KR102667558B1 - Method for manufacturing a semiconductor device having a double-sided tape for terminal protection and an electromagnetic shielding film - Google Patents

Abstract

A double-sided tape for terminal protection used in the process of forming an electromagnetic wave shield film on a semiconductor device having a terminal, comprising a viscoelastic layer (12), a base material (11), and a second adhesive layer (15), the viscoelastic layer (12) A double-sided tape for terminal protection, wherein at least one layer among the substrate (11) and the second adhesive layer (15) is a heat conductive layer.

Description

Method for manufacturing a semiconductor device having a double-sided tape for terminal protection and an electromagnetic shielding film

The present invention relates to a double-sided tape for terminal protection and a method of manufacturing a semiconductor device having an electromagnetic wave shielding film using the same.

This application claims priority based on Patent Application No. 2018-238855, filed in Japan on December 20, 2018, and uses the content here.

Conventionally, when a multi-pin LSI package used in an MPU or gate array is mounted on a printed wiring board, it is a semiconductor device having a plurality of electronic components, and the connection pad portion is a convex shape made of eutectic solder, high-temperature solder, gold, etc. Electrodes (hereinafter referred to as “terminals” in this specification) are used. Then, a mounting method is adopted in which these terminals are brought into contact with corresponding terminal parts on the chip mounting substrate and melt/diffusion bonded.

With the spread of personal computers, the Internet has become common, and today, smart phones and tablet terminals are also connected to the Internet, and digitized videos, music, photos, text information, etc. are transmitted through the Internet using wireless communication technology. This is increasing even more. In addition, IoT (Internet of Things) has spread, allowing smarter use of semiconductor devices such as sensors, RFID (Radio frequency identifier), MEMS (Micro Electro Mechanical Systems), and wireless components in various application fields such as home appliances and automobiles. Innovative changes are occurring in packaging technology to achieve this.

As electronic devices continue to evolve, the level of demand for semiconductor devices is increasing every year. In particular, in order to meet the demands for higher performance, miniaturization, higher integration, lower power consumption, and lower cost, two important points are heat countermeasures and noise countermeasures.

In response to these heat and noise measures, for example, as disclosed in Patent Document 1, a method of covering an electronic component module with a conductive material to form an electromagnetic wave shield film is adopted. In Patent Document 1, a conductive resin applied to the top and side surfaces of individual electronic component modules is heated and hardened to form an electromagnetic wave shield film.

Methods such as sputtering, ion plating, and spray coating are well known for forming an electromagnetic wave shield film by covering a semiconductor device having terminals with a conductive metal or conductive resin (hereinafter, collectively referred to as “conductive material”). there is.

Patent Document 1: Japanese Patent Publication No. 2011-151372

In the method for manufacturing electronic components disclosed in Patent Document 1, a conductive resin is applied to the external terminal electrodes provided on the back side of the assembly board while being embedded in an adhesive sheet. Since the masking portion is installed at a predetermined position of the adhesive sheet, electrical short circuit between the external terminal electrode and the electromagnetic wave shield film can be prevented.

However, installing the masking portion at a predetermined location on the adhesive sheet is complicated in terms of process. For this reason, there is a demand for a terminal protection tape that can be embedded even in external terminal electrodes that have irregularities such as solder balls and are prone to lifting.

On the other hand, in the electromagnetic shield film formation process using methods such as sputtering, ion plating, and spray coating to apply conductive materials, the surface temperature of the adhesive sheet increases, resulting in surface roughness on the surface of the adhesive sheet. There are cases where it happens. If roughness occurs on the surface of the adhesive sheet, there is a problem in that some of the embedded external terminal electrodes are exposed and electrically short-circuited with the electromagnetic wave shield film. In addition, there is also a problem that due to the roughening of the surface of the adhesive sheet, a portion of the side surface of the separated electronic component module is embedded in the adhesive sheet, and an electromagnetic wave shield film is not formed on this portion.

However, the present invention is a double-sided tape for terminal protection used in the process of forming an electromagnetic shield film on a semiconductor device having terminals, and is also used in the electromagnetic shield film formation process using methods such as sputtering, ion plating, and spray coating for applying conductive materials. The object is to provide a double-sided tape for terminal protection that can suppress an increase in surface temperature and surface roughness of the double-sided tape for terminal protection, and a method of manufacturing a semiconductor device having an electromagnetic wave shielding film using the same.

That is, the present invention provides the following double-sided tape for terminal protection and a method of manufacturing a semiconductor device having an electromagnetic wave shielding film using the same.

[1] A double-sided tape for terminal protection used in the process of forming an electromagnetic shielding film on a semiconductor device having a terminal,

It has a viscoelastic layer, a base material, and a second adhesive layer,

A double-sided tape for terminal protection, wherein at least one layer among the viscoelastic layer, the substrate, and the second adhesive layer is a heat conductive layer.

[2] The double-sided tape for terminal protection according to [1], wherein among the viscoelastic layer, the base material, and the second adhesive layer, two or more layers are heat conductive layers.

[3] The double-sided tape for terminal protection according to [1] or [2], wherein the heat conductive layer has a thermal conductivity of 1.0 W/(m·K) or more.

[4] The double-sided tape for terminal protection according to any one of [1] to [3], wherein the total thickness of the heat-conducting layer relative to the total thickness of the double-sided tape for terminal protection is 0.01 or more.

[5] The double-sided tape for terminal protection according to any one of [1] to [4], wherein the viscoelastic layer has an embedded layer and a first adhesive layer.

[6] The double-sided tape for terminal protection according to [5], which has the first adhesive layer, the embedding layer, the substrate, and the second adhesive layer in this order.

[7] A process of embedding a terminal of a semiconductor device having a terminal in the viscoelastic layer of the double-sided tape for terminal protection according to any one of [1] to [6] above, and

A process of forming an electromagnetic shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection.

A method of manufacturing a semiconductor device having an electromagnetic shielding film comprising a.

[8] A process of embedding a terminal of a semiconductor device assembly having a terminal in the viscoelastic layer of the double-sided tape for terminal protection according to any one of [1] to [6] above,

A process of dicing the semiconductor device assembly having the terminals to form a semiconductor device having terminals with terminals embedded in a viscoelastic layer of the double-sided tape for protecting the terminals, and

A process of forming an electromagnetic shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection.

A method of manufacturing a semiconductor device having an electromagnetic shielding film comprising a.

According to the present invention, a double-sided tape for terminal protection is used in the process of forming an electromagnetic shield film on a semiconductor device having a terminal, and is also used in the electromagnetic wave shield film formation process using methods such as sputtering, ion plating, and spray coating for applying a conductive material, A double-sided tape for terminal protection that can suppress an increase in surface temperature and surface roughness of the double-sided tape for terminal protection, and a method of manufacturing a semiconductor device having an electromagnetic wave shield film using the same are provided.

1 is a cross-sectional view schematically showing one embodiment of the double-sided tape for terminal protection of the present invention.
Figure 2 is a cross-sectional view schematically showing another embodiment of the double-sided tape for terminal protection of the present invention.
Figure 3 is a cross-sectional view schematically showing one embodiment of a method for manufacturing a semiconductor device having an electromagnetic wave shield film of the present invention.
Figure 4 is a cross-sectional view schematically showing another embodiment of a method for manufacturing a semiconductor device having an electromagnetic wave shield film of the present invention.
Figure 5 is a cross-sectional view schematically showing another embodiment of a method for manufacturing a semiconductor device having an electromagnetic wave shield film of the present invention.
Figure 6 is a photograph of the surface (first adhesive layer surface) of the double-sided terminal protection tape of Example 1 after sputtering.
Figure 7 is a photograph of the surface (first adhesive layer surface) of the double-sided terminal protection tape of Example 2 after sputtering.
Figure 8 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 1 after sputtering.
Figure 9 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 2 after sputtering.
Figure 10 is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 3 after sputtering.

1 is a cross-sectional view schematically showing one embodiment of the double-sided tape for terminal protection of the present invention. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, major parts may be enlarged for convenience, and the dimensional ratios of each component are not limited to being the same as the actual drawing.

The double-sided tape 1 for terminal protection shown in FIG. 1 is a double-sided tape 1 for terminal protection used in the process of forming an electromagnetic wave shield film on a semiconductor device having a terminal, and consists of a first adhesive layer 14 and a buried layer 13. It has a viscoelastic layer 12, a base material 11, and a second adhesive layer 15 in this order. At least one layer of the viscoelastic layer 12, the substrate 11, and the second adhesive layer 15 is a heat conductive layer.

As shown in FIG. 1, the double-sided tape for terminal protection of this embodiment may be provided with a release film 20 on the outermost layer of the viscoelastic layer 12 on the side of the first adhesive layer 14. Additionally, a release film 22 may be provided on the outermost layer on the side of the second adhesive layer 15.

The double-sided tape for terminal protection of this embodiment is not limited to that shown in FIG. 1, and some structures may be changed, deleted, or added to that shown in FIG. 1, within the range that does not impair the effect of the present invention. .

The double-sided tape 1 for terminal protection shown in FIG. 1 is fixed to the support 30 by peeling off the release film 22, as shown in FIG. 2, and further peeling the release film 20 to form a viscoelastic layer. In (12), a semiconductor device having a terminal is pressed with the terminal side facing down, the terminal is buried in the viscoelastic layer 12, and a conductive material is applied thereon by sputtering, ion plating, spray coating, etc., thereby preventing electromagnetic waves. It can be used in the process of forming a shield film. The double-sided tape for terminal protection of the present embodiment has at least one layer among the viscoelastic layer, the base material, and the second adhesive layer being a heat conductive layer, thereby protecting against electromagnetic waves using methods such as sputtering, ion plating, and spray coating for applying the conductive material. Even in the shield film formation process, an increase in the surface temperature of the double-sided tape for terminal protection and surface roughness can be suppressed.

In this specification, “heat conductive layer” means a layer with a heat conductivity of 0.5 (W/(m·K)) or more. Thermal conductivity can be calculated using the following formula (1).

Thermal conductivity (W/(m·K)) = thermal diffusivity × density × specific heat equation (1)

In the above equation (1), the thermal diffusivity is measured by temperature wave analysis (TWA method) using a thermal diffusivity/thermal conductivity measuring device (e.g., ai-Phase Mobile lu, manufactured by ai-Phase Co., Ltd.) It can be measured by . In the above formula (1), the specific heat can be calculated according to the DSC method and the density can be calculated according to the Archimedes method.

The thermal conductivity of the heat conductive layer is preferably 1.0 (W/(m·K)) or more, and more preferably 5.0 (W/(m·K)) or more. If the thermal conductivity of the heat conductive layer is more than the above lower limit, the heat dissipation effect of the double-sided tape for terminal protection increases in the electromagnetic wave shield film formation process using methods such as sputtering, ion plating, and spray coating for applying the conductive material, and as a result, the double-sided tape for terminal protection increases. The increase in surface temperature of the tape and surface roughening can be suppressed.

The thermal conductivity of the heat conductive layer is not particularly limited as long as it has the effect of the present invention, but may be, for example, 30.0 (W/(m·K)) or less, and 25.0 (W/(m·K)) or less.

The upper and lower limits can be arbitrarily combined.

As an example of a combination, 1.0 to 30.0 (W/(m·K)) is preferable, and 5.0 to 25.0 (W/(m·K)) is more preferable.

In the double-sided tape for terminal protection of this embodiment having a viscoelastic layer, a base material, and a second adhesive layer, it is preferable that at least one layer of the viscoelastic layer, the base material, and the second adhesive layer is a heat conductive layer, and at least two layers are It is more preferable that it is a heat conductive layer. The double-sided tape for terminal protection of this embodiment has at least one layer of the viscoelastic layer, the base material, and the second adhesive layer being a heat conductive layer, and is capable of protecting against electromagnetic waves by applying a conductive material, such as sputtering, ion plating, or spray coating. In the shield film formation process, the heat dissipation effect of the double-sided tape for terminal protection is increased, and as a result, an increase in the surface temperature of the double-sided tape for terminal protection and surface roughening can be suppressed. Any of the viscoelastic layer, the base material, and the second adhesive layer may be a heat-conducting layer, but it is particularly preferable that the base material is a heat-conducting layer.

The total thickness of the heat conductive layer relative to the total thickness of the double-sided tape for terminal protection is preferably 0.01 or more, more preferably 0.05 or more, and even more preferably 0.1 or more.

The total thickness of the heat conductive layer relative to the total thickness of the double-sided tape for terminal protection is not particularly limited as long as it has the effect of the present invention, but may be, for example, 1.0 or less, 0.8 or less, or 0.6 or less.

The upper and lower limits can be arbitrarily combined.

As an example of a combination, it is preferably 0.01 to 1.0, preferably 0.05 to 0.8, and more preferably 0.1 to 0.6.

In this specification, “total thickness of the double-sided tape for terminal protection” means the entire thickness of the double-sided tape for terminal protection, and means the total thickness of all layers constituting the double-sided tape for terminal protection. In addition, in this specification, “total thickness of heat conductive layers” means the total thickness of heat conductive layers included in the double-sided tape for terminal protection. If the total thickness of the heat-conducting layer relative to the total thickness of the double-sided tape for terminal protection is more than the above lower limit, the heat dissipation of the double-sided tape for terminal protection will occur in the electromagnetic wave shield film formation process using methods such as sputtering, ion plating, and spray coating for applying conductive materials. The effect is increased, and as a result, an increase in the surface temperature of the double-sided tape for terminal protection and surface roughening can be suppressed.

In this specification, the thickness of each layer can be measured, for example, by a static pressure thickness meter (product number: “PG-02J”) manufactured by TECLOCK Co., Ltd. in accordance with JIS K6783, JIS Z1702, and JIS Z1709.

Next, each layer constituting the double-sided tape for terminal protection of this embodiment is explained.

◎Mention

The base material is in the form of a sheet or a film, and its constituent materials include, for example, various resins and metal materials. In this specification, “sheet shape or film shape” means that it is in the form of a thin film, has a small in-plane thickness variation, and has flexibility.

Examples of the resin include polyethylene such as low-density polyethylene (also referred to as LDPE), linear low-density polyethylene (also referred to as LLDPE), and high-density polyethylene (also referred to as HDPE); Polyolefins other than polyethylene, such as polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resin; Ethylene-based copolymers (i.e., as monomers) such as ethylene-vinyl acetate copolymer (also called EVA), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, and ethylene-norbornene copolymer copolymer obtained using ethylene); Vinyl chloride-based resins such as polyvinyl chloride and vinyl chloride copolymer (that is, resins obtained using vinyl chloride as a monomer); polystyrene; polycycloolefin; Polyethylene terephthalate (also called PET), polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2, 6-naphthalenedicarboxylate, fully aromatic polyester in which all structural units have aromatic ring groups, etc. of polyester; copolymers of two or more of the above polyesters; poly(meth)acrylic acid ester; Polyurethane; polyurethane acrylate; polyimide; polyamide; polycarbonate; fluororesin; polyacetal; Modified polyphenylene oxide; polyphenylene sulfide; polysulfone; Polyether ketone, etc. can be mentioned.

Additionally, examples of the resin include polymer alloys such as mixtures of the polyester and other resins. In the polymer alloy of polyester and other resins, it is preferable that the amount of resins other than polyester is relatively small.

In addition, the resin includes, for example, a crosslinked resin obtained by crosslinking one or two or more of the resins exemplified so far; Modified resins such as ionomers using one or two or more of the above resins exemplified so far can also be used.

In addition, in this specification, “(meth)acrylic acid” is a concept that includes both “acrylic acid” and “methacrylic acid.” The same applies to terms similar to (meth)acrylic acid. For example, “(meth)acrylate” is a concept that includes both “acrylate” and “methacrylate,” and “(meth)acrylate” is a concept that includes both “acrylate” and “methacrylate.” The term “diary” is a concept that includes both “acryloyl group” and “methacryloyl group”.

As the metal material, a metal material with a thermal conductivity of 1.0 (W/(m·K)) or more is preferable, and a metal material with a heat conductivity of 5.0 (W/(m·K)) or more is more preferable. Thermal conductivity can be calculated using the equation (1) described above.

Examples of such metal materials include copper, gold, silver, and aluminum, and among them, copper is preferable. When the base material contains the above-mentioned metal material, its shape is preferably in the form of a metal foil, and it is preferable to laminate the metal foil as a metal layer on the resin through an adhesive layer. The adhesive for bonding the resin and the metal layer may be one known in the art, and may be appropriately selected from the adhesives described in the first adhesive layer described later according to the types of the resin and the metal layer. The adhesive composition for forming the adhesive layer may be the same as the adhesive composition described in the first adhesive layer. In addition, the pressure-sensitive adhesive composition can be produced by a method similar to the method for producing the pressure-sensitive adhesive composition described in the first pressure-sensitive adhesive layer described later.

The resin and metal materials constituting the base material may be of one type, two or more types, and in the case of two or more types, their combination and ratio may be selected arbitrarily.

As described above, the base material may have only one layer (single layer) or may be comprised of two or more layers. In the case of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited. .

In addition, in this specification, it is not limited to the case of the substrate, and "the plurality of layers may be the same or different from each other" means "all the layers may be the same, all the layers may be different, or only some layers may be the same." This means that “the plurality of layers are different from each other” means that “at least one of the constituent materials and thickness of each layer is different from each other.”

The thickness of the base material is preferably 5 to 1000 μm, more preferably 10 to 500 μm, more preferably 15 to 300 μm, and particularly preferably 20 to 150 μm.

Here, “thickness of the substrate” means the thickness of the entire substrate, and for example, the thickness of a substrate consisting of multiple layers means the total thickness of all layers constituting the substrate. For example, in the case of a substrate obtained by laminating the above-mentioned resin and a metal layer with an adhesive layer interposed, the thickness of the substrate means the total thickness of the resin, the metal layer, and the adhesive layer.

When the base material is made of multiple layers and has one or more metal layers, the total thickness of the metal layers relative to the thickness of the base material is preferably 0.05 or more, more preferably 0.10 or more, and still more preferably 0.15 or more.

The total thickness of the metal layer relative to the thickness of the base material is not particularly limited as long as it has the effect of the present invention, but may be, for example, 1.0 or less, 0.8 or less, or 0.6 or less.

The upper and lower limits can be arbitrarily combined.

As an example of a combination, it is preferably 0.05 to 1.0, more preferably 0.10 to 0.8, and even more preferably 0.15 to 0.6.

In this specification, “total thickness of the metal layer” means the total thickness of the metal layers included in the base material. If the total thickness of the metal layer relative to the thickness of the base material is more than the lower limit of the above range, the thermal conductivity of the base material increases, and an increase in the surface temperature of the double-sided tape for terminal protection using the base material can be suppressed and surface roughening.

When using resin as a base material, it is desirable to have high thickness precision, that is, to suppress variation in thickness regardless of the area. Among the above-mentioned constituent materials, materials that can be used to construct such a substrate with high thickness precision include, for example, polyethylene, polyolefins other than polyethylene, polyethylene terephthalate, and ethylene-vinyl acetate copolymer (EVA). You can.

In addition to the main constituent materials such as the above resins, the base material may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers).

Among the above additives, it is preferable that the base material contains a filler, and among these, it is preferable that the base material contains a heat conductive filler.

In this specification, “thermal conductive filler” means a filler with a thermal conductivity of 1.0 (W/(m·K)) or more. Thermal conductivity can be calculated using the equation (1) described above.

The thermal conductivity of the thermally conductive filler is preferably 1.0 (W/(m·K)) or more, and more preferably 4.0 (W/(m·K)) or more. If the thermal conductivity of the thermally conductive filler contained in the substrate is equal to or higher than the above lower limit, the thermal conductivity of the substrate increases, and an increase in the surface temperature of the double-sided tape for terminal protection using the substrate can be suppressed and surface roughening.

The thermal conductivity of the thermally conductive filler is not particularly limited as long as it has the effect of the present invention, but may be, for example, 30.0 (W/(m·K)) or less, and 25.0 (W/(m·K)) or less. .

The upper and lower limits can be arbitrarily combined.

As an example of a combination, 1.0 to 30.0 (W/(m·K)) is preferable, and 4.0 to 25.0 (W/(m·K)) is more preferable.

The thermally conductive filler is not particularly limited as long as it is above the lower limit of the thermal conductivity. It may be an organic filler or an inorganic filler, but it is preferable that it is an inorganic filler. Examples of inorganic fillers include inorganic oxides, inorganic carbides, and inorganic nitrides. Since inorganic fillers have high thermal conductivity, inorganic carbides and inorganic nitrides are preferable, and inorganic nitrides are more preferable.

Examples of the inorganic carbide include silicon carbide, and examples of the inorganic nitride include silicon nitride, aluminum nitride, and boron nitride. Among these, boron nitride is preferable because of its high thermal conductivity.

Additionally, one type of thermally conductive filler may be used alone, two or more types may be used in combination, and when two or more types are used together, their combination and ratio may be selected arbitrarily.

The shape of the heat conductive filler is not particularly limited as long as it has the effect of the present invention, and examples include spherical shape, plate shape, and fiber shape. Additionally, it is preferable that the thermally conductive filler is uniformly dispersed in the resin.

The average particle diameter of the heat conductive filler is not particularly limited as long as it has the effect of the present invention. For example, it is 0.01 to 20 μm, and 0.05 to 10 μm is more preferable. If the average particle diameter of the thermally conductive filler is more than the lower limit of the above range, thermal conductivity can be efficiently secured. If the average particle diameter of the heat conductive filler is below the upper limit of the above range, the smoothness of the substrate surface is ensured.

In this specification, “average particle diameter of heat conductive filler” refers to HORIBA, Ltd. It can be measured using the “Laser Diffraction Particle Size Distribution Measurement Device”.

The content of the heat conductive filler relative to the total mass of the base material is preferably 35 to 95% by mass, and more preferably 40 to 90% by mass. If the content of the thermally conductive filler relative to the total mass of the substrate is more than the lower limit of the above range, the thermal conductivity of the substrate increases, and an increase in the surface temperature of the double-sided tape for terminal protection using the substrate can be suppressed and surface roughening. If the content of the thermally conductive filler relative to the total mass of the substrate is less than or equal to the upper limit of the above range, the performance of the substrate can be secured.

The base material may be transparent or opaque, may be colored depending on the purpose, or may have other layers deposited on it.

When the viscoelastic layer is energy-ray curable, it is preferable that the substrate transmits energy rays.

The base material can be manufactured by a known method. For example, a base material containing a resin can be manufactured by molding a resin composition containing the resin.

When the base material is a resin containing a thermally conductive filler, the base material can be manufactured according to the powder kneading method and the varnish method.

·Powder kneading method

A base material made of a resin containing a thermally conductive filler can be obtained by adding a thermally conductive filler to a resin, dispersing the resin and the thermally conductive filler in a mixer, and pressing it into a predetermined mold while heating. Additionally, when dispersing in the above mixer, a solvent may be used as appropriate.

·Barneys method

After surface treating the thermally conductive filler, it is mixed with varnish to uniformly disperse, and then poured onto a sheet in that state to obtain a base material made of a resin containing the thermally conductive filler. Examples of the surface treatment include known surface treatments such as anti-water treatment, anti-humidity treatment, anti-chemical treatment, coupling treatment with large resin, and surface smoothing treatment. Additionally, when mixing with the varnish, a solvent may be used as appropriate.

◎Viscoelastic layer

In the double-sided tape for terminal protection of this embodiment, the viscoelastic layer is used to protect the terminal formation surface (in other words, circuit surface) of a semiconductor device having terminals, and the terminals provided on this terminal formation surface.

The viscoelastic layer preferably has an embedded layer and a first adhesive layer.

The thickness of the viscoelastic layer is preferably 1 to 1000 μm, more preferably 5 to 800 μm, and still more preferably 10 to 600 μm.

If the thickness of the viscoelastic layer is more than the above lower limit, even terminal electrodes that are prone to lifting, such as solder balls, can be buried. In addition, when the thickness of the viscoelastic layer is below the above upper limit, the double-sided tape for terminal protection is suppressed from becoming excessively thick.

Here, the “thickness of the viscoelastic layer” means the thickness of the entire viscoelastic layer, and the thickness of the viscoelastic layer consisting of multiple layers of the buried layer and the first adhesive layer means the total thickness of the buried layer and the first adhesive layer.

When bringing the terminal formation surface of a semiconductor device having a terminal into close contact with the viscoelastic layer 12, it is preferable to directly bring the terminal formation surface of the semiconductor device having a terminal into close contact with the first adhesive layer 14 in the viscoelastic layer 12. . At this time, in order to prevent adhesive residue on the terminal formation surface and the terminal, the first adhesive layer 14 is preferably set to be harder than the buried layer 13.

○ Landfill layer

In the double-sided tape for terminal protection of this embodiment, the buried layer is a layer that buries and protects the terminals of a semiconductor device having terminals among the viscoelastic layers.

The buried layer is in the form of a sheet or a film, and its constituent material is not particularly limited as long as it satisfies the above-mentioned conditions.

For example, when the purpose is to suppress deformation of the viscoelastic layer by reflecting the shape of the terminal existing on the semiconductor surface in the viscoelastic layer covering the terminal formation surface of a semiconductor device having a terminal to be protected, Preferred constituent materials of the embedding layer include acrylic resin, etc., since the adhesion property of the embedding layer is further improved.

In addition to the main constituent materials such as the acrylic resin described above, the buried layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers).

Among the above additives, it is preferable that the buried layer contains a filler, and among these, it is preferable that it contains the above-mentioned heat conductive filler. When the buried layer contains the above-mentioned thermal conductive filler, the thermal conductivity of the buried layer increases, and an increase in the surface temperature of the double-sided tape for terminal protection using the buried layer can be suppressed and surface roughening.

The content of the thermally conductive filler relative to the total mass of the buried layer is preferably 20 to 80 mass%, and more preferably 30 to 70 mass%. If the content of the thermally conductive filler relative to the total mass of the buried layer is more than the lower limit of the above range, the thermal conductivity of the buried layer increases, and an increase in the surface temperature of the double-sided tape for terminal protection using the buried layer can be suppressed. If the content of the thermally conductive filler relative to the total mass of the buried layer is less than or equal to the upper limit of the above range, the performance as a buried layer can be secured.

The buried layer may be only one layer (single layer), or may be two or more layers. In the case of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited.

The thickness of the buried layer can be appropriately adjusted depending on the terminal height of the terminal formation surface of the semiconductor device having the terminal to be protected within the range of the viscoelastic layer thickness being 1 to 1000 ㎛, but the influence of relatively high terminals is Since it can be easily absorbed, it is preferably 10 to 500 μm, more preferably 20 to 450 μm, and especially preferably 30 to 400 μm. When the thickness of the buried layer is more than the above lower limit, a viscoelastic layer with higher terminal protection performance can be formed. Additionally, when the thickness of the buried layer is below the above upper limit, productivity and suitability for winding into a roll shape are improved.

Here, the “thickness of the buried layer” means the thickness of the entire buried layer. For example, the thickness of a buried layer consisting of multiple layers means the total thickness of all layers constituting the buried layer.

The buried layer preferably has soft properties corresponding to those for burying terminals, and is preferably softer than the first adhesive layer.

(Composition for forming buried layer)

The buried layer can be formed using a composition for forming a buried layer containing its constituent materials.

For example, a buried layer can be formed in the target area by coating the buried layer forming composition on the surface on which the buried layer is to be formed, drying it as necessary, and curing it by irradiation of energy rays. In addition, by coating a release film with a composition for forming an embedded layer, drying it as needed, and curing it by irradiation of energy rays, an embedded layer of the desired thickness can be formed, and the embedded layer can also be transferred to the desired site. . A more specific method of forming the buried layer, along with the method of forming other layers, will be described in detail later. The content ratio of components that do not vaporize at room temperature in the composition for forming an embedded layer is usually the same as the content ratio of the components of the embedded layer. Here, “room temperature” means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples include a temperature of 15 to 30°C.

Coating of the composition for forming a buried layer may be performed by a known method, for example, an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater. , a method using various coaters such as a Meyer bar coater and a kiss coater.

Drying conditions for the composition for forming a buried layer are not particularly limited, but when the composition for forming a buried layer contains a solvent described later, it is preferable to heat dry the composition, in this case, for example, at 70 to 130°C for 10 seconds. It is preferable to dry under conditions of ~ 5 minutes.

When the composition for forming a buried layer has energy ray curability, it is preferably cured by irradiation of energy rays. In addition, in one aspect of the present invention, when the composition for forming a buried layer has energy ray curing properties, it is preferable not to cure it by irradiation of energy rays.

Examples of the composition for forming an embedded layer include composition (I) for forming an embedded layer containing an acrylic resin.

{Composition for forming buried layer (I)}

The composition (I) for forming a buried layer contains an acrylic resin.

The composition (I) for forming an embedded layer includes, among the first adhesive composition (I-1) described later, a composition containing an adhesive resin (I-1a), which is an acrylic resin, and an energy ray-curable compound, and the first adhesive composition (I-1). 2) Among them, a composition containing an energy-ray curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of adhesive resin (I-1a), which is an acrylic resin, can be used as the composition (I) for forming a buried layer.

The adhesive resin (I-1a) and the energy ray curable compound used in the composition (I) for forming the buried layer are described below in the description of the adhesive resin (I-1a) and the energy ray curable compound used in the first adhesive composition (I-1). Same as

The adhesive resin (I-2a) used in the composition (I) for forming a buried layer is the same as the description of the adhesive resin (I-2a) used in the first adhesive composition (I-2) described later.

The composition (I) for forming a buried layer preferably further contains a crosslinking agent. The crosslinking agent used in the composition (I) for forming an embedded layer is the same as the description of the crosslinking agent used in the first adhesive composition (I-1) and the first adhesive composition (I-2) described later.

The composition (I) for forming an embedded layer may further contain a photopolymerization initiator and other additives. The photopolymerization initiator and other additives used in the composition (I) for forming a buried layer are the same as the descriptions of the photopolymerization initiator and other additives used in the first adhesive composition (I-1) and the first adhesive composition (I-2) described later. . In addition, when manufacturing a buried layer containing the above-described thermally conductive filler, the composition (I) for forming a buried layer contains a thermally conductive filler as an additive.

The composition (I) for forming a buried layer may contain a solvent. The solvent used in the composition (I) for forming a buried layer is the same as the description of the solvent used in the first adhesive composition (I-1) and the first adhesive composition (I-2) described later.

In the composition (I) for forming a buried layer, by adjusting either or both the molecular weight of the adhesive resin (I-1a) and the molecular weight of the energy ray curable compound, the buried layer has soft properties corresponding to burying terminals. can be designed.

Additionally, by adjusting the content of the cross-linking agent in the composition (I) for forming a buried layer, the buried layer can be designed to have soft properties corresponding to those for burying terminals.

<<Method for producing composition for forming buried layer>>

The composition (I) for forming a buried layer is obtained by mixing each component for forming it.

When mixing each component, the order of addition is not particularly limited, and two or more types of components may be added simultaneously.

When using a solvent, the solvent may be mixed with several components other than the solvent and the components may be diluted in advance, or the solvent may be mixed with these components without diluting the components other than the solvent in advance. You can also use it as a

The method of mixing each component at the time of mixing is not particularly limited, and includes mixing by rotating a stirrer or a stirring blade, etc.; Method of mixing using a mixer; It may be appropriately selected from known methods, such as a method of mixing by applying ultrasonic waves.

The temperature and time at the time of addition and mixing of each component are not particularly limited as long as each compounding component does not deteriorate, and may be adjusted appropriately, but the temperature is preferably 15 to 30°C.

｛Composition of landfill layer｝

In the present embodiment, the composition of the buried layer is obtained by excluding the solvent from the composition (I) for forming the buried layer described above.

In the buried layer (1) when the composition (I) for forming a buried layer is a composition containing an adhesive resin (I-1a), which is an acrylic resin, and an energy ray curable compound among the first adhesive composition (I-1), which will be described later. The content ratio of the adhesive resin (I-1a), which is an acrylic resin, relative to the total mass of the buried layer 1, is preferably 50 to 99% by mass, more preferably 55 to 95% by mass, and 60 to 90% by mass. % is more preferable. In another aspect of the present invention, the content ratio of the adhesive resin (I-1a), which is an acrylic resin, with respect to the total mass of the buried layer 1 may be 45 to 90% by mass, or 50 to 85% by mass. Additionally, the content ratio of the energy ray curable compound relative to the total mass of the buried layer 1 is preferably 0.5 to 50 mass%, and more preferably 5 to 45 mass%. When the buried layer 1 contains a cross-linking agent, the content ratio of the cross-linking agent relative to the total mass of the buried layer 1 is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and 0.3 to 8 mass%. % is more preferable.

In the buried layer (2) when the composition (I) for forming a buried layer is a composition containing an energy-ray curable adhesive resin (I-2a) into which an unsaturated group is introduced into the side chain of the adhesive resin (I-1a), which is an acrylic resin. , the content ratio of the energy ray-curable adhesive resin (I-2a) with an unsaturated group introduced into the side chain relative to the total mass of the buried layer is preferably 10 to 70% by mass, more preferably 15 to 65% by mass, and 20% by mass. It is more preferred that it is ~60% by mass. When the buried layer 2 contains a cross-linking agent, the content ratio of the cross-linking agent relative to the total mass of the buried layer 2 is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and 0.3 to 8 mass%. % is more preferable. The buried layer 2 of the present embodiment may further contain adhesive resin (I-1a), which is the acrylic resin described above. In this case, the content ratio of the adhesive resin (I-1a), which is an acrylic resin, relative to the total mass of the buried layer 2, is preferably 20 to 70% by mass, more preferably 25 to 65% by mass, and 30 to 70% by mass. It is more preferable that it is 60% by mass. In addition, when the buried layer 2 of the present embodiment further contains the adhesive resin (I-1a), which is the acrylic resin, the adhesive resin (I-1a) relative to 100 parts by mass of the adhesive resin (I-2a) The content is preferably 70 to 100 parts by mass, more preferably 75 to 100 parts by mass, and still more preferably 80 to 100 parts by mass.

Adhesive resin (I-1a), which is an acrylic resin contained in the buried layer (1), an energy ray-curable compound, and an energy ray-curable adhesive resin in which an unsaturated group is introduced into the side chain of the adhesive resin (I-1a) contained in the buried layer (2). The composition of (I-2a), etc. includes the adhesive resin (I-1a), which is an acrylic resin used in the first adhesive composition (I-1) described later, the energy ray curable compound, and the side chain of the adhesive resin (I-1a) is unsaturated. It may be the same as the description of the energy ray-curable adhesive resin (I-2a) into which the group is introduced.

In this embodiment, it is preferable that the embedding layer 2 contains adhesive resin (I-2a), adhesive resin (I-1a), and a crosslinking agent. In this case, the adhesive resin (I-1a) is preferably an acrylic polymer having structural units derived from (meth)acrylic acid alkyl ester and units derived from a carboxyl group-containing monomer. In addition, the adhesive resin (I-2a) reacts an unsaturated group-containing compound having an isocyanate group and an energy-ray polymerizable unsaturated group with an acrylic polymer having structural units derived from (meth)acrylic acid alkyl ester and units derived from a hydroxyl group-containing monomer. It is preferable that it is an acrylic polymer obtained by As the crosslinking agent, a compound exemplified in the first adhesive composition (I-1) described later can be used, and it is particularly preferable to use tolylene-2,6-diisocyanate.

The content ratio of structural units derived from (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-1a) is preferably 75 to 99% by mass, more preferably 80 to 98% by mass, and 85 to 99% by mass. It is more preferable that it is 97% by mass. The content ratio of the structural unit of the carboxyl group-containing monomer relative to the total mass of the adhesive resin (I-1a) is preferably 1.0 to 30% by mass, more preferably 2.0 to 25% by mass, and 3.0 to 20% by mass. It is more preferable, and it is especially preferable that it is 5.0-15 mass %. The (meth)acrylic acid alkyl ester in the adhesive resin (I-1a) preferably has an alkyl group having 4 to 12 carbon atoms, and more preferably 4 to 8 carbon atoms. Additionally, the adhesive resin (I-1a) is preferably an acrylic acid alkyl ester. Among these, the (meth)acrylic acid alkyl ester is particularly preferably n-butyl acrylate. In addition, the carboxy-containing monomer in the adhesive resin (I-1a) includes ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid, anhydride of ethylenically unsaturated dicarboxylic acid, and among them, Ethylenically unsaturated monocarboxylic acids are preferred, (meth)acrylic acid is more preferred, and acrylic acid is particularly preferred.

The weight average molecular weight of the adhesive resin (I-1a) of this embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and still more preferably 200,000 to 600,000.

In this specification, “weight average molecular weight” is a polystyrene conversion value measured by gel-permission-chromatography (GPC) method, unless otherwise specified.

The content ratio of the structural unit derived from (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-2a) is preferably 1.0 to 95 mass%, more preferably 2.0 to 90 mass%, and 3.0 to 95 mass%. It is more preferable that it is 85% by mass. The content ratio of units derived from hydroxyl group-containing monomers relative to the total mass of the adhesive resin (I-2a) is preferably 1.0 to 50 mass%, more preferably 2.0 to 45 mass%, and 3.0 to 40 mass%. It is more desirable. The (meth)acrylic acid alkyl ester in the adhesive resin (I-2a) preferably has an alkyl group having 1 to 12 carbon atoms, and more preferably 1 to 4 carbon atoms. The adhesive resin (I-2a) preferably has structural units derived from two or more types of alkyl (meth)acrylate, and more preferably has structural units derived from methyl (meth)acrylate and n-butyl (meth)acrylate. And, it is more preferable to have structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (I-2a), those exemplified in the first adhesive composition (I-1) described later can be used, and it is particularly preferable to use 2-hydroxyethyl acrylate. As the unsaturated group-containing compound having an isocyanate group and an energy-ray polymerizable unsaturated group, compounds exemplified in the first adhesive composition (I-2) described later can be used, and 2-methacryloyloxyethyl isocyanate is used. Particularly desirable. When the total hydroxyl group derived from the hydroxyl group-containing monomer is 100 mol, the amount of the unsaturated group-containing compound having the isocyanate group and the energy-beam polymerizable unsaturated group is preferably 50 to 150 mol, and is more preferably 55 to 140 mol. Preferred, 60 to 135 mol is more preferable.

The weight average molecular weight of the adhesive resin (I-2a) of this embodiment is preferably 10,000 to 500,000, more preferably 20,000 to 400,000, and still more preferably 30,000 to 300,000.

○ Adhesive layer

Hereinafter, the adhesive layer constituting the viscoelastic layer may be referred to as a “first adhesive layer” to distinguish it from the second adhesive layer for bonding to the support, which will be described later.

The first adhesive layer is in the form of a sheet or film and contains an adhesive.

Examples of the adhesive include acrylic resin (adhesive made of a resin having a (meth)acryloyl group), urethane-based resin (adhesive made of a resin having a urethane bond), and rubber-based resin (adhesive made of a resin having a rubber structure). ), silicone resins (adhesives made of resins having siloxane bonds), epoxy resins (adhesives made of resins having epoxy groups), polyvinyl ether, and polycarbonate, and acrylic resins are preferred.

In addition, in the present invention, the term "adhesive resin" is a concept that includes both adhesive resin and adhesive resin. For example, not only the resin itself has adhesiveness, but also other components such as additives It also includes resins that exhibit adhesiveness by the combined use of and resins that exhibit adhesiveness by the presence of triggers such as heat or water.

In addition to the main constituent materials such as the above resin, the first adhesive layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers).

Among the above additives, it is preferable that the first adhesive layer contains a filler, and among these, it is preferable that it contains the above-mentioned heat conductive filler. When the first adhesive layer contains the above-described thermally conductive filler, the thermal conductivity of the first adhesive layer increases, and an increase in the surface temperature of the double-sided tape for terminal protection using the first adhesive layer can be suppressed and surface roughness can be suppressed.

The content of the heat conductive filler relative to the total mass of the first adhesive layer is preferably 20 to 80 mass%, and more preferably 30 to 70 mass%. When the content of the thermally conductive filler relative to the total mass of the first adhesive layer is more than the lower limit of the above range, the thermal conductivity of the first adhesive layer increases, the surface temperature of the double-sided tape for terminal protection using the first adhesive layer increases, and This can suppress roughness. If the content of the thermally conductive filler relative to the total mass of the first adhesive layer is less than or equal to the upper limit of the above range, the performance as the first adhesive layer can be secured.

The first adhesive layer may be only one layer (single layer), or may be a plurality of two or more layers. In the case of multiple layers, these plural layers may be the same or different from each other, and the combination of these plural layers is not particularly limited.

The thickness of the first adhesive layer is preferably 1 to 1000 μm, more preferably 2 to 100 μm, and particularly preferably 5 to 20 μm.

Here, the “first adhesive layer thickness” means the thickness of the entire first adhesive layer. For example, the first adhesive layer thickness consisting of multiple layers is the total thickness of all layers constituting the first adhesive layer. means.

The first adhesive layer may be formed using an energy ray curable adhesive or may be formed using a non-energy ray curable adhesive. The physical properties of the first adhesive layer formed using an energy-ray curable adhesive can be easily adjusted before and after curing.

In the present invention, “energy ray” means an electromagnetic wave or charged particle beam that has energy quantum, and examples thereof include ultraviolet rays and electron beams.

Ultraviolet rays can be irradiated, for example, by using a high-pressure mercury lamp, fusion H lamp, or xenon lamp as an ultraviolet ray source. Electron beams generated by an electron beam accelerator or the like can be irradiated.

In the present invention, “energy ray curability” means the property of hardening by irradiating an energy ray, and “non-energy ray curability” means the property of not hardening even when irradiating an energy ray.

{First adhesive composition}

The first adhesive layer can be formed using a first adhesive composition containing an adhesive. For example, the first adhesive layer can be formed on the target area by coating the first adhesive composition on the surface on which the first adhesive layer is to be formed and drying it as necessary. In addition, by applying the first adhesive composition to the release film and drying it as necessary, a first adhesive layer of the desired thickness can be formed, and the first adhesive layer can also be transferred to the target site. A more specific method of forming the first adhesive layer, along with the method of forming other layers, will be described in detail below. The content ratio of components that do not vaporize at room temperature in the first adhesive composition is usually the same as the content ratio of the components in the first adhesive layer. In addition, in this embodiment, “room temperature” means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples include a temperature of 15 to 25°C.

Coating of the first adhesive composition may be performed by a known method, for example, an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater. , a method using various coaters such as a Meyer bar coater and a kiss coater.

Drying conditions for the first adhesive composition are not particularly limited, but when the first adhesive composition contains a solvent described later, it is preferable to heat dry the first adhesive composition, in this case, for example, at 70 to 130°C for 10 seconds. It is preferable to dry under conditions of ~ 5 minutes.

When the first adhesive layer is energy ray curable, the first adhesive composition containing an energy ray curable adhesive, that is, the energy ray curable first adhesive composition, may include, for example, a non-energy ray curable adhesive resin (I- 1a) (hereinafter sometimes abbreviated as “adhesive resin (I-1a)”) and a first adhesive composition (I-1) containing an energy ray curable compound; Energy ray curable adhesive resin (I-2a) (hereinafter sometimes abbreviated as “adhesive resin (I-2a)”) in which an unsaturated group is introduced into the side chain of non-energy ray curable adhesive resin (I-1a). The first adhesive composition (I-2) containing; and the first adhesive composition (I-3) containing the adhesive resin (I-2a) and the energy ray-curable low molecular weight compound.

{First adhesive composition (I-1)}

As described above, the first adhesive composition (I-1) contains a non-energy ray curable adhesive resin (I-1a) and an energy ray curable compound.

(Adhesive resin (I-1a))

The adhesive resin (I-1a) is preferably an acrylic resin.

Examples of the acrylic resin include an acrylic polymer having at least structural units derived from (meth)acrylic acid alkyl ester.

The number of structural units of the acrylic resin may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

Examples of the (meth)acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is preferably linear or branched.

More specifically, (meth)acrylic acid alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, and (meth)acrylate. Isobutyl acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylate Isooctyl acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate ((meth)acrylate (also called lauryl acrylate), tridecyl (meth)acrylate, tetradecyl (meth)acrylate (also called myristyl (meth)acrylate), pentadecyl (meth)acrylate, hexadecyl (meth)acrylate ((meth)acrylate) (also called palmityl acrylate), heptadecyl (meth)acrylate, octadecyl (meth)acrylate (also called stearyl (meth)acrylate), nonadecyl (meth)acrylate, icosyl (meth)acrylate, etc. there is.

In order to improve the adhesive strength of the first adhesive layer, the acrylic polymer preferably has a structural unit derived from an alkyl (meth)acrylic acid ester in which the alkyl group has 4 or more carbon atoms. In order to further improve the adhesive strength of the first adhesive layer, the number of carbon atoms of the alkyl group is preferably 4 to 12, and more preferably 4 to 8. Additionally, the (meth)acrylic acid alkyl ester in which the alkyl group has 4 or more carbon atoms is preferably an acrylic acid alkyl ester.

The acrylic polymer preferably has structural units derived from functional group-containing monomers in addition to structural units derived from (meth)acrylic acid alkyl ester.

As the functional group-containing monomer, for example, the functional group reacts with a cross-linking agent described later to become the starting point of cross-linking, or the functional group reacts with an unsaturated group in an unsaturated group-containing compound to introduce an unsaturated group into the side chain of the acrylic polymer. things can be mentioned.

Examples of the functional group in the functional group-containing monomer include hydroxyl group, carboxyl group, amino group, and epoxy group.

That is, examples of functional group-containing monomers include hydroxyl group-containing monomers, carboxyl group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

Examples of the hydroxyl group-containing monomer include hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, ( Hydroxyalkyl (meth)acrylic acid such as 2-hydroxybutyl (meth)acrylic acid, 3-hydroxybutyl (meth)acrylic acid, and 4-hydroxybutyl (meth)acrylic acid; Non-(meth)acrylic unsaturated alcohols such as vinyl alcohol and allyl alcohol (that is, unsaturated alcohols that do not have a (meth)acryloyl skeleton) are included.

Examples of the carboxyl group-containing monomer include ethylenically unsaturated monocarboxylic acids (monocarboxylic acids having an ethylenically unsaturated bond) such as (meth)acrylic acid and crotonic acid; ethylenically unsaturated dicarboxylic acids (dicarboxylic acids having an ethylenically unsaturated bond) such as fumaric acid, itaconic acid, maleic acid, and citraconic acid; Anhydrides of the above ethylenically unsaturated dicarboxylic acids; and (meth)acrylic acid carboxyalkyl esters such as 2-carboxyethyl methacrylate.

The functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxyl group-containing monomer, and a hydroxyl group-containing monomer is more preferable.

The number of functional group-containing monomers constituting the acrylic polymer may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the acrylic polymer, the content of structural units derived from functional group-containing monomers is preferably 1 to 35% by mass, more preferably 3 to 32% by mass, and 5 to 30% by mass, based on the total amount of structural units. This is particularly desirable.

The acrylic polymer may further have structural units derived from other monomers in addition to structural units derived from (meth)acrylic acid alkyl ester and structural units derived from functional group-containing monomers.

The other monomers mentioned above are not particularly limited as long as they can be copolymerized with (meth)acrylic acid alkyl ester or the like.

Examples of the other monomers include styrene, α-methyl styrene, vinyl toluene, vinyl formate, vinyl acetate, acrylonitrile, and acrylamide.

The number of the other monomers constituting the acrylic polymer may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

The acrylic polymer can be used as the above-described non-energy ray-curable adhesive resin (I-1a).

On the other hand, a compound containing an unsaturated group having an energy ray polymerizable unsaturated group (energy ray polymerizable group) reacted with a functional group in the acrylic polymer can be used as the above-mentioned energy ray curable adhesive resin (I-2a).

In addition, in the present invention, “energy ray polymerizability” means the property of polymerizing by irradiating energy rays.

The number of adhesive resins (I-1a) contained in the first adhesive composition (I-1) may be one, two or more types may be used, and in the case of two or more types, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-1), the content of the adhesive resin (I-1a) is preferably 5 to 99% by mass, and 10 to 95% by mass, based on the total mass of the first adhesive composition (I-1). It is more preferable that it is mass %, and it is especially preferable that it is 15-90 mass %.

(Energy ray curable compound)

Examples of the energy ray curable compound contained in the first adhesive composition (I-1) include monomers or oligomers that have an energy ray polymerizable unsaturated group and can be cured by irradiation of an energy ray.

Among energy-ray curable compounds, monomers include, for example, trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, and dipentaerythritol hexa(meth)acrylate. polyhydric (meth)acrylates such as polyethylene glycol, 1,4-butyrene glycol di(meth)acrylate, and 1,6-hexanediol (meth)acrylate; Urethane (meth)acrylate; polyester (meth)acrylate; polyether (meth)acrylate; Epoxy (meth)acrylate, etc. can be mentioned.

Among energy-ray curable compounds, examples of oligomers include oligomers obtained by polymerizing the monomers exemplified above.

The energy ray-curable compound has a relatively large molecular weight and is preferably urethane (meth)acrylate or urethane (meth)acrylate oligomer because it is difficult to reduce the storage modulus of the first adhesive layer.

In this specification, “oligomer” means a substance with a weight average molecular weight or mass of 5,000 or less.

The number of the energy ray curable compounds contained in the first adhesive composition (I-1) may be one, two or more types may be used, and in the case of two or more types, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-1), the content of the energy radiation curable compound is preferably 1 to 95% by mass, and 5 to 90% by mass, based on the total mass of the first adhesive composition (I-1). It is more preferable, and it is especially preferable that it is 10-85 mass %.

(Cross-linking agent)

When using the above-described acrylic polymer as the adhesive resin (I-1a), which has structural units derived from functional group-containing monomers in addition to structural units derived from (meth)acrylic acid alkyl esters, the first adhesive composition (I-1) contains a crosslinking agent. It is desirable to contain more.

The crosslinking agent, for example, reacts with the functional group to crosslink the adhesive resins (I-1a).

Examples of the crosslinking agent include isocyanate-based crosslinking agents such as tolylene-2,6-diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates (crosslinking agents having an isocyanate group); Epoxy-based crosslinking agents (crosslinking agents having a glycidyl group) such as ethylene glycol glycidyl ether and N,N'-(cyclohexane-1,3-diylbismethylene)bis(glycidylamine); Aziridine-based crosslinking agents such as hexa[1-(2-methyl)-aziridinyl]triphosphatriazine (crosslinking agents having an aziridinyl group); Metal chelate-based crosslinking agents such as aluminum chelate (crosslinking agents having a metal chelate structure); Isocyanurate-based crosslinking agents (crosslinking agents having an isocyanuric acid skeleton), etc. can be mentioned.

It is preferable that the crosslinking agent is an isocyanate-based crosslinking agent because it improves the cohesion of the adhesive and thus improves the adhesive force of the first adhesive layer, and because it is readily available.

The number of crosslinking agents contained in the first adhesive composition (I-1) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-1), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, based on 100 parts by mass of the adhesive resin (I-1a), It is especially preferable that it is 1 to 10 parts by mass.

(Light polymerization initiator)

The first adhesive composition (I-1) may further contain a photopolymerization initiator. The curing reaction of the first adhesive composition (I-1) containing a photopolymerization initiator sufficiently proceeds even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

The photopolymerization initiator includes, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, etc. benzoin compounds; Acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and 2,2-dimethoxy-1,2-diphenyl ethan-1-one; Acyl phosphine oxide compounds such as bis(2, 4, 6-trimethyl benzoyl) phenyl phosphine oxide and 2, 4, 6-trimethyl benzoyl diphenyl phosphine oxide; Sulfide compounds such as benzyl phenyl sulfide and tetramethyl thiuram monosulfide; α-ketol compounds such as 1-hydroxycyclohexylphenyl ketone; , azo compounds such as azobisisobutyronitrile; Titanocene compounds such as titanocene; Thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; Benzyl, dibenzyl, benzophenone, 2, 4-diethylthioxanthone, 1,2-diphenyl methane, 2-hydroxy-2-methyl-1-[4-(1-methyl vinyl)phenyl]propanone , 2-chloroanthraquinone, etc.

In addition, examples of the photopolymerization initiator include quinone compounds such as 1-chloroanthraquinone; Photosensitizers such as amines can also be used.

The number of photopolymerization initiators contained in the first adhesive composition (I-1) may be one, two or more, and in the case of two or more, their combination and ratio may be arbitrarily selected.

In the first adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, based on 100 parts by mass of the energy ray curable compound. It is especially preferable that it is ~ 5 parts.

(Other additives)

The first adhesive composition (I-1) may contain other additives that do not correspond to any of the above-mentioned components within a range that does not impair the effect of the present invention.

Other additives mentioned above include, for example, antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments, dyes), sensitizers, tackifiers, reaction retarders, crosslinking accelerators ( and known additives such as catalysts). In addition, when manufacturing the first adhesive layer containing the above-mentioned thermally conductive filler, the first adhesive composition (I-1) contains the thermally conductive filler as an additive.

In addition, the reaction retardant refers to, for example, an unintended crosslinking reaction progressing in the stored first adhesive composition (I-1) due to the action of a catalyst mixed in the first adhesive composition (I-1). It is to suppress what is done. Examples of reaction retarders include those that form a chelate complex by chelating the catalyst, and more specifically, those that have two or more carbonyl groups (-C(=O)-) in one molecule. You can.

The number of other additives contained in the first adhesive composition (I-1) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-1), the content of other additives is not particularly limited and may be appropriately selected depending on the type.

(menstruum)

The first adhesive composition (I-1) may contain a solvent. The first adhesive composition (I-1) contains a solvent and improves coating compatibility on the surface to be coated.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; Ester (carboxylic acid ester) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; Aliphatic hydrocarbons such as cyclohexane and n-hexane; Aromatic hydrocarbons such as toluene and xylene; Alcohols such as 1-propanol and 2-propanol can be mentioned.

As the above-mentioned solvent, for example, one used in the production of adhesive resin (I-1a) may be used as is in the first adhesive composition (I-1) without being removed from adhesive resin (I-1a), and the solvent may be used as is in the first adhesive composition (I-1). The same or different type of solvent used in the production of the resin (I-1a) may be added separately during the production of the first adhesive composition (I-1).

The solvent contained in the first adhesive composition (I-1) may be one type, two or more types, and in the case of two or more types, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-1), the solvent content is not particularly limited and may be adjusted appropriately.

{First adhesive composition (I-2)}

As described above, the first adhesive composition (I-2) contains an energy-ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of the non-energy-ray-curable adhesive resin (I-1a).

(Adhesive resin (I-2a))

The adhesive resin (I-2a) is obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.

The unsaturated group-containing compound is a compound that, in addition to the energy ray polymerizable unsaturated group, further has a group that can bind to the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a).

Examples of the energy-ray polymerizable unsaturated group include (meth)acryloyl group, vinyl group (also called ethenyl group), allyl group (also called 2-propenyl group), etc., (meth) Acryloyl group is preferred.

Groups that can be bonded to functional groups in the adhesive resin (I-1a) include, for example, isocyanate groups and glycidyl groups that can bond to hydroxyl groups or amino groups, and hydroxyl and amino groups that can bond to carboxyl groups or epoxy groups. I can hear it.

Examples of the unsaturated group-containing compound include (meth)acryloyloxyethyl isocyanate, (meth)acryloyl isocyanate, glycidyl (meth)acrylate, and (meth)acryloyl Oxyethyl isocyanate is preferred, and among these, 2-methacryloyloxyethyl isocyanate is particularly preferred.

The isocyanate compound can combine with the hydroxyl group in the adhesive resin (I-1a), and when the total hydroxyl group in the adhesive resin (I-1a) is 100 mol, the amount of the isocyanate compound used is 10 to 150 mol. It is preferable, 20 to 140 mol is more preferable, and 30 to 130 mol is more preferable.

The number of adhesive resins (I-2a) contained in the first adhesive composition (I-2) may be one, two or more types, and when two or more types are used, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-2), the content of the adhesive resin (I-2a) is preferably 5 to 99% by mass, and 10 to 95%, based on the total mass of the first adhesive composition (I-2). It is more preferable that it is mass %, and it is especially preferable that it is 10-90 mass %.

(Cross-linking agent)

For example, when using the adhesive resin (I-2a) as the acrylic polymer having structural units derived from functional group-containing monomers similar to those in the adhesive resin (I-1a), the first adhesive composition (I-2) It may further contain a cross-linking agent.

Examples of the crosslinking agent in the first adhesive composition (I-2) include the same crosslinking agent as the crosslinking agent in the first adhesive composition (I-1).

The number of crosslinking agents contained in the first adhesive composition (I-2) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-2), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, based on 100 parts by mass of the adhesive resin (I-2a), It is especially preferable that it is 1 to 10 parts by mass.

(Light polymerization initiator)

The first adhesive composition (I-2) may further contain a photopolymerization initiator. The curing reaction of the first adhesive composition (I-2) containing a photopolymerization initiator sufficiently proceeds even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the first adhesive composition (I-2) include the same photopolymerization initiator as the photopolymerization initiator in the first adhesive composition (I-1).

The number of photopolymerization initiators contained in the first adhesive composition (I-2) may be one, two or more, and in the case of two or more, their combination and ratio may be arbitrarily selected.

In the first adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, based on 100 parts by mass of the adhesive resin (I-2a). , 0.05 to 5 parts by mass is particularly preferable.

(Other additives)

The first adhesive composition (I-2) may contain other additives that do not correspond to any of the above-mentioned components within a range that does not impair the effect of the present invention.

Examples of the other additives mentioned above in the first adhesive composition (I-2) include the same additives as the other additives in the first adhesive composition (I-1).

The number of other additives contained in the first adhesive composition (I-2) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-2), the content of other additives is not particularly limited and may be appropriately selected depending on the type.

(menstruum)

The first adhesive composition (I-2) may contain a solvent for the same purpose as the first adhesive composition (I-1).

Examples of the solvent in the first adhesive composition (I-2) include the same solvent as the solvent in the first adhesive composition (I-1).

The number of solvents contained in the first adhesive composition (I-2) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-2), the solvent content is not particularly limited and may be adjusted appropriately.

{First adhesive composition (I-3)}

As described above, the first adhesive composition (I-3) contains the adhesive resin (I-2a) and an energy ray-curable low molecular weight compound.

In the first adhesive composition (I-3), the content of the adhesive resin (I-2a) is preferably 5 to 99% by mass, and 10 to 95%, based on the total mass of the first adhesive composition (I-3). It is more preferable that it is mass %, and it is especially preferable that it is 15-90 mass %.

(Energy ray curable low molecular weight compound)

The energy ray curable low molecular weight compound contained in the first adhesive composition (I-3) includes monomers and oligomers that have an energy ray polymerizable unsaturated group and can be cured by irradiation of an energy ray, and the first adhesive composition (I-3) The same thing as the energy ray curable compound contained in (I-1) can be mentioned.

The energy ray-curable low molecular weight compound contained in the first adhesive composition (I-3) may be one type, two or more types may be used, and in the case of two or more types, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-3), the content of the energy ray-curable low molecular compound is preferably 0.01 to 300 parts by mass, and 0.03 to 200 parts by mass, based on 100 parts by mass of the adhesive resin (I-2a). It is more preferable, and it is especially preferable that it is 0.05 to 100 parts by mass.

(Light polymerization initiator)

The first adhesive composition (I-3) may further contain a photopolymerization initiator. The curing reaction of the first adhesive composition (I-3) containing a photopolymerization initiator sufficiently proceeds even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the first adhesive composition (I-3) include the same photopolymerization initiator as the photopolymerization initiator in the first adhesive composition (I-1).

The number of photopolymerization initiators contained in the first adhesive composition (I-3) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-3), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, based on 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable low molecular weight compound, and is preferably 0.03 It is more preferable that it is - 10 parts by mass, and it is especially preferable that it is 0.05 - 5 parts by mass.

(Other additives)

The first adhesive composition (I-3) may contain other additives that do not correspond to any of the above-mentioned components within a range that does not impair the effect of the present invention.

Examples of the other additives mentioned above include the same additives as the other additives in the first adhesive composition (I-1).

The number of other additives contained in the first adhesive composition (I-3) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-3), the content of other additives is not particularly limited and may be appropriately selected depending on the type.

(menstruum)

The first adhesive composition (I-3) may contain a solvent for the same purpose as the first adhesive composition (I-1).

Examples of the solvent in the first adhesive composition (I-3) include the same solvent as the solvent in the first adhesive composition (I-1).

The number of solvents contained in the first adhesive composition (I-3) may be one, two or more, and in the case of two or more, their combination and ratio can be arbitrarily selected.

In the first adhesive composition (I-3), the solvent content is not particularly limited and may be adjusted appropriately.

{First adhesive composition other than first adhesive composition (I-1) to (I-3)}

Up to this point, the first pressure-sensitive adhesive composition (I-1), the first pressure-sensitive adhesive composition (I-2), and the first pressure-sensitive adhesive composition (I-3) have been mainly explained, but what has been explained as the components contained therein is these three types. Even if it is a general first adhesive composition other than the first adhesive composition (in this embodiment, it is referred to as “the first adhesive composition other than the first adhesive composition (I-1) to (I-3)”), it can be used similarly.

Examples of the first adhesive composition other than the first adhesive compositions (I-1) to (I-3) include, in addition to the energy ray curable first adhesive composition, non-energy ray curable first adhesive compositions.

Examples of the non-energy ray-curable first adhesive composition include acrylic resin (resin having a (meth)acryloyl group), urethane-based resin (resin having a urethane bond), rubber-based resin (resin having a rubber structure), Examples include those containing adhesive resins such as silicone resins (resins having siloxane bonds), epoxy resins (resins having epoxy groups), polyvinyl ether, or polycarbonate, and those containing acrylic resins are preferred.

The first adhesive composition other than the first adhesive composition (I-1) to (I-3) preferably contains one or two or more types of crosslinking agent, and its content is equal to the above-mentioned first adhesive composition (I-3). It can be done in the same way as in case 1).

<Method for producing first adhesive composition>

The first adhesive composition, such as first adhesive composition (I-1) to (I-3), includes the adhesive and, if necessary, each component for constituting the first adhesive composition, such as components other than the adhesive. Obtained by mixing.

When mixing each component, the order of addition is not particularly limited, and two or more types of components may be added simultaneously.

When using a solvent, the solvent may be mixed with several components other than the solvent and the components may be diluted in advance, or the solvent may be mixed with these components without diluting the components other than the solvent in advance. You can also use it as a

The method of mixing each component at the time of mixing is not particularly limited, and includes mixing by rotating a stirrer or a stirring blade, etc.; Method of mixing using a mixer; It may be appropriately selected from known methods, such as a method of mixing by applying ultrasonic waves.

The temperature and time at the time of addition and mixing of each component are not particularly limited as long as each compounding component does not deteriorate, and may be adjusted appropriately, but the temperature is preferably 15 to 30°C.

{Composition of first adhesive layer}

In this embodiment, the composition of the first adhesive layer is obtained by excluding the solvent from the above-described first adhesive layer composition.

In the first adhesive layer (I-1) when the first adhesive layer composition is the first adhesive composition (I-1), the adhesive resin (I-1) relative to the total mass of the first adhesive layer (I-1) The content ratio of 1a) is preferably 50 to 99% by mass, more preferably 55 to 95% by mass, and still more preferably 60 to 90% by mass. In addition, in another aspect of the present invention, the content ratio of the adhesive resin (I-1a) relative to the total mass of the first adhesive layer (I-1) may be 25 to 80% by mass, or 30 to 75% by mass. It is good, and it may be 35 to 70% by mass. In addition, the content ratio of the energy radiation curable compound relative to the total mass of the first adhesive layer (I-1) is preferably 1 to 50 mass%, more preferably 2 to 48 mass%, and 5 to 45 mass%. % is more preferable. When the first adhesive layer (I-1) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first adhesive layer (I-1) is preferably 0.1 to 10% by mass, and 0.2 to 9% by mass. It is more preferable that it is 0.3 to 8 mass%.

In the first adhesive layer (I-2) when the first adhesive layer composition is the first adhesive composition (I-2), the adhesive resin (I-2) relative to the total mass of the first adhesive layer (I-2) The content ratio of 2a) is preferably 70 to 100 mass%, more preferably 75 to 100 mass%, more preferably 80 to 100 mass%, and particularly preferably 80 to 99.6 mass%. When the first adhesive layer (I-2) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first adhesive layer (I-2) is preferably 0.1 to 10% by mass, and 0.2 to 9% by mass. It is more preferable that it is %, and it is more preferable that it is 0.3-8 mass %.

In the first adhesive layer (I-3) when the first adhesive layer composition is the first adhesive composition (I-3), the adhesive resin (I-3) relative to the total mass of the first adhesive layer (I-3) The content ratio of 2a) is preferably 50 to 99% by mass, more preferably 55 to 95% by mass, and still more preferably 60 to 90% by mass. In addition, the content ratio of the energy radiation curable low molecular weight compound relative to the total mass of the first adhesive layer (I-3) is preferably 1 to 50 mass%, more preferably 2 to 48 mass%, and 5 to 45 mass%. It is more preferable that it is mass%. When the first adhesive layer (I-3) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first adhesive layer (I-3) is preferably 0.1 to 10% by mass, and 0.2 to 9% by mass. It is more preferable that it is 0.3 to 8 mass%.

In this embodiment, it is preferable that it is a 1st adhesive layer (I-2) containing adhesive resin (I-2a) and a crosslinking agent. In this case, the adhesive resin (I-2a) is an acrylic polymer having structural units derived from (meth)acrylic acid alkyl ester and units derived from hydroxyl group-containing monomers, and an unsaturated group-containing compound having an isocyanate group and an energy-ray polymerizable unsaturated group. It is preferable that it is an acrylic polymer obtained by reacting. As the crosslinking agent, the compounds exemplified in the first adhesive composition (I-1) can be used, and it is particularly preferable to use tolylene-2,6-diisocyanate.

The content ratio of structural units derived from (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-2a) is preferably 50 to 99% by mass, more preferably 60 to 98% by mass, and 70 to 99% by mass. It is more preferable that it is 97% by mass. The content ratio of units derived from hydroxyl group-containing monomers relative to the total mass of the adhesive resin (I-2a) is preferably 0.5 to 15 mass%, more preferably 1.0 to 10 mass%, and 2.0 to 10 mass%. It is more desirable. The (meth)acrylic acid alkyl ester in the adhesive resin (I-2a) preferably has an alkyl group having 1 to 12 carbon atoms, and more preferably 1 to 4 carbon atoms. The adhesive resin (I-2a) preferably has structural units derived from two or more types of alkyl (meth)acrylate, and more preferably has structural units derived from methyl (meth)acrylate and n-butyl (meth)acrylate. And, it is more preferable to have structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (I-2a), those exemplified in the adhesive resin (I-1a) described above can be used, and it is particularly preferable to use 2-hydroxyethyl acrylate. As the unsaturated group-containing compound having an isocyanate group and an energy-ray polymerizable unsaturated group, the compounds exemplified in the first adhesive composition (I-2) can be used, and it is particularly preferable to use 2-methacryloyloxyethyl isocyanate. do. When the total hydroxyl groups derived from the hydroxyl group-containing monomer are 100 mol, the amount of the unsaturated group-containing compound having the isocyanate group and the energy-beam polymerizable unsaturated group is preferably 20 to 80 mol, and is more preferably 25 to 75 mol. It is preferred, and 30 to 70 mol is more preferred.

◎Release film

The release film may be one known in the field.

Preferred examples of the release film include those in which at least one surface of a resin film such as polyethylene terephthalate has been subjected to a release treatment by silicone treatment or the like; For example, at least one surface of the film is a peeling surface made of polyolefin.

The thickness of the release film is preferably the same as the thickness of the base material.

◎Second adhesive layer

The second adhesive layer (i.e., bonding adhesive layer) is an adhesive layer for bonding the double-sided tape for terminal protection of this embodiment to a support.

The second pressure-sensitive adhesive layer may be one known in the art, and can be appropriately selected according to the support from those described in the above-mentioned first pressure-sensitive adhesive layer.

The thickness of the second adhesive layer is preferably 5 to 50 μm, more preferably 10 to 45 μm, and particularly preferably 15 to 40 μm.

Here, the “second adhesive layer thickness” means the thickness of the entire second adhesive layer. For example, the second adhesive layer thickness consisting of multiple layers is the total thickness of all layers constituting the second adhesive layer. means.

The second adhesive composition for forming the second adhesive layer is the same as the first adhesive composition, and the manufacturing method of the second adhesive composition is also the same as the manufacturing method of the first adhesive composition.

The second adhesive layer preferably contains the adhesive resin (I-1a) described above.

In this case, the content ratio of the adhesive resin (I-1a) relative to the total mass of the second adhesive layer is preferably 70 to 100 mass%, more preferably 75 to 100 mass%, and 80 to 100 mass%. It is more preferable, and it is especially preferable that it is 80-99.98 mass %. Additionally, the second adhesive layer may further contain a crosslinking agent. The content ratio of the crosslinking agent relative to the total mass of the second adhesive layer is preferably 0.005 to 0.1 mass%, more preferably 0.01 to 0.09 mass%, and still more preferably 0.015 to 0.08 mass%. In addition, the adhesive resin (I-1a) is preferably an acrylic polymer having structural units derived from a (meth)acrylic acid alkyl ester and units derived from a carboxyl group-containing monomer. The crosslinking agent described above can be used, and it is particularly preferable to use an isocyanate-based crosslinking agent.

The content ratio of structural units derived from (meth)acrylic acid alkyl ester relative to the total mass of the adhesive resin (I-1a) is preferably 70 to 100 mass%, more preferably 75 to 100 mass%, and 80 to 100 mass%. It is more preferable that it is 100% by mass. The content ratio of the structural unit of the carboxyl group-containing monomer relative to the total mass of the adhesive resin (I-1a) is preferably 0 to 20% by mass, more preferably 0.5 to 19% by mass, and 0.7 to 18% by mass. It is more preferable, and it is especially preferable that it is 1.0-17 mass %. The (meth)acrylic acid alkyl ester in the adhesive resin (I-1a) preferably has an alkyl group having 4 to 12 carbon atoms, and more preferably 4 to 8 carbon atoms. Additionally, the adhesive resin (I-1a) is preferably an acrylic acid alkyl ester. Among these, the (meth)acrylic acid alkyl ester is particularly preferably n-butyl acrylate. In addition, the carboxy-containing monomer in the adhesive resin (I-1a) includes ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid, anhydride of ethylenically unsaturated dicarboxylic acid, and among them, Ethylenically unsaturated monocarboxylic acids are preferred, (meth)acrylic acid is more preferred, and acrylic acid is particularly preferred.

The weight average molecular weight of the adhesive resin (I-1a) of this embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and still more preferably 200,000 to 600,000.

◇Manufacturing method of double-sided tape for terminal protection

The double-sided tape for terminal protection can be manufactured by sequentially stacking the above-described layers in a corresponding positional relationship. The method of forming each layer is the same as previously described.

For example, the above-described composition for forming an embedded layer is applied onto the peeled surface of the release film and dried as necessary to laminate the embedded layer. The first adhesive layer is laminated by coating the above-described first adhesive composition on the peeling treated surface of another release film and drying it as necessary. By bonding the embedding layer on the release film to the first adhesive layer on another release film, a terminal protection tape is obtained in which the release film, the embedding layer, the first adhesive layer, and the release film are laminated in this order. The release film can be removed when using the terminal protection tape.

Next, the release film on the side of the embedding layer of the terminal protection tape in which the above-described release film, embedding layer, first adhesive layer, and release film are laminated in this order is peeled, and this is bonded to the base material, thereby forming the first embedding layer and the first release film on the base material. A terminal protection tape can be obtained in which the adhesive layer and release film are laminated in this order.

Additionally, for example, the buried layer is laminated on the substrate by extrusion molding the composition for forming the buried layer. The first adhesive layer is laminated by coating the above-described first adhesive composition on the peeling treated surface of the release film and drying it as necessary. Also, by bonding the first adhesive layer on the release film to the embedding layer on the base material, a terminal protection tape can be obtained in which the embedding layer, the first adhesive layer, and the release film are laminated in this order on the base material.

The above-described terminal protection tape is prepared in which the embedding layer, the first adhesive layer, and the release film are laminated in this order on the base material. A second adhesive layer is laminated by coating the above-described second adhesive composition on the peeling treated surface of another release film and drying it as necessary. Then, the second adhesive layer on the release film is bonded to the base material of the terminal protection tape, so that the release film, the second adhesive layer, the base material, the embedding layer, the first adhesive layer, and the release film are laminated in this order. You can get double-sided tape to protect the terminal. The release film can be removed when using double-sided tape for terminal protection.

The double-sided tape for terminal protection having layers other than the above-described layers may be used in one or both of the forming step and the lamination step of the other layers so that the lamination position of the other layers is at an appropriate position in the above-mentioned manufacturing method. It can be manufactured by adding appropriately.

◇Method of manufacturing a semiconductor device having an electromagnetic shielding film

The double-sided tape for terminal protection of this embodiment can be used, for example, in the method of manufacturing a semiconductor device having an electromagnetic wave shielding film described below.

3 shows a method of manufacturing a semiconductor device having an electromagnetic wave shield film of the present embodiment, comprising a first adhesive layer 14, a buried layer 13, a substrate 11, and a second adhesive layer 15 in this order. This is a cross-sectional view schematically showing one embodiment in the case where the double-sided tape 1 for terminal protection is fixed to the support 30 and a semiconductor device having an electromagnetic wave shield film is manufactured.

First, as shown in FIGS. 3(a) and 3(b), the semiconductor device 65 having a terminal is placed on the viscoelastic layer 12 of the double-sided tape for terminal protection on the terminal 91 side, that is, the circuit board 63. The terminal formation surface 63a of is pressed downward, and the terminal 91 is buried in the viscoelastic layer 12.

At this time, the viscoelastic layer 12 is brought into contact with the terminal 91 of the semiconductor device 65 having a terminal, and the semiconductor device 65 having a terminal is firmly pressed against the double-sided tape for terminal protection. For this reason, the outermost surface of the viscoelastic layer 12 on the first adhesive layer 14 side is sequentially pressed to the surface of the terminal 91 and the terminal formation surface 63a of the circuit board 63. At this time, by heating the viscoelastic layer 12, the viscoelastic layer 12 softens and spreads between the terminals 91 to cover the terminals 91, and comes into close contact with the terminal formation surface 63a. ), especially the surface of the area near the terminal formation surface 63a, is covered, and the terminal 91 is buried.

As a method of pressing the semiconductor device 65 having terminals on the double-sided tape for terminal protection, a known method of pressing and attaching various sheets to an object can be applied, for example, a method using a laminate roller or a vacuum laminator. etc. can be mentioned.

The pressure when pressing the semiconductor device 65 having a terminal to the double-sided tape for terminal protection is not particularly limited, but is preferably 0.1 to 1.5 MPa, and more preferably 0.3 to 1.3 MPa. The heating temperature is preferably 30 to 70°C, more preferably 35 to 65°C, and particularly preferably 40 to 60°C. Additionally, it is preferable to bond the first adhesive layer 14 of the viscoelastic layer 12 to the terminal formation surface 63a.

Conductive resin 101 is applied to the exposed surface of the semiconductor device 65 having terminals that are not embedded in the viscoelastic layer 12 of the double-sided tape for terminal protection (FIG. 3(c)) and then thermally cured, thereby making it conductive. An electromagnetic wave shield film 10 made of a material is formed (FIG. 3(d)). As a method of forming the electromagnetic wave shield film 10 by covering it with a conductive material, methods such as sputtering, ion plating, and spray coating can be used.

As a sputtering method, a sputtering method known in the field such as DC sputtering, RF sputtering, DC magnetron sputtering, and ion beam sputtering can be adopted.

The double-sided tape for terminal protection has a viscoelastic layer, a base material, and a second adhesive layer, and at least one layer among the viscoelastic layer, the base material, and the second adhesive layer is a heat conductive layer, so that a conductive resin is applied by sputtering, Even in the electromagnetic wave shield film formation process using methods such as ion plating and spray coating, the increase in surface temperature and surface roughness of the double-sided tape for terminal protection can be suppressed.

By picking up the semiconductor device 66 having an electromagnetic wave shield film from the double-sided tape 1 for terminal protection of this embodiment, the semiconductor device 66 having an electromagnetic wave shield film covered with the electromagnetic wave shield film 10 can be taken out (Figure 3(e)).

In the method of manufacturing a semiconductor device having an electromagnetic shielding film shown in FIG. 3, the semiconductor device 65 having a terminal subject to an electromagnetic wave shield may be a semiconductor device 65 having individually manufactured terminals, and may be formed using a dicing method. The semiconductor device 65 may have individual terminals.

In the method of manufacturing a semiconductor device having an electromagnetic shielding film shown in FIG. 3, a semiconductor device 65 having terminals in which individual electronic components 61 and 62 are separated into individual pieces and sealed with an encapsulating resin 64 is formed using a double-sided tape for protecting the terminals. A method of electromagnetic wave shielding has been shown using (1), but as follows, a semiconductor device having terminals is formed from a semiconductor device assembly 6 having terminals before being separated into individual pieces using a double-sided tape 1 for protecting the terminals. (65) can also be shielded from electromagnetic waves.

4 and 5 show a method of manufacturing a semiconductor device having an electromagnetic wave shield film of the present embodiment, in which the first adhesive layer 14, the buried layer 13, the substrate 11, and the second adhesive layer 15 are formed in this order. This is a cross-sectional view schematically showing another embodiment of a method of shielding a semiconductor device 65 having a terminal from electromagnetic waves using the double-sided tape 1 for protecting the terminal.

First, as shown in FIGS. 4(a) and 4(b), a semiconductor device assembly 6 having terminals connected to the viscoelastic layer 12 of the double-sided tape for terminal protection by a circuit board 63 is attached to the terminal 91. ) side, that is, the terminal formation surface 63a of the circuit board 63 is pressed down, and the terminal 91 is buried in the viscoelastic layer 12, as in the case of Figures 3(a) and (b) above. .

At this time, while applying pressure from above to the semiconductor device assembly 6 having the terminal, the terminal 91 is applied to the viscoelastic layer 12 of the double-sided tape for terminal protection, as in the case of Figures 3(a) and 3(b). bury it.

Additionally, by bonding the viscoelastic layer 12 while heating, the viscoelastic layer 12 can be softened and the viscoelastic layer 12 can be brought into close contact with the terminal formation surface 63a of the circuit board 63. The pressure when pressing the semiconductor device assembly 6 having terminals to the double-sided tape for terminal protection is not particularly limited, but is preferably 0.1 to 1.5 MPa, and more preferably 0.3 to 1.3 MPa. The heating temperature is preferably 30 to 70°C, more preferably 35 to 65°C, and particularly preferably 40 to 60°C. Additionally, it is preferable to bond the first adhesive layer 14 of the viscoelastic layer 12 to the terminal formation surface 63a.

Next, the semiconductor device assembly 6 having terminals is diced to obtain a semiconductor device 65 having terminals (FIG. 4(c)). The double-sided tape for terminal protection of this embodiment used in the process of forming an electromagnetic wave shield film also serves as a dicing tape for the semiconductor device assembly 6 having terminals. In the method of manufacturing a semiconductor device having an electromagnetic shielding film shown in FIG. 3, when the semiconductor device 65 having terminals subject to electromagnetic shielding is a semiconductor device 65 having terminals separated into pieces according to the dicing method, , it is necessary to pick up a semiconductor device with a terminal on a dicing tape and replace it by attaching it to a double-sided tape for terminal protection (Figure 3(a)). On the other hand, in the method of manufacturing a semiconductor device having an electromagnetic wave shield film shown in FIG. 4, the task of replacing the semiconductor device 65 having a terminal on a dicing tape with a double-sided tape for terminal protection can be omitted.

Next, the release tape 22 is removed, and the double-sided tape for terminal protection is fixed on the support 30 through the second adhesive layer 15. Then, conductive resin 101 is applied to the exposed surface of the semiconductor device 65 having terminals not embedded in the viscoelastic layer 12 of the double-sided tape for terminal protection (FIG. 4(d)). At this time, if the separation of the conductive resin 101 is insufficient at the boundary portion of the semiconductor device 65 having each terminal of the semiconductor device assembly 6 having terminals, double-sided tape for terminal protection is applied using an expansion device, etc. It's okay to repeat it. With the conductive resin 101 applied to each side of the semiconductor device 65 having individual terminals, the semiconductor device 65 having individual terminals can be divided into individual pieces. In addition, the conductive resin 101 applied to the top and side surfaces of the semiconductor device 65 having individual terminals is heated and hardened to form a semiconductor device having terminals that are not embedded in the viscoelastic layer 12 of the double-sided tape for terminal protection. An electromagnetic wave shield film 10 made of a conductive material is formed on the exposed surface of 65 (FIG. 4(e)). The electromagnetic wave shielding film 10 may be formed directly on the semiconductor device 65 having a terminal (FIG. 4(c)) by applying a conductive material through a method such as sputtering, ion plating, or spray coating (FIG. 4(e)). . The temperature of the conductive material when applied by a method such as sputtering, ion plating, or spray coating is room temperature to 250°C.

The double-sided tape for terminal protection has a viscoelastic layer (12), a base material (11), and a second adhesive layer (15), and the viscoelastic layer (12), the base material (11), and the second adhesive layer (15). ) Among them, even in the electromagnetic wave shielding film forming process using sputtering ion plating, spray coating, etc., where at least one layer is a heat conductive layer and applying a conductive resin, the surface temperature of the double-sided tape for terminal protection increases and the surface roughens. It can be suppressed.

By picking up the semiconductor device 66 having an electromagnetic wave shield film from the double-sided tape for terminal protection of this embodiment, the semiconductor device 65 having a terminal covered with the electromagnetic wave shield film 10 can be taken out (FIG. 4(f)) ).

5(a) to 5(c), the process of embedding the terminal 91 in the viscoelastic layer 12 of the double-sided tape for terminal protection described above, dicing the semiconductor device assembly 6 having the terminal. , the process of forming the semiconductor device 65 having a terminal may be performed on a double-sided tape for terminal protection fixed on the support 30 through the second adhesive layer 15.

In the double-sided tape for terminal protection of the present embodiment, the height h0 of the terminal 91 is preferably lower than the thickness d1 of the viscoelastic layer 12, and is preferably 1.2≤d1/h0≤5.0. Specifically, the height of the terminal 91 is preferably 20 to 300 μm, more preferably 30 to 270 μm, and particularly preferably 40 to 240 μm. When the height of the terminal 91 is equal to or greater than the above lower limit, the function of the terminal 91 can be further improved. Additionally, if the height of the terminal 91 is below the above upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper part of the terminal 91 is further enhanced.

In addition, in this specification, “the height of the terminal” means the height at the portion that exists at the highest position on the terminal formation surface among the terminals. When the semiconductor device assembly 6 with terminals and the semiconductor device 65 with terminals have a plurality of terminals 91, the height h0 of the terminals 91 can be the average of these. The height of the terminal can be measured, for example, by a non-contact three-dimensional optical interference type surface roughness meter (manufactured by Veeco, Japan, brand name: Wyko NT1100).

The width of the terminal 91 is not particularly limited, but is preferably 170 to 350 μm, more preferably 200 to 320 μm, and particularly preferably 230 to 290 μm. When the width of the terminal 91 is equal to or greater than the above lower limit, the function of the terminal 91 can be further improved. Additionally, if the width of the terminal 91 is below the above upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper part of the terminal 91 is further enhanced.

Additionally, in this specification, “width of the terminal” means the maximum value of a line segment obtained by connecting two different points on the terminal surface with a straight line when looking down at the terminal in a direction perpendicular to the terminal formation surface. When the terminal is spherical or hemispherical, the “width of the terminal” refers to the maximum diameter (terminal diameter) of the terminal when viewed from a plane looking down at the terminal.

The distance between adjacent terminals 91 (i.e., pitch between terminals) is not particularly limited, but is preferably 250 to 800 μm, more preferably 300 to 600 μm, and particularly preferably 350 to 500 μm. do. When the distance is equal to or greater than the lower limit, the embedding property of the terminal 91 can be further improved. Moreover, if the distance is below the upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper part of the terminal 91 is further increased.

Additionally, in this specification, “distance between adjacent terminals” means the minimum value of the distance between surfaces of adjacent terminals.

Example

Hereinafter, the present invention will be described in more detail through specific examples. However, the present invention is not limited in any way to the examples shown below.

＜Monomer＞

The official names of the abbreviated monomers are shown below.

HEA: 2-hydroxyethyl acrylic acid

BA: n-butyl acrylic acid

MMA: Methyl methacrylate

AAc: Acrylic acid

(Preparation of composition A for forming the second adhesive layer)

(시클로헥산-1, 3-디일비스메틸렌) 비스(글리시딜아민)(농도 5%, MITSUBISHI GAS CHEMICAL COMPANY, INC. 제, 제품명 「TETRAD－C」) 0.2 질량부를 첨가하고, 30분간 교반을 행해 제2점착제층 형성용 조성물 A를 조제하였다.A solution of an acrylic copolymer consisting of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive base, solid content concentration 33.6%, manufactured by NIPPON CARBIDE INDUSTRIES CO., INC., product name “Nissetsu PE-121”) For 100 parts by mass, N, N' as a crosslinking agent

(Cyclohexane-1,3-diylbismethylene) 0.2 parts by mass of bis(glycidylamine) (concentration 5%, manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., product name "TETRAD-C") was added and stirred for 30 minutes. This was performed to prepare composition A for forming a second adhesive layer.

(Preparation of second adhesive layer A)

The composition A for forming the second adhesive layer is applied to the peeling surface of a polyethylene terephthalate film (“SP-PET381031” manufactured by LINTEC Corporation, thickness 38 μm), where one side of the polyethylene terephthalate film has been peeled by silicone treatment. A second adhesive layer A with a thickness of 20 μm was prepared by heating and drying at 100° C. for 1 minute.

(Preparation of composition B for forming the first adhesive layer)

A solution of a resin (weight average molecular weight ( Mw) 500,000, adhesive main agent, solid content 35% by mass, manufactured by Nippon Synthetic Chem Industry Co., Ltd., product name “COPONYL UN-4730-D”) for 100 parts by mass, tolylene-2 as a crosslinking agent, 0.5 parts by mass of 6-diisocyanate (manufactured by TOYOCHEM CO., LTD., product name "BHS-8515", solid content concentration: 37.5%) was added and stirred for 30 minutes to prepare composition B for forming the first adhesive layer.

(Preparation of first adhesive layer B)

The composition B for forming the first adhesive layer is applied to the peeling surface of a polyethylene terephthalate film (“SP-PET381031” manufactured by LINTEC Corporation, thickness 38 μm), where one side has been peeled by silicone treatment. A first adhesive layer B with a thickness of 10 μm was prepared by heating and drying at 100° C. for 1 minute.

(Preparation of composition A for forming buried layer)

A solution of an acrylic copolymer consisting of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive base, solid concentration 33.6%, manufactured by NIPPON CARBIDE INDUSTRIES CO., INC., product name “Nissetsu PE-121”) A resin obtained by adding 2-methacryloyloxyethyl isocyanate to an acrylic copolymer consisting of 100 parts by mass, 62 parts by mass of BA, 10 parts by mass of MMA, and 28 parts by mass of HEA at an addition rate of 80 mol% based on 100 mol% of HEA. Solution (weight average molecular weight (Mw) 370,000, adhesive base material, solid content concentration 45%, manufactured by Nippon Synthetic Chem Industry Co., Ltd., product name “COPONYL UN-2528 LM1”) 75 parts by mass and tolylene-2, 6 as a crosslinking agent - 15 parts by mass of diisocyanate (manufactured by TOYOCHEM CO., LTD., product name "BHS-8515", solid content concentration: 37.5%) was added and stirred for 30 minutes to prepare composition A for buried layer formation.

(Reference A)

An adhesive was applied to a polyethylene terephthalate (PET) film (thickness 25 μm) so that the adhesive layer had a thickness of 22 μm, and copper foil with a thickness of 9 μm was bonded to obtain base material A. In addition, in the formation of the adhesive layer, an acrylic copolymer consisting of 46 parts by mass of BA, 37 parts by mass of 2-ethylhexyl acrylate, 9 parts by mass of vinyl acetate, 6 parts by mass of AAc, and 2 parts by mass of maleic anhydride (adhesive main agent, solid content concentration) 30%) For 100 parts by mass, 2.18 parts by mass of tolylene-2,6-diisocyanate (manufactured by TOYOCHEM CO., LTD., product name "BHS-8515", solid content concentration: 37.5%) was added as a crosslinking agent, and stirred for 30 minutes. An adhesive composition prepared by stirring was used.

(Reference B)

A film in which a boron nitride filler was dispersed in a polyimide resin was formed to have a thickness of 25 μm and was used as base material B. The content of boron nitride filler relative to the total mass of the base material was 50% by mass.

(Reference C)

A film in which copper was deposited on one surface of a highly heat-resistant special polyester (product name “Torcena”, thickness 50 μm, manufactured by Toray Industries, Inc.) was used as the base material C. The thickness of the deposited copper was 0.1㎛.

(Statement D)

PET film (50 μm thick) was used as substrate D.

(Preparation of semiconductor device having terminals)

In order to evaluate the embedding properties of the terminal protection double-sided tapes of Examples and Comparative Examples, semiconductor devices having the following terminals were prepared.

·Semiconductor device having terminals

Size of semiconductor device: 6mm×6mm

Terminal height: 50㎛

Terminal diameter: 250㎛

Pitch between terminals: 400㎛

Number of terminals: 13 x 13 = 169

＜Measurement of thermal conductivity＞

The thermal diffusivity and thermal conductivity measuring device (manufactured by ai-Phase Co., Ltd., product name “ai-Phase Mobile 1 u”) was used to measure the thermal diffusivity of the substrate, viscoelastic layer, and second adhesive layer.

Then, the thermal conductivity of the base material, viscoelastic layer, and second adhesive layer was calculated using the following calculation formula (2).

In addition, the specific heat of the substrate, viscoelastic layer, and second adhesive layer was calculated according to the DSC method, and the density was calculated according to the Archimedes method.

Thermal conductivity (W/(m·K)) = thermal diffusivity × density × specific heat equation (2)

＜Measurement of surface temperature of double-sided tape for terminal protection during sputtering＞

Semiconductor devices having terminals were placed on the terminal protection double-sided tapes of Examples and Comparative Examples according to the method described later. A label for temperature measurement (NiGK Corporation, thermolabel for vacuum) is affixed to a location on the viscoelastic layer surface (first adhesive layer surface) where the semiconductor device having the terminal of the double-sided tape for terminal protection is not placed, and the surface is Protected with heat resistant tape. Sputtering was performed on this terminal protection double-sided tape under the conditions described later. After that, the heat-resistant tape was removed, and the surface temperature of the double-sided tape for terminal protection during sputtering was confirmed.

＜Sputtering treatment＞

The release film 22 on the second adhesive layer 15 side of the terminal protection double-sided tape 1 of the form shown in Figure 1 is peeled off, and alkali-free glass (EagleXG, manufactured by Corning, 100 mm x 100 mm, 0.7 mm thick) is peeled off. ) The double-sided tape for terminal protection of Examples and Comparative Examples was affixed through a second adhesive layer, and was used as a sample for measurement. For this sample, a semiconductor device having terminals was placed as follows.

As shown in Fig. 3(a), the terminal side of the semiconductor device having the above terminal is placed downward, and the viscoelastic layer 12 is tightly pressed at a press pressure (load of 1.1 MPa), press time of 40 s, and heating temperature of 50°C. A semiconductor device having a pressed terminal was placed on a double-sided tape for terminal protection.

After that, a copper layer was formed into a film by sputtering under the following conditions.

・Target: Copper

· Method: DC magnetron sputtering

·Application method: DC 500W

· Base material heating: 150℃

·Carrier gas: Argon

·Film formation pressure: 3.4Pa

The surface of the double-sided tape for terminal protection after sputtering (first adhesive layer surface) was observed with the naked eye. Those with no surface roughness, such as cracks, wrinkles, or peeling, were rated as Pass (A), and those with surface roughness, such as cracks, wrinkles, or peeling, were rated as Failed (B).

[Example 1]

Composition A for forming a buried layer was applied to the peeled surface of a polyethylene terephthalate film (“SP-PET381031” manufactured by LINTEC Corporation, thickness 38 µm), one side of which was peeled by silicone treatment, at 100°C. After heating and drying for a minute, the peeled side of the polyethylene terephthalate film (“SP-PET382150” manufactured by LINTEC Corporation, thickness 38 μm), where one side of the polyethylene terephthalate film has been peeled by silicone treatment, is placed on the buried layer forming composition A. It was laminated, and a buried layer with a thickness of 50 μm was prepared. Next, the buried layer A with a thickness of 50 μm was bonded to the first adhesive layer B with a thickness of 10 μm. Subsequently, the release film on the side of the buried layer A was peeled off and bonded to the base material A. Finally, the second adhesive layer A was laminated on the side opposite to the buried layer A of the base material, thereby producing a terminal protection double-sided tape 1 of Example 1 of the form shown in FIG. 1.

Using the double-sided tape for terminal protection (1), sputtering treatment was performed, the surface temperature of the double-sided tape for terminal protection (1) during sputtering was measured, and the surface of the double-sided tape for terminal protection (1) after sputtering was observed with the naked eye. Table 1 shows the observation results of the thermal conductivity of the viscoelastic layer, the base material A, and the second adhesive layer, the surface temperature of the double-sided tape for terminal protection 1 during sputtering, and the surface of the double-sided tape 1 for terminal protection after sputtering. Additionally, a photograph of the surface (first adhesive layer surface) of the terminal protection double-sided tape 1 after sputtering is shown in FIG. 6 .

[Example 2]

A double-sided tape for terminal protection (2) was manufactured in the same manner as in Example 1, except that base B was used instead of base A.

Using the double-sided tape for terminal protection 2, sputtering treatment was performed, the surface temperature of the double-sided tape for terminal protection 2 during sputtering was measured, and the surface of the double-sided tape for terminal protection 2 after sputtering was observed with the naked eye. Table 1 shows the observation results of the thermal conductivity of the viscoelastic layer, base material B, and the second adhesive layer, the surface temperature of the double-sided tape for terminal protection 2 during sputtering, and the surface of the double-sided tape 2 for terminal protection after sputtering. Additionally, a photograph of the surface (first adhesive layer surface) of the terminal protection double-sided tape 2 after sputtering is shown in FIG.

[Comparative Example 1]

A double-sided tape for terminal protection (3) was manufactured in the same manner as in Example 1, except that base C was used instead of base A.

Using the double-sided tape for terminal protection 3, sputtering treatment was performed, the surface temperature of the double-sided tape for terminal protection 3 during sputtering was measured, and the surface of the double-sided tape for terminal protection 3 after sputtering was observed with the naked eye. Table 1 shows the observation results of the thermal conductivity of the viscoelastic layer, the base material C, and the second adhesive layer, the surface temperature of the double-sided tape for terminal protection 3 during sputtering, and the surface of the double-sided tape 3 for terminal protection after sputtering. Additionally, a photograph of the surface (first adhesive layer surface) of the terminal protection double-sided tape 3 after sputtering is shown in FIG. 8 .

[Comparative Example 2]

A double-sided tape for terminal protection (4) was manufactured in the same manner as in Example 1, except that base material D was used instead of base material A.

Sputtering treatment was performed using the double-sided tape for terminal protection 4, the surface temperature of the double-sided tape for terminal protection 4 during sputtering was measured, and the surface of the double-sided tape 4 for terminal protection after sputtering was observed with the naked eye. Table 1 shows the observation results of the thermal conductivity of the viscoelastic layer, the base material D, and the second adhesive layer, the surface temperature of the double-sided tape for terminal protection 4 during sputtering, and the surface of the double-sided tape 4 for terminal protection after sputtering. Additionally, a photograph of the surface (first adhesive layer surface) of the terminal protection double-sided tape 4 after sputtering is shown in FIG. 9 .

[Comparative Example 3]

A double-sided tape 5 for terminal protection was manufactured in the same manner as in Comparative Example 2, except that the thickness of the buried layer A was set to 160 μm.

Using the double-sided tape for terminal protection 5, sputtering treatment was performed, the surface temperature of the double-sided tape for terminal protection 5 during sputtering was measured, and the surface of the double-sided tape for terminal protection 5 after sputtering was observed with the naked eye. Table 1 shows the observation results of the thermal conductivity of the viscoelastic layer, the base material D, and the second adhesive layer, the surface temperature of the double-sided tape for terminal protection 5 during sputtering, and the surface of the double-sided tape 5 for terminal protection after sputtering. Additionally, a photograph of the surface (first adhesive layer surface) of the terminal protection double-sided tape 5 after sputtering is shown in FIG. 10 .

From the results shown in Table 1, when using the double-sided terminal protection tape according to the embodiment of the present invention to shield a semiconductor device having a terminal from electromagnetic waves, at least one layer among the viscoelastic layer, the base material, and the second adhesive layer is It was confirmed that, by being a heat conductive layer, an increase in the surface temperature of the double-sided tape for terminal protection and surface roughening can be suppressed even during the sputtering process of applying the conductive material.

The double-sided tape for terminal protection of the present invention can be used to protect the terminals of a semiconductor device having a terminal when shielding the semiconductor device having a terminal from electromagnetic waves. Using the double-sided tape for terminal protection of the present invention, a semiconductor device having a terminal can be shielded from electromagnetic waves, and a semiconductor device having an electromagnetic wave shielding film can be manufactured.

1···Double-sided tape for terminal protection,
10···Electromagnetic shielding film,
11···Description,
12···Viscoelastic layer,
13···Landfill layer,
14···First adhesive layer,
15···Second adhesive layer (bonding adhesive layer),
30···Support,
A semiconductor device assembly having 6... terminals,
60···Semiconductor device assembly,
61, 62···electronic components,
63···circuit board,
63a···Terminal formation surface,
64···bag resin layer,
65... A semiconductor device having terminals,
66···Semiconductor device having an electromagnetic shielding film,
91···Terminal,
101···Conductive resin,
20, 22... release film

Claims (8)

A double-sided tape for terminal protection used in the process of forming an electromagnetic wave shield film on a semiconductor device having a terminal,
It has a viscoelastic layer, a base material, and a second adhesive layer,
Among the viscoelastic layer, the substrate, and the second adhesive layer, at least one layer is a heat conduction layer,
A double-sided tape for terminal protection, wherein the viscoelastic layer has a buried layer and a first adhesive layer. According to paragraph 1,
A double-sided tape for terminal protection, wherein among the viscoelastic layer, the substrate, and the second adhesive layer, at least two layers are heat conductive layers. According to claim 1 or 2,
A double-sided tape for terminal protection, wherein the heat conductive layer has a thermal conductivity of 1.0 W/(m·K) or more. According to claim 1 or 2,
A double-sided tape for terminal protection, wherein the total thickness of the heat-conducting layer relative to the total thickness of the double-sided tape for terminal protection is 0.01 or more. delete According to claim 1 or 2,
A double-sided tape for terminal protection, comprising the first adhesive layer, the buried layer, the substrate, and the second adhesive layer in this order. A step of embedding a terminal of a semiconductor device having a terminal in a viscoelastic layer of the double-sided tape for terminal protection according to claim 1 or 2, and
A process of forming an electromagnetic shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection.
A method of manufacturing a semiconductor device having an electromagnetic wave shield film, comprising: A process of embedding a terminal of a semiconductor device assembly having a terminal in a viscoelastic layer of the double-sided tape for terminal protection according to claim 1 or 2,
A process of dicing the semiconductor device assembly having the terminals to form a semiconductor device having terminals with terminals embedded in a viscoelastic layer of the double-sided tape for protecting the terminals, and
A process of forming an electromagnetic wave shield film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection.
A method of manufacturing a semiconductor device having an electromagnetic shielding film, comprising: