JP7465816B2 - Method for manufacturing double-sided tape for protecting terminals and semiconductor device with electromagnetic wave shielding film - Google Patents

Description

The present invention relates to a double-sided tape for protecting a terminal and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the same.
This application claims priority based on Japanese Patent Application No. 2018-238855, filed on December 20, 2018, the contents of which are incorporated herein by reference.

Conventionally, when mounting a multi-pin LSI package used in an MPU, gate array, etc., on a printed wiring board, a semiconductor device equipped with multiple electronic components is used, in which convex electrodes (hereinafter referred to as "terminals" in this specification) made of eutectic solder, high-temperature solder, gold, etc. are formed on the connection pads. Then, a mounting method is used in which these terminals are brought face-to-face and into contact with corresponding terminal portions on a chip mounting substrate, and melt/diffusion bonding is performed.

As personal computers have become more widespread, the Internet has become commonplace, and nowadays, even smartphones and tablet devices are connected to the Internet, and digitalized video, music, photos, text information, and other information are increasingly being transmitted over the Internet using wireless communication technology. Furthermore, the spread of the Internet of Things (IoT) is bringing about revolutionary changes in packaging technology for smarter use of semiconductor devices such as sensors, RFID (Radio frequency identifier), MEMS (Micro Electro Mechanical Systems), and wireless components in various application fields such as home appliances and automobiles.

As electronic devices continue to evolve, the demands placed on semiconductor devices are rising year by year. In particular, when trying to meet the needs for higher performance, smaller size, higher integration, lower power consumption, and lower costs, heat countermeasures and noise countermeasures are two key points.

To deal with such heat and noise issues, a method has been adopted in which an electronic component module is coated with a conductive material to form an electromagnetic shielding film, as disclosed in, for example, Patent Document 1. In Patent Document 1, a conductive resin is applied to the top and side surfaces of an individualized electronic component module, and then heated and hardened to form an electromagnetic shielding film.

Well-known methods for forming an electromagnetic shielding film by coating a semiconductor device with terminals with a conductive metal or conductive resin (hereinafter collectively referred to as "conductive material") include sputtering, ion plating, spray coating, etc.

JP 2011-151372 A

In the method of manufacturing electronic components disclosed in Patent Document 1, the external terminal electrodes provided on the rear surface of the assembly substrate are embedded in an adhesive sheet and coated with a conductive resin. Masking sections are provided at predetermined positions on the adhesive sheet, preventing electrical shorts between the external terminal electrodes and the electromagnetic shielding film.

However, providing masking areas at designated positions on the adhesive sheet is a cumbersome process. Therefore, there is a demand for a terminal protection tape that can embed external terminal electrodes that have unevenness, such as solder balls, and are prone to lifting.

On the other hand, in the process of forming an electromagnetic shielding film by a method such as sputtering, ion plating, or spray coating in which a conductive material is applied, the surface temperature of the adhesive sheet rises, which can cause surface roughness on the surface of the adhesive sheet. If the surface of the adhesive sheet becomes rough, the embedded external terminal electrodes become partially exposed, causing an electrical short circuit with the electromagnetic shielding film. In addition, if the surface of the adhesive sheet becomes rough, a part of the side of the singulated electronic component module becomes embedded in the adhesive sheet, which can cause a problem that an electromagnetic shielding film is not formed on the part.

Therefore, the present invention aims to provide a double-sided tape for protecting terminals, which is used in the process of forming an electromagnetic wave shielding film on a semiconductor device with terminals, and which is capable of suppressing an increase in the surface temperature and surface roughness of the double-sided tape for protecting terminals, even in the process of forming an electromagnetic wave shielding film by methods such as sputtering, ion plating, and spray coating, which apply a conductive material, and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the same.

In other words, the present invention provides the following double-sided tape for protecting terminals and a method for manufacturing a semiconductor device with an electromagnetic shielding film using the same.

[1] A double-sided tape for protecting terminals used in a process for forming an electromagnetic wave shielding film on a semiconductor device with terminals, comprising:
A viscoelastic layer, a substrate, and a second pressure-sensitive adhesive layer,
A double-sided tape for protecting a terminal, wherein at least one layer among the viscoelastic layer, the base material, and the second adhesive layer is a thermally conductive layer.
[2] The double-sided tape for protecting a terminal according to [1], wherein at least two layers among the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer are thermally conductive layers.
[3] The double-sided tape for protecting a terminal according to [1] or [2], wherein the thermal conductivity of the thermally conductive layer is 1.0 W/(m·K) or more.
[4] The double-sided tape for protecting a terminal according to any one of [1] to [3], wherein a ratio of a total thickness of the thermally conductive layer to a total thickness of the double-sided tape for protecting a terminal is 0.01 or more.
[5] The double-sided tape for protecting a terminal according to any one of [1] to [4], wherein the viscoelastic layer has an embedding layer and a first pressure-sensitive adhesive layer.
[6] The double-sided tape for protecting a terminal according to [5], comprising the first pressure-sensitive adhesive layer, the embedding layer, the base material, and the second pressure-sensitive adhesive layer in this order.

[7] A step of embedding terminals of a terminal-equipped semiconductor device in the viscoelastic layer of the double-sided tape for protecting a terminal according to any one of [1] to [6];
forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminals;
A method for manufacturing a semiconductor device with an electromagnetic wave shielding film comprising the steps of:
[8] A step of embedding terminals of a terminal-equipped semiconductor device assembly in a viscoelastic layer of the double-sided tape for protecting a terminal according to any one of [1] to [6];
a step of dicing the terminal-attached semiconductor device assembly to obtain a terminal-attached semiconductor device having terminals embedded in a viscoelastic layer of the terminal protection double-sided tape;
forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminals;
A method for manufacturing a semiconductor device with an electromagnetic wave shielding film comprising the steps of:

According to the present invention, there is provided a double-sided tape for protecting terminals, which is used in a process for forming an electromagnetic wave shielding film on a semiconductor device with terminals, and which is capable of suppressing an increase in the surface temperature of the double-sided tape for protecting terminals and surface roughness even in the process of forming an electromagnetic wave shielding film by a method such as sputtering, ion plating, or spray coating in which a conductive material is applied, and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the double-sided tape for protecting terminals is provided.

1 is a cross-sectional view showing a schematic diagram of one embodiment of a terminal-protecting double-sided tape of the present invention. FIG. 2 is a cross-sectional view illustrating a terminal protecting double-sided tape according to another embodiment of the present invention. 1 is a cross-sectional view that illustrates a schematic diagram of one embodiment of a method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to the present invention. 5A to 5C are cross-sectional views each showing a schematic diagram of another embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to the present invention. 5A to 5C are cross-sectional views each showing a schematic diagram of another embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to the present invention. 1 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for protecting a terminal of Example 1 after sputtering. 1 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for protecting a terminal of Example 2 after sputtering. 1 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for protecting a terminal of Comparative Example 1 after sputtering. 1 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for protecting a terminal of Comparative Example 2 after sputtering. 1 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for protecting a terminal of Comparative Example 3 after sputtering.

Figure 1 is a cross-sectional view showing a schematic diagram of one embodiment of the double-sided tape for protecting terminals of the present invention. Note that the figures used in the following explanation may show enlarged essential parts for the sake of convenience in order to make the features of the present invention easier to understand, and the dimensional ratios of each component may not necessarily be the same as in reality.

The double-sided tape 1 for protecting terminals shown in Figure 1 is used in the process of forming an electromagnetic shielding film on a semiconductor device with terminals, and has, in this order, a viscoelastic layer 12 consisting of a first adhesive layer 14 and an embedding layer 13, a substrate 11, and a second adhesive layer 15. At least one of the viscoelastic layer 12, the substrate 11, and the second adhesive layer 15 is a thermally conductive layer.

1, the terminal protecting double-sided tape of the present embodiment may include a release film 20 on the outermost layer on the first pressure-sensitive adhesive layer 14 side of the viscoelastic layer 12. Also, the terminal protecting double-sided tape may include a release film 22 on the outermost layer on the second pressure-sensitive adhesive layer 15 side.
The double-sided tape for protecting a terminal of this embodiment is not limited to that shown in FIG. 1, and some of the configuration may be changed, deleted, or added to that shown in FIG. 1 as long as the effects of the present invention are not impaired.

The double-sided tape 1 for protecting terminals shown in Fig. 1 can be used in a process for forming an electromagnetic wave shielding film by peeling off the release film 22, fixing it to a support 30 as shown in Fig. 2, peeling off the release film 20, pressing a semiconductor device with terminals against the viscoelastic layer 12 with the terminal side facing down, embedding the terminals in the viscoelastic layer 12, and applying a conductive material from above by sputtering, ion plating, spray coating, etc. The double-sided tape for protecting terminals of this embodiment has at least one layer among the viscoelastic layer, the base material, and the second adhesive layer as a thermal conductive layer, so that an increase in the surface temperature of the double-sided tape for protecting terminals and surface roughness can be suppressed even in the process for forming an electromagnetic wave shielding film by a method such as sputtering, ion plating, spray coating, etc., in which a conductive material is applied.

In this specification, the term "thermal conductive layer" refers to a layer having a thermal conductivity of 0.5 (W/(m·K)) or more. The thermal conductivity can be calculated by the following formula (1).
Thermal conductivity (W/(m K)) = thermal diffusivity x density x specific heat Equation (1)
In the formula (1), the thermal diffusivity can be measured by a temperature wave method (TWA method) using a thermal diffusivity/thermal conductivity measuring device (e.g., ai-Phase Mobile lu, manufactured by ai-Phase Corporation). In the formula (1), the specific heat can be calculated by a DSC method, and the density can be calculated by an Archimedes method.

The thermal conductivity of the thermally conductive layer is preferably 1.0 (W/(m·K)) or more, and more preferably 5.0 (W/(m·K)) or more. When the thermal conductivity of the thermally conductive layer is equal to or more than the lower limit, the heat dissipation effect of the double-sided tape for protecting terminals is enhanced in the electromagnetic wave shielding film formation process by a method such as sputtering, ion plating, or spray coating in which a conductive material is applied, and as a result, an increase in the surface temperature of the double-sided tape for protecting terminals and surface roughness can be suppressed.
The thermal conductivity of the thermal conduction layer is not particularly limited as long as it has the effect of the present invention, but may be, for example, 30.0 (W/(m·K)) or less, or 25.0 (W/(m·K)) or less.
The above upper and lower limits can be combined in any desired manner.
An example of the combination is preferably 1.0 to 30.0 (W/(m·K)), and more preferably 5.0 to 25.0 (W/(m·K)).

In the terminal protection double-sided tape of this embodiment having a viscoelastic layer, a substrate, and a second adhesive layer, it is preferable that at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermally conductive layer, and more preferably, two or more layers are thermally conductive layers. In the terminal protection double-sided tape of this embodiment, at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermally conductive layer, so that in the electromagnetic wave shielding film formation process by a method such as sputtering, ion plating, or spray coating to apply a conductive material, the heat dissipation effect of the terminal protection double-sided tape is enhanced, and as a result, the increase in the surface temperature of the terminal protection double-sided tape and surface roughness can be suppressed. Any of the viscoelastic layer, the substrate, and the second adhesive layer may be a thermally conductive layer, but it is particularly preferable that the substrate is a thermally conductive layer.

The ratio of the total thickness of the thermally conductive layer to the total thickness of the double-sided tape for protecting a terminal is preferably 0.01 or more, more preferably 0.05 or more, and even more preferably 0.1 or more.
The total thickness of the thermally conductive layer relative to the total thickness of the double-sided tape for protecting a terminal is not particularly limited as long as the effect of the present invention is achieved, but may be, for example, 1.0 or less, 0.8 or less, or 0.6 or less.
The above upper and lower limits can be combined in any desired manner.
As an example of the combination, 0.01 to 1.0 is preferable, 0.05 to 0.8 is more preferable, and 0.1 to 0.6 is even more preferable.
In this specification, the "total thickness of the double-sided tape for protecting terminals" means the overall thickness of the double-sided tape for protecting terminals, and means the total thickness of all layers constituting the double-sided tape for protecting terminals. In addition, in this specification, the "total thickness of the thermally conductive layer" means the total thickness of the thermally conductive layer contained in the double-sided tape for protecting terminals. When the total thickness of the thermally conductive layer relative to the total thickness of the double-sided tape for protecting terminals is equal to or greater than the lower limit, the heat dissipation effect of the double-sided tape for protecting terminals is enhanced in the electromagnetic wave shielding film formation process by a method such as sputtering, ion plating, or spray coating to apply a conductive material, and as a result, the increase in the surface temperature of the double-sided tape for protecting terminals and the surface roughness can be suppressed.
In this specification, the thickness of each layer can be measured, for example, in accordance with JIS K6783, JIS Z1702, and JIS Z1709 using a constant pressure thickness gauge (model number: PG-02J) manufactured by Tecrock Corporation.

Next, we will explain each layer that makes up the double-sided tape for protecting terminals in this embodiment.

The substrate is in the form of a sheet or film, and examples of the constituent materials thereof include various resins and metal materials, etc. In this specification, the term "sheet or film" refers to a thin film having a small variation in thickness within the plane and flexibility.
Examples of the resin include polyethylenes such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene (HDPE); polyolefins other than polyethylene such as polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resin; ethylene-based copolymers (i.e., copolymers obtained by using ethylene as a monomer) such as ethylene-vinyl acetate copolymer (EVA), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, and ethylene-norbornene copolymer; vinyl chloride-based resins (i.e., copolymers obtained by using ethylene as a monomer) such as polyvinyl chloride and vinyl chloride copolymers. Examples of the resin include resins obtained by using vinyl chloride as the polymerizable monomer; polystyrene; polycycloolefin; polyesters such as polyethylene terephthalate (also referred to as PET), polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalenedicarboxylate, and wholly aromatic polyesters in which all structural units have aromatic cyclic groups; copolymers of two or more of the above polyesters; poly(meth)acrylic acid esters; polyurethanes; polyurethane acrylates; polyimides; polyamides; polycarbonates; fluororesins; polyacetals; modified polyphenylene oxides; polyphenylene sulfides; polysulfones; and polyether ketones.
Further, the resin may be, for example, a polymer alloy such as a mixture of the polyester and other resins. The polymer alloy of the polyester and other resins is preferably one in which the amount of the resin other than the polyester is relatively small.
Examples of the resin include crosslinked resins in which one or more of the resins exemplified above are crosslinked; and modified resins such as ionomers using one or more of the resins exemplified above.

In this specification, "(meth)acrylic acid" is a concept that includes both "acrylic acid" and "methacrylic acid." The same applies to terms similar to (meth)acrylic acid. For example, "(meth)acrylate" is a concept that includes both "acrylate" and "methacrylate," and "(meth)acryloyl group" is a concept that includes both "acryloyl group" and "methacryloyl group."

The metal material is preferably a metal material having a thermal conductivity of 1.0 (W/(m·K)) or more, and more preferably a metal material having a thermal conductivity of 5.0 (W/(m·K)) or more. The thermal conductivity can be calculated from the above-mentioned formula (1).
Examples of such metal materials include copper, gold, silver, aluminum, etc., and copper is preferred. When the substrate contains the metal material, the shape is preferably a metal foil, and the metal foil is preferably laminated as a metal layer on the resin via an adhesive layer. The adhesive for bonding the resin and the metal layer may be one known in the art, and can be appropriately selected from the adhesives described in the first adhesive layer below according to the type of resin and metal layer. The adhesive composition for forming the adhesive layer can be the same as the adhesive composition described in the first adhesive layer. In addition, the adhesive composition can be manufactured by the same method as the manufacturing method of the adhesive composition described in the first adhesive layer below.

The resin and metal materials constituting the substrate may be of one type or of two or more types, and if there are two or more types, the combination and ratio of these may be selected arbitrarily.

As described above, the base material may be only one layer (single layer) or may be two or more layers. When the base material is a multiple layer, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited.
In this specification, not only in the case of a base material, "multiple layers may be the same or different from one another" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further, "multiple layers are different from one another" means "at least one of the constituent materials and thicknesses of each layer is different from one another".

The thickness of the substrate is preferably from 5 to 1000 μm, more preferably from 10 to 500 μm, further preferably from 15 to 300 μm, and particularly preferably from 20 to 150 μm.
Here, the "thickness of the substrate" means the thickness of the entire substrate, and for example, the thickness of a substrate consisting of multiple layers means the total thickness of all layers constituting the substrate. For example, in the case of a substrate obtained by laminating the above-mentioned resin and metal layer via an adhesive layer, the thickness of the substrate means the total thickness of the resin, the metal layer, and the adhesive layer.

When the substrate is made of multiple layers and has one or more metal layers, the ratio of the total thickness of the metal layers to the thickness of the substrate is preferably 0.05 or more, more preferably 0.10 or more, and even more preferably 0.15 or more.
The total thickness of the metal layers relative to the thickness of the substrate is not particularly limited as long as the effects of the present invention are achieved, but may be, for example, 1.0 or less, 0.8 or less, or 0.6 or less.
The above upper and lower limits can be combined in any desired manner.
An example of the combination is preferably 0.05 to 1.0, more preferably 0.10 to 0.8, and even more preferably 0.15 to 0.6.
In this specification, the "total thickness of the metal layers" refers to the total thickness of the metal layers contained in the substrate. When the total thickness of the metal layers relative to the thickness of the substrate is equal to or greater than the lower limit of the above range, the thermal conductivity of the substrate increases, and the increase in the surface temperature and surface roughness of the double-sided tape for protecting a terminal using the substrate can be suppressed.

When using a resin as the base material, it is preferable to use a resin with high thickness accuracy, i.e., one in which thickness variation is suppressed regardless of the location. Among the above-mentioned constituent materials, examples of materials that can be used to form a base material with such high thickness accuracy include polyethylene, polyolefins other than polyethylene, polyethylene terephthalate, and ethylene-vinyl acetate copolymer (EVA).

In addition to the main constituent materials such as the resin, the substrate may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers).

Among the above additives, the base material preferably contains a filler, and more preferably contains a thermally conductive filler.
In this specification, the term "thermally conductive filler" refers to a filler having a thermal conductivity of 1.0 (W/(m·K)) or more. The thermal conductivity can be calculated from the above-described formula (1).

The thermal conductivity of the thermally conductive filler is preferably 1.0 (W/(m·K)) or more, and more preferably 4.0 (W/(m·K)) or more. When the thermal conductivity of the thermally conductive filler contained in the substrate is equal to or more than the lower limit, the thermal conductivity of the substrate increases, and an increase in the surface temperature and surface roughness of the double-sided tape for protecting a terminal using the substrate can be suppressed.
The thermal conductivity of the thermally conductive filler is not particularly limited as long as it has the effects of the present invention, but may be, for example, 30.0 (W/(m·K)) or less, or 25.0 (W/(m·K)) or less.
The above upper and lower limits can be combined in any desired manner.
An example of the combination is preferably 1.0 to 30.0 (W/(m·K)), and more preferably 4.0 to 25.0 (W/(m·K)).

The thermally conductive filler is not particularly limited as long as it has a thermal conductivity equal to or higher than the lower limit of the above, and may be an organic filler or an inorganic filler, but is preferably an inorganic filler. Examples of the inorganic filler include inorganic oxides, inorganic carbides, and inorganic nitrides, and inorganic carbides and inorganic nitrides are preferred because they have high thermal conductivity as inorganic fillers, and inorganic nitrides are more preferred.
Examples of inorganic carbides include silicon carbide, and examples of inorganic nitrides include silicon nitride, aluminum nitride, and boron nitride. Among these, boron nitride is preferred because of its high thermal conductivity.
The thermally conductive filler may be used alone or in combination of two or more kinds, and when two or more kinds are used in combination, the combination and ratio thereof can be selected arbitrarily.

The shape of the thermally conductive filler is not particularly limited as long as it has the effect of the present invention, and examples include spherical, plate-like, fibrous, etc. In addition, it is preferable that the thermally conductive filler is uniformly dispersed in the resin.

The average particle size of the thermally conductive filler is not particularly limited as long as the effects of the present invention are achieved, and is, for example, 0.01 to 20 μm, and more preferably 0.05 to 10 μm. When the average particle size of the thermally conductive filler is equal to or greater than the lower limit of the above range, thermal conductivity can be efficiently ensured. When the average particle size of the thermally conductive filler is equal to or less than the upper limit of the above range, the smoothness of the substrate surface can be ensured.
In this specification, the "average particle size of the thermally conductive filler" can be measured using a "laser diffraction particle size distribution measuring device" manufactured by Horiba, Ltd.

The content of the thermally conductive filler relative to the total mass of the substrate is preferably 35 to 95% by mass, and more preferably 40 to 90% by mass. When the content of the thermally conductive filler relative to the total mass of the substrate is equal to or greater than the lower limit of the above range, the thermal conductivity of the substrate increases, and the increase in surface temperature and surface roughness of the double-sided tape for protecting terminals using the substrate can be suppressed. When the content of the thermally conductive filler relative to the total mass of the substrate is equal to or less than the upper limit of the above range, the performance of the substrate can be ensured.

The substrate may be transparent or opaque, may be colored according to the purpose, and may have other layers vapor-deposited thereon.
When the viscoelastic layer is energy ray curable, the substrate is preferably one that transmits energy rays.

The substrate can be manufactured by a known method. For example, a substrate containing a resin can be manufactured by molding a resin composition containing the resin.

When the base material is a resin containing a thermally conductive filler, the base material can be manufactured by a powder kneading method and a varnish method.

Powder kneading method: A thermally conductive filler is added to a resin, and the resin and the thermally conductive filler are dispersed in a mixer, and the mixture is placed in a predetermined mold and press-molded while being heated, thereby obtaining a substrate made of a resin containing a thermally conductive filler. In addition, a solvent can be used appropriately when dispersing the resin in the mixer.

- Varnish method After surface-treating the thermally conductive filler, it is mixed with varnish to be uniformly dispersed, and then poured onto a sheet in this state to obtain a substrate made of a resin containing the thermally conductive filler. Examples of the surface treatment include known surface treatments such as water resistance, moisture resistance, chemical resistance, coupling with resin, and surface smoothing treatment. In addition, a solvent can be used appropriately when mixing with the varnish.

Viscoelastic Layer In the terminal protecting double-sided tape of this embodiment, the viscoelastic layer is used to protect the terminal forming surface (in other words, the circuit surface) of the terminal-equipped semiconductor device and the terminals provided on this terminal forming surface.
The viscoelastic layer preferably has an embedding layer and a first adhesive layer.

The thickness of the viscoelastic layer is preferably from 1 to 1000 μm, more preferably from 5 to 800 μm, and even more preferably from 10 to 600 μm.
When the thickness of the viscoelastic layer is equal to or greater than the lower limit, it is possible to embed even terminal electrodes that are prone to floating, such as solder balls, etc. Also, when the thickness of the viscoelastic layer is equal to or less than the upper limit, the double-sided tape for protecting terminals is prevented from becoming excessively thick.
Here, "the thickness of the viscoelastic layer" means the thickness of the entire viscoelastic layer, and the thickness of a viscoelastic layer consisting of multiple layers including an embedded layer and a first adhesive layer means the total thickness of the embedded layer and the first adhesive layer.

When adhering the terminal forming surface of the semiconductor device with terminals to the viscoelastic layer 12, it is preferable to adhere the terminal forming surface of the semiconductor device with terminals directly to the first adhesive layer 14 in the viscoelastic layer 12. At this time, it is preferable to set the first adhesive layer 14 to be harder than the embedding layer 13 in order to prevent adhesive residue on the terminal forming surface and the terminals.

Burying Layer In the terminal protection double-sided tape of this embodiment, the embedding layer is a layer of the viscoelastic layer that embeds and protects the terminals of a terminal-equipped semiconductor device.
The embedding layer is in the form of a sheet or film, and the material constituting the embedding layer is not particularly limited as long as it satisfies the above-mentioned conditional relationship.

For example, if the objective is to prevent the viscoelastic layer covering the terminal formation surface of the terminal-equipped semiconductor device to be protected from being deformed by the shape of the terminals present on the semiconductor surface being reflected in the viscoelastic layer, preferred constituent materials for the embedding layer include acrylic resins, etc., which further improve the adhesion of the embedding layer.

In addition to the main constituent material such as the acrylic resin, the embedding layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers).

Among the above additives, it is preferable that the embedding layer contains a filler, and more preferably contains the above-mentioned thermally conductive filler. By containing the above-mentioned thermally conductive filler in the embedding layer, the thermal conductivity of the embedding layer is increased, and it is possible to suppress an increase in the surface temperature of the double-sided tape for protecting terminals using the embedding layer, as well as surface roughness.

The content of the thermally conductive filler relative to the total mass of the embedded layer is preferably 20 to 80% by mass, and more preferably 30 to 70% by mass. When the content of the thermally conductive filler relative to the total mass of the embedded layer is equal to or greater than the lower limit of the range, the thermal conductivity of the embedded layer increases, and the increase in the surface temperature of the double-sided tape for protecting terminals using the embedded layer, as well as surface roughness, can be suppressed. When the content of the thermally conductive filler relative to the total mass of the embedded layer is equal to or less than the upper limit of the range, the performance of the embedded layer can be ensured.

The embedded layer may be a single layer (single layer) or may be two or more layers. If there are multiple layers, these layers may be the same or different from each other, and the combination of these layers is not particularly limited.

The thickness of the embedding layer can be adjusted as appropriate according to the height of the terminals on the terminal-forming surface of the terminal-equipped semiconductor device to be protected, so long as the thickness of the viscoelastic layer is in the range of 1 to 1000 μm, but from the viewpoint of easily absorbing the influence of relatively tall terminals, the thickness is preferably 10 to 500 μm, more preferably 20 to 450 μm, and particularly preferably 30 to 400 μm. By making the thickness of the embedding layer equal to or greater than the lower limit, a viscoelastic layer having higher terminal protection performance can be formed. Furthermore, by making the thickness of the embedding layer equal to or less than the upper limit, productivity and suitability for winding in a roll shape are improved.
Here, the "thickness of the buried layer" refers to the thickness of the entire buried layer. For example, the thickness of a buried layer made up of multiple layers refers to the total thickness of all layers that make up the buried layer.

The embedding layer preferably has soft properties suitable for embedding the terminals, and is preferably softer than the first adhesive layer.

(Composition for forming embedding layer)
The burying layer can be formed using a burying layer-forming composition containing the constituent materials thereof.
For example, the buried layer can be formed at the desired site by applying the buried layer forming composition to the surface on which the buried layer is to be formed, drying it as necessary, and curing it by irradiating it with energy rays. Also, the buried layer can be formed with the desired thickness by applying the buried layer forming composition to a release film, drying it as necessary, and curing it by irradiating it with energy rays, and the buried layer can be transferred to the desired site. A more specific method for forming the buried layer will be described in detail later, along with the method for forming other layers. The ratio of the contents of the components that do not vaporize at room temperature in the buried layer forming composition is usually the same as the ratio of the contents of the components of the buried layer. Here, "room temperature" means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples of the temperature include a temperature of 15 to 30°C.

The embedding layer forming composition may be applied by known methods, such as methods using various coaters such as an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater, Mayer bar coater, and kiss coater.

The drying conditions for the burying layer forming composition are not particularly limited. When the burying layer forming composition contains a solvent described later, it is preferable to dry the composition by heating. In this case, it is preferable to dry the composition at 70 to 130° C. for 10 seconds to 5 minutes.
When the burying layer forming composition has energy ray curing properties, it is preferable to cure the burying layer forming composition by irradiation with energy rays. In addition, as one aspect of the present invention, when the burying layer forming composition has energy ray curing properties, it is preferable not to cure the burying layer forming composition by irradiation with energy rays.

An example of a composition for forming an embedded layer is composition (I) for forming an embedded layer containing an acrylic resin.

{Composition for forming embedding layer (I)}
The embedding layer forming composition (I) contains an acrylic resin.
As the embedding layer forming composition (I), a composition that contains an acrylic resin adhesive resin (I-1a) and an energy ray curable compound out of the first adhesive composition (I-1) described below, and a composition that contains an energy ray curable adhesive resin (I-2a) in which an unsaturated group has been introduced into the side chain of the acrylic resin adhesive resin (I-1a) out of the first adhesive composition (I-2) can be used as the embedding layer forming composition (I).

The adhesive resin (I-1a) and the energy ray curable compound used in the embedding layer forming composition (I) are the same as those described below for the adhesive resin (I-1a) and the energy ray curable compound used in the first adhesive composition (I-1).
The adhesive resin (I-2a) used in the embedding layer forming composition (I) is the same as the adhesive resin (I-2a) used in the first adhesive composition (I-2) described below.
The embedding layer forming composition (I) preferably further contains a crosslinking agent. The crosslinking agent used in the embedding layer forming composition (I) is the same as the crosslinking agent used in the first pressure-sensitive adhesive composition (I-1) and the first pressure-sensitive adhesive composition (I-2) described below.
The embedding layer forming composition (I) may further contain a photopolymerization initiator and other additives. The photopolymerization initiator and other additives used in the embedding layer forming composition (I) are the same as those described below for the photopolymerization initiator and other additives used in the first pressure-sensitive adhesive composition (I-1) and the first pressure-sensitive adhesive composition (I-2). In addition, when producing an embedding layer containing the above-mentioned thermally conductive filler, the embedding layer forming composition (I) contains a thermally conductive filler as an additive.
The embedding layer forming composition (I) may contain a solvent. The solvent used in the embedding layer forming composition (I) is the same as the solvent used in the first pressure-sensitive adhesive composition (I-1) and the first pressure-sensitive adhesive composition (I-2) described below.

By adjusting either or both of the molecular weight of the adhesive resin (I-1a) and the molecular weight of the energy ray curable compound in the embedding layer forming composition (I), the embedding layer can be designed to have soft properties suitable for embedding terminals.
In addition, by adjusting the content of the crosslinking agent in the embedding layer forming composition (I), the embedding layer can be designed to have soft properties suitable for embedding the terminals.

<<Method of manufacturing the composition for forming the embedding layer>>
The embedding layer forming composition (I) can be obtained by blending the respective components constituting the composition.
The order of addition of the components is not particularly limited, and two or more components may be added simultaneously.
When a solvent is used, the solvent may be used by mixing it with any of the other ingredients to pre-dilute the ingredients, or the solvent may be used by mixing it with any of the other ingredients without pre-diluting the ingredients.
The method for mixing the components during blending is not particularly limited, and may be appropriately selected from known methods such as a method of mixing by rotating a stirrer or stirring blade, a method of mixing using a mixer, a method of mixing by applying ultrasound, etc.
The temperature and time during addition and mixing of each component are not particularly limited as long as the components do not deteriorate, and may be adjusted appropriately. The temperature is preferably 15 to 30°C.

{Composition of the buried layer}
In this embodiment, the composition of the burying layer is the same as the above-mentioned burying layer forming composition (I) except for the solvent.
In the case where the buried layer forming composition (I) is a composition containing an acrylic resin adhesive resin (I-1a) and an energy ray curable compound in the first adhesive composition (I-1) described later, the content ratio of the acrylic resin adhesive resin (I-1a) to the total mass of the buried layer (1) in the buried layer (1) is preferably 50 to 99 mass%, more preferably 55 to 95 mass%, and even more preferably 60 to 90 mass%. In another aspect of the present invention, the content ratio of the acrylic resin adhesive resin (I-1a) to the total mass of the buried layer (1) may be 45 to 90 mass%, or may be 50 to 85 mass%. In addition, the content ratio of the energy ray curable compound to the total mass of the buried layer (1) is preferably 0.5 to 50 mass%, and more preferably 5 to 45 mass%. When the embedding layer (1) contains a crosslinking agent, the content of the crosslinking agent relative to the total mass of the embedding layer (1) is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and even more preferably 0.3 to 8 mass%.

In the case where the buried layer forming composition (I) is a composition containing an energy ray curable adhesive resin (I-2a) having an unsaturated group introduced into the side chain of an acrylic resin adhesive resin (I-1a), the content ratio of the energy ray curable adhesive resin (I-2a) having an unsaturated group introduced into the side chain to the total mass of the buried layer in the buried layer (2) is preferably 10 to 70 mass%, more preferably 15 to 65 mass%, and even more preferably 20 to 60 mass%. When the buried layer (2) contains a crosslinking agent, the content ratio of the crosslinking agent to the total mass of the buried layer (2) is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and even more preferably 0.3 to 8 mass%. The buried layer (2) of this embodiment may further contain the adhesive resin (I-1a) which is an acrylic resin. In this case, the content ratio of the adhesive resin (I-1a) which is an acrylic resin to the total mass of the embedded layer (2) is preferably 20 to 70 mass%, more preferably 25 to 65 mass%, and even more preferably 30 to 60 mass%. In addition, when the embedded layer (2) of this embodiment further contains the adhesive resin (I-1a) which is an acrylic resin, the content of the adhesive resin (I-1a) relative to 100 parts by mass of the adhesive resin (I-2a) is preferably 70 to 100 parts by mass, more preferably 75 to 100 parts by mass, and even more preferably 80 to 100 parts by mass.

The compositions of the adhesive resin (I-1a) which is an acrylic resin contained in the embedding layer (1), the energy ray curable compound, and the energy ray curable adhesive resin (I-2a) in which an unsaturated group has been introduced into the side chain of the adhesive resin (I-1a) contained in the embedding layer (2) may be the same as those of the adhesive resin (I-1a) which is an acrylic resin, the energy ray curable compound, and the energy ray curable adhesive resin (I-2a) in which an unsaturated group has been introduced into the side chain of the adhesive resin (I-1a) used in the first adhesive composition (I-1) described below.

In this embodiment, the embedding layer (2) preferably contains an adhesive resin (I-2a), an adhesive resin (I-1a), and a crosslinking agent. In this case, the adhesive resin (I-1a) is preferably an acrylic polymer having a structural unit derived from an (meth)acrylic acid alkyl ester and a unit derived from a carboxyl group-containing monomer. The adhesive resin (I-2a) is preferably an acrylic polymer obtained by reacting an acrylic polymer having a structural unit derived from an (meth)acrylic acid alkyl ester and a unit derived from a hydroxyl group-containing monomer with an isocyanate group and an unsaturated group-containing compound having an energy ray polymerizable unsaturated group. The crosslinking agent may be a compound exemplified in the first adhesive composition (I-1) described later, and it is particularly preferable to use tolylene-2,6-diisocyanate.

The content ratio of the structural unit derived from the (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-1a) is preferably 75 to 99 mass%, more preferably 80 to 98 mass%, and even more preferably 85 to 97 mass%. The content ratio of the structural unit of the carboxyl group-containing monomer relative to the total mass of the adhesive resin (I-1a) is preferably 1.0 to 30 mass%, more preferably 2.0 to 25 mass%, even more preferably 3.0 to 20 mass%, and particularly preferably 5.0 to 15 mass%. The (meth)acrylic acid alkyl ester in the adhesive resin (I-1a) preferably has an alkyl group having 4 to 12 carbon atoms, more preferably 4 to 8 carbon atoms. In addition, the adhesive resin (I-1a) is preferably an acrylic acid alkyl ester. Among them, the (meth)acrylic acid alkyl ester is particularly preferably n-butyl acrylate. In addition, examples of the carboxy-containing monomer in the adhesive resin (I-1a) include ethylenically unsaturated monocarboxylic acids, ethylenically unsaturated dicarboxylic acids, and anhydrides of ethylenically unsaturated dicarboxylic acids. Among these, ethylenically unsaturated monocarboxylic acids are preferred, (meth)acrylic acid is more preferred, and acrylic acid is particularly preferred.
The weight average molecular weight of the adhesive resin (I-1a) of this embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and even more preferably 200,000 to 600,000.
In this specification, unless otherwise specified, the "weight average molecular weight" is a polystyrene-equivalent value measured by gel permeation chromatography (GPC).

The content ratio of the structural unit derived from the (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-2a) is preferably 1.0 to 95% by mass, more preferably 2.0 to 90% by mass, and even more preferably 3.0 to 85% by mass. The content ratio of the unit derived from the hydroxyl group-containing monomer relative to the total mass of the adhesive resin (I-2a) is preferably 1.0 to 50% by mass, more preferably 2.0 to 45% by mass, and even more preferably 3.0 to 40% by mass. The (meth)acrylic acid alkyl ester in the adhesive resin (I-2a) preferably has an alkyl group having 1 to 12 carbon atoms, and more preferably 1 to 4 carbon atoms. The adhesive resin (I-2a) preferably has two or more structural units derived from the (meth)acrylic acid alkyl ester, more preferably has structural units derived from methyl (meth)acrylate and n-butyl (meth)acrylate, and even more preferably has structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (I-2a), those exemplified in the first adhesive composition (I-1) described later can be used, and it is particularly preferable to use 2-hydroxyethyl acrylate. As the unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group, those exemplified in the first adhesive composition (I-2) described later can be used, and it is particularly preferable to use 2-methacryloyloxyethyl isocyanate. When the total hydroxyl groups derived from the hydroxyl group-containing monomer are taken as 100 mol, the amount of the unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group is preferably 50 to 150 mol, more preferably 55 to 140 mol, and even more preferably 60 to 135 mol.
The weight average molecular weight of the adhesive resin (I-2a) of this embodiment is preferably 10,000 to 500,000, more preferably 20,000 to 400,000, and even more preferably 30,000 to 300,000.

Pressure-sensitive adhesive layer Hereinafter, the pressure-sensitive adhesive layer constituting the viscoelastic layer may be referred to as a "first pressure-sensitive adhesive layer" to distinguish it from a second pressure-sensitive adhesive layer for bonding to a support, which will be described later.
The first pressure-sensitive adhesive layer is in the form of a sheet or film, and contains a pressure-sensitive adhesive.
Examples of the adhesive include adhesive resins such as acrylic resins (adhesives made of resins having (meth)acryloyl groups), urethane resins (adhesives made of resins having urethane bonds), rubber resins (adhesives made of resins having a rubber structure), silicone resins (adhesives made of resins having siloxane bonds), epoxy resins (adhesives made of resins having epoxy groups), polyvinyl ethers, and polycarbonates, with acrylic resins being preferred.

In the present invention, the term "adhesive resin" is a concept that includes both resins that have adhesive properties and resins that have adhesive properties, and includes, for example, not only resins that are adhesive in themselves, but also resins that exhibit adhesive properties when used in combination with other components such as additives, and resins that exhibit adhesive properties in the presence of a trigger such as heat or water.

In addition to the main constituent materials such as the resin, the first adhesive layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc.

Among the above additives, it is preferable that the first adhesive layer contains a filler, and in particular, it is preferable that the first adhesive layer contains the above-mentioned thermally conductive filler. By containing the above-mentioned thermally conductive filler in the first adhesive layer, the thermal conductivity of the first adhesive layer is increased, and it is possible to suppress an increase in the surface temperature of the double-sided tape for protecting a terminal using the first adhesive layer, as well as surface roughness.

The content of the thermally conductive filler relative to the total mass of the first adhesive layer is preferably 20 to 80% by mass, and more preferably 30 to 70% by mass. When the content of the thermally conductive filler relative to the total mass of the first adhesive layer is equal to or greater than the lower limit of the above range, the thermal conductivity of the first adhesive layer increases, and an increase in the surface temperature of the double-sided tape for protecting a terminal using the first adhesive layer, as well as surface roughness, can be suppressed. When the content of the thermally conductive filler relative to the total mass of the first adhesive layer is equal to or less than the upper limit of the above range, the performance of the first adhesive layer can be ensured.

The first adhesive layer may be only one layer (single layer) or may be two or more layers. If it is multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited.

The thickness of the first pressure-sensitive adhesive layer is preferably from 1 to 1000 μm, more preferably from 2 to 100 μm, and particularly preferably from 5 to 20 μm.
Here, "the thickness of the first adhesive layer" means the thickness of the entire first adhesive layer; for example, the thickness of a first adhesive layer consisting of multiple layers means the total thickness of all layers constituting the first adhesive layer.

The first pressure-sensitive adhesive layer may be formed using an energy ray-curable pressure-sensitive adhesive or a non-energy ray-curable pressure-sensitive adhesive. The first pressure-sensitive adhesive layer formed using an energy ray-curable pressure-sensitive adhesive can easily adjust the physical properties before and after curing.
In the present invention, the term "energy ray" refers to electromagnetic waves or charged particle beams that have an energy quantum, and examples of such beams include ultraviolet rays and electron beams.
The ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, etc. as an ultraviolet ray source. The electron beam can be generated by an electron beam accelerator or the like.
In the present invention, "energy ray curable" means a property of being cured by irradiation with energy rays, and "non-energy ray curable" means a property of not being cured even when irradiated with energy rays.

{First pressure-sensitive adhesive composition}
The first pressure-sensitive adhesive layer can be formed using a first pressure-sensitive adhesive composition containing a pressure-sensitive adhesive. For example, the first pressure-sensitive adhesive composition can be applied to a surface on which the first pressure-sensitive adhesive layer is to be formed, and dried as necessary, to form the first pressure-sensitive adhesive layer at a desired location. In addition, the first pressure-sensitive adhesive composition can be applied to a release film, and dried as necessary, to form a first pressure-sensitive adhesive layer of a desired thickness, and the first pressure-sensitive adhesive layer can be transferred to a desired location. A more specific method for forming the first pressure-sensitive adhesive layer will be described in detail later, along with methods for forming other layers. The ratio of the contents of the components that do not vaporize at room temperature in the first pressure-sensitive adhesive composition is usually the same as the ratio of the contents of the components in the first pressure-sensitive adhesive layer. In this embodiment, "room temperature" means a temperature that is not particularly cooled or heated, that is, an ordinary temperature, and examples of such temperatures include temperatures of 15 to 25°C.

The first adhesive composition may be applied by any known method, such as a method using various coaters such as an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater, Mayer bar coater, or kiss coater.

The drying conditions for the first adhesive composition are not particularly limited, but when the first adhesive composition contains a solvent as described below, it is preferable to heat dry it. In this case, it is preferable to dry it under conditions of, for example, 70 to 130°C for 10 seconds to 5 minutes.

When the first adhesive layer is energy ray curable, examples of the first adhesive composition containing an energy ray curable adhesive, i.e., the energy ray curable first adhesive composition, include a first adhesive composition (I-1) containing a non-energy ray curable adhesive resin (I-1a) (hereinafter sometimes abbreviated as "adhesive resin (I-1a)") and an energy ray curable compound; a first adhesive composition (I-2) containing an energy ray curable adhesive resin (I-2a) (hereinafter sometimes abbreviated as "adhesive resin (I-2a)") in which an unsaturated group has been introduced into the side chain of the non-energy ray curable adhesive resin (I-1a); and a first adhesive composition (I-3) containing the adhesive resin (I-2a) and an energy ray curable low molecular weight compound.

{First Pressure-Sensitive Adhesive Composition (I-1)}
As described above, the first pressure-sensitive adhesive composition (I-1) contains the non-energy ray-curable pressure-sensitive adhesive resin (I-1a) and an energy ray-curable compound.

(Adhesive resin (I-1a))
The adhesive resin (I-1a) is preferably an acrylic resin.
The acrylic resin may, for example, be an acrylic polymer having at least a structural unit derived from an alkyl (meth)acrylate ester.
The structural unit contained in the acrylic resin may be of only one type, or of two or more types. When the structural unit is of two or more types, the combination and ratio thereof can be selected arbitrarily.

The (meth)acrylic acid alkyl ester may, for example, be one in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is preferably linear or branched.
More specifically, the (meth)acrylic acid alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, Examples of such acrylates include isononyl acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate (also referred to as lauryl (meth)acrylate), tridecyl (meth)acrylate, tetradecyl (meth)acrylate (also referred to as myristyl (meth)acrylate), pentadecyl (meth)acrylate, hexadecyl (meth)acrylate (also referred to as palmityl (meth)acrylate), heptadecyl (meth)acrylate, octadecyl (meth)acrylate (also referred to as stearyl (meth)acrylate), nonadecyl (meth)acrylate, and icosyl (meth)acrylate.

In order to improve the adhesive strength of the first adhesive layer, it is preferable that the acrylic polymer has a structural unit derived from a (meth)acrylic acid alkyl ester in which the alkyl group has 4 or more carbon atoms. In order to further improve the adhesive strength of the first adhesive layer, the alkyl group preferably has 4 to 12 carbon atoms, and more preferably 4 to 8 carbon atoms. In addition, it is preferable that the (meth)acrylic acid alkyl ester in which the alkyl group has 4 or more carbon atoms is an acrylic acid alkyl ester.

The acrylic polymer preferably further contains a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from an alkyl (meth)acrylate.
Examples of the functional group-containing monomer include those in which the functional group reacts with a crosslinking agent described below to become a crosslinking starting point, and those in which the functional group reacts with an unsaturated group in an unsaturated group-containing compound to enable the introduction of an unsaturated group into a side chain of an acrylic polymer.

Examples of the functional group in the functional group-containing monomer include a hydroxyl group, a carboxyl group, an amino group, and an epoxy group.
That is, examples of functional group-containing monomers include hydroxyl group-containing monomers, carboxyl group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

Examples of the hydroxyl group-containing monomer include hydroxyalkyl (meth)acrylates such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; non-(meth)acrylic unsaturated alcohols (i.e., unsaturated alcohols that do not have a (meth)acryloyl skeleton) such as vinyl alcohol and allyl alcohol.

Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids (monocarboxylic acids having an ethylenically unsaturated bond) such as (meth)acrylic acid and crotonic acid; ethylenically unsaturated dicarboxylic acids (dicarboxylic acids having an ethylenically unsaturated bond) such as fumaric acid, itaconic acid, maleic acid, and citraconic acid; anhydrides of the ethylenically unsaturated dicarboxylic acids; and (meth)acrylic acid carboxyalkyl esters such as 2-carboxyethyl methacrylate.

The functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxyl group-containing monomer, more preferably a hydroxyl group-containing monomer.

The functional group-containing monomer constituting the acrylic polymer may be one type or two or more types, and if there are two or more types, the combination and ratio of these can be selected arbitrarily.

In the acrylic polymer, the content of structural units derived from functional group-containing monomers is preferably 1 to 35% by mass, more preferably 3 to 32% by mass, and particularly preferably 5 to 30% by mass, based on the total amount of structural units.

The acrylic polymer may further contain a structural unit derived from another monomer, in addition to the structural unit derived from the alkyl (meth)acrylate ester and the structural unit derived from the functional group-containing monomer.
The other monomer is not particularly limited as long as it is copolymerizable with the (meth)acrylic acid alkyl ester and the like.
Examples of the other monomers include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile, and acrylamide.

The other monomers constituting the acrylic polymer may be one type only or two or more types, and if there are two or more types, their combination and ratio can be selected arbitrarily.

The acrylic polymer can be used as the non-energy ray-curable adhesive resin (I-1a) described above.
On the other hand, a compound obtained by reacting a functional group in the acrylic polymer with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group (energy ray-polymerizable group) can be used as the above-mentioned energy ray-curable adhesive resin (I-2a).
In the present invention, the term "energy ray polymerizable" means a property of being polymerized by irradiation with energy rays.

The adhesive resin (I-1a) contained in the first adhesive composition (I-1) may be one type or two or more types, and if there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-1), the content of the adhesive resin (I-1a) is preferably 5 to 99 mass%, more preferably 10 to 95 mass%, and particularly preferably 15 to 90 mass%, relative to the total mass of the first adhesive composition (I-1).

(Energy ray curable compound)
The energy ray-curable compound contained in the first pressure-sensitive adhesive composition (I-1) includes a monomer or oligomer that has an energy ray-polymerizable unsaturated group and is curable by irradiation with energy rays.
Of the energy ray-curable compounds, examples of the monomer include polyvalent (meth)acrylates such as trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol (meth)acrylate; urethane (meth)acrylate; polyester (meth)acrylate; polyether (meth)acrylate; and epoxy (meth)acrylate.
Among the energy ray-curable compounds, examples of the oligomer include oligomers obtained by polymerizing the above-mentioned monomers.
The energy ray curable compound is preferably a urethane (meth)acrylate or a urethane (meth)acrylate oligomer, in that it has a relatively large molecular weight and is less likely to reduce the storage modulus of the first pressure-sensitive adhesive layer.
As used herein, "oligomer" means a material having a weight average molecular weight or formula weight of 5,000 or less.

The energy ray-curable compound contained in the first adhesive composition (I-1) may be only one type or may be two or more types, and if there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-1), the content of the energy ray curable compound is preferably 1 to 95 mass%, more preferably 5 to 90 mass%, and particularly preferably 10 to 85 mass%, relative to the total mass of the first adhesive composition (I-1).

(Crosslinking Agent)
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to a structural unit derived from a (meth)acrylic acid alkyl ester is used as the pressure-sensitive adhesive resin (I-1a), it is preferable that the first pressure-sensitive adhesive composition (I-1) further contains a crosslinking agent.

The crosslinking agent reacts with the functional group, for example, to crosslink the adhesive resins (I-1a) together.
Examples of the crosslinking agent include isocyanate-based crosslinking agents (crosslinking agents having an isocyanate group) such as tolylene-2,6-diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates; epoxy-based crosslinking agents (crosslinking agents having a glycidyl group) such as ethylene glycol glycidyl ether and N,N'-(cyclohexane-1,3-diylbismethylene)bis(glycidylamine); aziridine-based crosslinking agents (crosslinking agents having an aziridinyl group) such as hexa[1-(2-methyl)-aziridinyl]triphosphatriazine; metal chelate-based crosslinking agents (crosslinking agents having a metal chelate structure) such as aluminum chelate; and isocyanurate-based crosslinking agents (crosslinking agents having an isocyanuric acid skeleton).
From the viewpoints of improving the cohesive strength of the adhesive and thereby improving the adhesive strength of the first adhesive layer, and of easy availability, the crosslinking agent is preferably an isocyanate-based crosslinking agent.

The first adhesive composition (I-1) may contain only one type of crosslinking agent or two or more types, and if there are two or more types, the combination and ratio of these can be selected arbitrarily.

In the first adhesive composition (I-1), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 1 to 10 parts by mass, per 100 parts by mass of the adhesive resin (I-1a).

(Photopolymerization initiator)
The first pressure-sensitive adhesive composition (I-1) may further contain a photopolymerization initiator. When the first pressure-sensitive adhesive composition (I-1) contains a photopolymerization initiator, the curing reaction proceeds sufficiently even when the first pressure-sensitive adhesive composition (I-1) is irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal; acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and 2,2-dimethoxy-1,2-diphenylethane-1-one; acyl phosphinates such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; phosphine oxide compounds; sulfide compounds such as benzyl phenyl sulfide and tetramethylthiuram monosulfide; α-ketol compounds such as 1-hydroxycyclohexyl phenyl ketone; azo compounds such as azobisisobutyronitrile; titanocene compounds such as titanocene; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl, dibenzyl, benzophenone, 2,4-diethylthioxanthone, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2-chloroanthraquinone, and the like.
As the photopolymerization initiator, for example, a quinone compound such as 1-chloroanthraquinone; a photosensitizer such as an amine, and the like can also be used.

The photopolymerization initiator contained in the first adhesive composition (I-1) may be only one type or two or more types, and if there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the energy ray-curable compound.

(Other additives)
The first pressure-sensitive adhesive composition (I-1) may contain other additives that do not fall under any of the above-mentioned components, as long as the effects of the present invention are not impaired.
Examples of the other additives include known additives such as antistatic agents, antioxidants, softeners (plasticizers), fillers, rust inhibitors, colorants (pigments, dyes), sensitizers, tackifiers, reaction retarders, crosslinking accelerators (catalysts), etc. In addition, when producing the first pressure-sensitive adhesive layer containing the above-mentioned thermally conductive filler, the first pressure-sensitive adhesive composition (I-1) contains a thermally conductive filler as an additive.
The reaction retarder is, for example, a retarder that inhibits the progress of an unintended crosslinking reaction in the first pressure-sensitive adhesive composition (I-1) during storage due to the action of a catalyst mixed in the first pressure-sensitive adhesive composition (I-1). Examples of the reaction retarder include a retarder that forms a chelate complex by chelating with a catalyst, and more specifically, a retarder that has two or more carbonyl groups (-C(=O)-) in one molecule.

The other additives contained in the first adhesive composition (I-1) may be of only one type or of two or more types, and if there are two or more types, their combination and ratio can be selected arbitrarily.

In the first adhesive composition (I-1), the content of other additives is not particularly limited and may be selected appropriately depending on their types.

(solvent)
The first pressure-sensitive adhesive composition (I-1) may contain a solvent. By containing a solvent, the first pressure-sensitive adhesive composition (I-1) has improved suitability for application to a surface to be coated.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters (carboxylic acid esters) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aliphatic hydrocarbons such as cyclohexane and n-hexane; aromatic hydrocarbons such as toluene and xylene; and alcohols such as 1-propanol and 2-propanol.

As the solvent, for example, the solvent used during the production of the adhesive resin (I-1a) may be used as is in the first adhesive composition (I-1) without being removed from the adhesive resin (I-1a), or the same or different type of solvent as that used during the production of the adhesive resin (I-1a) may be added separately during the production of the first adhesive composition (I-1).

The first adhesive composition (I-1) may contain only one type of solvent or two or more types, and if there are two or more types, the combination and ratio of these can be selected arbitrarily.

In the first adhesive composition (I-1), the solvent content is not particularly limited and may be adjusted as appropriate.

{First Pressure-Sensitive Adhesive Composition (I-2)}
As described above, the first adhesive composition (I-2) contains an energy ray-curable adhesive resin (I-2a) in which an unsaturated group has been introduced into the side chain of a non-energy ray-curable adhesive resin (I-1a).

(Adhesive resin (I-2a))
The adhesive resin (I-2a) can be obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.

The unsaturated group-containing compound is a compound having, in addition to the energy ray-polymerizable unsaturated group, a group that can bond to the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a).
Examples of the energy ray-polymerizable unsaturated group include a (meth)acryloyl group, a vinyl group (also called an ethenyl group), and an allyl group (also called a 2-propenyl group), with a (meth)acryloyl group being preferred.
Examples of the group capable of bonding to a functional group in the adhesive resin (I-1a) include an isocyanate group and a glycidyl group capable of bonding to a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding to a carboxy group or an epoxy group.

Examples of the unsaturated group-containing compound include (meth)acryloyloxyethyl isocyanate, (meth)acryloyl isocyanate, and glycidyl (meth)acrylate. Of these, (meth)acryloyloxyethyl isocyanate is preferred, and 2-methacryloyloxyethyl isocyanate is particularly preferred.
The isocyanate compound is capable of bonding with hydroxyl groups in the adhesive resin (I-1a), and the amount of the isocyanate compound used is preferably 10 to 150 mol, more preferably 20 to 140 mol, and even more preferably 30 to 130 mol, when the total number of hydroxyl groups in the adhesive resin (I-1a) is 100 mol.

The adhesive resin (I-2a) contained in the first adhesive composition (I-2) may be one type or two or more types, and if there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-2), the content of the adhesive resin (I-2a) is preferably 5 to 99 mass%, more preferably 10 to 95 mass%, and particularly preferably 10 to 90 mass%, relative to the total mass of the first adhesive composition (I-2).

(Crosslinking Agent)
When the adhesive resin (I-2a) is, for example, the acrylic polymer having a structural unit derived from a functional group-containing monomer similar to that in the adhesive resin (I-1a), the first adhesive composition (I-2) may further contain a crosslinking agent.

The crosslinking agent in the first pressure-sensitive adhesive composition (I-2) may be the same as the crosslinking agent in the first pressure-sensitive adhesive composition (I-1).
The first pressure-sensitive adhesive composition (I-2) may contain only one type of crosslinking agent, or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-2), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 1 to 10 parts by mass, per 100 parts by mass of the adhesive resin (I-2a).

(Photopolymerization initiator)
The first pressure-sensitive adhesive composition (I-2) may further contain a photopolymerization initiator. When the first pressure-sensitive adhesive composition (I-2) contains a photopolymerization initiator, the curing reaction proceeds sufficiently even when the composition is irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the first pressure-sensitive adhesive composition (I-2) include the same photopolymerization initiators as those in the first pressure-sensitive adhesive composition (I-1).
The photopolymerization initiator contained in the first pressure-sensitive adhesive composition (I-2) may be only one type, or may be two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, per 100 parts by mass of the adhesive resin (I-2a).

(Other additives)
The first pressure-sensitive adhesive composition (I-2) may contain other additives that do not fall under any of the above-mentioned components, as long as the effects of the present invention are not impaired.
Examples of the other additives in the first pressure-sensitive adhesive composition (I-2) include the same additives as those in the first pressure-sensitive adhesive composition (I-1).
The other additives contained in the first pressure-sensitive adhesive composition (I-2) may be one type only, or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-2), the content of other additives is not particularly limited and may be selected appropriately depending on their types.

(solvent)
The first pressure-sensitive adhesive composition (I-2) may contain a solvent for the same purpose as in the first pressure-sensitive adhesive composition (I-1).
Examples of the solvent in the first pressure-sensitive adhesive composition (I-2) include the same solvents as those in the first pressure-sensitive adhesive composition (I-1).
The first pressure-sensitive adhesive composition (I-2) may contain one type of solvent, or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.
In the first pressure-sensitive adhesive composition (I-2), the content of the solvent is not particularly limited and may be appropriately adjusted.

{First Pressure-Sensitive Adhesive Composition (I-3)}
As described above, the first pressure-sensitive adhesive composition (I-3) contains the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable low molecular weight compound.

In the first adhesive composition (I-3), the content of the adhesive resin (I-2a) is preferably 5 to 99 mass%, more preferably 10 to 95 mass%, and particularly preferably 15 to 90 mass%, relative to the total mass of the first adhesive composition (I-3).

(energy ray curable low molecular weight compound)
The energy ray-curable low molecular weight compound contained in the first pressure-sensitive adhesive composition (I-3) includes monomers and oligomers that have an energy ray-polymerizable unsaturated group and are curable by irradiation with energy rays, and examples of the energy ray-curable compound contained in the first pressure-sensitive adhesive composition (I-1) include the same monomers and oligomers as those contained in the first pressure-sensitive adhesive composition (I-2).
The energy ray-curable low molecular weight compound contained in the first pressure-sensitive adhesive composition (I-3) may be only one type, or may be two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-3), the content of the energy ray-curable low molecular weight compound is preferably 0.01 to 300 parts by mass, more preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass, per 100 parts by mass of the adhesive resin (I-2a).

(Photopolymerization initiator)
The first pressure-sensitive adhesive composition (I-3) may further contain a photopolymerization initiator. In the first pressure-sensitive adhesive composition (I-3) containing a photopolymerization initiator, the curing reaction proceeds sufficiently even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the first pressure-sensitive adhesive composition (I-3) include the same photopolymerization initiators as those in the first pressure-sensitive adhesive composition (I-1).
The photopolymerization initiator contained in the first pressure-sensitive adhesive composition (I-3) may be only one type, or may be two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-3), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable low molecular weight compound.

(Other additives)
The first pressure-sensitive adhesive composition (I-3) may contain other additives that do not fall under any of the above-mentioned components, as long as the effects of the present invention are not impaired.
Examples of the other additives include the same additives as those in the first pressure-sensitive adhesive composition (I-1).
The other additives contained in the first pressure-sensitive adhesive composition (I-3) may be one type only, or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

In the first adhesive composition (I-3), the content of other additives is not particularly limited and may be selected appropriately depending on their types.

(solvent)
The first pressure-sensitive adhesive composition (I-3) may contain a solvent for the same purpose as in the first pressure-sensitive adhesive composition (I-1).
Examples of the solvent in the first pressure-sensitive adhesive composition (I-3) include the same solvents as those in the first pressure-sensitive adhesive composition (I-1).
The first pressure-sensitive adhesive composition (I-3) may contain one type of solvent, or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.
In the first pressure-sensitive adhesive composition (I-3), the content of the solvent is not particularly limited and may be appropriately adjusted.

{First Pressure-Sensitive Adhesive Composition Other Than First Pressure-Sensitive Adhesive Compositions (I-1) to (I-3)}
Up to this point, the first pressure-sensitive adhesive composition (I-1), the first pressure-sensitive adhesive composition (I-2), and the first pressure-sensitive adhesive composition (I-3) have been mainly explained, but the components explained as contained therein can be similarly used in general first pressure-sensitive adhesive compositions other than these three types of first pressure-sensitive adhesive compositions (in the present embodiment, referred to as "first pressure-sensitive adhesive compositions other than first pressure-sensitive adhesive compositions (I-1) to (I-3)").

Examples of first pressure-sensitive adhesive compositions other than the first pressure-sensitive adhesive compositions (I-1) to (I-3) include not only energy ray-curable first pressure-sensitive adhesive compositions but also non-energy ray-curable first pressure-sensitive adhesive compositions.
Examples of the non-energy ray-curable first adhesive composition include those containing adhesive resins such as acrylic resins (resins having (meth)acryloyl groups), urethane resins (resins having urethane bonds), rubber resins (resins having a rubber structure), silicone resins (resins having siloxane bonds), epoxy resins (resins having epoxy groups), polyvinyl ether, or polycarbonate, and those containing acrylic resins are preferred.

It is preferable that the first pressure-sensitive adhesive compositions other than the first pressure-sensitive adhesive compositions (I-1) to (I-3) contain one or more types of crosslinking agents, and the content thereof can be the same as in the case of the first pressure-sensitive adhesive composition (I-1) described above, etc.

<Method for producing first pressure-sensitive adhesive composition>
The first pressure-sensitive adhesive compositions, such as the first pressure-sensitive adhesive compositions (I-1) to (I-3), can be obtained by blending the pressure-sensitive adhesive and, as necessary, each component for constituting the first pressure-sensitive adhesive composition, such as a component other than the pressure-sensitive adhesive.
The order of addition of the components is not particularly limited, and two or more components may be added simultaneously.
When a solvent is used, the solvent may be used by mixing it with any of the other ingredients to pre-dilute the ingredients, or the solvent may be used by mixing it with any of the other ingredients without pre-diluting the ingredients.
The method for mixing the components during blending is not particularly limited, and may be appropriately selected from known methods such as a method of mixing by rotating a stirrer or stirring blade, a method of mixing using a mixer, a method of mixing by applying ultrasound, etc.
The temperature and time during addition and mixing of each component are not particularly limited as long as the components do not deteriorate, and may be adjusted appropriately. The temperature is preferably 15 to 30°C.

{Composition of the first adhesive layer}
In this embodiment, the composition of the first pressure-sensitive adhesive layer is the same as the above-mentioned first pressure-sensitive adhesive layer composition except that the solvent is removed.
In the first pressure-sensitive adhesive layer (I-1) when the first pressure-sensitive adhesive layer composition is the first pressure-sensitive adhesive composition (I-1), the content ratio of the adhesive resin (I-1a) relative to the total mass of the first pressure-sensitive adhesive layer (I-1) is preferably 50 to 99 mass%, more preferably 55 to 95 mass%, and even more preferably 60 to 90 mass%. In addition, as another aspect of the present invention, the content ratio of the adhesive resin (I-1a) relative to the total mass of the first pressure-sensitive adhesive layer (I-1) may be 25 to 80 mass%, may be 30 to 75 mass%, or may be 35 to 70 mass%. In addition, the content ratio of the energy ray curable compound relative to the total mass of the first pressure-sensitive adhesive layer (I-1) is preferably 1 to 50 mass%, more preferably 2 to 48 mass%, and even more preferably 5 to 45 mass%. When the first pressure-sensitive adhesive layer (I-1) contains a crosslinking agent, the content of the crosslinking agent relative to the total mass of the first pressure-sensitive adhesive layer (I-1) is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and even more preferably 0.3 to 8 mass%.

When the first pressure-sensitive adhesive layer composition is the first pressure-sensitive adhesive composition (I-2), the content ratio of the adhesive resin (I-2a) in the first pressure-sensitive adhesive layer (I-2) relative to the total mass of the first pressure-sensitive adhesive layer (I-2) is preferably 70 to 100 mass%, more preferably 75 to 100 mass%, even more preferably 80 to 100 mass%, and particularly preferably 80 to 99.6 mass%. When the first pressure-sensitive adhesive layer (I-2) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first pressure-sensitive adhesive layer (I-2) is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and even more preferably 0.3 to 8 mass%.

In the first pressure-sensitive adhesive layer (I-3) in which the first pressure-sensitive adhesive layer composition is the first pressure-sensitive adhesive composition (I-3), the content ratio of the adhesive resin (I-2a) relative to the total mass of the first pressure-sensitive adhesive layer (I-3) is preferably 50 to 99% by mass, more preferably 55 to 95% by mass, and even more preferably 60 to 90% by mass. In addition, the content ratio of the energy ray-curable low molecular weight compound relative to the total mass of the first pressure-sensitive adhesive layer (I-3) is preferably 1 to 50% by mass, more preferably 2 to 48% by mass, and even more preferably 5 to 45% by mass. In the case where the first pressure-sensitive adhesive layer (I-3) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first pressure-sensitive adhesive layer (I-3) is preferably 0.1 to 10% by mass, more preferably 0.2 to 9% by mass, and even more preferably 0.3 to 8% by mass.

In this embodiment, the first adhesive layer (I-2) preferably contains an adhesive resin (I-2a) and a crosslinking agent. In this case, the adhesive resin (I-2a) is preferably an acrylic polymer obtained by reacting an acrylic polymer having a structural unit derived from an (meth)acrylic acid alkyl ester and a unit derived from a hydroxyl group-containing monomer with an unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group. The crosslinking agent may be any of the compounds exemplified in the first adhesive composition (I-1), and it is particularly preferable to use tolylene-2.6-diisocyanate.

The content ratio of the structural units derived from (meth)acrylic acid alkyl esters to the total mass of the adhesive resin (I-2a) is preferably 50 to 99% by mass, more preferably 60 to 98% by mass, and even more preferably 70 to 97% by mass. The content ratio of the units derived from hydroxyl group-containing monomers to the total mass of the adhesive resin (I-2a) is preferably 0.5 to 15% by mass, more preferably 1.0 to 10% by mass, and even more preferably 2.0 to 10% by mass. The (meth)acrylic acid alkyl ester in the adhesive resin (I-2a) preferably has an alkyl group having 1 to 12 carbon atoms, and more preferably 1 to 4 carbon atoms. The adhesive resin (I-2a) preferably has structural units derived from two or more types of (meth)acrylic acid alkyl esters, more preferably has structural units derived from methyl (meth)acrylate and n-butyl (meth)acrylate, and even more preferably has structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (I-2a), those exemplified in the above-mentioned adhesive resin (I-1a) can be used, and it is particularly preferable to use 2-hydroxyethyl acrylate. As the unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group, the compounds exemplified in the first adhesive composition (I-2) can be used, and it is particularly preferable to use 2-methacryloyloxyethyl isocyanate. When the total hydroxyl groups derived from the hydroxyl group-containing monomer are taken as 100 mol, the amount of the unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group is preferably 20 to 80 mol, more preferably 25 to 75 mol, and even more preferably 30 to 70 mol.

Release Film The release film may be any film known in the art.
Preferred examples of the release film include a resin film such as polyethylene terephthalate, at least one surface of which has been subjected to a release treatment such as silicone treatment; and a film in which at least one surface is a release surface composed of polyolefin.
The thickness of the release film is preferably similar to the thickness of the substrate.

Second Adhesive Layer The second adhesive layer (i.e., laminating adhesive layer) is an adhesive layer for laminating the terminal protecting double-sided tape of this embodiment to a support.
The second pressure-sensitive adhesive layer may be one known in the art, and can be appropriately selected from those described above for the first pressure-sensitive adhesive layer in accordance with the support.

The thickness of the second pressure-sensitive adhesive layer is preferably from 5 to 50 μm, more preferably from 10 to 45 μm, and particularly preferably from 15 to 40 μm.
Here, "the thickness of the second pressure-sensitive adhesive layer" means the thickness of the entire second pressure-sensitive adhesive layer; for example, the thickness of a second pressure-sensitive adhesive layer consisting of multiple layers means the total thickness of all layers constituting the second pressure-sensitive adhesive layer.

The second adhesive composition for forming the second adhesive layer is the same as the first adhesive composition, and the manufacturing method of the second adhesive composition is also the same as the manufacturing method of the first adhesive composition.

The second pressure-sensitive adhesive layer preferably contains the above-mentioned pressure-sensitive adhesive resin (I-1a).
In this case, the content ratio of the adhesive resin (I-1a) to the total mass of the second adhesive layer is preferably 70 to 100 mass%, more preferably 75 to 100 mass%, even more preferably 80 to 100 mass%, and particularly preferably 80 to 99.98 mass%. The second adhesive layer may further contain a crosslinking agent. The content ratio of the crosslinking agent to the total mass of the second adhesive layer is preferably 0.005 to 0.1 mass%, more preferably 0.01 to 0.09 mass%, and even more preferably 0.015 to 0.08 mass%. The adhesive resin (I-1a) is preferably an acrylic polymer having a structural unit derived from a (meth)acrylic acid alkyl ester and a unit derived from a carboxyl group-containing monomer. The crosslinking agent may be the above-mentioned crosslinking agent, and it is particularly preferable to use an isocyanate-based crosslinking agent.

The content ratio of the structural unit derived from the (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-1a) is preferably 70 to 100 mass%, more preferably 75 to 100 mass%, and even more preferably 80 to 100 mass%. The content ratio of the structural unit of the carboxyl group-containing monomer relative to the total mass of the adhesive resin (I-1a) is preferably 0 to 20 mass%, more preferably 0.5 to 19 mass%, even more preferably 0.7 to 18 mass%, and particularly preferably 1.0 to 17 mass%. The (meth)acrylic acid alkyl ester in the adhesive resin (I-1a) preferably has an alkyl group with 4 to 12 carbon atoms, more preferably 4 to 8. In addition, the adhesive resin (I-1a) is preferably an acrylic acid alkyl ester. Among them, the (meth)acrylic acid alkyl ester is particularly preferably n-butyl acrylate. In addition, examples of the carboxy-containing monomer in the adhesive resin (I-1a) include ethylenically unsaturated monocarboxylic acids, ethylenically unsaturated dicarboxylic acids, and anhydrides of ethylenically unsaturated dicarboxylic acids. Among these, ethylenically unsaturated monocarboxylic acids are preferred, (meth)acrylic acid is more preferred, and acrylic acid is particularly preferred.
The weight average molecular weight of the adhesive resin (I-1a) of this embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and even more preferably 200,000 to 600,000.

The double-sided tape for protecting a terminal can be manufactured by laminating the above-mentioned layers in order so that they are in a corresponding positional relationship. The method for forming each layer is as described above.

For example, the above-mentioned embedding layer forming composition is applied to the release-treated surface of a release film and dried as necessary to laminate the embedding layer. The above-mentioned first adhesive composition is applied to the release-treated surface of another release film and dried as necessary to laminate the first adhesive layer. The embedding layer on the release film is bonded to the first adhesive layer on the other release film to obtain a terminal protection tape in which the release film, embedding layer, first adhesive layer and release film are laminated in this order. The release film can be removed when the terminal protection tape is to be used.

Next, the release film on the embedded layer side of the terminal protection tape, in which the release film, embedding layer, first adhesive layer and release film are laminated in this order as described above, is peeled off and this is bonded to the substrate to obtain a terminal protection tape in which the embedded layer, first adhesive layer and release film are laminated in this order on the substrate.

For example, an embedding layer can be laminated on the substrate by extruding a composition for forming an embedding layer onto the substrate. The first adhesive composition described above is applied to the release-treated surface of a release film, and dried as necessary to laminate the first adhesive layer. Then, the first adhesive layer on the release film can be bonded to the embedding layer on the substrate to obtain a terminal protection tape in which the embedding layer, the first adhesive layer, and the release film are laminated in this order on the substrate.

The above-mentioned terminal protection tape is prepared in which the embedding layer, the first adhesive layer, and the release film are laminated in this order on the substrate. The above-mentioned second adhesive composition is applied to the release-treated surface of another release film, and dried as necessary to laminate the second adhesive layer. Then, the second adhesive layer on this release film is bonded to the substrate of the terminal protection tape to obtain the double-sided terminal protection tape of this embodiment in which the release film, the second adhesive layer, the substrate, the embedding layer, the first adhesive layer, and the release film are laminated in this order. The release film can be removed when using the double-sided terminal protection tape.

A double-sided tape for protecting terminals having layers other than the layers described above can be manufactured by appropriately adding either or both of the steps of forming and laminating the other layers to the manufacturing method described above so that the lamination position of the other layers is appropriate.

Manufacturing Method of a Semiconductor Device with an Electromagnetic Wave Shielding Film The double-sided tape for protecting a terminal of this embodiment can be used, for example, in the following manufacturing method of a semiconductor device with an electromagnetic wave shielding film.
FIG. 3 is a cross-sectional view that shows a schematic embodiment of a method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to the present embodiment, in which a terminal-protecting double-sided tape 1 having a first adhesive layer 14, a embedding layer 13, a substrate 11, and a second adhesive layer 15, in this order, is fixed to a support 30 to manufacture a semiconductor device with an electromagnetic wave shielding film.

First, as shown in Figures 3(a) and (b), the terminal-equipped semiconductor device 65 is pressed against the viscoelastic layer 12 of the terminal protection double-sided tape with the terminal 91 side, i.e., the terminal forming surface 63a of the circuit board 63, facing down, to embed the terminal 91 in the viscoelastic layer 12.
At this time, the viscoelastic layer 12 is brought into contact with the terminals 91 of the terminal-equipped semiconductor device 65, and the terminal-equipped semiconductor device 65 is pressed against the terminal-protecting double-sided tape. This causes the outermost surface of the viscoelastic layer 12 on the side of the first adhesive layer 14 to be pressed against the surface of the terminals 91 and the terminal-forming surface 63a of the circuit board 63, in that order. At this time, the viscoelastic layer 12 is heated, so that the viscoelastic layer 12 softens and spreads between the terminals 91 so as to cover the terminals 91, adheres closely to the terminal-forming surface 63a, and covers the surfaces of the terminals 91, particularly the surfaces of the areas in the vicinity of the terminal-forming surface 63a, thereby embedding the terminals 91.

As a method for pressing the terminal-equipped semiconductor device 65 onto the double-sided tape for protecting the terminals, a known method of pressing and attaching various sheets to an object can be applied, such as a method using a laminating roller or a vacuum laminator.

The pressure when bonding the terminal-equipped semiconductor device 65 to the terminal protection double-sided tape is not particularly limited, but is preferably 0.1 to 1.5 MPa, and more preferably 0.3 to 1.3 MPa. The heating temperature is preferably 30 to 70°C, more preferably 35 to 65°C, and particularly preferably 40 to 60°C. In addition, it is preferable to attach the first adhesive layer 14 of the viscoelastic layer 12 to the terminal formation surface 63a.

A conductive resin 101 is applied to the exposed surface of the terminal-equipped semiconductor device 65 that is not embedded in the viscoelastic layer 12 of the terminal protection double-sided tape (FIG. 3(c)), and then heat-cured to form an electromagnetic wave shielding film 10 made of a conductive material (FIG. 3(d)). Methods for forming the electromagnetic wave shielding film 10 by covering with a conductive material include sputtering, ion plating, spray coating, and the like.

As the sputtering method, a sputtering method known in this field, such as DC sputtering, RF sputtering, DC magnetron sputtering, ion beam sputtering, etc. can be used.

The double-sided tape for protecting terminals has a viscoelastic layer, a substrate, and a second adhesive layer, and at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermally conductive layer. This makes it possible to suppress an increase in the surface temperature of the double-sided tape for protecting terminals and surface roughness even during the process of forming an electromagnetic shielding film by methods such as sputtering, ion plating, and spray coating, which apply a conductive resin.

By picking up the semiconductor device 66 with an electromagnetic wave shielding film from the double-sided tape 1 for protecting terminals of this embodiment, the semiconductor device 66 with an electromagnetic wave shielding film covered with the electromagnetic wave shielding film 10 can be removed (Figure 3 (e)).

In the manufacturing method of a semiconductor device with an electromagnetic wave shielding film shown in Figure 3, the terminal-equipped semiconductor device 65 to be electromagnetically shielded may be an individually manufactured terminal-equipped semiconductor device 65, or may be a terminal-equipped semiconductor device 65 that has been singulated by a dicing method.

In the manufacturing method of a semiconductor device with an electromagnetic wave shielding film shown in Figure 3, a method is shown in which a semiconductor device with terminals 65, which has been singulated and has individual electronic components 61, 62 sealed with sealing resin 64, is electromagnetically shielded using double-sided tape 1 for protecting terminals. However, as described below, the semiconductor device with terminals 65 can also be electromagnetically shielded from the semiconductor device with terminals assembly 6 before it is singulated using double-sided tape 1 for protecting terminals.

Figures 4 and 5 are cross-sectional views that show a schematic diagram of another embodiment of a method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to this embodiment, in which a terminal-equipped semiconductor device 65 is electromagnetically shielded using a terminal-protecting double-sided tape 1 having, in this order, a first adhesive layer 14, an embedding layer 13, a substrate 11, and a second adhesive layer 15.

First, as shown in Figures 4(a) and (b), the terminal-equipped semiconductor device assembly 6 connected by the circuit board 63 is pressed against the viscoelastic layer 12 of the terminal protection double-sided tape with the terminal 91 side, i.e., the terminal forming surface 63a of the circuit board 63, facing down, and the terminal 91 is embedded in the viscoelastic layer 12 in the same manner as in Figures 3(a) and (b).

At this time, while applying pressure from above to the terminal-equipped semiconductor device assembly 6, the terminals 91 are embedded in the viscoelastic layer 12 of the double-sided tape for protecting the terminals, as in Figures 3(a) and (b) above.

Furthermore, by laminating the viscoelastic layer 12 while heating it, the viscoelastic layer 12 can be softened and adhered to the terminal forming surface 63a of the circuit board 63. The pressure when the terminal-equipped semiconductor device assembly 6 is pressed onto the terminal protection double-sided tape is not particularly limited, but is preferably 0.1 to 1.5 MPa, and more preferably 0.3 to 1.3 MPa. The heating temperature is preferably 30 to 70°C, more preferably 35 to 65°C, and particularly preferably 40 to 60°C. Furthermore, it is preferable to laminate the first adhesive layer 14 of the viscoelastic layer 12 to the terminal forming surface 63a.

Next, the terminal-equipped semiconductor device assembly 6 is diced to obtain a terminal-equipped semiconductor device 65 (FIG. 4(c)). The terminal-protecting double-sided tape of this embodiment used in the process of forming the electromagnetic wave shielding film also serves as a dicing tape for the terminal-equipped semiconductor device assembly 6. In the manufacturing method of a semiconductor device with an electromagnetic wave shielding film shown in FIG. 3, when the terminal-equipped semiconductor device 65 to be electromagnetically shielded is a terminal-equipped semiconductor device 65 that has been singulated by a dicing method, the work of picking up the terminal-equipped semiconductor device on the dicing tape and replacing it with the terminal-protecting double-sided tape (FIG. 3(a)) is required. On the other hand, in the manufacturing method of a semiconductor device with an electromagnetic wave shielding film shown in FIG. 4, the work of replacing the terminal-equipped semiconductor device 65 on the dicing tape with the terminal-protecting double-sided tape can be omitted.

Next, the release tape 22 is peeled off, and the terminal protection double-sided tape is fixed on the support 30 via the second adhesive layer 15. Then, a conductive resin 101 is applied to the exposed surface of the terminal-equipped semiconductor device 65 that is not embedded in the viscoelastic layer 12 of the terminal protection double-sided tape (FIG. 4(d)). At this time, if the separation of the conductive resin 101 is insufficient at the boundary portion of each terminal-equipped semiconductor device 65 of the terminal-equipped semiconductor device assembly 6, the terminal protection double-sided tape may be stretched using an expanding device or the like. With the conductive resin 101 applied to each side of the individualized terminal-equipped semiconductor device 65, each terminal-equipped semiconductor device 65 can be individualized. Furthermore, the conductive resin 101 applied to the top and side surfaces of the individualized terminal-equipped semiconductor device 65 is heated and cured to form an electromagnetic wave shielding film 10 made of a conductive material on the exposed surface of the terminal-equipped semiconductor device 65 that is not embedded in the viscoelastic layer 12 of the terminal protection double-sided tape (FIG. 4(e)). The electromagnetic wave shielding film 10 may be formed (FIG. 4(e)) by directly applying a conductive material to the semiconductor device 65 with terminals (FIG. 4(c)) by a method such as sputtering, ion plating, spray coating, etc. The temperature of the conductive material when applying the conductive material by a method such as sputtering, ion plating, spray coating, etc. is from room temperature to 250° C.

The double-sided tape for protecting terminals has a viscoelastic layer 12, a substrate 11, and a second adhesive layer 15, and at least one of the viscoelastic layer 12, the substrate 11, and the second adhesive layer 15 is a thermally conductive layer, so that an increase in the surface temperature of the double-sided tape for protecting terminals and surface roughness can be suppressed even in the electromagnetic wave shielding film formation process using methods such as sputtering ion plating and spray coating in which a conductive resin is applied.

By picking up the semiconductor device 66 with an electromagnetic shielding film from the terminal protection double-sided tape of this embodiment, a semiconductor device 65 with terminals covered with an electromagnetic shielding film 10 can be removed (Figure 4 (f)).

As shown in Figures 5(a) to (c), the process of embedding terminals 91 in the viscoelastic layer 12 of the above-mentioned double-sided tape for protecting terminals and the process of dicing the terminal-equipped semiconductor device assembly 6 to obtain a terminal-equipped semiconductor device 65 may be performed on the double-sided tape for protecting terminals fixed on the support 30 via the second adhesive layer 15.

In the terminal protection double-sided tape of this embodiment, the height h0 of the terminal 91 is preferably lower than the thickness d1 of the viscoelastic layer 12, and preferably satisfies 1.2≦d1/h0≦5.0. Specifically, the height of the terminal 91 is preferably 20 to 300 μm, more preferably 30 to 270 μm, and particularly preferably 40 to 240 μm. When the height of the terminal 91 is equal to or greater than the lower limit, the function of the terminal 91 can be further improved. Furthermore, when the height of the terminal 91 is equal to or less than the upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper part of the terminal 91 is enhanced.
In this specification, "height of terminal" means the height of the terminal at the highest position from the terminal formation surface. When the terminal-equipped semiconductor device assembly and the terminal-equipped semiconductor device 65 have multiple terminals 91, the height h0 of the terminals 91 can be the average of the terminals. The height of the terminal can be measured, for example, by a non-contact three-dimensional optical interference surface roughness meter (manufactured by Veeco Japan, product name: Wyko NT1100).

The width of the terminal 91 is not particularly limited, but is preferably 170 to 350 μm, more preferably 200 to 320 μm, and particularly preferably 230 to 290 μm. When the width of the terminal 91 is equal to or greater than the lower limit, the function of the terminal 91 can be further improved. Furthermore, when the width of the terminal 91 is equal to or less than the upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper part of the terminal 91 is enhanced.
In this specification, the "terminal width" refers to the maximum value of a line segment obtained by connecting two different points on the terminal surface with a straight line when the terminal is viewed in a plan view from above the terminal in a direction perpendicular to the terminal formation surface. When the terminal is spherical or hemispherical, the "terminal width" refers to the maximum diameter (terminal diameter) of the terminal when viewed in a plan view from above the terminal.

The distance between adjacent terminals 91 (i.e., the inter-terminal pitch) is not particularly limited, but is preferably 250 to 800 μm, more preferably 300 to 600 μm, and particularly preferably 350 to 500 μm. When the distance is equal to or greater than the lower limit, the embeddability of the terminals 91 can be further improved. Furthermore, when the distance is equal to or less than the upper limit, the effect of suppressing the viscoelastic layer 12 from remaining on the upper part of the terminals 91 is further enhanced.
In this specification, the "distance between adjacent terminals" means the minimum distance between the surfaces of adjacent terminals.

The present invention will be described in more detail below with reference to specific examples. However, the present invention is not limited to the examples shown below.

<Monomer>
The full names of the abbreviated monomers are shown below.
HEA: 2-hydroxyethyl acrylate BA: n-butyl acrylate MMA: methyl methacrylate AAc: acrylic acid

(Production of second pressure-sensitive adhesive layer-forming composition A)
To 100 parts by mass of an acrylic copolymer solution consisting of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive main agent, solids concentration 33.6%, manufactured by Nippon Carbide Industries Co., Ltd., product name "Nissetsu PE-121"), 0.2 parts by mass of N,N'-(cyclohexane-1,3-diylbismethylene)bis(glycidylamine) (concentration 5%, manufactured by Mitsubishi Gas Chemical Company, Inc., product name "TETRAD-C") as a crosslinking agent was added and stirred for 30 minutes to prepare a second adhesive layer forming composition A.

(Production of second pressure-sensitive adhesive layer A)
The second adhesive layer-forming composition A was applied to the release-treated surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate film had been subjected to a silicone treatment for release, and the composition was dried by heating at 100° C. for 1 minute to produce a second adhesive layer A having a thickness of 20 μm.

(Production of first pressure-sensitive adhesive layer-forming composition B)
A first adhesive layer-forming composition B was prepared by adding 0.5 parts by mass of tolylene-2,6-diisocyanate (manufactured by Toyochem Co., Ltd., product name "BHS-8515", solids concentration: 37.5%) as a crosslinking agent to 100 parts by mass of a resin solution (weight average molecular weight (Mw) 500,000, adhesive main agent, solids content 35 mass%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., product name "Coponyl UN-4730-D") obtained by adding 2-methacryloyloxyethyl isocyanate (approximately 50 mol % relative to HEA) to an acrylic copolymer consisting of 74 parts by mass of BA, 20 parts by mass of MMA, and 6 parts by mass of HEA, and stirring for 30 minutes.

(Production of first pressure-sensitive adhesive layer B)
The first adhesive layer-forming composition B was applied to the release-treated surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate film had been subjected to a silicone treatment for release, and the composition was dried by heating at 100° C. for 1 minute to produce a first adhesive layer B having a thickness of 10 μm.

(Production of Composition A for Forming Burying Layer)
100 parts by mass of an acrylic copolymer solution consisting of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive base, solid content concentration 33.6%, manufactured by Nippon Carbide Industries Co., Ltd., product name "Nissetsu PE-121") and a resin solution (weight average molecular weight (Mw) 370,000, adhesive base, solid content concentration 45%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., product name "Coponyl") in which 2-methacryloyloxyethyl isocyanate is added to an acrylic copolymer consisting of 62 parts by mass of BA, 10 parts by mass of MMA, and 28 parts by mass of HEA at an addition rate of 80 mol% relative to 100 mol% of HEA. To the mixture, 75 parts by mass of an isocyanate-2,6-diisocyanate (manufactured by Toyochem Co., Ltd., product name "BHS-8515", solid content concentration: 37.5%) was added as a crosslinking agent, and the mixture was stirred for 30 minutes to prepare a composition A for forming a embedding layer.

(Substrate A)
A pressure-sensitive adhesive was applied to a polyethylene terephthalate (PET) film (thickness 25 μm) so that the thickness of the pressure-sensitive adhesive layer was 22 μm, and a copper foil having a thickness of 9 μm was attached to obtain a substrate A. In addition, for the formation of the pressure-sensitive adhesive layer, 46 parts by mass of BA, 37 parts by mass of 2-ethylhexyl acrylate, 9 parts by mass of vinyl acetate, 6 parts by mass of AAc, and 2 parts by mass of maleic anhydride were mixed with 100 parts by mass of an acrylic copolymer (main adhesive, solid content concentration 30%), and 2.18 parts by mass of tolylene-2,6-diisocyanate (manufactured by Toyochem Co., Ltd., product name "BHS-8515", solid content concentration: 37.5%) was added as a crosslinking agent, and a pressure-sensitive adhesive composition was used, which was prepared by stirring for 30 minutes.
(Substrate B)
A film in which boron nitride filler was dispersed in polyimide resin was formed to a thickness of 25 μm to prepare a substrate B. The content of the boron nitride filler relative to the total mass of the substrate was 50 mass %.
(Substrate C)
A film of highly heat-resistant special polyester (product name "TORCENA", thickness 50 μm, manufactured by Toray Industries, Inc.) with copper vapor-deposited on one surface was used as the substrate C. The thickness of the vapor-deposited copper was 0.1 μm.
(Substrate D)
A PET film (thickness: 50 μm) was used as the substrate D.

(Preparation of Semiconductor Device with Terminals)
In order to evaluate the embeddability of the terminal protection double-sided tapes of the examples and comparative examples, the following semiconductor devices with terminals were prepared.
Semiconductor device with terminals Size of semiconductor device: 6mm x 6mm
Terminal height: 50 μm
Terminal diameter: 250 μm
Terminal pitch: 400 μm
Number of terminals: 13 x 13 = 169

<Measurement of thermal conductivity>
The thermal diffusivity of the substrate, the viscoelastic layer, and the second pressure-sensitive adhesive layer were measured using a thermal diffusivity/thermal conductivity measuring device (manufactured by A-Phase Corporation, product name "ai-Phase Mobile 1u").
The thermal conductivities of the substrate, the viscoelastic layer, and the second pressure-sensitive adhesive layer were then calculated using the following formula (2).
The specific heat of the substrate, the viscoelastic layer and the second pressure-sensitive adhesive layer was calculated by the DSC method, and the density was calculated by the Archimedes method.
Thermal conductivity (W/(m K)) = thermal diffusivity x density x specific heat Equation (2)

<Measurement of surface temperature of double-sided tape for protecting terminals during sputtering>
A semiconductor device with terminals was placed on the double-sided tape for protecting terminals of the examples and comparative examples by the method described below. A temperature measurement label (vacuum thermo label, manufactured by Nihon Yu Giken Kogyo Co., Ltd.) was attached to the portion of the viscoelastic layer surface (first adhesive layer surface) of the double-sided tape for protecting terminals where the semiconductor device with terminals was not placed, and the surface was protected with heat-resistant tape. Sputtering was performed on the double-sided tape for protecting terminals under the conditions described below. The heat-resistant tape was then peeled off to confirm the surface temperature of the double-sided tape for protecting terminals during sputtering.

<Sputtering treatment>
The release film 22 on the second adhesive layer 15 side of the terminal protection double-sided tape 1 in the form of Fig. 1 was peeled off, and the terminal protection double-sided tape of the Example and Comparative Example was attached to alkali-free glass (manufactured by Corning Incorporated, Eagle XG, 100 mm square, 0.7 mm thick) via the second adhesive layer to prepare a sample for measurement. A semiconductor device with terminals was placed on this sample as follows.
As shown in FIG. 3A, the semiconductor device with terminals was placed on the double-sided tape for protecting the terminals by pressing it against the viscoelastic layer 12 with the terminal side facing down under a pressing pressure (load of 1.1 MPa) for a pressing time of 40 s and a heating temperature of 50° C.
Thereafter, a copper layer was formed by sputtering under the following conditions.
Target: Copper Method: DC magnetron sputtering Power application: DC 500W
Substrate heating: 150°C
Carrier gas: Argon Film formation pressure: 3.4 Pa
The surface of the terminal protection double-sided tape (surface of the first adhesive layer) after sputtering was visually observed. Those without surface roughness such as cracks, wrinkles, or peeling were rated as pass (A), and those with surface roughness such as cracks, wrinkles, or peeling were rated as fail (B).

[Example 1]
The embedding layer forming composition A was applied to the release-treated surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate film was treated for release by silicone treatment, and the film was dried by heating at 100° C. for 1 minute. Then, the release-treated surface of a release film ("SP-PET382150" manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate film was treated for release by silicone treatment was laminated on the embedding layer forming composition A to produce an embedding layer having a thickness of 50 μm. Next, the embedding layer A having a thickness of 50 μm was bonded to the first adhesive layer B having a thickness of 10 μm. Next, the release film on the embedding layer A side was peeled off and bonded to the substrate A. Finally, the second adhesive layer A was laminated on the opposite side of the embedding layer A of the substrate to produce the terminal protection double-sided tape 1 of Example 1 having the form shown in FIG. 1.
A sputtering process was performed using the terminal-protecting double-sided tape 1, the surface temperature of the terminal-protecting double-sided tape 1 during sputtering was measured, and the surface of the terminal-protecting double-sided tape 1 after sputtering was visually observed. The thermal conductivities of the viscoelastic layer, the substrate A, and the second pressure-sensitive adhesive layer, the surface temperature of the terminal-protecting double-sided tape 1 during sputtering, and the observation results of the surface of the terminal-protecting double-sided tape 1 after sputtering are shown in Table 1. A photograph of the surface of the terminal-protecting double-sided tape 1 after sputtering (the surface of the first pressure-sensitive adhesive layer) is shown in Figure 6.

[Example 2]
A double-sided tape 2 for protecting a terminal was produced in the same manner as in Example 1, except that the substrate B was used instead of the substrate A.
A sputtering process was performed using the terminal-protecting double-sided tape 2, the surface temperature of the terminal-protecting double-sided tape 2 during sputtering was measured, and the surface of the terminal-protecting double-sided tape 2 after sputtering was visually observed. The thermal conductivities of the viscoelastic layer, substrate B, and second adhesive layer, the surface temperature of the terminal-protecting double-sided tape 2 during sputtering, and the observation results of the surface of the terminal-protecting double-sided tape 2 after sputtering are shown in Table 1. A photograph of the surface of the terminal-protecting double-sided tape 2 after sputtering (surface of the first adhesive layer) is shown in Figure 7.

[Comparative Example 1]
A terminal protecting double-sided tape 3 was produced in the same manner as in Example 1, except that the substrate C was used instead of the substrate A.
A sputtering process was performed using the terminal-protecting double-sided tape 3, the surface temperature of the terminal-protecting double-sided tape 3 during sputtering was measured, and the surface of the terminal-protecting double-sided tape 3 after sputtering was visually observed. The thermal conductivities of the viscoelastic layer, the substrate C, and the second pressure-sensitive adhesive layer, the surface temperature of the terminal-protecting double-sided tape 3 during sputtering, and the observation results of the surface of the terminal-protecting double-sided tape 3 after sputtering are shown in Table 1. Also, a photograph of the surface of the terminal-protecting double-sided tape 3 after sputtering (the surface of the first pressure-sensitive adhesive layer) is shown in Figure 8.

[Comparative Example 2]
A terminal protecting double-sided tape 4 was produced in the same manner as in Example 1, except that substrate D was used instead of substrate A.
A sputtering process was performed using the terminal-protecting double-sided tape 4, the surface temperature of the terminal-protecting double-sided tape 4 during sputtering was measured, and the surface of the terminal-protecting double-sided tape 4 after sputtering was visually observed. The thermal conductivities of the viscoelastic layer, substrate D, and second pressure-sensitive adhesive layer, the surface temperature of the terminal-protecting double-sided tape 4 during sputtering, and the observation results of the surface of the terminal-protecting double-sided tape 4 after sputtering are shown in Table 1. Also, a photograph of the surface of the terminal-protecting double-sided tape 4 after sputtering (the surface of the first pressure-sensitive adhesive layer) is shown in Figure 9.

[Comparative Example 3]
A terminal protecting double-sided tape 5 was produced in the same manner as in Comparative Example 2, except that the thickness of the embedding layer A was set to 160 μm.
A sputtering process was performed using the terminal-protecting double-sided tape 5, the surface temperature of the terminal-protecting double-sided tape 5 during sputtering was measured, and the surface of the terminal-protecting double-sided tape 5 after sputtering was visually observed. The thermal conductivities of the viscoelastic layer, substrate D, and second pressure-sensitive adhesive layer, the surface temperature of the terminal-protecting double-sided tape 5 during sputtering, and the observation results of the surface of the terminal-protecting double-sided tape 5 after sputtering are shown in Table 1. A photograph of the surface of the terminal-protecting double-sided tape 5 after sputtering (the surface of the first pressure-sensitive adhesive layer) is shown in Figure 10.

From the results shown in Table 1, it was confirmed that when using the double-sided tape for protecting terminals according to an embodiment of the present invention to electromagnetically shield a semiconductor device with terminals, by having at least one layer among the viscoelastic layer, the base material, and the second adhesive layer be a thermally conductive layer, it is possible to suppress an increase in the surface temperature of the double-sided tape for protecting terminals and surface roughness even during the sputtering process in which a conductive material is applied.

The double-sided tape for protecting terminals of the present invention can be used to protect the terminals of a semiconductor device with terminals when electromagnetically shielding the semiconductor device with terminals. By using the double-sided tape for protecting terminals of the present invention, a semiconductor device with terminals can be electromagnetically shielded, and a semiconductor device with an electromagnetic shielding film can be manufactured.

1: double-sided tape for protecting terminals, 10: electromagnetic wave shielding film, 11: substrate, 12: viscoelastic layer, 13: embedding layer, 14: first adhesive layer, 15: second adhesive layer (laminating adhesive layer), 30: support, 6: semiconductor device assembly with terminals, 60: semiconductor device assembly, 61, 62: electronic component, 63: circuit board, 63a: terminal forming surface, 64: sealing resin layer, 65: semiconductor device with terminals, 66: semiconductor device with electromagnetic wave shielding film, 91: terminal, 101: conductive resin, 20, 22: release film

Claims (5)

A double-sided tape for protecting terminals used in a process for forming an electromagnetic wave shielding film on a semiconductor device with terminals, comprising:
A viscoelastic layer, a substrate, and a second pressure-sensitive adhesive layer,
At least one of the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer is a thermally conductive layer,
The thermal conductivity of the thermally conductive layer is 1.0 W/(m K) or more,
a ratio of a total thickness of the thermally conductive layer to a total thickness of the terminal protection double-sided tape is 0.1 or more;
The viscoelastic layer comprises an embedding layer and a first adhesive layer . The double-sided tape for protecting terminals according to claim 1, wherein at least two layers of the viscoelastic layer, the base material, and the second adhesive layer are thermally conductive layers. The double-sided tape for protecting a terminal according to claim 1 , comprising the first adhesive layer, the embedding layer, the base material, and the second adhesive layer in this order. A step of embedding terminals of a semiconductor device with terminals in the viscoelastic layer of the double-sided tape for protecting a terminal according to any one of claims 1 to 3 ;
forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminals;
A method for manufacturing a semiconductor device with an electromagnetic wave shielding film comprising the steps of: A step of embedding terminals of a terminal-equipped semiconductor device assembly in the viscoelastic layer of the double-sided tape for protecting a terminal according to any one of claims 1 to 3 ;
a step of dicing the terminal-attached semiconductor device assembly to obtain a terminal-attached semiconductor device having terminals embedded in a viscoelastic layer of the terminal protection double-sided tape;
forming an electromagnetic wave shielding film on an exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminals;
A method for manufacturing a semiconductor device with an electromagnetic wave shielding film comprising the steps of:

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