TW201609587A - Regeneration method of glass plate and regeneration apparatus of glass plate - Google Patents

Regeneration method of glass plate and regeneration apparatus of glass plate Download PDF

Info

Publication number
TW201609587A
TW201609587A TW104117845A TW104117845A TW201609587A TW 201609587 A TW201609587 A TW 201609587A TW 104117845 A TW104117845 A TW 104117845A TW 104117845 A TW104117845 A TW 104117845A TW 201609587 A TW201609587 A TW 201609587A
Authority
TW
Taiwan
Prior art keywords
resin layer
glass plate
glass
roller brush
resin
Prior art date
Application number
TW104117845A
Other languages
Chinese (zh)
Inventor
Tetsushi Yokoyama
Tatsuzo MIYAGOE
Chiaki Ishikawa
shigeto Kumano
Kazuhisa Arashida
Masaru Yamauchi
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201609587A publication Critical patent/TW201609587A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0012Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/0016Abrading

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laminated Bodies (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

The present invention relates to a glass plate regeneration method, characterized by removing a resin layer formed on the glass plate, and comprising: a removal step which uses grinding agent in conjunction with a roll brush to remove the resin layer formed on the glass plate, and a grinding step which grinds the surface of the glass plate of which the resin layer has been removed.

Description

玻璃板之再生方法及玻璃板之再生裝置 Glass plate regeneration method and glass plate regeneration device

本發明係關於一種自使樹脂層附著於玻璃板上而成之複合體將樹脂層去除之玻璃板之再生。 The present invention relates to regeneration of a glass sheet from which a resin layer is removed from a composite in which a resin layer is adhered to a glass plate.

近年來,太陽電池(PV)、液晶面板(LCD)、有機EL(Electroluminescence,電致發光)面板(OLED)等電子器件(電子機器)之薄型化、輕量化不斷發展。作為謀求該電子器件之薄型化或輕量化之方法之一,進行有電子器件中所使用之玻璃基板之薄板化。 In recent years, thinner and lighter electronic devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCDs), and organic EL (Electroluminescence) panels (OLEDs) have been developed. As one of the methods for reducing the thickness and weight of the electronic device, the thinning of the glass substrate used in the electronic device is performed.

然而,若因薄板化而使玻璃基板之強度不足,則於器件之製造步驟中,玻璃基板之處理性降低。 However, if the strength of the glass substrate is insufficient due to the thinning, the glass substrate is rationally lowered in the manufacturing process of the device.

因此,自先前開始,廣泛採用如下方法:於厚度比最終厚度厚之玻璃基板上形成電子器件用零件(例如薄膜電晶體)後,藉由化學蝕刻處理將玻璃基板薄板化。 Therefore, from the beginning, a method of forming a surface of an electronic device (for example, a thin film transistor) on a glass substrate having a thickness thicker than a final thickness has been widely used, and then the glass substrate is thinned by a chemical etching treatment.

然而,於該方法中,例如,於將玻璃基板之厚度自0.7mm薄板化至0.2mm或0.1mm之情形時,會藉由蝕刻液將原來之玻璃基板之大部分材料削除。因此,該方法就生產性或原材料之使用效率之觀點而言欠佳。又,該藉由化學蝕刻而進行之玻璃基板之薄板化方法中,存在於玻璃基板表面存在微細之傷痕之情形、因蝕刻處理而以傷痕為起點形成微細之凹處(腐蝕坑),而成為光學性缺陷之情形。 However, in this method, for example, when the thickness of the glass substrate is thinned from 0.7 mm to 0.2 mm or 0.1 mm, most of the material of the original glass substrate is removed by the etching liquid. Therefore, this method is not preferable from the viewpoint of productivity or use efficiency of raw materials. Further, in the method of thinning a glass substrate by chemical etching, fine scratches are formed on the surface of the glass substrate, and fine pits (corrosion pits) are formed from the scratches by the etching process. The case of optical defects.

為了解決此種問題,最近,提出有如下方法:製作將薄板玻璃基板與成為補強板之複合體積層而成之玻璃積層體,並於玻璃積層體 之薄板玻璃基板上形成顯示裝置等電子器件用零件後,將複合體自薄板玻璃基板剝離(參照專利文獻1)。 In order to solve such a problem, recently, there has been proposed a method of producing a glass laminate in which a thin-plate glass substrate and a composite volume layer serving as a reinforcing plate are formed, and in a glass laminate. After forming a component for an electronic device such as a display device on the thin glass substrate, the composite is peeled off from the thin glass substrate (see Patent Document 1).

複合體具有成為支持基板之玻璃板、及形成於該支持基板上之樹脂層(聚矽氧樹脂層)。供電子器件用零件形成之薄板玻璃基板係以可剝離之方式積層、貼合於該複合體之樹脂層,而形成玻璃積層體(參照下述圖2(B))。 The composite has a glass plate serving as a support substrate and a resin layer (polyoxymethylene resin layer) formed on the support substrate. A thin plate glass substrate formed of a component for an electronic device is laminated and bonded to a resin layer of the composite to form a glass laminate (see FIG. 2(B) below).

將形成有電子器件用零件之薄板玻璃基板剝離後之複合體可再次積層、貼合於新的薄板玻璃基板而加以再利用。 The composite in which the thin glass substrate on which the electronic component is formed is peeled off can be laminated and bonded to a new thin glass substrate to be reused.

此處,複合體會因伴隨電子器件用零件之製造之加熱或液體處理、與薄板玻璃基板之剝離/貼合等,而根據再利用之次數,樹脂層逐漸劣化。若樹脂層劣化,則會產生無法獲得與薄板玻璃基板之必需之接著力、且劣化之樹脂附著於薄板玻璃基板等不良情況。 Here, the composite body is gradually deteriorated depending on the number of reuses due to heating or liquid treatment accompanying the manufacture of the electronic component parts, peeling/bonding to the thin glass substrate, and the like. When the resin layer is deteriorated, there is a problem that it is impossible to obtain a necessary adhesive force with the thin glass substrate, and the deteriorated resin adheres to the thin glass substrate.

於複合體之樹脂層劣化之情形時,必須將樹脂層自支持基板(成為支持基板之玻璃板)剝離而再次形成樹脂層。 When the resin layer of the composite is deteriorated, the resin layer must be peeled off from the support substrate (the glass plate serving as the support substrate) to form the resin layer again.

又,亦作如下考慮:無論樹脂層是否發生劣化,均將樹脂層自支持基板剝離而用作複合體以外之其他玻璃板製品。 Further, it is considered that the resin layer is peeled off from the support substrate regardless of whether or not the resin layer is deteriorated, and is used as a glass plate product other than the composite.

作為將樹脂層自支持基板剝離之方法,考慮有利用刀具削除之方法、或使碳酸鈣粉末等噴擊粒子撞擊而進行去除之方法。然而,該等方法中,存在如下可能性:因與刀具之接觸或噴擊粒子之衝擊而於支持基板之表面產生微細之龜裂,於再次利用支持基板(玻璃板)時,因微細龜裂之影響而使支持基板破損。 As a method of peeling the resin layer from the support substrate, a method of removing by a cutter or a method of removing the sprayed particles such as calcium carbonate powder may be considered. However, in these methods, there is a possibility that fine cracks are generated on the surface of the support substrate due to contact with the cutter or impact of the sprayed particles, and fine cracking occurs when the support substrate (glass plate) is reused. The support substrate is damaged by the influence.

作為不使支持基板產生微細龜裂等地將樹脂層去除之方法,考慮有使樹脂層於大氣中燃燒之方法。然而,該方法中,會因樹脂層之燃燒而生成氧化矽等氧化物,並附著於支持基板。由於氧化物固著於支持基板,因此難以去除。 As a method of removing the resin layer without causing fine cracking of the support substrate, a method of burning the resin layer in the air is considered. However, in this method, an oxide such as ruthenium oxide is formed by the combustion of the resin layer and adheres to the support substrate. Since the oxide is fixed to the support substrate, it is difficult to remove.

作為解決此種問題而不使支持基板破損地將樹脂層自複合體之 支持基板去除之方法,有專利文獻2中所記載之方法。 As a solution to this problem, the resin layer is self-complexed without breaking the support substrate. There is a method of supporting substrate removal, and there is a method described in Patent Document 2.

該方法為,首先,將樹脂層曝露於300~450℃之大氣、或350~600℃之惰性氣氛、或150~350℃之水蒸氣中而進行熱處理步驟。繼而,進行洗淨步驟,該洗淨步驟係藉由利用藥液或研磨劑對熱處理後之樹脂層進行研磨而將樹脂層去除。 In the method, first, the resin layer is exposed to an atmosphere of 300 to 450 ° C, or an inert atmosphere of 350 to 600 ° C, or water vapor of 150 to 350 ° C to carry out a heat treatment step. Then, a washing step is performed in which the resin layer is removed by polishing the heat-treated resin layer with a chemical solution or an abrasive.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2007/018028號 [Patent Document 1] International Publication No. 2007/018028

[專利文獻2]國際公開第2011/111611號 [Patent Document 2] International Publication No. 2011/111611

該專利文獻2中所記載之樹脂層之去除方法係藉由熱處理步驟使樹脂層分解後,進行樹脂層之去除。因此,藉由一面使用藥液使樹脂層溶解或膨潤一面利用刷毛刷除之方法、或一面使用分散有研磨劑之分散液將樹脂層削去一面利用刷毛刷除之方法等,可不使支持基板破損且容易地將樹脂層自支持基板去除。 In the method of removing the resin layer described in Patent Document 2, the resin layer is removed by decomposing the resin layer by a heat treatment step. Therefore, the support substrate can be omitted by a method of removing or swelling the resin layer by using a chemical solution, or by removing the resin layer by using a dispersion in which the polishing agent is dispersed, and removing the resin layer by brushing. The resin layer is easily removed from the support substrate by breakage.

另一方面,該方法中,必須進行於300~450℃之大氣中、350~600℃之惰性氣氛、或150~350℃之水蒸氣中之熱處理步驟。 On the other hand, in this method, it is necessary to carry out a heat treatment step in an atmosphere of 300 to 450 ° C, an inert atmosphere of 350 to 600 ° C, or a water vapor of 150 to 350 ° C.

因此,有如下等缺點:樹脂層之去除耗費工夫,為了進行熱處理而使設備規模龐大,生產性欠佳,成本較高。 Therefore, there are disadvantages such as the removal of the resin layer, the labor of the resin layer, the large scale of the equipment for the heat treatment, the poor productivity, and the high cost.

本發明之目的在於解決上述先前技術之問題,並提供一種玻璃板之再生方法、及實施該玻璃板之再生方法之玻璃板之再生裝置,該玻璃板之再生方法於將樹脂層自於作為支持基板之玻璃板上形成樹脂層而成之複合體去除時,可不進行高溫下之熱處理而將樹脂層自複合體去除,藉此,可不設法進行設備之較大之變更而簡化處理,從而謀求支持基板之再利用之生產性之提高或處理成本之降低等。 An object of the present invention is to solve the above problems of the prior art, and to provide a method for regenerating a glass sheet and a glass sheet reproducing apparatus for carrying out the method for regenerating the glass sheet, wherein the method for regenerating the glass sheet is to support the resin layer When the composite body in which the resin layer is formed on the glass plate of the substrate is removed, the resin layer can be removed from the composite without heat treatment at a high temperature, whereby the processing can be simplified without requiring a large change in equipment. The productivity of the reuse of the substrate is increased or the processing cost is lowered.

為了達成上述目的,本發明提供一種玻璃板之再生方法,其特徵在於,其係將形成於玻璃板上之樹脂層去除者,且包括:去除步驟,其係使用研磨劑藉由輥刷將形成於上述玻璃板上之樹脂層去除;及研磨步驟,其係對已將上述樹脂層去除之玻璃板之已去除樹脂層之面進行研磨。 In order to achieve the above object, the present invention provides a method for regenerating a glass sheet, which is characterized in that the resin layer is formed on a glass plate, and includes a removing step which is formed by using a roller by a roller brush. The resin layer on the glass plate is removed; and a polishing step of polishing the surface of the removed resin layer of the glass plate from which the resin layer has been removed.

於此種本發明之玻璃板之再生方法中,較佳為,於上述去除步驟之前,進行於上述樹脂層之表面置入傷痕之傷痕置入步驟。 In the method for regenerating the glass sheet of the present invention, it is preferred that the step of placing a flaw on the surface of the resin layer before the removing step is performed.

又,較佳為,上述輥刷之刷毛之線徑為0.2mm以上。 Moreover, it is preferable that the wire diameter of the bristles of the roller brush is 0.2 mm or more.

又,較佳為,上述去除步驟係使用分散有上述研磨劑之漿料進行上述樹脂層之去除之步驟,且上述漿料中之研磨劑之濃度為10質量%以上。 Moreover, it is preferable that the removal step is a step of removing the resin layer using a slurry in which the polishing agent is dispersed, and the concentration of the polishing agent in the slurry is 10% by mass or more.

又,較佳為,上述樹脂層係包含聚矽氧樹脂者。 Further, it is preferable that the resin layer contains a polyoxyn resin.

進而,較佳為,上述聚矽氧樹脂為加成反應型聚矽氧之硬化物,並且該加成反應型聚矽氧為包含下述線狀有機聚矽氧烷(a)與下述線狀有機聚矽氧烷(b)之硬化性聚矽氧樹脂組合物:線狀有機聚矽氧烷(a):每1分子中至少具有2個烯基之線狀有機聚矽氧烷;及線狀有機聚矽氧烷(b):每1分子中至少具有3個鍵結於矽原子之氫原子,且鍵結於矽原子之氫原子之至少1個存在於分子末端之矽原子之線狀有機聚矽氧烷;且上述樹脂層係藉由使該硬化性聚矽氧樹脂組合物於上述玻璃板之表面進行硬化而形成之硬化聚矽氧樹脂層。 Further, it is preferable that the polyfluorene oxide resin is a cured product of an addition reaction type polyfluorene oxygen, and the addition reaction type polyfluorene oxygen is a linear organopolyoxane (a) having the following line and the following line The curable polyoxynoxy resin composition of the organopolysiloxane (b): linear organopolyoxane (a): a linear organopolyoxane having at least two alkenyl groups per molecule; Linear organopolyoxane (b): at least 3 hydrogen atoms bonded to a deuterium atom per molecule, and at least one hydrogen atom bonded to a deuterium atom at the end of the molecule The above-mentioned resin layer is a cured polyoxyalkylene resin layer formed by curing the curable polyanthracene resin composition on the surface of the glass plate.

又,本發明之玻璃板之再生裝置之特徵在於,其係將形成於玻璃板上之樹脂層去除者,且包括:去除裝置,其具有輥刷、搬送機構及研磨劑供給機構,將形成 於上述玻璃板上之樹脂層去除,上述搬送機構相對地搬送上述輥刷與具有樹脂層之玻璃板,上述研磨劑供給機構對上述輥刷及較利用上述搬送機構進行之相對搬送中之輥刷更靠上游側之上述玻璃板之樹脂層的至少一者供給包含研磨劑之漿料;以及研磨裝置,其對藉由上述去除裝置將樹脂層去除後之玻璃板之樹脂層去除面進行研磨。 Moreover, the glass plate reproducing apparatus of the present invention is characterized in that it is a resin layer formed on a glass plate, and includes a removing device having a roller brush, a conveying mechanism, and an abrasive supply mechanism, which are formed. The resin layer on the glass plate is removed, and the transfer mechanism relatively transports the roll brush and the glass plate having the resin layer, and the abrasive supply mechanism applies the roll brush and the roll brush in the relative transfer by the transfer mechanism. Further, at least one of the resin layers of the glass plate on the upstream side is supplied with a slurry containing an abrasive; and a polishing apparatus for polishing the resin layer removal surface of the glass plate obtained by removing the resin layer by the removal device.

根據本發明,於在作為支持基板之玻璃板上形成樹脂層而成之複合體中,可不進行高溫下之熱處理而將樹脂層自複合體去除,從而使玻璃板再生。 According to the invention, in the composite in which the resin layer is formed on the glass plate as the support substrate, the glass layer can be regenerated without removing the resin layer from the composite without performing heat treatment at a high temperature.

因此,根據本發明,可不設法進行設備之較大之變更而簡化處理,從而謀求複合體之支持基板之再利用之生產性之提高或處理成本之降低等。 Therefore, according to the present invention, it is possible to simplify the processing without making a large change in the apparatus, and it is possible to improve the productivity of the reuse of the support substrate of the composite or to reduce the processing cost.

10‧‧‧玻璃板 10‧‧‧ glass plate

12‧‧‧樹脂層 12‧‧‧ resin layer

14‧‧‧複合體 14‧‧‧Compound

18‧‧‧薄板玻璃基板 18‧‧‧Sheet glass substrate

20‧‧‧玻璃積層體 20‧‧‧Glass laminate

30‧‧‧輥刷 30‧‧‧ Roller brush

30a‧‧‧刷毛 30a‧‧‧bristles

32‧‧‧滴加裝置 32‧‧‧Drip device

36‧‧‧搬送輥 36‧‧‧Transport roller

x‧‧‧箭頭 X‧‧‧ arrow

圖1係用以說明本發明之玻璃板之再生方法之一例的流程圖。 Fig. 1 is a flow chart for explaining an example of a method of regenerating a glass sheet of the present invention.

圖2(A)係概念性地表示成為本發明之玻璃板之再生方法之原料的複合體之一例之圖,圖2(B)係概念性地表示利用藉由該本發明之再生方法而製造之複合體的玻璃積層體之一例之圖。 Fig. 2(A) is a view conceptually showing an example of a composite which is a raw material of a method for regenerating a glass plate of the present invention, and Fig. 2(B) conceptually shows that it is produced by the regeneration method of the present invention. A diagram of an example of a glass laminate of the composite.

圖3係用以說明本發明之玻璃板之再生方法中之去除步驟及再生裝置中之去除裝置之一例的概念圖。 Fig. 3 is a conceptual diagram for explaining an example of a removal step in the method for regenerating a glass sheet of the present invention and a removal device in the regeneration apparatus.

以下,基於隨附之圖式中所示之較佳例,對本發明之玻璃板之再生方法及玻璃板之再生裝置詳細地進行說明。 Hereinafter, the method for regenerating the glass sheet of the present invention and the apparatus for regenerating the glass sheet will be described in detail based on the preferred examples shown in the accompanying drawings.

圖1中,以流程圖概念性地表示本發明之玻璃板之再生方法之一例。 In Fig. 1, an example of a method of regenerating a glass sheet of the present invention is conceptually shown in a flow chart.

如圖1所示,本發明之玻璃板之再生方法(以下,亦簡稱為本發明 之再生方法)為如下之方法:以如圖2(A)中概念性地表示之於玻璃板10之表面(主面)形成樹脂層12而成之複合體14為原材料,進行將樹脂層12自該複合體14(其玻璃板10)去除之去除步驟、及對已將樹脂層12去除之玻璃板10進行研磨之研磨步驟,從而使可再次利用之玻璃板10再生。 As shown in FIG. 1, the method for regenerating a glass plate of the present invention (hereinafter, also referred to as the present invention) The method of regenerating) is a method in which the resin layer 12 is formed by using the composite 14 in which the resin layer 12 is formed on the surface (main surface) of the glass sheet 10 as conceptually shown in FIG. 2(A) as a raw material. The removal step of removing the composite 14 (the glass plate 10) and the polishing step of polishing the glass sheet 10 from which the resin layer 12 has been removed are used to regenerate the reusable glass sheet 10.

又,於圖1所示之例中,作為較佳之態樣,於去除步驟之前,進行對樹脂層12之表面置入傷痕之傷痕置入步驟。 Further, in the example shown in Fig. 1, as a preferred aspect, a flaw insertion step of placing a flaw on the surface of the resin layer 12 is performed before the removing step.

複合體14係製成如圖2(B)中概念性地表示之於樹脂層12之表面積層、貼合薄板玻璃基板18而成之玻璃積層體20而加以利用。該玻璃積層體20係用於液晶面板或有機EL面板等顯示裝置、太陽電池等電子器件(電子機器)之製造者,且於薄板玻璃基板18之表面,形成構成電子器件之電子器件用零件。 The composite 14 is used as a glass laminate 20 in which the surface layer of the resin layer 12 is conceptually shown in Fig. 2(B) and the thin glass substrate 18 is bonded. The glass laminate 20 is used for a display device such as a liquid crystal panel or an organic EL panel, or a manufacturer of an electronic device (electronic device) such as a solar cell, and forms a component for an electronic device that constitutes an electronic device on the surface of the thin glass substrate 18.

複合體14之玻璃板10係作為製造電子器件時之薄板玻璃基板18之支持基板(支持體)而發揮作用。 The glass plate 10 of the composite 14 functions as a support substrate (support) of the thin glass substrate 18 when manufacturing an electronic device.

於薄板玻璃基板18之表面形成所需之電子器件用零件後,對於玻璃積層體20,將薄板玻璃基板18自複合體14(樹脂層12)剝離。 After the desired electronic component parts are formed on the surface of the thin glass substrate 18, the thin glass substrate 18 is peeled off from the composite 14 (resin layer 12) with respect to the glass laminate 20.

自複合體14剝離之薄板玻璃基板18例如被供給至製造電子器件之下一步驟。 The thin glass substrate 18 peeled off from the composite 14 is, for example, supplied to a step below the manufacturing of the electronic device.

另一方面,對於將薄板玻璃基板18剝離後之複合體14,藉由本發明之再生方法將樹脂層12去除,而使其成為單板之玻璃板10。或者,對於將薄板玻璃基板18剝離後之複合體14,再次於樹脂層12積層、貼合新的薄板玻璃基板18,而製成玻璃積層體20加以再利用。 On the other hand, in the composite 14 in which the thin glass substrate 18 is peeled off, the resin layer 12 is removed by the reproducing method of the present invention to form a single-plate glass plate 10. Alternatively, the composite body 14 from which the thin glass substrate 18 has been peeled off is laminated on the resin layer 12, and the new thin glass substrate 18 is bonded to each other to form a glass laminate 20 for reuse.

玻璃板10成為支持構成玻璃積層體20之薄板玻璃基板18之支持基板(支持體)。 The glass plate 10 serves as a support substrate (support) that supports the thin glass substrate 18 constituting the glass laminate 20.

作為玻璃板10之玻璃,可利用各種玻璃。作為一例,可例示無鹼玻璃、硼矽酸玻璃、鈉鈣玻璃、高二氧化矽玻璃、其他以氧化矽為 主要成分之氧化物系玻璃。 As the glass of the glass plate 10, various glasses can be utilized. As an example, an alkali-free glass, a borosilicate glass, a soda-lime glass, a high-cerium oxide glass, and other cerium oxide can be illustrated. The oxide of the main component is glass.

關於玻璃板10之厚度,作為一例,係根據構成玻璃積層體20之薄板玻璃基板18之厚度而設定。 The thickness of the glass plate 10 is set as an example according to the thickness of the thin glass substrate 18 which comprises the glass laminated body 20.

即,關於玻璃板10之厚度,係根據薄板玻璃基板18之厚度、樹脂層12之厚度、及玻璃積層體20之厚度來選擇玻璃板10之厚度。例如,於零件形成步驟被設計為對厚度0.5mm之基板進行處理,且薄板玻璃基板18之厚度與樹脂層12之厚度之和為0.1mm之情形時,將玻璃板10之厚度設為0.4mm。再者,玻璃板10之厚度既可與薄板玻璃基板18相同,亦可比薄板玻璃基板18厚或薄。 That is, regarding the thickness of the glass plate 10, the thickness of the glass plate 10 is selected according to the thickness of the thin glass substrate 18, the thickness of the resin layer 12, and the thickness of the glass laminate 20. For example, when the part forming step is designed to treat a substrate having a thickness of 0.5 mm, and the sum of the thickness of the thin glass substrate 18 and the thickness of the resin layer 12 is 0.1 mm, the thickness of the glass plate 10 is set to 0.4 mm. . Further, the thickness of the glass sheet 10 may be the same as that of the thin glass substrate 18 or thicker or thinner than the thin glass substrate 18.

又,就容易操作且不易破裂等原因而言,玻璃板10之厚度較佳為0.08mm以上。又,就期待於形成電子器件用零件後進行剝離時不破裂且適度地撓曲般之剛性之原因而言,玻璃板10之厚度較佳為1mm以下。 Further, the thickness of the glass sheet 10 is preferably 0.08 mm or more for reasons of easy handling and difficulty in cracking. Moreover, it is expected that the thickness of the glass plate 10 is preferably 1 mm or less for the reason that the parts for electronic devices are formed without being broken and moderately bent during peeling.

又,於複合體14中,樹脂層(接著層/吸附層)12係將薄板玻璃基板18以可自由剝離之方式貼合(接著)者。樹脂層12具有將薄板玻璃基板18以可自由剝離之方式貼合之黏著力,且黏著於玻璃板10。 Further, in the composite 14, the resin layer (adhesion layer/adsorption layer) 12 is bonded to the thin glass substrate 18 so as to be detachable. The resin layer 12 has an adhesive force for bonding the thin glass substrate 18 so as to be freely peelable, and is adhered to the glass plate 10.

形成樹脂層12之樹脂只要為可確保目標之黏著力及剝離性者,則可利用各種樹脂。具體而言,可例示丙烯酸系樹脂、聚烯烴樹脂、聚胺基甲酸酯樹脂、聚醯亞胺樹脂、聚矽氧樹脂、聚醯亞胺聚矽氧樹脂、聚矽氧系之溶膠-凝膠材料。樹脂層12亦可混合若干種樹脂而使用。 The resin forming the resin layer 12 can be used as long as it can secure the target adhesion and peelability. Specifically, an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxynoxy resin, a polyamidene polyoxyl resin, a polyoxyl sol-condensation can be exemplified. Glue material. The resin layer 12 can also be used by mixing several kinds of resins.

其中,就耐熱性或剝離性之觀點而言,較佳為包含聚矽氧樹脂之樹脂層12。 Among them, from the viewpoint of heat resistance or peelability, the resin layer 12 containing a polyoxyxylene resin is preferable.

作為一例,包含聚矽氧樹脂之樹脂層12係將成為聚矽氧樹脂之包含硬化性聚矽氧之樹脂組合物塗佈於玻璃板10,並使之硬化而形成。 As an example, the resin layer 12 containing a polyoxynoxy resin is formed by applying a curable polyoxymethylene-containing resin composition which is a polyoxyxylene resin to the glass sheet 10 and curing it.

硬化性聚矽氧根據其硬化機制被分類為縮合反應型聚矽氧、加成反應型聚矽氧、紫外線硬化型聚矽氧、及電子束硬化型聚矽氧,可使用任一種。 The sclerosing polyfluorene is classified into a condensation reaction type polyoxane, an addition reaction type polyoxane, an ultraviolet curing type polyfluorene, and an electron beam hardening type polyoxane according to the hardening mechanism, and any of them may be used.

該等中,較佳為加成反應型聚矽氧。其原因在於:容易進行硬化反應,且於形成聚矽氧樹脂層時剝離性之程度良好,耐熱性亦較高。 Among these, an addition reaction type polyoxane is preferred. This is because the curing reaction is easy, and the degree of peeling property is good when the polyoxynoxy resin layer is formed, and the heat resistance is also high.

加成反應型聚矽氧為包含主劑及交聯劑,且於鉑系觸媒等觸媒之存在下硬化之硬化性之組合物。加成反應型聚矽氧之硬化係藉由加熱處理而得到促進。 The addition reaction type polyfluorene is a curable composition containing a main component and a crosslinking agent and hardened in the presence of a catalyst such as a platinum-based catalyst. The hardening of the addition reaction type polyoxygen is promoted by heat treatment.

加成反應型聚矽氧之主劑較佳為具有鍵結於矽原子之烯基(乙烯基等)之有機聚矽氧烷(即,有機烯基聚矽氧烷。再者,較佳為直鏈狀),且烯基等成為交聯點。加成反應型聚矽氧中之交聯劑較佳為具有鍵結於矽原子之氫原子(氫矽烷基)之有機聚矽氧烷(即,有機氫聚矽氧烷。再者,較佳為直鏈狀),且氫矽烷基等成為交聯點。 The main component of the addition reaction type polyoxo is preferably an organic polyoxyalkylene having an alkenyl group (vinyl group or the like) bonded to a halogen atom (that is, an organic alkenyl polyoxyalkylene. Further, preferably, It is linear), and an alkenyl group or the like becomes a crosslinking point. The crosslinking agent in the addition reaction type polyoxo is preferably an organic polyoxyalkylene having a hydrogen atom (hydroalkylene group) bonded to a halogen atom (i.e., an organic hydrogen polyoxyalkylene. Further, preferably It is linear), and hydroquinone or the like becomes a crosslinking point.

加成反應型聚矽氧係藉由主劑與交聯劑之交聯點進行加成反應而硬化。再者,就來自交聯結構之耐熱性更加優異之方面而言,有機氫聚矽氧烷之鍵結於矽原子之氫原子相對於有機烯基聚矽氧烷之烯基之莫耳比較佳為0.5~2。 The addition reaction type polyoxymethylene is hardened by an addition reaction of a crosslinking point of a main agent and a crosslinking agent. Further, in terms of the more excellent heat resistance of the crosslinked structure, the organic hydrogen polyoxyalkylene is preferably bonded to the hydrogen atom of the halogen atom relative to the alkenyl group of the organic alkenyl polyoxyalkylene. It is 0.5~2.

其中,加成反應型聚矽氧較佳為包含下述線狀有機聚矽氧烷(a)與下述線狀有機聚矽氧烷(b)之硬化性聚矽氧樹脂組合物:線狀有機聚矽氧烷(a):每1分子中至少具有2個烯基之線狀有機聚矽氧烷;及線狀有機聚矽氧烷(b):每1分子中至少具有3個鍵結於矽原子之氫原子,且鍵結於矽原子之氫原子之至少1個存在於分子末端之矽原子之線狀有機聚矽氧烷。 Among them, the addition reaction type polyfluorene oxide is preferably a curable polyoxynoxy resin composition comprising the linear organopolyoxane (a) and the linear organopolyoxane (b) described below: linear Organic polyoxyalkylene (a): linear organopolyoxane having at least 2 alkenyl groups per molecule; and linear organopolyoxane (b): at least 3 bonds per molecule a linear organopolyoxane which is a hydrogen atom of a ruthenium atom and is bonded to at least one of the hydrogen atoms of the ruthenium atom at the end of the molecule.

樹脂層12更佳為藉由使該硬化性聚矽氧樹脂組合物於玻璃板10 之表面硬化而形成之硬化聚矽氧樹脂層。 The resin layer 12 is more preferably made of the curable polyoxynoxy resin composition on the glass plate 10 A hardened polyoxyalkylene resin layer formed by surface hardening.

於成為樹脂層12之硬化性聚矽氧為加成反應型聚矽氧之情形時,成為樹脂層12之樹脂組合物中,亦可進而包含觸媒(尤其為鉑族金屬系觸媒)或反應抑制劑等。 When the curable polyfluorene oxide to be the resin layer 12 is an addition reaction type polyfluorene oxygen, the resin composition to be the resin layer 12 may further contain a catalyst (particularly a platinum group metal catalyst) or Reaction inhibitors and the like.

鉑族金屬系觸媒(矽氫化用鉑族金屬觸媒)為用以進行、促進上述有機烯基聚矽氧烷中之烯基與上述有機氫聚矽氧烷中之氫原子的矽氫化反應之觸媒。作為鉑族金屬系觸媒,可列舉鉑系、鈀系、銠系等觸媒,尤其是就經濟性、反應性之方面而言,較佳為使用鉑系觸媒。 A platinum group metal catalyst (a platinum group metal catalyst for hydrogenation) is used for carrying out and promoting the hydrogenation reaction of an alkenyl group in the above organic alkenyl polyoxane with a hydrogen atom in the above organic hydrogen polyoxyalkylene. Catalyst. Examples of the platinum group-based catalyst include platinum-based, palladium-based, and ruthenium-based catalysts. In particular, in terms of economy and reactivity, a platinum-based catalyst is preferably used.

反應抑制劑(矽氫化用反應抑制劑)為抑制該等觸媒(尤其為鉑族金屬系觸媒)之常溫下之觸媒活性而延長樹脂組合物的使用壽命之所謂之適用期延長劑(亦稱作延遲劑)。作為反應抑制劑,例如可列舉各種有機氮化合物、有機磷化合物、乙炔系化合物、肟化合物、有機氯化合物等。尤其適宜為乙炔系化合物(例如乙炔醇類及乙炔醇之矽烷化物)。 A reaction inhibitor (a reaction inhibitor for hydrogenation) is a so-called pot life extender which suppresses the catalytic activity of the catalyst (particularly a platinum group metal catalyst) at a normal temperature and prolongs the service life of the resin composition ( Also known as retarder). Examples of the reaction inhibitor include various organic nitrogen compounds, organophosphorus compounds, acetylene compounds, hydrazine compounds, and organochlorine compounds. Particularly suitable are acetylene compounds (for example, decyl alcohols and decyl compounds of acetylene alcohols).

於複合體14中,樹脂層12之厚度只要根據複合體14(即玻璃積層體20)之用途等而適當設定即可。 In the composite 14, the thickness of the resin layer 12 may be appropriately set depending on the use of the composite 14 (that is, the glass laminate 20).

此處,根據本發明者等人之研究,樹脂層12之厚度較佳為2~100μm,更佳為3~50μm,進而較佳為7~20μm。藉由使樹脂層12之厚度為此範圍,可抑制薄板玻璃基板18之變形缺陷之產生。又,若樹脂層12過厚,則形成需要耗費時間及材料,因此並不經濟,進而,有耐熱性降低之情況。相反,若樹脂層12過薄,則有樹脂層12與薄板玻璃基板18之密接性降低之情況。 Here, the thickness of the resin layer 12 is preferably from 2 to 100 μm, more preferably from 3 to 50 μm, still more preferably from 7 to 20 μm, according to studies by the inventors of the present invention. By making the thickness of the resin layer 12 into this range, the occurrence of deformation defects of the thin glass substrate 18 can be suppressed. Further, when the resin layer 12 is too thick, it takes time and material to form, which is not economical, and further, heat resistance is lowered. On the other hand, when the resin layer 12 is too thin, the adhesion between the resin layer 12 and the thin glass substrate 18 may be lowered.

再者,樹脂層12亦可包含2層以上。於此情形時,樹脂層12之厚度意指所有層之合計厚度。 Further, the resin layer 12 may also contain two or more layers. In this case, the thickness of the resin layer 12 means the total thickness of all the layers.

又,於樹脂層12包含2層以上之情形時,形成各層之樹脂亦可為包含不同交聯性聚矽氧之樹脂。 Further, when the resin layer 12 contains two or more layers, the resin forming each layer may be a resin containing different crosslinkable polyfluorene oxide.

再者,積層於此種複合體14而構成玻璃積層體20之薄板玻璃基板18於電子器件之製造中,通常用作供薄膜電晶體等電子器件用零件形成之玻璃基板。 Further, the thin glass substrate 18 which is laminated on the composite body 14 and constitutes the glass laminate 20 is generally used as a glass substrate formed of a component for an electronic device such as a thin film transistor in the manufacture of an electronic device.

如上所述,本發明之再生方法係自將樹脂層12此種複合體14去除之方法。此處,圖1所示之本發明之再生方法中,作為較佳之態樣,於將樹脂層12去除之去除步驟之前,進行傷痕置入步驟。因此,本發明之玻璃板之再生裝置亦可具有用以進行該傷痕置入步驟之傷痕置入裝置。 As described above, the regeneration method of the present invention is a method of removing the composite 14 of the resin layer 12. Here, in the regeneration method of the present invention shown in Fig. 1, as a preferred aspect, the flaw insertion step is performed before the removal step of removing the resin layer 12. Therefore, the glass plate reproducing apparatus of the present invention may have a flaw insertion device for performing the flaw placing step.

該傷痕置入步驟係對複合體14之樹脂層12之表面(較佳為整個表面)施加如刮痕般之傷痕之步驟(使樹脂層12之表面受損之步驟)。 This flaw insertion step is a step of applying a scratch such as a scratch on the surface (preferably the entire surface) of the resin layer 12 of the composite 14 (step of impairing the surface of the resin layer 12).

藉由於去除步驟之前進行該傷痕置入步驟,使樹脂層12之表面之傷痕作為利用輥刷之刷毛及研磨劑進行之樹脂層12之去除之起點(關聯點/起始點)而發揮作用。因此,藉由進行傷痕置入步驟,可容易且高效率地進行去除步驟中之樹脂層12之去除,而可減輕去除步驟之負荷,就該等方面而言較佳。 By performing the flaw insertion step before the removal step, the flaw on the surface of the resin layer 12 functions as a starting point (correlation point/starting point) of removal of the resin layer 12 by the bristles of the roller brush and the polishing agent. Therefore, by performing the flaw insertion step, the removal of the resin layer 12 in the removal step can be easily and efficiently performed, and the load of the removal step can be alleviated, which is preferable in terms of such aspects.

關於傷痕置入步驟中之對樹脂層12之傷痕置入方法,可根據樹脂層12之硬度或形成材料等,利用可對樹脂層12置入傷痕之各種方法。即,於本發明之玻璃板之再生裝置中,關於傷痕置入裝置,可利用可對樹脂層12置入傷痕之公知之各種裝置。 Regarding the method of inserting the flaw into the resin layer 12 in the flaw insertion step, various methods of inserting a flaw into the resin layer 12 can be utilized depending on the hardness of the resin layer 12, the forming material, and the like. In other words, in the glass plate reproducing apparatus of the present invention, various known devices capable of inserting a flaw into the resin layer 12 can be used as the flaw insertion device.

作為較佳之傷痕置入方法(裝置),可例示利用輥刷之方法(裝置)。所謂輥刷,係於沿旋轉軸貫通中心而排列之複數個圓盤狀之芯材之表面(周面)、或圓柱狀之芯材之表面(周面)植設有尼龍製等之刷毛(纖維、線材、絲材)而成者。該輥刷以旋轉軸(圓盤之中心)或圓柱之中心為軸而旋轉。 As a preferred method (device) for injecting a flaw, a method (apparatus) using a roller brush can be exemplified. The roller brush is provided with a bristles made of nylon or the like on the surface (peripheral surface) of a plurality of disk-shaped core materials arranged along the center of the rotation axis or the surface (peripheral surface) of the cylindrical core material ( Fiber, wire, wire). The roller brush rotates with the axis of rotation (the center of the disk) or the center of the cylinder as the axis.

作為一例,使用輥刷之傷痕置入步驟係使樹脂層12朝上而藉由搬送輥等搬送複合體14。於該搬送路徑之中途上部,配置有使旋轉軸 與和搬送方向正交之方向一致之輥刷。輥刷係以使刷毛按壓於被搬送之複合體14(樹脂層12)之方式(壓入之方式)配置(參照圖3)。 As an example, in the flaw insertion step using the roller brush, the composite layer 14 is conveyed by a conveyance roller or the like with the resin layer 12 facing upward. In the upper part of the transport path, a rotating shaft is arranged A roller brush that is aligned with the direction orthogonal to the conveying direction. The roller brush is disposed such that the bristles are pressed against the conveyed composite 14 (resin layer 12) (in a press-fit manner) (see FIG. 3).

因此,於複合體14通過輥刷之下方時,藉由一面旋轉一面按壓之輥刷之刷毛,對樹脂層12之表面施加刮痕等傷痕。又,藉由使輥刷之寬度(旋轉軸方向之長度)長於複合體14之寬度(與搬送方向正交之方向之長度),可對樹脂層12之整個表面置入傷痕。 Therefore, when the composite 14 passes under the roller brush, scratches such as scratches are applied to the surface of the resin layer 12 by the bristles of the roller brush pressed while rotating. Further, by making the width of the roller brush (the length in the direction of the rotation axis) longer than the width of the composite 14 (the length in the direction orthogonal to the conveyance direction), the entire surface of the resin layer 12 can be scratched.

或者,亦可不搬送複合體14而將複合體14固定,沿與旋轉方向正交之方向搬送輥刷,藉此使複合體14通過旋轉之輥刷之附近。 Alternatively, the composite body 14 may be fixed without moving the composite body 14, and the roller brush may be conveyed in a direction orthogonal to the rotation direction, whereby the composite body 14 is passed around the rotating roller brush.

傷痕置入步驟中之對樹脂層12之傷痕置入除利用輥刷之方法以外,亦可利用使用傷痕置入機構之各種方法。作為一例,亦可利用如下方法:使用如剃刀般之前端銳利之構件或梳齒狀構件,將該等按壓於樹脂層12,並使傷痕置入機構與複合體14相對地移動。 In addition to the method of using a roller brush, the flaw of the resin layer 12 in the flaw insertion step may be various methods using a flaw insertion mechanism. As an example, a method may be employed in which a member such as a razor-like front end or a comb-tooth member is used, and the resin layer 12 is pressed against the resin layer 12, and the flaw insertion mechanism is moved relative to the composite body 14.

於傷痕置入步驟中,可藉由調節輥刷或梳齒狀構件等傷痕置入機構之硬度、刷毛之壓入量等傷痕置入機構之按壓力、傷痕置入機構與樹脂層12之相對移動速度、刷毛等與樹脂層12接觸之構件之硬度(韌性)、密度、大小等,而調節施加於樹脂層12之傷痕之深度、傷痕之密度、傷痕之大小等。 In the scar insertion step, the pressing force of the flaw insertion mechanism such as the hardness of the flaw insertion mechanism such as the roller brush or the comb-tooth member, the pressing amount of the bristles, and the like, the relative relationship between the flaw insertion mechanism and the resin layer 12 can be adjusted. The hardness (toughness), density, size, and the like of the member that is in contact with the resin layer 12 such as the moving speed, the bristles, and the like, and the depth of the flaw applied to the resin layer 12, the density of the flaw, the size of the flaw, and the like are adjusted.

作為一例,傷痕置入步驟較佳為進行至可目視到因施加於樹脂層12之傷痕而引起之白濁之程度。 As an example, the flaw insertion step is preferably performed to such an extent that white turbidity due to a flaw applied to the resin layer 12 is visually observed.

去除步驟係將樹脂層12自複合體14(其玻璃板10)去除之步驟。 The removing step is a step of removing the resin layer 12 from the composite 14 (its glass plate 10).

於本發明中,樹脂層12之去除係使用研磨劑及輥刷而進行。具體而言,可適宜地例示如下方法:使用使作為研磨劑之游離研磨粒分散於水等中而成之漿料,藉由利用輥刷進行之研削將樹脂層12去除。 In the present invention, the removal of the resin layer 12 is carried out using an abrasive and a roller brush. Specifically, a method in which a slurry obtained by dispersing free abrasive grains as an abrasive in water or the like is used, and the resin layer 12 is removed by grinding with a roller brush.

關於游離研磨粒,可利用氧化鈰、碳酸鈣、硬質塑膠、POLY-PLUS、桃核粉末、氧化鋯等各種公知之游離研磨粒。其中,就良好之研磨性、獲取之容易性、價格等方面而言,可較佳地利用碳酸鈣。 As the free abrasive grains, various known free abrasive grains such as cerium oxide, calcium carbonate, hard plastic, POLY-PLUS, peach kernel powder, and zirconia can be used. Among them, calcium carbonate can be preferably used in terms of good abrasiveness, ease of acquisition, price, and the like.

該等游離研磨粒可單獨使用,或亦可組合複數種而使用。 These free abrasive grains may be used singly or in combination of plural kinds.

又,游離研磨粒之數量平均粒徑較佳為1~10μm。 Further, the number average particle diameter of the free abrasive grains is preferably from 1 to 10 μm.

游離研磨粒較佳為分散於水等中而製成漿料加以使用。 The free abrasive grains are preferably dispersed in water or the like to be used as a slurry.

漿料中之游離研磨粒之濃度只要根據所使用之游離研磨粒、樹脂層12之形成材料、樹脂層12之厚度、輥刷之種類或操作條件(壓入量或轉數等)等適當設定即可。 The concentration of the free abrasive grains in the slurry is appropriately set depending on the free abrasive grains to be used, the material for forming the resin layer 12, the thickness of the resin layer 12, the type of the roller brush, or the operating conditions (pressing amount or number of revolutions, etc.). Just fine.

此處,根據本發明者等人之研究,漿料中之游離研磨粒之濃度較佳為5質量%以上,更佳為10質量%以上。藉由將漿料中之游離研磨粒之濃度設為5質量%以上,可穩定地以良好之效率進行樹脂層12之去除。 Here, the concentration of the free abrasive grains in the slurry is preferably 5% by mass or more, and more preferably 10% by mass or more, according to studies by the inventors of the present invention. By setting the concentration of the free abrasive grains in the slurry to 5% by mass or more, the removal of the resin layer 12 can be stably performed with good efficiency.

又,通常,漿料中之游離研磨粒之濃度越高,樹脂層12之去除效率越良好。然而,若漿料中之游離研磨粒之濃度達到一定程度之濃度,則即便進一步高濃度化,樹脂層12之去除效率之提高亦較少,添加至漿料中之游離研磨粒無法被有效地利用。相對於此,藉由將漿料中之游離研磨粒之濃度設為30質量%以下,可不浪費地有效利用添加至漿料中之游離研磨粒。 Further, generally, the higher the concentration of the free abrasive grains in the slurry, the better the removal efficiency of the resin layer 12. However, if the concentration of the free abrasive grains in the slurry reaches a certain concentration, even if the concentration is further increased, the removal efficiency of the resin layer 12 is less increased, and the free abrasive grains added to the slurry cannot be effectively use. On the other hand, by setting the concentration of the free abrasive grains in the slurry to 30% by mass or less, the free abrasive grains added to the slurry can be effectively utilized without waste.

於本發明之再生方法中,使用研磨劑之樹脂層12之去除係使用如上所述之輥刷而進行。 In the regeneration method of the present invention, the removal of the resin layer 12 using the abrasive is carried out using the roller brush as described above.

利用輥刷進行之樹脂層之去除係利用機械、物理作用之去除。 因此,可藉由提高輥刷之轉數(周速),容易地使刷毛以更高之頻度作用於樹脂,而可適宜地去除樹脂層14。 The removal of the resin layer by the roller brush is removed by mechanical and physical action. Therefore, the resin layer 14 can be suitably removed by increasing the number of revolutions of the roller brush (circumferential speed) to easily apply the bristles to the resin at a higher frequency.

輥刷之刷毛可利用包含各種材料者。具體而言,可較佳地例示尼龍製之刷毛(刷毛為尼龍製之輥刷)。藉由使用尼龍製之刷毛,就裝置之獲取較容易,可穩定地去除樹脂層12,可抑制玻璃板10之損傷,並且進行高效率之樹脂層12之去除等方面而言較佳。 The bristles of the roller brush can be utilized with various materials. Specifically, a bristles made of nylon (roller brushes made of nylon) can be preferably exemplified. By using the bristles made of nylon, the device can be easily obtained, the resin layer 12 can be stably removed, the damage of the glass plate 10 can be suppressed, and the removal of the resin layer 12 with high efficiency can be preferably performed.

又,刷毛(尤其為尼龍刷毛)之線徑較佳為0.05mm以上,更佳為 0.1mm以上,尤佳為0.2mm以上。藉由使用線徑為0.05mm以上之刷毛,可高效率地將樹脂層14去除。 Moreover, the wire diameter of the bristles (especially nylon bristles) is preferably 0.05 mm or more, more preferably 0.1 mm or more, particularly preferably 0.2 mm or more. By using the bristles having a wire diameter of 0.05 mm or more, the resin layer 14 can be removed efficiently.

刷毛之線徑較佳為0.6mm以下,更佳為0.5mm以下。藉由將刷毛之線徑設為0.6mm以下,可防止將樹脂層14去除時之玻璃板10之損傷,減輕其後之研磨步驟之負擔。 The wire diameter of the bristles is preferably 0.6 mm or less, more preferably 0.5 mm or less. By setting the wire diameter of the bristles to 0.6 mm or less, damage of the glass plate 10 when the resin layer 14 is removed can be prevented, and the burden of the subsequent polishing step can be reduced.

將使用輥刷實施樹脂層12之去除步驟之去除裝置之一例概念性地示於圖3。 An example of a removing device for removing the resin layer 12 using a roller brush is conceptually shown in FIG.

於該樹脂層12之去除(去除裝置)中,使樹脂層12朝上,一面藉由搬送輥36沿圖中箭頭x方向搬送複合體14,一面進行樹脂層12之去除。 In the removal (removal device) of the resin layer 12, the resin layer 12 is removed while the resin layer 12 is facing upward, and the composite 14 is conveyed by the conveyance roller 36 in the direction of the arrow x in the figure.

於該搬送路徑之中途上部,配置有使旋轉軸與和複合體14之搬送方向正交之方向一致之輥刷30。輥刷30之旋轉軸方向之長度長於該方向之複合體14之長度。又,輥刷30係以使刷毛30a按壓於由搬送輥36搬送之複合體14(樹脂層12)之方式(壓入之方式)配置。即,輥刷30係以使輥刷30之旋轉中心至複合體14之距離比輥刷30之旋轉中心至刷毛30a之前端之距離短之方式配置。 A roller brush 30 that aligns the rotating shaft and the direction orthogonal to the conveying direction of the composite 14 is disposed in the upper portion of the conveying path. The length of the roller brush 30 in the direction of the rotation axis is longer than the length of the composite body 14 in this direction. Further, the roller brush 30 is disposed such that the bristles 30a are pressed against the composite 14 (resin layer 12) conveyed by the conveyance roller 36 (in a press-fit manner). That is, the roller brush 30 is disposed such that the distance from the center of rotation of the roller brush 30 to the composite body 14 is shorter than the distance from the center of rotation of the roller brush 30 to the front end of the bristles 30a.

又,於輥刷30之上方,配置有滴加裝置32,對輥刷30滴加分散有游離研磨粒之漿料。 Further, a dropping device 32 is disposed above the roller brush 30, and a slurry in which free abrasive grains are dispersed is dropped onto the roller brush 30.

因此,於複合體14通過輥刷30之下方時,藉由一面旋轉一面被按壓之輥刷30之刷毛30a、及附著於刷毛30a之漿料之游離研磨粒,將樹脂層12自複合體14削除而去除,從而成為單板之玻璃板10。 Therefore, when the composite body 14 passes under the roller brush 30, the resin layer 12 is self-composite 14 by rotating the bristles 30a of the roller brush 30 pressed against one surface and the free abrasive grains of the slurry adhered to the bristles 30a. It is removed and removed to become a single-plate glass plate 10.

關於自滴加裝置32之漿料之滴加量、複合體14之搬送速度、輥刷30之轉數、刷毛30a向樹脂層12之壓入量等,只要根據所使用之游離研磨粒、漿料之濃度、樹脂層12之形成材料、樹脂層12之厚度、刷毛30a之線徑或長度等,適當設定可適宜地去除樹脂層12之條件即可。 The amount of the slurry to be dropped from the dropping device 32, the conveying speed of the composite 14, the number of revolutions of the roller brush 30, the amount of the bristles 30a to be pressed into the resin layer 12, and the like, as long as the free abrasive grains and pulp are used. The concentration of the material, the material for forming the resin layer 12, the thickness of the resin layer 12, the wire diameter or length of the bristles 30a, and the like may be appropriately set to appropriately remove the resin layer 12.

雖然亦取決於輥刷30之尺寸或轉數、刷毛30a之線徑等,但關於刷毛30a之壓入量,作為一例,較佳為0.5~5mm,更佳為1~3mm。 藉由將刷毛之壓入量設為該範圍,可防止玻璃板10之損傷,並且可更高效率地去除樹脂層14。 Although the size or the number of revolutions of the roller brush 30 and the wire diameter of the bristles 30a are also used, the amount of the bristles 30a to be pressed is preferably 0.5 to 5 mm, more preferably 1 to 3 mm. By setting the amount of pressing of the bristles to this range, damage of the glass sheet 10 can be prevented, and the resin layer 14 can be removed more efficiently.

又,使用輥刷30將樹脂層12自玻璃板10去除既可藉由使複合體14通過輥刷30之下方1次而進行,或亦可藉由使複合體14通過輥刷30之下方複數次而進行。 Further, the removal of the resin layer 12 from the glass sheet 10 by using the roller brush 30 may be performed by passing the composite body 14 one time under the roller brush 30, or by passing the composite body 14 under the roller brush 30. The second time.

再者,圖3所示之例中,藉由將輥刷30固定並搬送複合體14而進行樹脂層12之去除,但反之亦可藉由將複合體14固定並移動輥刷30(或進而移動滴加裝置32)而進行樹脂層12之去除。 Further, in the example shown in FIG. 3, the resin layer 12 is removed by fixing the roller brush 30 and transporting the composite 14, but conversely, the composite 14 can be fixed and moved by the roller brush 30 (or further) The removal of the resin layer 12 is performed by moving the dropping device 32).

又,分散有游離研磨粒(研磨劑)之漿料不限定於供給至輥刷30,亦可於輥刷與複合體14之相對移動中之輥刷30之上游側,供給至樹脂層12之表面。即,若為圖3所示之例,則亦可於輥刷30之圖中左側配置滴加裝置32,而將漿料供給至樹脂層12之表面。或者亦可對輥刷30與輥刷30之上游側之樹脂層12之表面之兩者供給漿料。 Further, the slurry in which the free abrasive grains (abrasive agent) is dispersed is not limited to being supplied to the roller brush 30, and may be supplied to the resin layer 12 on the upstream side of the roller brush 30 in the relative movement of the roller brush and the composite body 14. surface. That is, in the example shown in FIG. 3, the dropping device 32 may be disposed on the left side of the roller brush 30, and the slurry may be supplied to the surface of the resin layer 12. Alternatively, the slurry may be supplied to both the roller brush 30 and the surface of the resin layer 12 on the upstream side of the roller brush 30.

將樹脂層12自複合體14去除後,進行對已去除樹脂層12之側之玻璃板10之表面進行研磨之研磨步驟。 After the resin layer 12 is removed from the composite 14, a polishing step of polishing the surface of the glass sheet 10 on the side from which the resin layer 12 has been removed is performed.

如上所述,於本發明之再生方法中,藉由使用游離研磨粒等研磨劑之研削將樹脂層12去除。因此,於玻璃板10之樹脂層去除面會產生因研磨劑而導致之傷痕,表面性狀會劣化,進而,玻璃板10之強度亦降低。 As described above, in the regeneration method of the present invention, the resin layer 12 is removed by grinding using an abrasive such as free abrasive grains. Therefore, the surface of the resin layer removed from the glass sheet 10 is scratched by the polishing agent, the surface properties are deteriorated, and the strength of the glass sheet 10 is also lowered.

相對於此,於本發明之再生方法中,將樹脂層12去除後,對玻璃板10之表面進行研磨,藉此可確保所製造之玻璃板10之強度,並且亦使表面性狀良好。 On the other hand, in the regeneration method of the present invention, after the resin layer 12 is removed, the surface of the glass plate 10 is polished, whereby the strength of the glass plate 10 to be produced can be ensured, and the surface properties are also good.

再者,於本發明之再生方法中,於研磨步驟中,不僅可進行已去除樹脂層12之面之研磨,亦可進行相反側之面(玻璃板10之未形成 樹脂層12之面)之研磨。即,於研磨步驟中,亦可研磨玻璃板10之兩面。 Further, in the regenerating method of the present invention, not only the polishing of the surface on which the resin layer 12 has been removed but also the surface on the opposite side may be performed in the polishing step (the glass sheet 10 is not formed). Grinding of the surface of the resin layer 12). That is, both sides of the glass plate 10 can be polished in the polishing step.

於複合體14中,玻璃板10之未形成樹脂層12之面成為露出之狀態。又,於玻璃積層體20之狀態下,玻璃板10之未形成樹脂層12之面亦成為露出之狀態。因此,例如,玻璃板10之未形成樹脂層12之面因操作時與其他構件之滑動接觸、形成電子器件時之加熱或液體處理等而使表面受損之情形亦較多。 In the composite 14, the surface of the glass sheet 10 on which the resin layer 12 is not formed is exposed. Further, in the state of the glass laminate 20, the surface of the glass sheet 10 on which the resin layer 12 is not formed is also exposed. Therefore, for example, the surface of the glass sheet 10 on which the resin layer 12 is not formed is often damaged by sliding contact with other members during operation, heating or liquid treatment when forming an electronic device, and the like.

應對該情況,於本發明之再生方法中,不僅可對玻璃板10之形成有樹脂層12之面進行研磨,亦可於去除樹脂層12後,對未形成樹脂層12之面進行研磨。 In response to this, in the regeneration method of the present invention, not only the surface of the glass sheet 10 on which the resin layer 12 is formed but also the surface on which the resin layer 12 is not formed may be polished.

研磨步驟中,關於玻璃板10之研磨方法,可利用各種公知之玻璃板之研磨方法。即,於本發明之玻璃板之再生裝置中,研磨裝置可利用公知之各種玻璃板之研磨裝置。 In the polishing step, various polishing methods of glass plates can be used for the polishing method of the glass plate 10. That is, in the regenerating apparatus for a glass sheet of the present invention, the polishing apparatus can use a polishing apparatus of various known glass sheets.

作為一例,可例示如下方法(裝置):將保持於載體之玻璃板抵壓於設置於研磨壓盤之研磨墊,並且使研磨壓盤及載體相對地旋轉而對玻璃板進行研磨。作為其他方法,可例示如下方法(裝置):使玻璃板吸附保持於固定於平台之吸附片材,一面沿特定方向搬送平台,一面藉由設置於其搬送路徑之上方之研磨機之複數個研磨具對玻璃板進行研磨,該等研磨具具有大於玻璃板之直徑,且按照特定之旋轉中心進行自轉及公轉。 As an example, a method (apparatus) is described in which a glass plate held on a carrier is pressed against a polishing pad provided on a polishing platen, and the polishing platen and the carrier are relatively rotated to polish the glass plate. As another method, a method (apparatus) in which a glass plate is adsorbed and held on an adsorption sheet fixed to a stage and a platform is conveyed in a specific direction while being multi-grinded by a grinder disposed above the conveyance path The glass sheets are ground, and the grinding tools have a diameter larger than that of the glass sheets, and are rotated and revolved according to a specific rotation center.

視需要對研磨墊等對玻璃板進行研磨之構件供給將研磨劑分散於水等中而成之研磨漿料。 A member obtained by polishing a glass plate such as a polishing pad or the like is supplied with a polishing slurry obtained by dispersing an abrasive in water or the like.

於本發明之再生方法中,關於玻璃板10之已去除樹脂層12之面之研磨量,只要適當設定可消除因樹脂層12之去除而導致之損傷之研磨量即可。 In the regeneration method of the present invention, the amount of polishing of the surface of the glass sheet 10 from which the resin layer 12 has been removed may be appropriately set so as to eliminate the amount of polishing caused by the removal of the resin layer 12.

雖然亦取決於已去除樹脂層12之玻璃板10之表面之狀態,但根 據本發明者等人之研究,通常,若將已去除樹脂層12之面研磨0.3~2μm左右,則可適宜地消除因樹脂層12之去除而導致之損傷,從而獲得充分之強度及良好之表面性狀。 Although it also depends on the state of the surface of the glass sheet 10 from which the resin layer 12 has been removed, the root According to the study by the inventors of the present invention, in general, when the surface of the resin layer 12 has been removed by polishing to a thickness of about 0.3 to 2 μm, damage due to removal of the resin layer 12 can be suitably eliminated, thereby obtaining sufficient strength and goodness. Surface properties.

又,研磨量以少為佳。若考慮該方面,則較佳為以0.3~0.5μm之研磨量以玻璃板10可恢復充分之強度之方式進行樹脂層12之去除。 Moreover, the amount of polishing is preferably small. In consideration of this aspect, it is preferable to remove the resin layer 12 so that the glass plate 10 can recover sufficient strength with a polishing amount of 0.3 to 0.5 μm.

再者,關於玻璃板10之未形成樹脂層12之面之研磨量,只要根據該面之損傷狀態等適當設定即可。 In addition, the amount of polishing of the surface of the glass sheet 10 on which the resin layer 12 is not formed may be appropriately set depending on the damage state of the surface or the like.

關於以此方式製造之玻璃板10,如上所述,可再利用於與複合體14不同之玻璃製品,或者再次形成樹脂層12,製成複合體14而加以再利用。 As described above, the glass sheet 10 produced in this manner can be reused in a glass product different from the composite 14 or the resin layer 12 can be formed again to form the composite 14 and reused.

以上,對本發明之玻璃板之再生方法及再生裝置詳細地進行了說明,但本發明不限定於上述實施形態,當然,亦可於不脫離本發明之要旨之範圍內進行各種改良或變更。 In the above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

<再生之玻璃板之再利用> <Recycling of recycled glass sheets>

去除樹脂層12後之玻璃板10可進行各種再利用。例如,於將樹脂層12去除後,重新形成樹脂層,藉此可製成帶有樹脂層之玻璃板而加以利用。又,亦可將去除樹脂層12後之玻璃板10直接用作大型顯示器用之基板等。 The glass sheet 10 from which the resin layer 12 is removed can be variously reused. For example, after the resin layer 12 is removed, the resin layer is newly formed, whereby a glass plate with a resin layer can be used and used. Further, the glass sheet 10 from which the resin layer 12 is removed can be directly used as a substrate for a large-sized display or the like.

無論於何種情形時,均由於剝離後之玻璃板10之端部之強度容易降低,故而較佳為對端部實施倒角後再進行再利用。玻璃板10之倒角既可於玻璃板10上附有樹脂層12之狀態下進行,亦可於將樹脂層12自玻璃板10去除後進行。 In any case, since the strength of the end portion of the glass sheet 10 after peeling is likely to be lowered, it is preferable to perform chamfering on the end portion and then reuse it. The chamfering of the glass plate 10 may be performed in a state in which the resin layer 12 is attached to the glass plate 10, or may be performed after the resin layer 12 is removed from the glass plate 10.

[實施例] [Examples]

以下,示出本發明之具體實施例,更詳細地對本發明進行說明。 Hereinafter, the present invention will be described in more detail with reference to specific embodiments of the invention.

<樹脂組合物之製備> <Preparation of Resin Composition>

將作為成分(A)之直鏈狀乙烯基甲基聚矽氧烷(「VDT-127」,25℃下之黏度700-800cP(厘泊):Azmax製造,有機聚矽氧烷1mol中之乙烯基之mol%:0.325)與作為成分(B)之直鏈狀甲基氫聚矽氧烷(「HMS-301」,25℃下之黏度25-35cP(厘泊):Azmax製造,1分子內之鍵結於矽原子之氫原子之數量:8個),以全部乙烯基與全部鍵結於矽原子之氫原子之莫耳比(氫原子/乙烯基)成為0.9之方式混合。 A linear vinyl methyl polyoxyalkylene as a component (A) ("VDT-127", viscosity at 25 ° C, 700-800 cP (centipoise): Azmax, ethylene in 1 mol of organic polyoxane Molar % of base: 0.325) and linear methyl hydrogen polyoxyalkylene as component (B) ("HMS-301", viscosity at 25 ° C 25-35 cP (centipoise): Azmax, 1 molecule) The number of hydrogen atoms bonded to the ruthenium atom: 8) is mixed in such a manner that the molar ratio (hydrogen atom/vinyl group) of all the vinyl groups to the hydrogen atom bonded to the ruthenium atom is 0.9.

相對於該矽氧烷混合物100質量份,混合1質量份之作為成分(C)之下述式(1)所表示之具有乙炔系不飽和基之矽化合物(沸點:120℃)。 1 part by mass of the oxime compound having an acetylene-based unsaturated group represented by the following formula (1) as a component (C) (boiling point: 120 ° C) is mixed with 100 parts by mass of the mixture of the oxirane.

HC≡C-C(CH3)2-O-Si(CH3)3 式(1) HC≡CC(CH 3 ) 2 -O-Si(CH 3 ) 3 (1)

繼而,相對於成分(A)、成分(B)、及成分(C)之合計量,以按鉑換算計鉑金屬濃度成為100ppm之方式添加鉑系觸媒(信越聚矽氧股份有限公司製造,CAT-PL-56),而獲得有機聚矽氧烷組合物之混合液。 Then, a platinum-based catalyst (manufactured by Shin-Etsu Chemical Co., Ltd.) was added to the total amount of the component (A), the component (B), and the component (C) so that the platinum metal concentration was 100 ppm in terms of platinum. CAT-PL-56), and a mixture of organopolyoxane compositions was obtained.

進而,相對於所獲得之混合液100質量份,添加150質量份之IP Solvent2028(初餾點:213~262℃,出光興產製造),而製備未硬化之包含交聯性有機聚矽氧烷之樹脂組合物。 Furthermore, 150 parts by mass of IP Solvent 2028 (initial boiling point: 213 to 262 ° C, manufactured by Idemitsu Kogyo Co., Ltd.) was added to 100 parts by mass of the obtained mixed liquid to prepare an unhardened crosslinkable organic polyoxyalkylene. A resin composition.

<複合體14之製作> <Production of Composite 14>

使用藉由浮式法而獲得之長度720mm×寬度600mm×厚度0.4mm之玻璃板(旭硝子公司製造,AN100,無鹼玻璃,線膨脹係數38×10-7/℃)作為複合體之玻璃板10。對該玻璃板10之一面進行純水洗淨及UV(ultraviolet,紫外線)洗淨,使表面潔淨化。 A glass plate (length manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass, linear expansion coefficient: 38×10 -7 /° C.) having a length of 720 mm × a width of 600 mm × a thickness of 0.4 mm obtained by a floating method was used as a composite glass plate 10 . . One surface of the glass plate 10 was washed with pure water and UV (ultraviolet) to clean the surface.

藉由旋轉塗佈機於玻璃板10之經潔淨化之面塗佈所製備之樹脂組合物。 The prepared resin composition was applied to the cleaned surface of the glass plate 10 by a spin coater.

進而,將樹脂組合物於大氣中以180℃加熱硬化30分鐘,而製作具有厚度8μm之樹脂層12(聚矽氧樹脂層)之如圖2(A)所示之複合體14。 Further, the resin composition was heat-hardened at 180 ° C for 30 minutes in the air to prepare a composite 14 having a resin layer 12 (polyoxymethylene resin layer) having a thickness of 8 μm as shown in Fig. 2(A).

[實施例1] [Example 1]

使用如圖3所示之裝置,將樹脂層12自成為原材料之複合體14去除。 The resin layer 12 is removed from the composite 14 which is a raw material using the apparatus shown in FIG.

輥刷30之輥徑為38mm,刷毛30a為尼龍製,線徑為0.2mm,長度為9mm。 Roller diameter of roller brush 30 It is 38 mm, and the bristles 30a are made of nylon, and have a wire diameter of 0.2 mm and a length of 9 mm.

該輥刷30之轉數係設為600rpm,刷毛30a之壓入量係設為0.7mm,複合體14之搬送速度係設為1m/min(分鐘)。 The number of revolutions of the roller brush 30 was set to 600 rpm, the amount of press of the bristles 30a was set to 0.7 mm, and the conveyance speed of the composite 14 was set to 1 m/min (minute).

又,自滴加裝置32對輥刷30滴加使碳酸鈣分散於水中而成之漿料。碳酸鈣之濃度係設為5質量%。 Further, a slurry obtained by dispersing calcium carbonate in water is added to the roller brush 30 from the dropping device 32. The concentration of calcium carbonate was set to 5% by mass.

於該條件下,使複合體14通過輥刷30下方4次,而進行樹脂層12自複合體14之去除(通過數4次)。 Under this condition, the composite 14 was passed through the roller brush 30 four times, and the resin layer 12 was removed from the composite 14 (by number four times).

進而,使用氧化鈰漿料,藉由絨面革製之研磨墊將玻璃板10之已剝離樹脂層12之面研磨0.5μm,而使玻璃板10再生。 Further, the surface of the peeled resin layer 12 of the glass plate 10 was ground by 0.5 μm using a cerium oxide slurry by a polishing pad made of suede, and the glass plate 10 was regenerated.

[實施例2] [Embodiment 2]

於樹脂層12之去除中,將刷毛30a之線徑變更為0.3mm,將刷毛30a之壓入量變更為2.5mm,將複合體14之搬送速度變更為0.5m/min,除此以外,以與實施例1相同之方式使玻璃板10再生。 In the removal of the resin layer 12, the wire diameter of the bristles 30a is changed to 0.3 mm, the pressing amount of the bristles 30a is changed to 2.5 mm, and the conveying speed of the composite 14 is changed to 0.5 m/min. The glass plate 10 was regenerated in the same manner as in the first embodiment.

[實施例3] [Example 3]

於樹脂層12之去除中,將刷毛30a之線徑變更為0.3mm,將刷毛30a之壓入量變更為2mm,將複合體14之搬送速度變更為0.5m/min,將漿料之碳酸鈣濃度變更為10質量%,除此以外,以與實施例1相同之方式使玻璃板10再生。 In the removal of the resin layer 12, the wire diameter of the bristles 30a was changed to 0.3 mm, the amount of pressing of the bristles 30a was changed to 2 mm, and the conveying speed of the composite 14 was changed to 0.5 m/min, and the slurry of calcium carbonate was added. The glass plate 10 was regenerated in the same manner as in Example 1 except that the concentration was changed to 10% by mass.

[實施例4] [Example 4]

於樹脂層12之去除中,將刷毛30a之壓入量變更為2mm,將複合體14之搬送速度變更為0.5m/min,將漿料之碳酸鈣濃度變更為10質量%,除此以外,以與實施例1相同之方式使玻璃板10再生。 In the removal of the resin layer 12, the amount of pressing of the bristles 30a is changed to 2 mm, the conveying speed of the composite 14 is changed to 0.5 m/min, and the calcium carbonate concentration of the slurry is changed to 10% by mass. The glass plate 10 was regenerated in the same manner as in the first embodiment.

[實施例5] [Example 5]

於樹脂層12之去除中,將刷毛30a之線徑變更為0.3mm,將刷毛30a之壓入量變更為2mm,將複合體14之搬送速度變更為0.5m/min,將漿料之碳酸鈣濃度變更為20質量%,除此以外,以與實施例1相同之方式使玻璃板10再生。 In the removal of the resin layer 12, the wire diameter of the bristles 30a was changed to 0.3 mm, the amount of pressing of the bristles 30a was changed to 2 mm, and the conveying speed of the composite 14 was changed to 0.5 m/min, and the slurry of calcium carbonate was added. The glass plate 10 was regenerated in the same manner as in Example 1 except that the concentration was changed to 20% by mass.

[實施例6] [Embodiment 6]

於樹脂層12之去除中,將刷毛30a之線徑變更為0.3mm,將刷毛30a之壓入量變更為2mm,將複合體14之搬送速度變更為0.5m/min,將漿料之碳酸鈣濃度變更為30質量%,除此以外,以與實施例1相同之方式使玻璃板10再生。 In the removal of the resin layer 12, the wire diameter of the bristles 30a was changed to 0.3 mm, the amount of pressing of the bristles 30a was changed to 2 mm, and the conveying speed of the composite 14 was changed to 0.5 m/min, and the slurry of calcium carbonate was added. The glass plate 10 was regenerated in the same manner as in Example 1 except that the concentration was changed to 30% by mass.

[比較例1] [Comparative Example 1]

於樹脂層12之去除中,使用圓盤刷代替輥刷30。該圓盤刷之圓盤刷直徑為70mm,且為發泡胺基甲酸酯製,厚度為70mm。該發泡胺基甲酸酯以蕭氏E硬度計為10°。 In the removal of the resin layer 12, a disc brush is used instead of the roller brush 30. The disc brush diameter of the disc brush It is 70 mm and is made of foaming urethane and has a thickness of 70 mm. The foaming urethane was 10 ° in terms of Shore E hardness.

又,圓盤刷之轉數係設為200rpm,圓盤刷之壓入量係設為0.2mm,複合體14之搬送速度係設為1.3mm/min。進而,通過數係設為20次。 Further, the number of revolutions of the disk brush was set to 200 rpm, the amount of press of the disk brush was set to 0.2 mm, and the conveyance speed of the composite 14 was set to 1.3 mm/min. Further, the number system was set to 20 times.

除此以外,以與實施例1相同之方式使玻璃板10再生。 Except for this, the glass plate 10 was regenerated in the same manner as in the first embodiment.

[比較例2] [Comparative Example 2]

於樹脂層12之去除中,使用於比較例1中使用之圓盤刷之表面安裝有研磨墊之圓盤刷。研磨墊為發泡胺基甲酸酯製,厚度為2mm。該發泡胺基甲酸酯以蕭氏E硬度計為60°。 In the removal of the resin layer 12, a disk brush to which a polishing pad was attached to the surface of the disk brush used in Comparative Example 1 was used. The polishing pad was made of foamed urethane and had a thickness of 2 mm. The foaming urethane was 60° in Shore E hardness.

又,圓盤刷之轉數係設為200rpm,研磨墊之壓入量係設為0.2mm,複合體14之搬送速度係設為1.3mm/min。進而,通過數係設為20次。 Further, the number of revolutions of the disk brush was set to 200 rpm, the amount of press of the polishing pad was set to 0.2 mm, and the conveyance speed of the composite 14 was set to 1.3 mm/min. Further, the number system was set to 20 times.

除此以外,以與實施例1相同之方式使玻璃板10再生。 Except for this, the glass plate 10 was regenerated in the same manner as in the first embodiment.

[比較例3] [Comparative Example 3]

於樹脂層12之去除中,使用圓盤刷代替輥刷30。該圓盤刷之圓盤刷直徑為70mm,且為尼龍不織布製,厚度為20mm。該尼龍不織布為0.05mm之尼龍纖維製,且以蕭氏E硬度計為20°。 In the removal of the resin layer 12, a disc brush is used instead of the roller brush 30. The disc brush diameter of the disc brush It is 70mm and is made of nylon non-woven fabric and has a thickness of 20mm. The nylon nonwoven fabric was made of 0.05 mm nylon fiber and was 20° in Shore E hardness.

又,圓盤刷之轉數係設為200rpm,圓盤刷之壓入量係設為0.2mm,複合體14之搬送速度係設為1.3mm/min。進而,通過數係設為20次。 Further, the number of revolutions of the disk brush was set to 200 rpm, the amount of press of the disk brush was set to 0.2 mm, and the conveyance speed of the composite 14 was set to 1.3 mm/min. Further, the number system was set to 20 times.

除此以外,以與實施例1相同之方式使玻璃板10再生。 Except for this, the glass plate 10 was regenerated in the same manner as in the first embodiment.

<評價> <evaluation>

關於以此方式再生之玻璃板10,對於樹脂層12之去除性、已去除樹脂層12之研磨前之玻璃板10之強度、及進行研磨後之玻璃板10之強度進行評價。 The glass sheet 10 thus regenerated in this manner was evaluated for the removability of the resin layer 12, the strength of the glass sheet 10 before the removal of the resin layer 12, and the strength of the glass sheet 10 after polishing.

<樹脂層12之去除性> <Removability of Resin Layer 12>

樹脂層12之去除性係藉由目視進行評價。具體而言,將樹脂層12全部被去除之情形評價為○;將確認到部分樹脂層12殘留之情形評價為△;及將於整個面殘留有樹脂層12之情形評價為×。 The removability of the resin layer 12 was evaluated by visual observation. Specifically, the case where all of the resin layer 12 was removed was evaluated as ○; the case where the partial resin layer 12 remained was evaluated as Δ; and the case where the resin layer 12 remained on the entire surface was evaluated as ×.

<玻璃板10之強度(球環法)> <Strength of Glass Plate 10 (Ball Ring Method)>

已去除樹脂層12之研磨前及研磨後之玻璃板10之強度係將已去除樹脂層12之面作為測定面,藉由球環法(Ball on Ring)進行測定。 The strength of the glass sheet 10 before and after the polishing of the resin layer 12 was removed, and the surface on which the resin layer 12 was removed was taken as a measurement surface, and measured by a ball on ring method.

球環法係藉由如下方式進行:以使中心一致之方式將玻璃板10載置於直徑30mm、且上端具有曲率半徑2.5mm之弧度之不鏽鋼製之環(圓筒)上,於使直徑10mm之包含鋼之球體接觸環之中心之狀態下,於靜態荷重條件下對該球體施加荷重,並測定破壞玻璃板10之荷重(N)。 The ball and ring method is carried out by placing the glass plate 10 on a stainless steel ring (cylinder) having a diameter of 30 mm and an arc having a curvature radius of 2.5 mm at the upper end so that the diameter is 10 mm. In the state in which the center of the steel ball contact ring is included, a load is applied to the ball under a static load condition, and the load (N) of the glass plate 10 is measured.

將結果示於下述表。 The results are shown in the following table.

比較例1中,使用蕭氏E硬度10°之發泡胺基甲酸酯製之圓盤刷 In Comparative Example 1, a disk brush made of a foamed urethane having a Shore E hardness of 10° was used.

比較例2中,於比較例1之圓盤刷上安裝蕭氏E硬度60°之發泡胺基甲酸酯製之研磨墊 In Comparative Example 2, a polishing pad made of a foamed urethane having a Shore E hardness of 60° was attached to the disk brush of Comparative Example 1.

比較例3中,使用蕭氏E硬度20°之尼龍不織布製之圓盤刷 In Comparative Example 3, a disc brush made of nylon non-woven fabric having a Shore E hardness of 20° was used.

比較例1~3中,輥徑為圓盤直徑 In Comparative Examples 1 to 3, the roll diameter was the diameter of the disk.

如上述表所示,根據本發明,可將樹脂層12自複合體14去除,而使具有與一般之研磨玻璃相同程度之強度且具有300N左右或其以上之強度之玻璃板10再生。 As shown in the above table, according to the present invention, the resin layer 12 can be removed from the composite body 14, and the glass sheet 10 having the same strength as that of the general abrasive glass and having a strength of about 300 N or more can be regenerated.

再者,實施例1及實施例2中,樹脂層12之去除性之評價為△,但由於藉由研磨將樹脂層12去除,因此無實用上之問題。又,由於使用輥刷進行樹脂層12之去除,因此可藉由壓入量、轉數或搬送速度等若干條件變更而順利且容易地將整個面之樹脂層12去除。 Further, in Example 1 and Example 2, the removability of the resin layer 12 was evaluated as Δ. However, since the resin layer 12 was removed by polishing, there was no practical problem. Further, since the resin layer 12 is removed by using a roller brush, the resin layer 12 of the entire surface can be smoothly and easily removed by changing conditions such as the amount of press, the number of revolutions, and the conveyance speed.

相對於此,於樹脂層14之去除使用發泡胺基甲酸酯製之圓盤刷之比較例1、比較例2及比較例3中,由於樹脂層14遍佈整個面地殘留,因此無法進行玻璃板10之研磨。 On the other hand, in Comparative Example 1, Comparative Example 2, and Comparative Example 3 in which the resin layer 14 was removed by using a disk brush made of a foaming urethane, the resin layer 14 remained on the entire surface, and thus the film layer 14 could not be carried out. Grinding of the glass plate 10.

本申請案係基於2014年6月2日提出申請之日本專利申請案2014-114037者,並以參照之形式將其內容併入至本文中。 The present application is based on Japanese Patent Application No. 2014-114037, filed on Jun.

[產業上之可利用性] [Industrial availability]

可適宜地用於電子器件之製造中所利用之複合體之玻璃板之再利用。 It can be suitably used for reuse of a glass plate of a composite body used in the manufacture of electronic devices.

Claims (7)

一種玻璃板之再生方法,其特徵在於,其係將形成於玻璃板上之樹脂層去除者,且包括:去除步驟,其係使用研磨劑藉由輥刷將形成於上述玻璃板上之樹脂層去除;及研磨步驟,其係對上述樹脂層已去除之玻璃板之已去除樹脂層之面進行研磨。 A method for regenerating a glass plate, characterized in that it is a resin layer remover formed on a glass plate, and includes a removing step of using a polishing agent to form a resin layer formed on the glass plate by a roller brush And a grinding step of grinding the surface of the removed resin layer of the glass plate from which the resin layer has been removed. 如請求項1之玻璃板之再生方法,其中於上述去除步驟之前,進行於上述樹脂層之表面置入傷痕之傷痕置入步驟。 The method for regenerating a glass sheet according to claim 1, wherein the step of placing a flaw on the surface of the resin layer before the step of removing is performed. 如請求項1或2之玻璃板之再生方法,其中上述輥刷之刷毛之線徑為0.2mm以上。 The method for regenerating a glass sheet according to claim 1 or 2, wherein the bristles of the roller brush have a wire diameter of 0.2 mm or more. 如請求項1至3中任一項之玻璃板之再生方法,其中上述去除步驟係使用分散有上述研磨劑之漿料進行上述樹脂層之去除之步驟,且上述漿料中之研磨劑之濃度為10質量%以上。 The method for regenerating a glass sheet according to any one of claims 1 to 3, wherein the removing step is a step of removing the resin layer using a slurry in which the polishing agent is dispersed, and a concentration of the abrasive in the slurry It is 10% by mass or more. 如請求項1至4中任一項之玻璃板之再生方法,其中上述樹脂層係包含聚矽氧樹脂者。 The method for regenerating a glass sheet according to any one of claims 1 to 4, wherein the resin layer comprises a polyoxyn resin. 如請求項5之玻璃板之再生方法,其中上述聚矽氧樹脂為加成反應型聚矽氧之硬化物,並且該加成反應型聚矽氧為包含下述線狀有機聚矽氧烷(a)與下述線狀有機聚矽氧烷(b)之硬化性聚矽氧樹脂組合物:線狀有機聚矽氧烷(a):每1分子中至少具有2個烯基之線狀有機聚矽氧烷;及線狀有機聚矽氧烷(b):每1分子中至少具有3個鍵結於矽原子之氫原子,且鍵結於矽原子之氫原子之至少1個存在於分子末端之矽原子之線狀有機聚矽氧烷;且 上述樹脂層係藉由使該硬化性聚矽氧樹脂組合物於上述玻璃板之表面硬化而形成之硬化聚矽氧樹脂層。 The method for regenerating a glass plate according to claim 5, wherein the polyfluorene oxide resin is a hardening compound of an addition reaction type polyoxane, and the addition reaction type polyoxane is a linear organopolyoxane having the following ( a) a curable polyanthracene resin composition having a linear organopolyoxane (b): linear organopolyoxane (a): linear organic having at least 2 alkenyl groups per molecule a polyoxyalkylene; and a linear organopolyoxane (b): at least 3 hydrogen atoms bonded to a deuterium atom per molecule, and at least one hydrogen atom bonded to a deuterium atom is present in the molecule a linear organopolyoxane of a helium atom at the end; The resin layer is a cured polyoxyalkylene resin layer formed by curing the curable polyoxyxene resin composition on the surface of the glass plate. 一種玻璃板之再生裝置,其特徵在於,其係將形成於玻璃板上之樹脂層去除者,且包括:去除裝置,其具有輥刷、搬送機構及研磨劑供給機構,將形成於上述玻璃板上之樹脂層去除,上述搬送機構相對地搬送上述輥刷與具有樹脂層之玻璃板,上述研磨劑供給機構對上述輥刷及較利用上述搬送機構進行相對搬送中之輥刷更靠上游側之上述玻璃板之樹脂層的至少一者供給包含研磨劑之漿料;以及研磨裝置,其對藉由上述去除裝置將樹脂層去除後之玻璃板之樹脂層去除面進行研磨。 A glass plate reproducing device characterized in that the resin layer is formed on a glass plate, and includes: a removing device having a roller brush, a conveying mechanism, and an abrasive supply mechanism, which are formed on the glass plate The resin layer is removed, and the transfer mechanism relatively transports the roller brush and the glass plate having the resin layer, and the polishing agent supply mechanism further faces the roller brush and the roller brush that is relatively transported by the transport mechanism. At least one of the resin layers of the glass sheet is supplied with a slurry containing an abrasive; and a polishing apparatus for polishing the resin layer removal surface of the glass sheet obtained by removing the resin layer by the removal means.
TW104117845A 2014-06-02 2015-06-02 Regeneration method of glass plate and regeneration apparatus of glass plate TW201609587A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014114037A JP2015227275A (en) 2014-06-02 2014-06-02 Method and apparatus for regeneration of glass plate

Publications (1)

Publication Number Publication Date
TW201609587A true TW201609587A (en) 2016-03-16

Family

ID=54885009

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104117845A TW201609587A (en) 2014-06-02 2015-06-02 Regeneration method of glass plate and regeneration apparatus of glass plate

Country Status (4)

Country Link
JP (1) JP2015227275A (en)
KR (1) KR20150138817A (en)
CN (1) CN105291544A (en)
TW (1) TW201609587A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101842224B1 (en) * 2016-11-11 2018-03-26 한국에너지기술연구원 Partial dismantling device of photovoltaic module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301089A (en) * 1999-04-15 2000-10-31 Speedfam Clean System Kk Method and device for treating planar workpiece
JP4031629B2 (en) * 2001-10-05 2008-01-09 大日本印刷株式会社 Substrate cleaning apparatus and method
JP4144797B2 (en) * 2003-07-17 2008-09-03 旭平硝子加工株式会社 System for peeling metal thin films from glass substrates
JP5100156B2 (en) * 2007-03-02 2012-12-19 シャープ株式会社 Method for recovering glass substrates of waste liquid crystal panels
KR101486601B1 (en) * 2007-03-12 2015-01-26 아사히 가라스 가부시키가이샤 Glass substrate provided with protection glass and method for manufacturing display device using glass substrate provided with protection glass
JP4905238B2 (en) * 2007-04-27 2012-03-28 コニカミノルタオプト株式会社 Polishing method of glass substrate for magnetic recording medium
JP2009242206A (en) * 2008-03-31 2009-10-22 Noritake Co Ltd Cleaning tool for glass substrate
JP2011147879A (en) * 2010-01-21 2011-08-04 Central Glass Co Ltd Roll brush for cleaning film-formed glass plate and cleaning method
CN102791647B (en) * 2010-03-08 2015-04-08 旭硝子株式会社 Method for eliminating resin film and method for producing laminate

Also Published As

Publication number Publication date
CN105291544A (en) 2016-02-03
JP2015227275A (en) 2015-12-17
KR20150138817A (en) 2015-12-10

Similar Documents

Publication Publication Date Title
JP5716678B2 (en) LAMINATE MANUFACTURING METHOD AND LAMINATE
TWI400162B (en) A support body, a glass substrate laminate, a panel for a display device with a support, and a manufacturing method of a panel for a display device
TWI580566B (en) A manufacturing method of an electronic device, and a method for manufacturing a glass laminate
JP5790392B2 (en) Manufacturing method of electronic device
WO2011126028A1 (en) Method and apparatus for manufacturing glass plates
JP6240943B2 (en) Polishing apparatus and GaN substrate polishing method using the same
CN1789366A (en) Polishing composition for glass substrate
TW201410423A (en) Apparatus for processing laminated body and method for processing the same
TWI526316B (en) A method for removing the resin film and a method for producing the layered product
TWI526313B (en) The manufacturing method of the layered body
TW201609587A (en) Regeneration method of glass plate and regeneration apparatus of glass plate
WO2013099847A1 (en) Method for manufacturing sensor-integrated cover glass, and sensor-integrated cover glass
KR101523815B1 (en) Polishing device for plate-shaped body and polishing method for plate-shaped body
JP5350853B2 (en) Manufacturing method of glass substrate and manufacturing method of magnetic recording medium
JP6488912B2 (en) Packing method for substrate with adsorption layer and packing apparatus for substrate with adsorption layer
JP5265429B2 (en) Manufacturing method of glass substrate and manufacturing method of magnetic recording medium
JP2009277347A (en) Manufacturing method of glass substrate for information recording medium
JP6123899B2 (en) Method for processing plate-like body and method for manufacturing electronic device
JP7156341B2 (en) Single-sided polishing apparatus, single-sided polishing method, and polishing pad
JP6034580B2 (en) Manufacturing method of glass substrate for HDD
TWI549159B (en) A packing method with a substrate having an adsorbent layer and a packer and a packing device having a substrate having an adsorbent layer
JP2015047648A (en) Processing method for laminate, and method of manufacturing electronic device
JP2014175023A (en) Method for manufacturing glass substrate for magnetic recording medium
TW201111113A (en) Grinding machine for plate-like bodies and method of grinding plate-like bodies
JP2010231854A (en) Method for manufacturing substrate for magnetic disk