或公開案明確地且個別地以引用方式併入本文中一般。 上述闡述闡釋本發明之特定實施例,但不意欲限制本發明之實踐。下列申請專利範圍(包含其所有等效形式)意欲界定本發明範圍。
圖1呈現用於施加採用本發明調配物之晶圓級底部填充物(WAUF)之實例性步驟之流程圖。 圖2呈現2號實例性調配物之DSC繪圖。
Claims (33)
- 一種組合物,其包括: (i)馬來醯亞胺、納地醯亞胺或衣康醯亞胺; (ii)環氧樹脂; (iii)韌化劑;及 (iv)填充劑; 然而,條件係該組合物實質上不含丙烯酸酯樹脂; 其中: 該馬來醯亞胺、納地醯亞胺或衣康醯亞胺係單體或寡聚且可發生自由基固化以形成聚合網絡; 該環氧樹脂係可固化成三維聚合物網絡之熱固性樹脂; 該韌化劑減小該組合物之材料脆性且增加其抗衝擊性;且 該填充劑調節該所得組合物之熱膨脹係數(CTE);且 其中該組合物在固化時具有: 100℃至205℃之差示掃描量熱(DSC)起始溫度; 在200泊至40,000泊範圍內之熔體黏度,及 130℃至180℃之膠凝溫度,如藉由Ares流變儀在10 Rad頻率下以10℃/min升降溫速率使用1英吋直徑及1 mm厚試樣所量測。
- 如請求項1之組合物,其中該環氧樹脂包括上面具有一或多個環氧化物基團之聚合主鏈。
- 如請求項2之組合物,其中該環氧樹脂係選自雙酚A環氧樹脂、雙酚F環氧樹脂、萘環氧樹脂、酚醛清漆環氧樹脂、矽氧烷改質環氧樹脂、環脂族環氧樹脂、聯苯環氧樹脂、DCPD環氧樹脂或改質環氧樹脂以及其任兩者或更多者之組合。
- 如請求項3之組合物,其中該矽氧烷改質環氧樹脂具有以下結構: -(O-Si(Me)2 -O-Si(Me)(Z)-O-Si(Me)2 -O-Si(Me)2 )n - 其中: Z係-O-(CH2 )3 -O-Ph-CH2 -Ph-O-(CH2 -CH(OH)-CH2 -O-Ph-CH2 -Ph-O-)n -CH2 -環氧乙烷,且 n在約1至4範圍內。
- 如請求項4之組合物,其中藉由使下列組份之組合在適於促進其反應之條件下進行接觸來產生該矽氧烷改質環氧樹脂:其中「n」在約1至4範圍內。
- 如請求項1之組合物,其中該韌化劑係表氯醇及雙酚A之中等分子量至高分子量熱塑性聚合物。
- 如請求項6之組合物,其中該韌化劑係具有聚羥基醚結構且具有末端羥基以及沿其主鏈之重複羥基之苯氧基樹脂。
- 如請求項7之組合物,其中該苯氧基樹脂具有以下結構:其中n在約50至最高約150範圍內。
- 如請求項1之組合物,其中該馬來醯亞胺、納地醯亞胺或衣康醯亞胺分別具有以下結構:其中: m為1至15, p為0至15, 每一R2 獨立地選自氫或低碳烷基(例如C1-5 ),且 J係包括有機或有機矽氧烷基團之單價或多價基團,及 其兩者或更多者之組合。
- 如請求項9之組合物,其中J係選自以下之單價或多價基團: 通常具有在約6個至最多約500個範圍內之碳原子之烴基或經取代烴基物質,其中該等烴基物質係選自烷基、烯基、炔基、環烷基、環烯基、芳基、烷基芳基、芳基烷基、芳基烯基、烯基芳基、芳基炔基或炔基芳基,然而,條件係僅在J包括兩種或更多種不同物質之組合時J方可為芳基; 通常具有在約6個至最多約500個範圍內之碳原子之伸烴基或經取代伸烴基物質,其中該等伸烴基物質係選自伸烷基、伸烯基、伸炔基、伸環烷基、伸環烯基、伸芳基、烷基伸芳基、芳基伸烷基、芳基伸烯基、烯基伸芳基、芳基伸炔基或炔基伸芳基, 通常具有在約6個至最多約500個範圍內之碳原子之雜環或經取代雜環物質, 聚矽氧烷,或 聚矽氧烷-聚胺基甲酸酯嵌段共聚物,以及 上述基團中之一或多者與選自以下之連接體之組合:共價鍵、-O-、-S-、-NR-、-NR-C(O)-、-NR-C(O)-O-、-NR-C(O)-NR-、-S-C(O)-、-S-C(O)-O-、-S-C(O)-NR-、-O-S(O)2 -、-O-S(O)2 -O-、-O-S(O)2 -NR-、-O-S(O)-、-O-S(O)-O-、-O-S(O)-NR-、-O-NR-C(O)-、-O-NR-C(O)-O-、-O-NR-C(O)-NR-、-NR-O-C(O)-、-NR-O-C(O)-O-、-NR-O-C(O)-NR-、-O-NR-C(S)-、-O-NR-C(S)-O-、-O-NR-C(S)-NR-、-NR-O-C(S)-、-NR-O-C(S)-O-、-NR-O-C(S)-NR-、-O-C(S)-、-O-C(S)-O-、-O-C(S)-NR-、-NR-C(S)-、-NR-C(S)-O-、-NR-C(S)-NR-、-S-S(O)2 -、-S-S(O)2- O-、-S-S(O)2 -NR-、-NR-O-S(O)-、-NR-O-S(O)-O-、-NR-O-S(O)-NR-、-NR-O-S(O)2 -、-NR-O-S(O)2 -O-、-NR-O-S(O)2 -NR-、-O-NR-S(O)-、-O-NR-S(O)-O-、-O-NR-S(O)-NR-、-O-NR-S(O)2 -O-、-O-NR-S(O)2 -NR-、-O-NR-S(O)2 -、-O-P(O)R2 -、-S-P(O)R2 -或-NR-P(O)R2 -;其中每一R獨立地係氫、烷基或經取代烷基。
- 如請求項9之組合物,其中J係氧基烷基、硫代烷基、胺基烷基、羧基烷基、氧基烯基、硫代烯基、胺基烯基、羧基烯基、氧基炔基、硫代炔基、胺基炔基、羧基炔基、氧基環烷基、硫代環烷基、胺基環烷基、羧基環烷基、氧基環烯基、硫代環烯基、胺基環烯基、羧基環烯基、雜環、氧基雜環、硫代雜環、胺基雜環、羧基雜環、氧基芳基、硫代芳基、胺基芳基、羧基芳基、雜芳基、氧基雜芳基、硫代雜芳基、胺基雜芳基、羧基雜芳基、氧基烷基芳基、硫代烷基芳基、胺基烷基芳基、羧基烷基芳基、氧基芳基烷基、硫代芳基烷基、胺基芳基烷基、羧基芳基烷基、氧基芳基烯基、硫代芳基烯基、胺基芳基烯基、羧基芳基烯基、氧基烯基芳基、硫代烯基芳基、胺基烯基芳基、羧基烯基芳基、氧基芳基炔基、硫代芳基炔基、胺基芳基炔基、羧基芳基炔基、氧基炔基芳基、硫代炔基芳基、胺基炔基芳基或羧基炔基芳基、氧基伸烷基、硫代伸烷基、胺基伸烷基、羧基伸烷基、氧基伸烯基、硫代伸烯基、胺基伸烯基、羧基伸烯基、氧基伸炔基、硫代伸炔基、胺基伸炔基、羧基伸炔基、氧基伸環烷基、硫代伸環烷基、胺基伸環烷基、羧基伸環烷基、氧基伸環烯基、硫代伸環烯基、胺基伸環烯基、羧基伸環烯基、氧基伸芳基、硫代伸芳基、胺基伸芳基、羧基伸芳基、氧基烷基伸芳基、硫代烷基伸芳基、胺基烷基伸芳基、羧基烷基伸芳基、氧基芳基伸烷基、硫代芳基伸烷基、胺基芳基伸烷基、羧基芳基伸烷基、氧基芳基伸烯基、硫代芳基伸烯基、胺基芳基伸烯基、羧基芳基伸烯基、氧基烯基伸芳基、硫代烯基伸芳基、胺基烯基伸芳基、羧基烯基伸芳基、氧基芳基伸炔基、硫代芳基伸炔基、胺基芳基伸炔基、羧基 芳基伸炔基、氧基炔基伸芳基、硫代炔基伸芳基、胺基炔基伸芳基、羧基炔基伸芳基、雜伸芳基、氧基雜伸芳基、硫代雜伸芳基、胺基雜伸芳基、羧基雜伸芳基、含雜原子二價或多價環狀部分、含氧基雜原子二價或多價環狀部分、含硫代雜原子二價或多價環狀部分、含胺基雜原子二價或多價環狀部分或含羧基雜原子二價或多價環狀部分。
- 如請求項1之組合物,其進一步包括一或多種流動添加劑、黏著促進劑、流變改質劑、熔劑、膜增韌劑、環氧固化觸媒、固化劑及/或自由基聚合調控劑以及其任兩者或更多者之混合物。
- 如請求項12之組合物,其中該熔劑: 與金屬表面上之氧化物發生反應,從而促進熔融金屬之潤濕,且 藉由塗覆熱表面而用作氧障壁,從而預防其氧化。
- 如請求項12之組合物,其中該熔劑係羧酸、醇、多元醇、羥基酸或羥基鹼。
- 如請求項14之組合物,其中該羧酸係松香膠、十二烷二酸、己二酸、癸二酸、聚癸二酸聚酐、馬來酸、酒石酸或檸檬酸。
- 如請求項12之組合物,其中該熔劑係多元醇。
- 如請求項12之組合物,其中該熔劑係羥基喹啉或羥基喹啉衍生物。
- 如請求項12之組合物,其中該黏著促進劑增加該組合物對基板表面之黏著。
- 如請求項1之組合物,其進一步包括有機稀釋劑。
- 如請求項1之組合物,其進一步包括氰酸酯樹脂、苯并噁嗪、芳香族酯、芳香族烯烴、芳香族炔烴、芳香族腈或其任兩者或更多者之組合。
- 如請求項1之組合物,其中該組合物包括: 至少15 wt %之該環氧樹脂, 至少5 wt %之該韌化劑, 至少1 wt %之該馬來醯亞胺、納地醯亞胺或衣康醯亞胺,及 至少40 wt %之該填充劑。
- 如請求項21之組合物,其進一步包括以下中之一或多者: 至少1 wt %之熔劑,及/或 至少0.1 wt %之黏著促進劑。
- 如請求項1之組合物,其中該組合物包括: 在約5 wt %至最高40 wt %範圍內之該環氧樹脂, 在約5 wt %至最高25 wt %範圍內之該韌化劑, 在約1 wt %至最高25 wt %範圍內之該馬來醯亞胺、納地醯亞胺或衣康醯亞胺,及 在約10 wt %至最高80 wt %範圍內之該填充劑。
- 如請求項23之組合物,其進一步包括以下中之一或多者: 至少1 wt %之熔劑,及/或 至少0.1 wt %之黏著促進劑。
- 一種底部填充膜,其包括如請求項1之組合物之固化反應產物。
- 如請求項25之底部填充膜,其中該膜在85%相對濕度下暴露於85℃下約2天時吸收小於2重量%之水分。
- 如請求項25之底部填充膜,其中該膜係B階膜,其在固化之後具有大於約80℃之Tg,如藉由熱機械分析(TMA)所測定。
- 如請求項25之底部填充膜,其中該膜在260℃下之晶粒剪切力為至少5 kg/cm2 ,如使用SiN晶粒/PI晶粒/SiO2 (大小:3.81 × 3.81 × 700 mm3 )所測試,其中將該晶粒以120℃/1kg力/5秒附接於BT基板上,然後藉由使溫度經30分鐘自室溫斜升至175℃,然後在175℃下保持5hr來進行固化。
- 一種製備底部填充膜之方法,該方法包括在將如請求項1之組合物施加至適宜基板後將其固化。
- 一種物件,其包括如請求項25之底部填充膜,該底部填充膜黏著至其適宜基板。
- 如請求項30之物件,其中該適宜基板係聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚乙烯、聚丙烯、聚碳酸酯、環氧樹脂、聚醯亞胺、聚醯胺、聚酯、玻璃、具有氮化矽鈍化之Si晶粒、具有聚醯亞胺鈍化之Si晶粒、BT基板、裸Si、SR4基板或SR5基板。
- 如請求項30之物件,其中該物件係倒裝晶片封裝、堆疊晶粒、混合記憶體立方體或TSV裝置。
- 如請求項30之物件,其中該底部填充膜對該基板之黏著力為至少5 kg/cm2 ,如使用SiN晶粒/PI晶粒/SiO2 (大小:3.81 × 3.81 × 700 mm3 )所測試,其中將該晶粒以120℃/1kg力/5秒附接於BT基板上,然後藉由使溫度經30分鐘自室溫斜升至175℃,然後在175℃下保持5hr來進行固化。
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2016
- 2016-11-09 WO PCT/US2016/061098 patent/WO2017087228A1/en active Application Filing
- 2016-11-09 CN CN201680077238.1A patent/CN108495893A/zh active Pending
- 2016-11-09 JP JP2018544765A patent/JP6942718B2/ja active Active
- 2016-11-09 KR KR1020187015505A patent/KR20180083873A/ko not_active Application Discontinuation
- 2016-11-09 EP EP16866868.9A patent/EP3377578A4/en not_active Withdrawn
- 2016-11-16 TW TW105137361A patent/TWI732798B/zh active
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2018
- 2018-05-17 US US15/982,568 patent/US10927249B2/en active Active
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US20180319973A1 (en) | 2018-11-08 |
JP6942718B2 (ja) | 2021-09-29 |
TWI732798B (zh) | 2021-07-11 |
EP3377578A4 (en) | 2019-05-08 |
JP2018536757A (ja) | 2018-12-13 |
WO2017087228A1 (en) | 2017-05-26 |
KR20180083873A (ko) | 2018-07-23 |
US10927249B2 (en) | 2021-02-23 |
EP3377578A1 (en) | 2018-09-26 |
CN108495893A (zh) | 2018-09-04 |
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