CN107850855A - Exposure data correcting device, wiring pattern form system and the manufacture method of circuit board - Google Patents
Exposure data correcting device, wiring pattern form system and the manufacture method of circuit board Download PDFInfo
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- CN107850855A CN107850855A CN201680042016.6A CN201680042016A CN107850855A CN 107850855 A CN107850855 A CN 107850855A CN 201680042016 A CN201680042016 A CN 201680042016A CN 107850855 A CN107850855 A CN 107850855A
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- 238000000034 method Methods 0.000 title claims description 165
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- 238000013461 design Methods 0.000 claims abstract description 176
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- 238000005314 correlation function Methods 0.000 claims description 24
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 13
- 238000011161 development Methods 0.000 claims description 10
- 230000018109 developmental process Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000007261 regionalization Effects 0.000 claims description 7
- 238000004364 calculation method Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 51
- 230000006870 function Effects 0.000 description 199
- 238000005530 etching Methods 0.000 description 17
- 238000011960 computer-aided design Methods 0.000 description 16
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
While the workload for bringing the manual measurement by bottom data is reduced, suppress the error of exposure data correction, improve circuit width precision.A kind of exposure data correcting device, obtains truth of a matter evidence on the 1st based on the data obtained from the upper bottom of the 1st actual pattern, and above-mentioned 1st actual pattern is obtained by using the circuit fabrication of the exposure data based on design data；Obtain the bottom data based on the data obtained from the bottom of the 1st actual pattern；Determine that the truth of a matter is according to the dependency relation with data of going to the bottom on the 1st；Truth of a matter evidence on the 2nd is obtained, the truth of a matter is according to based on the data obtained from the upper bottom in the region including the region different from the 1st actual pattern or the data obtained from the upper bottom of 2nd actual pattern different with the 1st actual pattern on the above-mentioned 2nd；It has been based upon the design data used in the actual pattern for obtaining truth of a matter evidence on the 2nd and using, truth of a matter evidence and dependency relation on the 2nd, has determined correction function；The exposure data used in actual pattern that will be used to obtain truth of a matter evidence on the 2nd is modified based on correction function.
Description
Technical field
The present invention relates to exposure data correcting device, wiring pattern to form system and the manufacture method of circuit board, especially
It is related to the exposure data correcting device of the manufacture of the circuit board for being used in electronic equipment etc., wiring pattern forms system
And the manufacture method of circuit board.
Background technology
With the high performance of electronic equipment, the trend of miniaturization, for the circuit board used in the electronic device
It is required that the densification brought by the graph thinning of wiring pattern.
As for tackling the wiring pattern forming method of such densification brought by the graph thinning of wiring pattern,
Consider to the exposure device of the direct rendering style of the direct irradiation exposing patterns such as photonasty resist laser or UV-LED light
(DI), with will be read by the actual pattern that etching etc. is actually formed with reflected light to carry out and the ratio of former data (design data)
Compared with optical profile type check device (AOI) combination, by the data of the actual finished product after etching be taken into optical type appearance testing dress
Put in (AOI) and feed back to exposure device (DI) method (patent document 1~3).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2005-116929 publications
Patent document 2：Japanese Unexamined Patent Publication 2006-303229 publications
Patent document 3：Japanese Unexamined Patent Publication 2007-033764 publications
The content of the invention
The invention technical task to be solved
As shown in figure 17, actual pattern has the shape of the convex of upper bottom (top) and bottom (bottom), into performance number, example
Circuit width such as wiring pattern (hereinafter sometimes referred to simply as " pattern ") is different in top width 1702 and bottom width 1704.
During the densification of wiring pattern, the error for reducing design load and bottom width is critically important.If use optical profile type outward appearance
Check device (AOI), can relatively easily carry out into performance number measurement, but by AOI measurement into performance number be top width, it is impossible to
Obtain the data of bottom width.Therefore, even if feeding back to DI using AOI measured value and being exposed the amendment of data, also can
Have because of the error caused by top width and the difference of bottom width the problem of.
Although bottom width can be measured by using microscope, due to needing to carry out manually, so needing Pang
Big time of measuring.In the case where reducing measuring point in order to mitigate measurement burden and measuring, filled due to that can not obtain
The sample divided, so there is the problem of can not correctly being fed back.
It is an object of the present invention to provide a kind of exposure data correcting device, wiring pattern to form system and circuit board
Manufacture method, can reduce by go to the bottom (bottom) data manual measurement bring workload while, suppress impression
According to the error of correction, circuit width precision during fine circuits formation is improved.
For solving the technological means of problem
The present invention be in view of above-mentioned problem and make, there is following such feature.That is, a technical scheme of the invention
Exposure data correcting device, obtain truth of a matter evidence on the 1st, the truth of a matter is according to based on from the convex with upper bottom and bottom on the 1st
The data that upper bottom at least one of region of 1st actual pattern obtains, above-mentioned 1st actual pattern be by using based on
Exposure data as the design data used in the wiring pattern of target is carried out obtained from circuit fabrication；Obtain and be based on from above-mentioned
The bottom data for the data that bottom at least one of region of 1st actual pattern obtains；Determine truth of a matter evidence on the above-mentioned 1st
With the dependency relation of above-mentioned bottom data；Obtain truth of a matter evidence on the 2nd, on the above-mentioned 2nd the truth of a matter according to be based on from including with it is the above-mentioned 1st real
Data that the upper bottom in region including the different region at least one of region of border pattern obtains or from the above-mentioned 1st
The data that the upper bottom of the 2nd different actual pattern of actual pattern obtains；It has been based upon and has obtained truth of a matter evidence on the above-mentioned 2nd and use
Design data used in actual pattern, on the above-mentioned 2nd the truth of a matter according to and above-mentioned dependency relation, determine correction function, above-mentioned amendment letter
Number represent cause determined in design data into performance number and actual pattern into the factor of the difference between performance number, with being used for
Suppress the relation of the correction of the difference；Based on above-mentioned correction function, to the reality used to obtain truth of a matter evidence on the above-mentioned 2nd
The exposure data of border patterns is modified.
The present invention can also be that the truth of a matter is based on above-mentioned according to correction data, above-mentioned correction data are included on the above-mentioned 1st
Upper bottom at least one of region of 1st actual pattern measure into performance number, with corresponding to this into performance number above-mentioned
The difference into performance number determined in design data used in 1st actual pattern；Above-mentioned bottom data include correction data, above-mentioned
Correction data based on the bottom at least one of region of above-mentioned 1st actual pattern measure into performance number, with it is right
The difference into performance number determined in the design data used in above-mentioned 1st actual pattern that should be in this into performance number；Bottom on above-mentioned 2nd
Data include correction data, and above-mentioned correction data are based on including at least one of area with above-mentioned 1st actual pattern
Upper bottom in the region in the different region in domain measure into performance number, with corresponding to this into performance number in above-mentioned 1st actual pattern
The difference into performance number determined in design data used, or based in the different from above-mentioned 1st actual pattern the 2nd actual figure
The upper bottom of case measure into performance number, with corresponding to this into performance number in the design data used in above-mentioned 2nd actual pattern certainly
The fixed difference into performance number；Determine that above-mentioned dependency relation includes：Correction data based on the truth of a matter on the above-mentioned 1st in, determine
1st interim correction function；Based on the correction data in above-mentioned bottom data, the 2nd interim correction function is determined；Based on from above-mentioned
Correction that 1st interim correction function obtains and the correction obtained from the 2nd interim correction function corresponding to the correction
Difference, make correction difference function；Determine that above-mentioned correction function includes：Based in order to obtain on the above-mentioned 2nd the truth of a matter according to and make
Truth of a matter evidence in design data and the above-mentioned 2nd used in actual pattern, determines the 3rd interim correction function；Based on above-mentioned amendment
Amount difference function is modified to above-mentioned 3rd interim correction function, determines correction function.
In addition it is also possible to be, truth of a matter evidence is included at least a portion at the upper bottom of above-mentioned 1st actual pattern on the above-mentioned 1st
Region in measure into performance number；Above-mentioned bottom data are included at least one of of the bottom of above-mentioned 1st actual pattern
Measured in region into performance number；The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on including with it is upper
State that the upper bottom in the region including the different region at least one of region of the 1st actual pattern measures into performance number, with
The difference into performance number determined in the design data used in above-mentioned 1st actual pattern corresponding to this into performance number, or be based on
That is measured at the upper bottom of 2nd actual pattern different from above-mentioned 1st actual pattern exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 2nd actual pattern；Determine that above-mentioned dependency relation includes：Determine
1 finished product value function, above-mentioned 1st finished product value function represent to cause determined in design data into performance number and actual pattern into
Relation into performance number of the truth of a matter in the factor of difference between performance number and the above-mentioned 1st；The 2nd finished product value function is determined, it is above-mentioned
2nd finished product value function represent to cause determined in design data into performance number and actual pattern into the difference between performance number
The relation into performance number in the factor and above-mentioned bottom data；Decision is based on above-mentioned 1st finished product value function and the 2nd finished product value function
Difference finished product value difference function；Determine that above-mentioned correction function includes：Based in order to obtain on the above-mentioned 2nd the truth of a matter according to and use
Actual pattern used in design data and the above-mentioned 2nd on truth of a matter evidence, determine interim correction function；Based on above-mentioned finished product value difference point
The above-mentioned interim correction function of function pair is modified, and determines correction function.
And then or, the truth of a matter is based on above-mentioned according to correction data, above-mentioned correction data are included on the above-mentioned 1st
Upper bottom at least one of region of 1st actual pattern measure into performance number, with corresponding to this into performance number above-mentioned
The difference into performance number determined in design data used in 1st actual pattern；Above-mentioned bottom data include correction data, above-mentioned
Correction data based on the bottom at least one of region of above-mentioned 1st actual pattern measure into performance number, with it is right
The difference into performance number determined in the design data used in above-mentioned 1st actual pattern that should be in this into performance number；Bottom on above-mentioned 2nd
Data include correction data, and the correction data are based on including at least one of region with above-mentioned 1st actual pattern
What the upper bottom in the region including different regions was measured schemes into performance number, with corresponding to this into performance number in the above-mentioned 1st reality
The difference into performance number determined in design data used in case, or based on actual the different from above-mentioned 1st actual pattern the 2nd
The upper bottom of pattern measure into performance number, with corresponding to this into performance number in the design data used in above-mentioned 2nd actual pattern
The difference into performance number determined；Determine that above-mentioned dependency relation includes：Determine on the above-mentioned 1st in correction data of the truth of a matter in
The correction shown in the correction shown, the correction data in above-mentioned bottom data with corresponding to the correction being repaiied
Positive quantity correlation function；Determine that above-mentioned correction function includes：Based on the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
Truth of a matter evidence in design data used and the above-mentioned 2nd, determines interim correction function；Based on above-mentioned correction correlation function to above-mentioned
Interim correction function is modified, and determines correction function.
And then or, truth of a matter evidence is included at least a portion at the upper bottom of above-mentioned 1st actual pattern on the above-mentioned 1st
Region in measure into performance number；Above-mentioned bottom data are included at least one of of the bottom of above-mentioned 1st actual pattern
Measured in region into performance number；Truth of a matter evidence is included in including at least one of with above-mentioned 1st actual pattern on above-mentioned 2nd
The upper bottom in region including the different region in region measure into performance number or the different from above-mentioned 1st actual pattern the 2nd
The upper bottom of actual pattern measure into performance number；Determine that above-mentioned dependency relation includes：Determine that the truth of a matter measures on the above-mentioned 1st
Go out into performance number with measuring in data of going to the bottom into performance number into performance number correlation function；Determine that above-mentioned correction function includes：
It is above-mentioned into performance number correlation function based on what is determined, the finished product is corresponded into performance number, calculating in based on the truth of a matter on the above-mentioned 2nd
The guess value into performance number in the bottom of value；Based on used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
Design data in determine into performance number, with corresponding to the difference into performance number in the above-mentioned bottom deduced into performance number,
Determine correction function.
Can also be that what the truth of a matter included on the above-mentioned 1st and the 2nd is based on being obtained by optical type appearance testing device into performance number
The data arrived, above-mentioned bottom data are based on the data obtained by microscope.
Can also be that above-mentioned correction function is each region decision according to the same real estate for being configured with wiring pattern
's.
Can also be that above-mentioned correction function is each upper surface and the following table of the same substrate according to wiring pattern is configured with
What face determined.
Can also be that above-mentioned correction function is determined respectively for the ordinate in wiring pattern and horizontal line.
Possess in addition, the wiring pattern of the present invention forms system：Exposure data manufacturing mechanism, makes based on as target
The exposure data of the design data of wiring pattern；Pattern exposure mechanism, based on exposure data, the photonasty on substrate is configured at
Expose exposing patterns on resist；Developing pattern formation mechanism, the photonasty resist of above-mentioned exposing patterns will be exposed
Development, form developing pattern；Actual pattern formation mechanism, circuit fabrication, shape are carried out to the substrate for foring above-mentioned developing pattern
Into actual pattern；The upper truth of a matter is made based on from the upper bottom at least one of region of above-mentioned actual pattern according to manufacturing mechanism
The upper truth of a matter evidence of obtained data；Go to the bottom data creating mechanism, makes based on from least one of area of above-mentioned actual pattern
The bottom data for the data that bottom in domain obtains；Above-mentioned exposure data correcting device, based on above-mentioned upper truth of a matter evidence, bottom data
And design data, exposure data is modified.
In addition, the technical scheme of the present invention for the program that is modified to exposure data, perform computer：Take
Truth of a matter evidence on the 1st, the truth of a matter is according to based on from least one with upper bottom and the 1st actual pattern of the convex of bottom on the 1st
The process for the data that upper bottom in the region divided obtains, above-mentioned 1st actual pattern is by using based on the wiring as target
The exposure data of the design data of patterns is carried out obtained from circuit fabrication；Obtain based on from above-mentioned 1st actual pattern
The process of the bottom data for the data that bottom at least one of region obtains；Determine on the above-mentioned 1st the truth of a matter according to it is above-mentioned
The process of the dependency relation for data of going to the bottom；The process for obtaining truth of a matter evidence on the 2nd, on the above-mentioned 2nd the truth of a matter according to be based on from including with it is upper
State data that the upper bottom in the region including the different region at least one of region of the 1st actual pattern obtains or from
The data that the upper bottom of the 2nd different actual pattern of above-mentioned 1st actual pattern obtains；It has been based upon and has obtained truth of a matter evidence on the above-mentioned 2nd
And design data used in the actual pattern used, on the above-mentioned 2nd the truth of a matter according to and above-mentioned dependency relation determine the work of correction function
Sequence, above-mentioned correction function represent to cause determined in design data into performance number and actual pattern into the difference between performance number
The factor, with for suppress the difference correction relation；Based on above-mentioned correction function, in order to obtain bottom on the above-mentioned 2nd
The process that data and the exposure data used in the actual pattern that uses are modified.
In addition, the technical scheme of the present invention is used for including the method that exposure data is modified：Obtain bottom on the 1st
Data, the truth of a matter is according to based on from least one of region with upper bottom and the 1st actual pattern of the convex of bottom on the 1st
The obtained process of data in upper bottom, above-mentioned 1st actual pattern is by using based on used in the wiring pattern as target
The exposure data of design data is carried out obtained from circuit fabrication；Obtain based at least a portion from above-mentioned 1st actual pattern
Region in the obtained process of the bottom data of data in bottom；Determine truth of a matter evidence and above-mentioned bottom data on the above-mentioned 1st
The process of dependency relation；The process for obtaining truth of a matter evidence on the 2nd, the truth of a matter is according to being based on from including actual scheming with the above-mentioned 1st on the above-mentioned 2nd
Data that the upper bottom in region including the different region at least one of region of case obtains or from it is the above-mentioned 1st actual
The data that the upper bottom of the 2nd different actual pattern of pattern obtains；It has been based upon the reality for obtaining truth of a matter evidence on the above-mentioned 2nd and using
The design data of patterns, on the above-mentioned 2nd the truth of a matter according to and the above-mentioned dependency relation process that determines correction function, above-mentioned amendment letter
Number represent cause determined in design data into performance number and actual pattern into the factor of the difference between performance number, with being used for
Suppress the relation of the correction of the difference；Based on above-mentioned correction function, to the reality used to obtain truth of a matter evidence on the above-mentioned 2nd
The process that the exposure data of border patterns is modified.
And then the circuit board manufacture method of a technical scheme of the invention includes：Truth of a matter evidence on the 1st is obtained, on the 1st
The truth of a matter is according to based on obtaining from the upper bottom at least one of region with upper bottom and the 1st actual pattern of the convex of bottom
The process of data, above-mentioned 1st actual pattern is by using the exposure based on the design data used in the wiring pattern as target
Light data is carried out obtained from circuit fabrication；Obtain based under from least one of region of above-mentioned 1st actual pattern
The process of the bottom data for the data that bottom obtains；Determine that the truth of a matter is according to the work with the dependency relation of above-mentioned bottom data on the above-mentioned 1st
Sequence；The process for obtaining truth of a matter evidence on the 2nd, the truth of a matter is according to based on from including at least one with above-mentioned 1st actual pattern on the above-mentioned 2nd
Point the different region in region including region in the obtained data in upper bottom or from the different from above-mentioned 1st actual pattern the 2nd
The data that the upper bottom of actual pattern obtains；It has been based upon setting used in the actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using
Count, the process that truth of a matter evidence and above-mentioned dependency relation determine correction function on the above-mentioned 2nd, above-mentioned correction function represents to cause
Determined in design data into the factor in performance number and actual pattern into difference between performance number, with for suppressing the difference
The relation of correction；Based on above-mentioned correction function, in order to obtain the truth of a matter on the above-mentioned 2nd according to and the actual pattern that uses used in
The process that exposure data is modified；The process that wiring pattern is formed based on above-mentioned exposure data.
In addition it is also possible to be, the truth of a matter is based on above-mentioned according to correction data, above-mentioned correction data are included on the above-mentioned 1st
Upper bottom at least one of region of 1st actual pattern measure into performance number, with corresponding to this into performance number above-mentioned
The difference into performance number determined in design data used in 1st actual pattern；Above-mentioned bottom data include correction data, above-mentioned
Correction data based on the bottom at least one of region of above-mentioned 1st actual pattern measure into performance number, with it is right
The difference into performance number determined in the design data used in above-mentioned 1st actual pattern that should be in this into performance number；Bottom on above-mentioned 2nd
Data include correction data, and above-mentioned correction data are based on including at least one of area with above-mentioned 1st actual pattern
Upper bottom in the region in the different region in domain measure into performance number, with corresponding to this into performance number in above-mentioned 1st actual pattern
The difference into performance number determined in design data used, or based in the different from above-mentioned 1st actual pattern the 2nd actual figure
The upper bottom of case measure into performance number, with corresponding to this into performance number in the design data used in above-mentioned 2nd actual pattern certainly
The fixed difference into performance number；Determining the process of above-mentioned dependency relation includes：Correction data based on the truth of a matter on the above-mentioned 1st in
The process for determining the 1st interim correction function；The 2nd interim correction function is determined based on the correction data in above-mentioned bottom data
Process；Based on the correction obtained from above-mentioned 1st interim correction function and corresponding to the correction from the 2nd interim correction function
The process that the difference of obtained correction makes correction difference function；Determining the process of above-mentioned correction function includes：It is based upon
In acquirement the above-mentioned 2nd truth of a matter according to and the actual pattern that uses used in design data and the above-mentioned 2nd on the truth of a matter according to determining that the 3rd faces
When correction function process；Above-mentioned 3rd interim correction function is modified based on above-mentioned correction difference function, determines amendment
The process of function.
Can also be that truth of a matter evidence is included at least one of region at the upper bottom of above-mentioned 1st actual pattern on the above-mentioned 1st
In measure into performance number；Above-mentioned bottom data are included at least one of region of the bottom of above-mentioned 1st actual pattern
Measure into performance number；The truth of a matter is according to including correction data on above-mentioned 2nd, and the correction data are based on including with the above-mentioned 1st
The upper bottom in region including the different region at least one of region of actual pattern measure into performance number, with corresponding to
This into performance number the difference into performance number determined in the design data used in above-mentioned 1st actual pattern, or based on it is upper
State that the upper bottom of the 2nd different actual pattern of the 1st actual pattern measures into performance number, with corresponding to this into performance number above-mentioned the
The difference into performance number determined in design data used in 2 actual patterns；Determining the process of above-mentioned dependency relation includes：Determine
The process of 1 finished product value function, above-mentioned 1st finished product value function represent to cause determined in design data into performance number and actual pattern
In into the difference between performance number the factor, with the above-mentioned 1st on the truth of a matter according in the relation into performance number；Determine the 2 one-tenth performance number letters
Several processes, above-mentioned 2nd finished product value function represent to cause determined in design data into the finished product in performance number and actual pattern
The relation into performance number in the factor of difference between value and above-mentioned bottom data；Determine based on above-mentioned 1st finished product value function with
The process of the finished product value difference function of the difference of 2nd finished product value function；Determining the process of above-mentioned correction function includes：Based in order to
Truth of a matter evidence, decision are repaiied temporarily in the design data and the above-mentioned 2nd used in actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using
The process of positive function；It is modified based on the above-mentioned interim correction function of above-mentioned finished product value difference point function pair, determines correction function
Process.
Can also be that the truth of a matter is based on real the above-mentioned 1st according to correction data, above-mentioned correction data are included on the above-mentioned 1st
Measure into performance number and real the above-mentioned 1st into performance number corresponding to this at upper bottom at least one of region of border pattern
The difference into performance number determined in the design data of border patterns；Above-mentioned bottom data include correction data, above-mentioned amendment
Amount data based on the bottom at least one of region of above-mentioned 1st actual pattern measure into performance number, with corresponding to
The difference into performance number determined in the design data used in above-mentioned 1st actual pattern into performance number；Truth of a matter evidence on above-mentioned 2nd
Including correction data, the correction data are based on including different from least one of region of above-mentioned 1st actual pattern
Region including region in upper bottom measure into performance number, with corresponding to this into performance number in above-mentioned 1st actual pattern institute
The difference into performance number determined in design data, or based in 2nd actual pattern different from above-mentioned 1st actual pattern
Upper bottom measure into performance number, with being determined corresponding to this into performance number in the design data used in above-mentioned 2nd actual pattern
The difference into performance number；Determining the process of above-mentioned dependency relation includes：Determine correction data of the truth of a matter on the above-mentioned 1st
In show correction, with corresponding to the correction shown in the correction data in above-mentioned bottom data of the correction
The process of correction correlation function；Determining the process of above-mentioned correction function includes：Based in order to obtain on the above-mentioned 2nd the truth of a matter according to and
Truth of a matter evidence, the process for determining interim correction function in the design data and the above-mentioned 2nd used in actual pattern used；Based on above-mentioned
The process that correction correlation function was modified, determined correction function to above-mentioned interim correction function.
Can also be that truth of a matter evidence is included at least one of region at the upper bottom of above-mentioned 1st actual pattern on the above-mentioned 1st
In measure into performance number；Above-mentioned bottom data are included at least one of region of the bottom of above-mentioned 1st actual pattern
Measure into performance number；Truth of a matter evidence is included in including at least one of region with above-mentioned 1st actual pattern not on above-mentioned 2nd
What the upper bottom in region including same region was measured schemes into performance number or in the 2nd reality different from above-mentioned 1st actual pattern
The upper bottom of case measure into performance number；Determining the process of above-mentioned dependency relation includes：Determine that the truth of a matter measures on the above-mentioned 1st
The process into performance number correlation function into performance number measured into performance number and in data of going to the bottom gone out；Determine above-mentioned correction function
Process include：Based on determined it is above-mentioned into performance number correlation function, based on the truth of a matter on the above-mentioned 2nd in into performance number, calculate
Corresponding to the process of the guess value into performance number in the bottom into performance number；Based in order to obtain on the above-mentioned 2nd the truth of a matter according to and
Determined in the design data used in actual pattern used into performance number with corresponding to this into the above-mentioned bottom deduced of performance number
In into performance number difference, determine correction function process.
Can also be that what the truth of a matter included on the above-mentioned 1st and the 2nd is based on being obtained by optical type appearance testing device into performance number
The data arrived, above-mentioned bottom data are based on the data obtained by microscope.
Can also be that above-mentioned correction function is each region decision according to the same real estate for being configured with wiring pattern
's.
Can also be that above-mentioned correction function is each upper surface and the following table of the same substrate according to wiring pattern is configured with
What face determined.
Can also be that above-mentioned correction function is determined respectively for the ordinate in wiring pattern and horizontal line.
The circuit board manufacture method of the technical scheme of the present invention includes：Make based on the wiring pattern as target
The process of the exposure data of design data；Expose exposure based on exposure data, on the photonasty resist being configured on substrate
The process of light pattern；By the photonasty resist development for having exposed above-mentioned exposing patterns, the process for forming developing pattern；To shape
Substrate into above-mentioned developing pattern carries out circuit fabrication, the process for forming the 1st actual pattern；Make from the above-mentioned 1st actual figure
The process of truth of a matter evidence on the 1st of the data that upper bottom at least one of region of case obtains；Make and be based on from the above-mentioned 1st in fact
The process of the bottom data for the data that bottom at least one of region of border pattern obtains；Determine the truth of a matter on the above-mentioned 1st
According to the process of the dependency relation with above-mentioned bottom data；The process for making truth of a matter evidence on the 2nd, on the above-mentioned 2nd the truth of a matter according to be based on from
Data that upper bottom in region including the region different from least one of region of above-mentioned 1st actual pattern obtains or
The data obtained from the upper bottom of 2nd actual pattern different from above-mentioned 1st actual pattern；It has been based upon and has obtained bottom on the above-mentioned 2nd
Data and design data used in the actual pattern that uses, on the above-mentioned 2nd the truth of a matter according to and above-mentioned dependency relation, determine correction function
Process, above-mentioned correction function represent to cause determined in design data into performance number and actual pattern between performance number
The relation of correction of the factor of difference with being used for suppressing the difference；Based on above-mentioned correction function, in order to obtain on the above-mentioned 2nd
The truth of a matter according to and the actual pattern that uses used in the process that is modified of exposure data；Based on above-mentioned revised exposure data shape
Into the process of wiring pattern.
Invention effect
In accordance with the invention it is possible to provide a kind of exposure data correcting device, wiring pattern formation system and circuit board
Manufacture method, while the workload brought by the manual measurement of bottom data is reduced, the upper truth of a matter can be based on according to (AOI is surveyed
Measure data) suppress the margin of error of exposure data correction, raising fine circuits with the dependency relations of the bottom data of actual pattern
Circuit width precision during formation.
Brief description of the drawings
Fig. 1 represents that the wiring pattern of embodiments of the present invention forms the skeleton diagram of system.
Fig. 2 represents the hardware structure diagram of the exposure data correcting device of embodiments of the present invention.
Fig. 3 represents the flow chart of the exposure data modification method of an embodiment of the invention.
Fig. 4 represents the flow chart of the exposure data amendment process of an embodiment of the invention.
Fig. 5 represents the flow chart of the exposure data amendment process of an embodiment of the invention.
Fig. 6 represents the interim correction function of an embodiment of the invention.
Fig. 7 represents the interim correction function and correction function of an embodiment of the invention.
Fig. 8 represents the flow chart of the exposure data amendment process of an embodiment of the invention.
Fig. 9 represents the finished product value function of an embodiment of the invention.
Figure 10 represents the interim correction function and correction function of an embodiment of the invention.
Figure 11 represents the flow chart of the exposure data amendment process of an embodiment of the invention.
Figure 12 represents the correction correlation function of an embodiment of the invention.
Figure 13 represents the interim correction function and correction function of an embodiment of the invention.
Figure 14 represents the flow chart of the exposure data amendment process of an embodiment of the invention.
Figure 15 represent an embodiment of the invention into performance number correlation function.
Figure 16 represents the correction function of an embodiment of the invention.
Figure 17 represents the skeleton diagram of the cross sectional shape of actual pattern.
Embodiment
[the 1st embodiment]
Figure 1 illustrates the structure chart that the wiring pattern of an embodiment of the invention forms system 100.Wiring pattern
Formation system 100 possesses：Design data producing device 101, exposure data producing device 102, exposure device 104, developing pattern
Producing device 106, actual pattern producing device 108, upper bottom and bottom data creating device 110 and exposure data amendment dress
Put 112.
Design data producing device 101 is the device for making design data, in the present embodiment using CAD
(Computer Aided Design).The wiring pattern number for the target that the design data (former data) of wiring pattern will be formed
Represented according to change, such as with coordinate and circuit width.There can also be the data that addition of the required information of exposure.In the present invention
In, arbitrary wiring pattern can be used.
Exposure data producing device 102 is the device that exposure data is made from design data, used here as CAM
(Computer Aided Manufacturing).Exposure device 104 is based on the exposure made by exposure data producing device 102
Light data, the device on the photonasty resist being configured on substrate exposing exposing patterns.Swash it is, for example, possible to use utilizing
Light or UV-LED light directly make the direct drawing apparatus (DI of photonasty anti-aging drug exposing patterns：Direct Imaging).
Exposure data is to make photonasty resist sense for the exposure device of the drawing line device by using laser or UV light etc. etc.
Light and the data for forming exposing patterns corresponding with wiring pattern.
So-called photonasty resist, refer to the metal foil etching of copper foil etc. is being formed into wiring pattern by using photoetching process
When use anti-etching dose.So-called exposing patterns, refer to the pattern for exposing on photonasty resist based on exposure data, it is right
The developing pattern that Ying Yu is formed by development afterwards.Developing pattern producing device 106 is will to expose the photosensitive of exposing patterns
Property resist development and form the device of developing pattern.
Actual pattern producing device 108 is to form actual pattern to foring the substrate progress circuit fabrication of developing pattern
Device.Such as Etaching device can be used.So-called circuit fabrication, refer to form actual pattern, such as can enumerate with subduction
Metal foil is etched and forms wiring pattern by method.Actual pattern can be formed by actual pattern formation mechanism.So-called actual pattern,
Refer to carry out circuit formation and the wiring pattern that is actually formed, such as obtained from can enumerating and being etched metal foil with relief method
Wiring pattern.
Upper bottom and bottom data creating device 110 are the seats for making upper bottom (top) and bottom (bottom) by actual pattern
Mark and the device of the data represented into performance number of circuit width, gap width etc..In the present embodiment, in order to make the upper truth of a matter
According to and using optical type appearance testing device (AOI：Automatic Optical Inspection).AOI can be used for detecting
Its pattern is quantized from the light that the upper bottom (top) of actual pattern is reflected, made with coordinate and circuit width, gap width
Deng into performance number represent data.In addition, in order to make bottom data, the metallurgical microscopes with measurement function can be used
(sometimes referred to simply as " microscope ").Here, upper bottom and bottom data creating device 110 accept using the bottom being measured microscopically into
The input of performance number, bottom data are made based on it.
Exposure data correcting device 112 obtain by upper bottom and bottom data creating device 110 produce the 1st on truth of a matter evidence
And bottom data, determine the dependency relation of truth of a matter evidence and bottom data on the 1st.And then obtain by upper bottom and bottom data creating
Device 110 is producing, based on the region including comprising the region different from least one of region of the 1st actual pattern
In the obtained data in upper bottom or obtained from the upper bottom of 2nd actual pattern different from the 1st actual pattern the 2nd of data on bottom
Data.Also, be based upon obtain the truth of a matter on the 2nd according to and the actual pattern that uses used in design data, on the 2nd the truth of a matter according to and
The dependency relation determined, determine to represent to determine in design data into performance number and actual pattern into causing difference between performance number
The correction function of the factor divided, the relation of the correction with being used for suppressing the difference, it will be used to obtain truth of a matter evidence on the 2nd
Actual pattern used in exposure data be modified based on correction function.
Determined in design data into performance number and actual pattern into the factor for causing difference between performance number, refer to setting
In the wiring pattern specification counted, make to determine in design data into performance number and actual pattern into performance number by its skew
Between difference produce change the factor.As such factor, such as the pattern of the design data of actual pattern can be enumerated
The group of any or any more than 2 of gap, pattern dimension, pattern thickness, pattern position, pattern density, pattern form etc.
Close.In the present embodiment, the figure of wiring pattern is used as the factor for producing actual pattern data and the difference of former data
Case gap (here, being the gap of line and line).So-called correction function, it is that regulation produces the factor of difference and for suppressing difference
The function of the relation of the correction of exposure data.
As exposure data correcting device 112, in the present embodiment, the meter for possessing the hardware configuration shown in Fig. 2 is used
Calculation machine 200.Computer 200 possesses processing unit (processor) 201, display part 202, input unit 203, storage part 204, communication unit
205 and the bus 210 that connects these each constituent parts.Display part 202 shows the program by being performed in computer 200
The image of output.Input unit 203 accepts the input from user, e.g. keyboard or mouse.As long as storage part 204 is non-volatile
Property memory or volatile memory, hard disk etc. can protect stored device, be that what kind of form can.In storage part
Preserved in 204 for performing the program 206 for the process of exposure data amendment.Communication unit 205 carries out radio communication or made
With the wire communication of Ethernet (registration mark) cable, USB cable etc..Can also be obtained via communication unit 205 by upper bottom and under
The upper truth of a matter evidence and bottom data that the truth of a matter is produced according to producing device 110.If program 206 is performed, processing unit (processing
Device) 201 perform process for exposure data amendment.Exposure data correcting device 112 needs not be all-purpose computer, can also
By being realized for performing the software of all or part of hardware of each operation and conjunction with which action.
The motion flow of the system of present embodiment is represented in figure 3.First, design data producing device 101, which makes, uses
In the design data (process 301) of the 1st actual pattern, based on the design data, exposure data producing device 102 makes impression
According to (process 302).Exposure device 104 is being configured at substrate based on the exposure data produced by exposure data producing device 102
On photonasty resist on expose exposing patterns (process 304).Developing pattern producing device 106 will expose exposing patterns
Photonasty resist development, formed developing pattern (process 306), actual pattern producing device 108 is to foring developing pattern
Substrate carry out circuit fabrication, formed the 1st actual pattern (process 308).Upper bottom and bottom data creating device 110 make the 1st
Upper bottom and bottom data (process 310).Made on the 2nd in the case of truth of a matter evidence, here according to the upper bottom of the 1st actual pattern
Make truth of a matter evidence on the 2nd.In addition it is also possible to using the overall data obtained from the 1st actual pattern as the 2nd on truth of a matter evidence, will
One part is as truth of a matter evidence on the 1st.
It is determined whether need to make the 2nd actual pattern (process 312) for exposure data amendment.For example, from
The upper bottom of 1st actual pattern is obtained on the 2nd in the case of truth of a matter evidence, it is not necessary to makes the 2nd actual pattern.If it is required, then return
To design data production process 301, carry out same process and form the 2nd actual pattern, it is actual that the 2nd is made in process 310
The upper truth of a matter evidence of pattern.The bottom data of the 2nd actual pattern are not made.In the feelings for the upper truth of a matter evidence for not making the 2nd actual pattern
Under condition or after the 2nd actual pattern is made, data correction process 314 is exposed, is terminated for the dynamic of exposure data amendment
Make flow.Then, based on revised exposure data, such as exposure device 104, developing pattern producing device 106, reality are used
Design producing apparatus 108 forms wiring pattern, manufactures circuit board.
In Fig. 4, exposure data amendment process 314 is further illustrated.First, exposure data correcting device 112 obtains
By upper bottom and bottom data creating device 110 it is making, based on from the upper bottom at least one of region of the 1st actual pattern
The truth of a matter is obtained based on from least one of region of the 1st actual pattern according to (process 401) on the 1st of obtained data
The bottom data (process 402) for obtained data of going to the bottom, determine the dependency relation (process of truth of a matter evidence and bottom data on the 1st
404).And then exposure data correcting device 112 obtain by upper bottom and bottom data creating device 110 it is making, based on from comprising
Data that the upper bottom in region including the region different from least one of region of the 1st actual pattern obtains or from
The truth of a matter is according to (process 406) on the 2nd of the data that the upper bottom of the 2nd different actual pattern of 1 actual pattern obtains.Also, it is based upon
Obtain the truth of a matter on the 2nd according to and the actual pattern that uses used in design data, on the 2nd the truth of a matter according to and process 404 in make
The dependency relation gone out, determine to represent to determine in design data into performance number and actual pattern into causing difference between performance number
The factor and for suppressing the correction function of the relation of the correction of the difference (process 408), will in order to obtain on the 2nd the truth of a matter according to and
The exposure data used in actual pattern used is based on correction function amendment (process 410).
The bottom data and the dependency relation of the upper truth of a matter evidence obtained from upper bottom obtained from bottom depend on pattern interval, figure
Case size, the thickness of pattern, pattern position, pattern density, pattern form etc..Thus, after dependency relation is determined, for
Same pattern interval etc., by the way that its dependency relation is applied into truth of a matter evidence in the others obtained by AOI data, it is not necessary to manually
Measurement and this other upper truth of a matter are according to corresponding new bottom into performance number, it becomes possible to which correctly supposition is gone to the bottom data.Also, pass through
Based on the bottom data creating correction function that this is deduced, the error of exposure data correction can be suppressed, improve fine circuits
Circuit width precision during formation.
Correction function changes according to the region on the substrate for obtaining data.On the other hand, upper truth of a matter evidence and bottom data
Dependency relation comparatively will not according to obtain data substrate on region and change.Therefore, by will for example determine
Determine truth of a matter evidence and the measurement gone to the bottom used in data on the 1st of dependency relation only in the region being defined of the 1st actual pattern to enter
OK, dependency relation is determined with less workload, it is overall from the 1st actual pattern by the way that the dependency relation determined is applied to
Using AOI obtain the 2nd on truth of a matter evidence, for the 1st actual pattern its own, can also be examined while workload is mitigated
The more accurate correction function of the overall trend of substrate is considered.
Sometimes dependency relation and correction function change according to the region on substrate, so can also be connected up according to being configured with
Each region of the same real estate of pattern determines dependency relation and correction function.Design data and the relation into performance number, even if
It is on same substrate, can also turns into special relation in some regions.For example, because in the center of substrate, nearby etching solution is easy
Accumulating, etching speed is slower, so the trend for thering is pattern interval to narrow, due to very fast in substrate periphery etching speed, so having
The trend that pattern interval broadens.In addition, in substrate corners, due to the current convergence when forming copper film by plating, so there is copper
The dependency relation of the thickening trend of film, upper truth of a matter evidence and data of going to the bottom may be different from other regions.Therefore, by same
Each region of real estate determines dependency relation and correction function in the embodiment, can carry out the higher circuit shape of precision
Into.
In addition it is also possible to correction function is distinguished according to the upper surface for the same substrate for being configured with wiring pattern and lower surface
Determine.Same with the region of real estate, dependency relation and correction function are different sometimes.For example, upper surface due to etching solution compared with
Easily accumulate and etching speed is slower, so the trend for thering is pattern interval to narrow, in lower surface, because etching speed is very fast,
So trend for thering is pattern interval to broaden.Therefore, by each upper surface and lower surface to same real estate according to this implementation
Mode determines dependency relation and correction function, can form the higher circuit of precision and be formed.
Further, since there is the situation different from the relation into performance number of the design data in wiring pattern, so can also be right
Ordinate and horizontal line in wiring pattern determine correction function respectively.
[the 2nd embodiment]
The 2nd embodiment of the present invention is illustrated below.The difference of present embodiment and the 1st embodiment exists
In instead of the process 314 (Fig. 3, Fig. 4) of the 1st embodiment using process 500 (Fig. 5), other, which are put with the 1st embodiment, is
Same.In the following description, the part different from the 1st embodiment is only illustrated, same part is omitted.
For the ease of understand invent, take it is following in case of illustrate：Prepare to have on the insulating layer as substrate
There is the thickness 0.22mm of 5 μm of copper foil MCL-E-700G (Hitachi Chemical Co., Ltd.'s system, trade name) copper-surfaced plywood, use
About 19 μm of coating is implemented in electro-coppering, makes copper thick by half-etching (being used for that the thick whole facet etch processing of the overall copper of substrate is thinned)
As about 18 μm, using as the test pattern exposure of the 1st actual pattern, carry out circuit and formed, make dependency relation extraction base
Plate.
In the present embodiment, on the 1st made in process 310 the truth of a matter according to include based in the 1st actual pattern extremely
Upper bottom at least part of region measure into performance number with corresponding to this into performance number in the design used in the 1st actual pattern
The correction data of the difference into performance number determined in data, bottom data are included based at least one of the 1st actual pattern
Point region in bottom measure into performance number with correspond to this into performance number in the design data used in the 1st actual pattern
The correction data of the difference into performance number determined.
In the present embodiment, the gap width of wiring pattern is used as into performance number, but for ability technology people
For member, using circuit width etc. other into performance number in the case of, it is clear that can similarly implement the present invention.In following explanation
Other embodiments in similarly.
Here, in the corner of the 1st actual pattern and the defined region in center, the relief width on bottom in AOI measurements is used
Degree, calculate by measure respective gap width coordinate at the difference of gap width that determines of design data, as amendment
Measure data.Equally, the correction as bottom data, the corner for being measured microscopically the 1st actual pattern and the regulation in center are used
Region lower bottom gap width, calculate and measure the gap width with design data at the coordinate of each gap width
Difference, as correction data.Here, suppose that it is identical area to carry out for the region of the measurement of upper bottom and data of going to the bottom
Domain.By being compared between the data obtained from identical region, more accurate upper truth of a matter evidence and data of going to the bottom can be obtained
Dependency relation.
From truth of a matter evidence on the 1st that the dependency relation extraction substrate manufacture obtained based on above-mentioned condition is gone out and data of going to the bottom
Correction data are as follows.
[table 1]
CAD data in table 1 represents gap (clearance) width (μm) determined in design data.The finished product of AOI measurements
Value represents the corner and center of the test pattern obtained by AOI measurements corresponding with the gap width determined in design data
The gap width (μm) at the upper bottom in region, correction are the gap width (μm) and the gap width of AOI measurements of CAD data
The 1/2 of difference.Being set to 1/2 purpose is, the correction applied to the both ends in gap.It is also same on being measured microscopically.
What is be measured microscopically represents to pass through the bottom in the corner for the test pattern for being measured microscopically to obtain and middle section into performance number
Gap width, correction are the 1/2 of the difference of the gap width of CAD data and the gap width being measured microscopically.For example, CAD
Data=20, AOI measurement into performance number=44.1, be measured microscopically into performance number=28.4, it is meant that as design should be 20 μm
Gap, but the gap width on the upper bottom measured by AOI is 44.1 μm, is by the gap width being measured microscopically out
28.4μm.Also, if based on AOI measurements into performance number, then the gap of CAD data should correct 12.0 μm at both ends, if base
In being measured microscopically, then 4.2 μm should be corrected.
Then, exposure data correcting device 112 is obtained by upper truth of a matter evidence and bottom data creating device 110 in process 310
In produce the 1st on the truth of a matter according to and bottom data (process 501,502), the correction data based on truth of a matter evidence on the 1st determine
1st interim correction function (process 504), the correction data based on bottom data determine the 2nd interim correction function (process
506), based on from the correction that the 1st interim correction function obtains with being obtained corresponding to the correction from the 2nd interim correction function
Correction difference (offset) make correction difference function (process 508).
In the present embodiment, the 1st interim correction function is represented in the design data for being represented in table 1 and Fig. 6
Gap width, correction for AOI measurement gap width function (AOI measurement correction functions (etch plot)), the 2nd faces
When correction function be to represent the letter for gap width, for being measured microscopically gap width the correction in design data
Number (being measured microscopically correction function).Here, if the pass in the gap and correction in each design data represented in table 1 and Fig. 6
It is for respective interim correction function, but the approximate expression based on measurement data can also be passed through and determine interim correction function.Also,
Correction difference function is represented according to being repaiied from the 1st for the gap width in the design data that is represented in table 1 and Fig. 6 temporarily
The difference of correction of the correction that positive function obtains with being obtained according to the 2nd interim correction function for corresponding to the correction is (inclined
Shifting amount) function.It is same with interim correction function, gap and offset in each design data that will be represented in table 1 and Fig. 6
Relation is set to correction difference function, but can also determine correction difference function by the approximate expression based on measurement data.
Then, truth of a matter evidence on the 2nd is obtained in process 510.In the present embodiment, on the 2nd the truth of a matter according to including：Based on
The upper bottom in region including the region different from least one of region of the 1st actual pattern measure into performance number
With the correction data corresponding to the difference into performance number determined in the design data used in the 1st actual pattern into performance number,
Or based on measured at the upper bottom of 2nd actual pattern different from the 1st actual pattern into performance number with corresponding to this into performance number
The difference into performance number determined in the design data used in the 2nd actual pattern correction data.
Also, based on the truth of a matter in the design data and the 2nd used in the actual pattern used to obtain truth of a matter evidence on the 2nd
According to, determine the 3rd interim correction function (process 512), the 3rd interim correction function is modified based on correction difference function and
Correction function (process 514) is determined, (process 516) is modified to exposure data based on the correction function.
Here, if on the 2nd the truth of a matter according to comprising：It is whole based on the actual pattern in the corner including the 1st actual pattern and center
Upper bottom in body measure into performance number with being determined corresponding to this into performance number in the design data used in the 1st actual pattern
Into the correction data of the difference of performance number.Thus, the actual pattern used to obtain truth of a matter evidence on the 2nd is the 1st actual figure
Case.
From the correction data of truth of a matter evidence on the 2nd that the dependency relation extraction substrate manufacture obtained based on above-mentioned condition is gone out
It is as follows.
[table 2]
CAD data in table 2 represents the gap width (μm) determined in design data.The correction of AOI measurements is logical
The gap width (μm) crossed on the upper bottom for the test pattern that AOI measurements obtain and the difference of the gap width (μm) of CAD data
1/2.Offset is the offset (difference for being used for the correction and the correction for being measured microscopically of AOI measurements) of table 1.
In present embodiment, correction difference function is represented for the inclined of the gap width in the design data that is represented in table 2 and Fig. 7
The function of shifting amount.
In the present embodiment, the 3rd interim correction function is represented in the design data for being represented in table 2 and Fig. 7
Correction gap width, for AOI measurement gap width function (AOI measurement correction function (etch plot)).And
And by the way that the 3rd interim correction function is entered into line displacement to correct with correction difference function (offset).Here, by from right
In each design data it is gap width, subtract offset for the corrections of AOI measurements and obtain correction function.Correction function is
Represent the function of the revised correction (correction after the skew of table 2) for the gap width in design data.Here,
The relation of correction after skew for the gap width in the design data that is represented in table 2 and Fig. 7 is set to correction function, but
Correction function can also be determined by the approximate expression based on measurement data.
In the present embodiment, on the 2nd the truth of a matter according to based on the actual pattern in the corner including the 1st actual pattern and center
The finished product that upper bottom in entirety is measured is worth to, but can also be only set to not include to obtain truth of a matter evidence on the 1st and be used
The 1st actual pattern corner and center part, can also be based in 2nd actual pattern different from the 1st actual pattern
Upper bottom measure into performance number.In other embodiments similarly.
[embodiment 3]
The 3rd embodiment of the present invention is illustrated below.The difference of present embodiment and the 1st embodiment exists
In, instead of the process 314 (Fig. 3, Fig. 4) of the 1st embodiment using process 800 (Fig. 8), but other points and the 1st embodiment party
Formula is same.In the following description, only illustrate the part different from the 1st embodiment, omit same part.In addition,
Said so that the dependency relation by being made with the condition identical condition illustrated in the 2nd embodiment carries drawn substrate as an example
It is bright.
In the present embodiment, the truth of a matter is according to the upper bottom for being included in the 1st actual pattern on the 1st made in process 310
That is measured at least one of region is included at least a portion of the bottom of the 1st actual pattern into performance number, bottom data
Region in measure into performance number.In the defined region in the corner of the 1st actual pattern and center, the relief width on upper bottom
Degree is using truth of a matter evidence in AOI measurements, as data of going to the bottom, similarly measured using microscope the 1st actual pattern corner and in
Gap width on the bottom in the defined region of centre.
Exposure data correcting device 112 obtains to be made by upper truth of a matter evidence and bottom data creating device 110 in process 310
On the 1st gone out the truth of a matter according to and bottom data (process 801,802), determine to represent to determine in design data into performance number and reality
1st finished product value function of the relation into performance number into the truth of a matter in the factor and the 1st for cause between performance number difference in pattern
(process 804), determine to represent to determine in design data into performance number and actual pattern into causing difference between performance number
The factor and bottom data the relation into performance number the 2nd finished product value function (process 806), determine based on the 1st finished product value function with
The finished product value difference function (process 808) of the difference of 2nd finished product value function.Thus, the phase of truth of a matter evidence and bottom data in decision
Pass relation.
From truth of a matter evidence on the 1st that the dependency relation extraction substrate manufacture obtained based on above-mentioned condition is gone out and bottom data
Finished product Value Data it is as follows.
[table 3]
Same with table 1, the CAD data in table 3 represents the gap width (μm) determined in design data, AOI measurements and
It is microscopical to represent test pattern corresponding with the gap width determined in design data, being obtained by measurement into performance number
The gap width (μm) at upper bottom and bottom in corner and middle section.In table 3 measure into performance number use with shown in table 1
Identical value.Between difference corresponds to the gap width of the AOI measurements of the gap width of each CAD data and is measured microscopically
Behind the 1/2 of the difference of gap width.For example, the measurement of CAD data=20, AOI into performance number=44.1, be measured microscopically into performance number=
28.4, it is meant that although should be 20 μm of gap as design, the gap width in the upper bottom measured by AOI is
44.1 μm, be 28.4 μm by the gap width being measured microscopically out.Also, AOI measurements are into performance number and are measured microscopically finished product
The difference of value is 15.7, as the value that its 1/2 value rounds up, obtains finished product value difference=7.8 μm.
In the present embodiment, the 1st finished product value function is represented between in the design data that is represented in table 3 and Fig. 9
The function (AOI measurement finished products value function) into performance number of the AOI measurement gap width of gap width, the 2nd finished product value function is to represent
(performance number letter is measured microscopically into for the function into performance number for being measured microscopically gap width of the gap width in design data
Number).Here, the gap in each design data that will be represented in table 3 and Fig. 9 is set to respective into performance number with the relation into performance number
Function, but finished product value function can also be determined by the approximate expression based on measurement data.Also, finished product value difference function is to represent
AOI measurements for the gap in each design data for being represented in table 3 and Fig. 9 are into performance number and the difference for being measured microscopically into performance number
Function.It is same with finished product value function, finished product will be measured for the AOI in the gap in each design data for being represented in table 3 and Fig. 9
The relation of difference for being worth and being measured microscopically into performance number is set to finished product value difference function, but can also be by based on measurement data
Approximate expression determines finished product value difference function.
Then, in process 810, truth of a matter evidence on the 2nd is obtained.In the present embodiment, on the 2nd the truth of a matter according to including correction
Data, above-mentioned correction data are based on including the region different from least one of region of the 1st actual pattern
Upper bottom in region measure into performance number with being determined corresponding to this into performance number in the design data used in the 1st actual pattern
The difference into performance number correction data or measured at the upper bottom of 2nd actual pattern different from the 1st actual pattern into
Performance number and the difference into performance number determined in the design data used in the 2nd actual pattern corresponding to this into performance number.
Also, based on the truth of a matter in the design data and the 2nd used in the actual pattern used to obtain truth of a matter evidence on the 2nd
According to interim correction function (process 812) is determined, above-mentioned interim correction function is modified based on finished product value difference function, determined
Correction function (process 814).
Here, on the 2nd the truth of a matter according to use and the 2nd embodiment identical data.From the correlation obtained based on above-mentioned condition
Relation extraction substrate manufacture go out the 2nd on the truth of a matter according in correction data (AOI measurements) as shown in table 4, this with shown in table 2
It is identical.
[table 4]
In the present embodiment, interim correction function is represented between in the design data that is represented in table 4 and Figure 10
The function (AOI measurement correction functions (etch plot)) of the correction for AOI measurement gap width of gap width.Also, will
The interim correction function with finished product value difference function by being offset to correct.Here, by from the gap for each design data
Value is used in the correction of AOI measurements subtract finished product value difference (offset) and obtain correction function.Correction function is to represent pair
The function of the revised correction of gap width in design data.Here, by the design for being represented in table 4 and Figure 10
The relation of correction is set to correction function after the skew of gap width in data, but can also be by based on the near of measurement data
Correction function is determined like formula.
[embodiment 4]
The 4th embodiment of the present invention is illustrated below.The difference of present embodiment and the 1st embodiment exists
In instead of the process 314 (Fig. 3, Fig. 4) of the 1st embodiment using process 1100 (Figure 11), but other points are implemented with the 1st
Mode is same.In the following description, the part different from the 1st embodiment is only illustrated, same part is omitted.This
Outside, take to enter exemplified by carrying drawn substrate by the dependency relation made with the condition identical condition illustrated in the 2nd embodiment
Row explanation.
In the present embodiment, truth of a matter evidence includes correction data, above-mentioned correction on the 1st made in process 310
Data based on the upper bottom at least one of region of the 1st actual pattern measure into performance number with corresponding to this into performance number
The difference into performance number determined in the design data used in the 1st actual pattern；Bottom data include correction data, above-mentioned
Correction data are somebody's turn to do based on what the bottom at least one of region of the 1st actual pattern was measured into performance number with corresponding to
Into the difference into performance number determined in the design data used in the 1st actual pattern of performance number.
The truth of a matter is according to correction data on 2nd, and above-mentioned correction data are based on including at least one with the 1st actual pattern
Point the different region in region including region in upper bottom measure into performance number with it is actual the 1st into performance number corresponding to this
The difference into performance number determined in the design data of patterns, or based in 2nd actual pattern different from the 1st actual pattern
Upper bottom measure into performance number with corresponding to this into performance number the finished product determined in the design data used in the 2nd actual pattern
The difference of value.
Exposure data correcting device 112 obtains to be made by upper truth of a matter evidence and bottom data creating device 110 in process 310
Truth of a matter evidence and bottom data (process 1101,1102) on the 1st gone out, determine table in the correction data on the 1st in truth of a matter evidence
The correction shown and the correction phase corresponding to the correction represented in the correction data in data of going to the bottom of the correction
Close function (process 1104).Thus, the dependency relation of truth of a matter evidence and bottom data in decision.
Also, obtaining on the 2nd after truth of a matter evidence (process 1106), based on the reality used to obtain truth of a matter evidence on the 2nd
Truth of a matter evidence in the design data of border patterns and the 2nd, interim correction function (process 1108) is determined, based on correction correlation letter
Interim correction function is modified by number, determines correction function (process 1110), and exposure data is carried out based on the correction function
Correct (process 1112).
From truth of a matter evidence on the 1st that the dependency relation extraction substrate manufacture obtained based on above-mentioned condition is gone out and bottom data
Correction data be to associate and be shown in Table 1 below such with embodiment 2.It will be surveyed in Figure 12 in table 1 based on microscope
The correction of amount is expressed as curve map relative to the relation of the correction measured based on AOI.If for example, viewing CAD data=
20 row, then correction=12.1 based on AOI measurements, in contrast, based on correction=4.2 being measured microscopically.Herein
In the case of, the coordinate of description (x, y)=(12.1,4.2).After carrying out the processing to whole data, phase is determined by approximate expression
Close relational expression.Here, dependency relation formula is determined by linear approximation, y=1.2861x- is obtained as correction correlation function
10.563。
It is as follows from correction data of the truth of a matter on the 2nd that dependency relation extraction substrate manufacture goes out in.If it is based on
The correction of AOI measurements is x, and by being updated in above-mentioned correction correlation function (y=1.2861x-10.563), calculating is repaiied
Correction y after just.
[table 5]
In the present embodiment, interim correction function is to represent the gap in the design data shown in table 5 and Figure 13
The function (AOI measurement correction functions (etch plot)) of the correction for AOI measurement gap width of width.Also, pass through
Interim correction function is modified with correction correlation function, obtains correction function.Correction function is represented for designing number
The function of the revised correction of gap width in.Here, by between in the design data shown in table 5 and Figure 13
The relation of correction is set to correction function after the amendment of gap width, but can also determine to repair by the approximate expression based on measurement data
Positive function.
[embodiment 5]
The 5th embodiment of the present invention is illustrated below.The difference of present embodiment and the 1st embodiment exists
In instead of the process 314 (Fig. 3, Fig. 4) of the 1st embodiment using process 1400 (Figure 14), but other points are implemented with the 1st
Mode is same.In the following description, the part different from the 1st embodiment is only illustrated, same part is omitted.This
Outside, take exemplified by the dependency relation produced by the condition identical condition with illustrating in the 2nd embodiment carries drawn substrate
Illustrate.
In the present embodiment, the truth of a matter is according to the upper bottom for being included in the 1st actual pattern on the 1st made in process 310
That is measured at least one of region is included at least a portion of the bottom of the 1st actual pattern into performance number, bottom data
Region in measure into performance number.
Exposure data correcting device 112 obtain by the upper truth of a matter according to and bottom data creating device 110 produce the 1st on bottom
Data and bottom data (process 1401,1402), determine that on the 1st truth of a matter measures in into performance number with data of going to the bottom
Measure into performance number into performance number correlation function (process 1404).Thus, the truth of a matter is closed according to related to bottom data in decision
System.
In process 1406, truth of a matter evidence on the 2nd is obtained.Truth of a matter evidence includes on 2nd：Including with the 1st actual pattern extremely
The upper bottom in region including the different region at least part of region measure into performance number or different from the 1st actual pattern
The 2nd actual pattern upper bottom measure into performance number.
Based on being determined into performance number correlation function, according to bottom corresponding to being calculated into performance number in of the truth of a matter on the 2nd
Into the guess value (process 1408) of performance number, based in the design used in the actual pattern used to obtain truth of a matter evidence on the 2nd
The difference into performance number into performance number and corresponding to this into the bottom deduced of performance number determined in data, determines correction function
(process 1410).(process 1412) is modified to exposure data based on the correction function.
From truth of a matter evidence on the 1st that the dependency relation extraction substrate manufacture obtained based on above-mentioned condition is gone out and bottom data
Into performance number be associated with the 3rd embodiment and in table 3 represent as.In Figure 15 by table 3 based on being measured microscopically
Be expressed as curve map relative to based on the relation into performance number that AOI is measured into performance number.If for example, observation CAD data=20
Row, then AOI measurements into performance number=44.1, in contrast, based on being measured microscopically into performance number=28.4.In this situation
Under, the coordinate of description (x, y)=(44.1,28.4).After the processing is carried out to the data of whole, determined by approximate expression related
Relational expression.Here, by linear approximate decision dependency relation formula, y=1.0177x- is obtained as into performance number correlation function
13.389。
It is as shown below such from finished product Value Data of the truth of a matter on the 2nd that dependency relation extraction is gone out with substrate manufacture in
's.If based on AOI measurement into performance number be x, by being updated to above-mentioned correction correlation function (y=1.0177x-13.389)
In, the bottom of supposition is calculated into performance number (gap width).Also, will make the supposition that this is calculated into performance number (gap width) with
1/2 of the difference into performance number in design in CAD data is used as correction.
[table 6]
| CAD | AOI is measured into performance number | Speculate into performance number | Correction |
| 20 | 44.1 | 31.5 | 5.7 |
| 22 | 47.4 | 34.8 | 6.4 |
| 24 | 50.9 | 38.4 | 7.2 |
| 26 | 54.6 | 42.2 | 8.1 |
| 28 | 58.0 | 45.6 | 8.8 |
| 30 | 60.5 | 48.1 | 9.1 |
| 35 | 65.9 | 53.7 | 9.3 |
| 40 | 72.8 | 60.7 | 10.4 |
| 45 | 78.0 | 65.9 | 10.5 |
| 50 | 85.4 | 73.6 | 11.8 |
| 55 | 88.8 | 76.9 | 11.0 |
| 60 | 96.1 | 84.5 | 12.2 |
| 70 | 106.8 | 95.3 | 12.7 |
| 80 | 117.4 | 106.1 | 13.1 |
| 90 | 126.6 | 115.5 | 12.7 |
| 100 | 136.6 | 125.7 | 12.8 |
| 120 | 157.4 | 146.8 | 13.4 |
| 150 | 185.5 | 175.4 | 12.7 |
If the correction table for the gap width in design data represented in the table is shown as correction function (etching
Curve), then it is such as Figure 16.Here, correction function is represented based on deducing for the gap width in design data
The correction into performance number function.Here, the amendment for the gap width in design data that will be represented in table 6 and Figure 16
The relation of amount is set to correction function, but can also determine correction function by the approximate expression based on the data calculated.
Embodiment
Prepare the MCL-E-700G (Hitachi Chemical Co., Ltd.'s system, trade name) of the thickness 0.22mm with 5 μm of copper foil
Copper-surfaced plywood, implement about 19 μm of coating with electro-coppering, make copper is thick to turn into about 18 μm by half-etching, with passing through above-mentioned reality
The correction function that mode 2~5 obtains to be applied to be modified exposure data, the exposure, development, circuit for carrying out actual pattern are formed,
Produce circuit forming board.The circuit that the correction function produced using the process by embodiment 2~5 is formed is formed
Substrate is set to embodiment 1~4.
[comparative example 1]
As comparative example 1, prepare MCL-E-700G (Hitachi's chemical conversion strain formula meetings of the thickness 0.22mm with 5 μm of copper foil
Society's system, trade name) copper-surfaced plywood, implement about 19 μm of coating with electro-coppering, make copper is thick to turn into about 18 μm by half-etching,
Test pattern is exposed, circuit is carried out and is formed, produce correction function and carry drawn substrate.Also, the correction function is extracted and used
Substrate produces correction function (etch plot) with circuit width and gap width is measured microscopically, according to the measured value.
Prepare the MCL-E-700G (Hitachi Chemical Co., Ltd.'s system, trade name) of the thickness 0.22mm with 5 μm of copper foil
Copper-surfaced plywood, implement about 19 μm of coating with electro-coppering, exposure data carried out with above-mentioned correction function (bottom width)
Amendment, the exposure, development, circuit for carrying out actual pattern are formed, and produce circuit forming board.
[comparative example 2]
Prepare the MCL-E-700G (Hitachi Chemical Co., Ltd.'s system, trade name) of the thickness 0.22mm with 5 μm of copper foil
Copper-surfaced plywood, implement about 19 μm of coating with electro-coppering, make copper is thick to turn into about 18 μm by half-etching, test pattern is exposed
Light, carry out circuit and formed, produce correction function and carry drawn substrate.Also, the correction function is put forward into drawn substrate optical profile type
Automatic shape inspection apparatus measuring circuit width and gap width, producing correction function according to above-mentioned measured value, (etching is bent
Line).
Prepare the MCL-E-700G (Hitachi Chemical Co., Ltd.'s system, trade name) of the thickness 0.22mm with 5 μm of copper foil
Copper-surfaced plywood, implement about 19 μm of coating with electro-coppering, make copper is thick to turn into about 18 μm by half-etching, use correction function
(top width) is modified to exposure data, and the exposure, development, circuit for carrying out actual pattern are formed, and are produced circuit and are formed
Substrate.
[comparison]
The measurement result of embodiment 1~4, comparative example 1 and comparative example 2 is represented in table 7 and 8.Projects table of table 7 and 8
Show on line (circuit width) design load and be measured microscopically value.In addition, " L/S=50/40 " of table 7 represents L (lines：Circuit
Width) it is 50 μm, S (spaces：Gap width) it is 40 μm of design specifications, " L/S=50/50 " of table 8 represents L (lines：Circuit is wide
Degree) it is 50 μm, S (spaces：Gap width) it is 50 μm of design specifications.Embodiment 1 and 2 truth of a matter evidence and data of going to the bottom in decision
Dependency relation when, be based only on bottom and difference based on the correction into performance number still based on the difference into performance number in itself
Difference, so the correction function finally given is identical.Therefore, the result obtained according to embodiment 1 and 2 is also identical.
[table 7]
[table 8]
As shown in table 7, the design specification on L/S=50/40, the dimensional accuracy of the circuit width in embodiment 1 and 2
(deviation：3 σ) it is 8.8 μm of upper surface 6.7, lower surface, it is 8.4 μm of upper surface 6.5, lower surface in embodiment 3, in embodiment 4
In be 9.0 μm of upper surface 6.7, lower surface.In contrast, in comparative example 1, it is 9.7 μm of upper surface 7.1, lower surface, is comparing
It is 20.5 μm of upper surface 7.6, lower surface in example 2.
In addition, as shown in table 8, on L/S=50/50 design specification, the size of the circuit width in embodiment 1 and 2
Precision (deviation：3 σ) it is 7.7 μm of upper surface 6.0, lower surface, it is 7.4 μm of upper surface 5.8, lower surface in embodiment 3, in reality
It is 8.3 μm of upper surface 6.0, lower surface to apply in example 4.In contrast, be 9.2 μm of upper surface 6.4, lower surface in comparative example 1,
It is 8.8 μm of upper surface 6.0, lower surface in comparative example 2.
According to the result, in the deviation of upper surface and lower surface, embodiments of the invention 1~4 all show frequently compared with
Example better characteristics, it is known that circuit width precision improves by using the present invention.
Each embodiment described above is the illustration for illustrating the present invention, but the present invention is not limited to these implementations
Mode.In the range of purport is not departed from, the present invention can be implemented in the form of various.
Label declaration
100 wiring patterns form system
101 design data producing devices
102 exposure data producing devices
104 exposure devices
106 developing pattern producing devices
108 actual pattern producing devices
Bottom and bottom data creating device on 110
112 exposure data correcting devices
200 computers
201 processing units
202 display parts
203 input units
204 storage parts
205 communication units
206 exposure data revision programs
1700 substrates
1701 wiring patterns
Bottom (top) width on 1702
1704 bottom (bottom) width
Claims (22)
1. a kind of exposure data correcting device, to being modified for the exposure data that is patterned,
Obtain truth of a matter evidence on the 1st, on the 1st the truth of a matter according to based on from the 1st actual pattern with upper bottom and the convex of bottom to
The data that upper bottom at least part of region obtains, above-mentioned 1st actual pattern is by using based on the wiring as target
The exposure data of the design data of patterns is carried out obtained from circuit fabrication；
Obtain the bottom data based on the data obtained from the bottom at least one of region of above-mentioned 1st actual pattern；
Determine that the truth of a matter is according to the dependency relation with above-mentioned bottom data on the above-mentioned 1st；
Truth of a matter evidence on the 2nd is obtained, the truth of a matter is according to based on from including at least one of with above-mentioned 1st actual pattern on the above-mentioned 2nd
The data or actual from the different from above-mentioned 1st actual pattern the 2nd that the upper bottom in region including the different region in region obtains
The data that the upper bottom of pattern obtains；
It has been based upon the design data used in the actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using, truth of a matter evidence on the above-mentioned 2nd
And above-mentioned dependency relation, determine correction function, above-mentioned correction function represent to cause determined in design data into performance number and reality
The relation of the correction into the factor of the difference between performance number, with being used for suppressing the difference in the pattern of border；
Based on above-mentioned correction function, in order to obtain the truth of a matter on the above-mentioned 2nd according to and the actual pattern that uses used in exposure data
It is modified.
2. such as above-mentioned exposure data correcting device of claim 1,
The truth of a matter is according to including correction data on above-mentioned 1st, and the correction data are based at least one of above-mentioned 1st actual pattern
Point region in upper bottom measure into performance number, with corresponding to this into performance number in the design used in above-mentioned 1st actual pattern
The difference into performance number determined in data；
Above-mentioned bottom data include correction data, and the correction data are based at least a portion in above-mentioned 1st actual pattern
Region in bottom measure into performance number, with corresponding to this into performance number in the design number used in above-mentioned 1st actual pattern
According to the difference into performance number of middle decision；
The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on comprising with above-mentioned 1st actual pattern extremely
What the upper bottom in region including the different region at least part of region was measured exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 1st actual pattern, or based on above-mentioned 1st actual pattern
The upper bottom of the 2nd different actual patterns measure into performance number, with corresponding to this into performance number used in above-mentioned 2nd actual pattern
Design data in the difference into performance number that determines；
Determine that above-mentioned dependency relation includes：
Correction data based on the truth of a matter on the above-mentioned 1st in, determine the 1st interim correction function；
Based on the correction data in above-mentioned bottom data, the 2nd interim correction function is determined；
Based on the correction obtained from above-mentioned 1st interim correction function and corresponding to the correction from the 2nd interim correction function
The difference of obtained correction, make correction difference function；
Determine that above-mentioned correction function includes：
Based on the truth of a matter in the design data and the above-mentioned 2nd used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
According to determining the 3rd interim correction function；
Above-mentioned 3rd interim correction function is modified based on above-mentioned correction difference function, determines correction function.
3. such as above-mentioned exposure data correcting device of claim 1,
On above-mentioned 1st the truth of a matter according to measured at least one of region at the upper bottom that is included in above-mentioned 1st actual pattern into
Performance number；
Above-mentioned bottom data are included in the finished product measured at least one of region of the bottom of above-mentioned 1st actual pattern
Value；
The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on including with above-mentioned 1st actual pattern extremely
What the upper bottom in region including the different region at least part of region was measured exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 1st actual pattern, or based on above-mentioned 1st actual pattern
The upper bottom of the 2nd different actual patterns measure into performance number, with corresponding to this into performance number used in above-mentioned 2nd actual pattern
Design data in the difference into performance number that determines；
Determine that above-mentioned dependency relation includes：
Determine the 1st finished product value function, above-mentioned 1st finished product value function represent to cause determined in design data into performance number and reality
In pattern into the difference between performance number the factor, with the above-mentioned 1st on the truth of a matter according in the relation into performance number；
Determine the 2nd finished product value function, above-mentioned 2nd finished product value function represent to cause determined in design data into performance number and reality
In pattern into the difference between performance number the factor, with above-mentioned bottom data in the relation into performance number；
Determine the finished product value difference function of the difference based on above-mentioned 1st finished product value function and the 2nd finished product value function；
Determine that above-mentioned correction function includes：
Based on the truth of a matter in the design data and the above-mentioned 2nd used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
According to determining interim correction function；
It is modified based on the above-mentioned interim correction function of above-mentioned finished product value difference point function pair, determines correction function.
4. such as above-mentioned exposure data correcting device of claim 1,
The truth of a matter is according to including correction data on above-mentioned 1st, and the correction data are based at least one of above-mentioned 1st actual pattern
Point region in upper bottom measure into performance number, with corresponding to this into performance number in the design used in above-mentioned 1st actual pattern
The difference into performance number determined in data；
Above-mentioned bottom data include correction data, and the correction data are based at least a portion in above-mentioned 1st actual pattern
Region in bottom measure into performance number, with corresponding to this into performance number in the design number used in above-mentioned 1st actual pattern
According to the difference into performance number of middle decision；
The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on including with above-mentioned 1st actual pattern extremely
What the upper bottom in region including the different region at least part of region was measured exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 1st actual pattern, or based on above-mentioned 1st actual pattern
The upper bottom of the 2nd different actual patterns measure into performance number, with corresponding to this into performance number used in above-mentioned 2nd actual pattern
Design data in the difference into performance number that determines；
Determine that above-mentioned dependency relation includes：Determine on the above-mentioned 1st the truth of a matter according in correction data in show correction, with
Corresponding to the correction correlation function of the correction shown in the correction data in above-mentioned bottom data of the correction；
Determine that above-mentioned correction function includes：
Based on the truth of a matter in the design data and the above-mentioned 2nd used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
According to determining interim correction function；
Above-mentioned interim correction function is modified based on above-mentioned correction correlation function, determines correction function.
5. such as above-mentioned exposure data correcting device of claim 1,
On above-mentioned 1st the truth of a matter according to measured at least one of region at the upper bottom that is included in above-mentioned 1st actual pattern into
Performance number；
Above-mentioned bottom data are included in the finished product measured at least one of region of the bottom of above-mentioned 1st actual pattern
Value；
Truth of a matter evidence is included on above-mentioned 2nd exists including the region different from least one of region of above-mentioned 1st actual pattern
What the upper bottom in interior region was measured surveys into performance number or at the upper bottom of the 2nd actual pattern different from above-mentioned 1st actual pattern
Measure into performance number；
Determine that above-mentioned dependency relation includes：Determine on the above-mentioned 1st the truth of a matter according in measure into performance number with data of going to the bottom
Measure into performance number into performance number correlation function；
Determine that above-mentioned correction function includes：
It is above-mentioned into performance number correlation function based on what is determined, based on the truth of a matter on the above-mentioned 2nd in into performance number, calculate that correspond to should
Into the guess value into performance number in the bottom of performance number；
Based on the finished product determined in the design data used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
Value and the difference into performance number corresponded in the above-mentioned bottom deduced into performance number, determine correction function.
6. such as above-mentioned exposure data correcting device of any one of Claims 1 to 5,
On above-mentioned 1st and the 2nd the truth of a matter according in include into performance number based on the data obtained by optical type appearance testing device, it is above-mentioned
Data of going to the bottom are based on the data obtained by microscope.
7. such as above-mentioned exposure data correcting device of any one of claim 1~6,
Above-mentioned correction function is determined according to each region for the same real estate for being configured with wiring pattern.
8. such as above-mentioned exposure data correcting device of any one of claim 1~7,
Above-mentioned correction function is determined according to each upper surface and lower surface for the same substrate for being configured with wiring pattern.
9. such as above-mentioned exposure data correcting device of any one of claim 1~8,
Above-mentioned correction function is determined respectively for the ordinate in wiring pattern and horizontal line.
10. a kind of wiring pattern forms system, possess：
Exposure data manufacturing mechanism, make the exposure data of the design data based on the wiring pattern as target；
Pattern exposure mechanism, based on exposure data, expose exposing patterns on the photonasty resist being configured on substrate；
It developing pattern formation mechanism, will expose the photonasty resist development of above-mentioned exposing patterns, formed developing pattern；
Actual pattern formation mechanism, circuit fabrication is carried out to the substrate for foring above-mentioned developing pattern, forms actual pattern；
The upper truth of a matter is made based on the number obtained from the upper bottom at least one of region of above-mentioned actual pattern according to manufacturing mechanism
According to upper truth of a matter evidence；
Go to the bottom data creating mechanism, makes based on the number obtained from the bottom at least one of region of above-mentioned actual pattern
According to bottom data；
The above-mentioned exposure data correcting device of any one of claim 1~9, based on above-mentioned upper truth of a matter evidence, bottom data and set
Count, exposure data is modified.
11. a kind of program, for being modified to exposure data, the exposure data is used for being patterned, and the program makes meter
Calculation machine performs following process：
Obtain truth of a matter evidence on the 1st, on the 1st the truth of a matter according to based on from the 1st actual pattern with upper bottom and the convex of bottom to
The data that upper bottom at least part of region obtains, above-mentioned 1st actual pattern is by using based on the wiring as target
The exposure data of the design data of patterns is carried out obtained from circuit fabrication；
Obtain the bottom data based on the data obtained from the bottom at least one of region of above-mentioned 1st actual pattern；
Determine that the truth of a matter is according to the dependency relation with above-mentioned bottom data on the above-mentioned 1st；
Truth of a matter evidence on the 2nd is obtained, the truth of a matter is according to based on from including at least one of with above-mentioned 1st actual pattern on the above-mentioned 2nd
The data or actual from the different from above-mentioned 1st actual pattern the 2nd that the upper bottom in region including the different region in region obtains
The data that the upper bottom of pattern obtains；
It has been based upon the design data used in the actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using, truth of a matter evidence on the above-mentioned 2nd
And above-mentioned dependency relation, determine correction function, above-mentioned correction function represent to cause determined in design data into performance number and reality
The relation of the correction into the factor of the difference between performance number, with being used for suppressing the difference in the pattern of border；
Based on above-mentioned correction function, in order to obtain the truth of a matter on the above-mentioned 2nd according to and the actual pattern that uses used in exposure data
It is modified.
12. a kind of method for being modified to exposure data, the exposure data is used for being patterned, including following
Process：
Obtain truth of a matter evidence on the 1st, on the 1st the truth of a matter according to based on from the 1st actual pattern with upper bottom and the convex of bottom to
The data that upper bottom at least part of region obtains, above-mentioned 1st actual pattern is by using based on the wiring as target
The exposure data of the design data of patterns is carried out obtained from circuit fabrication；
Obtain the bottom data based on the data obtained from the bottom at least one of region of above-mentioned 1st actual pattern；
Determine that the truth of a matter is according to the dependency relation with above-mentioned bottom data on the above-mentioned 1st；
Truth of a matter evidence on the 2nd is obtained, the truth of a matter is according to based on from including at least one of with above-mentioned 1st actual pattern on the above-mentioned 2nd
The data or actual from the different from above-mentioned 1st actual pattern the 2nd that the upper bottom in region including the different region in region obtains
The data that the upper bottom of pattern obtains；
It has been based upon the design data used in the actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using, truth of a matter evidence on the above-mentioned 2nd
And above-mentioned dependency relation, determine correction function, above-mentioned correction function represent to cause determined in design data into performance number and reality
The relation of the correction into the factor of the difference between performance number, with being used for suppressing the difference in the pattern of border；
Based on above-mentioned correction function, in order to obtain the truth of a matter on the above-mentioned 2nd according to and the actual pattern that uses used in exposure data
It is modified.
13. a kind of circuit board manufacture method, including following process：
Obtain truth of a matter evidence on the 1st, on the 1st the truth of a matter according to based on from the 1st actual pattern with upper bottom and the convex of bottom to
The data that upper bottom at least part of region obtains, above-mentioned 1st actual pattern is by using based on the wiring as target
The exposure data of the design data of patterns is carried out obtained from circuit fabrication；
Obtain the bottom data based on the data obtained from the bottom at least one of region of above-mentioned 1st actual pattern；
Determine that the truth of a matter is according to the dependency relation with above-mentioned bottom data on the above-mentioned 1st；
Truth of a matter evidence on the 2nd is obtained, the truth of a matter is according to based on from including at least one of with above-mentioned 1st actual pattern on the above-mentioned 2nd
The data or actual from the different from above-mentioned 1st actual pattern the 2nd that the upper bottom in region including the different region in region obtains
The data that the upper bottom of pattern obtains；
It has been based upon the design data used in the actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using, truth of a matter evidence on the above-mentioned 2nd
And above-mentioned dependency relation, determine correction function, above-mentioned correction function represent to cause determined in design data into performance number and reality
The relation of the correction into the factor of the difference between performance number, with being used for suppressing the difference in the pattern of border；
Based on above-mentioned correction function, in order to obtain the truth of a matter on the above-mentioned 2nd according to and the actual pattern that uses used in exposure data
It is modified；
Wiring pattern is formed based on above-mentioned exposure data.
14. such as above-mentioned circuit board manufacture method of claim 13,
The truth of a matter is according to including correction data on above-mentioned 1st, and the correction data are based at least one of above-mentioned 1st actual pattern
Point region in upper bottom measure into performance number, with corresponding to this into performance number in the design used in above-mentioned 1st actual pattern
The difference into performance number determined in data；
Above-mentioned bottom data include correction data, and the correction data are based at least a portion in above-mentioned 1st actual pattern
Region in bottom measure into performance number, with corresponding to this into performance number in the design number used in above-mentioned 1st actual pattern
According to the difference into performance number of middle decision；
The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on comprising with above-mentioned 1st actual pattern extremely
What the upper bottom in region including the different region at least part of region was measured exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 1st actual pattern, or based on above-mentioned 1st actual pattern
The upper bottom of the 2nd different actual patterns measure into performance number, with corresponding to this into performance number used in above-mentioned 2nd actual pattern
Design data in the difference into performance number that determines；
Determining the process of above-mentioned dependency relation includes following process：
Correction data based on the truth of a matter on the above-mentioned 1st in, determine the 1st interim correction function；
Based on the correction data in above-mentioned bottom data, the 2nd interim correction function is determined；
Based on the correction obtained from above-mentioned 1st interim correction function and corresponding to the correction from the 2nd interim correction function
The difference of obtained correction, make correction difference function；
Determining the process of above-mentioned correction function includes following process：
Based on the truth of a matter in the design data and the above-mentioned 2nd used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
According to determining the 3rd interim correction function；
Above-mentioned 3rd interim correction function is modified based on above-mentioned correction difference function, determines correction function.
15. such as above-mentioned circuit board manufacture method of claim 13,
On above-mentioned 1st the truth of a matter according to measured at least one of region at the upper bottom that is included in above-mentioned 1st actual pattern into
Performance number；
Above-mentioned bottom data are included in the finished product measured at least one of region of the bottom of above-mentioned 1st actual pattern
Value；
The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on including with above-mentioned 1st actual pattern extremely
What the upper bottom in region including the different region at least part of region was measured exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 1st actual pattern, or based on above-mentioned 1st actual pattern
The upper bottom of the 2nd different actual patterns measure into performance number, with corresponding to this into performance number used in above-mentioned 2nd actual pattern
Design data in the difference into performance number that determines；
Determining the process of above-mentioned dependency relation includes following process：
Determine the 1st finished product value function, above-mentioned 1st finished product value function represent to cause determined in design data into performance number and reality
In pattern into the difference between performance number the factor, with the above-mentioned 1st on the truth of a matter according in the relation into performance number；
Determine the 2nd finished product value function, above-mentioned 2nd finished product value function represent to cause determined in design data into performance number and reality
In pattern into the difference between performance number the factor, with above-mentioned bottom data in the relation into performance number；
Determine the finished product value difference function of the difference based on above-mentioned 1st finished product value function and the 2nd finished product value function；
Determining the process of above-mentioned correction function includes following process：
Based on the truth of a matter in the design data and the above-mentioned 2nd used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
According to determining interim correction function；
It is modified based on the above-mentioned interim correction function of above-mentioned finished product value difference point function pair, determines correction function.
16. such as above-mentioned circuit board manufacture method of claim 13,
The truth of a matter is according to including correction data on above-mentioned 1st, and the correction data are based at least one of above-mentioned 1st actual pattern
Point region in upper bottom measure into performance number, with corresponding to this into performance number in the design used in above-mentioned 1st actual pattern
The difference into performance number determined in data；
Above-mentioned bottom data include correction data, and the correction data are based at least a portion in above-mentioned 1st actual pattern
Region in bottom measure into performance number, with corresponding to this into performance number in the design number used in above-mentioned 1st actual pattern
According to the difference into performance number of middle decision；
The truth of a matter is according to including correction data on above-mentioned 2nd, the correction data based on including with above-mentioned 1st actual pattern extremely
What the upper bottom in region including the different region at least part of region was measured exists into performance number and corresponding to this into performance number
The difference into performance number determined in design data used in above-mentioned 1st actual pattern, or based on above-mentioned 1st actual pattern
The upper bottom of the 2nd different actual patterns measure into performance number, with corresponding to this into performance number used in above-mentioned 2nd actual pattern
Design data in the difference into performance number that determines；
Determining the process of above-mentioned dependency relation includes：Determine that what is shown on the above-mentioned 1st in correction data of the truth of a matter in repaiies
The correction of the correction shown in positive quantity, the correction data in above-mentioned bottom data to corresponding to the correction is related
The process of function；
Determining the process of above-mentioned correction function includes following process：
Based on the truth of a matter in the design data and the above-mentioned 2nd used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
According to determining interim correction function；
Above-mentioned interim correction function is modified based on above-mentioned correction correlation function, determines correction function.
17. such as above-mentioned circuit board manufacture method of claim 13,
On above-mentioned 1st the truth of a matter according to measured at least one of region at the upper bottom that is included in above-mentioned 1st actual pattern into
Performance number；
Above-mentioned bottom data are included in the finished product measured at least one of region of the bottom of above-mentioned 1st actual pattern
Value；
Truth of a matter evidence is included on above-mentioned 2nd exists including the region different from least one of region of above-mentioned 1st actual pattern
What the upper bottom in interior region was measured surveys into performance number or at the upper bottom of the 2nd actual pattern different from above-mentioned 1st actual pattern
Measure into performance number；
Determining the process of above-mentioned dependency relation includes：Determine on the above-mentioned 1st the truth of a matter according in measure into performance number with going to the bottom
The process into performance number correlation function into performance number measured in data；
Determining the process of above-mentioned correction function includes following process：
It is above-mentioned into performance number correlation function based on what is determined, based on the truth of a matter on the above-mentioned 2nd in into performance number, calculate that correspond to should
Into the guess value into performance number in the bottom of performance number；
Based on the finished product determined in the design data used in the actual pattern used to obtain truth of a matter evidence on the above-mentioned 2nd
Value and the difference into performance number corresponded in the above-mentioned bottom deduced into performance number, determine correction function.
18. such as above-mentioned circuit board manufacture method of any one of claim 13~17,
On above-mentioned 1st and the 2nd the truth of a matter according in include into performance number based on the data obtained by optical type appearance testing device, it is above-mentioned
Data of going to the bottom are based on the data obtained by microscope.
19. such as above-mentioned circuit board manufacture method of any one of claim 13~18,
Above-mentioned correction function is determined according to each region for the same real estate for being configured with wiring pattern.
20. such as above-mentioned circuit board manufacture method of any one of claim 13~19,
Above-mentioned correction function is determined according to each upper surface and lower surface for the same substrate for being configured with wiring pattern.
21. such as any one of claim 13~20 above-mentioned circuit board manufacture method, it is characterised in that
Above-mentioned correction function is determined respectively for the ordinate in wiring pattern and horizontal line.
22. a kind of circuit board manufacture method, including following process：
Make the exposure data of the design data based on the wiring pattern as target；
Based on exposure data, expose exposing patterns on the photonasty resist being configured on substrate；
The photonasty resist development of above-mentioned exposing patterns will have been exposed, formed developing pattern；
Circuit fabrication is carried out to the substrate for foring above-mentioned developing pattern, forms the 1st actual pattern；
Make the truth of a matter on the 1st based on the data obtained from the upper bottom at least one of region of above-mentioned 1st actual pattern
According to；
Make the bottom data based on the data obtained from the bottom at least one of region of above-mentioned 1st actual pattern；
Determine that the truth of a matter is according to the dependency relation with above-mentioned bottom data on the above-mentioned 1st；
Truth of a matter evidence on the 2nd is made, the truth of a matter is according to based on from including at least one of with above-mentioned 1st actual pattern on the above-mentioned 2nd
The data or actual from the different from above-mentioned 1st actual pattern the 2nd that the upper bottom in region including the different region in region obtains
The data that the upper bottom of pattern obtains；
It has been based upon the design data used in the actual pattern for obtaining truth of a matter evidence on the above-mentioned 2nd and using, truth of a matter evidence on the above-mentioned 2nd
And above-mentioned dependency relation, determine correction function, above-mentioned correction function represent to cause determined in design data into performance number and reality
The relation of correction of the factor into the difference between performance number with being used for suppressing the difference in the pattern of border；
Based on above-mentioned correction function, in order to obtain the truth of a matter on the above-mentioned 2nd according to and the actual pattern that uses used in exposure data
It is modified；
Wiring pattern is formed based on above-mentioned revised exposure data.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015143080A JP6491974B2 (en) | 2015-07-17 | 2015-07-17 | EXPOSURE DATA CORRECTION DEVICE, WIRING PATTERN FORMING SYSTEM, AND WIRING BOARD MANUFACTURING METHOD |
| JP2015-143080 | 2015-07-17 | ||
| PCT/JP2016/071013 WO2017014190A1 (en) | 2015-07-17 | 2016-07-15 | Exposure data correction device, wiring pattern formation system, and method for manufacturing wiring substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107850855A true CN107850855A (en) | 2018-03-27 |
| CN107850855B CN107850855B (en) | 2020-05-26 |
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| Country | Link |
|---|---|
| JP (1) | JP6491974B2 (en) |
| KR (1) | KR102086497B1 (en) |
| CN (1) | CN107850855B (en) |
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| WO (1) | WO2017014190A1 (en) |
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| JP6663672B2 (en) * | 2015-09-25 | 2020-03-13 | 株式会社Ｓｃｒｅｅｎホールディングス | Data correction device, drawing device, wiring pattern forming system, inspection device, data correction method, and method of manufacturing wiring substrate |
Citations (4)
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|---|---|---|---|---|
| JP2000252202A (en) * | 1999-03-03 | 2000-09-14 | Hitachi Ltd | Manufacture of semiconductor device |
| JP2000269128A (en) * | 1999-03-19 | 2000-09-29 | Toshiba Corp | Pattern drawing method and drawing apparatus |
| CN101192009A (en) * | 2006-11-28 | 2008-06-04 | 中芯国际集成电路制造(上海)有限公司 | Method for establishing OPC model |
| CN101535898A (en) * | 2006-08-31 | 2009-09-16 | 先进微装置公司 | A method and a system for reducing overlay errors within exposure fields by APC control strategies |
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| JP4018309B2 (en) * | 2000-02-14 | 2007-12-05 | 松下電器産業株式会社 | Circuit parameter extraction method, semiconductor integrated circuit design method and apparatus |
| JP2003017830A (en) * | 2001-06-28 | 2003-01-17 | Nitto Denko Corp | Wiring circuit board manufacturing and checking method |
| TW584789B (en) * | 2003-05-26 | 2004-04-21 | Fujitsu Ltd | Pattern size correction apparatus, pattern size correction method and photomask |
| JP2005116929A (en) * | 2003-10-10 | 2005-04-28 | Fuji Photo Film Co Ltd | System for manufacturing pattern |
| JP2005115232A (en) * | 2003-10-10 | 2005-04-28 | Fuji Photo Film Co Ltd | Manufacture support system and program |
| JP2006303229A (en) * | 2005-04-21 | 2006-11-02 | Toray Eng Co Ltd | Circuit forming system |
| JP2007033764A (en) * | 2005-07-26 | 2007-02-08 | Fujifilm Holdings Corp | Pattern manufacturing system, exposure device, and exposure method |
| CN101278375B (en) * | 2005-11-16 | 2010-12-22 | 株式会社尼康 | Substrate processing method, photomask manufacturing method, photomask, and device manufacturing method |
| TW201224678A (en) * | 2010-11-04 | 2012-06-16 | Orc Mfg Co Ltd | Exposure device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000252202A (en) * | 1999-03-03 | 2000-09-14 | Hitachi Ltd | Manufacture of semiconductor device |
| JP2000269128A (en) * | 1999-03-19 | 2000-09-29 | Toshiba Corp | Pattern drawing method and drawing apparatus |
| CN101535898A (en) * | 2006-08-31 | 2009-09-16 | 先进微装置公司 | A method and a system for reducing overlay errors within exposure fields by APC control strategies |
| CN101192009A (en) * | 2006-11-28 | 2008-06-04 | 中芯国际集成电路制造(上海)有限公司 | Method for establishing OPC model |
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| TWI624200B (en) | 2018-05-11 |
| KR102086497B1 (en) | 2020-03-09 |
| KR20180014057A (en) | 2018-02-07 |
| CN107850855B (en) | 2020-05-26 |
| TW201714503A (en) | 2017-04-16 |
| WO2017014190A1 (en) | 2017-01-26 |
| JP2017026710A (en) | 2017-02-02 |
| JP6491974B2 (en) | 2019-03-27 |
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