JP2016145080A - Carrier tape and packaging body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape facilitating taking out an LED.SOLUTION: A carrier tape for storing an LED includes a sheet formed with a recessed embossment part capable of storing the LED. The embossment part is formed in a plan view in a shape of storing the LED provided with a light emission part having light transmissive resin in the lateral face. The embossment part is formed with a projection facing the light emission part of the LED in one surface of an inner wall forming a recessed shape, are formed with dents separated from the LED when storing the LED on both sides of the projection, and in which the width of the projection in a plan view is formed with narrower than that of the light emission part of the LED.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a carrier tape for housing an LED and a packaging body in which an LED is packaged on a carrier tape.

  Electronic components such as LEDs (Light Emitting Diodes) are stored and transported in an embossed portion (concave portion) of an embossed carrier tape (hereinafter also referred to as “carrier tape”). Various sizes and shapes of the embossed portion are known depending on the size and shape of the electronic component to be accommodated (see Patent Documents 1 and 2). When the LED is a light emitting device, when it is mounted on a secondary board, the light emitting part (light emitting surface) faces upward (upside light emitting LED) and the side faces (side light emitting LED). In addition, the side-emitting LED is accommodated so that the light-emitting portion faces in the lateral direction even when accommodated in the embossed portion.

JP-A-2-10256 Japanese Patent Laid-Open No. 10-120075

  The light emitting part of the LED is mainly composed of a translucent resin, and a suitable material is selected in consideration of optical characteristics such as light extraction efficiency from the light emitting element embedded therein. Therefore, a resin having a lower hardness than the LED base (package) may be used. A side-emitting LED using such a low-hardness resin may be difficult to remove from the embossed portion.

  In order to solve the above problems, a carrier tape according to an embodiment of the present invention is a carrier tape for housing an LED, and includes a sheet on which a concave embossed portion capable of housing an LED is formed, The embossed portion is configured in a shape to accommodate the LED having a light emitting portion having a translucent resin on its side surface in plan view, and the embossed portion emits light from the LED on one surface of the inner wall forming a concave shape. A recess that is spaced apart from the LED when the LED is accommodated on both sides of the convex portion, and the width of the convex portion in plan view is that of the light emitting portion of the LED. It is formed narrower than the width.

  Moreover, the carrier tape which concerns on other embodiment is a carrier tape provided with the concave embossed part which can accommodate LED provided with the light emission part which has translucent resin in the side surface, Comprising: The inner wall of an embossed part is LED A convex portion is provided in a region facing the light emitting portion, and the width of the convex portion is smaller than the width of the light emitting portion.

  Thus, the carrier tape can be easily taken out of the LED.

FIG. 1 is a schematic top view illustrating a carrier tape according to an embodiment of the invention and a packaging body in which LEDs are accommodated in a part of the embossed portions. FIG. 2A is a schematic perspective view illustrating a carrier tape according to an embodiment of the invention and a packaging body in which LEDs are accommodated in a part of the embossed portions. FIG. 2B is a schematic enlarged view in which a part of FIG. 2A is enlarged. FIG. 3A is a schematic top view illustrating a state in which the LED is accommodated in the embossed portion of the carrier tape according to the embodiment of the invention. FIG. 3B is a schematic top view illustrating a state in which the LED is accommodated in the embossed portion of the carrier tape according to the embodiment of the invention. FIG. 3C is a schematic top view illustrating a state in which the LEDs are housed in the embossed portion of the carrier tape according to the embodiment of the invention. FIG. 4 is a schematic cross-sectional view illustrating a state in which the LED is accommodated in the embossed portion of the carrier tape according to the embodiment of the invention. FIG. 5 is a schematic cross-sectional view illustrating a state in which LEDs are accommodated in the embossed portions of the carrier tape according to the embodiment of the invention. FIG. 6 is a schematic perspective view illustrating an LED housed in the embossed portion of the carrier tape according to the embodiment of the invention. FIG. 7 is a schematic perspective view illustrating an embossed portion of the carrier tape according to the embodiment of the invention and an LED accommodated therein.

  A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the carrier tape and the package for embodying the technical idea of the present invention, and the present invention does not limit the carrier tape and the package to the following.

  Further, the present specification by no means specifies the member shown in the claims as the member of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the extent that there is no specific description. It is just an example. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

  In this specification, the name about each surface of LED of the side light emission type accommodated in a carrier tape may be called as follows. Since the LED has a plurality of side surfaces, for convenience of explanation, the side surface having the light emitting part is “front surface”, the side surface facing the front surface is “rear surface”, and the two side surfaces between the front surface and the rear surface Is the “lateral surface”. Moreover, when it accommodates in an embossed part, the surface which opposes the bottom face of the embossed part is made into a "lower surface", and the surface which opposes the lower surface is made into an "upper surface."

  In the present embodiment, the carrier tape is a long tape having a plurality of embossed portions (portions processed into concave shapes). The embossed portion can accommodate a side light emitting type (side view type) LED having a light emitting surface (light emitting portion) on the front surface which is one of the side surfaces. The width of the front surface and the back surface of the LED is larger than the width of the horizontal surface, and the LED has a horizontally long shape when viewed from the top and front (front view). The front and back surfaces of the LED are accommodated so as to face the inner wall on the long side of the embossed portion, and the two lateral surfaces of the LED face the inner wall on the short side of the embossed portion. The two opposing long sides of the embossed portion are formed substantially in parallel, and similarly, the opposing short sides are also formed substantially parallel. Each surface may be a single flat surface, or may have a step, an inclined surface, or the like.

  As will be described later, the LED mainly includes a package, a semiconductor light emitting element (hereinafter, “light emitting element”) mounted on the package, and a translucent resin that covers the light emitting element.

  The LED package includes a recess opening on the side surface (front surface). A light emitting element is placed in the recess and filled with a translucent resin. The opening part of this recessed part becomes a light emission part. The translucent resin filled in the recess has a height in the vicinity of the center that is lower than the height of the side wall of the recess. That is, on the front surface of the LED, the surface of the translucent resin in the recess is lower than the surface of the package.

  A part of the translucent resin may be formed on the package around the opening of the recess, that is, on the package around the light emitting portion of the front surface of the LED. The translucent resin is supplied in an amount that can be accommodated in the concave portion of the package using, for example, a dispenser. However, the translucent resin may leak around the concave portion depending on the conditions through a curing process or the like. Such a translucent resin provided in a portion other than the recess of the package does not constitute a light emitting portion and does not particularly adversely affect the optical characteristics.

  However, on the front surface of the LED, the translucent resin provided outside the recess, that is, on the package, has a surface that is higher than the translucent resin surface of the light emitting unit in the recess (projects more forwardly). Will be formed. Therefore, translucent resin formed other than this recessed part becomes easy to catch with the inner wall of the embossed part of a carrier tape. In this embodiment, a convex part is provided on the inner wall of a part of the inner wall of the embossed part, specifically, the area facing the light emitting part (opening part of the concave part) of the front surface of the LED, so that it is outside the concave part of the package. The area where the formed translucent resin and the carrier tape are in contact with each other can be reduced or eliminated. Thereby, it can reduce that LED sticks to an embossed part.

  Providing a convex part in a part of the inner wall of the embossed part, in other words, providing a recess in a part of the inner wall of the embossed part. That is, in the inner wall of the embossed portion facing the front surface of the LED, a recess is provided in a region facing the package around the light emitting portion. Thereby, it is possible to make it difficult to contact the translucent resin provided other than the light emitting portion of the LED and the inner wall of the embossed portion.

  The recess is formed so as to be separated from the LED when the LED is accommodated in the embossed portion. On the other hand, the convex portion may be configured to come into contact with the light emitting portion of the LED when the LED is accommodated. The depressions are preferably formed on both sides of the convex portion in plan view. Furthermore, one surface of the inner wall of the embossed part in which dents are formed on both sides of the convex part may be formed in a step shape with the convex part and the dent.

  Thus, it becomes possible to suppress LED sticking by disposing the convex portion in the region facing the light emitting portion of the LED in the inner wall of the embossed portion. This is suitable as a carrier tape that accommodates an LED provided with a translucent resin filled in a recess so that the surface of the recess is lower (drawable) than the package. And the package which accommodated LED in such a carrier tape can take out LED easily, for example, can make it difficult to take out mistake in the mounting process to a secondary substrate.

  Hereinafter, each member will be described in detail.

(Carrier tape)
The carrier tape is a long tape in which a plurality of embossed portions are arranged at a predetermined interval (pitch). Although the width depends on the size of the LED to be accommodated, a width of about 8 mm to about 24 mm can be used. The length of the carrier tape can be variously selected depending on the reel size and the like. For example, the reel can have a size of φ180 mm, φ330 mm, or the like. Further, when a small amount is transported, it may be cut to a length including one embossed portion.

  The embossed portion is provided with openings on the surface side (upper surface side) of the carrier tape, and a plurality of embossed portions are formed at regular intervals in the carrier tape feeding direction (long direction). This space | interval is arbitrarily selected by the magnitude | size etc. of LED. The embossed portion is formed at a position deviated substantially in the center or in the left-right direction in the width direction of the carrier tape. And the through-hole is formed on the line parallel to the line in which an embossed part is formed. This through hole is a feed hole (sprocket hole) for feeding the carrier tape.

  The embossed portion includes a convex portion on a part of its inner wall. The position of the convex portion is a part of the inner wall facing the light emitting portion of the LED to be accommodated, and is particularly formed at a position facing the translucent resin constituting the light emitting portion. The width of the convex portion is preferably smaller than the width of the light emitting portion. Specifically, it is preferably about 15% to 90% of the width of the light emitting portion. More preferably, they are 40% or more and 88% or less, More preferably, they are 50% or more and 86% or less. Since the light emitting portion of the LED is located at the center of the front surface, it is preferable that the convex portion of the embossed portion is also provided so as to be located at the center on the long side of one inner wall. Furthermore, the provision of the convex portions results in the formation of depressions on both sides, and these depressions are preferably provided with the same width. That is, it is preferable that the embossed portion is provided in a line symmetrical shape when viewed from above.

  Here, the “width of the convex portion” refers to the width of the most protruding surface of the convex portions and facing the light emitting portion of the LED (hereinafter also referred to as “the top surface of the convex portion”) ( T1 in FIGS. 3A to 3C). Further, the length of the convex portion (the length of the embossed portion in the short side direction) is defined as the “projection length of the convex portion”. In detail, among the long sides of the embossed part, the distance between the imaginary line connecting the two inner walls (dents) located on both sides of the convex part with a straight line and the top surface of the convex part is indicated (FIGS. 3A to 3). D1 in FIG. 3C).

The width of the convex portion may be constant, or a part thereof may have a different width. In that case, the widest width is the above-described preferable range (about 15% or more and 90% or less, more preferably 40% or more and 88% or less, and further preferably 50% or more and 86% or less) of the width of the light emitting portion. preferable. Moreover, it is preferable that the protrusion length of a convex part is 0.1 mm or more and 0.5 mm or less. The convex portion may be provided continuously from the lower end to the upper end of the inner wall of the embossed portion, or may be provided apart from the upper end or the lower end so as to correspond to the position of the light emitting portion. . Furthermore, you may provide one or two or more several convex parts with respect to one light emission part. In addition, when one LED has two or more light emitting portions, it may have one convex portion for the plurality of light emitting portions, or each light emitting portion has a convex portion. Also good. The top surface of the convex portion is preferably a flat surface (flat surface) when viewed from above. Further, the corner of the top surface of the convex portion is rounded, and the radius of curvature of the roundness is preferably about 0.1 to 0.3 mm in consideration of easiness of embossing, for example. However, the shape is not limited to such a shape, and the entire top surface of the convex portion may be a convex curved surface or a concave curved surface, or may not be an integral top surface such as having a notch (slit) in part. Absent. Further, when the embossed portion is viewed from the side, the angle between the top surface and the bottom surface of the convex portion of the embossed portion may be vertical or inclined. In the case of tilting, it is preferably 90 degrees or more, and for example, it can be 90 degrees or more and about 110 degrees in consideration of the ease of embossing, the ease of taking out the LED, and the like (for example, FIG. 4).
Moreover, the inner wall of the recessed part of a carrier tape can be made into a rough surface. For example, the surface roughness Sa can be about 0.4 μm or more and about 1.5 μm. Such a rough surface can be provided on the entire or part of the inner wall of the recess. For example, it is preferably provided on the top surface of the convex portion.

  In a general carrier tape, the embossed portion is provided with an appropriate clearance. Also in this embodiment, the embossed part provided with the inner wall containing a convex part has clearance between LED accommodated. And it is a premise that the clearance is not too large in order that the inner wall of the embossed part and the LED are less likely to be caught by the width of the convex part being smaller than the width of the light emitting part. The clearance on the long side of the embossed portion, that is, the clearance (C1 in FIG. 3A) between the front or back surface of the LED and the inner wall of the embossed portion is preferably in the range of 0.05 mm to 0.15 mm. By adopting an embossed part with clearance in this range and a convex part, even if the LED moves including rotation in the embossed part, the LED is prevented from being caught on the inner wall of the embossed part. can do. The clearance here does not apply to the depressions provided on both sides of the convex portion of the embossed portion, and refers to the clearance between the top surface of the convex portion and the front surface of the LED.

  Further, the plurality of embossed portions are each formed at a constant interval (pitch). Increasing the protrusion length of the protrusion increases the pitch. Considering work efficiency and the like, the pitch is preferably about 2 mm to 4 mm. As for the protrusion length of the convex part of an embossed part, 0.1 mm-0.5 mm are mentioned as a preferable range as mentioned above, However, in the case of 2 mm pitch, protrusion length is 0.1 mm-0.00. 3 mm is more preferable, and when the pitch is 4 mm, the protrusion length is more preferably 0.3 to 0.5 mm.

  From another viewpoint, it is preferable that the width T1 of the convex portion and the protruding length D1 of the convex portion satisfy the relationship of the following (Formula 1).

  0.04 <D1 / T1 <1.43 (Formula 1)

  For example, FIG. 3A shows a state where the LED 100 is not tilted inside the embossed portion 12, but FIGS. 3B and 3C are states where the LED is tilted (rotated) inside the embossed portion. Is shown. In FIG. 3B, as compared with FIG. 3A, the width T1 of the convex portion is large and the protruding length D1 of the convex portion is small. Even if it is such a convex part, if the range of Formula 1 is satisfy | filled, even if LED rotates in an embossing part, it can make a light emission part hard to be caught in the inner wall (inner wall of a hollow) of an embossing part.

  In FIG. 3C, the width T1 of the convex portion is small and the protruding length D1 of the convex portion is large compared to FIG. 3A. Even if it is such a convex part, if the range of Formula 1 is satisfy | filled, even if LED rotates in an embossing part, it can make a light emission part hard to be caught in the inner wall (inner wall of a hollow) of an embossing part.

  For example, polycarbonate, polystyrene, acrylonitrile-butadiene-styrene resin (ABS resin), polyvinyl chloride resin, polyethylene terephthalate, and polypropylene are used as the carrier tape having the embossed portion as described above. Consists of sheets. This sheet is processed as a carrier tape having an embossed portion by vacuum forming, pressure forming, press forming or the like.

(LED)
An LED is accommodated in the embossed portion of the carrier tape. The LED includes a package, a light emitting element, and a translucent resin as main components.

  The LED package includes an insulating member such as resin, ceramic, and glass epoxy resin, and a conductive member that functions as an electrode. The LED package includes a recess that can accommodate a light emitting element. The light emitting part. Yes. For example, a package having a width of about 1.0 mm to 7.0 mm, a thickness of about 0.2 mm to 10 mm, and a depth of about 0.3 mm to 10 mm can be used. The recess includes an opening on the side surface (front surface) of the package. Light from the light emitting element accommodated in the recess is emitted to the outside from the opening via the translucent resin in the recess.

  The shape of the opening of the concave portion of the package is formed horizontally long on the side surface (front surface) of the package. The width of the recess can be, for example, about 0.2 mm to 6.9 mm. The recess is preferably provided at the center in the lateral direction of the package. The width of the convex portion provided on the inner wall of the embossed portion of the carrier tape is adjusted according to the width of the opening of the concave portion. The side surface (front surface) of the package is not limited to the horizontally long shape, but may be substantially the same in length and width, or may be vertically long. That is, what is necessary is just to be accommodated so that a light emission part (opening part of a recessed part) may oppose the inner wall of an embossing part, when accommodating in the embossing part of a carrier tape.

  The translucent resin constituting the light emitting part of the LED is preferably a resin that easily takes out light from the light emitting element. For example, a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, an acrylic resin An insulating resin composition having a light-transmitting property that can transmit light from the light-emitting element, such as a resin composition, can be given. In addition, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can be used. In such a resin, a colorant, a light diffusing agent, a light reflecting material, various fillers, a wavelength conversion member (fluorescent member), and the like can be contained as desired.

  The translucent resin has a Shore A hardness of 75 or less or a Shore D hardness of 70 or less. Preferably, the Shore A hardness is 70 or less, or the Shore D hardness is 70 or less. Resin having such hardness has high tackiness and is easy to catch on the inner wall of the embossed part. However, by providing a convex part on the inner wall of the embossed part, it is possible to reduce the catching. The Shore A hardness and Shore D hardness are values measured according to ASTM-D-2240 using a general Shore A hardness measuring instrument or Shore D hardness measuring instrument.

(Packaging body)
The package in which the LED is accommodated in the embossed part of the carrier tape and the cover tape is bonded to the opening side of the embossed part is wound as a single packaged body in a state of being wound around a reel provided with a core, for example. Can be transported. Furthermore, when shipped from the factory, the reels are enclosed in a bag with antistatic measures taken.

(Embodiment 1)
FIG. 1 is a top view illustrating a part of a packaging body in which an LED 100 is accommodated in a part of an embossed portion 12 of a carrier tape 10 and a carrier tape 10 according to the first embodiment. 2A is a perspective view, and FIG. 2B is an enlarged view of the embossed portion of FIG. 2A. 3A to 3C are top views of the embossed portion 12 and a state in which the LED 100 is accommodated therein, and the LED 100 includes a partial cross-sectional view so that the internal structure can be seen. 4 shows a cross-sectional view of the AA cross section of FIG. 1, the left side shows a cross section (a cross section passing through the light emitting element) not including the convex portion of the inner wall of the embossed part, and the right side shows the inner wall of the embossed part. It is sectional drawing which shows the cross section containing this convex part. FIG. 5 is a cross-sectional view of the embossed portion 12 and a state in which the LED 100 is accommodated therein, and the LED 100 includes a partial cross-sectional view so that the internal structure can be seen. FIG. 6 is a perspective view of the LED 100.

  In the first embodiment, the carrier tape 10 is made of, for example, a resin sheet mainly composed of polycarbonate having a width of about 8.0 mm and a thickness of about 0.2 mm. Here, as the LED 100, an LED 10 having a width of about 3.00 mm, a thickness of about 0.40 mm, and a depth (a length from a side surface (front surface) provided with a light emitting portion to a back surface) of about 0.85 mm is used. The embossed portion 12 of the carrier tape 10 is formed to be long and thin when viewed from above, and the length (width) of the long side is about 3.15 mm, the length (depth) of the short side is about 1.00 mm, and the depth is About 0.55 mm. The long side of the embossed part corresponds to the width of the LED.

  The LED 100 includes a concave opening on the side surface (front surface) of the package 102. As shown in FIGS. 3 and 5, the width L1 of the concave opening 102d is about 2.2 mm, and the height L2 is about 0.1 mm. 3 mm. The embossed portion 12 has a width of about 3.15 mm, and the convex portion 12b has a width T1 of about 1.35 mm. Here, since the corner of the side surface of the convex portion 12b (surface facing the light emitting portion of the LED) is rounded, the width of the convex portion 12b is closest to the LED (top surface of the convex portion). Is the width T1 of the convex portion.

  The height T2 of the convex portion 12b of the embossed portion 12 is the same as the distance from the upper end to the lower end of the embossed portion 12, that is, the depth of the embossed portion 12, as shown in FIG. In this way, the protrusion may be the same height as the depth of the embossed part, but the present invention is not limited to this, and it is sufficient that the height T2 of the protrusion is larger than the vertical width L2 of the light emitting part 102d.

(Embodiment 2)
FIG. 7 is a diagram illustrating a part of the carrier tape 20 according to the second embodiment and the LED 200 accommodated in the embossed portion 22. The LED 200 has a concave portion 202c formed on the upper side of the side surface, and this portion is a light emitting portion 202d. And the convex part 22b of the inner wall of the embossing part 22 is provided in the upper side according to this light emission part 202d. That is, the convex portion has a height shorter than the depth of the embossed portion 22.

  The carrier tape according to the present invention can be used for a carrier tape for LEDs used in illumination light sources, various indicator light sources, in-vehicle light sources, liquid crystal backlight light sources, and sensor light sources.

DESCRIPTION OF SYMBOLS 1 ... Package which accommodated LED in the carrier tape 10, 20 ... Carrier tape 12, 22 ... Embossed part 12a ... Inner wall 12b, 22b ... Convex part 12c ... Bottom 12d ... Through-hole 14 ... Feed hole 100, 200 ... Light-emitting device 102 ... Package 102a ... Electrode 102b ... Base material 102c, 202c ... Recessed part 102d, 202d ... Opening (light emitting part)
104 ... Translucent resin 106 ... Light emitting element

Claims (11)

A carrier tape for housing the LED,
It has a sheet with a concave embossed part that can accommodate LEDs,
The embossed portion is configured in a shape that accommodates an LED provided with a light emitting portion having a translucent resin on a side surface in a plan view,
The embossed portion forms a convex portion facing the light emitting portion of the LED on one surface of the inner wall forming the concave shape,
When the LED is accommodated on both sides of the convex portion, a recess that is separated from the LED is formed,
A carrier tape in which a width of the convex portion in plan view is narrower than a width of a light emitting portion of the LED.   The carrier tape according to claim 1, wherein the convex portion and depressions formed on both sides of the convex portion are formed in a step shape. A carrier tape having a concave embossed part capable of accommodating an LED having a light emitting part having a translucent resin on its side surface,
The inner wall of the embossed part has a convex part in a region facing the light emitting part of the LED, and the width of the convex part is smaller than the width of the light emitting part.   The carrier tape according to any one of claims 1 to 3, wherein a width of the convex portion is 15% or more and 90% or less of a width of the light emitting portion.   The carrier tape according to any one of claims 1 to 4, wherein a protruding length of the convex portion is not less than 0.1 mm and not more than 0.5 mm. The carrier tape according to any one of claims 1 to 5, wherein the convex portion has a width T1 of the convex portion and a protrusion length D1 of the convex portion satisfying the relationship of the following expression (1).
0.04 <D1 / T1 <1.43 (Formula 1)   The carrier tape according to any one of claims 1 to 6, wherein the convex portion is configured to come into contact with a light emitting portion of the LED when the LED is accommodated.   The carrier tape according to any one of claims 1 to 7, wherein the convex portion has a height reaching from the upper end to the lower end of the embossed portion.   The package body in which LED was accommodated in the embossed part of the carrier tape as described in any one of Claims 1 thru | or 8.   The packaging body according to claim 9, wherein the LED has a translucent resin containing silicone.   The package according to claim 9 or 10, wherein the translucent resin has a Shore A hardness of 75 or less, or a Shore D hardness of 70 or less.

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