CN1855414A - Processing device system - Google Patents
Processing device system Download PDFInfo
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- CN1855414A CN1855414A CNA2006100769141A CN200610076914A CN1855414A CN 1855414 A CN1855414 A CN 1855414A CN A2006100769141 A CNA2006100769141 A CN A2006100769141A CN 200610076914 A CN200610076914 A CN 200610076914A CN 1855414 A CN1855414 A CN 1855414A
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- carrying line
- transmission mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a disposing device system (10), which comprises the following parts: conveying line (11) of glass base (S, S') before and after conveying disposal, multiple disposing devices (12) along conveying line (11) and disposing glass base (S), first transmitting mechanism (12) among multiple disposing devices (12) and conveying line (11), wherein the first transmitting mechanism (13) transmits multiple glass base (S, S') among multiple disposing devices (12) and conveying line (11).
Description
Technical field
The present invention relates to processing device system, in more detail, relate to and a kind ofly can improve the treatment effeciency of handled object, further save the processing device system in space.
Background technology
Shown in Figure 17 (a), the processing device system of prior art comprises: along a plurality of processing unit 2 of carrying channel 1 arrangement; A plurality of box bodys 3 of arranging according to the mode of clamping carrying channel 1 with a plurality of processing unit 2; And between processing unit 2 and box body 3 first transmission mechanism 4 of transferring substrates.Processing unit 2 comprises: the process chamber 2A of treatment substrate and the carrying room 2D that is provided with the second transmission mechanism 2C of transferring substrates between process chamber 2A and loadlock may (load locking room) 2B.When transferring substrates between box body 3 and process chamber 2A, under atmospheric pressure, drive first transmission mechanism 4 substrate is taken out from box body 3, conveyance is to load locking room 2B.Then, with be adjusted in the load locking room 2B with the approaching vacuum atmosphere of carrying room 2D after, open gate valve between the two, under vacuum, drive the second transmission mechanism 2C, substrate in the load locking room 2B is temporarily moved in the carrying room 2D, then, closing gate valve is moved into the substrate in the carrying room 2D in the process chamber 2A, close the gate valve of process chamber 2A, substrate is implemented predetermined process.After the processing of substrate,, substrate is back in the box body 3 along opposite path by first, second transmission mechanism 4,2C.Wherein, in this figure, expression is the second transmission mechanism 2C of a processing unit 2 only, and still, another processing unit 2 also can have same transmission mechanism.
In addition, Figure 17 (b) expression is the processing unit that processing unit 2 is set to many chamber profile.And a plurality of process chamber 2A are connected on three sides of carrying room 2D, are connected with load locking room 2B on a remaining side.Under the situation of the processing unit of these many chamber profile, identical with the processing unit 2 shown in this figure (a), comprise first transmission mechanism 4 that under atmospheric pressure drives and the second transmission mechanism 2C that under vacuum, drives, by first, second transmission mechanism 4,2C, between box body 3 and process chamber 2A, carry out the transmission of substrate.Under the situation of the technology of patent documentation 1, different with the processing device system of Figure 17 (b), first, second transmission mechanism has the carrying arm of two sections, under atmospheric pressure by first transmission mechanism with the conveyances simultaneously of two pieces of substrates to load locking room, under vacuum, pass through second transfer device with untreated substrate and the substrate of handling, between load locking room and process chamber, transmit, realize improving treatment effeciency.
In patent documentation 2, proposed to have the scheme of semiconductor-fabricating device of the load locking room of double as carrying room.The side direction of this load locking room and vacuum processing chamber is adjacent, has the carrying arm that is used for conveyance substrate (wafer) and the frame shape wafer support structure of two sections.In the case, because load locking room double as carrying room, so can reduce the space that is provided with of semiconductor-fabricating device, thus equipment cost reduced.
In patent documentation 3, the processing method of workpiece (work) and the scheme of processing unit thereof have been proposed.In the method, outside the conveyance path of carrying device, be provided with a plurality of apparatus for work of handling, successively a plurality of workpiece are taken out from carrying device, be passed in the apparatus for work that is in the operation wait state, and workpiece is back to carrying device from the apparatus for work that fulfils assignment.As mentioned above, owing to take out the processing that workpiece utilizes apparatus for work from the conveyance path, therefore, relevant with the support of workpiece in handling, and can not be subjected to the restriction of carrying device, can be respectively under suitable condition, support the workpiece of various sizes, and handle.
In patent documentation 4, the scheme of the production system of semiconductor device has been proposed.Under the situation of this system, for the processing unit of an operation, be provided with the treated device of unloading from the operation of front connect below the annular carrier carrying line of loading of operation.In the carrier carrying line, be provided with being equipped with the carrier of the semiconductor wafer that need utilize the processing unit processing, from the carrier carrying line of last operation conveyance; With the carrier that will be equipped with the semiconductor wafer after in processing unit, handling, to the carrier carrying line of subsequent processing conveyance.This carrier carrying line is general for a plurality of processing unit, roughly is set up in parallel.Utilize this structure, can realize not making carrier to be detained, reduce the area occupied of carrier carrying line.
Patent documentation 1: TOHKEMY 2001-160584 communique
Patent documentation 2: Japanese kokai publication hei 05-198660 communique
Patent documentation 3: Japanese kokai publication hei 2004-079614 communique
Patent documentation 4: Japanese kokai publication hei 2003-152047 communique
But, (a) for Figure 17, (b) and the processing unit of patent documentation 1, for between box body and vacuum processing chamber, by the load locking room transferring substrates, first transmission mechanism of transferring substrates all must be set between box body and load locking room, and second transmission mechanism of transferring substrates is set between load locking room and process chamber, and, owing to second transmission mechanism will be adjusted to the vacuum degree approaching with process chamber, therefore, moving into when taking out of substrate, must make load locking room and the vacuum degree of carrying room same degree and atmospheric pressure between adjust repeatedly, in the substrate transmission, need a lot of times, can not improve treatment effeciency, in addition, outside carrying room, load locking room must be set, therefore have the problem on the space.
In addition, semiconductor-fabricating device for patent documentation 2, owing to use the transmission mechanism transferring substrates between box body and process chamber in the carrying room, therefore, compare with the situation of patent documentation 1, the transmission mechanism that has omitted load locking room and under atmospheric pressure used, improve the treatment effeciency of substrate and realize saving the space, still, because corresponding one by one between semiconductor-fabricating device and the box body, therefore, in order further to improve the treatment effeciency of substrate, with a plurality of arrangement of semiconductor-fabricating device the time, each device all needs box and lowering or hoisting gear (protractor: indexer), thereby, equipment complexity and cost are higher, and, when carrying out processing substrate with other procedure connections, substrate before and after handling temporarily must be accommodated in the box, the restriction treatment effeciency improves.Make processing unit corresponding one to one with box, and substrate is handled on this point, the technology of record is also identical therewith in patent documentation 4.
And, under the situation of the processing method of patent documentation 3 and processing unit, because for a transfer device (being equivalent to transmission mechanism), to a plurality of operating means (being equivalent to processing unit) should be arranged, utilize transfer device that substrate is displaced in any one idle apparatus for work, therefore, when being displaced to substrate in the apparatus for work, must survey idle apparatus for work, only make operating efficiency low in this respect.
Summary of the invention
The present invention proposes in order to address the above problem, its purpose is to provide a kind of transmission of shortening the handled object between carrying line and a plurality of processing unit, can shorten every needed processing time of handled object, and the treatment effeciency of raising handled object, can improve the treatment effeciency with the handled object of other procedure connections in a plurality of operations in addition, also can realize saving the processing device system in space.
The described processing device system of a first aspect of the present invention, it is characterized in that, comprise: the carrying line of conveyance handled object, along this carrying line setting and handle a plurality of processing unit of above-mentioned handled object, and between these processing unit and above-mentioned carrying line, transmit the transmission mechanism of handled object, wherein, above-mentioned transmission mechanism transmits a plurality of handled objects simultaneously between above-mentioned carrying line and above-mentioned a plurality of processing unit.
In addition, the described processing device system of a second aspect of the present invention, it is characterized in that, comprise: the carrying line of conveyance handled object, along a plurality of processing unit that are provided with and handle above-mentioned handled object from the upstream side of this carrying line to the downstream, and between these processing unit and above-mentioned carrying line, transmit the transmission mechanism of handled object, wherein, above-mentioned transmission mechanism is between above-mentioned carrying line and above-mentioned each processing unit, according to the above-mentioned handled object of the sequence delivery from the upstream side to the downstream.
In addition, the described processing device system of a third aspect of the present invention, it is characterized in that, comprise: the carrying line of conveyance handled object, along a plurality of processing unit that are provided with and handle above-mentioned handled object from the upstream side of this carrying line to the downstream, and between above-mentioned processing unit and above-mentioned carrying line, transmit the transmission mechanism of handled object, wherein, above-mentioned transmission mechanism transmits above-mentioned handled object in any order between above-mentioned carrying line and above-mentioned each processing unit.
In addition, the described processing device system of a fourth aspect of the present invention, it is characterized in that, be included in the carrying line of conveyance handled object in the atmosphere, implement vacuum treated a plurality of processing unit along this carrying line setting and to above-mentioned handled object, and between these processing unit and above-mentioned carrying line, transmit the transmission mechanism of above-mentioned handled object, and wherein, the above-mentioned handled object of transmission between the above-mentioned carrying line of above-mentioned transmission mechanism in atmosphere and above-mentioned each processing unit.
In addition, the described processing device system of a fifth aspect of the present invention, be according to what described processing device system on the one hand in first aspect～fourth aspect, it is characterized in that: will be arranged in the loadlock may as first transmission mechanism of the inscape of above-mentioned transmission mechanism.
In addition, the described processing device system of a sixth aspect of the present invention is according to the described processing device system in the 5th aspect, it is characterized in that: above-mentioned loadlock may has at least one supporting mechanism that supports handled object when transmitting above-mentioned handled object; The volume of above-mentioned loadlock may is less than for making the necessary volume of above-mentioned handled object rotation.
In addition, the described processing device system of a seventh aspect of the present invention is according to the described processing device system of either side in first aspect～the 6th aspect, and it is characterized in that: above-mentioned carrying line has the conveyance district that can control conveyance separately, stop.
In addition, the described processing device system of a eighth aspect of the present invention is according to the described processing device system in the 7th aspect, it is characterized in that: above-mentioned conveyance district has the rotation roller of a plurality of may command rotations.
In addition, the described processing device system of a ninth aspect of the present invention is according to processing device system described in the 7th aspect or the eight aspect, it is characterized in that: the part in above-mentioned a plurality of conveyances district has the pooling feature that above-mentioned handled object is waited for.
In addition, the described processing device system of a tenth aspect of the present invention, be according to the described processing device system of either side in the 7th aspect～the 9th aspect, it is characterized in that: the part in the above-mentioned conveyance district has second transmission mechanism that is used to transmit above-mentioned handled object.
In addition, the described processing device system of a eleventh aspect of the present invention is that it is characterized in that: above-mentioned carrying line has auto-conveying apparatus according to the described processing device system of either side in claim second aspect～fourth aspect.
In addition, the described processing device system of a twelveth aspect of the present invention is that it is characterized in that: above-mentioned auto-conveying apparatus matches with the passing time of above-mentioned transmission mechanism and moves according to the described processing device system of the tenth one side.
In addition, the described processing device system of a thirteenth aspect of the present invention is according to the described processing device system in the 12 aspect, it is characterized in that: above-mentioned auto-conveying apparatus has a plurality of rollers of may command rotation.
In addition, the described processing device system of a fourteenth aspect of the present invention is that it is characterized in that: above-mentioned auto-conveying apparatus has the propagation function that is used to transmit above-mentioned handled object according to the described processing device system of either side in the tenth one side～the 13 aspect.
In addition, the described processing device system of a fifteenth aspect of the present invention is according to the described processing device system of either side in first aspect～the 14 aspect, it is characterized in that: above-mentioned carrying line is connected with the upstream side or the downstream of the carrying line of other operations.
In addition, the described processing device system of a sixteenth aspect of the present invention is according to the described processing device system of either side in claim first aspect～the 15 aspect, and it is characterized in that: above-mentioned handled object is the FPD glass substrate.
According to processing device system described in aspect claim first aspect of the present invention～16, a kind of transmission of shortening the handled object between carrying line and a plurality of processing unit can be provided, can shorten the processing time of each handled object, and the treatment effeciency of raising handled object, can improve treatment effeciency in addition with the handled object of other procedure connections in a plurality of operations, and, realize the processing device system in saving space.
Description of drawings
Fig. 1 is the stereogram of an execution mode of expression processing device system of the present invention.
(a) and (b) among Fig. 2 are respectively the schematic diagram of the part of processing device system shown in Figure 1, wherein, (a) are its plane graph, (b) for representing the side view of its carrying line.
(a) and (b) are respectively the schematic diagram of the (a) and (b) that are equivalent to Fig. 2 of variation of the carrying line of processing device system shown in Figure 2 among Fig. 3.
Fig. 4 is the sectional view of the major part of expression processing device system shown in Figure 1.
(a) and (b) are respectively the schematic diagram of load locking room shown in Figure 4 among Fig. 5, wherein, (a) are and the sectional view of Fig. 4 vertical direction, (b) are the stereogram of its inner transmission mechanism of expression.
Fig. 6 is the stereogram of the inside of expression processing unit shown in Figure 4.
Fig. 7 is the ideograph of expression processing device system integral layout shown in Figure 1.
(a)～(h) is the key diagram of action that second transmission mechanism of carrying line shown in Figure 1 is described respectively among Fig. 8.
(a)～(d) is the key diagram of action that second transmission mechanism of carrying line shown in Figure 1 is described respectively among Fig. 9.
(a)～(c) is the sequential chart that is illustrated respectively in each processing unit of processing device system shown in Figure 1 among Figure 10.
Figure 11 is the ideograph that is equivalent to Fig. 7 of another execution mode of expression processing device system of the present invention.
Figure 12 is the ideograph of layout of another execution mode of processing device system of the present invention.
Figure 13 is the ideograph of layout of another execution mode of processing device system of the present invention.
Figure 14 be the expression processing device system of the present invention another execution mode stereogram.
Figure 15 is the ideograph of the layout of expression processing device system shown in Figure 14.
Figure 16 is the ideograph of layout of the variation of expression processing device system shown in Figure 14.
(a) and (b) are ideographs of layout of representing the processing device system of prior art respectively among Figure 17.
Symbol description:
10,10A, 10B, 10C, 10D processing device system
11 carrying lines
12 processing unit
13 first transmission mechanisms
14 load locking rooms (loadlock may)
15 second transmission mechanisms
16 first supporting mechanisms
17 second supporting mechanisms
111,112 conveyance districts
S, S ' glass substrate (handled object)
Embodiment
Below, with reference to Fig. 1～the present invention will be described for execution mode shown in Figure 16.
As shown in Figure 1 and Figure 2, processing device system 10 of the present invention comprises: the carrying line 11 of conveyance handled object S (for example glass substrate (being designated hereinafter simply as glass substrate) of panel display board (Flat Display Panel:FDP) usefulness); A plurality of processing unit 12 along these carrying line 11 settings; And between this processing unit 12 and carrying line 11, transmit first transmission mechanism 13 of glass substrate S, wherein, under the control device control of (figure does not show), in processing unit 12, glass substrate S is implemented dry-etching (dry etching) and handle the equal vacuum processing.First transmission mechanism 13 is arranged in the load locking room 14 that is connected with processing unit 12, and is corresponding one to one with respect to a plurality of processing unit 12.Load locking room 14 connects by gate valve 12A with respect to processing unit 12, in addition, gate valve 14A is installed on the side of carrying line 11 1 sides, so that switch between atmospheric pressure and vacuum pressure inside.
And as shown in Figure 1 and Figure 2, carrying line 11 comprises: base station 11A; The a pair of support component 11B, the 11B that on base station 11A, are arranged in parallel along the conveyance direction of glass substrate S; And perpendicular on these support components 11B, 11B, separate a plurality of rotation roller 11C that predetermined distance is arranged along the carriage direction of glass substrate S.And, utilize this support component of the pillar 11D horizontal support 11B that uprightly is arranged on the base station 11A.In addition, carrying line 11 for example alternately connects setting in first, second conveyance district 111,112 of two kinds.The first conveyance district 111 has a plurality of rotation roller 11C of may command rotation, is arranged on the front of load locking room 14, and comprise and first transmission mechanism 13 between transmit the glass substrate S before and after handling, the mechanism of S '.The second conveyance district 112 has a plurality of rotation roller 11C of may command rotation, is arranged between the load locking room 14, and has the pooling feature that the glass substrate S, the S ' that make before and after handling temporarily are in wait state.And first, second conveyance district 111,112 can control each group rotation roller 11C individually according to block.
As shown in Figure 1 and Figure 2, the first conveyance district 111 is provided with second transmission mechanism 15.As shown in Figure 2, second transmission mechanism 15 comprises a plurality of first lifter pins (pin) 15A that is provided with along the edge in conveyance district, with a plurality of second lifter pin 15B that are provided with in the outside of the first lifter pin 15A, in the upstream side and the downstream in conveyance district, here, by first, second lifter pin 15A, 15B support untreated glass substrate S respectively or handle after glass substrate S ' around, and carry out lifting.The second lifter pin 15B has the parts of acceptance 15C and rotatable in the upper end.In addition, the second lifter pin 15B is not limited to present embodiment, as shown in Figure 3, also can be rotation and make the supporter 15B ' of the last bullet formula that glass substrate upsprings.As described later, when the glass substrate S ' after untreated glass substrate S of transmission between carrying line 11 and processing unit 12 and the processing, the first lifter pin 15A is raised up to untreated glass substrate S the height of regulation, and transfer the second lifter pin 15B to, support with the second lifter pin 15B untreated glass substrate S during, the substrate S ' after accept handling with the first lifter pin 15A.In addition, in Fig. 1, omitted the second lifter pin 15B.
As mentioned above, with the first conveyance district 111 load locking room 14 in opposite directions in, be provided with first transmission mechanism 13.As Fig. 2～shown in Figure 5, first transmission mechanism 13 carry out under the state of opening gate valve 14A and second transmission mechanism 15 in the first conveyance district 111 between glass substrate S, the transmission of S '; At closing gate valve 14A and open carry out under the state of gate valve 12A and processing unit 12 between glass substrate S, the transmission of S '.In addition,, on load locking room 14, be connected with vacuum pump 14B and gas supply part 14C, under the state of closing gate valve 12A, 14A, drive vacuum pump 14B and make indoor decompression as Fig. 2, shown in Figure 4, and to indoor supply inert gas (for example, N
2Gas), can form atmosphere of inert gases.
Shown in the (a) and (b) of Fig. 5, first transmission mechanism 13 has the handle portion 13A of support glass substrate S, S ', what be connected with the cardinal extremity of handle portion stretches the 13B of portion that crooks one's arm, the rotatable axle 13C that is connected with the cardinal extremity of stretching the 13B of portion that crooks one's arm, and drive division 13D, here, handle portion 13A is the center rotation with stretching the 13B of portion that crooks one's arm with axle 13C.And, as shown in Figure 2, first transmission mechanism 13 will stretched under the folding state of the 13B of portion that crooks one's arm, make handle portion 13A at front end towards carrying line 11 or processing unit 12, and under this state, will stretch the portion 13B of crooking one's arm and stretch out, advance to carrying line 11 or processing unit 12.
In addition, shown in Fig. 5 (a), in load locking room 14, liftably be provided with the supporting mechanism 16 of support glass substrate S, S ', supporting mechanism 16 constitutes as the lifter pin with dull and stereotyped or pin shape receiving portion 16A of support glass substrate S, S ' flatly.Secondly, first transmission mechanism 13 is transferred glass substrate S, S ' to supporting mechanism 16, and behind the Rotate 180 °, accepts glass substrate S, S ' from supporting mechanism 16 once more, and with glass substrate S, S ' conveyance to carrying line 11 or processing unit 12.Shown in Fig. 5 (a), supporting mechanism 16 forms can lifting.
Secondly, because when this transmits, do not make glass substrate S, S ' rotates in load locking room 14, thereby can reduce the area of plane of load locking room 14, so that the floor space (foot print) that can reduce processing device system 10, and, because indoor volume is very little, thereby can shorten switching time of atmospheric pressure and vacuum, can shorten glass substrate S, the passing time of S ', thus can enhance productivity.
And, as Fig. 2, shown in Figure 4, on processing unit 12, be connected with vacuum pump 18 and gas supply part 19, under the state of closing gate valve 12A, drive vacuum pump, make the indoor specified vacuum degree that is decompressed to, and, implement the specified vacuum of glass substrate S and handle to indoor supply processing gas.
That is,, in processing unit 12, be provided with the mounting table 12B of bearing glass substrate S, on this mounting table 12B, glass substrate S implemented dry-etching and handle the equal vacuum processing as Fig. 4, shown in Figure 6.That is, for example on the mounting table 12B of processing unit 12, be assembled with lower electrode 12C, upper electrode in parallel (figure does not show) is set above this lower electrode 12C.And, on lower electrode 12C, be connected with high frequency electric source (all not showing among the figure), and apply High frequency power to lower electrode 12C from this high frequency electric source by match circuit.In addition, the supply unit of upper electrode double as processing gas, the processing gas of spray shape is supplied with on the whole surface of the glass substrate S on lower electrode 12C.Thereby, in making processing unit 12, keep applying High frequency power to lower electrode 12 under the state of specified vacuum degree, by making the processing gas plasma, glass substrate S is implemented dry-etching handle the equal vacuum processing.And 12D is the shading ring (shield ring) that surrounds lower electrode 12C.
Mounting table 12B is provided with the 3rd transmission mechanism 20.As shown in Figure 6, the 3rd transmission mechanism 20 liftably is arranged on four positions of both sides of the edge portion of lower electrode 12C, and it comprises: the first transferring elements 20A that transmits glass substrate S above mounting table 12B; With corresponding, liftably be arranged on a plurality of positions of shading ring 12D, and glass substrate S can be remained on the locational second transferring elements 20B that is higher than the first transferring elements 20A with the first transferring elements 20A.As shown in Figure 6, the first transferring elements 20A is formed pin, and when carrying out the transmission of glass substrate S, the inside of (figure does not show) rises to and transmits the position from the hole that is formed on lower electrode 12C lateral edge portion in the upper end of pin, under other situation, the upper end of pin is recovered in the hole.
The second transferring elements 20B comprises: positive and negative rotation for example only 90 ° pin 20C and be installed in this pin 20C the upper end rectangle accept parts 20D.And, when carrying out the transmission of glass substrate S, as Fig. 4, shown in Figure 6, temporarily make and accept parts 20D from being formed on the centre position that hole in the shading ring 12D rises to lower electrode 12C and transmits position (identical with the transmission position of the first transferring elements 20A), make the direction of accepting parts 20D change 90 °, then, rise to the holding position once more.In other cases, be received in the hole (figure does not show) that is formed at shading ring 12D.In the present embodiment, the second transferring elements 20B constitutes and is contained in shading ring 12D inside, still, also can be arranged on the outer space of shading ring 12D, can also be arranged on the outside of lower electrode 12C.
In addition, Fig. 1 is the figure of the major part of the processing device system 10 of expression present embodiment, and still, processing device system 10 constitutes its integral body as shown in Figure 7.That is, in the upstream of carrying line 11 shown in Figure 1, in abutting connection with disposing first box body 21 of accommodating a plurality of untreated glass substrate S, in downstream in abutting connection with second box body 22 that disposes the glass substrate S ' after accommodating a plurality of processing.And, one by one supply with untreated glass substrate S to carrying line 11, and the substrate after will handling is accommodated second box body 22 from carrying line 11 from first box body 21.
Below, with reference to Fig. 8, Fig. 9 the action of processing device system 10 is described.At first, under the control of control device, processing device system 10 drives, and in processing unit 12 glass substrate S is implemented specified vacuum and handles.At this moment, in load locking room 14, make glass substrate S ' and wait after first transmission mechanism 13 keeps having handled, simultaneously, shown in Fig. 8 (a), in the first conveyance district 111 of carrying line 11, utilize the receiving portion 15C of the second lifter pin 15B of second transmission mechanism 15, untreated glass substrate S is lifted and waits for from rotation roller 11C.In addition, in the second conveyance district 112 of upstream one side, rotation roller 11C stops the rotation, and follow-up untreated glass substrate S is waited for.
Then, in load locking room 14, to indoor supply N
2Gas and turn back to atmospheric pressure from vacuum state after opening gate valve 14A, shown in Fig. 8 (b), is stretched the 13B of portion that crooks one's arm, and the handle portion 13A that makes first transmission mechanism 13 is from load locking room 14 interior glass substrate S ' after the first conveyance district 111 takes out of processing.At this moment, make the position of glass substrate S ' between rotation roller 11C and the untreated glass substrate S that utilizes second lifter pin 15B support after the processing of supporting with handle portion 13A.Then, the first lifter pin 15A that drives second transmission mechanism 15 is outstanding from rotation roller 11C, as in this figure (c) with shown in the arrow, the glass substrate S ' after handling is lifted from handle portion 13A.Then, drive first transmission mechanism 13, handle portion 13A is withdrawn in load locking room 14 from the first conveyance district 111, then, the first lifter pin 15A is dropped to state shown in (e) from state shown in this figure (d), the glass substrate S ' after handling is transferred on the rotation roller 11C.
Then, shown in Fig. 8 (f), drive first transmission mechanism 13 in the load locking room 14, handle portion 13A is advanced, stop at 111 tops, the first conveyance district, simultaneously, shown in this figure arrow, the second lifter pin 15B of second transmission mechanism 15 is descended.Then, shown in this figure (g), the second lifter pin 15B is further descended, transfer untreated glass substrate S to handle portion 13A, afterwards, first transmission mechanism, 13 usefulness handle portion 13A accept untreated glass substrate S, then, handle portion 13A is withdrawed to load locking room 14 from the first conveyance district 111, untreated glass substrate S is moved in the load locking room 14.With this action simultaneously, shown in arrow among this figure (h), rotate the second lifter pin 15B, make accept the glass substrate S ' of parts 15C after the processing that utilizes rotation roller 11C and support and back out after, descend to the downside of rotation roller 11C.
In processing unit 12, by make once more first accept parts 20A rise to transmit the position after, make to keep second of untreated glass substrate S to accept parts 20D dropping to the centre position, accept on the parts 20A and untreated glass substrate S is remained on first.Make second to accept to be recovered in the shading ring 12D parts 20D changes 90 ° with direction on the centre position after.By also making first to accept parts 20A from transmitting the position and descend and be recovered in the lower electrode 12C, and untreated glass substrate S is carried on the lower electrode 12C, and untreated glass substrate S is implemented specified vacuum handle.
On the other hand, in load locking room 14, utilize the glass substrate S ' after the processing that first transmission mechanism 13 temporarily will take out of from processing unit 12 to transfer supporting mechanism 16 to, at interim glass substrate S ' after keeping handling on the supporting mechanism 16.First transmission mechanism 13 ° makes the front end of handle 13A towards carrying line 11 1 sides by axle 13C Rotate 180.Then, supporting mechanism 16 is descended, transfer the glass substrate S ' after handling to handle portion 13A.During this period, supply with N from gas supply part 14C
2Gas makes the indoor atmospheric pressure that is back to.Then, open gate valve 14A, shown in Fig. 8 (a), first transmission mechanism 13 forms the state of the glass substrate S ' after handling being transferred to the first conveyance district 111.
When during carrying out the transmission of glass substrate S, S ' between load locking room 14 and the processing unit 12, shown in Fig. 9 (a), the rotation roller 11C that on carrying line 11, makes the first conveyance district 111 with and the rotation roller 11C in the second conveyance district 112 of upstream and downstream side rotate simultaneously, glass substrate S ' after the processing in the first conveyance district 111 is transferred to the second conveyance district 112 in downstream, simultaneously, the untreated glass substrate S in the second conveyance district 112 of upstream side is transferred to the first conveyance district 111.
After above-mentioned shift action finishes, in the first conveyance district 111, drive second transmission mechanism 15, shown in Fig. 9 (b), the first lifter pin 15A is risen, untreated glass substrate S is lifted from rotation roller 11C, and the second lifter pin 15B is risen.Then, the second lifter pin 15B shown in arrow among this figure (c), make accept parts 15D half-twist after, shown in this figure (d), untreated glass substrate S is taken off from the first lifter pin 15A, and the first lifter pin 15A is descended.During this period, in load locking room 14, drive first transmission mechanism 13, wait for for the glass substrate S ' after will handling transfers the first conveyance district 111 to.Then, repeat above-mentioned a series of action.
Above-mentioned explanation, be illustrated for the situation of in a processing unit 12, handling glass substrate S, in the present embodiment, utilize control device control and treatment apparatus system, make that shown in Figure 10 (a) a plurality of (among Fig. 7 being 4) processing unit 12 of arranging along carrying line 11 operates simultaneously.In this case, in load locking room 14 separately, drive first transmission mechanism 13 corresponding simultaneously with four processing unit 12, press the time of L shown in Figure 10 (a), as shown in Fig. 8 (b), accept untreated glass substrate S from carrying line 11 simultaneously, and simultaneously untreated glass substrate S is moved in the load locking room 14.Close the gate valve 14A of each load locking room 14 then, be adjusted to the specified vacuum state.During this period, in each load locking room 14, first transmission mechanism 13 is transferred untreated glass substrate S to supporting mechanism 16, makes the side of the direction of handle portion 13A towards processing unit 12, and accepts untreated glass substrate S from supporting mechanism 16.
Then, open the gate valve 12A of the processing unit 12 corresponding with each load locking room 14, first transmission mechanism 13 of each processing unit 12, handle portion 13A is advanced in processing unit 12, after transferring untreated glass substrate S in the processing unit 12 the second transferring elements 20B, temporarily handle portion 13A is withdrawed from from processing unit 12, and then handle portion 13A is advanced to processing unit 12, from the first glass substrate S ' that accepts after parts 20A takes off processing, and take out of from processing unit 12.In processing unit 12, closing gate valve 12A implements specified vacuum to untreated glass substrate S and handles.Then, after each first transferring elements 13 is moved into the glass substrate S ' after the processing separately in separately the load locking room 14, glass substrate S ' after temporarily will handling transfers supporting mechanism 16 to, make the direction of handle 13A change 180 ° after, the glass substrate S ' after accepting to handle.Again next, when load locking room 14 is opened gate valve 14A, according to the time of UL shown in Figure 10 (a), as as shown in Fig. 8 (b), glass substrate S ' after each first transmission mechanism 13 handle portion 13A by separately will handle from each load locking room 14 after taking out of simultaneously on the carrying line 11, drive second transmission mechanism 15, shown in Fig. 8 (c), (d), transfer the glass substrate S ' after each processing to first lifter pin 15A simultaneously from handle portion 13A.Make the glass substrate S ' after whole processing, second box body 22 to the position, downstream that is positioned at carrying line 11 moves, and untreated glass substrate S is moved to the first conveyance district 111 of the anterior position of the load locking room 14 that is positioned at each processing unit 12 from first box body 21 of the upstream side position that is positioned at carrying line 11.Afterwards, make first, second lifter pin 15A, 15B collaborative work, shown in this figure (e)～(h), accept untreated glass substrate S from carrying line 11, and repeat above-mentioned action.In this case, the 12 parallel runnings of 4 processing unit can be made, treatment effeciency can be improved.Wherein, to the time of time UL, be to be used for glass substrate S of conveyance and to implement specified vacuum and handle the necessary activity duration from time L shown in Figure 10 (a).
In addition, shown in Figure 10 (b), (c), from 4 first transmission mechanisms 13 when processing unit 12 is separately supplied with untreated glass substrate S, make time of supplying with untreated glass substrate S from the upstream side side official hour that staggers one by one downstream.In the case, identical with situation shown in this figure (a), make the parallel running of 4 processing unit.This figure (b) is that the time of situation shown in (a) of activity duration of untreated glass substrate S and this figure is roughly the same, and still, this figure (c) compares with situation shown in this figure (a) and (b), and the activity duration of glass substrate S is shorter.In this case, make in a plurality of processing unit 12, certain several processing unit 12 parallel running makes other processing unit 12 utilize the glass substrate S of first transmission mechanism 13, the transmission of S '.
In the present embodiment of above explanation, comprise: the glass substrate S before and after conveyance is handled under atmosphere, the carrying line 11 of S ', implement vacuum treated a plurality of processing unit 12 along these carrying line 11 settings and to untreated glass substrate S, and the glass substrate S that between these processing unit 12 and carrying line 11, transmits the processing front and back, first transmission mechanism 13 of S ', wherein, because between the carrying line 11 and each processing unit 12 of first transmission mechanism 13 in atmospheric pressure, directly transmit glass substrate S, S ', therefore, can shorten the glass substrate S of the processing front and back between carrying line 11 and load locking room 14, the passing time of S ' only just can improve the treatment effeciency of glass substrate S with this.In addition, in the present embodiment, because between carrying line 11 and a plurality of processing unit 12, simultaneously or from upstream side downstream the side official hour that staggers one by one transmit glass substrate S, S ' before and after handling, therefore, each processing unit 12 is stopped and running expeditiously, can obviously improve the treatment effeciency of glass substrate S.In addition, because the carrying room of load locking room 14 double as prior aries, so can reduce the occupied area of processing device system 10 and save the space, thus equipment cost can be reduced.
In addition, according to present embodiment, owing in load locking room 14, be provided with support glass substrate S, S ' supporting mechanism 16, therefore, in load locking room 14, can not make glass substrate S, the S ' rotation before and after handling, and between load locking room 14 and processing unit 12, transmit, therefore can reduce the occupied area of load locking room 14.In addition, because carrying line 11 has first, second conveyance district 111,112 that can control conveyance separately, stop, may command is respectively rotated roller 11C rotation, therefore, the transmission special use of the first conveyance district 111 as glass substrate S, S ' can be used as the buffering special use that glass substrate S, S ' are waited for the second conveyance district 112.
In addition, processing device system of the present invention can be provided with shown in Figure 11～13.Processing device system 10A shown in Figure 11 is except that clamping carrying line 11 and make a plurality of processing unit 12 are provided with alternately in opposite directions, identical with above-mentioned execution mode.In addition, processing device system 10B shown in Figure 12 is except that adding the processing unit of distinguishing in opposite directions with a plurality of processing unit 12 of processing device system 10 shown in Figure 7 12, identical with situation shown in Figure 7.In the case, the time of the transmission of glass substrate S, the S ' of two first transmission mechanisms 13 that usefulness clamping carrying line 11 is provided with in opposite directions can be set the time of transmission arbitrarily under the condition of not interfering mutually, can further improve the treatment effeciency of glass substrate S.In addition, processing device system 10C shown in Figure 13 is provided with the carrying line 11 ' of untreated glass substrate S special use, the carrying line 11 that glass substrate S ' after the processing is special-purpose ", in a plurality of processing unit 12, move into special-purpose transmission mechanism 13 ' respectively and take out of special-purpose transmission mechanism 13 ".
In addition, shown in Figure 14, Figure 15 (a), processing device system 10D serves as according to constituting with processing device system 10 shown in Figure 1 except that the structure difference of carrying line 11.Therefore, below the part identical or suitable with the respective embodiments described above used identical symbol, and the processing device system 10D of present embodiment is described.
That is, the processing device system 10D of present embodiment shown in Figure 14,15 (a), comprises carrying line 11, processing unit 12, first transmission mechanism 13, load locking room 14 and first, second box body 21,22.Processing unit 12, first transmission mechanism 13 and load locking room 14 constitute in the same manner with the various embodiments described above, flank side surface along carrying line 11 separates predetermined distance, arrange a plurality of, between carrying line 11 and processing unit 12, handle the glass substrate S of front and back, the transmission of S ' by first transmission mechanism 13.
Carrying line 11 in the present embodiment, as shown in figure 14, the auto-conveying apparatus 32 that has carrying channel 31 and move back and forth along carrying channel 31.Carrying channel 31 is provided with guide rail, and auto-conveying apparatus 32 moves back and forth on carrying channel 31 along guide rail, glass substrate S, S ' before and after conveyance is handled.
As shown in figure 14, auto-conveying apparatus 32 comprises brace table 32A, at the rotation roller 32B that supports to be spaced from each other on the platform 32A predetermined distance and a plurality of arrangements, and the second transmission mechanism 32C, and the joint pin 32D that connects brace table 32A and motion drive division (figure does not show).A plurality of rotation roller 32B arrange with the direction of transfer of glass substrate S is parallel on the upper surface of brace table 32A, when and first, second box body 21,22 between drive rotation during glass substrate S, S ' before and after transmit handling.Then, except that a plurality of rotation roller 32B that are arranged on brace table 32 and the second transmission mechanism 32C form the state of the orientation half-twist that makes rotation roller 32B, serve as according to formation with the first conveyance district 111 shown in Figure 1.
In addition, first, second box body 21,22 as shown in figure 14, has a plurality of rotation roller 21A, 22A.These rotation rollers 21A, 22A all arrange on the direction identical with a plurality of rotation roller 32B of auto-conveying apparatus 21, and 32B drives simultaneously with these rotation rollers.
Below, action is described.From first box body 21 when processing unit 12 is supplied with untreated glass substrate S, auto-conveying apparatus 32 moves along carrying channel 31, and stops at the front of first box body 21.Then, drive first box body 21 and auto-conveying apparatus 32 rotation roller 21A, 32B separately simultaneously, supply with untreated glass substrate S to auto-conveying apparatus 32 from first box body 21.After auto-conveying apparatus 32 is accepted untreated glass substrate S, as shown in figure 14, stop at the front of the load locking room 14 of regulation along carrying channel 31.Then, auto-conveying apparatus 32 beginnings are moved to the front of load locking room 14, simultaneously, begin to drive the second transmission mechanism 32C of auto-conveying apparatus 32, and begin untreated glass substrate S is lifted.After the transmission of load locking room 14 is ready to complete, drive first transmission mechanism 13 of load locking room 14,13A stretches out with handle portion, and accepts untreated glass substrate S.At this moment, under the situation of the glass substrate S ' after first transmission mechanism 13 maintains processing, in fact drive first, second transmission mechanism 13,32C in the same manner, and handle the glass substrate S of front and back, the transmission of S ' with Fig. 8, situation shown in Figure 9.Then, processing device system 10D operates in the same manner with processing device system 10 shown in Figure 1, and untreated glass substrate S is carried out vacuum treatment, and the transmission of the glass substrate S ' after handling.
In addition, as shown in figure 16, in processing device system 10D shown in Figure 14, be positioned at first, second box body 21,22 under the situation of the upstream extremity of carrying line 11 and downstream, also can be provided with the function of the brace table 32A half-twist that makes auto-conveying apparatus 32 in addition, when transmitting with each box body 21,22, rotatable brace table 32A.
In the present embodiment, auto-conveying apparatus 32 moves along carrying channel 31, can not transmit a plurality of glass substrate S that handle front and back simultaneously, S ', but as Figure 10 (b), (c) shown in, can match with the passing time of first transmission mechanism 13 in each load locking room 14, and auto-conveying apparatus 32 is moved, with from the processing unit 12 of upstream side downstream the processing unit 12 of side supply with successively, in addition, under the condition of the passing time interference of the glass substrate S ' after not making untreated glass substrate S and processing, can be so that the time is carried out glass substrate S to each processing unit 12 arbitrarily, the transmission of S ', therefore, a plurality of processing unit 12 are ceaselessly operated, and improve the treatment effeciency of glass substrate S.
According to present embodiment, because can matching with the passing time of first transmission mechanism 13 to merge, moves auto-conveying apparatus 32, therefore, can make a plurality of processing unit 12 ceaselessly handle glass substrate S, can improve its treatment effeciency.Because auto-conveying apparatus 32 has the rotation roller 32B of a plurality of may command rotation, therefore, can and box body 21,22 between the taking out of and moving into of glass substrate S, S ' before and after handling glibly.In addition because auto-conveying apparatus 32 has the second transmission mechanism 32C that is used to transmit glass substrate S, S ' before and after handling, therefore, can and first transmission mechanism 13 between transmit glass substrate S, S ' before and after handling glibly.In addition, in addition, in the present embodiment, can obtain with the respective embodiments described above is the action effect of the execution mode of foundation.
And, to in the respective embodiments described above, glass substrate S before and after handling with the atmospheric atmosphere conveyance, between the carrying line 11 and vacuum treatment installation 12 of S ', use first, second transmission mechanism 13,15 directly transmit the glass substrate S before and after handling, the processing device system 10 of S ' is illustrated, but, the present invention is not limited to the respective embodiments described above, second transmission mechanism 15 that can also be arranged on the carrying line 11 only is the mode of the first lifter pin 15A, in addition, first transmission mechanism 13 that is arranged on the processing unit 12 is not to stretch to crook one's arm, and can also be by the flexible travelling arm of one or more slide mechanism.So long as in processing device system, between carrying line and a plurality of processing unit, be unit with the monolithic with a plurality of handled objects, simultaneously or time difference time is set, and carry out the processing device system that handled object transmits, all contain in the present invention.In addition, can set the passing time that utilizes first transmission mechanism arbitrarily.Be illustrated for the situation that supporting construction 16 is set in load locking room 14, still, supporting mechanism can be at least one, and in addition, processing unit 12 also is not limited to the dry-etching device, can also be into other processing unit such as membrane treatment appts.And handled object also is not limited to the glass substrate that FDP uses.
Industrial applicability
The present invention can be used for processing FPD with the processing device system of the handled objects such as glass substrate.
Claims (16)
1. a processing device system is characterized in that, comprising:
The carrying line of conveyance handled object along this carrying line setting and handle a plurality of processing unit of described handled object, and transmits the transmission mechanism of described handled object between these processing unit and described carrying line, wherein,
Described transmission mechanism transmits a plurality of handled objects simultaneously between described carrying line and described a plurality of processing unit.
2. a processing device system is characterized in that, comprising:
The carrying line of conveyance handled object along a plurality of processing unit that are provided with and handle described handled object from the upstream side of this carrying line to the downstream, and transmits the transmission mechanism of handled object between these processing unit and described carrying line, wherein,
Described transmission mechanism is between described carrying line and described each processing unit, according to the described handled object of the sequence delivery from the upstream side to the downstream.
3. a processing device system is characterized in that, comprising:
The carrying line of conveyance handled object along a plurality of processing unit that are provided with and handle described handled object from the upstream side of this carrying line to the downstream, and transmits the transmission mechanism of handled object between these processing unit and described carrying line, wherein,
Described transmission mechanism transmits described handled object in any order between described carrying line and described each processing unit.
4. a processing device system is characterized in that, comprising:
The carrying line of conveyance handled object in atmosphere is implemented vacuum treated a plurality of processing unit along this carrying line setting and to described handled object, and transmits the transmission mechanism of described handled object between these processing unit and described carrying line, wherein,
Described transmission mechanism transmits described handled object between the described carrying line in atmosphere and described each processing unit.
5. as processing device system as described in each in the claim 1～4, it is characterized in that:
To be arranged in the loadlock may as first transmission mechanism of the inscape of described transmission mechanism.
6. as processing device system as described in the claim 5, it is characterized in that:
Described loadlock may is included at least one supporting mechanism that supports handled object when transmitting described handled object; The volume of described loadlock may is less than for making the necessary volume of described handled object rotation.
7. as processing device system as described in each in the claim 1～6, it is characterized in that:
Described carrying line has the conveyance district that can control conveyance separately, stop.
8. as processing device system as described in the claim 7, it is characterized in that:
Described conveyance district has the rotation roller of a plurality of may command rotations.
9. as processing device system as described in claim 7 or 8, it is characterized in that:
Part in described a plurality of conveyances district has the pooling feature that described handled object is waited for.
10. as processing device system as described in each in the claim 7～9, it is characterized in that:
Part in the described conveyance district has second transmission mechanism that is used to transmit described handled object.
11., it is characterized in that as processing device system as described in each in the claim 2～4:
Described carrying line has auto-conveying apparatus.
12., it is characterized in that as processing device system as described in the claim 11:
Described auto-conveying apparatus matches with the passing time of described transmission mechanism and moves.
13., it is characterized in that as processing device system as described in the claim 12:
Described auto-conveying apparatus has the roller of a plurality of may command rotations.
14., it is characterized in that as processing device system as described in each in the claim 11～13:
Described auto-conveying apparatus has second transmission mechanism that is used to transmit described handled object.
15., it is characterized in that as processing device system as described in each in the claim 1～14:
Described carrying line is connected with the upstream side or the downstream of the carrying line of other operations.
16., it is characterized in that as processing device system as described in each in the claim 1～15:
Described handled object is the FPD glass substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005129905A JP4908771B2 (en) | 2005-04-27 | 2005-04-27 | Processing device system |
| JP2005129905 | 2005-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1855414A true CN1855414A (en) | 2006-11-01 |
| CN100437963C CN100437963C (en) | 2008-11-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100769141A Expired - Fee Related CN100437963C (en) | 2005-04-27 | 2006-04-25 | Processing device system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4908771B2 (en) |
| KR (1) | KR100796052B1 (en) |
| CN (1) | CN100437963C (en) |
| TW (1) | TW200644054A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431041B (en) * | 2007-11-06 | 2011-04-13 | 东京毅力科创株式会社 | Carrying bench, processing device and processing system |
| CN103262209A (en) * | 2010-12-15 | 2013-08-21 | 株式会社尼康 | Substrate processing system and method for producing display elements |
| CN108249139A (en) * | 2017-12-29 | 2018-07-06 | 英特尔产品（成都）有限公司 | For the control method of substrate transmission, apparatus and system between substrate processing apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5084525B2 (en) * | 2008-01-22 | 2012-11-28 | 株式会社アルバック | Substrate processing apparatus and substrate processing method |
| JP6154201B2 (en) * | 2013-06-10 | 2017-06-28 | セントラル硝子株式会社 | Plate material transfer device and plate material transfer method |
| JP6899813B2 (en) * | 2018-11-27 | 2021-07-07 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment and substrate processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3429786B2 (en) * | 1991-05-29 | 2003-07-22 | 東京エレクトロン株式会社 | Semiconductor manufacturing equipment |
| JPH0685032A (en) * | 1992-07-14 | 1994-03-25 | Kokusai Electric Co Ltd | Base board carrier |
| TW318258B (en) * | 1995-12-12 | 1997-10-21 | Tokyo Electron Co Ltd | |
| JP3554534B2 (en) * | 1995-12-12 | 2004-08-18 | 東京エレクトロン株式会社 | Substrate support mechanism and substrate exchange method for semiconductor processing apparatus, and semiconductor processing apparatus and substrate transfer apparatus |
| JP3650495B2 (en) * | 1995-12-12 | 2005-05-18 | 東京エレクトロン株式会社 | Semiconductor processing apparatus, substrate replacement mechanism and substrate replacement method thereof |
| JPH11288995A (en) * | 1998-04-04 | 1999-10-19 | Tokyo Electron Ltd | Transfer system and processing device thereof |
| JP2001196437A (en) * | 2000-01-12 | 2001-07-19 | Anelva Corp | Substrate conveying system and substrate treating apparatus having the system |
| JP2002079614A (en) * | 2000-06-19 | 2002-03-19 | Yokohama Rubber Co Ltd:The | Rubber/resin composite and low permeable hose using the same |
| JP2003152047A (en) * | 2001-11-09 | 2003-05-23 | Sharp Corp | Production system for semiconductor device |
| JP4173309B2 (en) * | 2002-01-28 | 2008-10-29 | 東京エレクトロン株式会社 | Centering device and single wafer inspection device |
| JP2004079614A (en) * | 2002-08-12 | 2004-03-11 | Dainippon Printing Co Ltd | Work processing method and its processing apparatus |
| JP2004281474A (en) * | 2003-03-12 | 2004-10-07 | Seiko Epson Corp | Delivering system for production object and carrying system having delivery system of production object |
| JP4493955B2 (en) * | 2003-09-01 | 2010-06-30 | 東京エレクトロン株式会社 | Substrate processing apparatus and transfer case |
-
2005
- 2005-04-27 JP JP2005129905A patent/JP4908771B2/en not_active Expired - Fee Related
-
2006
- 2006-04-25 CN CNB2006100769141A patent/CN100437963C/en not_active Expired - Fee Related
- 2006-04-26 KR KR1020060037673A patent/KR100796052B1/en not_active IP Right Cessation
- 2006-04-26 TW TW095114950A patent/TW200644054A/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431041B (en) * | 2007-11-06 | 2011-04-13 | 东京毅力科创株式会社 | Carrying bench, processing device and processing system |
| CN103262209A (en) * | 2010-12-15 | 2013-08-21 | 株式会社尼康 | Substrate processing system and method for producing display elements |
| CN103262209B (en) * | 2010-12-15 | 2015-12-09 | 株式会社尼康 | The manufacture method of base plate processing system and electronic component |
| CN108249139A (en) * | 2017-12-29 | 2018-07-06 | 英特尔产品（成都）有限公司 | For the control method of substrate transmission, apparatus and system between substrate processing apparatus |
| CN108249139B (en) * | 2017-12-29 | 2019-04-23 | 英特尔产品（成都）有限公司 | For the control method of substrate transmission, apparatus and system between substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4908771B2 (en) | 2012-04-04 |
| KR20060113461A (en) | 2006-11-02 |
| JP2006310471A (en) | 2006-11-09 |
| TW200644054A (en) | 2006-12-16 |
| KR100796052B1 (en) | 2008-01-21 |
| CN100437963C (en) | 2008-11-26 |
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