JP2010135706A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve stability and yield in a surface mounting type light-emitting device allowed to be used for both of an upper surface light-emitting type and a side-surface light emitting type, when using the light-emitting device as the side surface light-emitting type. <P>SOLUTION: The surface mounting type light-emitting device includes: a light-emitting element; a package which is provided with a recess for mounting the light-emitting element on the front side and a notch on the upper surface side of a rear part; a first lead led out from the right side surface of the package; and a second lead led out from the left side surface of the package. When using the light-emitting device as the upper surface light-emitting type, the rear of the package is used as a mounting part, and when using the device as the side surface light-emitting type, the bottom of the package is used as a mounting part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an improvement of a surface mount type light emitting device.

  The surface mount (SMD) type light emitting device includes a top emission type (top view type) in which the optical axis of the emitted light is perpendicular to the mounting surface, and a side surface in which the optical axis of the emitted light is parallel to the mounting surface. Although broadly divided into light-emitting types (side-view types), there is also a dual-purpose light-emitting device capable of both light emission modes of top emission and side emission. Examples of the combined light emitting device include the light emitting devices described in Patent Documents 1 and 2. The light emitting device of Patent Document 1 forms a side connection portion and a back connection portion by bending a lead drawn from the long side surface of a horizontally long package along the long side surface and the back surface. This light emitting device is a top emission type when mounted with the back connection portion facing the mounting surface, and is a side light emission type when mounted with the side connection portion facing the mounting surface. In the light emitting device of Patent Document 2, a lead pulled out from one side surface of the package is bent in order along the side surface, the back surface, and the other side surface to expose the surface in three directions, so that a surface in three directions other than the light emitting surface is obtained. A connecting portion is formed in Accordingly, the light emitting device can be used as a top emission type, a vertical side emission type, or a lateral side emission type.

Japanese Patent Laid-Open No. 5-218507 JP 2000-40781 A

Since the light emitting devices of Patent Documents 1 and 2 have a center of gravity at the center of the device, the position of the center of gravity when used as a side light emitting type is high. Therefore, the stability is poor, and the light emitting device is likely to be misaligned or the light emitting device is overturned during mounting. Therefore, the yield is reduced.
Therefore, an object of the present invention is to improve the stability and improve the yield when used as a side-emitting type in a surface-mounted light-emitting device for both top-emitting and side-emitting.

In order to achieve the above object, the present invention has the following configuration. That is,
A surface-mounted light emitting device,
A light emitting element;
A package provided with a recess on which the light emitting element is mounted on the front side, and a notch on the upper surface side of the back part; and
A first lead inserted into the package, the first region extending from the right side surface of the package and extending along the right side surface; and the second region extending along the back surface of the package continuously from the first region; A first lead having a third region extending along the bottom surface opposite to the top surface of the package continuously to the second region;
A second lead inserted into the package, the first region extending from the left side surface of the package and extending along the left side surface; and the second region extending along the back surface of the package continuously from the first region; A second lead having a third region extending along the bottom surface opposite to the upper surface of the package continuously to the second region;
With
When used as a top emission type, the back of the package is the mounting part,
When used as a side-emitting type, the bottom surface of the package is a mounting part.
A light emitting device.

  In the light emitting device of the present invention, a first installation mode (upper surface light emitting type installation mode) in which the back surface of the package is arranged to face the mounting substrate, and a second installation mode in which the bottom surface of the package is arranged to face the mounting substrate. It can be installed in two types of aspects (side emission type installation aspect). Since the notch is provided on the upper surface of the package, the center of gravity of the light emitting device is located on the bottom surface side of the center of the light emitting device. Therefore, it becomes a mounting substrate side at the time of a side emission type installation mode, and the stability at the time of mounting improves. As a result, the yield is improved.

  An LED chip is preferable as the light emitting element of the light emitting device of the present invention. If the LED chip is used, the device can be made compact, which contributes to the miniaturization of the light emitting device. In particular, in the case of a side-emitting light emitting device that is used for a small display such as a mobile phone, downsizing is important. The light emitting element is mounted on the mount portion of the lead member, and is disposed on the bottom surface of a recess formed in a package to be described later. The recess is filled with a sealing member. The emission color of the LED chip is not particularly limited. Further, a fluorescent material that emits fluorescence when excited by light from the LED chip may be included in the sealing member so that light of a color different from the original emission color of the LED chip is emitted.

The package of the light emitting device of the present invention has a recess on the front side. A light emitting element is mounted on the bottom surface of the recess, and light is emitted from the front side of the package. A notch is provided on the upper surface side of the back surface portion. In the present specification, each surface of the package is defined according to a so-called six-sided view with the light emission side surface as the front surface. That is, the side opposite to the front surface (light emitting surface) of the package is the back surface, one surface substantially perpendicular to the light emitting surface is the top surface, the side opposite to the top surface is the bottom surface, and the remaining surfaces are the left and right side surfaces. The shape of the recess is a horizontally long cup shape along the longitudinal direction of the light emitting device. A light emitting element is disposed on the bottom surface of the recess. A light-emitting element is disposed on the bottom surface of the concave portion by exposing a mount portion of a lead, which will be described later, provided with the light-emitting element from a part of the bottom surface of the concave portion. Further, a bonding portion that is wire-bonded to the light emitting element may be exposed from the bottom surface of the recess. The inner wall surface of the recess surrounds the light emitting element in the circumferential direction.
The package is formed of white resin or the like, and the inner wall surface of the reflection case serves as a reflector. In addition, a light reflection property can also be improved by providing a metal layer on the inner wall surface of the reflection case by plating.

  The shape of the cutout of the package is not particularly limited, and is arbitrary as long as the strength of the package is not excessively lowered. For example, it may be set in consideration of the shape and weight of the package. By providing the notch on the upper surface side, the center of gravity of the light emitting device is positioned on the bottom surface side from the center of the light emitting device. Therefore, since the center of gravity is located on the mounting substrate side when used as a side-emitting type, the stability during mounting is improved and the yield is improved. The notch is preferably formed in the center of the upper surface. This is because the center of gravity of the light emitting device is located in the center in the left-right direction, and thus the stability is further increased.

  A first lead and a second lead are inserted into the package. A mount portion for mounting the LED chip is provided in the insert region of the first lead or the insert region of the second lead.

In addition to the insert region, the first lead is pulled out from the right side surface of the package and is a first region along the right side surface. The second region is a second region continuous with the first region and along the back surface of the package. And a third region that is continuous with the second region and that extends along the bottom surface of the package. For example, a part of the first lead is pulled out from the right side surface of the package, and the leading portion is bent along each surface in the order of the right side surface, the back surface, and the bottom surface of the package. Three regions can be formed.
In addition to the insert region, the second lead is pulled out from the left side surface of the package and extends along the left side surface. The second region is a second region continuous with the first region and along the back surface of the package. And a third region that is continuous with the second region and that extends along the bottom surface of the package. Each region of the second lead can be formed by pulling out a part of the second lead from the left side surface of the package and bending it sequentially in the same manner as each region of the first lead.
The outer surface of the third region of the first lead and the second lead, that is, the surface opposite to the surface facing the package is preferably located on the same surface as the bottom surface of the package. This is because stability is increased when the bottom surface of the package is installed on the mounting substrate side. For example, a recess deeper than the thickness of each lead is provided in a part of the bottom surface of the package, and the third region of each lead is disposed in the recess.

With the first lead and the second lead thus formed, the light emitting device of the present invention can be installed in two types of modes, a top emission type and a side emission type. When used as a top emission type, the back surface of the package serves as a mounting portion, and the second region of the first lead and the second region of the second lead are connected to the connection terminal of the mounting substrate. When used as a side-emitting type, the bottom surface of the package serves as a mounting portion, and the third region of the first lead and the third region of the second lead are connected to the connection terminal of the mounting substrate.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1A is a perspective view of the light emitting device 1 according to the embodiment as viewed from the upper surface side, and FIG. 1B is a perspective view of the light emitting device 1 as viewed from the bottom surface side. FIG. 2 is a six-sided view, (A) is a top view, (B) is a left side view, (C) is a front view, (D) is a right side view, (E) is a bottom view, and (F) is a bottom view. It is a rear view. FIG. 3 is a cross-sectional view taken along the line AA in FIG.
As shown in FIG. 1A, the light emitting device 1 includes a package 12 including a reflective case 10 and a terminal holding portion 11, a first lead 3, and a second lead 4.
As shown in FIG. 3, the reflection case 10 is provided on the front side of the light emitting device 1 and includes a recess 13 that opens to the front side. The recess 13 has a horizontally long cup shape extending along the longitudinal direction of the light emitting device 1, and the inner peripheral surface of the recess 13 is a reflective surface. The recess 13 is filled with a silicone resin-based sealing member to form a sealing portion 70. The sealing member contains a phosphor that absorbs blue light and emits yellow light. At the bottom of the inner wall surface of the recess 13, a part of the insert region 31 of the first lead 3 and a part of the insert region 41 of the second lead 4 are exposed. The constituent material of the reflective case 10 is a synthetic resin such as nylon, and the insert regions 31 and 41 are covered with such a synthetic resin, whereby the adhesion to the sealing member made of a silicone resin can be improved. Further, the inner peripheral surface of the recess 13 can be coated with a white paint or the like to enhance reflectivity.

  The terminal holding part 11 is integrally formed with the reflection case 10 on the back side of the reflection case 10 and is solid as a whole. As shown in FIG. 2E, first concave portions 23 and 24 are formed on the left and right side surfaces of the terminal holding portion 11, respectively. Second recesses 25 and 26 are formed on the rear surface of the terminal holding portion 11 from both side portions toward the center. Third concave portions 27 and 28 are formed on the bottom surface of the terminal holding portion 11 from the both side portions toward the center.

The first lead 3 includes an insert region 31, first regions 32 a and 32 b, a second region 33, and a third region 34. As shown in FIG. 3, the insert portion 31 has a length of about 3/4 of the width L of the reflective case 10. The LED chip 60 is mounted on a portion of the insert portion 31 that is located substantially at the center of the reflective case 10. The LED chip 60 is a blue light emitting diode. The portions of the first lead 3 that are pulled out from the reflection case 10 become the first regions 32a and 32b. As shown in FIG. 2E, the first regions 32 a and 32 b are bent along the side surface of the terminal holding portion 11 and stored in the recess 23. The second region 33 is continuously provided on the distal end side of the first regions 32 a and 32 b, is bent along the back surface of the terminal holding portion 11, and is stored in the second recess 25. The third region 34 is continuously provided on the distal end side of the second region 33, is bent along the bottom surface of the terminal holding portion 11, and is stored in the third recess 27.
Similar to the first lead 3, the second lead 4 includes an insert region 41, first regions 42 a and 42 b, a second region 43, and a third region 44. As shown in FIG. 3, the insert portion 41 has a length of about ¼ of the width L of the reflection case 10. The portions of the second lead 4 that are pulled out from the reflection case 10 become the first regions 42a and 42b. Similar to the first lead 3, the first regions 42 a and 42 b are stored in the recess 24, the second region 43 is stored in the recess 26, and the third region 44 is stored in the third recess 28.
As shown in FIGS. 2B and 2C, the outer surfaces (mounting side surfaces) of the third regions 34 and 44 are positioned on substantially the same plane as a flat portion 52 described later.

  A notch 50 is provided in the center on the upper surface side of the back surface of the terminal holding portion 11. The notch 50 communicates with the concave gate portion 51 located on the back surface portion of the terminal holding portion 11. The gate part 51 is a part into which the material resin is injected when the package 12 is molded. On the bottom surface of the terminal holding portion 11, a flat portion 52 that is continuous with the bottom surface of the reflection case 11 is formed.

4A and 4B are left side views of the light emitting device 1 in a mounted state. As shown in FIG. 4A, the light-emitting device 1 is mounted with the back surface thereof facing the mounting substrate 100 and the second regions 33 and 43 are mounted as mounting portions, and functions as a top-emitting type. On the other hand, as shown in FIG. 4B, the bottom surface is disposed so as to face the mounting substrate 100, and the third regions 34 and 44 are mounted as mounting portions to function as a side-emitting type. As described above, the light emitting device 1 is a light emitting device for both the top emission type and the side emission type. A notch 50 is provided in the center on the upper surface side of the back surface of the light emitting device 1, and the center of gravity P of the light emitting device 1 is closer to the bottom surface than the center O of the light emitting device 1 when used as a side light emitting type. It will be located (refer FIG. 4 (B)). That is, when used as a side-emitting type, the center of gravity is located on the mounting surface side, and the stability during mounting is improved. As a result, the yield is improved. The first region 32a on the bottom surface side of the first lead is formed wider (thicker) than the first region 32b on the upper surface side, and the first region 42a on the bottom surface side of the second lead is formed on the first region 42b on the upper surface side. You may form wide (thick). Alternatively, a part of the region on the upper surface side of each region of the first and second leads may be removed, and each region may be disposed closer to the bottom surface. In this way, when used as a side-emitting type, the center of gravity P of the light-emitting device 1 is located on the bottom side further, so that the stability during mounting is further improved. On the other hand, a flat surface portion 52 is formed on the bottom surface of the terminal holding portion 11, and the bottom surfaces of the third regions 34 and 44 are located on substantially the same plane as the flat surface portion 52. As a result, a wide planar area is secured on the bottom surface of the package 12, and when used as a side-emitting type, stability during mounting is further improved.
In the first leads 3, 4, the first regions 32 a, 32 b, 42 a, 42 b are drawn from the left and right side surfaces that are the short surfaces of the package 12. Thereby, compared with the case where it pulls out from a longitudinal surface, when bending the 2nd area | regions 33 and 43 and the 3rd area | regions 34 and 44, the load to the package 12 becomes small and a failure | damage is prevented.
When the light emitting device 1 is used as a top emission type, the third regions 34 and 44 are exposed. When the light emitting device 1 is used as a side emission type, the second regions 33 and 43 are exposed. . In addition, the second region 33 and the second region 43 are located on a parallel line in the longitudinal direction of the light emitting device 1, and the third region 34 and the third region 44 are also located on a parallel line in the longitudinal direction of the light emitting device 1. When a plurality of light emitting devices 1 are used, by mounting the light emitting devices 1 so as to be arranged in a line in the longitudinal direction, the width of the mounting area is reduced and the mounting area is saved. By incorporating this as a light source to form a device, the device can be made thinner or smaller.

The present invention can be used as a light source for various apparatuses.

The present invention is not limited to the description of the embodiments and examples of the invention described above. Various modifications may be included in the present invention as long as those skilled in the art can easily conceive without departing from the description of the scope of claims. The contents of papers, published patent gazettes, patent gazettes, and the like specified in this specification are incorporated by reference in their entirety.

1A is a front perspective view of the light emitting device 1, and FIG. 1B is a rear perspective view of the light emitting device 1. 2A and 2B are six views of the light-emitting device 1. FIG. 2A is a plan view, FIG. 2B is a left side view, FIG. 2C is a front view, FIG. 2D is a right side view, and FIG. (F) is a rear view. FIG. 3 is a cross-sectional view taken along line AA in FIG. 4A is a left side view of the light emitting device 1 in a top emission type mounting state, and FIG. 4B is a left side view of the light emitting device 1 in a side emission type mounting state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 Reflective case 11 Terminal holding part 12 Package 13 Recess 14 Mount part 15 Bonding part 3 1st lead member 31 Insert area 32a, 32b 1st area 33 2nd area 34 3rd area 4 2nd lead member 41 Insert area 42a, 42b 1st area | region 43 2nd area | region 44 3rd area | region 50 Notch 51 Gate part 60 LED chip 70 Sealing part

Claims (3)

A surface-mounted light emitting device,
A light emitting element;
A package provided with a recess on which the light emitting element is mounted on the front side, and a notch on the upper surface side of the back part; and
A first lead inserted into the package, the first region extending from the right side surface of the package and extending along the right side surface; and the second region extending along the back surface of the package continuously from the first region; A first lead having a third region extending along the bottom surface opposite to the top surface of the package continuously to the second region;
A second lead inserted into the package, the first region extending from the left side surface of the package and extending along the left side surface; and the second region extending along the back surface of the package continuously from the first region; A second lead having a third region extending along the bottom surface opposite to the upper surface of the package continuously to the second region;
With
When used as a top emission type, the back of the package is the mounting part,
When used as a side-emitting type, the bottom surface of the package is a mounting part.
Light emitting device.   The said notch part is provided in the center of the upper surface side of the back surface part of the said package, and communicates with the concave-shaped gate part used as the injection | pouring part of a forming material when the said package is shape-molded. Light emitting device.   3. The light emitting device according to claim 1, wherein an outer surface of a third region of the first lead and an outer surface of the third region of the second lead are located on the same plane as a bottom surface of the package.

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