TWI851636B - Double-sided tape for terminal protection and method for manufacturing semiconductor device with electromagnetic wave shielding film - Google Patents

Abstract

The present invention is a double-sided tape for terminal protection, which is used in the step of forming an electromagnetic wave shielding film on a semiconductor device with terminals, and has a viscoelastic layer (12), a substrate (11), and a second adhesive layer (15), and at least one of the viscoelastic layer (12), the substrate (11), and the second adhesive layer (15) is a thermal conductive layer.

Description

Double-sided tape for terminal protection and method for manufacturing semiconductor device with electromagnetic wave shielding film

The present invention relates to a double-sided tape for terminal protection and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the double-sided tape for terminal protection. This application claims priority based on Japanese Patent Application No. 2018-238855 filed in Japan on December 20, 2018, and the contents of the application are cited in this article.

Previously, when mounting a multi-pin LSI (Large Scale Integration) package used in MPU (Micro Processor Unit) and gate arrays on a printed wiring board, a semiconductor device having a plurality of electronic components is used in which a convex electrode (hereinafter referred to as "terminal" in this manual) made of eutectic solder, high temperature solder, gold, etc. is formed on the connection pad. Then, a mounting method is adopted in which these terminals are made to face and contact with corresponding terminal portions on a chip mounting substrate, thereby melting/diffusion bonding.

With the popularization of personal computers and the generalization of the Internet, smartphones and tablet terminals are now also connected to the Internet, and the use of wireless communication technology to transmit digitized images, music, photos, text information, etc. through the Internet is increasing. Furthermore, the popularization of IoT (Internet of Things) has brought a new revolution to the packaging technology of semiconductor devices such as sensors, RFID (Radio frequency identifier), MEMS (Micro Electro Mechanical Systems), and wireless components, which are used in various application fields such as home appliances and automobiles to use sensors more intelligently.

As electronic devices continue to evolve, the requirements for semiconductor devices are increasing year by year. In particular, if we want to meet the demands for high performance, miniaturization, high integration, low power consumption, and low cost, heat and noise countermeasures are crucial.

In response to such heat countermeasures and noise countermeasures, a method of forming an electromagnetic wave shielding film by coating an electronic component module with a conductive material is used, as disclosed in Patent Document 1. In Patent Document 1, the conductive resin applied to the top and side surfaces of the singulated electronic component module is heated and hardened to form an electromagnetic wave shielding film.

As a method of forming an electromagnetic wave shielding film by coating a semiconductor device with terminals with a conductive metal or conductive resin (hereinafter, these are also collectively referred to as "conductive materials"), widely known methods include sputtering, ion plating, and spray coating. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2011-151372.

[The problem that the invention wants to solve]

In the manufacturing method of electronic components disclosed in Patent Document 1, the external terminal electrodes arranged on the inner surface of the collective substrate are coated with conductive resin in a state of being buried in the adhesive sheet. Since a masking portion is provided at a predetermined position of the adhesive sheet, it is possible to prevent an electrical short circuit between the external terminal electrodes and the electromagnetic wave shielding film.

However, the process of providing a masking portion at a predetermined position of an adhesive sheet is complicated. Therefore, a terminal protection tape is required that can embed even an external terminal electrode that has unevenness and is prone to protrusions, such as a solder ball.

On the other hand, in the step of forming the electromagnetic wave shielding film by sputtering, ion plating, spray coating, etc. of applying conductive materials, the surface temperature of the adhesive sheet sometimes rises, and the surface of the adhesive sheet is roughened. If the surface of the adhesive sheet is roughened, a part of the embedded external terminal electrode is exposed, and an electrical short circuit occurs with the electromagnetic wave shielding film. In addition, there is also the following problem: due to the rough surface of the adhesive sheet, a part of the side surface of the aforementioned singulated electronic component module is embedded in the adhesive sheet, and the electromagnetic wave shielding film is not formed on the aforementioned part.

Therefore, the subject of the present invention is to provide a double-sided tape for terminal protection and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the double-sided tape for terminal protection. The double-sided tape for terminal protection is used in the step of forming an electromagnetic wave shielding film on a semiconductor device with terminals, and in the step of forming the electromagnetic wave shielding film by sputtering, ion plating, spray coating, etc. of applying a conductive material, the surface temperature rise and surface roughness of the double-sided tape for terminal protection can also be suppressed. [Means for solving the subject]

That is, the present invention provides the following double-sided tape for terminal protection and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the double-sided tape for terminal protection.

[1] A double-sided tape for terminal protection, used in the step of forming an electromagnetic wave shielding film on a semiconductor device with terminals, and comprising a viscoelastic layer, a substrate, and a second adhesive layer, wherein at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermally conductive layer. [2] The double-sided tape for terminal protection as described in [1], wherein at least two of the viscoelastic layer, the substrate, and the second adhesive layer are thermally conductive layers. [3] The double-sided tape for terminal protection as described in [1] or [2], wherein the thermal conductivity of the thermally conductive layer is 1.0 W/(m・K) or more. [4] A double-sided tape for terminal protection as described in any one of [1] to [3], wherein the total thickness of the thermal conductive layer is 0.01 or more relative to the total thickness of the double-sided tape for terminal protection. [5] A double-sided tape for terminal protection as described in any one of [1] to [4], wherein the viscoelastic layer has an embedded layer and a first adhesive layer. [6] A double-sided tape for terminal protection as described in [5], comprising, in order, the first adhesive layer, the embedded layer, the substrate, and the second adhesive layer.

[7] A method for manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising: a step of embedding the terminals of the semiconductor device with terminals in the viscoelastic layer of the double-sided tape for terminal protection as described in any one of [1] to [6]; and a step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection. [8] A method for manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising: a step of embedding the terminals of a semiconductor device assembly with terminals in the viscoelastic layer of a terminal protection double-sided tape as described in any one of [1] to [6]; a step of cutting the semiconductor device assembly with terminals to form a semiconductor device with terminals in which the terminals are embedded in the viscoelastic layer of the terminal protection double-sided tape; and a step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the terminal protection double-sided tape. [Effect of the invention]

According to the present invention, a double-sided tape for terminal protection and a method for manufacturing a semiconductor device with an electromagnetic wave shielding film using the double-sided tape for terminal protection are provided. The double-sided tape for terminal protection is used in the step of forming an electromagnetic wave shielding film on a semiconductor device with terminals, and in the step of forming the electromagnetic wave shielding film by sputtering, ion plating, spray coating, etc. of applying a conductive material, the surface temperature increase and surface roughness of the double-sided tape for terminal protection can also be suppressed.

Fig. 1 is a cross-sectional view schematically showing an embodiment of the double-sided tape for terminal protection of the present invention. In addition, in the following description, in order to facilitate the understanding of the features of the present invention, the main parts are sometimes enlarged for convenience, and the size ratios of the various components are not necessarily the same as the actual ones.

The terminal protection double-sided tape 1 shown in FIG1 is used in the step of forming an electromagnetic wave shielding film on a semiconductor device with terminals, and sequentially comprises a viscoelastic layer 12 composed of a first adhesive layer 14 and an embedding layer 13, a substrate 11, and a second adhesive layer 15. At least one of the viscoelastic layer 12, the substrate 11, and the second adhesive layer 15 is a thermal conductive layer.

As shown in FIG1 , the terminal protection double-sided tape of this embodiment may also have a peeling film 20 on the outermost layer on the first adhesive layer 14 side of the viscoelastic layer 12. In addition, a peeling film 22 may also be provided on the outermost layer on the second adhesive layer 15 side. The terminal protection double-sided tape of this embodiment is not limited to the terminal protection double-sided tape shown in FIG1 , and a part of the structure may be changed, deleted or added to the terminal protection double-sided tape shown in FIG1 without damaging the effect of the present invention.

The terminal protection double-sided tape 1 shown in FIG. 1 can be used in the following steps: peel off the release film 22, as shown in FIG. 2, fix it to the support body 30, and then peel off the release film 20, press the semiconductor device with terminals against the viscoelastic layer 12 with the terminal side at the bottom, thereby burying the terminals in the viscoelastic layer 12, and then apply a conductive material from the top of the viscoelastic layer 12 by sputtering, ion plating, spray coating, etc., to form an electromagnetic wave shielding film. The terminal protection double-sided tape of this embodiment has at least one layer among the viscoelastic layer, the substrate, and the second adhesive layer as a heat conductive layer. In the step of forming an electromagnetic wave shielding film by sputtering, ion plating, spray coating, etc. of applying a conductive material, the surface temperature increase and surface roughness of the aforementioned terminal protection double-sided tape can also be suppressed.

In this specification, the so-called "thermal conductive layer" means a layer with a thermal conductivity of 0.5 (W/(m・K)) or more. The thermal conductivity can be calculated by the following formula (1). Thermal conductivity (W/(m・K)) = thermal diffusion rate × density × specific heat   Formula (1) In the above formula (1), the thermal diffusion rate can be measured by the temperature wave method (TWA (Temperature Wave Analysis) method) using a thermal diffusion rate-thermal conductivity measuring device (for example, ai-Phase (Co., Ltd.) manufactured, ai-Phase Mobile lu). In the above formula (1), the specific heat can be calculated by the DSC (Differential Scanning Calorimetry) method, and the density can be calculated by the Archimedean method.

The thermal conductivity of the thermal conductive layer is preferably 1.0 (W/(m・K)) or more, and more preferably 5.0 (W/(m・K)) or more. If the thermal conductivity of the thermal conductive layer is above the aforementioned lower limit, the heat dissipation effect of the terminal protection double-sided tape is improved in the electromagnetic wave shielding film formation step by sputtering, ion plating, spray coating, etc. of applying a conductive material, and as a result, the surface temperature rise and surface roughness of the terminal protection double-sided tape can be suppressed. The thermal conductivity of the thermal conductive layer is not particularly limited as long as it has the effect of the present invention, for example, it can be 30.0 (W/(m・K)) or less, and it can also be 25.0 (W/(m・K)) or less. The above upper limit and lower limit can be arbitrarily combined. As an example of a combination, 1.0 (W/(m·K)) to 30.0 (W/(m·K)) is preferred, and 5.0 (W/(m·K)) to 25.0 (W/(m·K)) is more preferred.

In the terminal protection double-sided tape of this embodiment having a viscoelastic layer, a substrate, and a second adhesive layer, it is preferred that at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermal conductive layer, and it is more preferred that two or more layers are thermal conductive layers. The terminal protection double-sided tape of this embodiment has at least one of the viscoelastic layer, the substrate, and the second adhesive layer as a thermal conductive layer. In the electromagnetic wave shielding film forming step by sputtering, ion plating, spray coating, etc. of applying a conductive material, the heat dissipation effect of the terminal protection double-sided tape is improved, and as a result, the surface temperature rise and surface roughness of the terminal protection double-sided tape can be suppressed. Any of the viscoelastic layer, the substrate, and the second adhesive layer can be a thermal conductive layer, and it is particularly preferred that the substrate is a thermal conductive layer.

The total thickness of the thermal conductive layer relative to the total thickness of the double-sided tape for terminal protection is preferably 0.01 or more, more preferably 0.05 or more, and further preferably 0.1 or more. The total thickness of the thermal conductive layer relative to the total thickness of the double-sided tape for terminal protection is not particularly limited as long as it has the effect of the present invention, for example, it can be less than 1.0, less than 0.8, or less than 0.6. The above upper limit and lower limit can be arbitrarily combined. As an example of combination, it is preferably 0.01 to 1.0, preferably 0.05 to 0.8, and further preferably 0.1 to 0.6. In this specification, the so-called "total thickness of the double-sided tape for terminal protection" means the thickness of the entire double-sided tape for terminal protection, which means the total thickness of all layers constituting the double-sided tape for terminal protection. In addition, in this specification, the so-called "total thickness of the thermal conductive layer" means the total thickness of the thermal conductive layer contained in the double-sided tape for terminal protection. If the total thickness of the thermal conductive layer is greater than the aforementioned lower limit relative to the total thickness of the double-sided tape for terminal protection, the heat dissipation effect of the double-sided tape for terminal protection is improved in the electromagnetic wave shielding film formation step by sputtering, ion plating, spray coating, etc. of applying conductive materials, and as a result, the surface temperature rise and surface roughness of the double-sided tape for terminal protection can be suppressed. In this specification, the thickness of each layer can be measured, for example, in accordance with JIS K6783, JIS Z1702, and JIS Z1709 using a constant pressure thickness tester (model number: "PG-02J") manufactured by Teclock Co., Ltd.

Next, each layer constituting the double-sided tape for terminal protection of this embodiment will be described.

◎Substrate The substrate is in sheet or film form, and various resins and metal materials can be cited as the constituent materials of the substrate. In this specification, the so-called "sheet or film form" means a thin film form with small thickness unevenness in the surface and a flexible shape. As the aforementioned resin, for example, polyethylene such as low-density polyethylene (also called LDPE (Low Density Polyethylene)), linear low-density polyethylene (also called LLDPE (Linear Low Density Polyethylene)), and high-density polyethylene (also called HDPE (High Density Polyethylene)) can be cited; polyolefins other than polyethylene such as polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resin; ethylene-vinyl acetate copolymer (also called EVA (Ethylene Vinyl Acetate copolymer), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate copolymer, ethylene-norbornene copolymer and other ethylene-based copolymers (i.e., copolymers obtained using ethylene as a monomer); polyvinyl chloride, vinyl chloride copolymers and other vinyl chloride resins (i.e., resins obtained using vinyl chloride as a monomer); polystyrene; polycycloolefins; polyethylene terephthalate (also known as PET (Polyethylene Polyesters such as polyethylene naphthalate, polyethylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalate, and wholly aromatic polyesters in which all structural units have aromatic cyclic groups; copolymers of two or more of the aforementioned polyesters; poly(meth)acrylates; polyurethanes; polyacrylic urethanes; polyimides; polyamides; polycarbonates; fluororesins; polyacetals; modified polyphenylene ethers; polyphenylene sulfides; polysulfones; polyether ketones, etc. In addition, as the aforementioned resins, for example, polymer alloys such as mixtures of the aforementioned polyesters and resins other than the aforementioned polyesters can also be cited. The polymer alloy of the aforementioned polyester and the aforementioned resin other than the polyester is preferably a relatively small amount of the resin other than the polyester. In addition, examples of the resin include: a crosslinked resin obtained by crosslinking one or more of the resins exemplified above; and a modified resin such as an ionic polymer using one or more of the resins exemplified above.

In addition, in this specification, the concept of "(meth)acrylic acid" includes both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth)acrylic acid, for example, the concept of "(meth)acrylate" includes both "acrylate" and "methacrylate", and the concept of "(meth)acryl" includes both "acryl" and "methacryl".

As the aforementioned metal material, a metal material having a thermal conductivity of 1.0 (W/(m・K)) or more is preferred, and a metal material having a thermal conductivity of 5.0 (W/(m・K)) or more is more preferred. The thermal conductivity can be calculated by the aforementioned formula (1). As such metal materials, copper, gold, silver, aluminum, etc. can be cited as examples, among which copper is preferred. When the substrate contains the aforementioned metal material, the shape of the substrate is preferably a metal foil, and it is preferred that the metal foil is laminated on the aforementioned resin via an adhesive layer as a metal layer. The adhesive used to bond the resin to the metal layer can be any adhesive known in the art, and can be appropriately selected from the adhesives described in the first adhesive layer described later according to the types of the resin and the metal layer. The adhesive composition used to form the adhesive layer can be the same adhesive composition as the adhesive composition described in the first adhesive layer. In addition, the adhesive composition can be manufactured by the same method as the manufacturing method of the adhesive composition described in the first adhesive layer described later.

The resin and metal material constituting the substrate may be only one kind or two or more kinds. When there are two or more kinds, the combination and ratio of these resins and metal materials can be arbitrarily selected.

As described above, the substrate may be only one layer (single layer) or may be multiple layers of two or more layers. In the case of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited. In addition, in this specification, it is not limited to the case of the substrate. The so-called "multiple layers may be the same or different from each other" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further, the so-called "multiple layers are different from each other" means "at least one of the constituent materials and thickness of each layer is different from each other".

The thickness of the substrate is preferably 5 μm to 1000 μm, more preferably 10 μm to 500 μm, further preferably 15 μm to 300 μm, and particularly preferably 20 μm to 150 μm. Here, the so-called "thickness of the substrate" means the thickness of the substrate as a whole, for example, the thickness of a substrate composed of multiple layers means the total thickness of all layers constituting the substrate. For example, in the case of a substrate obtained by laminating the aforementioned resin and metal layer via an adhesive layer, the thickness of the substrate means the total thickness of the aforementioned resin, the aforementioned metal layer, and the aforementioned adhesive layer.

In the case where the substrate is composed of multiple layers and has more than one metal layer, the total thickness of the metal layer is preferably 0.05 or more, more preferably 0.10 or more, and further preferably 0.15 or more relative to the thickness of the substrate. The total thickness of the metal layer relative to the thickness of the substrate is not particularly limited as long as it has the effect of the present invention, for example, it can be less than 1.0, less than 0.8, or less than 0.6. The above upper limit and lower limit can be combined arbitrarily. As an example of a combination, it is preferably 0.05 to 1.0, more preferably 0.10 to 0.8, and further preferably 0.15 to 0.6. In this specification, the so-called "total thickness of the metal layer" means the total thickness of the metal layer included in the substrate. When the total thickness of the metal layer relative to the thickness of the substrate is greater than the lower limit of the above range, the thermal conductivity of the substrate is improved, and the surface temperature increase and surface roughness of the double-sided tape for terminal protection using the substrate can be suppressed.

When using a resin as a substrate, a substrate with high thickness accuracy, that is, a substrate with suppressed thickness unevenness regardless of the location, is preferred. Examples of the above-mentioned constituent materials that can be used to form such a substrate with high thickness accuracy include polyethylene, polyolefins other than polyethylene, polyethylene terephthalate, and ethylene-vinyl acetate copolymer (EVA).

The substrate may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc. in addition to the aforementioned main constituent materials such as the resin.

Among the above additives, the base material preferably contains a filler, and more preferably contains a thermally conductive filler. In this specification, the so-called "thermally conductive filler" means a filler having a thermal conductivity of 1.0 (W/(m・K)) or more. The thermal conductivity can be calculated by the above-mentioned formula (1).

The thermal conductivity of the thermally conductive filler is preferably 1.0 (W/(m・K)) or more, and more preferably 4.0 (W/(m・K)) or more. If the thermal conductivity of the thermally conductive filler contained in the substrate is above the aforementioned lower limit, the thermal conductivity of the substrate is improved, and the surface temperature rise and surface roughness of the double-sided tape for terminal protection mentioned above using the aforementioned substrate can be suppressed. The thermal conductivity of the thermally conductive filler is not particularly limited as long as it has the effect of the present invention, for example, it can be 30.0 (W/(m・K)) or less, and it can also be 25.0 (W/(m・K)) or less. The above upper limit and lower limit can be arbitrarily combined. As an example of a combination, it is preferably 1.0 (W/(m・K)) to 30.0 (W/(m・K)), and more preferably 4.0 (W/(m・K)) to 25.0 (W/(m・K)).

The thermally conductive filler is not particularly limited as long as it is above the lower limit of the thermal conductivity. It may be an organic filler or an inorganic filler, and preferably an inorganic filler. Examples of inorganic fillers include inorganic oxides, inorganic carbides, and inorganic nitrides. In view of the high thermal conductivity of inorganic fillers, inorganic carbides and inorganic nitrides are preferred, and inorganic nitrides are more preferred. As inorganic carbides, silicon carbide can be cited as an example, and as inorganic nitrides, silicon nitride, aluminum nitride, and boron nitride can be cited as examples. Among them, boron nitride is preferred in terms of high thermal conductivity. In addition, a thermally conductive filler may be used alone or in combination of two or more. When two or more are used in combination, the combination and ratio of these thermally conductive fillers can be arbitrarily selected.

The shape of the thermally conductive filler is not particularly limited as long as it has the effect of the present invention, and examples thereof include spherical, plate-like, and fibrous shapes. In addition, the thermally conductive filler is preferably uniformly dispersed in the resin.

The average particle size of the thermally conductive filler is not particularly limited as long as it has the effect of the present invention, and is, for example, 0.01 μm to 20 μm, and more preferably 0.05 μm to 10 μm. If the average particle size of the thermally conductive filler is greater than the lower limit of the aforementioned range, thermal conductivity can be efficiently ensured. If the average particle size of the thermally conductive filler is less than the upper limit of the aforementioned range, the smoothness of the substrate surface can be ensured. In this specification, the "average particle size of the thermally conductive filler" can be measured using the "Laser Diffraction Particle Size Distribution Measurement Device" manufactured by HORIBA, Ltd.

The content of the thermally conductive filler relative to the total mass of the substrate is preferably 35 mass % to 95 mass %, and more preferably 40 mass % to 90 mass %. If the content of the thermally conductive filler relative to the total mass of the substrate is above the lower limit of the aforementioned range, the thermal conductivity of the substrate is improved, and the surface temperature rise and surface roughness of the double-sided tape for terminal protection described above using the aforementioned substrate can be suppressed. If the content of the thermally conductive filler relative to the total mass of the substrate is below the upper limit of the aforementioned range, the performance as the substrate can be ensured.

The substrate can be transparent or opaque, can be colored according to the purpose, and can also be evaporated with other layers. When the aforementioned viscoelastic layer is energy-ray-curable, the substrate is preferably transparent to the energy ray.

The substrate can be manufactured by a known method. For example, a substrate containing a resin can be manufactured by molding a resin composition containing the above-mentioned resin.

When the substrate is a resin containing a thermally conductive filler, the substrate can be manufactured by a powder kneading method and a varnish method.

・Powder kneading method The thermally conductive filler is added to the resin, the resin and the thermally conductive filler are dispersed in a mixer, and then inserted into a predetermined mold and pressurized while being heated to obtain a base material composed of a resin containing a thermally conductive filler. In addition, a suitable solvent can be used when dispersing in the above mixer.

・Varnish method After the thermal conductive filler is surface treated, it is mixed with varnish and uniformly dispersed, and in this state, it is poured onto the sheet to obtain a base material composed of a resin containing a thermal conductive filler. Examples of the surface treatment include water-based, moisture-resistant, chemical-resistant treatments, resin coupling treatments, surface smoothing treatments, and the like. In addition, a suitable solvent may be used when mixing with the varnish.

◎Viscoelastic layer In the double-sided tape for terminal protection of this embodiment, the viscoelastic layer is used to protect the terminal forming surface (in other words, the electrical path surface) of a semiconductor device with terminals, and the terminals provided on the terminal forming surface. The viscoelastic layer preferably has an embedded layer and a first adhesive layer.

The thickness of the viscoelastic layer is preferably 1 μm to 1000 μm, more preferably 5 μm to 800 μm, and further preferably 10 μm to 600 μm. By making the thickness of the viscoelastic layer above the aforementioned lower limit, the terminal electrode that is prone to bulges, such as solder balls, can also be buried. In addition, by making the thickness of the viscoelastic layer below the aforementioned upper limit, the thickness of the double-sided tape for terminal protection can be suppressed from being too thick. Here, the so-called "thickness of the viscoelastic layer" means the thickness of the viscoelastic layer as a whole, and the thickness of the viscoelastic layer composed of multiple layers of the embedding layer and the first adhesive layer means the total thickness of the embedding layer and the first adhesive layer.

When the terminal forming surface of the semiconductor device with terminals is brought into close contact with the viscoelastic layer 12, it is preferred that the terminal forming surface of the semiconductor device with terminals is brought into direct close contact with the first adhesive layer 14 in the viscoelastic layer 12. At this time, in order to prevent adhesive residues from remaining on the terminal forming surface and the terminals, the first adhesive layer 14 is preferably set to be harder than the embedding layer 13.

０ Embedded layer In the double-sided tape for terminal protection of this embodiment, the embedded layer is a layer that embeds the terminals of the semiconductor device with terminals in the viscoelastic layer for protection. The embedded layer is in the form of a sheet or a film, and the constituent material of the embedded layer is not particularly limited as long as the above-mentioned conditions are met.

For example, in order to suppress deformation of the viscoelastic layer (used to cover the terminal forming surface of a semiconductor device with terminals to be protected) due to the shape of the terminals on the semiconductor surface being reflected on the viscoelastic layer, acrylic resins and the like can be cited as preferred constituent materials for the aforementioned embedded layer in terms of further improving the adhesion of the embedded layer.

The embedding layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc. in addition to the aforementioned main constituent materials such as acrylic resin.

Among the above additives, the embedding layer preferably contains a filler, and more preferably contains the above thermally conductive filler. By containing the above thermally conductive filler in the embedding layer, the thermal conductivity of the embedding layer is improved, and the surface temperature rise and surface roughness of the double-sided tape for terminal protection mentioned above can be suppressed.

The content of the thermally conductive filler relative to the total mass of the embedded layer is preferably 20 mass % to 80 mass %, and more preferably 30 mass % to 70 mass %. If the content of the thermally conductive filler relative to the total mass of the embedded layer is above the lower limit of the aforementioned range, the thermal conductivity of the embedded layer is improved, and the surface temperature rise and surface roughness of the double-sided tape for terminal protection described above when using the embedded layer can be suppressed. If the content of the thermally conductive filler relative to the total mass of the embedded layer is below the upper limit of the aforementioned range, the performance as the embedded layer can be ensured.

The embedded layer may be only one layer (single layer) or may be two or more layers. In the case of multiple layers, these multiple layers may be the same as or different from each other, and the combination of these multiple layers is not particularly limited.

The thickness of the embedded layer can be in the range of 1μm to 1000μm when the thickness of the viscoelastic layer is 1μm to 1000μm, and can be appropriately adjusted according to the height of the terminal on the terminal forming surface of the semiconductor device with terminals to be protected. However, in terms of being able to easily absorb the influence of relatively high terminals, it is preferably 10μm to 500μm, more preferably 20μm to 450μm, and particularly preferably 30μm to 400μm. By making the thickness of the embedded layer above the aforementioned lower limit, a viscoelastic layer with higher terminal protection performance can be formed. In addition, by making the thickness of the embedded layer below the aforementioned upper limit, productivity and winding suitability in a roll shape are improved. Here, the “thickness of the buried layer” refers to the thickness of the entire buried layer. For example, the thickness of a buried layer composed of multiple layers refers to the total thickness of all layers constituting the buried layer.

The embedded layer is preferably soft enough to embed the terminals, and is preferably softer than the first adhesive layer.

(Embedding layer forming composition) The embedding layer can be formed using an embedding layer forming composition containing the constituent material of the embedding layer. For example, the embedding layer forming composition is applied to the surface to be formed of the embedding layer, dried as needed, and hardened by irradiating energy beams, thereby forming the embedding layer at the target location. In addition, the embedding layer forming composition is applied to the release film, dried as needed, and hardened by irradiating energy beams, thereby forming the embedding layer of the target thickness, and also the embedding layer can be transferred to the target location. A more specific method for forming the embedding layer will be described in detail later together with the method for forming other layers. The ratio of the contents of the components that do not vaporize at room temperature in the embedding layer forming composition is usually the same as the ratio of the contents of the aforementioned components in the embedding layer. Here, the so-called "room temperature" means a temperature that is not particularly cold or hot, that is, a normal temperature, for example, a temperature of 15°C to 30°C.

The embedding layer forming composition may be applied by a known method, for example, a method using the following various coaters: air knife coater, scraper coater, rod coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater, Meyer rod coater, light touch coater, etc.

The drying conditions of the embedding layer forming composition are not particularly limited. When the embedding layer forming composition contains the solvent described later, it is preferably dried by heating. In this case, for example, it is preferably dried at 70°C to 130°C for 10 seconds to 5 minutes. When the embedding layer forming composition has energy ray curability, it is preferably cured by irradiating energy rays. In addition, as one aspect of the present invention, when the embedding layer forming composition has energy ray curability, it is preferably not cured by irradiating energy rays.

As the embedding layer forming composition, for example, there can be mentioned an embedding layer forming composition (I) containing an acrylic resin.

(Embedding layer forming composition (I)) The embedding layer forming composition (I) contains an acrylic resin. As the embedding layer forming composition (I), a composition containing an adhesive resin (I-1a) which is an acrylic resin in the first adhesive composition (I-1) described later and an energy ray-curable compound, and a composition containing an energy ray-curable adhesive resin (I-2a) having an unsaturated group introduced into the side chain of the adhesive resin (I-1a) which is an acrylic resin in the first adhesive composition (I-2) can be used as the embedding layer forming composition (I).

The adhesive resin (I-1a) and the energy ray-curable compound used in the embedding layer forming composition (I) are the same as the adhesive resin (I-1a) and the energy ray-curable compound used in the first adhesive composition (I-1) described later. The adhesive resin (I-2a) used in the embedding layer forming composition (I) is the same as the adhesive resin (I-2a) used in the first adhesive composition (I-2) described later. The embedding layer forming composition (I) preferably further contains a crosslinking agent. The crosslinking agent used in the embedding layer forming composition (I) is the same as the crosslinking agent used in the first adhesive composition (I-1) and the first adhesive composition (I-2) described below. The embedding layer forming composition (I) may further contain a photopolymerization initiator and other additives. The photopolymerization initiator and other additives used in the embedding layer forming composition (I) are the same as the photopolymerization initiator and other additives used in the first adhesive composition (I-1) and the first adhesive composition (I-2) described below. In addition, when manufacturing an embedding layer containing the above-mentioned thermally conductive filler, the embedding layer forming composition (I) contains a thermally conductive filler as an additive. The embedding layer forming composition (I) may also contain a solvent. The solvent used in the embedding layer forming composition (I) is the same as the solvent used in the first adhesive composition (I-1) and the first adhesive composition (I-2) described below.

By adjusting the molecular weight of the adhesive resin (I-1a) and the molecular weight of the energy ray curable compound in the embedding layer forming composition (I), or both of them, the embedding layer can be designed to have a soft property suitable for embedding the terminal. In addition, by adjusting the content of the crosslinking agent in the embedding layer forming composition (I), the embedding layer can be designed to have a soft property suitable for embedding the terminal.

[Method for producing a composition for forming an embedded layer] The embedded layer forming composition (I) is obtained by mixing the components for constituting the embedded layer forming composition (I). The order of adding the components when mixing is not particularly limited, and two or more components may be added simultaneously. When a solvent is used, the solvent may be used by mixing the solvent with any component other than the solvent and diluting the component in advance, or by mixing the solvent with the components without diluting any component other than the solvent in advance. There is no particular limitation on the method of mixing the ingredients during preparation, and it can be appropriately selected from the following known methods: a method of mixing by rotating a stirrer or a stirring blade; a method of mixing by using a mixer; a method of mixing by applying ultrasonic waves, etc. Regarding the temperature and time when adding and mixing the ingredients, there is no particular limitation, and it can be appropriately adjusted as long as the ingredients are not degraded. The temperature is preferably 15°C to 30°C.

(Composition of embedding layer) The composition of the embedding layer in the present embodiment is obtained by removing the solvent from the embedding layer forming composition (I) described above. In the case where the embedding layer forming composition (I) is a composition containing an adhesive resin (I-1a) which is an acrylic resin and an energy line curable compound in the first adhesive composition (I-1) described later, the content ratio of the adhesive resin (I-1a) which is an acrylic resin relative to the total mass of the embedding layer (1) is preferably 50% by mass to 99% by mass, more preferably 55% by mass to 95% by mass, and further preferably 60% by mass to 90% by mass. As another aspect of the present invention, the content ratio of the adhesive resin (I-1a) as an acrylic resin relative to the total mass of the embedding layer (1) can be 45 mass % to 90 mass %, or 50 mass % to 85 mass %. In addition, the content ratio of the energy ray-hardening compound relative to the total mass of the embedding layer (1) is preferably 0.5 mass % to 50 mass %, and more preferably 5 mass % to 45 mass %. In the case where the embedding layer (1) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the embedding layer (1) is preferably 0.1 mass % to 10 mass %, more preferably 0.2 mass % to 9 mass %, and more preferably 0.3 mass % to 8 mass %.

In the case where the embedding layer forming composition (I) is a composition containing an energy ray-hardening adhesive resin (I-2a) having an unsaturated group introduced into the side chain of an adhesive resin (I-1a) which is an acrylic resin, in the embedding layer (2), the content ratio of the energy ray-hardening adhesive resin (I-2a) having an unsaturated group introduced into the side chain relative to the total mass of the embedding layer is preferably 10 mass % to 70 mass %, more preferably 15 mass % to 65 mass %, and further preferably 20 mass % to 60 mass %. When the embedding layer (2) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the embedding layer (2) is preferably 0.1 mass % to 10 mass %, more preferably 0.2 mass % to 9 mass %, and further preferably 0.3 mass % to 8 mass %. The embedding layer (2) of this embodiment may further contain the aforementioned adhesive resin (I-1a) as an acrylic resin. In this case, the content ratio of the adhesive resin (I-1a) as an acrylic resin relative to the total mass of the embedding layer (2) is preferably 20 mass % to 70 mass %, more preferably 25 mass % to 65 mass %, and further preferably 30 mass % to 60 mass %. In addition, when the embedding layer (2) of the present embodiment further contains the aforementioned adhesive resin (I-1a) which is an acrylic resin, the content of the aforementioned adhesive resin (I-1a) is preferably 70 to 100 parts by mass, more preferably 75 to 100 parts by mass, and further preferably 80 to 100 parts by mass, relative to 100 parts by mass of the aforementioned adhesive resin (I-2a).

The composition of the adhesive resin (I-1a) which is an acrylic resin, the energy ray-curable compound, and the energy ray-curable adhesive resin (I-2a) which has an unsaturated group introduced into the side chain of the adhesive resin (I-1a) contained in the embedding layer (1) can also be the same as the description of the adhesive resin (I-1a) which is an acrylic resin, the energy ray-curable compound, and the energy ray-curable adhesive resin (I-2a) which has an unsaturated group introduced into the side chain of the adhesive resin (I-1a) used in the first adhesive composition (I-1) described later.

In the present embodiment, the embedding layer (2) comprising an adhesive resin (I-2a), an adhesive resin (I-1a), and a crosslinking agent is preferred. In this case, the adhesive resin (I-1a) is preferably an acrylic polymer having structural units derived from (meth)acrylic acid alkyl esters and units derived from carboxyl group-containing monomers. In addition, the adhesive resin (I-2a) is preferably an acrylic polymer obtained by reacting an acrylic polymer having structural units derived from (meth)acrylic acid alkyl esters and units derived from hydroxyl group-containing monomers with an unsaturated group-containing compound having an isocyanate group and an energy-ray-polymerizable unsaturated group. The crosslinking agent may be a compound exemplified in the first adhesive composition (I-1) described later, and toluene-2,6-diisocyanate is particularly preferred.

The content ratio of the structural unit derived from the alkyl (meth)acrylate relative to the total mass of the adhesive resin (I-1a) is preferably 75 mass % to 99 mass %, more preferably 80 mass % to 98 mass %, and further preferably 85 mass % to 97 mass %. The content ratio of the structural unit containing a carboxyl group-containing monomer relative to the total mass of the adhesive resin (I-1a) is preferably 1.0 mass % to 30 mass %, more preferably 2.0 mass % to 25 mass %, further preferably 3.0 mass % to 20 mass %, and particularly preferably 5.0 mass % to 15 mass %. The carbon number of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (I-1a) is preferably 4 to 12, and further preferably 4 to 8. In addition, in the adhesive resin (I-1a), alkyl acrylate is preferred. Among them, the aforementioned alkyl (meth)acrylate is particularly preferably n-butyl acrylate. In addition, as the carboxyl group-containing monomer in the adhesive resin (I-1a), ethylene unsaturated monocarboxylic acid, ethylene unsaturated dicarboxylic acid, anhydride of ethylene unsaturated dicarboxylic acid, etc. can be listed, among which ethylene unsaturated monocarboxylic acid is preferred, (meth)acrylic acid is more preferred, and acrylic acid is particularly preferred. The weight average molecular weight of the adhesive resin (I-1a) of this embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and further preferably 200,000 to 600,000. In addition, in this specification, the so-called "weight average molecular weight" refers to the polystyrene conversion value measured by gel permeation chromatography (GPC) unless otherwise specified.

The content ratio of the structural unit derived from the alkyl (meth)acrylate relative to the total mass of the adhesive resin (I-2a) is preferably 1.0 mass % to 95 mass %, more preferably 2.0 mass % to 90 mass %, and further preferably 3.0 mass % to 85 mass %. The content ratio of the unit derived from the hydroxyl group-containing monomer relative to the total mass of the adhesive resin (I-2a) is preferably 1.0 mass % to 50 mass %, more preferably 2.0 mass % to 45 mass %, and further preferably 3.0 mass % to 40 mass %. The carbon number of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (I-2a) is preferably 1 to 12, and further preferably 1 to 4. The adhesive resin (I-2a) preferably has structural units derived from two or more (meth)acrylic acid alkyl esters, more preferably has structural units derived from (meth)acrylate methyl and n-butyl, and further preferably has structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl-containing monomer in the adhesive resin (I-2a), the hydroxyl-containing monomers exemplified in the first adhesive composition (I-1) described later can be used, and 2-hydroxyethyl acrylate is particularly preferred. As the unsaturated group-containing compound having an isocyanate group and an energy-ray-polymerizable unsaturated group, the compounds exemplified in the first adhesive composition (I-2) described later can be used, and 2-methacryloyloxyethyl isocyanate is particularly preferred. The amount of the unsaturated group-containing compound having an isocyanate group and an energy-ray-polymerizable unsaturated group used is preferably 50 mol to 150 mol, more preferably 55 mol to 140 mol, and further preferably 60 mol to 135 mol, when all hydroxyl groups derived from the hydroxyl-containing monomer are 100 mol. The weight average molecular weight of the adhesive resin (I-2a) of this embodiment is preferably 10,000 to 500,000, more preferably 20,000 to 400,000, and further preferably 30,000 to 300,000.

０ Adhesive layer Hereinafter, the adhesive layer constituting the viscoelastic layer is sometimes referred to as the "first adhesive layer" to distinguish it from the second adhesive layer described later for bonding to the support body. The first adhesive layer is in the form of a sheet or film and contains an adhesive. Examples of the adhesive include acrylic resins (adhesives composed of resins having a (meth)acryl group), urethane resins (adhesives composed of resins having a urethane bond), rubber resins (adhesives composed of resins having a rubber structure), silicone resins (adhesives composed of resins having a siloxane bond), epoxy resins (adhesives composed of resins having an epoxy group), polyvinyl ether, polycarbonate and other adhesive resins, and acrylic resins are preferred.

In addition, in the present invention, the concept of "adhesive resin" includes both resins having adhesive properties and resins having bonding properties. For example, it includes not only resins having adhesive properties themselves, but also resins that exhibit adhesive properties by being used in combination with other components such as additives, and resins that exhibit bonding properties by the presence of triggers such as heat or water.

The first adhesive layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc. in addition to the main constituent materials such as the aforementioned resin.

Among the above additives, the first adhesive layer preferably contains a filler, and more preferably contains the above-mentioned thermally conductive filler. By the first adhesive layer containing the above-mentioned thermally conductive filler, the thermal conductivity of the first adhesive layer is improved, and the surface temperature rise and surface roughness of the above-mentioned double-sided tape for terminal protection using the above-mentioned first adhesive layer can be suppressed.

The content of the thermally conductive filler relative to the total mass of the first adhesive layer is preferably 20 mass % to 80 mass %, and more preferably 30 mass % to 70 mass %. If the content of the thermally conductive filler relative to the total mass of the first adhesive layer is above the lower limit of the aforementioned range, the thermal conductivity of the first adhesive layer is improved, and the surface temperature rise and surface roughness of the aforementioned double-sided tape for terminal protection using the aforementioned first adhesive layer can be suppressed. If the content of the thermally conductive filler relative to the total mass of the first adhesive layer is below the upper limit of the aforementioned range, the performance as the first adhesive layer can be ensured.

The first adhesive layer may be only one layer (single layer) or may be two or more layers. In the case of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited.

The thickness of the first adhesive layer is preferably 1 μm to 1000 μm, more preferably 2 μm to 100 μm, and particularly preferably 5 μm to 20 μm. Here, the so-called "thickness of the first adhesive layer" means the thickness of the first adhesive layer as a whole. For example, the so-called thickness of the first adhesive layer composed of multiple layers means the total thickness of all layers constituting the first adhesive layer.

The first adhesive layer can be formed using an energy ray-curable adhesive or a non-energy ray-curable adhesive. The first adhesive layer formed using an energy ray-curable adhesive can easily adjust the physical properties before and after curing. In the present invention, the so-called "energy ray" means an electromagnetic wave or a charged particle beam having an energy quantum, and examples of the energy ray include ultraviolet rays, electron beams, etc. Ultraviolet rays can be irradiated by using a high-pressure mercury lamp, a fused H lamp, or a xenon lamp as an ultraviolet source. Electron beams can be irradiated by electron beams generated by electron beam accelerators, etc. In the present invention, the term "energy ray curing property" means the property of curing by irradiation with energy rays, and the term "non-energy ray curing property" means the property of not curing even by irradiation with energy rays.

(First adhesive composition) The first adhesive layer can be formed using a first adhesive composition containing an adhesive. For example, the first adhesive composition is applied to the surface to be formed on the first adhesive layer, and dried as needed, thereby forming the first adhesive layer at the target site. Alternatively, the first adhesive layer can be formed to a target thickness by applying the first adhesive composition to the release film and drying as needed, and the first adhesive layer can also be transferred to the target site. A more specific method for forming the first adhesive layer will be described in detail later together with the method for forming other layers. The ratio of the contents of the components that do not vaporize at room temperature in the first adhesive composition is usually the same as the ratio of the contents of the aforementioned components in the first adhesive layer. In addition, in this embodiment, the so-called "room temperature" means a temperature that is not particularly cold or hot, that is, a normal temperature, for example, a temperature of 15°C to 25°C.

The first adhesive composition may be applied by a known method, for example, a method using the following various coaters: air knife coater, scraper coater, rod coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater, Meyer rod coater, touch coater, etc.

The drying conditions of the first adhesive composition are not particularly limited. When the first adhesive composition contains a solvent described later, it is preferably dried by heating. In this case, for example, it is preferably dried at 70° C. to 130° C. for 10 seconds to 5 minutes.

When the first adhesive layer is energy ray-curable, the first adhesive composition containing the energy ray-curable adhesive, i.e., the energy ray-curable first adhesive composition, may be, for example, the following adhesive compositions: the first adhesive composition (I-1) containing a non-energy ray-curable adhesive resin (I-1a) (hereinafter, sometimes referred to as "adhesive resin (I-1a)") and an energy ray-curable adhesive resin. A curable compound; a first adhesive composition (I-2) comprising an energy ray-curable adhesive resin (I-2a) having an unsaturated group introduced into the side chain of a non-energy ray-curable adhesive resin (I-1a) (hereinafter sometimes referred to as "adhesive resin (I-2a)"); and a first adhesive composition (I-3) comprising the aforementioned adhesive resin (I-2a) and an energy ray-curable low molecular weight compound.

(First adhesive composition (I-1)) As described above, the first adhesive composition (I-1) contains a non-energy ray-curable adhesive resin (I-1a) and an energy ray-curable compound.

(Adhesive resin (I-1a)) The adhesive resin (I-1a) is preferably an acrylic resin. Examples of the acrylic resin include acrylic polymers having at least one structural unit derived from an alkyl (meth)acrylate. The acrylic resin may have only one structural unit or two or more structural units. In the case of two or more structural units, the combination and ratio of these structural units may be arbitrarily selected.

As the aforementioned alkyl (meth)acrylate, for example, there can be listed alkyl (meth)acrylates in which the carbon number of the alkyl group constituting the alkyl ester is 1 to 20, and the aforementioned alkyl group is preferably in a straight chain or branched chain. As the alkyl (meth)acrylate, more specifically, there can be listed: methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, Decyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate (also known as lauryl (meth)acrylate), tridecyl (meth)acrylate, tetradecyl (meth)acrylate (also known as myristyl (meth)acrylate), pentadecyl (meth)acrylate, hexadecyl (meth)acrylate (also known as palmityl (meth)acrylate), heptadecyl (meth)acrylate, octadecyl (meth)acrylate (also known as stearyl (meth)acrylate), nonadecyl (meth)acrylate, eicosyl (meth)acrylate, and the like.

In terms of improving the adhesion of the first adhesive layer, the acrylic polymer preferably has a structural unit derived from an alkyl (meth)acrylate having an alkyl group with a carbon number of 4 or more. In terms of further improving the adhesion of the first adhesive layer, the alkyl group preferably has a carbon number of 4 to 12, more preferably 4 to 8. In addition, the alkyl (meth)acrylate having an alkyl group with a carbon number of 4 or more is preferably an alkyl acrylate.

The acrylic polymer preferably has a structural unit derived from a functional group-containing monomer in addition to a structural unit derived from an alkyl (meth)acrylate. As the functional group-containing monomer, for example, the following monomers can be cited: the functional group reacts with the crosslinking agent described later to become a starting point for crosslinking, or the functional group reacts with the unsaturated group in the unsaturated group-containing compound to introduce an unsaturated group into the side chain of the acrylic polymer.

Examples of the functional group in the functional group-containing monomer include hydroxyl group, carboxyl group, amino group, epoxy group, etc. That is, examples of the functional group-containing monomer include hydroxyl group-containing monomer, carboxyl group-containing monomer, amino group-containing monomer, epoxy group-containing monomer, etc.

Examples of the hydroxyl group-containing monomer include hydroxyalkyl (meth)acrylates such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; and non-(meth)acrylic unsaturated alcohols such as vinyl alcohol and allyl alcohol (i.e., unsaturated alcohols that do not have a (meth)acryloyl skeleton).

Examples of the aforementioned carboxyl group-containing monomer include: ethylenically unsaturated monocarboxylic acids (monocarboxylic acids having ethylenically unsaturated bonds) such as (meth)acrylic acid and crotonic acid; ethylenically unsaturated dicarboxylic acids (dicarboxylic acids having ethylenically unsaturated bonds) such as fumaric acid, itaconic acid, maleic acid, and citric acid; anhydrides of the aforementioned ethylenically unsaturated dicarboxylic acids; (meth)acrylic acid carboxylalkyl esters such as 2-carboxyethyl methacrylate, and the like.

The functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxyl group-containing monomer, and more preferably a hydroxyl group-containing monomer.

The number of the functional group-containing monomers constituting the acrylic polymer may be one or two or more. When there are two or more functional group-containing monomers, the combination and ratio of these functional group-containing monomers may be arbitrarily selected.

In the acrylic polymer, the content of the structural unit derived from the functional group-containing monomer is preferably 1 to 35 mass %, more preferably 3 to 32 mass %, and even more preferably 5 to 30 mass %, relative to the total amount of the structural units.

The acrylic polymer may also have structural units derived from other monomers in addition to structural units derived from (meth) alkyl acrylate and structural units derived from functional group-containing monomers. The aforementioned other monomers are not particularly limited as long as they can be copolymerized with (meth) alkyl acrylate and the like. Examples of the aforementioned other monomers include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile, acrylamide, and the like.

The aforementioned other monomers constituting the aforementioned acrylic polymer may be only one kind or two or more kinds. When there are two or more kinds, the combination and ratio of these other monomers may be arbitrarily selected.

The aforementioned acrylic polymer can be used as the aforementioned non-energy ray-curable adhesive resin (I-1a). On the other hand, a compound obtained by reacting a functional group in the aforementioned acrylic polymer with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group (energy ray-polymerizable group) can be used as the aforementioned energy ray-curable adhesive resin (I-2a). In addition, in the present invention, the so-called "energy ray-polymerizable" means the property of being polymerized by irradiation with energy rays.

The adhesive resin (I-1a) contained in the first adhesive composition (I-1) may be only one kind or two or more kinds. When it is two or more kinds, the combination and ratio of these adhesive resins (I-1a) can be arbitrarily selected.

In the first adhesive composition (I-1), the content of the adhesive resin (I-1a) is preferably 5 mass % to 99 mass %, more preferably 10 mass % to 95 mass %, and even more preferably 15 mass % to 90 mass %, relative to the total mass of the first adhesive composition (I-1).

(Energy ray curing compound) As the energy ray curing compound mentioned above contained in the first adhesive composition (I-1), there can be listed monomers or oligomers having energy ray polymerizable unsaturated groups and capable of being cured by irradiation with energy rays. Among the energy ray curing compounds, as monomers, for example, there can be listed: trihydroxymethylpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol (meth)acrylate and other poly(meth)acrylates; (meth)acrylate urethane; polyester (meth)acrylate; polyether (meth)acrylate; epoxy (meth)acrylate and the like. Among the energy ray curing compounds, as oligomers, for example, oligomers obtained by polymerizing the above-mentioned monomers can be listed. In terms of relatively large molecular weight and less likely to reduce the storage elastic modulus of the first adhesive layer, the energy ray-curable compound is preferably (meth) urethane acrylate or (meth) urethane acrylate oligomer. In this specification, the term "oligomer" means a substance having a weight average molecular weight or formula weight of 5,000 or less.

The first adhesive composition (I-1) may contain only one energy ray curable compound or two or more energy ray curable compounds. When two or more energy ray curable compounds are contained, the combination and ratio of these energy ray curable compounds may be arbitrarily selected.

In the first adhesive composition (I-1), the content of the energy ray-hardening compound is preferably 1 mass % to 95 mass %, more preferably 5 mass % to 90 mass %, and even more preferably 10 mass % to 85 mass %, relative to the total mass of the first adhesive composition (I-1).

(Crosslinking agent) When the aforementioned acrylic polymer having structural units derived from a functional group-containing monomer in addition to structural units derived from an alkyl (meth)acrylate is used as the adhesive resin (I-1a), the first adhesive composition (I-1) preferably further contains a crosslinking agent.

The crosslinking agent reacts with the functional group to crosslink the adhesive resin (I-1a) with each other. As the crosslinking agent, for example, isocyanate crosslinking agents (crosslinking agents having an isocyanate group) such as toluene-2,6-diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, adducts of these diisocyanates, etc.; ethylene glycol glycidyl ether, N,N'-(cyclohexane-1,3-diylbis(methylene))bis(glycidylamine), etc. Epoxy crosslinking agents (crosslinking agents with glycidyl groups); aziridine crosslinking agents such as hexa[1-(2-methyl)-aziridine]triphosphatidyl triazine (crosslinking agents with aziridine groups); metal chelate crosslinking agents such as aluminum chelates (crosslinking agents with metal chelate structures); isocyanurate crosslinking agents (crosslinking agents with isocyanuric acid skeletons), etc. In terms of improving the cohesive force of the adhesive and thus improving the adhesion of the first adhesive layer, and in terms of ease of acquisition, the crosslinking agent is preferably an isocyanate crosslinking agent.

The first adhesive composition (I-1) may contain only one crosslinking agent or two or more crosslinking agents. When there are two or more crosslinking agents, the combination and ratio of these crosslinking agents can be arbitrarily selected.

In the first adhesive composition (I-1), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 1 to 10 parts by mass, based on 100 parts by mass of the adhesive resin (I-1a).

(Photopolymerization initiator) The first adhesive composition (I-1) may further contain a photopolymerization initiator. The first adhesive composition (I-1) containing a photopolymerization initiator fully undergoes a curing reaction even when irradiated with relatively low energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl ester, benzoin dimethyl ketal and other benzoin compounds; acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis(2,4,6-trimethylbenzyl)phenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, etc. Acylphosphine oxide compounds; sulfide compounds such as benzylphenyl sulfide and tetramethylthiuram monosulfide; α-keto alcohol compounds such as 1-hydroxycyclohexylphenyl ketone; azo compounds such as azobisisobutyronitrile; titanocene compounds such as titanocene; thioxanone compounds such as thiothionone; peroxide compounds; diketone compounds such as diacetyl; benzoyl, dibenzoyl, benzophenone, 2,4-diethylthiothionone, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2-chloroanthraquinone, etc. In addition, as the aforementioned photopolymerization initiator, for example, quinone compounds such as 1-chloroanthraquinone; photosensitizers such as amines, etc. can also be used.

The first adhesive composition (I-1) may contain only one type of photopolymerization initiator or two or more types of photopolymerization initiators. When there are two or more types of photopolymerization initiators, the combination and ratio of these photopolymerization initiators can be arbitrarily selected.

In the first adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the energy ray-curable compound.

(Other additives) The first adhesive composition (I-1) may also contain other additives that do not conform to any of the above-mentioned components within the scope of not impairing the effect of the present invention. As the aforementioned other additives, for example, there can be listed: antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments, dyes), sensitizers, adhesion agents, reaction delay agents, crosslinking promoters (catalysts) and other well-known additives. In addition, when manufacturing the first adhesive layer containing the above-mentioned thermally conductive filler, the first adhesive composition (I-1) contains the thermally conductive filler as an additive. In addition, the so-called reaction retarder refers to, for example, a compound that inhibits the unintended cross-linking reaction in the first adhesive composition (I-1) during storage due to the action of the catalyst mixed into the first adhesive composition (I-1). Examples of the reaction retarder include compounds that form chelate complexes by reacting chelates with the catalyst, and more specifically, compounds having two or more carbonyl groups (-C(=O)-) in one molecule.

The first adhesive composition (I-1) may contain only one other additive or two or more other additives. When there are two or more other additives, the combination and ratio of these other additives may be arbitrarily selected.

In the first adhesive composition (I-1), the content of other additives is not particularly limited and may be appropriately selected according to the type of the other additives.

(Solvent) The first adhesive composition (I-1) may also contain a solvent. By containing a solvent, the first adhesive composition (I-1) improves its suitability for application to the surface to which it is applied.

The aforementioned solvent is preferably an organic solvent. Examples of the aforementioned organic solvent include ketones such as methyl ethyl ketone and acetone; esters (carboxylates) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aliphatic hydrocarbons such as cyclohexane and n-hexane; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol, and the like.

As the aforementioned solvent, for example, the solvent used in the production of the adhesive resin (I-1a) can be used directly in the first adhesive composition (I-1) without being removed from the adhesive resin (I-1a), or a solvent of the same type or a different type from the solvent used in the production of the adhesive resin (I-1a) can be added during the production of the first adhesive composition (I-1).

The first adhesive composition (I-1) may contain only one solvent or two or more solvents. When the solvents are two or more solvents, the combination and ratio of the solvents may be arbitrarily selected.

The content of the solvent in the first adhesive composition (I-1) is not particularly limited and may be appropriately adjusted.

(First adhesive composition (I-2)) As described above, the first adhesive composition (I-2) contains an energy ray-curable adhesive resin (I-2a) having an unsaturated group introduced into the side chain of a non-energy ray-curable adhesive resin (I-1a).

(Adhesive resin (I-2a)) The aforementioned adhesive resin (I-2a) is obtained, for example, by reacting the functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy-ray-polymerizable unsaturated group.

The unsaturated group-containing compound has, in addition to the energy-ray-polymerizable unsaturated group, a group capable of bonding to the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a). Examples of the energy-ray-polymerizable unsaturated group include (meth)acryloyl, vinyl (also called ethylene), and allyl (also called 2-propenyl), and (meth)acryloyl is preferred. Examples of the group capable of bonding to the functional group in the adhesive resin (I-1a) include isocyanate and glycidyl groups capable of bonding to a hydroxyl or amine group, and hydroxyl and amine groups capable of bonding to a carboxyl or epoxide group.

As the aforementioned unsaturated group-containing compound, for example, (meth)acryloyloxyethyl isocyanate, (meth)acryloyl isocyanate, (meth)acrylate glyceryl ester, etc. can be listed, and (meth)acryloyloxyethyl isocyanate is preferred, and 2-methacryloyloxyethyl isocyanate is particularly preferred. The aforementioned isocyanate compound can bond with the hydroxyl group in the adhesive resin (I-1a), and the usage amount of the aforementioned isocyanate compound when all the hydroxyl groups in the adhesive resin (I-1a) are set to 100 mol is preferably 10 mol to 150 mol, more preferably 20 mol to 140 mol, and further preferably 30 mol to 130 mol.

The adhesive resin (I-2a) contained in the first adhesive composition (I-2) may be only one kind or two or more kinds. When it is two or more kinds, the combination and ratio of these adhesive resins (I-2a) can be arbitrarily selected.

In the first adhesive composition (I-2), the content of the adhesive resin (I-2a) is preferably 5 mass % to 99 mass %, more preferably 10 mass % to 95 mass %, and even more preferably 10 mass % to 90 mass %, relative to the total mass of the first adhesive composition (I-2).

(Crosslinking agent) For example, when the aforementioned acrylic polymer having structural units derived from a functional group-containing monomer similar to those in the adhesive resin (I-1a) is used as the adhesive resin (I-2a), the first adhesive composition (I-2) may further contain a crosslinking agent.

As the aforementioned crosslinking agent in the first adhesive composition (I-2), the same compounds as the crosslinking agent in the first adhesive composition (I-1) can be listed. The first adhesive composition (I-2) may contain only one crosslinking agent or two or more crosslinking agents. In the case of two or more crosslinking agents, the combination and ratio of these crosslinking agents can be arbitrarily selected.

In the first adhesive composition (I-2), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 1 to 10 parts by mass, based on 100 parts by mass of the adhesive resin (I-2a).

(Photopolymerization initiator) The first adhesive composition (I-2) may further contain a photopolymerization initiator. The first adhesive composition (I-2) containing a photopolymerization initiator fully undergoes a curing reaction even when irradiated with relatively low energy rays such as ultraviolet rays.

As the aforementioned photopolymerization initiator in the first adhesive composition (I-2), the same compounds as the photopolymerization initiator in the first adhesive composition (I-1) can be listed. The photopolymerization initiator contained in the first adhesive composition (I-2) may be only one kind or two or more kinds. In the case of two or more kinds, the combination and ratio of these photopolymerization initiators can be arbitrarily selected.

In the first adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, based on 100 parts by mass of the adhesive resin (I-2a).

(Other additives) The first adhesive composition (I-2) may contain other additives that do not correspond to any of the above-mentioned components within the scope of not impairing the effects of the present invention. As the above-mentioned other additives in the first adhesive composition (I-2), the same compounds as the other additives in the first adhesive composition (I-1) can be listed. The first adhesive composition (I-2) may contain only one other additive or two or more other additives. In the case of two or more other additives, the combination and ratio of these other additives can be arbitrarily selected.

In the first adhesive composition (I-2), the content of other additives is not particularly limited and can be appropriately selected according to the type of the other additives.

(Solvent) The first adhesive composition (I-2) may also contain a solvent for the same purpose as in the case of the first adhesive composition (I-1). As the aforementioned solvent in the first adhesive composition (I-2), the same solvent as in the first adhesive composition (I-1) can be listed. The first adhesive composition (I-2) may contain only one solvent or two or more solvents. In the case of two or more solvents, the combination and ratio of these solvents can be arbitrarily selected. In the first adhesive composition (I-2), the content of the solvent is not particularly limited and can be adjusted appropriately.

(First adhesive composition (I-3)) As described above, the first adhesive composition (I-3) contains the aforementioned adhesive resin (I-2a) and an energy ray-curable low molecular weight compound.

In the first adhesive composition (I-3), the content of the adhesive resin (I-2a) is preferably 5 mass % to 99 mass %, more preferably 10 mass % to 95 mass %, and even more preferably 15 mass % to 90 mass %, relative to the total mass of the first adhesive composition (I-3).

(Energy ray-hardening low molecular weight compound) As the energy ray-hardening low molecular weight compound contained in the first adhesive composition (I-3), monomers and oligomers having energy ray-polymerizable unsaturated groups and capable of being hardened by irradiation with energy rays can be listed, and compounds similar to the energy ray-hardening compound contained in the first adhesive composition (I-1) can be listed. The energy ray-hardening low molecular weight compound contained in the first adhesive composition (I-3) can be only one kind or two or more kinds. In the case of two or more kinds, the combination and ratio of these energy ray-hardening low molecular weight compounds can be arbitrarily selected.

In the first adhesive composition (I-3), the content of the energy ray-hardenable low molecular weight compound is preferably 0.01 to 300 parts by mass, more preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass, relative to 100 parts by mass of the adhesive resin (I-2a).

(Photopolymerization initiator) The first adhesive composition (I-3) may further contain a photopolymerization initiator. The first adhesive composition (I-3) containing a photopolymerization initiator fully undergoes a curing reaction even when irradiated with relatively low energy rays such as ultraviolet rays.

As the aforementioned photopolymerization initiator in the first adhesive composition (I-3), the same compounds as the photopolymerization initiator in the first adhesive composition (I-1) can be listed. The photopolymerization initiator contained in the first adhesive composition (I-3) may be only one type or two or more types. In the case of two or more types, the combination and ratio of these photopolymerization initiators can be arbitrarily selected.

In the first adhesive composition (I-3), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the total content of the adhesive resin (I-2a) and the aforementioned energy ray-curable low molecular weight compound.

(Other additives) The first adhesive composition (I-3) may also contain other additives that do not correspond to any of the above-mentioned components within the scope that does not impair the effects of the present invention. As the aforementioned other additives, the same compounds as the other additives in the first adhesive composition (I-1) can be listed. The first adhesive composition (I-3) may contain only one other additive or two or more other additives. In the case of two or more other additives, the combination and ratio of these other additives can be arbitrarily selected.

In the first adhesive composition (I-3), the content of other additives is not particularly limited and can be appropriately selected according to the type of the other additives.

(Solvent) The first adhesive composition (I-3) may also contain a solvent for the same purpose as in the case of the first adhesive composition (I-1). As the aforementioned solvent in the first adhesive composition (I-3), the same solvent as in the first adhesive composition (I-1) can be listed. The first adhesive composition (I-3) may contain only one solvent or two or more solvents. In the case of two or more solvents, the combination and ratio of these solvents can be arbitrarily selected. In the first adhesive composition (I-3), the content of the solvent is not particularly limited and can be adjusted appropriately.

(First adhesive composition other than first adhesive composition (I-1) to first adhesive composition (I-3)) Thus far, the first adhesive composition (I-1), first adhesive composition (I-2) and first adhesive composition (I-3) have been mainly described, but the components described as the components contained in these first adhesive compositions can also be used in the same manner in all first adhesive compositions other than these three first adhesive compositions (in this embodiment, referred to as "first adhesive composition other than first adhesive composition (I-1) to first adhesive composition (I-3)").

As the first adhesive composition other than the first adhesive composition (I-1) to the first adhesive composition (I-3), in addition to the energy ray-curable first adhesive composition, a non-energy ray-curable first adhesive composition can also be cited. Examples of the non-energy ray-curable first adhesive composition include compositions containing adhesive resins such as acrylic resins (resins having a (meth)acryl group), urethane resins (resins having a urethane bond), rubber resins (resins having a rubber structure), silicone resins (resins having a siloxane bond), epoxy resins (resins having an epoxy group), polyvinyl ether, or polycarbonate. Preferably, the composition contains an acrylic resin.

The first adhesive composition other than the first adhesive composition (I-1) to the first adhesive composition (I-3) preferably contains one or more crosslinking agents, and the content of the crosslinking agent can be set to the same as that of the first adhesive composition (I-1) and the like.

[Method for producing the first adhesive composition] The first adhesive composition (I-1) to the first adhesive composition (I-3) are obtained by mixing the adhesive and, if necessary, the components other than the adhesive, etc., which are used to constitute the first adhesive composition. The order of adding the components when mixing is not particularly limited, and two or more components may be added simultaneously. When a solvent is used, it can be used in the following manner: the solvent is mixed with any one of the mixing components other than the solvent and the mixing component is diluted in advance; or the solvent is mixed with these mixing components without diluting any one of the mixing components other than the solvent in advance. There is no particular limitation on the method of mixing the ingredients during preparation, and it can be appropriately selected from the following known methods: a method of mixing by rotating a stirrer or a stirring blade; a method of mixing by using a mixer; a method of mixing by applying ultrasonic waves, etc. Regarding the temperature and time when adding and mixing the ingredients, there is no particular limitation, and it can be appropriately adjusted as long as the ingredients are not degraded. The temperature is preferably 15°C to 30°C.

(Composition of the first adhesive layer) The composition of the first adhesive layer in this embodiment is obtained by removing the solvent from the first adhesive layer composition described above. In the first adhesive layer (I-1) where the first adhesive layer composition is the first adhesive composition (I-1) described above, the content ratio of the adhesive resin (I-1a) relative to the total mass of the first adhesive layer (I-1) is preferably 50% by mass to 99% by mass, more preferably 55% by mass to 95% by mass, and further preferably 60% by mass to 90% by mass. In another aspect of the present invention, the content ratio of the adhesive resin (I-1a) relative to the total mass of the first adhesive layer (I-1) may be 25% to 80% by mass, or 30% to 75% by mass, or 35% to 70% by mass. In addition, the content ratio of the energy ray-hardening compound relative to the total mass of the first adhesive layer (I-1) is preferably 1% to 50% by mass, more preferably 2% to 48% by mass, and further preferably 5% to 45% by mass. When the first adhesive layer (I-1) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first adhesive layer (I-1) is preferably 0.1 mass % to 10 mass %, more preferably 0.2 mass % to 9 mass %, and further preferably 0.3 mass % to 8 mass %.

In the case where the first adhesive layer composition is the aforementioned first adhesive composition (I-2), the content ratio of the adhesive resin (I-2a) relative to the total mass of the first adhesive layer (I-2) is preferably 70 mass % to 100 mass %, more preferably 75 mass % to 100 mass %, further preferably 80 mass % to 100 mass %, and particularly preferably 80 mass % to 99.6 mass %. When the first adhesive layer (I-2) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first adhesive layer (I-2) is preferably 0.1 mass % to 10 mass %, more preferably 0.2 mass % to 9 mass %, and further preferably 0.3 mass % to 8 mass %.

In the case where the first adhesive layer composition is the first adhesive composition (I-3), the content ratio of the adhesive resin (I-2a) relative to the total mass of the first adhesive layer (I-3) is preferably 50 mass % to 99 mass %, more preferably 55 mass % to 95 mass %, and further preferably 60 mass % to 90 mass %. In addition, the content ratio of the energy ray-curable low molecular weight compound relative to the total mass of the first adhesive layer (I-3) is preferably 1 mass % to 50 mass %, more preferably 2 mass % to 48 mass %, and further preferably 5 mass % to 45 mass %. When the first adhesive layer (I-3) contains a crosslinking agent, the content ratio of the crosslinking agent relative to the total mass of the first adhesive layer (I-3) is preferably 0.1 mass % to 10 mass %, more preferably 0.2 mass % to 9 mass %, and further preferably 0.3 mass % to 8 mass %.

In this embodiment, the first adhesive layer (I-2) comprising an adhesive resin (I-2a) and a crosslinking agent is preferred. In this case, the adhesive resin (I-2a) is preferably an acrylic polymer obtained by reacting an acrylic polymer having a structural unit derived from an alkyl (meth)acrylate and a unit derived from a hydroxyl-containing monomer with an unsaturated group-containing compound having an isocyanate group and an energy-ray-polymerizable unsaturated group. The crosslinking agent may be any of the compounds exemplified in the first adhesive composition (I-1), and toluene-2,6-diisocyanate is particularly preferred.

The content ratio of the structural unit derived from the alkyl (meth)acrylate relative to the total mass of the adhesive resin (I-2a) is preferably 50 mass % to 99 mass %, more preferably 60 mass % to 98 mass %, and further preferably 70 mass % to 97 mass %. The content ratio of the unit derived from the hydroxyl group-containing monomer relative to the total mass of the adhesive resin (I-2a) is preferably 0.5 mass % to 15 mass %, more preferably 1.0 mass % to 10 mass %, and further preferably 2.0 mass % to 10 mass %. The carbon number of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (I-2a) is preferably 1 to 12, and further preferably 1 to 4. The adhesive resin (I-2a) preferably has structural units derived from two or more (meth) alkyl esters, more preferably has structural units derived from methyl (meth) acrylate and n-butyl (meth) acrylate, and further preferably has structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl-containing monomer in the adhesive resin (I-2a), the hydroxyl-containing monomers exemplified in the above-mentioned adhesive resin (I-1a) can be used, and 2-hydroxyethyl acrylate is particularly preferred. As the unsaturated group-containing compound having an isocyanate group and an energy-ray-polymerizable unsaturated group, the compounds exemplified in the first adhesive composition (I-2) can be used, and 2-methacryloyloxyethyl isocyanate is particularly preferred. The amount of the unsaturated group-containing compound having an isocyanate group and an energy-ray-polymerizable unsaturated group used is preferably 20 mol to 80 mol, more preferably 25 mol to 75 mol, and further preferably 30 mol to 70 mol, based on 100 mol of all hydroxyl groups derived from the hydroxyl-containing monomer.

◎Peeling film The peeling film may be a peeling film known in the art. Preferred peeling films include: a film in which at least one surface of a film made of a resin such as polyethylene terephthalate is subjected to a peeling treatment by polysilicone treatment or the like; a film in which at least one surface of the film is a peeling surface made of polyolefin, etc. The thickness of the peeling film is preferably the same as the thickness of the substrate.

◎Second adhesive layer The second adhesive layer (i.e., bonding adhesive layer) is an adhesive layer used to bond the terminal protection double-sided tape of this embodiment to the support body. The aforementioned second adhesive layer can be an adhesive layer known in the art, and can be appropriately selected from the adhesive layer described in the above-mentioned first adhesive layer according to the support body.

The thickness of the second adhesive layer is preferably 5 μm to 50 μm, more preferably 10 μm to 45 μm, and particularly preferably 15 μm to 40 μm. Here, the so-called "thickness of the second adhesive layer" means the thickness of the second adhesive layer as a whole. For example, the so-called thickness of the second adhesive layer composed of multiple layers means the total thickness of all layers constituting the second adhesive layer.

The second adhesive composition used to form the second adhesive layer is the same as the first adhesive composition, and the manufacturing method of the second adhesive composition is also the same as the manufacturing method of the first adhesive composition.

The second adhesive layer preferably contains the above-mentioned adhesive resin (I-1a). In this case, the content ratio of the adhesive resin (I-1a) relative to the total mass of the second adhesive layer is preferably 70 mass % to 100 mass %, more preferably 75 mass % to 100 mass %, further preferably 80 mass % to 100 mass %, and particularly preferably 80 mass % to 99.98 mass %. In addition, the second adhesive layer may further contain a crosslinking agent. The content ratio of the crosslinking agent relative to the total mass of the second adhesive layer is preferably 0.005 mass % to 0.1 mass %, more preferably 0.01 mass % to 0.09 mass %, and further preferably 0.015 mass % to 0.08 mass %. In addition, the adhesive resin (I-1a) is preferably an acrylic polymer having a structural unit derived from an alkyl (meth)acrylate and a unit derived from a carboxyl group-containing monomer. The crosslinking agent can use the above-mentioned crosslinking agents, and isocyanate crosslinking agents are particularly preferred.

The content ratio of the structural unit derived from the alkyl (meth)acrylate relative to the total mass of the adhesive resin (I-1a) is preferably 70 mass % to 100 mass %, more preferably 75 mass % to 100 mass %, further preferably 80 mass % to 100 mass %. The content ratio of the structural unit containing a carboxyl group-containing monomer relative to the total mass of the adhesive resin (I-1a) is preferably 0 mass % to 20 mass %, more preferably 0.5 mass % to 19 mass %, further preferably 0.7 mass % to 18 mass %, particularly preferably 1.0 mass % to 17 mass %. The carbon number of the alkyl group of the alkyl (meth)acrylate in the adhesive resin (I-1a) is preferably 4 to 12, more preferably 4 to 8. In addition, in the adhesive resin (I-1a), alkyl acrylate is preferred. Among them, the aforementioned alkyl (meth)acrylate is particularly preferably n-butyl acrylate. In addition, as the carboxyl group-containing monomer in the adhesive resin (I-1a), ethylene unsaturated monocarboxylic acid, ethylene unsaturated dicarboxylic acid, anhydride of ethylene unsaturated dicarboxylic acid, etc. can be listed, among which ethylene unsaturated monocarboxylic acid is preferred, (meth)acrylic acid is more preferred, and acrylic acid is particularly preferred. The weight average molecular weight of the adhesive resin (I-1a) of this embodiment is preferably 100,000 to 800,000, more preferably 150,000 to 700,000, and further preferably 200,000 to 600,000.

◇Manufacturing method of double-sided tape for terminal protection The aforementioned double-sided tape for terminal protection can be manufactured by sequentially stacking the above-mentioned layers in a corresponding positional relationship. The formation method of each layer is as described above.

For example, the embedding layer forming composition is applied on the peeling treatment surface of the peeling film, and dried as needed to deposit the embedding layer. The first adhesive composition is applied on the peeling treatment surface of another peeling film, and dried as needed to deposit the first adhesive layer. The embedding layer on the peeling film is bonded to the first adhesive layer on the other peeling film, thereby obtaining a terminal protection tape on which the peeling film, the embedding layer, the first adhesive layer and the peeling film are sequentially deposited. The peeling film can be removed when the terminal protection tape is used.

Next, the peeling film on the embedding layer side of the terminal protection tape on which the peeling film, the embedding layer, the first adhesive layer and the peeling film are sequentially stacked is peeled off, and the terminal protection tape after the peeling film is peeled off is attached to the substrate, thereby obtaining a terminal protection tape on which the embedding layer, the first adhesive layer and the peeling film are sequentially stacked on the substrate.

In addition, for example, the embedding layer forming composition is extruded and formed on the substrate, thereby laminating the embedding layer on the substrate. The first adhesive composition is applied to the peeling treatment surface of the peeling film, and dried as needed to laminate the first adhesive layer. Then, the first adhesive layer on the peeling film is bonded to the embedding layer on the substrate, thereby obtaining a terminal protection tape in which the embedding layer, the first adhesive layer and the peeling film are laminated on the substrate in sequence.

The terminal protection tape described above is prepared in which an embedding layer, a first adhesive layer and a peeling film are sequentially laminated on a substrate. The second adhesive composition described above is applied to the peeling-treated surface of another peeling film, and dried as needed to laminate the second adhesive layer. Then, the second adhesive layer on the peeling film is laminated to the substrate of the terminal protection tape described above, thereby obtaining the terminal protection double-sided tape of this embodiment in which a peeling film, a second adhesive layer, a substrate, an embedding layer, a first adhesive layer and a peeling film are sequentially laminated. The peeling film can be removed when using the double-sided tape for terminal protection.

The double-sided tape for terminal protection having other layers in addition to the above-mentioned layers can be manufactured in the following manner: in the above-mentioned manufacturing method, any one or both of the formation step and the lamination step of the above-mentioned other layers are appropriately added in such a manner that the lamination position of the above-mentioned other layers becomes an appropriate position.

◇Method for manufacturing a semiconductor device with an electromagnetic wave shielding film The double-sided tape for terminal protection of the present embodiment can be used, for example, in the following method for manufacturing a semiconductor device with an electromagnetic wave shielding film. FIG. 3 is a cross-sectional view of an embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present embodiment, schematically showing a case where a double-sided tape for terminal protection 1 having a first adhesive layer 14, an embedding layer 13, a substrate 11, and a second adhesive layer 15 is fixed to a support 30 in sequence to manufacture a semiconductor device with an electromagnetic wave shielding film.

First, as shown in (a) and (b) of FIG. 3 , the semiconductor device 65 with terminals is pressed against the viscoelastic layer 12 of the terminal protection double-sided tape with the terminal 91 side, that is, the terminal forming surface 63a of the circuit substrate 63, at the bottom, so that the terminal 91 is buried in the viscoelastic layer 12. At this time, the terminal 91 of the semiconductor device 65 with terminals is brought into contact with the viscoelastic layer 12, and the semiconductor device 65 with terminals is pressed against the terminal protection double-sided tape. In this way, the outermost surface of the first adhesive layer 14 side of the viscoelastic layer 12 is pressed against the surface of the terminal 91 and the terminal forming surface 63a of the circuit substrate 63 in sequence. At this time, the viscoelastic layer 12 is heated to soften the viscoelastic layer 12, and expands between the terminals 91 in a manner covering the terminals 91, closely contacting the terminal forming surface 63a, and covering the surface of the terminal 91, especially the surface near the terminal forming surface 63a, thereby burying the terminal 91.

As a method of press-bonding the semiconductor device 65 with terminals to the terminal protection double-sided tape, a known method of pressing various sheets to an object for attachment can be applied, for example, a method using a laminating roller or a vacuum laminating machine.

The pressure when the semiconductor device 65 with terminals is pressed against the terminal protection double-sided tape is not particularly limited, but is preferably 0.1 MPa to 1.5 MPa, more preferably 0.3 MPa to 1.3 MPa. The heating temperature is preferably 30°C to 70°C, more preferably 35°C to 65°C, and particularly preferably 40°C to 60°C. In addition, it is preferred that the first adhesive layer 14 of the viscoelastic layer 12 is attached to the terminal forming surface 63a.

The conductive resin 101 is applied to the exposed surface of the semiconductor device 65 with terminals that is not embedded in the viscoelastic layer 12 of the terminal protection double-sided tape ((c) in FIG. 3), and then thermally cured to form an electromagnetic wave shielding film 10 made of a conductive material ((d) in FIG. 3). As a method of forming the electromagnetic wave shielding film 10 by coating with a conductive material, sputtering, ion plating, spray coating, etc. can be used.

As a sputtering method, a sputtering method known in the art such as DC (Direct Current) sputtering, RF (Radio Frequency) sputtering, DC magnetron sputtering, and ion beam sputtering can be used.

Since the terminal protection double-sided tape comprises a viscoelastic layer, a substrate, and a second adhesive layer, and at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermally conductive layer, the surface temperature rise and surface roughness of the terminal protection double-sided tape can be suppressed even in the step of forming an electromagnetic wave shielding film by sputtering, ion plating, spray coating, etc. of applying a conductive resin.

By picking up the semiconductor device 66 with the electromagnetic wave shielding film from the double-sided tape 1 for terminal protection of this embodiment, the semiconductor device 66 with the electromagnetic wave shielding film covered with the electromagnetic wave shielding film 10 can be taken out ((e) in FIG. 3 ).

In the method for manufacturing a semiconductor device with an electromagnetic wave shielding film shown in FIG. 3 , the semiconductor device with terminals 65 to be shielded from electromagnetic waves may be a semiconductor device with terminals 65 manufactured individually or may be a semiconductor device with terminals 65 singulated by dicing.

The method for manufacturing a semiconductor device with an electromagnetic wave shielding film shown in Figure 3 shows a method of using a double-sided tape 1 for terminal protection to shield the semiconductor device 65 with terminals that has been singulated and each electronic component 61, 62 is sealed by a sealing resin 64 from electromagnetic waves. However, as described below, the semiconductor device assembly 6 with terminals before singulation can also be shielded from electromagnetic waves using the double-sided tape 1 for terminal protection.

FIG. 4 and FIG. 5 are cross-sectional views of another embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film according to the present embodiment, schematically showing a method for shielding electromagnetic waves from a semiconductor device 65 with terminals by using a terminal protection double-sided tape 1 having a first adhesive layer 14, an embedding layer 13, a substrate 11, and a second adhesive layer 15 in sequence.

First, as shown in (a) and (b) of FIG. 4 , the semiconductor device assembly 6 with terminals connected by the circuit substrate 63 is pressed against the viscoelastic layer 12 of the double-sided tape for terminal protection with the terminal 91 side, that is, the terminal forming surface 63a of the circuit substrate 63, at the bottom, so that the terminal 91 is buried in the viscoelastic layer 12 in the same way as in (a) and (b) of FIG. 3 above.

At this time, while applying pressure from the upper side to the semiconductor device assembly 6 with terminals, the terminals 91 are embedded in the viscoelastic layer 12 of the terminal protection double-sided tape in the same manner as in (a) and (b) of FIG. 3 .

In addition, the viscoelastic layer 12 is heated while being bonded, so that the viscoelastic layer 12 can be softened and made to be in close contact with the terminal forming surface 63a of the circuit substrate 63. The pressure when the semiconductor device assembly 6 with terminals is pressed against the double-sided tape for terminal protection is not particularly limited, but is preferably 0.1 MPa to 1.5 MPa, more preferably 0.3 MPa to 1.3 MPa. The heating temperature is preferably 30°C to 70°C, more preferably 35°C to 65°C, and particularly preferably 40°C to 60°C. In addition, it is preferred that the first adhesive layer 14 of the viscoelastic layer 12 is bonded to the terminal forming surface 63a.

Next, the semiconductor device assembly 6 with terminals is cut to produce semiconductor devices 65 with terminals ((c) in FIG. 4). The double-sided tape for terminal protection of the present embodiment used in the step of forming the electromagnetic wave shielding film serves as a cutting tape for the semiconductor device assembly 6 with terminals. Furthermore, in the method for manufacturing a semiconductor device with an electromagnetic wave shielding film shown in FIG. 3, when the semiconductor device 65 with terminals to be shielded from electromagnetic waves is a semiconductor device 65 with terminals singulated by a cutting method, it becomes necessary to pick up the semiconductor device with terminals on the cutting tape and reattach it to the double-sided tape for terminal protection ((a) in FIG. 3). On the other hand, in the method for manufacturing a semiconductor device with an electromagnetic wave shielding film shown in FIG. 4, the operation of reattaching the semiconductor device 65 with terminals on the dicing tape to the double-sided tape for terminal protection can be omitted.

Next, the peeling tape 22 is peeled off, and the terminal protection double-sided tape is fixed to the support body 30 via the second adhesive layer 15. Then, the conductive resin 101 is applied to the exposed surface of the semiconductor device 65 with terminals that is not buried in the viscoelastic layer 12 of the terminal protection double-sided tape ((d) in FIG. 4 ). At this time, if the separation of the conductive resin 101 is insufficient at the boundary portion of each semiconductor device 65 with terminals in the semiconductor device assembly 6 with terminals, the terminal protection double-sided tape may be extended using an expansion device or the like. The individual semiconductor devices with terminals 65 can be singulated in a state where the conductive resin 101 is applied to the side surfaces of the individualized semiconductor devices with terminals 65. Furthermore, the conductive resin 101 applied to the top surface and the side surfaces of the individualized semiconductor devices with terminals 65 is heated and hardened, and an electromagnetic wave shielding film 10 made of a conductive material is formed on the exposed surface of the semiconductor devices with terminals 65 that is not buried in the viscoelastic layer 12 of the double-sided tape for terminal protection ((e) in FIG. 4). Alternatively, the conductive material may be directly formed into an electromagnetic wave shielding film 10 (FIG. 4(e)) by sputtering, ion plating, spray coating, etc. on the semiconductor device 65 with terminals (FIG. 4(c)). The temperature of the conductive material when applying the conductive material by sputtering, ion plating, spray coating, etc. is between room temperature and 250°C.

Since the terminal protection double-sided tape has a viscoelastic layer 12, a substrate 11, and a second adhesive layer 15, and at least one of the viscoelastic layer 12, the substrate 11, and the second adhesive layer 15 is a thermally conductive layer, even in the step of forming an electromagnetic wave shielding film by a method such as sputtering ion coating of a conductive resin, spray coating, etc., the surface temperature increase and surface roughness of the terminal protection double-sided tape can be suppressed.

By picking up the semiconductor device 66 with the electromagnetic wave shielding film from the double-sided tape for terminal protection of this embodiment, the semiconductor device 65 with terminals covered with the electromagnetic wave shielding film 10 can be taken out ((f) in FIG. 4 ).

In addition, as shown in (a) to (c) of Figure 5, the step of burying the terminal 91 in the viscoelastic layer 12 of the above-mentioned terminal protection double-sided tape and the step of cutting the semiconductor device assembly 6 with terminals to produce a semiconductor device 65 with terminals can also be performed on the terminal protection double-sided tape fixed to the support body 30 via the second adhesive layer 15.

In the double-sided tape for terminal protection of the present embodiment, the height h0 of the terminal 91 is preferably lower than the thickness d1 of the viscoelastic layer 12, and preferably 1.2≦d1/h0≦5.0. Specifically, the height of the terminal 91 is preferably 20μm to 300μm, more preferably 30μm to 270μm, and particularly preferably 40μm to 240μm. By making the height of the terminal 91 above the aforementioned lower limit, the function of the terminal 91 can be further improved. In addition, by making the height of the terminal 91 below the aforementioned upper limit, the effect of suppressing the residual viscoelastic layer 12 on the upper part of the terminal 91 becomes higher. In addition, in this specification, the so-called "height of the terminal" means the height of the part of the terminal that exists at the highest position away from the terminal forming surface. When the semiconductor device assembly with terminals and the semiconductor device with terminals 65 have a plurality of terminals 91, the height h0 of the terminal 91 can be set to the average of these terminals. The height of the terminal can be measured, for example, by a non-contact three-dimensional optical interferometer surface roughness meter (manufactured by Veeco, Japan, trade name: Wyko NT1100).

The width of the terminal 91 is not particularly limited, and is preferably 170 μm to 350 μm, more preferably 200 μm to 320 μm, and particularly preferably 230 μm to 290 μm. By making the width of the terminal 91 greater than the aforementioned lower limit, the function of the terminal 91 can be further improved. In addition, by making the width of the terminal 91 less than the aforementioned upper limit, the effect of suppressing the residual viscoelastic layer 12 on the upper part of the terminal 91 becomes higher. In addition, in this specification, the so-called "width of the terminal" means the maximum value of the line segment obtained by connecting two different points on the terminal surface with a straight line when looking down at the terminal in a direction perpendicular to the terminal forming surface. When the terminal is spherical or hemispherical, the so-called "terminal width" refers to the maximum diameter of the terminal when looking down at the terminal (terminal diameter).

The distance between adjacent terminals 91 (i.e., the distance between terminals) is not particularly limited, and is preferably 250 μm to 800 μm, more preferably 300 μm to 600 μm, and particularly preferably 350 μm to 500 μm. By making the distance above the lower limit, the embedding property of the terminal 91 can be further improved. In addition, by making the distance below the upper limit, the effect of suppressing the residual viscoelastic layer 12 on the upper part of the terminal 91 becomes higher. In addition, in this specification, the so-called "distance between adjacent terminals" means the minimum distance between the surfaces of adjacent terminals. [Implementation Example]

The present invention will be described in more detail below by way of specific embodiments. However, the present invention is not limited to the embodiments shown below.

[Monomer] The following are the official names of monomers using abbreviations. HEA: 2-Hydroxyethyl acrylate BA: n-butyl acrylate MMA: Methyl methacrylate AAc: Acrylic acid

(Preparation of Composition A for Forming the Second Adhesive Layer) To 100 parts by mass of a solution of an acrylic copolymer composed of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive main agent, solid content concentration 33.6%, manufactured by Nippon Carbide Industries Co., Ltd., product name "Nissetsu PE-121"), 0.2 parts by mass of N,N'-(cyclohexane-1,3-diylbis(methylene))bis(glycidylamine) (concentration 5%, manufactured by Mitsubishi Gas Chemical Co., Ltd., product name "TETRAD-C") as a crosslinking agent was added, and the mixture was stirred for 30 minutes to prepare Composition A for Forming the Second Adhesive Layer.

(Production of the second adhesive layer A) The second adhesive layer forming composition A was applied to the release-treated surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38μm) which was subjected to release treatment on one side of a polyethylene terephthalate film by polysilicone treatment, and heat-dried at 100°C for 1 minute to produce a second adhesive layer A with a thickness of 20μm.

(Preparation of Composition B for Forming the First Adhesive Layer) A solution of a resin (weight average molecular weight (Mw) 500,000, adhesive main agent, solid content 35% by mass, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., product name "COPONYL To the mixture was added 100 parts by weight of toluene-2,6-diisocyanate (manufactured by Toyochem Co., Ltd., product name "BHS-8515", solid content concentration: 37.5%) as a crosslinking agent, and the mixture was stirred for 30 minutes to prepare a first adhesive layer-forming composition B.

(Production of the first adhesive layer B) The first adhesive layer forming composition B was applied to the release-treated surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38μm) which was subjected to release treatment on one side of a polyethylene terephthalate film by polysilicone treatment, and then heat-dried at 100°C for 1 minute to produce a first adhesive layer B with a thickness of 10μm.

(Preparation of embedding layer forming composition A) 100 parts by mass of a solution of an acrylic copolymer composed of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive main agent, solid content concentration 33.6%, manufactured by Nippon Carbide Industries Co., Ltd., product name "Nissetsu PE-121"), and 62 parts by mass of BA, 10 parts by mass of MMA and 28 parts by mass of HEA were added to the acrylic copolymer. 75 parts by weight of a resin solution (weight average molecular weight (Mw) 370,000, adhesive main agent, solid content concentration 45%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., product name "COPONYL UN-2528LM1") to which 2-methacryloyloxyethyl isocyanate was added so as to have an addition rate of 100 mol% to 80 mol% and 15 parts by weight of toluene-2,6-diisocyanate (manufactured by Toyochem Co., Ltd., product name "BHS-8515", solid content concentration: 37.5%) as a crosslinking agent were stirred for 30 minutes to prepare a embedding layer forming composition A.

(Substrate A) An adhesive was applied to a polyethylene terephthalate (PET) film (thickness 25 μm) so that the thickness of the adhesive layer was 22 μm, and a copper foil with a thickness of 9 μm was laminated to obtain substrate A. In addition, when forming the adhesive layer, an adhesive composition prepared as follows was used: 2.18 parts by mass of toluene-2,6-diisocyanate (manufactured by Toyochem Co., Ltd., product name "BHS-8515", solid content concentration: 37.5%) was added as a crosslinking agent to 100 parts by mass of an acrylic copolymer composed of 46 parts by mass of BA, 37 parts by mass of 2-ethylhexyl acrylate, 9 parts by mass of vinyl acetate, 6 parts by mass of AAc, and 2 parts by mass of maleic anhydride, and stirred for 30 minutes. (Substrate B) A film in which a boron nitride filler was dispersed in a polyimide resin was prepared to have a thickness of 25 μm to serve as substrate B. The content of the boron nitride filler relative to the total mass of the substrate is set to 50% by mass. (Substrate C) A film with copper vapor-deposited on one surface of a high heat-resistant special polyester (product name "Torcena", thickness 50μm, manufactured by Toray Co., Ltd.) is used as substrate C. The thickness of the vapor-deposited copper is set to 0.1μm. (Substrate D) A PET film (thickness 50μm) is used as substrate D.

(Preparation of semiconductor devices with terminals) When evaluating the embedding properties of the double-sided tape for terminal protection of the embodiment and the comparative example, the following semiconductor devices with terminals were prepared. ・Semiconductor device with terminals Size of semiconductor device: 6mm×6mm Height of terminal: 50μm Diameter of terminal: 250μm Pitch between terminals: 400μm Number of terminals: 13×13＝169

[Measurement of thermal conductivity] The thermal diffusion rate-thermal conductivity measuring device (manufactured by ai-Phase (Co., Ltd.), product name "ai-Phase Mobile 1u") was used to measure the thermal diffusion rate of the substrate, viscoelastic layer, and second adhesive layer. Then, the thermal conductivity of the substrate, viscoelastic layer, and second adhesive layer was calculated according to the following calculation formula (2). In addition, the specific heat of the substrate, viscoelastic layer, and second adhesive layer was calculated by the DSC method, and the density was calculated by the Archimedean method. Thermal conductivity (W/(m・K)) = thermal diffusion rate × density × specific heat   Formula (2)

[Measurement of the surface temperature of the double-sided tape for terminal protection during sputtering] A semiconductor device with terminals is placed on the double-sided tape for terminal protection of the embodiment and the comparative example by the method described below. A temperature measurement label (manufactured by NOF Giken Kogyo Co., Ltd., vacuum heat label) is attached to the viscoelastic layer surface (first adhesive layer surface) of the double-sided tape for terminal protection where the semiconductor device with terminals is not placed, and the surface of the label is protected by a heat-resistant tape. The double-sided tape for terminal protection is sputtered under the conditions described below. Then, the heat-resistant tape is peeled off to confirm the surface temperature of the double-sided tape for terminal protection during sputtering.

[Sputtering treatment] The release film 22 on the second adhesive layer 15 side of the terminal protection double-sided tape 1 of the shape of Figure 1 is peeled off, and the terminal protection double-sided tape of the embodiment and the comparative example is attached to the alkali-free glass (manufactured by Corning, EagleXG, 100mm square, 0.7mm thick) via the second adhesive layer to prepare a sample for measurement. A semiconductor device with terminals is placed on the sample as follows. As shown in (a) of FIG. 3 , the semiconductor device with terminals is placed on the terminal protection double-sided tape by pressing the viscoelastic layer 12 with a pressure (load 1.1 MPa), a pressing time of 40 seconds, and a heating temperature of 50°C, with the terminal side of the semiconductor device with terminals facing downward. Then, a copper layer is formed by sputtering under the following conditions. Target: Copper Method: DC magnetron sputtering Application method: DC500W Substrate heating: 150°C Carrier gas: Argon Filming pressure: 3.4Pa The surface of the terminal protection double-sided tape after sputtering (first adhesive layer surface) was visually observed. Samples without surface roughness such as cracks and/or wrinkles, peeling, etc. are rated as acceptable (A), and samples with surface roughness such as cracks and/or wrinkles, peeling, etc. are rated as unacceptable (B).

[Example 1] The embedding layer forming composition A was applied to the peeling surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38μm) on one side of a polyethylene terephthalate film that had been subjected to a peeling treatment by a polysiloxane treatment, and after heat drying at 100°C for 1 minute, a release film ("SP-PET382150" manufactured by Lintec Corporation, thickness 38μm) on one side of a polyethylene terephthalate film that had been subjected to a peeling treatment by a polysiloxane treatment was laminated on the embedding layer forming composition A to produce an embedding layer with a thickness of 50μm. Next, a 50 μm thick embedding layer A is bonded to a 10 μm thick first adhesive layer B. Then, the release film on the embedding layer A side is peeled off and bonded to the substrate A. Finally, the second adhesive layer A is laminated on the side of the substrate opposite to the embedding layer A to produce a terminal protection double-sided tape 1 of Example 1 in the form shown in FIG. 1. The terminal protection double-sided tape 1 is used for sputtering treatment, and the surface temperature of the terminal protection double-sided tape 1 during sputtering is measured, and the surface of the terminal protection double-sided tape 1 after sputtering is visually observed. The thermal conductivity of the viscoelastic layer, the substrate A, and the second adhesive layer, the surface temperature of the terminal protection double-sided tape 1 during sputtering, and the observation results of the surface of the terminal protection double-sided tape 1 after sputtering are shown in Table 1. In addition, a photograph of the surface of the terminal protection double-sided tape 1 after sputtering (first adhesive layer surface) is shown in FIG6 .

[Example 2] A terminal protection double-sided tape 2 was manufactured in the same manner as in Example 1 except that substrate B was used instead of substrate A. The terminal protection double-sided tape 2 was used for sputtering treatment, the surface temperature of the terminal protection double-sided tape 2 during sputtering was measured, and the surface of the terminal protection double-sided tape 2 after sputtering was visually observed. The thermal conductivity of the viscoelastic layer, substrate B, and the second adhesive layer, the surface temperature of the terminal protection double-sided tape 2 during sputtering, and the observation results of the surface of the terminal protection double-sided tape 2 after sputtering are shown in Table 1. In addition, a photograph of the surface of the terminal protection double-sided tape 2 after sputtering (the surface of the first adhesive layer) is shown in FIG. 7.

[Comparative Example 1] A terminal protection double-sided tape 3 was manufactured in the same manner as in Example 1 except that substrate C was used instead of substrate A. The terminal protection double-sided tape 3 was used for sputtering treatment, the surface temperature of the terminal protection double-sided tape 3 during sputtering was measured, and the surface of the terminal protection double-sided tape 3 after sputtering was visually observed. The thermal conductivity of the viscoelastic layer, substrate C, and the second adhesive layer, the surface temperature of the terminal protection double-sided tape 3 during sputtering, and the observation results of the surface of the terminal protection double-sided tape 3 after sputtering are shown in Table 1. In addition, a photograph of the surface of the terminal protection double-sided tape 3 after sputtering (the surface of the first adhesive layer) is shown in FIG. 8.

[Comparative Example 2] A terminal protection double-sided tape 4 was manufactured in the same manner as in Example 1 except that substrate D was used instead of substrate A. The terminal protection double-sided tape 4 was used for sputtering treatment, the surface temperature of the terminal protection double-sided tape 4 during sputtering was measured, and the surface of the terminal protection double-sided tape 4 after sputtering was visually observed. The thermal conductivity of the viscoelastic layer, substrate D, and second adhesive layer, the surface temperature of the terminal protection double-sided tape 4 during sputtering, and the observation results of the surface of the terminal protection double-sided tape 4 after sputtering are shown in Table 1. In addition, a photograph of the surface of the terminal protection double-sided tape 4 after sputtering (first adhesive layer surface) is shown in FIG. 9.

[Comparative Example 3] A terminal protection double-sided tape 5 was manufactured in the same manner as in Comparative Example 2 except that the thickness of the embedding layer A was set to 160 μm. The terminal protection double-sided tape 5 was subjected to sputtering treatment, the surface temperature of the terminal protection double-sided tape 5 during sputtering was measured, and the surface of the terminal protection double-sided tape 5 after sputtering was visually observed. The thermal conductivity of the viscoelastic layer, the substrate D, and the second adhesive layer, the surface temperature of the terminal protection double-sided tape 5 during sputtering, and the observation results of the surface of the terminal protection double-sided tape 5 after sputtering are shown in Table 1. FIG10 shows a photograph of the surface (first adhesive layer surface) of the double-sided tape 5 for terminal protection after sputtering.

[Table 1] Thickness of each layer (μm) Thermal conductivity W/(m・K) Surface temperature(℃) Surface condition Second adhesive layer Substrate Viscoelastic layer Second adhesive layer Substrate Viscoelastic layer Embodiment 1 20 56.0 60 0.21 10 0.18 150＜T≦160 A Embodiment 2 20 25.0 60 0.21 5.0 0.18 150＜T≦160 A Comparison Example 1 20 50.1 60 0.21 0.03 0.18 160＜T≦170 B Comparison Example 2 20 50.0 60 0.21 0.03 0.18 160＜T≦170 B Comparison Example 3 20 50.0 170 0.21 0.03 0.18 170＜T≦180 B

According to the results shown in Table 1, it was confirmed that when the double-sided tape for terminal protection of the embodiment of the present invention is used to shield the semiconductor device with terminals from electromagnetic waves, at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermal conductive layer, so that even in the sputtering step of applying the conductive material, the surface temperature rise and surface roughness of the double-sided tape for terminal protection can be suppressed. [Industrial Applicability]

The terminal protection double-sided tape of the present invention can be used to protect the terminals of a semiconductor device with terminals when the semiconductor device with terminals is shielded from electromagnetic waves. By using the terminal protection double-sided tape of the present invention, a semiconductor device with terminals can be shielded from electromagnetic waves, thereby manufacturing a semiconductor device with an electromagnetic wave shielding film.

1: Double-sided tape for terminal protection 6: Semiconductor device assembly with terminals 10: Electromagnetic wave shielding film 11: Base material 12: Viscoelastic layer 13: Embedding layer 14: First adhesive layer 15: Second adhesive layer (bonding adhesive layer) 20,22: Peeling film 30: Support body 60: Semiconductor device assembly 61,62: Electronic parts 63: Circuit board 63a: Terminal forming surface 64: Sealing resin layer 65: Semiconductor device with terminals 66: Semiconductor device with electromagnetic wave shielding film 91: Terminal 101: Conductive resin

[FIG. 1] is a schematic cross-sectional view showing an embodiment of the double-sided tape for terminal protection of the present invention. [FIG. 2] is a schematic cross-sectional view showing another embodiment of the double-sided tape for terminal protection of the present invention. [FIG. 3] is a schematic cross-sectional view showing an embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present invention. [FIG. 4] is a schematic cross-sectional view showing another embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present invention. [FIG. 5] is a schematic cross-sectional view showing another embodiment of the method for manufacturing a semiconductor device with an electromagnetic wave shielding film of the present invention. [FIG. 6] is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Example 1 after sputtering. [Figure 7] is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Example 2 after sputtering. [Figure 8] is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 1 after sputtering. [Figure 9] is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 2 after sputtering. [Figure 10] is a photograph of the surface (first adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 3 after sputtering.

1: Double-sided tape for terminal protection

11: Base material

12: Viscoelastic layer

13: Buried layer

14: 1st adhesive layer

15: Second adhesive layer (bonding adhesive layer)

20,22: Peeling membrane

Claims (7)

A double-sided tape for terminal protection is used in the step of forming an electromagnetic wave shielding film on a semiconductor device with terminals; it has a viscoelastic layer, a substrate, and a second adhesive layer; at least one of the viscoelastic layer, the substrate, and the second adhesive layer is a thermal conductive layer; the viscoelastic layer has an embedded layer and a first adhesive layer. The double-sided tape for terminal protection as described in claim 1, wherein two or more of the viscoelastic layer, the substrate, and the second adhesive layer are thermal conductive layers. For the double-sided tape for terminal protection as described in claim 1 or 2, the thermal conductivity of the aforementioned thermal conductive layer is 1.0W/(m‧K) or more. The double-sided tape for terminal protection as described in claim 1 or 2, wherein the total thickness of the aforementioned heat conductive layer is 0.01 or more relative to the total thickness of the aforementioned double-sided tape for terminal protection. The double-sided tape for terminal protection as described in claim 1 or 2 has the aforementioned first adhesive layer, the aforementioned embedding layer, the aforementioned base material, and the aforementioned second adhesive layer in sequence. A method for manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising: a step of embedding the terminals of the semiconductor device with terminals in the viscoelastic layer of the double-sided tape for terminal protection as described in any one of claims 1 to 5; and a step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection. A method for manufacturing a semiconductor device with an electromagnetic wave shielding film, comprising: a step of embedding the terminals of a semiconductor device assembly with terminals in the viscoelastic layer of a double-sided tape for terminal protection as described in any one of claims 1 to 5; a step of cutting the semiconductor device assembly with terminals to make the semiconductor device assembly with terminals into a semiconductor device with terminals in which the terminals are embedded in the viscoelastic layer of the double-sided tape for terminal protection; and a step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device with terminals that is not embedded in the viscoelastic layer of the double-sided tape for terminal protection.

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