KR101091270B1 - Light emitting package and light emitting apparatus having the same - Google Patents
Light emitting package and light emitting apparatus having the same Download PDFInfo
- Publication number
- KR101091270B1 KR101091270B1 KR20100028840A KR20100028840A KR101091270B1 KR 101091270 B1 KR101091270 B1 KR 101091270B1 KR 20100028840 A KR20100028840 A KR 20100028840A KR 20100028840 A KR20100028840 A KR 20100028840A KR 101091270 B1 KR101091270 B1 KR 101091270B1
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- South Korea
- Prior art keywords
- light emitting
- cavity
- emitting device
- resin
- device package
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The embodiment relates to a light emitting device package and a light emitting device having the same.
The light emitting device package according to the embodiment, the body having a cavity; A plurality of lead electrodes disposed in the cavity; A light emitting element disposed in the cavity and electrically connected to the plurality of lead electrodes; Resin formed in the cavity; And a resin overflow preventing groove formed stepwise around the upper portion of the cavity of the body.
Description
The embodiment relates to a light emitting device package and a light emitting device having the same.
Light emitting diodes (LEDs) may be configured to generate light sources using compound semiconductor materials such as GaAs series, AlGaAs series, GaN series, InGaN series, and InGaAlP series.
Such a light emitting diode is packaged and used as a light emitting device that emits various colors, and the light emitting device is used as a light source in various fields such as a lighting indicator for displaying colors, a character display, and an image display.
The embodiment provides a light emitting device package including a structure capable of preventing overflow of a resin material around a cavity in a body, and a light emitting device having the same.
The embodiment provides a light emitting device package having a resin overflow prevention resin overflow prevention groove around a cavity of a body, and a light emitting device having the same.
The embodiment provides a light emitting device package having a resin overflow prevention groove around a cavity of the body to reduce a contact area between the light guide plate and the resin material, and a light emitting device having the same.
The light emitting device package according to the embodiment, the body having a cavity; At least one lead electrode disposed in the cavity; A light emitting element disposed in the cavity and electrically connected to the lead electrode; Resin formed in the cavity; And a resin overflow preventing groove formed stepped around the cavity of the body.
The light emitting device according to the embodiment includes a body having a cavity, at least one lead electrode disposed in the cavity, a light emitting element disposed in the cavity and electrically connected to the lead electrode, a resin formed in the cavity, and the body of the body. A plurality of light emitting device package including a resin overflow prevention groove formed stepped around the cavity; A substrate in which the plurality of light emitting device packages are arranged; And a light guide plate disposed corresponding to the cavities of the plurality of light emitting device packages.
The embodiment has the effect of preventing the resin overflow in the LED package.
The embodiment may prevent the resin material from protruding on the LED package.
The embodiment may provide a gap between the light emitting diode package and the light guide plate to remove color spreading in the light guide plate incident part.
1 is a cross-sectional view of a light emitting device package according to a first embodiment.
2 is a cross-sectional view of a light emitting device package according to a second embodiment.
3 is a cross-sectional view of a light emitting device package according to a third embodiment.
4 is a cross-sectional view of a light emitting device package according to a fourth embodiment.
5 is a cross-sectional view of a light emitting device package according to a fifth embodiment.
6 is a plan view of a light emitting device package according to a sixth embodiment.
7 is a plan view of a light emitting device package according to a seventh embodiment.
8 is a plan view of a light emitting device package according to an eighth embodiment.
9 is a plan view of a light emitting device package according to a ninth embodiment.
10 is a plan view of a light emitting device package according to the tenth embodiment.
11 is a cross-sectional view of a light emitting device package according to an eleventh embodiment.
12 is a cross-sectional view of a light emitting device according to a twelfth embodiment.
FIG. 13 is a diagram illustrating a problem caused by contact between a resin and a light guide plate of a light emitting device package.
FIG. 14 is a view illustrating a light emitting device package and a light guide plate of FIG. 12.
15 is a view showing a light emitting device according to a thirteenth embodiment.
In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.
In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.
Hereinafter, a light emitting device package and a light emitting device using the same according to embodiments will be described with reference to the accompanying drawings.
First Embodiment
1 is a side cross-sectional view of a light emitting device package according to a first embodiment.
Referring to FIG. 1, the light
The material of the
The
The shape of the
The
The
The depth A1 of the
The resin
A plurality of
Ends of the plurality of
The plurality of
The
The
The
The
The resin
The resin
The depth B1 of the resin
The resin
The upper surface width D1 of the
When the
The resin
2 is a cross-sectional view illustrating a light emitting device package according to a second embodiment. The second embodiment will be described with reference to the first embodiment.
Referring to FIG. 2, the light emitting
In addition, the upper end P1 of the
The
3 is a cross-sectional view illustrating a light emitting device package according to a third embodiment. The third embodiment will be described with reference to the embodiment disclosed above.
Referring to FIG. 3, the light emitting
An upper surface height of the
4 is a cross-sectional view illustrating a light emitting device package according to a fourth embodiment. The fourth embodiment will be described with reference to the embodiment disclosed above.
Referring to FIG. 4, the light emitting
5 is a cross-sectional view illustrating a light emitting device package according to a fifth embodiment. The fifth embodiment will be described with reference to the embodiment disclosed above.
Referring to FIG. 5, the light emitting
The
Here, the height B2 and the width C4 of the resin
The
6 is a plan view of a light emitting device package according to a sixth embodiment. The sixth embodiment will be described with reference to the embodiment disclosed above.
Referring to FIG. 6, the light emitting
7 is a plan view of a light emitting device package according to a seventh embodiment. The seventh embodiment will be described with reference to the embodiments disclosed above.
Referring to FIG. 7, the light emitting
8 is a plan view of a light emitting device package according to an eighth embodiment. An eighth embodiment will be described with reference to the embodiment disclosed above.
Referring to FIG. 8, the light emitting
9 is a plan view of a light emitting device package according to a ninth embodiment. The ninth embodiment will be described with reference to the embodiments disclosed above.
Referring to FIG. 9, the light emitting
10 is a plan view of a light emitting device package according to the tenth embodiment. The tenth embodiment will be described with reference to the embodiment disclosed above.
Referring to FIG. 10, the light emitting
11 is a side cross-sectional view of a light emitting device package according to an eleventh embodiment. The eleventh embodiment will be referred to the embodiment disclosed above.
Referring to FIG. 11, the light emitting
The lower surface of the second
12 illustrates a display device according to a twelfth embodiment. The twelfth embodiment may selectively apply the light emitting device package of the above-described embodiment (s), and the description of the package will be referred to in describing the light emitting device package.
Referring to FIG. 12, the
The light emitting
The plurality of light emitting device packages 101 may be mounted on the
Elements such as the
The
The
The
FIG. 13 is a diagram illustrating an example of light loss in a light guide plate due to the shape of a resin of a light emitting device package. FIG.
Referring to FIG. 13, when the light emitting
FIG. 14 is a view illustrating the light emitting device package and the light guide plate of FIG. 12.
Referring to FIG. 14, a gap G1 between the light emitting
15 is a view showing a light emitting device according to a thirteenth embodiment.
Referring to FIG. 15, the light emitting device has a structure in which a part of the light emitting
Accordingly, the surface S1 of the
The light emitting side of the light emitting device package according to the embodiment may be disposed not only the light guide plate, but also an optical sheet, a reflective plate, a lens, and the like, but is not limited thereto. The light emitting device package may be used for a lighting device such as a street lamp, a headlamp, an indicator device, a display board, and the like, but is not limited thereto.
Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.
In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.
101,102,103,104,105,106,107,108,109,109A, 101A: Light emitting device package
110: body,
111,113: lead electrode, 130: light emitting element
115,117: Cavity, 120,121,123,120A, 120B, 120C, 120D,: Resin overflow prevention groove
201: bottom cover, 215: substrate, 203: reflection sheet, 205: light guide plate, 207: optical sheet, 209: display panel
Claims (19)
At least one lead electrode disposed in the cavity;
A light emitting element disposed in the cavity and electrically connected to the lead electrode;
A first resin formed in the cavity;
A recess formed on the side of the cavity; And
At least a portion of the upper periphery of the cavity of the body includes a resin overflow prevention groove stepped from the upper surface of the body,
The resin overflow preventing groove is formed to a depth of 1/5 or less of the cavity depth from the upper surface of the body, extends from the side wall of the cavity is composed of two or less surfaces,
The light emitting device package in which the first resin is formed in the recess.
At least one lead electrode disposed in the cavity;
A light emitting element disposed in the cavity and electrically connected to the lead electrode;
A first resin formed in the cavity;
A recess formed on the side of the cavity; And
At least a portion of the upper periphery of the cavity of the body includes a resin overflow prevention groove stepped from the upper surface of the body, the resin overflow prevention groove extending from the side wall of the cavity is composed of two or less surfaces,
The resin overflow preventing groove is formed longer than the width of at least one side of the cavity,
The light emitting device package in which the first resin is formed in the recess.
At least one lead electrode disposed in the cavity;
A light emitting element disposed in the cavity and electrically connected to the lead electrode;
A first resin formed in the cavity;
A recess formed on the side of the cavity; And
At least a portion of the upper periphery of the cavity of the body includes a resin overflow prevention groove stepped from the upper surface of the body,
The resin overflow preventing groove is formed to a depth of 1/5 or less of the thickness of the body from the upper surface of the body, extending from the side wall of the cavity is composed of two or less surfaces,
The light emitting device package in which the first resin is formed in the recess.
The first resin material comprises a transparent resin layer, the second resin material light emitting device package comprising a transparent resin layer containing a phosphor.
A substrate on which the light emitting device packages are arranged; And
A light guide plate corresponding to the light emitting device package on at least one side;
An interval between at least one side of the light guide plate and the light emitting device package is less than 1mm, and at least one side of the light guide plate includes a receiving groove into which the upper portion of the body of the light emitting device package is inserted.
And a lower surface of the lead electrode on which the light emitting element is mounted is a lower surface of the light emitting element package.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100028840A KR101091270B1 (en) | 2010-03-30 | 2010-03-30 | Light emitting package and light emitting apparatus having the same |
US13/075,527 US8525213B2 (en) | 2010-03-30 | 2011-03-30 | Light emitting device having multiple cavities and light unit having the same |
US13/971,156 US9159884B2 (en) | 2010-03-30 | 2013-08-20 | Light emitting device having cavity side surfaces with recesses |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100028840A KR101091270B1 (en) | 2010-03-30 | 2010-03-30 | Light emitting package and light emitting apparatus having the same |
Publications (2)
Publication Number | Publication Date |
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KR20110109221A KR20110109221A (en) | 2011-10-06 |
KR101091270B1 true KR101091270B1 (en) | 2011-12-07 |
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Family Applications (1)
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KR20100028840A KR101091270B1 (en) | 2010-03-30 | 2010-03-30 | Light emitting package and light emitting apparatus having the same |
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Cited By (1)
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KR20160055417A (en) * | 2014-11-10 | 2016-05-18 | 엘지이노텍 주식회사 | Light emitting device pachage and lighting system having the same |
Families Citing this family (6)
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KR101301990B1 (en) * | 2012-08-28 | 2013-08-30 | 공명국 | High reliable and high power led pacage with plastic wall and the production method |
KR101433261B1 (en) * | 2013-01-15 | 2014-08-27 | 루미마이크로 주식회사 | Light Emitting Device |
US9608177B2 (en) | 2013-08-27 | 2017-03-28 | Lumens Co., Ltd. | Light emitting device package and backlight unit having the same |
DE102017101267B4 (en) * | 2017-01-24 | 2023-11-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic component and method for producing an optoelectronic component |
KR102472710B1 (en) * | 2018-06-05 | 2022-11-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Semiconductor device package |
KR102131365B1 (en) * | 2019-02-22 | 2020-07-08 | 엘지이노텍 주식회사 | Light emitting device and lighting system having the same |
-
2010
- 2010-03-30 KR KR20100028840A patent/KR101091270B1/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160055417A (en) * | 2014-11-10 | 2016-05-18 | 엘지이노텍 주식회사 | Light emitting device pachage and lighting system having the same |
KR102224242B1 (en) * | 2014-11-10 | 2021-03-08 | 엘지이노텍 주식회사 | Light emitting device pachage and lighting system having the same |
Also Published As
Publication number | Publication date |
---|---|
KR20110109221A (en) | 2011-10-06 |
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