KR20210105874A - Manufacturing method of semiconductor device having double-sided tape for terminal protection and electromagnetic wave shielding film - Google Patents

Abstract

A double-sided tape for terminal protection used in a process of forming an electromagnetic shielding film on a semiconductor device having a terminal, comprising a viscoelastic layer (12), a substrate (11), and a second adhesive layer (15), the viscoelastic layer (12); Among the base material (11) and the second pressure-sensitive adhesive layer (15), at least one layer is a heat-conducting double-sided tape for terminal protection.

Description

Manufacturing method of semiconductor device having double-sided tape for terminal protection and electromagnetic wave shielding film

The present invention relates to a double-sided tape for terminal protection and a method for manufacturing a semiconductor device having an electromagnetic wave shielding film using the same.

This application claims priority based on the patent application 2018-238855 for which it applied to Japan on December 20, 2018, and uses the content here.

Conventionally, when a multi-pin LSI package used for an MPU or a gate array is mounted on a printed wiring board, it is a semiconductor device including a plurality of electronic components, and a convex shape made of eutectic solder, high temperature solder, gold, etc. in the connection pad portion of the semiconductor device. The electrode (hereinafter, referred to as "terminal" in this specification) is used. Then, a mounting method in which these terminals are brought into contact with a corresponding terminal portion on a chip mounting substrate and melted/diffused is employed.

With the spread of personal computers, the Internet has become common, and now, smart phones and tablet terminals are also connected to the Internet and digitized images, music, photos, text information, etc. are transmitted through the Internet through wireless communication technology. This is increasing even more. In addition, with the spread of IoT (Internet　of　Things), semiconductor devices such as sensors, RFID (Radio　frequency　identifier), MEMS (MicroElectro　MechanicalSystems), and wireless components are used smarter in various application fields such as home appliances and automobiles. Innovative transformation is taking place in packaging technology for

In this way, while the evolution of electronic devices continues, the level of demand for semiconductor devices is increasing year by year. In particular, in order to meet the demands for high performance, miniaturization, high integration, low power consumption, and low cost, two important points are heat countermeasures and noise countermeasures.

Corresponding to such measures against heat and noise, for example, as disclosed in Patent Document 1, a method of forming an electromagnetic shielding film by covering an electronic component module with a conductive material is employed. In Patent Document 1, an electromagnetic wave shielding film is formed by heating and curing the conductive resin applied to the top and side surfaces of the separated electronic component module.

Methods such as sputtering, ion plating, and spray coating are well known as a method for forming an electromagnetic shielding film by coating a semiconductor device having terminals with a conductive metal or a conductive resin (hereinafter, collectively referred to as “conductive material”). have.

Patent Document 1: Japanese Patent Laid-Open No. 2011-151372

In the method for manufacturing an electronic component disclosed in Patent Document 1, the external terminal electrode provided on the back surface of the assembly board is embedded in an adhesive sheet, and a conductive resin is applied thereto. Since the masking part is provided at a predetermined position of the pressure-sensitive adhesive sheet, it is possible to prevent an electrical short circuit between the external terminal electrode and the electromagnetic wave shielding film.

However, providing the masking portion at a predetermined position of the pressure-sensitive adhesive sheet is complicated in process. For this reason, it has unevenness|corrugation, such as a solder ball, and it is calculated|required for the terminal protection tape which can be embedded even if it is an external terminal electrode which floats easily.

On the other hand, in the electromagnetic shielding film forming process by a method such as sputtering, ion plating, or spray coating for applying a conductive material, the surface temperature of the pressure-sensitive adhesive sheet rises, and as a result, the surface roughness of the pressure-sensitive adhesive sheet is reduced. may occur. When surface roughness occurs on the surface of the pressure-sensitive adhesive sheet, there is a problem that the embedded external terminal electrode is partially exposed and electrically shorted to the electromagnetic wave shielding film. In addition, due to the roughness of the surface of the pressure-sensitive adhesive sheet, a part of the side surface of the divided electronic component module is embedded in the pressure-sensitive adhesive sheet, and there is also a problem that the electromagnetic wave shielding film is not formed on the portion.

By the way, the present invention is a double-sided tape for terminal protection used in the process of forming an electromagnetic shielding film on a semiconductor device having a terminal. An object of the present invention is to provide a double-sided tape for terminal protection capable of suppressing a rise in surface temperature and roughness of the double-sided tape for terminal protection, and a method for manufacturing a semiconductor device having an electromagnetic wave shielding film using the same.

That is, the present invention provides the following double-sided tape for terminal protection and a method for manufacturing a semiconductor device having an electromagnetic wave shield film using the same.

[1] A double-sided tape for terminal protection used in a process of forming an electromagnetic shielding film on a semiconductor device having a terminal, comprising:

Having a viscoelastic layer, a substrate, and a second pressure-sensitive adhesive layer,

Among the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer, at least one layer is a heat-conducting double-sided tape for terminal protection.

[2] 　 The double-sided tape for terminal protection as described in [1] whose two or more layers are a heat conductive layer among the said viscoelastic layer, the said base material, and the said 2nd adhesive layer.

[3] 　 The double-sided tape for terminal protection according to [1] or [2], wherein the thermal conductivity of the heat conductive layer is 1.0 W/(m·K) or more.

[4] The double-sided tape for terminal protection according to any one of [1] to [3], wherein the total thickness of the heat conductive layer with respect to the total thickness of the double-sided tape for terminal protection is 0.01 or more.

[5] 　 The said viscoelastic layer has a buried layer and a 1st adhesive layer, The double-sided tape for terminal protection in any one of [1]-[4].

[6] 　 The double-sided tape for terminal protection as described in [5], which has the said 1st adhesive layer, the said embedding layer, the said base material, and the said 2nd adhesive layer in this order.

[7] 　 A step of embedding a terminal of a semiconductor device having a terminal in the viscoelastic layer of the double-sided tape for terminal protection according to any one of [1] to [6] above, and

A step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminal

A method of manufacturing a semiconductor device having an electromagnetic shielding film comprising:

[8] A step of embedding a terminal of a semiconductor device assembly having a terminal in the viscoelastic layer of the double-sided tape for terminal protection according to any one of [1] to [6] above;

dicing the semiconductor device assembly having the terminals so that the semiconductor device assembly having the terminals is a semiconductor device having the terminals embedded in the viscoelastic layer of the double-sided tape for terminal protection; and

A step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminal

A method of manufacturing a semiconductor device having an electromagnetic shielding film comprising:

According to the present invention, there is provided a double-sided tape for terminal protection used in the process of forming an electromagnetic shielding film on a semiconductor device having a terminal. A double-sided tape for terminal protection capable of suppressing a rise in surface temperature and roughness of the double-sided tape for terminal protection, and a method for manufacturing a semiconductor device having an electromagnetic wave shielding film using the same are provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically one Embodiment of the double-sided tape for terminal protection of this invention.
It is sectional drawing which shows typically other embodiment of the double-sided tape for terminal protection of this invention.
It is sectional drawing which shows typically one Embodiment of the manufacturing method of the semiconductor device which has an electromagnetic shielding film of this invention.
4 is a cross-sectional view schematically showing another embodiment of the method for manufacturing a semiconductor device having an electromagnetic shielding film of the present invention.
5 is a cross-sectional view schematically showing another embodiment of the method for manufacturing a semiconductor device having an electromagnetic shielding film of the present invention.
It is a photograph of the surface (1st adhesive layer surface) of the double-sided tape for terminal protection of Example 1 after sputtering.
It is a photograph of the surface (1st adhesive layer surface) of the double-sided tape for terminal protection of Example 2 after sputtering.
It is a photograph of the surface (1st adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 1 after sputtering.
It is a photograph of the surface (1st adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 2 after sputtering.
It is a photograph of the surface (1st adhesive layer surface) of the double-sided tape for terminal protection of Comparative Example 3 after sputtering.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically one Embodiment of the double-sided tape for terminal protection of this invention. In addition, in order to make the characteristics of this invention easy to understand, the drawing used for the following description may enlarge and show the part which becomes a main part for convenience, and the dimensional ratio of each component etc. are not limited that it is the same as reality.

The double-sided tape 1 for terminal protection shown in FIG. 1 is a double-sided tape 1 for terminal protection used in a process of forming an electromagnetic wave shield film on a semiconductor device having a terminal, and is composed of a first adhesive layer 14 and a buried layer 13. It has the viscoelastic layer 12 formed, the base material 11, and the 2nd adhesive layer 15 in this order. At least one layer of the viscoelastic layer 12 , the substrate 11 , and the second pressure-sensitive adhesive layer 15 is a heat conductive layer.

The double-sided tape for terminal protection of this embodiment may be equipped with the peeling film 20 in the outermost layer by the side of the 1st adhesive layer 14 of the viscoelastic layer 12, as shown in FIG. Moreover, you may equip the outermost layer by the side of the 2nd adhesive layer 15 with the peeling film 22.

The double-sided tape for terminal protection of this embodiment is not limited to what is shown in FIG. 1, Within the range which does not impair the effect of this invention, what is shown in FIG. 1, a part of structure may be changed, deleted or added. .

The double-sided tape 1 for terminal protection shown in FIG. 1 peels the peeling film 22, and as shown in FIG. 2, it fixes to the support body 30, and also peels the peeling film 20, The viscoelastic layer In (12), a semiconductor device having a terminal is pressed with the terminal side down, the terminal is embedded in the viscoelastic layer 12, and a conductive material is applied thereon by sputtering, ion plating, spray coating, etc. It can be used in the process of forming a shield film. In the double-sided tape for terminal protection of the present embodiment, at least one of the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer is a heat conductive layer. Also in a shield film formation process, the raise of the surface temperature of the said double-sided tape for terminal protection, and surface roughness can be suppressed.

In this specification, the "heat conductive layer" means a layer having a thermal conductivity of 0.5 (W/(m·K)) or more. Thermal conductivity is computable by following formula (1).

Thermal conductivity (W/(m K)) = thermal diffusivity × density × specific heat Formula (1)

In the formula (1), the thermal diffusivity is a thermal diffusivity/thermal conductivity measuring device (for example, ai-Phase Co., Ltd., ai-Phase Mobile lu) using a temperature wave method (Temperature wave analysis, TWA method) can be measured by In the above formula (1), the specific heat can be calculated according to the DSC method, and the density can be calculated according to the Archimedes method.

As a thermal conductivity of a heat conductive layer, it is preferable that it is 1.0 (W/(m*K)) or more, and it is more preferable that it is 5.0 (W/(m*K)) or more. When the thermal conductivity of the thermal conductive layer is equal to or higher than the lower limit, the heat dissipation effect of the double-sided tape for terminal protection increases in the electromagnetic shielding film forming process by a method such as sputtering, ion plating, or spray coating for applying a conductive material. As a result, both sides for terminal protection A rise in the surface temperature of the tape and surface roughness can be suppressed.

Although the heat conductivity of a heat conductive layer is not specifically limited as long as it has the effect of this invention, For example, 30.0 (W/(m*K)) or less may be sufficient and 25.0 (W/(m*K)) or less may be sufficient.

The above upper limit and lower limit may be arbitrarily combined.

As an example of a combination, 1.0-30.0 (W/(m*K)) is preferable, and 5.0-25.0 (W/(m*K)) is more preferable.

In the double-sided tape for terminal protection of this embodiment having a viscoelastic layer, a base material, and a second adhesive layer, it is preferable that at least one layer of the viscoelastic layer, the base material, and the second adhesive layer is a heat conductive layer, and two or more layers It is more preferable that it is a heat conductive layer. In the double-sided tape for terminal protection of the present embodiment, at least one of the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer is a heat conductive layer. In the shielding film forming step, the heat dissipation effect of the double-sided tape for terminal protection becomes high, and as a result, a rise in the surface temperature of the double-sided tape for terminal protection and surface roughness can be suppressed. Although any layer of the said viscoelastic layer, the said base material, and the said 2nd adhesive layer may be a heat conductive layer, it is especially preferable that the said base material is a heat conductive layer.

It is preferable that the total thickness of the heat conductive layer with respect to the total thickness of the double-sided tape for terminal protection is 0.01 or more, It is more preferable that it is 0.05 or more, It is more preferable that it is 0.1 or more.

Although the total thickness of the heat conductive layer with respect to the total thickness of the double-sided tape for terminal protection is not specifically limited as long as it has the effect of this invention, For example, it may be 1.0 or less, 0.8 or less, or 0.6 or less may be sufficient.

The above upper limit and lower limit may be arbitrarily combined.

As an example of a combination, it is preferable that it is 0.01-1.0, It is preferable that it is 0.05-0.8, It is more preferable that it is 0.1-0.6.

In this specification, "total thickness of the double-sided tape for terminal protection" means the thickness of the whole double-sided tape for terminal protection, and means the thickness of the sum total of all the layers which comprise the double-sided tape for terminal protection. In addition, in this specification, "total thickness of a heat conductive layer" means the thickness of the sum total of the heat conductive layers contained in the double-sided tape for terminal protections. When the total thickness of the heat-conducting layer with respect to the total thickness of the double-sided tape for terminal protection is equal to or greater than the lower limit, in the electromagnetic shielding film forming process by a method such as sputtering, ion plating, or spray coating to apply a conductive material, the heat dissipation of the double-sided tape for terminal protection The effect of is high, and as a result, a rise in the surface temperature of the double-sided tape for terminal protection and surface roughness can be suppressed.

In this specification, the thickness of each layer is based on JIS K6783, JIS Z1702, and JIS Z 1709, for example, and can be measured by the TECLOCK Co., Ltd. static pressure thickness meter (product number: "PG-02J").

Next, each layer which comprises the double-sided tape for terminal protection of this embodiment is demonstrated.

◎Mention

The base material is in the form of a sheet or a film, and examples of the constituent material include various resins and metal materials. In this specification, "sheet shape or film shape" means that it is a thin film shape, has a small variation in in-plane thickness, and has flexibility.

As said resin, For example, polyethylene, such as low-density polyethylene (it is also called LDPE), linear low-density polyethylene (it is also called LLDPE.), and high-density polyethylene (it is also called HDPE.); polyolefins other than polyethylene, such as polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resin; Ethylene-based copolymers such as ethylene-vinyl acetate copolymer (also referred to as EVA), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-norbornene copolymer (that is, as a monomer copolymers obtained using ethylene); vinyl chloride-based resins such as polyvinyl chloride and vinyl chloride copolymer (that is, a resin obtained by using vinyl chloride as a monomer); polystyrene; polycycloolefin; Polyethylene terephthalate (also called PET), polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalenedicarboxylate, wholly aromatic polyester in which all structural units have aromatic cyclic groups, etc. of polyester; copolymers of two or more of the above polyesters; poly(meth)acrylic acid esters; Polyurethane; polyurethane acrylate; polyimide; polyamide; polycarbonate; fluororesin; polyacetal; modified polyphenylene oxide; polyphenylene sulfide; polysulfone; Polyether ketone etc. are mentioned.

Moreover, as said resin, polymer alloys, such as a mixture of the said polyester and other resin, are also mentioned, for example. In the polymer alloy of the polyester and other resins, it is preferable that the amount of the resin other than the polyester is relatively small.

Moreover, as said resin, For example, 1 type(s) or 2 or more types of the said resin exemplified so far are crosslinked; Modified resins, such as an ionomer using 1 type, or 2 or more types of the said resin illustrated so far, are also mentioned.

In addition, in this specification, let "(meth)acrylic acid" be a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth)acrylic acid, for example, "(meth)acrylate" is a concept including both "acrylate" and "methacrylate", and "(meth)acrylate" "Diary" is a concept including both "acryloyl group" and "methacryloyl group".

As the metal material, a metal material having a thermal conductivity of 1.0 (W/(m·K)) or more is preferable, and a metal material having a thermal conductivity of 5.0 (W/(m·K)) or more is more preferable. The thermal conductivity can be calculated by the above formula (1).

Examples of such a metal material include copper, gold, silver, and aluminum, and copper is preferable among them. When the base material contains the metal material, the shape is preferably a metal foil shape, and the resin is preferably laminated with a metal foil as a metal layer via an adhesive layer. The adhesive for bonding resin and a metal layer may be a well-known thing in this field|area, and it can select suitably according to the kind of resin and a metal layer from the adhesive demonstrated by the 1st adhesive layer mentioned later. The same thing as the adhesive composition demonstrated by the 1st adhesive layer can be used for the adhesive composition for forming the said adhesive layer. In addition, the said adhesive composition can be manufactured by the method similar to the manufacturing method of the adhesive composition demonstrated by the 1st adhesive layer mentioned later.

The resin and the metal material constituting the base material may be used alone, or may be two or more, and in the case of two or more, combinations and ratios thereof may be arbitrarily selected.

As described above, the substrate may have only one layer (single layer), or may have multiple layers of two or more layers. In the case of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited. .

In addition, in this specification, it is not limited to the case of a base material, "a plurality of layers may be the same or different from each other" means "all layers may be the same, all layers may be different, and only some layers may be the same" Meaning and "a plurality of layers are different from each other" means that "at least one of the constituent materials and thickness of each layer is different from each other."

It is preferable that the thickness of a base material is 5-1000 micrometers, It is more preferable that it is 10-500 micrometers, It is still more preferable that it is 15-300 micrometers, It is especially preferable that it is 20-150 micrometers.

Here, "thickness of a base material" means the thickness of the whole base material, for example, the thickness of the base material which consists of multiple layers means the thickness of the sum total of all the layers which comprise a base material. For example, in the case of a base material obtained by laminating|stacking the said resin and a metal layer via an adhesive layer, the thickness of the base material means the thickness of the said resin, the said metal layer, and the said adhesive layer in total.

When the base material consists of multiple layers and has one or more metal layers, the total thickness of the metal layer with respect to the thickness of the base material is preferably 0.05 or more, more preferably 0.10 or more, and still more preferably 0.15 or more.

Although the total thickness of the metal layer with respect to the thickness of a base material is not specifically limited as long as it has the effect of this invention, For example, 1.0 or less may be sufficient, 0.8 or less may be sufficient, and 0.6 or less may be sufficient as it.

The above upper limit and lower limit may be arbitrarily combined.

As an example of a combination, it is preferable that it is 0.05-1.0, It is more preferable that it is 0.10-0.8, It is more preferable that it is 0.15-0.6.

In this specification, the "total thickness of a metal layer" means the thickness of the sum total of the metal layers contained in a base material. When the total thickness of the metal layer with respect to the thickness of the substrate is equal to or greater than the lower limit of the above range, the thermal conductivity of the substrate is increased, and the increase in the surface temperature of the double-sided tape for terminal protection using the substrate, and surface roughness can be suppressed.

When resin is used as a base material, it is preferable that the precision of thickness is high, ie, that the dispersion|variation in thickness was suppressed irrespective of a site|part. Among the above-mentioned constituent materials, materials that can be used to construct a base material with such high precision in thickness include, for example, polyethylene, polyolefins other than polyethylene, polyethylene terephthalate, ethylene-vinyl acetate copolymer (EVA), and the like. can

The base material may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts and softeners (plasticizers) in addition to the main constituent materials such as the resin.

It is preferable that the base material contains a filler among the said additive, and it is preferable that the thermal conductive filler is especially contained among them.

In this specification, a "thermal conductive filler" means a filler having a thermal conductivity of 1.0 (W/(m·K)) or more. The thermal conductivity can be calculated by the above formula (1).

It is preferable that it is 1.0 (W/(m*K)) or more, and, as for the thermal conductivity of a thermally conductive filler, it is more preferable that it is 4.0 (W/(m*K)) or more. When the thermal conductivity of the thermally conductive filler contained in the substrate is equal to or greater than the lower limit, the thermal conductivity of the substrate increases, and the increase in the surface temperature of the double-sided tape for terminal protection using the substrate and surface roughness can be suppressed.

Although the thermal conductivity of a thermally conductive filler is not specifically limited as long as it has the effect of this invention, For example, 30.0 (W/(mK)) or less may be sufficient and 25.0 (W/(mK)) or less may be sufficient. .

The above upper limit and lower limit may be arbitrarily combined.

As an example of a combination, 1.0-30.0 (W/(m*K)) is preferable, and 4.0-25.0 (W/(m*K)) is more preferable.

A thermally conductive filler will not be specifically limited if it is more than the lower limit of the said thermal conductivity, Although an organic filler or an inorganic filler may be sufficient, it is preferable that it is an inorganic filler. Examples of the inorganic filler include inorganic oxides, inorganic carbides, and inorganic nitrides. As the inorganic filler, from the viewpoint of high thermal conductivity, inorganic carbides and inorganic nitrides are preferable, and inorganic nitrides are more preferable.

Examples of the inorganic carbide include silicon carbide, and the inorganic nitride include silicon nitride, aluminum nitride, and boron nitride. Among them, boron nitride is preferable because of its high thermal conductivity.

In addition, a thermally conductive filler may be used individually by 1 type, may use 2 or more types together, and when using 2 or more types together, these combinations and a ratio can be selected arbitrarily.

The shape of the thermally conductive filler is not particularly limited as long as it has the effect of the present invention, and examples thereof include a spherical shape, a plate shape, and a fiber shape. Moreover, it is preferable that the heat conductive filler is disperse|distributed uniformly in resin.

The average particle diameter of a thermally conductive filler is not specifically limited as long as it has the effect of this invention, For example, it is 0.01-20 micrometers, and 0.05-10 micrometers is more preferable. Thermal conductivity can be ensured efficiently as the average particle diameter of a thermally conductive filler is more than the lower limit of the said range. The smoothness of the surface of a base material is ensured that the average particle diameter of a thermally conductive filler is below the upper limit of the said range.

In this specification, "the average particle diameter of a thermally conductive filler" is HORIBA, Ltd. It can measure using the "laser diffraction type particle size distribution measuring apparatus".

It is preferable that it is 35-95 mass %, and, as for content of the thermally conductive filler with respect to the gross mass of a base material, it is more preferable that it is 40-90 mass %. When the content of the thermally conductive filler with respect to the total mass of the substrate is equal to or greater than the lower limit of the above range, the thermal conductivity of the substrate is increased, and the increase in the surface temperature of the double-sided tape for terminal protection using the substrate, and surface roughness can be suppressed. Performance as a base material can be ensured as content of the thermally conductive filler with respect to the total mass of a base material is below the upper limit of the said range.

The base material may be transparent, may be opaque, may be colored according to the objective, and another layer may be vapor-deposited.

When the viscoelastic layer is energy ray-curable, the substrate preferably transmits energy ray.

A base material can be manufactured by a well-known method. For example, the base material containing resin can be manufactured by shape|molding the resin composition containing the said resin.

When the base material is a resin including a thermally conductive filler, the base material may be manufactured by a powder kneading method and a varnish method.

・Powder kneading method

A substrate made of a resin containing a thermally conductive filler can be obtained by adding a thermally conductive filler to the resin, dispersing the resin and the thermally conductive filler in a mixer, placing it in a predetermined mold, and press-molding while heating. Moreover, when disperse|distributing in the said mixer, a solvent can be used suitably.

・Varnish method

After the thermally conductive filler is surface-treated, it is mixed with a varnish to be uniformly dispersed and poured into the sheet in that state to obtain a substrate made of a resin containing the thermally conductive filler. As said surface treatment, well-known surface treatments, such as water resistance, anti-humidity, anti-chemical treatment, coupling treatment with anti-resin, and surface smoothing treatment, are mentioned as an example. In addition, when mixing with the said varnish, a solvent can be used suitably.

◎Viscoelastic layer

In the double-sided tape for terminal protection of this embodiment, the viscoelastic layer is used in order to protect the terminal formation surface (in other words, circuit surface) of the semiconductor device which has a terminal, and the terminal provided on this terminal formation surface.

It is preferable that the said viscoelastic layer has a buried layer and a 1st adhesive layer.

It is preferable that the thickness of a viscoelastic layer is 1-1000 micrometers, It is more preferable that it is 5-800 micrometers, It is more preferable that it is 10-600 micrometers.

When the thickness of the viscoelastic layer is equal to or greater than the lower limit, it is possible to embed even a terminal electrode that is easily floated, such as a solder ball. Moreover, when the thickness of a viscoelastic layer is below the said upper limit, it is suppressed that the double-sided tape for terminal protection becomes excessive thickness.

Here, the "thickness of the viscoelastic layer" means the thickness of the entire viscoelastic layer, and the thickness of the viscoelastic layer comprising a plurality of layers of the buried layer and the first adhesive layer means the total thickness of the buried layer and the first adhesive layer.

When the terminal formation surface of the semiconductor device having terminals is brought into close contact with the viscoelastic layer 12, it is preferable to directly contact the terminal formation surface of the semiconductor device having terminals to the first pressure-sensitive adhesive layer 14 in the viscoelastic layer 12. . At this time, in order to prevent adhesive residue on the terminal formation surface and the terminal, it is preferable to set the 1st adhesive layer 14 harder than the embedding layer 13. As shown in FIG.

○ buried layer

The double-sided tape for terminal protection of this embodiment WHEREIN: A buried layer is a layer which buries and protects the terminal of the semiconductor device which has a terminal among a viscoelastic layer.

The embedding layer is in the form of a sheet or a film, and the constituent material thereof is not particularly limited as long as the relationship of the above conditions is satisfied.

For example, when the purpose of suppressing deformation of the viscoelastic layer by reflecting the shape of the terminal existing on the semiconductor surface in the viscoelastic layer covering the terminal formation surface of the semiconductor device having the terminal to be protected is intended, As a preferable constituent material of the said embedding layer, since the sticking property of an embedding layer improves more, an acrylic resin etc. are mentioned.

The embedding layer may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts and softeners (plasticizers) in addition to the main constituent materials such as the acrylic resin.

It is preferable that the embedding layer contains a filler among the said additive, and it is preferable to contain the above-mentioned thermally conductive filler especially. When the buried layer contains the above-described thermally conductive filler, the thermal conductivity of the buried layer is increased, and a rise in the surface temperature of the double-sided tape for terminal protection using the buried layer and surface roughness can be suppressed.

It is preferable that it is 20-80 mass %, and, as for content of the thermally conductive filler with respect to the gross mass of a buried layer, it is more preferable that it is 30-70 mass %. When the content of the thermally conductive filler with respect to the total mass of the buried layer is equal to or greater than the lower limit of the above range, the thermal conductivity of the buried layer is increased, and the surface temperature of the double-sided tape for terminal protection using the buried layer, and surface roughness can be suppressed. Performance as a buried layer can be ensured as content of the thermally conductive filler with respect to the total mass of a buried layer is below the upper limit of the said range.

One layer (single layer) may be sufficient as a buried layer, and two or more layers may be sufficient as multiple layers, In the case of multiple layers, these multiple layers may mutually be the same or different, and the combination of these multiple layers is not specifically limited.

The thickness of the buried layer can be appropriately adjusted depending on the height of the terminal on the terminal formation surface of the semiconductor device having the terminal to be protected in the range where the thickness of the viscoelastic layer is 1 to 1000 µm, but the influence of the relatively high terminal It is preferable that it is 10-500 micrometers from the point which can also absorb easily, It is more preferable that it is 20-450 micrometers, It is especially preferable that it is 30-400 micrometers. When the thickness of the buried layer is equal to or greater than the lower limit, a viscoelastic layer with higher terminal protection performance can be formed. Moreover, when the thickness of a buried layer is below the said upper limit, productivity and the sound-winding compatibility to roll shape improve.

Here, the "thickness of a buried layer" means the thickness of the whole embedding layer, for example, the thickness of the embedding layer which consists of multiple layers means the thickness of the sum total of all the layers which comprise a buried layer.

It is preferable that the embedding layer has a soft property corresponding to embedding the terminal, and it is preferable that it is softer than the first pressure-sensitive adhesive layer.

(Composition for forming buried layer)

The buried layer can be formed using a composition for forming a buried layer containing the constituent material.

For example, a buried layer can be formed in the target site|part by coating the composition for embedding layer formation on the formation target surface of a buried layer, drying as needed, and hardening by irradiation of an energy ray. In addition, by coating the release film with the composition for forming a buried layer, drying if necessary, and curing by irradiation with an energy ray, a buried layer having a target thickness can be formed, and the buried layer can be transferred to a target site. . A more specific method of forming the buried layer will be described later in detail along with the method of forming other layers. The ratio of content of the components which do not vaporize at normal temperature in the composition for embedding layer formation becomes the same as the ratio of content of the said components of a buried layer normally. Here, "room temperature" means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples thereof include a temperature of 15 to 30°C.

Coating of the composition for forming a buried layer may be performed by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, a screen coater. , a method using various coaters, such as a Meyer bar coater and a Keith coater, is mentioned.

Although the drying conditions of the composition for embedding layer formation are not specifically limited, When the composition for embedding layer formation contains the solvent mentioned later, it is preferable to heat-dry, In this case, for example, at 70-130 degreeC for 10 second. It is preferable to dry under the conditions of ~ 5 minutes.

When the composition for embedding layer formation has energy-beam sclerosis|hardenability, it is preferable to harden|cure it by irradiation of an energy-beam. Moreover, in one aspect of this invention, when the composition for embedding|flush-mounting layer formation has energy-beam sclerosis|hardenability, it is preferable not to harden by irradiation of an energy-beam.

As a composition for embedding layer formation, the composition (I) for embedding layer formation containing an acrylic resin is mentioned, for example.

｛ Composition (I) for forming a buried layer

The composition (I) for embedding layer formation contains an acrylic resin.

As the composition (I) for embedding layer formation, among the 1st adhesive compositions (I-1) mentioned later, the composition containing the adhesive resin (I-1a) which is an acrylic resin, and an energy-beam curable compound, The 1st adhesive composition (I-) Among 2), the composition containing the energy-beam curable adhesive resin (I-2a) in which the unsaturated group was introduce|transduced into the side chain of the adhesive resin (I-1a) which is an acrylic resin can be used as composition (I) for embedding|flush-mounting layer formation.

The pressure-sensitive adhesive resin (I-1a) and the energy ray-curable compound used in the composition (I) for forming an embedding layer are the pressure-sensitive adhesive resin (I-1a) and the energy ray-curable compound used in the first pressure-sensitive adhesive composition (I-1) to be described later. same as

The adhesive resin (I-2a) used with the composition (I) for embedding layer formation is the same as description of the adhesive resin (I-2a) used with the 1st adhesive composition (I-2) mentioned later.

It is preferable that the composition (I) for embedding layer formation further contains a crosslinking agent. The crosslinking agent used with the composition (I) for embedding layer formation is the same as description of the crosslinking agent used by the 1st adhesive composition (I-1) and 1st adhesive composition (I-2) mentioned later.

The composition (I) for embedding layer formation may further contain a photoinitiator and another additive. The photoinitiator and other additives used in the composition (I) for forming the embedding layer are the same as the description of the photoinitiator and other additives used in the first pressure-sensitive adhesive composition (I-1) and the first pressure-sensitive adhesive composition (I-2) described later. . Moreover, when manufacturing the embedding layer containing the thermally conductive filler mentioned above, the composition (I) for embedding|flush-mounting layer formation contains a thermally conductive filler as an additive.

The composition (I) for embedding layer formation may contain the solvent. The solvent used with the composition (I) for embedding layer formation is the same as description of the solvent used by the 1st adhesive composition (I-1) and 1st adhesive composition (I-2) mentioned later.

In the composition (I) for forming a buried layer, by adjusting either or both of the molecular weight of the adhesive resin (I-1a) and the molecular weight of the energy ray-curable compound, the embedding layer has a soft property corresponding to burying the terminal. can be designed to

In addition, in the composition (I) for forming a buried layer, by adjusting the content of the crosslinking agent, the buried layer can be designed so as to have a soft property corresponding to burying the terminal.

<<Method for producing a composition for forming a buried layer>>

The composition (I) for embedding layer formation is obtained by mix|blending each component for comprising this.

At the time of mixing|blending each component, the order of addition is not specifically limited, You may add 2 or more types of components simultaneously.

In the case of using a solvent, the solvent may be mixed with some compounding components other than the solvent, and this compounding component may be diluted in advance, and some compounding components other than the solvent are not diluted in advance, and the solvent is mixed with these compounding components. It can also be used as

The method of mixing each component at the time of mixing|blending is not specifically limited, The method of rotating a stirrer, a stirring blade, etc. and mixing; a method of mixing using a mixer; What is necessary is just to select suitably from well-known methods, such as the method of adding ultrasonic waves and mixing.

The temperature and time at the time of addition and mixing of each component are not specifically limited as long as each compounding component does not deteriorate, What is necessary is just to adjust suitably, It is preferable that the temperature is 15-30 degreeC.

｛The composition of the buried layer ｝

In this embodiment, the composition of the buried layer removes the solvent from the above-mentioned composition (I) for embedding layer formation.

In the embedding layer (1) in the case where the composition (I) for embedding layer formation is a composition containing the adhesive resin (I-1a) which is an acrylic resin, and an energy-beam curable compound among the 1st adhesive compositions (I-1) mentioned later. It is preferable that the content ratio of the adhesive resin (I-1a) which is an acrylic resin with respect to the total mass of the buried layer 1 is 50-99 mass %, It is more preferable that it is 55-95 mass %, It is 60-90 mass % is more preferable. In another aspect of the present invention, the content ratio of the adhesive resin (I-1a) which is an acrylic resin with respect to the total mass of the buried layer 1 may be 45 to 90 mass% or 50 to 85 mass%. Moreover, it is preferable that it is 0.5-50 mass %, and, as for the content rate of the energy-beam curable compound with respect to the total mass of the buried layer 1, it is more preferable that it is 5-45 mass %. When the buried layer 1 contains a crosslinking agent, the content ratio of the crosslinking agent with respect to the total mass of the buried layer 1 is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and 0.3 to 8 mass%. % is more preferable.

In the embedding layer (2) in the case where the composition (I) for forming an embedding layer is a composition containing an energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of the adhesive resin (I-1a) which is an acrylic resin. , the content ratio of the energy ray-curable adhesive resin (I-2a) having an unsaturated group introduced into the side chain with respect to the total mass of the buried layer is preferably 10 to 70 mass%, more preferably 15 to 65 mass%, 20 It is more preferable that it is ~ 60% by mass. When the buried layer 2 contains a crosslinking agent, the content ratio of the crosslinking agent to the total mass of the buried layer 2 is preferably 0.1 to 10 mass%, more preferably 0.2 to 9 mass%, and 0.3 to 8 mass%. % is more preferable. The embedding layer 2 of this embodiment may further contain the adhesive resin (I-1a) which is the said acrylic resin. In this case, it is preferable that the content rate of the adhesive resin (I-1a) which is an acrylic resin with respect to the total mass of the embedding layer 2 is 20-70 mass %, It is more preferable that it is 25-65 mass %, 30- It is more preferable that it is 60 mass %. In addition, when the embedding layer 2 of this embodiment further contains the adhesive resin (I-1a) which is the said acrylic resin, the said adhesive resin (I-1a) with respect to 100 mass parts of said adhesive resin (I-2a). It is preferable that content is 70-100 mass parts, It is more preferable that it is 75-100 mass parts, It is more preferable that it is 80-100 mass parts.

An energy ray-curable adhesive resin in which an unsaturated group is introduced into the side chain of the adhesive resin (I-1a), which is an acrylic resin contained in the embedding layer (1), an energy ray-curable compound, and the adhesive resin (I-1a) included in the embedding layer (2) The composition of (I-2a), etc. are unsaturated in the side chain of the adhesive resin (I-1a) which is an acrylic resin used in the 1st adhesive composition (I-1) mentioned later, an energy-beam curable compound, and adhesive resin (I-1a) It may be the same as description of the energy-beam-curable adhesive resin (I-2a) into which a group was introduce|transduced.

In this embodiment, it is preferable that it is the embedding layer 2 containing adhesive resin (I-2a), adhesive resin (I-1a), and a crosslinking agent. In this case, it is preferable that the adhesive resin (I-1a) is an acrylic polymer which has a structural unit derived from (meth)acrylic acid alkyl ester, and a unit derived from a carboxyl group-containing monomer. In addition, the adhesive resin (I-2a) is an acrylic polymer having a structural unit derived from (meth)acrylic acid alkyl ester and a unit derived from a hydroxyl group-containing monomer, and an unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group is reacted. It is preferable that it is an acrylic polymer obtained by making it. The crosslinking agent can use the compound illustrated by the 1st adhesive composition (I-1) mentioned later, and it is especially preferable to use tolylene-2,6-diisocyanate.

It is preferable that the content rate of the structural unit derived from (meth)acrylic acid alkyl ester with respect to the total mass of adhesive resin (I-1a) is 75-99 mass %, It is more preferable that it is 80-98 mass %, It is 85- It is more preferable that it is 97 mass %. The content ratio of the structural unit of the carboxyl group-containing monomer with respect to the total mass of the adhesive resin (I-1a) is preferably 1.0 to 30 mass%, more preferably 2.0 to 25 mass%, and 3.0 to 20 mass% It is more preferable, and it is especially preferable that it is 5.0-15 mass %. It is preferable that carbon number of an alkyl group is 4-12, and, as for the (meth)acrylic acid alkyl ester in adhesive resin (I-1a), it is more preferable that it is 4-8. Moreover, in the adhesive resin (I-1a), it is preferable that it is an acrylic acid alkyl ester. Among them, the (meth)acrylic acid alkyl ester is particularly preferably n-butyl acrylate. Examples of the carboxy-containing monomer in the adhesive resin (I-1a) include an anhydride of ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid, and ethylenically unsaturated dicarboxylic acid, among them An ethylenically unsaturated monocarboxylic acid is preferable, (meth)acrylic acid is more preferable, and acrylic acid is especially preferable.

It is preferable that it is 100,000-800,000, as for the weight average molecular weight of adhesive resin (I-1a) of this embodiment, it is more preferable that it is 150,000-700,000, It is more preferable that it is 200,000-600,000.

In addition, in this specification, unless otherwise indicated, a "weight average molecular weight" is a polystyrene conversion value measured according to the gel permeation chromatography (GPC) method.

It is preferable that the content rate of the structural unit derived from (meth)acrylic acid alkyl ester with respect to the total mass of adhesive resin (I-2a) is 1.0-95 mass %, It is more preferable that it is 2.0-90 mass %, It is 3.0- It is more preferable that it is 85 mass %. The content ratio of the unit derived from the hydroxyl group-containing monomer with respect to the total mass of the adhesive resin (I-2a) is preferably 1.0 to 50 mass%, more preferably 2.0 to 45 mass%, and 3.0 to 40 mass% it is more preferable It is preferable that carbon number of an alkyl group is 1-12, and, as for the (meth)acrylic acid alkyl ester in adhesive resin (I-2a), it is more preferable that it is 1-4. It is preferable that the adhesive resin (I-2a) has structural units derived from two or more types of (meth)acrylic acid alkyl esters, and it is more preferable to have structural units derived from methyl (meth)acrylate and n-butyl (meth)acrylate. and more preferably have structural units derived from methyl methacrylate and n-butyl acrylate. As a hydroxyl-containing monomer in adhesive resin (I-2a), what is illustrated by the 1st adhesive composition (I-1) mentioned later can be used, It is especially preferable to use 2-hydroxyethyl acrylate. As an unsaturated group containing compound which has an isocyanate group and an energy-beam polymerizable unsaturated group, the compound illustrated by the 1st adhesive composition (I-2) mentioned later can be used, Using 2-methacryloyloxyethyl isocyanate Especially preferred. When the total hydroxyl groups derived from the hydroxyl group-containing monomer are 100 mol, the amount of the unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group is preferably 50 to 150 mol, more preferably 55 to 140 mol preferred, more preferably 60 to 135 mol.

It is preferable that it is 10,000-500,000, as for the weight average molecular weight of adhesive resin (I-2a) of this embodiment, it is more preferable that it is 20,000-400,000, It is more preferable that it is 30,000-300,000.

○ Adhesive layer

Hereinafter, the adhesive layer which comprises a viscoelastic layer is distinguished from the 2nd adhesive layer for bonding to the support body mentioned later, and a "1st adhesive layer" may be called.

A 1st adhesive layer is a sheet form or a film form, and contains an adhesive.

Examples of the pressure-sensitive adhesive include an acrylic resin (a pressure-sensitive adhesive composed of a resin having a (meth)acryloyl group), a urethane-based resin (a pressure-sensitive adhesive composed of a resin having a urethane bond), a rubber-based resin (a pressure-sensitive adhesive composed of a resin having a rubber structure) ), silicone resin (adhesive made of a resin having a siloxane bond), an epoxy resin (a tackifier comprising a resin having an epoxy group), polyvinyl ether, and adhesive resins such as polycarbonate, and an acrylic resin is preferred.

In addition, in the present invention, "adhesive resin" is a concept including both a resin having adhesiveness and a resin having adhesiveness, for example, not only the resin itself has adhesiveness, but also other components such as additives resins exhibiting adhesiveness when combined with and resins exhibiting adhesiveness by the presence of triggers such as heat or water are also included.

The 1st adhesive layer may contain well-known various additives, such as a filler, a colorant, an antistatic agent, antioxidant, an organic lubricant, a catalyst, and a softener (plasticizer), in addition to the main constituent materials, such as the said resin.

It is preferable that the 1st adhesive layer contains a filler among the said additive, and it is preferable that the above-mentioned thermally conductive filler is especially contained. When the first pressure-sensitive adhesive layer contains the above-described thermally conductive filler, the thermal conductivity of the first pressure-sensitive adhesive layer is increased, and the surface temperature of the double-sided tape for terminal protection using the first pressure-sensitive adhesive layer can be suppressed, and surface roughness can be suppressed.

It is preferable that it is 20-80 mass %, and, as for content of the thermally conductive filler with respect to the gross mass of a 1st adhesive layer, it is more preferable that it is 30-70 mass %. When the content of the thermally conductive filler with respect to the total mass of the first adhesive layer is at least the lower limit of the range, the thermal conductivity of the first adhesive layer increases, and the surface temperature of the double-sided tape for terminal protection using the first adhesive layer rises, and It can suppress roughness. When content of the thermally conductive filler with respect to the total mass of a 1st adhesive layer is below the upper limit of the said range, the performance as a 1st adhesive layer can be ensured.

One layer (single layer) may be sufficient as a 1st adhesive layer, and two or more layers may be sufficient as multiple layers, In the case of multiple layers, these multiple layers may mutually be same or different, and the combination of these multiple layers is not specifically limited.

It is preferable that 1st adhesive layer thickness is 1-1000 micrometers, It is more preferable that it is 2-100 micrometers, It is especially preferable that it is 5-20 micrometers.

Here, the "first adhesive layer thickness" means the thickness of the entire first adhesive layer, for example, the thickness of the first adhesive layer comprising a plurality of layers is the total thickness of all the layers constituting the first adhesive layer. means

What was formed using an energy-beam curable adhesive may be sufficient as a 1st adhesive layer, and what was formed using a non-energy-ray-curable adhesive may be sufficient as it. The first pressure-sensitive adhesive layer formed using the energy-beam-curable pressure-sensitive adhesive can easily control physical properties before and after curing.

In the present invention, the term "energy beam" means having an energy proton among electromagnetic waves or charged particle beams, and examples thereof include ultraviolet rays and electron beams.

Ultraviolet rays can be irradiated by using a high pressure mercury lamp, a fusion H lamp, a xenon lamp, etc. as an ultraviolet source, for example. The electron beam can irradiate what was generated by an electron beam accelerator etc.

In the present invention, "energy ray curability" means a property that is hardened by irradiating an energy ray, and "non-energy ray curability" means a property that does not cure even when irradiated with an energy ray.

｛First pressure-sensitive adhesive composition ｝

A 1st adhesive layer can be formed using the 1st adhesive composition containing an adhesive. For example, the 1st adhesive composition can be coated on the formation target surface of a 1st adhesive layer, and a 1st adhesive layer can be formed in the target site|part by drying as needed. Moreover, by coating a 1st adhesive composition on a peeling film and drying as needed, the 1st adhesive layer of the target thickness can be formed, and the 1st adhesive layer can also be transcribe|transferred to the target site|part. A more specific method for forming the first pressure-sensitive adhesive layer will be described in detail below along with the method for forming the other layers. The ratio of content of the components which do not vaporize at normal temperature in a 1st adhesive composition becomes the same as the ratio of content of the said components of a 1st adhesive layer normally. In addition, in this embodiment, "normal temperature" means the temperature which is not specifically cooled or heated, ie, normal temperature, for example, the temperature of 15-25 degreeC is mentioned.

The first pressure-sensitive adhesive composition may be coated by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen coater. , a method using various coaters, such as a Meyer bar coater and a Keith coater, is mentioned.

Although the drying conditions of a 1st adhesive composition are not specifically limited, When the 1st adhesive composition contains the solvent mentioned later, it is preferable to heat-dry, In this case, it is 70-130 degreeC for 10 second, for example. It is preferable to dry under the conditions of ~ 5 minutes.

When the first pressure-sensitive adhesive layer is energy-ray-curable, the first pressure-sensitive adhesive composition containing the energy-ray-curable pressure-sensitive adhesive, that is, the energy-ray-curable first pressure-sensitive adhesive composition, includes, for example, a non-energy-ray-curable pressure-sensitive adhesive resin (I- 1a) (Hereinafter, it may abbreviate as "adhesive resin (I-1a)") and the 1st adhesive composition (I-1) containing an energy-beam curable compound; An energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of the non-energy-ray-curable adhesive resin (I-1a) (hereinafter, may be abbreviated as "adhesive resin (I-2a)") 1st adhesive composition (I-2) contained; The 1st adhesive composition (I-3) etc. containing the said adhesive resin (I-2a) and an energy-beam curable low molecular compound are mentioned.

｛First pressure-sensitive adhesive composition (I-1)｝

The 1st adhesive composition (I-1) contains non-energy-ray-curable adhesive resin (I-1a) and an energy-beam curable compound as above-mentioned.

(Adhesive resin (I-1a))

It is preferable that the said adhesive resin (I-1a) is an acrylic resin.

As said acrylic resin, the acrylic polymer which has a structural unit derived from at least (meth)acrylic-acid alkylester is mentioned, for example.

One type may be sufficient as the structural unit which the said acrylic resin has, and 2 or more types may be sufficient as it, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

Examples of the (meth)acrylic acid alkyl ester include those having 1 to 20 carbon atoms in the alkyl group constituting the alkyl ester, and the alkyl group is preferably linear or branched.

More specifically, as (meth)acrylic acid alkyl ester, (meth)acrylate methyl, (meth)acrylate, (meth)acrylate n-propyl, (meth)acrylate isopropyl, (meth)acrylate n-butyl, (meth) Isobutyl acrylate, (meth)acrylic acid sec-butyl, (meth)acrylic acid tert-butyl, (meth)acrylic acid pentyl, (meth)acrylic acid hexyl, (meth)acrylic acid heptyl, (meth)acrylic acid 2-ethylhexyl, (meth) Isooctyl acrylate, (meth)acrylic acid n-octyl, (meth)acrylic acid n-nonyl, (meth)acrylic acid isononyl, (meth)acrylic acid decyl, (meth)acrylic acid undecyl, (meth)acrylic acid dodecyl ((meth)acrylate (also called lauryl acrylate), (meth)acrylic acid tridecyl, (meth)acrylic acid tetradecyl ((meth)acrylic acid myristyl), (meth)acrylic acid pentadecyl, (meth)acrylic acid hexadecyl ((meth)acrylate (also called palmityl acrylate), (meth)acrylic acid heptadecyl, (meth)acrylic acid octadecyl (also called (meth)acrylic acid stearyl.), (meth)acrylic acid nonadecyl, (meth)acrylic acid icosyl, and the like. have.

It is preferable that the said acrylic polymer has the structural unit derived from the C4 or more (meth)acrylic acid alkyl ester of the said alkyl group from the point which the adhesive force of a 1st adhesive layer improves. And it is preferable that it is 4-12, and, as for carbon number of the said alkyl group, it is more preferable that it is 4-8 at the point which the adhesive force of a 1st adhesive layer improves more. Moreover, it is preferable that carbon number of the said alkyl group is 4 or more (meth)acrylic acid alkyl esters, and it is preferable that it is an acrylic acid alkyl ester.

It is preferable that the said acrylic polymer has a structural unit derived from the functional group containing monomer other than the structural unit derived from the (meth)acrylic acid alkyl ester.

As the functional group-containing monomer, for example, when the functional group reacts with a crosslinking agent described later, it becomes a starting point of crosslinking, or the functional group reacts with an unsaturated group in the unsaturated group-containing compound to introduce an unsaturated group into the side chain of the acrylic polymer. thing can be heard

As said functional group in a functional group containing monomer, a hydroxyl group, a carboxy group, an amino group, an epoxy group, etc. are mentioned, for example.

That is, as a functional group containing monomer, a hydroxyl group containing monomer, a carboxy group containing monomer, an amino group containing monomer, an epoxy group containing monomer, etc. are mentioned, for example.

As said hydroxyl-containing monomer, (meth)acrylic acid hydroxymethyl, (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxypropyl, (meth)acrylic acid 3-hydroxypropyl, (meth)acrylic acid 3-hydroxypropyl, (meth)acrylic acid hydroxyalkyl, such as 2-hydroxybutyl (meth)acrylic acid, 3-hydroxybutyl (meth)acrylic acid, and 4-hydroxybutyl (meth)acrylic acid; Non-(meth)acrylic-type unsaturated alcohols, such as vinyl alcohol and allyl alcohol (that is, unsaturated alcohol which does not have a (meth)acryloyl skeleton), etc. are mentioned.

As said carboxyl group containing monomer, For example, ethylenically unsaturated monocarboxylic acids (monocarboxylic acid which has an ethylenically unsaturated bond), such as (meth)acrylic acid and a crotonic acid; ethylenically unsaturated dicarboxylic acids (dicarboxylic acids having an ethylenically unsaturated bond) such as fumaric acid, itaconic acid, maleic acid, and citraconic acid; anhydrides of the ethylenically unsaturated dicarboxylic acids; (meth)acrylic acid carboxyalkyl esters, such as 2-carboxyethyl methacrylate, etc. are mentioned.

The functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxyl group-containing monomer, and more preferably a hydroxyl group-containing monomer.

The number of functional group-containing monomers constituting the acrylic polymer may be one, two or more, and in the case of two or more, combinations and ratios thereof can be arbitrarily selected.

In the acrylic polymer, the content of the structural unit derived from the functional group-containing monomer is preferably 1-35 mass%, more preferably 3-32 mass%, and 5-30 mass%, based on the total amount of the structural unit. It is particularly preferred.

The said acrylic polymer may further have the structural unit derived from another monomer other than the structural unit derived from the (meth)acrylic-acid alkylester, and the structural unit derived from a functional group containing monomer.

The other monomer is not particularly limited as long as it can be copolymerized with (meth)acrylic acid alkyl ester or the like.

As said other monomer, styrene, (alpha)-methylstyrene, vinyl toluene, vinyl formate, vinyl acetate, acrylonitrile, acrylamide etc. are mentioned, for example.

One type may be sufficient as the said other monomer which comprises the said acrylic polymer, and 2 or more types may be sufficient, and when 2 or more types, these combinations and ratio can be selected arbitrarily.

The said acrylic polymer can be used as the above-mentioned non-energy-ray-curable adhesive resin (I-1a).

On the other hand, what made the functional group in the said acrylic polymer react with the unsaturated-group containing compound which has an energy-beam polymerizable unsaturated group (energy-beam polymeric group) can be used as above-mentioned energy-beam curable adhesive resin (I-2a).

In addition, in this invention, "energy-beam polymerizability" means the property of superposing|polymerizing by irradiating an energy-beam.

One type may be sufficient as adhesive resin (I-1a) which 1st adhesive composition (I-1) contains, and 2 or more types may be sufficient as it, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-1), it is preferable that content of adhesive resin (I-1a) is 5-99 mass % with respect to the gross mass of 1st adhesive composition (I-1), and 10-95 It is more preferable that it is mass %, and it is especially preferable that it is 15-90 mass %.

(energy-ray-curable compound)

As said energy-beam sclerosing|hardenable compound which 1st adhesive composition (I-1) contains, it has an energy-beam polymerizable unsaturated group, and the monomer or oligomer which can be hardened|cured by irradiation of an energy-beam is mentioned.

Among the energy ray-curable compounds, examples of the monomer include trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, and dipentaerythritol hexa(meth)acryl. polyhydric (meth)acrylates such as rate, 1,4-butyrene glycol di(meth)acrylate, and 1,6-hexanediol (meth)acrylate; urethane (meth)acrylate; polyester (meth)acrylate; polyether (meth)acrylate; Epoxy (meth)acrylate etc. are mentioned.

Among the energy ray-curable compounds, examples of the oligomer include an oligomer obtained by polymerization of the monomers exemplified above.

An energy-beam-curable compound has a comparatively large molecular weight, and urethane (meth)acrylate and a urethane (meth)acrylate oligomer are preferable at the point that it is hard to reduce the storage elastic modulus of a 1st adhesive layer.

As used herein, the term "oligomer" means a substance having a weight average molecular weight or food of 5,000 or less.

One type may be sufficient as the said energy-beam sclerosing|hardenable compound which 1st adhesive composition (I-1) contains, and 2 or more types may be sufficient, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-1), it is preferable that content of the said energy-beam sclerosing|hardenable compound is 1-95 mass % with respect to the gross mass of 1st adhesive composition (I-1), 5-90 mass % It is more preferable, and it is especially preferable that it is 10-85 mass %.

(crosslinking agent)

When using the above-mentioned acrylic polymer further having a structural unit derived from a functional group-containing monomer in addition to a structural unit derived from an alkyl (meth)acrylic acid ester as the adhesive resin (I-1a), the first adhesive composition (I-1) is a crosslinking agent It is preferable to contain more.

The said crosslinking agent reacts with the said functional group, and crosslinks adhesive resin (I-1a) with each other, for example.

Examples of the crosslinking agent include isocyanate-based crosslinking agents (crosslinking agents having an isocyanate group) such as tolylene-2,6-diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and an adduct body of such diisocyanate; Epoxy-based crosslinking agents (crosslinking agents having a glycidyl group), such as ethylene glycol glycidyl ether and N,N'-(cyclohexane-1,3-diylbismethylene)bis(glycidylamine); aziridine-based crosslinking agents (crosslinking agents having an aziridinyl group) such as hexa[1-(2-methyl)-aziridinyl]triphosphatriazine; metal chelate-based crosslinking agents such as aluminum chelates (crosslinking agents having a metal chelate structure); isocyanurate-based crosslinking agent (crosslinking agent having isocyanuric acid skeleton); and the like.

It is preferable that the crosslinking agent is an isocyanate type crosslinking agent from the point of improving the cohesive force of an adhesive to improve the adhesive force of a 1st adhesive layer, and easy availability.

One type may be sufficient as the crosslinking agent which 1st adhesive composition (I-1) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the first pressure-sensitive adhesive composition (I-1), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, with respect to 100 parts by mass of the content of the adhesive resin (I-1a), It is especially preferable that it is 1-10 mass parts.

(Photoinitiator)

The 1st adhesive composition (I-1) may contain the photoinitiator further. Even if the 1st adhesive composition (I-1) containing a photoinitiator irradiates comparatively low energy energy rays, such as an ultraviolet-ray, hardening reaction fully advances.

Examples of the photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, and the like. benzoin compounds; acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and 2,2-dimethoxy-1,2-diphenyl ethan-1-one; acyl phosphine oxide compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzyl phenyl sulfide and tetramethyl thiuram monosulfide; α-ketol compounds such as 1-hydroxycyclohexylphenyl ketone; , azo compounds such as azobis isobutyronitrile; titanocene compounds such as titanocene; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; Benzyl, dibenzyl, benzophenone, 2,4-diethylthioxanthone, 1,2-diphenyl methane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone , 2-chloroanthraquinone, and the like.

Moreover, as said photoinitiator, For example, Quinone compounds, such as 1-chloroanthraquinone; Photosensitizers, such as an amine, etc. can also be used.

One type may be sufficient as the photoinitiator which 1st adhesive composition (I-1) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the first pressure-sensitive adhesive composition (I-1), the content of the photoinitiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and more preferably 0.05 to 100 parts by mass of the content of the energy ray-curable compound. It is especially preferable that it is -5 parts by weight.

(Other additives)

The 1st adhesive composition (I-1) may contain the other additive which does not correspond to any of the above-mentioned components within the range which does not impair the effect of this invention.

Examples of the above other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments, dyes), sensitizers, tackifiers, reaction retarders, crosslinking accelerators ( catalyst) and other known additives. Moreover, when manufacturing the 1st adhesive layer containing the heat conductive filler mentioned above, 1st adhesive composition (I-1) contains a heat conductive filler as an additive.

Moreover, with a reaction retarder, crosslinking reaction which is not the objective advances in the 1st adhesive composition (I-1) in preservation|save by the action|action of the catalyst mixed in 1st adhesive composition (I-1), for example. inhibiting it from doing Examples of the reaction retardant include those that form a chelate complex by chelating with a catalyst, and more specifically, those having two or more carbonyl groups (-C(=O)-) in one molecule. can

One type may be sufficient as the other additive which 1st adhesive composition (I-1) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-1), content of another additive is not specifically limited, What is necessary is just to select suitably according to the kind.

(menstruum)

The 1st adhesive composition (I-1) may contain the solvent. The 1st adhesive composition (I-1) contains a solvent, and the coating suitability to the coating object surface improves.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; Esters, such as ethyl acetate (carboxylate ester); ethers such as tetrahydrofuran and dioxane; aliphatic hydrocarbons such as cyclohexane and n-hexane; aromatic hydrocarbons such as toluene and xylene; Alcohol, such as 1-propanol and 2-propanol, etc. are mentioned.

As said solvent, for example, what was used at the time of manufacture of adhesive resin (I-1a) may be used in 1st adhesive composition (I-1) as it is, without removing from adhesive resin (I-1a), and adhesiveness You may add separately the solvent of the same or different kind as that used at the time of manufacture of resin (I-1a) at the time of manufacture of 1st adhesive composition (I-1).

One type may be sufficient as the solvent which 1st adhesive composition (I-1) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the 1st adhesive composition (I-1), content of a solvent is not specifically limited, What is necessary is just to adjust suitably.

｛First pressure-sensitive adhesive composition (I-2)｝

1st adhesive composition (I-2) contains energy-beam curable adhesive resin (I-2a) in which the unsaturated group was introduce|transduced into the side chain of non-energy-ray-curable adhesive resin (I-1a) as mentioned above.

(Adhesive resin (I-2a))

The said adhesive resin (I-2a) is obtained by making the functional group in adhesive resin (I-1a) react with the unsaturated group containing compound which has an energy-beam polymerizable unsaturated group, for example.

The said unsaturated group containing compound is a compound which further has a group which can couple|bond with adhesive resin (I-1a) by reacting with the functional group in adhesive resin (I-1a) other than the said energy-beam polymerizable unsaturated group.

Examples of the energy-beam polymerizable unsaturated group include a (meth)acryloyl group, a vinyl group (also called an ethenyl group), an allyl group (also called a 2-propenyl group.), and the like, (meth) An acryloyl group is preferable.

Examples of the group capable of bonding with a functional group in the adhesive resin (I-1a) include an isocyanate group and a glycidyl group capable of bonding with a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding with a carboxy group or an epoxy group. can be heard

As said unsaturated group containing compound, (meth)acryloyloxyethyl isocyanate, (meth)acryloyl isocyanate, glycidyl (meth)acrylate etc. are mentioned, for example, (meth)acryloyl Oxyethyl isocyanate is preferable, and 2-methacryloyloxyethyl isocyanate is especially preferable.

The isocyanate compound is capable of bonding to a hydroxyl group in the adhesive resin (I-1a), and when the total hydroxyl groups in the adhesive resin (I-1a) are 100 mol, the amount of the isocyanate compound used is 10 to 150 mol. It is preferable, 20-140 mol is more preferable, 30-130 mol is still more preferable.

One type may be sufficient as adhesive resin (I-2a) which 1st adhesive composition (I-2) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-2), it is preferable that content of adhesive resin (I-2a) is 5-99 mass % with respect to the gross mass of 1st adhesive composition (I-2), 10-95 It is more preferable that it is mass %, and it is especially preferable that it is 10-90 mass %.

(crosslinking agent)

When using the said acrylic polymer which has the structural unit derived from the functional group containing monomer similar to that in adhesive resin (I-1a) as adhesive resin (I-2a), 1st adhesive composition (I-2), for example Silver may further contain a crosslinking agent.

As said crosslinking agent in 1st adhesive composition (I-2), the same thing as the crosslinking agent in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the crosslinking agent which 1st adhesive composition (I-2) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the first pressure-sensitive adhesive composition (I-2), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, with respect to 100 parts by mass of the content of the adhesive resin (I-2a), It is especially preferable that it is 1-10 mass parts.

(Photoinitiator)

The 1st adhesive composition (I-2) may contain the photoinitiator further. Even if the 1st adhesive composition (I-2) containing a photoinitiator irradiates comparatively low energy energy rays, such as an ultraviolet-ray, hardening reaction fully advances.

As said photoinitiator in 1st adhesive composition (I-2), the thing similar to the photoinitiator in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the photoinitiator which 1st adhesive composition (I-2) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the first pressure-sensitive adhesive composition (I-2), the content of the photoinitiator is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass with respect to 100 parts by mass of the content of the adhesive resin (I-2a). , it is particularly preferably 0.05 to 5 parts by mass.

(Other additives)

The 1st adhesive composition (I-2) may contain the other additive which does not correspond to any component mentioned above within the range which does not impair the effect of this invention.

As said other additive in 1st adhesive composition (I-2), the thing similar to the other additive in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the other additive which 1st adhesive composition (I-2) contains, and 2 or more types may be sufficient, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-2), content of another additive is not specifically limited, What is necessary is just to select suitably according to the kind.

(menstruum)

The 1st adhesive composition (I-2) may contain the solvent for the objective similar to the case of 1st adhesive composition (I-1).

As said solvent in 1st adhesive composition (I-2), the thing similar to the solvent in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the solvent which 1st adhesive composition (I-2) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-2), content of a solvent is not specifically limited, What is necessary is just to adjust suitably.

｛First pressure-sensitive adhesive composition (I-3)｝

The 1st adhesive composition (I-3) contains the said adhesive resin (I-2a) and an energy-beam curable low molecular weight compound as above-mentioned.

In 1st adhesive composition (I-3), it is preferable that content of adhesive resin (I-2a) is 5-99 mass % with respect to the gross mass of 1st adhesive composition (I-3), and 10-95 It is more preferable that it is mass %, and it is especially preferable that it is 15-90 mass %.

(energy-ray-curable low molecular weight compound)

As said energy-beam curable low molecular compound which 1st adhesive composition (I-3) contains, the monomer and oligomer which have an energy-beam polymerizable unsaturated group and can be hardened by irradiation of an energy-beam are mentioned, 1st adhesive composition The same thing as the energy-beam curable compound which (I-1) contains is mentioned.

One type may be sufficient as the said energy-beam-curable low molecular compound which 1st adhesive composition (I-3) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the first pressure-sensitive adhesive composition (I-3), the content of the energy ray-curable low-molecular compound is preferably 0.01 to 300 parts by mass, and 0.03 to 200 parts by mass with respect to 100 parts by mass of the content of the adhesive resin (I-2a). It is more preferable, and it is especially preferable that it is 0.05-100 mass parts.

(Photoinitiator)

The 1st adhesive composition (I-3) may contain the photoinitiator further. Even if the 1st adhesive composition (I-3) containing a photoinitiator irradiates comparatively low energy energy rays, such as an ultraviolet-ray, hardening reaction fully advances.

As said photoinitiator in 1st adhesive composition (I-3), the thing similar to the photoinitiator in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the photoinitiator which 1st adhesive composition (I-3) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the first pressure-sensitive adhesive composition (I-3), the content of the photoinitiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable low-molecular compound, 0.03 It is more preferable that it is -10 mass parts, and it is especially preferable that it is 0.05-5 mass parts.

(Other additives)

The 1st adhesive composition (I-3) may contain the other additive which does not correspond to any component mentioned above within the range which does not impair the effect of this invention.

As said other additive, the thing similar to the other additive in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the other additive which 1st adhesive composition (I-3) contains, and 2 or more types may be sufficient as them, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In 1st adhesive composition (I-3), content of another additive is not specifically limited, What is necessary is just to select suitably according to the kind.

(menstruum)

The 1st adhesive composition (I-3) may contain the solvent for the objective similar to the case of 1st adhesive composition (I-1).

As said solvent in 1st adhesive composition (I-3), the same thing as the solvent in 1st adhesive composition (I-1) is mentioned.

One type may be sufficient as the solvent which 1st adhesive composition (I-3) contains, and 2 or more types may be sufficient as it, and when 2 or more types, these combinations and a ratio can be selected arbitrarily.

In the 1st adhesive composition (I-3), content of a solvent is not specifically limited, What is necessary is just to adjust suitably.

｛First adhesive composition other than (I-1) to (I-3) ｝

Up to now, although the 1st adhesive composition (I-1), the 1st adhesive composition (I-2), and the 1st adhesive composition (I-3) were mainly demonstrated, what demonstrated as these containing components is these 3 types Even if it is general 1st adhesive composition (in this embodiment, "1st adhesive composition other than 1st adhesive composition (I-1) - (I-3)" is called) other than a 1st adhesive composition, it can use similarly.

As 1st adhesive composition other than 1st adhesive composition (I-1) - (I-3), the 1st adhesive composition of non-energy-ray-curable other than energy-beam curable 1st adhesive composition is also mentioned.

As a non-energy-ray-curable 1st adhesive composition, For example, an acrylic resin (resin which has a (meth)acryloyl group), a urethane resin (resin which has a urethane bond), a rubber-type resin (resin which has a rubber structure), Those containing a silicone-based resin (resin having a siloxane bond), an epoxy-based resin (resin having an epoxy group), polyvinyl ether, or an adhesive resin such as polycarbonate are mentioned, and it is preferable to contain an acrylic resin.

It is preferable that the 1st adhesive composition other than 1st adhesive composition (I-1) - (I-3) contains 1 type(s) or 2 or more types of crosslinking agents, and the content is the above-mentioned 1st adhesive composition (I-) 1) can be done in the same way.

<The manufacturing method of a 1st adhesive composition>

Said 1st adhesive compositions, such as 1st adhesive composition (I-1) - (I-3), each component for comprising the said adhesive and components other than the said adhesive as needed, for constituting a 1st adhesive composition It is obtained by mixing.

At the time of mixing|blending each component, the order of addition is not specifically limited, You may add 2 or more types of components simultaneously.

In the case of using a solvent, the solvent may be mixed with some compounding components other than the solvent, and this compounding component may be diluted in advance, and some compounding components other than the solvent are not diluted in advance, and the solvent is mixed with these compounding components. It can also be used as

The method of mixing each component at the time of mixing|blending is not specifically limited, The method of rotating a stirrer, a stirring blade, etc. and mixing; a method of mixing using a mixer; What is necessary is just to select suitably from well-known methods, such as the method of adding ultrasonic waves and mixing.

The temperature and time at the time of addition and mixing of each component are not specifically limited as long as each compounding component does not deteriorate, What is necessary is just to adjust suitably, It is preferable that the temperature is 15-30 degreeC.

｛ Composition of the first pressure-sensitive adhesive layer ｝

In this embodiment, the composition of the 1st adhesive layer removes a solvent from the 1st adhesive layer composition mentioned above.

In the first pressure-sensitive adhesive layer (I-1) in the case where the first pressure-sensitive adhesive layer composition is the first pressure-sensitive adhesive composition (I-1), the adhesive resin (I-) with respect to the total mass of the first pressure-sensitive adhesive layer (I-1) It is preferable that the content rate of 1a) is 50-99 mass %, It is more preferable that it is 55-95 mass %, It is more preferable that it is 60-90 mass %. Further, in another aspect of the present invention, the content ratio of the pressure-sensitive adhesive resin (I-1a) with respect to the total mass of the first pressure-sensitive adhesive layer (I-1) may be 25 to 80% by mass, or 30 to 75% by mass It is good, and 35-70 mass % may be sufficient. Moreover, it is preferable that it is 1-50 mass %, as for the content rate of an energy-beam curable compound with respect to the gross mass of a 1st adhesive layer (I-1), It is more preferable that it is 2-48 mass %, 5-45 mass % is more preferable. When the first adhesive layer (I-1) contains a crosslinking agent, the content ratio of the crosslinking agent with respect to the total mass of the first adhesive layer (I-1) is preferably 0.1 to 10 mass%, and 0.2 to 9 mass% It is more preferable that it is 0.3-8 mass %, and it is still more preferable.

In the first adhesive layer (I-2) in the case where the first adhesive layer composition is the first adhesive composition (I-2), the adhesive resin (I-) with respect to the total mass of the first adhesive layer (I-2) It is preferable that the content rate of 2a) is 70-100 mass %, It is more preferable that it is 75-100 mass %, It is still more preferable that it is 80-100 mass %, It is especially preferable that it is 80-99.6 mass %. When the 1st adhesive layer (I-2) contains a crosslinking agent, it is preferable that the content rate of the crosslinking agent with respect to the total mass of the 1st adhesive layer (I-2) is 0.1-10 mass %, and 0.2-9 mass % is more preferable, and it is still more preferable that it is 0.3-8 mass %.

In the first adhesive layer (I-3) in the case where the first adhesive layer composition is the first adhesive composition (I-3), the adhesive resin (I-) with respect to the total mass of the first adhesive layer (I-3) It is preferable that it is 50-99 mass %, as for the content rate of 2a), it is more preferable that it is 55-95 mass %, It is more preferable that it is 60-90 mass %. Moreover, it is preferable that it is 1-50 mass %, as for the content rate of the energy-beam curable low molecular compound with respect to the total mass of 1st adhesive layer (I-3), It is more preferable that it is 2-48 mass %, 5-45 It is more preferable that it is mass %. When the 1st adhesive layer (I-3) contains a crosslinking agent, it is preferable that the content ratio of the crosslinking agent with respect to the total mass of the 1st adhesive layer (I-3) is 0.1-10 mass %, 0.2-9 mass % It is more preferable that it is 0.3-8 mass %, and it is still more preferable.

In this embodiment, it is preferable that it is the 1st adhesive layer (I-2) containing adhesive resin (I-2a) and a crosslinking agent. In this case, the adhesive resin (I-2a) is an acrylic polymer having a structural unit derived from a (meth)acrylic acid alkyl ester and a unit derived from a hydroxyl group-containing monomer, an unsaturated group-containing compound having an isocyanate group and an energy ray polymerizable unsaturated group. It is preferable that it is an acrylic polymer obtained by making it react. As the crosslinking agent, the compound illustrated in the first pressure-sensitive adhesive composition (I-1) can be used, and tolylene-2,6-diisocyanate is particularly preferably used.

It is preferable that the content rate of the structural unit derived from (meth)acrylic acid alkyl ester with respect to the total mass of adhesive resin (I-2a) is 50-99 mass %, It is more preferable that it is 60-98 mass %, It is 70- It is more preferable that it is 97 mass %. The content ratio of the unit derived from the hydroxyl group-containing monomer with respect to the total mass of the adhesive resin (I-2a) is preferably 0.5 to 15 mass%, more preferably 1.0 to 10 mass%, and 2.0 to 10 mass% it is more preferable It is preferable that carbon number of an alkyl group is 1-12, and, as for the (meth)acrylic acid alkyl ester in adhesive resin (I-2a), it is more preferable that it is 1-4. It is preferable that the adhesive resin (I-2a) has structural units derived from two or more types of (meth)acrylic acid alkyl esters, and it is more preferable to have structural units derived from methyl (meth)acrylate and n-butyl (meth)acrylate. and more preferably have structural units derived from methyl methacrylate and n-butyl acrylate. As the hydroxyl group-containing monomer in the adhesive resin (I-2a), those exemplified in the aforementioned adhesive resin (I-1a) can be used, and 2-hydroxyethyl acrylate is particularly preferably used. As an unsaturated group containing compound which has an isocyanate group and an energy-beam polymerizable unsaturated group, the compound illustrated by 1st adhesive composition (I-2) can be used, It is especially preferable to use 2-methacryloyloxyethyl isocyanate. do. When the total hydroxyl groups derived from the hydroxyl group-containing monomer are 100 mol, the amount of the unsaturated group-containing compound having an isocyanate group and an energy-beam polymerizable unsaturated group is preferably 20 to 80 mol, more preferably 25 to 75 mol preferred, more preferably 30 to 70 mol.

◎Peeling film

The said release film may be a well-known thing in this field|area.

Preferred examples of the release film include those in which at least one surface of a film made of a resin such as polyethylene terephthalate is subjected to a release treatment by silicone treatment or the like; The thing in which the at least one surface of a film becomes the peeling surface comprised from polyolefin, etc. are mentioned.

It is preferable that the thickness of a peeling film is the same as the thickness of a base material.

◎Second adhesive layer

A 2nd adhesive layer (namely, bonding adhesive layer) is an adhesive layer for bonding the double-sided tape for terminal protection of this embodiment to a support body.

The said 2nd adhesive layer may be a well-known thing in this field|area, and can select suitably according to a support body from what was demonstrated with the above-mentioned 1st adhesive layer.

It is preferable that the 2nd adhesive layer thickness is 5-50 micrometers, It is more preferable that it is 10-45 micrometers, It is especially preferable that it is 15-40 micrometers.

Here, the "second pressure-sensitive adhesive layer thickness" means the thickness of the entire second pressure-sensitive adhesive layer, for example, the thickness of the second pressure-sensitive adhesive layer comprising a plurality of layers is the total thickness of all the layers constituting the second pressure-sensitive adhesive layer. means

The 2nd adhesive composition for forming a 2nd adhesive layer is the same as that of the said 1st adhesive composition, The manufacturing method of a 2nd adhesive composition is also the same as the manufacturing method of the said 1st adhesive composition.

It is preferable that the above-mentioned adhesive resin (I-1a) is included as a 2nd adhesive layer.

In this case, it is preferable that the content rate of the adhesive resin (I-1a) with respect to the total mass of a 2nd adhesive layer is 70-100 mass %, It is more preferable that it is 75-100 mass %, It is 80-100 mass % It is more preferable, and it is especially preferable that it is 80 to 99.98 mass %. Moreover, the 2nd adhesive layer may contain the crosslinking agent further. It is preferable that the content rate of the crosslinking agent with respect to the total mass of a 2nd adhesive layer is 0.005-0.1 mass %, It is more preferable that it is 0.01-0.09 mass %, It is more preferable that it is 0.015-0.08 mass %. Moreover, it is preferable that adhesive resin (I-1a) is an acrylic polymer which has the structural unit derived from (meth)acrylic-acid alkylester, and the unit derived from a carboxyl group-containing monomer. The crosslinking agent mentioned above can be used as a crosslinking agent, It is especially preferable to use an isocyanate type crosslinking agent.

It is preferable that the content ratio of the structural unit derived from the (meth)acrylic acid alkyl ester with respect to the total mass of adhesive resin (I-1a) is 70-100 mass %, It is more preferable that it is 75-100 mass %, It is 80- It is more preferable that it is 100 mass %. The content ratio of the structural unit of the carboxyl group-containing monomer with respect to the total mass of the adhesive resin (I-1a) is preferably 0 to 20 mass%, more preferably 0.5 to 19 mass%, and 0.7 to 18 mass% It is more preferable, and it is especially preferable that it is 1.0-17 mass %. It is preferable that carbon number of an alkyl group is 4-12, and, as for the (meth)acrylic acid alkyl ester in adhesive resin (I-1a), it is more preferable that it is 4-8. Moreover, in the adhesive resin (I-1a), it is preferable that it is an acrylic acid alkyl ester. Among them, the (meth)acrylic acid alkyl ester is particularly preferably n-butyl acrylate. Examples of the carboxy-containing monomer in the adhesive resin (I-1a) include an anhydride of ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid, and ethylenically unsaturated dicarboxylic acid, among them An ethylenically unsaturated monocarboxylic acid is preferable, (meth)acrylic acid is more preferable, and acrylic acid is especially preferable.

It is preferable that it is 100,000-800,000, as for the weight average molecular weight of adhesive resin (I-1a) of this embodiment, it is more preferable that it is 150,000-700,000, It is more preferable that it is 200,000-600,000.

◇Manufacturing method of double-sided tape for terminal protection

The said double-sided tape for terminal protection can be manufactured by laminating|stacking each layer mentioned above one by one so that it may become a corresponding positional relationship. The method of forming each layer is as described above.

For example, a embedding layer is laminated|stacked on the peeling process surface of a peeling film by coating the above-mentioned composition for embedding layer formation and drying as needed. On the peeling process surface of another peeling film, the 1st adhesive composition mentioned above is coated, and a 1st adhesive layer is laminated|stacked by drying as needed. By bonding the embedding layer on a peeling film together with the 1st adhesive layer on another peeling film, the tape for terminal protections on which the peeling film, the embedding layer, the 1st adhesive layer, and the peeling film were laminated|stacked in this order is obtained. What is necessary is just to remove a peeling film at the time of use of the tape for terminal protections.

Next, the release film on the side of the embedding layer of the terminal protection tape in which the above-described release film, embedding layer, first pressure-sensitive adhesive layer and release film were laminated in this order is peeled off, and this is bonded to the base material, whereby the embedding layer, the first The tape for terminal protection in which the adhesive layer and the peeling film were laminated|stacked in this order can be obtained.

Moreover, a embedding layer is laminated|stacked on a base material by extrusion-molding the composition for embedding|flush-mounting layer formation with respect to a base material, for example. On the peeling process surface of a peeling film, a 1st adhesive layer is laminated|stacked by coating the above-mentioned 1st adhesive composition and drying as needed. And also by bonding together the 1st adhesive layer on this peeling film with the embedding layer on a base material, the tape for terminal protection in which the embedding layer, the 1st adhesive layer, and the peeling film were laminated|stacked in this order on the base material can be obtained.

The above-mentioned terminal protection tape in which a buried layer, a first pressure-sensitive adhesive layer, and a release film were laminated in this order on a substrate is prepared. On the peeling process surface of another peeling film, the 2nd adhesive composition mentioned above is coated, and a 2nd adhesive layer is laminated|stacked by drying as needed. And by bonding the 2nd adhesive layer on this peeling film with the base material of the said terminal protection tape, a peeling film, a 2nd adhesive layer, a base material, a embedding layer, a 1st adhesive layer, and a peeling film were laminated|stacked in this order of this embodiment. Double-sided tape for terminal protection can be obtained. What is necessary is just to remove a peeling film at the time of use of the double-sided tape for terminal protection.

In the manufacturing method described above, the double-sided tape for terminal protection provided with layers other than the respective layers described above, in any one or both of the forming process of the other layer and the laminating process, so that the lamination position of the other layer is an appropriate position. It can be manufactured by adding suitably and carrying out.

◇Method for manufacturing a semiconductor device having an electromagnetic shielding film

The double-sided tape for terminal protection of this embodiment can be used for the manufacturing method of the semiconductor device which has the following electromagnetic shielding films, for example.

3 is a method for manufacturing a semiconductor device having an electromagnetic wave shielding film of the present embodiment, comprising a first pressure-sensitive adhesive layer 14, a buried layer 13, a substrate 11, and a second pressure-sensitive adhesive layer 15 in this order. It is sectional drawing which shows typically one Embodiment at the time of fixing the double-sided tape 1 for terminal protection to the support body 30, and manufacturing the semiconductor device which has an electromagnetic wave shielding film.

First, as shown in Figs. 3 (a) and (b), a semiconductor device 65 having a terminal on the viscoelastic layer 12 of the double-sided tape for terminal protection is attached to the terminal 91 side, that is, the circuit board 63 . is pressed with the terminal forming surface 63a facing down, and the terminal 91 is embedded in the viscoelastic layer 12 .

At this time, the viscoelastic layer 12 is brought into contact with the terminals 91 of the semiconductor device 65 having the terminals, and the semiconductor device 65 having the terminals is pressed against the double-sided tape for protecting the terminals. For this reason, the outermost surface of the 1st adhesive layer 14 side of the viscoelastic layer 12 is crimped|bonded sequentially to the surface of the terminal 91 and the terminal formation surface 63a of the circuit board 63. As shown in FIG. At this time, by heating the viscoelastic layer 12 , the viscoelastic layer 12 softens and spreads between the terminals 91 so as to cover the terminals 91 , and adheres to the terminal forming surface 63a , while simultaneously adhering to the terminals 91 . ), in particular, the surface of a portion near the terminal formation surface 63a is covered, and the terminal 91 is embedded.

As a method of crimping the semiconductor device 65 having terminals to the double-sided tape for protecting terminals, a known method of affixing various sheets by crimping them to an object can be applied, for example, a method using a lamination roller or a vacuum laminator. and the like.

Although the pressure at the time of crimping|bonding the semiconductor device 65 which has a terminal to the double-sided tape for terminal protection is not specifically limited, It is preferable that it is 0.1-1.5 MPa, It is more preferable that it is 0.3-1.3 MPa. 30-70 degreeC is preferable, as for heating temperature, 35-65 degreeC is more preferable, and its 40-60 degreeC is especially preferable. Moreover, it is preferable to bond the 1st adhesive layer 14 of the viscoelastic layer 12 to the terminal formation surface 63a.

Conductive resin 101 is applied to the exposed surface of the semiconductor device 65 having the terminals not embedded in the viscoelastic layer 12 of the double-sided tape for terminal protection (FIG. 3(c)) and further thermosetted to conduct conductive An electromagnetic wave shielding film 10 made of a material is formed (Fig. 3(d)). As a method of forming the electromagnetic shielding film 10 by coating with a conductive material, a method such as sputtering, ion plating, or spray coating can be used.

As a sputtering method, a well-known sputtering method in this field|area, such as DC sputtering, RF sputtering, DC magnetron sputtering, and ion beam sputtering, can be employ|adopted.

The said double-sided tape for terminal protection has a viscoelastic layer, a base material, and a 2nd adhesive layer, and at least 1 layer among the said viscoelastic layer, the said base material, and the said 2nd adhesive layer is a heat conductive layer, Sputtering which apply|coats a conductive resin, Also in the electromagnetic shielding film formation process by methods, such as ion plating and spray coating, a rise in the surface temperature of the said double-sided tape for terminal protection and surface roughness can be suppressed.

By picking up the semiconductor device 66 having the electromagnetic shielding film from the double-sided tape 1 for protecting the terminals of the present embodiment, the semiconductor device 66 having the electromagnetic shielding film covered with the electromagnetic shielding film 10 can be taken out (Fig. 3(e)).

In the method for manufacturing a semiconductor device having an electromagnetic shielding film shown in FIG. 3 , the semiconductor device 65 having a terminal to be subjected to the electromagnetic shielding may be a semiconductor device 65 having a terminal manufactured individually, or according to a dicing method The semiconductor device 65 having separate terminals may be used.

In the method for manufacturing a semiconductor device having an electromagnetic shielding film shown in FIG. 3 , the semiconductor device 65 having a terminal in which the individual electronic components 61 and 62 are encapsulated with a sealing resin 64 are separated into pieces with double-sided tape for terminal protection. Although the method of electromagnetic wave shielding was shown using (1), the semiconductor device which has a terminal using the double-sided tape 1 for terminal protection from the semiconductor device assembly 6 which has a terminal before fragmentation as follows as follows. (65) can also be electromagnetic shielding.

4 and 5 are a method of manufacturing a semiconductor device having an electromagnetic wave shielding film of the present embodiment, wherein the first adhesive layer 14, the buried layer 13, the substrate 11, and the second adhesive layer 15 are formed in this order. It is sectional drawing which shows typically other embodiment of the method of electromagnetic wave shielding the semiconductor device 65 which has a terminal using the double-sided tape 1 for terminal protection.

First, as shown in Figs. 4(a) and (b), a semiconductor device assembly 6 having a terminal connected by a circuit board 63 to a viscoelastic layer 12 of a double-sided tape for terminal protection is applied to a terminal 91 . ) side, that is, the terminal formation surface 63a of the circuit board 63 is pressed down, and the terminal 91 is embedded in the viscoelastic layer 12 as in the case of FIGS. 3(a) and (b). .

At this time, while applying pressure from the upper side to the semiconductor device assembly 6 having the terminals, as in the case of Figs. 3(a) and (b), the terminal 91 is applied to the viscoelastic layer 12 of the double-sided tape for terminal protection. to bury

Further, by bonding the viscoelastic layer 12 while heating, the viscoelastic layer 12 can be softened and the viscoelastic layer 12 can be brought into close contact with the terminal formation surface 63a of the circuit board 63 . Although the pressure at the time of crimping|bonding the semiconductor device assembly 6 which has a terminal to the double-sided tape for terminal protection is although it does not specifically limit, It is preferable that it is 0.1-1.5 MPa, It is more preferable that it is 0.3-1.3 MPa. 30-70 degreeC is preferable, as for heating temperature, 35-65 degreeC is more preferable, and its 40-60 degreeC is especially preferable. Moreover, it is preferable to bond the 1st adhesive layer 14 of the viscoelastic layer 12 to the terminal formation surface 63a.

Next, the semiconductor device assembly 6 having terminals is diced to obtain a semiconductor device 65 having terminals (Fig. 4(c)). The double-sided tape for terminal protection of this embodiment used for the process of forming an electromagnetic shielding film will serve also as a dicing tape of the semiconductor device assembly 6 which has a terminal. Incidentally, in the method for manufacturing a semiconductor device having an electromagnetic shielding film shown in FIG. 3 , when the semiconductor device 65 having a terminal to be subjected to the electromagnetic shielding is a semiconductor device 65 having terminals separated by a dicing method, , the operation of picking up the semiconductor device having the terminals on the dicing tape and replacing it with the double-sided tape for terminal protection (Fig. 3(a)) is required. On the other hand, in the manufacturing method of the semiconductor device which has an electromagnetic shielding film shown in FIG. 4, the operation|work of pasting and replacing the semiconductor device 65 which has a terminal on a dicing tape to the double-sided tape for terminal protection can be abbreviate|omitted.

Next, the release tape 22 is removed, and the double-sided tape for terminal protection is fixed on the support 30 through the second adhesive layer 15 . Then, the conductive resin 101 is applied to the exposed surface of the semiconductor device 65 having the terminals not embedded in the viscoelastic layer 12 of the double-sided tape for protecting terminals (Fig. 4(d)). At this time, if the separation of the conductive resin 101 at the boundary of the semiconductor device 65 having each terminal of the semiconductor device assembly 6 having terminals is insufficient, the double-sided tape for terminal protection is removed using an extension device or the like. You can extend it. In a state in which the conductive resin 101 is applied to each side surface of the semiconductor device 65 having the individual terminals, the semiconductor device 65 having the individual terminals can be divided into pieces. In addition, a semiconductor device having terminals not embedded in the viscoelastic layer 12 of the double-sided tape for terminal protection by heating and curing the conductive resin 101 applied to the top and side surfaces of the semiconductor device 65 having individualized terminals. An electromagnetic wave shielding film 10 made of a conductive material is formed on the exposed surface at (65) (Fig. 4(e)). The electromagnetic wave shielding film 10 may be formed directly on the semiconductor device 65 (Fig. 4(c)) having terminals by sputtering, ion plating, spray coating, or the like of a conductive material (Fig. 4(e)). . When the conductive material is applied by a method such as sputtering, ion plating, or spray coating, the temperature of the conductive material is room temperature to 250°C.

The double-sided tape for terminal protection has a viscoelastic layer 12 , a substrate 11 , and a second adhesive layer 15 , and the viscoelastic layer 12 , the substrate 11 , and the second adhesive layer 15 . ), in the electromagnetic shielding film forming step by a method such as sputtering ion plating or spray coating in which at least one layer is a heat conductive layer, applying a conductive resin, increase in the surface temperature of the double-sided tape for terminal protection, and can be suppressed

By picking up the semiconductor device 66 having the electromagnetic shielding film from the double-sided tape for protecting the terminals of the present embodiment, the semiconductor device 65 having the terminals covered with the electromagnetic shielding film 10 can be taken out (Fig. 4(f)). ).

In addition, as shown in Figs. 5 (a) to (c), the step of embedding the terminal 91 in the viscoelastic layer 12 of the double-sided tape for terminal protection described above, and dicing the semiconductor device assembly 6 having the terminal , you may perform the process of setting it as the semiconductor device 65 which has a terminal on the double-sided tape for terminal protection fixed on the support body 30 via the 2nd adhesive layer 15.

In the double-sided tape for terminal protection of this embodiment, it is preferable that the height h0 of the terminal 91 is lower than the thickness d1 of the viscoelastic layer 12, and it is preferable that it is 1.2≤　d1/h0　≤5.0. Specifically, it is preferable that the height of the terminal 91 is 20-300 micrometers, It is more preferable that it is 30-270 micrometers, It is especially preferable that it is 40-240 micrometers. When the height of the terminal 91 is equal to or greater than the lower limit, the function of the terminal 91 can be further improved. In addition, when the height of the terminal 91 is equal to or less than the upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 in the upper portion of the terminal 91 becomes higher.

In addition, in this specification, the "height of a terminal" means the height at the site|part which exists in the highest position on the terminal formation surface among terminals. When the semiconductor device assembly 6 having terminals and the semiconductor device 65 having terminals have a plurality of terminals 91 , the height h0 of the terminals 91 can be the average thereof. The height of the terminal can be measured with, for example, a non-contact three-dimensional optical interference type surface roughness meter (manufactured by Veeco, Japan, trade name: Wyko NT1100).

Although the width|variety of the terminal 91 is not specifically limited, It is preferable that it is 170-350 micrometers, It is more preferable that it is 200-320 micrometers, It is especially preferable that it is 230-290 micrometers. When the width of the terminal 91 is equal to or greater than the lower limit, the function of the terminal 91 can be further improved. In addition, when the width of the terminal 91 is equal to or less than the upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper portion of the terminal 91 becomes higher.

In addition, in this specification, the "width of a terminal" means the maximum value of a line segment obtained by connecting two other points on the terminal surface with a straight line when looking down at the terminal in a direction perpendicular to the terminal formation surface in a plan view. When the terminal is spherical or hemispherical, the term "terminal width" refers to the maximum diameter (terminal diameter) of the terminal when viewed from the bottom of the terminal.

The distance between adjacent terminals 91 (that is, the pitch between terminals) is not particularly limited, but is preferably 250 to 800 µm, more preferably 300 to 600 µm, and particularly preferably 350 to 500 µm. do. When the distance is equal to or greater than the lower limit, the embedding of the terminal 91 can be further improved. In addition, when the distance is equal to or less than the upper limit, the effect of suppressing the remaining of the viscoelastic layer 12 on the upper portion of the terminal 91 becomes higher.

In addition, in this specification, the "distance between mutually adjacent terminals" means the minimum value of the distance between the surfaces of mutually adjacent terminals.

Example

Hereinafter, the present invention will be described in more detail by way of specific examples. However, this invention is not limited in any way to the Example shown below.

<monomer>

The formal names of the abbreviated monomers are shown below.

HEA: Acrylic acid 2-hydroxyethyl

BA: n-butyl acrylate

MMA: Methyl methacrylate

AAc: Acrylic acid

(Preparation of composition A for forming a second pressure-sensitive adhesive layer)

(시클로헥산-1, 3-디일비스메틸렌) 비스(글리시딜아민)(농도 5%, MITSUBISHI GAS CHEMICAL COMPANY, INC. 제, 제품명 「TETRAD－C」) 0.2 질량부를 첨가하고, 30분간 교반을 행해 제2점착제층 형성용 조성물 A를 조제하였다.A solution of an acrylic copolymer consisting of 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive main agent, solid content concentration 33.6%, NIPPON CARBIDE INDUSTRIES CO., INC., product name "Nissetsu PE-121") With respect to 100 parts by mass, N,N' as a crosslinking agent

(Cyclohexane-1,3-diylbismethylene) bis(glycidylamine) (concentration 5%, manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., product name "TETRAD-C") 0.2 parts by mass was added, followed by stirring for 30 minutes. It performed and prepared the composition A for 2nd adhesive layer formation.

(Preparation of the second pressure-sensitive adhesive layer A)

The composition A for forming the second pressure-sensitive adhesive layer was coated on the release-treated surface of the release film (“SP-PET381031” manufactured by Lintec Corporation, 38 μm thick) in which one side of the polyethylene terephthalate film was subjected to release treatment by silicone treatment, , a second pressure-sensitive adhesive layer A having a thickness of 20 μm was prepared by drying by heating at 100° C. for 1 minute.

(Preparation of composition B for forming the first pressure-sensitive adhesive layer)

To the acrylic copolymer consisting of 74 parts by mass of BA, 20 parts by mass of MMA, and 6 parts by mass of HEA, a solution of a resin in which 2-methacryloyloxyethyl isocyanate (about 50 mol% with respect to HEA) is added (weight average molecular weight ( Mw) 500,000, an adhesive main ingredient, 35 mass % of solid content, Nippon Synthetic Chem Industry Co., Ltd. make, product name "COPONYL UN-4730-D") 100 parts by mass of tolylene-2 as a crosslinking agent; 0.5 mass parts of 6-diisocyanate (manufactured by TOYOCHEM CO., LTD., product name "BHS-8515", solid content concentration: 37.5%) was added, and it stirred for 30 minutes, and the composition B for 1st adhesive layer formation was prepared.

(Preparation of the first pressure-sensitive adhesive layer B)

The composition B for forming the first pressure-sensitive adhesive layer is coated on the release-treated surface of the release film (“SP-PET381031” manufactured by Lintec Corporation, 38 μm thick) in which one side of the polyethylene terephthalate film has been subjected to release treatment by silicone treatment, , a first pressure-sensitive adhesive layer B having a thickness of 10 μm was prepared by heating and drying at 100° C. for 1 minute.

(Preparation of composition A for forming a buried layer)

A solution of an acrylic copolymer comprising 91 parts by mass of BA and 9 parts by mass of AAc (weight average molecular weight (Mw) 500,000, adhesive main agent, solid content concentration 33.6%, NIPPON CARBIDE INDUSTRIES CO., INC., product name "Nisssetsu PE-121") A resin obtained by adding 2-methacryloyloxyethyl isocyanate to an acrylic copolymer consisting of 100 parts by mass, 62 parts by mass of BA, 10 parts by mass of MMA, and 28 parts by mass of HEA so that the addition ratio is 80 mol% with respect to 100 mol% of HEA. Solution (weight average molecular weight (Mw) 370,000, adhesive main agent, solid content concentration 45%, Nippon Synthetic Chem Industry Co., Ltd. product name "COPONYL UN-2528 LM1") 75 parts by mass and tolylene-2, 6 as a crosslinking agent - 15 mass parts of diisocyanate (TOYOCHEM CO., LTD. make, product name "BHS-8515", solid content concentration: 37.5%) was added, it stirred for 30 minutes, and the composition A for embedding|flush-mounting layer formation was prepared.

(Reference A)

The adhesive was apply|coated to the polyethylene terephthalate (PET) film (25 micrometers in thickness) so that adhesive layer thickness might be set to 22 micrometers, 9 micrometers-thick copper foil was bonded together, and the base material A was obtained. In addition, in formation of an adhesive layer, 46 mass parts of BA, 37 mass parts of 2-ethylhexyl acrylate, 9 mass parts of vinyl acetate, 6 mass parts of AAc, and the acrylic copolymer which consists of 2 mass parts of maleic anhydride (adhesive main agent, solid content concentration) 30%) To 100 parts by mass, 2.18 parts by mass of tolylene-2,6-diisocyanate (manufactured by TOYOCHEM CO., LTD., product name "BHS-8515", solid content concentration: 37.5%) as a crosslinking agent is added, and 30 minutes The pressure-sensitive adhesive composition prepared by stirring was used.

(Reference B)

A film in which a boron nitride filler was dispersed in a polyimide resin was formed to a thickness of 25 µm, and was used as the base material B. The content rate of the boron nitride filler with respect to the total mass of the base material was 50 mass %.

(Reference C)

A film in which copper was vapor-deposited on one surface of high heat-resistant special polyester (product name "Torcena", thickness 50 µm, manufactured by Toray Industries, Inc.) was used as the base material C. The thickness of the vapor-deposited copper was 0.1 micrometer.

(List D)

A PET film (thickness of 50 µm) was used as the substrate D.

(Preparation of a semiconductor device having a terminal)

It corresponds to evaluating the embedding property of the double-sided tape for terminal protection of an Example and a comparative example, and the semiconductor device which has the following terminal was prepared.

・Semiconductor device having terminals

Size of semiconductor device: 6mm x 6mm

Terminal height: 50 µm

Terminal diameter: 250 µm

Pitch between terminals: 400 μm

Number of terminals: 13 × 13 = 169

<Measurement of thermal conductivity>

The thermal diffusivity and thermal diffusivity of the base material, the viscoelastic layer, and the second pressure-sensitive adhesive layer were measured using a thermal diffusivity/thermal conductivity measuring device (manufactured by ai-Phase Co., Ltd., product name “ai-Phase Mobile 1 u”).

And the thermal conductivity of a base material, a viscoelastic layer, and a 2nd adhesive layer was computed by following formula (2).

In addition, the specific heat of the base material, the viscoelastic layer, and the second pressure-sensitive adhesive layer was calculated according to the DSC method, and the density was calculated according to the Archimedes method.

Thermal conductivity (W/(m K)) = thermal diffusivity × density × specific heat Equation (2)

<Measurement of surface temperature of double-sided tape for terminal protection during sputtering>

The semiconductor device which has a terminal on the double-sided tape for terminal protection of an Example and a comparative example was mounted according to the method mentioned later. A label for temperature measurement (manufactured by NiGK Corporation, a thermolabel for vacuum) is affixed to a location on the surface of the viscoelastic layer (first adhesive layer surface) on which a semiconductor device having a terminal of this terminal protection double-sided tape is not mounted, and the surface Protected with heat-resistant tape. Sputtering was performed on this double-sided tape for terminal protection under the conditions mentioned later. Then, the heat-resistant tape was peeled off, and the surface temperature of the double-sided tape for terminal protection at the time of sputtering was confirmed.

<Sputtering process>

The peeling film 22 on the side of the 2nd adhesive layer 15 of the double-sided tape 1 for terminal protection of the form of FIG. 1 was peeled, and alkali-free glass (made by Corning, EagleXG, 100 mm x 100 mm, 0.7 mm thickness) ), the double-sided tape for terminal protection of an Example and a comparative example was affixed through the 2nd adhesive layer, and it was set as the sample for a measurement. About this sample, the semiconductor device which has a terminal was mounted as follows.

As shown in Fig. 3(a), with the terminal side of the semiconductor device having the terminal facing down, the viscoelastic layer 12 is tightly pressed against the viscoelastic layer 12 at a press pressure (load 1.1 MPa), a press time of 40 s, and a heating temperature of 50°C. The semiconductor device having the pressed terminal was mounted on the double-sided tape for terminal protection.

Thereafter, a copper layer was formed by sputtering under the following conditions.

・Target: Copper

・Method: DC magnetron sputtering

・Application method: DC 500W

・Material heating: 150℃

・Carrier gas: Argon

・Film-forming pressure: 3.4Pa

The surface (1st adhesive layer surface) of the double-sided tape for terminal protection after sputtering was observed visually. Those having no surface roughness such as cracks, wrinkles, or peeling on the surface were set as pass (A), and those with surface roughness such as cracks, wrinkles, or peeling on the surface were designated as fail (B).

[Example 1]

The composition A for forming an embedding layer was coated on the release treatment surface of a release film ("SP-PET381031" manufactured by Lintec Corporation, 38 µm thick) in which one side of the polyethylene terephthalate film was peeled off by silicone treatment, and 1 After heating and drying for minutes, on the composition A for forming an embedding layer, the release surface of the release film ("SP-PET382150" manufactured by Lintec Corporation, 38 µm in thickness) in which one side of the polyethylene terephthalate film was peeled off by silicone treatment was applied. It laminated, and the 50-micrometer-thick buried layer was manufactured. Next, the 50-micrometer-thick embedding layer A was pasted together to the 10 micrometers thickness 1st adhesive layer B. Then, the peeling film by the side of the embedding layer A was peeled, and it bonded together with the base material A. Finally, the second pressure-sensitive adhesive layer A was laminated on the opposite side of the embedding layer A of the substrate to prepare the double-sided tape 1 for terminal protection of Example 1 of the form shown in FIG. 1 .

Using the double-sided tape 1 for terminal protection, sputtering was performed, the surface temperature of the double-sided tape 1 for terminal protection at the time of sputtering was measured, and the surface of the double-sided tape 1 for terminal protection after sputtering was visually observed. Table 1 shows the results of observation of the thermal conductivity of the viscoelastic layer, the substrate A, and the second adhesive layer, the surface temperature of the double-sided tape 1 for terminal protection during sputtering, and the surface of the double-sided tape 1 for terminal protection after sputtering. Moreover, the photograph of the surface (1st adhesive layer surface) of the double-sided tape 1 for terminal protection after sputtering is shown in FIG.

[Example 2]

Except having used the base material B instead of the base material A, it carried out similarly to Example 1, and manufactured the double-sided tape 2 for terminal protection.

Using the double-sided tape 2 for terminal protection, sputtering was performed, the surface temperature of the double-sided tape 2 for terminal protection at the time of sputtering was measured, and the surface of the double-sided tape 2 for terminal protection after sputtering was visually observed. Table 1 shows the results of observation of the thermal conductivity of the viscoelastic layer, the base B, and the second adhesive layer, the surface temperature of the double-sided tape 2 for terminal protection during sputtering, and the surface of the double-sided tape 2 for terminal protection after sputtering. Moreover, the photograph of the surface (1st adhesive layer surface) of the double-sided tape 2 for terminal protection after sputtering is shown in FIG.

[Comparative Example 1]

Except having used the base material C instead of the base material A, it carried out similarly to Example 1, and manufactured the double-sided tape 3 for terminal protections.

Using the double-sided tape 3 for terminal protection, sputtering was performed, the surface temperature of the double-sided tape 3 for terminal protection at the time of sputtering was measured, and the surface of the double-sided tape 3 for terminal protection after sputtering was visually observed. Table 1 shows the results of observation of the thermal conductivity of the viscoelastic layer, the base C, and the second adhesive layer, the surface temperature of the double-sided tape 3 for terminal protection during sputtering, and the surface of the double-sided tape 3 for terminal protection after sputtering. Moreover, the photograph of the surface (1st adhesive layer surface) of the double-sided tape 3 for terminal protection after sputtering is shown in FIG.

[Comparative Example 2]

Except having used the base material D instead of the base material A, it carried out similarly to Example 1, and manufactured the double-sided tape 4 for terminal protection.

Using the double-sided tape 4 for terminal protection, sputtering was performed, the surface temperature of the double-sided tape 4 for terminal protection at the time of sputtering was measured, and the surface of the double-sided tape 4 for terminal protection after sputtering was visually observed. Table 1 shows the results of observation of the thermal conductivity of the viscoelastic layer, the substrate D, and the second adhesive layer, the surface temperature of the double-sided tape 4 for terminal protection during sputtering, and the surface of the double-sided tape 4 for terminal protection after sputtering. Moreover, the photograph of the surface (1st adhesive layer surface) of the double-sided tape 4 for terminal protection after sputtering is shown in FIG.

[Comparative Example 3]

Except having made the thickness of the embedding layer A into 160 micrometers, it carried out similarly to the comparative example 2, and manufactured the double-sided tape 5 for terminal protection.

Using the double-sided tape 5 for terminal protection, sputtering was performed, the surface temperature of the double-sided tape 5 for terminal protection at the time of sputtering was measured, and the surface of the double-sided tape 5 for terminal protection after sputtering was visually observed. Table 1 shows the results of observation of the thermal conductivity of the viscoelastic layer, the base D, and the second adhesive layer, the surface temperature of the double-sided tape 5 for terminal protection during sputtering, and the surface of the double-sided tape 5 for terminal protection after sputtering. Moreover, the photograph of the surface (1st adhesive layer surface) of the double-sided tape 5 for terminal protection after sputtering is shown in FIG.

From the result shown in Table 1, when using the double-sided tape for terminal protection which concerns on the Example of this invention to electromagnetic wave shield the semiconductor device which has a terminal, at least 1 layer among a viscoelastic layer, a base material, and a 2nd adhesive layer It was confirmed that the rise of the surface temperature of the said double-sided tape for terminal protection and surface roughness could be suppressed also in the sputtering process of apply|coating an electrically-conductive material by being a heat conductive layer.

The double-sided tape for terminal protection of this invention can be used for the use which protects the terminal of the semiconductor device which has a terminal, when electromagnetic wave shielding the semiconductor device which has a terminal. By using the double-sided tape for terminal protection of the present invention, a semiconductor device having a terminal can be shielded from electromagnetic waves, and a semiconductor device having an electromagnetic shielding film can be manufactured.

1 Double-sided tape for terminal protection,
10 ... electromagnetic shielding film,
11 ... description,
12 ... viscoelastic layer,
13 ... the buried layer,
14 ... the first pressure-sensitive adhesive layer,
15... 2nd adhesive layer (bonding adhesive layer),
30 ... support,
6 ... a semiconductor device assembly having a terminal,
60 ... semiconductor device assembly,
61, 62 ... electronic parts,
63 ... circuit board,
63a ... terminal formation surface,
64 ... encapsulation resin layer,
A semiconductor device having 65 ... terminals;
66...a semiconductor device having an electromagnetic shielding film;
91 ... terminal,
101 ... conductive resin,
20, 22... release film

Claims (8)

A double-sided tape for terminal protection used in a process of forming an electromagnetic shielding film on a semiconductor device having a terminal, comprising:
Having a viscoelastic layer, a substrate, and a second pressure-sensitive adhesive layer,
Among the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer, at least one layer is a heat conductive layer, double-sided tape for terminal protection. According to claim 1,
Among the viscoelastic layer, the base material, and the second pressure-sensitive adhesive layer, two or more layers are a heat conductive layer, double-sided tape for terminal protection. 3. The method of claim 1 or 2,
The thermal conductivity of the said thermal conductive layer is 1.0 W/(m*K) or more, The double-sided tape for terminal protection. 4. The method according to any one of claims 1 to 3,
The total thickness of the heat conductive layer with respect to the total thickness of the double-sided tape for terminal protection is 0.01 or more, double-sided tape for terminal protection. 5. The method according to any one of claims 1 to 4,
The said viscoelastic layer has a buried layer and a 1st adhesive layer, The double-sided tape for terminal protection. 6. The method of claim 5,
The double-sided tape for terminal protection has the said 1st adhesive layer, the said embedding layer, the said base material, and the said 2nd adhesive layer in this order. The process of embedding the terminal of the semiconductor device which has a terminal in the viscoelastic layer of the double-sided tape for terminal protection in any one of Claims 1-6, and
A step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminal
A method of manufacturing a semiconductor device having an electromagnetic shielding film, comprising: The process of embedding the terminal of the semiconductor device assembly which has a terminal in the viscoelastic layer of the double-sided tape for terminal protection in any one of Claims 1-6,
dicing the semiconductor device assembly having the terminals to form the semiconductor device assembly having the terminals into a semiconductor device having the terminals embedded in the viscoelastic layer of the double-sided tape for protecting the terminals; and
A step of forming an electromagnetic wave shielding film on the exposed surface of the semiconductor device having the terminal that is not embedded in the viscoelastic layer of the double-sided tape for protecting the terminal
A method of manufacturing a semiconductor device having an electromagnetic shielding film, comprising:

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