JP2016034845A - Packing method of optical waveguide and packing body of the optical waveguide - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packing method of an optical waveguide which suppresses occurrence of breakage of the optical waveguide and can transport while maintaining performance of the optical waveguide.SOLUTION: A packing method is for an optical waveguide 20 including one or more core patterns 21 and a clad layer 22 for embedding the core patterns 21. The optical waveguide 20 has an approximate columnar shape including a first main surface 35 and a second main surface 36 approximately opposite in a Z direction and side surfaces which connect the first main surface 35 and the second main surface 36 in an approximately vertical direction. The optical waveguide 20 includes a side surface light input/output part 23 which is formed on at least a part of the side surface, and makes light enter to the core pattern 21 and light that transmits through the core pattern 21 emits. The packing method includes a process of packing the optical waveguide 20 so that the side surface light input/output part 23 does not contact with a packing member 40 for packing them.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical waveguide packaging method and an optical waveguide packaging body.

  With the increase in information capacity, development of optical interconnection technology that uses optical signals not only for communication fields such as trunk lines and access systems, but also for information processing in routers and servers, and for personal computers and mobile phones in consumer devices Yes. As an optical transmission line, it is desirable to use an optical waveguide that has a higher degree of freedom of wiring and can be densified than an optical fiber, and in particular, an optical waveguide that uses a polymer material excellent in processability and economy. Promising.

As an optical waveguide, an optical waveguide in which a lower clad layer is hardened on a substrate, a core pattern is formed on the lower clad layer, and an upper clad layer is laminated on the lower clad and the core pattern is proposed. (For example, refer to Patent Document 1).
When a plurality of such optical waveguides are arranged in a sheet shape, after forming the optical waveguide, by laser processing, cutting processing using a dicing saw and a router, shearing processing using a blade mold and a die, etc. It is necessary to cut the optical waveguide into pieces. The separated optical waveguide is packed in a packing member and conveyed to a consumer.

JP 2006-011210 A

However, when the optical waveguide is being transported, the optical waveguide may be in contact with the packing member that packs the optical waveguide. If the optical waveguide is in contact, the optical waveguide will be damaged. There was a problem. If the damaged part is the optical input / output part provided in the optical waveguide, the optical waveguide performance will be degraded, such as the decrease in photoconductivity and the accuracy of acceptance inspection after opening. There was a problem.
Therefore, an object of the present invention is to provide an optical waveguide packaging method and an optical waveguide packaging body that can be transported while suppressing the occurrence of damage to the optical waveguide and maintaining the performance of the optical waveguide.

As a result of intensive studies, the present inventors have found that the above-described problems can be solved by adopting the configuration shown below, and have completed the present invention. That is, the present invention is as follows.
[1] A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
The optical waveguide has a side-surface light input / output unit that makes light incident on the core pattern at least part of the side surface, or emits light that has passed through the core pattern,
A method for packing an optical waveguide, comprising a step of packing the side light input / output unit in a non-contact manner on a packing member for packing the optical waveguide.
[2] A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
At least a part of the side surface can be used as an alignment reference surface with an external housing,
An optical waveguide packaging method in which the alignment reference surface is packaged in a non-contact manner on the packaging member.
[3] A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
A side light input / output unit that emits light to the core pattern or emits light transmitted through the core pattern on at least a part of a side surface of the optical waveguide;
A method for packing an optical waveguide, comprising: a step of packing the side-surface light input / output portion with a detachable coating agent and packing the optical waveguide in a packing member for packing the optical waveguide.
[4] A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
At least a part of the side surface can be used as an alignment reference surface with an external housing,
A method for packing an optical waveguide, wherein the alignment reference surface is sealed with a peelable coating agent and packed in a packing member for packing the optical waveguide.
[5] The method for packing an optical waveguide according to any one of [1] to [4], wherein the optical waveguide is included in a space surrounded by a packing portion that prevents entry of foreign substances from the outside.
[6] The optical waveguide is fixed to the packaging member at any one of the first main surface and / or the second main surface and / or the side surface other than the side surface having the side light input / output unit, and then packed. The method for packing an optical waveguide according to any one of [1] to [5].
[7] The optical waveguide packaging method according to [2] or [4], wherein the optical waveguide is fixed and packaged on a side surface other than the alignment reference surface.
[8] The optical waveguide according to any one of [1] to [7], wherein the optical waveguide is a polymer optical waveguide, and the side surface light input / output unit is an optical waveguide formed by physical cutting. Packaging method of optical waveguide.
[9] The optical waveguide packaging according to [2] or [4], wherein the optical waveguide is a polymer optical waveguide, and the alignment reference surface is an optical waveguide formed by physical cutting. Method.
[10] The optical waveguide includes a main surface light input / output unit that allows light to enter the first main surface or the second main surface, or emits light that has passed through the core pattern. [1] The packaging method of the optical waveguide in any one of-[9].
[11] The optical waveguide packaging method according to any one of [1] to [10], wherein a plurality of the optical waveguides are packaged.
[12] The method of packing an optical waveguide according to [11], wherein the plurality of optical waveguides are arranged in parallel at an arbitrary pitch distance on a substantially straight line in the X direction or the Y direction.
[13] An optical waveguide packaged by the optical waveguide packaging method according to any one of [1] to [12].

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the damage of an optical waveguide can be suppressed, the optical waveguide packaging method and the optical waveguide packaging body which can be conveyed while maintaining the performance of an optical waveguide can be provided.

It is a figure for demonstrating the packing method of the optical waveguide in one Embodiment of this invention. It is a figure for demonstrating the optical waveguide in one Embodiment of this invention. It is FIG. (1) for demonstrating the packaging method of the optical waveguide in other embodiment of this invention. It is FIG. (2) for demonstrating the packaging method of the optical waveguide in other embodiment of this invention. It is FIG. (3) for demonstrating the packaging method of the optical waveguide in other embodiment of this invention. It is FIG. (4) for demonstrating the packaging method of the optical waveguide in other embodiment of this invention. It is FIG. (5) for demonstrating the packaging method of the optical waveguide in other embodiment of this invention.

[Packaging method of optical waveguide]
An optical waveguide packaging method according to an embodiment of the present invention is a packaging method of an optical waveguide 20 in which one or more core patterns 21 are embedded in a clad layer, as shown in FIGS. . When packing the optical waveguide 20 in the packing member 40, the alignment reference plane with the side light input / output unit 23 of the optical waveguide 20 and / or the housing outside the optical waveguide is not in contact with the packing member 40. So that it will be packed.
In this embodiment, “non-contact” means that the side surface on which the side light input / output unit 23 is formed and / or the alignment reference surface formed on the side surface are all the members (packaging members) transported together with the optical waveguide. It means not touching. The optical waveguide may be in contact with the packaging member 40 on a surface (side surface or main surface) other than the side surface on which the side surface light input / output unit 23 is formed. Further, the optical waveguide may be in contact with the packaging member 40 on a surface (side surface or main surface) other than the alignment reference surface with the external housing.
The effect of the present embodiment is particularly effective when the side light input / output unit and / or the alignment reference surface is provided on the side surface, and the side surface is the outer peripheral side surface of the optical waveguide.

  Hereinafter, with reference to FIG. 2, the optical waveguide packed by the optical waveguide packing method of one embodiment of the present invention will be described. FIG. 2 is a perspective view of an optical waveguide according to an embodiment of the present invention.

  As shown in FIG. 2, the optical waveguide 20 has a side surface 31 having a side surface light input / output unit 23 at one end in the X direction at a part of the side surface. In the case of the optical waveguide 20 shown in FIG. The optical waveguide 20 has a first main surface 35 on one side in the Z direction, which is substantially perpendicular to the X direction and the Y direction, and a second main surface 36 on the other side.

The optical waveguide 20 allows light to enter or pass through the core pattern 21 at a plurality of locations selected from the first main surface 35 and the second main surface 36 and the side surfaces 31, 32, 33, 34 substantially perpendicular to them. It is preferable to provide a light input / output unit that emits the emitted light. The first main surface 35 and the second main surface 36, and the side surfaces 31, 32, 33, and 34 substantially perpendicular to the first main surface 35 and the side surfaces 31, 32, 33, and 34 have no adverse effect on light input / output. Any flat surface (or curved surface) may be used. Further, when the surface having the optical input / output unit is a surface of a portion to be fitted to an external housing such as a connector, it may be a flat surface (or curved surface) as long as the fitting is not adversely affected. Furthermore, the surface having the light input / output unit may be inclined or curved as long as measurement is possible at the time of inspection.
The optical waveguide 20 shown in FIG. 2 has a rectangular parallelepiped shape, and two opposing side surfaces are parallel to each other, but may be a curved or notched side surface as appropriate.

The optical waveguide 20 includes one or more core patterns 21 and a clad layer 22 in which the core patterns 21 are embedded.
The core pattern 21 is made of a transparent resin having a refractive index higher than that of the cladding layer 22, and the optical signal propagates through the core pattern 21. The thickness of the core pattern 21 in the Z direction is not particularly limited, but is usually 10 μm or more and 100 μm or less.
The clad layer 22 is made of a resin having a refractive index lower than that of the core pattern 21. As a result, light incident on the interface between the core pattern 21 and the cladding layer 22 is reflected, and leakage of the optical signal from the core pattern 21 can be suppressed.

On the side surface 31 having the first side surface light input / output portion of the optical waveguide 20, the end surface of the core pattern 21 is exposed, and the exposed portion of the core pattern 21 becomes the side surface light input / output portion 23 of the optical waveguide 20. Further, a mirror 24 is provided on the core pattern 21 in the vicinity of the side surface 32 facing the first side surface of the optical waveguide 20. The light input / output unit that makes light incident on the mirror 24 or emits the light reflected by the mirror 24 becomes the main surface light input / output unit 25 provided on the first main surface 35 of the optical waveguide 20.
The optical waveguide 20 includes mirrors 24 at two positions on the optical axis of the core pattern 21, and enters the first main surface 35 and outputs light from the first main surface 35. It may be. The optical waveguide 20 may include a side surface having the second side surface light input / output unit in addition to the side surface 31. That is, the optical waveguide 20 only needs to have one or more side surface light input / output units and / or side surface alignment reference surfaces.

  When the side light input / output part and the side alignment reference surface in the optical waveguide 20 come into contact with a packaging member or the like during conveyance, damage or adhesion of foreign matter is likely to occur. The side surface has a small area with respect to the main surface, and is difficult to inspect from the normal direction of the main surface. For this reason, it is important to pack the side light input / output unit and the side alignment reference surface in a non-contact manner to reduce the possibility of breakage or adhesion of foreign matter.

  The optical waveguide 20 packed by the optical waveguide packing method according to the embodiment of the present invention is a polymer optical waveguide using a polymer material, and includes a side surface 31 having a side light input / output unit 23 and / or an external housing. It is preferable that the side surface 33 and / or the side surface 34 serving as a reference surface for the alignment is an optical waveguide formed by physical cutting. Here, physical cutting refers to laser processing, cutting using a dicing saw and a router, shearing using a blade and a die, and the like.

Conventionally, when an optical waveguide that is low in profile and easily charged, such as a polymer optical waveguide, is packaged, there has been a problem that handling is likely to deteriorate due to static electricity. However, the packaging method of the optical waveguide according to an embodiment of the present invention can be handled well when packaging the polymer optical waveguide, and is therefore an effective packaging method for the polymer optical waveguide.
When a polymer optical waveguide is formed by physical cutting, the interface with the cladding layer and core pattern, the interface between the cladding layers, etc. are exposed on the side surface of the optical waveguide, and it tends to break more easily than the main surface. is there. Therefore, it is more important that the side surface (side light input / output unit and / or the alignment reference surface of the side surface) essential to the characteristics of the optical waveguide in this embodiment is not contacted.
Further, when the polymer optical waveguide is formed by a physical cutting process, when the cut surface is a side surface, the surface is often rougher than when the cut surface is a main surface. Since the polymer optical waveguide easily generates static electricity as described above, foreign matter tends to adhere to the cut surface and the like, and the foreign matter tends to be difficult to remove. Therefore, it is more important that the side surfaces (side light input / output and side surface alignment reference surface) that are important for the characteristics in this embodiment are not contacted.
From the above, when all of the optical waveguide and the members attached to the optical waveguide (for example, the substrate that forms the foundation of the optical waveguide) are made of polymer resin, the side surfaces that are important for the characteristics of the optical waveguide are packed in a non-contact manner. Is even more important.

  Hereinafter, with reference to FIG.1 and FIG.3, the packaging member used for the packaging method of the optical waveguide of one Embodiment of this invention is demonstrated.

The packaging member 40 includes a placement portion 41 on which the optical waveguide 20 is placed, and a non-contact portion 42 provided so that the side light input / output portion 23 of the optical waveguide 20 is not in contact with the packaging member 40. The non-contact part 42 is a part where the side light input / output part 23 and / or the side alignment reference surfaces 33 and 34 provided in the optical waveguide 20 are not in contact with the packaging member 40.
As described in the first embodiment, the packaging member is formed on the first main surface 35 and the second main surface 36 so as not to touch the side light input / output unit 23 and / or the side alignment reference surfaces 33 and 34. Is preferably arranged. Further, as described in the second embodiment, a space is provided in the packing member, and the side surface light input / output unit 23 and / or the side surface alignment reference surfaces 33 and 34 may be disposed in the space. preferable. When packaged as described in the first embodiment, the optical waveguide 20 can be bonded or sandwiched by the first main surface 35 and / or the second main surface 36, thereby reducing warpage during conveyance of the optical waveguide 20. . In the case of packing as described in the second embodiment, for example, when the first main surface 35 or the second main surface 36 is used as the alignment reference surface, it can be arranged in the space, which is more preferable.
When the first main surface 35 and / or the second main surface 36 has a light input / output portion as in the second embodiment, it is more preferable that the main surface light input / output portion 25 is also non-contact. .

  Examples of the material of the packaging member 40 include polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyolefin (PO), polycarbonate (PC), polyimide, acrylic, urethane acrylate, oligoester acrylate, epoxy acrylate, silicon acrylate, Examples include acrylic acrylate and polyester acrylate.

The mounting portion 41 is placed so as to be in contact with the first main surface 35 or the second main surface 36 and mounts the optical waveguide 20.
As a method for placing the optical waveguide 20 on the placement portion 41, a method of pressing the optical waveguide 20 against the placement portion 41 may be used. Further, as another method for mounting the optical waveguide 20 on the mounting portion 41, there is a method of bonding the mounting portion 41 and the optical waveguide 20 together. The method of mounting the optical waveguide 20 on the mounting portion 41 is not limited to these, and other methods may be adopted as long as the optical waveguide 20 can be fixed on the mounting portion 41.

  As a method for placing the optical waveguide 20 on the placement portion 41, when a method of pressing the optical waveguide 20 against the placement portion 41 is adopted, as shown in FIG. It is preferable to use a packing lid portion 43 having 44. As shown in FIG. 3B, the packing lid portion 43 is disposed so as to press the optical waveguide 20 against the placement portion 41 by the pressing portion 44. At this time, the packing lid 43 is disposed so as to seal the opening that is the introduction port of the optical waveguide 20 of the packing member 40. If the packaging lid portion 43 has a shape that can seal the opening of the packaging member 40, the optical waveguide 20 is preferably contained in a space surrounded by the packaging lid portion 43 that prevents entry of foreign substances from the outside.

The pressing portion 44 preferably has elasticity from the viewpoint of preventing damage to the optical waveguide 20. From the above viewpoint, the elastic modulus of the pressing portion 44 is preferably in the range of 500 MPa to 20 GPa, more preferably in the range of 1 GPa to 15 GPa, and further preferably in the range of 1 GPa to 10 GPa. .
Further, the pressure pressed by the pressing unit 44 is such that the side light input / output unit and the side alignment reference surface do not physically contact the packing member as shown in FIG. 5 and / or the packing member structure. Then, it is not necessary to apply pressure only by holding the space in which the optical waveguide is stored. However, particularly when only the first main surface and the second main surface are held, from the viewpoint of further suppressing the movement of the optical waveguide during conveyance and from the viewpoint of suppressing deformation of the optical waveguide due to pressure, 0.1 N It is preferable to hold the optical waveguide at 5N or less, more preferably 0.5N or more and 5N or less, and further preferably 0.5 or more and 2N or less.

  As a method of mounting the optical waveguide 20 on the mounting portion 41, when a method of bonding the mounting portion 41 and the optical waveguide 20 is adopted, as shown in FIG. It is preferable to use a peelable adhesive layer 50 between the optical waveguide 20 and the optical waveguide 20. The adhesive layer 50 may be provided with either the optical waveguide 20 or the placement portion 41, and may be separately applied when neither the optical waveguide 20 nor the placement portion 41 is provided.

  The adhesive strength of the adhesive layer 50 is such that the peel strength is 0.01 N / cm or more and 10 N / cm or less from the viewpoint that it can be easily peeled when opened without being peeled during packaging and transportation. The range is preferably 0.01 N / cm or more and 5 N / cm or less, and more preferably 0.01 N / cm or more and 1 N / cm or less.

As shown in FIG. 4B, the opening of the packaging member 40 is preferably covered with a packaging lid portion 45 such as a film that can be sealed, and the optical waveguide 20 is preferably included in the packaging member 40. By covering the opening of the packing member 40 with the packing lid 45, the optical waveguide 20 can be enclosed in a space surrounded by the packing lid 43 that prevents entry of foreign matter from the outside. Adherence of foreign matters and damage to the optical waveguide 20 can be reduced.
Examples of the material of the packing lid 45 include polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyolefin (PO), polycarbonate (PC), polyimide, acrylic, urethane acrylate, oligoester acrylate, epoxy acrylate, and silicon acrylate. , Acrylic acrylate, polyester acrylate and the like.

  The non-contact part 42 is a space such as a groove provided in the packaging member 40 as shown in FIGS. 1, 3, and 4, for example. Various shapes can be adopted for the non-contact portion 42 as long as the side light input / output portion 23 of the optical waveguide 20 can be brought into non-contact with the packaging member 40. Further, the packaging member 40 as shown in FIGS. 1, 3, and 4 is preferable because the side surfaces 32, 33, and 34 serving as alignment reference surfaces can be further brought into non-contact. This space preferably has a depth that takes into account the warp of the optical waveguide 20 and the like. When the first main surface 35 and / or the second main surface 36 of the optical waveguide 20 have a light input / output unit and a partial alignment reference surface, the light input / output unit and the alignment reference surface are also included. More preferably, it is non-contact.

  As an optical waveguide packaging method according to an embodiment of the present invention, at least a part of the side surfaces 33, 34, and 35 is an optical waveguide that can be used as an alignment reference surface of an external housing. 35 alignment reference surfaces are preferably packed in a non-contact manner on the packing member 40. Since the alignment reference surface is packed in a non-contact manner on the packaging member 40, the alignment reference surface can be prevented from being damaged due to contact during transportation, and alignment accuracy can be maintained. The optical waveguide in this case includes not only the optical waveguide having the side surface light input / output unit but also the optical waveguide having the main surface light input / output unit only on the main surface.

As shown in FIG. 5, the optical waveguide packaging method according to an embodiment of the present invention is provided with a concave portion 37 in a part of the side surfaces 33, 34, and a convex portion (non-flat) that can be fitted to the concave portion 37 in the packing member 40. Contact maintaining part) 46. When packaging, the movement of the optical waveguide 20 in the X direction and the Y direction can be restricted by fitting the concave portion 37 and the convex portion 46 described above. For this reason, it can suppress that the side surface light input / output part 23 of the optical waveguide 20 on the right side in FIG. 5 and the side surfaces 32, 33, 34 functioning as the alignment reference surface contact the packaging member 40. By suppressing the non-contact maintaining unit 46 from contacting the side light input / output unit 23 and the alignment reference surfaces 32, 33, 34 with the packaging member 40, the side light input / output unit 23 and the alignment reference surface 32, Breakage of 33 and 34 can be prevented.
The non-contact maintaining unit 46 may have any shape that can restrain the movement of the optical waveguide 20 in the X and Y directions, and may use a side surface other than the side surface light input / output unit and / or the side surface alignment reference surface. As shown in FIG. 5, the non-contact maintaining unit 46 is preferably restrained at two or more side surfaces, and more preferably is restrained at three or more side surfaces.

As shown in FIG. 6, the optical waveguide 20 packed by the optical waveguide packing method according to the embodiment of the present invention includes at least a side light input / output unit 23 on the first end surface 31 or the second end surface 32, and It is preferable that the alignment reference surface on the side surface used for alignment with the external housing is sealed with a peelable coating agent 60. By sealing the side light input / output unit 23 with the coating agent 60, it is possible to suppress the side light input / output unit 23 from coming into contact with the packaging member 40, and to prevent the side light input / output unit 23 from being damaged. it can.
The coating agent 60 is preferably a material that can be removed in a later step, and more preferably a liquid coating agent 60. As the coating agent 60, for example, water, an aqueous solution, alcohols, and other various solvents that can bury the optical waveguide 20 can be used. These coating agents 60 can take out the optical waveguide 20 simply by drying after opening the package. From the above viewpoint, the coating agent 60 needs to be a material that does not adversely affect the performance of the optical waveguide 20.
In addition, even if the optical waveguide 20 is simply suspended in the coating agent 60 as described above, the optical waveguide 20 is vigorously collided with the packing member, and the optical waveguide 20 is damaged or directly adhered to the optical waveguide 20. Can be prevented. Further, as described above, it is preferable to use the optical waveguide 20 together with the packaging member 40 that fixes the optical waveguide 20 because the packaging member 40 can be contacted and adhered with foreign matter.

As shown in FIG. 7, the optical waveguide packaging method according to the embodiment of the present invention is preferably packaged with a plurality of optical waveguides 20A to 20C arranged in parallel in the X direction and / or the Y direction.
The plurality of optical waveguides 20A to 20C may be arranged in parallel in the X direction and / or the Y direction. By arranging in parallel in the X direction and / or the Y direction, the optical waveguides 20A to 20C can be easily picked up after the package is opened.

  The plurality of optical waveguides 20A to 20C may be arranged at an arbitrary pitch on a substantially straight line in a direction parallel to the first main surface and / or the second main surface. In other words, it is preferably arranged in parallel at an arbitrary pitch distance on a substantially straight line in the X direction and / or Y direction, and arranged in a straight line, a grid pattern, a staggered pattern, or the like. The arbitrary pitch-to-pitch distance on the substantially straight line in the X direction or Y direction of the plurality of optical waveguides 20A to 20C is the distance between the centers in the X direction or Y direction of the adjacent optical waveguides 20A to 20C. Thus, after the inspection of one optical waveguide 20 is completed, it becomes possible to inspect the next optical waveguide only by pitch-feeding the aggregate of the optical waveguides in the X direction or the Y direction. Inspection can be carried out efficiently. For the same reason as described above, the optical waveguide can be picked up sequentially only by feeding the pitch. The term “substantially straight” refers to a linear arrangement in a range that does not hinder the inspection and pickup of the optical waveguide.

[Packaging body]
The package of the present invention is an optical waveguide package packaged by the optical waveguide packaging method of the present invention described above.
The package of the present invention is obtained, for example, by packing the optical waveguide 20 in a packing member 40 as shown in FIGS.
The packaging member 40 preferably has a function for preventing the optical waveguide 20 from absorbing moisture. Examples of the packaging member 40 include a plastic bag, an optical waveguide packaging case, and cardboard. The packing member 40 may appropriately include a hygroscopic agent or a humectant.

[Modification]
As described above, the optical waveguide, the assembly of optical waveguides, the package, and the method for manufacturing the optical waveguide according to the embodiment of the present invention described above can be modified as follows, for example.
[Modification 1]
Although the number of the plurality of optical waveguides 20A to 20C in the embodiment of the present invention is 3, it may be 2 or 4 or more. Moreover, although the number of the core patterns 21 contained in one optical waveguide 20A-20C was 3, 1 or 2 may be sufficient and 4 or more may be sufficient.

[Modification 2]
As a method for mounting the optical waveguide 20 on the mounting portion 41, as shown in FIG. 4A, when a peelable adhesive layer 50 is used between the mounting portion 41 and the optical waveguide 20, mounting is performed. Although the adhesive layer 50 may be provided on the entire surface of the placement portion 41, the adhesive layer 50 may be provided on a part of the placement portion 41. The configuration in which the adhesive layer 50 is provided on a part of the mounting portion 41 is preferable because the optical waveguide 20 can be easily peeled after opening.

  The embodiments and modifications described above are merely examples, and the present invention is not limited to these contents as long as the features of the invention are not impaired. Moreover, as long as the characteristic of invention is not impaired, you may combine embodiment described above and a modification, or modifications.

  Hereinafter, the present invention will be described in more detail with reference to examples. In addition, an Example does not limit this invention.

[Example 1]
(Fabrication of optical waveguide assembly)
A polyimide film ("Upilex RN" manufactured by Ube Nitto Kasei Co., Ltd., thickness: 25 μm) is cut into a size of 100 μm × 100 μm as a substrate, and a lower part having a refractive index of 1.536 is formed on the substrate. A clad layer was formed.

  Next, a core layer-forming resin layer (thickness: 45 μm) is laminated on the lower clad layer surface, and exposed and developed to form a core pattern of width 45 μm × height 45 μm and length 9 cm at a pitch of 250 μm. A 12CH array (12CH core pattern for one optical waveguide) was arranged, and five sets of 12CH core patterns were arranged at intervals of 7 mm.

  Next, an upper clad layer was formed so as to cover the main surface and the upper surface of the core pattern from the core pattern forming surface side to obtain an optical waveguide sheet. The thickness of the upper clad layer after formation was 30 μm from the upper surface of the core pattern.

  From the upper clad layer side of the obtained optical waveguide sheet, using a dicing saw ("DAC552" manufactured by DISCO Corporation), the optical waveguide sheet is oriented in a direction perpendicular to the core pattern at a position 1 cm inside each end face of the core pattern. Was cut off. The optical waveguide sheet was cut so as to form an inclined surface of 45 ° at a position 1 cm inside from one end face of one core pattern of the optical waveguide sheet, thereby forming an optical path conversion mirror having an inclined surface of 45 °. An end surface perpendicular to the planar direction of the optical waveguide sheet was formed at a position 1 cm inside from the other end surface. This vertical side surface is a side surface including the side surface light input / output portion of the optical waveguide. The core pattern length used for light propagation was 7 cm.

  Next, a PET film with an adhesive layer (“Panaprotect ET-50k-B” manufactured by Panac Co., Ltd.) was attached as a packaging member A from the substrate (second main surface) side.

  Next, both sides of the 12CH core pattern in the direction in which the 12CH core pattern is arranged are cut with the dicing saw until the packaging member is exposed from the upper clad layer side so that the 12CH core pattern is the center. Two side surfaces perpendicular to the side surface having the optical input / output unit were formed, and an optical waveguide assembly including five optical waveguides each having 12 core patterns was formed. The design value of the distance between the two side surfaces in one optical waveguide was 2.998 mm (allowable value ± 0.002 mm). Of the two side surfaces perpendicular to the side surface having the side light input / output unit, a range of 1 cm on the side light input / output unit side is the alignment reference surface.

(Inspection 1)
The appearance of the obtained optical waveguide aggregate was examined with a metal microscope (magnification 50 times). Since the optical waveguide can be inspected every time the pitch is fed, the inspection can be easily performed.

(packing)
From the assembly side of the obtained optical waveguide, as a packaging member B, as a protective film, a non-treated surface of a PET film (“Cosmo Shine A1517” manufactured by Toyobo Co., Ltd., thickness: 16 μm) encloses the packaging member A. Now, the optical waveguide assembly was covered and bonded together through a part of the packaging member A without the optical waveguide and an adhesive provided on the packaging member A. At this time, neither the packaging member A nor the packaging member B is in contact with the reference surface and the side light input / output unit (side surface having the same), and the optical waveguide is packed in a closed space formed by them. .
Further, each of the optical waveguide assemblies contained in the packing member A and the packing member B is put in an A4 size envelope (packing member C), and the envelope is put in a cardboard (packing member E) together with a cushioning material (packing member D). It was set as a package.

(Transport)
Corrugated cardboard packed with optical waveguides was transported.

(Inspection 2)
When the package of the optical waveguide was opened and the protective film (packaging member B) was peeled off, the optical waveguide was all attached to the holding substrate (packaging member A), and the front and back of the optical waveguide could be easily determined. When the appearance of the optical waveguide was inspected in the same manner as described above, the optical waveguide could be inspected every time the pitch was fed, so that the inspection could be easily performed. There was no adhesion or damage of foreign matter on the side alignment reference surface.

(Implementation)
When the optical waveguides were peeled off from the holding substrate one by one and mounted so that the reference surface of the optical waveguide was brought into contact with an external housing having a 3 mm wide optical waveguide fitting portion, it was possible to achieve good alignment. The transmission of light through the side light input / output unit provided on the side surface was also good. The optical waveguide obtained by peeling was easy to handle with little warpage.

[Example 2]
The optical waveguide obtained in Example 1 is horizontal (X); 56 mm × vertical (Y); 3.1 mm (mounting portion) × depth (Z); 1 mm, horizontal (X); 18 mm × vertical (Y ); 6 mm (non-contact portion) × depth (Z); 5 mm is a recess connected in the X direction (the non-contact portion is 4 mm deeper in the Z direction than the mounting portion, and the alignment reference surface is also in the Y direction) The first main surface is placed on a packaging member (PET resin) having recesses (mounting portion and non-contact portion) that are continuous at a 10 mm pitch in five locations in the Y direction. Place the optical waveguide in the direction that the side light input / output part is in the non-contact part direction, and the distance between the side surface (Y) opposite to the non-contact part of the placement part and the optical waveguide is about 0.5 mm. It placed so that it might become a gap of.

  Next, of the second main surface of the optical waveguide, the optical waveguide is pressed by a packing lid portion (PET resin) having a convex portion that presses a range of 5 to 56 mm from the side surface on the mirror side (pressing force: 0.5 N). The package was made. The gap between the optical waveguide and the Z direction on the non-contact portion side of the packing lid portion was 4 mm. Further, the above package was packed in a sealed container (packing member).

In the obtained package, the side alignment reference surface and the side light input / output unit were not in contact with the packing member and the packing lid. Further, the light input / output unit provided on the second main surface and the first main surface and the second main surface on the side light input / output unit side (10 mm) were also non-contact (Examples 2, 3). 4, of the two side surfaces perpendicular to the side surface having the side light input / output unit, a range of 1 cm on the side light input / output unit side was used as the alignment reference surface).

  After that, when carrying, inspection 2 and mounting were performed in the same manner as in Example 1, after carrying, the packaging was opened and the optical waveguide was inspected. The optical waveguide was a little difficult to handle due to static electricity, and the warpage was somewhat However, since the inspection was performed with the packing lid portion removed (the optical waveguide was mounted on the mounting portion), the inspection was not hindered and the inspection could be performed by pitch feed. In addition, there is no adhesion or damage to the side alignment reference surface, and it can be mounted well. There was no hindrance. The alignment reference surface of the first main surface and the second main surface are not attached to or damaged by foreign matter, and can be mounted satisfactorily. It did not occur and there was no hindrance to light transmission.

[Example 3]
In Example 2, the same method was used except that the space in the non-contact portion and the sealed container were filled with pure water (coating agent).
In the obtained package, the alignment reference surface and the light input / output end surface were not in contact with the packaging member and the packaging lid.

  Thereafter, the sample was transported in the same manner as in Example 1, and after opening and after deionized water was dried by air blow, inspection 2 and mounting were carried out. It was possible to mount it satisfactorily without any foreign matter adhering to or damage to the side light input / output part. The alignment reference surface of the first main surface and the second main surface are not attached to or damaged by foreign matter, and can be mounted satisfactorily. It did not occur and there was no hindrance to light transmission.

[Example 4]
In Example 2, an optical waveguide of 10CH was provided by providing two concave portions of X; 0.1 mm × Y; 0.1 mm on the opposite side at a position 10 mm from the mirror side of the optical waveguide. Moreover, the packaging member which has a mounting part was equipped with two convex parts which fit the said X direction said recessed part in the position of 10.1 mm from the side opposite to a non-contact part. The packaging was carried out in the same manner except that the concave and convex portions were fitted when packaging. Note that a packaging lid material in which a gap of 0.5 mm is formed between the placing portion and the packaging lid material is used, and the optical waveguide is not pressed down on the first and second main surfaces.
In the obtained package, the alignment reference surface and the light input / output end surface were not in contact with the packaging member and the packaging lid.

  After that, when carrying, inspection 2 and mounting were performed in the same manner as in Example 1, after carrying, the packaging was opened and the optical waveguide was inspected. The optical waveguide was a little difficult to handle due to static electricity, and the warpage was somewhat However, since the inspection was performed with the packing lid portion removed (the optical waveguide was mounted on the mounting portion), the inspection was not hindered and the inspection could be performed by pitch feed. There is no adhesion or damage on the side alignment reference surface, and it can be mounted well, and there is no adhesion or damage on the side light input / output part, so there is no problem with light transmission. There wasn't. The alignment reference surface of the first main surface and the second main surface are not attached to or damaged by foreign matter, and can be mounted satisfactorily. It did not occur and there was no hindrance to light transmission.

[Comparative Example 1]
(Production and evaluation of optical waveguide)
In Example 1, after the assembly of optical waveguides was singulated, the obtained five optical waveguides were SUS304 cases (5) having a space of width 3.2 mm, length 7.2 mm, and height 1 mm. Then, each of the five optical waveguides obtained in the above space was packed, packed in a cushioning material and cardboard in the same manner as described above, and transported.

After the transport, the package was opened and the optical waveguide was inspected. As a result, the optical waveguide was difficult to handle due to static electricity.
Furthermore, there is an optical waveguide in which the reference surface and the light input / output surface are damaged, and the optical waveguide in which the burrs are generated due to the damage cannot be mounted on the external casing as in the first embodiment.
An optical waveguide with scratches on the light input / output surface could not perform light input / output well.

[result]
By comparing the above Examples 1 to 4 and Comparative Example 1, it can be seen that according to the present invention, the optical waveguide can be inspected efficiently.

20 Optical waveguide 21 Core pattern 22 Cladding layer 23 Side light input / output unit 24 Mirror 25 Main surface light input / output unit 31, 32, 33, 34 Side surface 35 First main surface 36 Second main surface 37 Recess 40 Packaging member 41 Placement part 42 Non-contact part 43, 45 Packing lid part 44 Press part 46 Convex part (non-contact maintenance part)
50 Adhesive layer 60 Coating agent

Claims (13)

A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
The optical waveguide has a side-surface light input / output unit that makes light incident on the core pattern at least part of the side surface, or emits light that has passed through the core pattern,
A method for packing an optical waveguide, comprising a step of packing the side light input / output unit in a non-contact manner on a packing member for packing the optical waveguide. A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
At least a part of the side surface can be used as an alignment reference surface with an external housing,
An optical waveguide packaging method in which the alignment reference surface is packaged in a non-contact manner on the packaging member. A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
A side light input / output unit that emits light to the core pattern or emits light transmitted through the core pattern on at least a part of a side surface of the optical waveguide;
A method for packing an optical waveguide, comprising: a step of packing the side-surface light input / output portion with a detachable coating agent and packing the optical waveguide in a packing member for packing the optical waveguide. A method of packing an optical waveguide having one or more core patterns and a cladding layer in which the core patterns are embedded,
The optical waveguide has a substantially columnar shape having a first main surface and a second main surface that are substantially opposed to each other in the Z direction, and a side surface that connects the first main surface and the second main surface in a substantially vertical direction. Yes,
At least a part of the side surface can be used as an alignment reference surface with an external housing,
A method for packing an optical waveguide, wherein the alignment reference surface is sealed with a peelable coating agent and packed in a packing member for packing the optical waveguide.   The optical waveguide packaging method according to any one of claims 1 to 4, wherein the optical waveguide is contained in a space surrounded by a packaging portion that prevents entry of foreign substances from the outside.   The optical waveguide is fixed and packed with the packing member at any one of the first main surface and / or the second main surface and / or the side surface other than the side surface having the side light input / output unit. Item 6. The optical waveguide packaging method according to any one of Items 1 to 5.   The optical waveguide packaging method according to claim 2 or 4, wherein the optical waveguide is fixed and packaged on a side surface other than the alignment reference surface.   The optical waveguide according to any one of claims 1 to 7, wherein the optical waveguide is a polymer optical waveguide, and the side-surface light input / output unit is an optical waveguide formed by physical cutting. Packing method.   The optical waveguide packaging method according to claim 2, wherein the optical waveguide is a polymer optical waveguide, and the alignment reference surface is an optical waveguide formed by physical cutting.   The optical waveguide includes a main surface light input / output unit that makes light incident on the first main surface or the second main surface or emits light that has passed through the core pattern. The optical waveguide packaging method according to any one of the preceding claims.   The optical waveguide packaging method according to claim 1, wherein a plurality of the optical waveguides are packaged.   The optical waveguide packaging method according to claim 11, wherein the plurality of optical waveguides are arranged in parallel at a distance between the arbitrary pitches on a substantially straight line in the X direction or the Y direction.   An optical waveguide packaged by the optical waveguide packaging method according to claim 1.

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