TWI560317B - - Google Patents
Info
- Publication number
- TWI560317B TWI560317B TW104111604A TW104111604A TWI560317B TW I560317 B TWI560317 B TW I560317B TW 104111604 A TW104111604 A TW 104111604A TW 104111604 A TW104111604 A TW 104111604A TW I560317 B TWI560317 B TW I560317B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104111604A TW201636454A (zh) | 2015-04-10 | 2015-04-10 | 化學鈀銀鍍膜的製作方法及其結構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104111604A TW201636454A (zh) | 2015-04-10 | 2015-04-10 | 化學鈀銀鍍膜的製作方法及其結構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201636454A TW201636454A (zh) | 2016-10-16 |
| TWI560317B true TWI560317B (https=) | 2016-12-01 |
Family
ID=57847589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104111604A TW201636454A (zh) | 2015-04-10 | 2015-04-10 | 化學鈀銀鍍膜的製作方法及其結構 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201636454A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6754151B1 (ja) * | 2020-02-18 | 2020-09-09 | 日本高純度化学株式会社 | めっき積層体 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200802940A (en) * | 2006-06-21 | 2008-01-01 | Everlight Electronics Co Ltd | A package method of a light-emitting diode and a structure thereof |
| TW201233280A (en) * | 2011-01-25 | 2012-08-01 | Taiwan Uyemura Co Ltd | Chemical palladium-gold plating film method |
| TW201309843A (zh) * | 2011-08-23 | 2013-03-01 | 台灣上村股份有限公司 | 薄鎳－鈀－金鍍層，帶有導線的此鍍層所成封裝結構以及彼等之製作方法 |
| TW201409758A (zh) * | 2012-08-21 | 2014-03-01 | Chang Wah Electromaterials Inc | 發光二極體封裝之前製程及其結構 |
-
2015
- 2015-04-10 TW TW104111604A patent/TW201636454A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200802940A (en) * | 2006-06-21 | 2008-01-01 | Everlight Electronics Co Ltd | A package method of a light-emitting diode and a structure thereof |
| TW201233280A (en) * | 2011-01-25 | 2012-08-01 | Taiwan Uyemura Co Ltd | Chemical palladium-gold plating film method |
| TW201309843A (zh) * | 2011-08-23 | 2013-03-01 | 台灣上村股份有限公司 | 薄鎳－鈀－金鍍層，帶有導線的此鍍層所成封裝結構以及彼等之製作方法 |
| TW201409758A (zh) * | 2012-08-21 | 2014-03-01 | Chang Wah Electromaterials Inc | 發光二極體封裝之前製程及其結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201636454A (zh) | 2016-10-16 |