TW201640608A - Carrier tape and pack - Google Patents

Carrier tape and pack Download PDF

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Publication number
TW201640608A
TW201640608A TW105103048A TW105103048A TW201640608A TW 201640608 A TW201640608 A TW 201640608A TW 105103048 A TW105103048 A TW 105103048A TW 105103048 A TW105103048 A TW 105103048A TW 201640608 A TW201640608 A TW 201640608A
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Taiwan
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led
light
carrier tape
convex portion
width
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TW105103048A
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Chinese (zh)
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TWI623057B (en
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岩角直樹
田村洋介
芝野幸弘
源涉
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日亞化學工業股份有限公司
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  • Packaging Frangible Articles (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

A carrier tape is provided from which LEDs can be easily picked up. A carrier tape for accommodating an LED includes a sheet defining recessed embossed portions that can accommodate the LED. The embossed portion is formed to accommodate the LED which includes a light emitting portion having light-transmissive resin and arranged on its lateral surface as viewed in plan view. The embossed portion includes a protruding part that is arranged on one of the interior surfaces of the recessed embossed portion and can face the light emitting portion of the LED. Depressed parts are provided on the both sides of the protruding part so that the depressed surfaces can be spaced away from the LED when the LED is accommodated in the embossed portion. The width of the protruding part is smaller than the width of the light emitting portion of the LED as viewed in plan view.

Description

承載帶及梱包體 Carrier tape and shackle

[相關申請案之交叉參考] [Cross-Reference to Related Applications]

本申請案根據35 U.S.C.§ 119規定主張於2015年1月30日提出之日本專利申請第2015-016311號之優先權及於2015年12月26日提出之日本專利申請第2015-255503號之優先權,並於此引用其全部內容。 The priority of Japanese Patent Application No. 2015-016311, filed on Jan. 30, 2015, and the priority of Japanese Patent Application No. 2015-255503, filed on Dec. 26, 2015, is hereby incorporated by reference. Right, and quote all of its contents here.

以下之揭示內容係關於一種用於收容LED之承載帶及將LED捆包於承載帶而成之捆包體。 The following disclosure relates to a carrier tape for housing an LED and a package body for binding the LED to a carrier tape.

LED(Light Emitting Diode,發光二極體)等電子零件被收容於壓孔承載帶(以下,亦稱作「承載帶」)之壓孔部(凹部)而保管、搬送。壓孔部之大小、形狀與收容之電子零件之大小、形狀相對應,已知有各種大小、形狀(參照日本專利特開平2-10256號公報、日本專利特開平10-120075號公報)。作為發光裝置之LED安裝於2次基板時,有發光部(發光面)朝向上方之類型(上表面發光型LED)及朝向橫向之類型(側面發光型LED),側面發光型LED於被收容於壓孔部時,亦以發光部朝向橫向之方式收容。 Electronic components such as an LED (Light Emitting Diode) are housed in a press-hole portion (recessed portion) of a press-hole carrier tape (hereinafter also referred to as a "carrier belt"), and are stored and transported. The size and shape of the press-fitting portion correspond to the size and shape of the electronic component to be housed, and various sizes and shapes are known (refer to Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. When the LED as the light-emitting device is mounted on the secondary substrate, the light-emitting portion (light-emitting surface) is oriented upward (upper-surface light-emitting type LED) and the horizontal-direction light-emitting type (side-emitting LED), and the side-emitting LED is housed in In the case of the hole-punching portion, the light-emitting portion is also housed in the lateral direction.

LED之發光部主要由透光性樹脂構成,考慮自埋設於其內部之發光元件之光之提取效率等光學特性而選擇適合之材料。因此,有使用與LED之基台(封裝體)相比,硬度較低之樹脂之情況。此種使用硬度較低之樹脂之側面發光型LED有難以自壓孔部取出之情況。 The light-emitting portion of the LED is mainly composed of a light-transmitting resin, and a suitable material is selected in consideration of optical characteristics such as light extraction efficiency of light-emitting elements embedded in the light-emitting element. Therefore, there is a case where a resin having a lower hardness than a base (package) of an LED is used. Such a side-emitting type LED using a resin having a low hardness is difficult to be taken out from the pressure hole portion.

本發明之實施形態之承載帶係用於收容LED者,且具備形成有能夠收容LED之凹狀之壓孔部的片材,上述壓孔部於俯視下構成為收容側面設有具有透光性樹脂之發光部之LED的形狀,上述壓孔部於形成凹狀之內壁之一面形成有與LED之發光部對向之凸部,於上述凸部之兩側形成有於收容有LED時與該LED隔開之凹陷,上述凸部之俯視下之寬度形成為較LED之發光部之寬度更窄。 The carrier tape according to the embodiment of the present invention is for accommodating an LED, and includes a sheet having a concave-shaped pressure-receiving portion capable of accommodating the LED, and the pressure-receiving portion is configured to have a light-transmitting side in a plan view. In the shape of the LED of the light-emitting portion of the resin, the pressing portion forms a convex portion facing the light-emitting portion of the LED on one surface of the concave inner wall, and is formed on both sides of the convex portion when the LED is housed The LED is spaced apart from each other, and the width of the convex portion in a plan view is formed to be narrower than the width of the light-emitting portion of the LED.

又,另一實施形態之承載帶係具備凹狀之壓孔部者,該壓孔部能夠收容側面具備具有透光性樹脂之發光部之LED,且壓孔部之內壁於與上述LED之發光部對向之區域具有凸部,凸部之寬度較發光部之寬度更小。 Further, in another embodiment, the carrier tape includes a concave-shaped pressure-receiving portion that can accommodate an LED having a light-emitting portion having a light-transmitting resin on a side surface, and the inner wall of the pressure-hole portion is in contact with the LED The light-emitting portion has a convex portion in a region facing the light-emitting portion, and the width of the convex portion is smaller than the width of the light-emitting portion.

藉由以上,可成為LED容易取出之承載帶。 With the above, it is possible to form a carrier tape in which the LED is easily taken out.

1‧‧‧將LED收容於承載帶而成之捆包體 1‧‧‧Bags in which the LEDs are housed in a carrier tape

10‧‧‧承載帶 10‧‧‧ Carrying belt

12‧‧‧壓孔部 12‧‧‧Pressing Department

12a‧‧‧內壁 12a‧‧‧ inner wall

12b‧‧‧凸部 12b‧‧‧ convex

12c‧‧‧底面 12c‧‧‧ bottom

12d‧‧‧貫通孔 12d‧‧‧through hole

14‧‧‧輸送孔 14‧‧‧ delivery hole

20‧‧‧承載帶 20‧‧‧ Carrying belt

22‧‧‧壓孔部 22‧‧‧Pressing Department

22b‧‧‧凸部 22b‧‧‧ convex

100‧‧‧發光裝置 100‧‧‧Lighting device

102‧‧‧封裝體 102‧‧‧Package

102a‧‧‧電極 102a‧‧‧electrode

102b‧‧‧基材 102b‧‧‧Substrate

102c‧‧‧凹部 102c‧‧‧ recess

102d‧‧‧開口部(發光部) 102d‧‧‧ openings (lighting section)

104‧‧‧透光性樹脂 104‧‧‧Translucent resin

106‧‧‧發光元件 106‧‧‧Lighting elements

200‧‧‧發光裝置 200‧‧‧Lighting device

202c‧‧‧凹部 202c‧‧‧ recess

202d‧‧‧開口部(發光部) 202d‧‧‧ openings (lighting section)

C1‧‧‧間隙 C1‧‧‧ gap

D1‧‧‧凸部之突出長度 The protruding length of the D1‧‧‧ convex

L1‧‧‧凹部之開口部之寬度 L1‧‧‧Width of the opening of the recess

L2‧‧‧凹部之開口部之高度 L2‧‧‧ Height of the opening of the recess

T1‧‧‧凸部之寬度 The width of the T1‧‧‧ convex

T2‧‧‧凸部之高度 Height of T2‧‧‧ convex

本發明之更完整之評價及許多隨之產生的優勢將藉助於結合隨附圖式進行之以下詳細描述而容易獲得且變得更加明顯,其中:圖1係例示本發明之實施形態之承載帶及於其一部分之壓孔部收容LED而成之捆包體之概略俯視圖。 A more complete evaluation of the present invention and many of the attendant advantages will be readily apparent from the following detailed description of the accompanying drawings in which: FIG. And a schematic plan view of the package body in which the LED is housed in a portion of the pressure hole portion.

圖2A係例示本發明之實施形態之承載帶及於其一部分之壓孔部收容LED而成之捆包體之概略立體圖。 2A is a schematic perspective view showing a carrier tape in which a carrier tape and an injection hole portion of a part of the embodiment of the present invention are housed with LEDs.

圖2B係將圖2A之一部分放大之概略放大圖。 Fig. 2B is a schematic enlarged view showing an enlarged portion of Fig. 2A.

圖3A係例示於本發明之實施形態之承載帶之壓孔部收容有LED之狀態之概略俯視圖。 3A is a schematic plan view showing a state in which an LED is housed in a press hole portion of a carrier tape according to an embodiment of the present invention.

圖3B係例示於本發明之實施形態之承載帶之壓孔部收容有LED之狀態之概略俯視圖。 3B is a schematic plan view showing a state in which an LED is housed in a press hole portion of a carrier tape according to an embodiment of the present invention.

圖3C係例示於本發明之實施形態之承載帶之壓孔部收容有LED之 狀態之概略俯視圖。 3C is a view showing an embodiment in which a pressurizing portion of a carrier tape according to an embodiment of the present invention houses an LED. A rough top view of the state.

圖4係圖1之IV-IV線之概略剖視圖。 Figure 4 is a schematic cross-sectional view taken along line IV-IV of Figure 1.

圖5係例示於本發明之實施形態之承載帶之壓孔部收容有LED之狀態之概略剖視圖。 Fig. 5 is a schematic cross-sectional view showing a state in which an LED is housed in a press hole portion of a carrier tape according to an embodiment of the present invention.

圖6係例示收容於本發明之實施形態之承載帶之壓孔部之LED的概略立體圖。 Fig. 6 is a schematic perspective view showing an LED housed in a press hole portion of a carrier tape according to an embodiment of the present invention.

圖7係例示本發明之實施形態之承載帶之壓孔部及收容於其內部之LED之概略立體圖。 Fig. 7 is a schematic perspective view showing a press hole portion of a carrier tape and an LED housed therein, according to an embodiment of the present invention.

現將參照隨附圖式對實施例進行說明,其中,於各圖式中,相同之參照符號表示相當或相同之要素。 The embodiments are described with reference to the drawings, in which like reference numerals indicate

但,以下所示之形態係例示用於將本發明之技術思想具體化之承載帶及捆包體,本發明並不將承載帶及捆包體限定於以下。 However, the form shown below exemplifies the carrier tape and the package body for embodying the technical idea of the present invention, and the present invention does not limit the carrier tape and the package body to the following.

又,本說明書絕非將申請專利範圍所示之構件特定為實施形態之構件者。尤其是實施形態所記載之構成零件之尺寸、材質、形狀,其相對配置等只要無特定之記載,則不為將本發明之範圍僅限定於其之主旨,而僅為說明例。再者,各圖式所示之構件之大小、位置關係等有為明確說明而誇張之情況。進而,於以下之說明中,相同之名稱、符號表示相同或同質之構件,且適當地省略詳細說明。 Further, the description of the invention is not intended to be a component of the embodiment. In particular, the dimensions, materials, and shapes of the components described in the embodiments are not intended to limit the scope of the present invention, and are merely illustrative examples, unless otherwise specified. Furthermore, the size, positional relationship, and the like of the members shown in the respective drawings are exaggerated for clarity of explanation. In the following description, the same names and symbols denote the same or the same components, and the detailed description is omitted as appropriate.

於本說明書中,有將收容於承載帶之側面發光型之LED之各面之名稱如以下般稱呼之情況。因LED具備複數個側面,故為說明方便,將具備發光部之側面稱作「前面」,將與該前面對向之側之側面稱作「背面」,將位於前面與背面之間之兩個側面稱作「橫面」。又,於收容於壓孔部時,將與該壓孔部之底面對向之面設為「下表面」,將與該下表面對向之面設為「上表面」。 In the present specification, the names of the respective faces of the side-illuminated LEDs housed in the carrier tape are referred to as follows. Since the LED has a plurality of side faces, for convenience of explanation, the side having the light-emitting portion is referred to as "front face", and the side facing the front face is referred to as "back face", and the two sides between the front face and the back face are referred to. The side is called "horizontal". Further, when being accommodated in the press hole portion, the surface facing the bottom surface of the press hole portion is referred to as "lower surface", and the surface facing the lower surface portion is referred to as "upper surface".

於本實施形態中,承載帶係具備複數個壓孔部(被加工為凹狀之 部分)之長條帶。壓孔部可收容在作為側面之一的前面具備發光面(發光部)之側面發光型(側視型)之LED。LED為前面及背面之寬度較橫面之寬度更大,且俯視、正視(前視)下為橫長形狀。以LED之前面、背面與壓孔部之長邊側之內壁對向,LED之兩個橫面與壓孔部之短邊側之內壁對向之方式收容。壓孔部之對向之兩個長邊形成為大致平行,同樣地對向之短邊亦形成為大致平行。再者,各面可為單一之平面,亦可具有階差、傾斜面等。 In this embodiment, the carrier tape system has a plurality of pressing holes (processed into a concave shape) Part) The long strip. The hole-hole portion can be housed in a side-light-emitting type (side-view type) LED having a light-emitting surface (light-emitting portion) on the front side as one of the side surfaces. The LED has a width greater than the width of the front surface and the back surface, and a horizontally long shape in a plan view and a front view (front view). The front surface and the back surface of the LED are opposed to the inner wall of the long side of the press hole portion, and the two lateral surfaces of the LED are accommodated in such a manner as to face the inner wall of the short side of the press hole portion. The two long sides of the opposing portions of the press-hole portions are formed to be substantially parallel, and the short sides of the opposite faces are also formed to be substantially parallel. Furthermore, each surface may be a single plane, or may have a step, an inclined surface, or the like.

LED如後述般主要具備:封裝體;安裝於封裝體之半導體發光元件(以下,稱作「發光元件」);及被覆發光元件之透光性樹脂。 As will be described later, the LED mainly includes a package, a semiconductor light-emitting device (hereinafter referred to as a "light-emitting device") mounted on the package, and a light-transmitting resin covering the light-emitting device.

LED之封裝體具有於側面(前面)開口之凹部,於凹部內載置有發光元件,並且填充有透光性樹脂。該凹部之開口部成為發光部。填充於凹部內之透光性樹脂形成為其中央附近之高度較凹部之側壁之高度更低。即,於LED之前面,凹部內之透光性樹脂之表面較封裝體之表面更低。 The LED package has a recess in the side (front) opening, and a light-emitting element is placed in the recess, and is filled with a light-transmitting resin. The opening of the concave portion serves as a light-emitting portion. The light-transmitting resin filled in the concave portion is formed such that the height near the center thereof is lower than the height of the side wall of the concave portion. That is, the surface of the light-transmitting resin in the concave portion is lower than the surface of the package before the LED.

有如下情況:透光性樹脂之一部分形成於凹部之開口部之周邊之封裝體上、即LED之前面中之發光部之周邊之封裝體上。透光性樹脂例如使用分注器供給容納於封裝體之凹部內之量,但亦存在經過硬化步驟等步驟,根據條件不同而向凹部之周邊漏出之情況。此種設於封裝體之凹部以外之透光性樹脂不構成發光部,而不會對光學特性特別產生不良影響。 There is a case where one portion of the light-transmitting resin is formed on the package around the opening of the concave portion, that is, the package around the light-emitting portion in the front surface of the LED. The translucent resin is supplied to the recessed portion of the package by using a dispenser, for example, but may be leaked to the periphery of the recess depending on the conditions such as the hardening step. Such a light-transmitting resin provided outside the concave portion of the package does not constitute a light-emitting portion, and does not particularly adversely affect optical characteristics.

然而,於LED之前面,設於凹部外、即封裝體上之透光性樹脂形成為其表面較凹部內之發光部之透光性樹脂之表面更高(更朝前方突出)。因此,於該凹部以外形成之透光性樹脂變得容易與承載帶之壓孔部之內壁黏附。於本實施形態中,藉由於壓孔部之內壁之一部分、詳細而言為與LED之前面中之發光部(凹部之開口部)對向之區域之內壁設置凸部,可使於封裝體之凹部外形成之透光性樹脂與承載帶相接 之面積變小或者消失。藉此,可減少LED與壓孔部黏附。 However, in the front surface of the LED, the light-transmitting resin provided on the outside of the concave portion, that is, the package is formed to have a higher surface (more protruding forward) than the surface of the light-transmitting resin of the light-emitting portion in the concave portion. Therefore, the light-transmitting resin formed outside the concave portion is easily adhered to the inner wall of the pressure-receiving portion of the carrier tape. In the present embodiment, by providing a convex portion on one of the inner walls of the puncture portion and, in detail, the inner wall of the region opposite to the light-emitting portion (the opening portion of the concave portion) on the front surface of the LED, the package can be packaged. The light transmissive resin formed outside the concave portion of the body is connected to the carrier tape The area becomes smaller or disappears. Thereby, the adhesion of the LED to the press hole portion can be reduced.

於壓孔部之內壁之一部分設置凸部,換言之為於壓孔部之內壁之一部分設置凹陷。即,於與LED之前面對向之壓孔部之內壁中與發光部之周邊之封裝體對向之區域設有凹陷。藉此,可使設於LED之發光部以外之透光性樹脂不易與壓孔部之內壁相接。 A convex portion is provided in a portion of the inner wall of the pressure hole portion, in other words, a recess is provided in a portion of the inner wall of the pressure hole portion. That is, a recess is formed in a region of the inner wall of the press-hole portion facing the LED before the LED and the periphery of the light-emitting portion. Thereby, the light-transmitting resin provided outside the light-emitting portion of the LED can be prevented from coming into contact with the inner wall of the press-hole portion.

凹陷形成為於將LED收容於壓孔部時與LED隔開。另一方面,凸部亦可構成為於收容LED時與該LED之發光部接觸。又,凹陷較佳為於俯視下形成於凸部之兩側。進而,於凸部之兩側形成有凹陷之壓孔部之內壁之一面亦可以凸部與凹陷形成為階梯狀。 The recess is formed to be spaced apart from the LED when the LED is received in the press hole portion. On the other hand, the convex portion may be configured to be in contact with the light-emitting portion of the LED when the LED is housed. Further, the depressions are preferably formed on both sides of the convex portion in plan view. Further, one surface of the inner wall of the pressing hole portion in which the recess is formed on both sides of the convex portion may be formed in a stepped shape by the convex portion and the concave portion.

如此,藉由於壓孔部之內壁中與LED之發光部對向之區域配置凸部,可抑制LED之黏附。其適合如下承載帶:收容填充於凹部之透光性樹脂以凹部之表面較封裝體更低(退後)之方式設置之LED。而且,於此種承載帶收容LED而成之捆包體容易取出LED,例如於向2次基板之安裝步驟中,可使取出失誤不易產生。 In this manner, by arranging the convex portions in the inner wall of the puncture portion facing the light-emitting portion of the LED, adhesion of the LED can be suppressed. It is suitable for a carrier tape that accommodates a light-transmitting resin filled in a concave portion so that the surface of the concave portion is lower (retracted) than the package. Further, the package body in which the LED is housed in the carrier tape can easily take out the LED. For example, in the step of mounting the secondary substrate, it is difficult to cause the removal error.

以下,對各構件進行詳細說明。 Hereinafter, each member will be described in detail.

(承載帶) (bearing belt)

承載帶係以特定之間隔(間距)排列有複數個壓孔部之長條帶。其寬度雖亦取決於要收容之LED之尺寸,但可使用約8mm~約24mm左右之承載帶。又,承載帶之長度可根據卷軸之尺寸等進行各種選擇。卷軸例如可使用 180mm、 330mm等尺寸。進而,於搬送少量之情形等時,亦可剪切成含有一個壓孔部之長度。 The carrier tape is arranged with a plurality of long holes of a plurality of pressing portions at a specific interval (pitch). Although the width depends on the size of the LED to be accommodated, a carrier tape of about 8 mm to about 24 mm can be used. Further, the length of the carrier tape can be variously selected depending on the size of the reel or the like. Reels can be used, for example 180mm, 330mm and other sizes. Further, when a small amount of conveyance or the like is carried out, it may be cut to a length including one of the press hole portions.

壓孔部於承載帶之表面側(上表面側)具有開口,複數個壓孔部朝向承載帶之輸送方向(長度方向)以固定間隔形成。該間隔係根據LED之大小等而任意選擇。壓孔部於承載帶之寬度方向,形成於大致中央或者偏向左右任一方向之位置。而且,於與形成有壓孔部之線平行之線上形成有貫通孔。該貫通孔係用於輸送承載帶之輸送孔(扣齒孔)。 The press hole portion has an opening on the surface side (upper surface side) of the carrier tape, and the plurality of press hole portions are formed at a fixed interval toward the conveyance direction (longitudinal direction) of the carrier tape. This interval is arbitrarily selected in accordance with the size of the LED or the like. The press-hole portion is formed at substantially the center or at any position in the left-right direction in the width direction of the carrier tape. Further, a through hole is formed in a line parallel to the line on which the press hole portion is formed. The through hole is used for conveying a conveying hole (a snap hole) of the carrier tape.

壓孔部於其內壁之一部分具備凸部。凸部之位置形成於與收容之LED之發光部對向之內壁之一部分、尤其是與構成發光部之透光性樹脂對向之位置。凸部之寬度較佳為較發光部之寬度更小。詳細而言,較佳為發光部之寬度之15%以上且90%以下之程度,更佳為40%以上且88%以下,進而較佳為50%以上且86%以下。因LED之發光部位於前面之中央,故壓孔部之凸部亦較佳為以與其對應地位於一個內壁之長邊之中央之方式設置。進而,設置有凸部係於兩側形成有凹陷,該凹陷較佳為分別以相同之寬度設置。即,壓孔部較佳為於俯視下設置為線對稱形狀。 The press hole portion has a convex portion at a portion of the inner wall thereof. The position of the convex portion is formed at a position facing one of the inner walls facing the light-emitting portion of the housed LED, in particular, the light-transmitting resin constituting the light-emitting portion. The width of the convex portion is preferably smaller than the width of the light-emitting portion. Specifically, the width of the light-emitting portion is preferably 15% or more and 90% or less, more preferably 40% or more and 88% or less, and still more preferably 50% or more and 86% or less. Since the light-emitting portion of the LED is located at the center of the front surface, the convex portion of the press-hole portion is preferably disposed so as to be located at the center of the long side of one of the inner walls. Further, the convex portion is provided with depressions formed on both sides, and the depressions are preferably provided in the same width. That is, it is preferable that the press hole portion is provided in a line symmetrical shape in plan view.

此處,「凸部之寬度」係指凸部中最突出之面、即與LED之發光部對向之面(以下,亦稱作「凸部之頂面」)之寬度(圖3A~圖3C中之T1)。又,將凸部之長度(壓孔部之短邊方向之長度)設為「凸部之突出長度」。詳細而言,係指以直線將壓孔部之長邊中位於凸部之兩側之兩個內壁(凹陷)彼此連結之假想線與凸部之頂面之距離(圖3A~圖3C中之D1)。 Here, the "width of the convex portion" refers to the width of the most prominent surface of the convex portion, that is, the surface facing the light-emitting portion of the LED (hereinafter also referred to as "the top surface of the convex portion") (FIG. 3A - FIG. T1 in 3C). Moreover, the length of the convex portion (the length in the short-side direction of the pressing hole portion) is referred to as "the protruding length of the convex portion". Specifically, the distance between the imaginary line connecting the two inner walls (recesses) on both sides of the convex portion in the long side of the pressing portion and the top surface of the convex portion in a straight line (in FIGS. 3A to 3C) D1).

凸部之寬度可為固定,或者亦可使一部分為不同寬度。此情形時,較佳為最大之寬度為發光部之寬度之上述較佳範圍(15%以上且90%以下之程度,更佳為40%以上且88%以下,進而較佳為50%以上且86%以下)。又,凸部之突出長度較佳為0.1mm以上且0.5mm以下。又,凸部可自壓孔部之內壁之下端至上端連續地設置,或者亦可以與發光部之位置對應之方式與上端或下端隔開地設置。進而,亦可相對於一個發光部,具備一個或者兩個以上之複數個凸部。又,於一個LED具有兩個以上之複數個發光部之情形時,可相對於該複數個發光部而具有一個凸部,或者亦可相對於每個發光部而具有凸部。凸部之頂面較佳為於俯視下為平坦之面(平面)。又,凸部之頂面之角帶圓弧,該圓弧之曲率半徑例如考慮壓孔加工之容易度等而較佳為0.1以 上且0.3mm以下之程度。但,並不限於此種形狀,亦可使凸部之頂面整體為凸曲面或凹曲面,或者亦可於一部分具有缺口(狹縫)等並非一體之頂面。又,於側視壓孔部時,壓孔部之凸部頂面與底面之角度可垂直,或者亦可傾斜。於傾斜之情形時,較佳為設為90度以上,例如考慮壓孔加工之容易度、LED之取出容易度等而可設為90度以上且110度之程度(例如圖4)。 The width of the protrusions may be fixed, or a part of the width may be different. In this case, the maximum width is preferably the above-mentioned preferred range of the width of the light-emitting portion (15% or more and 90% or less, more preferably 40% or more and 88% or less, still more preferably 50% or more). 86% or less). Further, the protruding length of the convex portion is preferably 0.1 mm or more and 0.5 mm or less. Further, the convex portion may be continuously provided from the lower end to the upper end of the inner wall of the pressure hole portion, or may be provided spaced apart from the upper end or the lower end in a manner corresponding to the position of the light emitting portion. Further, one or two or more plural convex portions may be provided for one light-emitting portion. Further, in the case where one LED has two or more plural light-emitting portions, one convex portion may be provided with respect to the plurality of light-emitting portions, or a convex portion may be provided for each of the light-emitting portions. The top surface of the convex portion is preferably a flat surface (planar surface) in plan view. Further, the corner of the top surface of the convex portion has a circular arc, and the radius of curvature of the circular arc is preferably 0.1 in consideration of easiness of the press hole processing or the like. Up to the extent of 0.3mm or less. However, the shape of the convex portion is not limited to such a shape, and the entire top surface of the convex portion may be a convex curved surface or a concave curved surface, or a partial surface having a notch (slit) or the like may not be integrated. Moreover, when the pressure hole portion is viewed from the side, the angle between the top surface and the bottom surface of the convex portion of the pressure hole portion may be perpendicular or may be inclined. In the case of the inclination, it is preferably 90 degrees or more, and can be set to be 90 degrees or more and 110 degrees, for example, in consideration of the easiness of the press hole processing, the ease of taking out the LED, and the like (for example, FIG. 4).

又,承載帶之凹部之內壁可設為粗糙面。例如,表面粗糙度Sa可設為0.4μm以上且1.5μm之程度。此種粗糙面可設於凹部之內壁之整面或者一部分。例如,較佳為設於凸部之頂面。 Further, the inner wall of the concave portion of the carrier tape may be a rough surface. For example, the surface roughness Sa can be set to be about 0.4 μm or more and 1.5 μm. Such a rough surface may be provided on the entire surface or a part of the inner wall of the recess. For example, it is preferably provided on the top surface of the convex portion.

於一般之承載帶中,壓孔部設有適當之間隙。於本實施形態中,具備包含凸部之內壁之壓孔部亦於與收容之LED之間具有間隙。而且,因凸部之寬度較發光部之寬度更小,為使壓孔部之內壁與LED不易黏附,以間隙不過大為前提。壓孔部之長邊側之間隙、即LED之前面或背面與壓孔部之內壁之間隙(圖3A中之C1)較佳為0.05mm~0.15mm之範圍。藉由設為具備該範圍之間隙與凸部之壓孔部,即便於壓孔部內LED進行包括旋轉之移動之情形時,亦可抑制LED黏附於壓孔部之凹陷之內壁。再者,此處之間隙並非與設於壓孔部之凸部之兩側之凹陷符合者,而係指凸部之頂面與LED之前面之間之間隙。 In a typical carrier tape, the pressure hole portion is provided with a suitable gap. In the present embodiment, the press hole portion including the inner wall of the convex portion also has a gap between the LED and the housed LED. Further, since the width of the convex portion is smaller than the width of the light-emitting portion, the inner wall of the pressure-receiving portion is less likely to adhere to the LED, and the gap is not large. The gap on the long side of the pressing portion, that is, the gap between the front surface or the back surface of the LED and the inner wall of the pressing portion (C1 in Fig. 3A) is preferably in the range of 0.05 mm to 0.15 mm. By providing the pressure hole portion having the gap and the convex portion in the range, even when the LED includes the rotation movement in the pressure hole portion, the LED can be prevented from adhering to the inner wall of the recess of the pressure hole portion. Furthermore, the gap here is not in accordance with the recess provided on both sides of the convex portion of the pressing portion, but refers to the gap between the top surface of the convex portion and the front surface of the LED.

又,複數個壓孔部分別以固定之間隔(間距)形成。若使凸部之突出長度變大,則間距亦變大。若考慮作業效率等,則間距較佳為2mm~4mm左右。壓孔部之凸部之突出長度如上述般作為較佳之範圍可列舉0.1mm~0.5mm,其中,2mm間距之情形時突出長度更佳為0.1mm~0.3mm,4mm間距之情形時,突出長度更佳為0.3~0.5mm。 Further, a plurality of press-hole portions are formed at regular intervals (pitch). When the protruding length of the convex portion is increased, the pitch is also increased. When the work efficiency or the like is considered, the pitch is preferably about 2 mm to 4 mm. The protruding length of the convex portion of the pressing portion is preferably 0.1 mm to 0.5 mm as described above, and the protruding length is preferably 0.1 mm to 0.3 mm in the case of 2 mm pitch, and the protruding length in the case of 4 mm pitch. More preferably, it is 0.3 to 0.5 mm.

又,就其他觀點而言,凸部之寬度T1與凸部之突出長度D1較佳為滿足下述(式1)之關係。 Further, from another viewpoint, the width T1 of the convex portion and the protruding length D1 of the convex portion preferably satisfy the relationship of the following (Formula 1).

0.04<D1/T1<1.43……(式1) 0.04<D1/T1<1.43......(Formula 1)

例如,圖3A表示於壓孔部12之內部中LED100不傾斜之狀態,圖3B、圖3C表示於壓孔部之內部中LED傾斜(旋轉)之狀態。圖3B與圖3A相比,凸部之寬度T1較大,凸部之突出長度D1較小。即便為此種凸部,若滿足式1之範圍,則即便LED於壓孔部內旋轉亦可使發光部不易黏附於壓孔部之內壁(凹陷之內壁)。 For example, FIG. 3A shows a state in which the LED 100 is not inclined in the inside of the press-hole portion 12, and FIGS. 3B and 3C show a state in which the LED is tilted (rotated) in the inside of the press-hole portion. 3B is larger than the width T1 of the convex portion and the protruding length D1 of the convex portion is smaller than that of FIG. 3A. Even if such a convex portion is satisfied, even if the LED is rotated in the pressure hole portion, the light-emitting portion is less likely to adhere to the inner wall of the pressure-hole portion (the inner wall of the recess).

圖3C與圖3A相比,凸部之寬度T1較小,凸部之突出長度D1較大。即便為此種凸部,若滿足式1之範圍,則即便LED於壓孔部內旋轉,亦可使發光部不易黏附於壓孔部之內壁(凹陷之內壁)。 3C is smaller than the width T1 of the convex portion and the protruding length D1 of the convex portion is larger than that of FIG. 3A. Even if such a convex portion is satisfied, even if the LED is rotated in the pressure hole portion, the light-emitting portion is less likely to adhere to the inner wall of the pressure-receiving portion (the inner wall of the recess).

具備此種壓孔部之承載帶由如下片材構成,該片材例如使用聚碳酸酯、聚苯乙烯、丙烯腈-丁二烯-苯乙烯樹脂(ABS樹脂)、聚氯乙烯樹脂、聚對苯二甲酸乙二酯、聚丙烯等熱塑性樹脂。將該片材藉由真空成型、壓空成形、加壓成型等而加工為具有壓孔部之承載帶。 The carrier tape having such a press-hole portion is composed of a sheet material using, for example, polycarbonate, polystyrene, acrylonitrile-butadiene-styrene resin (ABS resin), polyvinyl chloride resin, and poly-pair. A thermoplastic resin such as ethylene phthalate or polypropylene. The sheet is processed into a carrier tape having a press hole portion by vacuum molding, pressure forming, press molding, or the like.

(LED) (LED)

於承載帶之壓孔部收容LED。LED具備封裝體、發光元件及透光性樹脂作為主要構成要素。 The LED is housed in the pressure hole portion of the carrier tape. The LED includes a package, a light-emitting element, and a light-transmitting resin as main components.

LED之封裝體具備:樹脂、陶瓷、玻璃環氧樹脂等絕緣構件、以及作為電極發揮功能之導電構件,且具備能夠收容發光元件之凹部,該凹部之開口部成為LED之發光部。可使用封裝體之寬度例如為約1.0mm~7.0mm左右、厚度為約0.2mm~10mm左右、縱深為約0.3mm~10mm左右者。該凹部於封裝體之側面(前面)具備開口部。來自收容於凹部內之發光元件之光經由凹部內之透光性樹脂自開口部向外部放出。 The LED package includes an insulating member such as a resin, a ceramic, or a glass epoxy resin, and a conductive member that functions as an electrode, and includes a concave portion that can house the light-emitting element, and the opening of the concave portion serves as a light-emitting portion of the LED. The width of the package can be, for example, about 1.0 mm to 7.0 mm, a thickness of about 0.2 mm to 10 mm, and a depth of about 0.3 mm to 10 mm. The concave portion has an opening on the side surface (front surface) of the package. The light from the light-emitting element housed in the concave portion is discharged to the outside from the opening through the light-transmitting resin in the concave portion.

封裝體之凹部之開口部之形狀於封裝體之側面(前面)形成為橫長。凹部之寬度例如可設為約0.2mm~6.9mm左右。凹部較佳為於封裝體之橫向設於中央。根據該凹部之開口部之橫寬之長度,調整設於 承載帶之壓孔部之內壁之凸部之寬度。封裝體之側面(前面)並不限於橫長,亦可為縱橫長度大致相同之程度者或縱長。即,於收容於承載帶之壓孔部時,以發光部(凹部之開口部)與壓孔部之內壁對向之方式收容即可。 The shape of the opening of the concave portion of the package is formed to be horizontally long on the side (front surface) of the package. The width of the concave portion can be, for example, about 0.2 mm to 6.9 mm. Preferably, the recess is centrally disposed in the lateral direction of the package. Adjusting according to the length of the width of the opening of the recess The width of the convex portion of the inner wall of the pressure hole portion of the carrier tape. The side surface (front surface) of the package is not limited to the horizontal length, and may be a length or a length that is substantially the same in length and width. In other words, when it is housed in the press hole portion of the carrier tape, the light-emitting portion (the opening portion of the recess portion) may be housed so as to face the inner wall of the press-hole portion.

構成LED之發光部之透光性樹脂較佳為容易提取來自發光元件之光之樹脂,例如可列舉矽酮樹脂組合物、改性矽酮樹脂組合物、環氧樹脂組合物、改性環氧樹脂組合物、丙烯酸系樹脂組合物等具有能夠使來自發光元件之光透過之透光性之絕緣樹脂組合物。又,亦可使用矽酮樹脂、環氧樹脂、脲樹脂、氟樹脂及含有至少一種以上該等樹脂之混合樹脂等。於此種樹脂中亦可根據需要含有著色劑、光擴散劑、光反射材、各種填料、波長轉換構件(螢光構件)等。 The light-transmitting resin constituting the light-emitting portion of the LED is preferably a resin which can easily extract light from the light-emitting element, and examples thereof include an oxime resin composition, a modified fluorenone resin composition, an epoxy resin composition, and a modified epoxy. The resin composition, the acrylic resin composition, and the like have an optically insulating resin composition capable of transmitting light from the light-emitting element. Further, an fluorenone resin, an epoxy resin, a urea resin, a fluororesin, a mixed resin containing at least one of these resins, or the like may be used. In such a resin, a coloring agent, a light diffusing agent, a light reflecting material, various fillers, a wavelength converting member (fluorescent member), or the like may be contained as needed.

透光性樹脂之蕭氏A硬度為75以下,或者蕭氏D硬度為70以下。較佳為蕭氏A硬度為70以下,或者蕭氏D硬度為70以下。此種硬度之樹脂之黏性較高,為容易黏附於壓孔部之內壁之性質,但藉由於壓孔部之內壁之一部分設置凸部,可減少黏附。再者,蕭氏A硬度、蕭氏D硬度係使用一般之蕭氏A硬度測定器或者蕭氏D硬度測定器並基於ASTM-D-2240測定之值。 The light-transmitting resin has a Shore A hardness of 75 or less, or a Shore D hardness of 70 or less. It is preferable that the Shore A hardness is 70 or less, or the Shore D hardness is 70 or less. The resin having such hardness has a high viscosity and is easy to adhere to the inner wall of the press hole portion. However, since a convex portion is provided in one portion of the inner wall of the press hole portion, adhesion can be reduced. Further, the Shore A hardness and the Shore D hardness are values measured based on ASTM-D-2240 using a general Shore A hardness tester or a Shore D hardness tester.

(捆包體) (bundle)

於承載帶之壓孔部內分別收容LED,進而於壓孔部之開口側接著覆蓋帶而成之捆包體例如可於被捲繞於具備芯之卷軸之狀態下,作為一個捆包體搬送。進而,自工廠出貨時,每個卷軸分別被封入經實施抗靜電對策之袋內。 The packaged body in which the LED is housed in the pressure-receiving portion of the carrier tape and which is covered with the tape on the opening side of the pressure-receiving portion can be carried as a package body, for example, in a state in which it is wound around a reel having a core. Further, each of the reels is sealed in a bag subjected to antistatic countermeasures when shipped from the factory.

(實施形態1) (Embodiment 1)

圖1係表示實施形態1之承載帶10、與於承載帶10之壓孔部12之一部分收容LED100而成之捆包體之一部分之俯視圖。圖2A係立體圖,圖2B係圖2A之壓孔部之放大圖。圖3A~圖3C係壓孔部12以及於 其中收容有LED100之狀態之俯視圖,且關於LED100,包括局部剖視圖以便瞭解其內部構造。圖4表示圖1之IV-IV剖面之剖視圖,且係左側表示壓孔部之內壁之不包含凸部之剖面(通過發光元件之剖面),右側表示壓孔部之內壁之包含凸部之剖面之剖視圖。圖5係壓孔部12以及於其中收容有LED100之狀態之剖視圖,且關於LED100,包括局部剖視圖以便瞭解其內部構造。圖6係LED100之立體圖。 Fig. 1 is a plan view showing a portion of a carrier body 10 of the first embodiment and a package body in which the LED 100 is housed in one of the press-hole portions 12 of the carrier tape 10. 2A is a perspective view, and FIG. 2B is an enlarged view of the pressure hole portion of FIG. 2A. 3A to 3C are the pressure hole portion 12 and A top view in which the state of the LED 100 is housed, and with respect to the LED 100, includes a partial cross-sectional view to understand its internal configuration. 4 is a cross-sectional view taken along line IV-IV of FIG. 1, and the left side shows a cross section of the inner wall of the press-hole portion not including the convex portion (through the cross section of the light-emitting element), and the right side shows the convex portion of the inner wall of the press-hole portion. A cross-sectional view of the section. Fig. 5 is a cross-sectional view showing a state in which the press hole portion 12 and the LED 100 are housed therein, and with respect to the LED 100, a partial cross-sectional view is included to understand the internal configuration thereof. 6 is a perspective view of the LED 100.

於實施形態1中,承載帶10例如由寬度為約8.0mm、厚度為約0.2mm之以聚碳酸酯為主成分之樹脂片材構成。此處作為LED100,使用寬度為約3.00mm、厚度為約0.40mm、縱深(自具備發光部之側面(前面)至背面之長度)為約0.85mm之LED10。承載帶10之壓孔部12於俯視下形成為細長,長邊之長度(寬度)為約3.15mm、短邊之長度(縱深)為約1.00mm,深度為約0.55mm。壓孔部之長邊與LED之寬度對應。 In the first embodiment, the carrier tape 10 is composed of, for example, a resin sheet mainly composed of polycarbonate having a width of about 8.0 mm and a thickness of about 0.2 mm. Here, as the LED 100, an LED 10 having a width of about 3.00 mm, a thickness of about 0.40 mm, and a depth (a length from the side (front surface) to the back surface of the light-emitting portion) of about 0.85 mm is used. The press-hole portion 12 of the carrier tape 10 is formed to be elongated in plan view, the length (width) of the long side is about 3.15 mm, the length (depth) of the short side is about 1.00 mm, and the depth is about 0.55 mm. The long side of the pressing portion corresponds to the width of the LED.

LED100於封裝體102之側面(前面)具備凹部之開口部,如圖3及圖5所示,凹部之開口部102d之寬度L1為約2.2mm,高度L2為約0.3mm。壓孔部12之寬度為約3.15mm,凸部12b之寬度T1為約1.35mm。再者,此處因凸部12b之側面(與LED之發光部對向之面)之角帶圓弧,故作為凸部12b寬度,將最接近LED之面(凸部頂面)之寬度作為凸部之寬度T1。 The LED 100 is provided with an opening portion of the concave portion on the side surface (front surface) of the package body 102. As shown in FIGS. 3 and 5, the width L1 of the opening portion 102d of the concave portion is about 2.2 mm, and the height L2 is about 0.3 mm. The width of the pressing portion 12 is about 3.15 mm, and the width T1 of the convex portion 12b is about 1.35 mm. Here, since the corner of the side surface of the convex portion 12b (the surface facing the light-emitting portion of the LED) has an arc, the width of the convex portion 12b is the closest to the surface of the LED (the top surface of the convex portion). The width T1 of the convex portion.

如圖5所示,壓孔部12之凸部12b之高度T2與自壓孔部12之上端至下端之距離、即壓孔部12之深度相同。可如此般設為與壓孔部之深度相同之高度之凸部,但並不限於此,凸部之高度T2較發光部102d之上下方向之寬度L2更大即可。 As shown in FIG. 5, the height T2 of the convex portion 12b of the pressing hole portion 12 is the same as the distance from the upper end to the lower end of the pressing hole portion 12, that is, the depth of the pressing hole portion 12. The convex portion having the same height as the depth of the pressing portion may be used. However, the height T2 of the convex portion may be larger than the width L2 of the upper portion of the light emitting portion 102d.

(實施形態2) (Embodiment 2)

圖7係表示實施形態2之承載帶20之一部分、與收容於該壓孔部22之LED200之圖。LED200於其側面之偏上側形成有凹部202c,該部分成為發光部202d。而且,壓孔部22之內壁之凸部22b配合該發光部 202d而設於上側。即,設為較壓孔部22之深度更短之高度之凸部。 Fig. 7 is a view showing a portion of the carrier tape 20 of the second embodiment and an LED 200 housed in the pressing hole portion 22. The LED 200 is formed with a concave portion 202c on the upper side of the side surface thereof, and this portion serves as the light-emitting portion 202d. Moreover, the convex portion 22b of the inner wall of the pressing portion 22 is fitted to the light emitting portion. 202d is set on the upper side. That is, a convex portion having a height shorter than the depth of the pressure hole portion 22 is set.

本發明之承載帶可用於在照明用光源、各種指示器用光源、車載用光源、液晶之背光用光源、感測器用光源中所使用之LED用之承載帶。 The carrier tape of the present invention can be used for a carrier tape for LEDs used in illumination light sources, various indicator light sources, vehicle light sources, liquid crystal backlight sources, and sensor light sources.

1‧‧‧將LED收容於承載帶而成之捆包體 1‧‧‧Bags in which the LEDs are housed in a carrier tape

10‧‧‧承載帶 10‧‧‧ Carrying belt

12‧‧‧壓孔部 12‧‧‧Pressing Department

12b‧‧‧凸部 12b‧‧‧ convex

14‧‧‧輸送孔 14‧‧‧ delivery hole

100‧‧‧發光裝置 100‧‧‧Lighting device

Claims (11)

一種承載帶,其係用於收容LED者,且具備形成有能夠收容LED之凹狀之壓孔部的片材,上述壓孔部於俯視下構成為收容側面設有具有透光性樹脂之發光部之LED的形狀,上述壓孔部於形成凹狀之內壁之一面形成有與LED之發光部對向之凸部,於上述凸部之兩側形成有於收容有LED時與該LED隔開之凹陷,上述凸部之俯視下之寬度形成為較LED之發光部之寬度更窄。 A carrier tape for accommodating an LED, and a sheet having a concave-shaped pressure-receiving portion capable of accommodating an LED, wherein the pressure-receiving portion is configured to have a light-emitting resin illuminating side in a plan view. a shape of the LED of the portion, wherein the pressing portion forms a convex portion facing the light emitting portion of the LED on one surface of the concave inner wall, and is formed on both sides of the convex portion to be separated from the LED when the LED is housed In the open recess, the width of the convex portion in a plan view is formed to be narrower than the width of the light emitting portion of the LED. 如請求項1之承載帶,其中上述凸部與形成於該凸部之兩側之凹陷形成為階梯狀。 The carrier tape of claim 1, wherein the convex portion and the concave portion formed on both sides of the convex portion are formed in a stepped shape. 一種承載帶,其特徵在於:其係具備凹狀之壓孔部者,該壓孔部能夠收容側面具備具有透光性樹脂之發光部之LED,且上述壓孔部之內壁於與上述LED之發光部對向之區域具有凸部,該凸部之寬度較上述發光部之寬度更小。 A carrier tape comprising a concave-shaped pressure-receiving portion capable of accommodating an LED having a light-emitting portion having a light-transmitting resin on a side surface thereof, wherein an inner wall of the pressure-receiving portion is opposite to the LED The light-emitting portion has a convex portion in a region facing the light-emitting portion, and the width of the convex portion is smaller than a width of the light-emitting portion. 如請求項1之承載帶,其中上述凸部之寬度為上述發光部之寬度之15%以上且90%以下之寬度。 The carrier tape according to claim 1, wherein the width of the convex portion is a width of 15% or more and 90% or less of a width of the light-emitting portion. 如請求項1之承載帶,其中上述凸部之突出長度為0.1mm以上且0.5mm以下。 The carrier tape of claim 1, wherein the protruding portion has a protruding length of 0.1 mm or more and 0.5 mm or less. 如請求項1之承載帶,其中關於上述凸部,凸部之寬度T1與凸部之突出長度D1滿足以下(式1)之關係:0.04<D1/T1<1.43……(式1)。 The carrier tape of claim 1, wherein the width T1 of the convex portion and the protruding length D1 of the convex portion satisfy the relationship of the following (Formula 1) with respect to the convex portion: 0.04 < D1/T1 < 1.43 (Expression 1). 如請求項1至6中任一項之承載帶,其構成為於收容有LED時上述凸部與該LED之發光部接觸。 The carrier tape according to any one of claims 1 to 6, wherein the convex portion is in contact with the light-emitting portion of the LED when the LED is housed. 如請求項1之承載帶,其中上述凸部為自上述壓孔部之上端到達下端之高度。 The carrier tape of claim 1, wherein the convex portion is a height from an upper end of the pressure hole portion to a lower end. 一種捆包體,其係於如請求項1之承載帶之壓孔部收容LED而成。 A package body which is obtained by accommodating an LED in a press hole portion of a carrier tape of claim 1. 如請求項9之捆包體,其中上述LED之透光性樹脂包含矽酮。 The package body of claim 9, wherein the light transmissive resin of the LED comprises an anthrone. 如請求項9之捆包體,其中上述透光性樹脂之蕭氏A硬度為75以下,或者蕭氏D硬度為70以下。 The package according to claim 9, wherein the translucent resin has a Shore A hardness of 75 or less, or a Shore D hardness of 70 or less.
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