TW201636454A - 化學鈀銀鍍膜的製作方法及其結構 - Google Patents
化學鈀銀鍍膜的製作方法及其結構 Download PDFInfo
- Publication number
- TW201636454A TW201636454A TW104111604A TW104111604A TW201636454A TW 201636454 A TW201636454 A TW 201636454A TW 104111604 A TW104111604 A TW 104111604A TW 104111604 A TW104111604 A TW 104111604A TW 201636454 A TW201636454 A TW 201636454A
- Authority
- TW
- Taiwan
- Prior art keywords
- palladium
- plating layer
- silver
- layer
- chemical
- Prior art date
Links
- 239000000126 substance Substances 0.000 title claims abstract description 56
- 238000000576 coating method Methods 0.000 title claims abstract description 48
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000011248 coating agent Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 25
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 222
- 238000007747 plating Methods 0.000 claims abstract description 165
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 111
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910052709 silver Inorganic materials 0.000 claims abstract description 73
- 239000004332 silver Substances 0.000 claims abstract description 73
- 238000006722 reduction reaction Methods 0.000 claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000006467 substitution reaction Methods 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910001096 P alloy Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 239000006188 syrup Substances 0.000 claims description 3
- 235000020357 syrup Nutrition 0.000 claims description 3
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 238000002310 reflectometry Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104111604A TW201636454A (zh) | 2015-04-10 | 2015-04-10 | 化學鈀銀鍍膜的製作方法及其結構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104111604A TW201636454A (zh) | 2015-04-10 | 2015-04-10 | 化學鈀銀鍍膜的製作方法及其結構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201636454A true TW201636454A (zh) | 2016-10-16 |
| TWI560317B TWI560317B (https=) | 2016-12-01 |
Family
ID=57847589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104111604A TW201636454A (zh) | 2015-04-10 | 2015-04-10 | 化學鈀銀鍍膜的製作方法及其結構 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201636454A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230069914A1 (en) * | 2020-02-18 | 2023-03-09 | Japan Pure Chemical Co., Ltd. | Plating stack |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI326921B (en) * | 2006-06-21 | 2010-07-01 | Everlight Electronics Co Ltd | A package method of a light-emitting diode and a structure thereof |
| TW201233280A (en) * | 2011-01-25 | 2012-08-01 | Taiwan Uyemura Co Ltd | Chemical palladium-gold plating film method |
| TW201309843A (zh) * | 2011-08-23 | 2013-03-01 | 台灣上村股份有限公司 | 薄鎳－鈀－金鍍層，帶有導線的此鍍層所成封裝結構以及彼等之製作方法 |
| TWI520382B (zh) * | 2012-08-21 | 2016-02-01 | 長華電材股份有限公司 | 發光二極體封裝之前製程及其結構 |
-
2015
- 2015-04-10 TW TW104111604A patent/TW201636454A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230069914A1 (en) * | 2020-02-18 | 2023-03-09 | Japan Pure Chemical Co., Ltd. | Plating stack |
| US12497699B2 (en) * | 2020-02-18 | 2025-12-16 | Japan Pure Chemical Co., Ltd. | Plating stack |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI560317B (https=) | 2016-12-01 |
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