TW201617218A - Laminated sheet and manufacturing method of the laminated sheet - Google Patents

Laminated sheet and manufacturing method of the laminated sheet Download PDF

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TW201617218A
TW201617218A TW104122311A TW104122311A TW201617218A TW 201617218 A TW201617218 A TW 201617218A TW 104122311 A TW104122311 A TW 104122311A TW 104122311 A TW104122311 A TW 104122311A TW 201617218 A TW201617218 A TW 201617218A
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layer
adhesive
laminated sheet
laminated
sheet
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TWI688473B (en
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中西健一
池谷達宏
新井良和
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昭和電工股份有限公司
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  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

The present invention provides a laminate sheet which is available to adhere to a heating element easily and is usable as a heat spreader which has high emission properties, and a manufacturing method of the laminated sheet. The present invention provides a laminated sheet (10), which includes a metal sheet layer (1) and an adhesive layer (2), wherein the metal sheet layer includes a metal layer (12) and a heat radiation layer (11) which comprises a heat radiation filler (C) and a binder component (D), and wherein the adhesive layer (2) includes an adhesive resin composition (A) and a heat conductive filler (B), and the adhesive layer (2) is provided on the surface of the metal sheet layer (1) at the side where the metal layer is provided.

Description

層合薄片及層合薄片之製造方法 Laminated sheet and method for manufacturing laminated sheet

本發明係關於在半導體晶片、電晶體、冷凝器等之電子零件、及將來自電池之發熱進行輻射者所具備的層合薄片及層合薄片之製造方法。 The present invention relates to a method of manufacturing an electronic component such as a semiconductor wafer, a transistor, or a condenser, and a laminated sheet and a laminated sheet provided by radiation from a battery.

近年來,於半導體晶片、電晶體、冷凝器等之電子零件、電池(battery)等之電氣零件中係發展更加高性能化。伴隨此,電子零件或電氣零件之發熱量逐漸增大。若電子零件或電氣零件成為高溫,則有壽命變短,或可靠性降低的情況。 In recent years, in electronic components such as semiconductor wafers, transistors, and condensers, and electric components such as batteries have been developed to have higher performance. Along with this, the amount of heat generated by the electronic component or the electrical component gradually increases. If the electronic component or the electrical component is at a high temperature, the life may be shortened or the reliability may be lowered.

因此,以往,於電子零件或電氣零件係安裝有使此等所產生的熱散熱的散熱片或散熱器(heat spreader)。作為散熱器係多使用有在鋁箔或銅箔等之具有熱傳導性的金屬箔上貼合黏著膠帶者等。 Therefore, conventionally, a heat sink or a heat spreader that dissipates heat generated by such heat is attached to an electronic component or an electrical component. As the heat sink system, an adhesive tape or the like is bonded to a metal foil having thermal conductivity such as aluminum foil or copper foil.

例如,於專利文獻1中係揭示有:將黏著劑層與熱輻射薄片層合而成的除熱用散熱薄片,該熱輻射薄片係在由鋁或鋁合金所成之層上設置熱輻射層。 For example, Patent Document 1 discloses a heat-dissipating heat-dissipating sheet obtained by laminating an adhesive layer and a heat-radiating sheet, and the heat-radiating sheet is provided with a heat radiation layer on a layer made of aluminum or an aluminum alloy. .

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2005-101025號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-101025

然而,專利文獻1所揭示的熱輻射層係由於塗敷有氧化鋁,因此並非可得到充分的熱輻射性者。 However, the heat radiation layer disclosed in Patent Document 1 is not coated with alumina, and thus is not sufficient in heat radiation.

本發明係鑑於上述情事而完成者,提供一種可容易接合於電子零件等之發熱體,進而將所產生的熱有效率地擴散、散熱之層合薄片、對應於各種電子零件的小型輕量化及薄型化之層合薄片及該層合薄片之製造方法。 The present invention has been made in view of the above circumstances, and provides a laminated body which can be easily joined to a heat generating body such as an electronic component, and which efficiently diffuses and dissipates heat generated, and which is small and lightweight in accordance with various electronic components. A thinned laminated sheet and a method of producing the laminated sheet.

本發明係將以下之(1)~(13)作為要旨。 The present invention has the following (1) to (13) as its gist.

(1)一種層合薄片,其特徵為,含有:由含有熱輻射填料(C)及黏合劑成分(D)之熱輻射層與金屬層所構成的金屬薄片層,以及層合於該金屬薄片層之金屬層側之面的黏著層,該黏著層係含有黏著樹脂組成物(A)與熱傳導性填料(B)。 (1) A laminated sheet comprising: a metal foil layer composed of a heat radiation layer containing a heat radiation filler (C) and a binder component (D) and a metal layer, and laminated to the metal foil An adhesive layer on the side of the metal layer side of the layer, the adhesive layer comprising an adhesive resin composition (A) and a thermally conductive filler (B).

(2)如(1)之層合薄片,前述熱輻射填料(C)為碳質材料。 (2) The laminated thin film of (1), wherein the heat radiation filler (C) is a carbonaceous material.

(3)如(2)之層合薄片,其中,前述碳質材料係由 碳黑、石墨及氣相法碳纖維中選出的1種或2種以上。 (3) The laminated sheet according to (2), wherein the carbonaceous material is One or two or more selected from the group consisting of carbon black, graphite, and gas phase carbon fiber.

(4)如(1)~(3)中任一項之層合薄片,其中,前述黏合劑成分(D)係含有高分子多醣類及酸交聯劑。 (4) The laminated sheet according to any one of (1) to (3), wherein the binder component (D) contains a polymer polysaccharide and an acid crosslinking agent.

(5)如(4)之層合薄片,其中,前述高分子多醣類係由幾丁質、幾丁聚醣及其衍生物中選出的1種或2種以上,前述酸交聯劑係由苯均四酸、偏苯三甲酸、馬來酸、鄰苯二甲酸及該等之酸酐中選出的1種或2種以上。 (5) The laminated thin film according to (4), wherein the polymer polysaccharide is one or more selected from the group consisting of chitin, chitosan and derivatives thereof, and the acid crosslinking agent is One or two or more selected from the group consisting of pyromellitic acid, trimellitic acid, maleic acid, phthalic acid, and the like.

(6)如(1)~(5)中任一項之層合薄片,其中,前述熱輻射層之平均厚度為0.1~4μm。 (6) The laminated sheet according to any one of (1) to (5) wherein the heat radiation layer has an average thickness of 0.1 to 4 μm.

(7)如(1)~(6)中任一項之層合薄片,其中,前述金屬薄片層之平均厚度為0.02~0.5mm。 (7) The laminated sheet according to any one of (1) to (6) wherein the metal foil layer has an average thickness of 0.02 to 0.5 mm.

(8)如(1)~(7)中任一項之層合薄片,其中,前述黏著層係含有:黏著樹脂組成物(A)、前述熱傳導性填料(B)以及聚合起始劑(E)之黏著劑組成物的硬化物,該黏著樹脂組成物(A)係含有具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)。 The laminated sheet according to any one of (1) to (7), wherein the adhesive layer comprises: an adhesive resin composition (A), the aforementioned thermally conductive filler (B), and a polymerization initiator (E) The cured resin composition (A) contains a (meth)acryl fluorenyl group-containing polyurethane (a) and a polymerizable monomer (b).

(9)如(1)~(8)中任一項之層合薄片,其係含有對前述黏著樹脂組成物(A)100質量份而言為250~900質量份之前述熱傳導性填料(B)。 (9) The laminated sheet according to any one of (1) to (8), wherein the thermally conductive filler (B) is contained in an amount of from 250 to 900 parts by mass based on 100 parts by mass of the adhesive resin composition (A). ).

(10)如(1)~(9)中任一項之層合薄片,其中,前述熱傳導性填料(B)係含有由金屬氧化物及金屬水合物中選出的1種或2種以上。 The laminated thin film of any one of (1) to (9), wherein the heat conductive filler (B) contains one or more selected from the group consisting of metal oxides and metal hydrates.

(11)如(1)~(10)中任一項之層合薄片,其中,於前述黏著層之與前述金屬薄片層相反面層合 有剝離薄片。 (11) The laminated sheet according to any one of (1) to (10), wherein the adhesive layer is laminated on the opposite side of the metal foil layer There are peeling sheets.

(12)一種散熱器,其係由如(1)~(11)中任一項之層合薄片所構成。 (12) A heat sink comprising the laminated sheet according to any one of (1) to (11).

(13)一種電子機器,其係組入有如(12)之散熱器。 (13) An electronic machine in which a heat sink such as (12) is incorporated.

(14)一種層合薄片之製造方法,其特徵為,於剝離薄片上,依此順序層合黏著薄片與金屬薄片,且以使該熱輻射層位於最外面的方式進行層合,該黏著薄片係由含有黏著樹脂組成物(A)及熱傳導性填料(B)之黏著層所構成;該金屬薄片係由金屬層與含有熱輻射填料(C)及黏合劑成分(D)之熱輻射層所構成。 (14) A method of producing a laminated sheet, characterized in that an adhesive sheet and a metal foil are laminated on the release sheet in this order, and laminated in such a manner that the heat radiation layer is located at the outermost side, the adhesive sheet It is composed of an adhesive layer containing an adhesive resin composition (A) and a heat conductive filler (B); the metal foil is composed of a metal layer and a heat radiation layer containing the heat radiation filler (C) and the binder component (D). Composition.

本發明之層合薄片係藉由使黏著層緊密接著於發熱體,而可將層合薄片容易地接合於發熱體,可有效率地將熱擴散及輻射。 In the laminated sheet of the present invention, the laminated sheet can be easily joined to the heat generating body by closely adhering the adhesive layer to the heat generating body, and the heat can be efficiently diffused and radiated.

進而,本發明之層合薄片係由於黏著層為含有黏著樹脂與熱傳導性填料者,因此可將發熱體的熱有效率地散熱。 Further, in the laminated sheet of the present invention, since the adhesive layer contains the adhesive resin and the thermally conductive filler, the heat of the heat generating body can be efficiently dissipated.

1‧‧‧金屬薄片層 1‧‧‧metal foil layer

1a‧‧‧金屬薄片層1之熱輻射層側之面 1a‧‧‧ Surface of the thermal radiation layer on the metal foil layer 1

1b‧‧‧金屬薄片層1之金屬層側之面 1b‧‧‧Metal layer side of metal foil layer 1

11‧‧‧熱輻射層 11‧‧‧thermal radiation layer

12‧‧‧金屬層 12‧‧‧metal layer

2‧‧‧黏著層 2‧‧‧Adhesive layer

2b‧‧‧黏著層之與金屬薄片相反之面 2b‧‧‧ The opposite side of the adhesive layer to the metal foil

3‧‧‧剝離薄片 3‧‧‧ peeling sheet

10‧‧‧層合薄片 10‧‧‧Laminated sheets

[第1圖]係顯示本發明之層合薄片的一例之剖面圖。 [Fig. 1] Fig. 1 is a cross-sectional view showing an example of a laminated sheet of the present invention.

以下,針對本發明之實施形態,使用附圖詳細地進行說明。但,本發明並不僅限定於以下之實施形態。在不脫離本發明之趣旨及其範圍內,可將該形態及詳細內容進行種種變更,此乃只要是本發明領域具有通常知識者則可容易理解。因此,本發明並非限定於以下所示之實施形態的記載內容所解釋者。在不脫離本發明之趣旨的範圍內,可進行附加、省略、變更、置換、及其他的變更。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. The present invention can be variously modified without departing from the spirit and scope of the invention, and can be easily understood as long as it has ordinary knowledge in the field of the invention. Therefore, the present invention is not limited to the description of the description of the embodiments shown below. Additions, omissions, changes, substitutions, and other modifications may be made without departing from the scope of the invention.

第1圖係顯示本發明之層合薄片的一例之示意圖,且顯示剖面圖。第1圖所示之層合薄片10係含有金屬薄片層1與黏著層2,該金屬薄片層1係由熱輻射層11及金屬層12所構成;該黏著層2係層合於該金屬層12側之面1b。又,亦可在層合薄片10之使用前,因應需要而進一步於黏著層2之露出面2b層合剝離薄片3。 Fig. 1 is a schematic view showing an example of a laminated sheet of the present invention, and showing a cross-sectional view. The laminated sheet 10 shown in Fig. 1 comprises a metal foil layer 1 and an adhesive layer 2, which is composed of a heat radiation layer 11 and a metal layer 12; the adhesive layer 2 is laminated on the metal layer 12 side face 1b. Further, the release sheet 3 may be further laminated on the exposed surface 2b of the adhesive layer 2 before use of the laminated sheet 10, if necessary.

前述金屬薄片層1與前述黏著層2之合計的平均厚度係可因應需要而選擇。較佳為0.05~3mm,更佳為0.1mm~2.5mm,再更佳為0.15mm~2mm。作為平均厚度之較佳的範圍之其他例子亦可列舉0.05~1.5mm,或0.05~1mm,或0.05~0.8mm等。若平均厚度為0.05mm以上,則容易得到具有因金屬薄片層1所致之高散熱性與因黏著層2所致之充分的黏著力之層合薄片10。又,成為形狀為安定,且容易追隨所接合之發熱體的形狀之層合薄片10。因而,成為可將發熱體的熱有效率地傳導至層 合薄片10,而將發熱體的熱有效率地散熱者。 The total thickness of the metal foil layer 1 and the adhesive layer 2 described above can be selected as needed. It is preferably 0.05 to 3 mm, more preferably 0.1 mm to 2.5 mm, and still more preferably 0.15 mm to 2 mm. Other examples of the preferred range of the average thickness may be 0.05 to 1.5 mm, or 0.05 to 1 mm, or 0.05 to 0.8 mm. When the average thickness is 0.05 mm or more, the laminated sheet 10 having high heat dissipation property due to the metal foil layer 1 and sufficient adhesion due to the adhesive layer 2 can be easily obtained. Further, the laminated sheet 10 having a shape that is stable and easily follows the shape of the joined heat generating body. Therefore, it is possible to efficiently transfer the heat of the heating element to the layer. The sheet 10 is bonded to heat the heat of the heat generating body efficiently.

於本說明書中之前述金屬薄片層1與前述黏著層2之合計的平均厚度,係指藉由本發明之層合薄片10的剖面觀察,對隨機選出的10處之前述金屬薄片層1與前述黏著層2之合計的厚度進行測定,作為該算術平均值所得到的值。 The average thickness of the above-mentioned metal foil layer 1 and the above-mentioned adhesive layer 2 in the present specification means that the above-mentioned metal foil layer 1 of 10 randomly selected and the aforementioned adhesion are observed by the cross section of the laminated foil 10 of the present invention. The total thickness of the layer 2 was measured and used as the value obtained by the arithmetic mean.

<金屬薄片層> <metal foil layer>

以第1圖為例來說明金屬薄片層。金屬薄片層係如第1圖所示般,由熱輻射層11與金屬層12所構成。熱輻射層11係含有熱輻射填料(C)及黏合劑成分(D)。熱輻射層11的厚度雖可因應需要來選擇,但較佳為0.1~4μm,更佳為0.5~3μm。若為0.1μm以上,則可充分確保熱輻射層內的熱輻射填料量,而得到充分的散熱性。由於即使超過4μm熱輻射性也不會上昇,因此對成本面而言為不利。 The metal foil layer will be described by taking Fig. 1 as an example. The metal foil layer is composed of the heat radiation layer 11 and the metal layer 12 as shown in Fig. 1 . The heat radiation layer 11 contains a heat radiation filler (C) and a binder component (D). The thickness of the heat radiation layer 11 can be selected as needed, but is preferably 0.1 to 4 μm, more preferably 0.5 to 3 μm. When it is 0.1 μm or more, the amount of the heat radiation filler in the heat radiation layer can be sufficiently ensured, and sufficient heat dissipation can be obtained. Since heat radiation does not rise even if it exceeds 4 μm, it is disadvantageous for the cost side.

作為前述熱輻射層11所使用之熱輻射填料(C)係無論金屬、非金屬,皆無特別限定。就高熱輻射率及低成本的觀點而言較佳為碳質材料。作為碳質材料的例子係可列舉:乙炔黑、科琴黑等之碳黑、石墨、氣相法碳纖維等,由此等當中選擇1種或者2種以上來使用亦可。熱輻射填料(C)之粒徑係以累積質量50%粒徑(D50)為0.1~2.0μm為佳,更佳為0.2~1μm。若累積質量50%粒徑(D50)為0.1~2.0μm,則可得到平滑性高的熱輻射層。 熱輻射層11中之熱輻射填料(C)的量雖可任意地選擇,但較佳為20~80質量%,更佳為30~60質量%,再更佳為30~60質量%。 The heat radiation filler (C) used as the heat radiation layer 11 is not particularly limited as long as it is a metal or a nonmetal. From the viewpoint of high heat emissivity and low cost, a carbonaceous material is preferred. Examples of the carbonaceous material include carbon black such as acetylene black and ketjen black, graphite, and gas-phase carbon fiber. One or two or more of them may be used. The particle size of the heat radiation filler (C) is preferably 0.1 to 2.0 μm in terms of cumulative mass 50% particle diameter (D50), more preferably 0.2 to 1 μm. When the cumulative mass 50% particle diameter (D50) is 0.1 to 2.0 μm, a heat radiation layer having high smoothness can be obtained. The amount of the heat radiation filler (C) in the heat radiation layer 11 can be arbitrarily selected, but is preferably 20 to 80% by mass, more preferably 30 to 60% by mass, still more preferably 30 to 60% by mass.

作為前述熱輻射層11所使用之黏合劑成分(D)係只要可黏著前述熱輻射填料(C)的材料則無特別限定。就熱輻射填料(C)之黏著性,或在將熱輻射填料(C)及黏合劑成分(D)之組成物作為熱輻射層11來層合於金屬層12時之塗佈性,又作為熱輻射層11之皮膜性能的觀點而言,作為黏合劑成分(D)係較佳為含有高分子多醣類及酸交聯劑。作為高分子多醣類係可列舉由幾丁聚醣、幾丁質及其衍生物中選出的1種或2種以上。作為酸交聯劑係可列舉由苯均四酸、偏苯三甲酸、馬來酸、鄰苯二甲酸及該等之酸酐中選出的1種或2種以上。 The binder component (D) used as the heat radiation layer 11 is not particularly limited as long as it can adhere the heat radiation filler (C). The applicability of the heat-radiating filler (C) or the composition of the heat-radiating filler (C) and the binder component (D) as the heat radiation layer 11 to be laminated on the metal layer 12 From the viewpoint of the film properties of the heat radiation layer 11, the binder component (D) preferably contains a polymer polysaccharide and an acid crosslinking agent. The polymer polysaccharides may be one or more selected from the group consisting of chitosan, chitin and derivatives thereof. The acid crosslinking agent may be one or more selected from the group consisting of pyromellitic acid, trimellitic acid, maleic acid, phthalic acid, and the like.

前述金屬薄片層1之平均厚度雖可因應需要而選擇,但較佳為0.02~0.5mm。若金屬薄片層1之平均厚度為0.02mm以上,則可得到熱輻射性優異的層合薄片10,並且使在製造層合薄片10之步驟中的金屬薄片層1之形變或變形成為少者。若金屬薄片層1之平均厚度為0.5mm以下,則可充分確保在將層合薄片10接合於發熱體時之對於層合薄片10的發熱體之形狀追隨性。因而,即使在發熱體的表面為彎曲面時,亦可充分確保發熱體與層合薄片10之接觸面積,因此,可將發熱體的熱有效率地散熱。金屬薄片層1之平均厚度係更佳為0.05~0.4mm,再更佳為0.05~0.35mm。作為其他較佳之厚度的 例子亦可列舉0.05~0.25mm,或0.05~0.1.5mm等。 Although the average thickness of the above-mentioned metal foil layer 1 can be selected as needed, it is preferably 0.02 to 0.5 mm. When the average thickness of the metal foil layer 1 is 0.02 mm or more, the laminated sheet 10 excellent in heat radiation property can be obtained, and the deformation or deformation of the metal foil layer 1 in the step of producing the laminated sheet 10 can be minimized. When the average thickness of the foil layer 1 is 0.5 mm or less, the shape followability of the heat generating body for the laminated sheet 10 when the laminated sheet 10 is joined to the heat generating body can be sufficiently ensured. Therefore, even when the surface of the heat generating body is a curved surface, the contact area between the heat generating body and the laminated sheet 10 can be sufficiently ensured, so that heat of the heat generating body can be efficiently radiated. The average thickness of the metal foil layer 1 is more preferably 0.05 to 0.4 mm, still more preferably 0.05 to 0.35 mm. As other preferred thicknesses Examples may also be listed in the range of 0.05 to 0.25 mm, or 0.05 to 0.15 mm.

作為前述金屬層12係可使用金、銀、銅、鋁、及包含該等之金屬的合金等。較佳係熱傳導率為高的金屬,就低價格或加工容易性的觀點而言,較佳係使用銅、鋁及包含該等之金屬的合金作為金屬層12。 As the metal layer 12, gold, silver, copper, aluminum, an alloy containing the metal, or the like can be used. A metal having a high thermal conductivity is preferable, and from the viewpoint of low cost or ease of processing, copper, aluminum, and an alloy containing the metal are preferably used as the metal layer 12.

由熱輻射層11與金屬層12所構成之金屬薄片層1的形成方法並無特別限定,可因應需要而選擇。可列舉例如,於金屬層12上凹版塗佈用以形成熱輻射層11之組成物,藉由乾燥爐加熱而形成熱輻射層11的方法等。 The method of forming the foil layer 1 composed of the heat radiation layer 11 and the metal layer 12 is not particularly limited, and may be selected as needed. For example, a method of forming a composition for forming the heat radiation layer 11 by gravure coating on the metal layer 12, and forming the heat radiation layer 11 by heating in a drying furnace may be mentioned.

以凹版塗佈所致之塗佈方法係作為用以形成均勻的被膜之塗佈方法而為佳。又,藉由加熱使黏合劑成分進行反應,而可形成更強固的被膜。因此,藉由以如上述般的方法來形成金屬薄片層1,而可得到優異的生產性,並且可得到具有厚度均勻之熱輻射層11的金屬薄片層1。 The coating method by gravure coating is preferred as a coating method for forming a uniform film. Further, the binder component is reacted by heating to form a stronger film. Therefore, by forming the metal foil layer 1 by the above-described method, excellent productivity can be obtained, and the metal foil layer 1 having the heat radiation layer 11 having a uniform thickness can be obtained.

<黏著層> <adhesive layer>

本發明所使用之黏著層2的厚度雖可因應需要來選擇,但較佳為平均0.1~1mm,更佳為0.1~0.7mm,再更佳為0.2~0.5mm。若黏著層2的厚度為平均0.1mm以上,則成為黏著層2與發熱體及金屬薄片層1之接合強度為充分高的層合薄片10。若黏著層2的厚度為平均1mm以下,則可將發熱體的熱隔著黏著層2有效率地傳導至金屬薄片層1。 The thickness of the adhesive layer 2 used in the present invention may be selected according to needs, but is preferably 0.1 to 1 mm on average, more preferably 0.1 to 0.7 mm, still more preferably 0.2 to 0.5 mm. When the thickness of the adhesive layer 2 is 0.1 mm or more on average, the laminated sheet 10 in which the bonding strength between the adhesive layer 2 and the heat generating body and the metal foil layer 1 is sufficiently high is obtained. When the thickness of the adhesive layer 2 is 1 mm or less on average, the heat of the heat generating body can be efficiently conducted to the metal foil layer 1 via the adhesive layer 2.

另外,於本發明中,黏著層2之平均的厚度,係指藉 由本發明之層合薄片10的剖面觀察,對隨機選出的30處之黏著層2厚度進行測定,作為該算術平均值所得到的值。 In addition, in the present invention, the average thickness of the adhesive layer 2 means From the cross section of the laminated sheet 10 of the present invention, the thickness of the randomly selected adhesive layer 2 at 30 points was measured as a value obtained by the arithmetic mean.

黏著層2係使用後述的測定方法測定之對於SUS304的黏著力較佳為1N/25mm以上者,更佳為5N/25mm以上,再更佳為10N/25mm以上。若上述之黏著力為1N/25mm以上,則成為黏著層2與發熱體及金屬薄片層1之接合強度為充分高的層合薄片10。 The adhesive layer 2 preferably has an adhesive force to SUS304 of 1 N/25 mm or more, more preferably 5 N/25 mm or more, and still more preferably 10 N/25 mm or more, measured by a measuring method described later. When the above-mentioned adhesive force is 1 N/25 mm or more, the laminated sheet 10 in which the bonding strength between the adhesive layer 2 and the heat generating body and the metal foil layer 1 is sufficiently high is obtained.

「黏著力之試驗方法」 "Test Method for Adhesion"

黏著層2之黏著力係藉由以下所示之方法求出。 The adhesive force of the adhesive layer 2 was obtained by the method shown below.

將厚度50μm之PET薄膜(Toray股份有限公司製,「LUMIRROR(商標)S-10」)作為基材,於基材上形成黏著層,而製成試驗用層合薄片。接著,將試驗用層合薄片切下縱25mm、橫100mm的大小,製成長條狀薄片。然後,於由SUS304所構成之試驗板上,將黏著層朝向試驗板來層合長條狀薄片。其後,讓2kg之橡膠滾輪(寬:約50mm)在長條狀薄片上來回1次,將試驗板與長條狀薄片接合。 A PET film ("LUMIRROR (trademark) S-10" manufactured by Toray Co., Ltd.) having a thickness of 50 μm was used as a substrate, and an adhesive layer was formed on the substrate to prepare a laminated sheet for testing. Next, the test laminated sheet was cut into a size of 25 mm in length and 100 mm in width to obtain a long sheet. Then, on the test plate composed of SUS304, the adhesive layer was laminated to the test plate to laminate the elongated sheet. Thereafter, a 2 kg rubber roller (width: about 50 mm) was placed one time on the long sheet to join the test sheet to the long sheet.

將接合後的試驗板及長條狀薄片在23℃、濕度50%RH之環境下放置24小時。其後,按照JIS Z0237,以剝離速度300mm/分進行180°方向之拉伸試驗,測定對於長條狀薄片之試驗板的黏著力(N/25mm)。 The joined test panels and long strips were allowed to stand in an environment of 23 ° C and a humidity of 50% RH for 24 hours. Thereafter, a tensile test in a 180° direction was carried out at a peeling speed of 300 mm/min in accordance with JIS Z0237, and the adhesion (N/25 mm) of the test piece to the elongated sheet was measured.

「黏著層之成分」 "The composition of the adhesive layer"

黏著層2係由含有黏著樹脂組成物(A)及熱傳導性填料(B)之黏著劑組成物所構成。作為熱傳導性填料(B)係只要具有熱傳導性者即可,可列舉例如由金屬氧化物、金屬氮化物及金屬水合物等中選出的1種或2種以上之粒子。作為金屬氧化物係可列舉:氧化鋁、氧化鎂、氧化鋅、二氧化鈦等。作為金屬氮化物係可列舉:氮化鋁、氮化硼、氮化矽等。作為金屬水合物係可列舉:氫氧化鎂、氫氧化鋁等,就熱傳導性或難燃性優異的觀點而言,較佳為含有氫氧化鋁。 The adhesive layer 2 is composed of an adhesive composition containing an adhesive resin composition (A) and a heat conductive filler (B). The heat conductive filler (B) may be one or two or more kinds selected from the group consisting of metal oxides, metal nitrides, and metal hydrates, as long as it has heat conductivity. Examples of the metal oxides include alumina, magnesia, zinc oxide, and titania. Examples of the metal nitride system include aluminum nitride, boron nitride, and tantalum nitride. The metal hydrate system may, for example, be magnesium hydroxide or aluminum hydroxide, and preferably contains aluminum hydroxide from the viewpoint of excellent thermal conductivity or flame retardancy.

又,作為熱傳導性填料(B)亦可使用鋁等之金屬粉、碳化矽等。 Further, as the thermally conductive filler (B), metal powder such as aluminum or tantalum carbide can be used.

作為熱傳導性填料(B)係上述之材料當中尤其以使用金屬水合物為佳。藉由使用金屬水合物作為熱傳導性填料,而可形成具有優異的熱傳導性及難燃性之黏著層2。又,就操作容易性的觀點而言,較佳為使用金屬水合物。 As the thermally conductive filler (B), among the above materials, a metal hydrate is particularly preferable. The adhesive layer 2 having excellent thermal conductivity and flame retardancy can be formed by using a metal hydrate as a heat conductive filler. Further, from the viewpoint of ease of handling, it is preferred to use a metal hydrate.

熱傳導性填料(B)為粉體者係就對於黏著層2均勻地分散的觀點而言為佳。熱傳導性填料(B)之粒徑係以累積質量50%粒徑(D50)為1~50μm為佳,更佳為3~30μm。若累積質量50%粒徑(D50)為1~50μm,則可充分得到黏著層2中所包含的熱傳導性填料(B)與發熱體及金屬薄片層1之接觸面積,而可將發熱體的熱隔著黏著層2有效率地傳導至金屬薄片層1。 It is preferable that the thermally conductive filler (B) is a powder, and the adhesive layer 2 is uniformly dispersed. The particle diameter of the thermally conductive filler (B) is preferably 50 to 50 μm in terms of cumulative mass 50% (D50), more preferably 3 to 30 μm. When the cumulative mass 50% particle diameter (D50) is 1 to 50 μm, the contact area between the heat conductive filler (B) contained in the adhesive layer 2 and the heat generating body and the metal foil layer 1 can be sufficiently obtained, and the heat generating body can be obtained. The heat is efficiently conducted to the foil layer 1 through the adhesive layer 2.

「累積質量50%粒徑(D50)」,例如,藉由使用股 份有限公司島津製作所製之商品名「SALD-200V ER」的雷射繞射式粒度分布測定裝置之雷射繞射式粒度分布測定所得到。 "Cumulative mass 50% particle size (D50)", for example, by using shares It is obtained by laser diffraction type particle size distribution measurement of a laser diffraction type particle size distribution measuring device of the product name "SALD-200V ER" manufactured by Shimadzu Corporation.

作為黏著層2所使用之黏著樹脂組成物(A)係只要可充分得到黏著力者即可。黏著樹脂組成物(A)係可僅為樹脂成分,亦可為併用反應性者作為樹脂成分,包含聚合性單體、聚合起始劑者。作為樹脂成分係可列舉例如:(甲基)丙烯酸系樹脂、矽酮系樹脂等。 The adhesive resin composition (A) used as the adhesive layer 2 is sufficient as long as the adhesiveness can be sufficiently obtained. The adhesive resin composition (A) may be only a resin component, or may be a reactive component as a resin component, and may include a polymerizable monomer or a polymerization initiator. Examples of the resin component include a (meth)acrylic resin and an anthrone-based resin.

作為黏著樹脂成分所使用之矽酮系樹脂,例如,可使用以一般結構式-[(CH3)2SiO]m-[(CH3)SiO3/2]n-[(CH3)3SiO1/2]p-(上述之結構式中之m、n、p為整數)所示者。 As the anthrone-based resin used as the adhesive resin component, for example, a general structural formula -[(CH 3 ) 2 SiO] m -[(CH 3 )SiO 3/2 ] n -[(CH 3 ) 3 SiO can be used. 1/2 ] p - (in the above structural formula, m, n, and p are integers).

於含有(甲基)丙烯酸系樹脂作為黏著樹脂成分的情況中,黏著層2係以使含有黏著樹脂組成物(A)、上述之熱傳導性填料(B)、以及光聚合起始劑(E)的黏著劑組成物硬化者為佳,該黏著樹脂組成物(A)係含有具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)。 In the case where a (meth)acrylic resin is contained as the adhesive resin component, the adhesive layer 2 is provided to contain the adhesive resin composition (A), the above-mentioned thermally conductive filler (B), and a photopolymerization initiator (E). It is preferable that the adhesive composition is cured, and the adhesive resin composition (A) contains a (meth)acryl oxime group-containing polyurethane (a) and a polymerizable monomer (b).

於本說明書之範圍中,「(甲基)丙烯醯基」係意味著以化學式「CH2=CH-CO-」所表示之基或者以化學式「CH2=C(CH3)-CO-」所表示之基,「異氰酸基」係意味著以化學式「-N=C=O」所表示之基。 In the scope of the present specification, "(meth)acrylonitrile" means a group represented by the chemical formula "CH 2 =CH-CO-" or a chemical formula "CH 2 =C(CH 3 )-CO-" The "isocyanate group" means a group represented by the chemical formula "-N=C=O".

「黏著樹脂組成物(A)」 "Adhesive resin composition (A)"

針對含有具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)作為黏著樹脂組成物(A)的情況,於以下進行說明。 The case where the polyaminoformate (a) having a (meth)acryl fluorenyl group and the polymerizable monomer (b) are used as the adhesive resin composition (A) will be described below.

(聚胺基甲酸酯(a)) (polyurethane (a))

作為於聚胺基甲酸酯(a)之製造中所使用的多元醇雖無特別限定,但較佳為聚氧伸烷基多元醇,進而以具有碳數2~4之伸烷基鏈的聚氧伸烷基多元醇為佳。 The polyhydric alcohol used in the production of the polyurethane (a) is not particularly limited, but is preferably a polyoxyalkylene polyol, and further has an alkylene chain having a carbon number of 2 to 4. Polyoxyalkylene polyols are preferred.

作為較佳的聚氧伸烷基多元醇係可列舉例如:聚氧乙烯多元醇、聚氧丙烯多元醇、聚氧丁烯多元醇、聚四亞甲基醚二醇等。此等之聚氧伸烷基多元醇係藉由將環氧乙烷、環氧丙烷、環氧丁烷等之伸烷基氧化物進行加成聚合而得到。作為本發明所使用之聚氧伸烷基多元醇係可為使1種之伸烷基氧化物等加成聚合而成的聚合物,亦可使用使2種以上之伸烷基氧化物等加成共聚合所得到的共聚物。 Preferable examples of the polyoxyalkylene polyol include polyoxyethylene polyol, polyoxypropylene polyol, polyoxybutylene polyol, and polytetramethylene ether glycol. These polyoxyalkylene polyols are obtained by addition polymerization of an alkylene oxide such as ethylene oxide, propylene oxide or butylene oxide. The polyoxyalkylene polyol used in the present invention may be a polymer obtained by addition polymerization of one type of alkylene oxide or the like, or two or more kinds of alkylene oxides may be used. The resulting copolymer is copolymerized.

聚氧伸烷基多元醇之數量平均分子量係通常為500~5,000,較佳為800~4,000,更佳為1000~3,000。由於藉由聚氧伸烷基多元醇之數量平均分子量為500~5,000,而可充分得到黏著層2之黏著力,並且以所期望的量確保聚胺基甲酸酯中之胺基甲酸酯鍵,因此黏著層2之凝聚力為充分高者。 The polyoxyalkylene polyol has a number average molecular weight of usually 500 to 5,000, preferably 800 to 4,000, more preferably 1,000 to 3,000. Since the number average molecular weight of the polyoxyalkylene polyol is 500 to 5,000, the adhesion of the adhesive layer 2 can be sufficiently obtained, and the urethane in the polyurethane can be ensured in a desired amount. The key, so the cohesive force of the adhesive layer 2 is sufficiently high.

作為於聚胺基甲酸酯(a)之製造中所使用的聚異氰酸酯雖無特別限定,但較佳為包含2個異氰酸基之 化合物。作為聚異氰酸酯係可列舉:甲伸苯基二異氰酸酯(tolylene diisocyanate)及其氫化物、伸二甲苯二異氰酸酯及其氫化物、二苯基甲烷二異氰酸酯及其氫化物、1,5-伸萘基二異氰酸酯及其氫化物、六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯、四甲基伸二甲苯二異氰酸酯、異佛酮二異氰酸酯、4,4’-二環己基二異氰酸酯、1,3-雙(異氰酸甲酯)環己烷、降莰烷二異氰酸酯等之二異氰酸酯,亦可將此等二種以上併用。其中,就反應性之控制優異的觀點而言,較佳為異佛酮二異氰酸酯或二苯基甲烷二異氰酸酯及其氫化物。 The polyisocyanate used in the production of the polyurethane (a) is not particularly limited, but preferably contains two isocyanate groups. Compound. Examples of the polyisocyanate include tolylene diisocyanate and its hydride, xylene diisocyanate and its hydride, diphenylmethane diisocyanate and its hydride, 1,5-anthranyl Isocyanate and its hydride, hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate, tetramethyl xylene diisocyanate, isophorone diisocyanate, 4,4'-dicyclohexyl diisocyanate, 1, A diisocyanate such as 3-bis(methyl isocyanate) cyclohexane or a decane diisocyanate may be used in combination of two or more kinds. Among them, isophorone diisocyanate or diphenylmethane diisocyanate and a hydrogenated product thereof are preferred from the viewpoint of excellent control of reactivity.

[聚胺基甲酸酯(a)之第一合成方法] [First Synthesis Method of Polyurethane (a)]

接著,針對聚胺基甲酸酯(a)之第一合成方法,亦即聚胺基甲酸酯(a1)之合成方法進行說明。 Next, a method for synthesizing the first synthesis method of the polyurethane (a), that is, the polyurethane (a1) will be described.

首先,使聚氧伸烷基多元醇與聚異氰酸酯以異氰酸基量多於羥基量的比例進行反應,而合成「具有異氰酸基之聚胺基甲酸酯」。 First, a polyoxoalkylene polyol and a polyisocyanate are reacted in a ratio of an amount of isocyanate groups more than a hydroxyl group to synthesize a "polyurethane having an isocyanate group".

此時,藉由調整異氰酸基量相對於羥基量之比,而可調整具有異氰酸基之聚胺基甲酸酯的分子量。具體而言,異氰酸基量相對於羥基量之比越小,則具有異氰酸基之聚胺基甲酸酯的分子量越大,異氰酸基量相對於羥基量之比越大,則具有異氰酸基之聚胺基甲酸酯的分子量越小。較佳係對聚氧伸烷基多元醇之羥基1莫耳而言,聚異氰酸酯之異氰酸基量為1.03~1.35莫耳,更佳為1.05~1.1莫 耳。 At this time, the molecular weight of the polyaminocarbamate having an isocyanate group can be adjusted by adjusting the ratio of the amount of isocyanate groups to the amount of hydroxyl groups. Specifically, the smaller the ratio of the amount of the isocyanate group to the amount of the hydroxyl group, the larger the molecular weight of the polyaminocarbamate having an isocyanate group, and the larger the ratio of the amount of the isocyanate group to the amount of the hydroxyl group. The smaller the molecular weight of the polyaminocarbamate having an isocyanate group. Preferably, for the hydroxyl group 1 mole of the polyoxyalkylene polyol, the isocyanate group of the polyisocyanate is 1.03 to 1.35 moles, more preferably 1.05 to 1.1 moles. ear.

接著,使具有異氰酸基之聚胺基甲酸酯與具有羥基及(甲基)丙烯醯基之化合物進行反應而合成聚胺基甲酸酯(a1)。 Next, the polyurethane having an isocyanate group is reacted with a compound having a hydroxyl group and a (meth)acrylonium group to synthesize a polyurethane (a1).

作為具有羥基及(甲基)丙烯醯基之化合物雖無特別限定,但可列舉:2-羥乙基(甲基)丙烯酸酯、2-羥丙基(甲基)丙烯酸酯、4-羥丁基(甲基)丙烯酸酯等之羥烷基(甲基)丙烯酸酯;1,3-丁二醇單(甲基)丙烯酸酯、1,4-丁二醇單(甲基)丙烯酸酯、1,6-己二醇單(甲基)丙烯酸酯、3-甲基戊二醇單(甲基)丙烯酸酯等之來自各種多元醇之具有(甲基)丙烯醯基的一元醇等。可單獨使用,亦可併用二種以上。其中,就與異氰酸基之反應性、光硬化性優異的觀點而言,較佳為使用2-羥乙基丙烯酸酯。 The compound having a hydroxyl group and a (meth)acrylinyl group is not particularly limited, and examples thereof include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyrate. Hydroxyalkyl (meth) acrylate such as benzyl (meth) acrylate; 1,3-butylene glycol mono (meth) acrylate, 1,4-butanediol mono (meth) acrylate, 1 A monohydric alcohol having a (meth)acrylonyl group derived from various polyols, such as 6-hexanediol mono(meth)acrylate or 3-methylpentanediol mono(meth)acrylate. They may be used alone or in combination of two or more. Among them, 2-hydroxyethyl acrylate is preferably used from the viewpoint of excellent reactivity with an isocyanate group and photocurability.

在使具有異氰酸基之聚胺基甲酸酯與具有羥基及(甲基)丙烯醯基之化合物進行反應時,藉由添加烷基醇,來與具有異氰酸基之聚胺基甲酸酯進行反應,而可調整對於聚胺基甲酸酯(a1)之(甲基)丙烯醯基的導入量。 When a polyaminocarbamate having an isocyanate group is reacted with a compound having a hydroxyl group and a (meth)acryloyl group, a polyamine group having an isocyanate group is added by adding an alkyl alcohol. The acid ester is reacted, and the amount of introduction of the (meth) acrylonitrile group of the polyurethane (a1) can be adjusted.

對於聚胺基甲酸酯(a)之(甲基)丙烯醯基的導入量,通常,對異氰酸基而言為50~100mol%,較佳為70~100mol%,更佳為90~100mol%。藉由使(甲基)丙烯醯基的導入量對異氰酸基而言為50~100mol%,而使黏著層2之凝聚力成為充分高者。 The amount of introduction of the (meth)acryl fluorenyl group of the polyurethane (a) is usually 50 to 100 mol%, preferably 70 to 100 mol%, more preferably 90 to the isocyanate group. 100 mol%. When the amount of introduction of the (meth) acrylonitrile group is 50 to 100 mol% with respect to the isocyanate group, the cohesive force of the adhesive layer 2 is sufficiently high.

作為烷基醇雖無特別限定,但可列舉:直鏈型、分支型、脂環型之烷基醇等,作為具體例係可列舉:乙醇、丙醇、丁醇等。 The alkyl alcohol is not particularly limited, and examples thereof include a linear type, a branched type, and an alicyclic alkyl alcohol. Specific examples thereof include ethanol, propanol, and butanol.

[聚胺基甲酸酯(a)之第二合成方法] [Second Synthesis Method of Polyurethane (a)]

接著,針對聚胺基甲酸酯(a)之第二合成方法,亦即聚胺基甲酸酯(a2)之合成方法進行說明。 Next, a second synthesis method of the polyurethane (a), that is, a method of synthesizing the polyurethane (a2) will be described.

首先,使聚氧伸烷基多元醇與聚異氰酸酯以羥基量多於異氰酸基量的比例進行反應,而合成「具有羥基之聚胺基甲酸酯」。 First, a polyoxyalkylene polyol and a polyisocyanate are reacted in a ratio of a hydroxyl group amount to an isocyanate group to synthesize a "hydroxyl-containing polyurethane".

接著,使具有羥基之聚胺基甲酸酯與具有異氰酸基及(甲基)丙烯醯基之化合物進行反應,而合成聚胺基甲酸酯(a2)。 Next, a polyurethane having a hydroxyl group is reacted with a compound having an isocyanato group and a (meth)acryloyl group to synthesize a polyurethane (a2).

作為具有異氰酸基及(甲基)丙烯醯基之化合物雖無特別限定,但可列舉:2-(甲基)丙烯醯氧乙基異氰酸酯、1,1-雙(丙烯醯氧甲基)乙基異氰酸酯等。可單獨使用,亦可併用二種以上。其中,就與羥基之反應性、光硬化性優異的觀點而言,較佳為使用2-(甲基)丙烯醯氧乙基異氰酸酯。 The compound having an isocyanato group and a (meth)acryl fluorenyl group is not particularly limited, and examples thereof include 2-(meth)acryloyloxyethyl isocyanate and 1,1-bis(acryloxymethyl). Ethyl isocyanate and the like. They may be used alone or in combination of two or more. Among them, from the viewpoint of excellent reactivity with a hydroxyl group and excellent photocurability, 2-(meth)acryloyloxyethyl isocyanate is preferably used.

於聚胺基甲酸酯(a)之合成中,羥基與異氰酸基之反應,係在對於異氰酸基為惰性之有機溶劑的存在下,使用二月桂酸二丁基錫、二乙基己酸二丁基錫、二月桂酸二辛基錫等之胺基甲酸酯化觸媒,通常,以30~100℃持續進行1~5小時左右。 In the synthesis of the polyurethane (a), the reaction of a hydroxyl group with an isocyanate group is carried out in the presence of an organic solvent inert to the isocyanate group, using dibutyltin dilaurate or diethylhexylate. A urethane catalyst such as dibutyltin acid or dioctyltin dilaurate is usually carried out at 30 to 100 ° C for about 1 to 5 hours.

胺基甲酸酯化觸媒的使用量通常對反應物之總質量而言為50~500質量ppm。 The amount of the urethane catalyst used is usually 50 to 500 ppm by mass based on the total mass of the reactants.

聚胺基甲酸酯(a)之重量平均分子量雖可任意選擇,但較佳為10,000~300,000,更佳為20,000~200,000,再更佳為30,000~100,000。若聚胺基甲酸酯(a)之重量平均分子量為10,000~300,000,則可充分得到黏著層2之黏著力,並且操作為容易且作業性亦提昇。 The weight average molecular weight of the polyurethane (a) may be arbitrarily selected, but is preferably 10,000 to 300,000, more preferably 20,000 to 200,000, still more preferably 30,000 to 100,000. When the weight average molecular weight of the polyurethane (a) is 10,000 to 300,000, the adhesive force of the adhesive layer 2 can be sufficiently obtained, and handling is easy and workability is also improved.

「重量平均分子量」 "weight average molecular weight"

重量平均分子量係使用凝膠滲透層析法:商品名「Shodex GPC-101」(昭和電工股份有限公司製,「Shodex」為註冊商標)所測定之聚苯乙烯換算的分子量。 The weight average molecular weight is a polystyrene-equivalent molecular weight measured by gel permeation chromatography: trade name "Shodex GPC-101" (manufactured by Showa Denko Co., Ltd., "Shodex" is a registered trademark).

管柱:LF-804(昭和電工股份有限公司製) Pipe column: LF-804 (made by Showa Denko Co., Ltd.)

管柱的溫度:40℃ Column temperature: 40 ° C

試料:0.2質量%四氫呋喃溶液 Sample: 0.2% by mass tetrahydrofuran solution

流量:1ml/min Flow rate: 1ml/min

溶離液:四氫呋喃 Dissolution: tetrahydrofuran

檢測器:RI檢測器 Detector: RI detector

黏著樹脂組成物(A)中之聚胺基甲酸酯(a)之含量係較佳為10~40質量%,更佳為15~35質量%。若黏著樹脂組成物(A)中之聚胺基甲酸酯(a)之含量為10質量%以上且為40質量%以下,則成為可充分得到黏著層2之黏著力,並且黏著層2之凝聚力為充分高 者。 The content of the polyurethane (a) in the adhesive resin composition (A) is preferably from 10 to 40% by mass, more preferably from 15 to 35% by mass. When the content of the polyurethane (a) in the adhesive resin composition (A) is 10% by mass or more and 40% by mass or less, the adhesive force of the adhesive layer 2 can be sufficiently obtained, and the adhesive layer 2 can be obtained. Cohesion is fully high By.

「聚合性單體(b)」 "Polymerizable monomer (b)"

作為黏著樹脂組成物(A)中所使用的聚合性單體(b)雖無特別限定,但較佳為使用(甲基)丙烯酸酯。作為(甲基)丙烯酸酯係可列舉例如:甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸酯、n-丙基(甲基)丙烯酸酯、n-丁基(甲基)丙烯酸酯、tert-丁基(甲基)丙烯酸酯、異丁基(甲基)丙烯酸酯、2-乙基己基(甲基)丙烯酸酯、異癸基(甲基)丙烯酸酯、n-己基(甲基)丙烯酸酯、硬脂基(甲基)丙烯酸酯、異硬脂基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸酯、十三基(甲基)丙烯酸酯等之烷基(甲基)丙烯酸酯;環己基(甲基)丙烯酸酯、降莰基(甲基)丙烯酸酯等之環狀烷基(甲基)丙烯酸酯;乙氧基乙基(甲基)丙烯酸酯等之烷氧基烷基(甲基)丙烯酸酯;甲氧基二乙二醇(甲基)丙烯酸酯、乙氧基二乙二醇(甲基)丙烯酸酯等之烷氧基(聚)烷二醇(甲基)丙烯酸酯;2-羥乙基(甲基)丙烯酸酯等之含羥基之(甲基)丙烯酸酯;(甲基)丙烯酸、β-羧乙基(甲基)丙烯酸酯等之含羧基之(甲基)丙烯酸酯;2-磺乙基(甲基)丙烯酸酯等之磺酸基之(甲基)丙烯酸酯;八氟戊基(甲基)丙烯酸酯等之氟化烷基(甲基)丙烯酸酯;N,N-二甲基胺乙基(甲基)丙烯酸酯等之N,N-二烷基胺烷基(甲基)丙烯酸酯;聚乙二醇二(甲基)丙烯酸酯、 二季戊四醇六(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等之多官能(甲基)丙烯酸酯;(甲基)丙烯醯胺、二甲基(甲基)丙烯醯胺等之(甲基)丙烯醯胺;環氧丙基(甲基)丙烯酸酯等之具有環氧基的(甲基)丙烯酸酯等。可單獨使用,亦可併用二種以上。上述當中,尤其以烷基(甲基)丙烯酸酯、含羧基之(甲基)丙烯酸酯及含羥基之(甲基)丙烯酸酯為佳。 The polymerizable monomer (b) used in the adhesive resin composition (A) is not particularly limited, but (meth) acrylate is preferably used. Examples of the (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and n-butyl (meth) acrylate. Ester, tert-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n-hexyl (A Alkyl esters of acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, etc. Acryl ester; a cyclic alkyl (meth) acrylate such as cyclohexyl (meth) acrylate or norbornyl (meth) acrylate; or an alkyl group such as ethoxyethyl (meth) acrylate An alkoxy (poly)alkylene glycol such as oxyalkyl (meth) acrylate; methoxy diethylene glycol (meth) acrylate or ethoxy diethylene glycol (meth) acrylate ( a hydroxyl group-containing (meth) acrylate such as 2-hydroxyethyl (meth) acrylate; a carboxyl group such as (meth)acrylic acid or β-carboxyethyl (meth) acrylate; (meth) acrylate; 2-sulfoethyl (methyl) a sulfonic acid group (meth) acrylate such as an enoate; a fluorinated alkyl (meth) acrylate such as octafluoropentyl (meth) acrylate; N,N-dimethylaminoethyl ( N,N-dialkylamine alkyl (meth) acrylate such as methyl) acrylate; polyethylene glycol di(meth) acrylate, a polyfunctional (meth) acrylate such as dipentaerythritol hexa(meth) acrylate or pentaerythritol tetra(meth) acrylate; (meth) acrylamide, dimethyl (meth) acrylamide or the like ( Methyl) acrylamide; (meth) acrylate having an epoxy group such as a glycidyl (meth) acrylate. They may be used alone or in combination of two or more. Among the above, an alkyl (meth) acrylate, a carboxyl group-containing (meth) acrylate, and a hydroxyl group-containing (meth) acrylate are preferable.

聚合性單體(b),就黏著劑組成物之黏度與黏著層2之黏著性、強度、耐熱性的觀點而言,較佳為包含具有羧基之(甲基)丙烯酸酯及/或具有羥基之(甲基)丙烯酸酯等之具有極性基之(甲基)丙烯酸酯。 The polymerizable monomer (b) preferably contains a (meth) acrylate having a carboxyl group and/or a hydroxyl group from the viewpoint of the viscosity of the adhesive composition and the adhesion, strength, and heat resistance of the adhesive layer 2. A (meth) acrylate having a polar group such as (meth) acrylate.

具有極性基之(甲基)丙烯酸酯的含量係以黏著樹脂組成物(A)中1~40質量%為佳。若具有羥基之(甲基)丙烯酸酯的含量為黏著樹脂組成物(A)中1~40質量%,則可充分得到黏著層2之黏著力,並且使黏著層2之耐水性成為良好。 The content of the (meth) acrylate having a polar group is preferably from 1 to 40% by mass in the adhesive resin composition (A). When the content of the (meth) acrylate having a hydroxyl group is from 1 to 40% by mass in the adhesive resin composition (A), the adhesive force of the adhesive layer 2 can be sufficiently obtained, and the water resistance of the adhesive layer 2 can be made good.

聚合性單體(b),就賦予黏著層2黏著性的觀點而言,較佳為包含n-丁基丙烯酸酯、2-乙基己基丙烯酸酯、異辛基丙烯酸酯等之能夠降低所得到的黏著樹脂組成物(A)之硬化物的玻璃轉移點者。聚合性單體(b)之組成,較佳為假設在僅將黏著樹脂組成物(A)中所包含的聚合性單體(b)進行聚合時之以下述的FOX之式所致之玻璃轉移溫度的理論值成為-80℃~-10℃般的組成,更佳係成為-70℃~-20℃般的組成。 The polymerizable monomer (b) preferably contains n-butyl acrylate, 2-ethylhexyl acrylate or isooctyl acrylate from the viewpoint of imparting adhesion to the adhesive layer 2, and the like. The glass transition point of the cured product of the adhesive resin composition (A). The composition of the polymerizable monomer (b) is preferably a glass transition caused by the following FOX formula when only the polymerizable monomer (b) contained in the adhesive resin composition (A) is polymerized. The theoretical value of the temperature is a composition of -80 ° C to -10 ° C, and more preferably a composition of -70 ° C to -20 ° C.

「玻璃轉移溫度」 "glass transition temperature"

1/(Tg+273)=Σ[Wi/(Tgi+273)]:Fox之式 1/(Tg+273)=Σ[Wi/(Tgi+273)]:Fox

Tg(℃):計算玻璃轉移溫度 Tg (°C): Calculate the glass transition temperature

Wi:各單體之重量分率 Wi: the weight fraction of each monomer

Tgi(℃):各單體成分之均聚物的玻璃轉移溫度 Tgi (°C): glass transition temperature of homopolymer of each monomer component

本發明之黏著樹脂組成物(A)中所使用的聚合性單體(b)之含量係較佳為60~90質量%,更佳為65~85質量%。若黏著劑組成物中之聚合性單體(b)之含量為60~90質量%,則成為可充分得到黏著層2之黏著力,並且黏著層2之凝聚力為充分高者。 The content of the polymerizable monomer (b) used in the adhesive resin composition (A) of the present invention is preferably 60 to 90% by mass, more preferably 65 to 85% by mass. When the content of the polymerizable monomer (b) in the adhesive composition is from 60 to 90% by mass, the adhesive force of the adhesive layer 2 can be sufficiently obtained, and the cohesive force of the adhesive layer 2 is sufficiently high.

黏著樹脂組成物(A)亦可在對黏著性、強度、耐熱性等之黏著層2的功能不造成影響的程度,除了具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)以外亦包含其他的聚合物。 The adhesive resin composition (A) may also have a degree of influence on the function of the adhesive layer 2 such as adhesion, strength, heat resistance, etc., except for the poly(meth) acrylate having a (meth) acrylonitrile group (a) Other polymers are also included in addition to the polymerizable monomer (b).

作為其他的聚合物之例子亦可使用例如:天然橡膠、聚丁二烯橡膠等之共軛二烯聚合物;丁基橡膠;苯乙烯-丁二烯無規共聚物、苯乙烯-異戊二烯無規共聚物等之芳香族乙烯基-共軛二烯共聚物;芳香族乙烯基-共軛二烯共聚物之氫化物;丙烯腈-丁二烯共聚合橡膠等之氰化乙烯化合物-共軛二烯共聚物;氰化乙烯-芳香族乙烯基-共軛二烯共聚物;氰化乙烯化合物-共軛二烯共聚物與聚(鹵乙烯)之混合物;聚表氯醇橡膠等之聚表鹵代醇橡膠;聚乙烯氧化物、聚丙烯氧化物等之聚伸烷基氧化物; 乙烯-丙烯-二烯共聚物(EPDM);矽酮橡膠;氟橡膠;聚乙烯;乙烯-丙烯共聚物等之乙烯-α-烯烴共聚物;聚丙烯等之α-烯烴聚合物;聚氯乙烯樹脂等之聚鹵乙烯樹脂;聚偏二氯乙烯樹脂等之聚鹵亞乙烯樹脂;環氧樹脂;酚樹脂;聚苯醚樹脂;耐隆-6等之聚醯胺;聚胺基甲酸酯;聚酯;聚乙酸乙烯酯;聚(乙烯-乙烯醇)等。可單獨使用或將二種以上組合使用。 As another example of the polymer, for example, a conjugated diene polymer such as natural rubber or polybutadiene rubber; butyl rubber; styrene-butadiene random copolymer, styrene-isoprene can be used. An aromatic vinyl-conjugated diene copolymer such as an olefin random copolymer; a hydride of an aromatic vinyl-conjugated diene copolymer; a vinyl cyanide compound such as an acrylonitrile-butadiene copolymer rubber Conjugated diene copolymer; ethylene cyanide-aromatic vinyl-conjugated diene copolymer; mixture of vinyl cyanide compound-conjugated diene copolymer and poly(vinyl halide); polyepichlorohydrin rubber, etc. Polyepianol rubber; polyalkylene oxide of polyethylene oxide, polypropylene oxide, etc.; Ethylene-propylene-diene copolymer (EPDM); anthrone rubber; fluororubber; polyethylene; ethylene-α-olefin copolymer such as ethylene-propylene copolymer; α-olefin polymer such as polypropylene; polyvinyl chloride Polyvinyl halide resin such as resin; polyvinyl halide resin such as polyvinylidene chloride resin; epoxy resin; phenol resin; polyphenylene ether resin; polyamine which is resistant to uranium-6; ; polyester; polyvinyl acetate; poly(ethylene vinyl alcohol) and the like. They may be used alone or in combination of two or more.

對黏著樹脂組成物(A)為100質量份而言,具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)之合計含量係較佳為80質量份以上,更佳為90質量份以上,再更佳為100質量份。藉由將具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)之合計含量設為80質量份以上,而成為可充分得到黏著層2之黏著力,並且黏著層2之凝聚力為充分高者。 The total content of the (meth)acrylonitrile-based polyurethane (a) and the polymerizable monomer (b) is preferably 80% by mass based on 100 parts by mass of the adhesive resin composition (A). The amount is more than 90 parts by mass, more preferably 100 parts by mass. By setting the total content of the (meth)acrylonitrile group-containing polyurethane (a) and the polymerizable monomer (b) to 80 parts by mass or more, the adhesion of the adhesive layer 2 can be sufficiently obtained. , and the cohesive force of the adhesive layer 2 is sufficiently high.

「聚合起始劑(E)」 "Polymerization initiator (E)"

作為聚合起始劑(E)雖可使用熱聚合起始劑及光聚合起始劑等,但就製造容易性的觀點而言,較佳為使用光聚合起始劑。 A thermal polymerization initiator, a photopolymerization initiator, and the like can be used as the polymerization initiator (E). However, from the viewpoint of easiness of production, a photopolymerization initiator is preferably used.

作為光聚合起始劑係可列舉:二苯基酮、二苯基乙烷二酮等之羰系光聚合起始劑;二苯基二硫化物、四甲基銨一硫化物等之硫化物系光聚合起始劑;2,4,6-三甲基苯甲醯基二苯基膦氧化物等之醯基膦氧化物類;苯醌、蒽醌等之醌系光聚合起始劑;偶氮二異丁腈、2,2’-偶氮二丙烷等 之偶氮系光聚合起始劑;磺醯氯系光聚合起始劑;噻噸酮、2-氯噻噸酮等之噻噸酮系光聚合起始劑;過氧化苯甲醯等之過氧化物系光聚合起始劑等,亦可二種以上併用。 Examples of the photopolymerization initiator include carbonyl photopolymerization initiators such as diphenyl ketone and diphenyl ethane diketone; and sulfides such as diphenyl disulfide and tetramethylammonium monosulfide; a photopolymerization initiator; a mercaptophosphine oxide such as 2,4,6-trimethylbenzhydryldiphenylphosphine oxide; an oxime photopolymerization initiator of benzoquinone or anthracene; Azobisisobutyronitrile, 2,2'-azodipropane, etc. An azo-based photopolymerization initiator; a sulfonium chloride-based photopolymerization initiator; a thioxanthone-based photopolymerization initiator such as thioxanthone or 2-chlorothioxanthone; An oxide photopolymerization initiator or the like may be used in combination of two or more kinds.

上述當中,就於黏著劑組成物中之溶解性的觀點而言,作為光聚合起始劑較佳為醯基膦氧化物類,更佳為2,4,6-三甲基苯甲醯基二苯基膦氧化物。 Among the above, from the viewpoint of solubility in the adhesive composition, the photopolymerization initiator is preferably a mercaptophosphine oxide, more preferably 2,4,6-trimethylbenzylidene. Diphenylphosphine oxide.

於黏著層2所使用之黏著劑組成物中,較佳為對黏著樹脂組成物(A)100質量份而言,包含0.1~5.0質量份之光聚合起始劑(E)。於黏著層2所使用之黏著劑組成物中,較佳為對黏著樹脂組成物(A)100質量份而言,包含250~900質量份之熱傳導性填料(B)。特佳為對黏著樹脂組成物(A)100質量份而言,包含250~900質量份之熱傳導性填料(B),與0.1~5.0質量份之光聚合起始劑(E)。 In the adhesive composition for the adhesive layer 2, it is preferable to contain 0.1 to 5.0 parts by mass of the photopolymerization initiator (E) per 100 parts by mass of the adhesive resin composition (A). In the adhesive composition for the adhesive layer 2, it is preferable to contain 250 to 900 parts by mass of the thermally conductive filler (B) for 100 parts by mass of the adhesive resin composition (A). It is particularly preferable to contain 250 to 900 parts by mass of the thermally conductive filler (B) and 0.1 to 5.0 parts by mass of the photopolymerization initiator (E) per 100 parts by mass of the adhesive resin composition (A).

若對黏著樹脂組成物(A)100質量份而言,熱傳導性填料(B)之含量為250質量份以上,則可將發熱體的熱隔著黏著層2有效率地傳導至金屬薄片層1。 When the content of the thermally conductive filler (B) is 250 parts by mass or more for 100 parts by mass of the adhesive resin composition (A), the heat of the heating element can be efficiently conducted to the foil layer 1 via the adhesive layer 2 .

若熱傳導性填料(B)之含量相對於黏著樹脂組成物(A)100質量份為900質量份以下,則成為發熱體及金屬薄片層1之接合強度為充分高的黏著層2。熱傳導性填料(B)之含量係更佳為相對於黏著樹脂組成物(A)100質量份為700質量份以下。熱傳導性填料(B)之含量的上限係可因應需要而任意選擇,可為相對於黏著樹脂組成物(A)100質量份為600質量份以下,或400質量份以 下。 When the content of the heat conductive filler (B) is 900 parts by mass or less based on 100 parts by mass of the adhesive resin composition (A), the adhesive layer 2 having a sufficiently high bonding strength between the heat generating body and the metal foil layer 1 is obtained. The content of the heat conductive filler (B) is preferably 700 parts by mass or less based on 100 parts by mass of the adhesive resin composition (A). The upper limit of the content of the thermally conductive filler (B) may be arbitrarily selected as needed, and may be 600 parts by mass or less, or 400 parts by mass, per 100 parts by mass of the adhesive resin composition (A). under.

在使用金屬水合物作為熱傳導性填料(B)的情況,若金屬水合物之含量相對於黏著樹脂組成物(A)100質量份為250質量份以上,則可得到難燃性高的層合薄片10。為了更進一步提高層合薄片10之難燃性,更佳為將金屬水合物之含量設為相對於黏著樹脂組成物(A)100質量份為290質量份以上。 When a metal hydrate is used as the thermally conductive filler (B), if the content of the metal hydrate is 250 parts by mass or more based on 100 parts by mass of the adhesive resin composition (A), a laminate sheet having high flame retardancy can be obtained. 10. In order to further improve the flame retardancy of the laminated sheet 10, the content of the metal hydrate is more preferably 290 parts by mass or more based on 100 parts by mass of the adhesive resin composition (A).

對黏著樹脂組成物(A)100質量份而言,黏著劑組成物中之聚合起始劑(E)的含量較佳為0.1~5質量份,更佳為0.2~4質量份,再更佳為0.5~2質量份。若聚合起始劑(E)的含量相對於黏著樹脂組成物(A)100質量份為0.1~5質量份,則可充分得到黏著劑組成物之光硬化性,並且可充分得到黏著層2之黏著力。 The content of the polymerization initiator (E) in the adhesive composition is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 4 parts by mass, even more preferably 100 parts by mass of the adhesive resin composition (A). It is 0.5 to 2 parts by mass. When the content of the polymerization initiator (E) is 0.1 to 5 parts by mass based on 100 parts by mass of the adhesive resin composition (A), the photocurability of the adhesive composition can be sufficiently obtained, and the adhesive layer 2 can be sufficiently obtained. Adhesion.

黏著層2所使用的黏著劑組成物亦可為了提昇黏著層2之黏著力,而進一步包含與聚胺基甲酸酯(a)不同的樹脂。 The adhesive composition used for the adhesive layer 2 may further contain a resin different from the polyurethane (a) in order to enhance the adhesion of the adhesive layer 2.

作為樹脂雖無特別限定,但可列舉:松香、松香之酯化物等之松香系樹脂;二萜烯聚合物、α-蒎烯-酚共聚物等之萜烯系樹脂;脂肪族系(C5系)、芳香族系(C9系)等之石油樹脂;苯乙烯系樹脂、酚系樹脂、二甲苯樹脂等,亦可二種以上併用。 The resin is not particularly limited, and examples thereof include rosin-based resins such as rosin and rosin esterified compounds; terpene-based resins such as diterpene polymers and α-pinene-phenol copolymers; and aliphatic systems (C5-based systems). A petroleum resin such as an aromatic system (C9 series); a styrene resin, a phenol resin, a xylene resin, or the like may be used in combination of two or more kinds.

黏著層2所使用的黏著劑組成物亦可因應需要而進一步包含添加劑。 The adhesive composition used for the adhesive layer 2 may further contain an additive as needed.

作為添加劑雖無特別限定,但可列舉:分散劑、可塑 劑、表面潤滑劑、整平劑、軟化劑、抗氧化劑、抗老化劑、紫外線吸收劑、聚合抑制劑、苯并三唑系等之光安定劑、磷酸酯系及其他的難燃劑、界面活性劑等之抗靜電劑等。 The additive is not particularly limited, but examples thereof include a dispersing agent and a plasticizer. Agents, surface lubricants, leveling agents, softeners, antioxidants, anti-aging agents, UV absorbers, polymerization inhibitors, benzotriazole-based light stabilizers, phosphate esters and other flame retardants, interfaces An antistatic agent such as an active agent.

「剝離薄片」 "stripping sheet"

作為剝離薄片3的例子雖無特別限定,但可列舉例如藉由剝離處理劑將表面處理後的塑膠薄膜。 The example of the release sheet 3 is not particularly limited, and examples thereof include a plastic film which has been surface-treated by a release treatment agent.

作為剝離處理劑係可使用矽酮系、長鏈烷基系、氟系等者。作為塑膠薄膜係可列舉聚對苯二甲酸乙二酯(PET)薄膜等。 As the release treatment agent, an anthrone type, a long-chain alkyl type, a fluorine type or the like can be used. Examples of the plastic film include a polyethylene terephthalate (PET) film and the like.

「層合薄片之製造方法」 "Method for manufacturing laminated sheets"

接著,作為本發明之層合薄片之製造方法的一例,列舉第1圖所示之層合薄片10之製造方法為例進行說明。 Next, as an example of the method for producing a laminated sheet of the present invention, a method of producing the laminated sheet 10 shown in Fig. 1 will be described as an example.

首先,藉由於剝離薄片3的其中一面,形成黏著層2,而製成黏著薄片。 First, the adhesive layer 2 is formed by peeling off one side of the sheet 3 to form an adhesive sheet.

作為黏著層2之形成方法係可列舉例如:於剝離薄片3的其中一面塗佈上述之黏著劑組成物,照射紫外線而硬化的方法等。 The method of forming the pressure-sensitive adhesive layer 2 is, for example, a method in which the above-described pressure-sensitive adhesive composition is applied to one surface of the release sheet 3, and is cured by irradiation with ultraviolet rays.

黏著劑組成物之塗佈方法雖無特別限定,但可列舉例如使用凹版輥式塗佈機、反向輥式塗佈機、接觸輥式塗佈機、浸漬輥式塗佈機、刮棒塗佈機、刀塗佈機、噴塗機、點塗佈機、直接塗佈機等的方法。 The coating method of the adhesive composition is not particularly limited, and examples thereof include a gravure roll coater, a reverse roll coater, a contact roll coater, a dip roll coater, and a bar coating. A method such as a cloth machine, a knife coater, a spray coater, a spot coater, or a direct coater.

在照射紫外線來使黏著劑組成物硬化的情況,紫外線之照射量係較佳為500~5000mJ/cm2When the ultraviolet ray is irradiated to cure the adhesive composition, the ultraviolet ray irradiation amount is preferably 500 to 5,000 mJ/cm 2 .

於如此方式所得到的黏著薄片中,係可在直至將黏著薄片進行使用的期間,為了保護黏著層2,而於黏著層2上配置保護用之剝離薄片,成為將黏著層2挾持在2片剝離薄片之間的形狀。又,亦可藉由使用其兩面為藉由剝離處理劑加以處理後者作為剝離薄片3,並將黏著薄片捲繞成滾筒狀,成為黏著層2被挾持在剝離薄片之間的狀態,直至黏著薄片之使用時。 In the adhesive sheet obtained in this manner, in order to protect the adhesive layer 2 during the use of the adhesive sheet, the protective release sheet is placed on the adhesive layer 2, and the adhesive layer 2 is held in two sheets. The shape between the sheets is peeled off. Further, the latter may be treated as a release sheet 3 by using a release treatment agent on both sides, and the adhesive sheet may be wound into a roll shape to be in a state in which the adhesive layer 2 is held between the release sheets until the adhesive sheet is adhered. When used.

另外,於黏著層2上配置保護用之剝離薄片的情況,亦可在配置保護用之剝離薄片之前使成為黏著層2之黏著劑組成物硬化,亦可在配置保護用之剝離薄片之後,使成為黏著層2之黏著劑組成物硬化。在配置保護用之剝離薄片後,使成為黏著層2之黏著劑組成物硬化的情況中,作為剝離薄片3及/或保護用之剝離薄片係使用具有光透過性者。 Further, when the release sheet for protection is disposed on the adhesive layer 2, the adhesive composition to be the adhesive layer 2 may be cured before the release sheet for protection is disposed, or after the release sheet for protection may be disposed. The adhesive composition that becomes the adhesive layer 2 hardens. In the case where the adhesive sheet for the adhesive layer 2 is cured after the release sheet for protection is disposed, the release sheet 3 and/or the release sheet for protection are used to have light transparency.

接著,將黏著薄片與由熱輻射層11及金屬層12所構成的金屬薄片進行層合而形成層合薄片10。於黏著薄片之黏著層2上配置保護用之剝離薄片的情況中,係將保護用之剝離薄片去除後,與金屬薄片進行層合。黏著薄片與金屬薄片係使黏著薄片之黏著層2與金屬薄片層1之金屬層12側對向。 Next, the adhesive sheet is laminated with the metal foil composed of the heat radiation layer 11 and the metal layer 12 to form a laminated sheet 10. In the case where the release sheet for protection is disposed on the adhesive layer 2 of the adhesive sheet, the release sheet for protection is removed, and then laminated with the metal sheet. The adhesive sheet and the metal foil are such that the adhesive layer 2 of the adhesive sheet faces the metal layer 12 side of the metal foil layer 1.

亦可在層合步驟時,使用真空貼合裝置、高壓釜、加壓機等,以避免於黏著薄片與金屬薄片層1之間 咬入氣泡,亦即避免氣泡產生。 In the laminating step, a vacuum laminating device, an autoclave, a press machine, or the like may be used to avoid the adhesion between the adhesive sheet and the foil layer 1 Biting into the bubble, that is, avoiding bubble generation.

在將層合薄片10接合於發熱體時,係卸除剝離薄片3而將黏著層2之露出面接合於發熱體。 When the laminated sheet 10 is joined to the heat generating body, the peeling sheet 3 is removed to bond the exposed surface of the adhesive layer 2 to the heat generating body.

本實施形態之層合薄片10係具有金屬薄片層1,與層合於金屬薄片層1的金屬層12側之面的黏著層2。因此,藉由使黏著層2緊密接著於發熱體而可將層合薄片10接合於發熱體。因此,本實施形態之層合薄片10係可將層合薄片容易地接合於發熱體。 The laminated sheet 10 of the present embodiment has the metal foil layer 1 and an adhesive layer 2 laminated on the surface of the metal foil layer 1 on the metal layer 12 side. Therefore, the laminated sheet 10 can be joined to the heat generating body by closely adhering the adhesive layer 2 to the heat generating body. Therefore, in the laminated sheet 10 of the present embodiment, the laminated sheet can be easily joined to the heat generating body.

由於本實施形態之層合薄片10係黏著層2為含有黏著樹脂與熱傳導性填料者,因此例如與黏著層為僅由黏著樹脂所構成者相比較,可將發熱體的熱有效率地傳導至層合薄片10。因此,本實施形態之層合薄片10係可將發熱體的熱有效率地散熱。 Since the laminated sheet 10 of the present embodiment is an adhesive layer 2 containing an adhesive resin and a thermally conductive filler, for example, the heat of the heat generating body can be efficiently conducted to the adhesive layer as compared with the case where only the adhesive resin is used. Laminated sheet 10. Therefore, the laminated sheet 10 of the present embodiment can efficiently dissipate heat of the heat generating body.

第1圖所示之層合薄片10的黏著層2係在使包含黏著樹脂組成物(A)、前述熱傳導性填料(B)、以及聚合起始劑(E)之黏著劑組成物的硬化而成者之情況中,成為發熱體與層合薄片10之接合強度為優異者,該黏著樹脂組成物(A)係包含具有(甲基)丙烯醯基之聚胺基甲酸酯(a)及聚合性單體(b)。 The adhesive layer 2 of the laminated sheet 10 shown in Fig. 1 is cured by an adhesive composition containing the adhesive resin composition (A), the thermally conductive filler (B), and the polymerization initiator (E). In the case of the case, the bonding strength between the heating element and the laminated sheet 10 is excellent, and the adhesive resin composition (A) contains a (meth) acrylonitrile-based polyurethane (a) and Polymerizable monomer (b).

由於第1圖所示之層合薄片10係於黏著層2之與金屬薄片層1相反側之面層合有剝離薄片3者,因此在直至將層合薄片10接合於發熱體的期間,可藉由剝離薄片3來保護黏著層2。 Since the laminated sheet 10 shown in FIG. 1 is formed by laminating the release sheet 3 on the surface of the adhesive layer 2 opposite to the metal foil layer 1, the laminate sheet 10 can be bonded to the heating element until the laminated sheet 10 is bonded thereto. The adhesive layer 2 is protected by peeling off the sheet 3.

於本實施形態之層合薄片10之製造方法中, 係藉由使黏著薄片之黏著層2與金屬薄片層1之金屬層12側的面對向來層合黏著薄片與金屬薄片,而得到層合薄片10,該黏著薄片係於剝離薄片3的其中一面具有黏著層2;該金屬薄片係於單面具有熱輻射層11。 In the method of manufacturing the laminated sheet 10 of the present embodiment, The adhesive sheet and the metal foil are laminated by facing the adhesive layer 2 of the adhesive sheet and the metal layer 12 side of the metal foil layer 1, thereby obtaining a laminated sheet 10 which is attached to one side of the peeling sheet 3. There is an adhesive layer 2; the metal foil has a heat radiation layer 11 on one side.

另外,作為於金屬薄片層1之金屬層側的面1b形成黏著層的方法之例子,例如,亦可使用於金屬薄片層1之金屬層側的面1b塗佈含有黏著樹脂組成物(A)與熱傳導性填料(B)之黏著劑組成物,並使其硬化的方法。 In addition, as an example of a method of forming an adhesive layer on the surface 1b of the metal foil layer 1 on the metal layer side, for example, it is also possible to apply the adhesive resin composition (A) to the surface 1b on the metal layer side of the metal foil layer 1. A method of hardening a composition with an adhesive of a thermally conductive filler (B).

第1圖所示之層合薄片10係可容易接合於發熱體,並且可在接合於發熱體之後容易重貼,進而,可將發熱體的熱有效率地散熱者。因而,層合薄片10係可適合作為用以將在發熱體所產生的熱進行散熱之散射片來使用。作為發熱體係可列舉例如:半導體晶片、電晶體、冷凝器等之電子零件、電池(battery)等之電氣零件。作為發熱體的其他例子係可進一步列舉:電子電路基板、太陽能電池面板、照明器具、顯示器背光、液晶投影機、LED燈、訊號、行動電話、智慧型手機、個人電腦、平板電腦、伺服器、小型遊戲機、太陽能電池面板記憶體模組、放大器、各種電池、及相機模組等。 The laminated sheet 10 shown in Fig. 1 can be easily joined to the heat generating body, and can be easily reattached after being joined to the heat generating body, and further, the heat of the heat generating body can be efficiently radiated. Therefore, the laminated sheet 10 can be suitably used as a diffusion sheet for dissipating heat generated in the heat generating body. Examples of the heat generating system include electrical components such as a semiconductor wafer, a transistor, a condenser, and the like, and an electric component such as a battery. Other examples of the heating element include an electronic circuit board, a solar cell panel, a lighting fixture, a display backlight, a liquid crystal projector, an LED lamp, a signal, a mobile phone, a smart phone, a personal computer, a tablet computer, a server, Small game consoles, solar panel memory modules, amplifiers, various batteries, and camera modules.

本發明之層合薄片並不限於上述之第1圖所示之層合薄片10。 The laminated sheet of the present invention is not limited to the laminated sheet 10 shown in Fig. 1 described above.

例如,於第1圖所示之層合薄片10中,雖列舉於黏著層2之與金屬薄片層1相反側之面層合有剝離薄片3的 情況為例進行說明,但亦可無剝離薄片。 For example, in the laminated sheet 10 shown in Fig. 1, the release sheet 3 is laminated on the surface of the adhesive layer 2 opposite to the metal foil layer 1. The case will be described as an example, but there may be no peeling sheet.

[實施例] [Examples]

以下,雖藉由實施例而更具體地說明本發明,但本發明並不受此等例子任何限定。 Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by these examples.

(實施例A-1) (Example A-1) <聚胺基甲酸酯(a)之合成> <Synthesis of Polyurethane (a)>

將異佛酮二異氰酸酯及作為於末端具有羥基價為56mgKOH/g之羥基的聚丙二醇之商品名「D-2000」(Mitsui Fine Chemicals股份有限公司製,數量平均分子量:2000)以前者為15莫耳,後者為14莫耳之比例裝入於具備有溫度計、攪拌機、滴下漏斗、附有乾燥管之冷卻管的四口燒瓶中。其後,對於前述異佛酮二異氰酸酯及聚丙二醇,添加二月桂酸二辛基錫100wt ppm,昇溫至70℃,進行反應4小時,而得到於末端具有異氰酸基之聚胺基甲酸酯。 The product name "D-2000" (manufactured by Mitsui Fine Chemicals Co., Ltd., number average molecular weight: 2000) of isophorone diisocyanate and polypropylene glycol having a hydroxyl group having a hydroxyl group of 56 mgKOH/g at the end is 15 mol. The ear, which was 14 moles, was placed in a four-necked flask equipped with a thermometer, a stirrer, a dropping funnel, and a cooling tube with a drying tube. Thereafter, 100 wt% of dioctyltin dilaurate was added to the above isophorone diisocyanate and polypropylene glycol, and the temperature was raised to 70 ° C to carry out a reaction for 4 hours to obtain a polyaminocarboxylic acid having an isocyanate group at the terminal. ester.

接著,對於所得之聚胺基甲酸酯1莫耳,添加2-羥乙基丙烯酸酯2莫耳,昇溫至70℃,進行反應2小時,而得到於末端具有重量平均分子量為70,000之丙烯醯基的聚胺基甲酸酯(a)。此時,藉由IR頻譜,確認來自異氰酸基之吸收峰值消失之後,結束反應。 Next, 2 mol of 2-hydroxyethyl acrylate was added to the obtained polyurethane, and the temperature was raised to 70 ° C, and the reaction was carried out for 2 hours to obtain an acrylonitrile having a weight average molecular weight of 70,000 at the terminal. The base of the polyurethane (a). At this time, it was confirmed by the IR spectrum that the absorption peak derived from the isocyanate group disappeared, and the reaction was terminated.

<黏著樹脂組成物(A)之製造> <Manufacture of Adhesive Resin Composition (A)>

將如此方式所得到的聚胺基甲酸酯(a)100質量份、以及作為聚合性單體(b)之2-乙基己基丙烯酸酯252質量份與異硬脂基丙烯酸酯196質量份與丙烯酸18質量份與2-羥乙基丙烯酸酯10質量份,在燒瓶中進行混合,而得到黏著樹脂組成物(A)。 100 parts by mass of the polyurethane (a) obtained in this manner, and 252 parts by mass of 2-ethylhexyl acrylate as the polymerizable monomer (b) and 196 parts by mass of isostearyl acrylate 18 parts by mass of acrylic acid and 10 parts by mass of 2-hydroxyethyl acrylate were mixed in a flask to obtain an adhesive resin composition (A).

<黏著劑組成物之製造> <Manufacture of Adhesive Composition>

對於如此所得到的黏著樹脂組成物(A)100質量份,將作為熱傳導性填料(B)之D50為18μm的氫氧化鋁(昭和電工公司製,商品名HIGILITE(商標)H-31)300質量份,與作為光聚合起始劑(E)之2,4,6-三甲基苯甲醯基二苯基膦氧化物(BASF公司製,商品名:LUCIRIN TPO)0.8質量份,在室溫下使用散佈機(diaper)進行混合,而調整均勻的黏著劑組成物。 300 parts by mass of aluminum hydroxide (manufactured by Showa Denko KK, trade name HIGILITE (trademark) H-31) having a D50 of 40 μm as a heat conductive filler (B), as a heat conductive filler (B), 100 parts by mass of the adhesive resin composition (A). And 0.8 parts by mass of 2,4,6-trimethylbenzimidyl diphenylphosphine oxide (manufactured by BASF Corporation, trade name: LUCIRIN TPO) as a photopolymerization initiator (E) at room temperature The diaper is used for mixing, and the uniform adhesive composition is adjusted.

<層合薄片之製造> <Manufacture of laminated sheets>

使用如此方式所調整的黏著劑組成物,藉由以下所示之方法,形成第1圖所示之層合薄片。 Using the adhesive composition adjusted in this manner, the laminated sheet shown in Fig. 1 was formed by the method shown below.

使用塗抹器以使膜厚(硬化後之平均厚度)成為0.4mm厚的方式將黏著劑組成物塗佈於藉由剝離處理劑將表面處理後的厚度75μm之剝離PET薄膜(200mm×200mm)。其後,於由黏著劑組成物所構成的塗膜上配置相同剝離PET薄膜。接著,於其中一方的剝離PET薄膜上,使用紫外線照射裝置(日本電池股份有限公司製,UV照射裝 置4kw×1,輸出:160W/cm,金屬鹵素燈),以照射距離12cm、燈移動速度20m/min、照射量約1000mJ/cm2之條件照射紫外線,使黏著劑組成物硬化。 The adhesive composition was applied to a peeled PET film (200 mm × 200 mm) having a thickness of 75 μm which was surface-treated by a release treatment agent so that the film thickness (average thickness after hardening) was 0.4 mm thick using an applicator. Thereafter, the same peeled PET film was placed on the coating film composed of the adhesive composition. Next, on one of the peeling PET films, an ultraviolet irradiation device (manufactured by Nippon Battery Co., Ltd., UV irradiation device 4 kw × 1, output: 160 W/cm, metal halide lamp) was used, and the irradiation distance was 12 cm, and the lamp moving speed was 20 m. /min, and the irradiation amount of about 1000 mJ/cm 2 is irradiated with ultraviolet rays to harden the adhesive composition.

藉由以上的步驟,得到將厚度0.4mm之黏著層挾持於2片剝離PET薄膜之間的黏著薄片。 By the above procedure, an adhesive sheet in which an adhesive layer having a thickness of 0.4 mm was held between two peeling PET films was obtained.

接著,將去除其中一方之剝離PET薄膜後的黏著薄片,與第1圖所示之由熱輻射層11與金屬層12所構成的鋁金屬薄片(昭和電工製:碳塗覆箔SDX(商標),厚度:0.05mm)進行層合,而形成層合體。在此使用的熱輻射層係包含碳黑作為熱輻射填料,且作為黏合劑成分係使幾丁聚醣衍生物藉由酸交聯而成者。熱輻射層之厚度為1μm。黏著薄片與金屬薄片係使黏著薄片之黏著層與金屬薄片之金屬層側對向來進行層合。 Then, the adhesive sheet after peeling off one of the PET films and the aluminum foil formed of the heat radiation layer 11 and the metal layer 12 shown in Fig. 1 (made by Showa Denko: carbon coated foil SDX (trademark)) , thickness: 0.05 mm) was laminated to form a laminate. The heat radiation layer used herein contains carbon black as a heat radiation filler, and as a binder component, a chitosan derivative is crosslinked by an acid. The thickness of the heat radiation layer was 1 μm. The adhesive sheet and the metal foil are laminated such that the adhesive layer of the adhesive sheet is opposed to the metal layer side of the metal foil.

表1所示之金屬薄片的厚度係平均厚度。 The thickness of the metal foil shown in Table 1 is the average thickness.

接著,將所得到的黏著薄片與金屬薄片之層合體於40℃、0.5MPa之高壓釜中進行固化處理(curing)10分鐘。藉此,可將黏著層與金屬薄片充分接合,並且將黏著層與金屬薄片之間的氣泡去除,而得到第1圖所示之層合薄片(A-1)。 Next, the obtained laminate of the adhesive sheet and the metal foil was subjected to curing in an autoclave at 40 ° C and 0.5 MPa for 10 minutes. Thereby, the adhesive layer and the metal foil can be sufficiently bonded, and the air bubbles between the adhesive layer and the metal foil can be removed to obtain the laminated foil (A-1) shown in Fig. 1.

(實施例A-2) (Example A-2)

除了將熱傳導性填料(B)設為作為D50為9μm之氧化鋁(昭和電工公司製,商品名AS-50)390質量份以外,以與實施例A-1之層合薄片相同的方式,得到實施例 A-2之層合薄片。 In the same manner as the laminated sheet of Example A-1, except that the thermally conductive filler (B) was used as 390 parts by mass of alumina having a D50 of 9 μm (trade name: AS-50, manufactured by Showa Denko Co., Ltd.). Example Laminate sheet of A-2.

(實施例A-3) (Example A-3)

除了將由實施例A-1之熱輻射層11與金屬層12所構成的鋁金屬薄片之厚度變更成0.1mm以外,以與實施例A-1之層合薄片相同的方式,得到實施例A-3之層合薄片。另外,熱輻射層的條件係相同。 Example A was obtained in the same manner as the laminated sheet of Example A-1 except that the thickness of the aluminum metal foil composed of the heat radiation layer 11 and the metal layer 12 of Example A-1 was changed to 0.1 mm. 3 laminated sheets. In addition, the conditions of the heat radiation layer are the same.

(實施例A-4) (Example A-4)

除了將實施例A-1之第1圖所示之由熱輻射層11與金屬層12所構成的鋁金屬薄片變更成銅金屬薄片(昭和電工製:碳塗覆銅箔CDX)0.01mm厚以外,以與實施例A-1之層合薄片相同的方式,得到實施例A-4之層合薄片。另外,熱輻射層的條件係相同。 In addition to the aluminum foil of the heat radiation layer 11 and the metal layer 12 shown in the first embodiment of the embodiment A-1, it is changed to a copper foil (manufactured by Showa Denko: carbon coated copper foil CDX) of 0.01 mm thick. The laminated sheet of Example A-4 was obtained in the same manner as the laminated sheet of Example A-1. In addition, the conditions of the heat radiation layer are the same.

(比較例B-1) (Comparative Example B-1)

除了將金屬薄片設為50μm之鋁箔以外,以與實施例A-1之層合薄片相同的方式,得到比較例B-1之層合薄片。 A laminated sheet of Comparative Example B-1 was obtained in the same manner as in the laminated sheet of Example A-1 except that the metal foil was set to an aluminum foil of 50 μm.

(比較例B-2) (Comparative Example B-2)

除了將金屬薄片設為經表面處理的熱輻射薄片以外,具體而言係除了使用神戶製鋼公司製之「KOBEHONETSU(商標)‧鋁KS750」(單面熱輻射塗覆材(0.1mm 厚))以外,以與實施例A-1之層合薄片相同的方式,得到比較例B-2之層合薄片。於此熱輻射薄片中,金屬層為鋁層,熱輻射層並不包含於本發明之熱輻射層的範圍中。 In addition to using a foil as a surface-treated heat radiation sheet, in particular, "KOBEHONETSU (trademark) ‧ aluminum KS750" manufactured by Kobe Steel Co., Ltd. (single-sided heat radiation coating material (0.1 mm) A laminate sheet of Comparative Example B-2 was obtained in the same manner as in the laminated sheet of Example A-1 except for the thickness). In the heat radiating sheet, the metal layer is an aluminum layer, and the heat radiating layer is not included in the range of the heat radiating layer of the present invention.

(比較例B-3) (Comparative Example B-3)

在黏著組成物製造時,除了不添加熱傳導性填料(B),且將黏著層的厚度設為0.05mm以外,以與實施例A-1之層合薄片相同的方式,得到比較例B-3之層合薄片。 In the production of the adhesive composition, Comparative Example B-3 was obtained in the same manner as in the laminated sheet of Example A-1 except that the thermally conductive filler (B) was not added and the thickness of the adhesive layer was set to 0.05 mm. Laminated sheets.

(比較例B-4) (Comparative Example B-4)

除了將金屬薄片設為10μm之銅箔,且將黏著層的厚度設為0.1mm以外,以與實施例A-1之層合薄片相同的方式,得到比較例B-4之層合薄片。 A laminated sheet of Comparative Example B-4 was obtained in the same manner as in the laminated sheet of Example A-1 except that the metal foil was a copper foil of 10 μm and the thickness of the adhesive layer was 0.1 mm.

針對實施例A-1、A-2、比較例B-1、B-2之層合薄片各者,使用上述的方法來求出黏著層之黏著力。又,針對實施例A-1、A-2、比較例B-1、B-2之層合薄片各者,使用下述的方法來評估散熱性。將該等之結果顯示於表2。 For each of the laminated sheets of Examples A-1 and A-2 and Comparative Examples B-1 and B-2, the adhesion of the adhesive layer was determined by the above method. Further, for each of the laminated sheets of Examples A-1 and A-2 and Comparative Examples B-1 and B-2, the heat dissipation property was evaluated by the following method. The results of these are shown in Table 2.

(散熱性之評估) (Evaluation of heat dissipation)

將剝離PET薄膜剝離後的縱60mm、橫60mm之正方形的層合薄片,於縱60mm、橫60mm之正方形的陶瓷加熱器(坂口電熱公司製WALN-1)之兩面,使黏著薄片之黏著層與陶瓷加熱器對向來進行層合。接著,測定將陶瓷加熱器以5W進行加熱時之加熱器溫度(60分鐘後),評估散熱性。評估係在室溫25℃、濕度50%的環境下進行。 A laminated sheet of 60 mm in length and 60 mm in width after peeling off the PET film was peeled off on both sides of a square ceramic heater (WALN-1 manufactured by Koukou Electric Co., Ltd.) of 60 mm in length and 60 mm in width to make the adhesive layer of the adhesive sheet and The ceramic heater is laminated to the original. Next, the heater temperature (after 60 minutes) when the ceramic heater was heated at 5 W was measured, and the heat dissipation property was evaluated. The evaluation was carried out in an environment of room temperature 25 ° C and a humidity of 50%.

另外,使無貼附層合薄片的狀態之陶瓷加熱器以5W進行散熱時之加熱器溫度為150℃。 Further, the heater temperature in the case where the ceramic heater in the state in which the laminated sheet was not attached was cooled at 5 W was 150 °C.

由以上的結果,可證明本發明之層合薄片係具有優異的散熱性。另一方面,可證明在不具有熱輻射層(比較例1及4)、於黏著層不具有填料(比較例3)、熱輻射層 並非在本發明之範圍的層(比較例2)的比較例中係散熱性為差。 From the above results, it was confirmed that the laminated sheet of the present invention has excellent heat dissipation properties. On the other hand, it can be confirmed that there is no heat radiation layer (Comparative Examples 1 and 4), no filler (Comparative Example 3), and heat radiation layer in the adhesive layer. In the comparative example of the layer (Comparative Example 2) which is not in the range of the present invention, heat dissipation was poor.

1‧‧‧金屬薄片層 1‧‧‧metal foil layer

1a‧‧‧金屬薄片層1之熱輻射層側之面 1a‧‧‧ Surface of the thermal radiation layer on the metal foil layer 1

1b‧‧‧金屬薄片層1之金屬層側之面 1b‧‧‧Metal layer side of metal foil layer 1

2‧‧‧黏著層 2‧‧‧Adhesive layer

2b‧‧‧黏著層之與金屬薄片相反之面 2b‧‧‧ The opposite side of the adhesive layer to the metal foil

3‧‧‧剝離薄片 3‧‧‧ peeling sheet

10‧‧‧層合薄片 10‧‧‧Laminated sheets

11‧‧‧熱輻射層 11‧‧‧thermal radiation layer

12‧‧‧金屬層 12‧‧‧metal layer

Claims (14)

一種層合薄片,其特徵為,含有:由含有熱輻射填料(C)及黏合劑成分(D)之熱輻射層與金屬層所構成的金屬薄片層,以及層合於該金屬薄片層之金屬層側之面的黏著層,該黏著層係含有黏著樹脂組成物(A)與熱傳導性填料(B)。 A laminated sheet comprising: a metal foil layer composed of a heat radiation layer and a metal layer containing a heat radiation filler (C) and a binder component (D), and a metal layer laminated to the metal foil layer An adhesive layer on the side of the layer side, the adhesive layer comprising an adhesive resin composition (A) and a thermally conductive filler (B). 如請求項1之層合薄片,其中,前述熱輻射填料(C)為碳質材料。 The laminated sheet of claim 1, wherein the heat radiation filler (C) is a carbonaceous material. 如請求項2之層合薄片,其中,前述碳質材料係由碳黑、石墨及氣相法碳纖維中選出的1種或2種以上。 The laminated sheet according to claim 2, wherein the carbonaceous material is one or more selected from the group consisting of carbon black, graphite, and fumed carbon fibers. 如請求項1之層合薄片,其中,前述黏合劑成分(D)係含有高分子多醣類及酸交聯劑。 The laminated sheet according to claim 1, wherein the binder component (D) contains a polymer polysaccharide and an acid crosslinking agent. 如請求項4之層合薄片,其中,前述高分子多醣類係由幾丁質、幾丁聚醣及其衍生物中選出的1種或2種以上,前述酸交聯劑係由苯均四酸、偏苯三甲酸、馬來酸、鄰苯二甲酸及該等之酸酐中選出的1種或2種以上。 The laminated sheet according to claim 4, wherein the polymer polysaccharide is one or more selected from the group consisting of chitin, chitosan and derivatives thereof, and the acid crosslinking agent is derived from benzene. One or two or more selected from the group consisting of tetracarboxylic acid, trimellitic acid, maleic acid, phthalic acid, and the like. 如請求項1之層合薄片,其中,前述熱輻射層之平均厚度為0.1~4μm。 The laminated sheet of claim 1, wherein the heat radiation layer has an average thickness of 0.1 to 4 μm. 如請求項1之層合薄片,其中,前述金屬薄片層之平均厚度為0.02~0.5mm。 The laminated sheet of claim 1, wherein the metal foil layer has an average thickness of 0.02 to 0.5 mm. 如請求項1之層合薄片,其中,前述黏著層係含有:黏著樹脂組成物(A)、前述熱傳導性填料(B)以及聚合起始劑(E)之黏著劑組成物的硬化物,該黏著樹脂組成物(A)係含有具有(甲基)丙烯醯基之聚胺基甲酸酯 (a)及聚合性單體(b)。 The laminated sheet according to claim 1, wherein the adhesive layer comprises a cured product of the adhesive composition (A), the thermally conductive filler (B), and the polymerization initiator (E), which is a cured product. The adhesive resin composition (A) contains a poly (meth) acrylate group having a (meth) acrylonitrile group. (a) and a polymerizable monomer (b). 如請求項1之層合薄片,其係含有對前述黏著樹脂組成物(A)100質量份而言為250~900質量份之前述熱傳導性填料(B)。 The laminated thin film of claim 1 which contains 250 to 900 parts by mass of the above-mentioned thermally conductive filler (B) to 100 parts by mass of the above-mentioned adhesive resin composition (A). 如請求項1之層合薄片,其中,前述熱傳導性填料(B)係含有由金屬氧化物及金屬水合物中選出的1種或2種以上。 The laminated sheet according to claim 1, wherein the thermally conductive filler (B) contains one or more selected from the group consisting of metal oxides and metal hydrates. 如請求項1之層合薄片,其中,於前述黏著層之與前述金屬薄片層相反面層合有剝離薄片。 The laminated sheet according to claim 1, wherein a release sheet is laminated on the opposite side of the adhesive layer from the metal foil layer. 一種散熱器(heat spreader),其係由如請求項1之層合薄片所構成。 A heat spreader consisting of the laminated sheet of claim 1. 一種電子機器,其係組入有如請求項12之散熱器。 An electronic machine incorporating a heat sink as claimed in claim 12. 一種層合薄片之製造方法,其特徵為,於剝離薄片上,依此順序層合黏著薄片與金屬薄片,且以使該熱輻射層位於最外面的方式進行層合,該黏著薄片係由含有黏著樹脂組成物(A)及熱傳導性填料(B)之黏著層所構成;該金屬薄片係由金屬層與含有熱輻射填料(C)及黏合劑成分(D)之熱輻射層所構成。 A method for producing a laminated sheet, characterized in that an adhesive sheet and a metal foil are laminated on the release sheet in this order, and the heat radiation layer is laminated on the outermost side, and the adhesive sheet is contained The adhesive layer of the adhesive resin composition (A) and the heat conductive filler (B) is composed of a metal layer and a heat radiation layer containing the heat radiation filler (C) and the binder component (D).
TW104122311A 2014-08-20 2015-07-09 Laminated sheet and manufacturing method of the laminated sheet TWI688473B (en)

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