TWI553757B - Substrate processing system and display element manufacturing method - Google Patents

Description

Substrate processing system and method of manufacturing display element

The present invention relates to a substrate processing system and a method of manufacturing a display element

The present application claims priority to U.S. Patent Application Serial No. 61/423,222, filed on Dec.

As a display element constituting a display device such as a display device, for example, a liquid crystal display element or an organic electroluminescence (organic EL) element is known. At present, these display elements are mainly active devices that form thin film transistors (TFTs) corresponding to respective pixels on the surface of the substrate.

In recent years, there has been a technique of forming a display element on a sheet substrate (for example, a film member or the like). As such a technique, for example, a method called a roll to roll method (hereinafter, simply referred to as a "winding method") is widely known (for example, refer to Patent Document 1). In the winding method, a sheet-like substrate (for example, a strip-shaped film member) wound on a substrate supply side is fed, and the substrate to be fed is wound on the recovery roller on the substrate recovery side. A processing device provided between the supply roller and the recovery roller is used to apply the desired processing to the substrate.

While the substrate is being transferred from the substrate to the wound substrate, for example, a plurality of transfer rollers are used to transport the substrate, and a plurality of processing devices (units) are used to form a gate electrode, a gate insulating film, a semiconductor film, a source-drain, and the like which constitute the TFT. The constituent elements of the display element are sequentially formed on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, and the like are sequentially formed on a substrate.

Advanced technical literature

[Patent Document 1] International Publication No. 2006/100868

In the case of performing the above-described winding method, a processing system having high processing efficiency and high throughput can be obtained.

It is an object of the present invention to provide a substrate processing system and a method of manufacturing a display element which can achieve high throughput.

An aspect of the present invention provides a substrate processing system including: a plurality of substrate housing devices having a housing chamber for housing a substrate; and a plurality of substrate processing devices having a connection portion connected to the plurality of substrate housing devices, wherein the substrate housing device The substrate is processed while being connected to the connecting portion; the guiding device guides each of the plurality of substrate receiving devices to each of the plurality of substrate processing devices; and the control device controls the guiding device to make the plurality of the substrates Each of the housing devices is connected to each of the plurality of substrate processing apparatuses in a predetermined order.

Another aspect of the present invention provides a method of fabricating a display device in which a display device is formed on a substrate using the substrate processing system of the above aspect.

According to an aspect of the present invention, a substrate processing system capable of obtaining a high throughput and a method of manufacturing a display element can be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a front view showing the overall configuration of a substrate processing system SYS of the present embodiment.

As shown in FIG. 1, the substrate processing system SYS is provided, for example, on the floor FL of a manufacturing plant, and has a first layer portion 1 and a second layer portion 2.

In the first layer portion 1 of the substrate processing system SYS, a receiving device loading port 10, a receiving device carrying port 11 and a substrate loading device 12 are provided. The second layer portion 2 of the substrate processing system SYS is a clean room surrounded by the wall portion 2a. The second layer portion 2 is provided with a plurality of substrate processing apparatuses PR arranged in a line. Further, a guiding device GD and a plurality of substrate housing devices ST are connected to the first layer portion 1 and the second layer portion 2.

Hereinafter, in the description of the substrate processing system SYS, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following figures, the plane parallel to the ground FL in the XYZ orthogonal coordinate system is set to the XY plane. In the XY plane, the direction in which the plurality of substrate processing apparatuses PR are arranged is set to the Y direction, and the direction orthogonal to the Y direction is set to the X direction. Further, the direction perpendicular to the ground FL (XY plane) is set to the Z-axis direction.

The substrate processing system SYS is a system in which a roll-to-roll method (hereinafter, simply referred to as a "winding method") is applied to various surfaces of a flexible substrate S formed in a strip shape. The substrate processing system SYS is used to form, for example, a display element (electronic element) such as an organic EL element or a liquid crystal display element on the substrate S. Of course, the substrate processing system SYS can also be used in the case of forming components other than these components.

For the substrate S to be processed in the substrate processing system SYS, for example, a resin film or a foil such as stainless steel can be used. For example, a resin film may be a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin, or a poly Styrene resin, polyvinyl alcohol resin and other materials.

The dimension of the substrate S in the short-side direction is, for example, about 50 cm to 2 m, and the dimension in the longitudinal direction (one-week dimension) is, for example, 10 m or more. Of course, this size is only an example and is not limited thereto. For example, the dimension of the substrate S in the short side direction may be 50 cm or less, or may be 2 m or more. In the present embodiment, the substrate S having a short side dimension of more than 2 m can be used. Further, the dimension of the substrate S in the longitudinal direction may be 10 m or less.

The substrate S has a thickness of, for example, 1 mm or less and is formed to have flexibility. The term "flexibility" as used herein means, for example, the property of imparting a predetermined force to the substrate at least to its own weight, without breaking or cracking, and bending the substrate. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility indicated. Further, the flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate. Further, as the substrate S, a strip-shaped substrate may be used, or a plurality of unit substrates may be connected to form a strip shape.

It is preferable that the substrate S has a small thermal expansion coefficient which does not change in size to withstand heat of, for example, about 200 °C. For example, an inorganic filler may be mixed in the resin film to lower the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

Fig. 2 is a cross-sectional view showing the configuration of the substrate housing device ST.

As shown in FIG. 2, the substrate housing device ST has a container (case) 20 having a plurality of wall surfaces. The container 20 is formed, for example, in a substantially rectangular parallelepiped shape. Inside the container 20, a housing chamber RM that surrounds the wall portion constituting the container 20 is formed. The substrate S is housed in the housing chamber RM. The container 20 has two openings (EN, EX) in one wall portion 20a. In the present embodiment, the substrate housing device ST is used in a state where the wall portion 20a faces the +X side.

One of the two openings is to carry the substrate into the substrate transfer inlet EN of the storage chamber RM. The other of the two openings is a substrate carrying port EX for carrying out the substrate of the storage chamber RM. In the present embodiment, the configuration in which the substrate loading port EN is disposed on the -Z side of the substrate carrying-out port EX has been described as an example. However, the arrangement may be reversed.

A plurality of wheels (stage driving portions) 28 are provided on the surface (bottom surface) on the -Z side of the container 20. A plurality of wheels 28 are arranged in two rows in the X direction. The substrate housing device ST is provided with a drive mechanism (not shown) that drives the wheels 28 to move the container 20 in the X direction. The control unit CONT can adjust the amount of movement of the container 20, the movement timing, and the like by the drive mechanism.

A loading roller 22 is provided in the vicinity of the substrate loading inlet EN in the storage chamber RM. The loading roller 22 is provided in a pair between the substrate S that is carried in the -X direction from the substrate loading port EN in the -X direction. The loading roller 22 is rotatable to pull the substrate S carried in from the substrate loading inlet EN into the storage chamber RM.

A direction change roller 23 is provided on the downstream side of the loading roller 22. The direction change roller 23 has rollers 23a and 23b. A folded-back portion 24 is provided on the downstream side of the direction change roller 23. The folded portion 24 has a plurality of (here, eight) rollers 24a to 24h. Each of the rollers 24a to 24h is formed in a cylindrical shape, and is disposed such that the central axis extends along the Y axis and is parallel to each other in the X direction.

The rollers 24a, 24c, 24e, and 24g are disposed along the +Z side wall portion of the container 20. The rollers 24b, 24d, 24f, and 24h are disposed along the -Z side wall portion of the container 20. In the rollers 24a to 24h arranged in this manner, the substrate S is hung thereon in the order of the drum 24a, the drum 24b, the drum 24c, the drum 24d, the drum 24e, the drum 24f, the drum 24g, and the drum 24h. In this way, since the drum disposed on the Z side and the drum disposed on the -Z side are alternately suspended, the configuration of the substrate S formed in a strip shape can be effectively accommodated.

A carry-out drum 25 is provided on the downstream side of the drum 24h and in the vicinity of the substrate discharge port EX. The carry-out drum 25 is provided with a pair at a position sandwiching the substrate S in the Z direction. That is, the carry-out roller 25 is provided one on each of the front side and the back side of the substrate S. The carry-out drum 25 is rotatable to feed the substrate S carried out from the substrate carry-out port EX to the outside of the storage chamber RM. Further, the +X side wall portion 20a of the container 20 is provided with a protruding portion 29 that protrudes in the +X direction.

Further, in order to accommodate the substrate S in the folded-back state as shown in FIG. 2, the guide plate RM may be placed on the transfer path of the substrate S, for example, between the respective rollers, and the guide plate may be provided on the front or back surface of the guide substrate S. . The guide plate may be provided on either the front side or the back side of the substrate S, or may be provided on both sides. Further, as the guide, air guiding can also be used.

As shown in FIG. 1, the storage device loading port 10 provided in the first layer portion 1 of the substrate processing system SYS is carried into the portion of the substrate housing device ST. Further, the storage device outlet 11 is a portion that carries out the substrate storage device ST. The storage device outlet 11 is provided on the +Y side of the storage device inlet 10. The substrate loading device 12 fills the substrate S into the storage chamber RM of the substrate housing device ST. The substrate loading device 12 is provided on the -Y side of the storage device carrying inlet 10.

FIG. 3 is a view showing the configuration of the substrate loading device 12.

As shown in FIG. 3, the substrate loading device 12 has a sheet roll 121R, a tape roll 122R, a sheet conveying roller 123RL, a tape transfer roller 124, a processing table 125, a cutter 126, an following unit 127, a discharge roller 128, and a connection. The crucible 129 and the discharge crucible (substrate insertion portion) 130.

The sheet roll 121R is filled with a supply source of the substrate S of the substrate housing device ST, and the substrate S is wound. The tape guide roll 122R is attached to a supply source of the tape L at the front end and the rear end of the substrate S, and the tape L is wound. The substrate S and the conduction tape L are respectively delivered from the sheet roll 121R and the tape guide roll 122R.

The sheet conveying roller 123RL transports the substrate S sent from the sheet roll 121R to the processing table 125. The tape guide roller 124 conveys the tape L sent from the tape roll 122R to the processing table 125. The cutter 126 cuts the conduction belt L that is conveyed to the processing table 125. Next, the unit 127 follows the cut-off conduction band L and the front end (or the rear end) of the substrate S.

The discharge roller 128 discharges the substrate S following the tape L from the discharge port 130 to the outside of the substrate loading device 12. The port 129 has a recess for inserting the protruding portion 29 of the substrate housing device ST. The substrate housing device ST is connected to the substrate loading device 12 in a state where the protruding portion 29 is inserted into the concave portion of the connection port 129.

A terminal (not shown) is provided in each of the protruding portion 29 and the connection port 129, and the substrate storage device ST is electrically connected to the substrate loading device 12 by inserting the protruding portion 29 into the concave portion of the connection port 129. Of course, it is also possible to form the end portion of the air pressure system line and the end portion of the vacuum line in the protruding portion 29 and the port 129, and insert the protruding portion 29 into the recess of the port 129 to thereby press the substrate housing device ST. The pipeline is connected to the pipeline of the substrate loading device 12.

Fig. 4 is a view showing a configuration of a substrate S in a state in which the conduction band L is attached.

As shown in FIG. 4, an element (for example, a large display or the like) is formed on a plurality of regions 3 in which the substrate S is arranged in the longitudinal direction. Further, the conduction band L has an end conduction band L1 attached to the front end Sh of the substrate S, and an end conduction band L2 attached to the rear end Se of the substrate S. The front end conduction belt L1 and the rear end conduction belt L2 are respectively provided with a notch portion La and an opening portion Lb.

The notch portion La and the opening portion Lb are used, for example, in a projection portion of a transport system that is hung in the processing device PR included in the substrate processing system SYS, or as a reference position for alignment. Further, the front end guide belt L1 is formed with the direction mark Lc, and the rear end belt L2 is formed with the direction mark Ld. The substrate S to which the tape guide tape L is attached is housed in the housing chamber RM of the substrate housing device ST.

Moreover, the notch part La and the opening part Lb provided in the front end conduction belt L1 and the rear end conduction belt L2 can be processed by the cutter 126 etc. shown in FIG.

Further, the tape L is provided with an information recording unit such as an electronic tag (IC tag) or a magnetic strip (not shown). In the information recording unit, various materials (processing conditions, processing results, batch management, and the like) related to the processing and processing of the substrate S are recorded. The information recorded in the information recording unit is recorded so as to be rewritable to, for example, a memory unit provided in the substrate housing device ST, that is, a memory unit provided in the control unit CONT.

Fig. 5 is a plan view showing the configuration of the second layer portion 2 of the substrate processing system SYS shown in Fig. 1 as viewed from above. Fig. 6 is a side view showing a part of the second layer portion 2.

As shown in FIG. 1, FIG. 5, and FIG. 6, the substrate processing apparatus PR provided in the second layer portion 2 of the substrate processing system SYS is a device for performing various processes for forming a display element on the substrate S. In the present embodiment, the substrate processing apparatus PR may be, for example, a partition forming device for forming a partition wall on the substrate S, and an electrode forming device for forming an electrode for driving the organic EL element to form an organic A light-emitting layer forming device or the like of the light-emitting layer of the EL element.

Specifically, for example, a film forming device such as a droplet applying device (for example, an inkjet coating device or a photogravure printing device), a vapor deposition device, a sputtering device, and the like, and an exposure device, a developing device, and a surface modifying device , washing equipment, etc. In the present embodiment, the first substrate processing apparatus PR1, the second substrate processing apparatus PR2, the third substrate processing apparatus PR3, and the fourth substrate processing apparatus PR4 that perform various processes are sequentially disposed from the -Y side to the +Y side. . Further, as the processing device, other processing devices for performing various types of engineering (heating or the like) may be disposed.

Each of the substrate processing apparatuses PR has a receiving unit 30 that performs the reception of the substrate S with the substrate housing device ST. The receiving unit 30 includes a discharge port 30N for discharging the substrate S to the substrate transfer inlet EN of the substrate storage device ST, and a pick-up device for drawing the substrate S from the substrate transfer port EX of the substrate storage device ST (pull-in, substrate) Pull out) 30X. Further, each of the substrate processing apparatuses PR has a port 39 (FIG. 6) connected to the protruding portion 29 of the substrate housing device ST.

Each of the ports 39 is provided with a terminal (not shown), and the projecting portion 29 is inserted into the recess of the port 39 to electrically connect the substrate housing device ST to each of the substrate processing devices PR. Of course, it is also possible to form the end portion of the line in which the air pressure system is connected to the port 39 and the end portion of the line of the vacuum system, and to insert the protrusion 29 into the recess of the port 39 to connect the line and the substrate processing device of the substrate housing device ST. Pipeline connection for PR.

FIG. 7 is a view showing a configuration in which the partition forming device PR1 is used as an example of the substrate processing apparatus PR.

As shown in FIG. 7, the partition wall forming apparatus PR1 has a processing unit including an ultraviolet curable resin layer forming portion 31, a temperature adjusting portion 32, an imprint forming portion 33, an ultraviolet ray irradiating portion 34, a buffer portion 35, and an air conditioning portion 36. Further, the partition wall forming device PR1 has the above-described discharge port 30N and the suction port 30X.

The ultraviolet curable resin layer forming portion 31 forms a layer of an ultraviolet curable resin on the surface of the substrate S which is drawn from the pick 30X to the inside of the device by a coating method. The temperature adjustment unit 32 performs temperature adjustment of the substrate S on which the ultraviolet curable resin layer is formed. The control unit CONT controls the amount of adjustment of the temperature adjustment unit 32. The imprint forming portion 33 forms a predetermined pattern on the ultraviolet curable resin layer.

The stamp forming portion 33 has a stamper roller 33a and a pressure roller 33b. A mold to be formed on the partition wall of the ultraviolet curable resin layer is formed on the surface of the stamper drum 33a. The pressure roller 33b presses the surface side of the substrate S against the surface of the stamper drum 33a. Therefore, the substrate S is conveyed between the stamper drum 33a and the pressure roller 33b, and the pattern of the partition walls is formed on the ultraviolet curable resin layer on the substrate S.

The ultraviolet ray irradiation unit 34 irradiates the ultraviolet ray curable resin layer of the substrate S with ultraviolet rays. The ultraviolet ray irradiation unit 34 has a plurality of light sources that emit ultraviolet rays. The substrate S passing through the ultraviolet ray irradiation portion 34 forms a partition wall in a hardened state. The buffer portion 35 is housed in a predetermined amount by the substrate S of the ultraviolet irradiation unit 34. The substrate S passing through the buffer portion 35 is discharged from the suction cassette 30X to the substrate housing device ST. The air conditioning unit 36 has filters 36a and 36b for removing foreign matter such as dust from the air in the partition forming device PR1. The filters 36a and 36b use a HEPA filter or the like.

Further, as shown in FIG. 1, the guiding device GD has a frame 40, a rail (guide rail) 41, a carriage (stage) 42, and lifting mechanisms 43 and 44. The guiding device GD guides the substrate housing device ST between the first layer portion 1 and the second layer portion 2 and between. The frame 40 is disposed on a straight line in the guiding direction (Y direction) of the substrate housing device ST. The rail 41 is formed to extend in the Y direction, and two rails are disposed on the +Z side of the frame 40 in the X direction (see FIG. 3).

The trolley 42 is arranged to be movable in the Y direction along the rail 41. A recess 42d of the embedded rail 41 is formed on the surface 42b on the -Z side of the carriage 42. The carriage 42 is disposed to be movable in the Y direction along the rail 41 in a state where the rail 41 is fitted into the recess 42d.

The carriage 42 has a loading surface 42a on which the substrate housing device ST is mounted. The loading surface 42a of the carriage 42 is formed with a pair of rails 42c extending in parallel in the X direction. The wheel 28 of the substrate housing device ST is loaded on the rail 42c. This wheel 28 is disposed at a position opposite to the rail 42c, respectively. Thus, each wheel 28 is movable along rail 42c. As described above, the substrate housing device ST is provided to be movable in the X direction independently of the guiding device GD.

The elevating mechanism 43 moves in the +Z direction while the substrate housing device ST is loaded, and accordingly, the substrate housing device ST is transported from the first layer portion 1 to the second layer portion 2. The elevating mechanism 44 carries the substrate housing device ST from the second layer portion 2 in the -Z direction, whereby the substrate housing device ST is transported from the second layer portion 2 to the first layer portion 1.

Next, the operation of the substrate processing system SYS having the above configuration will be described.

When the substrate accommodating device ST is carried into the accommodating device loading port 10 of the first layer portion 1 from the outside, the control unit CONT is placed on the -Z side of the substrate accommodating device ST, and the substrate accommodating device ST is loaded on the loading device. Face 42a. The substrate storage device ST is carried in from the storage device loading port 10 at a predetermined interval.

After the substrate housing device ST is loaded, the control device CONT moves the carriage 42 in the -Y direction to guide the substrate housing device ST to the substrate loading device 12. The control unit CONT moves the substrate housing device ST along the rail 42c formed on the carriage 42 to the +X side to insert the projection 29 into the port 129. In this state, the control unit CONT loads the substrate S from the substrate loading device 12 to the substrate housing device ST. This substrate S is housed in the substrate housing device ST in a state in which the tape L is attached as shown in FIG. 4 .

After the substrate S is housed in the substrate housing device ST, the control device CONT moves the carriage 42 to the lifting mechanism 43. Thereafter, the control unit CONT moves the elevating mechanism 43 to the +Z side, and transports the bogie 42 to the second layer portion 2. The control unit CONT moves the carriage 42 to the +Y side, and the carriage 42 is placed on the rail 41 of the second layer portion 2. After the movement of the carriage 42, the control unit CONT moves the elevating mechanism 43 to the -Z side, and then the substrate storage device ST to be carried in is placed in a standby state. In this way, the control device CONT transports the substrate housing device ST carried into the first layer portion 1 to the second layer portion 2 in order using the elevating mechanism 43.

The control unit CONT first arranges the carriage 42 that moves from the elevating mechanism 43 to the rail 41 in the second layer portion 2 on the -X side of the first substrate processing apparatus PR1. In this state, the control unit CONT fixes the position of the carriage 42 and moves the substrate housing unit ST to the +X side alone. By this operation, the protruding portion 29 is inserted into the connection port 39, and the substrate housing device ST is connected to each substrate processing device PR.

After the substrate housing device ST is connected to the first substrate processing device PR1, the control device CONT causes the substrate S to be discharged from the substrate carrying port EX of the substrate housing device ST. Further, the control unit CONT carries the discharged substrate S from the first 处理 30X of the first substrate processing apparatus PR1 into the inside of the first substrate processing apparatus PR1. The partition wall forming process is performed on the substrate S in the inside of the first substrate processing apparatus PR1.

After the first substrate processing apparatus PR1 has processed all the substrates S and the substrate S is housed in the storage chamber RM of the substrate housing apparatus ST, the control unit CONT moves the substrate housing apparatus ST to the -X side. By this operation, the connection between the substrate housing device ST and the first substrate processing device PR1 is released.

The control device CONT arranges the substrate housing device ST that has been disconnected from the first substrate processing device PR1 on the +X side of the second substrate processing device PR2, and connects the substrate housing device ST to the second substrate processing device PR2. The control device CONT processes the substrate S housed in the substrate housing device ST in the second substrate processing device PR2. After the end of the process, the connection with the second substrate processing apparatus PR2 is released.

Thereafter, the substrate housing device ST is sequentially connected to the third substrate processing device PR3 and the fourth substrate processing device PR4 to process the substrate S. The second substrate processing apparatus PR2, the third substrate processing apparatus PR3, and the fourth substrate processing apparatus PR4 perform processing as a process after the partition wall forming process performed by the first substrate processing apparatus PR1. Such a treatment includes, for example, an electrode formation treatment and a light-emitting layer formation treatment.

When the second substrate portion 2 is connected to the second substrate processing device PR2 after the processing of the first substrate processing device PR1 is completed, for example, the first substrate processing device PR1 becomes Empty state. Therefore, the control device CONT is connected to the first substrate processing device PR1 in the empty state even if the next substrate housing device ST is connected. In this way, by sequentially connecting the next substrate housing device ST to the empty substrate processing device PR for processing, the processing of the substrate S can be performed with high efficiency.

After the processing of each substrate processing apparatus PR (in the present embodiment, the processing by the fourth substrate processing apparatus PR4) is completed, the control unit CONT moves the carriage 42 to the +Y side and mounts it on the elevating mechanism 44. After the carriage 42 is mounted on the elevating mechanism 44, the control unit CONT moves the elevating mechanism 44 to the -Z side, and transports the bogie 42 and the substrate housing apparatus ST loaded on the bobbin 42 to the first layer portion 1. After the lifting mechanism 44 reaches the first layer portion 1, the control unit CONT moves the carriage 42 to the -Y side and arranges it on the rail 41 of the first layer portion 1. Further, after the carriage 42 is moved, the control unit CONT moves the elevating mechanism 44 to the +Z side, and the substrate housing apparatus ST that has finished the next process stands by.

The control unit CONT moves the carriage 42 disposed on the rail 41 from the elevating mechanism 44 in the first layer portion 1 to the front surface of the storage unit discharge port 11. In this state, the control unit CONT carries the substrate accommodation device ST on the carriage 42 out of the storage unit discharge port 11. After the substrate storage device ST is carried out, the carriage 42 is moved to the front side of the storage device loading port 10. In this state, the control unit CONT waits for the next substrate storage device ST that has been carried in from the storage device loading port 10. As described above, the trolley 42 moves in a manner to circulate between the first layer portion 1 and the second layer portion 2. The substrate storage device ST that has been carried out from the storage device outlet 11 to the outside is transported to another room (building) or factory, and is returned to the storage device loading port 10 in an empty state via the assembly step of the display elements.

According to the present embodiment, the plurality of substrate storage devices ST having the storage chamber RM in which the substrate S is housed are provided, and the connection ports 39 connected to the plurality of substrate storage devices ST are connected to the substrate storage device ST. In the state of the 埠39, the plurality of substrate processing apparatuses PR for processing the substrate S, the guiding device GD for guiding each of the plurality of substrate housing devices ST, and the plurality of substrate processing apparatuses PR, and the control guiding device GD are plural Since each of the plurality of substrate processing apparatuses PR is connected to the control unit CONT of each of the plurality of substrate processing apparatuses PR in a predetermined order, the substrate S accommodated in the substrate housing apparatus ST can be efficiently processed. According to this, it is possible to provide a substrate processing system SYS capable of obtaining a high throughput.

Moreover, since batch management for each predetermined length of the substrate S accommodated in the substrate housing apparatus ST can be performed, the production management can be improved and the down time can be reduced.

Further, the length of the substrate S may be determined in advance, for example, by the size of the display element and the number of display elements, and the substrate S of the size may be accommodated in the substrate housing device ST.

In this case, the length of the substrate S accommodated in the substrate housing device ST differs depending on the size of the display element and the number of display elements in each of the substrate housing devices ST.

Moreover, the control unit CONT can manage the processing time of the plurality of substrate processing apparatuses PR in consideration of the length of the substrate S accommodated in the substrate housing apparatus ST.

The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the scope of the invention.

In the above embodiment, the configuration in which a plurality of substrate processing apparatuses PR are provided on the +X side of the frame 40 has been described as an example, but the present invention is not limited thereto. For example, as shown in FIG. 8, one of the substrate processing apparatuses PR may be provided on the -X side of the frame 40.

In the configuration shown in Fig. 8, the third substrate processing apparatus PR3 and the fifth substrate processing apparatus PR5 are disposed in the X direction via the frame 40. The fifth substrate processing apparatus PR5 is a device that performs the same processing as the third substrate processing apparatus PR3. The fifth substrate processing apparatus PR5 is configured such that the connection port 39 faces the +X side.

The third substrate processing apparatus PR3 and the fifth substrate processing apparatus PR5 perform the same processing, for example, a droplet coating process, a vapor deposition process, an exposure process, a film formation process, an etching process, a surface modification process, and a cleaning process. For example, the third substrate processing apparatus PR3 and the fifth substrate processing apparatus PR5 may have such a processing function, and the apparatus manufacturing plant and the processing mechanism may be different.

Further, the third substrate processing apparatus PR3 is disposed on the +X side with respect to the frame 40 at intervals. A movable portion 45 movable in the X direction is provided at a position sandwiched by the third substrate processing apparatus PR3 and the fifth substrate processing apparatus PR5 in the frame 40. The movable portion 45 is movably provided on the rail 45a extending in the X direction. When the movable portion 45 slides to the +X side in a state where the substrate housing device ST is loaded, the substrate housing device ST is placed at a position connectable to the substrate processing device PR3.

A turntable 46 is disposed between the fifth substrate processing apparatus PR5 and the frame 40. The turntable 46 is provided to be rotatable about the Z axis by the second stage drive unit (not shown). A rail 46a connectable to the rail 45a is formed on the +Z side of the turntable 46. In the state where the connecting portion 46b connected to the rail 45a in the rail 46a is disposed on the +X side, the movable portion 45 can be moved to the turntable 46.

When the movable portion 45 is placed on the turntable 46, the turntable 46 is rotated by 180°, and the substrate transfer inlet EN and the substrate transfer opening EX of the substrate housing device ST mounted on the movable portion 45 are oriented toward the -X side. Therefore, the substrate housing device ST can be connected to the fifth substrate processing device PR5. With this configuration, for example, when the takt of the third substrate processing apparatus PR3 is low, a plurality of substrate processing apparatuses PR of the low-tempo processing can be arranged in parallel.

Further, in Fig. 8, between the third substrate processing apparatus PR3 and the fifth substrate processing apparatus PR5, the two movable portions 45 of the same structure are arranged in the X direction. The movable portion 45 of one of the movable portions 45 is connected to the third substrate processing apparatus PR3 and moved in the X direction, and the other movable portion 45 is connected to the fifth substrate processing apparatus PR3 by the substrate housing device ST. Move in the X direction.

Thus, by providing the two movable portions 45, both the third substrate processing device PR3 and the fifth substrate processing device PR5 can be used at the same time.

In order to fully utilize this advantage, although the turntable 46 is provided in FIG. 8, the arrangement of the turntable 46 may be omitted, and a movable portion for connecting the substrate housing device ST to the side of the fifth substrate processing apparatus PR5 may be provided instead. 45 A mechanism that moves in the X direction and rotates 180° around the Z axis. In this case, the rotatable movable portion 45 functions as a movable portion and a turntable to constitute a second stage that can be moved and rotated by the second stage driving portion (not shown).

For example, when the substrate receiving device ST is subjected to the next processing for the end of the processing of the second substrate processing apparatus PR, when the preceding substrate housing apparatus ST is connected to the third substrate processing apparatus PR3, the substrate housing apparatus is provided. The ST is connected to the fifth substrate processing apparatus PR5. According to this, the processing waiting time of the substrate housing device ST can be reduced. In this way, the guidance target of each substrate storage device ST can be set in accordance with the length of the processing time of the substrate processing apparatus PR, thereby preventing the takt of the entire substrate processing system SYS from being lowered.

Further, for example, as shown in FIGS. 9A and 9B, the fifth substrate processing apparatus PR5 may be arranged in a layer on the +Z side of the third substrate processing apparatus PR3. In the configuration shown in FIG. 9A, a lifting device (second stage) 90 that transports the substrate housing device ST between the third substrate processing device PR3 and the fifth substrate processing device PR5 is provided. The lifting device (second stage) 90 is provided so as to be movable up and down along the Z-axis by the second stage driving unit (not shown).

The lifting device 90 has an elevator 91 and a pillar portion 92. The lifter 91 has loading portions 91a and 91b on which the substrate housing device ST is mounted. The loading unit 91a and the loading unit 91b are provided in two layers in the Z direction. The interval between the loading portion 91a and the loading portion 91b is equal to the interval between the third substrate processing device PR3 and the fifth substrate processing device PR5.

Therefore, the substrate storage device ST is mounted on the mounting portion 91a and the loading portion 91b, respectively, that is, as shown in FIG. 9B, the substrate housing device ST mounted on the loading portion 91a and the substrate housing device ST mounted on the loading portion 91b are simultaneously Connected to the substrate processing apparatus PR.

In Fig. 9B, the protruding portion 29 of the substrate housing device ST mounted on the loading portion 91a is connected to the port 39 of the third substrate processing device PR3, and the protruding portion 29 of the substrate housing device ST mounted on the loading portion 91b is connected to the fifth portion. The connection of the substrate processing apparatus PR5 is 埠39. In this manner, a plurality of substrate processing apparatuses PR are arranged to overlap each other in the direction of gravity, and similarly to the configuration shown in FIG. 8, when the third substrate processing apparatus PR3 has a low beat, etc., a plurality of such lows can be set in parallel. The substrate processing apparatus PR of the process is tempered, and the overall beat of the substrate processing system SYS can be prevented from being lowered.

Further, in the above-described embodiment, the configuration in which the substrate processing apparatus PR is arranged in a straight line or a hierarchical shape has been described as an example, but the present invention is not limited thereto. For example, a plurality of substrate processing apparatuses PR may be arranged in the circumferential direction. In the configuration shown in Fig. 10, six substrate processing apparatuses PRA to PRF are disposed around an annular turntable (second stage) TTR formed in an annular shape. The ring-shaped turntable (second stage) TTR is set to be rotatable about the Z-axis by the second stage drive unit (not shown).

As shown in FIG. 10, the substrate processing apparatuses PRA to PRF are arranged along the circumferential direction of the ring-shaped turntable TTR, respectively. Each of the substrate processing apparatuses PRA to PRF is disposed at a position shifted by 45° in the circumferential direction of the ring-shaped turntable TTR. The substrate processing apparatuses PRA to PRF are disposed such that the respective ports 39 are oriented toward the outer peripheral side of the ring-shaped turntable TTR.

Rail portions 221 to 228 are formed on the ring-shaped turntable TTR. The rail portions 221 to 228 each have a pair of rails arranged in parallel. The rail portions 221 to 228 extend in a direction toward the center of the ring-shaped turntable TTR. The rail portions 221 to 228 are disposed at positions shifted by 45° in the circumferential direction of the ring-shaped turntable TTR.

The rail portions 221 to 228 are provided with eight mounting portions 211 to 218 on which the substrate housing device ST is mounted. In the state shown in FIG. 10, the loading units 211 to 216 are respectively disposed at positions facing the substrate processing apparatuses PRA to PRF. The loading unit 217 is disposed at a position where the substrate housing device ST is carried out from the ring-shaped turntable TTR. The loading unit 218 is disposed at a position where the substrate housing device ST is carried into the ring-shaped turntable TTR.

The loading portions 211 to 218 are provided to be movable in the extending direction of the rail portions 221 to 228. By moving the mounting units 211 to 216 disposed at the positions facing the substrate processing apparatuses PRA to PRF to the outer peripheral side of the ring-shaped turntable TTR while the substrate housing device ST is mounted, the loading units 211 to 216 are placed on the mounting portions 211 to 216. The substrate housing devices ST are connected to the substrate processing devices PRA to PRF, respectively. Moreover, the loading units 211 to 216 are moved from the state to the inner peripheral side of the ring-shaped turntable TTR, and the connection between the substrate storage apparatuses ST and the substrate processing apparatuses PRA to PRF is released.

When the connection between the substrate storage device ST and the substrate processing devices PRA to PRF is released, the ring-shaped turntable TTR is rotated by 45°, and each of the substrate housing devices ST is disposed adjacent to the previously connected substrate processing devices PRA to PRF. The position at which the substrate processing apparatuses PRA to PRF oppose each other. In this manner, each time the processing of the substrate housing apparatus ST is completed, the ring-shaped turntable TTR is rotated by 45°, for example, and the respective processes of the substrate processing apparatuses PRA to PRF are sequentially performed, that is, the processing can be performed efficiently.

Further, a center-shaped turntable TTC having a disk shape is provided at a central portion of the ring-shaped turntable TTR. The center turntable TTC is set to be rotatable in the circumferential direction. The rail portion 201 is formed on the center turntable TTC. The rail portion 201 has a pair of rails arranged in parallel in one direction.

The interval between one of the rail portions 201 and the rail is the same as the interval between one of the rail portions 221 to 228 provided in the ring-shaped turntable TTR. Therefore, the rail portion 201 and the rail portions 221 to 228 are connected depending on the angular position of the center turntable TTC.

When the rail portion 201 is connected to any of the rail portions 221 to 228, the loading portions 211 to 218 disposed on the rail portions 221 to 228 connected thereto can be moved to the center turntable TTC. Therefore, the substrate housing device ST can be temporarily retracted to the center turntable TTC. With this configuration, for example, when the processing of any of the substrate processing apparatuses PRA to PRF is temporarily interrupted, the substrate housing apparatus ST connected to the substrate processing apparatus PR interrupted by the processing can be temporarily evacuated to the center turntable TTC. on.

In this configuration, for example, the substrate housing device ST that has been processed by the substrate processing apparatus PR can be temporarily evacuated to the center turntable TTC, and the substrate housing device can be made depending on the progress of the processing of the other substrate processing apparatus PR. The ST is appropriately moved from the center turntable TTC to the other substrate processing apparatus PR.

Further, the configuration of the substrate housing device ST may be configured as shown in Fig. 11 in addition to the configuration of the above embodiment. In the configuration of FIG. 11, the rollers 101 to 121 of the plurality of rollers 101 to 123 of the guide substrate S are three times of the single-folded state of the substrate S shown in FIG. 2, and are disposed in the substrate S. Each of these locations.

Specifically, in the drum 106, the substrate S is folded back so that the first surface Sa of the substrate S faces each other. Here, a portion of the substrate S that is folded back to the downstream side of the drum 106 via the drum 106 is referred to as a first portion S1. Further, a portion of the substrate S that is folded back to the direction opposite to the first portion S1 via the drum 106 is referred to as a fourth portion S4.

In the drum 107, the first portion S1 is folded back in such a manner that the second surface Sb of the first portion S1 faces each other. Here, a portion of the substrate S that is folded back to the downstream side of the drum 107 via the drum 107 is referred to as a second portion S2.

In the drum 108 and the drum 109, this second portion S2 is directionally shifted toward the drum 106. Here, a portion of the substrate S that is direction-converted via the drum 108 and the drum 109 is referred to as a third portion S3.

In the drum 110, this third portion S3 is folded back along the fourth portion S4. At the same time, for example, in the moving state of the substrate S from the substrate carrying-in EN to the substrate-ejecting exit EX, the third portion S3 is folded back via the drum 110 so that the third portion S3 and the fourth portion S4 move in opposite directions.

In the middle of the drum 106 to the drum 110, the substrate S is folded back in the above manner. Therefore, the portion of the substrate S that is hung between the rollers 101 to 107 and the portion of the substrate S that is hung on the rollers 109 to 115 is in the Z direction and X. The directions are arranged at regular intervals. Similarly, the folding substrate S is substantially the same in the middle of the drum 113 to the roller 117. Therefore, the portion of the substrate S that is hung between the rollers 109 to 115 and the portion of the substrate S that is hung on the rollers 116 to 121 is in the Z direction. It is spaced apart from the X direction by a predetermined interval. In this way, the substrate S can be accommodated with good efficiency in a limited space of the storage chamber RM.

Further, in the above-described embodiment, the configuration of the guide device GD is described as an example in which the guide rail that circulates the bogie 42 is placed on the rail 41 of the frame 40. However, the present invention is not limited thereto. For example, a configuration of other guide rails such as a metal wire is used.

Further, the present invention is not limited to the configuration of the substrate housing device ST and the substrate processing device PR (PR1 to PR5, PRA to PRF) described in the above embodiments. Hereinafter, other configurations of the substrate housing device (substrate storage device) and the substrate processing device (processing device) will be described with reference to FIGS. 12 to 20 .

Fig. 12 is a view showing the internal structure of a substrate storage device (substrate storage device) STR.

As shown in FIG. 12, the substrate storage device STR includes a container CT that accommodates a flexible substrate S and a substrate transfer portion CV that mounts the substrate S. For example, the substrate storage device STR is housed in a container CT that is placed on a carriage 42 (not shown) through a wheel 28, and is stored in a state of being attached to the substrate transfer unit CV. The substrate S is formed to have an endless shape in the longitudinal direction.

The container CT is formed to have, for example, a substantially rectangular parallelepiped shape. Further, the wall portion CTa on the -X side of the container CT is formed such that the end portion on the +Z side is inclined to the +X side, for example. Further, the +X side end portion CTb of the container CT has a shape in which the +Z side end portion protrudes toward the +X side, for example. A storage chamber RM surrounded by a wall portion (including wall portions CTa and CTb) constituting the container CT is formed inside the container CT.

The container CT has a window portion W at the wall portion CTa. The window portion W is an opening portion that communicates with the outside of the container CT and the storage chamber RM and penetrates the wall portion CTa. The window portion W is disposed substantially at the center in the Z direction of the wall portion CTa. A connection portion J is provided in the wall portion CTa. The connection portion J is connected to, for example, a portion of the device-side connection portions 590 and 591 provided in an external device such as the processing device PA.

Further, a window member W to be described later is provided in the window portion W, and the door member is opened by the connection processing device PA, and is closed by the connection of the processing device PA. That is, in a state where the processing device PA is not connected, the shutter member prevents foreign matter such as dust and debris from entering the container CT.

The connecting portion J connects the processing device PA to the container CT in such a manner that the offset of the relative position of the processing device PA and the container CT is suppressed. The device side connecting portions 590 and 591 are connected to the edge portion of the window portion W in the wall portion CTa of the container CT. In this case, the connection portion J is provided at the edge of the window portion W so as to correspond to the connection position of the device-side connection portions 590 and 591. In this way, the connection portion J is provided on the wall portion CTa which is the same as the wall portion CTa of the installation window portion W, and is disposed around the window portion W.

In addition to the apparatus side connecting portions 590 and 591, the processing device PA is provided with grip rollers 592 and 593, a processing portion 595, and the like. The grip rollers 592 and 593 are disposed at positions sandwiching the treatment portion 595 in the Z direction. The +X side end of the holding roller 592 and the +X side end of the holding roller 593 are all in contact with a plane parallel to the YZ plane.

The processing unit 595 is formed to perform predetermined processing on the processing surface 595a indicated by a broken line in Fig. 12 . The processing surface 595a is set to be parallel to the YZ plane, and is set, for example, on a plane including the +X side end points of the grip rollers 592 and 593. The predetermined treatment includes, for example, a coating treatment, a film formation treatment, an exposure treatment, a development treatment, a heat treatment, a cooling treatment, and the like. Of course, it is also possible to carry out other processing.

The substrate transfer unit CV has a plurality of rolls R that are folded back into the substrate S in the storage chamber RM. Hereinafter, when a plurality of rollers R are distinguished, they are described as drums 511 to 566. Each of the rollers R has a shaft portion Ra parallel to the Y direction. Each of the rollers R is rotatably supported by, for example, a wall portion on the +Y side and the -Y side of the container CT. A cylindrical outer peripheral portion Rb for holding the accommodated substrate S is provided around the shaft portion Ra of each of the rollers R.

A plurality of rollers R are sequentially disposed in the transport path of the substrate S in the storage chamber RM. The plurality of rollers R are arranged vertically apart from the central portion of the storage chamber RM. In the present embodiment, the plurality of rollers R are disposed apart from the -Z side first portion RM1 in the Z direction central portion of the storage chamber RM and the +Z side second portion RM2 in the Z direction center portion of the relative storage chamber RM. .

In the first portion RM1 of the storage chamber RM, three rows of rollers R arranged in the X direction are provided in the Z direction. The rollers R constituting one row have the same diameter. Further, the closer to the +Z side from the -Z side, the closer to the center portion of the storage chamber RM in the Z direction, and the smaller the diameter of the drum R. Further, in addition to the row of the rollers R, a roller 512 and a roller 513 for switching the direction of the substrate S are also provided. Hereinafter, when the row of the rollers R of the first portion RM1 is distinguished, the first column L1 to the third row L3 are sequentially referred to from the -Z side to the +Z side of the storage chamber RM.

In the first portion RM, the rollers 529, 533, and 565 disposed on the most-X side of the rollers R of the first row L1, the second row L2, and the third row L3 are fixed by the roller supporting member 567. The drum support member 567 is disposed to be movable in the Z direction along the guide portion 568. The drum support member 567 is coupled to, for example, a drive mechanism 569. This drive mechanism 569 can slide the roller support member 567 in the Z direction. The amount of movement and the movement timing of the roller supporting member 567 by the driving mechanism 569 are controlled by, for example, the control unit CONT.

In the second portion RM2 of the storage chamber RM, three rows of rollers R arranged in the X direction are arranged in the Z direction. The rollers R constituting one row have the same diameter. Further, the closer to the -Z side from the +Z side to the -Z side, the smaller the diameter of the roller R is in the central portion in the Z direction of the storage chamber RM. In the second portion RM2, in addition to the row of the rollers R, a drum 511, a drum 531, and a drum 549 for converting the direction of the substrate S are also provided.

Further, the drum 511 disposed in the second portion RM2 and the drum 512 disposed in the first portion RM1 are disposed at positions where the window portion W is located in the Z direction. Hereinafter, when the column R of the second portion RM2 is distinguished, the fourth column L4 to the sixth column L6 are sequentially referred to from the -Z side to the +Z side of the storage chamber RM.

The substrate S is sequentially attached to the drum 511 to the drum 566, and is guided to the transport path of the storage chamber RM. In the present embodiment, since the substrate S is formed in an endless shape, the transport path is a path through which the storage chamber RM circulates. Hereinafter, the transport path of the substrate S will be described with the drum 511 as a starting point and the clockwise direction as a forward direction.

The substrate S attached to the drum 511 is bent toward the +X side via a drum 512 disposed on the -Z side of the drum 511. The substrate S is bent to the +Z side via the drum 513 disposed on the -Z side of the storage chamber RM and near the corner of the +X side on the downstream side of the drum 512. The downstream side of the drum 513 of the substrate S is bent to the -Z side via the drum 514 disposed on the most +X side in the fourth row L4 of the drum R.

The downstream side of the drum 514 of the substrate S is bent to the +Z side via the drum 515 disposed on the most +X side in the first row L1 of the drum R. The downstream side of the drum 515 of the substrate S is bent to the -Z side via the drum 516 disposed adjacent to the drum 514 on the -X side in the fourth row L4. The downstream side of the drum 516 of the substrate S is bent to the +Z side via the drum 517 disposed adjacent to the drum 515 on the -X side in the first row L1.

Thereafter, the rollers R (rollers 518, 520, 522, 524, 526, 528, and 530) passing through the fourth column L4 and the rollers R (the rollers 519, 521 of the first column L1) are alternately engaged in the -X direction. 523, 525, 527 and 529). The downstream side of the substrate S passing through the drum 530 on the most-X side in the fourth row L4 is bent to the -X side, and is hung on the direction changing roller 531.

The downstream side of the drum 531 of the substrate S is bent to the -Z side via the drum 532 disposed adjacent to the +Z side of the drum 530. Thereafter, the substrate S interacts in the +X direction via the rollers R (rollers 533, 535, 537, 539, 541, 543, 545, and 547) of the second column L2 and the rollers R of the fifth column R5 (the rollers 534, 536, Between 538, 540, 542, 544, 546, and 548). The downstream side of the substrate S passing through the roller 548 on the most +X side in the fifth row L5 is bent to the +X side, and is hung on the roller 549 for direction conversion.

The downstream side of the drum 549 of the substrate S is bent to the -Z side via the drum 550 disposed adjacent to the +Z side of the drum 548. Thereafter, the substrate S interacts in the -X direction via the rollers R (rollers 551, 553, 555, 557, 559, 561, 563, and 565) of the third column L3 and the rollers R of the fifth column R5 (the rollers 552, 554, Between 556, 558, 560, 562, 564 and 566). The downstream side of the substrate S passing through the drum 566 on the most-X side in the sixth row L6 is bent to the -Z side, and is hung on the drum 511.

In the above configuration, since the drum 511 and the drum 512 are disposed at positions sandwiching the window portion W in the Z direction, the portion between the drum 511 and the drum 512 which are hung on the substrate S of the drum 511 and the drum 512 is disposed. The surface on the -X side (the second surface Sb of the substrate S) is exposed at the position of the window portion W.

Further, the substrate transfer portion CV has a substrate support portion SP. The substrate support portion SP is disposed at a position sandwiching the substrate S between the window portion W of the container CT. The substrate support portion SP is disposed between the drum 511 and the drum 512 in the Z direction. The substrate supporting portion SP has a support plate 571 that supports the first surface Sa of the substrate S, a pair of support rollers 572 and 573, and a support member 574 that supports the support plates 571 and the support rollers 572 and 573.

The support plate 571 has a support surface 571a formed on the -X side. The support surface 571a is formed flat. The support plate 571 is configured such that the support surface 571a is parallel to the YZ plane. In this state, the support surface 571a is disposed to face the first surface Sa of the substrate S.

The support rollers 572 and 573 are disposed at positions sandwiching the support plate 571 in the Z direction. The support rollers 572 and 573 are formed in a cylindrical shape or a cylindrical shape. The support rollers 572 and 573 are arranged such that the central axis is parallel to the Y direction. The Y-direction dimensions of the support rollers 572 and 573 are larger than the Y-direction dimension of the substrate S. The support rollers 572 and 573 are supported by the support member 574 so as to be rotatable in the circumferential direction.

The support member 574 is fixed integrally to prevent the support plate 571 and the support rollers 572 and 573 from moving independently in the X direction, the Y direction, and the Z direction. In the state supported by the support member 574, the -X side end portion (the point of the support substrate S) of each of the support rollers 572 and 573 is disposed on the same plane as the support surface 571a. Therefore, the substrate S is supported by the support surface 571a and the two support rollers 572 and 573 which are disposed in the same plane shape as the support surface 571a.

The support member 574 is disposed to be movable in the X direction. The substrate transfer unit CV has a drive mechanism 575 that can move the support member 574 in the X direction. By controlling the drive mechanism 575, the control unit CONT can adjust the amount of movement of the support member 574 in the X direction, the movement timing, and the like.

Next, the operation of the substrate storage device STR configured as described above will be described. Here, a case where the substrate S stored in the substrate storage device STR is processed will be described as an example.

Fig. 13 is a view showing an example of the operation of the substrate storage device STR.

As shown in FIG. 13, when the substrate S stored in the substrate storage device STR is processed, first, the device-side connecting portions 590 and 591 of the external processing device PA are connected to the connection portion J of the substrate storage device STR. .

After the connection of the processing device PA is completed, the control device CONT controls the drive mechanism 575 to move the support member 574 in the -X direction. By this action, the support rollers 572 and 573 are in contact with the first surface Sa of the substrate S, and the first surface Sa is pulled out toward the -X side. The control device CONT moves the support member 574 to a position where the substrate S is held between the support rollers 572, 573 and the clamp rollers 592, 593.

Due to the movement of the support member 574, the portion of the substrate S held by the support roller 572 and the grip roller 592, and the portion Sc between the portion supported by the support roller 573 and the grip roller 593 are pulled up from the window portion W. The outside of the storage chamber RM is in a state in which the processing unit 595 of the processing unit PA is exposed.

The exposed portion Sc is supported by the support surface 571a of the support plate 571, and is disposed parallel to the YZ plane along the support surface 571a. Further, the exposed portion Sc is disposed along the support surface 571a, and is placed on the processing surface 595a of the processing portion 595 of the processing apparatus PA.

On the other hand, by the above operation, the transport path of the substrate S changes from the state of FIG. Specifically, the transport path along the -X side wall portion CTa of the substrate storage device STR, that is, the long exposed portion Sc is pulled out from the window portion W to the outside of the substrate storage device STR. On the other hand, the substrate S stored in the substrate storage device STR is formed in an endless shape, and its length is constant. Therefore, the tension of the substrate S must be adjusted to avoid excessive tension applied to the substrate S.

To this end, the control unit CONT controls the drive mechanism 569 to move the roller support member 567 to the +Z side. By this action, the rollers 529, 533, and 565 move along the guide portion 568 toward the +Z side together with the roller support member 567. Therefore, the transport path of the portion of the substrate S that is hung on the rollers 529, 533, and 565 is shortened.

In this case, the control unit CONT adjusts at least one of the amount of movement of the support member 574 and the amount of movement of the roller support member 567 so that the amount of change in the conveyance path of the substrate S that changes due to the movement of the support member 574 is dependent on the roller support member 567. The amount of change in the transport path that changes as it moves is equal. By this operation, the path length of the transport path of the substrate S is maintained constant, so that excessive tension is not applied to the substrate S.

As described above, after the substrate S is placed on the processing surface 595a of the processing unit 595 while maintaining the path length of the transport path of the substrate S, the processing unit 595 performs processing on the second surface Sb of the substrate S. After the completion of the process, the control unit CONT controls the drive mechanism 569 and the drive mechanism 575 to return the roller support member 567 and the support member 574 to their original positions while keeping the path length of the transport path of the substrate S constant. Thereafter, the device side connecting portions 590 and 591 are detached from the connecting portion J, and the processing device PA is withdrawn from the substrate storage device STR. In this way, the processing of the substrate S is performed.

As described above, according to the present embodiment, the container CT having the storage chamber RM having the substrate S having the endless shape of the storage device, the window portion W provided in the container CT, and the housing portion are housed in the storage chamber. Since one portion Sc of the substrate S of the RM and the substrate portion W are transferred to the substrate transport portion CV of the substrate S, the substrate portion S can be exposed to the outside of the storage chamber RM without exposing the remaining portion of the substrate S. According to this, since the exposure range of the substrate S can be suppressed, it is possible to prevent foreign matter such as dust from adhering to the substrate S.

Further, when the surface of the substrate S is not processed, the window member can be closed to maintain dustproofness.

Further, according to the present embodiment, since the processing apparatus PA is connected to the substrate storage device STR while the substrate S is stored in the storage chamber RM, the substrate S is processed, so that it is less likely to adhere to the substrate S in a foreign matter. The environment is processed. According to this, it is possible to prevent foreign matter from adhering to the substrate S.

Fig. 14 is a view showing the configuration of the substrate storage device STR2. In the substrate storage device STR2, the configuration of the container CT in the vicinity of the window portion W is different from that of the substrate storage device STR. Therefore, the description will be focused on this point.

As shown in FIG. 14, the substrate storage device STR2 has pull-out portions 670 and 671 for pulling the substrate S from the window portion W to the outside. The pull-out portions 670 and 671 have robot arm portions 674 and 675 attached to the inner peripheral portion of the window portion W. The mechanical arm portion 674 is attached to the inner circumferential surface of the window portion W on the +Z side. The mechanical arm portion 675 is attached to the side of the window portion W on the -Z side.

The arm portions 674 and 675 are provided to be rotatable in the θY direction about the mounting position. The arm portions 674 and 675 are connected to the arm driving portions 676 and 677, respectively. The arm driving units 676 and 677 have, for example, a motor mechanism (not shown). The control unit CONT can control the driving amount and the driving timing by the arm driving units 676 and 677.

Guide rollers 672 and 673 are attached to the front end portions of the robot arms 674 and 675. The guide rollers 672 and 673 are formed in a cylindrical shape, and are arranged such that the central axis is parallel to the Y axis. The guide rollers 672 and 673 are provided to be rotatable in the circumferential direction (θY direction). Further, a mounting portion 678 for attaching the external processing device PA to the container CT is formed. Further, instead of the mounting portion 678, an opening for arranging the external processing device PA may be formed.

When the substrate S is pulled out to the outside of the window portion W from this state, the control unit CONT controls the arm driving portions 676 and 677 so that the mechanical arm portion 674 is in the counterclockwise direction in the drawing, and the mechanical arm portion 675 is clockwise in the figure. Rotate. With the rotational movement of the mechanical arm portion 674 and the mechanical arm portion 675, the guide rollers 672 and 673 attached to the front end portions of the mechanical arm portion 674 and the mechanical arm portion 675 pull the substrate S, and pull the substrate S to the window portion W. Outside.

FIG. 15 is a view showing a state in which the substrate S is pulled out from the window portion W to the outside of the storage chamber RM by the drawing portions 670 and 671.

As shown in FIG. 15, in a state in which the substrate S is pulled out, the front ends of the arm portions 674 and 675 are arranged to face the -X side.

The substrate S is exposed on the outer side of the window portion W in a state of being hung on the guide rollers 672 and 673. The second surface Sb of the exposed portion Sc between the guide rollers 672 and 673 of the substrate S is pressed against the support surface 679a of the substrate supporting member 679. The support surface 679a is formed as, for example, a curved surface that protrudes toward the +X side. The exposed portion Sc is pressed against the support surface 679a by the pressure-bonding support surface 679a, and is in a state of being bent toward the +X side. Further, the substrate supporting member 679 is, for example, a rotating cylinder.

Further, due to the operation of the mechanical arm portions 674 and 675, the path length of the transport path along the substrate S of the portion of the wall portion CTa becomes longer. Therefore, the control unit CONT controls the drive mechanism 569 to move the roller support member 567 toward the +Z side along the guide portion 568 to adjust the path length of the transport path of the substrate S. Further, in the substrate storage device STR2, the roller support member 567 can be moved over a wide range in the Z direction as compared with the substrate storage device STR. Thus, the adjustment amount of the path length of the transport path of the substrate S is large.

After the substrate S is pulled out to the outside of the storage chamber RM, the processing device PA is placed in the attachment portion 678 of the container CT. In a state where the processing device PA is attached to the mounting portion 678, the processing portion 695 faces the -X side of the window portion W. Therefore, the exposed portion Sc is disposed in the opposing position of the processing portion 695 as viewed from the X direction. In this state, the processing unit 695 processes the first surface Sa of the substrate S.

After the processing by the processing unit 695, the processing device PA is removed from the mounting portion 678. After the treatment device PA is removed, the control unit CONT accommodates the arm portions 674 and 675 in the storage chamber RM of the container CT while moving the roller support member 567 toward the -Z side. By this operation, the substrate S is accommodated in the storage chamber RM together with the mechanical arm portions 674 and 675 while keeping the path length of the transport path of the substrate S constant.

As described above, in the present embodiment, the substrate S is largely pulled out from the window portion W by the robot arm portions 674 and 675, and an external device such as the processing device PA is attached between the exposed portion Sc of the substrate S and the container CT. With this configuration, the first surface Sa of the substrate S can be processed.

Further, in the present embodiment, since the substrate S is supported by the substrate supporting member (for example, the rotating drum) 679 having the columnar supporting surface 679a formed thereon, the substrate S can be disposed in the processing portion 695 in a shape corresponding to the shape of the supporting surface 679a. The opposite position. For example, when the support surface 679a is a flat surface, the substrate S is placed in a flat state at the opposing position of the processing portion 695.

The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention.

For example, in the above-described embodiment, the window portion W is disposed on the wall portion CTa. However, the present invention is not limited thereto. For example, as shown in FIG. 16, the window portion W may be disposed on the wall portion CTb or another wall portion.

Further, in the above-described embodiment, the window portion W is provided in one of the containers CT. However, the configuration is not limited thereto, and as shown in FIG. 16, the window portion W may be provided at a plurality of places of the container CT. In this case, a plurality of window portions W may be disposed in one wall portion, or one or a plurality of window portions W may be provided in each of the plurality of wall portions.

Further, in addition to the configuration of the above embodiment, as shown in Fig. 17, a window member may be provided in the window portion W. As the door member, in Fig. 17, it may be the slider SL of the switch window portion W. The slider SL is connected to the slide driving unit 700. The slide driving unit 700 can control the driving amount and the timing (timing) of the driving by the control of the control unit CONT.

In this configuration, the control unit CONT can open and close the window portion W depending on the connection state with the external processing device. In this case, when the external processing device is connected to the connection portion J, the control device CONT moves the slider SL to the -Z side to open the window portion W. Further, when the connection between the external processing device and the connection portion J is released, the control device CONT moves the slider SL to the +Z side to close the window portion W. According to this, it is possible to prevent foreign matter such as dust from entering the storage chamber RM.

Further, in the above-described embodiment, the configuration in which the drum R is disposed in contact with both the first surface Sa and the second surface Sb of the substrate S has been described as an example, but the invention is not limited thereto. For example, it may be configured to contact the first surface Sa of the substrate S without contacting the second surface Sb.

As an example of this, as shown in FIG. 18, for example, the configuration of the substrate S is performed by using the guide members 701 and 702 formed in a right-angled equilateral triangle shape. As shown in FIG. 18, the substrate transfer unit CV has two transfer units CV1 and CV2. In the transport unit CV1 on the +X side in the figure, the substrate S is bent inward in a spiral shape (+X side in the drawing) so as to contact only the first surface Sa via a plurality of rollers R, and then bent through the roller R1. The guide member 701 is folded.

In the conveyance unit CV1, the substrate S is bent by one side 701a of the guide member 701 on the downstream side of the drum R1. The substrate S is bent at an angle of 45° by the oblique side 701b of the guiding member 701 on the downstream side of the one side 701a. Further, the downstream side of the oblique side 701b of the substrate S is bent toward the other side 701c of the guided member 701, and then faces the guiding member 702. In this way, the first face Sa of the substrate S is wound around the guiding member 701 in this manner.

On the other hand, the portion of the substrate S facing the guiding member 702 is bent at one side 702a of the guiding member 702, and is bent along the oblique side 702b and the other side 702c in the same manner as in the case of the guiding member 701. The substrate S faces the drum R2 on the downstream side of the other side 702c. The first face Sa of the substrate S is wound around the guiding member 702 in this manner.

The substrate S is bent toward the outside in a spiral shape via a plurality of rollers R on the downstream side of the drum R2, and then faces the conveying portion CV2 on the -X side in the drawing. The configuration of the transport unit CV2 is the same as that of the transport unit CV1 described above. In other words, the substrate S is bent into a spiral shape only in contact with the first surface Sa of the substrate S, and the roller R1, the guiding members 701 and 702, and the roller R2 are provided at the center portion.

As shown in Fig. 18, the substrate S is bent so that the first surface Sa is in contact with the rollers R, R1, R2 and the guiding members 701, 702, and the second surface Sb is not in contact with the rollers and the guiding members. In such a configuration, since the substrate transfer portion CV can transport the substrate S without contacting the surface of the second surface Sb of the substrate S, the state of the second surface Sb can be protected.

Further, the configuration of the guiding members 701 and 702 is not limited to the configuration of the right-angled equilateral triangle, and for example, the cylindrical drum may be disposed on each side of the right-angled equilateral triangle.

Further, as shown in FIG. 19, for example, the configuration shown in FIG. 18 may be formed so as to overlap in the Y direction. In this case, the transport units CV3 and CV4 are provided on the +Y side of the transport units CV1 and CV2. The conveyance unit CV1 and the conveyance unit CV3 have the same configuration, and the conveyance unit CV2 and the conveyance unit CV4 have the same configuration. The direction changing rollers 801 to 804 are disposed between the transport units CV1 and CV2 and the transport units CV3 and CV4.

After being wound around the conveyance units CV1 and CV2, the substrate S is direction-converted by the direction change rollers 801 and 802 to the conveyance units CV3 and CV4. After the substrate S is wound around the conveyance units CV3 and CV4, the direction change rollers 803 and 804 are direction-converted, and are again wound around the conveyance unit CV1 and the conveyance unit CV2. Further, it is always the first surface Sa of the substrate S that is wound around the direction changing rollers 801 to 804. In this way, the substrate S circulates between the transport portion CV1 and the transport portion CV4.

In the configuration shown in Fig. 19, the substrate S is housed in two layers in the Y direction. In this case, the windows W1 and W2 may be arranged side by side in the Y direction. Since each of the substrates S in which the two layers are arranged in the Y direction can be processed separately, the processing efficiency can be improved.

Further, as shown in FIG. 20, for example, a plurality of configurations may be arranged in the X direction and the Z direction in the configuration shown in FIG. 18. In this case, the transport units CV3 and CV4 are provided on the -Z side of the transport units CV1 and CV2. Further, the transport unit CV1 and the transport unit CV3 have the same configuration, and the transport unit CV2 and the transport unit CV4 have the same configuration. In the configuration shown in FIG. 20, for example, the respective window portions W1 to W4 may be provided for each of the transport units CV1 to CV4. In this way, since processing can be performed at a plurality of places, processing efficiency can be improved.

Further, in addition to the configuration of the above-described embodiment, the processing unit may be provided in the storage chamber RM of the substrate storage device STR, for example. In this case, for example, a processing unit that performs various processes such as a plating process, a washing process, a drying process, and a heat treatment on the substrate can be disposed. As shown in FIG. 18, when the second surface Sb of the base substrate S does not contact the substrate transfer portion CV, the processing portion PA2 that processes the second surface Sb may be provided in the storage chamber RM.

Further, in the above-described embodiment, the storage device for storing the substrate having the endless longitudinal direction is described, but the configuration is not limited thereto. For example, a supply roller, a recovery roller, a plurality of rollers for conveying the substrate wound on the supply roller to the window portion W1, and a substrate for the transmission window portion W1 may be disposed in the container CT. The substrate is wound and the substrate is sent to a plurality of rollers of the recovery drum to store the substrate conveyed by roll to roll.

Further, in the above-described embodiment, the configuration in which the drum R is disposed such that the central axis is parallel to the Y direction has been described as an example, but the invention is not limited thereto. For example, the drum R may be arranged such that the central axis is parallel to the X direction or the Z direction, and the present invention is also applicable.

Further, for example, in the embodiment shown in FIGS. 18, 19, and 20, a mechanism for shortening the transport path used in the substrate storage device STR and the substrate storage device STR2 may be employed. In other words, when the substrate is pulled out and exposed to the substrate by the processing device, the transfer path is shortened by moving the roller so that the path length of the substrate transfer path is maintained constant.

1‧‧‧ first floor

2‧‧‧Second floor

10‧‧‧ containment device entrance

11‧‧‧ containment device

12‧‧‧Substrate loading device

20‧‧‧Container (housing)

20a‧‧‧One of the walls of the container

22‧‧‧ moving into the drum

23‧‧‧ Directional change roller

24‧‧‧Departure

24a~24h‧‧‧Folding roller

25‧‧‧ moving out of the drum

29‧‧‧Protruding

30N‧‧‧ discharge line (substrate insertion part)

30X‧‧‧ Pull-in (receipt 基板, substrate pull-out)

39‧‧‧Links

40‧‧‧ frame

41‧‧‧ Track

42‧‧‧Trolley (stage)

42c‧‧‧ track

43, 44‧‧‧ Lifting mechanism

126‧‧‧Cutter

567‧‧‧Roll support member

568‧‧‧Guidance Department

569, 575‧‧‧ drive mechanism

571a‧‧‧ support surface

590, 591‧‧‧ device side connection

592, 593‧‧‧Clamping roller

595‧‧‧Processing Department

595a‧‧‧Processing surface

672, 673‧‧‧ Guide roller

674, 675‧‧ mechanical arm

676, 677‧‧‧ Arm drive department

678‧‧‧Installation Department

679‧‧‧Substrate support member

679a‧‧‧support surface

695‧‧‧Processing Department

700‧‧‧Sliding drive department

701, 702‧‧‧ Guided components

CONT‧‧‧ control device

CT‧‧‧ container

CTa, CTb‧‧‧ wall

CV‧‧‧Substrate Transfer Department

EN‧‧‧Substrate entrance

FL‧‧‧ Ground

GD‧‧‧ guiding device

J‧‧‧Connecting Department

PR, PR1~PR5, PRA~PRF, PA‧‧‧ substrate processing device (processing device)

R‧‧‧Roller

RM‧‧‧ containment room

S‧‧‧Substrate

Sa‧‧‧ The first side of the substrate S

The second side of the Sb‧‧‧ substrate S

SP‧‧‧Substrate support

ST, STR, STR2‧‧‧ substrate storage device (substrate storage device)

SYS‧‧‧ substrate processing system

W, W1, W2‧‧‧ Window Department

Fig. 1 is a front elevational view showing the overall configuration of a substrate processing system according to an embodiment of the present invention.

Fig. 2 is a view showing the configuration of a substrate housing device of the embodiment.

Fig. 3 is a view showing the configuration of a substrate loading apparatus of the embodiment.

Fig. 4 is a view showing the structure of a substrate of the embodiment.

Fig. 5 is a view showing a partial configuration of a substrate processing system of the embodiment.

Fig. 6 is a view showing a partial configuration of a substrate processing system of the embodiment.

Fig. 7 is a view showing the configuration of a substrate processing apparatus of the embodiment.

Fig. 8 is a view showing a partial configuration of a substrate processing system according to another embodiment of the present invention.

Fig. 9A is a view showing a partial configuration of a substrate processing system according to another embodiment of the present invention.

Fig. 9B is a view showing a partial configuration of a substrate processing system according to another embodiment of the present invention.

Fig. 10 is a view showing a part of the configuration of a substrate processing system according to another embodiment of the present invention.

Figure 11 is a view showing a part of the configuration of a substrate processing system according to another embodiment of the present invention.

Fig. 12 is a cross-sectional view showing the internal structure of a substrate storage device.

Fig. 13 is a cross-sectional view showing an operation example of one of the substrate storage devices.

Fig. 14 is a cross-sectional view showing the configuration of another substrate storage device.

Fig. 15 is a cross-sectional view showing an operation example of another substrate storage device.

Fig. 16 is a view showing another example of the substrate storage device.

Fig. 17 is a view showing another example of the substrate storage device.

Fig. 18 is a view showing another example of the substrate storage device.

Fig. 19 is a view showing another example of the substrate storage device.

Fig. 20 is a view showing another example of the substrate storage device.

1‧‧‧ first floor

2‧‧‧Second floor

2a‧‧‧ wall

10‧‧‧ containment device entrance

11‧‧‧ containment device

12‧‧‧Substrate loading device

30N‧‧‧ discharge line (substrate insertion part)

30X‧‧‧ Pull-in (receipt 基板, substrate pull-out)

40‧‧‧ frame

41‧‧‧ Track

42‧‧‧Trolley (stage)

42c‧‧‧ track

43, 44‧‧‧ Lifting mechanism

CONT‧‧‧ control device

FL‧‧‧ Ground

GD‧‧‧ guiding device

PR (PR1~PR4)‧‧‧Substrate processing device (processing device)

ST‧‧‧Substrate storage device (substrate storage device)

SYS‧‧‧ substrate processing system

Claims (13)

A substrate processing system for forming an electronic component on a long flexible sheet substrate, comprising: a plurality of substrate housing devices; and a housing chamber surrounded by a wall portion for accommodating the sheet substrate of a predetermined length; The sheet substrate is formed in the opening portion of the wall portion so as to be carried out from the storage chamber in the longitudinal direction, and is carried into the housing chamber in the longitudinal direction, or a part of the sheet substrate is exposed to the housing. The outdoor unit is formed in a window portion of one of the wall portions; the plurality of substrate processing apparatuses include a connection portion connectable to the opening or the window portion of the substrate housing device, and one of the substrate housing devices is connected to the In the state of the connection portion, the sheet substrate is taken out from the opening portion and subjected to a predetermined process, and then returned to the storage chamber through the opening portion, or a predetermined process is performed on a portion of the sheet substrate exposed to the window portion. The guiding device is configured to connect each of the plurality of substrate housing devices to each of the plurality of substrate processing devices Guide; and a control means for controlling the guiding means to the receiving means of each of a plurality of substrates, respectively, and each of the plurality of substrate processing apparatus connected in a predetermined order. The substrate processing system according to the first aspect of the invention, wherein the plurality of substrate processing apparatuses include a first substrate processing apparatus that performs the first processing on the sheet substrate, and performs the first step on the sheet substrate a second substrate processing apparatus that processes the second processing of the subsequent processing; the control apparatus controls the guiding apparatus to connect the substrate housing apparatus that accommodates the sheet substrate before the first processing in the plurality of substrate housing apparatuses In the first substrate processing apparatus, the substrate housing device that accommodates the sheet substrate subjected to the first processing in the plurality of substrate housing devices is connected to the second substrate processing apparatus. The substrate processing system according to the first or second aspect of the invention, wherein the opening has a substrate carrying inlet for loading the sheet substrate into the storage chamber, and a substrate carrying port for carrying out the sheet substrate from the storage chamber; The plurality of substrate processing apparatuses include a substrate pull-out portion that pulls the sheet substrate accommodated in the storage chamber from the substrate carry-out port to the outside, and processes the substrate pulled out by the substrate pull-out portion. And the sheet substrate processed by the processing unit is inserted into the substrate insertion portion of the storage chamber from the substrate carrying inlet. The substrate processing system of claim 3, wherein each of the plurality of substrate processing apparatuses has a housing having a plurality of wall surfaces; the connecting portion is provided on one of the wall surfaces; and the substrate drawing portion At least one of the substrate insertion portions is provided on the one wall surface. The substrate processing system according to claim 1, wherein the guiding device includes a stage that supports each of the plurality of substrate housing devices, and a stage driving unit that drives the stage. The substrate processing system of claim 5, wherein the guiding device has a guiding rail for guiding the stage; the guiding rail is arranged such that the stage can be cycled between the plurality of substrate processing devices . The substrate processing system of claim 6, wherein the guiding device includes a second stage that supports the plurality of substrate housing devices, and a second stage driving unit that drives the second stage. The substrate processing system of claim 7, wherein the second stage is rotatably arranged along an arrangement direction of the plurality of substrate processing apparatuses; and the plurality of substrate housing apparatuses are arranged in the foregoing The second stage is placed on the second stage in such a manner that the rotation direction of the stage is two. The substrate processing system according to claim 1, wherein the plurality of substrate processing apparatuses are arranged in a plurality of overlapping directions in the gravity direction. The substrate processing system according to claim 1, wherein the control device sets a guidance target of the substrate housing device based on a length of processing time of each of the plurality of substrate processing devices. The substrate processing system according to claim 1, wherein the plurality of substrate housing devices accommodate sheet substrates having different lengths. The substrate processing system of claim 1, wherein the plurality of substrate processing apparatuses include a plurality of substrate processing apparatuses that perform the same processing; In the above-described guiding device, the substrate housing device is transported to any one of a plurality of substrate processing devices that perform the same processing. A method of manufacturing a display element for forming a display element on a long flexible sheet substrate, comprising: a step of preparing the sheet substrate; and using any one of claims 1 to 12 The substrate processing system of the item forms a display element on the sheet substrate; and the assembly step of the display element.