JP6265255B2 - Optical wiring component manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an optical wiring component.

  In the optical waveguide, light introduced from one end of the core portion is conveyed to the other end while being reflected at the boundary with the cladding portion. A light emitting element such as a semiconductor laser is disposed on the incident side of the optical waveguide, and a light receiving element such as a photodiode is disposed on the emission side. Light incident from the light emitting element propagates through the optical waveguide, is received by the light receiving element, and performs communication based on the flickering pattern of the received light or its intensity pattern.

  By the way, an optical waveguide generally performs short-distance optical communication, whereas an optical fiber is used for long-distance optical communication. Therefore, by connecting these, it becomes possible to connect the local network and the backbone network.

  For the connection between the optical waveguide and the optical fiber, for example, a configuration in which the end face of the optical waveguide and the end face of the optical fiber are held in contact with each other is employed (see, for example, Patent Document 1). For this holding, a coupling mechanism that can be fitted to each other is used. Specifically, alignment pins are provided for both the fitting hole provided in the first ferrule holding the end of the optical waveguide and the fitting hole provided in the second ferrule holding the end of the optical fiber. By being inserted, the optical waveguide and the optical fiber are optically coupled.

JP 2011-75688 A

  When the optical waveguide and the optical fiber are optically coupled in this way, if there is a gap between them, the reflectance between each medium and the gap increases. As a result, there is a high probability that light to be propagated from the optical waveguide side to the optical fiber side is reflected and returned to the optical waveguide side again. As a result, the amount of light transmitted to the optical fiber side is reduced, leading to a decrease in optical coupling efficiency. Further, the return light generated by the reflection causes a problem of destabilizing the light emitting element.

  An object of the present invention is to provide an optical wiring component manufacturing method capable of efficiently manufacturing an optical wiring component capable of realizing stable optical coupling efficiency with other optical components.

Such an object is achieved by the present inventions (1) to (9) below.
(1) A first main surface and a second main surface that are in a front-back relationship with each other, and a light incident / exit surface configured by a part of an outer surface that connects the first main surface and the second main surface, A sheet-like optical waveguide provided;
A connector body including a first outer surface and a second outer surface facing each other; a mounting surface on which the first main surface of the optical waveguide is mounted; and the first outer surface and the second outer surface. An optical connector comprising a through-hole or a groove penetrating;
An elastic body having translucency and elasticity, and continuously covering from the second main surface of the optical waveguide to the light incident / exit surface;
A method of manufacturing an optical wiring component having
Preparing an optical waveguide with a connector comprising the optical waveguide and the optical connector;
After placing the resin composition on the molding die, pressing the light incident / exit surface of the optical waveguide against the resin composition, and closely molding the resin composition;
Curing the resin composition to obtain the elastic body;
Releasing the mold; and
A method of manufacturing an optical wiring component, comprising:

(2) The optical wiring component further includes an adhesive that bonds between the optical waveguide and the mounting surface.
The method for manufacturing an optical wiring component according to the above (1), wherein the elastic modulus of the adhesive is larger than the elastic modulus of the elastic body.

(3) a first main surface and a second main surface that are in a relationship of front and back, and a light incident / exit surface composed of a part of an outer surface that connects the first main surface and the second main surface; A sheet-like optical waveguide provided;
A connector body including a first outer surface and a second outer surface facing each other; a mounting surface on which the first main surface of the optical waveguide is mounted; and the first outer surface and the second outer surface. An optical connector comprising a through-hole or a groove penetrating;
It has translucency and elasticity, continuously covers from the second main surface of the optical waveguide to the light incident / exit surface, and has a function of being provided between the optical waveguide and the optical connector and bonding them. An elastic body having,
A method of manufacturing an optical wiring component having
Supplying a resin composition in contact with the optical waveguide;
A step of bringing the optical waveguide and the optical connector close to each other so as to compress the resin composition, and molding the resin composition with a mold;
Curing the resin composition to obtain the elastic body, and bonding the optical waveguide and the optical connector through the elastic body;
A method of manufacturing an optical wiring component, comprising:

(4) a first main surface and a second main surface that are in a relationship of front and back, and a light incident / exit surface configured by a part of an outer surface that connects the first main surface and the second main surface; A sheet-like optical waveguide provided;
A connector body including a first outer surface and a second outer surface facing each other; a mounting surface on which the first main surface of the optical waveguide is mounted; and the first outer surface and the second outer surface. An optical connector comprising a through-hole or a groove penetrating;
It has translucency and elasticity, continuously covers from the second main surface of the optical waveguide to the light incident / exit surface, and has a function of being provided between the optical waveguide and the optical connector and bonding them. An elastic body having,
A method of manufacturing an optical wiring component having
Supplying a resin composition in contact with the optical connector;
A step of bringing the optical waveguide and the optical connector close to each other so as to compress the resin composition, and molding the resin composition with a mold;
Curing the resin composition to obtain the elastic body, and bonding the optical waveguide and the optical connector through the elastic body;
A method of manufacturing an optical wiring component, comprising:

  (5) The method for manufacturing an optical wiring component according to any one of (1) to (4), wherein the elastic body is molded so as to protrude from a plane including the first outer surface of the connector body.

  (6) The optical waveguide according to (1) to (5), wherein the light incident / exit surface is placed so as to be shifted from the plane including the first outer surface toward the second outer surface. The manufacturing method of the optical wiring component in any one.

  (7) The optical connector is a surface that connects the first outer surface of the connector body and the mounting surface, and is a receding surface that is shifted to the second outer surface side from a plane including the first outer surface. A method for manufacturing an optical wiring component according to any one of (1) to (6), comprising:

  (8) The optical wiring component according to (7), wherein the elastic body is formed so as to continuously cover from the second main surface through the light incident / exit surface to the receding surface or the first outer surface. Method.

(9) The refractive index of the core portion of the optical waveguide is greater than 1.4,
The optical wiring component manufacturing method according to any one of (1) to (8), wherein a refractive index of the elastic body is between 1.4 and a refractive index of a core portion of the optical waveguide.

  ADVANTAGE OF THE INVENTION According to this invention, the optical wiring component which can implement | achieve the stable optical coupling efficiency between other optical components can be manufactured efficiently.

It is a perspective view which shows 1st Embodiment of the optical wiring component of this invention. FIG. 2 is a plan view of a surface facing another optical component in the optical connector shown in FIG. 1 and a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a sectional view taken along line B-B in FIG. 2. It is a perspective view which shows only the optical connector contained in the optical wiring component shown in FIG. 5 is a plan view of a surface facing another optical component in the optical connector shown in FIG. 4 and a cross-sectional view taken along the line CC of FIG. It is a figure which shows the modification of the optical wiring component and optical connector shown in FIGS. FIG. 4 is a partially enlarged perspective view showing a part of an optical waveguide included in the optical wiring component shown in FIG. 3. It is sectional drawing which shows 2nd Embodiment of the optical wiring component of this invention. It is sectional drawing which shows 3rd Embodiment of the optical wiring component of this invention. It is a figure for demonstrating the method (1st Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (1st Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (1st Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (1st Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (2nd Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (The modification of 2nd Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (3rd Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG. It is a figure for demonstrating the method (4th Embodiment of the manufacturing method of the optical wiring component of this invention) which manufactures the optical wiring component shown in FIG.

DESCRIPTION OF EMBODIMENTS Hereinafter, an optical wiring component, a method for manufacturing an optical wiring component, and an electronic apparatus according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<Optical wiring parts>
<< First Embodiment >>
First, a first embodiment of the optical wiring component of the present invention will be described.

  FIG. 1 is a perspective view showing a first embodiment of an optical wiring component according to the present invention. FIG. 2 is a plan view of a surface of the optical connector shown in FIG. FIG. 3 is a cross-sectional view taken along line -A, and FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is a perspective view showing only the optical connector included in the optical wiring component shown in FIG. 1, and FIG. 5 is a plan view of a surface of the optical connector shown in FIG. It is CC sectional view taken on the line of FIG. In the following description, for the sake of convenience of explanation, the upper part of FIGS.

  An optical wiring component 10 shown in FIG. 1 has an optical waveguide 1 and an optical connector 5 provided at an end of the optical waveguide 1.

  The optical waveguide 1 shown in FIG. 1 has a strip shape (sheet shape) having a long shape and a cross-sectional shape whose thickness is smaller than the width. In the optical waveguide 1, an optical signal can be transmitted between one end and the other end in the longitudinal direction.

  In each drawing of the present application, only the vicinity of one end of the optical waveguide 1 is illustrated in the optical wiring component 10, and other portions are not illustrated. In the optical wiring component 10, the configuration other than the vicinity of one end of the optical waveguide 1 is not particularly limited. In this specification, the left end portion of the optical waveguide 1 in FIG. 2B is also referred to as a “tip portion 101”, and the left end face is also referred to as a “tip surface 102”. Further, among the upper and lower surfaces of the optical waveguide 1 in FIG. 2B that are in a front-back relationship, the lower surface is also referred to as “lower surface 103 (first main surface)” and the upper surface is also referred to as “upper surface 104 (second main surface)”. Say.

  As shown in FIG. 2B, such an optical waveguide 1 includes a laminate in which a clad layer 11, a core layer 13, and a clad layer 12 are laminated in this order from below. In addition, as shown in FIG. 3, eight long core portions 14 provided in parallel and side clad portions 15 adjacent to the side surfaces of the core portions 14 are formed on the core layer 13. ing. In FIG. 3, the core layer 13 of the optical waveguide 1 is seen through.

  These core portions 14 function as a transmission path for transmitting an optical signal in the optical waveguide 1. The front end surface 102 of each core portion 14 is a part of the outer surface connecting the lower surface 103 and the upper surface 104, and is also a light incident / exit surface that can be optically coupled to each core portion 14.

  As shown in FIG. 1, an optical connector 5 is provided at the distal end portion 101 of the optical waveguide 1 so as to cover the lower surface of the distal end portion 101. That is, the optical connector 5 includes a connector main body 51 and a groove 50 formed in the connector main body 51, and the distal end portion 101 of the optical waveguide 1 is inserted into the groove 50.

  The left end surface of the optical connector 5 in FIGS. 2B and 5B is a surface facing the optical component when the optical wiring component 10 is optically connected to another optical component. In this specification, the left end surface of the optical connector 5 in FIGS. 2B and 5B is referred to as “opposing surface 52”, and the right end surface of the optical connector 5 in FIGS. 2B and 5B. Is referred to as “non-facing surface 53”. In other words, the optical connector 5 includes a connector body 51, a facing surface 52 provided in the connector body 51, a non-facing surface 53 provided in the connector body 51, a groove 50 formed in the connector body 51, It has.

  The groove 50 is formed so as to penetrate the opposing surface 52 (first outer surface) and the non-facing surface 53 (second outer surface) of the connector body 51. Moreover, the groove | channel 50 is comprised so that it may have a cut surface which makes a rectangle, when cut | disconnected along the direction orthogonal to the longitudinal direction.

  The bottom surface 502 of the groove 50 is a mounting surface on which the optical waveguide 1 is mounted. The optical waveguide 1 is bonded to the bottom surface 502 via the adhesive 6.

  Further, the elastic body 7 is provided so as to continuously cover from the front end surface 102 to the upper surface 104 of the optical waveguide 1. The elastic body 7 has translucency and elasticity, and has a function of protecting the tip surface 102 that is a light incident / exit surface. For this reason, when the optical wiring component 10 and other optical components are optically connected, it is possible to prevent the tip surface 102 of the optical waveguide 1 from being greatly damaged. In addition, even if the elastic body 7 is brought into contact with another optical component, the other optical component is not easily damaged, so that the optical wiring component 10 and the other optical component can be pressed against each other with sufficient force. Become.

  Furthermore, since the elastic body 7 is in close contact with other optical components and easily deforms following the shape thereof, a gap is hardly formed between the elastic body 7 and the other optical components. As a result, the occurrence of Fresnel reflection due to the gap is suppressed, and a decrease in optical coupling efficiency due to reflection loss can be suppressed. For this reason, the optical wiring component 10 can implement | achieve the stable optical coupling efficiency between other optical components.

  Further, the optical waveguide 1 may have a distal end surface 102 located in the same plane as the facing surface 52 of the optical connector 5 or may protrude from a plane including the facing surface 52 (on the non-facing surface 53 side). 2 may be located on the opposite side), but in FIG. 2B, it is retracted from the plane including the facing surface 52 (located on the non-facing surface 53 side). As a result, a part of the groove 50 exists in the vicinity of the front end face 102. When the elastic body 7 enters a part of the groove 50, the elastic body 7 has a sufficient thickness in the normal direction of the front end surface 102. As a result, the compression width when the elastic body 7 is compressed can be sufficiently secured, and the function of protecting the distal end surface 102 can be further enhanced.

Hereinafter, the configuration of the optical wiring component 10 will be further described in detail.
(Optical connector)
As described above, the optical connector 5 includes the connector main body 51 and the groove 50 formed in the connector main body 51.

  The optical waveguide 1 is bonded to the bottom surface 502 via the adhesive 6 as described above. Thereby, the optical waveguide 1 is fixed in the state inserted in the groove 50. As a result, since the optical waveguide 1 can be protected from external force or the like, it is possible to more reliably suppress a decrease in optical coupling efficiency between the optical wiring component 10 and other optical components.

  The groove 50 is formed so as to penetrate the connector main body 51, and opens in the facing surface 52 (first outer surface) and the non-facing surface 53 (second outer surface) of the optical connector 5. That is, the groove 50 penetrates so as to connect the facing surface 52 and the non-facing surface 53.

  The cross-sectional shape of the groove 50 (cut surface shape in the direction orthogonal to the line connecting the openings) is not limited to the rectangle as described above, and may be a square, a parallelogram, a hexagon, an octagon. Other shapes such as oval may be used.

  Further, when the width of the optical waveguide 1 (the length in the direction perpendicular to the longitudinal direction of the core portion 14) is W, the width W1 of the groove 50 is preferably set wider than the width W of the optical waveguide 1. Thereby, a gap can be provided between the side surface of the distal end portion 101 of the optical waveguide 1 and the inner surface of the groove 50. As a result, the adhesive 6 can be allowed to protrude into this space, so that the overflowing adhesive 6 can be prevented from entering the tip surface 102.

  In this case, the width W1 of the groove 50 is preferably about 1.01W to 3W, and more preferably about 1.1W to 2W. Thereby, the effect mentioned above can be heightened more. Further, even when a volume change occurs in the adhesive 6 or the optical waveguide 1 due to a change in the environment in which the optical wiring component 10 is placed, the volume change is absorbed by the gap between the optical waveguide 1 and the groove 50. be able to. For this reason, it is possible to prevent a large stress from being generated along with the volume change, and to prevent a decrease in transmission efficiency of the optical waveguide 1 due to the stress concentration.

  Further, the outer shape of the connector main body 51 is not particularly limited, and may be a substantially rectangular parallelepiped as shown in FIGS. Further, the connector main body 51 may include a part conforming to various connector standards. Examples of such connector standards include a miniature MT connector, an MT connector specified in JIS C 5981, a 16MT connector, a two-dimensional array MT connector, an MPO connector, and an MPX connector.

  As shown in FIGS. 1 and 4, two guide holes 511 are formed in the connector main body 51 of the optical connector 5 according to this embodiment. The guide hole 511 is opened in the opposing surface 52 (first outer surface) and in the non-facing surface 53 (second outer surface) of the connector main body 51. That is, the two guide holes 511 penetrate so as to connect the first outer surface and the second outer surface, respectively.

  In these guide holes 511, guide pins (not shown) are inserted when the optical wiring component 10 is connected to other optical components. Thereby, when aligning the optical wiring component 10 and other optical components, the positions of each other can be more accurately aligned, and both can be fixed to each other. That is, the guide hole 511 functions as a connection mechanism for connecting the optical wiring component 10 to other optical components.

  Note that the guide hole 511 does not pass through the connector body 51 and does not have to be opened in a plane including the non-facing surface 53.

  Further, instead of the connection mechanism, a locking mechanism using locking by a claw, an adhesive, or the like may be used.

  Further, the shape of the groove 50 is not limited to the illustrated shape. For example, in the optical connector 5 shown in FIG. 2, the depth of the groove 50 is constant. For example, the groove 50 may be gradually deepened from the facing surface 52 side toward the non-facing surface 53 side.

  Examples of the constituent material of the connector body 51 include various resin materials such as phenol resin, epoxy resin, olefin resin, urea resin, melamine resin, unsaturated polyester resin, polyphenylene sulfide resin, stainless steel, and the like. And various metal materials such as an aluminum alloy.

  The connector main body 51 shown in FIGS. 1 and 2 is a surface connecting the facing surface 52 (first outer surface) and the bottom surface 502 of the groove 50, and is a non-facing surface 53 (second surface) than a plane including the facing surface 52. It has a receding surface 504 that is offset to the outer surface) side.

  By providing such a receding surface 504, a space is formed as much as the receding surface 504 recedes (displaces) from the plane including the opposing surface 52. Such a space becomes a room for the elastic body 7 to enter, for example. When the elastic body 7 enters, the tip surface (surface on the other optical component side) of the optical wiring component 10 can occupy more area by the elastic body 7. For this reason, when connecting the optical wiring component 10 and another optical component, it can prevent that the relatively hard connector main body 51 and another optical component contact directly. Thereby, damage to other optical components can be suppressed.

  Further, when the elastic body 7 enters, the elastic body 7 can contact not only the tip surface 102 and the upper surface 104 of the optical waveguide 1 but also the connector main body 51. Moreover, since the receding surface 504 is positioned below the optical waveguide 1 as shown in FIG. 2B, it is elastic so as to continuously cover from the upper surface 104 of the optical waveguide 1 to the receding surface 504 through the tip surface 102. A body 7 can be provided. As a result, the elastic body 7 can be more firmly attached to both the optical waveguide 1 and the optical connector 5. As a result, it becomes difficult to form a gap between the elastic body 7 and the optical waveguide 1, and a decrease in optical transmission efficiency during this period can be suppressed.

  The receding surface 504 is not limited to a flat surface as shown in FIGS. Examples of the shape that can replace the flat surface include a curved surface shape that is curved so as to protrude or dent, a step shape that forms a step shape, and the like.

  Further, the retraction amount L1 of the receding surface 504, that is, the distance between the plane including the facing surface 52 and the plane parallel to the facing surface 52 passing through the portion of the receding surface 504 closest to the non-facing surface 53 is not particularly limited. However, it is preferably about 10 to 1000% of the thickness of the optical waveguide 1, and more preferably about 30 to 500%. As a result, an area sufficient for the elastic body 7 to be in close contact with the receding surface 504 is secured, and the area of the bottom surface 502 of the groove 50 is reduced by the provision of the receding surface 504, so that the optical waveguide 1 is placed. Can be prevented from becoming unstable.

  That is, when the retraction amount L1 is less than the lower limit value, depending on the size of the optical connector 5, a sufficient area cannot be secured on the retraction surface 504, or the thickness of the elastic body 7 in the vicinity of the retraction surface 504 is reduced. There is a risk that it cannot be secured sufficiently. On the other hand, if the retraction amount L1 exceeds the upper limit, depending on the size of the optical connector 5, the area of the bottom surface 502 is reduced by the amount of the retraction surface 504, so the area where the optical waveguide 1 is not placed increases. Mounting may become unstable.

  Furthermore, the thickness L2 of the receding surface 504, that is, the distance between the plane including the bottom surface 502 of the groove 50 and the plane parallel to the bottom surface 502 passing through the portion of the receding surface 504 closest to the facing surface 52 is not particularly limited. However, it is preferably about 10 to 1000% of the thickness of the optical waveguide 1, and more preferably about 30 to 500%. Also in this case, a sufficient area for the elastic body 7 to adhere to the receding surface 504 is ensured, and the effect of suppressing damage to other optical components can be fully enjoyed.

  Further, in the optical wiring component 10 shown in FIG. 2B, the tip surface 102 of the optical waveguide 1 is retracted (shifted) to the non-facing surface 53 side from the plane including the facing surface 52. Only a space is formed. Such a space also becomes a room for the elastic body 7 to enter, for example. When the elastic body 7 enters, the elastic body 7 having a sufficient volume (thickness) is disposed between the tip surface 102 of the optical waveguide 1 and another optical component. For this reason, when connecting the optical wiring component 10 and another optical component, it can relieve | moderate that a big load is added with respect to the optical waveguide 1. FIG. In other words, even if a large load is applied to the optical wiring component 10, it is possible to make it difficult to deform the vicinity of the distal end surface 102 of the optical waveguide 1. Thereby, damage to the optical waveguide 1 can be suppressed, and a decrease in optical coupling efficiency between the optical wiring component 10 and other optical components can be suppressed.

  From the above viewpoint, when the bottom surface 502 of the groove 50 is viewed in plan, the optical waveguide 1 may overlap the receding surface 504, but preferably does not overlap. Thereby, the elastic body 7 covers the receding surface 504 and also covers the tip surface 102 of the optical waveguide 1 with a sufficient thickness. As a result, the effects as described above become more prominent.

  Moreover, the optical connector 5 may have an arbitrary configuration added to the configuration shown in FIGS.

  FIG. 6 is a view showing a modification of the optical wiring component and the optical connector shown in FIGS. This modification is the same as the optical wiring component and the optical connector shown in FIGS. 1 to 3 except that the following matters are different.

  As shown in FIG. 6, in the optical connector 5 according to the modification, the connector main body 51 is composed of an assembly in which a base 51a and a lid 51b are assembled. In addition, illustration of the elastic body 7 is abbreviate | omitted in FIG.

  In this modification, as shown by an arrow in FIG. 6, the lid 51b is accommodated in the groove 50 provided in the base 51a. That is, the opening above the groove 50 is closed by the lid 51b. At this time, the lid 51b may be in contact with the elastic body 7 or may not be in contact.

  When the lid 51b is in contact with the elastic body 7, the base 51a and the lid 51b may be fixed to each other or may be separated from each other.

  On the other hand, when the lid body 51b is not in contact with the elastic body 7, the base body 51a and the lid body 51b may be fixed to each other. For this fixing, for example, an adhesive or the like can be used.

(Optical waveguide)
FIG. 7 is a partially enlarged perspective view showing a part of an optical waveguide included in the optical wiring component shown in FIG. In FIG. 7, for convenience of explanation, the vicinity of the two core portions 14 in the optical waveguide 1 shown in FIG.

  The two core parts 14 shown in FIG. 7 are each surrounded by a clad part (side clad part 15 and clad layers 11 and 12), and can confine light in the core part 14 and propagate.

  The refractive index distribution in the cross section of the core portion 14 may be any distribution. This refractive index distribution may be a so-called step index (SI) type distribution in which the refractive index changes discontinuously, or a so-called graded index (GI) type distribution in which the refractive index changes continuously. May be.

  Further, the optical waveguide 1 and the core portion 14 formed therein may be linear or curved in a plan view. Furthermore, the optical waveguide 1 and the core part 14 formed therein may be branched or intersected in the middle.

  The cross-sectional shape of the core portion 14 is not particularly limited, and may be a circle such as a perfect circle, an ellipse, or an oval, or a polygon such as a triangle, a quadrangle, a pentagon, or a hexagon. By being (rectangular), there is an advantage that the core portion 14 can be easily formed.

  The width and height of the core portion 14 (thickness of the core layer 13) are not particularly limited, but are preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and about 10 to 70 μm. More preferably. Thereby, it is possible to increase the density of the core portion 14 while suppressing a decrease in the transmission efficiency of the optical waveguide 1.

  On the other hand, as shown in FIG. 7, when a plurality of core portions 14 are arranged in parallel, the width of the side cladding portion 15 located between the core portions 14 is preferably about 5 to 250 μm, preferably 10 to 200 μm. More preferably, it is about 10 to 120 μm. Thereby, it is possible to increase the density of the core portion 14 while preventing the optical signals from being mixed (crosstalk) between the core portions 14.

  The constituent material (main material) of the core layer 13 as described above is, for example, acrylic resin, methacrylic resin, polycarbonate, polystyrene, cyclic ether resin such as epoxy resin or oxetane resin, polyamide, polyimide, poly Benzoxazole, polysilane, polysilazane, silicone resin, fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, polyether, benzocyclo In addition to various resin materials such as cyclic olefin resins such as butene resin and norbornene resin, glass materials such as quartz glass and borosilicate glass can be used. Note that the resin material may be a composite material in which materials having different compositions are combined.

  Further, as the constituent material of the cladding layers 11 and 12, for example, the same material as the constituent material of the core layer 13 described above can be used, and in particular, (meth) acrylic resin, epoxy resin, silicone resin, It is preferably at least one selected from the group consisting of polyimide resins, fluorine resins, and polyolefin resins.

  The entire optical waveguide 1 is preferably made of a resin material. Thereby, the optical waveguide 1 becomes rich in flexibility, and the mounting operation is facilitated.

  Although the width | variety of the optical waveguide 1 is not specifically limited, It is preferable that it is about 1-100 mm, and it is more preferable that it is about 2-10 mm.

  Moreover, the number of the core parts 14 formed in the optical waveguide 1 is not particularly limited, but is preferably about 1 to 100. When the number of core portions 14 is large, the optical waveguide 1 may be multilayered as necessary. Specifically, the optical waveguide 1 shown in FIG. 7 can be multilayered by alternately stacking core layers and cladding layers.

  Although not shown in FIG. 2, the optical waveguide 1 shown in FIG. 7 further includes a support film 2 as the lowermost layer and a cover film 3 as the uppermost layer.

  Examples of the constituent material of the support film 2 and the cover film 3 include various resin materials such as polyethylene terephthalate (PET), polyolefin such as polyethylene and polypropylene, polyimide, and polyamide.

  Moreover, although the average thickness of the support film 2 and the cover film 3 is not specifically limited, It is preferable that it is about 5-500 micrometers, and it is more preferable that it is about 10-400 micrometers. Thereby, since the support film 2 and the cover film 3 have moderate rigidity, the core layer 13 is reliably supported and the core layer 13 and the clad layers 11 and 12 are reliably protected from external force and external environment. can do.

  In addition, the support film 2 and the cover film 3 should just be provided as needed, respectively, and may be abbreviate | omitted.

(adhesive)
Examples of the adhesive 6 include an epoxy adhesive, an acrylic adhesive, a urethane adhesive, a silicone adhesive, an olefin adhesive, and various hot melt adhesives (polyester and modified olefin). .

  The elastic modulus of the cured product of the adhesive 6 is preferably about 1000 to 20000 MPa, more preferably about 300 to 15000 MPa, still more preferably about 500 to 12500 MPa, and particularly preferably about 1000 to 10,000 MPa. . By setting the elastic modulus of the cured product of the adhesive 6 within the above range, the optical waveguide 1 is more securely fixed to the optical connector 5 and the concentration of thermal stress or the like in the optical waveguide 1 is suppressed. In addition, an increase in transmission loss can be suppressed.

  The elastic modulus of the adhesive 6 is measured at a temperature of 25 ° C. in accordance with the method defined in JIS K 7127.

  Moreover, it is preferable that the glass transition temperature of the hardened | cured material of the adhesive agent 6 is about 30-260 degreeC, and it is more preferable that it is about 35-200 degreeC. By setting the glass transition temperature of the cured product of the adhesive 6 within the above range, the heat resistance of the optical wiring component 10 can be further increased.

  In addition, the glass transition temperature of the hardened | cured material of the adhesive agent 6 can be measured by the dynamic viscoelasticity measuring method (DMA method).

  Further, the adhesive 6 does not need to be provided on the entire bottom surface 502 of the groove 50, and for example, there may be a part where the adhesive 6 is not partially provided.

  The adhesive 6 may be in a liquid state or a solid state before being cured. The adhesive 6 that is solid before curing has a thermosetting resin as a main component. Examples of such thermosetting resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, bisphenol type epoxy resins such as bisphenol S type epoxy resins, phenol novolac type epoxy resins, and cresol novolak types. In addition to various epoxy resins such as novolak type epoxy resins such as epoxy resins, aromatic epoxy resins such as trisphenolmethane triglycidyl ether, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, and the like such as polyimide and polyamideimide Examples thereof include imide resins, silicone resins, phenol resins, urea resins, and the like, and one or more of them can be used in combination.

(Elastic body)
As described above, the elastic body 7 has translucency and elasticity, and continuously covers from the distal end surface 102 to the upper surface 104 of the optical waveguide 1.

  Here, translucency refers to a property having transparency at the wavelength of light incident on the optical waveguide 1. In the present invention, when light having a wavelength of 850 nm is incident on the elastic body 7, it refers to a state where the insertion loss is 2 dB or less and is referred to as “having translucency”.

  Elasticity refers to the property of deforming when an external force is applied and restoring to its original shape when the external force is removed. In the present invention, the term “having elasticity” refers to a state where the tensile strength is 0.3 MPa or more and the elastic modulus is 0.01 to 1000 MPa.

  Since the elastic body 7 continuously covers from the tip surface 102 to the upper surface 104 of the optical waveguide 1, a sufficiently large contact area between the elastic body 7 and the optical waveguide 1 can be ensured. As a result, the elastic body 7 can be more reliably fixed.

  Further, as described above, since the elastic body 7 is also in contact with the receding surface 504 of the connector main body 51, the contact area of the elastic body 7 can be further increased.

  In addition, the elastic body 7 may be in contact with the side surface of the groove 50 as shown in FIG. When in contact, the contact area between the elastic body 7 and the connector main body 51 can be increased. Further, when not in contact, the contact area between the elastic body 7 and the connector main body 51 can be reduced. For example, even when the elastic body 7 is thermally expanded, stress is thereby generated in the optical waveguide 1. It becomes difficult.

  Further, as shown in FIG. 2B, the elastic body 7 is molded so as to protrude from a plane including the opposing surface 52 of the connector main body 51 (projecting to the opposite side to the non-facing surface 53). Is preferred. Thus, the elastic body 7 comes into contact with the other optical components before the optical connector 5 when connecting the optical wiring component 10 and the other optical components. The gap between the two is gradually filled while the elastic body 7 is deformed by gradually reducing the distance between the two. At this time, since the elastic body 7 is compressed and deforms following it, it is difficult for air to remain at the connection interface, thereby suppressing a decrease in optical coupling efficiency (an increase in reflection loss) due to Fresnel reflection. it can.

  The elastic body 7 does not necessarily protrude from the plane including the facing surface 52, may be in the same plane as the facing surface 52, and retreats from the plane including the facing surface 52 to the non-facing surface 53 side. It may be. Even in these cases, the elastic body 7 can achieve the above effect by following the shape of other optical components. Therefore, the shape of the elastic body 7 is appropriately selected according to the shape of the other optical component.

  Moreover, the elastic body 7 does not necessarily need to contact another optical component. That is, when connecting the optical wiring component 10 and another optical component, the elastic body 7 and the other optical component may be connected in a separated state. In this case, the elastic body 7 functions as an optical element depending on the shape of the interface with the outside air. An example of such an optical element is a convex lens. That is, when the elastic body 7 has a convex curved surface, the elastic body 7 has a function of a convex lens.

  Since such an elastic body 7 can focus light, it contributes to increasing the optical coupling efficiency between the optical wiring component 10 and other optical components. Thereby, the optical coupling efficiency can be further increased.

  The protruding length L3 of the elastic body 7 (the distance between the tip of the elastic body 7 and the plane including the facing surface 52) is not particularly limited, but is about 0.1 to 500% of the thickness of the optical waveguide 1. Is preferable, and it is more preferable that it is about 0.5 to 200%. Thereby, when the elastic body 7 hits another optical component, a projection length sufficient to change following the shape is secured. For this reason, it becomes possible to suppress more that air remains in a connection interface, and it can suppress more reliably the fall of optical coupling efficiency.

  Further, as shown in FIG. 2B, the elastic body 7 is preferably molded so as to include a shape that rises upward (on the side opposite to the bottom surface 502 of the groove 50). By including such a shape, it becomes easy to disperse the stress generated in the elastic body 7, so that it is possible to avoid applying a large stress to the optical waveguide 1 locally. As a result, an increase in transmission loss of the optical waveguide 1 due to stress concentration can be suppressed.

  The rising height L4 of the elastic body 7 (the maximum distance between the top of the elastic body 7 and the optical waveguide 1) is not particularly limited, but is about 1 to 5000% of the thickness of the optical waveguide 1. Preferably, it is about 5 to 2000%. This makes it easier to disperse the stress generated in the elastic body 7, so that the stress applied to the optical waveguide 1 is reduced to a smaller extent, and the increase in transmission loss of the optical waveguide 1 due to the stress concentration is more reliably achieved. Can be suppressed.

  Examples of the constituent material of the elastic body 7 include transparent polyamide, polyolefin, fluororesin, polyester, (meth) acrylic resin, plastic resin such as polycarbonate, epoxy resin, oxetane resin, vinyl ether resin, melamine resin. , Phenolic resins, silicone resins, curable resins such as transparent polyimide, and the like, and materials containing one or more of these are used.

  The elastic body 7 may be made of styrene, polyolefin, polyvinyl chloride, polyurethane, polyester, polyamide, polybutadiene, trans polyisoprene, fluoro rubber, chlorinated as necessary. Various thermoplastic elastomers such as polyethylene may be contained.

  The constituent material of the elastic body 7 may be a thermosetting (heat-setting) material, but a photo-setting (photo-setting) material is preferably used. Such a material can be efficiently formed in a short time when the elastic body 7 is formed. For this reason, the elastic body 7 excellent in dimensional accuracy is obtained.

  As described above, when the light having a wavelength of 850 nm is incident on the elastic body 7, the insertion loss of the elastic body 7 is 2 dB or less, but preferably 1.5 dB or less. Such an elastic body 7 can suppress a decrease in transmission efficiency even when it is interposed between the optical waveguide 1 and another optical component. For this reason, the optical coupling efficiency between the optical wiring component 10 and another optical component can fully be improved.

  The insertion loss of the elastic body 7 is, for example, 4.6.1 insertion in a polymer optical waveguide test method (JPCA-PE02-05-01S-2008), which is a standard created by the Japan Electronic Circuits Association. It can be measured according to the loss measurement method.

  As described above, the elasticity of the elastic body 7 has a tensile strength of 0.3 MPa or more and an elastic modulus of 0.01 to 1000 MPa, preferably a tensile strength of 1 MPa or more, and The elastic modulus satisfies 0.1 to 300 MPa, more preferably the tensile strength is 5 MPa or more, and the elastic modulus satisfies 0.5 to 100 MPa. Such an elastic body 7 is interposed between the optical waveguide 1 and other optical components, and when subjected to a compressive force from both, it deforms relatively easily and follows both shapes and is plastically deformed. Is difficult to produce.

  If the tensile strength of the elastic body 7 is lower than the lower limit, the elastic body 7 may be damaged depending on the magnitude of the load when a load is applied to the elastic body 7. Further, when the elastic modulus of the elastic body 7 is lower than the lower limit value, the elastic body 7 is very easily deformed and may be deformed even by its own weight. On the other hand, if the elastic modulus of the elastic body 7 exceeds the upper limit value, the elastic body 7 is difficult to deform and the shape may not easily follow other optical components.

  The tensile strength of the elastic body 7 can be measured in accordance with, for example, a test method for tensile properties of plastics defined in JIS K 7127: 1999.

  The elastic modulus of the elastic body 7 is, for example, a storage elastic modulus E ′ measured at a frequency of 1 Hz and a measurement temperature of 23 ° C. by a dynamic viscoelasticity measuring device using a test piece of 20 mm long × 20 mm wide × 1 mm thick. As required. Examples of the dynamic viscoelasticity measuring apparatus include RSAIII manufactured by TA Instruments, DMS210 and DMS6100 manufactured by SII NanoTechnology.

  Further, the elastic modulus of the adhesive 6 is preferably larger than the elastic modulus of the elastic body 7. Thereby, the adhesive 6 becomes relatively difficult to deform. For this reason, for example, even when the elastic body 7 receives a compressive force and the compressive force is applied to the adhesive 6, the adhesive 6 is not easily deformed, so that the positional relationship between the optical waveguide 1 and the optical connector 5 is difficult to change. Become. As a result, the positional accuracy of the optical waveguide 1 with respect to the optical connector 5 can be maintained high, and the optical coupling efficiency between the optical wiring component 10 and other optical components can be maintained high.

  The refractive index of the elastic body 7 is preferably between 1.4 and the refractive index of the core portion 14 of the optical waveguide 1. Since the refractive index of the elastic body 7 is within such a range, the refractive index difference between the optical waveguide 1 and the elastic body 7 and between the elastic body 7 and another optical component (for example, an optical fiber). It is possible to suppress the reflection loss associated with. Thereby, the optical coupling efficiency between the optical wiring component 10 and another optical component can be improved more.

  Since the refractive index of the core of the optical fiber is normally about 1.46, the refractive index of the elastic body 7 is preferably between the refractive index of the core portion 14 and 1.46. .

  If the other optical component is other than an optical fiber, the refractive index of the elastic body 7 should be between the refractive index of the core portion 14 of the optical waveguide 1 and the refractive index of the other optical component. preferable. Thereby, the optical coupling efficiency between the optical wiring component 10 and another optical component can be improved more.

  Further, as shown in FIG. 2B, the adhesive 6 is preferably located on the proximal end side (on the non-opposing surface 53 side of the optical connector 5) with respect to the distal end face 102 of the optical waveguide 1. As a result, a gap having a thickness corresponding to the thickness of the adhesive 6 is formed between the optical waveguide 1 and the bottom surface 502 in the vicinity of the front end surface 102 of the optical waveguide 1. Since the elastic body 7 can enter the gap, the elastic body 7 can be more firmly adhered by the anchor effect. As a result, the reliability of the optical wiring component 10 can be further increased.

  The surface of the elastic body 7 may be subjected to a surface treatment as necessary. Examples of the surface treatment include surface modification treatment such as liquid repellent treatment, film formation treatment such as low reflection coating and protective coating.

<< Second Embodiment >>
Next, a second embodiment of the optical wiring component of the present invention will be described.
FIG. 8 is a cross-sectional view showing a second embodiment of the optical wiring component of the present invention.

  Hereinafter, although 2nd Embodiment is described, in the following description, it demonstrates centering around difference with 1st Embodiment, The description is abbreviate | omitted about the same matter. In FIG. 8, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  In the optical wiring component 10 according to the second embodiment, the adhesive 6 according to the first embodiment is omitted, and instead, the elastic body 7 has a function of bonding the optical waveguide 1 and the optical connector 5. Except for this, it is the same as the optical wiring component 10 according to the first embodiment.

  As shown in FIG. 8, the elastic body 7 shown in FIG. 8 is not only provided so as to continuously cover from the front end surface 102 to the upper surface 104 of the optical waveguide 1, but also between the optical waveguide 1 and the optical connector 5. It is also inserted in between. The elastic body 7 bonds between the optical waveguide 1 and the optical connector 5. Thereby, the elastic body 7 which concerns on this embodiment can ensure a wider contact area with respect to the optical waveguide 1 or the optical connector 5 compared with the elastic body 7 which concerns on 1st Embodiment. As a result, the elastic body 7 can be more reliably fixed.

Moreover, according to this embodiment, since the adhesive agent 6 can be omitted, the structure can be simplified. Furthermore, since the adhesive 6 is omitted, for example, there is no possibility that a gap is generated between the adhesive 6 and the elastic body 7. For this reason, there is no possibility that a problem or the like due to the expansion of the gap occurs, and the optical wiring component 10 can be further improved in reliability.
In the second embodiment described above, the same effect as in the first embodiment can be obtained.

«Third embodiment»
Next, a third embodiment of the optical wiring component of the present invention will be described.
FIG. 9 is a cross-sectional view showing a third embodiment of the optical wiring component of the present invention.

  Hereinafter, the third embodiment will be described. However, in the following description, differences from the first embodiment will be mainly described, and description of similar matters will be omitted. In FIG. 9, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  The optical wiring component 10 according to the present embodiment is the same as the optical wiring component 10 according to the first embodiment except that the shape of the optical connector 5 is different.

  That is, the optical connector 5 shown in FIG. 9 includes a through hole 50 ′ formed in the connector main body 51 instead of the groove 50 shown in FIG. 2. The through hole 50 ′ is formed so as to penetrate the opposing surface 52 (first outer surface) and the non-facing surface 53 (second outer surface) of the connector body 51. Further, the through-hole 50 ′ is configured to have a rectangular cut surface when cut along a direction orthogonal to the longitudinal direction thereof. Further, in the optical connector 5 shown in FIG. 9, the receding surface is omitted.

  Furthermore, in the optical connector 5 shown in FIG. 9, the lower surface 502 ′ positioned below in FIG. 9 among the inner surfaces of the through holes 50 ′ is a mounting surface on which the optical waveguide 1 is mounted. The optical waveguide 1 is bonded to the lower surface 502 ′ via an adhesive 6.

  Further, the elastic body 7 is provided so as to continuously cover from the front end surface 102 to the upper surface 104 of the optical waveguide 1.

  Moreover, the elastic body 7 is also in contact with the opposing surface 52 of the connector main body 51 as shown in FIG. That is, the elastic body 7 is configured to continuously cover from the upper surface 104 of the optical waveguide 1 through the distal end surface 102 to the opposing surface 52 (first outer surface) of the connector main body 51. Thereby, since the area which the elastic body 7 contacts with respect to the optical waveguide 1 or the optical connector 5 can be expanded further, the elastic body 7 can be fixed more reliably.

As shown in FIG. 9, the elastic body 7 may be in contact with the upper surface of the through-hole 50 ′ (the inner surface located above FIG. 9), but may be separated from the upper surface. Similarly, the elastic body 7 may be in contact with the side surface (the left and right inner surfaces in FIG. 9A) of the through hole 50 ′ as shown in FIG. 9A, but is separated from the side surface. Also good.
In the third embodiment described above, the same effect as in the first embodiment can be obtained.

  According to the third embodiment, the lower surface 502 ′ of the through hole 50 ′ is set as the mounting surface of the optical waveguide 1. Therefore, the entire side surface of the optical waveguide 1 is surrounded by the optical connector 5. For this reason, the function of protecting the optical waveguide 1 from an external force or the like can be further enhanced, and the reliability of the optical wiring component 10 can be further increased.

<Optical wiring component manufacturing method>
<< First Embodiment >>
Next, a first embodiment of the optical wiring component manufacturing method of the present invention will be described.
10 to 13 are diagrams for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (first embodiment of the manufacturing method of the optical wiring component of the present invention), respectively. 2A is a plan view similar to FIG. 2A, and FIG. 2B is a cross-sectional view similar to FIG. 2B. In the following description, for convenience of explanation, the upper part of FIGS. 10 to 13 is referred to as “upper” and the lower part thereof is referred to as “lower”. 10-13, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  The manufacturing method of the optical wiring component 10 according to the present embodiment includes: [1] a preparatory process for preparing the optical waveguide with connector 4 including the optical waveguide 1 and the optical connector 5; and [2] a resin composition for the mold 8. A molding process in which at least the front end surface 102 (light incident / exit surface) of the optical waveguide 1 is pressed against the resin composition 70 after the article 70 is disposed, and the resin composition 70 is adhered and molded; and [3] Resin It has the hardening process which hardens the composition 70, and obtains the elastic body 7, and the mold release process of releasing the mold 4 [4]. Hereinafter, each process is explained in full detail.

[1] Preparation Step First, the optical waveguide 1 and the optical connector 5 are prepared. Then, as shown in FIG. 10, the optical waveguide 1 and the optical connector 5 are bonded and fixed via an adhesive 6. Thereby, the optical waveguide 4 with a connector shown in FIG. 11 is obtained.

  At this time, since the optical waveguide 1 is disposed in the groove 50 of the optical connector 5, the placement operation can be performed by lowering the optical waveguide 1 from above the groove 50. In such an operation, for example, the optical waveguide 1 can be held by a tool 100 as shown in FIG. 10 and the optical waveguide 1 can be arranged at a target position by driving the tool 100.

  In other words, the mounting surface (the bottom surface 502 of the groove 50) of the optical waveguide 1 provided in the optical connector 5 is in a state that can be seen in a plan view from the outside of the optical connector 5, and therefore the bottom surface from above in FIG. When the optical waveguide 1 is lowered toward 502, the optical waveguide 1 can be lowered while avoiding interference with the optical connector 5. Further, the fine adjustment of the mounting position can be performed while directly viewing the optical waveguide 1 without being obstructed by the optical connector 5, so that the alignment accuracy can be easily increased.

  For this reason, the relative position of the optical waveguide 1 with respect to the optical connector 5 can be determined with a positional accuracy equivalent to the driving positional accuracy of the tool 100. As a result, the position of the optical waveguide 1 with respect to the optical connector 5 can be determined quickly and accurately, and the optical wiring component 10 having excellent optical coupling efficiency with other optical components can be obtained.

  In addition, as a device provided with such a tool 100, for example, various bonding devices such as a flip chip bonder can be used.

[2] Molding Step Next, a molding die 8 shown in FIG. 12 is prepared. The mold 8 is a mold for forming the elastic body 7 having a desired shape by molding the resin composition 70. Specifically, the mold 8 shown in FIG. 12 includes a first portion 801 having a flat plate shape and a second portion 802 having a flat plate shape located on one main surface of the first portion 801. . The first portion 801 and the second portion 802 are arranged so that the principal surfaces are orthogonal to each other.

  Further, the mold 8 is configured such that its width is smaller than the width of the groove 50 of the optical connector 5. Thereby, the mold 8 can be inserted into the groove 50. For this reason, the mold 8 can be easily brought close to the optical waveguide 1 inserted and fixed in the groove 50. As a result, the resin composition 70 disposed in the mold 8 can be easily pressed against the optical waveguide 1 and molded while being sandwiched between the optical waveguide 1 and the mold 8. Can do.

  In other words, since the resin composition 70 can be molded with the molding die 8 entering the groove 50, interference between the molding die 8 and the connector main body 51 can be avoided. For this reason, the resin composition 70 can be reliably molded into a target shape.

  The mold 8 is provided with a cavity 81 corresponding to the shape of the elastic body 7 to be formed. The cavity 81 is a recess formed by recessing a part of the surface of the mold 8. By molding the resin composition 70 by the recess, a shape protruding from the elastic body 7 can be formed.

  The resin composition 70 is a composition that becomes the elastic body 7 by being cured. This resin composition 70 is placed in the cavity 81. The resin composition 70 may be disposed only in the cavity 81, or a part thereof may protrude from the cavity 81. Further, the resin composition 70 may be disposed only outside the cavity 81 in anticipation of the resin composition 70 moving during molding.

  Next, the optical waveguide 4 with a connector is brought closer to the mold 8 so that the resin composition 70 and the optical waveguide 1 are in contact with each other. As a result, the resin composition 70 is sandwiched and molded between the optical waveguide 4 with connector and the molding die 8 and is in close contact with the optical waveguide 1. Thereby, the resin composition 70 is shape | molded in the target shape as shown in FIG.

  In addition, the shape of the shaping | molding die 8 is not limited to the shape mentioned above, What kind of shape may be sufficient. For example, the mold 8 may be composed of an assembly of a plurality of parts.

  Although it does not specifically limit as a constituent material of the shaping | molding die 8, For example, resin-type material, glass-type material, crystal-type material, carbon-type material, ceramics-type material, metal-type material etc. are mentioned.

  Moreover, as the resin composition 70, the varnish containing the resin material before hardening of the elastic body 7 mentioned above and a solvent, etc. are mentioned, for example.

[3] Curing Step Next, the molded resin composition 70 is cured. Thereby, the elastic body 7 shown in FIG. 2 is obtained.

  The curing method of the resin composition 70 is not particularly limited, and may be photocuring or thermosetting. In addition, light can be irradiated to the resin composition 70 through the mold 8 by imparting light transmittance to the mold 8. For this reason, the resin composition 70 can be cured while maintaining the state where the resin composition 70 is molded by the mold 8. As a result, the elastic body 7 with high dimensional accuracy can be obtained. Such an elastic body 7 contributes to further improving the optical coupling efficiency between the optical wiring component 10 and other optical components.

[4] Mold Release Step Next, the mold 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 2 is obtained.

  Further, if necessary, a mold release agent can be applied to the cavity 81 of the mold 8 or a mold release agent can be added to the resin composition 70 to perform the mold release operation more smoothly.

  Although not shown, the optical wiring component manufacturing method according to the present embodiment is also applicable to the method of manufacturing the optical wiring component shown in FIG. That is, the resin composition 70 may be disposed in the through hole 50 ′, and then the resin composition 70 may be molded by the molding die 8 as described in a modification of the second embodiment described later.

<< Second Embodiment >>
Next, a second embodiment of the optical wiring component manufacturing method of the present invention will be described.
FIG. 14 is a view for explaining a method of manufacturing the optical wiring component shown in FIGS. 1 and 2 (second embodiment of the manufacturing method of the optical wiring component of the present invention). 2A is a plan view similar to FIG. 2A, and FIG. 2B is a cross-sectional view similar to FIG. 2B. In the following description, for convenience of explanation, the upper part of FIG. 14 is referred to as “upper” and the lower part is referred to as “lower”. Moreover, in FIG. 14, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  Hereinafter, although 2nd Embodiment is described, in the following description, it demonstrates centering around difference with 1st Embodiment, The description is abbreviate | omitted about the same matter.

  The manufacturing method of the optical wiring component 10 according to the present embodiment includes: [1] a preparatory process for preparing the optical waveguide 4 with a connector including the optical waveguide 1 and the optical connector 5; The placement step of placing the optical waveguide 4 and [3] supplying the resin composition 70 between the mold 8 and the front end face 102 of the optical waveguide 1, bringing the resin composition 70 into contact with the front end face 102 and molding. A molding process, [4] a curing process for curing the resin composition 70 to obtain the elastic body 7, and [5] a mold release process for releasing the molding die 8. Hereinafter, each process is explained in full detail.

[1] Preparation Step First, the optical waveguide 4 with a connector shown in FIG. 14 is prepared.

[2] Arrangement Step Next, the mold 8 is prepared. Then, the optical waveguide 4 with a connector is disposed with respect to the mold 8. At this time, a gap is provided between the optical waveguide with connector 4 and the mold 8.

[3] Molding Step Next, as shown in FIG. 14, the resin composition 70 is supplied into the gap between the optical waveguide 4 with connector and the molding die 8. As a result, the resin composition 70 is stored in the gap, contacts the tip surface 102 of the optical waveguide 1, and is molded by the gap.

[4] Curing Step Next, the molded resin composition 70 is cured. Thereby, the elastic body 7 shown in FIG. 2 is obtained.

[5] Mold Release Step Next, the mold 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 2 is obtained.
Note that the present embodiment as described above also has the same effect as the first embodiment.

<< Modification of Second Embodiment >>
In addition, the manufacturing method of the optical wiring component which concerns on this embodiment is applicable also to the method of manufacturing the optical wiring component shown in FIG.

  FIG. 15 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 9 (a modification of the second embodiment of the method of manufacturing an optical wiring component of the present invention).

[1] Preparation Step First, an optical waveguide 4 with a connector shown in FIG.

[2] Arrangement Step Next, the mold 8 is prepared. Then, the optical waveguide 4 with a connector is disposed with respect to the mold 8. At this time, a gap is provided between the tip surface 102 of the optical waveguide 1 and the molding die 8.

[3] Molding Step Next, as shown in FIG. 15B, the resin composition 70 is supplied into the gap between the tip surface 102 of the optical waveguide 1 and the molding die 8. As a result, the resin composition 70 is stored in the gap, contacts the tip surface 102 of the optical waveguide 1, and is molded by the gap.

  The resin composition 70 also enters the through hole 50 ′ and fills the through hole 50 ′ so as to enclose the optical waveguide 1.

  The method for supplying the resin composition 70 is not particularly limited, and examples thereof include a method using a supply device such as a dispenser. The supply path is not particularly limited, and may be, for example, a path through an opening on the non-facing surface 53 side of the through hole 50 ′ or a path through a hole provided in the mold 8. In addition, in FIG. 15, a mode that the resin composition 70 is supplied through the path | route which penetrates the shaping | molding die 8 is illustrated as an example.

  Further, the shape of the molding die 8 is not particularly limited, but the molding die 8 shown in FIG. 15B, as an example, molds the resin composition 70 protruding from the facing surface 52 of the optical connector 5 into a lens shape. The resin composition 70 is formed so that a part of the resin composition 70 is in contact with the facing surface 52.

[4] Curing Step Next, the molded resin composition 70 is cured. Thereby, the elastic body 7 shown in FIG. 9 is obtained. In addition, when the resin composition 70 has photocurability, as shown in FIG.15 (c), what has a light transmittance is used as the shaping | molding die 8, and it is with respect to the resin composition 70. What is necessary is just to irradiate the light L through the shaping | molding die 8. FIG. Thereby, the resin composition 70 can be cured while maintaining the state where the resin composition 70 is molded by the mold 8. As a result, the elastic body 7 with high dimensional accuracy can be obtained.

  In addition, the hardening method of the resin composition 70 is not limited to said method, For example, when the resin composition 70 has thermosetting property, it can be hardened by heating.

[5] Mold Release Step Next, the mold 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 9 is obtained.
Also in this modification, the same effect as the second embodiment described above can be obtained.

«Third embodiment»
Next, as a third embodiment of the method for manufacturing an optical wiring component of the present invention, a method for manufacturing the optical wiring component shown in FIG. 8 will be described.

  FIG. 16 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 8 (third embodiment of the manufacturing method of the optical wiring component of the present invention). In the following description, for convenience of explanation, the upper part of FIG. 16 is referred to as “upper”. In FIG. 16, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  Hereinafter, the third embodiment will be described. However, in the following description, differences from the first embodiment will be mainly described, and description of similar matters will be omitted.

  The manufacturing method of the optical wiring component 10 according to the present embodiment includes: [1] a supplying step of supplying the resin composition 70 so as to be in contact with the optical waveguide 1; and [2] the optical waveguide 1 so as to compress the resin composition 70. And the optical connector 5 are brought close to each other, and a molding step of molding the resin composition 70 with the molding die 8; [3] The resin composition 70 is cured to obtain the elastic body 7, and light is transmitted through the elastic body 7. A curing process for bonding the waveguide 1 and the optical connector 5; and [4] a mold release process for releasing the mold 8. Hereinafter, each process is explained in full detail.

[1] Supplying Step First, as shown in FIG. 16A, the optical waveguide 1 is arranged with respect to the mold 8.
Subsequently, the resin composition 70 is supplied to the upper surface of the optical waveguide 1. Thereby, the resin composition 70 accumulates on the upper surface of the optical waveguide 1.

[2] Molding Step Next, as shown in FIG. 16A, the optical waveguide 1 and the optical connector 5 are brought close to each other so as to compress the resin composition 70. As a result, the resin composition 70 is sandwiched between the optical waveguide 1 and the optical connector 5 and compressed, and a part of the resin composition 70 protrudes from between them. The protruding resin composition 70 is stored in the cavity 81 of the mold 8. As a result, the resin composition 70 is spread between the optical waveguide 1 and the optical connector 5 and molded by the cavity 81 as shown in FIG.

[3] Curing Step Next, the molded resin composition 70 is cured. Thereby, the elastic body 7 shown in FIG. 8 is obtained.

[4] Mold Release Step Next, the mold 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 8 is obtained.
In the present embodiment as described above, the same effects as those of the first and second embodiments can be obtained.

  In this embodiment, since the elastic body 7 also has a function of bonding the optical waveguide 1 and the optical connector 5, the work of bonding using the adhesive 6 can be omitted. For this reason, this embodiment is useful in that the manufacturing work can be further simplified.

<< Fourth Embodiment >>
Next, as a fourth embodiment of the method for manufacturing an optical wiring component of the present invention, a method for manufacturing the optical wiring component shown in FIG. 8 will be described.

  FIG. 17 is a view for explaining a method of manufacturing the optical wiring component shown in FIG. 8 (a fourth embodiment of the manufacturing method of the optical wiring component of the present invention). In the following description, the upper side of FIG. 17 is referred to as “upper” for convenience of description. Moreover, in FIG. 17, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  Hereinafter, the fourth embodiment will be described. In the following description, differences from the first embodiment will be mainly described, and description of similar matters will be omitted.

  The manufacturing method of the optical wiring component 10 according to the present embodiment includes: [1] a supplying step of supplying the resin composition 70 so as to contact the optical connector 5; [2] the optical waveguide 1 so as to compress the resin composition 70. And the optical connector 5 are brought close to each other, and a molding step of molding the resin composition 70 with the molding die 8; [3] The resin composition 70 is cured to obtain the elastic body 7, and light is transmitted through the elastic body 7. A curing process for bonding the waveguide 1 and the optical connector 5; and [4] a mold release process for releasing the mold 8. That is, this embodiment is the same as the third embodiment except that the position where the resin composition 70 is formed is different. Hereinafter, each process is explained in full detail.

[1] Supplying Step First, as shown in FIG. 17A, the resin composition 70 is supplied to the bottom surface 502 of the groove 50 of the optical connector 5. As a result, the resin composition 70 accumulates on the bottom surface 502.
On the other hand, the optical waveguide 1 is disposed with respect to the mold 8.

[2] Molding Step Next, as shown in FIG. 17A, the optical waveguide 1 and the optical connector 5 are brought close to each other so as to compress the resin composition 70. As a result, the resin composition 70 is sandwiched between the optical waveguide 1 and the optical connector 5 and compressed, and a part of the resin composition 70 protrudes from between them. The protruding resin composition 70 is stored in the cavity 81 of the mold 8. As a result, the resin composition 70 is spread between the optical waveguide 1 and the optical connector 5 and molded by the cavity 81 as shown in FIG.

[3] Curing Step Next, the molded resin composition 70 is cured. Thereby, the elastic body 7 shown in FIG. 8 is obtained.

[4] Mold Release Step Next, the mold 8 is released from the elastic body 7. Thereby, the optical wiring component 10 shown in FIG. 8 is obtained.
In the present embodiment as described above, the same effects as those of the first embodiment are obtained.

  In this embodiment, since the elastic body 7 also has a function of bonding the optical waveguide 1 and the optical connector 5, the work of bonding using the adhesive 6 can be omitted. For this reason, this embodiment is useful in that the manufacturing work can be further simplified.

<Electronic equipment>
As described above, the optical wiring component of the present invention as described above can suppress a decrease in optical coupling efficiency associated with optical connection even when connected to other optical components. Therefore, by providing the optical wiring component of the present invention, a highly reliable electronic device (electronic device of the present invention) capable of performing high-quality optical communication is obtained.

  Examples of the electronic device including the optical wiring component of the present invention include electronic devices such as a smartphone, a tablet terminal, a mobile phone, a game machine, a router device, a WDM device, a personal computer, a television, and a home server. In any of these electronic devices, it is necessary to transmit a large amount of data at high speed between an arithmetic device such as an LSI and a storage device such as a RAM. Therefore, by providing such an electronic device with the optical wiring component of the present invention, problems such as noise and signal degradation peculiar to electric wiring can be eliminated, and a dramatic improvement in performance can be expected.

  In addition, the amount of heat generated in the optical waveguide portion is significantly reduced compared to the electrical wiring. For this reason, the electric power required for cooling can be reduced and the power consumption of the whole electronic device can be reduced.

  As mentioned above, although the optical wiring component, the manufacturing method of an optical wiring component, and the electronic device were demonstrated based on embodiment of illustration, this invention is not limited to these.

  For example, in the above embodiment, an optical connector is attached to one end of the optical waveguide, but a similar optical connector may be attached to the other end, and a different optical connector is attached. Also good. Various light receiving and emitting elements may be mounted on the other end instead of the optical connector. In addition, any element may be added to the embodiment.

  Moreover, the manufacturing method of the optical wiring component of this invention also includes what changed the order of the process in each said embodiment, and also the arbitrary processes may be added.

DESCRIPTION OF SYMBOLS 1 Optical waveguide 2 Support film 3 Cover film 4 Optical waveguide 5 with connector 5 Optical connector 6 Adhesive 7 Elastic body 8 Mold 10 Optical wiring component 11 Clad layer 12 Clad layer 13 Core layer 14 Core part 15 Side surface clad part 50 Groove 50 ' Through-hole 51 Connector body 51a Base 51b Lid 52 Opposing surface 53 Non-opposing surface 70 Resin composition 81 Cavity 100 Tool 101 Tip portion 102 Tip surface 103 Lower surface 104 Upper surface 502 Bottom surface 502 ′ Lower surface 504 Retreating surface 511 Guide hole 801 First Part 802 Second part L Light L1 Retraction L2 Thickness L3 Projection length L4 Swelling height W Width W1 Width

Claims (9)

A sheet-like shape comprising: a first main surface and a second main surface that are in a front-back relationship with each other; and a light incident / exit surface configured by a part of an outer surface that connects the first main surface and the second main surface Optical waveguides of
A connector body including a first outer surface and a second outer surface facing each other; a mounting surface on which the first main surface of the optical waveguide is mounted; and the first outer surface and the second outer surface. An optical connector comprising a through-hole or a groove penetrating;
An elastic body having translucency and elasticity, and continuously covering from the second main surface of the optical waveguide to the light incident / exit surface;
A method of manufacturing an optical wiring component having
Preparing an optical waveguide with a connector comprising the optical waveguide and the optical connector;
After placing the resin composition on the molding die, pressing the light incident / exit surface of the optical waveguide against the resin composition, and closely molding the resin composition;
Curing the resin composition to obtain the elastic body;
Releasing the mold; and
A method of manufacturing an optical wiring component, comprising: The optical wiring component further has an adhesive for bonding between the optical waveguide and the mounting surface,
The method of manufacturing an optical wiring component according to claim 1, wherein an elastic modulus of the adhesive is larger than an elastic modulus of the elastic body. A sheet-like shape comprising: a first main surface and a second main surface that are in a front-back relationship with each other; and a light incident / exit surface configured by a part of an outer surface that connects the first main surface and the second main surface Optical waveguides of
A connector body including a first outer surface and a second outer surface facing each other; a mounting surface on which the first main surface of the optical waveguide is mounted; and the first outer surface and the second outer surface. An optical connector comprising a through-hole or a groove penetrating;
It has translucency and elasticity, continuously covers from the second main surface of the optical waveguide to the light incident / exit surface, and has a function of being provided between the optical waveguide and the optical connector and bonding them. An elastic body having,
A method of manufacturing an optical wiring component having
Supplying a resin composition in contact with the optical waveguide;
A step of bringing the optical waveguide and the optical connector close to each other so as to compress the resin composition, and molding the resin composition with a mold;
Curing the resin composition to obtain the elastic body, and bonding the optical waveguide and the optical connector through the elastic body;
A method of manufacturing an optical wiring component, comprising: A sheet-like shape comprising: a first main surface and a second main surface that are in a front-back relationship with each other; and a light incident / exit surface configured by a part of an outer surface that connects the first main surface and the second main surface Optical waveguides of
A connector body including a first outer surface and a second outer surface facing each other; a mounting surface on which the first main surface of the optical waveguide is mounted; and the first outer surface and the second outer surface. An optical connector comprising a through-hole or a groove penetrating;
It has translucency and elasticity, continuously covers from the second main surface of the optical waveguide to the light incident / exit surface, and has a function of being provided between the optical waveguide and the optical connector and bonding them. An elastic body having,
A method of manufacturing an optical wiring component having
Supplying a resin composition in contact with the optical connector;
A step of bringing the optical waveguide and the optical connector close to each other so as to compress the resin composition, and molding the resin composition with a mold;
Curing the resin composition to obtain the elastic body, and bonding the optical waveguide and the optical connector through the elastic body;
A method of manufacturing an optical wiring component, comprising:   5. The method of manufacturing an optical wiring component according to claim 1, wherein the elastic body is formed so as to protrude from a plane including the first outer surface of the connector main body.   The said optical waveguide is mounted so that the said light entrance / exit surface may be located so that it may shift | deviate to the 2nd outer surface side rather than the plane containing the said 1st outer surface. Manufacturing method of optical wiring parts.   The optical connector further includes a receding surface that is a surface that connects the first outer surface of the connector body and the mounting surface, and is displaced toward the second outer surface side from a plane that includes the first outer surface. The method for manufacturing an optical wiring component according to any one of claims 1 to 6.   The method of manufacturing an optical wiring component according to claim 7, wherein the elastic body is formed so as to continuously cover from the second main surface to the receding surface or the first outer surface through the light incident / exit surface. The refractive index of the core portion of the optical waveguide is greater than 1.4,
9. The method of manufacturing an optical wiring component according to claim 1, wherein a refractive index of the elastic body is between 1.4 and a refractive index of a core portion of the optical waveguide.

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