CN103262209B - The manufacture method of base plate processing system and electronic component - Google Patents

The manufacture method of base plate processing system and electronic component Download PDF

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Publication number
CN103262209B
CN103262209B CN201180059872.XA CN201180059872A CN103262209B CN 103262209 B CN103262209 B CN 103262209B CN 201180059872 A CN201180059872 A CN 201180059872A CN 103262209 B CN103262209 B CN 103262209B
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China
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aforementioned
substrate
base plate
accommodation apparatus
cylinder
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CN201180059872.XA
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CN103262209A (en
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浜田智秀
木内彻
增川孝志
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

Base plate processing system of the present invention, possesses: multiple substrate accommodation apparatus, has the reception room of collecting substrate; Multiple substrate board treatment, has the connecting portion being connected to each substrate accommodation apparatus, processes under the state that substrate accommodation apparatus is connected to connecting portion to substrate; Guiding device, guides multiple substrate accommodation apparatus to be connected with each substrate board treatment respectively; And control device, control guiding device and be linked in sequence with set with each substrate board treatment respectively to make multiple substrate accommodation apparatus.

Description

The manufacture method of base plate processing system and electronic component
Technical field
The present invention is about the manufacture method of base plate processing system and electronic component.
Subject application advocates the United States Patent (USP) provisional application the 61/423rd that on December 15th, 2010 applies for, the priority of No. 222, and its content is applied at this.
Background technology
As the display element forming the display unit such as display equipment, the liquid crystal display cells that has such as been widely known by the people, organic electric-excitation luminescent (organic EL) element.At present, these display elements form the active member (activedevice) of membrane transistor (ThinFilmTransistor:TFT) for main flow with each pixel of correspondence in substrate surface.
In recent years, a kind of technology at plate shape substrates (such as film member etc.) upper formation display element is proposed.As this kind of technology, such as, be widely known by the people (for example, referring to patent documentation 1) with the gimmick being called as volume to volume (rolltoroll) mode (hereinafter referred to as " winding method ").Winding method, be a slice plate shape substrates of the confession application cylinder by twisting in supply substrate side (such as, banded film member) send, and the substrate be sent is twisted in the recovery cylinder of substrate recovery side while to be located at for the processing unit between application cylinder and recovery cylinder, bestow desired processing to substrate.
And from send substrate to winding substrate during, such as use the conveyance substrates such as multiple conveyance cylinders, use multiple processing unit (unit) to form the gate, lock dielectric film, semiconductor film, source-drain etc. that form TFT, in the processed surface of substrate, sequentially form the inscape of display element.Such as, when forming the situation of organic EL element, on substrate, luminescent layer, anode, negative electrode, circuit etc. are sequentially formed.
Prior art document:
[patent documentation 1] International Publication No. 2006/100868 publication
Summary of the invention
The present invention for the problem solved is: when carrying out the situation of above-mentioned winding method, need the treatment system that treatment effeciency is high, can obtain high-throughput.
Object of the present invention, is namely to provide and a kind ofly obtains the base plate processing system of high-throughput and the manufacture method of electronic component.
The present invention in order to the technological means solved the problems of the technologies described above is:
The present invention one aspect provides a kind of base plate processing system, possesses: multiple substrate accommodation apparatus, has the reception room of collecting substrate; Multiple substrate board treatment, has the connecting portion being connected to each substrate accommodation apparatus, processes under the state that substrate accommodation apparatus is connected to connecting portion to substrate; Guiding device, guides multiple substrate accommodation apparatus to be connected with each substrate board treatment respectively; And control device, control guiding device and be linked in sequence with set with each substrate board treatment respectively to make multiple substrate accommodation apparatus.
Another aspect of the present invention provides a kind of manufacture method of electronic component, uses the base plate processing system of above-mentioned aspect to form electronic component in substrate.
Technique effect of the present invention is: according to aspect of the present invention, can provide a kind of and can obtain the base plate processing system of high-throughput and the manufacture method of electronic component.
Accompanying drawing explanation
Fig. 1 is the front view that the entirety of the base plate processing system of the invention process form is formed.
Fig. 2 is the figure of the formation of the substrate accommodation apparatus of this example.
Fig. 3 is the figure of the formation of the substrate filling device of this example.
Fig. 4 is the figure that the substrate of this example is formed.
Fig. 5 is the figure that the part of the base plate processing system of this example is formed.
Fig. 6 is the figure that the part of the base plate processing system of this example is formed.
Fig. 7 is the figure of the formation of the substrate board treatment of this example.
Fig. 8 is the figure that the part of the base plate processing system of another example of the present invention is formed.
Fig. 9 A is the figure that the part of the base plate processing system of another example of the present invention is formed.
Fig. 9 B is the figure that the part of the base plate processing system of another example of the present invention is formed.
Figure 10 is the figure that the part of the base plate processing system of another example of the present invention is formed.
Figure 11 is the figure that the part of the base plate processing system of another example of the present invention is formed.
Figure 12 is the profile of the Inner Constitution of substrate storage device.
Figure 13 is the profile of an action case of substrate storage device.
Figure 14 is the profile of the formation of another substrate storage device.
Figure 15 is the profile of an action case of another substrate storage device.
Figure 16 is the figure of another example of substrate storage device.
Figure 17 is the figure of another example of substrate storage device.
Figure 18 is the figure of another example of substrate storage device.
Figure 19 is the figure of another example of substrate storage device.
Figure 20 is the figure of another example of substrate storage device.
Main element label declaration:
SYS base plate processing system
PR, PR1 ~ PR5, PRA ~ PRF, PA substrate board treatment (processing unit)
GD guiding device
ST, STR, STR2 substrate accommodation apparatus (substrate storage device)
S substrate
CONT control device
20 containers (framework)
29 protuberances
30N discharges port (substrate insertion section)
30X draws in port (income port, substrate pulling unit)
39 Ports
40 vehicle frames
41 rails
The 1st of Sa substrate S
The 2nd of Sb substrate S
SP substrate supporting portion
CT container
CV substrate conveying unit
CTa, CTb wall portion
RM reception room
W, W1, W2 window portion
J connecting portion
R cylinder
567 idler components
568 guide portion
569,575 driving mechanisms
571a bearing-surface
590,591 device side connecting portions
592,593 gripper cylinder
595 handling parts
595a treated side
672,673 guide roller
674,675 mechanical arms
676,677 arm drive divisions
678 installation portions
679 supporting member for substrate
679a bearing-surface
695 handling parts
700 slip drive divisions
701,702 guiding elements
Embodiment
Below, with reference to graphic explanation example of the present invention.
Fig. 1 is the front view that the entirety of the base plate processing system SYS of this example is formed.
As shown in Figure 1, base plate processing system SYS is such as located at the ground FL of manufacturing works, has ground floor part 1 and second layer part 2.
In the ground floor part 1 of base plate processing system SYS, be provided with that accommodation apparatus moves into mouth 10, accommodation apparatus takes out of mouth 11 and substrate filling device 12.The second layer part 2 of base plate processing system SYS is the dust free room fenced up with wall portion 2a.The multiple substrate board treatment PR be arranged in a direction are provided with in second layer part 2.In addition, guiding device GD and multiple substrate accommodation apparatus ST is connected with in ground floor part 1 and second layer part 2.
Below, in the explanation of base plate processing system SYS, set the orthogonal coordinate system of an XYZ, with reference to the orthogonal coordinate system of this XYZ while the position relationship of each component is described.In following figure, the plane parallel with ground FL in orthogonal for XYZ coordinate system is set to XY plane.In XY plane, multiple substrate board treatment PR arrange direction is set to Y-direction, the direction orthogonal with Y-direction is set to X-direction.Again, vertical with ground FL (XY plane) direction is set to Z-direction.
Base plate processing system SYS has to being formed as banded the system that flexual substrate S surface imposes the volume to volume mode (hereinafter referred to as " winding method ") of various process.Base plate processing system SYS, with when being substrate S such as to be formed the situations such as the display element such as organic EL element, liquid crystal display cells (electronic component).Certainly, when forming the situation of the element beyond these elements, also base plate processing system SYS can be used.
As the substrate S of handling object in base plate processing system SYS, the paper tinsel (foil) of such as resin film and stainless steel etc. can be used.Such as resin film can use the materials such as polyvinyl resin, acrylic resin, mylar, ethylene vinyl alcohol copolymer resin, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, polyvinyl alcohol resin.
The short side direction size of substrate S is formed as such as 50cm ~ 2m degree, and long side direction size (1 week size) is then formed as such as more than 10m.Certainly, this size is only an example, is not limited to this.The short side direction size of such as substrate S can be below 50cm, can also be more than 2m.In this example, short side direction size can be used more than the substrate S of 2m.In addition, substrate S long side direction size can be below 10m.
Substrate S has the thickness of such as below 1mm, and is formed as having pliability.Pliability alleged herein, refers to the character that the pre-determined force such as imposing to substrate degree of at least conducting oneself with dignity also can not rupture or break and this substrate can be bent.In addition, the character such as bent because of above-mentioned pre-determined force is also contained in the pliability of indication.Again, above-mentioned pliability can change along with environment of this substrate material, size, thickness and temperature etc. etc.Moreover substrate S can use the substrate of a slice band shape, also can use and multiple unit substrate connected and be formed as banded formation.
Substrate S, to bear its size of heat of such as 200 DEG C of degree, also the little person of indeclinable hot coefficient of dilatation is better.Such as inorganic filler can be mixed in resin film to reduce hot coefficient of dilatation.As inorganic filler, such as, there are titanium oxide, zinc oxide, aluminium oxide, silica etc.
Fig. 2 is the profile of the formation of substrate accommodation apparatus ST.
As shown in Figure 2, substrate accommodation apparatus ST has the container (framework) 20 of the multiple wall of tool.Container 20 is formed as such as its profile and is roughly cuboid.Inner in container 20, the wall portion being formed with to form container 20 around reception room RM.Substrate S is housed in this reception room RM.Container 20 has two peristomes (EN, EX) at a wall portion 20a.In this example, substrate accommodation apparatus ST uses under the state of this wall portion 20a towards+X side.
A mouthful EN moved into by the substrate that reception room RM moved into by substrate by the side in two peristomes.The opposing party in two peristomes takes out of a mouthful EX in order to the substrate taken out of by the substrate of reception room RM.Though this example is moved into mouthful EN for substrate and is configured in the formation that substrate takes out of the-Z side of mouthful EX and is described, and can also be contrary configuration certainly.
Multiple wheel (microscope carrier drive division) 28 is provided with in the face (bottom surface) of-Z side of container 20.Multiple wheel 28 is configured to two row in X-direction.Wheels 28 is provided with to make container 20 toward the not shown driving mechanism of X-direction movement in substrate accommodation apparatus ST.Control device CONT can by the amount of movement of this driving mechanism adjustment container 20 and mobile sequential etc.
Substrate in reception room RM is moved into be provided with near mouthful EN and is moved into cylinder 22.Move into cylinder 22 by move into from substrate mouthful EN toward reception room RM in-position that substrate S that X-direction is moved into clips from Z-direction arranges a pair.Move into cylinder 22 rotatable to draw in reception room RM by moving into the substrate S that mouthful EN moves into from substrate.
Direction conversion cylinder 23 is provided with in the downstream moving into cylinder 22.Direction conversion cylinder 23 has cylinder 23a and 23b.Return portion 24 is provided with in the downstream of direction conversion cylinder 23.Return portion 24 has multiple (being 8 herein) cylinder 24a ~ 24h.Each cylinder 24a ~ 24h is formed as cylindric respectively, is configured to central shaft and extends along Y-axis, parallel to each other in X-direction.
Cylinder 24a, 24c, 24e and 24g configure along+Z sidewall the portion of container 20.Cylinder 24b, 24d, 24f and 24h then configure along-Z sidewall the portion of container 20.Cylinder 24a ~ the 24h configured in this way, substrate S are hung thereon with the order of cylinder 24a, cylinder 24b, cylinder 24c, cylinder 24d, cylinder 24e, cylinder 24f, cylinder 24g, cylinder 24h.So, owing to hanging over the cylinder being configured at Z side and the cylinder being configured in-Z side alternately, the formation of the substrate S being formed as banded can therefore effectively be accommodated.
Take out of nearby being provided with of mouthful EX in cylinder 24h downstream and substrate and take out of cylinder 25.Take out of the position that cylinder 25 clips substrate S in Z-direction and be provided with a pair.That is, take out of cylinder 25 and be respectively equipped with one in the face side of substrate S and rear side.Take out of cylinder 25 rotatable to send to reception room RM outside by taking out of the substrate S that mouthful EX takes out of from substrate.Again, be provided with in+X sidewall portion the 20a of container 20 and protrude from+the protuberance 29 of X-direction.
Again, in order to substrate S is accommodated to reception room RM under state of turning back as shown in Figure 2, also can in the transport path of substrate S, such as between each cylinder, arrange and guide the surface of substrate S or the guide plate at the back side.This guide plate, can be located at the face side of substrate S or rear side either party, also can be located at two sides.In addition, as this guide plate, air also can be used to guide.
As shown in Figure 1, the accommodation apparatus being located at the ground floor part 1 of base plate processing system SYS moves into mouth 10, is the part moving into aforesaid substrate accommodation apparatus ST.Again, accommodation apparatus takes out of mouth 11 is the parts taking out of substrate accommodation apparatus ST.Accommodation apparatus takes out of mouth 11 and is located at+Y the side that accommodation apparatus moves into mouth 10.Substrate S is fills up to the reception room RM of substrate accommodation apparatus ST by substrate filling device 12.Substrate filling device 12 is located at the-Y side that accommodation apparatus moves into mouth 10.
Fig. 3 is the figure of the formation of substrate filling device 12.
As shown in Figure 3, substrate filling device 12 has sheet material volume 121R, conduction band volume 122R, sheet material conveyance cylinder 123RL, conduction band conveyance cylinder 124, machine table 125, cutting knife 126, then unit 127, discharges cylinder 128, Port 129 and discharge port (substrate insertion section) 130.
Sheet material volume 121R is fills up to the source of supply of the substrate S of substrate accommodation apparatus ST, is wound with substrate S.Conduction band volume 122R is affixed on the source of supply of the conduction band L of substrate S front end and rear end, is wound with this conduction band L.Substrate S and conduction band L is sent respectively from sheet material volume 121R and conduction band volume 122R.
The substrate S sent from sheet material volume 121R transports toward machine table 125 by sheet material conveyance cylinder 123RL.The conduction band L sent from conduction band volume 122R transports toward machine table 125 by conduction band conveyance cylinder 124.Cutting knife 126 cuts off the conduction band L being transported to machine table 125.Then unit 127 by the front end (or rear end) of cut-off conduction band L and substrate S in addition then.
Discharge cylinder 128 by the substrate S of then conduction band L from the outside of discharging port 130 and be expelled to substrate filling device 12.The recess that Port 129 has to make the protuberance 29 of substrate accommodation apparatus ST to insert.Under the state inserting the recess of Port 129 at protuberance 29, substrate accommodation apparatus ST is connected with substrate filling device 12.
Be respectively equipped with not shown terminal in protuberance 29 and Port 129, by recess protuberance 29 being inserted Port 129, substrate accommodation apparatus ST be electrically connected with substrate filling device 12.Certainly, also can be formed in protuberance 29 and Port 129 configures the end of pneumatics pipeline and the end of vacuum pipeline respectively, according to this pipeline of substrate accommodation apparatus ST is connected with the pipeline of substrate filling device 12 by recess protuberance 29 being inserted Port 129.
Fig. 4 is the figure that the substrate S of the state posting conduction band L is formed.
As shown in Figure 4, element (such as giant display etc.) is formed with in substrate S in the multiple regions 3 being arranged in long side direction.Again, conduction band L, have the front end conduction band L1 of the front end Sh being attached to substrate S, with the rear end conduction band L2 of rear end Se being attached to substrate S.Notch part La and peristome Lb is respectively equipped with in front end conduction band L1 and rear end conduction band L2.
Notch part La and peristome Lb, for such as hanging over jut of the conveyance system in processing unit PR that base plate processing system SYS possesses etc. or being used as the part of reference position of position alignment.Again, in front end, conduction band L1 is formed with travel direction label L c, and in rear end, conduction band L2 is then formed with travel direction label L d.The substrate S that this kind posts conduction band L is housed in the reception room RM of substrate accommodation apparatus ST.
Again, be located at notch part La and the peristome Lb of front end conduction band L1 and rear end conduction band L2, can process by the cutting knife 126 etc. shown in Fig. 3.
Again, the information recording unit of not shown electronic tag (ICtag) or magnetic stripe etc. is provided with in conduction band L.In this information recording unit, record the various data (information for the treatment of conditions, result, batch management etc.) that processing and the process of substrate S are correlated with.Be recorded in the information of information recording unit, be recorded as and can override to being such as located at the memory portion of substrate accommodation apparatus ST, being namely located at the memory portion etc. of control device CONT.
Fig. 5 is the vertical view of the formation of second layer part 2 from the base plate processing system SYS shown in top view Fig. 1.Fig. 6 is the end view that the part of second layer part 2 is formed.
As shown in Fig. 1, Fig. 5 and Fig. 6, be located at the substrate board treatment PR of the second layer part 2 of base plate processing system SYS, carry out the device of the various process in order to form display element to substrate S.As this kind of substrate board treatment PR, in this example, such as, can be the spaced walls forming apparatus in order to form spaced walls at substrate S, be used for driving the electrode forming apparatus of the electrode of organic EL element in order to formation, in order to form the luminescent layer forming apparatus etc. of the luminescent layer of organic EL element.
Specifically, film formation device and exposure device, developing apparatus, surfaction device, the decontaminating apparatus etc. such as apparatus for coating liquid droplet (such as inkjet type apparatus for coating, intaglio plate (photogravure) printing equipment etc.), evaporation coating device, sputtering unit is such as had.In this example, sequentially configure first substrate processing unit PR1, second substrate processing unit PR2, the 3rd substrate board treatment PR3 and tetrabasal processing unit PR4 that this kind carries out various process from past+Y side ,-Y side.Again, as processing unit, also configurable other carry out the processing unit of various engineering (heating etc.).
Each substrate board treatment PR has the portion that receives and grant 30 received and grant carrying out substrate S between substrate accommodation apparatus ST.Receive and grant portion 30, have substrate substrate S being expelled to substrate accommodation apparatus ST move into mouthful EN discharge port 30N, with take out of from the substrate of substrate accommodation apparatus ST acquisition port (drawing in port, the substrate pulling unit) 30X that mouthful EX captures substrate S.In addition, each substrate board treatment PR has the Port 39 (Fig. 6) of the protuberance 29 being connected to substrate accommodation apparatus ST.
Be respectively equipped with not shown terminal in Port 39, by recess protuberance 29 being inserted Port 39, make substrate accommodation apparatus ST be electrically connected with each substrate board treatment PR according to this.Again, also can be formed in Port 39 and configure the line end of pneumatics system and the line end of vacuum system, and by recess protuberance 29 being inserted Port 39, the pipeline of substrate accommodation apparatus ST is connected with the pipeline of substrate board treatment PR.
Fig. 7 is the example as substrate board treatment PR, the figure of formation when using the situation of spaced walls forming apparatus PR1.
As shown in Figure 7, spaced walls forming apparatus PR1 has the handling part comprising ultraviolet hardening resin layer forming portion 31, temperature adjustment portion 32, the marking (imprint) forming portion 33, Ultraviolet radiation portion 34, buffer part 35 and air-conditioning part 36.In addition, spaced walls forming apparatus PR1 has above-mentioned discharge port 30N and acquisition port 30X.
Ultraviolet hardening resin layer forming portion 31 forms the layer of ultraviolet hardening resin to the substrate S surface in device with rubbing method capturing from acquisition port 30X.Temperature adjustment portion 32 carries out the temperature adjustment of the substrate S being formed with ultraviolet hardening resin layer.Control device CONT can control the adjustment amount in temperature adjustment portion 32.Marking forming portion 33 forms predetermined pattern in ultraviolet hardening resin layer.
Marking forming portion 33 has pressing mold (stamper) cylinder 33a and crimping cylinder 33b.The mould of the spaced walls being formed at ultraviolet hardening resin layer is formed in pressing mold cylinder 33a surface.The face side of substrate S is crimped on pressing mold cylinder 33a surface by crimping cylinder 33b.Therefore, substrate S namely by conveyance by pressing mold cylinder 33a with crimp between cylinder 33b, according to this pattern of spaced walls is formed in the ultraviolet hardening resin layer on substrate S.
The ultraviolet hardening resin layer irradiation ultraviolet radiation of the 34 couples of substrate S in Ultraviolet radiation portion.Ultraviolet radiation portion 34 has multiple light sources of irradiation ultraviolet radiation.Namely the spaced walls of hardening state is formed in the substrate S by Ultraviolet radiation portion 34.Buffer part 35 is accommodated a certain amount of part by the substrate S in Ultraviolet radiation portion 34.Substrate S via buffer part 35 discharges from acquisition port 30X toward substrate accommodation apparatus ST.Air-conditioning part 36 has filter 36a and 36b removing the foreign matters such as dust from the air in spaced walls forming apparatus PR1.Filter 36a and 36b uses HEPA filter etc.
In addition, as shown in Figure 1, guiding device GD has vehicle frame 40, rail (guiding rail bar) 41, chassis (microscope carrier) 42, elevating mechanism 43 and 44.Guiding device GD is in ground floor part 1 and second layer part 2 and guide substrate accommodation apparatus ST therebetween.Vehicle frame 40 is established in a straight line at the channeling direction (Y-direction) of substrate accommodation apparatus ST.Rail 41 is formed as extending Y-direction, sets two (with reference to Fig. 3) on+Z side of vehicle frame 40 in X-direction.
Chassis 42 is configured to be displaced into Y-direction along rail 41.The recess 42d embedding rail 41 is formed in the face 42b of-Z side of chassis 42.Y-direction is displaced into along this rail 41 under the states that chassis 42 is configured to 41 embedding recess 42d in-orbit.
Chassis 42 has the loading surface 42a of mounting substrate accommodation apparatus ST.The tracking 42c extended in parallel in X-direction is formed in the loading surface 42a of chassis 42.In the wheel 28 of rail 42c mounting substrate accommodation apparatus ST.This wheel 28 is configured in the position with rail 42c subtend respectively.Therefore, each wheel 28 can move along rail 42c.From the above, substrate accommodation apparatus ST is arranged to relatively independently to be displaced into X-direction by guiding device GD.
Elevating mechanism 43 is past under the state being loaded with substrate accommodation apparatus ST+and Z-direction moves, and according to this substrate accommodation apparatus ST relocated to second layer part 2 from ground floor part 1.Elevating mechanism 44 load from the substrate accommodation apparatus ST of second layer part 2 past-Z-direction moves, and according to this substrate accommodation apparatus ST relocated to ground floor part 1 from second layer part 2.
Secondly, the action of the base plate processing system SYS with above-mentioned formation is described.
Control device CONT, when the accommodation apparatus from outside, substrate accommodation apparatus ST being moved into ground floor part 1 moves into mouth 10, is configured in-Z the side of this substrate accommodation apparatus ST, and substrate accommodation apparatus ST is loaded into loading surface 42a by chassis 42.Substrate accommodation apparatus ST moves into mouth 10 with predetermined distance from accommodation apparatus and moves into.
After mounting substrate accommodation apparatus ST, control device CONT make chassis 42 past-Y-direction moves and substrate accommodation apparatus ST guided to substrate filling device 12.Control device CONT makes substrate accommodation apparatus ST move along the past+X side of the rail 42c being formed at chassis 42, so that protuberance 29 is inserted Port 129.In this case, substrate S is filled to substrate accommodation apparatus ST from substrate filling device 12 by control device CONT.This substrate S, is housed in substrate accommodation apparatus ST under the state posting conduction band L as shown in Figure 4.
After substrate S is housed in substrate accommodation apparatus ST, control device CONT makes chassis 42 move on elevating mechanism 43.Afterwards, control device CONT makes the past+Z side of elevating mechanism 43 move, and is transported by chassis 42 toward second layer part 2.Control device CONT makes the past+Y side of chassis 42 move, and is configured on the rail 41 of second layer part 2 by this chassis 42.After the movement of chassis 42, control device CONT makes the past-Z side of elevating mechanism 43 move, and makes then the substrate accommodation apparatus ST be moved to be in holding state.So, control device CONT uses elevating mechanism 43 sequentially to be transported toward second layer part 2 by the substrate accommodation apparatus ST being moved to ground floor part 1.
Control device CONT, by second layer part 2 from elevating mechanism 43 toward the chassis 42 of rail 41 movement, be first configured in-X the side of first substrate processing unit PR1.Under this state, control device CONT makes the position of chassis 42 fix, and substrate accommodation apparatus ST is moved past+X side separately.By this action, namely protuberance 29 inserts Port 39, and substrate accommodation apparatus ST is connected to each substrate board treatment PR.
After substrate accommodation apparatus ST is connected to first substrate processing unit PR1, control device CONT, makes substrate S take out of mouthful EX from the substrate of substrate accommodation apparatus ST and discharges.In addition, control device CONT, moves into the inside of first substrate processing unit PR1 from the acquisition port 30X of first substrate processing unit PR1 by the substrate S of discharge.In the inside of first substrate processing unit PR1, above-mentioned spaced walls formation processing is carried out respectively to substrate S.
After first substrate processing unit PR1 has carried out process to all substrate S and substrate S has been contained in the reception room RM of substrate accommodation apparatus ST, control device CONT has made the past-X side of substrate accommodation apparatus ST move.By this action, namely the connection of substrate accommodation apparatus ST and first substrate processing unit PR1 is removed.
Control device CONT, will relieve+X the side being configured at second substrate processing unit PR2 with the substrate accommodation apparatus ST of the connection of first substrate processing unit PR1, and make substrate accommodation apparatus ST be connected to second substrate processing unit PR2.Control device CONT, in second substrate processing unit PR2, to the substrate S process being housed in substrate accommodation apparatus ST.After process terminates, namely remove the connection with second substrate processing unit PR2.
Afterwards, substrate accommodation apparatus ST is made sequentially to be connected to the 3rd substrate board treatment PR3 and tetrabasal processing unit PR4, to substrate S process.In second substrate processing unit PR2, the 3rd substrate board treatment PR3 and tetrabasal processing unit PR4, carry out the process as processing procedure after the spaced walls formation processing of carrying out at first substrate processing unit PR1.This kind of process, such as, have electrode formation processing and luminescent layer formation processing etc.
This kind in the action of second layer part 2, such as, finishes after the process of first substrate processing unit PR1 for a substrate accommodation apparatus ST, and when being connected to the situation of second substrate processing unit PR2, namely first substrate processing unit PR1 becomes empty state.Therefore, control device CONT makes a time substrate accommodation apparatus ST be connected to the first substrate processing unit PR1 of this dummy status.So, by sequentially making a time substrate accommodation apparatus ST be connected to empty substrate board treatment PR to process, the process can carrying out substrate S with high efficiency.
After the process (in this example, being the process at tetrabasal processing unit PR4) of each substrate board treatment PR terminates, control device CONT makes chassis 42 move toward+Y side to be loaded on elevating mechanism 44.Be loaded into after on elevating mechanism 44 by chassis 42, control device CONT makes the past-Z side of elevating mechanism 44 move, and chassis 42 and the substrate accommodation apparatus ST that is loaded in this chassis 42 is transported toward ground floor part 1.After elevating mechanism 44 arrives ground floor part 1, control device CONT makes the past-Y side of chassis 42 move, and is configured on the rail 41 of ground floor part 1.Again, after making chassis 42 move, control device CONT makes the past+Z side of elevating mechanism 44 move, and makes next process by standby for the substrate accommodation apparatus ST terminated.
Control device CONT, makes to configure to the chassis 42 rail 41 in ground floor part 1 from elevating mechanism 44, and the front taking out of mouth 11 toward accommodation apparatus is moved.Under this state, the substrate accommodation apparatus ST on chassis 42 is taken out of mouth 11 from accommodation apparatus and takes out of by control device CONT.After taking out of substrate accommodation apparatus ST, the front making chassis 42 move into mouth 10 toward accommodation apparatus is moved.Under this state, control device CONT, makes next by standby for the substrate accommodation apparatus ST moving into the sky that mouth 10 is moved into from accommodation apparatus.As previously discussed, chassis 42 moves in the mode of circulation between ground floor part 1 and second layer part 2.Take out of mouth 11 from accommodation apparatus and take out of substrate accommodation apparatus ST to outside, be transported to another room (building) or factory, via the number of assembling steps of display element, become empty state and get back to accommodation apparatus and move into mouth 10.
So, according to this example, owing to possessing: multiple substrate accommodation apparatus ST, there is the reception room RM of collecting substrate S; Multiple substrate board treatment PR, has the Port 39 that is connected to each substrate accommodation apparatus ST and to substrate S process under the state being connected to Port 39 at substrate accommodation apparatus ST; Guiding device GD, guides each substrate accommodation apparatus ST to be connected with each substrate board treatment PR; And control device CONT, control guiding device GD and each substrate accommodation apparatus ST is linked in sequence with set to each substrate board treatment PR, therefore can the efficient substrate S process to being housed in substrate accommodation apparatus ST.Accordingly, a kind of base plate processing system SYS that can obtain high-throughput can be provided.
Again, batch management of every certain length of the substrate S being accommodated in substrate accommodation apparatus ST can be carried out, therefore can promote production management, reduce downtime (downtime).
In addition, also the visual size of such as display element and the quantity of display element predetermine the length of substrate S, and the substrate S of this size is contained in substrate accommodation apparatus ST.
When this situation, be contained in the length of the substrate S of substrate accommodation apparatus ST, the size of visual display element and the quantity of display element and different in each substrate accommodation apparatus ST.
Again, control device CONT can consider the length of the substrate S that substrate accommodation apparatus ST accommodates, and manages the processing time etc. of multiple substrate board treatment PR.
Technical scope of the present invention is not limited to above-mentioned example, can have suitable change not departing within the scope of interesting purport of the present invention.
In above-mentioned example, though lifting the formation that multiple substrate board treatment PR is located at it+X side of vehicle frame 40 is that example is described, be not limited thereto.Such as shown in Fig. 8, it can also be the formation that a part of substrate board treatment PR is located at vehicle frame 40-X side.
In forming shown in Fig. 8, the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5 is arranged in X-direction across vehicle frame 40.5th substrate board treatment PR5 and the 3rd substrate board treatment PR3 carries out the device of same treatment.5th substrate board treatment PR5 is configured to Port 39 towards+X side.
Again, the same treatment that 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5 carries out, refer to such as drop coating process, vapor deposition treatment, exposure-processed, film forming process, etch processes, surfaction process, clean process etc., as long as the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5 possesses this kind of processing capacity, device manufactory and processing mechanism can be different.
Again, the 3rd substrate board treatment PR3 relative frame 40 is arranged at intervals in+X side.By the position that the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5 clips in vehicle frame 40, be provided with removable in the moving part 45 of X-direction.Moving part 45 is located in a movable manner and extends on the rail 45a of X-direction.When moving part 45 during past+X Slideslip, is configured in the position between being connected with substrate board treatment PR3 by substrate accommodation apparatus ST under the state being loaded with substrate accommodation apparatus ST.
Rotating disk 46 is provided with between the 5th substrate board treatment PR5 and vehicle frame 40.Rotating disk 46 is arranged to rotate centered by Z axis by the second microscope carrier drive division (not shown).The rail 46a that can be connected to rail 45a is formed in the face of+Z side of rotating disk 46.Under the state that the connecting portion 46b being connected to rail 45a in-orbit in 46a is configured in+X side, moving part 45 can be moved on rotating disk 46.
When the state lower rotary table 46 that moving part 45 is configured on rotating disk 46 rotates 180 °, mouthful EN moved into by the substrate being loaded into the substrate accommodation apparatus ST of moving part 45 and substrate takes out of mouthful EX namely towards-X side.Therefore, substrate accommodation apparatus ST can be connected to the 5th substrate board treatment PR5.Form by this, in the situation etc. that the beat (takt) of such as the 3rd substrate board treatment PR3 is lower, the substrate board treatment PR of this low beat processing procedure multiple that can be arranged in parallel.
Again, in Fig. 8, between the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5, two moving parts 45 of same configuration are in X-direction spread configuration.And wherein the moving part 45 of a side moves toward X-direction for substrate accommodation apparatus ST being connected to the 3rd substrate board treatment PR3, the moving part 45 of the opposing party moves toward X-direction for substrate accommodation apparatus ST being connected to the 5th substrate board treatment PR5.
So, by arranging two moving parts 45, the both sides of the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5 can be used simultaneously.
For fully applying flexibly this advantage, though be provided with rotating disk 46 in Fig. 8, but also replaceability, omit the setting of rotating disk 46, and have and the moving part 45 substrate accommodation apparatus ST being connected to the 5th substrate board treatment PR5 side can be made to be displaced into X-direction move, and rotate the mechanism of 180 ° centered by Z axis.When this situation, namely rotatable moving part 45 undertakes the role of moving part and rotating disk, forms second microscope carrier that can move by the second microscope carrier drive division (not shown) and rotate.
Such as, when the substrate accommodation apparatus ST that the process for second substrate processing unit PR terminates carries out a secondary process, when leading substrate accommodation apparatus ST is connected to the situation of the 3rd substrate board treatment PR3, this substrate accommodation apparatus ST is made to be connected to the 5th substrate board treatment PR5.Accordingly, the processing latency of substrate accommodation apparatus ST can be reduced.So, according to the length in the processing time at substrate board treatment PR, the guiding target of each substrate accommodation apparatus ST can be set, suppress the beat (takt) of base plate processing system SYS entirety to reduce according to this.
Again, can also be shown in such as Fig. 9 A and Fig. 9 B, the formation that the 5th substrate board treatment PR5 configures at+Z offset the layer of the 3rd substrate board treatment PR3.In forming shown in Fig. 9 A, be provided with the lowering or hoisting gear (the second microscope carrier) 90 transporting substrate accommodation apparatus ST between the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5.Lowering or hoisting gear (the second microscope carrier) 90 is arranged to be elevated along Z axis by the second microscope carrier drive division (not shown).
Lowering or hoisting gear 90 has lift 91 and column sections 92.Lift 91 has loading part 91a and 91b of mounting substrate accommodation apparatus ST.Loading part 91a and loading part 91b is set to two-layer in Z-direction.The interval of this loading part 91a and loading part 91b is equal with the interval of the 3rd substrate board treatment PR3 and the 5th substrate board treatment PR5.
Therefore, loading part 91a and loading part 91b is loaded into respectively by by substrate accommodation apparatus ST, namely as shown in Figure 9 B, become the substrate accommodation apparatus ST being loaded into loading part 91a and be connected to substrate board treatment PR with the substrate accommodation apparatus ST being loaded into loading part 91b simultaneously.
In Fig. 9 B, the protuberance 29 being loaded into the substrate accommodation apparatus ST of loading part 91a is connected to the Port 39 of the 3rd substrate board treatment PR3, and the protuberance 29 being loaded into the substrate accommodation apparatus ST of loading part 91b is connected to the Port 39 of the 5th substrate board treatment PR5.So, by multiple substrate board treatment PR in the stacked formation of gravity direction, same with the formation shown in Fig. 8, when the situation etc. that the 3rd substrate board treatment PR3 beat is lower, can be arranged in parallel the substrate board treatment PR of this low beat processing procedure multiple, and the beat of base plate processing system SYS entirety can be suppressed to reduce.
Again, in above-mentioned example, though the formation that act substrate board treatment PR is configured to linearity or stratum's shape is that example is described, be not limited thereto.Such as, can also be the formation along the circumferential direction configured by multiple substrate board treatment PR.In formation shown in Figure 10,6 substrate board treatment PRA ~ PRF are configured round being formed as circular ring-type rotating disk (the second microscope carrier) TTR.Ring-type rotating disk (the second microscope carrier) TTR arranges and can rotate centered by Z axis by the second microscope carrier drive division (not shown).
As shown in Figure 10, substrate board treatment PRA ~ PRF configures along the circumferential direction of ring-type rotating disk TTR respectively.Each substrate board treatment PRA ~ PRF is configured in the circumferential direction of ring-type rotating disk TTR the position of 45 ° of staggering respectively.Substrate board treatment PRA ~ PRF is configured to the outer circumferential side of each Port 39 towards ring-type rotating disk TTR.
Rail portion 221 ~ 228 is formed on ring-type rotating disk TTR.Rail portion 221 ~ 228 has a tracking of configured in parallel respectively.Rail portion 221 ~ 228 extends the direction towards ring-type rotating disk TTR center.Rail portion 221 ~ 228 is configured in the circumferential direction of ring-type rotating disk TTR the position of 45 ° of staggering respectively.
In rail portion 221 ~ 228, be provided with 8 loading parts 211 ~ 218 of mounting substrate accommodation apparatus ST.State shown in Figure 10, loading part 211 ~ 216 is configured in the position with substrate board treatment PRA ~ PRF subtend respectively.Loading part 217 is configured in the position taking out of substrate accommodation apparatus ST from ring-type rotating disk TTR.Loading part 218 is configured in position substrate accommodation apparatus ST being moved into ring-type rotating disk TTR.
Loading part 211 ~ 218 is arranged to move along the bearing of trend in rail portion 221 ~ 228.Be configured in by making the outer circumferential side moving to ring-type rotating disk TTR with the loading part 211 ~ 216 of substrate board treatment PRA ~ PRF subtend position under the state being equipped with substrate accommodation apparatus ST, and make the substrate accommodation apparatus ST on each loading part 211 ~ 216 be connected to substrate board treatment PRA ~ PRF.Again, loading part 211 ~ 216 from then on state moves to the inner circumferential side of ring-type rotating disk TTR, removes the connection of each substrate accommodation apparatus ST and substrate board treatment PRA ~ PRF according to this.
Made ring-type rotating disk TTR rotate 45 ° in the connection of each substrate accommodation apparatus ST and substrate board treatment PRA ~ PRF by under the state removed, namely each substrate accommodation apparatus ST is configured in the position of the substrate board treatment PRA ~ PRF subtend adjacent with the substrate board treatment PRA ~ PRF be connected before.In this way, after each process to substrate accommodation apparatus ST terminates, make ring-type rotating disk TTR such as rotate 45 °, sequentially carry out the process of substrate board treatment PRA ~ PRF, can efficiently process.
Again, the central portion in ring-type rotating disk TTR is provided with discoideus central rotating disk TTC.Central authorities rotating disk TTC is arranged to rotate in circumferencial direction.Rail portion 201 is formed in central rotating disk TTC.Rail portion 201 has configured in parallel in a tracking in a direction.
The interval of one tracking in rail portion 201, identical with the interval of the tracking forming the rail portion 221 ~ 228 being located at ring-type rotating disk TTR respectively.Therefore, depending on the angle position of central rotating disk TTC, connecting rail portion 201 and rail portion 221 ~ 228.
Under the state that portion 201 to be connected in rail portion 221 ~ 228 any one in-orbit, the loading part 211 ~ 218 be configured in this rail portion 221 ~ 228 connected can move on central rotating disk TTC.Therefore, temporary transient the retreating on central rotating disk TTC of substrate accommodation apparatus ST can be made.Forming by this, such as, when making the situation etc. of the process brief interruption of any one in substrate board treatment PRA ~ PRF, the substrate accommodation apparatus ST of the substrate board treatment PR being connected to this interrupt processing can be made temporarily to retreat on central rotating disk TTC.
Again, form by this, the substrate accommodation apparatus ST terminated in the process of a substrate board treatment PR can be such as made temporarily to retreat on central rotating disk TTC, and the development situation of the process of other substrate board treatments of apparent PR, make substrate accommodation apparatus ST suitable move to other substrate board treatments PR from central rotating disk TTC.
Again, about the formation of substrate accommodation apparatus ST, except the formation in above-mentioned example, also can be made formation as shown in figure 11.In the formation of Figure 11, guide the cylinder 101 ~ 121 in multiple cylinders 101 ~ 123 of substrate S, the single state of turning back of the substrate S shown in previous Fig. 2 is made three times, and is configured in the position of being turned back by this substrate S.
Specifically, in cylinder 106, to turn back substrate S in the first surface Sa mode respect to one another of substrate S.Herein, the part in so far cylinder 106 downstream of turning back in substrate S, via cylinder 106 is called Part I S1.Again, Part IV S4 is called by turning back to the rightabout part of Part I S1 in substrate S, via cylinder 106.
In cylinder 107, to turn back this Part I S1 in second of Part I S1 Sb mode respect to one another.Herein, Part II S2 is called in substrate S, via cylinder 107 by the part in so far cylinder 107 downstream of turning back.
In cylinder 108 and cylinder 109, this Part II S2 is converted to towards cylinder 106 by direction.Herein, will be Part III S3 by the portion markings that direction is changed in substrate S, via cylinder 108 and cylinder 109.
In cylinder 110, this Part III S3 is turned back into along Part IV S4.Meanwhile, such as, move into mouthful EN at substrate S from substrate and take out of the mobile status of mouthful EX toward substrate, this Part III S3 turns back into Part III S3 via cylinder 110 and Part IV S4 is displaced into rightabout.
In cylinder 106 to cylinder 110 way, substrate S is turned back in the above described manner, therefore hang in substrate S the part of cylinder 101 ~ 107, with substrate S in hang over the part of cylinder 109 ~ 115, namely become and configure at Z-direction and X-direction predetermined distance of being separated by.Same, also to turn back substrate S with roughly the same formation in cylinder 113 to cylinder 117 way, therefore hang in substrate S the part of cylinder 109 ~ 115, with substrate S in hang over the part of cylinder 116 ~ 121, become and configure at Z-direction and X-direction predetermined distance of being separated by.So, can with good efficiencies collecting substrate S in the limited space of reception room RM.
Again, for the formation of guiding device GD in above-mentioned example, as the guiding rail bar making chassis 42 circulate, though lifting the formation being configured in the rail 41 of vehicle frame 40 is that example is described, but being not limited thereto, can also be the formation such as using other guiding rail bars such as metal wire.
Again, the present invention is not limited to the formation of substrate accommodation apparatus ST illustrated by above-mentioned example and substrate board treatment PR (PR1 ~ PR5, PRA ~ PRF).Below, form for other of substrate accommodation apparatus (substrate storage device) and substrate board treatment (processing unit), be illustrated with reference to Figure 12 ~ Figure 20.
Figure 12 is the figure of the Inner Constitution of substrate storage device (substrate accommodation apparatus) STR.
As shown in figure 12, substrate storage device STR has: collecting be formed as band shape have flexual substrate S container C T, with hang up the substrate conveying unit CV of substrate S.Substrate storage device STR, such as, be contained in the container C T be loaded in through wheel 28 on not shown chassis 42, and taken care of with the state being put up in substrate conveying unit CV by substrate S.It is endless that substrate S is formed as long side direction.
Container C T-shaped becomes such as profile in roughly cuboid.Again, the wall portion CTa of-X side of container C T becomes+Z side end such as to favour the shape of+X side.In addition ,+X side end the CTb of the container C T shape that then becomes+Z side end such as outstanding to+X side.The wall portion (containing wall portion CTa and CTb) being formed with to form container C T in the inside of container C T around reception room RM.
Container C T has window portion W in wall portion CTa.The outside of window portion W connection container CT and reception room RM and the peristome that interpenetrating walls portions CTa is formed.Window portion W is configured in the Z-direction substantial middle of wall portion CTa.Connecting portion J is provided with in wall portion CTa.Connecting portion J is connected to the part of the device side connecting portion 590 and 591 being such as located at the external device (ED)s such as processing unit PA.
Again, be provided with door sheet element described later in window portion W, this sheet element is opened because of connection handling device PA, close because of the connection releasing of processing unit PA.That is in the state of non-connection handling device PA, this sheet element can prevent the foreign matter such as dust and chip from invading in container C T.
Processing unit PA can be connected with container C T with the mode that the skew of the relative position of container C T is suppressed by processing unit PA by connecting portion J.Device side connecting portion 590 and 591 is connected to the edge of window portion W in the wall portion CTa of container C T.When this situation, connecting portion J is located at the edge of window portion W in the mode of the link position of corresponding intrument side connecting portion 590 and 591.So, connecting portion J is located at the wall portion CTa identical with the wall portion CTa arranging window portion W, is configured in around window portion W.
In aforementioned processing device PA, except device side connecting portion 590 and 591, be also provided with gripper cylinder 592 and 593 and handling part 595 etc.Gripper cylinder 592 and 593 configuration is that Z-direction clips the position of handling part 595.+ X side the point of gripper cylinder 592 and the+X side point of gripper cylinder 593 are all contacted with the parallel plane plane with YZ.
Handling part 595 is formed as carrying out set process in Figure 12 with the treated side 595a shown in dotted line.Treated side 595a is set to and YZ plane parallel, is set in the plane of+X side point such as comprising gripper cylinder 592 and 593.Aforementioned set process, such as, have coating process, film formation processing, exposure-processed, development treatment, heat treated, cooling processing etc.Certainly, can also be the formation of carrying out other process.
Substrate conveying unit CV, has multiple cylinder R of the substrate S that turns back in reception room RM.Below, when distinguishing the situation of multiple cylinder R, cylinder 511 ~ cylinder 566 is labeled as.Each cylinder R, has the axle portion Ra parallel with Y-direction respectively.Each cylinder R, this axle portion Ra are rotatably supported on the wall portion of+Y side of such as container C T and-Y side.Around the axle portion Ra of each cylinder R, be provided with the cylindric peripheral part Rb hanging up accommodated substrate S.
Multiple cylinder R is sequentially configured in the transport path of the substrate S in reception room RM.Multiple cylinder R is relative to the upper and lower separate configuration of the central portion of reception room RM.In this example ,-Z side Part I the RM1 of the Z-direction central portion of multiple cylinder R separate configuration in relative reception room the RM ,+Z side Part II RM2 with the Z-direction central portion in relative reception room RM.
Part I RM1 in reception room RM, is provided with 3 in Z-direction and lists in the row that X-direction configures the cylinder R of the state of 8.The diameter forming the cylinder R of row is all identical.Again, the Z-direction central portion from past+Z side ,-Z side more close to reception room RM, the diameter of cylinder R are less.In addition, outside the row of above-mentioned cylinder R, cylinder 512 and the cylinder 513 in the direction of conversion baseplate S is also provided with.Below, when distinguishing the row of cylinder R of Part I RM1, arrange L3 by being sequentially labeled as first row L1 ~ three from the past+Z side ,-Z side of reception room RM.
In Part I RM, the cylinder 529,533,565 being configured in-X side in the cylinder R of first row L1, secondary series L2 and the 3rd row L3 is respectively fixed with idler component 567.Idler component 567 is arranged to be displaced into Z-direction along guide portion 568.Idler component 567 is connected to such as driving mechanism 569.This driving mechanism 569 can make idler component 567 slide on Z-direction.Controlled with such as control device CONT by the amount of movement of the idler component 567 of this driving mechanism 569 and mobile sequential.
Part II RM2 in reception room RM, is provided with 3 in Z-direction and lists in the row that X-direction configures the cylinder R of the state of 9.The diameter forming the cylinder R of row is all identical.Again, the Z-direction central portion from past-Z side ,+Z side more close to reception room RM, the diameter of cylinder R are less.In Part II RM2, except the row of above-mentioned cylinder R, be also provided with the cylinder 511 in the direction of conversion baseplate S, cylinder 531 and cylinder 549.
Again, be configured at the cylinder 511 of Part II RM2 and be configured at the cylinder 512 of Part I RM1, configuration is that Z-direction holds the position of window portion W under the arm.Below, when the situation of the row of the cylinder R of difference Part II RM2, sequentially will be labeled as the 4th row L4 ~ six from the past+Z side ,-Z side of reception room RM and arrange L6.
Substrate S is sequentially hung on cylinder 511 ~ cylinder 566, according to this transport path of directed reception room RM.In this example, because substrate S is formed as endless, the therefore transport path path of circulating in reception room RM.Below, for the transport path of substrate S, with cylinder 511 be starting point, with clockwise for clockwise direction is illustrated.
Be hung on the substrate S of cylinder 511, via be configured in this cylinder 511-Z side cylinder 512 and bend towards+X side.The downstream of the cylinder 512 in substrate S, is bent to+Z side by the cylinder 513 near the bight of-Z side and+X side that are configured in reception room RM.The downstream of the cylinder 513 in substrate S, is bent to-Z side via being configured in the cylinder 514 of+X side in the 4th row L4 of cylinder R.
The downstream of the cylinder 514 in substrate S, is bent to+Z side via the cylinder 515 being configured in+X side in the first row L1 of cylinder R.The downstream of the cylinder 515 in substrate S, is bent to-Z side in the cylinder 516 of the adjacent configuration in-X side with cylinder 514 via in the 4th row L4.The downstream of the cylinder 516 in substrate S, is bent to+Z side in the cylinder 517 of the adjacent configuration in-X side with cylinder 515 via in first row L1.
Afterwards, in-X-direction mutual via (being hung on) the 4th row cylinder R (cylinder 518,520,522,524,526,528 and 530) of L4 and the cylinder R (cylinder 519,521,523,525,527 and 529) of first row L1.Via in the 4th row L4 the downstream of the substrate S of the cylinder 530 of-X side be bent to-X side, and be hung on direction conversion cylinder 531.
The downstream of the cylinder 531 in substrate S, is bent to-Z side via the cylinder 532 of the adjacent configuration in+Z side of cylinder 530.Afterwards, substrate S arranges between the cylinder R (cylinder 534,536,538,540,542,544,546 and 548) of R5 in the cylinder R via secondary series L2 (cylinder 533,535,537,539,541,543,545 and 547) and the 5th that+X-direction is mutual.Via in the 5th row L5 the downstream of the substrate S of the cylinder 548 of+X side be bent to+X side, and be hung on the cylinder 549 of direction conversion.
The downstream of the cylinder 549 in substrate S, is bent to-Z side via the cylinder 550 of the adjacent configuration in+Z side of cylinder 548.Afterwards, substrate S arranges between the cylinder R (cylinder 552,554,556,558,560,562,564 and 566) of R5 in the cylinder R (cylinder 551,553,555,557,559,561,563 and 565) and the 5th via the 3rd row L3 that-X-direction is mutual.Via in the 6th row L6 the downstream of the substrate S of the cylinder 566 of-X side be bent to-Z side, and be hung on above-mentioned cylinder 511.
In above-mentioned formation, because cylinder 511 and cylinder 512 configuration are that Z-direction clips the position of window portion W, therefore hang over the part between cylinder 511 in the substrate S of cylinder 511 and cylinder 512 and cylinder 512, the face (second Sb of substrate S) being namely configured in-X side is exposed to the position of window portion W.
Again, substrate conveying unit CV has substrate supporting portion SP.Substrate supporting portion SP is located at the position clipping substrate S between the window portion W of container C T.Substrate supporting portion SP is configured between cylinder 511 and cylinder 512 in Z-direction.Substrate supporting portion SP, has the support plate 571 of the first surface Sa of supporting substrates S, a pair idler pulley 572 and 573 and supports the supporting member 574 of these support plates 571, idler pulley 572 and 573.
Support plate 571 has the bearing-surface 571a being formed in-X side.The formation that bearing-surface 571a is smooth.Support plate 571 is configured to bearing-surface 571a and YZ plane parallel.Under this state, the first surface Sa subtend of bearing-surface 571a and substrate S configures.
Idler pulley 572 and 573 is located at the position clipping support plate 571 in Z-direction.Idler pulley 572 and 573 is formed as cylindric or cylindric.Idler pulley 572 and 573 is configured to central shaft and is parallel to Y-direction.The Y-direction size of idler pulley 572 and 573 is greater than the Y-direction size of substrate S.Idler pulley 572 and 573 is supported as rotating in circumferential direction by supporting member 574.
Supporting member 574 be fixed to one to avoid support plate 571, idler pulley 572 and 573 is independently displaced into X-direction, Y-direction and Z-direction.Under the state supported by supporting member 574, each-X side end (point of supporting substrates S) and bearing-surface 571a of idler pulley 572 and 573 is configured at grade.Therefore, substrate S supported surface 571a and bearing-surface 571a is configured to same plane shape therewith two idler pulleies 572,573 supported.
Supporting member 574 is arranged to move in X-direction.Substrate conveying unit CV has the driving mechanism 575 that supporting member 574 can be made toward X-direction movement.Control device CONT is by this driving mechanism 575 of control, and adjustable supporting member 574 is toward the amount of movement of X-direction and mobile sequential etc.
Secondly, the action of the substrate storage device STR formed in the above described manner is described.Herein, to be illustrated by the situation of keeping in the substrate S process of substrate storage device STR.
Figure 13 is the figure of an action case of substrate storage device STR.
As shown in figure 13, to being taken care of when the situation of the substrate S process of substrate storage device STR, first, the device side connecting portion 590 and 591 of outside processing unit PA is made to be connected to the connecting portion J of substrate storage device STR.
After the connection of processing unit PA completes, control device CONT namely control driving mechanism 575 make supporting member 574 past-X-direction moves.By this action, idler pulley 572 and 573 is contacted with the first surface Sa of substrate S, and this first surface Sa is gone out by past-X layback.Control device CONT makes supporting member 574 move to the position of seizing substrate S between idler pulley 572,573 and gripper cylinder 592,593 on both sides by the arms.
Because of the movement of supporting member 574, part Sc between the part of being seized on both sides by the arms by idler pulley 572 and gripper cylinder 592 in substrate S and the part of being seized on both sides by the arms by idler pulley 573 and gripper cylinder 593 is pulled to the outside of reception room RM from window portion W, and the state of handling part 595 for exposing in relative processing unit PA.
This exposed portion Sc is supported by the bearing-surface 571a of support plate 571, is configured to and YZ plane parallel along this bearing-surface 571a.Again, exposed portion Sc configures along bearing-surface 571a, and becomes on the treated side 595a of the handling part 595 being configured in processing unit PA.
On the other hand, the carrying out of above action, the transport path of substrate S changes from the state of Figure 12.Specifically, along the transport path of-X sidewall portion CTa of substrate storage device STR, be namely elongatedly equivalent to exposed portion Sc is drawn out to substrate storage device STR outside amount from window portion W.In contrast, be formed as endless by keeping at the substrate S of substrate storage device STR, its length is certain.Therefore, the tension force of substrate S must be adjusted, to avoid applying excessive tension force to substrate S.
For this reason, control device CONT control driving mechanism 569 makes the past+Z side of idler component 567 move.By this action, cylinder 529,533,565 moves along the past+Z side of guide portion 568 together with idler component 567.Therefore, the transport path being hung on the part of this cylinder 529,533,565 in substrate S shortens.
When this situation, control device CONT adjusts at least one party in the amount of movement of supporting member 574 and the amount of movement of idler component 567, and the variable quantity of the transport path changed to make the variable quantity of the transport path of the substrate S changed because of the movement of supporting member 574 and the movement because of idler component 567 is equal.By this action, the path length of the transport path of substrate S is maintained at necessarily, therefore can not apply excessive tension force to substrate S.
As mentioned above, after on certain treated side 595a substrate S being configured in handling part 595 of the path length of the transport path maintaining substrate S, the process of second Sb to substrate S is carried out with handling part 595.After this has processed, control device CONT controls driving mechanism 569 and driving mechanism 575, the path length of the transport path of substrate S is kept certain, while make idler component 567 and supporting member 574 get back to origin-location.Afterwards, device side connecting portion 590 and 591 is departed from from connecting portion J, processing unit PA is exited from substrate storage device STR.In this way, the process to substrate S is carried out.
As previously discussed, according to this example, due to possessed have collecting tool pliability be formed as the reception room RM of the substrate S of endless container C T, be located at the window portion W of this container C T and transport the substrate conveying unit CV of substrate S with a part of Sc of the substrate S being housed in reception room RM and the mode of window portion W subtend, therefore substrate S can be made to expose to reception room RM outside and the remainder of substrate S can not be made to expose in window portion W.Accordingly, owing to suppressing, substrate S's expose scope, and the foreign matters such as dust therefore can be suppressed to be attached to substrate S.
Again, not to the surface of substrate S carry out processing process time, can door sheet element closing window portion W to maintain dust tightness.
Again, according to this example, under being made state that substrate S is housed in reception room RM, processing unit PA is connected to substrate storage device STR, to substrate S process, the environment that therefore can not easily be attached to substrate S at a foreign matter processes.Accordingly, foreign matter can be prevented to be attached to substrate S.
Figure 14 is the figure of the formation of substrate storage device STR2.Substrate storage device STR2, the formation of its container C T near window portion W is different from substrate storage device STR, is therefore described centered by this dissimilarity.
As shown in figure 14, substrate storage device STR2, has in order to substrate S is drawn out to outside pulling unit 670 and 671 from window portion W.This pulling unit 670 and 671 has the mechanical arm 674 and 675 being arranged on window portion W inner peripheral portion.Machinery arm 674 is arranged on the+Z side inner peripheral surface of window portion W.Machinery arm 675 is arranged on the face of-Z side of window portion W.
Machinery arm 674 and 675 is configured to rotate to θ Y-direction centered by installation site.Machinery arm 674 and 675 is connected to mechanical arm drive division 676 and 677.Mechanical arm drive division 676 and 677 has such as not shown motor mechanism etc.Control device CONT can control the drive volume of carrying out with mechanical arm drive division 676 and 677 and driver' s timing.
Fore-end in mechanical arm 674 and 675 is provided with guide roller 672 and 673.Guide roller 672 and 673 is formed as cylindric, is configured to central shaft parallel with Y-axis.Guide roller 672 and 673 is configured to rotate in circumferential direction (θ Y-direction).Again, become to have the loading protion 678 of installing outside processing unit PA in container C T-shaped.In addition, also can replace loading protion 678 and be formed in order to the peristome of the processing unit PA of configuring external.
When from then on substrate S being drawn out under state the situation of W outside, window portion, control device CONT controller mechanical arm drive division 676 and 677, makes the anticlockwise in figure of mechanical arm 674, mechanical arm 675 rotates respectively clockwise in figure.In rotary moving along with mechanical arm 674 and mechanical arm 675, namely the guide roller 672 and 673 being arranged on mechanical arm 674 and each leading section of mechanical arm 675 hauls substrate S, substrate S is drawn out to the outside of window portion W.
Figure 15 is the figure of the state with pulling unit 670 and 671, substrate S being drawn out to reception room RM outside from window portion W.
As shown in figure 15, under the state that substrate S is drawn out, be configured to the front end of mechanical arm 674 and 675 towards-X side.
Substrate S is exposed to the outside of window portion W under the state being hung on guide roller 672 and 673.Second Sb of the exposed portion Sc between the guide roller 672 and 673 in substrate S, the bearing-surface 679a of crimping supporting member for substrate 679.Bearing-surface 679a is formed as the flexure plane that such as past+X side is protruded.Because of crimping bearing-surface 679a, namely exposed portion Sc againsts bearing-surface 679a and becomes the state of past+X lateral bend configuration.Again, supporting member for substrate 679 such as rotating cylinder.
Again, because of the action of above-mentioned mechanical arm 674 and 675, along the path length of the transport path of the substrate S of the part of wall portion CTa by elongated.Therefore, control device CONT control driving mechanism 569 moves, to adjust the path length of the transport path of substrate S along the past+Z side of guide portion 568 to make idler component 567.Again, in substrate storage device STR2, compare with substrate storage device STR, can be made and idler component 567 can be moved in Z-direction in a big way.So, the adjustment amount of the path length of the transport path of substrate S is namely larger.
After substrate S is drawn out to reception room RM outside, processing unit PA is configured at the loading protion 678 of container C T.Under the state that processing unit PA is installed on loading protion 678, handling part 695 is towards-X the side of window portion W.Therefore, observe from X-direction the subtend position that exposed portion Sc is configured in handling part 695.Under this state, the first surface Sa process of handling part 695 couples of substrate S.
After processing with handling part 695, processing unit PA is taken off from loading protion 678.After taking off processing unit PA, mechanical arm 674 and 675 is accommodated the reception room RM to container C T by control device CONT, makes the past-Z side of idler component 567 move simultaneously.By this action, the path length of the transport path of substrate S is kept certain, while substrate S is contained in reception room RM together with mechanical arm 674 and 675.
As mentioned above, this example, owing to using mechanical arm 674 and 675 that substrate S is significantly pulled to outside from window portion W, and between the exposed portion Sc and container C T of substrate S the formation of the external device (ED) such as installation process device PA, therefore can to the first surface Sa process of substrate S.
Again, this example, owing to using the supporting member for substrate (such as, going barrel) 679 being formed with cylindrical bearing surface 679a to carry out supporting substrates S, therefore with the shape of corresponding bearing-surface 679a shape, substrate S can be configured in the subtend position of handling part 695.Such as, if bearing-surface 679a is tabular surface, namely substrate S is configured in the subtend position of handling part 695 with smooth state.
Technical scope of the present invention is not restricted to above-mentioned example, can be suitable in the scope not departing from the present invention's interest purport be changed.
Such as, in above-mentioned example, though be the formation that window portion W is configured in wall portion CTa, be not limited thereto, can also as shown in figure 16, window portion W is configured in the formation of wall portion CTb or other wall portion.
Again, in above-mentioned example, though be the formation that window portion W is located at a place of container C T, be not limited thereto, also as shown in figure 16, the formation of window portion W can be set in the many places of container C T.When this situation, can be the formation configuring multiple window portion W in a wall portion, can also be respectively arrange one or respectively arrange the formation of multiple window portion W in multiple wall portion.
Again, except the formation of above-mentioned example, also as shown in figure 17, a sheet element can be set in aforementioned window portion W.As this sheet element, Tu17Zhong can be the saddle SL of window portion W.Saddle SL is connected to slip drive division 700.Slip drive division 700 by the control of control device CONT, can control the sequential (opportunity) of drive volume and driving.
During this is formed, control device CONT is visual makes window portion W switch with the connection status of external process devices.When this situation, control device CONT, when reason device is connected to the situation of connecting portion J in the outside, making saddle SL move to-Z side becomes open mode to make window portion W.Again, control device CONT, the connection managing device and connecting portion J in the outside by remove situation time, then making saddle SL move to+Z side becomes closed condition to make window portion W.Accordingly, can prevent the foreign matters such as dust from invading reception room RM.
Again, above-mentioned example, though the formation being configured to contact with the both sides of first surface Sa and second Sb of substrate S for cylinder R is described, is not limited thereto.Such as, can also be configured to the first surface Sa of contact substrate S and the formation do not contacted with second Sb.
As this example, as shown in figure 18, use is such as had to be formed as the guiding elements 701 and 702 of right angle equilateral triangle shape to bend the formation etc. of substrate S.As shown in figure 18, substrate conveying unit CV has two conveying unit CV1 and CV2.The conveying unit CV1 of+X side in figure, substrate S are after swirling (in figure+X side) bends to the inside via multiple cylinder R only to contact the mode of first surface Sa, then bend to guiding elements 701 via cylinder R1.
In conveying unit CV1, the 701a bending of the directed component 701 in downstream of the cylinder R1 in substrate S.The hypotenuse 701b of the directed component 701 in downstream of one side 701a in this substrate S bends with 45° angle degree.Again, the downstream of this hypotenuse 701b in substrate S, after the another side 701c of directed component 701 bends, towards guiding elements 702.In this way, the first surface Sa of substrate S is around in guiding elements 701.
On the other hand, the part towards guiding elements 702 in substrate S, bends in the 702a of guiding elements 702, same with the situation of guiding elements 701, is sequentially bent along hypotenuse 702b and another side 702c.In substrate S in the downstream of another side 702c towards cylinder R2.In this way, the first surface Sa of substrate S is around in guiding elements 702.
The downstream of the cylinder R2 in substrate S is after swirling bends toward the outer side via multiple cylinder R, the conveying unit CV2 of-X side in figure.In conveying unit CV2, its formation is identical with above-mentioned conveying unit CV1.That is, only contact with the first surface Sa of substrate S and this substrate S is bent into circinate formation, be provided with cylinder R1, guiding elements 701,702 and cylinder R2 in central portion.
As shown in figure 18, substrate S is bent into first surface Sa and contacts with cylinder R, R1, R2 and guiding elements 701,702, and second Sb does not contact with these cylinders and guiding elements.In this kind is formed, because substrate conveying unit CV can transport substrate S under second Sb surface of not contact substrate S, therefore can protect the state of second Sb.
Again, about the formation of guiding elements 701 and 702, be not limited to the formation being formed as above-mentioned right angle equilateral triangle, such as, also the cylinder of cylindrical shape be configured in the formation on each limit of right angle equilateral triangle.
In addition, also such as shown in Figure 19, the formation shown in Figure 18 can be formed in the formation of Y-direction overlap.When this situation, conveying unit CV3 and CV4 is set in+Y the side of conveying unit CV1 and CV2.Conveying unit CV1 and conveying unit CV3 are identical formation, conveying unit CV2 and conveying unit CV4 is identical formation.Between conveying unit CV1 and CV2 and conveying unit CV3 and CV4, be configured with direction conversion cylinder 801 ~ 804.
Substrate S, after being wound in conveying unit CV1 and CV2, is changed by direction via direction conversion cylinder 801 and 802, and the conveying unit CV3 and CV4 that arrives.Again, this substrate S, after conveying unit CV3 and CV4, is changed by direction, once again around to conveying unit CV1 and conveying unit CV2 via direction conversion cylinder 803 and 804.In addition, be around in direction and change the first surface Sa that cylinder 801 ~ 804 perseverance is substrate S.In this way, substrate S circulates between conveying unit CV1 ~ conveying unit CV4.
In forming shown in Figure 19, substrate S is accommodated into two-layer in the Y direction.When this situation, it can also be the formation being arranged side by side window portion W1 and W2 in Y-direction.Owing to can process respectively each configuring two-layer substrate S in the Y direction, therefore treatment effeciency can be improved.
In addition, also can such as shown in Figure 20, X-direction will be formed in shown in Figure 18 and Z-direction configuration is multiple.When this situation, be provided with conveying unit CV3 and CV4 in the-Z side of conveying unit CV1 and CV2.Again, conveying unit CV1 and conveying unit CV3 are identical formation, and conveying unit CV2 and conveying unit CV4 are identical formation.In forming shown in Figure 20, such as, for each conveying unit CV1 ~ CV4, the formation of window portion W1 ~ W4 can be set respectively.So, owing to can process in many places, therefore treatment effeciency can be improved.
Again, except the formation of above-mentioned example, can also be made such as in the formation in the reception room RM set handling portion of substrate storage device STR.When this situation, such as configurable handling part substrate being carried out to the various process such as plating process, clean process, dry process, heat treatment.As shown in figure 18, when the situation of second Sb not formation of contact substrate conveying unit CV of substrate S, reception room RM can be located to the handling part PA2 of this second Sb process.
Again, in above-mentioned example, though be that the storage appts of the substrate of endless is described for keeping long side direction, be not limited to this and form.Such as, also can configure in container C T for application cylinder, recovery cylinder, in order to by roll up in supply roller substrate conveyance to above-mentioned window portion W1 multiple cylinder and the substrate through window portion W1 is reeled with recovery cylinder and substrate is delivered to reclaims multiple cylinders of cylinder, the substrate transported in volume to volume (rolltoroll) mode with keeping.
Again, above-mentioned example, though the formation being configured to central shaft parallel with Y-direction for cylinder R is described, is not limited thereto.Such as, cylinder R can also be configured to the central shaft formation parallel with X-direction or Z-direction, also applicable the present invention.
In addition, such as, in example shown in Figure 18, Figure 19 and Figure 20, what also can be used in that substrate storage device STR and substrate storage device STR2 adopts adjusts short mechanism by transport path.That is, when the situation making it expose substrate pull-out to use processing unit to impose process to substrate, adopt traveling roller that transport path is shortened with the adjusting mechanism making the path length of substrate transport path remain certain.

Claims (13)

1. a base plate processing system, for forming electronic component at rectangular pliability plate shape substrates, is characterized in that possessing:
Multiple substrate accommodation apparatus, there is reception room, and peristome or window portion, aforementioned reception room is surrounded by wall portion to accommodate aforementioned plate shape substrates with certain length, aforementioned peristome is formed in a part for aforesaid wall to be taken out outside aforementioned reception room at long side direction by aforementioned plate shape substrates and to make aforementioned plate shape substrates return aforementioned reception room at long side direction, and the part that aforementioned window portion is formed in aforesaid wall is exposed in the outside of aforementioned reception room to make a part for aforementioned plate shape substrates;
Multiple substrate board treatment, have and can be connected to the aforementioned peristome of aforesaid base plate accommodation apparatus or the connecting portion in window portion, under a state being connected to aforementioned connecting portion of aforesaid base plate accommodation apparatus, take out aforementioned plate shape substrates from aforementioned peristome and make it return aforementioned reception room through aforementioned peristome after carrying out set process, or set process is carried out to a part for the aforementioned plate shape substrates exposing aforementioned window portion;
Guiding device, guides aforementioned multiple substrate accommodation apparatus to be connected with aforementioned multiple substrate board treatment respectively; And
Control device, controls aforementioned guiding device and is linked in sequence with set with aforementioned multiple substrate board treatment respectively to make aforementioned multiple substrate accommodation apparatus.
2. base plate processing system according to claim 1, is characterized in that, aforementioned multiple substrate board treatment, comprises:
First substrate processing unit, carries out the first process to aforementioned plate shape substrates; And
Second substrate processing unit, the second process of processing procedure after aforementioned first process is carried out to aforementioned plate shape substrates;
Foregoing control device controls aforementioned guiding device, be connected to aforementioned first substrate processing unit with aforesaid base plate accommodation apparatus collecting in multiple aforesaid base plate accommodation apparatus being carried out aforementioned first aforementioned plate shape substrates before treatment, and aforesaid base plate accommodation apparatus collecting in multiple aforesaid base plate accommodation apparatus having been carried out the aforementioned plate shape substrates after aforementioned first process is connected to aforementioned second substrate processing unit.
3. base plate processing system according to claim 1 and 2, is characterized in that, aforementioned peristome, has the substrate aforementioned plate shape substrates being moved into aforementioned reception room and moves into mouth and take out of mouth with the substrate taking out of aforementioned plate shape substrates from aforementioned reception room;
Aforementioned multiple substrate board treatment, has:
Substrate pulling unit, takes out of mouth by the aforementioned plate shape substrates being housed in aforementioned reception room from aforesaid base plate and is drawn out to outside;
Handling part, processes the aforementioned plate shape substrates pulled out with aforesaid base plate pulling unit; And
Substrate insertion section, moves into mouth by the aforementioned plate shape substrates processed through aforementioned handling part from aforesaid base plate and inserts aforementioned reception room.
4. base plate processing system according to claim 3, is characterized in that, aforementioned multiple substrate board treatment has framework respectively, and aforementioned framework has multiple wall;
Aforementioned connecting portion is located at the wall in aforementioned framework;
At least one party in aforesaid base plate pulling unit and aforesaid base plate insertion section is located at an aforementioned wall.
5. base plate processing system according to claim 2, is characterized in that, aforementioned guiding device, has:
Microscope carrier, supports each of aforementioned multiple substrate accommodation apparatus; And
Microscope carrier drive division, drives aforementioned microscope carrier.
6. base plate processing system according to claim 5, is characterized in that, aforementioned guiding device has the guiding rail bar guiding aforementioned microscope carrier;
Aforementioned guiding rail bar is arranged to aforementioned microscope carrier and can be circulated between aforementioned multiple substrate board treatment.
7. base plate processing system according to claim 1, is characterized in that, aforementioned guiding device, has:
Second microscope carrier, supports aforementioned multiple substrate accommodation apparatus; And
Second microscope carrier drive division, drives aforementioned second microscope carrier.
8. base plate processing system according to claim 7, is characterized in that, aforementioned second microscope carrier is rotatably arranged along the orientation of aforementioned multiple substrate board treatment;
Aforementioned multiple substrate accommodation apparatus, to be arranged in the mode of the direction of rotation of aforementioned second microscope carrier, is configured on aforementioned second microscope carrier.
9. base plate processing system according to claim 1, is characterized in that, aforementioned multiple substrate board treatment is multiple in gravity direction overlay configuration.
10. base plate processing system according to claim 1, is characterized in that, foregoing control device, according to the length in each processing time of aforementioned multiple substrate board treatment, sets the guiding target of aforesaid base plate accommodation apparatus.
11. base plate processing systems according to claim 1, is characterized in that, the plate shape substrates that aforementioned multiple substrate accommodation apparatus collecting length is different from each other.
12. base plate processing systems according to claim 1, is characterized in that, aforementioned multiple substrate board treatment comprises the multiple substrate board treatments carrying out same treatment;
Aforementioned guiding device, by the conveyance of aforesaid base plate accommodation apparatus to any one of carrying out in multiple substrate board treatments of same treatment aforementioned.
The manufacture method of 13. 1 kinds of electronic components, uses the base plate processing system according to any one of claim 1 to 12 to form electronic component on aforementioned plate shape substrates.
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KR101890099B1 (en) * 2012-09-14 2018-08-20 가부시키가이샤 니콘 Substrate processing device and device manufacturing method
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JP6744720B2 (en) 2016-01-05 2020-08-19 住友化学株式会社 Organic device manufacturing method and roll

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574237A (en) * 2003-05-30 2005-02-02 精工爱普生株式会社 Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate
CN1855414A (en) * 2005-04-27 2006-11-01 东京毅力科创株式会社 Processing device system
CN101143644A (en) * 2006-09-13 2008-03-19 株式会社大福 Substrate storage facility and substrate processing facility, and method for operating substrate storage

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06206149A (en) * 1992-12-02 1994-07-26 Hitachi Ltd Production line
US5948166A (en) * 1996-11-05 1999-09-07 3M Innovative Properties Company Process and apparatus for depositing a carbon-rich coating on a moving substrate
JP3560109B2 (en) * 1996-11-18 2004-09-02 富士電機ホールディングス株式会社 Method and apparatus for manufacturing thin film photoelectric conversion element
JP2000303178A (en) * 1999-04-16 2000-10-31 Sanyo Electric Co Ltd Thin film forming device
KR100551806B1 (en) * 1999-09-06 2006-02-13 동경 엘렉트론 주식회사 Transfer apparatus and accommodating apparatus for semiconductor process, and semiconductor processing system
JP2002035982A (en) * 2000-07-27 2002-02-05 Uht Corp Laser processing machine
JP2006100868A (en) 2004-09-28 2006-04-13 Hitachi Kokusai Electric Inc Radio communication system
US8080277B2 (en) * 2005-03-18 2011-12-20 Konica Minolta Holdings, Inc. Method of forming organic compound layer, method of manufacturing organic EL element and organic EL element
TWI408770B (en) * 2005-07-15 2013-09-11 Nidec Sankyo Corp The substrate moving out of the moving method and the substrate moving out of the system
JP4850811B2 (en) * 2007-11-06 2012-01-11 東京エレクトロン株式会社 Mounting table, processing apparatus and processing system
JP4486692B2 (en) * 2008-03-14 2010-06-23 株式会社日立国際電気 Substrate processing equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574237A (en) * 2003-05-30 2005-02-02 精工爱普生株式会社 Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate
CN1855414A (en) * 2005-04-27 2006-11-01 东京毅力科创株式会社 Processing device system
CN101143644A (en) * 2006-09-13 2008-03-19 株式会社大福 Substrate storage facility and substrate processing facility, and method for operating substrate storage

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