CN105632978A - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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Publication number
CN105632978A
CN105632978A CN201610122229.1A CN201610122229A CN105632978A CN 105632978 A CN105632978 A CN 105632978A CN 201610122229 A CN201610122229 A CN 201610122229A CN 105632978 A CN105632978 A CN 105632978A
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plate shape
shape substrates
treatment unit
substrate
cylinder
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CN105632978B (en
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浜田智秀
奈良圭
增川孝志
木内彻
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/32—Arrangements for turning or reversing webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/517—Drying material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
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  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

A substrate processing device and a substrate processing method. The substrate processing device is provided with: a substrate supply unit that supplies substrates such that the substrate, formed in a band shape, is in the state of being stood up in the direction of the shorter dimension thereof; a substrate processing unit that has a conveyance unit that conveys the substrate supplied from said substrate supply unit in the standing state, and a plurality of processing units that are disposed along the substrate conveyance route of said conveyance unit and that process the surface to be processed of the standing substrate; and a substrate retrieval unit that retrieves the substrate processed by said substrate processing unit in the standing state.

Description

Substrate board treatment and substrate processing method using same
Point case application of application for a patent for invention that to be on April 11st, 2011, national applications number be 201180018300.7 for the application to be international application no be PCT/JP2011/058988, international filing date, denomination of invention is " substrate board treatment ".
Technical field
The invention relates to a kind of substrate board treatment and substrate processing method using same.
The application is No. 61/322347, the U.S. Provisional Application according to application on April 9th, 2010 and U.S. Provisional Application No. 61/322417 CLAIM OF PRIORITY of application on April 9th, 2010, and its content is incorporated herein.
Background technology
As the display module forming the display equipment such as display equipment, such as, there are LCD assembly, organic electroluminescent (organic EL) assembly, electrophoresis assembly etc. for Electronic Paper. At present, these display modules are called as after the switch assembly of thin film transistor (ThinFilmTransistor:TFT) or amplification assembly or electric current drive assembly etc. to be formed at substrate surface, and the active display module (Activedisplaydevice) forming respective display module thereon is gradually main flow.
In recent years, it is proposed that the upper technology forming display module of a kind of substrate in sheet (such as film member etc.). Such as, as this kind of technology, such as, there is one to be called as scroll bar and scroll bar (rolltoroll) mode (following, to be abbreviated as " scroll bar mode ") person is widely known by the people (with reference to patent documentation 1). Such as, scroll bar mode is that the substrate (banded film member) of the confession application cylinder by being wound on supply substrate side is sent and reeled with the recovery cylinder of substrate recovery side by the substrate sent and transport substrate.
During substrate is sent to being wound, such as use the conveyance substrate such as multiple conveyance cylinders to use multiple treatment unit to form the grid electrode of formation TFT, gate insulating film, semiconductor film, source-drain electrode etc. on one side, the processed surface of substrate is sequentially formed the constitutive requirements of display module. Such as, when forming the situation of organic el element, it is on substrate, sequentially form luminescent layer, anode, negative electrode, circuit etc.
Patent documentation 1: International Publication No. 2006/100868 brochure
Summary of the invention
But, in aforesaid method, owing to along the transport path configuration process device of substrate, therefore device entirety must can be made to maximize according to the conveyance form of such as substrate.
The object of the form of the present invention is to provide the substrate board treatment of a kind of energy space saving.
The substrate board treatment of one form, it is transport being formed as banded substrate in long side direction, and processes the processed surface of this substrate, it is characterised in that, possess: supply substrate portion, when making the short side direction of this substrate intersect relative to horizontal direction for should substrate; Processing substrate portion, there is conveying unit and multiple process portion, this conveying unit, this substrate supplied from this supply substrate portion is transported under this crossing condition, the plurality of process portion, it is the transport path configuration of this substrate along this conveying unit, the processed surface of this substrate of this crossing condition is processed; And substrate recovery portion, this substrate after this processing substrate portion processes is reclaimed under this crossing condition.
The substrate board treatment of one form, is transport being formed as banded substrate in long side direction, and processes the processed surface of this substrate, it is characterised in that, possess: supporting device, possess first bearing portion and the 2nd bearing portion; First conveyance mechanism, transports this substrate to this first bearing portion; Conversion portion, the processed surface at this substrate transports to this first bearing portion, and towards the 2nd bearing portion, the conveyance direction of this substrate is changed conveyance direction; First process portion, is carried out the first process among this substrate by the processed surface of this first bearing portion supporting; And the 2nd process portion, carried out the 2nd process among this substrate by the processed surface of the 2nd bearing portion supporting.
Form according to the present invention, can provide the substrate board treatment of energy space saving.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the formation of the substrate board treatment of display the first example.
Fig. 2 is the vertical view of the formation of the substrate board treatment of this example of display.
Fig. 3 is the vertical view of the formation of the substrate board treatment of display the 2nd example.
Fig. 4 is the vertical view of the formation of the substrate board treatment of display the 3rd example.
Fig. 5 is the stereographic map of the formation of the substrate board treatment of display the 4th example.
Fig. 6 is the vertical view of the formation of the substrate board treatment of this example of display.
Fig. 7 is the vertical view of the formation of the substrate board treatment of this example of display.
Fig. 8 is the vertical view of the formation of the substrate board treatment of this example of display.
Fig. 9 is the stereographic map of the formation of the substrate board treatment of display the 5th example.
Figure 10 is the vertical view of the formation of the substrate board treatment of display the 6th example.
Figure 11 is the vertical view of the formation of the substrate board treatment of display the 7th example.
Figure 12 is the vertical view of the formation of the substrate board treatment of another example of display.
Embodiment
(the first example)
Then, the substrate board treatment of the first example is described. Fig. 1 is the stereographic map of the formation of the substrate board treatment FPA4 of this example of display. Fig. 2 is the vertical view of the formation of display base plate treatment unit FPA4.
As shown in Figures 1 and 2, such as, substrate board treatment FPA has supply substrate portion SU, the processing substrate portion PR, the cavity C B (omitting diagram in Fig. 1) accommodating this processing substrate portion PR that surface (processed surface) Fp of plate shape substrates FB are processed of supply plate shape substrates (banded film structural component) FB, reclaims the substrate recovery portion CL of plate shape substrates FB and control the control portion CONT in this each portion. Substrate board treatment FPA is arranged on such as factory etc. In this example, plate shape substrates FB is supplied under upright state, processes, reclaims. In this example, this upright state comprises makes the processed surface Fp of plate shape substrates FB relative to horizontal plane (X/Y plane) with the state of set angular cross, such as heeling condition or be configured to substantially vertical state. That is, the state that the processing substrate face Fp of this plate shape substrates FB is erect also comprises the state that the short side direction of substrate FB is non-horizontal posture.
In the following description, setting XYZ orthogonal coordinate system system, unifies, with reference to this XYZ orthogonal coordinate system, the position relation that limit illustrates each component. Specifically, if the set direction on horizontal plane is X-axis direction, direction orthogonal with X-axis direction on this horizontal plane be Y-axis direction, plumbous direction of hanging down is Z direction of principal axis. Again, if being respectively �� X, �� Y, �� Z-direction around rotation (inclination) direction of X-axis, Y-axis, Z axle.
Again, in example, it is described as substantially vertical state for the processing substrate face Fp of plate shape substrates FB relative to horizontal plane.
Substrate board treatment FPA, be after sending, from supply substrate portion SU, the plate shape substrates FB being wound into rolling strip to the scroll bar that the surface of plate shape substrates FB is carried out during plate shape substrates FB being recycled into rolling strip with substrate recovery portion CL various process to the device of scroll bar mode (following, to be abbreviated as " scroll bar mode "). Substrate board treatment FPA, can be used on plate shape substrates FB to be formed the situation of the such as display module such as organic el element, LCD assembly (electronic package). Certainly, use substrate board treatment FPA also may be used in the situation forming the assembly beyond these assemblies.
As the plate shape substrates FB becoming handling object at substrate board treatment FPA, the paper tinsel (foil) of such as resin molding or stainless steel etc. can be used. Resin molding can use the materials such as such as polyvinyl resin, acrylic resin, vibrin, ethylene vinyl alcohol copolymer (Ethylenevinylcopolymer) resin, polyvinyl chloride-based resin, celluosic resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, acetic acid Vinylite.
The size of the short side direction of plate shape substrates FB is that the size being formed as such as 50cm��2m degree, long side direction is then formed as such as more than 10m. Certainly, this size is only an example, is not limited to this example. The such as short side direction of plate shape substrates FB is of a size of below 50cm and also, also can be more than 2m. Again, the size of the long side direction of plate shape substrates FB also can at below 10m.
Plate shape substrates FB is formed as such as having the thickness of below 1mm and have flexibility. Herein, so-called flexible, refer to the character that the pre-determined force that substrate such as imposes degree of at least conducting oneself with dignity also can not rupture or break and can be bent by this substrate. In addition, the character such as bent because of above-mentioned pre-determined force is also contained in the flexibility referred to. Again, above-mentioned flexibility can change along with the environment etc. of this substrate material, size, thickness and temperature etc. Moreover, plate shape substrates FB can use the substrate of a slice band shape, also can use and multiple unit substrate connected and be formed as banded formation.
Plate shape substrates FB, to bear its size of heat of such as 200 DEG C of degree, also substantially unconverted thermal expansivity smaller is better. Such as mineral filler can be mixed in resin molding to reduce thermal expansivity. As mineral filler, such as, there are titanium oxide, zinc oxide, aluminum oxide, silicon oxide etc.
Supply substrate portion SU has supply port 10 (omitting icon in Fig. 1) and the shaft component 11 being configured in this supply port 10 and a bearing portion 12. Shaft component 11 is formed as such as cylinder shape, and central shaft arrangement precedent is as almost parallel with Z-direction. Therefore, at shaft component 11, it is wound with plate shape substrates FB with upright state. Shaft component 11 is set as can relatively prop up bearing portion 12 and dismount. Prop up bearing portion 12 and this shaft component 11 be can be rotated to support on circumferential direction (such as �� Z-direction). Supply substrate portion SU, the plate shape substrates FB being wound into the strip that such as rolls (that is, this plate shape substrates FB is non-horizontal posture) when the short side direction of this plate shape substrates FB is erect that is when consistent with Z-direction is sent and is supplied to processing substrate portion PR.
The shaft component 13 of the protection substrate PB of the processed surface Fp being wound with protection plate shape substrates FB it is provided with in supply port 10. In addition, the shaft component 13 being located in supply port 10 is called also may be used in protecting group Plate supplying portion. Protection substrate PB is after the process of processing substrate portion PR completes, by the substrate being pasted on plate shape substrates FB before substrate recovery portion CL recovery. Protection substrate PB, identical with plate shape substrates FB, it is be formed as such as banded and there is flexible formation. Shaft component 13 is formed as such as cylinder shape, and central shaft arrangement precedent is as almost parallel with Z-direction. Therefore, at shaft component 13, it is wound with protection substrate PB with upright state. Shaft component 13 can be rotated to support on circumferential direction (such as �� Z-direction) by a bearing portion 14. Shaft component 13 is set as can relatively prop up bearing portion 14 and dismount. Supply substrate portion SU, sends protection substrate PB under upright state and is supplied to processing substrate portion PR.
The plate shape substrates FB that substrate recovery portion CL will move from processing substrate portion PR when being pasted with protection substrate PB, when the short side direction of this plate shape substrates FB and protection substrate PB is erect, winding reclaims. In the recovery port 20 (omitting diagram in Fig. 1) of substrate recovery portion CL, samely with supply substrate portion SU, be provided with to reel plate shape substrates FB and protection substrate PB shaft component 21 with this shaft component 21 is supported to a rotatable bearing portion 22. Shaft component 21 is set as can relatively prop up bearing portion 22 and dismount.
The supply port 10 of supply substrate portion SU is the outside being configured in the cavity C B such as accommodating processing substrate portion PR with the recovery port 20 of substrate recovery portion CL. Supply port 10 and recovery port 20 are the faces of the such as-Y side being configured in cavity C B, relative to processing substrate portion PR such as in X-direction and row arrangement. As above-mentioned, owing to supply port 10 is configured in a position jointly with recovery port 20, therefore this supply port 10 and recovery port 20 high-level efficiency can be accessed.
The plate shape substrates FB supplied from supply substrate portion SU is transported to substrate recovery portion CL by processing substrate portion PR under upright state, and to the processed surface Fp process of the plate shape substrates FB of upright state in conveyance process. Processing substrate portion PR has carrying device 30, treatment unit 40 and the alignment device (non-icon) etc. that such as transport mechanism etc. Processing substrate portion PR is contained in the vacuum chamber CB of air conditioning managing, manages into envrionment temperature and ambient moisture certain and protect above-mentioned each device not affect by dust etc.
As shown in Figures 1 and 2, carrying device 30 has multiple (such as 6) guide roller R101��R106 and 2 process cylinder 31 and 32. Plate shape substrates FB is directed to substrate recovery portion CL from supply substrate portion SU by guide roller R101��R104. Protection substrate PB is directed to substrate recovery portion CL from supply substrate portion SU with the path different from plate shape substrates FB by guide roller R105 and R106.
Guide roller R101��R106 is that to be configured to such as turning axle and Z direction of principal axis almost parallel. Therefore, at guide roller R101��R104, plate shape substrates FB establishes with upright state (as above-mentioned, the posture of the short side direction of substrate FB substantially non-horizontal). Again, at guide roller R105 and R106, protection substrate PB opens with upright state to establish. Guide roller R101��R106 is that the formation being such as provided with driving mechanism also may be used. Owing to guide roller R101��R104 is wound with the processed surface Fp of plate shape substrates FB, therefore it is that the formation of the not shown gas blanket forming apparatus being such as provided with formation gas blanket in the barrel surface of each guide roller R101��R104 also may be used. By above-mentioned formation, plate shape substrates FB keeps set tension force to be transported between at least guide roller R101��R104.
Process cylinder 31 and 32 is the guide path of the plate shape substrates FB being configured in such as guide roller R101��R104. Process cylinder 31 and 32 is that to be configured in cavity C B the such as position in Y-direction identical. In this example, such as, process cylinder 31 and 32 and all it is configured in cavity C B in the substantially central portion of Y-direction.
Process cylinder 31 and 32 is formed as cylinder shape (as an example, the bucket shape of diameter 1��number m degree) respectively. Process cylinder 31 and 32 is that to be configured to such as central shaft and Z-direction almost parallel, opens with upright state and is provided with plate shape substrates FB. Process cylinder 31 and 32 is formed as such as the relatively big footpath of guide roller R101��R104.
Process cylinder 31 and 32 is located at respectively to clip the position of the supply opening SUa being connected to supply substrate portion SU with the recovery port CLa being connected to substrate recovery portion CL. More specifically, process cylinder 31 is configured in supply opening SUa-X side, and process cylinder 32 is configured in recovery port CLa+X side.
As the conveyance direction of plate shape substrates FB middle in processing substrate portion PR, first, such as, transport toward +Y direction from supply opening SUa, change conveyance direction by guide roller R101 toward-X direction (wherein past-Y rolls the direction of oblique 45 ��). Through the plate shape substrates FB of guide roller R101 be by process cylinder 31 turn back, conveyance direction converts +X direction to. Plate shape substrates FB after turning back from process cylinder 31 toward +X direction, changes conveyance direction by guide roller R102 toward +Y direction, and a part (the preparation processing unit (plant) 44) conveyance direction by treatment unit 40 converts-Y direction to. Through the plate shape substrates FB of preparation processing unit (plant) 44, change conveyance direction by guide roller R103 toward +X direction, turn back by process cylinder 32, change conveyance direction toward-X direction (wherein past+Y rolls the direction of oblique 45 ��). Through the plate shape substrates FB of process cylinder 32, changing conveyance direction by guide roller R104 toward-Y direction, conveyance is to recovery port CLa. In the above described manner, carrying device 30, frequently switches conveyance direction in X-direction and Y-direction and transports plate shape substrates FB simultaneously in cavity C B.
Treatment unit 40 is the device in order to the processed surface Fp of plate shape substrates FB to be formed such as organic el element. In this example, as such as treatment unit 40, it may also be useful to such as decontaminating apparatus 41, TFT layer forming apparatus 42, drying installation (dryer part) 43, preparation processing unit (plant) 44, luminescent layer forming apparatus 45, laminater 46 etc. In addition, setting example such as other devices such as point next door forming apparatus (non-icon) in order to form point next door on processed surface Fp also may be used.
As the kind of this kind for the treatment of unit 40, it may also be useful to the various devices such as film deposition system or exposure apparatus, developing apparatus, surfaction device, decontaminating apparatus such as such as apparatus for coating liquid droplet (such as inkjet type apparatus for coating, screen painting type apparatus for coating etc.), evaporation coating device, sputtering apparatuss. These each devices are suitably located in the transport path of such as plate shape substrates FB.
Decontaminating apparatus 41 has the first decontaminating apparatus 41A and the 2nd decontaminating apparatus 41B cleaning protection substrate PB of clean plate shape substrates FB. First decontaminating apparatus 41A is that the transport path being located at plate shape substrates FB is such as between supply opening SUa (with reference to Fig. 2) and process cylinder 31. Again, the 2nd decontaminating apparatus 41B is that the transport path being located at protection substrate PB is such as between supply opening SUb and laminater 46. Decontaminating apparatus 41 is by purifying for the plate shape substrates FB or protection substrate PB from the outside of cavity C B toward inner supply.
TFT layer forming apparatus 42 forms the device in order to the TFT assembly or electrode driving organic el element. TFT layer forming apparatus 42 has such as the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C. First forming apparatus 42A is the-Y side being configured in process cylinder 31. 2nd forming apparatus 42B is the-X side being configured in process cylinder 31. 3rd forming apparatus 42C is the+Y side being configured in process cylinder 31. + X the side of process cylinder 31 is empty state, is configured with such as guide roller R101.
These first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C are located at such as to process cylinder 31 around. The succession of steps forming TFT assembly and electrode shares by such as the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C carrying out.
First forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C, can to the plate shape substrates FB process being wound in process cylinder 31 with upright state respectively towards process cylinder 31. Process cylinder 31 becomes the bearing portion supporting plate shape substrates FB when carrying out the process of TFT layer forming apparatus 42.
Drying installation 43 is by such as heating plate shape substrates FB so that being formed in the device of the stabilization such as TFT assembly or electrode of this plate shape substrates FB. Drying installation 43 is configured between the transport path process cylinder 31 of plate shape substrates FB and process cylinder 32. When drying installation 43 is configured to such as observe from Y-direction with process cylinder 31 and process cylinder 32 part overlapping.
Such as, as shown in Figures 1 and 2, preparing processing unit (plant) 44 is the device carrying out the preliminary step (insulation layer forming step etc.) when plate shape substrates FB forms luminescent layer. Preparation processing unit (plant) 44 is configured in together with drying installation 43 between the transport path process cylinder 31 of such as plate shape substrates FB and process cylinder 32. Preparation processing unit (plant) 44 has such as the first processing unit (plant) 44A, the 2nd processing unit (plant) 44B and the 3rd processing unit (plant) 44C, and a succession of preliminary processing step shares carrying out.
Luminescent layer forming apparatus 45 is the device forming the luminescent layer forming organic el element. Luminescent layer forming apparatus 45 has such as the first forming apparatus 45A, the 2nd forming apparatus 45B and the 3rd forming apparatus 45C. This first forming apparatus 45A, the 2nd forming apparatus 45B and the 3rd forming apparatus 45C are located at such as to process cylinder 32 around. The succession of steps forming luminescent layer shares by such as the first forming apparatus 45A, the 2nd forming apparatus 45B and the 3rd forming apparatus 45C carrying out.
First forming apparatus 45A is the+Y side being configured in process cylinder 32. 2nd forming apparatus 45B is the+X side being configured in process cylinder 32. 3rd forming apparatus 45C is the-Y side being configured in process cylinder 32.-X the side of process cylinder 32 is empty state, is configured with such as guide roller R104.
Laminater 46 is the device fitted with protection substrate (protection material) PB by plate shape substrates FB. Laminater 46 is that the transport path being configured in plate shape substrates FB such as processes between cylinder 32 and recovery port CLa. The formation of laminater 46, is make protection substrate PB in the face of being configured in the processed surface Fp side of such as plate shape substrates FB, is directed between plate shape substrates FB with protection substrate PB, afterwards, plate shape substrates FB and protection substrate PB are fitted.
Among above-mentioned treatment unit 40, such as, when the 3rd forming apparatus 45C of the first forming apparatus 42A of TFT layer forming apparatus 42, the first decontaminating apparatus 41A, the 2nd decontaminating apparatus 41B, luminescent layer forming apparatus 45 is configured to observe from X-direction overlapping. Again, overlap when the 2nd forming apparatus 45B of the 2nd forming apparatus 42B of TFT layer forming apparatus 42, process cylinder 31, process cylinder 32, luminescent layer forming apparatus 45 is configured to observe from X-direction. Moreover, overlapping when the first forming apparatus 45A of the 3rd forming apparatus 42C of TFT layer forming apparatus 42, drying installation 43, luminescent layer forming apparatus 45 is configured to observe from X-direction.
Again, such as, when the first forming apparatus 42A of TFT layer forming apparatus 42, process cylinder 31, the 3rd forming apparatus 42C are configured to observe from Y-direction overlap. Again, such as, when decontaminating apparatus 41A and 41B is be configured to observe from Y-direction with drying installation 43 overlapping. Again, processing unit (plant) 44 is prepared overlapping when being be configured to observe from Y-direction with laminater 46. Moreover, overlapping when the first forming apparatus 45A of luminescent layer forming apparatus 45, process cylinder 32, the 3rd forming apparatus 45C are configured to observe from Y-direction. As above-mentioned, carrying device 30 and treatment unit 40 are that intensive being configured to becomes many from overlapping part when X-direction and Y-direction observation.
The substrate board treatment FPA formed in the above described manner is that the control by control portion CONT manufactures the display module such as organic el element, LCD assembly (electronic package) in scroll bar mode. Hereinafter, the step using the substrate board treatment FPA of above-mentioned formation to manufacture display module is described.
First, it is wound into, by shaft component 11, the bearing portion 12 that the plate shape substrates FB of band shape of rolling strip is installed in the supply port 10 of supply substrate portion SU. Again, the bearing portion 14 protection substrate PB being wound on the band shape of shaft component 13 being installed in the supply port 10 of supply substrate portion SU. Moreover, the bearing portion 22 shaft component 21 reclaimed being installed in the recovery port 20 of substrate recovery portion CL.
Control portion CONT makes shaft component 11 rotate by a bearing portion 12 in this case, sends this plate shape substrates FB from supply substrate portion SU. From the plate shape substrates FB that supply substrate portion SU sends, it is that the supply opening SUa from processing substrate portion PR is supplied in cavity C B. Control portion CONT the plate shape substrates FB that is supplied in cavity C B is transported to carrying device 30 and simultaneously by each treatment unit 40 to the FB process of this plate shape substrates. In this example, control portion CONT controls each motor one by one in the way of plate shape substrates FB to give set tension force by the rotary actuation motor being suitably located at processing cylinder 31,32 and each cylinder R101��R106.
By this action, the plate shape substrates FB being supplied to processing substrate portion PR cleans by the first decontaminating apparatus 41A, is directed to process cylinder 31 by guide roller R101. Plate shape substrates FB is respectively towards in the way of the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C of TFT layer forming apparatus 42, twining with upright state winding and hang at process cylinder 31 by processed surface Fp. Twine the processed surface Fp hanging the plate shape substrates FB at process cylinder 31 at winding, form TFT assembly or distribution etc. by this TFT layer forming apparatus 42.
It is supplied to drying installation 43 through the plate shape substrates FB of process cylinder 31, such as, applies the drying treatment such as heat treated. Plate shape substrates FB after drying treatment is supplied to preparation processing unit (plant) 44 by such as guide roller R102. Preparation processing unit (plant) 44, at such as the first processing unit (plant) 44A��the 3rd processing unit (plant) 44C, forms insulating film or electricity hole input horizon or electron injecting layer etc. at plate shape substrates FB.
Plate shape substrates FB after preparation processing is directed to process cylinder 32 by such as guide roller R103. Plate shape substrates FB is respectively towards in the way of the first forming apparatus 45A, the 2nd forming apparatus 45B and the 3rd forming apparatus 45C of luminescent layer forming apparatus 45, twining with upright state winding and hang at process cylinder 32 by processed surface Fp. Twine the processed surface Fp hanging the plate shape substrates FB at process cylinder 32 at winding, form luminescent layer etc. by this luminescent layer forming apparatus 45.
It is supplied to laminater 46 through the plate shape substrates FB of process cylinder 32, pastes protection substrate PB at processed surface Fp. Paste the plate shape substrates FB after protection substrate (protection material) PB and it is recycled to substrate recovery portion CL from such as recovery port CLa. The plate shape substrates FB being recycled to substrate recovery portion CL is that the shaft component 21 in recovery port 20 is wound into rolling strip. Be wound with the plate shape substrates FB of given amount at shaft component 21 after, plate shape substrates FB is such as cut off, the shaft component 21 being wound with plate shape substrates FB is removed from a bearing portion 22. In this bearing portion 22 installation example such as the new shaft component 21 of the plate shape substrates FB that do not reel.
Control portion CONT is by carrying out above-mentioned process, and the processed surface Fp of plate shape substrates FB is formed assembly.
As above-mentioned, according to this example, due to possess by be formed as banded plate shape substrates FB short side direction under upright state for should the supply substrate portion SU of plate shape substrates FB, the processing substrate portion PR of the multiple treatment unit 40 that there is the carrying device 30 transported under upright state by the plate shape substrates FB supplied from this supply substrate portion SU and process along the transport path configuration of plate shape substrates FB of this carrying device 30 and the processed surface Fp to the plate shape substrates FB of upright state, by the substrate recovery portion CL that the plate shape substrates FB after this processing substrate portion PR processes reclaims under upright state, therefore become and it is easy to the conveyance direction of the plate shape substrates FB formation that (X-direction and Y-direction) is changed in the horizontal direction.
Therefore, treatment unit 40 can be increased at the selection width of X-direction and the layout of Y-direction, such as also can to do one's utmost to reduce the layout of the way selection configuration process device 40 of the device area of substrate board treatment FPA4. Thus, the space saving of substrate board treatment FPA4 can be sought.
(the 2nd example)
Then, the substrate board treatment of the present invention the 2nd example is described.
Fig. 3 is the vertical view of the formation of display base plate treatment unit FPA2. At substrate board treatment FPA2, the formation of processing substrate portion PR is different from the first example. Other formations can be identical formation with such as the first example. In this example, it is described centered by this difference.
As shown in Figure 3, substrate board treatment FPA2 has supply substrate portion SU, processing substrate portion PR, substrate recovery portion CL, cavity C B and control portion CONT. Processing substrate portion PR is housed in cavity C B. Supply substrate portion SU has and is formed as cylinder shape and central shaft arrangement and becomes the shaft component 111 parallel with Z-direction and be supported to by this shaft component 111 rotatable to prop up bearing portion 112. At shaft component 111, plate shape substrates FB reels with upright state. In addition, it is noted that in Fig. 3, omit the diagram of the formation of supply protection substrate at supply substrate portion SU. Substrate recovery portion CL has and is formed as cylinder shape and central shaft arrangement and becomes the shaft component 121 parallel with Z-direction and be supported to by this shaft component 121 rotatable to prop up bearing portion 122.
The carrying device 130 of processing substrate portion PR, central part when overlooking in cavity C B has process conveyance cylinder 131. Process conveyance cylinder 131 is formed as such as cylinder shape, is configured to central shaft parallel with Z-direction. Process conveyance cylinder 131 is set as such as to rotate in �� Z-direction. Plate shape substrates FB opens with upright state to be located at this process conveyance cylinder 131. As above-mentioned, at processing substrate portion PR, plate shape substrates FB is transported with upright state.
Process conveyance cylinder 131 has such as not shown rotary drive mechanism. This rotary drive mechanism controls by such as control portion CONT. The plate shape substrates FB supplied from supply opening SUa is located at this process conveyance cylinder 131 and transports to recovery port CLa. At process conveyance cylinder 131, by such as processed surface Fp toward the outer side in the way of open and establish plate shape substrates FB.
Processing substrate portion PR, is configured with multiple treatment unit 140 around process conveyance cylinder 131 in the way of to transport the barrel surface of cylinder 131 along this process. As this treatment unit 140, it is use the various treatment unit such as illustrated at the first example. In the example shown in Fig. 3, as multiple treatment unit 140, by carrying out each treatment unit of TFT layer forming step, pre-process (preliminary step) each treatment unit of luminescent layer forming step, each treatment unit of carrying out luminescent layer forming step arrange side by side along the circumferential direction one of process conveyance cylinder 131. Multiple treatment unit 140 is respectively towards process conveyance cylinder 131.
At aforesaid substrate treatment unit FPA2, supply plate shape substrates FB to processing substrate portion PR with upright state from supply substrate portion SU. Plate shape substrates FB opens with upright state at processing substrate portion PR to be located at process conveyance cylinder 131 and be transported to substrate recovery portion CL. Again, by multiple treatment unit 140, sequentially process such as opening the plate shape substrates FB being located at process conveyance cylinder 131 with upright state.
As above-mentioned, according to this example, process conveyance cylinder 131 has the function supporting the plate shape substrates FB with upright state winding and the function transported with upright state by this plate shape substrates FB concurrently. Thus, the space saving of substrate board treatment FPA2 can be sought. Again, due to one process conveyance cylinder 131 around carry out in steps, the layout of the device in processing substrate portion PR therefore can be made to simplify.
(the 3rd example)
Then, the substrate board treatment of the present invention the 3rd example is described.
Fig. 4 is the vertical view of the formation of display base plate treatment unit FPA3. At substrate board treatment FPA3, the formation of processing substrate portion PR is different from the first example. Other formations can be identical formation with such as the first example. In this example, it is described centered by this difference.
As shown in Figure 4, the formation of substrate board treatment FPA3 arranges multiple process conveyance cylinder illustrated at the 2nd example at processing substrate portion PR. In this example, the carrying device 230 of processing substrate portion PR has guide roller R111��R114 and process conveyance cylinder 231��233.
Guide roller R111��R114 and process conveyance cylinder 231��233 are formed as cylinder shape respectively, is configured to central shaft parallel with Z-direction respectively. Process conveyance cylinder 231��233 is formed as the relatively big footpath of guide roller R111��R114. Plate shape substrates FB opens with upright state to be located at this process conveyance cylinder 231��233 and guide roller R111��R114. As above-mentioned, at processing substrate portion PR, plate shape substrates FB is transported with upright state.
As the configuration of carrying device 230, such as guide roller R111��R114 is the substantially central portion being configured in cavity C B with the state of each two row side by side in length and breadth. Again, process conveyance cylinder 231��233 is configured to from three directions (-X direction, +Y direction,-X direction) around these four guide roller R111��R114.
Processing substrate portion PR, is configured with multiple treatment unit 241��243 respectively around process conveyance cylinder 231��233 in the way of to transport the barrel surface of cylinder 231��233 along this process. As this treatment unit 241��243, it is use the various treatment unit such as illustrated at the first example. Such as, it it is each treatment unit using and carrying out TFT layer forming step as treatment unit 241, it is each treatment unit using the pre-process (preliminary step) carrying out luminescent layer forming step as treatment unit 242, it is use each treatment unit carrying out luminescent layer forming step also may be used as treatment unit 243. Each treatment unit 241��243 is towards such as processing conveyance cylinder 231��233.
Processing substrate portion PR, multiple process conveyance cylinder 231��233 is formed as such as cylinder shape, is configured to central shaft parallel with Z-direction. Process conveyance cylinder 231 is set as to rotate in such as �� Z-direction.
Process conveyance cylinder 231��233 has such as not shown rotary drive mechanism. This rotary drive mechanism controls by such as control portion CONT. The plate shape substrates FB supplied from supply opening SUa is located at this process conveyance cylinder 231��233 and transports to recovery port CLa. At process conveyance cylinder 231��233, by such as processed surface Fp toward the outer side in the way of open and establish plate shape substrates FB. On the other hand, at guide roller R111��R114, establish plate shape substrates FB by processed surface Fp towards opening in the way of inner side.
At aforesaid substrate treatment unit FPA3, supply plate shape substrates FB to processing substrate portion PR with upright state from supply substrate portion SU. Plate shape substrates FB opens with upright state at processing substrate portion PR to be located at process conveyance cylinder 231��233 and be transported to substrate recovery portion CL. Again, by multiple treatment unit 241��243, sequentially process respectively such as opening the plate shape substrates FB being located at process conveyance cylinder 231��233 with upright state.
As above-mentioned, according to this example, by use multiple process conveyance cylinder 231��233, continuous print process can be made in such as multiple region respectively to share and to carry out. It is thus possible to increase the selection width arranged. Again, according to this example, owing to concentrating on the formation of the central part of such as cavity C B for guide roller R111��R114, therefore by such as making the treatment unit such as drying installation 244 be configured in the central part of this cavity C B, the process of the drying treatment etc. of the plate shape substrates FB after each process conveyance cylinder 231��233 processes can be made common. Thus, space saving can be sought.
(the 4th example)
Hereinafter, with reference to graphic explanation the present invention the 4th example. Hereinafter, suitably omit about the explanation giving the formation product with above-mentioned example same-sign.
Fig. 5 is the stereographic map of the formation of display base plate treatment unit FPA. Fig. 6 is the vertical view of the formation of display base plate treatment unit FPA.
At the 4th example, carrying device 30 has multiple (such as 10) guide roller R1��R10, bucket mechanism DRM, process cylinder 32. Plate shape substrates FB is directed to substrate recovery portion CL from supply substrate portion SU by guide roller R1��R8. Protection substrate PB is directed to substrate recovery portion CL with the path different from plate shape substrates FB from supply substrate portion SU by guide roller R9 and R10. In addition, if bucket mechanism DRM be first barrel of mechanism, process cylinder 32 be that the 2nd barrel of mechanism also may be used.
Guide roller R1��R3, R6��R10 is that to be configured to such as turning axle and Z direction of principal axis almost parallel. Therefore, at guide roller R1��R3, R6��R8, plate shape substrates FB opens with upright state to establish. Again, at guide roller R9 and R10, protection substrate PB opens with upright state to establish. Guide roller R1��R10 is that the formation being provided with such as driving mechanism also may be used. About the guide roller R1 being wound with the such as processed surface Fp of plate shape substrates FB, R4, R7, R8, for the formation of the not shown gas blanket forming apparatus being provided with formation gas blanket (air bearing) in barrel surface also may be used. Anyway, the situation of this example, plate shape substrates FB keeps set tension force to be transported between at least guide roller R1��R9.
Fig. 7 is the stereographic map of the formation of the vicinity of the Zhong Tong mechanism DRM of display base plate process portion PR.
As shown in Figure 7, bucket mechanism DRM has and is configured to rotary middle spindle and the almost parallel cylinder element CYL of Z-direction and this cylinder element CYL is supported to rotary drive mechanism (driving part) ACT that can rotate at circumferential direction. Cylinder element CYL has the first cylindrical portion (the 1st cylinder) CY1, the 2nd cylindrical portion (the 2nd cylinder) CY2 and guiding portion G.
First cylindrical portion CY1 and the 2nd cylindrical portion CY2 is a part for the barrel surface being respectively this cylinder element CYL. Owing to the first cylindrical portion CY1 and the 2nd cylindrical portion CY2 is all a part of a cylinder element CYL, if therefore cylinder element CYL rotates, the first cylindrical portion CY1 and the 2nd cylindrical portion CY2 can rotate integrally.
First cylindrical portion CY1 and the 2nd cylindrical portion CY2 is split in Z-direction by such as guiding portion G. That is, the 2nd cylindrical portion CY2, relative to the first cylindrical portion CY1 in the position of Z-direction that is the position difference in the direction intersected relative to horizontal direction. First cylindrical portion CY1 is configured in G+Z side, guiding portion (top), and the 2nd cylindrical portion CY2 is configured in G-Z side, guiding portion (lower section). First cylindrical portion CY1 and the 2nd cylindrical portion CY2 is formed as such as having each other equal footpath. First cylindrical portion CY1 and the 2nd cylindrical portion CY2 is formed as more such as the big footpath of guide roller R1��R10 (such as more than diameter 1m). Guiding portion G is that the part being wound in the first cylindrical portion CY1 among plate shape substrates FB and the part being wound in the 2nd cylindrical portion CY2 are guided in the way of the conveyance of the face parallel with X/Y plane.
In the transport path of plate shape substrates FB, between the first cylindrical portion CY1 and the 2nd cylindrical portion CY2, it is configured with guide roller R2��R5. Guide roller R2 also turns back being turned back into U-shaped by the first cylindrical portion CY1 with half cycle journey toward the plate shape substrates FB of +X direction conveyance toward-Y direction. Plate shape substrates FB after turning back toward-Y direction is turned back by guide roller R3 toward-X direction.
Guide roller R4 and R5 rolls oblique state configuration with the past+X in end of such as+Z side. The plate shape substrates FB being directed to-X direction by guide roller R3 is turned back by guide roller R4 toward tiltedly lower direction (+X direction and past-Z roll oblique direction). Guide roller R5 is configured on the tiltedly lower direction (+X direction and roll oblique direction toward-Z) of guide roller R4. Guide roller R5 turns back from guide roller R4 toward the plate shape substrates FB of tiltedly lower direction conveyance toward-X direction so that it is towards the 2nd cylindrical portion CY2.
Guide roller R4 and R5, in the situation of the formation of Fig. 7, is set to that its rotation keeps almost parallel each other and in the tilted given amount of XZ plane.
Again, the actuator of the inclination (tilt quantity or vergence direction) of adjustable such as turning axle it is provided with at guide roller R4 and R5. By the heeling condition of this turning axle of at least one of adjustment guide roller R4 and R5, the conveyance direction of the plate shape substrates FB sent from guide roller R5 toward-X direction can be made to become level (parallel with X-axis) and be maintained in roughly certain by the position of the Z-direction of plate shape substrates simultaneously. The adjustment of the heeling condition of the turning axle of at least one of guide roller R4 and R5, can drive the actuator of tilt adjustments to control by the control portion CONT of the measurement signal of the sensor receiving the posture of plate shape substrates FB or the change of position sent from precision monitor from guide roller R5 toward-X direction.
As above-mentioned, guide roller R2��R5 is that the conveyance direction of the plate shape substrates FB after the periphery to be wound on the first cylindrical portion CY1 is towards the conveyance direction changing plate shape substrates FB in the way of the direction of the 2nd cylindrical portion CY2. Especially, can by guide roller R4, R5's is right, does not change the conveyance direction (-X direction) of plate shape substrates FB and only makes the height location of Z-direction offset given amount (for more than the width amount of the Z-direction of plate shape substrates FB in this example). In addition, as as this example, plate shape substrates is made to turn back toward the situation of Z-direction parallel offset, between guide roller R4 and R5, plate shape substrates FB is transported by inclination in XZ face, but this tilt quantity is the width amount according to plate shape substrates, guide roller R4, the angle of inclination of the interval of the X-direction of R5, the rotary middle spindle of guide roller R4, R5 or vergence direction etc. determine in geometry mode. Be with, the situation of this example, if making guide roller R4, R5 all tilts in the way of in the of 45 degree the juxtaposition up and down in Z-direction by each rotary middle spindle in XZ face, then make the plate shape substrates advanced between guide roller R4 and R5 vertical (tilt quantity 90 degree) also may be used.
Again, by guide roller R2��R5, plate shape substrates FB is the space of-Z side (downside) being directed to the plate shape substrates FB such as guided in the position of guide roller R1. As above-mentioned, in this example, relative to the coiling direction of plate shape substrates FB toward the first cylindrical portion CY1, plate shape substrates FB is identical toward the coiling direction of the 2nd cylindrical portion CY2, in the way of not reversing in the surperficial back side of plate shape substrates FB, guide plate shape substrates FB by guide roller R2��R5.
As shown in Figures 5 and 6, the guide path that cylinder 32 is the plate shape substrates FB being configured in such as guide roller R1��R4 is processed. Process cylinder 32 is formed as such as cylinder shape. Process cylinder 32 is that to be configured to such as central shaft and Z-direction almost parallel, and plate shape substrates FB opens with upright state and establishes. Process cylinder 32 is formed as the more such as big footpath of guide roller R1��R10. The footpath of this process cylinder 32 is configured to roughly etc. also may be used in footpath with above-mentioned first cylindrical portion CY1 and the 2nd cylindrical portion CY2.
Decontaminating apparatus 41 is with so that purifying and establish from the outside of cavity C B toward the plate shape substrates FB or protection substrate PB of inner supply, having the first decontaminating apparatus 41A of clean plate shape substrates FB and clean the 2nd decontaminating apparatus 41B of protection substrate PB. First decontaminating apparatus 41A is that the transport path being located at plate shape substrates FB is such as between supply opening SUa (with reference to Fig. 6) and cylinder element CYL. Again, the 2nd decontaminating apparatus 41B is that the transport path being located at protection substrate PB is such as between supply opening SUb and laminater 46.
The TFT layer forming apparatus 42 being configured in barrel surrounding of mechanism DRM forms the device in order to the TFT assembly or electrode, wiring layer etc. driving organic el element. TFT layer forming apparatus 42 has such as the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C. First forming apparatus 42A is configured in cylinder element CYL-Y side. 2nd forming apparatus 42B is configured in cylinder element CYL-X side. 3rd forming apparatus 42C is configured in cylinder element CYL+Y side.
As above-mentioned, first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C are located at around cylinder element CYL, and the succession of steps forming TFT assembly and electrode, wiring layer etc. shares by such as the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C carrying out.
Fig. 8 is the figure of the relation of the cylinder element CYL of display the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C and bucket mechanism DRM.
As shown in Figure 8, the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C have two process portion 42A1 and 42A2, process portion 42B1 and 42B2, process portion 42C1 and 42C2 respectively. Process portion 42A1,42B1,42C1 be respectively with the first cylindrical portion CY1 in the face of arranging, can to the plate shape substrates FB process being located at this first cylindrical portion CY1. Process portion 42A2,42B2,42C2 be respectively with the 2nd cylindrical portion CY2 in the face of arranging, can to the plate shape substrates FB process being located at the 2nd cylindrical portion CY2. As above-mentioned, the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C can to the plate shape substrates FB process reeled with upright state. In addition, the first cylindrical portion CY1 and the 2nd cylindrical portion CY2, when carrying out the process of TFT layer forming apparatus 42, becomes a bearing portion of supporting plate shape substrates FB.
Again, the first cylindrical portion CY1 and the 2nd cylindrical portion CY2 becomes the situation of a bearing portion of supporting plate shape substrates FB, and bucket mechanism being called, supporting device also may be used.
As shown in Fig. 5��Fig. 7, drying installation 43 is by such as heating plate shape substrates FB so that being formed in the device of the stabilization such as TFT assembly or electrode of this plate shape substrates FB. In the face of-X side of drying installation 43, it is provided with two insert port 43a and 43b as shown in Figure 7. Insert port 43a is configured in+Z side, is inserted with the plate shape substrates FB after the first cylindrical portion CY1. Insert port 43b is configured in-Z side, is inserted with the plate shape substrates FB after the 2nd cylindrical portion CY2.
In the face of+X side of drying installation 43, it is provided with two relief outlet 43c and 43d. Relief outlet 43c is configured in+Z side, for inserting from insert port 43a and plate shape substrates FB after carrying out drying treatment discharges. Relief outlet 43d is configured in-Z side, for inserting from insert port 43b and plate shape substrates FB after carrying out drying treatment discharges.
Such as, as shown in Figures 5 and 6, preparing processing unit (plant) 44 is the device carrying out the preliminary step (insulation layer forming step etc.) when plate shape substrates FB forms luminescent layer. Preparation processing unit (plant) 44 is between the cylinder element CYL of the transport path bucket mechanism DRM being configured in such as plate shape substrates FB together with drying installation 43 and process cylinder 32. Preparation processing unit (plant) 44 has such as the first processing unit (plant) 44A, the 2nd processing unit (plant) 44B and the 3rd processing unit (plant) 44C, and a succession of preliminary processing step shares carrying out.
Among above-mentioned treatment unit 40, the 3rd forming apparatus 45C of the first forming apparatus 42A of such as TFT layer forming apparatus 42, the first decontaminating apparatus 41A, the 2nd decontaminating apparatus 41B, luminescent layer forming apparatus 45 configures along the 1st direction (in this example, the 1st direction is X-direction). Again, the 2nd forming apparatus 45B of the 2nd forming apparatus 42B of TFT layer forming apparatus 42, cylinder element CYL, process cylinder 32, luminescent layer forming apparatus 45 configures along the X direction. Moreover, the first forming apparatus 45A of the 3rd forming apparatus 42C of TFT layer forming apparatus 42, drying installation 43, luminescent layer forming apparatus 45 configures along the X direction.
Again, the first forming apparatus 42A of such as TFT layer forming apparatus 42, cylinder element CYL, the 3rd forming apparatus 42C are along the 2nd direction (being the Y-direction intersected with X-direction in this example) configuration. Again, such as decontaminating apparatus 41A and 41B and drying installation 43 configure along the Y direction. Again, preparing processing unit (plant) 44 with laminater 46 is configure along the Y direction. Moreover, the first forming apparatus 45A of luminescent layer forming apparatus 45, process cylinder 32, the 3rd forming apparatus 45C configure along the Y direction. As above-mentioned, carrying device 30 and treatment unit 40 are along the X direction and Y-direction configuration, therefore intensive when being configured to observe from X-direction and Y-direction each device part that overlaps each other become many.
The substrate board treatment FPA formed in the above described manner is that the control by control portion CONT manufactures the display module such as organic el element, LCD assembly (electronic package) in scroll bar mode. Hereinafter, the step using the substrate board treatment FPA of above-mentioned formation to manufacture display module is described.
First, it is wound into, by shaft component 11, the bearing portion 12 that the plate shape substrates FB of band shape of rolling strip is installed in the supply port 10 of supply substrate portion SU. Again, the bearing portion 14 protection substrate PB being wound on the band shape of shaft component 13 being installed in the supply port 10 of supply substrate portion SU. Moreover, the bearing portion 22 shaft component 21 reclaimed being installed in the recovery port 20 of substrate recovery portion CL.
Control portion CONT makes shaft component 11 rotate by a bearing portion 12 in this case, sends this plate shape substrates FB from supply substrate portion SU. From the plate shape substrates FB that supply substrate portion SU sends, it is that the supply opening SUa from processing substrate portion PR is supplied in cavity C B. Control portion CONT the plate shape substrates FB that is supplied in cavity C B is transported to carrying device 30 and simultaneously by each treatment unit 40 to the FB process of this plate shape substrates. In addition, in advance prior to being wound into leading section and the terminal part of the plate shape substrates FB of rolling strip at shaft component 11, paste with so that plate shape substrates FB becomes toward the automatic loading for the treatment of unit FPA and to be easy to a leading sheet and also may be used.
By this action, the plate shape substrates FB being supplied to processing substrate portion PR cleans by the first decontaminating apparatus 41A, is directed to the first cylindrical portion CY1 of barrel mechanism DRM by guide roller R1. Plate shape substrates FB is respectively towards in the way of the first forming apparatus 42A, the 2nd forming apparatus 42B and the 3rd forming apparatus 42C of TFT layer forming apparatus 42, twining with upright state winding and hang at the first cylindrical portion CY1 by processed surface Fp. Such as, twine the processed surface Fp hanging the plate shape substrates FB at the first cylindrical portion CY1 at winding, form TFT assembly or distribution etc. by this TFT layer forming apparatus 42 (process portion A1, B1 and C1).
The inside being supplied to drying installation 43 through the plate shape substrates FB of the first cylindrical portion CY1 from the insert port 43a of drying installation 43+Z side, such as, apply the drying treatment such as heat treated. Plate shape substrates FB after drying treatment takes out of from the relief outlet 43c of drying installation 43+Z side. The plate shape substrates FB taken out of guides toward-Y direction by such as guide roller R2, guides toward-X direction by guide roller R3. Through the plate shape substrates FB of guide roller R3 be by guide roller R4 toward tiltedly lower direction (+X direction and past-Z roll oblique direction) guiding, guide toward-X direction by guide roller R5.
It is the 2nd cylindrical portion CY2 reeling twine extension at bucket mechanism DRM with upright state through the plate shape substrates FB of guide roller R5. Such as, twine at winding and hang the processed surface Fp of plate shape substrates FB at the 2nd cylindrical portion CY2, overlap to form the TFT assembly of necessary layer or distribution etc. by this TFT layer forming apparatus 42 (process portion A2, B2 and C2).
The inside being supplied to drying installation 43 through the plate shape substrates FB of the 2nd cylindrical portion CY2 from the insert port 43b of drying installation 43-Z side, such as, apply the drying treatment such as heat treated again. Plate shape substrates FB after drying treatment takes out of from the relief outlet 43d of drying installation 43-Z side. The plate shape substrates FB taken out of is supplied to preparation processing unit (plant) 44 by such as guide roller R6. Preparation processing unit (plant) 44, at such as the first processing unit (plant) 44A��the 3rd processing unit (plant) 44C, forms insulating film or electricity hole input horizon or electron injecting layer etc. at plate shape substrates FB.
Plate shape substrates FB after preparation processing is directed to process cylinder 32 by such as guide roller R7. Plate shape substrates FB is respectively towards in the way of the first forming apparatus 45A, the 2nd forming apparatus 45B and the 3rd forming apparatus 45C of luminescent layer forming apparatus 45, twining with upright state winding and hang at process cylinder 32 by processed surface Fp. Twine the processed surface Fp hanging the plate shape substrates FB at process cylinder 32 at winding, form luminescent layer etc. by this luminescent layer forming apparatus 45.
It is supplied to laminater 46 through the plate shape substrates FB of process cylinder 32, pastes protection substrate PB at processed surface Fp. Paste the plate shape substrates FB after protection substrate PB and it is recycled to substrate recovery portion CL from such as recovery port CLa. The plate shape substrates FB being recycled to substrate recovery portion CL is that the shaft component 21 in recovery port 20 is wound into rolling strip. Be wound with the plate shape substrates FB of given amount at shaft component 21 after, plate shape substrates FB is such as cut off, the shaft component 21 being wound with plate shape substrates FB is removed from a bearing portion 22. In this bearing portion 22 installation example such as the new shaft component 21 of the plate shape substrates FB that do not reel.
Control portion CONT is by carrying out above-mentioned process, and the processed surface Fp of plate shape substrates FB is formed assembly.
As above-mentioned, according to this example, be wound on a part for periphery of the first cylindrical portion CY1 of barrel mechanism DRM at plate shape substrates FB after, the conveyance direction of this plate shape substrates FB is changed to the 2nd cylindrical portion CY2, this plate shape substrates FB is wound on the 2nd cylindrical portion CY2, the processed surface Fp of the part being wound on the first cylindrical portion CY1 is carried out the first process and the processed surface Fp to the part being wound on the 2nd cylindrical portion CY2 carries out the 2nd process, therefore plate shape substrates FB high-density can be processed. Thus, the space saving of substrate board treatment FPA can be sought.
In addition, at the substrate board treatment FPA shown in Fig. 5 and Fig. 6, at process cylinder 32, plate shape substrates FB only reels once, but, formed to possess two cylindrical section portions of the 1st cylindrical portion and the 2nd cylindrical portion samely with the cylinder element CYL of bucket mechanism DRM, also may be used at each cylindrical portion winding plate shape substrates FB. Moreover, in this formation, luminescent layer forming apparatus 45 is configured in the 1st cylindrical portion and the 2nd cylindrical portion also may be used. In addition, with the situation of two cylindrical section portion formations process cylinders 32, guide roller R4 as shown in Figure 7, R5, it may also be useful to two guide roller that each rotary middle spindle tilts make plate shape substrates FB turn back also may be used.
(the 5th example)
Then, the present invention the 5th example is described. In this example, the formation of bucket mechanism is different from the 4th example, is therefore described taking the formation of bucket mechanism as center. Fig. 9 is the stereographic map of the formation of the bucket mechanism DRM2 of this example of display.
In above-mentioned example, it is that the formation being formed as single cylinder element CYL for the first cylindrical portion CY1 and the 2nd cylindrical portion CY2 is described, but in the 5th example, as shown in Figure 9, such as, it it is the formation that display the first cylindrical portion CY1 is formed as different cylinder elements (the first cylinder element C1 and the 2nd cylinder element C2) from the 2nd cylindrical portion CY2.
As shown in Figure 9, the first cylinder element C1 is the configuration of the state to be separated in Z-direction with the 2nd cylinder element C2. The end face C2a of-Z side of the end face C1a and the 2nd cylinder element C2 of the+Z side of the first cylinder element C1 is facing with each other. The medullary ray of turning axle SF is set as common between the first cylinder element C1 and the 2nd cylinder element C2 (in XY face identical position).
In formation shown in Fig. 9, such as between the first cylinder element C1 and the 2nd cylinder element C2, footpath is different. Specifically, the footpath D1 of the first cylinder element C1 is greater than the footpath D2 of the 2nd cylinder element C2. As above-mentioned, from the 2nd cylinder element C2, there is different footpaths by the first cylinder element C1, the path length of adjustable transport path.
Rotary drive mechanism ACT2 is that the formation that the first cylinder element C1 and the 2nd cylinder element C2 can be made independently to rotate also may be used. Again, rotary drive mechanism ACT2 only makes a formation rotated in the first cylinder element C1 and the 2nd cylinder element C2 also may be used.
Formation according to Fig. 9, reeling to open through the plate shape substrates FB of such as guide roller R21 is located at the first cylindrical portion CY1, is directed to the 2nd cylindrical portion CY2 by guide roller (conversion portion) R22 and R23. Winding is opened the plate shape substrates FB after being located at the 2nd cylindrical portion CY2 and is guided by guide roller R24.
The difference of the diameter of the first cylinder element C1 and the 2nd cylinder element C2, can be depending on and be configured in each cylinder element C1, and the size etc. that arranges of the processing form of the various treatment unit of the surrounding of C2 or processing conditions, processing department (processing head etc.) produces.
In this example, owing to continuous print plate shape substrates FB transports to the 2nd cylinder element C2 from the first cylinder element C1, therefore the situation that the diameter of each cylinder element C1, C2 is different, it is necessary to corresponding with the measures of dispersion of this diameter make speed of rotation (rpm) also produce difference.
Again, the first cylinder element C1 and the 2nd cylinder element C2 respectively or any one cylinder element the situation of motor of rotary actuation is set, between from the part contacted with the first cylinder element C1 of plate shape substrates FB to the part contacted with the 2nd cylinder element C2, set tension force can be given.
In addition, in the formation shown in Fig. 9, the first cylinder element C1 is configured in-Z side, and the 2nd cylinder element C2 is configured in+Z side, though it is not so limited, the first cylinder element C1 is configured in+Z side, and the 2nd cylinder element C2 is configured in-Z side and also may be used.
(the 6th example)
Then, the present invention the 6th example is described. In this example, the formation of bucket mechanism is different from above-mentioned example, is therefore described taking the formation of bucket mechanism as center. Figure 10 is the stereographic map of the formation of the bucket mechanism DRM3 of this example of display.
As shown in Figure 10, the formation of the bucket mechanism DRM3 of this example is multiple 2nd cylindrical portion (processing reference plane) that relative first cylindrical portion (processing reference plane) CY1 is configured with separation. Specifically, the formation of bucket mechanism DRM3 is that relative first cylindrical portion CY1 is configured with two the 2nd cylindrical portion CY21, CY22. Such as, in this example, the first cylindrical portion CY1 and the 2nd cylindrical portion CY21, CY22 is formed as different cylinder element (the first cylinder element C1 and the 2nd cylinder element C21, C22).
The formation of bucket mechanism DRM3 is configured with two the 2nd cylinder element C21 and C22 in the first cylinder element C1+Z side. Two the 2nd cylinder element C21 and C22 are formed as such as identical footpath D4 and D5. The footpath D3 of the first cylinder element C1 is formed as being greater than these footpaths D4 and D5.
As shown in Figure 10, the first cylinder element C1 is the configuration of the state to be separated in Z-direction with the 2nd cylinder element C21 and C22. End face C21a and the C22a of-Z side of the end face C1a and the 2nd cylinder element C21 and C22 of the+Z side of the first cylinder element C1 is facing with each other. First cylinder element C1 and the 2nd cylinder element C21, C22 have other turning axle SF1 and SF21, a SF22 respectively. Turning axle SF1, turning axle SF21 and turning axle SF22 be configured to parallel to each other. Rotary drive mechanism ACT3 can control the first cylinder element C1, the 2nd cylinder element C21 and C22 independently rotates.
Formation according to Figure 10, reel to open through the plate shape substrates FB of such as guide roller R31 and it is located at the first cylindrical portion CY1, by being directed to upper section the 2nd cylindrical portion CY2 of Z-direction as the guide roller R32 and R33 in conversion portion (arranging additional guide roller if desired). Winding is opened the plate shape substrates FB after being located at the 2nd cylindrical portion CY2 and is located at the 2nd cylindrical portion CY22 by guide roller R34 winding, afterwards, is guided by guide roller R35. In formation shown in Figure 10, the first cylinder element C1 is configured in-Z side, and the 2nd cylinder element C21 and C22 is configured in+Z side, though it is not so limited, the first cylinder element C1 is configured in+Z side, and the 2nd cylinder element C21 and C22 is configured in-Z side and also may be used.
(the 7th example)
Then, the present invention the 7th example is described. In this example, the formation of bucket mechanism is different from above-mentioned example, is therefore described taking the formation of bucket mechanism as center. Figure 11 is the stereographic map of the formation of the bucket mechanism DRM4 of this example of display.
As shown in figure 11, the bucket mechanism DRM4 of this example, is provided with the first cylinder element C1, the 2nd cylinder element C2 and the 3rd cylinder element C3. These first cylinder elements C1, the 2nd cylinder element C2 and the 3rd cylinder element C3 are in Z-direction three sections configuration. In this example, plate shape substrates FB is periphery i.e. periphery i.e. the 3rd cylindrical portion CY3 of the 2nd cylindrical portion CY2 and the 3rd cylinder element C3 of the periphery i.e. first cylindrical portion CY1 of hanger at the first cylinder element C1, the 2nd cylinder element C2, is applied in a succession of processing treatment.
First cylinder element C1, the 2nd cylinder element C2, the 3rd cylinder element C3 are the configurations of the state to be separated in Z-direction. The adjacent end face of the first cylinder element C1, the 2nd cylinder element C2, the 3rd cylinder element C3 is facing with each other. Turning axle SF is that it is coaxial (position in XY face is identical) to be set as between the first cylinder element C1, the 2nd cylinder element C2, the 3rd cylinder element C3.
First cylinder element C1, the 2nd cylinder element C2, the 3rd cylinder element C3 are that to be formed as such as footpath equal. Bucket mechanism DRM4 has rotary drive mechanism ACT4. Rotary drive mechanism ACT4 for making such as three cylinder element C1, the formation that C2, C3 rotate integrally or drive indivedual formations rotated such as making it also can, for the formation making the first cylinder element C1 and the 2nd cylinder element C2 independently rotate also may be used. Again, rotary drive mechanism ACT4 is for only to make three cylinder element C1 with motor etc., and any one in C2, C3 forces the formation rotated also may be used.
Formation according to Figure 11, reeling to open through the plate shape substrates FB of such as guide roller R41 is located at the first cylindrical portion CY1, is directed to the 2nd cylindrical portion CY2 by guide roller (conversion portion) R42��R45. Winding is opened the plate shape substrates FB after being located at the 2nd cylindrical portion CY2 and is directed to the 3rd cylindrical portion CY3 by guide roller (conversion portion) R46��R49. Winding is opened the plate shape substrates FB after being located at the 3rd cylindrical portion CY3 and is guided by guide roller R50. As above-mentioned, in this example, make the plate shape substrates FB between the first cylindrical portion CY1 with the 2nd cylindrical portion CY2 unroll be formed between the 2nd cylindrical portion CY2 and the 3rd cylindrical portion CY3 repeatedly to form also samely, therefore can the further densification for the treatment of step (minimizing that floorage is set for the treatment of unit) of use bucket mechanism DRM4.
The technical scope of the present invention is not limited to above-mentioned example, can apply suitable change in the scope of interesting purport not departing from the present invention.
Such as, in above-mentioned example, it is assumed that carry out the process to plate shape substrates, processing in the respective position of three cylindrical portion CY1, CY2, CY3, but such as plate shape substrates FB is not processed between from the first cylindrical portion CY1 to the 2nd cylindrical portion CY2 and also may be used. Again, carry out the process to plate shape substrates at the place of the guide roller with the function as changes direction end also may be used.
As shown in figure 12, the plate shape substrates FB winding being directed to barrel mechanism DRM5 by guide roller R51 is located at the first cylindrical portion CY1, after being guided by guide roller R52, on the path to the 2nd cylindrical portion CY2, winding is located at the guide roller R53 that such as turning axle is configured to level (parallel with X/Y plane). Herein, the heating unit (bucket of heat drying) of heating this plate shape substrates FB can be set at such as guide roller R53. That is, guide roller R53 can be configured to thermotank. This situation, a part being located at guide roller R53 that reels among plate shape substrates FB is heated. As shown in figure 12, guide roller R53, in order to the plate shape substrates FB sent here with upright state from guide roller R52 is sent into guide roller R54 with upright state, is the configuration becoming and giving distortion.
Such as, the situation for the treatment of unit 40 in using apparatus for coating etc. as bucket mechanism DRM5, it is preferably, plate shape substrates FB after coating being processed is dried process etc., but this kind of situation, around the plate shape substrates at a moment after establishing application step and drying step can be used at guide roller (rotary barrel of heat treated) R53. Plate shape substrates FB after drying treatment, is be directed to the 2nd cylindrical portion CY2 by such as guide roller R54, after being wound on the 2nd cylindrical portion CY2, guides by guide roller R55.
Again, in above-mentioned each explanation, the formation that such as plate shape substrates FB transports for upright state to be described, but it is not limited to this. Such as, bucket mechanism DRM and process cylinder 32 at least one, the processed surface Fp of plate shape substrates FB is transported with the state relative to horizontal plane or inclination, in at least one the transport path of conveyance to bucket mechanism DRM and process cylinder 32, it is configured to the processed surface Fp of plate shape substrates FB substantial parallel relative to horizontal plane also may be used. Again, in the transport path of plate shape substrates FB, the state that combination makes plate shape substrates FB erect also may be used with horizontal state.
In addition, by plate shape substrates FB with non-horizontal posture, such as by the processed surface Fp of plate shape substrates FB with relative to horizontal plane (X/Y plane) tilt set angle state conveyance or process situation, the cylinder element CYL of Shi Tong mechanism DRM, process cylinder 32, guide roller R1, R2, R6, the rotary middle spindle of R7, R8 etc. tilts relative to Z-direction.
The technical scope of the present invention is not limited to above-mentioned example, can apply suitable change in the scope of interesting purport not departing from the present invention.
Such as, except the formation of above-mentioned example, the carrying device 30 shown in Fig. 1, Fig. 2, Fig. 5, Fig. 6, except guide roller R101��R106, process cylinder 31 and 32, the stance adjustment cylinder of the posture with adjustment plate shape substrates FB also may be used.
This stance adjustment cylinder, is configurable on the upstream side of the transport path treatment unit 40 of such as plate shape substrates FB. Again, also may be used at the front configuration stance adjustment cylinder being such as close to treatment unit 40. Stance adjustment cylinder is that to be configured to such as central shaft parallel with Z-direction, is set as and can move in X-direction, Y-direction and Z-direction. Again, stance adjustment cylinder is configured to such as central shaft tilt relative to Z direction of principal axis. This situation, by the inclination or the change in location that make such as stance adjustment cylinder, the posture of adjustable plate shape substrates FB.
Again, above-mentioned guide roller or process cylinder, process conveyance cylinder hold concurrently also may be used by the formation of stance adjustment cylinder.
Again, in above-mentioned example, to process cylinder 31, process cylinder 32 is formed as cylinder shape and is described, but be not limited to cylinder shape. Such as, the shape of process cylinder 31 is made to be oval or polygonal post or the part formation curvature surface on the surface of process cylinder 31 also may be used. This situation, is preferably, fixing process cylinder 31, process cylinder 32, make plate shape substrates FB with contact or cordless at the surface sliding of process cylinder 31,32.
Again, the cylinder element CYL of bucket mechanism DRM also equally, is not limited to cylinder element. Such as, substitute cylinder element CYL, when the processed surface of plate shape substrates is processed by each treatment unit 40, it may also be useful to be formed can guide the guide member of guiding face of processed surface with curvature surface or be formed can be smooth guide processed surface the guide member of guiding face also may be used. , it may also be useful to the situation of guide member, is preferably, in addition make plate shape substrates FB to contact or cordless slip.
Again, in the front end of the plate shape substrates FB of the rolling strip being arranged at supply substrate portion SU, paste with both measured lengths and there is the thickness with plate shape substrates FB same degree and rigidity lead sheet high compared with plate shape substrates also may be used. So, when the scroll bar of new plate shape substrates FB is installed on supply substrate portion SU, also plate shape substrates can be filled in treatment unit FPA4 automatically.
Again, in above-mentioned each explanation, the formation that such as plate shape substrates FB transports for upright state to be described, but it is not limited to this. Such as, process cylinder 31 and process cylinder 32 at least one, the processed surface Fp of plate shape substrates FB is transported with the state relative to horizontal plane or inclination, in at least one the transport path of conveyance to process cylinder 31 and process cylinder 32, it is configured to the processed surface Fp of plate shape substrates FB substantial parallel relative to horizontal plane also may be used. Again, in the transport path of plate shape substrates FB, the state that combination makes plate shape substrates FB erect also may be used with horizontal state.
In addition, by plate shape substrates FB with non-horizontal posture, such as by the processed surface Fp of plate shape substrates FB with relative to horizontal plane (X/Y plane) tilt set angle state conveyance or process situation, make process cylinder 31, process cylinder 32, guide roller R101, R102, R103, the rotary middle spindle of R104, R8 etc. tilts relative to Z-direction.
[main element numbers explanation]
FB plate shape substrates
SU supply substrate portion
PR processing substrate portion
Room, CB chamber
CL substrate recovery portion
CONT control portion
Fp processed surface
DRM bucket mechanism
CYL cylinder element
CY1 first cylindrical portion
CY2 the 2nd cylindrical portion
ACT rotary drive mechanism
C1 first cylinder element
C2 the 2nd cylinder element
DRM��DRM5 bucket mechanism
42A1,42A2,42B1,42B2,42C1,42C2 process portion
43 drying installations
FPA, FPA4, FPA2, FPA3 substrate board treatment
R101��R106, R111��R114 guide roller
10 supply ports
11,13,21,111,121 shaft components
12,14,22,112,122 bearing portion
20 recovery port
30,130,230 carrying devices
31,32 process cylinders
40,140,241��244 treatment unit
131,231��233 process conveyance cylinders

Claims (11)

1. a substrate board treatment, the plate shape substrates of the long ribbon shape with pliability is processed by it, it is characterised in that, possess:
First treatment unit, is implemented the first process to transporting in the described plate shape substrates of long side direction;
2nd treatment unit, the direction intersected in the conveyance direction with the described plate shape substrates in this first treatment unit is in staggered configuration, and described plate shape substrates is implemented the 2nd process;
3rd treatment unit, possesses and is arranged to make that two row of described plate shape substrates pass through respectively moves into discharge portion, and implement the 3rd process to the plate shape substrates after described first process or to the plate shape substrates after described 2nd process; And
Carrying device, possess by described plate shape substrates by described first treatment unit towards described plate shape substrates is transported in the way of described 3rd treatment unit the first conveying unit in described long side direction, by after described plate shape substrates is by described 3rd treatment unit towards described plate shape substrates is transported in the way of described 2nd treatment unit in described long side direction the 2nd conveying unit and by after described plate shape substrates is by described 2nd treatment unit towards described plate shape substrates being transported in the way of described 3rd treatment unit the 3rd conveying unit in described long side direction.
2. substrate board treatment as claimed in claim 1, wherein, described first treatment unit and described 2nd treatment unit, the upper and lower intersected in the conveyance direction with described plate shape substrates is to being in staggered configuration.
3. substrate board treatment as claimed in claim 2, wherein, described 3rd treatment unit move into discharge portion, have for move into described first process after plate shape substrates first move into mouth with for discharge described plate shape substrates the first relief outlet and for move into described 2nd process after plate shape substrates the 2nd move into mouth with for discharge described plate shape substrates second row outlet;
Described 1st moves into mouth and the described 2nd moves into mouth in upper and lower to configuration, and described first relief outlet and described second row export in upper and lower to configuration.
4. substrate board treatment as described in item as arbitrary in claims 1 to 3, wherein, described first treatment unit possesses the processed surface that can make described plate shape substrates is that cylinder planar twelve Earthly Branches hold and are displaced into the first cylinder element of described long side direction simultaneously and are configured at the surrounding of this first cylinder element and carry out the first process portion of described first process;
It is that cylinder planar twelve Earthly Branches hold and are displaced into the 2nd cylinder element of described long side direction simultaneously and are configured at the surrounding of the 2nd cylinder element and carry out the 2nd process portion of described 2nd process that described 2nd treatment unit possesses the processed surface that can make described plate shape substrates.
5. substrate board treatment as claimed in claim 4, wherein, described first cylinder element and described 2nd cylinder element in upper and lower to being arranged, and can be formed around the rotary barrel that central shaft rotates.
6. substrate board treatment as claimed in claim 2, wherein, in the transport path of the long side direction of each the described plate shape substrates formed by described first conveying unit, described 2nd conveying unit, described 3rd conveying unit, the multiple guide roller for the conveyance direction converting described plate shape substrates are set;
At least two guide roller in the plurality of guide roller, according to the upper and lower of described first treatment unit and described 2nd treatment unit to the staggering of configuration, configure in the way of skew in upper and lower by the transport path of described plate shape substrates.
7. substrate board treatment as described in claims 1 to 3,6 arbitrary items, wherein, described 3rd process that described 3rd treatment unit carries out makes the process of described plate shape substrates drying or is heated to the process of both fixed temperatures.
8. a substrate processing method using same, it makes the plate shape substrates with the long ribbon shape of pliability transport in long side direction, while described plate shape substrates is implemented multiple process, it is characterised in that, comprise:
First step, is sent to the first treatment unit by described plate shape substrates, and the processed surface of described plate shape substrates is implemented the first process;
2nd step, is sent to the 2nd treatment unit by described plate shape substrates, and the processed surface of the described plate shape substrates after described first process is implemented the 2nd process;
Third step, described plate shape substrates after described first process and the described plate shape substrates after described 2nd process are sent to the 3rd treatment unit moving into discharge portion possessing and being arranged to make two row of described plate shape substrates to pass through respectively, the processed surface of described plate shape substrates is implemented the 3rd process; And
Conveyance step, by transporting described plate shape substrates in the carrying device of described long side direction with the order of described first treatment unit, described 3rd treatment unit, described 2nd treatment unit and described 3rd treatment unit, transports described plate shape substrates.
9. substrate processing method using same as claimed in claim 8, wherein, described 3rd process that described 3rd treatment unit carries out makes the process of described plate shape substrates drying or is heated to the process of both fixed temperatures.
10. substrate processing method using same as claimed in claim 9, wherein, described first treatment unit and described 2nd treatment unit, the upper and lower intersected in the conveyance direction with described plate shape substrates is to being in staggered configuration.
11. substrate processing method using sames as claimed in claim 10, wherein, in the transport path of the long side direction of the described plate shape substrates formed by described carrying device, arrange the multiple guide roller for the conveyance direction converting described plate shape substrates;
By at least two guide roller in the plurality of guide roller, and according to the upper and lower of described first treatment unit and described 2nd treatment unit to the staggering of configuration, make the transport path of described plate shape substrates in upper and lower to skew.
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