TW201620067A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TW201620067A
TW201620067A TW105103023A TW105103023A TW201620067A TW 201620067 A TW201620067 A TW 201620067A TW 105103023 A TW105103023 A TW 105103023A TW 105103023 A TW105103023 A TW 105103023A TW 201620067 A TW201620067 A TW 201620067A
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substrate
processing
sheet substrate
sheet
processing device
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TW105103023A
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Chinese (zh)
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TWI587433B (en
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濱田智秀
奈良圭
增川孝志
木內徹
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尼康股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/04Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/32Arrangements for turning or reversing webs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/50Auxiliary process performed during handling process
    • B65H2301/51Modifying a characteristic of handled material
    • B65H2301/517Drying material

Abstract

A substrate processing apparatus comprises a first treatment device for performing a first treatment on a sheet-like substrate conveyed in the long belt direction; a second treatment device disposed, staggered with respect to the first treatment device, in a direction intersecting the conveying direction of the sheet-like substrate and configured to perform a second treatment on the sheet-like substrate; a third treatment device, which is provided with a carrying-discharge unit allowing two rows of sheet-like substrates to pass through together in a way of being spaced apart, and to perform a third treatment on the sheet-like substrate after the first treatment, or the sheet-like substrate after the second treatment; and a conveying device comprising: a first conveying unit to convey the sheet-like substrate in the long belt direction after the sheet-like substrate passes the first treatment device and moves toward the third treatment device; a second conveying unit to convey the sheet-like substrate in the long belt direction after the sheet-like substrate passes the third treatment device and moves toward the second treatment device; and a third conveying unit to convey the sheet-like substrate in the long belt direction after the sheet-like substrate passes the second treatment device and moves toward the third treatment device.

Description

基板處理裝置及基板處理方法 Substrate processing apparatus and substrate processing method

本發明係關於一種基板處理裝置。本申請係根據2010年4月9日申請之美國臨時申請61/322347號及2010年4月9日申請之美國臨時申請61/322417號主張優先權,並將其內容援引於此。 The present invention relates to a substrate processing apparatus. The present application claims priority from U.S. Provisional Application No. 61/322,347, filed on Apr. 9, 2010, and U.S. Provisional Application No. 61/322,417, filed on Apr.

作為構成顯示器裝置等顯示裝置之顯示元件,例如有液晶顯示元件、有機電致發光(有機EL)元件、用於電子紙之電泳元件等。目前,此等顯示元件係以在基板表面形成被稱為薄膜電晶體(Thin Film Transistor:TFT)之開關元件或增幅元件或電流驅動元件等之後,於其上形成各自之顯示元件的主動顯示元件(Active display device)漸為主流。 Examples of the display element constituting the display device such as a display device include a liquid crystal display element, an organic electroluminescence (organic EL) element, an electrophoresis element for electronic paper, and the like. At present, these display elements are active display elements on which respective display elements are formed after forming a switching element called a thin film transistor (TFT) or an amplifying element or a current driving element on the surface of the substrate. (Active display device) is becoming mainstream.

近年來,提出了一種在片狀之基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術,例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下,簡記為「捲軸方式」)者廣為人知(例如,參照專利文獻1)。捲軸方式,係將捲繞在基板供應側之供應用滾筒之基板(例如,帶狀之薄膜構件)送出、並一邊將送出之基板以基板回收側之回收用滾筒加以捲繞來搬送基板。 In recent years, a technique of forming a display element on a sheet-like substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a roll to roll method (hereinafter, abbreviated as "reel method") is widely known (for example, refer to Patent Document 1). In the reel method, a substrate (for example, a strip-shaped film member) wound around a supply roller on the substrate supply side is fed out, and the substrate to be fed is wound around a recovery roller on the substrate recovery side to transport the substrate.

在基板送出至被捲繞為止之期間,例如一邊使用複數個搬送滾筒等搬送基板、一邊使用複數個處理裝置來形成構成TFT之閘極電極、閘極絕緣膜、半導體膜、源極-汲極電極等,在基板之被處理面上依序形 成顯示元件之構成要件。例如,在形成有機EL元件之情形時,係於基板上依序形成發光層、陽極、陰極、電路等。 During the transfer from the substrate to the winding, the gate electrode, the gate insulating film, the semiconductor film, and the source-drainage of the TFT are formed by using a plurality of processing devices, for example, using a plurality of transfer rollers. Electrodes, etc., on the processed surface of the substrate It is a constituent element of the display element. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, and the like are sequentially formed on a substrate.

專利文獻1:國際公開第2006/100868號小冊子 Patent Document 1: International Publication No. 2006/100868

然而,上述方法中,由於必須沿著基板之搬送路徑配置處理裝置,因此會依例如基板之搬送形態使裝置整體大型化。 However, in the above method, since it is necessary to arrange the processing apparatus along the transport path of the substrate, the entire apparatus is increased in size depending on, for example, the transport form of the substrate.

本發明之形態之目的在於提供一種能省空間化之基板處理裝置。 It is an object of the present invention to provide a substrate processing apparatus which can save space.

一形態之基板處理裝置,係處理具有可撓性之長帶之片狀基板,具備:第1處理裝置,對被搬送於該長帶方向的該片狀基板施予第1處理;第2處理裝置,以相對該第1處理裝置於與該片狀基板之搬送方向交叉之方向錯開的方式配置,且對該片狀基板施予第2處理;第3處理裝置,具備可使二行該片狀基板以隔有間隔之方式一起通過之搬入排出部,且對該第1處理後之片狀基板、或該第2處理後之片狀基板施予第3處理;以及搬送裝置,包含:第1搬送部,以該片狀基板通過該第1處理裝置朝向該第3處理裝置的方式,將該片狀基板搬送於長帶方向;第2搬送部,以該片狀基板在經該第3處理裝置之後朝向該第2處理裝置的方式,將該片狀基板搬送於長帶方向;以及,第3搬送部,以該片狀基板在經該第2處理裝置之後朝向該第3處理裝置的方式,將該片狀基板搬送於長帶方向。 A substrate processing apparatus according to one aspect is a sheet substrate having a flexible long strip, and includes: a first processing apparatus that applies a first process to the sheet substrate conveyed in the long strip direction; and a second process The apparatus is disposed so as to be shifted in a direction intersecting the transport direction of the sheet substrate with respect to the transport direction of the sheet substrate, and the second processing is performed on the sheet substrate. The third processing device is provided with two rows of the sheet. The substrate is carried into the discharge portion with the gap therebetween, and the third process is performed on the first processed sheet substrate or the second processed sheet substrate; and the transfer device includes: In the transport unit, the sheet substrate is transported in the long strip direction by the first processing device toward the third processing device, and the second transport unit is in the third substrate. After the processing device is moved toward the second processing device, the sheet substrate is transported in the long strip direction; and the third transport portion is directed toward the third processing device after passing through the second processing device. Way, the sheet substrate is transported to the long strip To.

一形態之基板處理方法,係一邊搬送具有可撓性之長帶之片狀基板往長帶方向、一邊對該片狀基板施予複數個處理,包含:第1步驟,將該片狀基板搬送至第1處理裝置,且對該片狀基板之被處理面施予第1 處理;第2步驟,將該片狀基板搬送至第2處理裝置,且對已經該第1處理之該片狀基板之被處理面施予第2處理;第3步驟,將該第1處理後之該片狀基板、及該第2處理後之該片狀基板,搬送至具備可使二行該片狀基板一起通過之搬入排出部的第3處理裝置,且對該片狀基板之被處理面施予第3處理;以及搬送步驟,藉由以該第1處理裝置、該第3處理裝置、該第2處理裝置、及該第3處理裝置之順序將該片狀基板搬送於長帶方向之搬送裝置,搬送該片狀基板。 In a method of processing a substrate, a plurality of processes are performed on the sheet substrate while the sheet substrate having the flexible long strip is conveyed in the long strip direction, and the first step is performed to transport the sheet substrate. To the first processing device, and to apply the first surface to the processed surface of the sheet substrate In the second step, the sheet substrate is transferred to the second processing device, and the second processed surface is applied to the processed surface of the sheet substrate that has been subjected to the first processing; and the third step is performed after the first processing The sheet substrate and the sheet substrate after the second treatment are transported to a third processing device including a loading/discharging unit through which the two sheets of the sheet substrate are passed together, and the sheet substrate is processed. The third processing is performed on the surface, and the transporting step is performed by transporting the sheet substrate in the longitudinal direction by the first processing device, the third processing device, the second processing device, and the third processing device. The transfer device transports the sheet substrate.

根據本發明之形態,可提供能省空間化之基板處理裝置。 According to the aspect of the invention, it is possible to provide a substrate processing apparatus which can save space.

FB‧‧‧片狀基板 FB‧‧‧Flake substrate

SU‧‧‧基板供應部 SU‧‧‧Substrate Supply Department

PR‧‧‧基板處理部 PR‧‧‧Substrate Processing Department

CB‧‧‧腔室 CB‧‧‧室

CL‧‧‧基板回收部 CL‧‧‧Substrate Recycling Department

CONT‧‧‧控制部 CONT‧‧‧Control Department

Fp‧‧‧被處理面 Fp‧‧‧ processed surface

DRM‧‧‧桶機構 DRM‧‧‧ barrel agency

CYL‧‧‧圓筒構件 CYL‧‧‧Cylinder components

CY1‧‧‧第一圓筒部 CY1‧‧‧ first cylindrical part

CY2‧‧‧第二圓筒部 CY2‧‧‧Second cylinder

ACT‧‧‧旋轉驅動機構 ACT‧‧‧Rotary drive mechanism

C1‧‧‧第一圓筒構件 C1‧‧‧ first cylindrical member

C2‧‧‧第二圓筒構件 C2‧‧‧Second cylindrical member

DRM~DRM5‧‧‧桶機構 DRM~DRM5‧‧‧ barrel mechanism

42A1,42A2,42B1,42B2,42C1,42C2‧‧‧處理部 42A1, 42A2, 42B1, 42B2, 42C1, 42C2‧‧ ‧ Processing Department

43‧‧‧乾燥裝置 43‧‧‧Drying device

FPA,FPA4,FPA2,FPA3‧‧‧基板處理裝置 FPA, FPA4, FPA2, FPA3‧‧‧ substrate processing equipment

R101~R106,R111~R114‧‧‧導引滾筒 R101~R106, R111~R114‧‧‧ guide roller

10‧‧‧供應埠 10‧‧‧Supply

11,13,21,111,121‧‧‧軸構件 11,13,21,111,121‧‧‧ shaft members

12,14,22,112,122‧‧‧支承部 12,14,22,112,122‧‧‧Support

20‧‧‧回收埠 20‧‧‧Recycling

30,130,230‧‧‧搬送裝置 30,130,230‧‧‧Transporting device

31,32‧‧‧處理滾筒 31,32‧‧‧Processing roller

40,140,241~244‧‧‧處理裝置 40,140,241~244‧‧‧Processing device

131,231~233‧‧‧處理搬送滾筒 131,231~233‧‧‧Handling conveyor roller

圖1係顯示第一實施形態之基板處理裝置之構成的立體圖。 Fig. 1 is a perspective view showing a configuration of a substrate processing apparatus according to a first embodiment.

圖2係顯示本實施形態之基板處理裝置之構成的俯視圖。 Fig. 2 is a plan view showing the configuration of a substrate processing apparatus of the embodiment.

圖3係顯示第二實施形態之基板處理裝置之構成的俯視圖。 Fig. 3 is a plan view showing the configuration of a substrate processing apparatus according to a second embodiment.

圖4係顯示第三實施形態之基板處理裝置之構成的俯視圖。 Fig. 4 is a plan view showing a configuration of a substrate processing apparatus according to a third embodiment.

圖5係顯示第四實施形態之基板處理裝置之構成的立體圖。 Fig. 5 is a perspective view showing the configuration of a substrate processing apparatus according to a fourth embodiment.

圖6係顯示本實施形態之基板處理裝置之構成的俯視圖。 Fig. 6 is a plan view showing the configuration of the substrate processing apparatus of the embodiment.

圖7係顯示本實施形態之基板處理裝置之構成的俯視圖。 Fig. 7 is a plan view showing the configuration of a substrate processing apparatus of the embodiment.

圖8係顯示本實施形態之基板處理裝置之構成的俯視圖。 Fig. 8 is a plan view showing the configuration of the substrate processing apparatus of the embodiment.

圖9係顯示第五實施形態之基板處理裝置之構成的立體圖。 Fig. 9 is a perspective view showing the configuration of a substrate processing apparatus according to a fifth embodiment.

圖10係顯示第六實施形態之基板處理裝置之構成的俯視圖。 Fig. 10 is a plan view showing the configuration of a substrate processing apparatus according to a sixth embodiment.

圖11係顯示第七實施形態之基板處理裝置之構成的俯視圖。 Fig. 11 is a plan view showing the configuration of a substrate processing apparatus according to a seventh embodiment.

圖12係顯示另一實施形態之基板處理裝置之構成的俯視圖。 Fig. 12 is a plan view showing the configuration of a substrate processing apparatus according to another embodiment.

(第一實施形態) (First embodiment)

接著,說明第一實施形態之基板處理裝置。圖1係顯示本實施形態之基板處理裝置FPA4之構成的立體圖。圖2係顯示基板處理裝置FPA4之構成的俯視圖。 Next, a substrate processing apparatus according to the first embodiment will be described. Fig. 1 is a perspective view showing the configuration of a substrate processing apparatus FPA4 of the present embodiment. FIG. 2 is a plan view showing the configuration of the substrate processing apparatus FPA4.

如圖1及圖2所示,基板處理裝置FPA具有供應片狀基板(例如,帶狀之膜構件)FB之基板供應部SU、對片狀基板FB之表面(被處理面)Fp進行處理之基板處理部PR、收容該基板處理部PR之腔室CB(圖1中省略圖示)、回收片狀基板FB之基板回收部CL、及控制該等各部之控制部CONT。基板處理裝置FPA係設置在例如工廠等。本實施形態中,片狀基板FB係在豎立狀態下被供應、處理、回收。本實施形態中,該豎立狀態包含使片狀基板FB之被處理面Fp相對於水平面(XY平面)以既定角度交叉之狀態,例如傾斜狀態或配置成大致垂直之狀態。亦即,使該片狀基板FB之基板處理面Fp豎立之狀態亦包含基板FB之短邊方向為非水平姿勢之狀態。 As shown in FIG. 1 and FIG. 2, the substrate processing apparatus FPA has a substrate supply unit SU that supplies a sheet substrate (for example, a strip-shaped film member) FB, and processes the surface (processed surface) Fp of the sheet substrate FB. The substrate processing unit PR, the chamber CB (not shown in FIG. 1) in which the substrate processing unit PR is housed, the substrate collection unit CL that collects the sheet substrate FB, and the control unit CONT that controls the respective units. The substrate processing apparatus FPA is provided, for example, at a factory or the like. In the present embodiment, the sheet substrate FB is supplied, processed, and recovered in an upright state. In the present embodiment, the erected state includes a state in which the processed surface Fp of the sheet substrate FB intersects at a predetermined angle with respect to a horizontal plane (XY plane), for example, a state of being inclined or a state of being substantially perpendicular. In other words, the state in which the substrate processing surface Fp of the sheet substrate FB is erected also includes a state in which the short side direction of the substrate FB is in a non-horizontal posture.

以下之說明中,設定XYZ正交座標系統,一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。具體而言,設水平面上之既定方向為X軸方向、在該水平面上與X軸方向正交之方向為Y軸方向、鉛垂方向為Z軸方向。又,設繞X軸、Y軸、Z軸之旋轉(傾斜)方向分別為θX、θY、θZ方向。 In the following description, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. Specifically, the predetermined direction on the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction on the horizontal plane is the Y-axis direction, and the vertical direction is the Z-axis direction. Further, the directions of rotation (inclination) around the X-axis, the Y-axis, and the Z-axis are θX, θY, and θZ directions, respectively.

又,實施形態中,以片狀基板FB之基板處理面Fp相對於水平面為大致垂直之狀態為例進行說明。 Further, in the embodiment, a state in which the substrate-treated surface Fp of the sheet substrate FB is substantially perpendicular to the horizontal plane will be described as an example.

基板處理裝置FPA,係在從基板供應部SU送出捲繞成捲軸 狀之片狀基板FB後至以基板回收部CL將片狀基板FB回收成捲軸狀之期間對片狀基板FB之表面進行各種處理之捲軸對捲軸方式(以下,簡記為「捲軸方式」)之裝置。基板處理裝置FPA,可使用於在片狀基板FB上形成例如有機EL元件、液晶顯示元件等顯示元件(電子元件)之情形。當然,在形成此等元件以外之元件之情形使用基板處理裝置FPA亦可。 The substrate processing apparatus FPA is sent out from the substrate supply unit SU and wound into a reel The reel-to-reel method (hereinafter, abbreviated as "reel method") for performing various processing on the surface of the sheet-like substrate FB while the sheet-like substrate FB is collected in a reel shape by the substrate-receiving portion CL Device. The substrate processing apparatus FPA can be used to form a display element (electronic element) such as an organic EL element or a liquid crystal display element on the sheet substrate FB. Of course, the substrate processing apparatus FPA may be used in the case of forming an element other than these elements.

作為在基板處理裝置FPA成為處理對象之片狀基板FB,可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂等材料。 As the sheet substrate FB to be processed by the substrate processing apparatus FPA, for example, a resin film or a foil such as stainless steel can be used. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, or the like may be used. Materials such as polycarbonate resin, polystyrene resin, and vinyl acetate resin.

片狀基板FB之短邊方向之尺寸係形成為例如50cm~2m程度、長邊方向之尺寸則形成為例如10m以上。當然,此尺寸僅為一例,並不限於此例。例如片狀基板FB之短邊方向之尺寸為50cm以下亦可、亦可為2m以上。又,片狀基板FB之長邊方向之尺寸亦可在10m以下。 The dimension in the short-side direction of the sheet-like substrate FB is, for example, about 50 cm to 2 m, and the dimension in the longitudinal direction is formed to be, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the dimension of the short side direction of the sheet substrate FB may be 50 cm or less, or may be 2 m or more. Further, the dimension of the longitudinal direction of the sheet substrate FB may be 10 m or less.

片狀基板FB係形成為例如具有1mm以下之厚度且具有可撓性。此處,所謂可撓性,係指例如對基板施以至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外,例如因上述既定力而彎折之性質亦包含於所指之可撓性。又,上述可撓性會隨著該基板材質、大小、厚度、以及温度等之環境等而改變。再者,片狀基板FB可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。 The sheet substrate FB is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken by applying a predetermined force to at least its own weight. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility indicated. Further, the flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate. Further, the sheet substrate FB may be a strip-shaped substrate, or a plurality of unit substrates may be connected to form a strip shape.

片狀基板FB,以承受例如200℃程度之熱其尺寸亦實質上 無變化之熱膨脹係數較小者較佳。例如可將無機填料混於樹脂膜以降低熱膨脹係數。作為無機填料,例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。 The sheet substrate FB is subjected to heat of, for example, about 200 ° C, and its size is also substantially A smaller coefficient of thermal expansion without change is preferred. For example, an inorganic filler may be mixed in the resin film to lower the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

基板供應部SU具有供應埠10(圖1中省略圖示)與配置在該供應埠10內之軸構件11及支承部12。軸構件11係形成為例如圓柱狀,中心軸配置成例如與Z方向大致平行。因此,在軸構件11,以豎立狀態捲繞有片狀基板FB。軸構件11係設成可相對支承部12拆裝。支承部12將該軸構件11可旋轉地支承在周方向(例如θZ方向)。基板供應部SU,將捲繞成例如捲軸狀之片狀基板FB在該片狀基板FB之短邊方向豎立之狀態下、亦即在與Z方向一致之狀態下(亦即,該片狀基板FB為非水平姿勢)送出並供應至基板處理部PR。 The substrate supply unit SU has a supply port 10 (not shown in FIG. 1 ) and a shaft member 11 and a support portion 12 disposed in the supply port 10 . The shaft member 11 is formed, for example, in a cylindrical shape, and the central axis is disposed, for example, substantially in parallel with the Z direction. Therefore, in the shaft member 11, the sheet substrate FB is wound in an upright state. The shaft member 11 is detachably attachable to the support portion 12. The support portion 12 rotatably supports the shaft member 11 in the circumferential direction (for example, the θZ direction). The substrate supply unit SU is in a state in which the sheet-like substrate FB wound in the form of a reel is erected in the short-side direction of the sheet-like substrate FB, that is, in a state of being aligned with the Z direction (that is, the sheet-like substrate) The FB is sent to the substrate processing unit PR in a non-horizontal posture.

在供應埠10內設有捲繞有保護片狀基板FB之被處理面Fp之保護基板PB之軸構件13。此外,將設在供應埠10內之軸構件13稱為保護基板供應部亦可。保護基板PB,係在基板處理部PR之處理完成後、藉由基板回收部CL回收前黏貼於片狀基板FB之基板。保護基板PB,與片狀基板FB相同,係形成為例如帶狀且具有可撓性之構成。軸構件13係形成為例如圓筒狀,中心軸配置成例如與Z方向大致平行。因此,在軸構件13,以豎立狀態捲繞有保護基板PB。軸構件13係藉由支承部14可旋轉地支承在周方向(例如θZ方向)。軸構件13係設成可相對支承部14拆裝。基板供應部SU,將保護基板PB在豎立狀態下送出並供應至基板處理部PR。 A shaft member 13 around which a protective substrate PB for protecting the surface Fp of the sheet substrate FB is wound is provided in the supply crucible 10. Further, the shaft member 13 provided in the supply port 10 may be referred to as a protective substrate supply portion. The protective substrate PB is adhered to the substrate of the sheet substrate FB before being recovered by the substrate collecting portion CL after the processing of the substrate processing portion PR is completed. The protective substrate PB is formed in, for example, a strip shape and has flexibility, similar to the sheet substrate FB. The shaft member 13 is formed, for example, in a cylindrical shape, and the central axis is disposed substantially parallel to the Z direction, for example. Therefore, in the shaft member 13, the protective substrate PB is wound in an upright state. The shaft member 13 is rotatably supported in the circumferential direction (for example, the θZ direction) by the support portion 14. The shaft member 13 is detachably attachable to the support portion 14. The substrate supply unit SU sends the protective substrate PB in an upright state and supplies it to the substrate processing unit PR.

基板回收部CL將在黏貼有保護基板PB之狀態下從基板處理部PR搬送來之片狀基板FB,在該片狀基板FB及保護基板PB之短邊方向豎立之狀態下捲繞回收。在基板回收部CL之回收埠20(圖1中省略圖示), 與基板供應部SU同樣地,設有用以捲繞片狀基板FB及保護基板PB之軸構件21與將該軸構件21支承成可旋轉之支承部22。軸構件21係設成可相對支承部22拆裝。 The substrate-receiving portion CL is wound and recovered in a state in which the sheet-like substrate FB that has been transported from the substrate processing portion PR in a state in which the protective substrate PB is adhered and erected in the short-side direction of the sheet-like substrate FB and the protective substrate PB. In the recovery 埠 20 of the substrate collection unit CL (not shown in FIG. 1 ), Similarly to the substrate supply unit SU, a shaft member 21 for winding the sheet substrate FB and the protective substrate PB and a support portion 22 for supporting the shaft member 21 so as to be rotatable are provided. The shaft member 21 is detachably attachable to the support portion 22.

基板供應部SU之供應埠10與基板回收部CL之回收埠20係配置在例如收容基板處理部PR之腔室CB之外部。供應埠10及回收埠20係配置在腔室CB之例如-Y側之面,相對於基板處理部PR例如在X方向並排配置。如上述,由於供應埠10與回收埠20共同配置在一個部位,因此能對該供應埠10及回收埠20高效率進行存取。 The supply cassette 10 of the substrate supply unit SU and the recovery cassette 20 of the substrate collection unit CL are disposed outside the chamber CB that houses the substrate processing unit PR, for example. The supply port 10 and the recovery port 20 are disposed on the surface of the chamber CB, for example, on the -Y side, and are arranged side by side with respect to the substrate processing portion PR, for example, in the X direction. As described above, since the supply port 10 and the recovery cassette 20 are disposed together in one portion, the supply port 10 and the recovery cassette 20 can be accessed with high efficiency.

基板處理部PR將從基板供應部SU供應之片狀基板FB在豎立狀態下搬送向基板回收部CL,且在搬送過程中對豎立狀態之片狀基板FB之被處理面Fp進行處理。基板處理部PR具有例如搬送機構等之搬送裝置30、處理裝置40及對準裝置(未圖示)等。基板處理部PR係收容於經空調管理之真空腔室CB內,管理成環境溫度與環境溼度一定且保護上述各裝置不受塵埃等影響。 The substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate collection unit CL in an upright state, and processes the processed surface Fp of the sheet substrate FB in the upright state during the transfer. The substrate processing unit PR includes, for example, a transport device 30 such as a transport mechanism, a processing device 40, and an aligning device (not shown). The substrate processing unit PR is housed in the vacuum chamber CB managed by the air conditioner, and is managed such that the ambient temperature and the ambient humidity are constant and the devices are protected from dust and the like.

如圖1及圖2所示,搬送裝置30具有複數個(例如6個)導引滾筒R101~R106與2個處理滾筒31及32。導引滾筒R101~R104將片狀基板FB從基板供應部SU導引至基板回收部CL。導引滾筒R105及R106以與片狀基板FB不同之路徑將保護基板PB從基板供應部SU導引至基板回收部CL。 As shown in FIGS. 1 and 2, the transport device 30 has a plurality of (for example, six) guide rollers R101 to R106 and two process rollers 31 and 32. The guide rollers R101 to R104 guide the sheet substrate FB from the substrate supply portion SU to the substrate collection portion CL. The guide rollers R105 and R106 guide the protective substrate PB from the substrate supply portion SU to the substrate recovery portion CL in a path different from the sheet substrate FB.

導引滾筒R101~R106係配置成例如旋轉軸與Z軸方向大致平行。因此,在導引滾筒R101~R104,片狀基板FB係以豎立狀態(如上述,基板FB之短邊方向實質上非水平之姿勢)懸掛。又,在導引滾筒R105及 R106,保護基板PB係以豎立狀態懸掛。導引滾筒R101~R106為例如設有驅動機構之構成亦可。由於導引滾筒R101~R104捲繞有片狀基板FB之被處理面Fp,因此為例如在各導引滾筒R101~R104之圓筒面設有形成氣體層之未圖示之氣體層形成裝置之構成亦可。藉由上述構成,片狀基板FB係保持既定張力被搬送於至少導引滾筒R101~R104之間。 The guide rollers R101 to R106 are arranged such that, for example, the rotation axis is substantially parallel to the Z-axis direction. Therefore, in the guide rollers R101 to R104, the sheet substrate FB is suspended in an upright state (as described above, the short side direction of the substrate FB is substantially non-horizontal). Also, in the guide roller R105 and R106, the protective substrate PB is suspended in an upright state. The guide rollers R101 to R106 may be configured to have a drive mechanism, for example. Since the guide rollers F101 to R104 are wound with the processed surface Fp of the sheet substrate FB, for example, a gas layer forming device (not shown) for forming a gas layer is provided on the cylindrical surface of each of the guide rollers R101 to R104. It can also be constructed. According to the above configuration, the sheet substrate FB is conveyed between at least the guide rollers R101 to R104 while maintaining a predetermined tension.

處理滾筒31及32係配置在例如導引滾筒R101~R104之片狀基板FB之導引路徑。處理滾筒31及32係配置成在腔室CB內例如於Y方向上之位置相同。本實施形態中,例如處理滾筒31及32皆配置在腔室CB內於Y方向之大致中央部。 The processing rollers 31 and 32 are disposed, for example, on a guiding path of the sheet-like substrate FB of the guiding rollers R101 to R104. The processing rollers 31 and 32 are arranged to have the same position in the chamber CB, for example, in the Y direction. In the present embodiment, for example, the processing rolls 31 and 32 are disposed in a substantially central portion of the chamber CB in the Y direction.

處理滾筒31及32係分別形成為圓筒狀(作為一例,直徑1~數m程度之桶狀)。處理滾筒31及32係配置成例如中心軸與Z方向大致平行,以豎立狀態懸掛有片狀基板FB。處理滾筒31及32係形成為例如較導引滾筒R101~R104大徑。 Each of the processing drums 31 and 32 is formed in a cylindrical shape (for example, a barrel having a diameter of 1 to several m). The processing drums 31 and 32 are arranged such that, for example, the central axis is substantially parallel to the Z direction, and the sheet substrate FB is suspended in an upright state. The processing rolls 31 and 32 are formed to have a larger diameter than the guide rolls R101 to R104, for example.

處理滾筒31及32係分別設在夾連接於基板供應部SU之供應口SUa與連接於基板回收部CL之回收口CLa之位置。更具體而言,處理滾筒31係配置在供應口SUa之-X側,處理滾筒32係配置在回收口CLa之+X側。 The processing rollers 31 and 32 are respectively provided at positions where the supply port SUa connected to the substrate supply unit SU and the recovery port CLa connected to the substrate collection unit CL are sandwiched. More specifically, the processing drum 31 is disposed on the -X side of the supply port SUa, and the processing drum 32 is disposed on the +X side of the recovery port CLa.

作為基板處理部PR內中片狀基板FB之搬送方向,首先,例如從供應口SUa往+Y方向搬送,藉由導引滾筒R101往-X方向(其中往-Y側傾斜45°之方向)轉換搬送方向。經過導引滾筒R101之片狀基板FB係藉由處理滾筒31折返,搬送方向轉換成+X方向。從處理滾筒31往+X方向折返後之片狀基板FB,藉由導引滾筒R102往+Y方向轉換搬送方向, 藉由處理裝置40之一部分(預備加工裝置44)搬送方向轉換成-Y方向。經過預備加工裝置44之片狀基板FB,藉由導引滾筒R103往+X方向轉換搬送方向,藉由處理滾筒32折返,往-X方向(其中往+Y側傾斜45°之方向)轉換搬送方向。經過處理滾筒32之片狀基板FB,藉由導引滾筒R104往-Y方向轉換搬送方向,搬送至回收口CLa。以上述方式,搬送裝置30,在腔室CB內於X方向及Y方向頻繁切換搬送方向並同時搬送片狀基板FB。 The transport direction of the sheet-like substrate FB in the substrate processing unit PR is first transported from the supply port SUa to the +Y direction, for example, by the guide roller R101 in the -X direction (in the direction inclined to the -Y side by 45°). Convert the transfer direction. The sheet substrate FB that has passed through the guide roller R101 is folded back by the process drum 31, and the conveyance direction is converted into the +X direction. The sheet substrate FB that has been folded back from the processing drum 31 in the +X direction is transferred to the +Y direction by the guide roller R102. The conveyance direction is converted to the -Y direction by a portion of the processing device 40 (preparation processing device 44). The sheet-like substrate FB of the preliminary processing device 44 is transferred to the +X direction by the guide roller R103, and is transferred by the processing roller 32, and is transferred to the -X direction (in the direction inclined by 45° toward the +Y side). direction. The sheet substrate FB that has passed through the processing drum 32 is transferred to the recovery port CLa by the guide roller R104 in the -Y direction. In the above-described manner, the transport device 30 frequently switches the transport direction in the X direction and the Y direction in the chamber CB and simultaneously transports the sheet substrate FB.

處理裝置40係用以對片狀基板FB之被處理面Fp形成例如有機EL元件之裝置。本實施形態中,作為例如處理裝置40,使用例如洗淨裝置41、TFT層形成裝置42、乾燥裝置(乾燥部)43、預備加工裝置44、發光層形成裝置45、層壓裝置46等。此外,設置例如用以在被處理面Fp上形成分隔壁之分隔壁形成裝置(未圖示)等其他裝置亦可。 The processing device 40 is a device for forming, for example, an organic EL element on the processed surface Fp of the sheet substrate FB. In the present embodiment, for example, the cleaning device 41, the TFT layer forming device 42, the drying device (drying portion) 43, the preliminary processing device 44, the light-emitting layer forming device 45, the laminating device 46, and the like are used. Further, other means such as a partition wall forming means (not shown) for forming a partition wall on the surface Fp to be processed may be provided.

作為此種處理裝置40之種類,使用例如液滴塗布裝置(例如噴墨型塗布裝置、網版印刷型塗布裝置等)、蒸鍍裝置、濺鍍裝置等成膜裝置、或曝光裝置、顯影裝置、表面改質裝置、洗淨裝置等各種裝置。此等各裝置係適當設在例如片狀基板FB之搬送路徑上。 As a type of such a processing apparatus 40, for example, a film forming apparatus such as a droplet applying apparatus (for example, an ink jet type coating apparatus or a screen printing type coating apparatus), a vapor deposition apparatus, and a sputtering apparatus, or an exposure apparatus or a developing apparatus are used. Various devices such as surface modification devices and cleaning devices. Each of these devices is suitably provided, for example, on a transport path of the sheet substrate FB.

洗淨裝置41具有洗淨片狀基板FB之第一洗淨裝置41A與洗淨保護基板PB之第二洗淨裝置41B。第一洗淨裝置41A係設在片狀基板FB之搬送路徑例如供應口SUa(參照圖2)與處理滾筒31之間。又,第二洗淨裝置41B係設在保護基板PB之搬送路徑例如供應口SUb與層壓裝置46之間。洗淨裝置41將從腔室CB之外部往內部供應之片狀基板FB或保護基板PB潔淨化。 The cleaning device 41 has a first cleaning device 41A that cleans the sheet substrate FB and a second cleaning device 41B that cleans the protective substrate PB. The first cleaning device 41A is disposed between the transport path of the sheet substrate FB, for example, between the supply port SUa (see FIG. 2) and the process drum 31. Further, the second cleaning device 41B is disposed between the transfer path of the protective substrate PB, for example, between the supply port SUb and the laminating device 46. The cleaning device 41 cleans the sheet substrate FB or the protective substrate PB supplied from the outside of the chamber CB to the inside.

TFT層形成裝置42係形成用以驅動有機EL元件之TFT元 件或電極之裝置。TFT層形成裝置42具有例如第一形成裝置42A、第二形成裝置42B及第三形成裝置42C。第一形成裝置42A係配置在處理滾筒31之-Y側。第二形成裝置42B係配置在處理滾筒31之-X側。第三形成裝置42C係配置在處理滾筒31之+Y側。處理滾筒31之+X側為空的狀態,配置有例如導引滾筒R101。 The TFT layer forming device 42 forms a TFT element for driving the organic EL element Piece or electrode device. The TFT layer forming device 42 has, for example, a first forming device 42A, a second forming device 42B, and a third forming device 42C. The first forming device 42A is disposed on the -Y side of the process drum 31. The second forming device 42B is disposed on the -X side of the process drum 31. The third forming device 42C is disposed on the +Y side of the process drum 31. The +X side of the processing drum 31 is empty, and for example, a guide roller R101 is disposed.

此等第一形成裝置42A、第二形成裝置42B及第三形成裝置42C係設在例如處理滾筒31之周圍。形成TFT元件及電極之一連串步驟係藉由例如第一形成裝置42A、第二形成裝置42B及第三形成裝置42C分擔進行。 The first forming device 42A, the second forming device 42B, and the third forming device 42C are disposed around, for example, the processing drum 31. The step of forming one of the TFT elements and the electrodes is carried out by, for example, the first forming means 42A, the second forming means 42B, and the third forming means 42C.

第一形成裝置42A、第二形成裝置42B及第三形成裝置42C分別朝向處理滾筒31,可對以豎立狀態捲繞於處理滾筒31之片狀基板FB進行處理。處理滾筒31成為在進行TFT層形成裝置42之處理時支承片狀基板FB之支承部。 The first forming device 42A, the second forming device 42B, and the third forming device 42C are respectively directed toward the processing drum 31, and can process the sheet substrate FB wound in the upright state on the processing drum 31. The processing drum 31 serves as a support portion that supports the sheet substrate FB when the TFT layer forming apparatus 42 is processed.

乾燥裝置43係藉由例如加熱片狀基板FB以使形成在該片狀基板FB之TFT元件或電極等穩定化之裝置。乾燥裝置43係配置在片狀基板FB之搬送路徑處理滾筒31與處理滾筒32之間。乾燥裝置43係配置成例如從Y方向觀察時與處理滾筒31及處理滾筒32一部分重疊。 The drying device 43 is a device for stabilizing a TFT element or an electrode formed on the sheet substrate FB by, for example, heating the sheet substrate FB. The drying device 43 is disposed between the conveyance path processing drum 31 of the sheet substrate FB and the processing drum 32. The drying device 43 is disposed so as to overlap a part of the processing drum 31 and the processing drum 32 when viewed from the Y direction, for example.

如圖1及圖2所示,預備加工裝置44係進行在片狀基板FB形成發光層時之預備步驟(例如,絕緣層形成步驟等)之裝置。預備加工裝置44係與乾燥裝置43一起配置在例如片狀基板FB之搬送路徑處理滾筒31與處理滾筒32之間。預備加工裝置44具有例如第一加工裝置44A、第二加工裝置44B及第三加工裝置44C,一連串預備加工步驟係分擔進行。 As shown in FIGS. 1 and 2, the preliminary processing device 44 is a device for performing a preliminary step (for example, an insulating layer forming step) when the light-emitting layer is formed on the sheet substrate FB. The preparatory processing device 44 is disposed between the transport path processing drum 31 and the processing drum 32, for example, the sheet substrate FB, together with the drying device 43. The preliminary processing device 44 has, for example, a first processing device 44A, a second processing device 44B, and a third processing device 44C, and a series of preliminary processing steps are performed in a shared manner.

發光層形成裝置45係形成構成有機EL元件之發光層之裝置。發光層形成裝置45具有例如第一形成裝置45A、第二形成裝置45B及第三形成裝置45C。該第一形成裝置45A、第二形成裝置45B及第三形成裝置45C係設在例如處理滾筒32之周圍。形成發光層之一連串步驟係藉由例如第一形成裝置45A、第二形成裝置45B及第三形成裝置45C分擔進行。 The light-emitting layer forming device 45 is a device that forms a light-emitting layer of an organic EL element. The light-emitting layer forming device 45 has, for example, a first forming device 45A, a second forming device 45B, and a third forming device 45C. The first forming device 45A, the second forming device 45B, and the third forming device 45C are disposed around, for example, the processing drum 32. The series of steps of forming the light-emitting layer is carried out by, for example, the first forming means 45A, the second forming means 45B, and the third forming means 45C.

第一形成裝置45A係配置在處理滾筒32之+Y側。第二形成裝置45B係配置在處理滾筒32之+X側。第三形成裝置45C係配置在處理滾筒32之-Y側。處理滾筒32之-X側為空的狀態,配置有例如導引滾筒R104。 The first forming device 45A is disposed on the +Y side of the process drum 32. The second forming device 45B is disposed on the +X side of the process drum 32. The third forming device 45C is disposed on the -Y side of the process drum 32. The -X side of the processing drum 32 is empty, and for example, a guide roller R104 is disposed.

層壓裝置46係將片狀基板FB與保護基板(保護材)PB加以貼合之裝置。層壓裝置46係配置在片狀基板FB之搬送路徑例如處理滾筒32與回收口CLa之間。層壓裝置46之構成,係使保護基板PB對向配置在例如片狀基板FB之被處理面Fp側,在片狀基板FB與保護基板PB之間進行對準,之後,將片狀基板FB與保護基板PB加以貼合。 The laminating device 46 is a device that bonds the sheet substrate FB and the protective substrate (protective material) PB. The laminating device 46 is disposed between the processing path of the sheet substrate FB, for example, between the processing drum 32 and the recovery port CLa. The laminating device 46 is configured such that the protective substrate PB is disposed opposite to the surface to be processed Fp of the sheet substrate FB, for example, and is aligned between the sheet substrate FB and the protective substrate PB, and then the sheet substrate FB is placed. It is bonded to the protective substrate PB.

上述處理裝置40之中,例如TFT層形成裝置42之第一形成裝置42A、第一洗淨裝置41A、第二洗淨裝置41B、發光層形成裝置45之第三形成裝置45C係配置成從X方向觀察時重疊。又,TFT層形成裝置42之第二形成裝置42B、處理滾筒31、處理滾筒32、發光層形成裝置45之第二形成裝置45B係配置成從X方向觀察時重疊。再者,TFT層形成裝置42之第三形成裝置42C、乾燥裝置43、發光層形成裝置45之第一形成裝置45A係配置成從X方向觀察時重疊。 Among the processing devices 40, for example, the first forming device 42A of the TFT layer forming device 42, the first cleaning device 41A, the second cleaning device 41B, and the third forming device 45C of the light-emitting layer forming device 45 are arranged from X. Overlapping when viewing in the direction. Further, the second forming device 42B of the TFT layer forming device 42, the processing roller 31, the processing roller 32, and the second forming device 45B of the light-emitting layer forming device 45 are arranged to overlap when viewed in the X direction. Further, the third forming device 42C of the TFT layer forming device 42, the drying device 43, and the first forming device 45A of the light-emitting layer forming device 45 are arranged to overlap when viewed in the X direction.

又,例如TFT層形成裝置42之第一形成裝置42A、處理滾 筒31、第三形成裝置42C係配置成從Y方向觀察時重疊。又,例如洗淨裝置41A及41B與乾燥裝置43係配置成從Y方向觀察時重疊。又,預備加工裝置44與層壓裝置46係配置成從Y方向觀察時重疊。再者,發光層形成裝置45之第一形成裝置45A、處理滾筒32、第三形成裝置45C係配置成從Y方向觀察時重疊。如上述,搬送裝置30及處理裝置40係密集配置成從X方向及Y方向觀察時重疊部分變多。 Further, for example, the first forming means 42A of the TFT layer forming device 42 and the processing roll The cylinder 31 and the third forming device 42C are arranged to overlap when viewed in the Y direction. Further, for example, the cleaning devices 41A and 41B and the drying device 43 are disposed so as to overlap each other when viewed from the Y direction. Further, the preliminary processing device 44 and the laminating device 46 are disposed so as to overlap each other when viewed in the Y direction. Further, the first forming device 45A, the processing roller 32, and the third forming device 45C of the light-emitting layer forming device 45 are arranged to overlap when viewed in the Y direction. As described above, the conveying device 30 and the processing device 40 are densely arranged so as to increase the number of overlapping portions when viewed in the X direction and the Y direction.

以上述方式構成之基板處理裝置FPA係藉由控制部CONT之控制以捲軸方式製造有機EL元件、液晶顯示元件等顯示元件(電子元件)。以下,說明使用上述構成之基板處理裝置FPA製造顯示元件之步驟。 In the substrate processing apparatus FPA configured as described above, a display element (electronic element) such as an organic EL element or a liquid crystal display element is manufactured by a reel method under the control of the control unit CONT. Hereinafter, a procedure of manufacturing a display element using the substrate processing apparatus FPA having the above configuration will be described.

首先,將在軸構件11捲繞成捲軸狀之帶狀之片狀基板FB安裝於基板供應部SU之供應埠10內之支承部12。又,將捲繞在軸構件13之帶狀之保護基板PB安裝於基板供應部SU之供應埠10內之支承部14。再者,將回收用之軸構件21安裝於基板回收部CL之回收埠20內之支承部22。 First, the strip-shaped substrate FB in which the shaft member 11 is wound into a roll shape is attached to the support portion 12 in the supply cassette 10 of the substrate supply portion SU. Moreover, the strip-shaped protective substrate PB wound around the shaft member 13 is attached to the support portion 14 in the supply port 10 of the substrate supply portion SU. Further, the shaft member 21 for recovery is attached to the support portion 22 in the recovery cassette 20 of the substrate collecting portion CL.

控制部CONT在此狀態下透過支承部12使軸構件11旋轉,從基板供應部SU送出該片狀基板FB。從基板供應部SU送出之片狀基板FB,係從基板處理部PR之供應口SUa供應至腔室CB內。控制部CONT將供應至腔室CB內之片狀基板FB搬送至搬送裝置30並同時藉由各處理裝置40對該片狀基板FB進行處理。本實施形態中,控制部CONT以藉由適當設在加工用滾筒31,32及各滾筒R101~R106之旋轉驅動用馬達對片狀基板FB賦予既定張力之方式逐一控制各馬達。 In this state, the control unit CONT rotates the shaft member 11 through the support portion 12, and sends the sheet substrate FB from the substrate supply portion SU. The sheet substrate FB sent from the substrate supply unit SU is supplied into the chamber CB from the supply port SUa of the substrate processing unit PR. The control unit CONT transports the sheet substrate FB supplied into the chamber CB to the transport device 30 while processing the sheet substrate FB by each processing device 40. In the present embodiment, the control unit CONT controls the motors one by one by applying a predetermined tension to the sheet substrate FB by appropriately providing the rotation rollers for the processing rollers 31 and 32 and the rollers R101 to R106.

藉由此動作,供應至基板處理部PR之片狀基板FB係藉由 第一洗淨裝置41A洗淨,藉由導引滾筒R101導引至處理滾筒31。片狀基板FB,係以被處理面Fp分別朝向TFT層形成裝置42之第一形成裝置42A、第二形成裝置42B及第三形成裝置42C之方式,以豎立狀態捲繞纏掛在處理滾筒31。在捲繞纏掛在處理滾筒31之片狀基板FB之被處理面Fp,藉由該TFT層形成裝置42形成TFT元件或配線等。 By this action, the sheet substrate FB supplied to the substrate processing portion PR is used by The first cleaning device 41A is washed and guided to the processing drum 31 by the guide roller R101. The sheet substrate FB is wound and wound around the processing drum 31 in an upright state so that the processed surface Fp faces the first forming device 42A, the second forming device 42B, and the third forming device 42C of the TFT layer forming device 42, respectively. . A TFT element, wiring, or the like is formed by the TFT layer forming device 42 by winding the processed surface Fp of the sheet substrate FB wound around the processing drum 31.

經過處理滾筒31之片狀基板FB係供應至乾燥裝置43,例如施加加熱處理等乾燥處理。乾燥處理後之片狀基板FB係透過例如導引滾筒R102供應至預備加工裝置44。預備加工裝置44,在例如第一加工裝置44A~第三加工裝置44C,在片狀基板FB形成絕緣膜或電洞注入層或電子注入層等。 The sheet substrate FB that has passed through the processing drum 31 is supplied to the drying device 43, and for example, a drying process such as heat treatment is applied. The sheet substrate FB after the drying process is supplied to the preliminary processing device 44 through, for example, the guide roller R102. In the preliminary processing device 44, for example, the first processing device 44A to the third processing device 44C form an insulating film, a hole injection layer, an electron injection layer, or the like on the sheet substrate FB.

預備加工後之片狀基板FB係透過例如導引滾筒R103導引至處理滾筒32。片狀基板FB,係以被處理面Fp分別朝向發光層形成裝置45之第一形成裝置45A、第二形成裝置45B及第三形成裝置45C之方式,以豎立狀態捲繞纏掛在處理滾筒32。在捲繞纏掛在處理滾筒32之片狀基板FB之被處理面Fp,藉由該發光層形成裝置45形成發光層等。 The sheet substrate FB after the preliminary processing is guided to the processing drum 32 through, for example, the guide roller R103. The sheet substrate FB is wound around the processing drum 32 in an upright state so that the processed surface Fp faces the first forming device 45A, the second forming device 45B, and the third forming device 45C of the light emitting layer forming device 45, respectively. . The light-emitting layer or the like is formed by the light-emitting layer forming device 45 by winding the processed surface Fp of the sheet substrate FB wound around the processing drum 32.

經過處理滾筒32之片狀基板FB係供應至層壓裝置46,在被處理面Fp黏貼保護基板PB。黏貼保護基板(保護材)PB後之片狀基板FB係從例如回收口CLa回收至基板回收部CL。回收至基板回收部CL之片狀基板FB係在回收埠20內之軸構件21捲繞成捲軸狀。在軸構件21捲繞有既定量之片狀基板FB後,將片狀基板FB例如切斷,將捲繞有片狀基板FB之軸構件21從支承部22移除。在該支承部22安裝例如未捲繞片狀基板FB之新的軸構件21。 The sheet substrate FB that has passed through the processing drum 32 is supplied to the laminating device 46, and the protective substrate PB is adhered to the surface Fp to be processed. The sheet substrate FB after the protective substrate (protective material) PB is adhered to the substrate recovery portion CL from, for example, the recovery port CLa. The sheet member FB recovered in the substrate recovery portion CL is wound into a reel shape in the shaft member 21 in the recovery crucible 20. After the sheet member FB of a predetermined amount is wound around the shaft member 21, the sheet substrate FB is cut, for example, and the shaft member 21 around which the sheet substrate FB is wound is removed from the support portion 22. A new shaft member 21, for example, in which the sheet substrate FB is not wound, is attached to the support portion 22.

控制部CONT係藉由進行上述處理,對片狀基板FB之被處理面Fp形成元件。 The control unit CONT forms an element on the processed surface Fp of the sheet substrate FB by performing the above processing.

如上述,根據本實施形態,由於具備將形成為帶狀之片狀基板FB之短邊方向在豎立狀態下供應該片狀基板FB之基板供應部SU、具有將從該基板供應部SU供應之片狀基板FB在豎立狀態下搬送之搬送裝置30及沿著該搬送裝置30之片狀基板FB之搬送路徑配置且對豎立狀態之片狀基板FB之被處理面Fp進行處理之複數個處理裝置40之基板處理部PR、將在該基板處理部PR進行處理後之片狀基板FB在豎立狀態下回收之基板回收部CL,因此成為易於將片狀基板FB之搬送方向在水平方向(X方向及Y方向)轉換之構成。 As described above, according to the present embodiment, the substrate supply unit SU that supplies the sheet substrate FB in the erect state in the short-side direction of the strip-shaped substrate FB is provided, and the substrate supply unit SU is supplied from the substrate supply unit SU. A plurality of processing apparatuses in which the sheet substrate FB is transported in the upright state and the transport path of the sheet substrate FB of the transport apparatus 30 is disposed, and the processed surface Fp of the sheet substrate FB in the upright state is processed. In the substrate processing unit PR of 40, the substrate-receiving portion CL in which the sheet-like substrate FB processed in the substrate processing unit PR is collected in an upright state is easy to move the sheet-like substrate FB in the horizontal direction (X direction). And the composition of the Y direction) conversion.

因此,可增加處理裝置40在X方向及Y方向之佈置之選擇寬度,例如亦能以極力縮小基板處理裝置FPA4之裝置面積之方式選擇配置處理裝置40之佈置。藉此,可謀求基板處理裝置FPA4之省空間化。 Therefore, the selection width of the arrangement of the processing device 40 in the X direction and the Y direction can be increased. For example, the arrangement of the processing device 40 can be selected in such a manner as to minimize the device area of the substrate processing device FPA4. Thereby, space saving of the substrate processing apparatus FPA4 can be achieved.

(第二實施形態) (Second embodiment)

接著,說明本發明第二實施形態之基板處理裝置。 Next, a substrate processing apparatus according to a second embodiment of the present invention will be described.

圖3係顯示基板處理裝置FPA2之構成的俯視圖。在基板處理裝置FPA2,基板處理部PR之構成與第一實施形態不同。其他構成能與例如第一實施形態為相同構成。本實施形態中,以該不同點為中心進行說明。 FIG. 3 is a plan view showing the configuration of the substrate processing apparatus FPA2. In the substrate processing apparatus FPA2, the configuration of the substrate processing unit PR is different from that of the first embodiment. The other configuration can be configured in the same manner as, for example, the first embodiment. In the present embodiment, the difference will be mainly described.

如圖3所示,基板處理裝置FPA2具有基板供應部SU、基板處理部PR、基板回收部CL、腔室CB及控制部CONT。基板處理部PR係收容在腔室CB內。基板供應部SU具有形成為圓筒狀且中心軸配置成與Z方向平行之軸構件111、及將該軸構件111支承成可旋轉之支承部112。 在軸構件111,片狀基板FB係以豎立狀態捲繞。此外,為了簡化說明,圖3中,在基板供應部SU省略供應保護基板之構成之圖示。基板回收部CL具有形成為圓筒狀且中心軸配置成與Z方向平行之軸構件121、及將該軸構件121支承成可旋轉之支承部122。 As shown in FIG. 3, the substrate processing apparatus FPA2 includes a substrate supply unit SU, a substrate processing unit PR, a substrate recovery unit CL, a chamber CB, and a control unit CONT. The substrate processing unit PR is housed in the chamber CB. The substrate supply portion SU has a shaft member 111 that is formed in a cylindrical shape and whose central axis is arranged in parallel with the Z direction, and a support portion 112 that supports the shaft member 111 so as to be rotatable. In the shaft member 111, the sheet substrate FB is wound in an upright state. In addition, in order to simplify the description, in FIG. 3, the illustration of the structure which supplies a protective substrate is abbreviate|omitted in the board|substrate supply part SU. The substrate collecting portion CL has a shaft member 121 which is formed in a cylindrical shape and whose central axis is arranged in parallel with the Z direction, and a support portion 122 that supports the shaft member 121 so as to be rotatable.

基板處理部PR之搬送裝置130,在腔室CB內之俯視時中央部具有處理搬送滾筒131。處理搬送滾筒131係形成為例如圓筒狀,配置成中心軸與Z方向平行。處理搬送滾筒131係設成例如可在θZ方向旋轉。片狀基板FB係以豎立狀態懸掛在該處理搬送滾筒131。如上述,在基板處理部PR,片狀基板FB係以豎立狀態被搬送。 The conveyance device 130 of the substrate processing unit PR has a processing conveyance roller 131 at the center in a plan view in the chamber CB. The processing conveyance roller 131 is formed, for example, in a cylindrical shape, and is arranged such that the central axis is parallel to the Z direction. The processing conveyance drum 131 is configured to be rotatable in the θZ direction, for example. The sheet substrate FB is suspended from the process conveyance drum 131 in an upright state. As described above, in the substrate processing unit PR, the sheet substrate FB is transported in an upright state.

處理搬送滾筒131具有例如未圖示之旋轉驅動機構。該旋轉驅動機構係藉由例如控制部CONT控制。從供應口SUa供應之片狀基板FB係懸掛在該處理搬送滾筒131並搬送至回收口CLa。在處理搬送滾筒131,以例如被處理面Fp朝向外側之方式懸掛片狀基板FB。 The processing conveyance drum 131 has a rotation drive mechanism which is not shown, for example. The rotary drive mechanism is controlled by, for example, a control unit CONT. The sheet substrate FB supplied from the supply port SUa is suspended from the process conveyance drum 131 and conveyed to the recovery port CLa. In the processing of the transport roller 131, the sheet substrate FB is suspended such that the processed surface Fp faces outward.

基板處理部PR,在處理搬送滾筒131之周圍以沿著該處理搬送滾筒131之圓筒面之方式配置有複數個處理裝置140。作為該處理裝置140,係使用例如在第一實施形態說明之各種處理裝置。在圖3所示之例,作為複數個處理裝置140,將進行TFT層形成步驟之各處理裝置、發光層形成步驟之前置處理(預備步驟)各處理裝置、進行發光層形成步驟之各處理裝置沿著處理搬送滾筒131之周方向一列並排。複數個處理裝置140係分別朝向處理搬送滾筒131。 In the substrate processing unit PR, a plurality of processing apparatuses 140 are disposed around the processing conveyance drum 131 so as to follow the cylindrical surface of the processing conveyance drum 131. As the processing device 140, for example, various processing devices described in the first embodiment are used. In the example shown in FIG. 3, each of the processing means for performing the TFT layer forming step, the processing means before the light-emitting layer forming step (preparation step), and the processing for performing the light-emitting layer forming step are performed as the plurality of processing apparatuses 140. The devices are arranged side by side in the circumferential direction of the processing conveyance drum 131. A plurality of processing apparatuses 140 are respectively oriented toward the processing conveyance drum 131.

在上述基板處理裝置FPA2,從基板供應部SU對基板處理部PR以豎立狀態供應片狀基板FB。片狀基板FB,係在基板處理部PR以 豎立狀態懸掛在處理搬送滾筒131被搬送至基板回收部CL。又,藉由複數個處理裝置140,對例如以豎立狀態懸掛在處理搬送滾筒131之片狀基板FB依序進行處理。 In the substrate processing apparatus FPA2, the sheet substrate FB is supplied from the substrate supply unit SU to the substrate processing unit PR in an upright state. The sheet substrate FB is attached to the substrate processing unit PR The erected state is suspended in the process transport roller 131 and transported to the substrate collecting portion CL. Further, the plurality of processing apparatuses 140 sequentially process the sheet-like substrate FB suspended in the processing conveyance drum 131 in an upright state, for example.

如上述,根據本實施形態,處理搬送滾筒131兼具支承以豎立狀態捲繞之片狀基板FB之功能、及將該片狀基板FB以豎立狀態搬送之功能。藉此,可謀求基板處理裝置FPA2之省空間化。又,由於在一個處理搬送滾筒131之周圍進行所有步驟,因此能使基板處理部PR內之裝置之佈置簡單化。 As described above, according to the present embodiment, the processing conveyance roller 131 has a function of supporting the sheet substrate FB wound in the upright state and a function of transporting the sheet substrate FB in the upright state. Thereby, space saving of the substrate processing apparatus FPA2 can be achieved. Further, since all the steps are performed around one processing conveyance roller 131, the arrangement of the devices in the substrate processing portion PR can be simplified.

(第三實施形態) (Third embodiment)

接著,說明本發明第三實施形態之基板處理裝置。 Next, a substrate processing apparatus according to a third embodiment of the present invention will be described.

圖4係顯示基板處理裝置FPA3之構成的俯視圖。在基板處理裝置FPA3,基板處理部PR之構成與第一實施形態不同。其他構成能與例如第一實施形態為相同構成。本實施形態中,以該不同點為中心進行說明。 4 is a plan view showing the configuration of the substrate processing apparatus FPA3. In the substrate processing apparatus FPA3, the configuration of the substrate processing unit PR is different from that of the first embodiment. The other configuration can be configured in the same manner as, for example, the first embodiment. In the present embodiment, the difference will be mainly described.

如圖4所示,基板處理裝置FPA3之構成,係在基板處理部PR設置複數個在第二實施形態說明之處理搬送滾筒。本實施形態中,基板處理部PR之搬送裝置230具有導引滾筒R111~R114與處理搬送滾筒231~233。 As shown in FIG. 4, the substrate processing apparatus FPA3 is configured such that a plurality of processing conveyance rollers described in the second embodiment are provided in the substrate processing unit PR. In the present embodiment, the transport device 230 of the substrate processing unit PR has the guide rollers R111 to R114 and the process transport rollers 231 to 233.

導引滾筒R111~R114及處理搬送滾筒231~233係分別形成為圓筒狀,配置成中心軸分別與Z方向平行。處理搬送滾筒231~233係形成為較導引滾筒R111~R114大徑。片狀基板FB係以豎立狀態懸掛在該處理搬送滾筒231~233及導引滾筒R111~R114。如上述,在基板處理部PR,片狀基板FB係以豎立狀態被搬送。 The guide rollers R111 to R114 and the process transport rollers 231 to 233 are each formed in a cylindrical shape, and are arranged such that the central axes are parallel to the Z direction. The processing conveyance rollers 231 to 233 are formed to have larger diameters than the guide rollers R111 to R114. The sheet substrate FB is suspended from the process conveyance rollers 231 to 233 and the guide rollers R111 to R114 in an upright state. As described above, in the substrate processing unit PR, the sheet substrate FB is transported in an upright state.

作為搬送裝置230之配置,例如導引滾筒R111~R114係以縱橫各並排二列之狀態配置在腔室CB之大致中央部。又,處理搬送滾筒231~233係配置成從三方向(-X方向、+Y方向、-X方向)圍繞該四個導引滾筒R111~R114。 As the arrangement of the transporting device 230, for example, the guide rollers R111 to R114 are arranged in a substantially central portion of the chamber CB in a state in which the vertical and horizontal rows are arranged in two rows. Further, the processing conveyance rollers 231 to 233 are arranged to surround the four guide rollers R111 to R114 from three directions (-X direction, +Y direction, and -X direction).

基板處理部PR,在處理搬送滾筒231~233之周圍以沿著該處理搬送滾筒231~233之圓筒面之方式分別配置有複數個處理裝置241~243。作為該處理裝置241~243,係使用例如在第一實施形態說明之各種處理裝置。例如,作為處理裝置241係使用進行TFT層形成步驟之各處理裝置,作為處理裝置242係使用進行發光層形成步驟之前置處理(預備步驟)之各處理裝置,作為處理裝置243係使用進行發光層形成步驟之各處理裝置亦可。各處理裝置241~243係朝向例如處理搬送滾筒231~233。 In the substrate processing unit PR, a plurality of processing units 241 to 243 are disposed around the processing transfer rollers 231 to 233 so as to follow the cylindrical surfaces of the processing transport rollers 231 to 233. As the processing devices 241 to 243, for example, various processing devices described in the first embodiment are used. For example, each processing device that performs the TFT layer forming step is used as the processing device 241, and each processing device that performs the light emitting layer forming step pre-processing (preparation step) is used as the processing device 242, and is used as the processing device 243 to emit light. Each processing device of the layer forming step may also be used. Each of the processing apparatuses 241 to 243 faces, for example, the processing conveyance rollers 231 to 233.

基板處理部PR,複數個處理搬送滾筒231~233係形成為例如圓筒狀,配置成中心軸與Z方向平行。處理搬送滾筒231係設成可在例如θZ方向旋轉。 In the substrate processing unit PR, the plurality of processing conveyance rollers 231 to 233 are formed, for example, in a cylindrical shape, and the central axis is arranged in parallel with the Z direction. The processing conveyance roller 231 is configured to be rotatable in, for example, the θZ direction.

處理搬送滾筒231~233具有例如未圖示之旋轉驅動機構。該旋轉驅動機構係藉由例如控制部CONT控制。從供應口SUa供應之片狀基板FB係懸掛在該處理搬送滾筒231~233並搬送至回收口CLa。在處理搬送滾筒231~233,以例如被處理面Fp朝向外側之方式懸掛片狀基板FB。另一方面,在導引滾筒R111~R114,以被處理面Fp朝向內側之方式懸掛片狀基板FB。 The processing conveyance rollers 231 to 233 have, for example, a rotation drive mechanism (not shown). The rotary drive mechanism is controlled by, for example, a control unit CONT. The sheet substrate FB supplied from the supply port SUa is suspended from the process conveyance rollers 231 to 233 and transported to the recovery port CLa. In the processing of the transport rollers 231 to 233, the sheet substrate FB is suspended such that the processed surface Fp faces outward. On the other hand, in the guide rollers R111 to R114, the sheet substrate FB is suspended so that the surface to be processed Fp faces inward.

在上述基板處理裝置FPA3,從基板供應部SU對基板處理部PR以豎立狀態供應片狀基板FB。片狀基板FB,係在基板處理部PR以 豎立狀態懸掛在處理搬送滾筒231~233被搬送至基板回收部CL。又,藉由複數個處理裝置241~243,對例如以豎立狀態懸掛在處理搬送滾筒231~233之片狀基板FB分別依序進行處理。 In the substrate processing apparatus FPA3, the sheet substrate FB is supplied from the substrate supply unit SU to the substrate processing unit PR in an upright state. The sheet substrate FB is attached to the substrate processing unit PR The erected state is suspended by the process transport rollers 231 to 233 and transported to the substrate collecting portion CL. Further, the plurality of processing apparatuses 241 to 243 sequentially process the sheet substrates FB suspended in the processing conveyance rollers 231 to 233, for example, in an erect state.

如上述,根據本實施形態,藉由使用複數個處理搬送滾筒231~233,能在例如複數個區域分別使連續之處理分擔進行。藉此,能增加佈置之選擇寬度。又,根據本實施形態,由於為導引滾筒R111~R114集中在例如腔室CB之中央部之構成,因此藉由例如使乾燥裝置等處理裝置244配置在該腔室CB之中央部,能使在各處理搬送滾筒231~233處理後之片狀基板FB之乾燥處理等之處理共通化。藉此,可謀求省空間化。 As described above, according to the present embodiment, by using a plurality of process transport rollers 231 to 233, continuous processing can be performed in, for example, a plurality of regions. Thereby, the selection width of the arrangement can be increased. Further, according to the present embodiment, since the guide rollers R111 to R114 are concentrated in the central portion of the chamber CB, for example, by disposing the processing device 244 such as a drying device in the central portion of the chamber CB, for example, The processing such as the drying process of the sheet substrate FB after the respective processing of the transfer rollers 231 to 233 is common. Thereby, space can be saved.

(第四實施形態) (Fourth embodiment)

以下,參照圖式說明本發明第四實施形態。以下,適當省略關於賦予與上述實施形態相同符號之構成品之說明。 Hereinafter, a fourth embodiment of the present invention will be described with reference to the drawings. Hereinafter, the description of the components having the same reference numerals as those of the above embodiment will be omitted as appropriate.

圖5係顯示基板處理裝置FPA之構成的立體圖。圖6係顯示基板處理裝置FPA之構成的俯視圖。 Fig. 5 is a perspective view showing the configuration of the substrate processing apparatus FPA. Fig. 6 is a plan view showing the configuration of the substrate processing apparatus FPA.

在第四實施形態,搬送裝置30具有複數個(例如10個)導引滾筒R1~R10、桶機構DRM、處理滾筒32。導引滾筒R1~R8將片狀基板FB從基板供應部SU導引至基板回收部CL。導引滾筒R9及R10將保護基板PB以與片狀基板FB不同之路徑從基板供應部SU導引至基板回收部CL。此外,設桶機構DRM為第一桶機構、處理滾筒32為第二桶機構亦可。 In the fourth embodiment, the conveying device 30 has a plurality of (for example, ten) guide rollers R1 to R10, a tub mechanism DRM, and a processing drum 32. The guide rollers R1 to R8 guide the sheet substrate FB from the substrate supply portion SU to the substrate collection portion CL. The guide rollers R9 and R10 guide the protective substrate PB from the substrate supply portion SU to the substrate recovery portion CL in a different path from the sheet substrate FB. Further, the barrel mechanism DRM may be the first barrel mechanism, and the processing drum 32 may be the second barrel mechanism.

導引滾筒R1~R3,R6~R10係配置成例如旋轉軸與Z軸方向大致平行。因此,在導引滾筒R1~R3,R6~R8,片狀基板FB係以豎立狀態懸掛。又,在導引滾筒R9及R10,保護基板PB係以豎立狀態懸掛。導引 滾筒R1~R10為設有例如驅動機構之構成亦可。關於捲繞有例如片狀基板FB之被處理面Fp之導引滾筒R1,R4,R7,R8,為在圓筒面設有形成氣體層(空氣軸承)之未圖示之氣體層形成裝置之構成亦可。不論如何,本實施形態之情形,片狀基板FB係保持既定張力被搬送於至少導引滾筒R1~R9之間。 The guide rollers R1 to R3 and R6 to R10 are arranged such that, for example, the rotation axis is substantially parallel to the Z-axis direction. Therefore, in the guide rollers R1 to R3, R6 to R8, the sheet substrate FB is suspended in an upright state. Further, in the guide rollers R9 and R10, the protective substrate PB is suspended in an upright state. guide The rollers R1 to R10 may be configured to have, for example, a drive mechanism. The guide rolls R1, R4, R7, and R8 around which the processed surface Fp of the sheet-like substrate FB is wound are provided with a gas layer forming device (not shown) in which a gas layer (air bearing) is formed on the cylindrical surface. It can also be constructed. In any case, in the case of the present embodiment, the sheet substrate FB is conveyed between at least the guide rollers R1 to R9 while maintaining a predetermined tension.

圖7係顯示基板處理部PR之中桶機構DRM之附近之構成的立體圖。 FIG. 7 is a perspective view showing a configuration of the vicinity of the tub mechanism DRM in the substrate processing unit PR.

如圖7所示,桶機構DRM具有配置成旋轉中心軸與Z方向大致平行之圓筒構件CYL、及將該圓筒構件CYL支承成可在圓周方向旋轉之旋轉驅動機構(驅動部)ACT。圓筒構件CYL具有第一圓筒部(第1滾筒)CY1、第二圓筒部(第2滾筒)CY2、及導引部G。 As shown in Fig. 7, the tub mechanism DRM has a cylindrical member CYL that is disposed such that the central axis of rotation is substantially parallel to the Z direction, and a rotary drive mechanism (drive portion) ACT that supports the cylindrical member CYL so as to be rotatable in the circumferential direction. The cylindrical member CYL has a first cylindrical portion (first roller) CY1, a second cylindrical portion (second roller) CY2, and a guiding portion G.

第一圓筒部CY1及第二圓筒部CY2係分別為該圓筒構件CYL之圓筒面之一部分。由於第一圓筒部CY1及第二圓筒部CY2皆為一個圓筒構件CYL之一部分,因此若圓筒構件CYL旋轉則第一圓筒部CY1及第二圓筒部CY2會一體旋轉。 The first cylindrical portion CY1 and the second cylindrical portion CY2 are each a part of the cylindrical surface of the cylindrical member CYL. Since both the first cylindrical portion CY1 and the second cylindrical portion CY2 are part of one cylindrical member CYL, when the cylindrical member CYL is rotated, the first cylindrical portion CY1 and the second cylindrical portion CY2 are integrally rotated.

第一圓筒部CY1及第二圓筒部CY2係藉由例如導引部G在Z方向分割。亦即,第二圓筒部CY2,相對於第一圓筒部CY1在Z方向之位置、亦即在相對於水平方向交叉之方向之位置不同。第一圓筒部CY1係配置在導引部G之+Z側(上方),第二圓筒部CY2係配置在導引部G之-Z側(下方)。第一圓筒部CY1及第二圓筒部CY2係形成為例如彼此具有相等之徑。第一圓筒部CY1及第二圓筒部CY2係形成為較例如導引滾筒R1~R10大徑(例如直徑1m以上)。導引部G係以片狀基板FB之中捲繞於第一圓筒部CY1之部分及捲繞於第二圓筒部CY2之部分沿著與XY平面平行之 面搬送之方式進行導引。 The first cylindrical portion CY1 and the second cylindrical portion CY2 are divided in the Z direction by, for example, the guiding portion G. That is, the second cylindrical portion CY2 is different in position in the Z direction with respect to the first cylindrical portion CY1, that is, in a direction intersecting with the horizontal direction. The first cylindrical portion CY1 is disposed on the +Z side (upper side) of the guiding portion G, and the second cylindrical portion CY2 is disposed on the -Z side (lower side) of the guiding portion G. The first cylindrical portion CY1 and the second cylindrical portion CY2 are formed to have, for example, equal diameters to each other. The first cylindrical portion CY1 and the second cylindrical portion CY2 are formed to have a larger diameter (for example, a diameter of 1 m or more) than, for example, the guide rollers R1 to R10. The guiding portion G is a portion of the sheet substrate FB wound around the first cylindrical portion CY1 and a portion wound around the second cylindrical portion CY2 is parallel to the XY plane. Guided by the way of face transfer.

在片狀基板FB之搬送路徑,在第一圓筒部CY1與第二圓筒部CY2之間配置有導引滾筒R2~R5。導引滾筒R2將被第一圓筒部CY1以半周程折返成U字狀並往+X方向搬送之片狀基板FB往-Y方向折返。導引滾筒R3將往-Y方向折返後之片狀基板FB往-X方向折返。 Guide rollers R2 to R5 are disposed between the first cylindrical portion CY1 and the second cylindrical portion CY2 in the transport path of the sheet substrate FB. The guide roller R2 is folded back in the -Y direction by the sheet substrate FB which is folded back into a U shape by the first cylindrical portion CY1 in a half-cycle and transported in the +X direction. The guide roller R3 folds back the sheet substrate FB folded in the -Y direction in the -X direction.

導引滾筒R4及R5,係以例如+Z側之端部往+X側傾斜之狀態配置。導引滾筒R4將透過導引滾筒R3導引至-X方向之片狀基板FB往斜下方向(+X方向且往-Z側傾斜之方向)折返。導引滾筒R5係配置在導引滾筒R4之斜下方向(+X方向且往-Z側傾斜之方向)上。導引滾筒R5將從導引滾筒R4往斜下方向搬送之片狀基板FB往-X方向折返,使其朝向第二圓筒部CY2。 The guide rollers R4 and R5 are disposed, for example, in a state where the end portion on the +Z side is inclined toward the +X side. The guide roller R4 is folded back by the guide roller R3 to the sheet-like substrate FB in the -X direction in the obliquely downward direction (the +X direction and the direction inclined to the -Z side). The guide roller R5 is disposed in the obliquely downward direction (the +X direction and the direction inclined to the -Z side) of the guide roller R4. The guide roller R5 is folded back in the -X direction from the guide roller R4 in the obliquely downward direction so as to be directed toward the second cylindrical portion CY2.

導引滾筒R4及R5,在圖7之構成之情形,設定成其旋轉軸線保持彼此大致平行且在XZ平面內傾斜既定量。 In the case of the configuration of Fig. 7, the guide rollers R4 and R5 are set such that their rotation axes are kept substantially parallel to each other and are inclined in the XZ plane by a predetermined amount.

又,在導引滾筒R4及R5設有可調整例如旋轉軸之傾斜(傾斜量或傾斜方向)之致動器。藉由調整導引滾筒R4及R5之至少一個之該旋轉軸之傾斜狀態,能使從導引滾筒R5往-X方向送出之片狀基板FB之搬送方向成為水平(與X軸平行)並同時將片狀基板之Z方向之位置維持成大致一定。導引滾筒R4及R5之至少一個之旋轉軸之傾斜狀態之調整,可藉由接收來自精密監測從導引滾筒R5往-X方向送出之片狀基板FB之姿勢或位置之變化之感測器之測量訊號之控制部CONT驅動傾斜調整用之致動器來控制。 Further, the guide rollers R4 and R5 are provided with actuators that can adjust, for example, the tilt (inclination amount or tilt direction) of the rotary shaft. By adjusting the tilting state of the rotating shaft of at least one of the guiding rollers R4 and R5, the conveying direction of the sheet substrate FB fed from the guide roller R5 to the -X direction can be horizontal (parallel to the X axis) and simultaneously The position of the sheet substrate in the Z direction is maintained substantially constant. The adjustment of the tilting state of the rotating shaft of at least one of the guide rollers R4 and R5 can be performed by receiving a sensor from the position or position of the sheet substrate FB which is precisely monitored from the guide roller R5 to the -X direction. The control unit CONT of the measurement signal drives the actuator for tilt adjustment to control.

如上述,導引滾筒R2~R5係以捲繞在第一圓筒部CY1之外周面後之片狀基板FB之搬送方向朝向第二圓筒部CY2之方向之方式轉換 片狀基板FB之搬送方向。尤其是,能藉由導引滾筒R4,R5之對,不改變片狀基板FB之搬送方向(-X方向)而僅使Z方向之高度位置偏移既定量(本實施形態中為片狀基板FB之Z方向之寬度量以上)。此外,如本實施形態般,使片狀基板折返往Z方向平行偏移之情形,在導引滾筒R4及R5之間片狀基板FB在XZ面內被傾斜搬送,但此傾斜量係根據片狀基板之寬度量、導引滾筒R4,R5之X方向之間隔、導引滾筒R4,R5之旋轉中心軸之傾斜角度或傾斜方向等以幾何學方式決定。是以,本實施形態之情形,若使導引滾筒R4,R5以各旋轉中心軸在XZ面內皆傾斜45度之方式在Z方向之上下並置,則使在導引滾筒R4及R5之間行進之片狀基板垂直(傾斜量90度)亦可。 As described above, the guide rollers R2 to R5 are switched in such a manner that the conveyance direction of the sheet-like substrate FB wound around the outer circumferential surface of the first cylindrical portion CY1 is directed toward the second cylindrical portion CY2. The conveying direction of the sheet substrate FB. In particular, it is possible to shift the height position of the Z direction by a predetermined amount without changing the conveyance direction (-X direction) of the sheet substrate FB by the pair of the guide rollers R4 and R5 (in the present embodiment, the sheet substrate) The width of the FB in the Z direction is greater than or equal to). Further, in the case where the sheet substrate is folded back in the Z direction in the same manner as in the present embodiment, the sheet substrate FB is obliquely conveyed in the XZ plane between the guide rollers R4 and R5, but the amount of tilt is based on the sheet. The width of the substrate, the interval between the guiding rollers R4 and R5 in the X direction, the inclination angle or the inclination direction of the central axes of rotation of the guiding rollers R4 and R5 are geometrically determined. Therefore, in the case of the present embodiment, if the guide rollers R4, R5 are juxtaposed in the Z direction so that the respective rotation center axes are inclined by 45 degrees in the XZ plane, the guide rollers R4 and R5 are placed between the guide rollers R4 and R5. The traveling sheet substrate may be vertical (a tilt amount of 90 degrees).

又,藉由導引滾筒R2~R5,片狀基板FB係導引至例如在導引滾筒R1之位置被導引之片狀基板FB之-Z側(下側)之空間。如上述,本實施形態中,相對於片狀基板FB往第一圓筒部CY1之捲繞方向,片狀基板FB往第二圓筒部CY2之捲繞方向相同,以片狀基板FB之表面背面不反轉之方式,藉由導引滾筒R2~R5導引片狀基板FB。 Further, by the guide rollers R2 to R5, the sheet substrate FB is guided to a space on the -Z side (lower side) of the sheet substrate FB guided at the position of the guide roller R1, for example. As described above, in the present embodiment, the winding direction of the sheet substrate FB toward the first cylindrical portion CY1 is the same as the winding direction of the sheet substrate FB toward the second cylindrical portion CY2, and the surface of the sheet substrate FB is the same. The back surface is not reversed, and the sheet substrate FB is guided by the guide rollers R2 to R5.

如圖5及圖6所示,處理滾筒32係配置在例如導引滾筒R1~R4之片狀基板FB之導引路徑。處理滾筒32係形成為例如圓筒狀。處理滾筒32係配置成例如中心軸與Z方向大致平行,片狀基板FB以豎立狀態懸掛。處理滾筒32係形成為較例如導引滾筒R1~R10大徑。該處理滾筒32之徑構成為與上述第一圓筒部CY1及第二圓筒部CY2大致等徑亦可。 As shown in FIGS. 5 and 6, the process roller 32 is disposed, for example, on a guide path of the sheet substrate FB of the guide rollers R1 to R4. The processing drum 32 is formed, for example, in a cylindrical shape. The processing drum 32 is disposed such that, for example, the central axis is substantially parallel to the Z direction, and the sheet substrate FB is suspended in an upright state. The processing drum 32 is formed to have a larger diameter than, for example, the guiding rollers R1 to R10. The diameter of the treatment drum 32 may be substantially equal to the first cylindrical portion CY1 and the second cylindrical portion CY2.

洗淨裝置41係用以使從腔室CB之外部往內部供應之片狀基板FB或保護基板PB潔淨化而設,具有洗淨片狀基板FB之第一洗淨裝置41A及洗淨保護基板PB之第二洗淨裝置41B。第一洗淨裝置41A係設在 片狀基板FB之搬送路徑例如供應口SUa(參照圖6)與圓筒構件CYL之間。又,第二洗淨裝置41B係設在保護基板PB之搬送路徑例如供應口SUb與層壓裝置46之間。 The cleaning device 41 is provided to clean the sheet substrate FB or the protective substrate PB supplied from the outside of the chamber CB to the inside, and has a first cleaning device 41A for cleaning the sheet substrate FB and a cleaning protective substrate. The second cleaning device 41B of PB. The first cleaning device 41A is provided at The conveyance path of the sheet substrate FB is, for example, between the supply port SUa (see FIG. 6) and the cylindrical member CYL. Further, the second cleaning device 41B is disposed between the transfer path of the protective substrate PB, for example, between the supply port SUb and the laminating device 46.

配置在桶機構DRM之周圍之TFT層形成裝置42係形成用以驅動有機EL元件之TFT元件或電極、配線層等之裝置。TFT層形成裝置42具有例如第一形成裝置42A、第二形成裝置42B及第三形成裝置42C。第一形成裝置42A係配置在圓筒構件CYL之-Y側。第二形成裝置42B係配置在圓筒構件CYL之-X側。第三形成裝置42C係配置在圓筒構件CYL之+Y側。 The TFT layer forming device 42 disposed around the barrel mechanism DRM forms a device for driving a TFT element or an electrode of an organic EL element, a wiring layer, and the like. The TFT layer forming device 42 has, for example, a first forming device 42A, a second forming device 42B, and a third forming device 42C. The first forming device 42A is disposed on the -Y side of the cylindrical member CYL. The second forming device 42B is disposed on the -X side of the cylindrical member CYL. The third forming device 42C is disposed on the +Y side of the cylindrical member CYL.

如上述,第一形成裝置42A、第二形成裝置42B及第三形成裝置42C係設在圓筒構件CYL之周圍,形成TFT元件及電極、配線層等之一連串步驟係藉由例如第一形成裝置42A、第二形成裝置42B及第三形成裝置42C分擔進行。 As described above, the first forming device 42A, the second forming device 42B, and the third forming device 42C are disposed around the cylindrical member CYL, and a series of steps of forming a TFT element, an electrode, a wiring layer, and the like are performed by, for example, a first forming device. 42A, the second forming device 42B, and the third forming device 42C are shared.

圖8係顯示第一形成裝置42A、第二形成裝置42B及第三形成裝置42C與桶機構DRM之圓筒構件CYL之關係的圖。 Fig. 8 is a view showing the relationship between the first forming device 42A, the second forming device 42B, and the third forming device 42C and the cylindrical member CYL of the tub mechanism DRM.

如圖8所示,第一形成裝置42A、第二形成裝置42B及第三形成裝置42C分別具有二個處理部42A1及42A2、處理部42B1及42B2、處理部42C1及42C2。處理部42A1,42B1,42C1係分別與第一圓筒部CY1對向設置,可對懸掛在該第一圓筒部CY1之片狀基板FB進行處理。處理部42A2,42B2,42C2係分別與第二圓筒部CY2對向設置,可對懸掛在該第二圓筒部CY2之片狀基板FB進行處理。如上述,第一形成裝置42A、第二形成裝置42B及第三形成裝置42C可對以豎立狀態捲繞之片狀基板FB進行處理。此外, 第一圓筒部CY1及第二圓筒部CY2,在進行TFT層形成裝置42之處理時,成為支承片狀基板FB之支承部。 As shown in FIG. 8, the first forming device 42A, the second forming device 42B, and the third forming device 42C have two processing units 42A1 and 42A2, processing units 42B1 and 42B2, and processing units 42C1 and 42C2, respectively. The processing units 42A1, 42B1, and 42C1 are disposed to face the first cylindrical portion CY1, respectively, and can process the sheet substrate FB suspended in the first cylindrical portion CY1. The processing units 42A2, 42B2, and 42C2 are disposed opposite to the second cylindrical portion CY2, respectively, and can process the sheet substrate FB suspended in the second cylindrical portion CY2. As described above, the first forming device 42A, the second forming device 42B, and the third forming device 42C can process the sheet substrate FB wound in an upright state. In addition, The first cylindrical portion CY1 and the second cylindrical portion CY2 serve as support portions for supporting the sheet substrate FB when the TFT layer forming apparatus 42 is processed.

又,第一圓筒部CY1及第二圓筒部CY2成為支承片狀基板FB之支承部之情形,將桶機構稱為支承機構亦可。 Further, the first cylindrical portion CY1 and the second cylindrical portion CY2 may be supported by the support portion of the sheet substrate FB, and the barrel mechanism may be referred to as a support mechanism.

如圖5~圖7所示,乾燥裝置43係藉由例如加熱片狀基板FB以使形成在該片狀基板FB之TFT元件或電極等穩定化之裝置。在乾燥裝置43之-X側之面,如圖7所示設有二個插入口43a及43b。插入口43a係配置在+Z側,插入有經過第一圓筒部CY1後之片狀基板FB。插入口43b係配置在-Z側,插入有經過第二圓筒部CY2後之片狀基板FB。 As shown in FIG. 5 to FIG. 7, the drying device 43 is a device for stabilizing a TFT element or an electrode formed on the sheet substrate FB by, for example, heating the sheet substrate FB. On the side of the -X side of the drying device 43, as shown in Fig. 7, two insertion ports 43a and 43b are provided. The insertion port 43a is disposed on the +Z side, and the sheet substrate FB that has passed through the first cylindrical portion CY1 is inserted. The insertion port 43b is disposed on the -Z side, and the sheet substrate FB that has passed through the second cylindrical portion CY2 is inserted.

在乾燥裝置43之+X側之面,設有二個排出口43c及43d。排出口43c係配置在+Z側,供從插入口43a插入並進行乾燥處理後之片狀基板FB排出。排出口43d係配置在-Z側,供從插入口43b插入並進行乾燥處理後之片狀基板FB排出。 On the +X side of the drying device 43, two discharge ports 43c and 43d are provided. The discharge port 43c is disposed on the +Z side, and is discharged from the sheet substrate FB inserted into the insertion port 43a and dried. The discharge port 43d is disposed on the -Z side, and is discharged from the sheet substrate FB inserted into the insertion port 43b and dried.

如圖5及圖6所示,預備加工裝置44係進行在片狀基板FB形成發光層時之預備步驟(例如,絕緣層形成步驟等)之裝置。預備加工裝置44係與乾燥裝置43一起配置在例如片狀基板FB之搬送路徑桶機構DRM之圓筒構件CYL與處理滾筒32之間。預備加工裝置44具有例如第一加工裝置44A、第二加工裝置44B及第三加工裝置44C,一連串預備加工步驟係分擔進行。 As shown in FIGS. 5 and 6, the preliminary processing device 44 is a device for performing a preliminary step (for example, an insulating layer forming step) when forming a light-emitting layer on the sheet substrate FB. The preliminary processing device 44 is disposed between the cylindrical member CYL of the transport path barrel mechanism DRM of the sheet substrate FB and the processing drum 32 together with the drying device 43. The preliminary processing device 44 has, for example, a first processing device 44A, a second processing device 44B, and a third processing device 44C, and a series of preliminary processing steps are performed in a shared manner.

上述處理裝置40之中,例如TFT層形成裝置42之第一形成裝置42A、第一洗淨裝置41A、第二洗淨裝置41B、發光層形成裝置45之第三形成裝置45C係沿著第1方向(本實施形態中第1方向為X方向)配 置。又,TFT層形成裝置42之第二形成裝置42B、圓筒構件CYL、處理滾筒32、發光層形成裝置45之第二形成裝置45B係沿著X方向配置。再者,TFT層形成裝置42之第三形成裝置42C、乾燥裝置43、發光層形成裝置45之第一形成裝置45A係沿著X方向配置。 Among the processing devices 40, for example, the first forming device 42A of the TFT layer forming device 42, the first cleaning device 41A, the second cleaning device 41B, and the third forming device 45C of the light-emitting layer forming device 45 are along the first Direction (in the first embodiment, the first direction is the X direction) Set. Further, the second forming device 42B of the TFT layer forming device 42, the cylindrical member CYL, the processing roller 32, and the second forming device 45B of the light-emitting layer forming device 45 are arranged along the X direction. Further, the third forming device 42C of the TFT layer forming device 42, the drying device 43, and the first forming device 45A of the light-emitting layer forming device 45 are arranged along the X direction.

又,例如TFT層形成裝置42之第一形成裝置42A、圓筒構件CYL、第三形成裝置42C係沿著第2方向(本實施形態中為與X方向交叉之Y方向)配置。又,例如洗淨裝置41A及41B與乾燥裝置43係沿著Y方向配置。又,預備加工裝置44與層壓裝置46係沿著Y方向配置。再者,發光層形成裝置45之第一形成裝置45A、處理滾筒32、第三形成裝置45C係沿著Y方向配置。如上述,搬送裝置30及處理裝置40係沿著X方向及Y方向配置,因此密集配置成從X方向及Y方向觀察時各裝置彼此重疊部分變多。 Further, for example, the first forming device 42A, the cylindrical member CYL, and the third forming device 42C of the TFT layer forming device 42 are arranged along the second direction (the Y direction intersecting the X direction in the present embodiment). Further, for example, the cleaning devices 41A and 41B and the drying device 43 are arranged along the Y direction. Further, the preliminary processing device 44 and the laminating device 46 are arranged along the Y direction. Further, the first forming device 45A, the processing roller 32, and the third forming device 45C of the light-emitting layer forming device 45 are arranged along the Y direction. As described above, since the conveying device 30 and the processing device 40 are arranged along the X direction and the Y direction, they are densely arranged so that the overlapping portions of the respective devices when viewed in the X direction and the Y direction are increased.

以上述方式構成之基板處理裝置FPA係藉由控制部CONT之控制以捲軸方式製造有機EL元件、液晶顯示元件等顯示元件(電子元件)。以下,說明使用上述構成之基板處理裝置FPA製造顯示元件之步驟。 In the substrate processing apparatus FPA configured as described above, a display element (electronic element) such as an organic EL element or a liquid crystal display element is manufactured by a reel method under the control of the control unit CONT. Hereinafter, a procedure of manufacturing a display element using the substrate processing apparatus FPA having the above configuration will be described.

首先,將在軸構件11捲繞成捲軸狀之帶狀之片狀基板FB安裝於基板供應部SU之供應埠10內之支承部12。又,將捲繞在軸構件13之帶狀之保護基板PB安裝於基板供應部SU之供應埠10內之支承部14。再者,將回收用之軸構件21安裝於基板回收部CL之回收埠20內之支承部22。 First, the strip-shaped substrate FB in which the shaft member 11 is wound into a roll shape is attached to the support portion 12 in the supply cassette 10 of the substrate supply portion SU. Moreover, the strip-shaped protective substrate PB wound around the shaft member 13 is attached to the support portion 14 in the supply port 10 of the substrate supply portion SU. Further, the shaft member 21 for recovery is attached to the support portion 22 in the recovery cassette 20 of the substrate collecting portion CL.

控制部CONT在此狀態下透過支承部12使軸構件11旋轉,從基板供應部SU送出該片狀基板FB。從基板供應部SU送出之片狀基板 FB,係從基板處理部PR之供應口SUa供應至腔室CB內。控制部CONT將供應至腔室CB內之片狀基板FB搬送至搬送裝置30並同時藉由各處理裝置40對該片狀基板FB進行處理。此外,預先於在軸構件11捲繞成捲軸狀之片狀基板FB之前端部及終端部,黏貼用以使片狀基板FB往處理裝置FPA之自動裝載變容易之導頭片亦可。 In this state, the control unit CONT rotates the shaft member 11 through the support portion 12, and sends the sheet substrate FB from the substrate supply portion SU. Sheet substrate sent from the substrate supply portion SU FB is supplied into the chamber CB from the supply port SUa of the substrate processing unit PR. The control unit CONT transports the sheet substrate FB supplied into the chamber CB to the transport device 30 while processing the sheet substrate FB by each processing device 40. Further, in advance, the tip end portion and the end portion of the sheet-like substrate FB which is wound in the form of a reel in the form of a reel may be attached to the guide piece for facilitating automatic loading of the sheet-like substrate FB to the processing apparatus FPA.

藉由此動作,供應至基板處理部PR之片狀基板FB係藉由第一洗淨裝置41A洗淨,藉由導引滾筒R1導引至桶機構DRM之第一圓筒部CY1。片狀基板FB,係以被處理面Fp分別朝向TFT層形成裝置42之第一形成裝置42A、第二形成裝置42B及第三形成裝置42C之方式,以豎立狀態捲繞纏掛在第一圓筒部CY1。在捲繞纏掛在第一圓筒部CY1之片狀基板FB之被處理面Fp,藉由該TFT層形成裝置42(例如,處理部A1,B1及C1)形成TFT元件或配線等。 By this operation, the sheet substrate FB supplied to the substrate processing portion PR is washed by the first cleaning device 41A, and guided to the first cylindrical portion CY1 of the tub mechanism DRM by the guide roller R1. The sheet substrate FB is wound and wound in the first circle in an upright state so that the processed surface Fp faces the first forming device 42A, the second forming device 42B, and the third forming device 42C of the TFT layer forming device 42, respectively. Tube CY1. A TFT element, a wiring, or the like is formed by the TFT layer forming device 42 (for example, the processing portions A1, B1, and C1) by winding the processed surface Fp of the sheet substrate FB wound around the first cylindrical portion CY1.

經過第一圓筒部CY1之片狀基板FB係從乾燥裝置43之+Z側之插入口43a供應至乾燥裝置43之內部,例如施加加熱處理等乾燥處理。乾燥處理後之片狀基板FB係從乾燥裝置43之+Z側之排出口43c搬出。搬出之片狀基板FB係藉由例如導引滾筒R2往-Y方向導引,藉由導引滾筒R3往-X方向導引。經過導引滾筒R3之片狀基板FB係藉由導引滾筒R4往斜下方向(+X方向且往-Z側傾斜之方向)導引,藉由導引滾筒R5往-X方向導引。 The sheet substrate FB that has passed through the first cylindrical portion CY1 is supplied from the insertion port 43a on the +Z side of the drying device 43 to the inside of the drying device 43, and, for example, a drying process such as heat treatment is applied. The sheet substrate FB after the drying process is carried out from the discharge port 43c on the +Z side of the drying device 43. The sheet substrate FB that is carried out is guided in the -Y direction by, for example, the guide roller R2, and guided in the -X direction by the guide roller R3. The sheet substrate FB passing through the guide roller R3 is guided by the guide roller R4 in the obliquely downward direction (the +X direction and the direction inclined to the -Z side), and guided by the guide roller R5 in the -X direction.

經過導引滾筒R5之片狀基板FB係以豎立狀態捲繞纏掛在桶機構DRM之第二圓筒部CY2。在捲繞纏掛在第二圓筒部CY2之片狀基板FB之被處理面Fp,藉由該TFT層形成裝置42(例如,處理部A2,B2及 C2)重疊形成必要層之TFT元件或配線等。 The sheet substrate FB passing through the guide roller R5 is wound in an erected state around the second cylindrical portion CY2 of the tub mechanism DRM. The TFT-forming device F is formed by winding the processed surface Fp of the sheet substrate FB wound around the second cylindrical portion CY2 (for example, the processing portions A2, B2 and C2) A TFT element or wiring or the like which forms a necessary layer is superposed.

經過第二圓筒部CY2之片狀基板FB係從乾燥裝置43之-Z側之插入口43b供應至乾燥裝置43之內部,例如再次施加加熱處理等乾燥處理。乾燥處理後之片狀基板FB係從乾燥裝置43之-Z側之排出口43d搬出。搬出之片狀基板FB係藉由例如導引滾筒R6供應至預備加工裝置44。預備加工裝置44,在例如第一加工裝置44A~第三加工裝置44C,在片狀基板FB形成絕緣膜或電洞注入層或電子注入層等。 The sheet substrate FB that has passed through the second cylindrical portion CY2 is supplied from the insertion port 43b on the -Z side of the drying device 43 to the inside of the drying device 43, and, for example, a drying process such as heat treatment is applied again. The sheet substrate FB after the drying process is carried out from the discharge port 43d on the -Z side of the drying device 43. The sheet substrate FB that is carried out is supplied to the preliminary processing device 44 by, for example, the guide roller R6. In the preliminary processing device 44, for example, the first processing device 44A to the third processing device 44C form an insulating film, a hole injection layer, an electron injection layer, or the like on the sheet substrate FB.

預備加工後之片狀基板FB係透過例如導引滾筒R7導引至處理滾筒32。片狀基板FB,係以被處理面Fp分別朝向發光層形成裝置45之第一形成裝置45A、第二形成裝置45B及第三形成裝置45C之方式,以豎立狀態捲繞纏掛在處理滾筒32。在捲繞纏掛在處理滾筒32之片狀基板FB之被處理面Fp,藉由該發光層形成裝置45形成發光層等。 The sheet substrate FB after the preliminary processing is guided to the processing drum 32 through, for example, the guide roller R7. The sheet substrate FB is wound around the processing drum 32 in an upright state so that the processed surface Fp faces the first forming device 45A, the second forming device 45B, and the third forming device 45C of the light emitting layer forming device 45, respectively. . The light-emitting layer or the like is formed by the light-emitting layer forming device 45 by winding the processed surface Fp of the sheet substrate FB wound around the processing drum 32.

經過處理滾筒32之片狀基板FB係供應至層壓裝置46,在被處理面Fp黏貼保護基板PB。黏貼保護基板PB後之片狀基板FB係從例如回收口CLa回收至基板回收部CL。回收至基板回收部CL之片狀基板FB係在回收埠20內之軸構件21捲繞成捲軸狀。在軸構件21捲繞有既定量之片狀基板FB後,將片狀基板FB例如切斷,將捲繞有片狀基板FB之軸構件21從支承部22移除。在該支承部22安裝例如未捲繞片狀基板FB之新的軸構件21。 The sheet substrate FB that has passed through the processing drum 32 is supplied to the laminating device 46, and the protective substrate PB is adhered to the surface Fp to be processed. The sheet substrate FB after the protective substrate PB is adhered to the substrate recovery portion CL from, for example, the recovery port CLa. The sheet member FB recovered in the substrate recovery portion CL is wound into a reel shape in the shaft member 21 in the recovery crucible 20. After the sheet member FB of a predetermined amount is wound around the shaft member 21, the sheet substrate FB is cut, for example, and the shaft member 21 around which the sheet substrate FB is wound is removed from the support portion 22. A new shaft member 21, for example, in which the sheet substrate FB is not wound, is attached to the support portion 22.

控制部CONT係藉由進行上述處理,對片狀基板FB之被處理面Fp形成元件。 The control unit CONT forms an element on the processed surface Fp of the sheet substrate FB by performing the above processing.

如上述,根據本實施形態,在片狀基板FB捲繞在桶機構 DRM之第一圓筒部CY1之外周面之一部分後,該片狀基板FB之搬送方向轉換向第二圓筒部CY2,該片狀基板FB捲繞在第二圓筒部CY2,對捲繞在第一圓筒部CY1之一部分之被處理面Fp進行第一處理且對捲繞在第二圓筒部CY2之一部分之被處理面Fp進行第二處理,因此可對片狀基板FB高密度進行處理。藉此,可謀求基板處理裝置FPA之省空間化。 As described above, according to the present embodiment, the sheet substrate FB is wound around the barrel mechanism. After a part of the outer peripheral surface of the first cylindrical portion CY1 of the DRM, the conveying direction of the sheet substrate FB is switched to the second cylindrical portion CY2, and the sheet substrate FB is wound around the second cylindrical portion CY2, and is wound. The first processed surface Fp of one of the first cylindrical portions CY1 is subjected to the first processing and the second processed surface Fp of the processed portion Fp wound around one of the second cylindrical portions CY2 is performed, so that the high density of the sheet substrate FB can be obtained. Process it. Thereby, space saving of the substrate processing apparatus FPA can be achieved.

此外,在圖5及圖6所示之基板處理裝置FPA,在處理滾筒32,片狀基板FB僅捲繞一次,但與桶機構DRM之圓筒構件CYL同樣地,以具備第1圓筒部與第2圓筒部之二段圓筒部構成,在各圓筒部捲繞片狀基板FB亦可。再者,此構成中,將發光層形成裝置45配置在第1圓筒部與第2圓筒部亦可。此外,以二段圓筒部構成處理滾筒32之情形,如圖7所示之導引滾筒R4,R5,使用各旋轉中心軸傾斜之二個導引滾筒使片狀基板FB折返亦可。 Further, in the substrate processing apparatus FPA shown in FIG. 5 and FIG. 6, the sheet substrate FB is wound only once in the processing drum 32, but the first cylindrical portion is provided similarly to the cylindrical member CYL of the barrel mechanism DRM. The cylindrical portion of the second cylindrical portion may be formed, and the sheet substrate FB may be wound around each cylindrical portion. In this configuration, the light-emitting layer forming device 45 may be disposed in the first cylindrical portion and the second cylindrical portion. Further, in the case where the processing drum 32 is constituted by the two-stage cylindrical portion, the guide rollers R4, R5 shown in Fig. 7 may be folded back by the two guide rollers inclined by the respective rotation center axes.

(第五實施形態) (Fifth Embodiment)

接著,說明本發明第五實施形態。本實施形態中,桶機構之構成與第四實施形態不同,因此以桶機構之構成為中心進行說明。圖9係顯示本實施形態之桶機構DRM2之構成的立體圖。 Next, a fifth embodiment of the present invention will be described. In the present embodiment, the configuration of the tub mechanism is different from that of the fourth embodiment. Therefore, the configuration of the tub mechanism will be mainly described. Fig. 9 is a perspective view showing the configuration of the tub mechanism DRM2 of the present embodiment.

上述實施形態中,係以第一圓筒部CY1與第二圓筒部CY2形成為單一之圓筒構件CYL之構成為例進行說明,但第五實施形態中,如圖9所示,係顯示第一圓筒部CY1與第二圓筒部CY2形成為不同之圓筒構件(例如,第一圓筒構件C1與第二圓筒構件C2)之構成。 In the above embodiment, the configuration in which the first cylindrical portion CY1 and the second cylindrical portion CY2 are formed as a single cylindrical member CYL will be described as an example. However, in the fifth embodiment, as shown in FIG. The first cylindrical portion CY1 and the second cylindrical portion CY2 are formed as different cylindrical members (for example, the first cylindrical member C1 and the second cylindrical member C2).

如圖9所示,第一圓筒構件C1與第二圓筒構件C2係以在Z方向分離之狀態配置。第一圓筒構件C1之+Z側之端面C1a與第二圓筒構 件C2之-Z側之端面C2a彼此對向。旋轉軸SF之中心線係設成在第一圓筒構件C1與第二圓筒構件C2之間共通(在XY面內相同位置)。 As shown in FIG. 9, the first cylindrical member C1 and the second cylindrical member C2 are disposed in a state of being separated in the Z direction. End face C1a on the +Z side of the first cylindrical member C1 and the second cylindrical structure The end faces C2a on the -Z side of the piece C2 oppose each other. The center line of the rotating shaft SF is provided to be common between the first cylindrical member C1 and the second cylindrical member C2 (the same position in the XY plane).

圖9所示之構成中,在例如第一圓筒構件C1與第二圓筒構件C2之間,徑不同。具體而言,第一圓筒構件C1之徑D1大於第二圓筒構件C2之徑D2。如上述,藉由第一圓筒構件C1與第二圓筒構件C2具有不同之徑,可調整搬送路徑之路徑長度。 In the configuration shown in Fig. 9, for example, the diameter differs between the first cylindrical member C1 and the second cylindrical member C2. Specifically, the diameter D1 of the first cylindrical member C1 is larger than the diameter D2 of the second cylindrical member C2. As described above, the path length of the transport path can be adjusted by the first cylindrical member C1 and the second cylindrical member C2 having different diameters.

旋轉驅動機構ACT2為能使第一圓筒構件C1與第二圓筒構件C2分別獨立旋轉之構成亦可。又,旋轉驅動機構ACT2為僅使第一圓筒構件C1與第二圓筒構件C2中之一個旋轉之構成亦可。 The rotation drive mechanism ACT2 may be configured to allow the first cylindrical member C1 and the second cylindrical member C2 to rotate independently. Further, the rotation drive mechanism ACT2 may be configured to rotate only one of the first cylindrical member C1 and the second cylindrical member C2.

根據圖9所示之構成,經過例如導引滾筒R21之片狀基板FB捲繞懸掛在第一圓筒部CY1,透過導引滾筒(轉換部)R22及R23導引至第二圓筒部CY2。捲繞懸掛在第二圓筒部CY2後之片狀基板FB係透過導引滾筒R24導引。 According to the configuration shown in Fig. 9, the sheet-like substrate FB, for example, the guide roller R21, is wound and suspended in the first cylindrical portion CY1, and guided to the second cylindrical portion CY2 through the guide rollers (converting portions) R22 and R23. . The sheet substrate FB that is wound and suspended behind the second cylindrical portion CY2 is guided through the guide roller R24.

第一圓筒構件C1與第二圓筒構件C2之直徑之差異,可取決於配置在各圓筒構件C1,C2之周圍之各種處理裝置之加工形態或加工條件、加工部(加工頭部等)之設置尺寸等產生。 The difference in diameter between the first cylindrical member C1 and the second cylindrical member C2 may depend on the processing form or processing conditions of various processing devices disposed around each of the cylindrical members C1, C2, and the processing portion (processing head, etc.) The setting size and the like are generated.

本實施形態中,由於連續之片狀基板FB從第一圓筒構件C1搬送至第二圓筒構件C2,因此各圓筒構件C1,C2之直徑不同之情形,必須與該直徑之差異量對應使旋轉速度(rpm)亦產生差異。 In the present embodiment, since the continuous sheet substrate FB is transferred from the first cylindrical member C1 to the second cylindrical member C2, the diameter of each of the cylindrical members C1 and C2 must be different from the difference in diameter. The rotation speed (rpm) also makes a difference.

又,在第一圓筒構件C1與第二圓筒構件C2分別、或任一個圓筒構件設置旋轉驅動用之馬達之情形,在從片狀基板FB之與第一圓筒構件C1接觸之部分至與第二圓筒構件C2接觸之部分之間,可賦予既定張 力。 Further, in the case where the first cylindrical member C1 and the second cylindrical member C2 or the cylindrical member are provided with a motor for rotational driving, the portion contacting the first cylindrical member C1 from the sheet substrate FB Between the portion in contact with the second cylindrical member C2, a predetermined sheet can be given force.

此外,圖9所示之構成中,第一圓筒構件C1配置在-Z側,第二圓筒構件C2配置在+Z側,但並不限於此,第一圓筒構件C1配置在+Z側,第二圓筒構件C2配置在-Z側亦可。 Further, in the configuration shown in Fig. 9, the first cylindrical member C1 is disposed on the -Z side, and the second cylindrical member C2 is disposed on the +Z side. However, the present invention is not limited thereto, and the first cylindrical member C1 is disposed at +Z. On the side, the second cylindrical member C2 may be disposed on the -Z side.

(第六實施形態) (Sixth embodiment)

接著,說明本發明第六實施形態。本實施形態中,桶機構之構成與上述實施形態不同,因此以桶機構之構成為中心進行說明。圖10係顯示本實施形態之桶機構DRM3之構成的立體圖。 Next, a sixth embodiment of the present invention will be described. In the present embodiment, the configuration of the tub mechanism is different from that of the above-described embodiment. Therefore, the configuration of the tub mechanism will be mainly described. Fig. 10 is a perspective view showing the configuration of the tub mechanism DRM3 of the present embodiment.

如圖10所示,本實施形態之桶機構DRM3之構成係相對第一圓筒部(加工用基準面)CY1配置有分離之複數個第二圓筒部(加工用基準面)。具體而言,桶機構DRM3之構成係相對第一圓筒部CY1配置有二個第二圓筒部CY21,CY22。本實施形態中,第一圓筒部CY1與第二圓筒部CY21,CY22係形成為不同之圓筒構件(例如,第一圓筒構件C1與第二圓筒構件C21,C22)。 As shown in FIG. 10, the barrel mechanism DRM3 of the present embodiment is configured such that a plurality of second cylindrical portions (processing reference faces) separated from each other are disposed with respect to the first cylindrical portion (processing reference surface) CY1. Specifically, the barrel mechanism DRM3 is configured such that two second cylindrical portions CY21, CY22 are disposed with respect to the first cylindrical portion CY1. In the present embodiment, the first cylindrical portion CY1 and the second cylindrical portions CY21, CY22 are formed as different cylindrical members (for example, the first cylindrical member C1 and the second cylindrical members C21, C22).

桶機構DRM3之構成係在第一圓筒構件C1之+Z側配置有二個第二圓筒構件C21及C22。二個第二圓筒構件C21及C22係形成為例如相同之徑D4及D5。第一圓筒構件C1之徑D3係形成為大於此等徑D4及D5。 The barrel mechanism DRM3 is configured such that two second cylindrical members C21 and C22 are disposed on the +Z side of the first cylindrical member C1. The two second cylindrical members C21 and C22 are formed, for example, by the same diameters D4 and D5. The diameter D3 of the first cylindrical member C1 is formed to be larger than the equal diameters D4 and D5.

如圖10所示,第一圓筒構件C1與第二圓筒構件C21及C22係以在Z方向分離之狀態配置。第一圓筒構件C1之+Z側之端面C1a與第二圓筒構件C21及C22之-Z側之端面C21a及C22a彼此對向。第一圓筒構件C1及第二圓筒構件C21,C22分別具有個別之旋轉軸SF1及SF21, SF22。旋轉軸SF1、旋轉軸SF21及旋轉軸SF22係配置成彼此平行。旋轉驅動機構ACT3能控制第一圓筒構件C1、第二圓筒構件C21及C22分別獨立旋轉。 As shown in FIG. 10, the first cylindrical member C1 and the second cylindrical members C21 and C22 are disposed in a state of being separated in the Z direction. The end surface C1a on the +Z side of the first cylindrical member C1 and the end faces C21a and C22a on the -Z side of the second cylindrical members C21 and C22 oppose each other. The first cylindrical member C1 and the second cylindrical members C21, C22 respectively have individual rotation axes SF1 and SF21, SF22. The rotation axis SF1, the rotation axis SF21, and the rotation axis SF22 are disposed in parallel to each other. The rotation drive mechanism ACT3 can control the first cylindrical member C1 and the second cylindrical members C21 and C22 to rotate independently.

根據圖10所示之構成,經過例如導引滾筒R31之片狀基板FB捲繞懸掛在第一圓筒部CY1,透過作為轉換部之導引滾筒R32及R33(必要時設置追加之導引滾筒)導引至Z方向之上段之第二圓筒部CY2。捲繞懸掛在第二圓筒部CY2後之片狀基板FB係透過導引滾筒R34捲繞懸掛在第二圓筒部CY22,之後,係透過導引滾筒R35導引。圖10所示之構成中,第一圓筒構件C1配置在-Z側,第二圓筒構件C21及C22配置在+Z側,但並不限於此,第一圓筒構件C1配置在+Z側,第二圓筒構件C21及C22配置在-Z側亦可。 According to the configuration shown in Fig. 10, the sheet-like substrate FB, for example, the guide roller R31, is wound and suspended in the first cylindrical portion CY1, and transmitted through the guide rollers R32 and R33 as the conversion portions (additional guide rollers are provided as necessary) Guided to the second cylindrical portion CY2 in the upper portion of the Z direction. The sheet substrate FB that has been wound and suspended by the second cylindrical portion CY2 is wound around the second cylindrical portion CY22 through the guide roller R34, and then guided through the guide roller R35. In the configuration shown in Fig. 10, the first cylindrical member C1 is disposed on the -Z side, and the second cylindrical members C21 and C22 are disposed on the +Z side. However, the present invention is not limited thereto, and the first cylindrical member C1 is disposed at +Z. On the side, the second cylindrical members C21 and C22 may be disposed on the -Z side.

(第七實施形態) (Seventh embodiment)

接著,說明本發明第七實施形態。本實施形態中,桶機構之構成與上述實施形態不同,因此以桶機構之構成為中心進行說明。圖11係顯示本實施形態之桶機構DRM4之構成的立體圖。 Next, a seventh embodiment of the present invention will be described. In the present embodiment, the configuration of the tub mechanism is different from that of the above-described embodiment. Therefore, the configuration of the tub mechanism will be mainly described. Fig. 11 is a perspective view showing the configuration of the tub mechanism DRM4 of the present embodiment.

如圖11所示,本實施形態之桶機構DRM4,設有第一圓筒構件C1、第二圓筒構件C2及第三圓筒構件C3。此等第一圓筒構件C1、第二圓筒構件C2及第三圓筒構件C3係在Z方向三段配置。本實施形態中,片狀基板FB係掛架在第一圓筒構件C1之外周面即第一圓筒部CY1、第二圓筒構件C2之外周面即第二圓筒部CY2、及第三圓筒構件C3之外周面即第三圓筒部CY3,被施加一連串加工處理。 As shown in Fig. 11, the tub mechanism DRM4 of the present embodiment is provided with a first cylindrical member C1, a second cylindrical member C2, and a third cylindrical member C3. The first cylindrical member C1, the second cylindrical member C2, and the third cylindrical member C3 are arranged in three stages in the Z direction. In the present embodiment, the sheet substrate FB is cradle on the outer circumferential surface of the first cylindrical member C1, that is, the first cylindrical portion CY1, the second cylindrical member CY2, and the second cylindrical portion CY2, and the third surface. A series of processing processes are applied to the outer peripheral surface of the cylindrical member C3, that is, the third cylindrical portion CY3.

第一圓筒構件C1、第二圓筒構件C2、第三圓筒構件C3係 以在Z方向分離之狀態配置。第一圓筒構件C1、第二圓筒構件C2、第三圓筒構件C3之相鄰之端面彼此對向。旋轉軸SF係設成在第一圓筒構件C1、第二圓筒構件C2、第三圓筒構件C3之間共軸(在XY面內之位置相同)。 The first cylindrical member C1, the second cylindrical member C2, and the third cylindrical member C3 are It is configured in a state of being separated in the Z direction. Adjacent end faces of the first cylindrical member C1, the second cylindrical member C2, and the third cylindrical member C3 face each other. The rotating shaft SF is coaxially arranged between the first cylindrical member C1, the second cylindrical member C2, and the third cylindrical member C3 (the same position in the XY plane).

第一圓筒構件C1、第二圓筒構件C2、第三圓筒構件C3係形成為例如徑相等。桶機構DRM4具有旋轉驅動機構ACT4。旋轉驅動機構ACT4為使例如三個圓筒構件C1,C2,C3一體旋轉之構成、或驅動使其等個別旋轉之構成亦可,為使第一圓筒構件C1與第二圓筒構件C2分別獨立旋轉之構成亦可。又,旋轉驅動機構ACT4為以馬達等僅使三個圓筒構件C1,C2,C3中之任一個強制旋轉之構成亦可。 The first cylindrical member C1, the second cylindrical member C2, and the third cylindrical member C3 are formed to have the same diameter, for example. The tub mechanism DRM4 has a rotary drive mechanism ACT4. The rotation drive mechanism ACT4 may be configured such that the three cylindrical members C1, C2, and C3 are integrally rotated, or may be driven to rotate individually, for the first cylindrical member C1 and the second cylindrical member C2, respectively. The composition of independent rotation is also possible. Further, the rotation drive mechanism ACT4 may be configured to forcibly rotate only one of the three cylindrical members C1, C2, and C3 by a motor or the like.

根據圖11所示之構成,經過例如導引滾筒R41之片狀基板FB捲繞懸掛在第一圓筒部CY1,透過導引滾筒(轉換部)R42~R45導引至第二圓筒部CY2。捲繞懸掛在第二圓筒部CY2後之片狀基板FB係透過導引滾筒(轉換部)R46~R49導引至第三圓筒部CY3。捲繞懸掛在第三圓筒部CY3後之片狀基板FB係透過導引滾筒R50導引。如上述,本實施形態中,使在第一圓筒部CY1與第二圓筒部CY2之間之片狀基板FB之迴繞之構成在第二圓筒部CY2與第三圓筒部CY3之間亦同樣地反覆構成,因此能使使用桶機構DRM4之處理步驟進一步高密度化(處理裝置之設置底面積之減少)。 According to the configuration shown in Fig. 11, the sheet-like substrate FB, for example, the guide roller R41, is wound and suspended in the first cylindrical portion CY1, and guided to the second cylindrical portion CY2 through the guide rollers (conversion portions) R42 to R45. . The sheet substrate FB wound around the second cylindrical portion CY2 is guided to the third cylindrical portion CY3 through the guide rollers (converting portions) R46 to R49. The sheet substrate FB wound around the third cylindrical portion CY3 is guided through the guide roller R50. As described above, in the present embodiment, the rewinding of the sheet substrate FB between the first cylindrical portion CY1 and the second cylindrical portion CY2 is between the second cylindrical portion CY2 and the third cylindrical portion CY3. Since the configuration is repeated in the same manner, the processing procedure using the tub mechanism DRM4 can be further increased in density (the reduction in the bottom area of the processing device).

本發明之技術範圍並不限於上述實施形態,在不脫離本發明之趣旨之範圍內可施加適當變更。 The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

例如,上述實施形態中,假設在三個圓筒部CY1,CY2,CY3分別之位置進行對片狀基板之處理、加工,但例如在從第一圓筒部CY1至第二圓筒部CY2之間對片狀基板FB不進行處理亦可。又,在具有作為方向轉換部之功 能之導引滾筒之處進行對片狀基板之處理亦可。 For example, in the above-described embodiment, it is assumed that the processing and processing of the sheet substrate are performed at the positions of the three cylindrical portions CY1, CY2, and CY3, respectively, but for example, from the first cylindrical portion CY1 to the second cylindrical portion CY2. The sheet substrate FB may not be processed. Also, having the merit as a direction conversion unit It is also possible to perform processing on the sheet substrate at the position where the roller can be guided.

如圖12所示,藉由導引滾筒R51導引至桶機構DRM5之片狀基板FB捲繞懸掛在第一圓筒部CY1,透過導引滾筒R52導引後,在至第二圓筒部CY2之路徑上,捲繞懸掛在例如旋轉軸配置成水平(與XY平面平行)之導引滾筒R53。此處,可在例如導引滾筒R53設置加熱該片狀基板FB之加熱裝置(加熱乾燥用之桶)。亦即,能將導引滾筒R53構成為加熱桶。此情形,片狀基板FB之中捲繞懸掛在導引滾筒R53之部分被加熱。如圖12所示,導引滾筒R53,為了將從導引滾筒R52以豎立狀態送來之片狀基板FB以豎立狀態送入導引滾筒R54,係成為賦予扭曲之配置。 As shown in FIG. 12, the sheet substrate FB guided to the tub mechanism DRM5 by the guide roller R51 is wound and suspended in the first cylindrical portion CY1, guided by the guide roller R52, and then guided to the second cylindrical portion. On the path of CY2, the winding is suspended, for example, by a guide roller R53 whose rotation axis is arranged horizontally (parallel to the XY plane). Here, for example, a heating device (a barrel for heating and drying) for heating the sheet substrate FB may be provided in the guide roller R53. That is, the guide roller R53 can be configured as a heating tub. In this case, the portion of the sheet substrate FB that is wound and suspended from the guide roller R53 is heated. As shown in FIG. 12, the guide roller R53 is placed in the erected state in order to feed the sheet-like substrate FB fed from the guide roller R52 in an upright state to the guide roller R54.

例如,在使用塗布裝置等作為桶機構DRM5中處理裝置40之情形,較佳為,對塗布處理後之片狀基板FB進行乾燥處理等,但在此種情形,可在導引滾筒(加熱處理用之旋轉桶)R53繞繞懸掛塗布步驟後一刻之片狀基板並利用於乾燥步驟。乾燥處理後之片狀基板FB,係透過例如導引滾筒R54導引至第二圓筒部CY2,捲繞在第二圓筒部CY2之後,藉由導引滾筒R55導引。 For example, in the case where a coating device or the like is used as the processing device 40 in the tub mechanism DRM5, it is preferable to perform drying treatment or the like on the sheet-form substrate FB after the coating treatment, but in this case, the guide roller (heat treatment) The rotating drum) R53 is wound around the sheet substrate one time after the suspension coating step and used in the drying step. The sheet substrate FB after the drying process is guided to the second cylindrical portion CY2 through, for example, the guide roller R54, wound around the second cylindrical portion CY2, and guided by the guide roller R55.

又,上述各說明中,以將例如片狀基板FB以豎立狀態搬送之構成為例進行說明,但並不限於此。例如,在桶機構DRM及處理滾筒32之至少一個,將片狀基板FB之被處理面Fp以相對於水平面垂直或傾斜之狀態搬送,在搬送至桶機構DRM及處理滾筒32之至少一個之搬送路徑上,將片狀基板FB之被處理面Fp配置成相對於水平面實質上平行亦可。又,在片狀基板FB之搬送路徑,組合使片狀基板FB豎立之狀態與橫向之狀態亦可。 In the above description, the configuration in which the sheet substrate FB is transported in an upright state is described as an example, but the invention is not limited thereto. For example, in at least one of the tub mechanism DRM and the processing drum 32, the processed surface Fp of the sheet substrate FB is conveyed in a state of being perpendicular or inclined with respect to the horizontal plane, and transported to at least one of the tub mechanism DRM and the processing drum 32. In the path, the processed surface Fp of the sheet substrate FB may be disposed substantially parallel to the horizontal plane. Further, in the transport path of the sheet substrate FB, the state in which the sheet substrate FB is erected and the state in the lateral direction may be combined.

此外,在將片狀基板FB以非水平姿勢、例如將片狀基板FB之被處理面Fp以相對於水平面(XY平面)傾斜既定角度之狀態搬送或處理之情形,使桶機構DRM之圓筒構件CYL、處理滾筒32、導引滾筒R1,R2,R6,R7,R8等之旋轉中心軸相對於Z方向傾斜即可。 In addition, in the case where the sheet substrate FB is conveyed or processed in a state of being inclined at a predetermined angle with respect to the horizontal plane (XY plane) in a non-horizontal posture, for example, the cylinder of the barrel mechanism FD is made. The rotation center axis of the member CYL, the process roller 32, the guide rollers R1, R2, R6, R7, R8 and the like may be inclined with respect to the Z direction.

本發明之技術範圍並不限於上述實施形態,在不脫離本發明之趣旨之範圍內可施加適當變更。 The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

例如,除了上述實施形態之構成之外,圖1、圖2、圖5、圖6所示之搬送裝置30,除了導引滾筒R101~R106、處理滾筒31及32之外,具有調整片狀基板FB之姿勢之姿勢調整滾筒亦可。 For example, in addition to the configuration of the above-described embodiment, the conveying device 30 shown in Figs. 1, 2, 5, and 6 has an adjustment sheet substrate in addition to the guide rollers R101 to R106 and the processing rollers 31 and 32. The position adjustment roller of the FB posture can also be used.

此姿勢調整滾筒,可配置在例如片狀基板FB之搬送路徑處理裝置40之上游側。又,在例如緊鄰處理裝置40之前方配置姿勢調整滾筒亦可。姿勢調整滾筒係配置成例如中心軸與Z方向平行,設成可在X方向、Y方向及Z方向移動。又,姿勢調整滾筒係配置成例如中心軸相對於Z軸方向傾斜。此情形,藉由使例如姿勢調整滾筒之傾斜或位置變化,可調整片狀基板FB之姿勢。又,上述導引滾筒或處理滾筒、處理搬送滾筒兼用姿勢調整滾筒之構成亦可。 This posture adjustment roller can be disposed, for example, on the upstream side of the conveyance path processing device 40 of the sheet substrate FB. Further, the posture adjustment roller may be disposed immediately before the processing device 40, for example. The posture adjusting roller is disposed such that the central axis is parallel to the Z direction and is movable in the X direction, the Y direction, and the Z direction. Further, the posture adjustment roller is disposed such that, for example, the central axis is inclined with respect to the Z-axis direction. In this case, the posture of the sheet substrate FB can be adjusted by, for example, changing the inclination or position of the posture adjusting roller. Further, the guide roller or the process roller and the process transport roller may be configured as a posture adjustment roller.

又,上述實施形態中,以處理滾筒31、處理滾筒32形成為圓筒狀為例進行說明,但並不限於圓筒狀。例如,使處理滾筒31之形狀為橢圓或多角柱、或在處理滾筒31之表面之一部分形成曲率面亦可。此情形,較佳為,固定處理滾筒31、處理滾筒32,使片狀基板FB以接觸或非接觸方式在處理滾筒31,32之表面滑動。 In the above-described embodiment, the processing drum 31 and the processing drum 32 are formed in a cylindrical shape as an example, but the shape is not limited to a cylindrical shape. For example, the shape of the processing drum 31 may be an elliptical or polygonal column, or a curvature surface may be formed on a part of the surface of the processing drum 31. In this case, it is preferable that the processing drum 31 and the processing drum 32 are fixed so that the sheet substrate FB slides on the surfaces of the processing drums 31, 32 in a contact or non-contact manner.

又,桶機構DRM之圓筒構件CYL亦同樣地,並不限於圓筒構件。例 如,替代圓筒構件CYL,在各處理裝置40對片狀基板之被處理面進行處理時,使用形成有能以曲率面導引被處理面之導引面之導引構件、或形成有能平坦地導引被處理面之導引面之導引構件亦可。此外,使用導引構件之情形,較佳為,使片狀基板FB以接觸或非接觸方式滑動。 Further, the cylindrical member CYL of the tub mechanism DRM is similarly not limited to the cylindrical member. example For example, instead of the cylindrical member CYL, when each processing device 40 processes the processed surface of the sheet substrate, a guiding member formed with a guiding surface capable of guiding the surface to be processed with a curvature surface or formed with energy is formed. The guiding member that guides the guiding surface of the surface to be processed flatly may also be used. Further, in the case of using the guiding member, it is preferable to slide the sheet substrate FB in a contact or non-contact manner.

又,在設置於基板供應部SU之捲軸狀之片狀基板FB之前端,以既定長度黏貼具有與片狀基板FB相同程度之厚度且剛性較片狀基板高之導頭片亦可。如此,在將新的片狀基板FB之捲軸安裝於基板供應部SU時,亦可將片狀基板自動裝填於處理裝置FPA4內。 In addition, a tip piece having a thickness equal to the thickness of the sheet substrate FB and having a higher rigidity than the sheet substrate may be adhered to the front end of the sheet-like substrate FB provided in the substrate supply portion SU. As described above, when the reel of the new sheet substrate FB is attached to the substrate supply unit SU, the sheet substrate can be automatically loaded into the processing apparatus FPA4.

又,上述各說明中,以將例如片狀基板FB以豎立狀態搬送之構成為例進行說明,但並不限於此。例如,在處理滾筒31及處理滾筒32之至少一個,將片狀基板FB之被處理面Fp以相對於水平面垂直或傾斜之狀態搬送,在搬送至處理滾筒31及處理滾筒32之至少一個之搬送路徑上,將片狀基板FB之被處理面Fp配置成相對於水平面實質上平行亦可。又,在片狀基板FB之搬送路徑,組合使片狀基板FB豎立之狀態與橫向之狀態亦可。 In the above description, the configuration in which the sheet substrate FB is transported in an upright state is described as an example, but the invention is not limited thereto. For example, in at least one of the processing drum 31 and the processing drum 32, the processed surface Fp of the sheet substrate FB is conveyed in a state of being perpendicular or inclined with respect to the horizontal plane, and is conveyed to at least one of the processing drum 31 and the processing drum 32. In the path, the processed surface Fp of the sheet substrate FB may be disposed substantially parallel to the horizontal plane. Further, in the transport path of the sheet substrate FB, the state in which the sheet substrate FB is erected and the state in the lateral direction may be combined.

此外,在將片狀基板FB以非水平姿勢、例如將片狀基板FB之被處理面Fp以相對於水平面(XY平面)傾斜既定角度之狀態搬送或處理之情形,使處理滾筒31、處理滾筒32、導引滾筒R101,R102,R103,R104,R8等之旋轉中心軸相對於Z方向傾斜即可。 In addition, the processing drum 31 and the processing drum are disposed in a state in which the sheet substrate FB is conveyed or processed in a state of being inclined at a predetermined angle with respect to the horizontal plane (XY plane) in a non-horizontal posture, for example, the processed surface Fp of the sheet substrate FB. 32. The center axis of rotation of the guide rollers R101, R102, R103, R104, R8, etc. may be inclined with respect to the Z direction.

FB‧‧‧片狀基板 FB‧‧‧Flake substrate

SU‧‧‧基板供應部 SU‧‧‧Substrate Supply Department

PB‧‧‧保護基板 PB‧‧‧protective substrate

PR‧‧‧基板處理部 PR‧‧‧Substrate Processing Department

CL‧‧‧基板回收部 CL‧‧‧Substrate Recycling Department

CONT‧‧‧控制部 CONT‧‧‧Control Department

Fp‧‧‧被處理面 Fp‧‧‧ processed surface

41‧‧‧洗淨裝置 41‧‧‧cleaning device

41A‧‧‧第一洗淨裝置 41A‧‧‧First cleaning device

41B‧‧‧第二洗淨裝置 41B‧‧‧Second cleaning device

42‧‧‧TFT層形成裝置 42‧‧‧TFT layer forming device

42A‧‧‧第一形成裝置 42A‧‧‧First forming device

42B‧‧‧第二形成裝置 42B‧‧‧Second forming device

42C‧‧‧第三形成裝置 42C‧‧‧ third forming device

43‧‧‧乾燥裝置 43‧‧‧Drying device

44‧‧‧預備加工裝置 44‧‧‧Preparation processing equipment

44A‧‧‧第一加工裝置 44A‧‧‧First processing unit

44B‧‧‧第二加工裝置 44B‧‧‧Second processing unit

44C‧‧‧第三加工裝置 44C‧‧‧ Third processing unit

45‧‧‧發光層形成裝置 45‧‧‧Lighting layer forming device

45A‧‧‧第一形成裝置 45A‧‧‧First forming device

45B‧‧‧第二形成裝置 45B‧‧‧Second forming device

45C‧‧‧第三形成裝置 45C‧‧‧ third forming device

46‧‧‧層壓裝置 46‧‧‧Laminating device

FPA4‧‧‧基板處理裝置 FPA4‧‧‧ substrate processing device

R101~R106‧‧‧導引滾筒 R101~R106‧‧‧ Guide roller

11,13,21‧‧‧軸構件 11,13,21‧‧‧Axis components

12,14,22‧‧‧支承部 12,14,22‧‧‧Support

30‧‧‧搬送裝置 30‧‧‧Transporting device

31,32‧‧‧處理滾筒 31,32‧‧‧Processing roller

Claims (11)

一種基板處理裝置,係處理具有可撓性之長帶之片狀基板,具備:第1處理裝置,對被搬送於該長帶方向的該片狀基板施予第1處理;第2處理裝置,以相對該第1處理裝置於與該片狀基板之搬送方向交叉之方向錯開的方式配置,且對該片狀基板施予第2處理;第3處理裝置,具備可使二行該片狀基板以隔有間隔之方式一起通過之搬入排出部,且對該第1處理後之片狀基板、或該第2處理後之片狀基板施予第3處理;以及搬送裝置,包含:第1搬送部,以該片狀基板通過該第1處理裝置朝向該第3處理裝置的方式,將該片狀基板搬送於長帶方向;第2搬送部,以該片狀基板在經該第3處理裝置之後朝向該第2處理裝置的方式,將該片狀基板搬送於長帶方向;以及,第3搬送部,以該片狀基板在經該第2處理裝置之後朝向該第3處理裝置的方式,將該片狀基板搬送於長帶方向。 A substrate processing apparatus that processes a sheet-shaped substrate having a flexible long strip, and includes: a first processing device that applies a first process to the sheet substrate conveyed in the long-band direction; and a second processing device The first processing device is disposed so as to be shifted in a direction intersecting the transport direction of the sheet substrate, and the second processing is applied to the sheet substrate. The third processing device includes two rows of the sheet substrate. Carrying in the discharge unit together with the interval therebetween, and applying a third process to the sheet substrate after the first process or the sheet substrate after the second process; and the transfer device includes the first transfer The sheet substrate is conveyed in the long strip direction so that the sheet substrate passes the first processing device toward the third processing device, and the second substrate passes through the third processing device Then, the sheet substrate is conveyed in the long strip direction toward the second processing device, and the third transport unit is directed toward the third processing device after passing through the second processing device. Transfer the sheet substrate to the long strip direction 如申請專利範圍第1項之基板處理裝置,其中,該第1處理裝置與該第2處理裝置,以於與該片狀基板之搬送方向交叉之上下方向錯開的方式配置。 The substrate processing apparatus according to the first aspect of the invention, wherein the first processing device and the second processing device are disposed so as to be shifted from the upper and lower directions in the direction in which the sheet substrate is conveyed. 如申請專利範圍第2項之基板處理裝置,其中,該第3處理裝置之搬入排出部,具有搬入該第1處理後之片狀基板的第1搬入口與排出該片狀基板的第1排出口、搬入該第2處理後之片狀基板的第2搬入口與排出該片狀基板的第2排出口;將該第1搬入口與該第2搬入口配置於上下方向,將該第1排出口與該第2排出口配置於上下方向。 The substrate processing apparatus according to the second aspect of the invention, wherein the loading/discharging unit of the third processing apparatus includes a first loading port into which the sheet-shaped substrate after the first processing is carried and a first row in which the sheet substrate is discharged The second inlet port of the sheet substrate after the second processing and the second discharge port for discharging the sheet substrate are discharged, and the first transfer port and the second transfer port are disposed in the vertical direction, and the first port is placed The discharge port and the second discharge port are disposed in the vertical direction. 如申請專利範圍第1至3項中任一項之基板處理裝置,其中,該第1處理裝置,具備將該片狀基板之被處理面一邊呈圓筒面狀地支承且一邊使其可於該長帶方向移動的第1圓筒構件、及配置於該第1圓筒構件周圍並進行該第1處理的第1處理部;該第2處理裝置,具備將該片狀基板之被處理面一邊呈圓筒面狀地支承且一邊使其可於該長帶方向移動的第2圓筒構件、及配置於該第2圓筒構件周圍並進行該第2處理的第2處理部。 The substrate processing apparatus according to any one of the first to third aspects of the present invention, wherein the first processing apparatus is configured to support the processed surface of the sheet substrate in a cylindrical shape a first cylindrical member that moves in the direction of the elongate direction, and a first processing unit that is disposed around the first cylindrical member and performs the first process; and the second processing device includes a processed surface on which the sheet substrate is to be processed A second cylindrical member that is supported in a cylindrical shape and that is movable in the longitudinal direction, and a second treatment portion that is disposed around the second cylindrical member and performs the second treatment. 如申請專利範圍第4項之基板處理裝置,其中,該第1圓筒構件與該第2圓筒構件,於上下方向排列配置,並且以可繞中心軸旋轉之旋轉桶構成。 The substrate processing apparatus according to claim 4, wherein the first cylindrical member and the second cylindrical member are arranged side by side in the vertical direction, and are configured by a rotary tub that is rotatable about a central axis. 如申請專利範圍第2項之基板處理裝置,其中,在藉由各個該第1搬送部、該第2搬送部、該第3搬送部所形成之該片狀基板之長帶方向之搬送路徑,設置用於轉換該片狀基板之搬送方向的複數個導引滾筒;該複數個導引滾筒中至少二個導引滾筒,因應該第1處理裝置與該第2處理裝置於上下方向之錯開配置,以該片狀基板之搬送路徑於上下方向移位之方式配置。 The substrate processing apparatus according to the second aspect of the invention, wherein the transport path in the long-band direction of the sheet substrate formed by each of the first transport unit, the second transport unit, and the third transport unit is a plurality of guiding rollers for converting a conveying direction of the sheet substrate; at least two guiding rollers of the plurality of guiding rollers are disposed in a vertical direction of the first processing device and the second processing device It is disposed such that the transport path of the sheet substrate is displaced in the vertical direction. 如申請專利範圍第1至6項中任一項之基板處理裝置,其中,該第3處理裝置所進行之該第3處理,係使該片狀基板乾燥之處理、或加熱至既定溫度之處理。 The substrate processing apparatus according to any one of claims 1 to 6, wherein the third processing performed by the third processing apparatus is a process of drying the sheet substrate or heating to a predetermined temperature. . 一種基板處理方法,係一邊搬送具有可撓性之長帶之片狀基板往長帶方向、一邊對該片狀基板施予複數個處理,包含:第1步驟,將該片狀基板搬送至第1處理裝置,且對該片狀基板之被 處理面施予第1處理;第2步驟,將該片狀基板搬送至第2處理裝置,且對已經該第1處理之該片狀基板之被處理面施予第2處理;第3步驟,將該第1處理後之該片狀基板、及該第2處理後之該片狀基板,搬送至具備可使二行該片狀基板一起通過之搬入排出部的第3處理裝置,且對該片狀基板之被處理面施予第3處理;以及搬送步驟,藉由以該第1處理裝置、該第3處理裝置、該第2處理裝置、及該第3處理裝置之順序將該片狀基板搬送於長帶方向之搬送裝置,搬送該片狀基板。 A substrate processing method for performing a plurality of processes on a sheet substrate while transporting a flexible substrate strip in a long strip direction, including: in the first step, transporting the sheet substrate to the first step 1 processing device, and the sheet substrate is The processing surface is subjected to the first processing; in the second step, the sheet substrate is transferred to the second processing device, and the second processing is performed on the processed surface of the sheet substrate that has been subjected to the first processing; and the third step is The sheet-form substrate after the first process and the sheet-form substrate after the second process are transported to a third processing device including a loading/discharging unit through which the two sheets of the sheet-like substrate can pass together, and The processed surface of the sheet substrate is subjected to a third process; and the transporting step is performed in the order of the first processing device, the third processing device, the second processing device, and the third processing device The substrate is conveyed to a conveying device in the long belt direction, and the sheet substrate is conveyed. 如申請專利範圍第8項之基板處理方法,其中,該第3處理裝置所進行之該第3處理,係使該片狀基板乾燥之處理、或加熱至既定溫度之處理。 The substrate processing method according to the eighth aspect of the invention, wherein the third processing performed by the third processing apparatus is a process of drying the sheet substrate or heating to a predetermined temperature. 如申請專利範圍第9項之基板處理方法,其中,該第1處理裝置與該第2處理裝置,以於與該片狀基板之搬送方向交叉之上下方向錯開的方式配置。 The substrate processing method according to claim 9, wherein the first processing device and the second processing device are disposed so as to be shifted from the upper and lower directions in the direction in which the sheet substrate is conveyed. 如申請專利範圍第10項之基板處理方法,其中,在藉由該搬送裝置所形成之該片狀基板之長帶方向之搬送路徑,設置用於轉換該片狀基板之搬送方向的複數個導引滾筒;藉由該複數個導引滾筒中至少二個導引滾筒,以因應該第1處理裝置與該第2處理裝置於上下方向之錯開配置的方式,使該片狀基板之搬送路徑於上下方向移位。 The substrate processing method according to claim 10, wherein a plurality of guides for switching a conveying direction of the sheet substrate are provided in a conveying path of the sheet substrate formed by the conveying device in a long belt direction a guide roller for transporting the sheet substrate by at least two guide rollers of the plurality of guide rollers so that the first processing device and the second processing device are arranged in a vertical direction Shift in the up and down direction.
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