TW201721525A - 行動電子機器 - Google Patents
行動電子機器 Download PDFInfo
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- TW201721525A TW201721525A TW106103677A TW106103677A TW201721525A TW 201721525 A TW201721525 A TW 201721525A TW 106103677 A TW106103677 A TW 106103677A TW 106103677 A TW106103677 A TW 106103677A TW 201721525 A TW201721525 A TW 201721525A
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Abstract
本發明的目的在於提供能夠以卡片進行結帳並且具有精巧大小的平板型的行動電子機器。本發明的平板型的行動電子機器1係具備:板狀的殼體2,係具有正面21;觸控面板.顯示部3,係設置在殼體2的正面21;及讀取部4、5、6,係進行與結帳關聯的卡片C2的讀取處理。讀取部4、5、6係與殼體2構成為一體。
Description
本發明係有關具有卡片結帳功能的平板(tablet)型的行動電子機器。
平板型的行動電子機器正逐漸普及(參照例如下述之專利文獻1)。另一方面,專門用於進行包括IC卡和磁卡在內的各種卡片(信用卡、金融卡等)的結帳之結帳終端(參照例如下述之專利文獻2)亦廣為人知。
專利文獻1 日本國特開2012-215682號公報
專利文獻2 日本國特開2013-003810號公報
需要能夠以卡片進行結帳並且精巧(compact)的平板型的行動電子機器。
本發明的目的在於提供能夠以卡片進行結帳並且精巧的平板型的行動電子機器。
本發明的行動電子機器係平板型的行動電子機器,具備:板狀的殼體;觸控面板(touch panel)及顯示部,係設置在前述殼體的正面;讀取部,係進行與結帳關聯的卡片的讀取處理;前述讀取部係與前述殼體構成為一體。
此外,亦可構成為:前述讀取部係具備進行做為前述卡片的IC卡的讀取處理之IC讀取部及進行做為前述卡片的磁卡的讀取處理之磁讀取部;前述IC讀取部係具備從IC卡的IC晶片(chip)取得電子資訊的IC感測器(sensor)及為了將IC卡的IC晶片引導至前述IC感測器的位置而設置於前述殼體的IC用插入溝;前述磁讀取部係具備從磁卡的磁記錄部取得磁資訊的磁感測器及為了將磁卡的磁記錄部引導至前述磁感測器的位置而設置於前述殼體的磁用插入溝;前述IC用插入溝與前述磁用插入溝係有一部分重疊。
此外,亦可構成為:於IC卡插入前述IC用插入溝之插入方向,前述IC用插入溝的底部係設置在比前述磁用插入溝的底部更靠內的靠內區域,前述IC感測器係配置在前述靠內區域。
此外,亦可構成為:前述IC用插入溝係具備形狀與IC卡的壓紋(emboss)部對應的壓紋部用溝部。
此外,亦可構成為:前述IC讀取部係具備進行做為前述IC卡的接觸式IC卡的讀取處理之接觸式IC讀取部及進行做為前述IC卡的非接觸式IC卡的讀取處理之非接觸式IC讀取部。
此外,亦可構成為:從正面觀看前述行動電子機器,前述殼體及前述顯示部為大致矩形;前述接觸式IC讀取部及前述磁讀取部係配置在前述殼體的一方垂直側面之側,並且前述非接觸式IC讀取部係配置在前述殼體的另一方垂直側面之側。
依據本發明,能夠提供能夠以卡片進行結帳並且精巧的平板型的行動電子機器。
1‧‧‧行動電子機器
2‧‧‧殼體
3‧‧‧顯示部
4‧‧‧磁讀取部(讀取部)
5‧‧‧接觸式IC讀取部(讀取部)
6‧‧‧非接觸式IC讀取部(讀取部)
21‧‧‧正面
22‧‧‧背面
23‧‧‧上側面
24‧‧‧下側面
25‧‧‧右側面
26‧‧‧左側面
41‧‧‧磁感測器
42‧‧‧磁用插入溝
51‧‧‧接觸式IC感測器(IC感測器)
52‧‧‧IC用插入溝
61‧‧‧非接觸式IC感測器
421‧‧‧底部
521‧‧‧底部
522‧‧‧壓紋部用溝部
523‧‧‧主溝部
524‧‧‧重疊區域
525‧‧‧靠內區域
526‧‧‧入口緣部
C1‧‧‧磁卡
C2‧‧‧接觸式IC卡
C22‧‧‧壓紋部
C3‧‧‧非接觸式IC卡
D1‧‧‧厚度方向
D11‧‧‧前方向
D12‧‧‧背方向
D2‧‧‧垂直方向
D21‧‧‧上方向
D22‧‧‧下方向
D3‧‧‧水平方向
D31‧‧‧右方向
D32‧‧‧左方向、插入方向
第1圖係顯示本發明實施形態的行動電子機器1之立體圖。
第2圖係實施形態的行動電子機器1的正視圖。
第3圖係第2圖的局部放大圖。
第4圖係實施形態的行動電子機器1的右側局部視圖。
第5圖係顯示利用實施形態的行動電子機器1進行結帳時的卡片讀取態樣之立體圖,其中(A)顯示磁卡C1的讀取,(B)顯示接觸式IC卡C2的讀取,(C)顯示非接觸式IC卡C3的讀取。
第6圖係沿第2圖的A-A線的剖面圖。
第7圖係沿第2圖的B-B線的剖面圖。
以下,針對本發明實施形態的行動電子機器1,參照圖式進行說明。第1圖係顯示本發明實施形態的行動電子機器1之立體圖。第2圖係實施形態的行動電子機
器1的正視圖。第3圖係第2圖的局部放大圖。第4圖係實施形態的行動電子機器1的右側局部視圖。第5圖係顯示利用實施形態的行動電子機器1結帳時的卡片讀取態樣之立體圖,其中(A)顯示磁卡C1的讀取,(B)顯示接觸式IC卡C2的讀取,(C)顯示非接觸式IC卡C3的讀取。第6圖係沿第2圖的A-A線的剖面圖。第7圖係沿第2圖的B-B線的剖面圖。
如第1圖至第4圖所示,實施形態的行動電子機器1係具備:殼體2、觸控面板.顯示部3、磁讀取部4、接觸式IC讀取部5及非接觸式IC讀取部6。行動電子機器1係構成為平板型終端,可具備例如有線通信部、無線通信部、做為輸入裝置的按鈕(button)、揚聲器(speaker)、GPS(Global Positioning System;全球定位系統)部等一般性功能。
殼體2構成行動電子機器1外形的主要部分,具有扁平板狀的大致直方體形狀。殼體2係具備:橫長形且大致矩形的正面21及背面22、上側面23、下側面24、右側面25及左側面26。
另外,在本說明書中,「大致矩形」係包括整體而言可視為矩形的所有形狀,例如亦包括完整的矩形、帶圓弧角的矩形、邊有稍微彎曲的形狀等。
殼體2係具備:前蓋(front cover)210,主要構成正面21;框(frame)230,主要構成上側面23、下側面24、右側面25及左側面26;及背蓋(rear cover)220,主要構成背面22。
各圖中,殼體2的厚度方向、垂直方向、水平方向分別以厚度方向D1、垂直方向D2、水平方向D3稱之。此外,在厚度方向D1中,朝正面21的方向以前方向D11稱之,朝背面22的方向以背方向D12稱之。在垂直方向D2中,朝上側面23的方向以上方向D21稱之,朝下側面24的方向以下方向D22稱之。在水平方向D3中,朝右側面25的方向以右方向D31稱之,朝左側面26的方向以左方向D32稱之。
前蓋210係以玻璃和塑膠(plastic)之類的透光性材料構成。前蓋210係具備矩形且透明的顯示區域211及包圍顯示區域211四邊的不透明的框狀區域212。顯示區域211及框狀區域212係配置在同一平面上。
背蓋220係例如以鋁合金和鎂合金之類的金屬材料構成。
前蓋210與背蓋220係以兩者於殼體2的厚度方向D1具有間隔的方式平行配置。亦即,背蓋220係相對於前蓋210配置在殼體2厚度方向D1的另一側。
框230係設置在前蓋210與背蓋220之間。框230係例如以鋁合金和鎂合金之類的金屬材料或以高剛性樹脂構成。所謂的高剛性樹脂,係例如在樹脂中摻入玻璃纖維、碳纖維、其他強化纖維及滑石粉(talc)之類的添加劑而成的纖維強化樹脂。
框230係繞周方向連續地構成上側面23、下側面24、右側面25及左側面26。
觸控面板.顯示部3係設置在殼體2的正面21
。觸控面板.顯示部3係具備觸控面板與顯示部。觸控面板乃係具有接觸式輸入功能的壓電式或靜電式的觸控面板。觸控面板係藉由黏合等手段而固定在前蓋210的顯示區域211的背面側。從正面觀看殼體2,顯示部係具有顯示圖像及影像的大致矩形的顯示畫面。顯示畫面係配置在觸控面板的背面側。
如第5圖(A)所示,磁讀取部4係進行磁卡C1的讀取處理。如第5圖(B)所示,接觸式IC讀取部5係進行接觸式IC卡C2的讀取處理。如第5圖(C)所示,非接觸式IC讀取部6係進行非接觸式IC卡C3的讀取處理。
磁讀取部4、接觸式IC讀取部5及非接觸式IC讀取部6係與殼體2構成為一體。
如第1圖至第6圖所示,磁讀取部4係具備磁感測器41與磁用插入溝42。
磁感測器41亦稱為磁讀寫頭(head),係從磁卡C1的磁記錄部取得磁資訊。磁用插入溝42乃係為了將磁卡C1的磁記錄部引導至磁感測器41的位置而設置於殼體2。磁感測器41係以其檢測部對著磁用插入溝42內部之方式配置在殼體2的內側。
磁用插入溝42係朝垂直方向D2直線狀延伸,於上側面23及下側面24敞開。此外,磁用插入溝42還於右側面25敞開,以有底的方式朝左方向D32凹陷。磁用插入溝42的底部421係朝垂直方向D2直線狀延伸。磁用插入溝42的厚度(於殼體2厚度方向D1的厚度)僅比磁卡C1的厚度(壓印有持卡人姓名和卡片號碼的壓紋部C12以外
的區域的厚度)寬一些。
因此,如第5圖(A)所示,在將磁卡C1插入磁用插入溝42後,能夠在不讓磁卡C1鬆動的狀態下朝垂直方向D2滑移磁卡C1。另外,就算將磁卡C1插入達磁用插入溝42的底部421,磁卡C1的壓紋部C12也不會位於磁用插入溝42。
藉由令磁卡C1的一部分位於磁用插入溝42內部,再令磁卡C1朝垂直方向D2移動,使磁卡C1的磁記錄部的磁資訊由磁感測器41取得。
如第1圖至第7圖所示,接觸式IC讀取部5係具備接觸式IC感測器51與IC用插入溝52。
接觸式IC感測器51係與接觸式IC卡C2的IC晶片接觸而從IC晶片取得電子資訊。IC用插入溝52乃係為了將接觸式IC卡C2的IC晶片引導至接觸式IC感測器51的位置而設置於殼體2。
IC用插入溝52係於右側面25敞開,以有底的方式朝左方向D32凹陷。IC用插入溝52的底部521的位置係比磁用插入溝42的底部421的位置更朝左方向D32深入。換言之,於接觸式IC卡C2插入IC用插入溝52之插入方向(左方向D32),IC用插入溝52的深度係比磁用插入溝42深。
亦即,於接觸式IC卡C2插入IC用插入溝52之插入方向(左方向D32),IC用插入溝52的底部521係設置在比磁用插入溝42的底部421更靠內的靠內區域525。所謂的靠內區域525,指的是IC用插入溝52之中比磁用插入溝42
更靠內的區域。
接觸式IC感測器51係配置在靠內區域525。詳言之,接觸式IC感測器51係以其檢測部對著IC用插入溝52的靠內區域525的內部之方式配置在殼體2的內側。
如第7圖所示,從右側面觀看,IC用插入溝52係具備壓紋部用溝部522及主溝部523。壓紋部用溝部522係具有與接觸式IC卡C2的壓紋部C22對應之形狀。主溝部523係具有與接觸式IC卡C2的壓紋部C22以外的區域C21對應之形狀。
主溝部523的厚度(於殼體2厚度方向D1的厚度)係僅比接觸式IC卡C2的壓紋部C22以外的區域C21的厚度厚一些,並且僅比接觸式IC卡C2的壓紋部C22的厚度窄一些。此外,壓紋部用溝部522的厚度(於殼體2厚度方向D1的厚度)係僅比接觸式IC卡C2的壓紋部C22的厚度厚一些。
因此,只要令接觸式IC卡C2的壓紋部C22位於IC用插入溝52的壓紋部用溝部522,便能夠將接觸式IC卡C2插入IC用插入溝52。此外,能夠在不讓接觸式IC卡C2鬆動的狀態下朝左方向D32滑移接觸式IC卡C2。
接觸式IC卡C2係當插入達IC用插入溝52的靠內區域525,便會保持在該位置。藉此,使接觸式IC卡C2的IC晶片的電子資訊由接觸式IC感測器51取得。
如第3圖所示,從正面觀看,IC用插入溝52的靠內區域525入口兩側的入口緣部526係帶有圓弧(形成有R角)。藉此,在要令接觸式IC卡C2插入至IC用插入
溝52的靠內區域525時,容易將接觸式IC卡C2引導至靠內區域525。此外,在令磁卡C1滑移於磁用插入溝42時,就算磁卡C1差點要往IC用插入溝52的靠內區域525移動,磁卡C1也會抵碰到靠內區域525的入口緣部526(526A)。此時,由於入口緣部526(526A)帶有圓弧,因此磁卡C1不容易卡在入口緣部526(526A),磁卡C1的移動方向會被矯正成適當的方向。
另外,靠內區域525兩側的入口緣部526之中位在磁卡C1移動方向(下方向D22)上游側的入口緣部526B亦可不帶有圓弧而形成為稜角。
此外,磁用插入溝42與IC用插入溝52係有一部分重疊。詳言之,IC用插入溝52之中比磁用插入溝42底部421更朝向右方向D31的區域係磁用插入溝42與IC用插入溝52重疊的區域(亦稱為「重疊區域524」)。
如第2圖所示,非接觸式IC讀取部6係具備非接觸式IC感測器61。非接觸式IC感測器61係由天線(antenna)構成。非接觸式IC卡C3係具備IC晶片與天線。藉由在非接觸式IC感測器61的天線與非接觸式IC卡C3的天線之間送收資料,非接觸式IC讀取部6係從放置在殼體2正面21之側且非接觸式IC感測器61附近的非接觸式IC卡C3的IC晶片取得電子資訊。就非接觸式IC卡C3的例子而言,能夠舉出NFC(Near Field Communication;近場通訊)規格的卡片。
藉由令非接觸式IC卡C3靠近非接觸式IC讀取部6,使非接觸式IC卡C3的IC晶片的電子資訊由非接觸式IC感測
器61取得。
如上述,從正面觀看殼體2,磁讀取部4及接觸式IC讀取部5係配置在殼體2的一方垂直側面(右側面25)之側。此外,非接觸式IC讀取部6係配置在殼體2的另一方垂直側面(左側面26)之側。
依據實施形態的行動電子機器1,能夠達成例如下述效果。
實施形態的行動電子機器1係具備殼體2及設置在殼體2正面21的觸控面板.顯示部3,並且具備磁讀取部4、接觸式IC讀取部5及非接觸式IC讀取部6做為進行與結帳關聯的卡片的讀取處理之讀取部。磁讀取部4、接觸式IC讀取部5及非接觸式IC讀取部6係與殼體2構成為一體。因此,依據實施形態的行動電子機器1,能夠以卡片進行結帳,並且能夠提供精巧的平板型的行動電子機器1。
此外,相較於經由連接線(cable)外接有分離的讀取部(讀卡機(card reader))之構成,能夠避免被從連接線連接部分盗取卡片資料(skimming)。此外,藉由構成為一體,能夠使可攜性和操作性提升。
此外,IC讀取部5係具備從接觸式IC卡C2的IC晶片取得電子資訊的接觸式IC感測器51及為了將接觸式IC卡C2的IC晶片引導至接觸式IC感測器51的位置而設置於殼體2的IC用插入溝52。磁讀取部4係具備從磁卡C1的磁記錄部取得磁資訊的磁感測器41及為了將磁卡C1的磁記錄部引導至磁感測器41的位置而設置於殼體2的磁用插入溝42。IC用插入溝52與磁用插入溝42係有一部分
重疊。因此,能夠謀求IC用插入溝52的空間(space)及磁用插入溝42的空間的省空間化。
此外,於接觸式IC卡C2插入IC用插入溝52之插入方向D32,IC用插入溝52係設置在比磁用插入溝42更靠內的靠內區域525。此外,接觸式IC感測器51係設置在靠內區域525。因此,能夠將接觸式IC感測器51配置在不與磁用插入溝42重疊的位置,設計自由度高。
此外,IC用插入溝52係具備形狀與接觸式IC卡C2的壓紋部C22對應的壓紋部用溝部522。因此,在將接觸式IC卡C2插入IC用插入溝52時,能夠將壓紋部用溝部522活用做為插入導引部(guide)。
此外,從正面觀看行動電子機器1,接觸式IC讀取部5及磁讀取部4係配置在殼體2的一方垂直側面即右側面25之側。此外,非接觸式IC讀取部6係配置在殼體2的另一方垂直側面即左側面26之側。因此,例如相較於接觸式IC讀取部5、磁讀取部4及非接觸式IC讀取部6皆配置在右側面25之側的形態,更容易謀求垂直方向D2的精巧化。
以上針對本發明的較佳實施形態進行了說明,但本發明並不限於上述實施形態,當能夠以各種形態實施。
例如,在上述實施形態中係具備磁讀取部4、接觸式IC讀取部5及非接觸式IC讀取部6做為進行與結帳關聯的卡片的讀取處理之讀取部,但並不以此為限。行動電子機器係只要具備1個以上的讀取部即可。
在上述實施形態中,磁用插入溝42及IC用插入溝52係朝左方向D32凹陷,但並不以此為限。磁用插入溝42及IC用插入溝52亦可朝其他方向(例如右方向D31、厚度方向D1、垂直方向D2)凹陷。
接觸式IC讀取部5、磁讀取部4及非接觸式IC讀取部6亦可配置在同一側。
1‧‧‧行動電子機器
2‧‧‧殼體
4‧‧‧磁讀取部(讀取部)
5‧‧‧接觸式IC讀取部(讀取部)
21‧‧‧正面
22‧‧‧背面
24‧‧‧下側面
25‧‧‧右側面
42‧‧‧磁用插入溝
52‧‧‧IC用插入溝
220‧‧‧背蓋
230‧‧‧框
522‧‧‧壓紋部用溝部
523‧‧‧主溝部
524‧‧‧重疊區域
D1‧‧‧厚度方向
D11‧‧‧前方向
D2‧‧‧垂直方向
D21‧‧‧上方向
D22‧‧‧下方向
D3‧‧‧水平方向
Claims (5)
- 一種平板型的行動電子機器,具備:板狀的殼體;觸控面板及顯示部,係設置在前述殼體的正面;及讀取部,係與前述殼體構成為一體且進行與結帳關聯的卡片的讀取處理;其中,從前述行動電子機器的正面觀看,前述殼體為大致矩形,前述行動電子機器係具備進行作為前述卡片的接觸式IC卡的讀取處理之接觸式IC讀取部、進行作為前述卡片的磁卡的讀取處理之磁讀取部,前述接觸式IC讀取部係具備從接觸式IC卡的IC晶片取得電子資訊的接觸式IC感測器、及為了將前述接觸式IC卡的IC晶片引導至前述接觸式IC感測器的位置而設置於前述殼體的IC用插入溝,前述磁讀取部係具備從磁卡的磁記錄部取得磁資訊的磁感測器、及為了將磁卡的磁記錄部引導至前述磁感測器的位置而設置於前述殼體的磁用插入溝,前述接觸式IC讀取部及前述磁讀取部兩者係配置在沿前述殼體的短邊方向的一垂直側面之側,或者配置在沿前述殼體的長邊方向的一橫側面之側。
- 如請求項1之行動電子機器,其更具備進行作為前述卡片的非接觸式IC卡的讀取處理之非接觸式IC讀取部, 前述非接觸式IC讀取部,係可進行配置在前述殼體的正面之非接觸式IC卡的讀取。
- 如請求項1或2之行動電子機器,其中前述IC用插入溝及前述磁用插入溝,係於前述殼體的長度方向外側、前述殼體的短邊方向外側或者前述殼體的厚度方向外側敞開。
- 如請求項1或2之行動電子機器,其中前述IC用插入溝係具備形狀與IC卡的壓紋部對應的壓紋部用溝部。
- 如請求項3之行動電子機器,其中前述IC用插入溝係具備形狀與IC卡的壓紋部對應的壓紋部用溝部。
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2013
- 2013-07-31 JP JP2013158474A patent/JP5639236B1/ja not_active Expired - Fee Related
- 2013-11-08 KR KR1020157021100A patent/KR101586982B1/ko active Application Filing
- 2013-11-08 BR BR212016000904-0U patent/BR212016000904Y1/pt active IP Right Grant
- 2013-11-08 CN CN201380074444.3A patent/CN105190648A/zh active Pending
- 2013-11-08 RU RU2016141942A patent/RU2016141942A/ru not_active Application Discontinuation
- 2013-11-08 SG SG11201506204PA patent/SG11201506204PA/en unknown
- 2013-11-08 EP EP17167801.4A patent/EP3220313A3/en not_active Withdrawn
- 2013-11-08 RU RU2016141943A patent/RU2016141943A/ru not_active Application Discontinuation
- 2013-11-08 CA CA2916457A patent/CA2916457A1/en not_active Abandoned
- 2013-11-08 RU RU2016104989/08A patent/RU2604327C1/ru active
- 2013-11-08 EP EP13890788.6A patent/EP2919168B1/en not_active Not-in-force
- 2013-11-08 CA CA2896651A patent/CA2896651C/en active Active
- 2013-11-08 US US14/649,814 patent/US9323961B2/en not_active Expired - Fee Related
- 2013-11-08 MX MX2016001150A patent/MX2016001150A/es unknown
- 2013-11-08 WO PCT/JP2013/080355 patent/WO2015015661A1/ja active Application Filing
- 2013-11-08 KR KR1020167000300A patent/KR20160026971A/ko not_active Application Discontinuation
- 2013-11-08 AU AU2013395851A patent/AU2013395851B2/en active Active
- 2013-12-24 TW TW102147865A patent/TWI537836B/zh not_active IP Right Cessation
- 2013-12-24 TW TW106103677A patent/TW201721525A/zh unknown
- 2013-12-24 TW TW105113828A patent/TWI578238B/zh active
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2015
- 2015-10-27 SA SA515370339A patent/SA515370339B1/ar unknown
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2016
- 2016-01-06 HK HK16100088.5A patent/HK1212493A1/zh unknown
- 2016-01-11 AU AU2016200140A patent/AU2016200140A1/en not_active Abandoned
- 2016-01-11 ZA ZA2016/00181A patent/ZA201600181B/en unknown
- 2016-01-13 US US14/995,056 patent/US9569645B2/en active Active
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2017
- 2017-02-13 US US15/431,137 patent/US20170154196A1/en not_active Abandoned
- 2017-04-20 ZA ZA2017/02593A patent/ZA201702593B/en unknown
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