KR102086497B1 - Exposure data correction apparatus, wiring pattern forming system, and manufacturing method of wiring board - Google Patents

Abstract

While reducing the effort by manual measurement of bottom and bottom data, the error of the exposure data correction amount is suppressed and the circuit width accuracy is improved. Acquire the first bottom data based on the data obtained from the bottom of the first fail turn obtained by the circuit processing using the exposure data based on the design data, and the bottom data based on the data obtained from the bottom of the first fail turn. Determine the correlation between the first lower data and the lower data, and obtain the data obtained from the upper floor in the region including the different regions of the first failure turn or the second lower turn different from the first failure turn. Acquire a second bottom data based on the data, and determine a correction function based on the design data for the failure turn, the second bottom data, and the correlation used to obtain the second bottom data, and determine the second bottom data. An exposure data correcting apparatus for correcting exposure data for a failure turn used to obtain based on a correction function.

Description

Exposure data correction apparatus, wiring pattern forming system, and manufacturing method of wiring board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure data compensating apparatus, a wiring pattern forming system, and a manufacturing method of a wiring board, and in particular, an exposure data compensating apparatus, a wiring pattern forming system, and a manufacturing method of a wiring board used in the manufacture of a wiring board used for electronic equipment and the like. It is about.

Due to the trend of higher functionality and miniaturization of electronic devices, higher density due to thinning of wiring patterns is also required for wiring boards used in electronic devices.

As a wiring pattern formation method for coping with the densification by thinning the wiring pattern, a direct drawing type exposure apparatus DI for directly irradiating an exposure pattern to a photosensitive resist with laser light or UV-LED light, etching, etc. By combining the optical inspection device AOI which reads the failure turn actually formed by the reflected light and compares it with the original data (design data), and introduces the actual result data after etching into the optical appearance inspection device AOI. The method of feeding back to (DI) is considered (patent documents 1-3).

Japanese Patent Laid-Open No. 2005-116929 Japanese Patent Laid-Open No. 2006-303229 Japanese Patent Publication No. 2007-033764

As shown in FIG. 17, the failure turn has a convex shape having an upper (top) and a lower (bottom) shape, and a result value, for example, a wiring pattern (hereinafter, simply referred to as a "pattern"). ) Has a different circuit width at top width 1702 and bottom width 1704. In densification of the wiring pattern, it is important to reduce the error between the design value and the bottom width. When the optical appearance inspection device AOI is used, the result value can be measured relatively easily, but the result value measured by the AOI is the saw width, and data of the bottom width is not obtained. For this reason, even if the exposure data is corrected by feeding back to DI using the measured value of AOI, there is a problem that an error due to the difference between the top width and the bottom width occurs.

Although it is possible to measure the bottom width by using a microscope, a large measurement time is needed because it needs to be performed manually. In order to reduce the measurement burden, when the measurement point is reduced and the measurement is performed, there is a problem that accurate feedback cannot be performed because sufficient samples cannot be taken.

The present invention provides an exposure data correction device, a wiring pattern forming system, which can reduce the error of the exposure data correction amount while reducing the effort by manual measurement of the bottom (bottom) data and improve the circuit width accuracy at the time of forming a fine circuit. It aims at providing the manufacturing method of a wiring board.

This invention is made | formed in view of the said subject, and has the following characteristics. That is, the exposure data correcting apparatus of one embodiment of the present invention includes at least a portion of the convex first failing turn having an upper and a lower bottom obtained by circuit processing using exposure data based on design data for a target wiring pattern. Acquiring the first bottom data based on the data obtained from the bottom in the area, acquiring the bottom bottom data based on the data obtained from the bottom in at least a part of the first failure turn, and obtaining the first bottom data. And a second failure turn different from the first failure turn or the data obtained from the bottom in an area including a region different from at least a portion of the first failure turn and determining a correlation between the lower and lower data. To obtain second bottom data based on data obtained from the bottom bottom, and to obtain the second bottom bottom data. On the basis of the design data for the failure turn used, the second bottom data and the correlation, a factor for generating a difference between the result value determined in the design data and the result value in the failure turn and for suppressing the difference. A correction function indicating the relationship between the correction amounts is determined, and the exposure data for the failure turn used to obtain the second bottom data is corrected based on the correction function.

The first bottom data in the present invention is a result determined in the result value measured at the bottom in at least a portion of the first fail turn and the design data for the first fail turn corresponding to the result value. Correction amount data based on the difference between the values, wherein the bottom data includes a result value measured at the bottom of at least a portion of the first failure turn and a value for the first failure turn corresponding to the result value. Correction amount data based on the difference between the result values determined in the design data, wherein the second bottom data is measured at an upper floor in an area including an area different from an area of at least a portion of the first failure turn. Correction amount data based on a difference between a result value and a result value determined in the design data for the first failure turn corresponding to the result value; or And correction amount data based on a difference between a result value measured at the bottom of a second failure turn different from the first failure turn and a result value determined in design data for the second failure turn corresponding to the result value. The determining of the correlation may include determining a first provisional correction function based on the correction amount data in the first upper row data, and determining a second provisional correction function based on the correction amount data in the lower row data. And generating a correction amount difference function based on the difference between the correction amount obtained from the first provisional correction function and the correction amount obtained from the second provisional correction function corresponding to the correction amount, wherein determining the correction function comprises: A third provisional correction based on the design data for the failure turn used to acquire the bottom data and the second bottom data Determining the number, and based on the correction amount function by modifying the difference of the third temporary correction function may include determining the correction function.

Further, the first bottom data includes a result value measured in at least a portion of an area of the bottom of the first failure turn, and the bottom data is in at least a portion of the bottom of the first failure turn. The second bottom data includes the measured result value, and the second bottom data corresponds to the result value measured at the bottom of the area including an area different from at least a part of the first failure turn and the result value. Correction amount data based on the difference of the determined result value in the design data for the first fail turn or the result value measured at the bottom of the second fail turn different from the first fail turn and the second corresponding to the result value. The correction amount data based on the difference of the result value determined in the design data for the failure turn, and determining the correlation is determined in the design data. A first result function indicating a relationship between a factor that generates a difference between a result value between an overvalue and a failure turn and a result value in the first upper floor data is determined, and the result value and the failure turn determined in the design data are determined. A second result function indicating a relationship between a factor for generating a difference of the result value in the result value and the result value in the bottom data, and determining a result based on the difference between the first result function and the second result function Determining a value difference function, wherein determining the correction function comprises: determining a provisional correction function based on design data for the failure turn and the second bottom data used to obtain the second bottom data, The correction function may be determined by modifying the provisional correction function based on the result difference function.

Further, the first bottom data is a difference between a result value measured at an upper floor in at least a portion of the first fail turn and a result value determined in design data for the first fail turn corresponding to the result value. And the correction data based on the data, and the lower data includes the result value measured at the lower part of at least a portion of the first failure turn and the design data for the first failure turn corresponding to the result value. Correction amount data based on the difference of the result value determined in the above, wherein the second bottom data includes a result value measured at the bottom in an area including an area different from at least a part of the first failure turn; Correction amount data or the first failure based on the difference of the result value determined in the design data for the first failure turn corresponding to the result value And the correction amount data based on the difference between the result value measured at the bottom of the second failure turn different from the result value determined in the design data for the second failure turn corresponding to the result value, and the correlation Determining includes determining a correction amount correlation function of the correction amount indicated in the correction amount data in the first upper and lower data and the correction amount appearing in the correction amount data in the lower data corresponding to the correction amount. Determining is based on the design data for the failure turn used to obtain the second bottom data and the second bottom data to determine the provisional correction function, and based on the correction amount correlation function to correct the temporary correction function And determining the correction function.

Further, the first bottom data includes a result value measured in at least a portion of an area of the bottom of the first failure turn, and the bottom data is in at least a portion of the bottom of the first failure turn. The second bottom data includes a measured result value, and the second bottom data is different from the result value measured at the bottom or the first failure turn in an area including an area different from at least a part of the first failure turn. And including a result value measured at the bottom of the different second failure turn, and determining the correlation: a result correlation function of the result value measured in the first bottom data and the result value measured in the bottom data. Determining, and determining the correction function based on the result value in the second bottom data based on the determined result correlation function. The result value determined in the design data for the failure turn used to calculate an estimate value of the result value at the bottom corresponding to and the second bottom data, and the result at the estimated bottom corresponding to the result value. It may include determining the correction function based on the difference of the values.

The resultant values contained in the first and second bottom data may be based on data obtained by an optical appearance inspection apparatus, and the bottom data may be based on data obtained by a microscope.

The correction function may be determined for each region of the same substrate surface on which the wiring pattern is arranged.

The correction function may be determined for each of the upper and lower surfaces of the same substrate on which the wiring pattern is arranged.

The correction function may be determined for each of the vertical line and the horizontal line in the wiring pattern.

Moreover, the wiring pattern forming system of this invention exposes an exposure pattern to the exposure data creation means which produces exposure data based on the design data of the target wiring pattern, and the photosensitive resist arrange | positioned on a board | substrate based on exposure data. Pattern exposure means for forming, developing pattern forming means for developing a photosensitive resist exposed to the exposure pattern to form a development pattern, and fail turn forming means for performing a circuit processing on the substrate on which the development pattern is formed to form a failure turn. And bottom data creation means for creating bottom data based on data obtained from the bottom of at least a portion of the failed turn, and bottom based on data obtained from the bottom in at least a portion of the failed turn. Bottom data creation means for creating data, and the bottom data, bottom Based on the data and design data includes the above-described exposure data correction apparatus for correcting an exposure data.

Moreover, the program for correcting exposure data in one Embodiment of this invention is a convex which has the upper and lower sides obtained by the circuit processing which used the exposure data based on the design data for the target wiring pattern in a computer. Acquiring first bottom data based on data obtained from the bottom of at least a portion of the first failed turn of the image; and based on data obtained from the bottom of the at least one region of the first failed turn; A process of obtaining lower and lower data, a process of determining a correlation between the first lower data and the lower data, and an area different from an area that is different from at least a portion of the first failure turn Data based on data or data obtained from the bottom of a second failure turn that is different from the first failure turn; And a result value determined in the design data and the failure turn based on the design data for the failure turn used to obtain the second bottom data, the second bottom data, and the correlation. Determining a correction function indicative of a relationship between a factor for generating a difference in the resultant value and a correction amount for suppressing the difference, and exposure data for a failure turn used to obtain the second upper floor data. The correction process is performed based on the above.

Moreover, it is a method for correct | amending the exposure data in one Embodiment of this invention, The convex 1st which has an upper and lower bottom obtained by the circuit processing using exposure data based on the design data for the target wiring pattern. Acquiring first bottom data based on data obtained from the bottom of at least a portion of the failed turn; and bottom data based on data obtained from the bottom of the at least one region of the first failed turn. Data obtained from an upper floor in an area including a step of acquiring, a step of determining a correlation between the first bottom data and the bottom data, and an area different from at least a part of the first failure turn; A second bottom day based on data obtained from a bottom of a second fail turn that is different from the first fail turn And a result value determined in the design data and a result in the failure turn, based on the design data for the failure turn, the second bottom data, and the correlation, which are used to obtain the second bottom data. Determining a correction function indicative of a relationship between a factor causing a difference in value and a correction amount for suppressing the difference, and exposure data for a failure turn used to obtain the second upper floor data based on the correction function. Calibration process.

Moreover, the wiring board manufacturing method in one Embodiment of this invention is a convex 1st failure turn which has the upper and lower bottoms obtained by the circuit processing using exposure data based on the design data for the target wiring pattern. Obtaining first bottom data based on data obtained from the bottom of at least part of the area; and obtaining bottom data based on the data obtained from the bottom of at least part of the first failure turn. And a step of determining a correlation between the first bottom data and the bottom data, and data obtained from a bottom bottom in an area including an area different from at least a part of the first failure turn. The second low data obtained based on the data obtained from the low bottom of the second failure turn different from the pattern is obtained. And a difference between the result value determined in the design data and the result value in the failure turn, based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determining a correction function indicating a relationship between a factor to be generated and a correction amount for suppressing the difference, correcting exposure data for a failure turn used to obtain the second bottom data based on the correction function; And forming a wiring pattern based on the exposure data.

Further, the first bottom data is a difference between a result value measured at an upper floor in at least a portion of the first fail turn and a result value determined in design data for the first fail turn corresponding to the result value. And the correction data based on the data, and the lower data includes the result value measured at the lower part of at least a portion of the first failure turn and the design data for the first failure turn corresponding to the result value. Correction amount data based on the difference of the result value determined in the above, wherein the second bottom data includes a result value measured at the bottom in an area including an area different from at least a part of the first failure turn; Correction amount data or the first failure based on the difference of the result value determined in the design data for the first failure turn corresponding to the result value And the correction amount data based on the difference between the result value measured at the bottom of the second failure turn different from the result value determined in the design data for the second failure turn corresponding to the result value, and the correlation The determining step includes determining a first provisional correction function based on the correction amount data in the first upper and lower data, and determining a second provisional correction function based on the correction amount data in the lower and lower data. And generating a correction amount difference function based on the difference between the correction amount obtained from the first provisional correction function and the correction amount obtained from the second provisional correction function corresponding to the correction amount, wherein the determining of the correction function comprises: A third design based on the design data for the failure turn used to acquire the second bottom data and the second bottom data And the step of determining the correction function, the correction amount based on the differential function modifying the third temporary correction function may include the step of determining the correction function.

The first bottom data includes a result value measured in at least a portion of the bottom of the first failure turn, and the bottom data is measured in at least a portion of the bottom of the first failure turn. The second bottom data includes a result value, and the second bottom data includes a result value measured at an upper floor in an area including an area different from at least a part of the first failure turn and the first value corresponding to the result value. Correction value data based on the difference of the determined result value in the design data for the failure turn or the result value measured at the bottom of the second failure turn different from the first failure turn and the second failure turn corresponding to the result value And the correction amount data based on the difference of the result value determined in the design data for the data, and the step of determining the correlation includes the result determined in the design data. Determining a first result function representing a relationship between a factor causing a difference between a result value and a result value in a failure turn and a result value in the first bottom data; and the result value and the actual result value determined in the design data. Determining a second resultant function indicating a relationship between a factor causing a difference in the resultant value in the pattern and a resultant value in the bottom data, and a difference between the first resultant function and the second resultant function. Determining a resultant difference function based on the step of determining a correction function, wherein the step of determining the correction function is based on design data for the failure turn and the second bottom data used for obtaining the second bottom data. A step of determining a positive function, and a step of modifying the provisional correction function based on the result difference function, determine a correction function.

The first bottom data is based on a difference between a result value measured at the bottom in at least a portion of the first failure turn and a result value determined in the design data for the first failure turn corresponding to the result value. And the correction data, wherein the lower data is determined in the result value measured at the bottom of at least a portion of the first failure turn and in the design data for the first failure turn corresponding to the result value. A correction value data based on the difference between the result values, and the second bottom data includes the result value measured at the bottom in an area including an area different from at least a part of the first failure turn and the result. The correction amount data or the first failure turn based on the difference of the result value determined in the design data for the first failure turn corresponding to the value; A correction amount data based on the difference between the result value measured at the bottom of the different second failure turn and the result value determined in the design data for the second failure turn corresponding to the result value, and determining the correlation. The step includes determining a correction amount correlation function of the correction amount indicated in the correction amount data in the first upper and lower data and the correction amount indicated in the correction amount data in the lower data corresponding to the correction amount. The determining step may include determining a provisional correction function based on the design data for the failure turn used to obtain the second upper floor data and the second lower data, and the temporary correction based on the correction amount correlation function. The function may be modified to determine the correction function.

The first bottom data includes a result value measured in at least a portion of the bottom of the first failure turn, and the bottom data is measured in at least a portion of the bottom of the first failure turn. The second bottom data, including a result value, is a result value measured at an upper floor in an area including an area different from at least a part of the first failure turn, or a different value from the first failure turn. And a result value measured at the upper and lower ends of two failure turns, wherein the determining of the correlation comprises determining a result correlation function between the result measured in the first lower data and the result measured in lower data. And a step of determining the correction function, based on the determined result correlation function, based on the result value in the second bottom data. Calculating the estimated value of the resultant value at the bottom, and the resultant value determined in the design data for the failure turn used to obtain the second bottom data and the estimated bottom value corresponding to the resultant value. The process of determining a correction function based on the difference of the result value of may be included.

The resultant values contained in the first and second bottom data may be based on data obtained by an optical appearance inspection apparatus, and the bottom data may be based on data obtained by a microscope.

The correction function may be determined for each region of the same substrate surface on which the wiring pattern is arranged.

The correction function may be determined for each of the upper and lower surfaces of the same substrate on which the wiring pattern is arranged.

The correction function may be determined for each of the vertical line and the horizontal line in the wiring pattern.

In the wiring board manufacturing method in one embodiment of the present invention, an exposure pattern includes a step of creating exposure data based on design data of a target wiring pattern, and a photosensitive resist disposed on the substrate based on the exposure data. Exposing the photosensitive resist exposed to the exposure pattern, forming a development pattern, and performing a circuit processing on the substrate on which the development pattern is formed to form a first failure turn; A process of creating first bottom data based on data obtained from the bottom of at least a portion of one failure turn, and bottom data based on data obtained from the bottom of at least a portion of the first failure turn; And a step of determining a correlation between the first bottom data and the bottom data; A process of creating second bottom data based on data obtained from the bottom in an area including an area different from at least a part of the pattern or data obtained from the bottom of a second failure turn different from the first failure turn And a difference between the result value determined in the design data and the result value in the failure turn, based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determining a correction function indicating a relationship between a factor to be generated and a correction amount for suppressing the difference, correcting exposure data for a failure turn used to obtain the second bottom data based on the correction function; And forming a wiring pattern based on the corrected exposure data.

According to the present invention, while reducing the effort by manual measurement of the bottom and bottom data, based on the correlation between the bottom and bottom data (AOI measurement data) and the bottom and bottom data of the failure turn, the error of the exposure data correction amount is suppressed to form a fine circuit. The exposure data correction apparatus, the wiring pattern forming system, and the manufacturing method of a wiring board which can improve the circuit width precision at the time can be provided.

1 shows a schematic diagram of a wiring pattern forming system according to an embodiment of the present invention.
Fig. 2 shows a hardware configuration diagram of the exposure data correction device in the embodiment of the present invention.
3 shows a flowchart of an exposure data correction method of an embodiment of the present invention.
4 shows a flowchart of an exposure data correction process in one embodiment of the present invention.
5 shows a flowchart of an exposure data correction process of an embodiment of the present invention.
Fig. 6 shows a temporary correction function in one embodiment of the present invention.
7 shows a provisional correction function and a correction function in one embodiment of the present invention.
8 shows a flowchart of an exposure data correction process in one embodiment of the present invention.
9 shows a result function of an embodiment of the present invention.
10 shows a provisional correction function and a correction function in one embodiment of the present invention.
11 shows a flowchart of an exposure data correction process in one embodiment of the present invention.
12 shows a correction amount correlation function in one embodiment of the present invention.
13 shows a temporary correction function and a correction function in one embodiment of the present invention.
14 shows a flowchart of an exposure data correction process in one embodiment of the present invention.
15 shows the result correlation function of one embodiment of the present invention.
16 shows a correction function of one embodiment of the present invention.
17 shows a schematic diagram of the cross-sectional shape of a failure turn.

[First Embodiment]

The structural diagram of the wiring pattern formation system 100 which concerns on FIG. 1 at one Embodiment of this invention is shown. The wiring pattern forming system 100 includes a design data creating apparatus 101, an exposure data creating apparatus 102, an exposure apparatus 104, a developing pattern creating apparatus 106, a fail-turn creating apparatus 108, a bottom and a bottom. The data creation apparatus 110 and the exposure data correction apparatus 112 are provided.

The design data generating apparatus 101 is an apparatus which creates design data, and uses CAD (Computer Aided Design) in this embodiment. The design data (original data) of the wiring pattern is a data of a wiring pattern of a target to be formed, and is represented by coordinates and a circuit width, for example. You may have data to which the information required for exposure was added. In the present invention, any wiring pattern can be used.

The exposure data creation apparatus 102 is an apparatus which creates exposure data from design data, and uses CAM (Computer Aided Manufacturing) here. The exposure apparatus 104 is an apparatus which exposes an exposure pattern to the photosensitive resist arrange | positioned on the board | substrate based on the exposure data created by the exposure data creation apparatus 102. FIG. For example, direct imaging apparatus (DI) which uses laser light or UV-LED light to expose an exposure pattern to a direct photosensitive resist can be used. Exposure data is data for exposing and forming a photosensitive resist by exposure apparatuses, such as a linear drawing apparatus using a laser beam, UV light, etc., in the exposure pattern corresponding to a wiring pattern.

The photosensitive resist means the etching resist used when forming a wiring pattern by etching metal foil, such as copper foil, by the photolithographic method. An exposure pattern means the pattern exposed to the photosensitive resist based on exposure data, and corresponds to the developing pattern formed by subsequent image development. The development pattern preparation device 106 is an apparatus for developing a photosensitive resist exposed to an exposure pattern to form a development pattern.

The fail turn device 108 is a device for performing a circuit process on a substrate on which a development pattern is formed to form a fail turn. For example, an etching apparatus can be used. Circuit processing means forming a failure turn, for example, forming a wiring pattern by etching a metal foil by a subtract method. The failure turn can be formed by the failure turn forming means. A failure turn means the wiring pattern actually formed by performing circuit formation, for example, the wiring pattern obtained by etching metal foil by the subtract method.

The upper and lower data generating apparatus 110 is an apparatus which creates data displayed by the coordinates of the upper and lower (bottom) and the lower (bottom) of the failure turn and the resultant values such as the circuit width and the gap width. In the present embodiment, an optical appearance inspection device (AOI: Automatic Optical Inspection) is used to create the bottom data. The AOI can be used to detect light reflected from the top of the failure turn (top), digitize the pattern, and use the data displayed as coordinates, and result values such as circuit width and gap width. In addition, a metal microscope (sometimes referred to simply as a "microscope") having a measurement function can be used to create bottom and bottom data. Here, the upper and lower data generation apparatus 110 receives the input of the lower and lower result values measured using the microscope, and creates the lower and lower data based on this.

The exposure data correction apparatus 112 acquires the first bottom data and the bottom data created by the upper and lower data creation apparatus 110, and determines the correlation between the first upper and lower data. Further, a second thread different from the first failure turn or the data obtained from the bottom in the region including the region different from at least a portion of the first failure turn, which is created by the upper and lower data creation apparatus 110. The second bottom data is obtained based on the data obtained from the bottom of the pattern. And generating a difference between the result value determined in the design data and the result value in the failure turn based on the design data for the failure turn, the second bottom data and the determined correlation used to obtain the second bottom data. A correction function indicating the relationship between the factor and the correction amount for suppressing the difference is determined, and the exposure data for the failure turn used to obtain the second bottom data is corrected based on the correction function.

The factor that causes the difference between the result value determined in the design data and the result value in the failure turn is the result value determined in the design data and the result value in the failure turn due to variations in the wiring pattern specification of the design data. Means a factor that causes a change in the difference. As such a factor, any or any combination of two or more of the pattern gap, the pattern size, the pattern thickness, the pattern position, the pattern density, the pattern shape, etc. of the design data of a failure turn are mentioned, for example. In the present embodiment, as a factor for generating a difference between the failure turn data and the original data, a pattern gap of a wiring pattern (here, a gap between a line and a line) is used. The correction function defines a relationship between a factor for generating a difference and a correction amount of exposure data for suppressing the difference.

As the exposure data correction device 112, in the present embodiment, a computer 200 having a hardware configuration shown in FIG. 2 is used. The computer 200 includes a processing unit (processor) 201, a display unit 202, an input unit 203, a storage unit 204, a communication unit 205, and a bus 210 for connecting each component thereof. The display unit 202 displays an image output by a program executed in the computer 200. The input unit 203 accepts input from a user, for example, a keyboard or a mouse. The storage unit 204 may be anything as long as it can store information such as a nonvolatile memory, a volatile memory, a hard disk, and the like. A program 206 for executing a process for correcting exposure data is stored in the storage unit 204. The communication unit 205 performs wireless communication, wired communication using an Ethernet (registered trademark) cable, a USB cable, or the like. Through the communication unit 205, the bottom and bottom data and the bottom and bottom data created by the upper and lower data creation apparatus 110 may be acquired. When the program 206 is executed, the processing unit (processor) 201 executes a process for correcting exposure data. The exposure data correction device 112 does not need to be a general-purpose computer, but may be realized by hardware for performing all or part of each step and software operating in cooperation with this.

The operation flow of the system in this embodiment is shown in FIG. First, the design data creation device 101 creates the design data for the first failure turn (step 301), and the exposure data creation device 102 creates the exposure data based on this design data (step) (302)). The exposure apparatus 104 exposes an exposure pattern to the photosensitive resist disposed on the substrate based on the exposure data created by the exposure data generating apparatus 102 (step 304). The developing pattern producing device 106 develops the photosensitive resist exposed to the exposure pattern to form a developing pattern (step 306), and the fail-turn producing device 108 performs circuit processing on the substrate on which the developing pattern is formed. Form a first failure turn (step 308). The upper and lower data generation apparatus 110 creates the first upper and lower data (step 310). When the second bottom data is generated from the bottom of the first failure turn, the second bottom data is also created here. Moreover, the whole data obtained from a 1st failure turn can also be made into 2nd bottom data, and one part can also be made into 1st bottom data.

Next, it is determined whether it is necessary to create a second failure turn for exposure data correction (step 312). For example, when the second bottom data is obtained from the bottom of the first failure turn, it is not necessary to create the second failure turn. If necessary, the process returns to the design data creation step 301, and the same process is performed to form the second failure turn, and in step 310, the bottom bottom data of the second failure turn is generated. The bottom data of the second failure turn are not created. When the bottom bottom data of the second failure turn is not generated or after the second failure turn is generated, the exposure data correction step 314 is performed to end the operation flow for exposure data correction. Thereafter, based on the corrected exposure data, for example, the wiring pattern is formed using the exposure apparatus 104, the developing pattern generating apparatus 106, and the fail-turn generating apparatus 108 to manufacture a wiring board. .

In FIG. 4, the exposure data correction step 314 will be described in more detail. First, the exposure data correction device 112 obtains the first bottom data based on the data obtained from the bottom bottom in at least a portion of the first failure turn created by the bottom and bottom data creation apparatus 110 (step (401), the bottom data based on the data obtained from the bottom in at least one area of the first failure turn is acquired (step 402), and the correlation between the first bottom data and the bottom data is determined ( Process 404). In addition, the exposure data correction device 112 is configured to obtain data or data obtained from the bottom of the bottom in an area including a region different from at least a portion of the first failure turn, which is created by the bottom and bottom data generation device 110. The second bottom data is acquired based on the data obtained from the bottom of the second failure turn different from the one failure turn (step 406). And the result value determined in the design data and the result in the failure turn, based on the design data for the failure turn used to obtain the second bottom data, the second bottom data, and the correlation created in the process 404. A correction function indicating a relationship between a factor causing a difference in value and a correction amount for suppressing the difference is determined (step 408), and the exposure data for the failure turn used to obtain the second upper floor data is converted into the correction function. Based on the correction (step 410).

The correlation between the bottom data obtained from the bottom and the bottom data obtained from the bottom is considered to depend on the pattern gap, the pattern size, the thickness of the pattern, the pattern position, the pattern density, the pattern shape, and the like. Therefore, once the correlation is determined, the same pattern gap and the like are applied to other bottom data obtained by the AOI data, so that the new bottom value corresponding to the other bottom data is not manually measured. It is possible to accurately estimate the bottom and bottom data. By creating a correction function based on this estimated bottom data, the error of the exposure data correction amount can be suppressed and the circuit width accuracy at the time of fine circuit formation can be improved.

The correction function is considered to change depending on the area on the substrate from which data is acquired. On the other hand, it is considered that the correlation between the bottom data and the bottom data does not change relatively depending on the area on the substrate from which the data is acquired. For this reason, for example, the measurement of the first bottom data and the bottom data for determining the correlation is performed only in a limited area of the first failure turn to determine the correlation with little effort, and the determined correlation is determined in this first thread. By applying to the second bottom data obtained using the AOI from the entire pattern, a more accurate correction function can be obtained in consideration of the tendency of the entire substrate while reducing the effort for the first failure turn itself.

Since a correlation and a correction function may change with the area | region on a board | substrate, you may determine a correlation and a correction function for every area | region of the same board | substrate surface in which wiring pattern was arrange | positioned. The relationship between the design data and the resultant value may be a unique relationship depending on the area even on the same substrate. For example, in the vicinity of the center of the substrate, the etching liquid tends to be high and the etching speed is low. Therefore, the pattern gap tends to be narrow, and in the vicinity of the substrate, the etching rate is fast, so the pattern gap tends to be wide. In addition, at the substrate angle, since the current concentrates at the time of forming the copper film by electroplating, the copper film tends to be thick, and it is considered that the correlation between the bottom data and the bottom data is different from other regions. For this reason, it becomes possible to form a circuit with higher precision by determining a correlation and a correction function according to this embodiment for every area | region of the same board | substrate surface.

In addition, you may determine a correction function for every upper surface and lower surface of the same board | substrate with which the wiring pattern was arrange | positioned. Similar to the area of the substrate surface, the correlation and the correction function may be different. For example, since the upper surface has a tendency for the etching liquid to be easy and the etching speed is slow, the pattern gap tends to be narrow, and the lower surface tends to be fast, so the pattern gap tends to be wide. For this reason, it becomes possible to form a circuit with higher precision by determining a correlation and a correction function for every upper surface and lower surface of the same board | substrate surface according to this embodiment.

In addition, since the relationship between the design data and the resultant value in the wiring pattern may be different, a correction function may be determined for each of the vertical line and the horizontal line in the wiring pattern.

Second Embodiment

2nd Embodiment of this invention is described below. This embodiment differs from the first embodiment in that the process 500 (FIG. 5) is employed instead of the process 314 (FIGS. 3 and 4) of the first embodiment, but the other points are the first embodiment. Same as In the following description, only the part different from 1st Embodiment is demonstrated, and the same part is abbreviate | omitted.

For understanding of the invention, a copper clad laminate of 0.22 mm thick MCL-E-700G (trade name manufactured by Hitachi Kasei Co., Ltd.) having a copper foil of 5 µm on an insulating layer as a substrate was prepared, and was about 19 µm by electroplating. Plating was carried out, the copper thickness was set to about 18 µm by half etching (full surface etching treatment for thinning the copper thickness of the entire substrate), the test pattern as the first failed turn was exposed, and the circuit was formed. The case where the board | substrate for correlation extraction was produced is demonstrated as an example.

In the present embodiment, the first bottom data generated in the step 310 is configured for the result value measured at the bottom in at least a portion of the first failure turn and for the first failure turn corresponding to the result value. Correction data based on the difference between the result values determined in the design data, wherein the bottom data includes a result value measured at the bottom of at least a portion of the first failure turn and a first room corresponding to the result value. Correction amount data based on the difference of the determined result value in the design data for the pattern.

In this embodiment, although the gap width of a wiring pattern is used as a result value, it is clear to those skilled in the art that similarly the present invention can be implemented also when other result values, such as a circuit width, are used. The same applies to other embodiments described below.

Here, in the four corners of the first failing turn and the predetermined area in the center, the gap width at the bottom is measured using the AOI, and the gap width determined from the design data in the coordinates at which the gap widths are measured. Is calculated as the correction amount data. Similarly, as a correction amount of the bottom data, the gap width at the bottom of the four corners of the first failed turn and the predetermined region in the center is measured using a microscope, and the design data in the coordinates at which the gap widths are measured. The difference with the gap width is calculated as the correction amount data. Here, the area | region where measurement for upper and lower data is made into the same area. By comparing between the data obtained from the same area, it is possible to obtain a more accurate correlation between the bottom data and the bottom data.

The correction amount data in the first bottom data and the bottom data created from the correlation extraction substrate obtained based on the conditions described above are as follows.

CAD data in Table 1 shows the gap width (micrometer) determined in the design data. The resultant value of the AOI measurement indicates the gap width (μm) of the upper bottom at the four corners and the center region of the test pattern obtained by the AOI measurement corresponding to the gap width determined in the design data, and the correction amount is the gap width of the CAD data. (Μm) and the difference between the gap widths of the AOI measurements were made 1/2. 1/2 means the amount of correction applied to both ends of the gap. The same applies to the microscopic measurement. The result of the microscopic measurement indicates the gap width at the bottom of the four corners and the center region of the test pattern obtained by the microscopic measurement, and the correction amount is 1/2 the difference between the gap width of the CAD data and the gap width of the microscopic measurement. It is. For example, the CAD data = 20, the AOI measurement result value = 44.1, and the microscopic measurement result value = 28.4, the design should be a gap of 20 µm, and the gap width at the bottom measured by AOI is 44.1 µm. And the gap width measured by the microscope was 28.4 μm. And based on the AOI measurement result, this clearance of CAD data should be corrected by 12.0 micrometers at both ends, and based on microscope measurement, 4.2 micrometers will be corrected.

Subsequently, the exposure data correction device 112 acquires the first bottom data and the bottom data created in the step 310 by the bottom data and the bottom data creation device 110 (steps 501 and 502). The first provisional correction function is determined based on the correction amount data in the first bottom data (step 504), and the second provisional correction function is determined based on the correction amount data in the bottom data (step 506). Based on the difference (shift amount) between the correction amount obtained from the first provisional correction function and the second provisional correction function corresponding to the correction amount, a correction amount difference function is created (step 508).

In this embodiment, a 1st provisional correction function is a function (AOI measurement correction function (etching curve)) which shows the correction amount for AOI measurement gap width with respect to the gap width in the design data shown in Table 1 and FIG. The second temporary correction function is a function (microscope measurement correction function) indicating a correction amount for the microscopic measurement gap width with respect to the gap width in the design data. Here, although the relationship between the clearance gap and the correction amount in each design data shown in Table 1 and FIG. 6 is each temporary correction function, the temporary correction function may be determined by an approximation formula based on the measurement data. The correction amount difference function is a difference between the correction amount obtained from the first provisional correction function with respect to the gap width in the design data shown in Table 1 and FIG. 6 and the correction amount obtained from the second provisional correction function corresponding to the correction amount (shift. Function). Similarly to the provisional correction function, the relationship between the gap and the shift amount in each of the design data shown in Table 1 and FIG. 6 is used as a correction amount difference function. The correction amount difference function may be determined by an approximation equation based on the measurement data.

Next, in step 510, the second bottom bottom data is acquired. In the present embodiment, the second bottom data includes a result value measured at the bottom in an area including an area different from at least a part of the first failure turn and the first failure turn corresponding to the result value. In the correction value data based on the difference of the determined result value in the design data or the result value measured at the bottom of the second failure turn different from the first failure turn, and the design data for the second failure turn corresponding to the result value. Correction amount data based on the difference of the determined result value.

Then, the third provisional correction function is determined based on the design data for the failure turn and the second phase data used to acquire the second bottom data (step 512), and the third temporary correction is based on the correction amount difference function. The function is corrected to determine a correction function (step 514), and the exposure data is corrected based on this correction function (step 516).

Here, the second bottom data includes the result value measured at the upper floor of the entire failure turn including the four corners and the center of the first failure turn, and the design data for the first failure turn corresponding to the result value. It is assumed that the correction amount data based on the difference of the determined result value is included. Therefore, the failure turn used to acquire the second bottom data is the first failure turn.

The correction amount data in the second bottom bottom data created from the correlation extraction substrate obtained based on the conditions described above are as follows.

CAD data in Table 2 shows the gap width (micrometer) determined in the design data. The correction amount of the AOI measurement is a half of the difference between the gap width (µm) and the gap width (µm) of the CAD data at the bottom of the test pattern obtained by the AOI measurement. The shift amount is the shift amount in Table 1 (the difference between the correction amount for AOI measurement and the correction amount for microscope measurement). In this embodiment, the correction amount difference function is a function indicating a shift amount with respect to the gap width in the design data shown in Table 2 and FIG. 7.

In the present embodiment, the third provisional correction function is a function (AOI measurement correction function (etching curve)) indicating a correction amount for the AOI measurement gap width with respect to the gap width in the design data shown in Table 2 and FIG. 7. . Then, the third temporary correction function is corrected by shifting by the correction amount difference function (shift amount). Here, a correction function is obtained by subtracting the shift amount from the correction amount for the AOI measurement for the gap value of each design data. The correction function is a function indicating a corrected correction amount (correction amount after shift in Table 2) with respect to the gap width in the design data. Here, although the relationship of the amount of correction after shift with respect to the gap width in the design data shown in Table 2 and FIG. 7 is used as a correction function, the correction function may be determined by an approximation equation based on the measurement data.

In the present embodiment, although the second bottom data is obtained based on the result value measured at the bottom of the entire failure turn including the four corners and the center of the first failure turn, it is used to obtain the first bottom data. It may be only a portion not including the four corners and the center of the first failed turn, and may be based on the result value measured at the bottom of the second failed turn different from the first failed turn. The same applies to other embodiments.

Embodiment 3

A third embodiment of the present invention will be described below. This embodiment differs from the first embodiment in that the process 800 (FIG. 8) is employed instead of the process 314 (FIGS. 3 and 4) of the first embodiment, but the other points are the first embodiment. Same as In the following description, only the part different from 1st Embodiment is demonstrated, and the same part is abbreviate | omitted. In addition, the correlation extraction board | substrate created on the conditions same as the conditions demonstrated in 2nd Embodiment is demonstrated as an example.

In this embodiment, the 1st bottom data created in the process 310 contains the result value measured in the at least one area | region of the top bottom of a 1st failure turn, and the bottom data is the It includes the result measured in at least a portion of the bottom. In the four corners of the first failing turn and the predetermined area in the center, the gap width at the bottom is measured using AOI, and the bottom corner data is measured using a microscope as the bottom and bottom data. The gap width at the bottom of the predetermined area is measured.

The exposure data correction device 112 acquires the first bottom data and the bottom data created in the step 310 by the bottom data and the bottom data creation device 110 (steps 801 and 802), and the design data is added to the design data. The first result function representing the relationship between the factor causing the difference between the result value determined in the step and the result value in the failure turn and the result value in the first bottom data is determined (step 804). Determine a second result function representing the relationship between the factor causing the difference between the determined result value and the result value in the failure turn and the result value in the bottom data (step 806), and the first result function And a result difference function based on the difference between the second result function and the second result function (step 808). This determines the correlation between the bottom data and the bottom data.

The resultant data in the 1st bottom data and the bottom data which were created from the correlation extraction board | substrate obtained based on the conditions mentioned above are as follows.

As in Table 1, the CAD data in Table 3 represents the gap width (µm) determined in the design data, and the AOI measurement and the results of the microscope are the test patterns obtained by the measurement corresponding to the gap width determined in the design data. The gap width (micrometer) of an upper bottom and a lower bottom in four corners and a center area | region is shown. As the measured result value in Table 3, the same thing as what was shown in Table 1 is used. The difference is 1/2 of the difference between the gap width of the AOI measurement and the gap width of the microscope measurement corresponding to the gap width of each CAD data. For example, the CAD data = 20, the AOI measurement result value = 44.1, and the microscopic measurement result value = 28.4, the design should be a gap of 20 µm, and the gap width at the bottom measured by AOI is 44.1 µm. And the gap width measured by the microscope was 28.4 μm. And the difference of the AOI measurement result value and the microscopic measurement result value is 15.7, and the value difference = 7.8 micrometers was obtained as the value which rounded the half value.

In this embodiment, a 1st result value function is a function (AOI measurement result value function) which shows the result value of AOI measurement gap width with respect to the gap width in the design data shown in Table 3 and FIG. A result value function is a function (microscope measurement result function) which shows the result value of the microscopic measurement gap width with respect to the gap width in design data. Here, although the relationship between the clearance gap and the result value in each design data shown in Table 3 and FIG. 9 is used as a result value function, the result value function may be determined by an approximation formula based on the measurement data. The resultant difference function is a function indicating the difference between the AOI measurement result and the microscope measurement result with respect to the gap in the design data shown in Table 3 and FIG. 9. Similarly to the resultant function, the relationship between the difference between the AOI measurement result and the microscope measurement result with respect to the gaps in the design data shown in Table 3 and Fig. 9 is used as the resultant difference function, which is an approximation based on the measurement data. The result difference function may be determined by an equation.

Next, in step 810, second bottom bottom data is acquired. In the present embodiment, the second bottom data includes a result value measured at the bottom in an area including an area different from at least a part of the first failure turn and a first failure turn corresponding to the result value. The correction value data based on the difference of the determined result value in the design data for the second data or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value. Correction amount data based on the difference of the determined result value.

Then, a temporary correction function is determined based on the design data for the failure turn and the second bottom data used to acquire the second bottom data (step 812), and the temporary correction function is based on the result difference function. The correction is made to determine the correction function (step 814).

Here, the same thing as 2nd Embodiment is used for 2nd bottom bottom data. The correction amount data (AOI measurement) in the second bottom data generated from the correlation extraction substrate obtained based on the above conditions is as shown in Table 4, which is the same as that shown in Table 2.

In this embodiment, the provisional correction function is a function (AOI measurement correction function (etching curve)) indicating the correction amount for the AOI measurement gap width with respect to the gap width in the design data shown in Table 4 and FIG. 10. Then, the temporary correction function is corrected by shifting the resultant difference function. Here, a correction function is obtained by subtracting the result value difference (shift amount) from the correction amount for the AOI measurement for the gap value of each design data. The correction function is a function indicating the corrected correction amount with respect to the gap width in the design data. Here, although the relationship of the amount of correction after shift with respect to the gap width in the design data shown in Table 4 and FIG. 10 is used as a correction function, the correction function may be determined by an approximation equation based on the measurement data.

Embodiment 4

A fourth embodiment of the present invention will be described below. This embodiment differs from the first embodiment in that the process 1100 (FIG. 11) is employed instead of the process 314 (FIGS. 3 and 4) of the first embodiment, but the other points are the first embodiment. Same as In the following description, only the part different from 1st Embodiment is demonstrated, and the same part is abbreviate | omitted. In addition, the board | substrate for correlation extraction manufactured on the same conditions as the conditions demonstrated in 2nd Embodiment is demonstrated as an example.

In the present embodiment, the first bottom data generated in the step 310 is configured for the result value measured at the bottom in at least a portion of the first failure turn and for the first failure turn corresponding to the result value. Correction data based on the difference between the result values determined in the design data, wherein the bottom data includes a result value measured at the bottom of at least a portion of the first failure turn and a first room corresponding to the result value. Correction amount data based on the difference of the determined result value in the design data for the pattern.

The second bottom data is determined in the result value measured at the bottom in an area including an area different from at least a part of the first failure turn and in the design data for the first failure turn corresponding to the result value. The difference between the resultant value measured at the bottom of the second failure turn different from the correction amount data or the first failure turn based on the difference of the resultant value, and the resultant value determined in the design data for the second failure turn corresponding to the resultant value. Correction amount data based on the data.

The exposure data correction device 112 acquires the first bottom data and the bottom data created in the step 310 by the bottom bottom data and the bottom bottom data creating device 110 (steps 1101 and 1102), and the first bottom bottom. The correction amount correlation function of the correction amount indicated in the correction amount data in the data and the correction amount shown in the correction amount data in the bottom data corresponding to the correction amount is determined (step 1104). This determines the correlation between the bottom data and the bottom data.

After acquiring the second bottom data (step 1106), the provisional correction function is determined based on the design data for the failure turn and the second bottom data used to acquire the second bottom data (step 1108). ), The provisional correction function is corrected based on the correction amount correlation function to determine a correction function (step 1110), and the exposure data is corrected based on this correction function (step 1112).

The correction amount data in the first bottom data and the bottom data created from the correlation extraction substrate obtained on the basis of the conditions described above are as shown in Table 1 in relation to the second embodiment. It is FIG. 12 which showed the relationship of the correction amount based on the microscopic measurement with respect to the correction amount based on AOI measurement in Table 1 in FIG. For example, looking at the rows of CAD data = 20, the correction amount based on the AOI measurement = 12.1, while the correction amount based on the microscopic measurement = 4.2. In this case, the coordinates of (x, y) = (12.1, 4.2) are plotted. After this is done for all data, the correlation is determined by an approximation equation. Here, the correlation was determined by linear approximation, and y = 1.2861x-10.563 was obtained as the correction amount correlation function.

The correction amount data in the second bottom bottom data created from the correlation extraction substrate is as shown below. The corrected correction amount y is calculated by setting the correction amount based on the AOI measurement as x and substituting it into the correction amount correlation function (y = 1.2861x-10.563) described above.

In this embodiment, the temporary correction function is a function (AOI measurement correction function (etching curve)) indicating the correction amount for the AOI measurement gap width with respect to the gap width in the design data shown in Table 5 and FIG. 13. The correction function is obtained by correcting the provisional correction function with the correction amount correlation function. The correction function is a function indicating the corrected correction amount with respect to the gap width in the design data. Here, although the relationship of the correction amount with respect to the clearance width in the design data shown in Table 5 and FIG. 13 is a correction function, you may determine a correction function by the approximation formula based on measurement data.

[Embodiment 5]

A fifth embodiment of the present invention will be described below. This embodiment differs from the first embodiment in that the process 1400 (FIG. 14) is employed instead of the process 314 (FIGS. 3 and 4) of the first embodiment, but the other points are the first embodiment. Same as In the following description, only the part different from 1st Embodiment is demonstrated, and the same part is abbreviate | omitted. In addition, the board | substrate for correlation extraction manufactured on the same conditions as the conditions demonstrated in 2nd Embodiment is demonstrated as an example.

In this embodiment, the 1st bottom data created in the process 310 contains the result value measured in the at least one area | region of the top bottom of a 1st failure turn, and the bottom data is the It includes the result measured in at least a portion of the bottom.

The exposure data correction device 112 acquires the first bottom data and the bottom data created by the bottom data and the bottom data creation device 110 (steps 1401 and 1402), and the result measured in the first bottom data. A result correlation function of the measured result value in the value and the bottom data is determined (step 1404). This determines the correlation between the bottom data and the bottom data.

In step 1406, the second bottom bottom data is acquired. The second bottom data is a result measured at the bottom in an area including an area different from at least a portion of the first failure turn or a result measured at the bottom of a second failure turn different from the first failure turn. Contains a value.

Based on the determined result correlation function, the estimated value of the result value at the corresponding bottom is calculated from the result value in the second bottom data (step 1408), and the failure turn used to obtain the second bottom data is calculated. The correction function is determined based on the difference between the result value determined in the design data and the result value at the estimated bottom corresponding to the result value (step 1410). The exposure data is corrected based on this correction function (step 1412).

The resultant values in the first bottom data and the bottom data created from the correlation extraction substrate obtained based on the conditions described above are as shown in Table 3 in relation to the third embodiment. It is FIG. 15 which showed the relationship of the result value based on the microscopic measurement with respect to the result value based on AOI measurement in Table 3 in FIG. For example, looking at the row of CAD data = 20, the result value in AOI measurement = 44.1, On the other hand, the result value based on a microscope measurement = 28.4. In this case, plot the coordinates of (x, y) = (44.1, 28.4). After this is done for all data, the correlation is determined by an approximation equation. Here, the correlation was determined by linear approximation, and y = 1.0177x-13.389 was obtained as a result correlation function.

The resultant data in the 2nd bottom bottom data created from the correlation extraction board | substrate are as showing below. The resultant value based on AOI measurement is set to x, and substituted into the correction amount correlation function (y = 1.0177x-13.389) mentioned above, and computes the estimated bottom result value (gap width). Then, the difference between the calculated estimated result value (gap width) and the design result value in the CAD data is defined as a correction amount.

The correction amount with respect to the gap width in the design data shown in this table is expressed as a correction function (etching curve) as shown in FIG. 16. The correction function is a function indicating a correction amount based on the estimated result value for the gap width in the design data. Here, although the relationship of the correction amount with respect to the clearance width in the design data shown in Table 6 and FIG. 16 is made into a correction function, you may determine a correction function by the approximation formula based on the calculated data.

Example

In order to confirm the effect of this embodiment, a copper clad laminate of 0.22 mm thick MCL-E-700G (trade name, manufactured by Hitachi Kasei Co., Ltd.) having a copper foil of 5 µm was prepared, and electroplated copper plate of about 19 µm The plating was performed, the copper thickness was set to about 18 µm by half etching, the exposure data was corrected by the correction function obtained in the above-described embodiments 2 to 5, and the exposure, development, and circuit formation of the failed turn were performed, The formation substrate was produced. The circuit forming board | substrates formed using the correction function created by the process of Embodiments 2-5 are Example 1-4, respectively.

Comparative Example 1

As Comparative Example 1, a copper clad laminate of 0.22 mm thick MCL-E-700G (trade name manufactured by Hitachi Kasei Co., Ltd.) having a copper foil of 5 µm was prepared, and electroplated copper plating was carried out at about 19 µm, The copper thickness was about 18 micrometers by half etching, the test pattern was exposed, the circuit formation was performed, and the board | substrate for correction function extraction was produced. And the circuit width and the gap width were measured with the microscope for this correction function extraction board | substrate, and the correction function (etching curve) was created from this measured value.

A copper clad laminate of 0.22 mm thick MCL-E-700G (trade name manufactured by Hitachi Kasei Co., Ltd.) having a copper foil of 5 µm was prepared, plated at about 19 µm by electroplating, and copper was plated by half etching. The thickness was made about 18 micrometers, exposure data was corrected with the said correction function (bottom width), exposure, development, and circuit formation of a failure turn were performed, and the circuit formation board | substrate was produced.

Comparative Example 2

A copper clad laminate of 0.22 mm thick MCL-E-700G (trade name manufactured by Hitachi Kasei Co., Ltd.) having a copper foil of 5 µm was prepared, plated at about 19 µm by electroplating, and copper was plated by half etching. The thickness is about 18 µm, the test pattern is exposed, the circuit is formed, and the substrate for correction function extraction is produced. The circuit width and the gap width were measured by the optical automatic appearance inspection apparatus on the board | substrate for correction function extraction, and the correction function (etching curve) was created from the said measured value.

A copper clad laminate of 0.22 mm thick MCL-E-700G (trade name manufactured by Hitachi Kasei Co., Ltd.) having a copper foil of 5 µm was prepared, plated at about 19 µm by electroplating, and copper was plated by half etching. The thickness was made about 18 micrometers, exposure data was corrected with the correction function (top width), exposure, development, and circuit formation of a failure turn were performed, and the circuit formation board was produced.

[compare]

In Tables 7 and 8, measurement results of Examples 1 to 4, Comparative Example 1, and Comparative Example 2 are shown. Each item of Tables 7 and 8 shows the design value and the microscope measurement value regarding a line (circuit width). In addition, "L / S = 50/40" of Table 7 shows that L (line: circuit width) is a design specification of 50 micrometers, and S (space: gap width) is 40 micrometers, and "L / S of Table 8 is shown. = 50/50 "denotes a design specification in which L (line: circuit width) is 50 µm and S (space: gap width) is 50 µm. Examples 1 and 2 are finally obtained because the difference is based on the difference between the amount of correction based on the bottom and the result value or on the difference of the result value itself when determining the correlation between the bottom and bottom data. The correction function is the same. Therefore, the result obtained by Examples 1 and 2 also becomes the same.

As shown in Table 7, for the design specifications of L / S = 50/40, the dimensional accuracy (variation: 3σ) of the circuit width in Examples 1 and 2 is 6.7 on the upper surface and 8.8 µm on the lower surface. In 3, it was upper surface 6.5, lower surface 8.4 micrometer, and in Example 4, it was upper surface 6.7, lower surface 9.0 micrometer. In contrast, in Comparative Example 1, the upper surface was 7.1 and the lower surface was 9.7 µm, and in Comparative Example 2, the upper surface was 7.6 and the lower surface was 20.5 µm.

In addition, as shown in Table 8, about the design specification of L / S = 50/50, the dimensional precision (variation: 3σ) of the circuit width in Example 1 and 2 is 6.0 at the upper surface, 7.7 micrometer at the bottom, In Example 3, it was upper surface 5.8, lower surface 7.4 micrometer, and in Example 4, upper surface 6.0 and lower surface 8.3 micrometer. In contrast, in Comparative Example 1, the upper surface was 6.4 and the lower surface was 9.2 µm, and in Comparative Example 2, the upper surface was 6.0 and the lower surface was 8.8 µm.

From these results, it can be seen that in the fluctuations in the upper and lower surfaces, Examples 1 to 4 of the present invention all show better characteristics than the comparative examples, and the circuit width precision is improved by using the present invention.

Each embodiment described above is an illustration for explaining the present invention, and the present invention is not limited to these embodiments. The present invention can be implemented in various forms without departing from the gist thereof.

100: wiring pattern forming system
101: design data generator
102: exposure data generating device
104: exposure apparatus
106: developing pattern generator
108: fail turn device
110: lower and lower data generation device
112: exposure data correction device
200: computer
201 processing part
202: display unit
203: input unit
204 memory
205: communication unit
206: exposure data correction program
1700: substrate
1701: wiring pattern
1702: top width
1704: bottom width

Claims (22)

An exposure data correction device for correcting exposure data for creating a wiring pattern,
The first upper floor based on the data obtained from the upper floor in the at least one area | region of the convex 1st failure turn which has the upper and lower bottom obtained by the circuit processing using exposure data based on the design data for the target wiring pattern. Get the data,
Acquiring the bottom data based on the data obtained from the bottom in at least one area of the first failure turn,
Determine a correlation between the first bottom data and the bottom data,
Second bottom data based on data obtained from a bottom in an area including an area different from at least a portion of the first fail turn or data obtained from a bottom of a second fail turn different from the first fail turn; To obtain the
Generating a difference between the result value determined in the design data and the result value in the failure turn based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determine a correction function indicating the relationship between the factor and the correction amount for suppressing the difference,
Correcting exposure data for a failure turn used to obtain the second bottom data based on the correction function,
Exposure data correction device. The method of claim 1, wherein the first bottom data is determined in a result value measured at an upper floor in at least a portion of the first failure turn and in design data for the first failure turn corresponding to the result value. Includes correction amount data based on the difference of the result values,
The bottom data is based on a difference between a result value measured at the bottom of at least a portion of the first failure turn and a result value determined in the design data for the first failure turn corresponding to the result value. Including correction amount data,
The second bottom data is a result value measured at a bottom in an area including an area different from at least a part of the first failure turn and design data for the first failure turn corresponding to the result value. In the correction amount data based on the difference of the result value determined in the or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value A correction amount data based on the difference of the determined result value,
Determining the correlation,
A first provisional correction function is determined based on the correction amount data in the first bottom data;
A second provisional correction function is determined based on the correction amount data in the bottom data,
Creating a correction amount difference function based on the difference between the correction amount obtained from the first provisional correction function and the correction amount obtained from the second provisional correction function corresponding to the correction amount;
Determining the correction function,
Determine a third provisional correction function based on the design data for the failure turn used to obtain the second bottom data and the second bottom data,
And correcting the third provisional correction function based on the correction amount difference function to determine a correction function. The method according to claim 1, wherein the first bottom data includes a result value measured in at least a portion of an area of the bottom of the first failure turn,
The bottom data includes a result value measured in at least a portion of the bottom of the first failure turn;
The second bottom data is a result value measured at a bottom in an area including an area different from at least a part of the first failure turn and design data for the first failure turn corresponding to the result value. In the correction amount data based on the difference of the result value determined in the or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value A correction amount data based on the difference of the determined result value,
Determining the correlation,
Determining a first result function indicating a relationship between a factor that generates a difference between the result value determined in the design data and the result value in the failure turn and the result value in the first bottom data;
Determining a second result function indicating a relationship between a factor for generating a difference between the result value determined in the design data and the result value in the failure turn and the result value in the bottom data;
Determining a result difference function based on the difference between the first result function and the second result function;
Determining the correction function,
Determine a provisional correction function based on the design data for the failure turn used to acquire the second bottom data and the second bottom data,
And correcting the provisional correction function based on the result difference function to determine a correction function. The method of claim 1, wherein the first bottom data is determined in a result value measured at an upper floor in at least a portion of the first failure turn and in design data for the first failure turn corresponding to the result value. Includes correction amount data based on the difference of the result values,
The bottom data is based on a difference between a result value measured at the bottom of at least a portion of the first failure turn and a result value determined in the design data for the first failure turn corresponding to the result value. Including correction amount data,
The second bottom data is a result value measured at a bottom in an area including an area different from at least a part of the first failure turn and design data for the first failure turn corresponding to the result value. In the correction amount data based on the difference of the result value determined in the or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value A correction amount data based on the difference of the determined result value,
Determining the correlation includes determining a correction amount correlation function of a correction amount appearing in the correction amount data in the first upper and lower data and a correction amount appearing in the correction amount data in the lower data corresponding to the correction amount. ,
Determining the correction function,
Determine a provisional correction function based on the design data for the failure turn used to acquire the second bottom data and the second bottom data,
And correcting the provisional correction function based on the correction amount correlation function to determine a correction function. The method according to claim 1, wherein the first bottom data includes a result value measured in at least a portion of an area of the bottom of the first failure turn,
The bottom data includes a result value measured in at least a portion of the bottom of the first failure turn;
The second bottom data is measured at a bottom in an area including an area different from at least a part of the first failure turn or at a bottom of a second failure turn different from the first failure turn. Contains the measured results,
Determining the correlation includes determining a resultant correlation function of the resultant value measured in the first upper and lower data and the resultant value measured in the lower and lower data,
Determining the correction function,
Based on the determined result correlation function, the estimated value of the result value at the bottom corresponding to the result value is calculated on the basis of the result value in the second bottom data,
Determining a correction function based on the difference between the result value determined in the design data for the failure turn used to obtain the second bottom data and the result value at the estimated bottom corresponding to the result value; Exposure data correction device. The resultant value contained in the said 1st and 2nd bottom data is a thing based on the data obtained by the optical visual inspection apparatus, The said bottom data is the data obtained by a microscope. Exposure data correction apparatus which is based on. The exposure data correction device according to any one of claims 1 to 5, wherein the correction function is determined for each region of the same substrate surface on which the wiring pattern is arranged. The exposure data correction device according to any one of claims 1 to 5, wherein the correction function is determined for each of the upper and lower surfaces of the same substrate on which the wiring pattern is arranged. The exposure data correction device according to any one of claims 1 to 5, wherein the correction function is determined for each of the vertical line and the horizontal line in the wiring pattern. Exposure data creation means for creating exposure data based on design data of a target wiring pattern;
Pattern exposure means for exposing the exposure pattern to the photosensitive resist disposed on the substrate based on the exposure data;
Developing pattern forming means for developing a photosensitive resist exposed to the exposure pattern to form a developing pattern;
Failure turn forming means for performing a circuit processing on the substrate on which the development pattern is formed to form a failure turn;
Bottom data preparation means for creating bottom data based on data obtained from the bottom in at least a portion of the failure turn;
Bottom data creation means for creating bottom data based on data obtained from the bottom in at least a portion of the failure turn;
The wiring pattern forming system provided with the exposure data correction apparatus in any one of Claims 1-5 which corrects exposure data based on the said bottom data, bottom data, and design data. A computer-readable recording medium having recorded thereon a program for correcting exposure data for creating a wiring pattern, comprising:
The first upper floor based on the data obtained from the upper floor in the at least one area | region of the convex 1st failure turn which has the upper and lower bottom obtained by the circuit processing using exposure data based on the design data for the target wiring pattern. The process of acquiring data,
Acquiring the bottom data based on the data obtained from the bottom in at least a portion of the first failure turn;
Determining a correlation between the first bottom data and the bottom data;
Second bottom data based on data obtained from a bottom in an area including an area different from at least a portion of the first fail turn or data obtained from a bottom of a second fail turn different from the first fail turn. Process of acquiring
Generating a difference between the result value determined in the design data and the result value in the failure turn based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determining a correction function indicating a relationship between a factor and a correction amount for suppressing the difference,
And a program for executing a process of correcting exposure data for a failure turn used to obtain the second bottom data based on the correction function. A method for correcting exposure data for creating a wiring pattern,
The first upper floor based on the data obtained from the upper floor in the at least one area | region of the convex 1st failure turn which has the upper and lower bottom obtained by the circuit processing using exposure data based on the design data for the target wiring pattern. The process of acquiring data,
Acquiring the bottom data based on the data obtained from the bottom in at least a portion of the first failure turn;
Determining a correlation between the first bottom data and the bottom data;
Second bottom data based on data obtained from a bottom in an area including an area different from at least a portion of the first fail turn or data obtained from a bottom of a second fail turn different from the first fail turn; Process of acquiring
Generating a difference between the result value determined in the design data and the result value in the failure turn based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determining a correction function indicating a relationship between a factor and a correction amount for suppressing the difference,
Correcting exposure data for a failure turn used to obtain the second bottom data based on the correction function. The first upper floor based on the data obtained from the upper floor in the at least one area | region of the convex 1st failure turn which has the upper and lower bottom obtained by the circuit processing using exposure data based on the design data for the target wiring pattern. The process of acquiring data,
Acquiring the bottom data based on the data obtained from the bottom in at least a portion of the first failure turn;
Determining a correlation between the first bottom data and the bottom data;
Second bottom data based on data obtained from a bottom in an area including an area different from at least a portion of the first fail turn or data obtained from a bottom of a second fail turn different from the first fail turn. Process of acquiring
Generating a difference between the result value determined in the design data and the result value in the failure turn based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determining a correction function indicating a relationship between a factor and a correction amount for suppressing the difference,
Correcting exposure data for the failure turn used to obtain the second bottom data based on the correction function;
The wiring board manufacturing method including the process of forming a wiring pattern based on the said exposure data. The method of claim 13, wherein the first bottom data is determined in a result value measured at an upper floor in at least a portion of the first failure turn and in design data for the first failure turn corresponding to the result value. Includes correction amount data based on the difference of the result values,
The bottom data is based on a difference between a result value measured at the bottom of at least a portion of the first failure turn and a result value determined in the design data for the first failure turn corresponding to the result value. Including correction amount data,
The second bottom data is a result value measured at a bottom in an area including an area different from at least a part of the first failure turn and design data for the first failure turn corresponding to the result value. In the correction amount data based on the difference of the result value determined in the or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value A correction amount data based on the difference of the determined result value,
The process of determining the correlation,
Determining a first provisional correction function based on the correction amount data in the first upper floor data;
Determining a second provisional correction function based on the correction amount data in the bottom data;
A step of creating a correction amount difference function based on the difference between the correction amount obtained from the first provisional correction function and the correction amount obtained from the second provisional correction function corresponding to the correction amount;
The process of determining the correction function,
Determining a third provisional correction function based on the design data for the failure turn used to acquire the second bottom data and the second bottom data;
And modifying the third provisional correction function based on the correction amount difference function to determine a correction function. The method of claim 13, wherein the first bottom data includes a result value measured in at least a portion of an area of the bottom of the first failure turn,
The bottom data includes a result value measured in at least a portion of the bottom of the first failure turn;
The second bottom data is a result value measured at a bottom in an area including an area different from at least a part of the first failure turn and design data for the first failure turn corresponding to the result value. In the correction amount data based on the difference of the result value determined in the or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value A correction amount data based on the difference of the determined result value,
The process of determining the correlation,
A step of determining a first result function indicating a relationship between a factor for generating a difference between the result value determined in the design data and the result value in the failure turn and the result value in the first bottom data;
Determining a second resultant function indicating a relationship between a factor for generating a difference between the resultant value determined in the design data and the resultant value in the failure turn and the resultant value in the bottom data;
Determining a result difference function based on the difference between the first result function and the second result function;
The process of determining the correction function,
Determining a provisional correction function based on design data for the failure turn used to acquire the second bottom data and the second bottom data;
And modifying the provisional correction function based on the result difference function to determine a correction function. The method of claim 13, wherein the first bottom data is determined in a result value measured at an upper floor in at least a portion of the first failure turn and in design data for the first failure turn corresponding to the result value. Includes correction amount data based on the difference of the result values,
The bottom data is based on a difference between a result value measured at the bottom of at least a portion of the first failure turn and a result value determined in the design data for the first failure turn corresponding to the result value. Including correction amount data,
The second bottom data is a result value measured at a bottom in an area including an area different from at least a part of the first failure turn and design data for the first failure turn corresponding to the result value. In the correction amount data based on the difference of the result value determined in the or the result value measured at the bottom of the second failure turn different from the first failure turn and the design data for the second failure turn corresponding to the result value A correction amount data based on the difference of the determined result value,
The step of determining the correlation includes determining a correction amount correlation function of the correction amount indicated in the correction amount data in the first upper and lower data and the correction amount indicated in the correction amount data in the lower data corresponding to the correction amount. Including,
The process of determining the correction function,
Determining a provisional correction function based on design data for the failure turn used to acquire the second bottom data and the second bottom data;
And modifying the provisional correction function based on the correction amount correlation function to determine a correction function. The method of claim 13, wherein the first bottom data includes a result value measured in at least a portion of an area of the bottom of the first failure turn,
The bottom data includes a result value measured in at least a portion of the bottom of the first failure turn;
The second bottom data is measured at a bottom in an area including an area different from at least a part of the first failure turn or at a bottom of a second failure turn different from the first failure turn. Contains the measured results,
The step of determining the correlation includes a step of determining a resultant correlation function of the resultant value measured in the first upper and lower data and the resultant value measured in the lower and lower data,
The process of determining the correction function,
Calculating an estimated value of a result value at the bottom corresponding to the result value based on the result value in the second bottom data based on the determined result value correlation function;
Determining a correction function based on the difference between the result value determined in the design data for the failure turn used to obtain the second bottom data and the result value at the estimated bottom corresponding to the result value. , Wiring board manufacturing method. 18. The data obtained according to any one of claims 13 to 17, wherein the resultant values included in the first and second bottom data are based on data obtained by an optical appearance inspection device, and the bottom data is data obtained by a microscope. It is based on the wiring board manufacturing method. The wiring board manufacturing method according to any one of claims 13 to 17, wherein the correction function is determined for each region of the same substrate surface on which the wiring pattern is arranged. The wiring board manufacturing method in any one of Claims 13-17 in which the said correction function is determined for every upper surface and lower surface of the same board | substrate with which the wiring pattern was arrange | positioned. The wiring board manufacturing method according to any one of claims 13 to 17, wherein the correction function is determined for each of the vertical line and the horizontal line in the wiring pattern. A process of creating exposure data based on design data of a target wiring pattern;
Exposing the exposure pattern to a photosensitive resist disposed on the substrate based on the exposure data;
Developing a photosensitive resist exposed to the exposure pattern to form a development pattern;
Performing a circuit processing on the substrate on which the development pattern is formed to form a first failure turn;
Creating first bottom data based on data obtained from the bottom in at least a portion of the first failure turn;
Creating bottom data based on data obtained from bottom in at least a portion of said first failure turn;
Determining a correlation between the first bottom data and the bottom data;
Second bottom data based on data obtained from a bottom in an area including an area different from at least a portion of the first fail turn or data obtained from a bottom of a second fail turn different from the first fail turn. To create a process,
Generating a difference between the result value determined in the design data and the result value in the failure turn based on the design data for the failure turn used to obtain the second bottom data, the second bottom data and the correlation. Determining a correction function indicating a relationship between a factor and a correction amount for suppressing the difference,
Correcting exposure data for a failure turn used to obtain the second bottom data based on the correction function;
And forming a wiring pattern based on the corrected exposure data.

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