JP2003225869A - Wheel as processing tool, spacer, and processing tool as combination of wheel and spacer - Google Patents

Wheel as processing tool, spacer, and processing tool as combination of wheel and spacer

Info

Publication number
JP2003225869A
JP2003225869A JP2002028590A JP2002028590A JP2003225869A JP 2003225869 A JP2003225869 A JP 2003225869A JP 2002028590 A JP2002028590 A JP 2002028590A JP 2002028590 A JP2002028590 A JP 2002028590A JP 2003225869 A JP2003225869 A JP 2003225869A
Authority
JP
Japan
Prior art keywords
wheel
spacer
holes
peripheral portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002028590A
Other languages
Japanese (ja)
Inventor
Tomohiko Akiyama
智彦 秋山
Kenichiro Kumamoto
健一郎 熊本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Noritake Super Abrasive Co Ltd
Original Assignee
Noritake Co Ltd
Noritake Super Abrasive Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd, Noritake Super Abrasive Co Ltd filed Critical Noritake Co Ltd
Priority to JP2002028590A priority Critical patent/JP2003225869A/en
Publication of JP2003225869A publication Critical patent/JP2003225869A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To prevent the occurrence of problems in conventional multiple setting methods in cutting a hard and fragile material by forming a board of a wheel and a spacer light without depending on a material change. <P>SOLUTION: This wheel for processing is the one for cutting work with a plurality of wheels installed on a rotary shaft. An abrasive material layer 13 is fixed to the outer circumferential surface of the substrate 10 to form an edge, through holes 11a of large diameters are formed in the outer circumferential part 10a of the substrate 10, and through holes 11b of small diameters are formed in an inner circumferential part 10b. A plurality of circular through holes are formed in a circumferential direction, with the through holes 11a in the outer circumferential part larger than the through holes 11b in the inner circumferential part. The board 10 can be reduced in weight without generating the high concentration of stress close to the through holes. By forming similar through holes in the spacer, the spacer can also be reduced in weight. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、希土類磁石、フェ
ライト、ガラス、水晶などの硬脆性材料の切断加工など
に使用される加工用ホイールおよびスペーサならびにホ
イールとスペーサを組み合わせた加工用工具に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing wheel and a spacer used for cutting hard brittle materials such as rare earth magnets, ferrite, glass, and quartz, and a processing tool in which the wheel and the spacer are combined.

【0002】[0002]

【従来の技術】希土類磁石、フェライト、ガラス、水晶
などの切断加工用に、特開昭56−76381号公報、
特開昭63−109980号公報、特開平9−1744
41号公報などに記載の切断ホイールが用いられてい
る。これらのホイールの基本構造は、環状に成形した薄
肉の基板の外周部または内周部に砥材層を固着して刃先
部を形成した構造としたものである。
2. Description of the Related Art Japanese Unexamined Patent Publication (Kokai) No. 56-76381 discloses a cutting process for rare earth magnets, ferrite, glass, quartz and the like.
JP-A-63-109980, JP-A-9-1744
The cutting wheel described in Japanese Patent No. 41, etc. is used. The basic structure of these wheels is a structure in which an abrasive material layer is fixed to the outer peripheral portion or the inner peripheral portion of a thin-walled substrate formed in an annular shape to form a cutting edge portion.

【0003】このようなホイールにおいて、被切断材の
材料歩留りを高くするために、刃先部および基板はでき
るだけ薄肉のものが用いられ、基板の厚さは現状、外周
刃ホイールでは0.2mm程度、内周刃ホイールでは
0.05mm程度まで製作可能とされている。かかる薄
肉の基板においては、機械的強度を確保し、切断時の被
切断材、切粉との摩擦などによる変形を防止する機能に
優れた基板であることが要求される。
In such a wheel, in order to increase the material yield of the material to be cut, the cutting edge portion and the substrate are as thin as possible, and the thickness of the substrate is currently about 0.2 mm for the peripheral blade wheel. It is possible to manufacture up to about 0.05 mm with the inner blade wheel. Such a thin substrate is required to be a substrate having an excellent function of ensuring mechanical strength and preventing deformation due to friction with a material to be cut or chips during cutting.

【0004】このような基板として従来は、鉄系合金や
超硬合金が用いられている。たとえば前記の特開昭56
−76381号公報記載のホイールではSK鋼が、特開
昭63−109980号公報記載のホイールではFe−
C−Si−Mn−Cr−Mo−W−V系合金が、特開平
9−174441号公報記載のホイールではWC−Co
系、WC−TiC−Co系、WC−TiC−TaC−C
o系超硬合金が用いられている。
Conventionally, iron-based alloys and cemented carbides have been used as such substrates. For example, the above-mentioned JP-A-56
In the wheel described in JP-A-76381, SK steel is used, and in the wheel described in JP-A-63-109980, Fe-.
The C-Si-Mn-Cr-Mo-W-V alloy is WC-Co in the wheel described in JP-A-9-174441.
System, WC-TiC-Co system, WC-TiC-TaC-C
O-based cemented carbide is used.

【0005】[0005]

【発明が解決しようとする課題】ところで、従来の鉄系
合金や超硬合金を用いた基板は、切断機械に多数個のホ
イールをセット(マルチセット)して切断する場合、ホ
イールの総重量が大となり、切断機械へのホイールの取
付け作業の負担が増加する、スピンドルが撓むために切
断精度不良が発生する、切断機械の剛性が不足し異常振
動が発生してモータの過負荷やスピンドル部の損傷が生
じる、という問題がある。
By the way, a conventional substrate using an iron-based alloy or cemented carbide has a total weight of wheels when a plurality of wheels are set in a cutting machine (multi-set) and cut. The load on the cutting machine will increase, the load on the cutting machine will increase, the cutting accuracy will deteriorate due to the bending of the spindle, the rigidity of the cutting machine will be insufficient, and abnormal vibration will occur, which will overload the motor and damage the spindle section. Is caused.

【0006】このような問題に対し、ホイールの総重量
を減らすために、ホイールの間隔を設定するためのスペ
ーサをアルミニウム製のスペーサとすることが行われて
いる。しかしながら、アルミニウム製スペーサは、アル
ミニウムが非磁性体であるので、スペーサ製作用の研削
盤で磁力式の加工材取付けテーブルにアルミニウム加工
材を密に固定することができないために、スペーサに加
工した後の厚さ精度、平面度、平坦度が鉄製スペーサに
比べて劣り、このアルミニウム製スペーサを用いてホイ
ールをマルチセットしたときに、ホイール間隔の設定精
度不良やホイールの振れによる切断精度不良が発生しや
すいという難点がある。また、スペーサの厚さが5mm
より薄い場合、研削盤による平面研削時に研削熱により
アルミニウム加工材が変形し、高精度のスペーサの製作
が困難である。
In order to reduce the total weight of the wheels, in order to reduce the total weight of the wheels, aluminum spacers are used as spacers for setting the wheel intervals. However, since aluminum is a non-magnetic material in aluminum spacers, it is not possible to tightly fix the aluminum machining material to the magnetic material machining table with a grinding machine for manufacturing the spacer. The thickness accuracy, flatness, and flatness of the wheels are inferior to those of iron spacers, and when the wheels are multi-set using this aluminum spacer, poor wheel spacing setting accuracy and cutting accuracy due to wheel runout occur. It has the drawback of being easy. In addition, the thickness of the spacer is 5 mm
If it is thinner, the aluminum processed material is deformed by the grinding heat during the surface grinding by the grinder, and it is difficult to manufacture the spacer with high accuracy.

【0007】本発明が解決すべき課題は、硬脆性材料の
切断加工などにおいて、ホイールの基板およびスペーサ
を材質変更によらずに軽量化して、従来のマルチセット
時における問題の発生を防止することにある。
The problem to be solved by the present invention is to reduce the weight of the wheel substrate and the spacer without changing the material in the cutting process of hard and brittle materials, etc., and prevent the occurrence of problems in the conventional multi-setting. It is in.

【0008】[0008]

【課題を解決するための手段】本発明は、複数のホイー
ルを回転軸に取り付けて切断加工などを行う加工用ホイ
ールであって、偏平なリング状に成形した基板の外周面
に砥材層を固着して刃先部を形成したホイールの前記基
板の外周部および内周部にそれぞれ円形の貫通孔を周方
向に複数個形成し、外周部の貫通孔を内周部の貫通孔よ
りも大径の貫通孔としたことを特徴とする。ここで加工
用ホイールは、スペーサを介して複数のホイールを回転
軸に取り付けて切断加工などを行う加工用ホイールであ
ってもよく、また、基板がスペーサ部と基板本体部とを
一体化した基板であり、スペーサを介することなく複数
のホイールを回転軸に取り付けて切断加工などを行う加
工用ホイールであってもよい。
SUMMARY OF THE INVENTION The present invention is a processing wheel for attaching a plurality of wheels to a rotary shaft to perform cutting processing, and has an abrasive material layer on the outer peripheral surface of a flat ring-shaped substrate. A plurality of circular through holes are formed in the circumferential direction in the outer peripheral portion and the inner peripheral portion of the base plate of the wheel that is firmly fixed to form the cutting edge portion, and the outer peripheral through hole has a diameter larger than that of the inner peripheral portion. It is characterized in that it is a through hole. Here, the processing wheel may be a processing wheel that performs a cutting process by attaching a plurality of wheels to a rotating shaft through a spacer, and the substrate is a substrate in which a spacer portion and a substrate body portion are integrated. Therefore, the processing wheel may be a processing wheel that is provided with a plurality of wheels attached to the rotating shaft without a spacer and performs cutting processing.

【0009】本発明の加工用ホイールは、基板にスペー
サを加えた厚さ、またはスペーサ部分を一体化した基板
の厚さが5mm程度以下で、スペーサを介して、または
スペーサを介することなく複数のホイールを取付け具に
より回転軸に取り付けて(これをマルチセットとい
う)、希土類磁石、フェライト、ガラス、水晶などの硬
脆性材料の切断などに用いる加工用ホイールである。基
板に貫通孔を形成することにより基板は軽量化される
が、貫通孔を無秩序に形成すると加工時に基板の貫通孔
近傍に高い応力集中が発生するおそれがある。本発明者
らは、基板に種々の態様で貫通孔を形成して切断加工時
の基板の回転強度について構造解析を行い、応力集中が
最も低くなる貫通孔の形成条件を見出した。
In the processing wheel of the present invention, the thickness of the substrate to which the spacer is added or the thickness of the substrate in which the spacer portion is integrated is about 5 mm or less, and a plurality of spacers are provided with or without the spacer. It is a processing wheel that is used to cut hard and brittle materials such as rare earth magnets, ferrites, glass, and crystals by attaching the wheel to a rotating shaft with a fixture (this is called a multi-set). Although the substrate is made lighter by forming the through holes in the substrate, if the through holes are formed randomly, high stress concentration may occur near the through holes of the substrate during processing. The present inventors have conducted structural analysis on the rotational strength of the substrate at the time of cutting by forming the through holes in various forms in the substrate, and have found the conditions for forming the through holes that minimize the stress concentration.

【0010】応力集中が最も低くなる貫通孔の形成条件
として最も重要なことは、基板の外周部の貫通孔を内周
部の貫通孔よりも大径の貫通孔とすることである。基板
の外周部と内周部にそれぞれ複数個の貫通孔を周方向に
形成した場合、内周部に大径の貫通孔を形成すると孔と
孔との間隔が小さくなり、この部分にホイールを回転さ
せたときの応力が集中しやすい。これに対し、外周部の
貫通孔を内周部の貫通孔よりも大径にすると、同じ開口
率であっても孔と孔との間隔が大きくなり、応力集中が
発生しにくくなる。さらに同じ開口率であっても、外周
部の貫通孔を大径にするほうが孔の数が少なくなり、加
工コストが削減できる。
The most important condition for forming the through hole that minimizes the stress concentration is that the through hole in the outer peripheral portion of the substrate has a larger diameter than that of the through hole in the inner peripheral portion. When a plurality of through holes are formed in the outer peripheral portion and the inner peripheral portion of the substrate in the circumferential direction, if a large-diameter through hole is formed in the inner peripheral portion, the distance between the holes becomes small, and the wheel is placed in this portion. Stress tends to concentrate when rotating. On the other hand, when the diameter of the through hole in the outer peripheral portion is made larger than that of the through hole in the inner peripheral portion, the distance between the holes becomes large even if the aperture ratio is the same, and stress concentration is less likely to occur. Further, even if the aperture ratio is the same, the larger the diameter of the through hole in the outer peripheral portion, the smaller the number of holes, and the processing cost can be reduced.

【0011】貫通孔を形成する範囲は、スペーサを介し
て複数のホイールを回転軸に取り付けて切断加工などを
行う加工用ホイールの場合は、基板がスペーサと接する
範囲に形成するものとし、またスペーサ部と基板本体部
とを一体化した加工用ホールの場合は、基板のスペーサ
部に形成するものとする。複数のホイールを回転軸に取
り付けるマルチセットの場合、基板のスペーサ接触部ま
たはスペーサ部はホイール取付け具のフランジにより強
固に締め付けられるので、この部分に貫通孔が形成され
ていても剛性は充分に確保される。
In the case of a processing wheel in which a plurality of wheels are attached to a rotating shaft via spacers to perform cutting processing, the through holes are formed in the range in which the substrate is in contact with the spacer. In the case of a processing hole in which the plate portion and the substrate main body portion are integrated, they are formed in the spacer portion of the substrate. In the case of a multi-set that attaches multiple wheels to the rotating shaft, the spacer contact part or spacer part of the board is firmly tightened by the flange of the wheel fixture, so sufficient rigidity is secured even if a through hole is formed in this part. To be done.

【0012】貫通孔の大きさは、大径の貫通孔の内径を
スペーサ接触部またはスペーサ部の範囲の半径方向長さ
の50〜70%とするのが望ましい。外周部の貫通孔の
内径が前記70%を超えると孔の個数が少なくなって重
量軽減の効果が小さくなり、一方外周部の貫通孔の内径
が前記50%未満になると内周部の貫通孔を大きくせざ
るを得ず、内周部の貫通孔の個数が減り重量軽減の効果
が小さくなる。このような貫通孔を形成することにより
基板の重量が軽減され、鉄製スペーサを用いた場合でも
アルミニウム製スペーサに変更した場合と同等の重量軽
減効果が得られる。
The size of the through-hole is preferably such that the inner diameter of the large-diameter through-hole is 50 to 70% of the radial length of the spacer contact portion or the range of the spacer portion. If the inner diameter of the through hole in the outer peripheral portion exceeds 70%, the number of holes is reduced, and the effect of weight reduction is reduced, while if the inner diameter of the through hole in the outer peripheral portion is less than 50%, the through hole in the inner peripheral portion is reduced. Inevitably, the number of through holes in the inner peripheral portion is reduced, and the effect of weight reduction is reduced. By forming such through-holes, the weight of the substrate is reduced, and even when the iron spacer is used, the same weight reduction effect can be obtained as when the spacer is changed to the aluminum spacer.

【0013】ここで前記外周部に形成する貫通孔の個数
と前記内周部に形成する貫通孔の個数とをそれぞれ6個
以上とすることが望ましい。外周部と内周部の貫通孔が
5個以下であると、貫通孔形成により除去する体積が少
なく、基板の重量軽減効果が得られなくなる。
Here, it is desirable that the number of through holes formed in the outer peripheral portion and the number of through holes formed in the inner peripheral portion are each 6 or more. If the number of through holes in the outer peripheral portion and the inner peripheral portion is 5 or less, the volume removed by forming the through holes is small and the effect of reducing the weight of the substrate cannot be obtained.

【0014】上記の基板またはスペーサ付き基板の重量
の必要削減量は、工作機械に取り付ける際の重量制約、
工作機械の剛性や要求される加工精度などによって異な
る。たとえば、80枚のホイールをセットした場合、開
口率の小さい基板のホイールでは総重量が約40kgに
も達し、工作機械への取り付け作業の負担が大きくな
る。また、スピンドルの撓みが大きくなると斜断が発生
し、希土類磁石などの精密切断に要求される切断精度が
得られないことになる。これらのことを考慮して、ホイ
ールを組み込んだ後の取付け具全体の重量、およびホイ
ール1枚あたりの適正な重量を設定するものとする。
The necessary reduction amount of the weight of the above-mentioned substrate or the substrate with the spacer is due to the weight constraint when mounting on the machine tool,
It depends on the rigidity of the machine tool and the required machining accuracy. For example, when 80 wheels are set, the total weight of a wheel of a substrate having a small aperture ratio reaches about 40 kg, and the work of mounting it on a machine tool becomes heavy. Further, when the deflection of the spindle becomes large, oblique cutting occurs, and the cutting accuracy required for precision cutting of rare earth magnets or the like cannot be obtained. In consideration of these matters, the weight of the entire fixture after the wheel is assembled and the proper weight per wheel are set.

【0015】また、マルチセット時にホイールとともに
回転軸に取り付けられるスペーサについても、上記基板
の場合と同様な設計思想により貫通孔を設けることによ
り、スペーサの重量を軽減することができる。すなわち
本発明のスペーサは、加工用の複数のホイールとともに
回転軸に取り付けて使用するスペーサであって、偏平な
リング状に成形したスペーサ本体の外周部および内周部
にそれぞれ円形の貫通孔を周方向に複数個形成し、外周
部の貫通孔を内周部の貫通孔よりも大径の貫通孔とする
とともに、前記外周部の貫通孔の内径をスペーサ本体の
半径方向長さの50〜70%としたことを特徴とする。
Further, regarding the spacer attached to the rotary shaft together with the wheel at the time of multi-setting, the weight of the spacer can be reduced by providing the through hole according to the same design concept as that of the substrate. That is, the spacer of the present invention is a spacer to be used by being attached to a rotary shaft together with a plurality of wheels for machining, and circular through holes are formed in the outer peripheral portion and the inner peripheral portion of a spacer body molded in a flat ring shape. A plurality of through holes in the outer peripheral portion are formed to have a larger diameter than the through holes in the inner peripheral portion, and the inner diameter of the through holes in the outer peripheral portion is 50 to 70 of the radial length of the spacer body. It is characterized by being set as%.

【0016】このような貫通孔を設けることにより、ス
ペーサ本体が鉄製であってもアルミニウム製なみの重量
とすることができ、ホイールと組み合わせたときの総重
量を軽減することができる。このスペーサは貫通孔のな
いホイールとも組み合わせることができ、この場合は従
来の鉄製スペーサをアルミニウム製スペーサに変更した
場合と同様な重量軽減効果を発揮するとともに、アルミ
ニウム製スペーサの欠点を回避することができる。また
上記の貫通孔を設けたホイールと組み合わせた場合は、
より一層の重量軽減効果を発揮する。
By providing such a through hole, even if the spacer main body is made of iron, it can be made as heavy as aluminum, and the total weight when combined with the wheel can be reduced. This spacer can be combined with a wheel that does not have a through hole, and in this case, the same weight reduction effect as when changing the conventional iron spacer to an aluminum spacer can be achieved and the drawbacks of the aluminum spacer can be avoided. it can. When combined with the wheel with the above through holes,
Exhibits a further weight reduction effect.

【0017】[0017]

【発明の実施の形態】以下、実験例に基づいて本発明を
詳細に説明する。図1〜図3は実験に供した切断加工用
のホイールを示す図で、図1は本発明に係るホイール
(発明品)で(a)は正面図、(b)は(a)のA−B
−C線断面図である。図2は比較例のホイールで(a)
は小径の貫通孔を多数形成したホイール(比較品1)の
正面図、(b)は外周部が小径で内周部が大径の貫通孔
を形成したホイール(比較品2)の正面図である。図3
は従来の貫通孔なしのホイール(従来品1,2)で
(a)は正面図、(b)は(a)のD−D線断面図であ
る。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on experimental examples. 1 to 3 are views showing a wheel for cutting used for an experiment, FIG. 1 is a wheel (invention product) according to the present invention, (a) is a front view, (b) is A- of (a). B
It is a -C line sectional view. FIG. 2 shows a comparative wheel (a).
Is a front view of a wheel (Comparative Product 1) having a large number of small-diameter through-holes, and (b) is a front view of a wheel (Comparative Product 2) having a small-diameter outer peripheral portion and a large-diameter through-hole inner peripheral portion. is there. Figure 3
FIG. 3A is a front view of a wheel without a through hole (conventional products 1 and 2) of the related art, and (b) is a sectional view taken along line D-D of (a).

【0018】図1に示すホイールは本発明に係るホイー
ルで、スペーサ付き基板10のスペーサ部10cの外周
部10aに大径の貫通孔11aを形成し、内周部10b
に小径の貫通孔11bを形成したホイールである。図2
に示すホイールは実験に供した比較例のホイールで、
(a)のホイールは基板20外周部と内周部に異なる内
径の小径の貫通孔21a,21bを形成したホイールで
あり、(b)のホイールは基板30の内周部に大径の貫
通孔31aを形成し、外周部に小径の貫通孔31bを形
成したホイールである。図3に示すホイールは貫通孔な
しの従来のホイールで、基板40とスペーサ50は別体
である。なお図1ないし図3を通じて、12はホイール
取付孔であり、13は砥材層である。砥材層13は#1
40/170のダイヤモンド砥粒を集中度100でレジ
ノイドボンドを用いて結合したものである。
The wheel shown in FIG. 1 is a wheel according to the present invention, in which a large diameter through hole 11a is formed in the outer peripheral portion 10a of the spacer portion 10c of the substrate 10 with spacers, and the inner peripheral portion 10b.
The wheel has a small-diameter through hole 11b formed therein. Figure 2
The wheel shown in is the wheel of the comparative example used for the experiment,
The wheel of (a) is a wheel in which small diameter through holes 21a and 21b having different inner diameters are formed in the outer peripheral portion and the inner peripheral portion of the substrate 20, and the wheel of (b) is a large through hole in the inner peripheral portion of the substrate 30. 31a is formed, and a small-diameter through hole 31b is formed in the outer peripheral portion of the wheel. The wheel shown in FIG. 3 is a conventional wheel having no through hole, and the substrate 40 and the spacer 50 are separate bodies. 1 to 3, 12 is a wheel mounting hole, and 13 is an abrasive layer. Abrasive layer 13 is # 1
40/170 diamond abrasive grains are bonded at a concentration of 100 using resinoid bonds.

【0019】〔実験例1〕表1は実験に用いたホイール
の基板およびスペーサの材質、スペーサ部を含むホイー
ル1枚当たりの重量、スペーサ部の平面度、および、砥
材層の振れを示す。基板は鉄製で、寸法は外径175m
m,取付孔内径30mmであり、スペーサ部の外径は1
46mm、厚さは3.5mmであり、砥材層の厚さは
0.6mmである。砥材層の砥粒にはダイヤモンド砥粒
を用い、砥粒の集中度100、結合剤にレジノイドボン
ドを用いた。スペーサ部の平面度は三次元測定器を用い
て外側面の24点について測定した。砥材層の振れは回
転時の砥材層の振れをダイヤルゲージで測定した。
[Experimental Example 1] Table 1 shows the materials of the substrate and spacer of the wheel used in the experiment, the weight per wheel including the spacer portion, the flatness of the spacer portion, and the deflection of the abrasive layer. The board is made of iron and has an outer diameter of 175 m.
m, the inner diameter of the mounting hole is 30 mm, and the outer diameter of the spacer is 1
The thickness of the abrasive layer is 46 mm and the thickness is 3.5 mm, and the thickness of the abrasive layer is 0.6 mm. Diamond abrasive grains were used as the abrasive grains of the abrasive layer, the concentration of the abrasive grains was 100, and resinoid bond was used as the binder. The flatness of the spacer portion was measured at 24 points on the outer surface using a three-dimensional measuring device. Regarding the runout of the abrasive layer, the runout of the abrasive layer during rotation was measured with a dial gauge.

【0020】[0020]

【表1】 [Table 1]

【0021】スペーサを含む重量は、発明品のホイール
の場合はアルミニウム製スペーサを用いた従来品2のホ
イールの場合とほぼ同じである。小径の貫通孔を多数形
成した比較品1のホイールは重量が鉄製スペーサを用い
た従来品1のホイールの場合に近い506gとなり、重
量軽減の効果が低い。発明品のホイールのスペーサ部の
平面度および砥材層の振れは従来品1のホイールの場合
と同程度であった。
The weight including the spacer is almost the same as that of the wheel of the conventional product 2 using the spacer made of aluminum in the case of the wheel of the invention. The wheel of the comparative product 1 in which a large number of small-diameter through holes are formed has a weight of 506 g, which is close to that of the wheel of the conventional product 1 using the iron spacer, and the effect of reducing the weight is low. The flatness of the spacer portion and the runout of the abrasive layer of the wheel of the invention product were similar to those of the wheel of the conventional product 1.

【0022】〔実験例2〕発明品1と比較品2のホイー
ルの回転強度について構造解析を実施した。砥材層の砥
粒にはダイヤモンド砥粒を用い、砥粒の集中度100、
結合剤にレジノイドボンドを用い、ホイールの回転周速
度は120m/secとして計算した。結果を表2に示
す。
[Experimental Example 2] Structural analysis was carried out on the rotational strengths of the wheels of the invention product 1 and the comparative product 2. Diamond abrasive grains are used for the abrasive grains of the abrasive layer, and the degree of concentration of the abrasive grains is 100,
A resinoid bond was used as a binder, and the wheel circumferential speed was calculated as 120 m / sec. The results are shown in Table 2.

【0023】[0023]

【表2】 [Table 2]

【0024】表2の結果から、周速度120m/sec
で高速回転させたとき、内周部に大径貫通孔を形成した
比較品2のホイールの場合は大径貫通孔の間で非常に高
い応力集中が発生し、危険であることがわかった。した
がって、応力集中を避けるためには、大径貫通孔を外周
部に形成し、小径貫通孔を内周部に形成することが重要
であることが確認された。
From the results shown in Table 2, the peripheral speed is 120 m / sec.
It was found that in the case of the wheel of the comparative product 2 in which the large diameter through hole was formed in the inner peripheral portion when it was rotated at a high speed, extremely high stress concentration occurred between the large diameter through holes, which was dangerous. Therefore, in order to avoid stress concentration, it was confirmed that it is important to form the large diameter through hole in the outer peripheral portion and the small diameter through hole in the inner peripheral portion.

【0025】〔実験例3〕図1に示す基本形状で貫通孔
の内径を種々変更してホイールを製作した。外周部の大
径貫通孔の内径、個数、寸法A(図1の(b)の10a
と10bの合計長さで実数は58mm)との比率、およ
び、内周部の小径貫通孔の内径、個数、大径貫通孔の内
径との比率、ならびにホイールの重量を表3に示す。
[Experimental Example 3] Wheels were manufactured in the basic shape shown in FIG. 1 with various inner diameters of through holes. Inner diameter, number, and dimension A of the large-diameter through holes in the outer peripheral portion (10a in FIG. 1B)
Table 3 shows the ratio of the total length of 10 to 10b and the real number is 58 mm), the inner diameter and the number of the small-diameter through holes in the inner peripheral portion, the ratio to the inner diameter of the large-diameter through holes, and the weight of the wheel.

【0026】[0026]

【表3】 [Table 3]

【0027】表3からわかるように、外周部の貫通孔の
内径が寸法Aの70%を超えると孔の個数が少なくなっ
て重量軽減の効果が小さくなり、一方外周部の貫通孔の
内径が寸法Aの50%未満になると内周部の貫通孔を大
きくせざるを得ず、内周部の貫通孔の個数が減り重量軽
減の効果が小さくなる。このことから、外周部の貫通孔
の内径は寸法Aの50〜70%の範囲で、個数は6個以
上が好ましいことがわかる。また、内周部の貫通孔の内
径は外周部の貫通孔の内径の30〜70%の範囲で、個
数は6個以上が好ましいことがわかる。
As can be seen from Table 3, when the inner diameter of the through hole in the outer peripheral portion exceeds 70% of the dimension A, the number of holes is reduced and the effect of weight reduction is reduced, while the inner diameter of the through hole in the outer peripheral portion is reduced. If it is less than 50% of the dimension A, the through holes in the inner peripheral portion must be enlarged, and the number of the through holes in the inner peripheral portion is reduced, so that the effect of reducing the weight is reduced. From this, it is understood that the inner diameter of the through hole in the outer peripheral portion is in the range of 50 to 70% of the dimension A, and the number is preferably 6 or more. Further, it can be seen that the inner diameter of the through hole in the inner peripheral portion is in the range of 30 to 70% of the inner diameter of the through hole in the outer peripheral portion, and the number is preferably 6 or more.

【0028】なお、以上の実験例はスペーサ部と基板本
体部とを一体化した基板についての実験結果であるが、
従来の鉄製スペーサに貫通孔を形成した場合も、同様な
条件で貫通孔を形成することにより、応力集中を招くこ
となくマルチセットの場合の加工用工具の総重量を軽減
できることが確認できた。
The above experimental example is an experimental result for a substrate in which the spacer portion and the substrate body portion are integrated.
It was confirmed that, even when the through hole was formed in the conventional iron spacer, by forming the through hole under the same conditions, it is possible to reduce the total weight of the machining tool in the case of multi-set without causing stress concentration.

【0029】[0029]

【発明の効果】切断加工用などのホイールの基板の内周
部および外周部にそれぞれ円形の貫通孔を周方向に複数
個形成し、外周部の貫通孔を内周部の貫通孔よりも大径
の貫通孔とすることにより、貫通孔近傍に高い応力集中
が発生することなく基板を軽量化することができる。貫
通孔の大きさと個数を最適値に設定することで、重量軽
減の効果を最大限に発揮することができる。またホイー
ルとともに使用するスペーサについてもホイールと同様
な設計思想により貫通孔を設けることにより、スペーサ
自体の軽量化とともに、ホイールと組み合わせた加工用
工具の総重量を軽減することができる。
EFFECTS OF THE INVENTION A plurality of circular through holes are formed in the circumferential direction in the inner peripheral portion and the outer peripheral portion of a wheel substrate for cutting and the like, and the outer peripheral through holes are larger than the inner peripheral through holes. The diameter of the through hole makes it possible to reduce the weight of the substrate without causing high stress concentration in the vicinity of the through hole. By setting the size and the number of the through holes to the optimum values, the weight reduction effect can be maximized. Further, by providing a through hole for the spacer used with the wheel according to the same design concept as the wheel, the weight of the spacer itself can be reduced and the total weight of the machining tool combined with the wheel can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明に係る切断ホイールの例を示す図で
(a)は正面図、(b)は(a)のA−B−C線断面図
である。
FIG. 1 is a view showing an example of a cutting wheel according to the present invention, (a) is a front view, and (b) is a cross-sectional view taken along the line ABC in (a).

【図2】 実験に供した比較例の切断ホイールを示す図
で(a)は小径の貫通孔を多数形成したホイールの正面
図、(b)は外周部が小径で内周部が大径の貫通孔を形
成したホイールの正面図である。
2A and 2B are views showing a cutting wheel of a comparative example used in an experiment, FIG. 2A is a front view of a wheel in which a large number of small-diameter through holes are formed, and FIG. 2B is a front view of a wheel having a small outer diameter and a large inner diameter. It is a front view of the wheel which formed the through-hole.

【図3】 従来の貫通孔なしの切断ホイールの例を示す
図で(a)は正面図、(b)は(a)のD−D線断面図
である。
FIG. 3 is a view showing an example of a conventional cutting wheel without a through hole, (a) is a front view, and (b) is a sectional view taken along line D-D of (a).

【符号の説明】[Explanation of symbols]

10,20,30 スペーサ付き基板 11a,31a 大径貫通孔 11b,21a,21b,31b 小径貫通孔 12 ホイール取付孔 13 砥材層 Substrate with spacer 11a, 31a Large diameter through hole 11b, 21a, 21b, 31b Small diameter through hole 12 Wheel mounting hole 13 Abrasive layer

フロントページの続き (72)発明者 熊本 健一郎 福岡県浮羽郡田主丸町大字竹野210番地 ノリタケダイヤ株式会社内 Fターム(参考) 3C063 AA02 AB03 BB02 BC03 BG01 BG04 BG07 BH40 EE31 FF23 FF30 Continued front page    (72) Inventor Kenichiro Kumamoto             210 Takeno, Odaiba, Ukiha-gun, Fukuoka             Noritake Diamond Co., Ltd. F term (reference) 3C063 AA02 AB03 BB02 BC03 BG01                       BG04 BG07 BH40 EE31 FF23                       FF30

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 複数のホイールを回転軸に取り付けて切
断加工などを行う加工用ホイールであって、偏平なリン
グ状に成形した基板の外周面に砥材層を固着して刃先部
を形成したホイールの前記基板の外周部および内周部に
それぞれ円形の貫通孔を周方向に複数個形成し、外周部
の貫通孔を内周部の貫通孔よりも大径の貫通孔としたこ
とを特徴とする基板に貫通孔を有する加工用ホイール。
1. A processing wheel for mounting a plurality of wheels on a rotary shaft to perform cutting, for example, wherein an abrasive material layer is fixed to the outer peripheral surface of a flat ring-shaped substrate to form a cutting edge portion. A plurality of circular through holes are circumferentially formed in the outer peripheral portion and the inner peripheral portion of the substrate of the wheel, respectively, and the through hole of the outer peripheral portion has a larger diameter than the through hole of the inner peripheral portion. A processing wheel that has through holes in the substrate.
【請求項2】 加工用ホイールが、スペーサを介して複
数のホイールを回転軸に取り付けて切断加工を行う加工
用ホイールであって、前記外周部の貫通孔の内径が基板
とスペーサが接触する範囲の半径方向長さの50〜70
%である請求項1記載の基板に貫通孔を有する加工用ホ
イール。
2. The processing wheel is a processing wheel that performs cutting by mounting a plurality of wheels on a rotating shaft via a spacer, and the inner diameter of the through hole of the outer peripheral portion is a range in which the substrate and the spacer are in contact with each other. 50 to 70 of the radial length of
%, The processing wheel having a through hole in the substrate according to claim 1.
【請求項3】 ホイールの基板が、スペーサ部と基板本
体部とを一体化した基板であり、スペーサを介すること
なく複数のホイールを回転軸に取り付けて切断加工を行
う加工用ホイールであって、前記外周部の貫通孔の内径
が基板の前記スペーサ部の範囲の半径方向長さの50〜
70%である請求項1記載の基板に貫通孔を有する加工
用ホイール。
3. A processing wheel, wherein a substrate of the wheel is a substrate in which a spacer portion and a substrate body portion are integrated, and wherein a plurality of wheels are attached to a rotary shaft to perform cutting without interposing spacers, The inner diameter of the through hole at the outer peripheral portion is 50 to 50 times the radial length in the range of the spacer portion of the substrate.
70% is a processing wheel having a through hole in the substrate according to claim 1.
【請求項4】 前記外周部の貫通孔の個数と前記内周部
の貫通孔の個数がそれぞれ6個以上である請求項2また
は3記載の基板に貫通孔を有する加工用ホイール。
4. The processing wheel having through holes in a substrate according to claim 2, wherein the number of through holes in the outer peripheral portion and the number of through holes in the inner peripheral portion are each 6 or more.
【請求項5】 加工用の複数のホイールとともに回転軸
に取り付けて使用するスペーサであって、偏平なリング
状に成形したスペーサ本体の外周部および内周部にそれ
ぞれ円形の貫通孔を周方向に複数個形成し、外周部の貫
通孔を内周部の貫通孔よりも大径の貫通孔とするととも
に、前記外周部の貫通孔の内径をスペーサ本体の半径方
向長さの50〜70%としたことを特徴とする加工用ホ
イールとともに使用するスペーサ。
5. A spacer, which is used by being attached to a rotary shaft together with a plurality of wheels for processing, wherein circular through holes are circumferentially formed in an outer peripheral portion and an inner peripheral portion of a spacer body formed in a flat ring shape. A plurality of through holes in the outer peripheral portion are formed to have a larger diameter than the through holes in the inner peripheral portion, and the inner diameter of the through hole in the outer peripheral portion is 50 to 70% of the radial length of the spacer body. A spacer to be used with the processing wheel characterized by the above.
【請求項6】 前記外周部の貫通孔の個数と前記内周部
の貫通孔の個数がそれぞれ6個以上である請求項6記載
のスペーサ。
6. The spacer according to claim 6, wherein the number of through holes in the outer peripheral portion and the number of through holes in the inner peripheral portion are each 6 or more.
【請求項7】 請求項1〜4のいずれかに記載の加工用
ホイールと請求項5または6に記載のスペーサとを組み
合わせた加工用工具。
7. A machining tool in which the machining wheel according to any one of claims 1 to 4 and the spacer according to claim 5 or 6 are combined.
JP2002028590A 2002-02-05 2002-02-05 Wheel as processing tool, spacer, and processing tool as combination of wheel and spacer Pending JP2003225869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002028590A JP2003225869A (en) 2002-02-05 2002-02-05 Wheel as processing tool, spacer, and processing tool as combination of wheel and spacer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002028590A JP2003225869A (en) 2002-02-05 2002-02-05 Wheel as processing tool, spacer, and processing tool as combination of wheel and spacer

Publications (1)

Publication Number Publication Date
JP2003225869A true JP2003225869A (en) 2003-08-12

Family

ID=27749737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002028590A Pending JP2003225869A (en) 2002-02-05 2002-02-05 Wheel as processing tool, spacer, and processing tool as combination of wheel and spacer

Country Status (1)

Country Link
JP (1) JP2003225869A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017030970A (en) * 2015-07-29 2017-02-09 株式会社村田製作所 Electronic component conveying table, characteristic measuring device, sorting device, and taping device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017030970A (en) * 2015-07-29 2017-02-09 株式会社村田製作所 Electronic component conveying table, characteristic measuring device, sorting device, and taping device

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