TWI630429B - Optical wiring component, method of producing optical wiring component and electronic device - Google Patents

Abstract

The optical wiring component (10) of the present invention is characterized in that it has a sheet-shaped optical waveguide (1) and is provided with a surface 103 (first main surface) and an upper surface 104 (second main surface) which are in a front-to-back relationship. a front surface (102) (light incident surface) formed by a portion connecting the lower surface (103) and the outer surface (104); the optical connector (5) is provided to be opposed to each other. The connector body (51) and the through-facing surface of the opposing surface (52) (first outer surface) and the non-opposing surface (53) (second outer surface) facing the other optical components (52) a groove (50) including a bottom surface (502) on which the lower surface (103) of the optical waveguide (1) is placed, and an elastic body (7) having a light transmission property and a non-opposing surface (53) It is elastic and continuously covers the front surface (102) from the upper surface (104) of the optical waveguide (1). According to this, it is possible to provide an optical wiring component capable of achieving stable optical coupling efficiency with other optical components, a method of manufacturing an optical wiring component capable of efficiently manufacturing the optical wiring component, and a reliability of the optical wiring component. Gaozhi electronic machine.

Description

Optical wiring component, manufacturing method of optical wiring component, and electronic device

The present invention relates to an optical wiring component, a method of manufacturing an optical wiring component, and an electronic device.

In an optical waveguide, light guided from one end of a core portion is transmitted to the other end while being reflected by a boundary with a clad portion. A light-emitting element such as a semiconductor laser is disposed on the incident side of the optical waveguide, and a light-receiving element such as a photodiode is disposed on the emission side. The light incident from the light-emitting element propagates through the optical waveguide, is received by the light-receiving element, and communicates according to the blinking mode of the received light or its strong and weak mode.

Optical waveguides typically carry short-range optical communications, while long-haul optical communications use optical fibers. Thereby, by connecting these, it is possible to connect the local network and the backbone network.

In the connection between the optical waveguide and the optical fiber, for example, a state in which the end surface of the optical waveguide is butted against the end surface of the optical fiber is used (for example, see Patent Document 1). A coupling mechanism that can be fitted to each other is used for the holding. Specifically, the positioning pin is inserted into both the fitting hole of the first ferrule provided at the end of the holding optical waveguide and the fitting hole of the second ferrule provided at the end of the holding optical fiber, thereby optically Coupling optical waveguides and optical fibers.

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-75688

When the optical waveguide and the optical fiber are optically coupled as described above, if a gap is formed between the two, the reflectance between each medium and the gap increases. As a result, the light to be transmitted from the optical waveguide side to the optical fiber side is reflected, and the probability of returning to the optical waveguide side again becomes high. Thereby, the amount of light propagating to the side of the optical fiber is reduced, resulting in a decrease in optical coupling efficiency. Further, the return light generated by the reflection causes a problem such as instability of the light-emitting element.

An object of the present invention is to provide an optical wiring component capable of achieving stable optical coupling efficiency with other optical components, a method of manufacturing an optical wiring component capable of efficiently manufacturing the optical wiring component, and reliability of the optical wiring component. Higher electronic machines.

This object can be achieved by the present invention of the following (1) to (10).

(1) An optical wiring component comprising: a sheet-shaped optical waveguide, comprising: a first main surface and a second main surface which are in a front-to-back relationship; and the first main surface and the second surface are connected a part of the outer surface of the main surface is formed by the light incident surface; the optical connector includes: the connector body including the first outer surface and the second outer surface facing each other; and the through hole or the groove, and the inner surface includes Mounting surface of the first main surface of the optical waveguide, and penetrating the first outer surface and the second outer surface; the elastic body having light transmissivity and elasticity, and the second from the optical waveguide The main surface continuously covers the light incident surface, and the elastic coefficient is 0.01~1000 MPa; The subsequent agent is then between at least a part of the first main surface of the optical waveguide and the mounting surface, and the elastic modulus of the cured product is larger than the elastic modulus of the elastic body.

(2) The optical wiring component according to (1) above, wherein the elastic system is formed to protrude from a plane including the first outer surface of the connector body.

(3) The optical wiring component according to the above aspect (1), wherein the optical waveguide is located on a side of the second outer surface from a plane including the first outer surface. The position is placed.

The optical wiring component according to any one of the above aspects, wherein the optical connector further includes a retreating surface that connects the first outer surface of the connector body and the aforementioned The surface of the bottom surface of the groove is displaced further toward the second outer surface side than the plane including the first outer surface.

(5) The optical wiring component according to the above (4), wherein the elastic body is further continuously covered from the second main surface to the retracted surface or the first outer surface via the light incident surface.

(6) The optical wiring component according to any one of (1) to (5), wherein a refractive index of a core portion of the optical waveguide is greater than 1.4, and a refractive index of the elastic body is at a core of the optical waveguide The refractive index is between 1.4.

The optical wiring component according to any one of the above aspects, wherein the cured product of the adhesive has an elastic modulus of 1,000 to 20,000 MPa.

(8) The optical wiring component according to any one of (1) to (7), wherein the manufacturing method is characterized in that the optical waveguide and the optical light are provided a step of attaching an optical waveguide of the connector to the connector; After the resin composition is placed on the molding die, the light incident surface of the optical waveguide is pressed against the resin composition, and the resin composition is brought into close contact with the resin composition, and the resin composition is cured to obtain the foregoing. a step of an elastomer; and a step of demolding the aforementioned forming die.

(9) The optical wiring component according to any one of the above (1) to (7), wherein the manufacturing method is characterized in that the optical waveguide and the light are prepared a step of attaching an optical waveguide of the connector to the connector; arranging the optical waveguide with the connector attached to the molding die; and supplying a resin composition between the molding die and the light incident surface of the optical waveguide, a step of contacting the resin composition with the light incident surface and performing molding; a step of curing the resin composition to obtain the elastic body; and a step of demolding the mold.

(10) An electronic device comprising the optical wiring component according to any one of the above (1) to (7).

According to the present invention, an optical wiring component capable of achieving stable optical coupling efficiency with other optical components can be obtained.

Moreover, according to the present invention, the optical wiring component can be efficiently manufactured.

Further, according to the present invention, it is possible to obtain an electronic device having high reliability because the optical wiring component is provided.

1‧‧‧ optical waveguide

2‧‧‧Support film

3‧‧‧ Cover film

4‧‧‧ Optical waveguide with connector

5‧‧‧Optical connector

6‧‧‧Binder

7‧‧‧ Elastomers

8‧‧‧ Forming die

10‧‧‧Light wiring parts

11‧‧‧Cladding

12‧‧‧Cladding

13‧‧‧ core layer

14‧‧‧ core

15‧‧‧ Side Bread Section

50‧‧‧ slots

50’‧‧‧through hole

51‧‧‧Connector body

51a‧‧‧ base

51b‧‧‧ cover

52‧‧‧ opposite

53‧‧‧ Non-opposite

70‧‧‧Resin composition

81‧‧‧ cavity

100‧‧‧ tools

101‧‧‧ front end

102‧‧‧ front end

103‧‧‧ lower surface

104‧‧‧ upper surface

502‧‧‧ bottom

502’‧‧‧ lower surface

504‧‧‧ Back face

511‧‧‧ Guide hole

801‧‧‧Part 1

802‧‧‧Part 2

L‧‧‧Light

L1‧‧‧ retreat

L2‧‧‧ thickness

L3‧‧‧ protruding length

L4‧‧‧ raised height

W‧‧‧Width

W1‧‧‧Width

Fig. 1 is a perspective view showing a first embodiment of the optical wiring component of the present invention.

Fig. 2 is a plan view of the optical connector shown in Fig. 1 facing the other optical components and a cross-sectional view taken along line A-A of Fig. 1.

Fig. 3 is a cross-sectional view taken along line B-B of Fig. 2;

Fig. 4 is a perspective view showing only the optical connector included in the optical wiring component shown in Fig. 1.

Fig. 5 is a plan view showing a surface of the optical connector shown in Fig. 4 opposite to other optical components, and a cross-sectional view taken along line C-C of Fig. 4.

Fig. 6 is a view showing a modification of the optical wiring component and the optical connector shown in Figs. 1 to 3;

Fig. 7 is a partially enlarged perspective view showing a part of an optical waveguide included in the optical wiring component shown in Fig. 3;

Fig. 8 is a cross-sectional view showing a second embodiment of the optical wiring component of the present invention.

Fig. 9 is a cross-sectional view showing a third embodiment of the optical wiring component of the present invention.

FIG. 10 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (the first embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 11 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (the first embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 12 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (the first embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 13 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (the first embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 14 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (a second embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 15 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 9 (a modification of the second embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 16 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 8 (a third embodiment of the method of manufacturing the optical wiring component of the present invention).

FIG. 17 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 8 (a fourth embodiment of the method of manufacturing the optical wiring component of the present invention).

Hereinafter, the optical wiring component, the optical wiring component manufacturing method, and the electronic device of the present invention will be described in detail based on preferred embodiments shown in the drawings.

<Light wiring parts>

"First Embodiment"

First, a first embodiment of the optical wiring component of the present invention will be described.

1 is a perspective view showing a first embodiment of the optical wiring component of the present invention, and FIG. 2 is a plan view of the optical connector shown in FIG. 1 facing the other optical component and a cross-sectional view taken along line AA of FIG. 3 is a cross-sectional view taken along line BB of FIG. 2 . 4 is a perspective view showing only the optical connector included in the optical wiring component shown in FIG. 1, and FIG. 5 is a plan view of the optical connector shown in FIG. 4 opposite to other optical components and FIG. CC line profile. In the following description, for convenience of explanation, the upper side of FIGS. 2 and 5 is referred to as "upper" and the lower side is referred to as "lower".

The optical wiring component 10 shown in FIG. 1 has an optical waveguide 1 and an optical connector 5 provided at an end of the optical waveguide 1.

The optical waveguide 1 shown in Fig. 1 has an elongated shape and has a strip shape (sheet shape) having a cross-sectional shape having a thickness smaller than the width. In the optical waveguide 1, one end and the other end in the longitudinal direction can be The light signal is transmitted between.

In the drawings of the present application, only the vicinity of one end of the optical waveguide 1 in the optical wiring component 10 is illustrated, and the other portions are omitted. In the optical wiring component 10, the configuration other than the vicinity of one end of the optical waveguide 1 is not particularly limited, and for example, it can be configured similarly to the vicinity of one end. Further, in the present specification, the left end portion of the optical waveguide 1 in FIG. 2(b) is referred to as "front end portion 101", and the end surface at the left end is referred to as "front end surface 102". Further, in the lower surface of the optical waveguide 1 in Fig. 2(b) which is in a front-to-back relationship, the lower surface is also referred to as "lower surface 103 (first main surface)", and the upper surface is referred to as "upper surface 104". (2nd main face)".

As shown in FIG. 2(b), the optical waveguide 1 includes a laminate in which the cladding layer 11, the core layer 13, and the cladding layer 12 are laminated in this order. Further, as shown in FIG. 3, in the core layer 13, eight elongated core portions 14 and a side bread layer portion 15 adjacent to the side surfaces of the respective core portions 14 are formed. In addition, in FIG. 3, the core layer 13 of the optical waveguide 1 is shown in perspective.

The core portions 14 function as a transmission path for transmitting optical signals in the optical waveguide 1. The front end surface 102 of each core portion 14 connects a portion of the lower surface 103 and a portion of the outer surface of the upper surface 104, and is also capable of optically coupling the incident light to the respective core portions 14.

As shown in FIG. 1, the optical connector 5 is provided on the front end portion 101 of the optical waveguide 1 so as to cover the lower surface of the front end portion 101. That is, the optical connector 5 includes the connector body 51 and the groove 50 formed in the connector body 51, and the front end portion 101 of the optical waveguide 1 is inserted into the groove 50.

The left end surface of the optical connector 5 in FIGS. 2(b) and 5(b) is a surface facing the optical component when the optical wiring component 10 is optically connected to other optical components. In the present specification, the left end surface of the optical connector 5 in FIGS. 2(b) and 5(b) is referred to as "opposing surface 52", and the optical connections in FIGS. 2(b) and 5(b) are connected. The right end face of the device 5 is referred to as a "non-opposing face 53". change In other words, the optical connector 5 includes the connector body 51, the opposing surface 52 provided on the connector body 51, the non-opposing surface 53 provided on the connector body 51, and the groove 50 formed in the connector body 51.

The groove 50 is formed to penetrate the opposing surface 52 (first outer surface) of the connector body 51 and the non-opposing surface 53 (second outer surface). Further, the groove 50 is configured to have a rectangular cut surface when cut along a direction orthogonal to the longitudinal direction thereof.

The bottom surface 502 of the groove 50 serves as a mounting surface on which the optical waveguide 1 is placed. The bottom surface 502 is followed by an optical waveguide 1 via an adhesive 6.

Further, the elastic body 7 is provided so as to continuously cover the front end surface 102 of the optical waveguide 1 to the upper surface 104. The elastic body 7 has light transmissivity and elasticity, and has a function of protecting the end surface 102 as a light incident surface. Therefore, when the optical wiring component 10 and other optical components are optically connected, it is possible to prevent the front end surface 102 of the optical waveguide 1 from being greatly damaged. Further, even if the elastic body 7 is brought into contact with other optical components, it is difficult to damage other optical components, so that the optical wiring component 10 and other optical components can be pressed against each other with sufficient force.

Further, since the elastic body 7 is easily attached to other optical components and follows the shape deformation, it is difficult to form a gap between the elastic body 7 and other optical components. As a result, it is possible to suppress the Fresnel reflection caused by the gap, thereby suppressing the decrease in the optical coupling efficiency due to the reflection loss. Therefore, the optical wiring component 10 can achieve stable optical coupling efficiency with other optical components.

Further, in the optical waveguide 1, the front end surface 102 may be located in the same plane as the opposite surface 52 of the optical connector 5, or may protrude from the plane including the opposite surface 52 (the opposite side to the side opposite to the non-opposing surface 53) However, in FIG. 2(b), it is retracted more than the plane including the opposing surface 52 (on the side of the non-opposing surface 53). Thereby, a part of the groove 50 exists in the vicinity of the front end face 102. The elastomer 7 has a sufficient thickness in the normal direction of the front end face 102 by the elastomer 7 entering a portion of the groove 50. degree. As a result, the compression width at the time of compression of the elastic body 7 can be sufficiently ensured, and the function of protecting the distal end surface 102 can be further improved.

Hereinafter, the configuration of the optical wiring component 10 will be described in further detail.

(optical connector)

As described above, the optical connector 5 includes the connector body 51 and the groove 50 formed in the connector body 51.

As described above, the optical waveguide 1 is followed by the bottom surface 502 via the adhesive 6. Thereby, the optical waveguide 1 is fixed in a state of being inserted into the groove 50. As a result, since the optical waveguide 1 can be protected from an external force or the like, it is possible to more reliably suppress a decrease in optical coupling efficiency between the optical wiring component 10 and other optical components.

The groove 50 is formed to penetrate the connector body 51 and open into the opposing surface 52 (first outer surface) of the optical connector 5 and the non-opposing surface 53 (second outer surface). That is, the groove 50 penetrates so as to connect the opposing surface 52 and the non-opposing surface 53.

The cross-sectional shape of the groove 50 (the shape of the cut surface in the direction orthogonal to the line connecting the openings) is not limited to the rectangular shape as described above, and may be a square, a parallelogram, a hexagon, an octagon, or the like. Elliptical and other shapes.

Further, when the width of the optical waveguide 1 (the length in the direction orthogonal to the longitudinal direction of the core portion 14) is W, it is preferable that the width W1 of the groove 50 is set to be wider than the width W of the optical waveguide 1. Thereby, a gap can be provided between the side surface of the front end portion 101 of the optical waveguide 1 and the inner surface of the groove 50. As a result, the overflow of the adhesive 6 can be allowed in this space, so that the overflowing adhesive 6 can be prevented from flowing into the front end surface 102.

At this time, the width W1 of the groove 50 is preferably about 1.01 W to 3 W, and 1.1 W is preferable. 2W or so is better. Thereby, the above effects can be further improved. Further, even when a volume change occurs in the adhesive 6 and the optical waveguide 1 due to a change in the environment in which the optical wiring component 10 is placed, the volume change can be absorbed by the gap between the optical waveguide 1 and the groove 50. Therefore, it is possible to prevent a large stress from being generated accompanying the volume change, and it is possible to prevent a decrease in the transmission efficiency of the optical waveguide 1 due to stress concentration.

Further, the outer shape of the connector body 51 is not particularly limited, and may be a substantially rectangular parallelepiped as shown in FIGS. 1 and 4, or may have other shapes. Also, the connector body 51 can include portions in accordance with various connector specifications. Examples of the connector specifications include a small (Mini) MT connector, an MT connector defined in JIS C 5981, a 16MT connector, a two-dimensional array type MT connector, an MPO connector, and an MPX connector.

As shown in FIGS. 1 and 4, in the connector body 51 of the optical connector 5 of the present embodiment, two guide holes 511 are formed. The guide holes 511 are respectively opened into the opposing surface 52 (first outer surface) and the non-opposing surface 53 (second outer surface) of the connector body 51. In other words, the two guide holes 511 penetrate each other so as to connect the first outer surface and the second outer surface.

When the optical wiring component 10 and other optical components are connected, guide pins (not shown) are inserted into the via holes 511. Thereby, when the optical wiring component 10 is aligned with other optical components, the positions of the optical wiring component 10 can be aligned more accurately, and both can be fixed to each other. That is, the via hole 511 functions as a connection mechanism for connecting the optical wiring component 10 and other optical components.

Further, the guide hole 511 may not open through the connector body 51 and may not open into a plane including the non-opposing surface 53.

Further, instead of the above-described connection mechanism, a locking mechanism or an adhesive using a claw-based locking may be used.

Further, the shape of the groove 50 is not limited to the shape illustrated. For example, in the optical connector 5 shown in FIG. 2, the depth of the groove 50 is constant, but for example, it may be a shape that gradually becomes deeper as it goes from the opposite surface 52 side toward the non-opposing surface 53 side.

Examples of the constituent material of the connector body 51 include various materials such as a phenol resin, an epoxy resin, an olefin resin, a urea resin, a melamine resin, an unsaturated polyester resin, and a polyphenylene sulfide resin. Resin materials, various metal materials such as stainless steel and aluminum alloy.

Further, the connector body 51 shown in Figs. 1 and 2 includes a retreating surface 504 that connects the opposing surface 52 (first outer surface) to the surface of the bottom surface 502 of the groove 50, and includes a facing surface. The plane of 52 is more deviated toward the side of the non-opposing surface 53 (second outer surface).

By providing such a receding surface 504, a space is formed corresponding to the amount by which the receding surface 504 is more retracted (deviation) than the plane including the opposing surface 52. This space becomes, for example, a remaining space for the invasion of the elastic body 7. By the intrusion of the elastic body 7, a larger area of the front end surface (surface on the other optical component side) of the optical wiring component 10 can be occupied by the elastic body 7. Therefore, when the optical wiring component 10 and other optical components are connected, it is possible to prevent the relatively rigid connector body 51 from coming into direct contact with other optical components. Thereby, damage of other optical components can be suppressed.

Further, the elastic body 7 is in contact with the front end surface 102 or the upper surface 104 of the optical waveguide 1 and can be in contact with the connector body 51 by the intrusion of the elastic body 7. Further, as shown in FIG. 2(b), since the receding surface 504 is located below the optical waveguide 1, the elastic body 7 can be provided so as to continuously cover the back surface 504 from the upper surface 104 of the optical waveguide 1 through the front end surface 102. Thereby, the elastic body 7 can be more firmly adhered to both the optical waveguide 1 and the optical connector 5. As a result, a gap is unlikely to occur between the elastic body 7 and the optical waveguide 1, and light transmission efficiency between them can be suppressed. Decline.

Further, the receding surface 504 is not limited to the flat surface as shown in FIGS. 1 and 2, and may have any shape. The shape of the flat surface instead of the flat surface may be, for example, a curved surface shape that is curved or protruded, or a stepped shape that is stepped.

Further, the retreat amount L1 of the receding surface 504, that is, the distance between the plane including the opposing surface 52 and the plane passing through the portion on the most non-opposing surface 53 side of the receding surface 504 and parallel to the opposing surface 52 Although it is not particularly limited, it is preferably about 10 to 1000% of the thickness of the optical waveguide 1, and more preferably about 30 to 500%. Thereby, it is possible to ensure a sufficient area for the adhesion of the elastic body 7 in the receding surface 504, and to suppress the area of the bottom surface 502 of the groove 50 from being reduced in accordance with the amount of the rear surface 504, so that the optical waveguide 1 is placed. It becomes unstable.

In other words, if the amount of retraction L1 is smaller than the lower limit value, depending on the size of the optical connector 5, a sufficient area may not be secured in the receding surface 504 or the thickness of the elastic body 7 in the vicinity of the receding surface 504 may not be sufficiently ensured. On the other hand, if the amount of retraction L1 exceeds the above-described upper limit value, depending on the size of the optical connector 5, the area of the bottom surface 502 and the amount by which the receding surface 504 becomes larger may be reduced accordingly, so that the area of the optical waveguide 1 is not placed. It becomes larger, making the placement unstable.

Further, the thickness L2 of the receding surface 504, that is, the distance between the plane including the bottom surface 502 of the groove 50 and the plane passing through the portion on the most opposite surface 52 side of the receding surface 504 and parallel to the bottom surface 502 is not particularly limited. However, it is preferably about 10 to 1000% of the thickness of the optical waveguide 1, and about 30 to 500% is more preferable. At this time, it is also possible to ensure a sufficient area for the adhesion of the elastic body 7 in the receding surface 504, and to sufficiently enjoy the effect of suppressing damage of other optical components.

Further, in the optical wiring component 10 shown in Fig. 2(b), the front end surface 102 of the optical waveguide 1 retreats (deviations) from the plane including the opposing surface 52 toward the non-opposing surface 53 side, and the amount thereof There is space in the area. This space also becomes a remaining space for, for example, the intrusion of the elastic body 7. By the intrusion of the elastic body 7, an elastic body 7 having a sufficient volume (thickness) is disposed between the distal end surface 102 of the optical waveguide 1 and other optical components. Therefore, when the optical wiring component 10 and other optical components are connected, it is possible to alleviate the application of a large load to the optical waveguide 1. In other words, even if a large load is applied to the optical wiring component 10, the vicinity of the front end surface 102 of the optical waveguide 1 can be prevented from being easily deformed. Thereby, damage of the optical waveguide 1 can be suppressed, and the fall of the optical coupling efficiency between the optical wiring component 10 and another optical component can be suppressed.

Further, from the above viewpoint, when the bottom surface 502 of the groove 50 is viewed in plan, the optical waveguide 1 can overlap the receding surface 504, but it is preferable not to overlap. Thereby, the elastic body 7 covers the receding surface 504, and also covers the front end surface 102 of the optical waveguide 1 with a sufficient thickness. As a result, the effect as described above becomes more remarkable.

Further, the optical connector 5 may be attached to any structure as shown in FIGS. 1 to 3 as needed.

Fig. 6 is a view showing a modification of the optical wiring component and the optical connector shown in Figs. 1 to 3; In addition, in the present modification, the following matters are different, and the optical wiring component and the optical connector shown in FIGS. 1 to 3 are the same.

As shown in Fig. 6, in the optical connector 5 of the modification, the connector body 51 is composed of an assembly in which the base 51a and the lid 51b are assembled. In addition, in FIG. 6, the illustration of the elastic body 7 is abbreviate|omitted.

In the present modification, as shown by an arrow in FIG. 6, the cover 50 provided in the base 51a is housed in the cover 51b. That is, the opening above the groove 50 is blocked by the lid 51b. At this time, the lid body 51b may or may not be in contact with the elastic body 7.

When the lid body 51b is in contact with the elastic body 7, the base body 51a and the lid body 51b may be fixed to each other or may be apart from each other.

On the other hand, when the lid body 51b is not in contact with the elastic body 7, the base body 51a and the lid body 51b may be fixed to each other. For this fixation, for example, an adhesive or the like can be used.

(optical waveguide)

Fig. 7 is a partially enlarged perspective view showing a part of an optical waveguide included in the optical wiring component shown in Fig. 3; In FIG. 7, for convenience of explanation, the vicinity of two core portions 14 in the optical waveguide 1 shown in FIG. 3 is enlarged to illustrate

The two core portions 14 shown in Fig. 7 are surrounded by the cladding portion (the side bread layer portion 15 and the respective cladding layers 11 and 12), and can be trapped by the core portion 14 to propagate.

The refractive index distribution in the cross section of the core 14 can be arbitrarily distributed. The refractive index distribution may be a so-called step (SI) type distribution in which the refractive index changes discontinuously, or a so-called progressive (GI) type distribution in which the refractive index continuously changes.

Further, when the optical waveguide 1 or the core portion 14 formed in the optical waveguide is viewed in plan, it may be linear or curved. Further, the optical waveguide 1 or the core portion 14 formed in the optical waveguide may be branched or crossed in the middle, respectively.

Further, the cross-sectional shape of the core portion 14 is not particularly limited. For example, a circular, elliptical or elliptical shape such as a circle, a triangle, a quadrangle, a pentagon or a hexagon may be used, but a quadrilateral is used. The rectangular shape has the advantage of easily forming the core 14.

The width and height of the core portion 14 (thickness of the core layer 13) are not particularly limited, and are preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and still more preferably about 10 to 70 μm. Thereby, it is possible to suppress a decrease in the transmission efficiency of the optical waveguide 1, and to realize the core portion 14 High density.

On the other hand, as shown in Fig. 7, when a plurality of core portions 14 are arranged in parallel, the width of the side bread layer portion 15 located between the core portions 14 is preferably about 5 to 250 μm, and more preferably about 10 to 200 μm. Further, about 10 to 120 μm is further preferable. Thereby, it is possible to prevent the crosstalk from being mixed (crosstalk) between the core portions 14 and to increase the density of the core portion 14.

The constituent material (main material) of the core layer 13 as described above is, for example, a cyclic ether such as an acrylic resin, a methacrylic resin, a polycarbonate, a polystyrene, or an epoxy resin or an oxetane resin. Resin, polyamine, polyimine, polybenzoxazole, polydecane, polyazane, anthrone, fluorine resin, polyurethane, polyolefin resin, polybutylene Alkene, polyisoprene, polychloroprene, polyester such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT), polyethylene succinate, In addition to various resin materials such as polyfluorene, polyether, or a cyclic olefin resin such as a benzocyclobutene resin or a norbornene resin, a glass material such as quartz glass or borosilicate glass can be used. Further, the resin material may be a composite material of a combination of different components.

Further, as the constituent material of the cladding layers 11 and 12, for example, the same material as that of the above-described core layer 13 can be used, but it is selected from the group consisting of (meth)acrylic resin, epoxy resin, and anthrone resin. At least one of a group of a polyimine-based resin, a fluorine-based resin, and a polyolefin-based resin is particularly preferable.

Further, the optical waveguide 1 as a whole is preferably made of a resin material. Thereby, the optical waveguide 1 is rich in flexibility, and the assembly work can be facilitated.

The width of the optical waveguide 1 is not particularly limited, and is preferably about 1 to 100 mm, and more preferably about 2 to 10 mm.

Further, the number of the core portions 14 formed in the optical waveguide 1 is not particularly limited, but preferably about 1 to 100 is preferable. Further, when the number of the core portions 14 is large, the optical waveguide 1 can be multilayered as needed. Specifically, it is possible to perform multilayering by further alternately overlapping the core layer and the cladding layer on the optical waveguide 1 shown in FIG.

Further, although not shown in FIG. 2, the optical waveguide 1 shown in FIG. 7 further includes a support film 2 as the lowermost layer and a cover film 3 as the uppermost layer.

Examples of the constituent material of the support film 2 and the cover film 3 include polyethylene terephthalate (PET), polyolefins such as polyethylene and polypropylene, and various resins such as polyimine and polyamine. material.

Further, the average thickness of the support film 2 and the cover film 3 is not particularly limited, and is preferably about 5 to 500 μm, more preferably about 10 to 400 μm. Thereby, since the support film 2 and the cover film 3 have appropriate rigidity, the core layer 13 can be reliably supported, and the core layer 13 and the clad layers 11 and 12 can be reliably protected from the external force and the outside.

Further, the support film 2 and the cover film 3 may be provided as needed, or may be omitted.

(adhesive)

Examples of the adhesive 6 include an epoxy-based adhesive, an acrylic adhesive, a urethane adhesive, an anthrone-based adhesive, an olefin-based adhesive, and various hot-melt adhesives (polyesters, Modified olefins) and the like.

The elastic modulus of the cured product of the adhesive agent 6 is preferably about 1,000 to 20,000 MPa, more preferably about 300 to 15,000 MPa, still more preferably about 500 to 12,500 MPa, and even more preferably about 1,000 to 10,000 MPa. By the hardening of the adhesive 6 When the coefficient of elasticity is set within the above range, the optical waveguide 1 can be more reliably fixed to the optical connector 5, and thermal stress or the like can be suppressed from being concentrated in the optical waveguide 1, and an increase in transmission loss can be suppressed.

Further, the modulus of elasticity of the adhesive 6 was measured at a temperature of 25 ° C in accordance with the method specified in JIS K 7127.

Further, the cured product of the adhesive 6 has a glass transition temperature of preferably about 30 to 260 ° C, more preferably about 35 to 200 ° C. By setting the glass transition temperature of the cured product of the adhesive 6 within the above range, the heat resistance of the optical wiring component 10 can be further improved.

Further, the glass transition temperature of the cured product of the adhesive 6 can be measured by a dynamic viscoelasticity measurement method (DMA method).

Further, the adhesive 6 does not need to be provided on the entire bottom surface 502 of the groove 50, and for example, a portion where the adhesive 6 is not provided may be partially present.

Further, the state before curing of the adhesive 6 may be liquid or solid. The adhesive 6 which is solid before hardening has a thermosetting resin as a main component. Examples of the thermosetting resin include bisphenol epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, and bisphenol S epoxy resin. Such as phenol novolac type epoxy resin, phenol novolak type epoxy resin and other novolac type epoxy resin, such as trisphenol methane triglycidyl ether aromatic epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type Examples of the epoxy resin such as an epoxy resin include a quinone imine resin such as polyimide or phthalimide, an oxime resin, a phenol resin, and a urea resin, and any of these can be used. Two or more types are used in combination or in combination.

(elastomer)

As described above, the elastic body 7 has light transmissivity and elasticity, and is continuously covered from the front end surface 102 of the optical waveguide 1. Cover to upper surface 104.

Here, the light transmittance refers to a property of transparency in the wavelength of light incident on the optical waveguide 1. In the present invention, the term "transparent" means that when light having a wavelength of 850 nm is incident on the elastic body 7, the insertion loss is 2 dB or less.

Further, the elasticity refers to a property which is deformed when an external force is applied and returns to the original shape if the external force is eliminated. In the present invention, "having elasticity" means a state in which the tensile strength is 0.3 MPa or more and the elastic modulus is 0.01 to 1000 MPa.

By continuously covering the front end surface 102 of the optical waveguide 1 to the upper surface 104 by the elastic body 7, the contact area between the elastic body 7 and the optical waveguide 1 can be sufficiently ensured. As a result, the elastic body 7 can be fixed more reliably.

Further, as described above, the elastic body 7 is further brought into contact with the receding surface 504 of the connector body 51, whereby the contact area of the elastic body 7 can be further widened.

Further, as shown in Fig. 2(a), the elastic body 7 may or may not be in contact with the side surface of the groove 50. At the time of contact, the contact area of the elastic body 7 with the connector body 51 can be widened. Further, when the contact is not made, the contact area between the elastic body 7 and the connector body 51 can be made small. Therefore, even when the elastic body 7 is thermally expanded, stress is hard to be generated in the optical waveguide 1 by reducing the contact area.

Further, as shown in FIG. 2(b), the elastic body 7 is preferably formed so as to protrude from the plane including the opposing surface 52 of the connector body 51 (projecting toward the opposite side of the non-opposing surface 53). Thereby, when the optical wiring component 10 and other optical components are connected, the elastic body 7 comes into contact with other optical components before the optical connector 5. Further, by gradually reducing the distance between the both sides, the elastic body 7 is gradually deformed while being loosened on one side. At this time, the elastic body 7 is compressed and follows. Therefore, it is difficult for air to remain in the connection interface, and it is possible to suppress a decrease in light coupling efficiency (increased reflection loss) accompanying Fresnel reflection.

Further, the elastic body 7 does not have to protrude from the plane including the opposing surface 52, and may be in the same plane as the opposing surface 52, or may be retracted from the plane including the opposing surface 52 toward the non-opposing surface 53 side. Even in such a case, the elastic body 7 follows the shape of another optical component, whereby the above effects can be exhibited. Thereby, the shape of the elastic body 7 is appropriately selected in accordance with the shape of other optical parts.

Also, the elastic body 7 does not have to be in contact with other optical parts. That is, when the optical wiring component 10 and other optical components are connected, the elastic body 7 can be connected away from other optical components. At this time, the elastic body 7 functions as an optical element depending on the shape of the interface with the outside air. As the optical element, for example, a convex lens or the like can be given. That is, when the elastic body 7 has a convex curved surface, the elastic body 7 functions as a convex lens.

Such an elastic body 7 is capable of aggregating light, thereby contributing to an improvement in optical coupling efficiency between the optical wiring component 10 and other optical components. Thereby, the optical coupling efficiency can be further improved.

Further, the protruding length L3 of the elastic body 7 (the distance between the tip end of the elastic body 7 and the plane including the opposing surface 52) is not particularly limited, but is preferably about 0.1 to 500% of the thickness of the optical waveguide 1. 0.5~200% is better. Thereby, it is possible to ensure a sufficient protruding length required for the elastic body 7 to change in conformity with its shape when it comes into contact with other optical components. Therefore, it is possible to further suppress the air from remaining in the connection interface, and it is possible to more reliably suppress the decrease in the optical coupling efficiency.

Further, as shown in Fig. 2(b), the elastic body 7 is preferably formed to include a shape that is convex upward (opposite side of the bottom surface 502 of the groove 50). By including this shape, the stress generated in the elastic body 7 is easily dispersed, so that it is possible to avoid local application of a large stress to the optical waveguide 1. its As a result, an increase in the transmission loss of the optical waveguide 1 accompanying the stress concentration can be suppressed.

Further, the projection height L4 of the elastic body 7 (the maximum distance between the vertex of the upper surface of the elastic body 7 and the optical waveguide 1) is not particularly limited, but is preferably about 1 to 5000% of the thickness of the optical waveguide 1. 5~2000% is better. Thereby, the stress generated in the elastic body 7 is more easily dispersed, so that the stress applied to the optical waveguide 1 is reduced to be smaller, and the increase in the transmission loss of the optical waveguide 1 accompanying the stress concentration can be more reliably suppressed.

The constituent material of the elastic body 7 may, for example, be a flexible resin such as transparent polyamide, polyolefin, fluororesin, polyester, (meth)acrylic resin or polycarbonate, such as an epoxy resin or oxygen. For the curable resin such as a heterocyclic butane-based resin, a vinyl ether-based resin, a melamine-based resin, a phenolic resin, an anthrone-based resin, or a transparent polyimine, one or more of these may be used. material.

Further, the constituent material of the elastic body 7 may contain styrene, polyolefin, polyvinyl chloride, polyurethane, polyester, polyamine, polybutadiene, or the like as needed. Various thermoplastic elastomers such as polyisoprene, fluororubber, and chlorinated polyethylene.

Further, a thermosetting (thermosetting) material can be used as the constituent material of the elastic body 7, but a photocurable (photocurable) material is preferably used. Such a material can be efficiently formed in a short time when the elastic body 7 is formed. Therefore, the elastic body 7 excellent in dimensional accuracy can be obtained.

As described above, when the light having a wavelength of 850 nm is incident on the elastic body 7 with respect to the light transmittance of the elastic body 7, the insertion loss satisfies 2 dB or less, but it is preferable to satisfy 1.5 dB or less. Such an elastic body 7 can suppress a decrease in transmission efficiency even when it is interposed between the optical waveguide 1 and other optical components. Therefore, the optical coupling efficiency between the optical wiring component 10 and other optical components can be sufficiently improved.

In addition, the insertion loss of the elastic body 7 can be inserted, for example, in accordance with 4.6.1 in the test method (JPCA-PE02-05-01S-2008) of a polymer optical waveguide manufactured by Japan Electronics Packaging and Circuits Association. The measurement method of the loss is measured.

As described above, the elastic tensile strength of the elastic body 7 is 0.3 MPa or more, the elastic modulus is 0.01 to 1000 MPa, the tensile strength is 1 MPa or more, and the elastic modulus is preferably 0.1 to 300 MPa, and the tensile strength is 5 MPa or more and the elastic modulus. It is better to satisfy 0.5~100MPa. When the elastic body 7 is interposed between the optical waveguide 1 and other optical components, when the compression force is applied to both of them, the elastic body 7 is relatively easily deformed to follow the shape of both, and plastic deformation is less likely to occur.

Further, when the tensile strength of the elastic body 7 is less than the above lower limit value, when the load is applied to the elastic body 7, the elastic body 7 may be damaged depending on the magnitude of the load. Further, when the elastic modulus of the elastic body 7 is less than the above lower limit value, the elastic body 7 is extremely deformed and may be deformed by its own weight. On the other hand, when the elastic modulus of the elastic body 7 exceeds the above upper limit value, the elastic body 7 is less likely to be deformed, and the shape thereof may be difficult to follow other optical components.

Further, the tensile strength of the elastic body 7 can be measured, for example, according to the test method of the tensile properties of the plastic specified in JIS K 7127:1999.

Further, the elastic modulus of the elastic body 7 is, for example, a storage elastic modulus E' measured by a dynamic viscoelasticity measuring device at a frequency of 1 Hz and a measurement temperature of 23 ° C as a test piece having a length of 20 mm × a width of 20 mm × a thickness of 1 mm. To find out. In addition, examples of the dynamic viscoelasticity measuring device include DMS210, DMS6100, and the like manufactured by RSAIII manufactured by TA Instruments, or SII NANO TECHNOLOGY INC.

Moreover, the elastic modulus of the adhesive 6 is greater than the elastic modulus of the elastic body 7 good. Thereby, the adhesive 6 becomes relatively non-deformable. Therefore, for example, even when the elastic body 7 receives a compressive force and the compressive force is applied to the adhesive 6, the adhesive 6 is not easily deformed, so that the positional relationship between the optical waveguide 1 and the optical connector 5 is less likely to change. As a result, the positional accuracy of the optical waveguide 1 with respect to the optical connector 5 can be maintained high, and the optical coupling efficiency between the optical wiring component 10 and other optical components can be maintained high.

Further, the refractive index of the elastic body 7 is preferably between 1.4 and 1.4 in the refractive index of the core portion 14 of the optical waveguide 1. By the refractive index of the elastic body 7 being within this range, the reflection loss accompanying the refractive index difference can be suppressed between the optical waveguide 1 and the elastic body 7 and between the elastic body 7 and other optical components (for example, an optical fiber). Thereby, the optical coupling efficiency between the optical wiring component 10 and other optical components can be further improved.

Further, since the refractive index of the core of the optical fiber is usually about 1.46, it is preferable to set the refractive index of the elastic body 7 to be between the refractive index of the core portion 14 and 1.46.

Further, when the other optical component is other than the optical fiber, it is preferable that the refractive index of the elastic body 7 is between the refractive index of the core portion 14 of the optical waveguide 1 and the refractive index of the other optical component. Thereby, the optical coupling efficiency between the optical wiring component 10 and other optical components can be further improved.

Further, as shown in FIG. 2(b), the adhesive 6 is preferably located closer to the proximal end side than the distal end surface 102 of the optical waveguide 1 (on the side of the non-opposing surface 53 of the optical connector 5). Thereby, a gap corresponding to the thickness of the thickness of the adhesive 6 is formed between the optical waveguide 1 and the bottom surface 502 in the vicinity of the front end surface 102 of the optical waveguide 1. Since the elastic body 7 can enter the gap, the elastic body 7 can be more firmly adhered by the anchoring effect. As a result, the reliability of the optical wiring component 10 can be further improved.

Further, a surface treatment may be performed on the surface of the elastic body 7 as needed. As The surface treatment may, for example, be a surface modification treatment such as a liquid repellent treatment, a low reflection coating, a film formation treatment such as a protective coating, or the like.

"Second Embodiment"

Next, a second embodiment of the optical wiring component of the present invention will be described.

Fig. 8 is a cross-sectional view showing a second embodiment of the optical wiring component of the present invention.

In the following, the second embodiment will be described. The following description focuses on differences from the first embodiment, and the description of the same matters will be omitted. In FIG. 8, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the optical wiring component 10 shown in FIG. 8 of the second embodiment, the adhesive 6 of the first embodiment is omitted. Instead of this, the elastic body 7 has a function of bonding the optical waveguide 1 and the optical connector 5, and The optical wiring component 10 of the first embodiment is the same.

As shown in FIG. 8, the elastic body 7 shown in FIG. 8 is provided not only in such a manner as to continuously cover the front end surface 102 of the optical waveguide 1 to the upper surface 104, but also between the optical waveguide 1 and the optical connector 5. Further, the elastic body 7 is then between the optical waveguide 1 and the optical connector 5. Thereby, the elastic body 7 of the present embodiment can ensure a wider contact area with respect to the optical waveguide 1 and the optical connector 5 than the elastic body 7 of the first embodiment. As a result, the elastic body 7 can be fixed more reliably.

Further, according to the present embodiment, the adhesive 6 can be omitted, so that the structure can be simplified. Further, since the adhesive 6 is omitted, for example, no gap is formed between the adhesive 6 and the elastic body 7. Therefore, the defect caused by the gap expansion does not occur, and further high reliability of the optical wiring component 10 can be achieved.

In the second embodiment described above, the same effects as those of the first embodiment can be obtained.

"Third Embodiment"

Next, a third embodiment of the optical wiring component of the present invention will be described.

Fig. 9 is a cross-sectional view showing a third embodiment of the optical wiring component of the present invention.

In the following, the third embodiment will be described. The following description focuses on differences from the first embodiment, and the description of the same matters will be omitted. In FIG. 9, the same components as those of the above-described embodiment are denoted by the same reference numerals.

The optical wiring component 10 of the present embodiment is the same as the optical wiring component 10 of the first embodiment except that the shape of the optical connector 5 is different.

That is, the optical connector 5 shown in Fig. 9 is provided with a through hole 50' formed in the connector body 51 instead of the groove 50 shown in Fig. 2 . The through hole 50' is formed to penetrate the opposing surface 52 (first outer surface) of the connector body 51 and the non-opposing surface 53 (second outer surface). Further, when the cutting is performed in a direction orthogonal to the longitudinal direction thereof, the through hole 50' is configured to have a rectangular cut surface. Further, in the optical connector 5 shown in Fig. 9, the receding surface is omitted.

Further, in the optical connector 5 shown in Fig. 9, of the inner surface of the through hole 50', the lower surface 502' located in Fig. 9 serves as a mounting surface on which the optical waveguide 1 is placed. The lower surface 502' is followed by an optical waveguide 1 via an adhesive 6.

Further, the elastic body 7 is provided so as to continuously cover the front end surface 102 of the optical waveguide 1 to the upper surface 104.

Further, as shown in FIG. 9, the elastic body 7 is also in contact with the opposing surface 52 of the connector body 51. That is, the elastic body 7 is configured to continuously cover the opposite surface 52 (first outer surface) of the connector body 51 from the upper surface 104 of the optical waveguide 1 through the front end surface 102. Thereby, the area in which the elastic body 7 is in contact with the optical waveguide 1 and the optical connector 5 can be further widened, so that the elastic body 7 can be more reliably fixed.

Further, as shown in Fig. 9, the elastic body 7 may be in contact with the upper surface of the through hole 50' (the inner surface located above the upper side of Fig. 9) or may be away from the upper surface. Similarly, as shown in Fig. 9(a), the elastic body 7 may be in contact with the side surface of the through hole 50' (the left and right inner surfaces of Fig. 9(a)), or may be away from the side surface.

In the third embodiment described above, the same effects as those of the first embodiment can be obtained.

Further, according to the third embodiment, the lower surface 502' of the through hole 50' is set as the mounting surface of the optical waveguide 1. Therefore, the entire side surface of the optical waveguide 1 is surrounded by the optical connector 5. Therefore, the function of protecting the optical waveguide 1 from external force or environmental change can be further enhanced, and the reliability of the optical wiring component 10 can be further improved.

<Method of Manufacturing Optical Wiring Parts>

"First Embodiment"

Next, a first embodiment of a method of manufacturing an optical wiring component according to the present invention will be described.

10 to 13 are views for explaining a method of manufacturing the optical wiring component shown in Figs. 1 and 2 (the first embodiment of the method of manufacturing the optical wiring component of the present invention). In addition, (a) of each figure is the same plan view as FIG. 2 (a), and (b) of each figure is a sectional view similar to FIG. 2 (b), respectively. In the following description, for convenience of explanation, the upper side of FIGS. 10 to 13 is referred to as "upper" and the lower side is referred to as "lower". In FIGS. 10 to 13, the same components as those of the above-described embodiment are denoted by the same reference numerals.

The method for manufacturing the optical wiring component 10 of the present embodiment includes the steps of: [1] preparing a optical waveguide 4 including a connector to which the optical waveguide 1 and the optical connector 5 are attached; and [2] disposing the resin composition 70 on the molding die 8. Thereafter, the resin composition 70 is pressed against at least the front end surface 102 of the optical waveguide 1 (light incident surface), and the resin composition 70 is brought into close contact with each other to form a molding step; [3] The resin composition 70 is cured to obtain a hardening step of the elastic body 7; and [4] a demolding step of demolding the forming mold 8. Hereinafter, each step will be described in detail.

[1] Preparation steps

First, the optical waveguide 1 and the optical connector 5 are prepared. Then, as shown in FIG. 10, the optical waveguide 1 and the optical connector 5 are fixed via the adhesive 6. Thereby, the optical waveguide 4 with the connector shown in Fig. 11 is obtained.

At this time, since the optical waveguide 1 is disposed in the groove 50 of the optical connector 5, the arrangement can be performed by lowering the optical waveguide 1 from above the groove 50. In this type of operation, the optical waveguide 1 can be held by the tool 100 as shown in FIG. 10, and the optical waveguide 1 can be placed at the target position by the driving tool 100.

In other words, the mounting surface of the optical waveguide 1 (the bottom surface 502 of the slot 50) provided in the optical connector 5 is in a state of being viewable from the outside of the optical connector 5, so that the optical waveguide 1 is directed from the upper side toward the bottom surface 502 in FIG. When it is lowered, it can be lowered while avoiding interference with the optical connector 5. Further, it is possible to directly adjust the placement position of the optical waveguide 1 without being hindered by the optical connector 5, so that the alignment accuracy can be easily improved.

Therefore, the relative position of the optical waveguide 1 with respect to the optical connector 5 can be determined with the same positional accuracy as the driving position accuracy of the tool 100. As a result, the position of the optical waveguide 1 with respect to the optical connector 5 can be quickly and accurately determined, and the optical wiring component 10 excellent in optical coupling efficiency with other optical components can be obtained.

Further, as the device having such a tool 100, for example, various welding devices such as a flip chip bonding machine can be used.

[2] Forming step

Next, the forming die 8 shown in Fig. 12 is prepared. This molding die 8 is used to form a molding die of the elastic body 7 of a target shape by molding the resin composition 70. Specifically, the molding die 8 shown in FIG. 12 includes a first portion 801 having a flat plate shape and a second portion 802 having a flat shape on one of the main faces of the first portion 801. The first portion 801 and the second portion 802 are arranged such that the principal faces are orthogonal to each other.

Further, the forming die 8 is configured to have a width smaller than the width of the groove 50 of the optical connector 5. Thereby, the molding die 8 can be inserted into the groove 50. Therefore, the molding die 8 can be easily brought close to the optical waveguide 1 inserted and fixed in the groove 50. As a result, the resin composition 70 placed on the molding die 8 can be easily pressed against the optical waveguide 1 and can be formed in a state of being sandwiched between the optical waveguide 1 and the molding die 8.

In other words, the resin composition 70 can be molded in a state where the molding die 8 enters the inside of the groove 50, so that interference between the molding die 8 and the connector body 51 can be avoided. Therefore, the resin composition 70 can be reliably formed into a target shape.

Further, the molding die 8 is provided with a cavity 81 corresponding to the shape of the elastic body 7 to be formed. The cavity 81 is a recess in which a part of the surface of the forming die 8 is recessed. By forming the resin composition 70 by the concave portion, it is possible to form a shape that protrudes toward the elastic body 7.

The resin composition 70 is formed into a composition of the elastic body 7 by curing. This resin composition 70 is placed in the cavity 81. Further, the resin composition 70 may be disposed only in the cavity 81 or may overflow a part of the cavity 81. Further, it is also conceivable that the resin composition 70 moves during molding, and is disposed only outside the cavity 81.

Next, the optical waveguide 4 to which the connector is attached is brought close to the forming die 8 so that the resin composition 70 comes into contact with the optical waveguide 1. Thereby, the resin composition 70 is sandwiched by the light wave attached to the connector The guide 4 is formed between the forming die 8 and is in close contact with the optical waveguide 1. Thereby, the resin composition 70 is shaped into a target shape as shown in FIG.

Further, the shape of the molding die 8 is not limited to the above-described shape, and may be any shape. For example, the forming die 8 may be composed of an aggregate of a plurality of parts.

The constituent material of the molding die 8 is not particularly limited, and examples thereof include a resin material, a glass material, a crystal material, a carbon material, a ceramic material, and a metal material.

In addition, examples of the resin composition 70 include a varnish containing a resin material before curing of the above-described elastic body 7 and a solvent.

[3] Hardening step

Next, the formed resin composition 70 is cured. Thereby, the elastic body 7 shown in Fig. 2 can be obtained.

The curing method of the resin composition 70 is not particularly limited, and it may be photocured or thermally cured. Further, by imparting light transmittance to the molding die 8, the resin composition 70 can be irradiated with light over the molding die 8. Therefore, the resin composition 70 can be cured while maintaining the state in which the resin composition 70 is molded by the molding die 8. As a result, the elastic body 7 having high dimensional accuracy can be obtained. The elastic body 7 contributes to further improve the light coupling efficiency between the optical wiring component 10 and other optical components.

[4] demoulding step

Next, the forming die 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 2 can be obtained.

And, as needed, the release agent or the tree is applied to the cavity 81 of the forming die 8. The mold composition 70 is added with a mold release agent, whereby the mold release work can be performed more smoothly.

Further, although not shown, the method of manufacturing the optical wiring component of the present embodiment can be applied to a method of manufacturing the optical wiring component shown in FIG. In other words, the resin composition 70 is placed in the through hole 50'. Thereafter, the resin composition 70 can be molded by the molding die 8 as exemplified in the modification of the second embodiment to be described later.

"Second Embodiment"

Next, a second embodiment of the method of manufacturing the optical wiring component of the present invention will be described.

FIG. 14 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (a second embodiment of the method of manufacturing the optical wiring component of the present invention). In addition, each (a) is a plan view similar to FIG. 2 (a), and each (b) is a sectional view similar to FIG. 2 (b), respectively. In the following description, for convenience of explanation, the upper side of FIG. 14 is referred to as "upper" and the lower side is referred to as "lower". In FIG. 14, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the following, the second embodiment will be described. The following description focuses on differences from the first embodiment, and the description of the same matters will be omitted.

The method of manufacturing the optical wiring component 10 of the present embodiment includes: [1] preparing a optical waveguide 4 including a connector to which the optical waveguide 1 and the optical connector 5 are attached; and [2] arranging a connector with the connector 8 a step of disposing the optical waveguide 4; [3] a step of forming a resin composition 70 between the molding die 8 and the front end surface 102 of the optical waveguide 1, and bringing the resin composition 70 into contact with the front end surface 102 and forming the molding; [4] The resin composition 70 is cured to obtain a hardening step of the elastic body 7; [5] a demolding step of demolding the forming mold 8. Hereinafter, each step will be described in detail.

[1] Preparation steps

First, the optical waveguide 4 with the connector shown in Fig. 14 is prepared.

[2] Configuration steps

Next, the forming die 8 is prepared. Further, the optical waveguide 4 to which the connector is attached is disposed to the forming die 8. At this time, a gap is provided between the optical waveguide 4 with the connector and the forming die 8.

[3] Forming step

Next, as shown in FIG. 14, the resin composition 70 is supplied to the gap between the optical waveguide 4 with the connector and the molding die 8. Thereby, the resin composition 70 is stored in the gap, is in contact with the front end surface 102 of the optical waveguide 1, and is formed by the gap.

[4] Hardening step

Next, the formed resin composition 70 is cured. Thereby, the elastic body 7 shown in Fig. 2 can be obtained.

[5] demoulding step

Next, the forming die 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 2 can be obtained.

Further, in the present embodiment as described above, the same effects as those of the first embodiment can be exhibited.

<<Modification of Second Embodiment>>

Further, the method of manufacturing the optical wiring component of the present embodiment can also be applied to a method of manufacturing the optical wiring component shown in FIG.

FIG. 15 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 9 (a modification of the second embodiment of the method of manufacturing the optical wiring component of the present invention).

[1] Preparation steps

First, the optical waveguide 4 with the connector shown in Fig. 15 (a) is prepared.

[2] Configuration steps

Next, the forming die 8 is prepared. Further, the optical waveguide 4 to which the connector is attached is disposed to the forming die 8. At this time, a gap is provided between the front end surface 102 of the optical waveguide 1 and the forming die 8.

[3] Forming step

Next, as shown in FIG. 15(b), the resin composition 70 is supplied to the gap between the distal end surface 102 of the optical waveguide 1 and the molding die 8. Thereby, the resin composition 70 is stored in the gap, is in contact with the front end surface 102 of the optical waveguide 1, and is formed by the gap.

Further, the resin composition 70 also penetrates into the through hole 50' and is filled into the through hole 50' so as to contain the optical waveguide 1.

In addition, the method of supplying the resin composition 70 is not particularly limited, and examples thereof include a method of supplying a device such as a liquid dosing device. Further, the supply path is not particularly limited. For example, it may be a path through the opening on the side of the non-opposing surface 53 of the through hole 50', or may be a path through the hole provided in the molding die 8. In addition, in FIG. 15, as an example, the form which supplied the resin composition 70 via the path of the penetration molding die 8 is shown.

Further, the shape of the molding die 8 is not particularly limited. However, as an example, the molding die 8 shown in FIG. 15(b) is configured such that the resin composition 70 protruding from the opposing surface 52 of the optical connector 5 is formed as The lens is formed in such a manner that a part of the resin composition 70 is in contact with the opposing surface 52.

[4] Hardening step

Next, the formed resin composition 70 is cured. Thereby, the elastic body 7 shown in Fig. 9 can be obtained. Further, when the resin composition 70 has photocurability, it is formed as shown in Fig. 15 (c). When the mold 8 is light transmissive, the resin composition 70 may be irradiated with the light L over the molding die 8. Thereby, the resin composition 70 can be cured while maintaining the state in which the resin composition 70 is molded by the molding die 8. As a result, the elastic body 7 having high dimensional accuracy can be obtained.

Further, the method of curing the resin composition 70 is not limited to the above method. For example, when the resin composition 70 has thermosetting properties, it can be cured by heating.

[5] demoulding step

Next, the forming die 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 9 can be obtained.

Also in the present modification, the same effects as those of the second embodiment described above can be obtained.

"Third Embodiment"

Next, a method of manufacturing the optical wiring component shown in FIG. 8 will be described as a third embodiment of the method of manufacturing an optical wiring component according to the present invention.

FIG. 16 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 8 (a third embodiment of the method of manufacturing the optical wiring component of the present invention). In the following description, for convenience of explanation, the upper side of FIG. 16 is referred to as "upper". In FIG. 16, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the following, the third embodiment will be described. The following description focuses on differences from the first embodiment, and the description of the same matters will be omitted.

The method for manufacturing the optical wiring component 10 of the present embodiment includes: [1] a supply step of supplying the resin composition 70 in contact with the optical waveguide 1, and [2] a method of compressing the resin composition 70 to cause the optical waveguide 1 to The optical connectors 5 are close to each other, and a forming step of molding the resin composition 70 by the forming die 8; [3] hardening the resin composition 70 to obtain the elastic body 7, And a step of hardening the optical waveguide 1 and the optical connector 5 via the elastic body 7; and [4] a demolding step of demolding the forming mold 8. Hereinafter, each step will be described in detail.

[1] Supply step

First, as shown in Fig. 16 (a), the optical waveguide 1 is placed on the molding die 8.

Next, the resin composition 70 is supplied to the upper surface of the optical waveguide 1. Thereby, the resin composition 70 stays on the upper surface of the optical waveguide 1.

[2] Forming step

Next, as shown in Fig. 16 (a), the optical waveguide 1 and the optical connector 5 are brought close to each other so as to compress the resin composition 70. Thereby, the resin composition 70 is sandwiched between the optical waveguide 1 and the optical connector 5 and compressed, and a part overflows from between them. The overflowed resin composition 70 is stored in the cavity 81 of the forming die 8. As a result, as shown in FIG. 16(b), the resin composition 70 is spread between the optical waveguide 1 and the optical connector 5, and is formed by the cavity 81.

[3] Hardening step

Next, the formed resin composition 70 is cured. Thereby, the elastic body 7 shown in Fig. 8 can be obtained.

[4] demoulding step

Next, the forming die 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 8 can be obtained.

In the present embodiment as described above, the same effects as those of the first and second embodiments can be exhibited.

Further, in the present embodiment, since the elastic body 7 also functions as the optical waveguide 1 and the optical connector 5, the operation by the adhesive 6 can be omitted. Therefore, this embodiment is useful in that the manufacturing work can be further simplified.

"Fourth Embodiment"

Next, a method of manufacturing the optical wiring component shown in FIG. 8 will be described as a fourth embodiment of the method of manufacturing an optical wiring component according to the present invention.

FIG. 17 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 8 (a fourth embodiment of the method of manufacturing the optical wiring component of the present invention). In the following description, for convenience of explanation, the upper side of FIG. 17 is referred to as "upper". In FIG. 17, the same components as those of the above-described embodiment are denoted by the same reference numerals.

In the following, the fourth embodiment will be described. The following description focuses on differences from the first embodiment, and the description of the same matters will be omitted.

The method for manufacturing the optical wiring component 10 of the present embodiment includes: [1] a supply step of supplying the resin composition 70 in contact with the optical connector 5; [2] a method of compressing the resin composition 70 to form the optical waveguide 1 a forming step in which the optical connector 5 is adjacent to each other, and the resin composition 70 is formed by the forming die 8; [3] the resin composition 70 is hardened to obtain the elastic body 7, and the optical waveguide 1 is followed by the elastic body 7 and a hardening step of the optical connector 5; and [4] a demolding step of demolding the forming die 8. In other words, the position of the resin composition 70 is different in this embodiment, and is the same as that of the third embodiment. Hereinafter, each step will be described in detail.

[1] Supply step

First, as shown in FIG. 17(a), the resin composition 70 is supplied to the bottom surface 502 of the groove 50 of the optical connector 5. Thereby, the resin composition 70 is retained on the bottom surface 502.

On the other hand, the optical waveguide 1 is placed on the molding die 8.

[2] Forming step

Next, as shown in FIG. 17(a), the optical waveguide 1 is made by compressing the resin composition 70. It is close to the optical connector 5. Thereby, the resin composition 70 is sandwiched between the optical waveguide 1 and the optical connector 5 and compressed, and a part overflows from between them. The overflowed resin composition 70 is stored in the cavity 81 of the forming die 8. As a result, as shown in Fig. 17 (b), the resin composition 70 is spread between the optical waveguide 1 and the optical connector 5, and is formed by the cavity 81.

[3] Hardening step

Next, the formed resin composition 70 is cured. Thereby, the elastic body 7 shown in Fig. 8 can be obtained.

[4] demoulding step

Next, the forming die 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 8 can be obtained.

In the present embodiment as described above, the same effects as those of the first embodiment can be exhibited.

Further, in the present embodiment, since the elastic body 7 also functions as the optical waveguide 1 and the optical connector 5, the operation by the adhesive 6 can be omitted. Therefore, this embodiment is useful in that the manufacturing work can be further simplified.

<Electronic Machine>

As described above, the optical wiring component of the present invention as described above can suppress the decrease in the optical coupling efficiency accompanying the optical connection even when it is connected to other optical components. As a result, by providing the optical wiring component of the present invention, it is possible to obtain an electronic device (an electronic device of the present invention) which is highly reliable in performing high-quality optical communication.

Examples of the electronic device including the optical wiring component of the present invention include a smart phone, a tablet terminal, a mobile phone, a game machine, a router device, a wavelength division multiplexing (WDM) device, a personal computer, a television, a local server, and the like. Electronic machine class. In these electronic machines, It is necessary to transfer large-capacity data at high speed between a computing device such as a large integrated circuit (LSI) and a storage device such as a random access memory (RAM). By providing the optical wiring component of the present invention with such an electronic device, it is possible to eliminate the troubles such as interference and signal degradation that are peculiar to the electrical wiring, and it is expected that the performance can be drastically improved.

Further, in the optical waveguide portion, the amount of heat generation can be significantly reduced as compared with the electric wiring. Therefore, it is possible to reduce the power required for cooling, and it is possible to reduce the power consumption of the entire electronic device.

Although the optical wiring component, the optical wiring component manufacturing method, and the electronic device have been described above based on the illustrated embodiment, the present invention is not limited thereto.

For example, in the above embodiment, the optical connector is attached to one end of the optical waveguide, but the same optical connector may be attached to the other end, or an optical connector different from this may be mounted. Further, at the other end, various light-receiving light-emitting elements can be mounted instead of the optical connector. Further, any of the above embodiments may be added.

Further, the method of manufacturing the optical wiring component of the present invention further includes the step of replacing the steps in the above-described respective embodiments, and an arbitrary step can be added.

[Industrial availability]

An optical wiring component according to the present invention includes: a sheet-shaped optical waveguide including: a first main surface and a second main surface which are in a front-to-back relationship; and a light incident surface, wherein the first main surface is connected The surface is configured to be a part of the outer surface of the second main surface; the optical connector includes: the connector body including the first outer surface and the second outer surface facing each other; and the through hole or the groove, and the inner surface includes the inner surface a mounting surface of the first main surface of the optical waveguide is disposed to penetrate the first outer surface and the second outer surface; and the elastic body has translucency and elasticity, and the second main body of the optical waveguide The surface continuously covers the light incident surface, and the elastic coefficient is 0.01~1000 MPa; And an adhesive agent, wherein at least a part of the first main surface of the optical waveguide and the mounting surface, the elastic modulus of the cured product is larger than the elastic modulus of the elastic body. According to this, it is possible to provide an optical wiring component capable of achieving stable optical coupling efficiency with other optical components, a method of manufacturing an optical wiring component capable of efficiently manufacturing the optical wiring component, and a reliability of the optical wiring component. Gaozhi electronic machine. Thereby, the present invention has industrial applicability.

Claims (10)

An optical wiring component comprising: a sheet-shaped optical waveguide, comprising: a first main surface and a second main surface which are in a front-back relationship; and a first main surface and the second main surface a part of the outer side surface constitutes a light incident surface; the optical connector includes: a connector body including a first outer surface and a second outer surface facing each other; and a through hole or a groove, wherein the through hole or the groove is The inner surface includes a mounting surface on which the first main surface of the optical waveguide is placed, and penetrates the first outer surface and the second outer surface; the elastic body has translucency and elasticity, and the optical waveguide The second main surface continuously covers the light incident surface, and has an elastic modulus of 0.01 to 1000 MPa; and an adhesive, and at least a portion of the first main surface of the optical waveguide and the mounting surface, and The elastic modulus of the cured product of the subsequent agent is greater than the elastic modulus of the aforementioned elastomer. The optical wiring component according to claim 1, wherein the elastic system is formed to protrude from a plane including the first outer surface of the connector body. The optical wiring component according to the first aspect of the invention, wherein the optical waveguide is placed such that the light incident surface is located further away from the second outer surface than a plane including the first outer surface. The optical wiring component according to claim 1, wherein the optical connector further includes a retreating surface that connects a surface of the first outer surface of the connector main body and a bottom surface of the groove, and the ratio includes the foregoing The plane of the first outer surface is further toward the second outer surface Side deviation. The optical wiring component according to claim 4, wherein the elastic body further passes through the light incident surface from the second main surface, and continuously covers the retracted surface or the first outer surface. The optical wiring component according to claim 1, wherein a refractive index of a core portion of the optical waveguide is greater than 1.4; and a refractive index of the elastic body is between a refractive index of a core portion of the optical waveguide and 1.4. The optical wiring component according to claim 1, wherein the cured product of the adhesive has an elastic modulus of 1,000 to 20,000 MPa. A method of manufacturing an optical wiring component, comprising: manufacturing the optical wiring component of the first aspect of the invention, comprising: a step of preparing an optical waveguide having a connector attached to the optical waveguide and the optical connector; After the resin composition is disposed, the light incident surface of the optical waveguide is pressed against the resin composition, the resin composition is brought into close contact with the resin composition, and the resin composition is cured to obtain the elastomer. And a step of demolding the aforementioned forming mold. A method of manufacturing an optical wiring component, comprising: manufacturing the optical wiring component of the first aspect of the invention, comprising: a step of preparing an optical waveguide having a connector attached to the optical waveguide and the optical connector; a step of arranging the optical waveguide with the connector; and supplying a resin composition between the molding die and the light incident surface of the optical waveguide, and contacting the resin composition with the light incident surface and forming the resin composition step a step of hardening the resin composition to obtain the elastic body; and a step of demolding the forming mold. An electronic device characterized by having the optical wiring component of the first application of the patent scope.