TW201714503A - Exposure data correction device, wiring pattern formation system, and method for manufacturing wiring substrate - Google Patents

Abstract

To minimize error in the exposure data correction amount and improve circuit width accuracy while reducing the effort involved in manually measuring lower base data. An exposure data correction device for: acquiring first upper base data based on data obtained from the upper base of a first actual pattern, which is obtained by circuit processing involving the use of exposure data based on design data; acquiring lower base data based on data obtained from the lower base of the first actual pattern; determining the correlation between the first upper base data and the lower base data; acquiring second upper base data based on data obtained from the upper base in a region including a different region of the first actual pattern or data obtained from the upper base of a second actual pattern different from the first actual pattern; determining a correction function on the basis of the correlation, the second upper base data, and design data for the actual pattern used to obtain the second upper base data; and correcting, on the basis of the correction function, the exposure data for the actual pattern used to obtain the second upper base data.

Description

Exposure data correction device, wiring pattern forming system, and method of manufacturing wiring substrate

The present invention relates to an exposure data correction device, a wiring pattern forming system, and a method of manufacturing a wiring board, and more particularly to an exposure data correction device, a wiring pattern forming system, and a wiring for manufacturing a wiring substrate used in an electronic device or the like. A method of manufacturing a substrate.

With the trend toward higher performance and miniaturization of electronic devices, it is desirable to increase the density of the wiring boards used in electronic devices by thinning the wiring patterns.

As a wiring pattern forming method for achieving such a high density by the thinning of the wiring pattern, a method has been devised which is a direct drawing type exposure apparatus (DI) and an optical inspection apparatus (AOI). In combination, the exposure device (DI) directly irradiates the exposure pattern to the photosensitive photoresist layer with laser light or UV-LED (ultraviolet light-emitting diode) light or the like, and the optical inspection device (AOI) utilizes reflection The physical pattern formed by etching or the like is read by light, and compared with the original material (design data), the above method is used to introduce the actual finished processed material into the optical appearance inspection device (AOI), and return it. The exposure apparatus (DI) is granted (Patent Documents 1 to 3).

(Prior Art Document) [Patent Document] Patent Document 1: Japanese Laid-Open Patent Publication No. 2005-116929. Patent Document 2: Japanese Laid-Open Patent Publication No. 2006-303229. Patent Document 3: Japanese Laid-Open Patent Publication No. 2007-033764.

(Problem to be Solved by the Invention) As shown in Fig. 17, the solid pattern has a convex shape having an upper bottom (top) and a lower bottom (bottom), and a finishing value such as a wiring pattern (hereinafter also referred to simply as The circuit width of the "pattern" is not the same between the top width 1702 and the bottom width 1704. For the high density of the wiring pattern, it is important to reduce the error between the design value and the bottom width. When an optical visual inspection device (AOI) is used, although the finishing value measurement can be performed relatively easily, the finishing value measured by the AOI is the top width, and the data of the bottom width cannot be obtained. Therefore, even if the measurement value of the AOI is fed back to the DI for correction of the exposure data, there is still a problem that an error occurs due to the difference between the top width and the bottom width.

Although a microscope can be used to measure the bottom width, a large amount of measurement time is required due to the need for manual operation. If the measurement is performed in such a manner as to reduce the measurement position in order to reduce the burden of measurement, there may be a problem that the correct feedback cannot be performed because sufficient samples cannot be obtained.

An object of the present invention is to provide an exposure data correction device, a wiring pattern forming system, and a method of manufacturing a wiring substrate, which can reduce labor consumption caused by manual measurement of bottom (bottom) data, and suppress error of exposure data correction amount , to improve the accuracy of the circuit width when forming a fine circuit.

(Means for Solving the Problem) The present invention has been made in view of the above problems, and has the following features. That is, the exposure data correcting apparatus according to an embodiment of the present invention performs the operation of acquiring the first upper base data based on the first solid pattern having the convex shape of the upper bottom and the lower bottom. The data obtained by the upper bottom in at least a part of the area, the first physical pattern is obtained by circuit processing, and the circuit processing uses exposure data based on design data for the target wiring pattern; and the bottom material is obtained. The bottom material is based on data obtained from a lower bottom in at least a portion of the first entity pattern; determining a correlation between the first upper base data and the lower base data; obtaining a second upper base data, the second upper The bottom material is based on data obtained from an upper base in an area, wherein the aforementioned one area contains an area different from at least a part of the area of the first physical pattern, or the second upper base data is based on the upper base from the second physical pattern The obtained data, wherein the second physical pattern is different from the first physical pattern; and based on design data for obtaining a physical pattern of the second upper material, The second upper base data and the foregoing correlation relationship are used to determine a correction function, which indicates a relationship between the two: causing a difference between the finishing value specified in the design data and the finishing value in the solid pattern. And a correction amount for suppressing the difference; and correcting the exposure data for obtaining the physical pattern of the second upper base data based on the correction function.

The present invention may also include the following feature: the first background data in the present invention includes correction amount data based on a difference between the following two finishing values: an upper base in at least a portion of the aforementioned first solid pattern a measured finishing value and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the bottom material includes a difference between the following two finishing values The correction amount data: a finishing value measured in a lower bottom portion in at least a part of the first solid pattern, and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value The second upper base data includes correction amount data based on the difference between the two finishing values, and one of the two finishing values is a finishing value measured in the upper base in one region. Wherein the one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is the first entity map corresponding to the previous finishing value The finishing value specified in the design data used; or the second upper data includes correction data based on the difference between the other two finishing values, one of the other two finishing values is a finishing value measured on the upper bottom of the second solid pattern different from the first solid pattern, and the other of the other two finishing values is the second corresponding to the previous finishing value The finishing value specified in the design data for the solid pattern; the operation for determining the correlation relationship includes the following operation: determining the first tentative correction function based on the correction amount data in the first upper base data; The correction amount data in the determination determines a second tentative correction function; and, based on the difference between the correction amount obtained from the first provisional correction function and the correction amount obtained from the second tentative correction function corresponding to the correction amount, Creating a correction amount difference function; and determining the operation of the correction function includes the following operations: design data based on the physical pattern for obtaining the second upper base data, and the foregoing 2 on the base material, the third tentative decision correction function; and, based on the difference function and the correction amount, the correction of the third provisional correction function to determine the correction function.

Furthermore, the present invention may be characterized in that the first background data includes a finishing value measured in at least a portion of the upper base of the first solid pattern; and the bottom material is included in the first a finishing value measured in at least a portion of the lower base of the solid pattern; the second upper base data includes correction amount data based on a difference between the two finishing values, one of the two finishing values a finishing value measured in a top of a region, wherein the one region contains a region different from at least a portion of the first solid pattern, and the other of the two finishing values is a finishing value specified in the design data for the first solid pattern corresponding to the previous finishing value; or the second background data includes a correction amount based on a difference between the other two finishing values One of the two finishing values is a finishing value measured on the upper bottom of the second solid pattern different from the first solid pattern, and the other of the two finishing values is a finishing value defined in the design data for the second solid pattern corresponding to the previous finishing value; and an operation for determining the correlation relationship includes an operation of determining a first finishing value function indicating the following Relationship between the factors resulting from the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the finishing value in the first upper base data; determining the second finishing value function , which indicates the relationship between the difference between the finishing value specified in the design data and the finishing value in the physical pattern, and the finishing value in the aforementioned bottom data; a finishing value difference function based on a difference between the first finishing value function and the second finishing value function; and determining an operation of the correction function includes the following operation: based on obtaining the second upper data The design data for the physical pattern and the second upper base data determine a tentative correction function; and correct the tentative correction function based on the difference value function of the finishing value To determine the correction function.

Further, the present invention may further include the following feature: the first upper base data includes correction amount data based on a difference between the following two finishing values: measured by an upper base in at least a portion of the first physical pattern a finishing value obtained by the finishing value and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; and the lower bottom data includes a correction based on a difference between the following two finishing values The amount of data: a finishing value measured in a lower bottom portion in at least a part of the first solid pattern, and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; The second upper base data includes correction amount data based on the difference between the two finishing values, one of the two finishing values being a finishing value measured in the upper base in one region, wherein The one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is the first solid pattern corresponding to the previous finishing value The finishing value specified in the design data; or the second upper data includes correction data based on the difference between the other two finishing values, one of the two finishing values is a finishing value measured by the upper bottom of the second solid pattern different in the first solid pattern, and the other of the two finishing values is the second solid pattern corresponding to the previous finishing value The finishing value specified in the design data; the action determining the correlation relationship includes the following actions: determining the correction amount correlation function of the following two correction amounts: the correction shown in the correction amount data in the first upper base data And a correction amount shown in the correction amount data in the bottom data corresponding to the correction amount; and determining the operation of the correction function includes the following actions: based on the entity used to obtain the second upper data The design data for the pattern and the second upper base data determine a tentative correction function; and, based on the correction amount correlation function, correct the tentative correction function to determine the correction Number.

Furthermore, the present invention may further include the feature that the first supernatant material includes a finishing value measured in at least a portion of the upper base of the first solid pattern; and the bottom material is included in the foregoing a finishing value measured in at least a portion of the lower base of the solid pattern; the second upper base data comprising a finishing value measured by the upper base in a region, wherein the aforementioned one region contains the foregoing a region in which at least a part of the solid pattern has a different region, or the second upper data includes a finishing value measured on an upper base of the second solid pattern different from the first solid pattern; and the correlation is determined The action includes the following actions: determining a finishing value correlation function of the following two finishing values: a finishing value measured in the first upper base data, and a finishing value measured in the aforementioned lower base data And determining the action of the aforementioned correction function includes the following actions: based on the refined value correlation function that has been determined, and based on the fine addition in the second upper base data The work value is used to calculate an estimated value of the finishing value in the bottom corresponding to the finishing value; and the correction function is determined based on the difference between the following two finishing values: used to obtain the second upper base data The finishing value specified in the design data for the solid pattern and the finishing value in the lower base corresponding to the above-described calculated finishing value.

The finishing value included in the first upper base data and the second upper base data may be a finishing value based on data obtained by using an optical appearance inspection device; and the lower bottom data may be based on using a microscope. The information obtained is the bottom information.

The correction function can be determined in units of respective regions of the same substrate surface on which the wiring patterns are arranged.

The correction function can be determined in units of the upper surface and the lower surface of the same substrate on which the wiring pattern is disposed.

The correction function described above can be determined for each of the vertical line and the horizontal line in the wiring pattern.

Further, the wiring pattern forming system of the present invention includes: an exposure data creating means for creating exposure data based on design data of a target wiring pattern; and pattern exposure means for being disposed on the substrate based on exposure data Exposing an exposure pattern on the photosensitive photoresist layer; developing a pattern forming means for developing the photosensitive photoresist layer exposing the exposure pattern to form a developing pattern; and a solid pattern forming means for forming the developing pattern The substrate is processed by a circuit to form a solid pattern; and the upper substrate is formed by means of a substrate for making an upper base material based on data obtained from an upper base in at least a portion of the solid pattern; Forming a bottom material based on data obtained from a lower bottom in at least a portion of the foregoing solid pattern; and the aforementioned exposure data correcting device based on the aforementioned upper base data, lower base data, and design Data to correct exposure data.

Moreover, the program for correcting exposure data in an embodiment of the present invention causes the computer to perform the following steps: obtaining the first upper base data based on the convex shape having the upper bottom and the lower bottom The material obtained by the upper bottom in at least a part of the first solid pattern, the first solid pattern is obtained by circuit processing, and the circuit processing uses exposure data based on design data for the target wiring pattern; The bottom data is based on data obtained from the bottom of at least a portion of the pattern of the first entity; determining the correlation between the first base material and the bottom material; obtaining the second base data The second background data is based on data obtained from an upper base in an area, wherein the one area contains an area different from at least a part of the first physical pattern, or the second upper base data is based on the second a material obtained by the upper base of the solid pattern, wherein the second solid pattern is different from the first solid pattern; and is based on a solid pattern for obtaining the second upper base data The design data, the aforementioned second base data, and the aforementioned correlation relationship are used to determine a correction function indicating a relationship between the following two values: the finishing value specified in the design data and the finishing value in the solid pattern. a factor of the difference value and a correction amount for suppressing the difference; and correcting the exposure data for obtaining the solid pattern of the second upper base data based on the correction function.

Moreover, a method for correcting exposure data in an embodiment of the present invention includes the steps of: obtaining a first upper base data based on a first convex shape having an upper bottom and a lower bottom; The material obtained by the upper bottom in at least a part of the solid pattern, the first physical pattern is obtained by circuit processing, and the circuit processing uses exposure data based on design data for the target wiring pattern; And the data obtained based on the bottom bottom in at least a part of the area of the first entity pattern; determining the correlation between the first upper base data and the bottom material; and obtaining the second upper base data, The second upper base data is based on data obtained from an upper base in an area, wherein the one area includes an area different from at least a part of the area of the first physical pattern, or the second upper base data is based on the second physical pattern The data obtained by the upper bottom, wherein the second physical pattern is different from the first physical pattern; and the design is based on a solid pattern for obtaining the second upper data. The second base material and the aforementioned correlation relationship are used to determine a correction function, which represents a relationship between the following two factors: the difference between the finishing value specified in the design data and the finishing value in the solid pattern. a factor of generating a value, and a correction amount for suppressing the difference; and correcting exposure data for obtaining the physical pattern of the second upper base data based on the correction function.

Further, a method of manufacturing a wiring board according to an embodiment of the present invention includes the steps of: obtaining a first upper base material based on a first solid pattern having a convex shape of an upper bottom and a lower bottom; The data obtained by the upper bottom in at least a part of the area, the first physical pattern is obtained by circuit processing, and the circuit processing uses exposure data based on design data for the target wiring pattern; and the bottom material is obtained. The bottom material is based on data obtained from a lower bottom in at least a portion of the first entity pattern; determining a correlation between the first upper base data and the lower base data; obtaining a second upper base data, the second upper The bottom material is based on data obtained from an upper base in an area, wherein the aforementioned one area contains an area different from at least a part of the area of the first physical pattern, or the second upper base data is based on the upper base from the second physical pattern The obtained data, wherein the second physical pattern is different from the first physical pattern; and the design capital for use in obtaining the physical pattern of the second upper base data The second upper base data and the foregoing correlation relationship are used to determine a correction function indicating a relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern. a factor of occurrence, and a correction amount for suppressing the difference; correcting exposure data for obtaining a physical pattern of the second upper base data based on the correction function; and forming a wiring pattern based on the exposure data .

Furthermore, the present invention may further include the feature that the first upper base data includes correction amount data based on a difference between two finishing values: measured in an upper base in at least a portion of the first physical pattern a finishing value obtained by the finishing value and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; and the lower bottom data includes a correction based on a difference between the following two finishing values The amount of data: a finishing value measured in a lower bottom portion in at least a part of the first solid pattern, and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; The second upper base data includes correction amount data based on the difference between the two finishing values, one of the two finishing values being a finishing value measured in the upper base in one region, wherein The one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is for the first solid pattern corresponding to the previous finishing value The finishing value specified in the data; or the second upper data includes correction data based on the difference between the other two finishing values, one of the two finishing values is in the foregoing a finishing value measured by the upper bottom of the second solid pattern different from the first solid pattern, and the other of the two finishing values is for the second solid pattern corresponding to the previous finishing value The finishing value specified in the design data; the step of determining the correlation relationship includes the following steps: determining the first tentative correction function based on the correction amount data in the first upper base data; based on the correction amount in the foregoing bottom data Data, determining a second tentative correction function; and generating a correction amount difference based on a difference between a correction amount obtained from the first provisional correction function and a correction amount obtained from the second provisional correction function corresponding to the correction amount And a step of determining the foregoing correction function, comprising the steps of: designing data for obtaining a physical pattern of the second upper base data and the second upper base data, 3 provisional correction function; and, based on the difference function and the correction amount, the correction of the third provisional correction function to determine the correction function.

The present invention may further include the feature that the first supernatant material includes a finishing value measured in at least a portion of an upper base of the first solid pattern; and the bottom material is included in the first solid pattern. a finishing value measured in at least a portion of the lower base; the second upper base data includes correction amount data based on a difference between the two finishing values, one of the two finishing values, Is a finishing value measured in the upper base in a region, wherein the aforementioned one region contains a region different from at least a portion of the first solid pattern, and the other of the two finishing values is a finishing value specified in the design data for the first solid pattern corresponding to the previous finishing value; or the second background data includes correction amount data based on the difference between the other two finishing values, the foregoing One of the two finishing values is a finishing value measured on the upper base of the second solid pattern different from the first solid pattern, and the other of the two finishing values is a finishing value defined in the design data for the second solid pattern corresponding to the previous finishing value; and a step of determining the correlation relationship, comprising the step of: determining a first finishing value function, which represents the following Relationship: a factor causing a difference between a finishing value specified in the design data and a finishing value in the solid pattern, and a finishing value in the first upper base data; determining a second finishing value function, Represents the relationship between the difference between the finishing value specified in the design data and the finishing value in the physical pattern, and the finishing value in the aforementioned bottom material; and, determining the finishing a value difference function based on the difference between the first finishing value function and the second finishing value function; and the step of determining the correction function includes the following steps: based on the entity used to obtain the second upper data The design data for the pattern and the second upper base data determine a tentative correction function; and, based on the difference value function of the finishing value, correct the tentative correction function to Determine the correction function.

The present invention may also include the following feature: the first upper base data includes correction amount data based on a difference between the following two finishing values: measured by the upper base in at least a part of the area of the first physical pattern a finishing value and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the bottom material includes a correction amount based on a difference between the following two finishing values a finishing value measured in a lower bottom in at least a part of the first solid pattern, and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the second The upper base data includes correction amount data based on a difference between the two finishing values, one of the two finishing values being a finishing value measured in the upper base in an area, wherein the aforementioned one The region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is a design for the first solid pattern corresponding to the previous finishing value The finishing value specified in the material; or the second upper base data includes correction amount data based on the difference between the other two finishing values, one of the two finishing values is in the foregoing a finishing value measured by the upper bottom of the second solid pattern having different physical patterns, and the other of the two finishing values is a design for the second solid pattern corresponding to the previous finishing value The finishing value specified in the data; the step of determining the correlation relationship includes the following steps: determining a correction amount correlation function of the following two correction amounts: the correction amount shown in the correction amount data in the first upper base data, And a correction amount shown in the correction amount data in the foregoing bottom data corresponding to the correction amount; and the step of determining the correction function includes the step of: based on the solid pattern for obtaining the second upper base data The design data and the second upper base data determine a tentative correction function; and, based on the correction amount correlation function, correct the tentative correction function to determine a correction function.

The present invention may further include the feature that the first supernatant material includes a finishing value measured in at least a portion of an upper base of the first solid pattern; and the bottom material is included in the first solid pattern. a finishing value measured in at least a portion of the lower base; the second upper base data comprising a finishing value measured by an upper base in an area, wherein the aforementioned one area contains the first solid pattern a region in which at least a part of the region is different, or the second background data includes a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern; and the step of determining the correlation is included The following steps: determining a finishing value correlation function of the following two finishing values: a finishing value measured in the aforementioned first background data, and a finishing value measured in the foregoing lower base data; The step of determining the aforementioned correction function comprises the steps of: calculating based on the refined value correlation function that has been determined, and based on the finishing value in the second upper data described above And an estimated value of the finishing value in the bottom corresponding to the finishing value; and determining a correction function based on a difference between the following two finishing values: used to obtain the physical pattern of the second upper base data The finishing value specified in the design data and the finishing value in the lower base corresponding to the calculated finishing value.

The finishing value included in the first upper base data and the second upper base data may be a finishing value based on data obtained by using an optical appearance inspection device; and the lower bottom data may be based on using a microscope. The information obtained is the bottom information.

The correction function can be determined in units of respective regions of the same substrate surface on which the wiring patterns are arranged.

The correction function can be determined in units of the upper surface and the lower surface of the same substrate on which the wiring pattern is arranged.

The correction function described above can be determined for each of the vertical line and the horizontal line in the wiring pattern.

A method of manufacturing a wiring substrate according to an embodiment of the present invention includes the steps of: producing exposure data based on design data of a target wiring pattern; and photosensitive photoresist disposed on the substrate based on exposure data Exposing an exposure pattern on the layer; developing the photosensitive photoresist layer exposing the exposure pattern to form a development pattern; performing circuit processing on the substrate on which the development pattern is formed to form a first solid pattern; a bottom material, which is based on data obtained from an upper base in at least a portion of the first physical pattern; and a bottom material based on at least a portion of the first physical pattern The information obtained at the bottom; determining the correlation between the first upper base data and the aforementioned lower base data; producing the second upper base data based on the information obtained from the upper base in a region, Wherein the foregoing one region contains a region different from at least a portion of the first solid pattern, or the second upper substrate is based on the second The data obtained by the upper layer of the volume pattern, wherein the second solid pattern is different from the first solid pattern; the design data for the physical pattern for obtaining the second upper base material, the second upper base material, and the foregoing Correlation, to determine a correction function, the correction function indicating a relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the suppression of the a correction amount of the difference; correcting exposure data for obtaining the physical pattern of the second upper base data based on the correction function; and forming a wiring pattern based on the corrected exposure data.

(Effect of the Invention) According to the present invention, it is possible to provide an exposure data correction device, a wiring pattern forming system, and a method of manufacturing a wiring substrate, which can reduce labor consumption caused by manual measurement of lower base data, and based on the upper base data ( The correlation between the AOI measurement data and the underlying data of the solid pattern suppresses the error value of the exposure data correction amount, and improves the circuit width accuracy when the micro circuit is formed.

[First Embodiment] Fig. 1 is a schematic view showing a wiring pattern forming system 100 according to an embodiment of the present invention. The wiring pattern forming system 100 includes a design data creation device 101, an exposure data creation device 102, an exposure device 104, a development pattern creation device 106, a physical pattern creation device 108, an upper and lower bottom data creation device 110, and exposure data correction. Device 112.

The design data creation device 101 is a device for creating design data, and CAD (Computer Aided Design) is used in the present embodiment. The design information (original material) of the wiring pattern is the result of data recording of the wiring pattern to be formed, and is expressed, for example, by coordinates and circuit width. It may also have information attached to the information required for exposure. In the present invention, any wiring pattern can be used.

The exposure data creation device 102 is a device for creating exposure data based on design data, and CAM (Computer Aided Manufacturing) is used here. The exposure device 104 is a device that exposes an exposure pattern to a photosensitive resist layer disposed on a substrate based on exposure data created by the exposure data creation device 102. For example, a direct drawing device (DI: Direct Imaging) capable of directly exposing an exposure pattern on a photosensitive photoresist layer using laser light or UV-LED light can be used. The exposure data is a material for sensitizing the photosensitive resist layer to an exposure pattern corresponding to the wiring pattern by an exposure device such as a linear drawing device using laser light or UV-LED light.

The photosensitive photoresist layer is an etched photoresist layer used when a metal foil such as a copper foil is etched by a lithography method to form a wiring pattern. The exposure pattern refers to a pattern that is exposed onto the photosensitive photoresist layer based on the exposure data, and corresponds to a development pattern formed in accordance with a subsequent development step. The developing pattern forming device 106 is a device that develops a photosensitive resist layer on which an exposure pattern has been exposed to form a developing pattern.

The solid pattern making device 108 is a device that performs circuit processing on a substrate on which a developing pattern has been formed to form a solid pattern. For example, an etching device can be used. The circuit processing means forming a solid pattern, and for example, a method of etching a metal foil according to a subtraction to form a wiring pattern. The solid pattern can be formed by a solid pattern forming means. The solid pattern refers to a wiring pattern which is actually formed by performing a circuit formation process, and examples thereof include a wiring pattern obtained by etching a metal foil by a subtractive method.

The upper and lower bottom data creating apparatuses 110 are apparatuses for producing data represented by the coordinates of the upper bottom (top) and the lower bottom (bottom) of the solid pattern and the circuit width or the gap width. In the present embodiment, the upper substrate is produced using an optical visual inspection device (AOI: Automatic Optical Inspection). The AOI can be used to detect light reflected from the upper bottom (top) of the solid pattern to quantify the pattern and to make the data represented by the coordinates of the coordinates and the width of the circuit or the width of the gap. Further, a metal microscope having a measuring function (sometimes referred to simply as a "microscope") can be used to produce the lower substrate. Here, the upper and lower bottom data producing apparatus 110 receives the input of the lower bottom finishing value measured using the microscope, and creates the lower base data based on the lower bottom finishing value.

The exposure data correcting means 112 obtains the first upper base data and the lower base data produced by the upper and lower bottom making means 110, and determines the correlation between the first upper base data and the lower base data. Further, the second upper base material produced by the upper and lower bottom making means 110 is obtained, and the second upper base data is based on data obtained from the upper base in an area, wherein the area contains the first solid pattern At least a portion of the region is different, or the second background data is based on data obtained from the upper base of the second physical pattern, wherein the second physical pattern is different from the first physical pattern. And, based on the physical pattern (the physical pattern is used to obtain the second upper data), the design data, the second upper data, and the determined correlation, the finishing values and entities specified in the design data. The difference between the finishing values in the pattern determines a correction function, and then the exposure data for the solid pattern is corrected based on the correction function, wherein the correction function indicates a factor that causes the difference to be generated and a correction amount used to suppress the difference The relationship between the two, and the physical pattern is used to obtain the second upper data.

The factor that causes the difference between the finishing value specified in the design data and the finishing value in the solid pattern refers to the design of the wiring pattern specification of the design data, which may be caused by the change of the factor. The difference between the finishing value specified in the data and the finishing value in the solid pattern changes. As such a factor, one of the following or a combination of any two or more of them: a pattern gap of a design material of a solid pattern, a pattern size, a pattern thickness, a pattern position, a pattern density, a pattern shape, and the like. In the present embodiment, as a factor causing a difference between the physical pattern material and the original material, a pattern gap (here, a line-to-line gap) of the wiring pattern is employed. The correction function is a function that defines a relationship between a factor causing the difference and a correction amount of the exposure data for suppressing the difference.

As the exposure data correction device 112, in the present embodiment, the computer 200 having the hardware configuration shown in Fig. 2 is used. The computer 200 includes a processing unit (processor) 201, a display unit 202, an input unit 203, a storage unit 204, a communication unit 205, and a bus bar 210 that connects these components. The display unit 202 displays an image output by a program executed in the computer 200. The input unit 203 is a component that receives input from a user, such as a keyboard or a mouse. The memory unit 204 can be any component as long as it is a non-volatile memory, a volatile memory, or a hard disk or the like that can store information. A program 206 for performing the steps for correcting the exposure data is stored in the storage unit 204. The communication unit 205 performs wireless communication or performs wired communication using an Ethernet (registered trademark) cable or a USB (Universal Serial Bus) cable. The upper base data and the lower base data produced by the upper and lower bottom making apparatuses 110 can also be obtained via the communication unit 205. Once the program 206 is executed, the processing unit (processor) 201 performs the steps for the exposure data correction. The exposure data correction device 112 does not necessarily need to be a general-purpose computer, but may be implemented by hardware for performing all or a part of the steps and software that operates in cooperation with the hardware.

The operational flow of the system in this embodiment is shown in Fig. 3. First, the design material creation device 101 creates design data for the first physical pattern (step 301), and the exposure data creation device 102 creates exposure data based on the design data (step 302). The exposure device 104 exposes the exposure pattern to the photosensitive photoresist layer disposed on the substrate based on the exposure data created by the exposure data creation device 102 (step 304). The developing pattern forming device 106 develops the photosensitive resist layer on which the exposure pattern has been exposed to form a developing pattern (step 306), and the solid pattern forming device 108 performs circuit processing on the substrate on which the developing pattern is formed to form the first 1 physical pattern (step 308). The upper and lower bottom data producing apparatus 110 creates the first upper base data and the lower base data (step 310). In the case where the second upper base material is created using the upper base of the first physical pattern, the second upper base material is also produced here. Further, it is also possible to use the entire data obtained from the first entity pattern as the second base material, and to use a part of the data as the first base material.

Next, it is determined whether or not the second solid pattern is to be created for the exposure data correction (step 312). For example, when the second upper material is obtained by using the upper bottom of the first solid pattern, it is not necessary to create the second physical pattern. If it is necessary to create the second physical pattern, the design returns to the design data creation step 301, the same steps are performed to form the second physical pattern, and in step 310, the upper base data of the second physical pattern is created. The bottom material of the second physical pattern will not be produced. When the top material of the second solid pattern is not to be created, or after the second solid pattern is created, the exposure data correction step 314 is performed, and the operation flow for the exposure data correction is ended. Thereafter, a wiring pattern is formed based on the corrected exposure data, for example, using the exposure device 104, the development pattern creation device 106, and the solid pattern creation device 108, thereby manufacturing a wiring substrate.

In Fig. 4, the exposure data correction step 314 is explained more specifically. First, the exposure data correcting means 112 obtains the first upper base data created by the upper and lower bottom data creating apparatus 100, wherein the first upper base data is based on the upper base in at least a part of the area from the first physical pattern. Obtaining the data (step 401), and then obtaining the bottom material, wherein the first bottom material is based on the data obtained from the lower bottom in at least a portion of the first entity pattern (step 402), and determines the first The relationship between the bottom material and the bottom material (step 404). Further, the exposure data correcting means 112 obtains the second upper base data created by the upper and lower base data producing apparatus 100, wherein the second upper base data is based on the data obtained from the upper base in an area, wherein The area includes a region different from at least a portion of the first solid pattern, or the second upper material is based on data obtained from an upper base of the second physical pattern, wherein the second physical pattern is different from the first physical pattern ( Step 406). Then, based on the design data for the physical pattern for obtaining the second upper base data, the second upper base data, and the correlation relationship produced in step 404, the finishing values and the physical patterns specified in the design data are The difference between the finishing values determines a correction function, wherein the correction function represents a relationship between a factor that causes the difference to be generated and a correction amount used to suppress the difference (step 408), and then corrects the entity based on the correction function The exposure data for the pattern, wherein the solid pattern is used to obtain the second upper data (step 410).

The correlation between the bottom material obtained from the bottom and the upper material obtained from the bottom is conceived depending on the pattern gap, the pattern size, the pattern thickness, the pattern position, the pattern density, the pattern shape, and the like. Therefore, after determining the correlation relationship, the same pattern gap or the like can be correctly estimated by applying the correlation to other upper data obtained from the AOI data without manual measurement and The finishing value of the new lower base corresponding to the other upper data. Further, by creating a correction function based on the estimated bottom data, it is possible to suppress the error of the exposure data correction amount and improve the circuit width accuracy at the time of forming the fine circuit.

The correction function is assumed to vary depending on the area on the substrate used to acquire the data. On the other hand, the correlation between the upper and lower data is assumed to be relatively invariant depending on the area on the substrate used to obtain the data. Therefore, for example, the measurement for the first upper base data and the lower base data for determining the correlation may be performed only in the restricted area of the first physical pattern, thereby determining the correlation with less labor consumption. In addition, the correlation relationship that has been determined is applied to the second base material acquired from the entire first physical pattern using the AOI, and the tendency of the entire substrate can be considered while reducing the labor consumption for the first physical pattern itself. A more correct correction function inside.

Since the correlation and the correction function sometimes change depending on the area on the substrate, the correlation and the correction function can be determined for each region of the same substrate surface on which the wiring pattern is arranged. The relationship between the design data and the finishing value, even on the same substrate, sometimes becomes a special relationship depending on the region. For example, since the etching liquid tends to accumulate in the vicinity of the center of the substrate, the etching rate tends to be slow, so that the pattern gap tends to be narrow, and the etching speed is high around the substrate, so that the pattern gap tends to be wide. Further, in the corners of the substrate, since the current concentrates there when the copper film is formed by electroplating, the copper film tends to become thick, and it is assumed that the correlation between the upper substrate and the lower substrate is different from that of the substrate. The area is different. Therefore, by following the present embodiment to determine the correlation and the correction function for each region of the same substrate surface, it is possible to perform a circuit formation process with higher accuracy.

Further, the correction function may be individually determined for the upper surface and the lower surface of the same substrate on which the wiring pattern is disposed. Like the area of the substrate surface, the correlation and correction function sometimes differ depending on the upper surface and the lower surface. For example, since the etching liquid is easily accumulated on the upper surface, the etching rate is slow, so that the pattern gap tends to be narrow, and in the lower surface, the etching speed is faster, so the pattern gap tends to become wider. Therefore, by following the present embodiment to determine the correlation and the correction function for the upper surface and the lower surface of the same substrate surface, it is possible to perform a circuit formation process with higher precision.

Further, the relationship between the design data and the finishing value in the wiring pattern may be different, and the correction function may be determined for each of the vertical line and the horizontal line in the wiring pattern.

[Second embodiment] Hereinafter, a second embodiment of the present invention will be described. The present embodiment is different from the first embodiment in that step 500 (Fig. 5) is used instead of step 314 (Figs. 3 and 4) of the first embodiment, and the first embodiment is used. the same. In the following description, only the portions different from the first embodiment will be described, and the same portions will be omitted.

In order to facilitate the understanding of the invention, a copper-clad laminate having MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 0.2 μm of a copper foil of 5 μm on the insulating layer is prepared as a substrate. Then, a plating of about 19 μm was applied by copper plating, and the thickness of the copper was made to be about 18 μm by half etching (the entire surface etching treatment for thinning the copper thickness of the entire substrate), and the exposure was tested as the first solid pattern. The pattern is subjected to circuit formation processing to produce a substrate for correlation extraction.

In this embodiment, the first upper base data produced in step 310 includes correction amount data based on the difference between the two finishing values, and the two finishing values are at least in the first solid pattern. a finishing value measured by the upper base in a part of the area, and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; and the bottom material includes two finishing operations The correction amount data of the difference between the values, the two finishing values are the finishing value measured at the lower bottom in at least a part of the first solid pattern, and the first entity corresponding to the finishing value The finishing value specified in the design data for the pattern.

In the present embodiment, the gap width of the wiring pattern is used as the finishing value. However, it is of course understood by those skilled in the art that the present invention can be carried out, for example, in the case of using other finishing values such as the circuit width. This is also the same in other embodiments that will be described below.

Here, the AOI is used to measure the gap width of the four corners of the first solid pattern and the upper base in the designated area of the center, and for the coordinates of the respective gap widths, the gap width and the gap defined by the coordinates in the design data are calculated. The difference between the widths is used as the correction amount data. Similarly, as the correction amount of the lower base data, the four corners of the first solid pattern and the gap width of the lower base in the designated area in the center are measured using a microscope, and the gap width and the coordinates are calculated for the coordinates of the respective gap widths. The difference between the gap widths specified in the design data is used as the correction amount data. Here, the area to be measured for the upper and lower base data is set to the same area. By comparing the data obtained from the same area, it is possible to obtain a more accurate correlation between the upper and lower materials.

The calibration amount data in the first upper base data and the lower base data prepared by extracting the substrate from the correlation obtained based on the above conditions are shown in the following table. [Table 1]

The CAD data in Table 1 indicates the gap width (μm) specified in the design data. The finishing value measured by the AOI indicates the width (μm) of the gap between the four corners of the test pattern and the upper portion of the test pattern measured according to the AOI measurement corresponding to the gap width specified in the design data, and the correction amount is The difference between the gap width (μm) of the CAD data and the gap width measured by the AOI is multiplied by 1/2. The reason for multiplying 1/2 is the amount of correction applied to both ends of the gap. The same is true for microscope measurements. The finishing value measured by the microscope indicates the gap width (μm) of the four corners of the test pattern measured according to the microscopic measurement and the lower base in the central region, and the correction amount is the gap width (μm) of the CAD data and the microscope measurement. The difference between the gap widths is multiplied by 1/2. For example, CAD data = 20, AOI measurement finishing value = 44.1, microscope measurement finishing value = 28.4, the meaning is that the design should be 20μm gap, the gap width in the upper base measured according to AOI It was 44.1 μm, and the gap width measured according to the microscope was 28.4 μm. Also, if the finishing value is measured based on the AOI, the gap of the CAD data should be corrected at 12.0 μm at both ends, and if it is based on a microscope measurement, a correction of 4.2 μm should be performed.

Next, the exposure data correction device 112 obtains the first upper base data and the lower base data created by the upper base data and the lower base data creation device 110 in step 310 (steps 501, 502), based on the first upper base data. The correction amount data in the middle determines the first tentative correction function (step 504), and determines the second tentative correction function based on the correction amount data in the lower base data (step 506), based on the correction amount obtained from the first tentative correction function. A correction amount difference function is created (step 508) with a difference (offset) between the correction amount obtained from the second tentative correction function corresponding to the correction amount.

The first tentative correction function in the present embodiment is a function (AOI measurement correction function (etching curve)) for indicating the amount of correction for the AOI measurement gap width, and the above correction amount means relative to Tables 1 and 6. The correction amount of the gap width in the design data shown in the figure; the second tentative correction function is a function (microscopic measurement correction function) for indicating the correction amount for measuring the gap width of the microscope, and the above correction amount means relative to the design The amount of correction for the gap width in the data. Here, although the relationship between the gap width and the correction amount in each design data shown in Tables 1 and 6 is used as each tentative correction function, the tentative correction function may be determined based on the approximation formula based on the measurement data. Further, the correction amount difference function is a correction amount obtained from the first tentative correction function with respect to the gap width in the design data shown in Tables 1 and 6, and the second correction corresponding to the correction amount. A function of the difference (offset) between the correction amounts obtained by the tentative correction function. Similarly to the tentative correction function, although the relationship between the gap and the offset in each design data shown in Tables 1 and 6 is used as the correction amount difference function, it can also be determined based on the approximation based on the measurement data. Correction difference function.

Next, in step 510, the second upper base data is obtained. In this embodiment, the second upper data includes correction amount data based on the difference between the two finishing values, and one of the two finishing values is measured in the upper base in a region. a finishing value, wherein the region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is a design for the first solid pattern corresponding to the previous finishing value The finishing value specified in the data; or, the second upper data includes correction amount data based on the difference between the other two finishing values, one of the two finishing values is based on the first entity The finishing value measured by the upper bottom of the second solid pattern having different patterns, and the other of the two finishing values is the design data for the second solid pattern corresponding to the previous finishing value The specified finishing value.

Then, based on the design data for the physical pattern for obtaining the second upper base data and the second upper base data, the third tentative correction function is determined (step 512), and the third tentative correction function is corrected based on the correction amount difference function. To determine the correction function (step 514), the exposure data is corrected based on the correction function (step 516).

Here, the second upper base data includes correction amount data based on the difference between the two finishing values, and one of the two finishing values is the fine measured according to the upper bottom in the solid pattern as a whole. a processing value, wherein the solid pattern as a whole includes four corners and a center of the first solid pattern, and the other of the two finishing values is in a design material for the first solid pattern corresponding to the previous finishing value The specified finishing value. Therefore, the physical pattern for obtaining the second upper base material is the first physical pattern.

The calibration amount data in the second upper base data prepared by extracting the substrate from the correlation obtained based on the above conditions is as shown in the following table. [Table 2]

The CAD data in Table 2 indicates the gap width (μm) specified in the design data. The correction value measured by the AOI is obtained by multiplying the difference between the gap width (μm) of the upper base of the test pattern obtained by the AOI measurement and the gap width (μm) of the CAD data by 1/2. The offset is the offset of Table 1 (the difference between the correction amount for AOI measurement and the correction amount for microscopic measurement). In the present embodiment, the correction amount difference function is a function indicating the offset amount, and the offset amount is the gap width in the design data shown in Tables 2 and 7.

In the present embodiment, the third tentative correction function is a function (AOI measurement correction function (etching curve)) for indicating the correction amount for measuring the gap width of the AOI, and the above-mentioned correction amount means relative to Tables 2 and 7. The amount of correction for the gap width in the design data shown in the figure. Then, the third tentative correction function is corrected by using the correction amount difference function (offset amount). Here, the correction amount is obtained by subtracting the offset amount from the correction amount for the AOI measurement with respect to the gap value of each design material. The correction function is a function indicating the corrected correction amount (the correction amount after the offset of Table 2) with respect to the gap width in the design data. Here, although the relationship between the offset correction amount shown in Tables 2 and 7 and the gap width in the design data is used as the correction function, the correction function may be determined based on the approximation formula based on the measurement data.

In this embodiment, the second upper base data is obtained based on the finishing value measured according to the upper bottom in the whole solid pattern, wherein the solid pattern entirely includes the four corners and the center of the first solid pattern, but may not The portion including the four corners and the center of the first solid pattern for obtaining the first upper base material may be based on the finishing value measured based on the upper base in the second solid pattern different from the first solid pattern. This is the same in other implementations.

[Embodiment 3] Hereinafter, a third embodiment of the present invention will be described. The present embodiment differs from the first embodiment in that step 800 (Fig. 8) is used instead of step 314 (Figs. 3 and 4) of the first embodiment, and the first embodiment is used. the same. In the following description, only the portions different from the first embodiment will be described, and the same portions will be omitted. In addition, the substrate for correlation extraction prepared based on the same conditions as those described in the second embodiment will be described as an example.

In this embodiment, the first upper base material produced in step 310 includes the finishing value measured in at least a part of the upper base of the first solid pattern, and the lower base data is included in the first entity. The finished value measured in at least a portion of the underlying layer of the pattern. In the four corners of the first solid pattern and the designated area in the center, the gap width in the upper base is measured as the upper base data using the AOI, and the four corners of the first solid pattern and the designated area in the center are measured in the same bottom using the microscope. The gap width is used as the bottom material.

The exposure data correction device 112 obtains the first upper base data and the lower base data created by the upper base data and the lower base data creation device 110 in step 310 (steps 801 and 802); and determines the first finishing value function. The first finishing value function represents a relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the fineness in the first upper base data. Processing value (step 804); determining a second finishing value function, the second finishing value function indicating a relationship between the following: resulting in a finishing value specified in the design data and a finishing value in the solid pattern a factor of the difference, and a finishing value in the bottom material (step 804); and determining a finishing value difference function, the finishing value difference function is based on the first finishing value function and the second finishing value The difference between the functions (step 808). In this way, the relationship between the upper and lower materials is determined.

The data of the finishing values in the first upper base data and the lower base data prepared from the correlation extraction substrate obtained based on the above conditions are shown in the following table. [table 3]

As in Table 1, the CAD data in Table 3 indicates the gap width (μm) specified in the design data. The finishing values of the AOI measurement and the microscopic measurement indicate the gap width (μm) of the upper and lower bases in the four corners and the central region of the test pattern, which are measured according to the gap width specified in the design data. The measured finishing values in Table 3 were the same values as shown in Table 1. The difference is obtained by multiplying the difference between the gap width of the AOI measurement corresponding to the gap width of each CAD data by the gap width measured by the microscope by 1/2. For example, CAD data = 20, AOI measurement finishing value = 44.1, microscope measurement finishing value = 28.4, the meaning is that the design should be 20μm gap, the gap width in the upper base measured according to AOI It was 44.1 μm, and the gap width measured according to the microscope was 28.4 μm. Moreover, the difference between the AOI measurement finishing value and the microscope measurement finishing value is 15.7, and the value of 1/2 of the difference is rounded to the value obtained, that is, the difference of the finishing value is 7.8 μm.

In the present embodiment, the first finishing value function is a function of the finishing value of the AOI measurement gap width with respect to the gap width in the design data shown in Tables 3 and 9 (AOI measurement finishing value function) And the second finishing value function is a function of the finishing value of the microscopic measurement gap width with respect to the gap width in the design data (microscopic measurement of the finishing value function). Here, although the relationship between the gap and the finishing value in each design data shown in Tables 3 and 9 is used as a function of each finishing value, the finishing value function may be determined based on the approximation based on the measurement data. . Further, the finishing value difference function is a function representing the difference between the AOI measurement finishing value and the microscope measurement finishing value with respect to the gap width in each of the design materials shown in Tables 3 and 9. The same as the finishing value function, although the relationship between the difference between the AOI measurement finishing value and the microscope measurement finishing value relative to the gap in each design data shown in Tables 3 and 9 is taken as the finishing value difference. The value function, but the difference value of the finishing value can also be determined based on the approximation based on the measured data.

Next, in step 810, the second supernatant data is acquired. In this embodiment, the second upper base data includes correction amount data based on the difference between the two finishing values, and one of the two finishing values is measured in the upper base in a region. a finishing value, wherein the region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is for the first solid pattern corresponding to the previous finishing value The finishing value specified in the design data; or, the second upper data includes correction amount data based on the difference between the other two finishing values, one of the two finishing values is based on the first The finishing value measured by the upper bottom of the second solid pattern having different physical patterns, and the other of the two finishing values is the design data for the second solid pattern corresponding to the previous finishing value The specified finishing value.

Then, based on the design data for the physical pattern for obtaining the second upper base data and the second upper base data, the tentative correction function is determined (step 812), and the tentative correction function is corrected based on the finishing value difference function, and The correction function is determined (step 814).

Here, the second upper data is the same as the second embodiment. The calibration amount data (AOI measurement) in the second upper substrate produced by the correlation extraction substrate obtained based on the above conditions is as shown in the following table. This data is the same as shown in Table 2. [Table 4]

In the present embodiment, the tentative correction function is a function (AOI measurement correction function (etching curve)) for indicating the amount of correction for measuring the gap width of the AOI, and the above-mentioned correction amount means relative to Table 4 and FIG. The amount of correction for the gap width in the design data shown. And, the temporary correction function is offset by using the finishing value difference function to correct. Here, the correction function is obtained by subtracting the finishing value difference (offset amount) from the correction amount for AOI measurement with respect to the gap value of each design material. The correction function is a function of the amount of correction that has been corrected relative to the width of the gap in the design data. Here, although the relationship between the offset correction amount shown in Tables 4 and 10 and the gap width in the design data is used as the correction function, the correction function may be determined based on the approximation formula based on the measurement data.

[Embodiment 4] Hereinafter, a fourth embodiment of the present invention will be described. The present embodiment differs from the first embodiment in that step 1100 (Fig. 11) is used instead of step 314 (Figs. 3 and 4) of the first embodiment, and the first embodiment is used. the same. In the following description, only the portions different from the first embodiment will be described, and the same portions will be omitted. In addition, the substrate for correlation extraction prepared based on the same conditions as those described in the second embodiment will be described as an example.

In this embodiment, the first upper base data produced in step 310 includes correction amount data based on the difference between the two finishing values, and the two finishing values are at least in the first solid pattern. a finishing value measured by the upper base in a part of the area, and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; and the bottom material includes two finishing operations The correction amount data of the difference between the values, the two finishing values are the finishing value measured according to the lower bottom in at least a part of the first solid pattern, and the first corresponding to the finishing value The finishing value specified in the design data for the solid pattern.

The second upper base data includes correction amount data based on a difference between the two finishing values, one of the two finishing values being a finishing value measured in the upper base in one region, wherein The region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is defined in the design data for the first solid pattern corresponding to the previous finishing value. The finishing value; or, the second upper data includes correction amount data based on the difference between the other two finishing values, and one of the two finishing values is based on the second difference from the first physical pattern The finishing value measured by the upper bottom of the solid pattern, and the other of the two finishing values is the finishing value specified in the design data for the second solid pattern corresponding to the previous finishing value .

The exposure data correction device 112 obtains the first upper base data and the lower base data created by the upper base data and the lower base data creation device 110 in step 310 (steps 1101, 1102); and determines the following two correction amounts. The correction amount correlation function: the correction amount shown in the correction amount data in the first upper base data, and the correction amount shown in the correction amount data in the bottom data corresponding to the correction amount (step 1104). In this way, the relationship between the upper and lower materials is determined.

Then, after acquiring the second background data (step 1106), the tentative correction function is determined based on the design data for the physical pattern for obtaining the second upper base data and the second upper base data (step 1108), based on the correction amount. The correlation function modifies the tentative correction function, determines the correction function (step 1110), and corrects the exposure data based on the correction function (step 1112).

The correction amount data in the first upper base data and the lower base data prepared based on the correlation relationship obtained based on the above conditions are related to the embodiment 2, and are as shown in Table 1. For the relative relationship between the amount of correction based on the microscope measurement in Table 1 and the amount of correction based on the AOI measurement, the result after expressing it as a graph is the 12th figure. For example, if the CAD data = 20 is observed, the correction based on the AOI measurement is 12.1, and the correction amount based on the microscope measurement is 4.2. In this case, mark it at the coordinates of (x, y) = (12.1, 4.2). After all such data is marked as such, the correlation is determined by the approximation. Here, the correlation relation is determined by linear approximation, and the correlation function of the correction amount is y=1.2861x-10.563.

The correction amount data in the second upper base material produced by the autocorrelation extraction substrate is as follows. The correction amount based on the AOI measurement is taken as x, and the aforementioned correction amount correlation function (y=1.2861x-10.563) is substituted, thereby calculating the corrected correction amount y. [table 5]

In the present embodiment, the tentative correction function is a function (AOI measurement correction function (etching curve)) for indicating the amount of correction for the AOI measurement gap width, and the above-mentioned correction amount means relative to Tables 5 and 13. The amount of correction for the gap width in the design data shown. And, the correction function is obtained by correcting the tentative correction function according to the correction amount correlation function. The correction function is a function of the amount of correction that has been corrected relative to the width of the gap in the design data. Here, although the relationship between the corrected correction amount shown in Tables 5 and 13 and the gap width in the design data is used as the correction function, the correction function may be determined based on the approximation formula based on the measurement data.

[Embodiment 5] Hereinafter, a fifth embodiment of the present invention will be described. The present embodiment is different from the first embodiment in that step 1400 (Fig. 14) is used instead of step 314 (Figs. 3 and 4) of the first embodiment, and the first embodiment is used. the same. In the following description, only the portions different from the first embodiment will be described, and the same portions will be omitted. In addition, the substrate for correlation extraction prepared based on the same conditions as those described in the second embodiment will be described as an example.

In the present embodiment, the first upper base material produced in step 310 includes the finishing value measured in at least a portion of the upper base of the first solid pattern, and the lower base data is included in the first The finished value measured in at least a portion of the lower base of the solid pattern.

The exposure data correcting means 112 obtains the first upper base data and the lower base data produced by the upper base data and the lower base data creating apparatus 110 (steps 1401, 1402); and determines the measured in the first upper base data. The finishing value is related to the finishing value of the finishing value measured in the bottom material (step 1404). In this way, the relationship between the upper and lower materials is determined.

In step 1406, the second upper base data is obtained. The second upper base data includes a finishing value measured by an upper base in an area, wherein the area contains a different area from at least a part of the first physical pattern, or the second upper base data includes The finishing value measured by the upper base of the second solid pattern different in the first solid pattern.

Based on the determined finishing value correlation function, the estimated value of the finishing value in the corresponding bottom is calculated from the finishing value in the second upper data (step 1408), and based on the following two finishing values The difference is used to determine a correction function: a finishing value specified in the design data for obtaining the physical pattern of the second upper data, and a finishing value in the lower base corresponding to the estimated finishing value ( Step 1410). Based on this correction function, the exposure data is corrected (step 1412).

The substrate for the extraction of the correlation relationship obtained based on the above conditions, and the finishing values in the first upper base data and the lower base data produced are related to the embodiment 3, as shown in Table 3. For the relative relationship between the microscopic measurement-based finishing value and the AOI-based finishing value in Table 3, the result after expressing it as a graph is shown in Fig. 15. For example, if the CAD data = 20 is observed, the finishing value based on the AOI measurement is 44.1, and the precision based on the microscope measurement is 28.4. In this case, mark it at the coordinates of (x, y) = (44.1, 28.4). After all such data is marked as such, the correlation is determined by the approximation. Here, the correlation relation is determined by linear approximation, and the correction quantity correlation function is obtained as y=1.0177x-13.389.

The finishing value data in the second upper base material produced by the self-correlation extraction substrate is as follows. The finishing value based on the AOI measurement is taken as x, and the aforementioned correction amount correlation function (y=1.0177x-13.389) is substituted, thereby calculating the estimated bottom finishing value (gap width). Then, the value obtained by multiplying the calculated difference between the calculated finishing value (gap width) and the design finishing value in the CAD data by 1/2 is used as the correction amount.

[Table 6]

If the correction amount shown in the table with respect to the gap width in the design data is expressed as a correction function (etching curve), it will be as shown in Fig. 16. Here, the correction function is a function indicating the amount of correction, and the correction amount is a refined value calculated based on the gap width in the design data. Here, although the relationship between the correction amount shown in Tables 6 and 16 and the gap width in the design data is used as the correction function, the correction function may be determined based on the approximation based on the measurement data.

(Example) In order to confirm the effect of the present embodiment, a copper-clad laminate having a thickness of 0.22 mm of MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a copper foil of 5 μm was prepared and applied by copper plating. For a plating of about 19 μm, the thickness of the copper is made to be about 18 μm by half etching, and the exposure data is corrected according to the correction function obtained by the above-described embodiment types 2 to 5, and exposure, development, and circuit formation processing of the solid pattern are performed. A circuit is formed to form a substrate. The circuit-formed substrates formed using the correction functions created in the steps of the second to fifth embodiments are denoted as Examples 1 to 4, respectively.

[Comparative Example 1] As a comparative example 1, a copper-clad laminate having a thickness of 0.22 mm of MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a copper foil of 5 μm was prepared, and about 19 μm was applied by copper plating. In the plating, the copper thickness was set to about 18 μm by half etching, and the test pattern was exposed thereon to perform a circuit formation process, thereby producing a substrate for correction function extraction. Then, the substrate width and the gap width are measured by the microscope for the correction function extraction, and a correction function (etching curve) is created based on the measured value.

A copper-clad laminate having a thickness of 0.22 mm of MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a copper foil of 5 μm was prepared, and plating of about 19 μm was applied by copper plating, and copper thickness was half-etched. The formation of about 18 μm was performed, and the exposure data was corrected in accordance with the above-described correction function (bottom width), and exposure, development, and circuit formation processing of the solid pattern were performed to fabricate a circuit-formed substrate.

[Comparative Example 2] A copper-clad laminate having a thickness of 0.22 mm of MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a copper foil of 5 μm was prepared, and plating of about 19 μm was applied by copper plating. The thickness of the copper was set to about 18 μm by half etching, and the test pattern was exposed thereon to perform circuit formation processing, thereby producing a substrate for correction function extraction. Then, the correction measuring function extraction circuit width and the gap width are extracted by the optical automatic visual inspection device, and a correction function (etching curve) is created based on the measured value.

A copper-clad laminate having a thickness of 0.22 mm of MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a copper foil of 5 μm was prepared, and plating of about 19 μm was applied by copper plating, and copper thickness was half-etched. The substrate was formed to have a length of about 18 μm, and the exposure data was corrected in accordance with the above-described correction function (top width), and exposure, development, and circuit formation processing of the solid pattern were performed to fabricate a circuit-formed substrate.

[Comparative] The measurement results of Examples 1 to 4, Comparative Example 1, and Comparative Example 2 are shown in Tables 7 and 8. The items of Tables 7 and 8 indicate design values and microscope measurements regarding the line portion (circuit width). In addition, "L/S=50/40" in Table 7 indicates a design specification in which L (line portion: circuit width) is 50 μm and S (space portion: gap width) is 40 μm, and "L/S=50/ of Table 8"50" indicates a design specification in which L (line portion: circuit width) is 50 μm and S (space portion: gap width) is 50 μm. In Embodiment 1 and Embodiment 2, since the difference is only when the correlation between the upper base data and the lower base data is to be determined, it is based on the difference between the correction amount based on the upper base and the finishing value, or based on the finishing value itself. The difference, so the resulting correction function will be the same. Therefore, the results obtained according to Example 1 and Example 2 will also be the same. [Table 7]

[Table 8]

As shown in Table 7, with respect to the design specifications of L/S=50/40, the dimensional accuracy (deviation: 3σ) of the circuit width in Example 1 and Example 2 was 6.7 μm on the upper surface and 8.8 μm on the lower surface. In Example 3, the upper surface was 6.5 μm and the lower surface was 8.4 μm. In Example 4, the upper surface was 6.7 μm and the lower surface was 9.0 μm. On the other hand, in Comparative Example 1, the upper surface was 7.1 μm and the lower surface was 9.7 μm, and in Comparative Example 2, the upper surface was 7.6 μm and the lower surface was 20.5 μm.

As shown in Table 8, regarding the design specifications of L/S=50/50, the dimensional accuracy (deviation: 3σ) of the circuit width in Example 1 and Example 2 was 6.0 μm on the upper surface and 7.7 μm on the lower surface. In Example 3, the upper surface was 5.8 μm and the lower surface was 7.4 μm. In Example 4, the upper surface was 6.0 μm and the lower surface was 8.3 μm. On the other hand, in Comparative Example 1, the upper surface was 6.4 μm and the lower surface was 9.2 μm, and in Comparative Example 2, the upper surface was 6.0 μm and the lower surface was 8.8 μm.

From this result, it is understood that the first to fourth embodiments of the present invention show characteristics superior to those of the comparative example with respect to the deviation in the upper surface and the lower surface, and therefore the circuit width accuracy can be improved by using the present invention.

The embodiments described above are merely illustrative of the present invention, and the present invention is not limited to these embodiments. The present invention can be implemented in various forms without departing from the gist thereof.

100‧‧‧Wiring pattern forming system
101‧‧‧Design data production device
102‧‧‧Exposure data production device
104‧‧‧Exposure device
106‧‧‧Development pattern making device
108‧‧‧Solid pattern making device
110‧‧‧Upper and lower base data production devices
112‧‧‧Exposure data correction device
200‧‧‧ computer
201‧‧‧Processing Department
202‧‧‧Display Department
203‧‧‧ Input Department
204‧‧‧Memory Department
205‧‧‧Communication Department
206‧‧‧Exposure data correction program
301~314‧‧‧Steps
401~410‧‧‧Steps
500~516‧‧‧Steps
800~816‧‧‧Steps
1100~1112‧‧‧Steps
1400~1412‧‧ steps
1700‧‧‧Substrate
1701‧‧‧Wiring pattern
1702‧‧‧Upper (top) width
1704‧‧‧ bottom (bottom) width

Fig. 1 is a schematic view showing a wiring pattern forming system of an embodiment of the present invention. Fig. 2 is a view showing the hardware configuration of the exposure data correction device in the embodiment of the present invention. Fig. 3 is a flow chart showing a method of correcting exposure data according to an embodiment of the present invention. Fig. 4 is a flow chart showing the procedure of the exposure data correction according to an embodiment of the present invention. Fig. 5 is a flow chart showing the procedure of the exposure data correction of an embodiment of the present invention. Fig. 6 is a view showing a tentative correction function of an embodiment of the present invention. Fig. 7 shows a tentative correction function and a correction function of an embodiment of the present invention. Fig. 8 is a flow chart showing the procedure of the exposure data correction of an embodiment of the present invention. Fig. 9 is a view showing a finishing value function of an embodiment of the present invention. Fig. 10 shows a tentative correction function and a correction function of an embodiment of the present invention. Fig. 11 is a flow chart showing the procedure of the exposure data correction of an embodiment of the present invention. Fig. 12 is a view showing a correction amount correlation function of an embodiment of the present invention. Fig. 13 is a view showing a tentative correction function and a correction function of an embodiment of the present invention. Fig. 14 is a flow chart showing the procedure of the exposure data correction of an embodiment of the present invention. Fig. 15 is a view showing a finishing value correlation function of an embodiment of the present invention. Fig. 16 shows a correction function of an embodiment of the present invention. Fig. 17 is a schematic view showing a sectional shape of a solid pattern.

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100‧‧‧Wiring pattern forming system

101‧‧‧Design data production device

102‧‧‧Exposure data production device

104‧‧‧Exposure device

106‧‧‧Development pattern making device

108‧‧‧Solid pattern making device

110‧‧‧Upper and lower base data production devices

112‧‧‧Exposure data correction device

Claims (22)

An exposure data correction device that corrects exposure data for making a wiring pattern, and the exposure data correction device performs the following actions: obtaining a first upper base data based on having an upper bottom and a lower bottom The material obtained by the upper bottom in at least a part of the convex first solid pattern, the first solid pattern is obtained by circuit processing, and the circuit processing uses design data based on the target wiring pattern. Exposure data; obtaining the bottom material, the data obtained from the bottom bottom in at least a part of the pattern of the first entity pattern; determining the correlation between the first base material and the bottom material; 2 upper base data, the second upper base data is based on data obtained from an upper base in an area, wherein the aforementioned one area contains an area different from at least a part of the area of the first physical pattern, or the second upper base data Based on the data obtained from the upper bottom of the second physical pattern, wherein the second physical pattern is different from the first physical pattern; The design data for the physical pattern of the second upper base data, the second upper base data, and the correlation relationship are used to determine a correction function, the correction function indicating a relationship between the following: causing finishing processing specified in the design data a factor generated by a difference between the value and the finishing value in the solid pattern, and a correction amount for suppressing the difference; and, based on the aforementioned correction function, for the physical pattern used to obtain the second upper base data The exposure data is corrected. The data correction device according to claim 1, wherein the first upper base data includes correction amount data based on a difference between the two finishing values: at least a part of the area of the first physical pattern a finishing value measured at the bottom and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the bottom material includes a difference between the following two finishing values The correction amount data of the value: the finishing value measured in the lower bottom in at least a part of the first solid pattern, and the finishing specified in the design data for the first solid pattern corresponding to the finishing value The second base data includes the correction amount data based on the difference between the two finishing values, and one of the two finishing values is the finishing measured by the upper bottom in one region. a value, wherein the one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is the first entity map corresponding to the previous finishing value The finishing value specified in the design data of the case; or, the second upper base data includes correction amount data based on the difference between the other two finishing values, one of the other two finishing values, Is a finishing value measured on the upper bottom of the second solid pattern different from the first solid pattern, and the other of the other two finishing values is the aforementioned one corresponding to the previous finishing value (2) The finishing value specified in the design data for the solid pattern; the operation for determining the correlation relationship includes the following operation: determining the first tentative correction function based on the correction amount data in the first upper base data; The correction amount data in the data determines the second tentative correction function; and the difference between the correction amount obtained from the first tentative correction function and the correction amount obtained from the second tentative correction function corresponding to the correction amount Determining a correction amount difference function; and determining the operation of the correction function includes the following operations: design data based on the physical pattern used to acquire the second upper base data, and the foregoing The second upper base data determines a third tentative correction function; and the third tentative correction function is corrected based on the correction amount difference function to determine a correction function. The data correction device according to claim 1, wherein the first supernatant material includes a finishing value measured in at least a portion of an upper base of the first solid pattern; and the bottom material is included in a finishing value measured in at least a portion of the lower base of the first solid pattern; the second upper base data includes correction amount data based on a difference between the two finishing values, the two finishing values One of the values is a finishing value measured in the upper base of a region, wherein the aforementioned one region contains a region different from at least a portion of the aforementioned first solid pattern, and the other two of the two finishing values The finishing value specified in the design data for the first solid pattern corresponding to the previous finishing value; or the second upper data includes a difference between the other two finishing values. The correction amount data, wherein one of the two finishing values is a finishing value measured on a top of the second solid pattern different from the first solid pattern, and the two finishing values are One is a finishing value defined in the design data for the second solid pattern corresponding to the previous finishing value; and the operation for determining the correlation relationship includes the following operation: determining a first finishing value function, Indicates the relationship between the difference between the finishing value specified in the design data and the finishing value in the physical pattern, and the finishing value in the first upper base data; A finishing value function, which represents a relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the finishing value in the aforementioned bottom data. And determining a finishing value difference function based on a difference between the first finishing value function and the second finishing value function; and determining an operation of the correction function, comprising the following operation: 2 design data for the physical pattern of the upper base data and the second upper base data, determining a tentative correction function; and, based on the aforementioned difference value function of the finishing value, the tentative correction function Line correction to determine correction function. The data correction device according to claim 1, wherein the first upper base data includes correction amount data based on a difference between the two finishing values: at least a part of the area of the first physical pattern a finishing value measured at the bottom and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the bottom material includes a difference between the following two finishing values The correction amount data of the value: the finishing value measured in the lower bottom in at least a part of the first solid pattern, and the finishing specified in the design data for the first solid pattern corresponding to the finishing value The second base data includes the correction amount data based on the difference between the two finishing values, and one of the two finishing values is the finishing measured by the upper bottom in one region. a value, wherein the one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is the first entity map corresponding to the previous finishing value The finishing value specified in the design data of the case; or the second upper base data includes correction amount data based on the difference between the other two finishing values, one of the two finishing values is a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern, and the other of the two finishing values is the second entity corresponding to the previous finishing value The finishing value specified in the design data for the pattern; the operation for determining the correlation relationship includes the following actions: determining the correction amount correlation function of the following two correction amounts: as shown in the correction amount data in the first upper base data The correction amount and the correction amount shown in the correction amount data in the lower base data corresponding to the correction amount; and determining the operation of the correction function includes the following operation: based on obtaining the second upper base data The design data for the physical pattern and the second upper base data determine a tentative correction function; and, based on the correction amount correlation function, correct the tentative correction function to determine the calibration Positive function. The data correction device according to claim 1, wherein the first supernatant material includes a finishing value measured in at least a portion of an upper base of the first solid pattern; and the bottom material is included in a finishing value measured in at least a portion of the lower base of the first solid pattern; the second upper base data comprising a finishing value measured by an upper base in a region, wherein the aforementioned one region contains a region in which at least a part of the first solid pattern is different, or the second upper material includes a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern; The action of the relationship includes the following actions: determining the finishing value correlation function of the following two finishing values: the finishing value measured in the first upper base data, and the fineness measured in the aforementioned lower base data Processing value; and determining the action of the aforementioned correction function, comprising the following actions: based on the determined finishing value correlation function, and based on the fine addition in the aforementioned second background data a value to calculate an estimated value of the finishing value in the bottom corresponding to the finishing value; and determining a correction function based on a difference between the following two finishing values: an entity used to obtain the second upper base data The finishing value specified in the design data for the pattern, and the finishing value in the lower base corresponding to the above-described calculated finishing value. The data correction device according to any one of claims 1 to 5, wherein the finishing value included in the first upper base data and the second upper base data is obtained based on an optical visual inspection device. The finishing value of the data; the aforementioned bottom data is based on the data obtained by using the microscope. The data correction device according to any one of claims 1 to 6, wherein the correction function is determined in units of respective regions of the same substrate surface on which the wiring patterns are arranged. The data correction device according to any one of claims 1 to 7, wherein the correction function is determined in units of an upper surface and a lower surface of the same substrate on which the wiring pattern is arranged. The data correction device according to any one of claims 1 to 8, wherein the correction function is determined for each of a vertical line and a horizontal line in the wiring pattern. A wiring pattern forming system comprising: an exposure data producing means for producing exposure data, the exposure data is based on design data of a target wiring pattern; and a pattern exposure means for sensing sensitivity on a substrate based on exposure data Exposing an exposure pattern on the photoresist layer; developing a pattern forming means for developing the photosensitive photoresist layer exposing the exposure pattern to form a development pattern; and a solid pattern forming means for the substrate on which the development pattern is formed Circuit processing to form a solid pattern; upper substrate data producing means for fabricating upper base data based on data obtained from an upper base in at least a portion of the aforementioned solid pattern; lower bottom data producing means, Forming the underlying material based on the data obtained from the lower bottom in at least a portion of the foregoing physical pattern; and the exposure data correcting device according to any one of claims 1 to 9, which is based on the foregoing The upper base data, the lower base data and the design data are used to correct the exposure data. A program for correcting exposure data, and the exposure data is used to create a wiring pattern, the program causes the computer to perform the following steps: Obtaining the first upper base data, the first upper base data is based on having an upper bottom and The material obtained by the upper bottom in at least a part of the convex first solid pattern, the first solid pattern is obtained by circuit processing, and the circuit is processed using a design based on the target wiring pattern. Exposure data of the data; obtaining the bottom material, the data obtained from the bottom bottom in at least a part of the pattern of the first entity; determining the correlation between the first base material and the bottom material; Obtaining a second upper base data based on data obtained from an upper base in an area, wherein the one area includes an area different from at least a part of the first physical pattern, or the second upper The bottom material is based on data obtained from the upper bottom of the second physical pattern, wherein the second physical pattern is different from the first physical pattern; The design data for the physical pattern of the second upper base data, the second upper base data, and the aforementioned correlation relationship are used to determine a correction function indicating a relationship between the following: resulting in a finishing value specified in the design data a factor generated by a difference from a finishing value in the solid pattern, and a correction amount for suppressing the difference; and an exposure for obtaining a physical pattern of the second upper base data based on the correction function The data is corrected. A method for correcting exposure data, and the exposure data is used to make a wiring pattern, the method comprising the steps of: obtaining a first upper base data, the first upper base data being based on having an upper bottom and a lower bottom The material obtained by the upper bottom in at least a part of the convex first solid pattern, the first solid pattern is obtained by circuit processing, and the circuit processing uses design data based on the target wiring pattern. Exposure data; obtaining the bottom material, the data obtained from the bottom bottom in at least a part of the pattern of the first entity pattern; determining the correlation between the first base material and the bottom material; 2 upper base data, the second upper base data is based on data obtained from an upper base in an area, wherein the aforementioned one area contains an area different from at least a part of the area of the first physical pattern, or the second upper base data Based on the data obtained from the upper bottom of the second physical pattern, wherein the second physical pattern is different from the first physical pattern; based on the second upper The design data for the physical pattern of the data, the second upper base data, and the aforementioned correlation relationship are used to determine a correction function indicating a relationship between the following: resulting in a finishing value and a physical pattern specified in the design data. The difference between the finishing values and the amount of correction for suppressing the difference; and correcting the exposure data for obtaining the physical pattern of the second upper data based on the correction function. A method of manufacturing a wiring board, comprising the steps of: obtaining a first upper substrate data obtained based on an upper bottom in at least a portion of a first solid pattern having a convex shape of an upper bottom and a lower bottom; According to the data, the first physical pattern is obtained by circuit processing, and the circuit processing uses exposure data based on design data for the target wiring pattern; and the bottom data is obtained based on the first entity a data obtained from a lower bottom in at least a portion of the pattern; determining a correlation between the first upper base data and the lower base data; obtaining a second upper base data based on an upper portion of the area a data obtained by the bottom, wherein the one region includes a region different from at least a portion of the first entity pattern, or the second matrix material is based on data obtained from an upper base of the second entity pattern, wherein the second portion The physical pattern is different from the first physical pattern; the design data for obtaining the physical pattern of the second upper base material, the second upper base data, and the foregoing Correlation, to determine a correction function, the correction function indicating a relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the suppression of the a correction amount of the difference; correcting exposure data for obtaining the physical pattern of the second upper base data based on the correction function; and forming a wiring pattern based on the exposure data. The method of manufacturing a wiring board according to claim 13, wherein the first background data includes correction amount data based on a difference between the two finishing values: at least a part of the region of the first solid pattern a finishing value measured by the upper base and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the bottom material is included based on the following two finishing values The correction amount data of the difference: the finishing value measured in the lower bottom in at least a part of the region of the first solid pattern, and the fineness specified in the design data for the first solid pattern corresponding to the finishing value The processing value; the second upper base data includes correction amount data based on the difference between the two finishing values, and one of the two finishing values is the fine measured in the upper base in one region. a processing value, wherein the one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is the first one corresponding to the previous finishing value The finishing value specified in the design data for the body pattern; or the second background data includes correction amount data based on the difference between the other two finishing values, one of the two finishing values, a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern, and the other of the two finishing values is the second corresponding to the previous finishing value The finishing value specified in the design data for the solid pattern; the step of determining the correlation relationship includes the following steps: determining the first tentative correction function based on the correction amount data in the first upper base data; The correction amount data in the determination determines a second tentative correction function; and, based on the difference between the correction amount obtained from the first provisional correction function and the correction amount obtained from the second tentative correction function corresponding to the correction amount, Making a correction amount difference function; and determining the foregoing correction function includes the following steps: design data based on the physical pattern used to obtain the second upper base data, and the second End of data, the third tentative decision correction function; and, based on the difference function and the correction amount, the correction of the third provisional correction function to determine the correction function. The method of manufacturing a wiring board according to claim 13, wherein the first supernatant material includes a finishing value measured in at least a portion of an upper base of the first solid pattern; and the bottom material includes a finishing value measured in at least a portion of the lower base of the first solid pattern; the second upper base data includes correction amount data based on a difference between the two finishing values, the two finishing operations One of the values is a finishing value measured in the upper base of a region, wherein the aforementioned one region contains a region different from at least a portion of the aforementioned first solid pattern, and the other two finishing values are One is a finishing value specified in the design data for the first solid pattern corresponding to the previous finishing value; or the second upper data includes a difference based on the other two finishing values The correction amount data, wherein one of the two finishing values is a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern, and the two finishing operations are performed The other one is a finishing value defined in the design data for the second solid pattern corresponding to the previous finishing value; and the step of determining the correlation relationship includes the following steps: determining the first finishing value function , which indicates the relationship between the difference between the finishing value specified in the design data and the finishing value in the physical pattern, and the finishing value in the first upper base data; The second finishing value function, which represents the relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the fineness in the aforementioned bottom data a machining value; and determining a finishing value difference function based on a difference between the first finishing value function and the second finishing value function; and determining the correction function comprises the following steps: The design data for the physical pattern of the second upper base data and the second upper base data determine a tentative correction function; and, based on the difference value function of the finishing value, the tentative correction The function is modified to determine the correction function. The method of manufacturing a wiring board according to claim 13, wherein the first background data includes correction amount data based on a difference between the two finishing values: at least a part of the region of the first solid pattern a finishing value measured by the upper base and a finishing value specified in the design data for the first solid pattern corresponding to the finishing value; the bottom material is included based on the following two finishing values The correction amount data of the difference: the finishing value measured in the lower bottom in at least a part of the region of the first solid pattern, and the fineness specified in the design data for the first solid pattern corresponding to the finishing value The processing value; the second upper base data includes correction amount data based on the difference between the two finishing values, and one of the two finishing values is the fine measured in the upper base in one region. a processing value, wherein the one region includes a region different from at least a portion of the first solid pattern, and the other of the two finishing values is the first one corresponding to the previous finishing value The finishing value specified in the design data for the body pattern; or the second background data includes correction amount data based on the difference between the other two finishing values, one of the two finishing values, a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern, and the other of the two finishing values is the second corresponding to the previous finishing value The finishing value specified in the design data for the solid pattern; the step of determining the correlation relationship includes the following steps: determining the correction amount correlation function of the following two correction amounts: the correction amount data in the first upper base data a correction amount shown, and a correction amount shown in the correction amount data in the lower base data corresponding to the correction amount; and the step of determining the correction function includes the following steps: based on obtaining the second upper base Determining a tentative correction function by design data for the physical pattern of the data and the second upper base data; and correcting the tentative correction function based on the correction amount correlation function Reference Correction function. The method of manufacturing a wiring board according to claim 13, wherein the first supernatant material includes a finishing value measured in at least a portion of an upper base of the first solid pattern; and the bottom material includes a finishing value measured in at least a portion of a lower base of the first physical pattern; the second upper data comprising a finishing value measured by an upper base in a region, wherein the aforementioned one region contains a region different from at least a part of the first solid pattern, or the second upper material includes a finishing value measured on an upper bottom of the second solid pattern different from the first solid pattern; The step of correlating includes the following steps: determining a finishing value correlation function of the following two finishing values: a finishing value measured in the aforementioned first base data, and a measured value in the aforementioned bottom material And a step of determining the aforementioned correction function, comprising the steps of: based on the determined finishing value correlation function, and based on the aforementioned second base data The finishing value is used to calculate an estimated value of the finishing value in the bottom corresponding to the finishing value; and the correction function is determined based on the difference between the following two finishing values: used to obtain the aforementioned second background The finishing value specified in the design data for the physical pattern of the data, and the finishing value in the lower base corresponding to the above-described calculated finishing value. The method of manufacturing a wiring board according to any one of claims 13 to 17, wherein the finishing values included in the first upper substrate and the second upper substrate are based on an optical appearance inspection device. The finishing value of the obtained data; the aforementioned bottom material is based on the data obtained by using the microscope. The method of manufacturing a wiring board according to any one of claims 13 to 18, wherein the correction function is determined in units of respective regions of the same substrate surface on which the wiring patterns are arranged. The method of manufacturing a wiring board according to any one of claims 13 to 19, wherein the correction function is determined in units of an upper surface and a lower surface of the same substrate on which the wiring pattern is arranged. The method of manufacturing a wiring board according to any one of claims 13 to 20, wherein the correction function is determined for each of a vertical line and a horizontal line in the wiring pattern. A method for manufacturing a wiring substrate, comprising the steps of: fabricating exposure data based on design data of a target wiring pattern; and exposing an exposure pattern on a photosensitive photoresist layer disposed on the substrate based on exposure data; Developing a photosensitive photoresist layer exposing the exposure pattern to form a development pattern; performing circuit processing on the substrate on which the development pattern is formed to form a first solid pattern; and forming a first upper substrate, the first upper substrate The bottom material is based on data obtained from an upper bottom in at least a portion of the first physical pattern; and the bottom material is based on data obtained from a lower bottom in at least a portion of the first physical pattern Determining the correlation between the first upper base data and the aforementioned lower base data; producing a second upper base data based on data obtained from an upper base in an area, wherein the aforementioned one area contains the foregoing An area of at least a portion of the first physical pattern is different, or the second upper base material is based on the upper base of the second physical pattern The obtained data, wherein the second physical pattern is different from the first physical pattern; and the correction is determined based on design data for obtaining the physical pattern of the second upper base material, the second upper base data, and the correlation relationship a function, the correction function indicating a relationship between the difference between the finishing value specified in the design data and the finishing value in the solid pattern, and the amount of correction for suppressing the difference; The exposure data for obtaining the physical pattern of the second upper base data is corrected based on the correction function; and the wiring pattern is formed based on the corrected exposure data.