TW201711941A - Electronic component conveyance working table, characteristic measurement device, sorting device and packing tape device wherein the working table is provided with a small temperature deviation in an outer edge portion and a small moment of inertia - Google Patents

Abstract

The present invention provides an electronic component conveyance working table having a relatively small temperature deviation in an outer edge portion and a relatively small moment of inertia (inertia). The electronic component conveyance working table is formed to be a disc shape, and includes a central portion 2 for forming a mounting mechanism, an outer edge portion 5 for forming a plurality of recess portions (not shown), and a middle portion 7 disposed between the central portion 2 and the outer edge portion 5. Each of the recess portions stores an electronic component (not shown), and the electronic component is conveyed by means of rotation. The middle portion 5 is formed with a plurality of hollow portions 8 passing through a front main surface and a back main surface. In a top view, the plurality of hollow portions 8 are arranged separately on a plurality of concentric circles with different diameters.

Description

Worktable for electronic component transfer, characteristic measuring device, screening device, and strap device

The present invention relates to a disc-shaped electronic component transporting table in which an electronic component is housed in a recess formed in an outer edge portion and transports electronic components in a circumferential direction. More specifically, the temperature deviation of the outer edge portion is small. Further, the workpiece transfer table for electronic parts having a small inertia moment (inertia) in the circumferential direction of the rotary shaft. In addition, in this application, the terms of inertia moment and inertia all mean the circumferential direction of the rotating shaft of the electronic component transfer table.

Moreover, the present invention relates to a characteristic measuring device, a screening device, and a packaging device for an electronic component using the above-described electronic component transfer table of the present invention.

In the electronic component-based measuring device, the electronic component screening device, the electronic component packaging device, and the like, a disk-shaped electronic component transfer table that transports electronic components in a circumferential manner is used (hereinafter, only the operation is omitted) Taiwan" to record).

The above-described table is disclosed in, for example, Patent Document 1 (Japanese Laid-Open Patent Publication No. 2003-300616).

The table 1000 disclosed in Patent Document 1 is shown in Figs. 16 and 17 . 16 is a plan view of the table 1000. Fig. 17 is a cross-sectional view showing the main part of a state in which the table 1000 is mounted on the table driving device 110.

The table 1000 has a disk shape.

In the central portion 102 of the table 1000, one central hole 103 and four positioning holes 104 penetrating between the two main faces are formed as attachment mechanisms.

A plurality of recesses (workpiece recesses) 106 for accommodating electronic components are formed on the outer edge portion 105 of the table 1000.

The table 1000 is attached to the table drive mechanism 110, for example, as shown in FIG.

The table drive mechanism 110 has a disk-shaped table mounting portion (workbench fastening portion) 111 and a shaft (protrusion portion) 112.

The table 1000 is disposed above the table mounting portion 111, and the shaft 112 is inserted into the center hole 103. Further, the bolt 114 is inserted into the positioning hole 104 via the disk washer 113, and the bolt 114 is fastened to the table mounting portion 111.

The table 1000 attached to the table drive mechanism 110 in this manner repeatedly rotates and stops at a high speed, and transports the electronic components (workpieces) in a circumferential shape.

That is, a drive source such as a stepping motor (not shown) is connected to the shaft 112 of the table drive mechanism 110, and by controlling the drive source, the table 100 repeatedly rotates and stops at a high speed.

The table driving device 110 constitutes, for example, part of a characteristic measuring device for an electronic component.

The above-described characteristic measuring device is disclosed in, for example, Patent Document 2 (Japanese Patent Laid-Open Publication No. 2007-240158).

The characteristic measuring device of Patent Document 2 is for measuring the resistance value of the thermistor.

In the characteristic measuring device of Patent Document 2, the table is repeatedly rotated and stopped at a high speed. That is, when the electronic component is housed in the concave portion and the electrical characteristics of the electronic component are measured in the measurement region, the table needs to be completely stopped. Further, in order to store the electronic components and measure the electrical characteristics, in order to accommodate the next electronic component and measure the electrical characteristics of the next electronic component, the table needs to be rotated immediately and then stopped.

In the characteristic measuring device, in order to rotate and stop the table at a high speed, the weight of the table is reduced, and the inertia moment in the circumferential direction of the rotating shaft of the table is reduced. Sex) is more effective.

Conventionally, in order to reduce the weight of the table, a hollow portion penetrating the two main faces is provided at an intermediate portion between the center portion and the outer edge portion of the transfer table.

Three previous work stations 1100 to 1300 are shown in Figs. 18 to 20 .

Fig. 18 is a plan view showing the table 1100 of the previous example 1 in which the hollow portion is not formed.

Fig. 19 is a plan view showing the table 1200 of the previous example 2 in which the hollow portion 108 is formed.

Fig. 20 is a plan view showing the table 1300 of the previous example 3 in which the hollow portion 118 is formed.

As shown in FIG. 18, the table 1100 of the first example has one center hole 103 and four positioning holes 104 formed in the center portion 102.

The table 1100 is formed with a plurality of recesses for accommodating electronic components on the outer edge portion 105. However, in Fig. 18, for the sake of convenience of observation, the illustration of the concave portion is omitted (the same applies to the following drawings).

In the table 1100, a hollow portion is not formed in the intermediate portion 107.

As a result, the table 1100 has a larger weight and a larger inertia than the tables 1200 and 1300 in which the hollow portion is formed as described below. The inertia of the table 1100 is 5.10E-06 (kg.m ² ).

Since the table 1100 has a large inertia, the time from the stop of the stepping motor to the complete stop is long. Therefore, it is necessary to wait for the waiting time from the stop of the stepping motor to the measurement of the electrical characteristics of the electronic component. Therefore, the measurement efficiency of the characteristic measuring apparatus using the table 1100 is inferior. In addition, before the workbench is completely stopped, that is, when the workbench is still vibrating or the like, if the electrical characteristics of the electronic component are measured, the electrode of the electronic component is scratched by the measurement terminal, or the measurement error becomes large. .

The table 1200 of the previous example 2 shown in Fig. 19 is formed with eight sector-shaped hollow portions 108 in the intermediate portion 107.

As a result, the table 1200 has a smaller weight and less inertia than the table 1100. The amount of the hollow of the table 1200 (the weight reduced by the hollow portion / the weight without the hollow portion reducing the weight) was 48%. Further, the inertia of the table 1200 is 3.39E-06 (kg.m ² ).

The inertia of the table 1200 is small, and the time from the stop of the stepping motor to the complete stop is short. Therefore, after the stepping motor is stopped, the electrical characteristics of the electronic component can be measured in the measurement area in a short time. Therefore, the measurement efficiency of the characteristic measuring apparatus using the table 1200 is high.

Further, in the table 1300 of the previous example 3 shown in FIG. 20, eight circular hollow portions 118 are formed in the intermediate portion 107.

As a result, the table 1300 is also the same as the table 1200, and has a smaller weight and less inertia than the table 1100. The amount of the hollow of the table 1300 is 18%. Further, the inertia of the table 1300 is 4.36E-06 (kg.m ² ).

The inertia of the table 1300 is small, and the time from the stop of the stepping motor to the complete stop is short. Therefore, after the stepping motor is stopped, the electrical characteristics of the electronic component can be measured in the measurement area in a short time. Therefore, the measurement efficiency of the characteristic measuring apparatus using the table 1200 is high.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-300616

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-240158

As described above, in order to reduce the moment of inertia (inertia) in the circumferential direction of the rotating shaft of the table, it is effective to form a hollow portion on the table to reduce the weight of the table.

However, if a hollow portion is formed on the table, a new problem arises in that the temperature at the outer edge portion of the table is deviated.

That is, the driving mechanism of the mounting table is provided with a stepping motor or the like that generates heat. The source, the self-driving source transfers heat to the central portion of the table via the shaft, so that the central portion of the table becomes extremely hot.

Although the temperature in the central portion of the workbench is also a problem, the bigger problem is that the temperature at the outer edge of the workbench is deviated.

For example, in the characteristic measuring device, the resistance value of the thermistor such as the NTC thermistor or the PTC thermistor is measured. However, the thermistor is an electronic component in which the resistance value changes depending on the temperature, and if the temperature of the edge portion of the table on which the recess of the thermistor is formed is deviated, the thermal sensitivity cannot be accurately measured. The resistance value of the resistor. In other words, the temperature of each of the thermistors conveyed to the measurement area by the table is different due to the temperature deviation of the outer edge of the table, and the resistance value of the thermistor cannot be accurately measured.

In the table 1100 of the prior art example 1 shown in Fig. 18 in which the hollow portion is not formed, for example, when the temperature of the portion where the temperature of the central portion 102 is the highest is 50 ° C, the temperature of the outer edge portion 105 is uniformly 31.4 ° C, and no temperature deviation occurs. .

On the other hand, in the table 1200 which forms the hollow portion 108 of the previous example 2, as shown in FIG. 21, when the temperature of the portion where the temperature of the central portion 102 is the highest is 50 ° C, the maximum temperature of the temperature of the outer edge portion 105 is MAX. At 28.248 ° C, the minimum temperature MIN is 27.057 ° C, resulting in a temperature difference of 1.191 ° C.

Further, in the table 1300 of the previous example 3 in which the hollow portion 118 is formed, as shown in Fig. 22, when the temperature of the portion where the temperature of the central portion 102 is the highest is 50 ° C, the maximum temperature MAX of the outer edge portion 105 is 29.315. °C, the minimum temperature MIN is 28.806 ° C, resulting in a temperature difference of 0.509 ° C.

As described above, in order to reduce the inertia of the table, it is effective to form a hollow portion on the table to reduce the weight of the table. However, if the hollow portion is formed, the temperature at the outer edge portion of the table is generated. Since the deviation is used, when it is used in the case of the characteristic measuring device, the electrical characteristics cannot be accurately measured.

In the present invention, the electronic component transporting table (the electronic component transporting table described in the first aspect of the present invention) has a disk shape and includes a center in which the mounting mechanism is formed. a portion having a plurality of recessed outer edge portions and an intermediate portion between the central portion and the outer edge portion, wherein each of the recessed portions houses an electronic component, and the electronic component is transferred by rotation, and the front surface is formed in the intermediate portion. A plurality of hollow portions of the front surface and the back main surface, and in a case of a plan view, a plurality of hollow portions are disposed on a plurality of concentric circles having different diameters.

Further, the electronic component transporting table according to another aspect of the present invention (the electronic component transporting table described in claim 2) has a disk shape, and includes a central portion in which the mounting mechanism is formed and a plurality of recesses are formed. The edge portion and the intermediate portion between the central portion and the outer edge portion respectively store one electronic component in each concave portion, and convey the electronic component by rotation, and form a plurality of hollow portions penetrating the front main surface and the back main surface in the intermediate portion Each of the hollow portions has a groove shape, and in a plan view, a plurality of groove-shaped hollow portions are radially arranged from the center of the electronic component transfer table to the outer edge.

In the electronic component transporting table of the first invention (the electronic component transporting table described in the first aspect of the invention), it is preferable that the plurality of hollow portions are disposed on at least one concentric circle and disposed in the other When a plurality of hollow portions on at least one concentric circle are arranged in the circumferential direction around the center of the electronic component transfer table, and the outer edge of the electronic component transfer table is viewed from the center of the electronic component transfer table At least one hollow portion is formed over the entire outer edge of the electronic component transfer table. This is because, in this case, the deviation of the temperature of the outer edge portion can be made smaller.

Further, the hollow portion may have a groove shape, the groove-shaped hollow portion being disposed along a concentric circle, and concentric circles at the intermediate portion forming a connecting beam. In this case, the number of the connecting beams formed on the concentric circles is preferably the same as the concentric circles on the outer edge side of the electronic component transfer table from the concentric circles on the center side of the electronic component transfer table. Become more. This is because, in this case, the heat of the center portion of the worktable for electronic component transfer can be made to the electron zero. The outer edge of the transfer table is finely dispersed, and the temperature difference of the outer edge portion is made smaller. Further, the connecting beams formed on the respective concentric circles are preferably formed at equal intervals. In this case, the heat of the center portion of the electronic component transfer table can be uniformly dispersed toward the outer edge portion of the electronic component transfer table, and the temperature difference between the outer edge portions can be further increased. small. Further, the connecting beam formed at the intermediate portion is preferably formed into a fractal shape. This is because, in this case, the temperature difference of the outer edge portion can be made extremely small.

Further, when the outer edge of the electronic component transporting table is viewed from the center of the electronic component transporting table, it is preferable that the connecting beam is formed to be bilaterally symmetrical when at least one point on the outer edge is viewed. In this case, the heat of the center portion of the electronic component transfer table can be uniformly dispersed along the outer edge portion of the electronic component transfer table, and the temperature of the outer edge portion is deviated. smaller.

Also, the hollow portion may be circular or polygonal. In this case, in order to disperse the heat evenly, when observing at least one point on the outer edge when observing the outer edge of the electronic component transfer table from the center of the electronic component transfer table, The connecting beam formed by forming a circular or polygonal hollow portion is also preferably formed to be bilaterally symmetrical.

Further, in the electronic component transporting table of the second invention (the electronic component transporting table described in the second aspect of the invention), it is preferable that the width of the connecting beam formed in the intermediate portion is from the electronic component transfer. The center of the workbench widens to the outer edge. This is because, in this case, the deviation of the temperature of the outer edge portion can be made smaller.

Further, it is also preferable that the hollow portion which is radially arranged from the center to the outer edge is formed in a curved shape. This is because, in this case, the heat dissipation path (connection beam) from the central portion to the outer edge portion becomes long, and the temperature of the outer edge portion is more likely to be more uniform.

Further, in the electronic component transfer table of the present invention, the hollow portion can be filled with a material having a lower material density than the intermediate portion. In this case, the inertia moment (inertia) can be reduced while suppressing the decrease in the strength of the electronic component transfer table. Again, for example, If the thermal conductivity of the material used for filling is equal to the thermal conductivity of the material constituting the intermediate portion, it is easy to make the temperature of the outer edge portion more uniform. Alternatively, if the thermal conductivity of the material used for filling is higher than the thermal conductivity of the material constituting the intermediate portion, the heat of the central portion can be efficiently dissipated to the outer edge portion. Alternatively, if the thermal conductivity of the material for filling is lower than the thermal conductivity of the material constituting the intermediate portion, it is possible to suppress the influence of the heat of the central portion on the outer edge portion and to improve the strength.

Further, a film can be adhered to at least one of the main surfaces of the upper and lower surfaces of the upper surface of the electronic component transfer table of the present invention. In this case, heat can be dissipated through the film, and as a result, the temperature of the outer edge portion becomes more uniform. More specifically, for example, if the thermal conductivity of the film is higher than the thermal conductivity of the material constituting the intermediate portion, the heat at the center portion can be efficiently dissipated to the outer edge portion. Alternatively, if the thermal conductivity of the film is lower than the thermal conductivity of the material constituting the intermediate portion, it is possible to suppress the influence of the heat of the central portion on the outer edge portion and to dissipate heat.

Further, in the electronic component transporting table of the present invention, it is preferable to reduce the moment of inertia by 20% or more by providing the hollow portion. This is because, in this case, the time until the stepping motor for driving is stopped until the electronic component transporting table is completely stopped is sufficiently small.

The electronic component transfer table of the present invention can be used, for example, for a characteristic measuring device for an electronic component. In this case, the electrical characteristics of the electronic component can be accurately measured. Moreover, the electronic component transfer table of the present invention can also be used for a screening device or a packaging device for electronic components.

The temperature deviation at the outer edge portion of the table for transporting electronic parts of the present invention is small, and the moment of inertia (inertia) is small.

2‧‧‧ Central Department

3‧‧‧Center hole (installation mechanism)

4‧‧‧Positioning holes (mounting mechanism)

5‧‧‧The outer edge

7‧‧‧Intermediate

8, 18, 28, 38, 48, 58, 108, 118‧‧ ‧ hollow

9, 19, 29, 39, 49, 59‧‧‧ connecting beams

52‧‧‧film

100, 200, 300, 400, 500, 600, 700, 800, 1000, 1100, 1200, 1300‧‧‧Working table for electronic parts transfer (workbench)

102‧‧‧Central Department

103‧‧‧ center hole

104‧‧‧Positioning holes

105‧‧‧The outer edge

106‧‧‧ recess

107‧‧‧Intermediate

110‧‧‧Workbench drive

111‧‧‧Workbench installation

112‧‧‧Axis

113‧‧‧Disc washer

114‧‧‧ bolt

Fig. 1 is a plan view showing an electronic component transfer table 100 according to the first embodiment.

FIG. 2 is a plan view showing a temperature distribution of the electronic component transfer table 100.

Fig. 3 is a plan view showing the electronic component transfer table 200 of the second embodiment.

4 is a plan view showing a temperature distribution of the electronic component transfer table 200.

Fig. 5 is a plan view showing the electronic component transfer table 300 of the third embodiment.

FIG. 6 is a plan view showing a temperature distribution of the electronic component transfer table 300.

Fig. 7 is a plan view showing the electronic component transfer table 400 of the fourth embodiment.

FIG. 8 is a plan view showing a temperature distribution of the electronic component transfer table 400.

Fig. 9 is a plan view showing the electronic component transfer table 500 of the fifth embodiment.

FIG. 10 is a plan view showing a temperature distribution of the electronic component transfer table 500.

Fig. 11 is a graph showing the relationship between the hollow amount of the electronic component transfer table and the temperature difference of the outer edge portion.

Fig. 12 is a graph showing the relationship between the moment of inertia (inertia) of the electronic component transfer table and the temperature difference of the outer edge portion.

Fig. 13 is a plan view showing the electronic component transfer table 600 of the sixth embodiment.

Fig. 14 is a plan view showing the electronic component transfer table 700 of the seventh embodiment.

Fig. 15 is a plan view showing the electronic component transfer table 800 of the eighth embodiment.

FIG. 16 is a plan view showing the electronic component transfer table 1000 disclosed in Patent Document 1.

Fig. 17 is a cross-sectional view showing the essential part of the electronic component transfer table 1000 attached to the electronic component transfer table driving device.

FIG. 18 is a plan view showing the electronic component transfer table 1100 of the first example.

Fig. 19 is a plan view showing the electronic component transfer table 1200 of the second example.

FIG. 20 is a plan view showing the electronic component transfer table 1300 of the third example.

21 is a plan view showing a temperature distribution of the electronic component transfer table 1200.

FIG. 22 is a plan view showing a temperature distribution of the electronic component transfer table 1300.

Hereinafter, embodiments for carrying out the invention will be described together with the drawings.

Furthermore, each embodiment exemplarily shows an embodiment of the present invention, and the present invention is not limited to the embodiment. Further, the contents described in the different embodiments can be combined and implemented, and the implementation in this case is also included in the present invention. Further, the drawings are merely for the sake of easy understanding of the embodiments, and may not be drawn strictly. For example, the dimensional ratio between the constituent elements or constituent elements of the drawing may not match the dimensional ratio of the components described in the specification. In addition, there are cases where the constituent elements described in the specification are omitted in the drawings, or when the number is omitted, the drawing is performed.

[Embodiment 1]

In FIG. 1, the electronic component transfer table 100 of the first embodiment (which may be omitted as described above as "workbench 100" may be used; and the same applies to the following embodiments).

The table 100 is made of, for example, ceramics and has a disk shape. However, the material of the table 100 is not limited to ceramics, and may be a glass fiber reinforced epoxy glass material.

A central hole 3 and four positioning holes 4 penetrating between the two main faces are formed in the central portion 2 of the table 100 as an attachment mechanism. The center hole 3 is for inserting a shaft of a table drive mechanism (not shown). The positioning hole 4 is for inserting a bolt or the like, and fastens the table 100 to a table mounting portion of the table drive mechanism or the like. However, the mounting mechanism is not limited to the center hole 3 and the positioning hole 4, and other methods are also possible.

A plurality of recesses for accommodating electronic components are formed on the outer edge portion 5 of the table 100. However, in FIG. 1, as described above, for the sake of convenience of observation, the illustration of the concave portion is omitted (the same applies to the following drawings).

The size of the recess is of course larger than the size of the electronic components that are housed. The shape and size of the electronic components housed in the recess are arbitrary. However, in the case of a rectangular parallelepiped of an electronic component, for example, the longitudinal dimension is about 0.05 mm to 10 mm, the lateral dimension is about 0.05 mm to 10 mm, and the height dimension is about 0.05 mm to 10 mm. Moreover, when the electronic component is in the form of a disk, it may be, for example, a diameter of about 0.05 mm to 10 mm, and a thickness dimension. It is about 0.05mm~10mm.

The number of the recesses is arbitrary, and may be, for example, 50 to 500.

In the present embodiment, the diameter of the table 100 is set to 68 mm. Further, regarding the thickness of the table 100, the thickness of the portion of the center portion 2 where the attachment mechanism is formed is 0.78 mm, and the thickness of the portion of the outer edge portion 5 where the recess is formed is 0.18 mm, and the thickness of the other portion is made. Set to 0.48mm.

Although the diameter of the table 100 is arbitrary in the present invention, it may be, for example, about 50 mm to 500 mm. Further, although the thickness of the table 100 is arbitrary, the thickness of the center portion 2 may be about 0.5 mm to 30 mm, and the thin portion of the outer edge portion 5 may be about 0.05 mm to 10 mm.

A plurality of hollow portions 8 are formed in the intermediate portion 7 between the central portion 2 and the outer edge portion 5 of the table 100. A connecting beam 9 is formed in the intermediate portion 7 by forming the hollow portion 8.

Although the width dimension of the beam 9 is arbitrary, in order to maintain the strength, for example, it is desirable to be about 0.25 mm or more.

In the table 100 of the present embodiment, the hollow portion 8 is formed in a groove shape. Further, the plurality of hollow portions 8 are arranged in a concentric shape having five different diameters centering on the center of the table 100. The hollow portions 8 in the groove shape are arranged along concentric circles.

As can be seen from Fig. 1, the hollow portion 8 disposed on the concentric circle on the center portion 2 side of the table 100 has a longer length of the groove, and is disposed on the concentric circle on the outer edge portion 5 side of the table 100. 8, the shorter the length of the groove.

As a result, three hollow portions 8 are arranged on the first concentric circle from the side of the center portion 2. Six hollow portions 8 are arranged on the second concentric circle. There are 12 hollow portions 8 arranged on the third concentric circle. 24 hollow portions 8 are arranged on the fourth concentric circle. 48 hollow portions 8 are arranged on the fifth concentric circle.

Moreover, for each concentric circle having a different diameter, the hollow portion 8 is staggered in the circumferential direction, so that when the outer edge of the table 100 is viewed from the center of the table 100, the work is performed. At least one hollow portion 8 is formed on the entire outer edge of the table 100.

The hollow portion 8 is formed on the table 100 as described above, so that the connecting beam 9 formed in the intermediate portion 7 is formed in a so-called fractal shape. Fractal means that the same shape (branch) changes the shape in which the scale repeats.

In the table 100 of the present embodiment, since the connecting beam 9 is formed in a fractal shape, even if the temperature of the center portion 2 becomes high due to the stepping motor of the table driving mechanism or the like, the heat thereof is uniformly dispersed and simultaneously transmitted to Since the outer edge portion 5 is formed, no temperature deviation occurs in the outer edge portion 5. Or, even if a temperature deviation occurs, it is extremely small.

Moreover, when viewing the outer edge from the center of the workbench, the table 100 of the present embodiment looks at at least one point on the outer edge (for example, at the connection center and at the center portion 2). The connecting beam 9 can also be formed to be bilaterally symmetrical when the side of the concentric circle is provided on the outer edge of the line connecting the beam 9 of the hollow portion 8. As a result, in the table 100, even if the temperature of the center portion 2 is high due to the stepping motor of the table driving mechanism or the like, the heat is uniformly dispersed and transmitted to the outer edge portion 5, so that the outer edge portion 5 does not A temperature deviation is generated. Or, even if a temperature deviation occurs, it is extremely small.

The temperature distribution of the stage 100 at a temperature at which the temperature of the central portion 2 is the highest is 50 °C. Furthermore, the measurement of the temperature distribution of the stage 100 can be performed using, for example, infrared thermal imaging.

The temperature distribution of the stage 100 is shown in FIG.

In the table 100, when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 ° C, the temperature of the outer edge portion 5 is uniformly 25.039 ° C, and no temperature deviation occurs.

Further, since the table 100 is formed with a hollow portion as described above, the weight is small and the inertia is small. The amount of the hollow of the table 100 (the weight which is reduced by the hollow portion/the weight when the hollow portion is not used) is 53%, and the weight is greatly reduced. Further, the inertia of the table 100 is 2.32E-06 (kg.m ² ), which is sufficiently small.

As described above, the temperature deviation of the outer edge portion of the table 100 of the present embodiment is small, and the moment of inertia (inertia) is small. When the table 100 is used in the characteristic measuring device disclosed in Japanese Laid-Open Patent Publication No. 2007-240158, the electrical characteristics (for example, the resistance value) of the electronic component (for example, the thermistor) can be accurately and efficiently used. The measurement was carried out.

Workbench 100 can be manufactured using the general manufacturing methods used in prior manufacturing workbenches. That is, the hollow portion 8 can be formed in the same manner as the center hole 3 or the positioning hole 4.

[Embodiment 2]

In Fig. 3, the table 200 of the second embodiment is shown.

The table 200 is configured in the same manner as the table 100 of the first embodiment shown in Figs. 1 and 2 except for the shape, number, and arrangement of the hollow portion 18 and the connecting beam 19.

120 circular hollow portions 18 are formed in the intermediate portion 7 of the table 200.

The hollow portion 18 is arranged in a concentric shape having five different diameters centering on the center of the table 200. That is, 24 hollow portions 18 are respectively disposed on the respective concentric circles.

Moreover, in the table 200, for each concentric circle having a different diameter, the hollow portion 18 is staggered in the circumferential direction. Therefore, when the outer edge of the table 200 is viewed from the center of the table 200, the table 200 is At least one hollow portion 18 is formed over the entire outer edge.

Further, when the table 200 is viewed from another angle, the connecting beam 19 is formed on the concentric circle of the intermediate portion 7 by forming the circular hollow portion 18, and is observed when the outer edge is viewed from the center of the table. In the case of at least one point on the outer edge, the formed connecting beam 19 can also be formed to be bilaterally symmetrical.

In the table 200 of the present embodiment, the shape, number, and arrangement of the hollow portion 18 or the connecting beam 19 are as described above, and even if the temperature of the center portion 2 is changed to a high temperature by a stepping motor of the table driving mechanism, the heat is also Evenly dispersed and simultaneously transmitted to the outer edge portion 5, the temperature deviation at the outer edge portion 5 is reduced.

In Fig. 4, the temperature distribution of the stage 200 when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 °C. In the work table 200, the highest temperature portion of the central portion 2 When the temperature is 50 ° C, the maximum temperature MAX of the outer edge portion 5 is 28.663 ° C, the minimum temperature MIN is 28.629 ° C, and the temperature deviation is only 0.034 ° C. In the table 200, the deviation of the temperature of the outer edge portion 5 is reduced.

The amount of the hollow of the table 200 is 24%. The inertia of the table 200 is 3.86E-06 (kg.m ² ), which is a sufficiently small value.

[Embodiment 3]

In Fig. 5, a table 300 of the third embodiment is shown.

The table 300 has been modified to the table 200 of the second embodiment shown in Figs. 3 and 4 .

Specifically, the arrangement of the table 300 with respect to the table 200 and the hollow portion 28 and the connecting beam 29 is changed. Furthermore, the shape and number of the hollow portions 28 of the table 300 are the same as those of the table 200.

120 circular hollow portions 28 are formed in the intermediate portion 7 of the table 300.

The hollow portion 28 is arranged in a concentric shape having five different diameters centering on the center of the table 300. That is, 24 hollow portions 28 are disposed on the respective concentric circles.

As shown in FIG. 5, in the table 300, the hollow portions 28 disposed on the concentric circles having different diameters are arranged in a straight line from the center to the outer edge portion of the table 300. In the table 200 of the second embodiment, for each concentric circle having a different diameter, the hollow portion 18 is staggered in the circumferential direction, and when the outer edge of the table 200 is viewed from the center of the table 200, the table 200 is placed on the table 200. At least one hollow portion 18 is formed over the entire outer edge. On the other hand, when the hollow portion 28 of the table 300 is disposed in the outer periphery of the table 300 from the center of the table 300, the area where the five hollow portions 28 are formed and the hollow portion 28 are not formed. The areas are alternately set.

Fig. 6 shows the temperature distribution of the stage 300 when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 °C. In the table 300, when the temperature of the highest temperature portion of the central portion 2 is 50 ° C, the maximum temperature MAX of the outer edge portion 5 is 29.167 ° C, the minimum temperature. The MIN is 29.128 ° C and the temperature difference is 0.039 ° C. This temperature difference is a sufficiently small value that is sufficiently improved as compared with the previous example.

However, when the temperature distribution of the table 300 is compared with the temperature distribution of the table 200, the temperature of the outer edge portion 5 of the table 200 is lower, and the temperature of the maximum temperature MAX and the minimum temperature MIN of the outer edge portion 5 is lower. The difference is smaller. In the table, in order to suppress the temperature deviation of the outer edge portion, it is understood that the table portion 200 is more preferably arranged such that the hollow portion 18 is formed in a plurality of concentric circles having different diameters, and further, for each concentric circle having a different diameter, The hollow portion 18 is arranged to be shifted in the circumferential direction, and when the outer edge is viewed from the center of the table, at least one hollow portion 18 is formed over the entire outer edge.

The table 300 of the present embodiment has a hollow amount of 24%, which is the same as the table 200. Further, the inertia of the table 200 is also 3.86E-06 (kg.m ² ), which is the same as the table 200.

[Embodiment 4]

In Fig. 7, the table 400 of the fourth embodiment is shown.

In the table 400, a plurality of hexagonal hollow portions 38 are disposed on the entire surface of the intermediate portion 7.

In the table 400, the connecting beam 39 is formed to be relatively thin.

In Fig. 8, the temperature distribution of the stage 400 when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 °C. In the table 400, when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 ° C, the maximum temperature MAX of the outer edge portion 5 is 27.083 ° C, the minimum temperature MIN is 26.707 ° C, and the temperature difference is 0.376 ° C. This temperature difference is larger than the stages 100 to 300 of the first to third embodiments, but is significantly smaller than the previous example. It is considered that in the table 400, a plurality of hexagonal hollow portions 38 are formed on the entire surface of the intermediate portion 7, so that the path formed by the connecting beam 39 from the center to the outer edge of the table 400 becomes a non-uniform length. The position, the temperature difference between the maximum temperature MAX and the minimum temperature MIN is relatively large.

The amount of the hollow of the table 400 is 52%, and the amount of weight reduction is larger than that of the other embodiments. As a result, the inertia is also extremely small, being 1.99E-06 (kg.m ² ).

[Embodiment 5]

In Fig. 9, a table 500 of the fifth embodiment is shown.

In the table 500, 24 groove-shaped hollow portions 49 are formed in the intermediate portion 7. Each of the hollow portions 49 is disposed in a radial shape from the center to the outer edge of the table 500.

In the table 500, the width of the connecting beam 49 gradually widens from the center to the outer edge of the table 500.

The width of the connecting beam 49 gradually widens from the center to the outer edge of the table 500, so that the temperature of the outer edge portion becomes more uniform. The width of the connecting beam 49 is preferably such that the portion having the widest width on the outer edge side is, for example, 1.1 times or more the portion having the smallest width on the center side.

In Fig. 10, the temperature distribution of the stage 500 when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 °C. In the table 500, when the temperature of the portion where the temperature of the center portion 2 is the highest is 50 ° C, the maximum temperature MAX of the outer edge portion 5 is 29.514 ° C, the minimum temperature MIN is 29.472 ° C, and the temperature difference is 0.42 ° C. It is considered that the temperature deviation of the outer edge portion 5 in the table 500 is small depending on the width of the connecting beam 49 gradually widening from the center to the outer edge of the table 500.

The amount of the hollow of the table 500 is 37%. The inertia of the table 50.0 is 3.32E-06 (kg.m ² ).

[Comparison of the embodiment and the previous example]

In Table 1, in the tables 100 to 500 of the first to fifth embodiments and the stages 1100 to 1300 of the previous examples 1 to 3, the respective hollow amounts are compared with the temperature difference between the inertia and the outer edge portion.

Further, in Fig. 11, the stages 100 to 500 of the first to fifth embodiments and the stages 1100 to 1300 of the previous examples 1 to 3 indicate the relationship between the hollow amount of the table and the temperature difference of the outer edge portion.

Further, in FIG. 12, the table 10 to 500 of the first to fifth embodiments and the stages 1100 to 1300 of the previous examples 1 to 3 indicate the moment of inertia (inertia) and the temperature of the outer edge portion. Bad relationship.

The following matters can be known from the study tables 1, 11, and 12.

It can be seen that the amount of the hollow amount is related to the magnitude of the inertia. That is, there is a tendency that the inertia becomes smaller as the amount of hollowness increases. However, it is considered that the inertia is not only affected by the amount of hollow, but also by the shape, number, and arrangement of the hollow portion. As a result, although the table 100 of the first embodiment has a larger amount of hollow than the table 400 of the fourth embodiment, the inertia is larger.

In order to reduce the temperature difference of the outer edge portion, it is extremely effective to form the connecting beam 9 into a fractal shape as in the table 100 of the first embodiment. In the table 100, there is no temperature difference in the outer edge portion, and the entire outer edge is uniform in temperature.

Comparing the table 200 of the second embodiment with the table 300 of the third embodiment, it is understood that in order to reduce the temperature difference at the outer edge portion, as in the table 300, for each concentric circle having a different diameter, the hollow portion is circumferentially When the outer edge is viewed from the center of the table, it is effective to form at least one hollow portion 18 on the entire outer edge of the table.

As in the table 400 of the fourth embodiment, it is effective to arrange the plurality of hollow portions 38 over the entire surface of the intermediate portion 7 to reduce the inertia. However, the table 400 has a smaller effect of reducing the temperature deviation of the outer peripheral portion than the table of the other embodiment.

In order to keep the inertia reduced while reducing the temperature deviation of the outer peripheral portion, as in the table 500 of the fifth embodiment, it is effective to arrange the groove-shaped hollow portion 49 from the center to the outer edge of the table to be radiated.

Further, in the tables 100 to 500 of the first to fifth embodiments, the inertia (inertia moment) was reduced by 20% or more as compared with the previous example 1 in which the hollow portion was not provided, which was a very good result. For example, in the table 400 of the fourth embodiment, the inertia is 39.0%, which is reduced by 60% or more, compared with the previous example 1 in which the hollow portion is not provided. The time for the electronic component transporting table of the present invention to be self-driving, for example, when the stepping motor is stopped until it is completely stopped, is sufficiently small.

As described above, according to the present invention, it is understood that the temperature deviation of the outer edge portion can be made small and And the workbench with less inertia.

Further, other embodiments will be described.

[Embodiment 6]

In Fig. 13, the table 600 of the sixth embodiment is shown.

The table 600 is modified to the table 500 of the fifth embodiment shown in Figs. 9 and 10 . That is, in the table 500, the hollow portion 48 is linear from the center to the outer edge, but the table 600 is changed in this way, and the hollow portion 58 is formed in a curved shape.

In the table 600, the connecting beam 59 is also curved, and the heat dissipation path from the center portion to the outer edge portion becomes long, and the temperature of the outer edge tends to become more uniform.

[Embodiment 7]

In Fig. 14, the table 700 of the seventh embodiment is shown.

The table 700 is modified to the table 200 of the second embodiment shown in Figs. 3 and 4 . That is, the table 700 is filled with the material 51 having a lower density than the material constituting the intermediate portion 7 in the hollow portion 18 of the table 200. For example, when the material constituting the intermediate portion 7 is zirconia (density: 5.7 g/cm ³ , thermal conductivity: 3 W/m.K), the material 51 can be bakelite (density... about 1.2 g). Resin-based material such as /cm ³ , thermal conductivity (about 0.23 W/m.K), nitrile rubber (density...about 0.98 g/cm ³ , thermal conductivity...about 0.25 W/m.K) A rubber-based material such as a rubber material, aluminum (density: about 2.7 g/cm ³ , thermal conductivity: about 230 W/m.K).

In this case, the strength reduction of the table 700 can be suppressed, and the moment of inertia (inertia) can be reduced.

Further, for example, when the thermal conductivity of the material 51 is equal to the thermal conductivity of the material constituting the intermediate portion 7, the temperature of the outer edge is more likely to be more uniform. Alternatively, if the thermal conductivity of the material 51 is higher than the thermal conductivity of the material constituting the intermediate portion 7, the heat of the central portion can be efficiently dissipated to the outer edge portion. Alternatively, if the thermal conductivity of the material 51 is lower than the thermal conductivity of the material constituting the intermediate portion 7, the influence of the heat of the central portion on the outer edge portion can be suppressed, and And can increase the strength.

[Embodiment 8]

In Fig. 15, a table 800 of the eighth embodiment is shown.

The table 800 is modified to the table 200 of the second embodiment shown in Figs. 3 and 4 . That is, the table 800 is attached to the main surface of the table 200 to adhere the film 52. More specifically, the film 52 is adhered to the portion of the upper side main surface of the outer edge portion 5 for accommodating the recess (not shown) of the electronic component and the portion of the central portion 2 where the center hole 3 and the positioning hole 4 are formed. The entire face. Further, in Fig. 15, since the concave portion is not drawn, the drawing of the film 52 at the edge portion is uniformly omitted.

Although the material of the film 52 is arbitrary, for example, even if the aluminum is adhered (density...about 2.7 g/cm ³ , thermal conductivity...about 230 W/m.K), the inertia is not hollower. The material obtained by processing the thin sheet of material.

Further, the film 52 may be adhered to the main surface of the lower side instead of the main surface of the upper side. Alternatively, it may be adhered to the two main faces of the upper side and the lower side.

The film 52 has the effect of dissipating heat, with the result that the temperature of the outer edge is more uniform. Further, the thermal conductivity of the film 52 is appropriately selected to have high thermal conductivity and low thermal conductivity.

The above description of the stages 100 to 800 of the first to eighth embodiments has been described. However, the present invention is not limited to the above, and various modifications can be made in accordance with the gist of the present invention.

For example, in the stages 100 to 300 of the first to third embodiments, the plurality of hollow portions 8, 18, and 28 are disposed separately on five concentric circles having different diameters, but the number of concentric circles is not limited to five. It can be less than 5 or more than 5.

Further, in the stages 100 to 800 of the first to eighth embodiments, the upper main surface is formed flatly. However, for example, the heat radiating fin may be provided on the upper main surface, and the heat may be dissipated into the air by the heat radiating fin. Small due to the influence of the heat of the central part on the external The temperature of the edge is more uniform.

Further, in the description of the table 100 according to the first embodiment, the case where the table 100 is used for, for example, a characteristic measuring device for an electronic component has been described. However, the device using the table of the present invention is not limited to the characteristic measuring device for an electronic component. It can also be used as a screening device or packaging device for electronic parts.

2‧‧‧ Central Department

3‧‧‧Center hole (installation mechanism)

4‧‧‧Positioning holes (mounting mechanism)

5‧‧‧The outer edge

7‧‧‧Intermediate

8‧‧‧ hollow part

9‧‧‧Connecting beam

100‧‧‧Working table for electronic parts transfer (workbench)

Claims (19)

An electronic component transporting table having a disk shape, comprising: a central portion in which a mounting mechanism is formed, an outer edge portion in which a plurality of concave portions are formed, and an intermediate portion between the central portion and the outer edge portion Each of the recesses accommodates one electronic component, and the electronic component is transferred by rotation, and a plurality of hollow portions penetrating the front main surface and the back main surface are formed in the intermediate portion, and in the case of a plan view, a plurality of the hollow portions are disposed. On a plurality of concentric circles of different diameters. An electronic component transporting table having a disk shape, comprising: a central portion in which a mounting mechanism is formed, an outer edge portion in which a plurality of concave portions are formed, and an intermediate portion between the central portion and the outer edge portion Each of the recesses accommodates one electronic component, and the electronic component is transferred by rotation, and a plurality of hollow portions penetrating the front main surface and the back main surface are formed in the intermediate portion, and the hollow portions are grooved, respectively, in a plan view. A plurality of the hollow portions of the groove shape are radially arranged from the center of the electronic component transfer table to the outer edge. The electronic component transfer table according to claim 1, wherein the plurality of hollow portions disposed on at least one of the concentric circles and the plurality of hollow portions disposed on at least one of the concentric circles are used for electronic component transfer work. When the center of the table is placed in the center in the circumferential direction, when the outer edge of the electronic component transfer table is viewed from the center of the electronic component transfer table, the electronic zero is used. At least one of the hollow portions is formed on the entire outer edge of the workpiece transfer table. The electronic component transfer table according to claim 1 or 3, wherein the hollow portion has a groove shape, and the groove-shaped hollow portion is disposed along the concentric circle, and the hollow portion is formed by the groove shape A connecting beam is formed on each of the concentric circles of the intermediate portion. In the electronic component transfer table of claim 4, the number of the connecting beams formed on each of the concentric circles is from the concentric circle on the center side of the electronic component transfer table to the electronic component transfer table. The above concentric circles on the outer edge side are sequentially increased. The electronic component transfer table of claim 4, wherein the connecting beams formed on the respective concentric circles are formed at equal intervals. The electronic component transfer table of claim 4, wherein the connecting beam is formed in a fractal shape in the intermediate portion. In the case of the electronic component transporting workbench of claim 4, when the outer edge of the electronic component transporting table is viewed from the center of the electronic component transporting table, at least one point on the outer edge is observed. The connecting beams are formed to be bilaterally symmetrical. The electronic component transfer table according to claim 1 or 3, wherein the hollow portion has a circular shape. The electronic component transfer table of claim 1 or 3, wherein the hollow portion is polygonal. The electronic component transfer table according to claim 9, wherein the connecting portion is formed on each of the concentric circles of the intermediate portion by forming the circular portion or the hollow portion of the polygonal shape, and is used in a table for transferring from an electronic component. When the center observes the outer edge of the worktable for electronic parts, when looking at at least one point on the outer edge, the above connection The connecting beams are formed to be bilaterally symmetrical. The electronic component transporting table according to claim 2, wherein the connecting portion is formed in the intermediate portion by forming the hollow portion, and the width of the connecting beam is gradually widened from the center of the electronic component transporting table . The electronic component transfer table of claim 2 or 12, wherein the hollow portion is formed in a curved shape. The electronic component transfer table according to any one of claims 1 to 3, wherein the hollow portion is filled with a material having a lower material density than the intermediate portion. The electronic component transfer table according to any one of claims 1 to 3, wherein the film is adhered to at least one of the upper and lower main faces. The electronic component transfer table according to any one of claims 1 to 3, wherein the inertia moment is reduced by 20% or more by providing the hollow portion. A characteristic measuring device for an electronic component, comprising the electronic component transfer table according to any one of claims 1 to 16. A screening device for an electronic component, comprising the electronic component transfer table according to any one of claims 1 to 16. A packaging device for an electronic component, comprising the electronic component transfer table according to any one of claims 1 to 16.